Lighting device and display lamp comprising same

WO2026168738A1PCT designated stage Publication Date: 2026-08-13LG INNOTEK CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-12-18
Publication Date
2026-08-13

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Abstract

The present invention relates to a lighting device in which pixel lighting is obtained by assembling a pattern mask for each cell, and to a display lamp comprising the lighting device, and according to an embodiment of the present invention, the lighting device comprises: a substrate; a partition module disposed on the substrate and having a plurality of pixel holes therein; and a plurality of pattern masks aligned to respective pixel holes, wherein the partition module may be provided, on the top surface, with an assembly placement recess near each pixel hole for seating a pattern mask. In addition, further included may be: a plurality of light sources disposed on the substrate and aligned with respective pixel holes; a fixing frame, disposed on the partition module, for fixing the pattern masks; and an optical module disposed on the fixing frame.
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Description

Lighting devices and indicator lamps including them

[0001] The embodiment relates to a lighting device capable of implementing pixel lighting by a cell-by-cell pattern mask assembly method and a display lamp including the same.

[0002] Typical lighting applications include not only automotive lighting but also lights for displays and signage.

[0003] Semiconductor light-emitting devices, such as light-emitting diodes (LEDs), offer advantages over conventional light sources like fluorescent lamps and incandescent lamps, including low power consumption, a semi-permanent lifespan, fast response speed, safety, and environmental friendliness. These light-emitting diodes are applied to various lighting devices, such as display devices, indoor lights, and outdoor lights.

[0004] Recently, lamps employing light-emitting diodes have been proposed as automotive lighting.

[0005] Here, light-emitting diodes are advantageous in that they consume less power compared to incandescent bulbs, allow for greater design freedom due to their small size, and are economical due to their semi-permanent lifespan.

[0006] However, lighting devices using such light-emitting diodes faced a problem of reduced cost competitiveness due to the high complexity and difficulty of the manufacturing process.

[0007] Therefore, in the future, it is necessary to develop lighting devices that can enhance assemblability and cost competitiveness by minimizing manufacturing and assembly processes.

[0008] An embodiment of the invention can provide a lighting device that can improve assembly and cost competitiveness by minimizing manufacturing and assembly processes, by manufacturing a partition module in which an assembly mounting groove for mounting a pattern mask is formed on the upper surface around each pixel hole using an injection molding method, and by aligning and assembling one pattern mask for each pixel hole using an individual assembly method.

[0009] An embodiment comprises, as a lighting device, a substrate, a partition module disposed on the substrate and having a plurality of pixel holes formed therein, and a plurality of pattern masks aligned with each pixel hole, wherein the partition module may have an assembly mounting groove formed on the upper surface around each pixel hole for mounting the pattern mask.

[0010] Another embodiment is a display lamp comprising at least one lighting device, wherein the lighting device comprises at least one lighting device to which a partition module and an optical module are assembled, and a cover lens covering the lighting device, wherein the lighting device comprises a substrate, a partition module disposed on the substrate and having a plurality of pixel holes formed therein, and a plurality of pattern masks aligned with each pixel hole, and wherein the partition module may have an assembly mounting groove formed on the upper surface around each pixel hole for mounting the pattern mask.

[0011] The lighting device according to the embodiment can improve assembly efficiency and cost competitiveness by minimizing manufacturing and assembly processes, by manufacturing a partition module in which an assembly mounting groove for mounting a pattern mask is formed on the upper surface around each pixel hole using an injection molding method, and by aligning and assembling one pattern mask for each pixel hole using an individual assembly method.

[0012] FIG. 1 is a perspective view showing the exterior of a lighting device according to one embodiment.

[0013] FIG. 2 is an exploded perspective view showing a lighting device according to one embodiment.

[0014] FIG. 3 is a side cross-sectional view showing a lighting device according to one embodiment.

[0015] FIGS. 4 and FIGS. 5a, FIGS. 5b, FIGS. 5c are perspective views showing the upper and lower surfaces of a partition module of a lighting device according to one embodiment.

[0016] FIGS. 6 and 7 are perspective views showing the upper and lower surfaces of a fixed frame of a lighting device according to one embodiment.

[0017] FIGS. 8 and 9 are perspective views showing the upper and lower surfaces of an optical module of a lighting device according to one embodiment.

[0018] FIGS. 10 and FIGS. 11 are perspective views showing the upper and lower surfaces of a pattern mask of a lighting device according to one embodiment.

[0019] FIGS. 12 and FIGS. 13 are perspective views showing the upper and lower surfaces of a cover case of a lighting device according to one embodiment.

[0020] FIG. 14 is a plan view of a vehicle equipped with a lighting device according to an embodiment.

[0021] FIG. 15 is a drawing showing an example of the taillights and indicator lamps of the vehicle of FIG. 14.

[0022] FIG. 16 is an example of a symbol or character of an indicator lamp displayed by the lighting device of FIG. 15.

[0023] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0024] However, the technical concept of the present invention is not limited to the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted. Furthermore, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a meaning generally understood by those skilled in the art to which the present invention pertains, unless explicitly and specifically defined otherwise; and terms commonly used, such as those defined in advance, may be interpreted by considering their meaning in the context of the relevant technology. Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0025] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as “at least one of A and B and C (or more than one),” it may include one or more of all combinations that can be formed from A, B, and C. Furthermore, in describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used. These terms are intended merely to distinguish the component from other components and are not determined by the essence, order, or sequence of the component. Also, when it is stated that a component is 'connected,' 'combined,' or 'connected' to another component, this may include not only cases where the component is directly connected, combined, or connected to the other component, but also cases where it is 'connected,' 'combined,' or 'connected' due to another component located between the component and the other component.

[0026] Furthermore, when described as being formed or placed "above or below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above or below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0027] The lighting device according to the present invention can be applied to various lamp devices requiring lighting, such as vehicle lamps, household lighting devices, or industrial lighting devices. For example, when the lighting device is applied to a vehicle lamp, it can be applied to headlamps, parking lights, side mirror lights, fog lights, tail lamps, brake lights, daytime running lights, vehicle interior lighting, door scars, rear combination lamps, backup lamps, etc. The lighting device of the present invention can also be applied to indoor and outdoor advertising devices, display devices, and various types of electric vehicles. In addition, it can be applied to all lighting-related fields or advertising-related fields that are currently developed and commercialized or that can be realized through future technological advancements.

[0028] FIG. 1 is a perspective view showing the exterior of a lighting device according to one embodiment, FIG. 2 is an exploded perspective view showing a lighting device according to one embodiment, and FIG. 3 is a side cross-sectional view showing a lighting device according to one embodiment.

[0029] As illustrated in FIGS. 1 to 3, the lighting device (1000) may include a substrate (1100), a partition module (1300) disposed on the substrate (1100) and having a plurality of pixel holes formed therein, and a plurality of pattern masks (1400) aligned with each pixel hole. Additionally, the lighting device (1000) may further include a plurality of light sources (1200) disposed on the substrate (1100) and aligned with each pixel hole, a fixing frame (1500) disposed on the partition module (1300) and fixing the pattern mask (1400), and an optical module (1600) disposed on the fixing frame (1500). Additionally, the lighting device (1000) may further include a cover case (1700) covering an edge area of ​​the optical module (1600). Here, the bulkhead module (1300), the fixed frame (1500), and the optical module (1600) can be manufactured by injection molding and assembled or separated from each other.

[0030] The partition module (1300) may have an assembly mounting groove formed on its upper surface around each pixel hole for mounting a pattern mask (1400). Here, the assembly mounting groove of the partition module (1300) may face the lower edge area of ​​the pattern mask (1400).

[0031] For example, the assembly mounting groove surface of the bulkhead module (1300) can be in contact with the surface of the lower edge region of the pattern mask (1400).

[0032] As another example, the assembly mounting groove surface of the bulkhead module (1300) may be in non-contact with the surface of the lower edge region of the pattern mask (1400). Here, the non-contact space between the assembly mounting groove of the bulkhead module (1300) and the pattern mask (1400) may be filled with air or an adhesive layer.

[0033] As another example, the assembly mounting groove of the bulkhead module (1300) may have an uneven pattern formed on its upper surface facing the pattern mask (1400), and the pattern mask (1400) may have an uneven pattern formed on the edge area of ​​its lower surface facing the assembly mounting groove of the bulkhead module (1300). Here, the assembly mounting groove of the bulkhead module (1300) may be positioned so that the convex area of ​​the uneven pattern corresponds to the concave area of ​​the uneven pattern of the pattern mask (1400), and the concave area of ​​the uneven pattern may correspond to the convex area of ​​the uneven pattern of the pattern mask (1400).

[0034] Additionally, the assembly mounting groove of the bulkhead module (1300) may have a vertical depth value greater than the thickness value between the upper and lower surfaces of the pattern mask (1400). This is because the pattern mask (1400) is inserted into the assembly mounting groove of the bulkhead module (1300), and the fixing projection of the fixing frame (1500) for fixing the pattern mask (1400) is also inserted.

[0035] Additionally, the cross-sectional area of ​​the pixel hole of the partition module (1300) may be smaller than the lower surface area of ​​the pattern mask (1400). This is because the edge area of ​​the lower surface of the pattern mask (1400) is seated in the assembly seating groove of the partition module (1300), and the central area of ​​the lower surface of the pattern mask (1400) covers the pixel hole of the partition module (1300).

[0036] Additionally, the partition module (1300) may have a reflector formed in the lower region of each pixel hole that includes a light source insertion hole. Here, the light source insertion hole is aligned with the light source (1200) placed on the substrate (1100), and the cross-sectional area of ​​the light source insertion hole may be equal to or larger than the upper area of ​​the light source (1200). This is because if the reflector of the partition module (1300) and the light source (1200) partially overlap, light emitted from the light source (1200) may be lost.

[0037] Additionally, the partition module (1300) may include an assembly border (1350) formed along the periphery of a pixel hole on the lower surface facing the substrate (1100). Here, the assembly border (1350) may have a groove shape that is concave to a predetermined depth on the inner side of the lower surface of the partition module (1300).

[0038] Meanwhile, depending on the case, the assembly edge (1350) may have a convex shape that protrudes a predetermined height in the direction of the substrate (1100).

[0039] For example, the assembly edge (1350) may be in direct contact with the substrate (1100) or in contact with a support member located between the substrate and the partition module.

[0040] In another case, the bulkhead module (1300) may have a flat bottom surface without an assembly edge.

[0041] Additionally, a support member (not shown) may be disposed between the substrate (1100) and the partition module (1300), the support member comprising a plurality of holes and a concave or convex border formed around each hole. Here, the holes of the support member (not shown) are formed to correspond to the pixel holes of the partition module (1300), and the concave or convex border of the support member (not shown) may be formed to correspond to the assembly border (1350) of the partition module (1300). At this time, if the assembly border (1350) of the partition module (1300) has a convex shape, the partition module (1300) may be inserted into the concave border of the support member and assembled to the support member, or if the assembly border (1350) of the partition module (1300) has a concave shape, it may be combined with the convex border of the support member and assembled to the support member.

[0042] For example, the thickness of the support member may be equal to or greater than the thickness of the assembly edge of the bulkhead module (1300). This is to improve assembly by ensuring that the assembly edge of the bulkhead module (1300) is smoothly inserted into the hole of the support member.

[0043] Additionally, the upper surface of the support member may contact the lower surface of the bulkhead module (1300), and the inner surface of each hole of the support member may contact the outer surface of the assembly edge of the bulkhead module (1300). Here, the lower surface of the assembly edge of the bulkhead module (1300) may contact the upper surface of the substrate (1100).

[0044] In some cases, the lower surface of the assembly edge of the bulkhead module (1300) may be separated from the upper surface of the substrate (1100).

[0045] In addition, the support member may include at least one of an adhesive material and an elastic material.

[0046] Next, the pattern mask (1400) may have a plurality of pattern holes formed therein to diffuse light emitted from the light source (1200) in an upward direction. Here, the pattern mask (1400) may have a plurality of pattern holes formed in a central area facing the pixel hole of the partition module (1300), and a plurality of pattern holes not formed in an edge area facing the assembly mounting groove of the partition module (1300).

[0047] Additionally, the pattern hole density of the pattern mask (1400) may increase as it moves away from the center of the pattern mask (1400). In some cases, the number of pattern holes of the pattern mask (1400) may increase as it moves away from the center of the pattern mask (1400). In other cases, the size of the pattern holes of the pattern mask (1400) may increase as it moves away from the center of the pattern mask (1400).

[0048] Next, the fixed frame (1500) may have a plurality of through holes formed that are aligned with each pixel hole of the partition module (1300), and on the lower surface of the fixed frame (1500), a fixing projection may be formed that protrudes in the direction of the partition module around each through hole to fix the pattern mask (1400). Here, the fixing projection of the fixed frame (1500) may be inserted into the assembly mounting groove of the partition module (1300) and fastened. At this time, the fixing projection of the fixed frame (1500) may be inserted into the assembly mounting groove of the partition module (1300) and positioned to face the edge area of ​​the pattern mask (1400).

[0049] For example, a fixed projection of a fixed frame (1500) may be inserted into an assembly seating groove of a bulkhead module (1300) so that the lower surface of the fixed projection contacts the upper edge area of ​​a pattern mask (1400) and the side of the fixed projection contacts the side of the assembly seating groove of the bulkhead module (1300).

[0050] As another example, the fixing projection of the fixed frame (1500) may be inserted into the assembly seating groove of the bulkhead module (1300) so that the lower surface of the fixing projection contacts the upper edge area of ​​the pattern mask (1400), and the side of the fixing projection may not contact the side of the assembly seating groove of the bulkhead module (1300). Here, the non-contact space between the side of the fixing projection of the fixed frame (1500) and the side of the assembly seating groove of the bulkhead module (1300) may be filled with air or an adhesive layer.

[0051] As another example, the fixing projection of the fixed frame (1500) may be inserted into the assembly seating groove of the bulkhead module (1300) so that the lower surface of the fixing projection does not come into contact with the upper edge area of ​​the pattern mask (1400), and the side surface of the fixing projection may come into contact with the side surface of the assembly seating groove of the bulkhead module (1300). Here, the non-contact space between the lower surface of the fixing projection of the fixed frame (1500) and the upper edge area of ​​the pattern mask (1400) may be filled with air or an adhesive layer.

[0052] As another example, the fixing projection of the fixed frame (1500) may be inserted into the assembly seating groove of the partition module (1300) so that the lower surface of the fixing projection does not come into contact with the upper surface edge area of ​​the pattern mask (1400), and the side surface of the fixing projection does not come into contact with the side surface of the assembly seating groove of the partition module (1300). Here, air or an adhesive layer may be filled in the non-contact space between the lower surface of the fixing projection of the fixed frame (1500) and the upper surface edge area of ​​the pattern mask (1400), and between the side surface of the fixing projection of the fixed frame (1500) and the side surface of the assembly seating groove of the partition module (1300).

[0053] Additionally, on the lower surface of the fixed frame (1500), a fastening groove for fastening with the bulkhead module (1300) is formed along the outer periphery of the fixed projection, and on the upper surface of the bulkhead module (1300), a fastening projection for fastening with the fixed frame (1500) can be formed along the outer periphery of the assembly seating groove. Here, the fastening projection of the bulkhead module (1300) can be inserted into the fastening groove of the fixed frame (1500) to fasten the bulkhead module (1300) and the fixed frame (1500) so that they can be assembled together.

[0054] For example, the height value of the fastening projection of the bulkhead module (1300) may be equal to or smaller than the depth value of the fastening groove of the fixed frame (1500). This is so that the fastening projection of the bulkhead module (1300) can be smoothly inserted into the fastening groove of the fixed frame (1500) to improve assembly.

[0055] Next, at least one assembly projection may be formed on the upper surface of the fixed frame (1500) to be assembled with the optical module (1600). Here, the assembly projection of the fixed frame (1500) may be positioned in the outermost edge region of the fixed frame (1500).

[0056] Additionally, the cross-sectional area of ​​the through hole of the fixed frame (1500) may be equal to or larger than the cross-sectional area of ​​the pixel hole of the partition module (1300). This is to prevent light loss from occurring by blocking the light emitted upward through the pixel hole of the partition module (1300) due to the fixed frame (1500).

[0057] Additionally, at least one assembly groove may be formed on the side of the optical module (1600) to be assembled with the fixed frame (1500). Here, the assembly groove of the optical module (1600) may be positioned in the outermost edge region of the optical module (1600).

[0058] Next, the optical module (1600) may include a plurality of diffusers arranged to be aligned in each through hole of the fixed frame (1500). Here, the plurality of diffusers may be connected to each other by the optical frame of the optical module (1600).

[0059] Additionally, the optical module (1600) may include an optical frame having a plurality of mounting holes formed that are aligned with each through hole of the fixed frame (1500), and a plurality of diffusers filled within each mounting hole of the optical frame. In one example, the plurality of diffusers may be made of a transparent silicone material. In another example, the plurality of diffusers may include a plurality of beads. Here, the composition ratio of the beads may be 1% to 10% of the total composition of the diffuser, but this is merely one embodiment and is not limited thereto. In yet another example, the plurality of diffusers may include a phosphor.

[0060] Additionally, the optical frame may be made of the same material as the diffuser or a different material. For example, the optical frame may include a light-blocking material to prevent light mixing between adjacent pixels. For another example, the optical frame may be made of a material comprising a composition in which a binder resin including an alkali-soluble resin and an epoxy resin is mixed with one or more coloring agents selected from carbon black, a mixture of organic black pigment and a colored organic pigment, a metal oxide inorganic pigment and a metal nitride inorganic pigment.

[0061] Next, the cover case (1700) may have a central hole formed therein that exposes the central area of ​​the optical module (1600) to the outside. Here, the cover case (1700) may have a fastening hole formed therein so that it is fastened to the substrate (1100) through a fastening member. For example, the central hole of the cover case (1700) may have a lower area larger than the upper area. This is so that the cover case (1700) can smoothly cover the entire side of the optical module (1600), the fixed frame (1500), and the partition module (1300) to block light loss.

[0062] The cover case (1700) may include an upper cover portion covering the upper edge area of ​​the optical module (1600) and a side cover portion covering the sides of the optical module (1600), the fixed frame (1500), and the partition module (1300). Here, the cover case (1700) may have a thickness in the vertical direction from the surface of the substrate (1100) that is greater than the total thickness obtained by summing the thickness of the optical module (1600), the thickness of the fixed frame (1500), and the thickness of the partition module (1300). This is so that the cover case (1700) can smoothly cover the entire sides of the optical module (1600), the fixed frame (1500), and the partition module (1300) to block light loss.

[0063] Meanwhile, the substrate (1100) may include at least one of a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 substrate. For example, if the substrate (1100) is a flexible PCB, the lighting device (1000) may have flexible characteristics.

[0064] Additionally, the substrate (1100) has one or more coupling holes, and the lighting device (1000) can be fastened to a bracket (not shown) through the coupling holes using a fastening means (not shown).

[0065] Additionally, the substrate (1100) may be electrically connected to at least one light source (1200). The substrate (1100) may include a wiring layer on top, and the wiring layer may be electrically connected to at least one light source (1200). The substrate (1100) may be a single-layer substrate having a single wiring layer or a multi-layer substrate having a plurality of wiring layers.

[0066] When the substrate (1100) is a single-layer substrate, the substrate (1100) may have a protective layer on the upper surface of the wiring layer, an insulating layer on the lower surface of the wiring layer, and a metal layer disposed below the insulating layer. For example, the metal layer may serve as a heat dissipation heater.

[0067] Additionally, if the substrate (1100) is a multilayer substrate, the substrate (1100) may have a protective layer on the upper surface of the upper wiring layer, an insulating layer on the lower surface of the upper wiring layer, and a layer for lower wiring disposed below the insulating layer, and the layer for lower wiring may be connected to the upper wiring layer through vias. Here, the protective layer of the substrate (1100) is a layer for protecting the wiring layer and may be formed of a solder resistor material or a reflective material, and the color of the reflective material may be provided as white.

[0068] Next, the light source (1200) emits the largest amount of light in the third direction (Z) or the optical axis direction, where the third direction (Z) is a direction orthogonal to the first and second directions (X,Y), which are horizontal directions, and may be a vertical direction toward the optical module (1600) from the substrate (100).

[0069] The light source (1200) is mounted on the substrate (1100) and can be provided as an LED chip or a package covering the surface of the LED chip with resin.

[0070] The light source (1200) is a light-emitting element having a light-emitting diode chip (LED Chip), and may include various forms such as a package in which the light-emitting diode chip is packaged, a flip-chip, or a CSP (Chip scale package). Here, the light-emitting diode chip may emit at least one of blue, red, green, ultraviolet (UV), or infrared light, and the light source (1200) may emit at least one of white, blue, red, green, or infrared light, and may emit light in a colored light such as white, blue, or green. The thickness (T0) or height of the light source (1200) may be about 0.4 mm or less, or in the range of about 0.25 mm to about 0.4 mm. The light-emitting element of the light source (1200) may include a light-emitting diode chip, and the light-emitting diode chip may include a mini LED chip or a micro LED chip.

[0071] One or more light sources (1200) may be placed within a single pixel area. Here, when multiple light-emitting elements are placed within the pixel area, the light-emitting elements may emit different colors. For example, multiple light-emitting elements may emit different colors among blue, green, red, yellow, and white. For another example, multiple light-emitting elements may emit the same color among blue, green, red, yellow, and white. Here, blue, green, red, yellow, and white may include wavelength bands of each color or include similar colors.

[0072] Additionally, the light-emitting device may include a light-emitting diode chip and a phosphor layer, and the phosphor layer may be laminated on the surface of the light-emitting diode chip. Here, the phosphor layer may include at least one or more of a yellow phosphor, a red phosphor, a red phosphor, or a green phosphor, and may include a wavelength conversion material such as a quantum dot. Such a light-emitting device may emit blue, green, red, yellow, or white light through the mixing of light generated from the light-emitting diode chip and light wavelength-converted by the phosphor layer.

[0073] Additionally, the light-emitting element can have a light-emitting diode chip mounted on a substrate (100) in a flip-chip manner and can emit light on at least five sides. Here, the at least five sides may include the top surface and four sides of the light-emitting element.

[0074] The light-emitting element may include a top-view type LED package. The present disclosure is not limited thereto, and the light-emitting element may include a side-type type LED package.

[0075] Next, the partition module (1300) is a light-blocking member that covers the outer side of the pixel area where the light source (1200) is placed, and may have a single partition structure, a multiple partition structure, or a double light-blocking structure. Here, the partition module (1300) can block light interference between adjacent light sources (1200) and can block the problem of light penetrating into the pixel area of ​​an adjacent light source (1200).

[0076] Additionally, the partition module (1300) may have a pixel hole formed in correspondence with the pixel area where the light source (1200) is placed, and the pixel hole of the partition module (1300) may determine the size of the pixel area. Here, the top-view shape of the pixel hole of the partition module (1300) may be a polygonal shape, such as a triangular, square, or hexagonal shape. The polygonal shape may include a shape with angular corners or a curved shape. Additionally, the top-view shape of the pixel hole may be a circular shape or an elliptical shape.

[0077] Next, the partition module (1300) may include a metal material or a resin material. For example, the metal material may be an alloy of at least one or two of aluminum (Al), nickel (Ni), copper (Cu), and silver (Ag), and the resin material may include an epoxy or silicone material. As another example, the partition module (1300) may be selected from materials such as polyimide (PI), polyurethane (PU), polyvinyl chloride (PVC), polypropylene (PP), polyethylene (PE), and polyethylene terephthalate (PET).

[0078] Depending on the case, the bulkhead module (1300) may be formed in a single layer or multiple layers.

[0079] Additionally, the partition module (1300) may include a light reflector or a light absorber within a resin material, wherein the light reflector is Al2O3, TiO2, It may include at least one of SiO2, ZnO, and ZrO2, and the light-absorbing material may include a light-absorbing pigment or dye.

[0080] Additionally, the upper surface width between adjacent pixel holes (1310) in the partition module (1300) may be the minimum distance between adjacent pixel areas, such as 1.1 mm or less, for example, in the range of 0.5 mm to 1.1 mm or in the range of 0.7 mm to 1 mm. Here, if the upper surface width of the partition module (1300) is larger than the above range, the dark area between pixels may be increased, and if it is smaller than the above range, light leakage may occur or there may be difficulties in manufacturing.

[0081] Additionally, the vertical height of the partition module (1300) may be equal to or greater than the vertical thickness of the light source (1200) with respect to the upper surface of the substrate (1100).

[0082] Additionally, the side of the partition (1300) module may have a predetermined angle with respect to the upper surface of the substrate (1100) for light reflection, and the angle may be about 91 degrees or more, for example, in the range of about 91 degrees to about 95 degrees or in the range of about 92 degrees to about 94 degrees. Here, if the angle is greater than the above range, light emitted through the pixel area may propagate onto adjacent pixel areas, and pixel brightness may be reduced, and if the angle is smaller than the above range, light extraction efficiency may be reduced.

[0083] Additionally, within the pixel area defined by the partition module (1300), a transparent resin layer (not shown) that seals the light-emitting element of the light source (1200) may be further formed. Here, the resin layer seals the light-emitting element and can be inserted into each pixel hole of the partition module (1300) to come into contact with the inner surface of the partition module (1300). The resin layer can protect the light-emitting element from moisture.

[0084] Meanwhile, the lighting device (1000) displays images or information such as symbols, logos, symbols, or characters by means of light sources (1200) each placed within pixel areas, and can be defined as a lighting module or a display lamp. That is, the lighting device (1000) can display images or information such as symbols, logos, symbols, or characters through a display area.

[0085] Additionally, the lighting device (1000) can be implemented as pixel lighting using pixel regions.

[0086] The lighting device (1000) controls the operation of a light source (1200) within a pixel area through a control unit (not shown) according to the image or information to be displayed, and can display the image or information by the light extracted through the pixel area by turning on or off the light source (1200).

[0087] A light source (1200) placed within a pixel area can be turned on or turned off depending on whether power is supplied. Here, the pixel area can be implemented as a grid type or a unit cell type and can function as a pixel, which is the smallest unit constituting an image or information. That is, the pixel area can be defined as a unit pixel or a unit light-emitting part.

[0088] The top-view shape of the pixel area may be a polygonal shape, such as a square or a triangle, or provided as a circle or an ellipse. The top-view shape of the display area having the pixel areas may be a polygonal shape, such as a triangle or a square, or a circle or an ellipse. The top-view shape of the display area having the pixel areas may have a shape such as a symbol, a logo, a symbol, or a character.

[0089] In this way, the lighting device according to the embodiment can improve assembly efficiency and cost competitiveness by minimizing the manufacturing and assembly processes, by manufacturing a partition module in which an assembly mounting groove for mounting a pattern mask is formed on the upper surface around each pixel hole using an injection molding method, and by aligning and assembling one pattern mask for each pixel hole using an individual assembly method.

[0090] FIGS. 4 and FIGS. 5a, FIGS. 5b, and FIGS. 5c are perspective views showing the upper and lower surfaces of a partition module of a lighting device according to one embodiment, FIG. 4 is a perspective view showing the upper surface of the partition module, and FIGS. 5a, FIGS. 5b, and FIGS. 5c are perspective views showing the lower surface of the partition module.

[0091] As illustrated in FIGS. 4 and FIGS. 5a, 5b, and 5c, the partition module (1300) may have an assembly mounting groove (1330) formed on the upper surface around each pixel hole (1310) for mounting a pattern mask (1400 of FIG. 10). Here, the assembly mounting groove (1330) of the partition module (1300) may face the lower edge area of ​​the pattern mask (1400).

[0092] For example, the surface of the assembly mounting groove (1330) of the bulkhead module (1300) can be in contact with the surface of the lower edge region of the pattern mask (1400).

[0093] As another example, the surface of the assembly mounting groove (1330) of the bulkhead module (1300) may be in non-contact with the surface of the lower edge region of the pattern mask (1400). Here, the non-contact space between the assembly mounting groove (1330) of the bulkhead module (1300) and the pattern mask (1400) may be filled with air or an adhesive layer.

[0094] As another example, the assembly mounting groove (1330) of the bulkhead module (1300) may have an uneven pattern formed on its upper surface facing the pattern mask (1400), and the pattern mask (1400) may have an uneven pattern formed on the edge area of ​​its lower surface facing the assembly mounting groove (1330) of the bulkhead module (1300).

[0095] Here, the assembly mounting groove (1330) of the bulkhead module (1300) may be positioned such that the convex area of ​​the uneven pattern corresponds to the concave area of ​​the uneven pattern of the pattern mask (1400), and the concave area of ​​the uneven pattern may correspond to the convex area of ​​the uneven pattern of the pattern mask (1400).

[0096] Thus, the reason for forming an uneven pattern on the assembly mounting groove (1330) of the bulkhead module (1300) and the pattern mask (1400) is to stably fix the pattern mask (1400) within the assembly mounting groove (1330).

[0097] Additionally, the assembly mounting groove (1330) of the bulkhead module (1300) may have a vertical depth value greater than the thickness value between the upper and lower surfaces of the pattern mask (1400). This is because the pattern mask (1400) is inserted into the assembly mounting groove (1330) of the bulkhead module (1300), and the fixing projection (1530 in FIG. 7) of the fixing frame (1500 in FIG. 7) for fixing the pattern mask (1400) is also inserted.

[0098] Additionally, the cross-sectional area of ​​the pixel hole (1310) of the partition module (1300) may be smaller than the lower surface area of ​​the pattern mask (1400). This is because the edge area of ​​the lower surface of the pattern mask (1400) is seated in the assembly seating groove (1330) of the partition module (1300), and the central area of ​​the lower surface of the pattern mask (1400) covers the pixel hole (1310) of the partition module (1300).

[0099] Additionally, the partition module (1300) may have a reflector (1320) formed in the lower region of each pixel hole (1310) that includes a light source insertion hole. Here, the light source insertion hole is aligned with the light source (1200) placed on the substrate (1100), and the cross-sectional area of ​​the light source insertion hole may be equal to or larger than the upper area of ​​the light source (1200). This is because if the reflector (1320) of the partition module (1300) and the light source (1200) partially overlap, light emitted from the light source (1200) may be lost.

[0100] And, the bulkhead module (1300) may include an assembly border (1350 in FIG. 5a and FIG. 5b) formed along the periphery of a pixel hole (1310) on the lower surface facing the substrate (1100).

[0101] Here, as shown in FIG. 5a, the assembly edge (1350) may have a convex shape that protrudes by a predetermined height in the direction of the substrate (1100 in FIG. 2).

[0102] In some cases, as shown in FIG. 5b, the assembly edge (1350) may have a groove shape that is concave to a predetermined depth inwardly on the lower side of the bulkhead module (1300). For example, the assembly edge (1350) may be in direct contact with the substrate (1100) or in contact with a support member located between the substrate and the bulkhead module.

[0103] In another case, as shown in FIG. 5c, the bulkhead module (1300) may have a flat bottom surface without an assembly edge (not shown).

[0104] Additionally, a support member (not shown) may be disposed between the substrate (1100) and the partition module (1300), the support member (not shown) comprising a plurality of holes and a concave or convex edge formed around each hole. Here, the holes of the support member (not shown) are formed to correspond to the pixel holes of the partition module (1300), and the concave or convex edge of the support member (not shown) may be formed to correspond to the assembly edge (1350) of the partition module (1300) shown in FIG. 5A and FIG. 5B. At this time, the partition module (1300) may be assembled to the support member by being inserted into the concave edge of the support member when the assembly edge (1350) of the partition module (1300) has a convex shape, or it may be assembled to the support member by being combined with the convex edge of the support member when the assembly edge (1350) of the partition module (1300) has a concave shape.

[0105] For example, the thickness of the support member (not shown) may be equal to or greater than the thickness of the assembly edge (1350) of the bulkhead module (1300). This is to ensure that the assembly edge (1350) of the bulkhead module (1300) is smoothly inserted into the hole of the support member (not shown), thereby improving assembly.

[0106] Additionally, the upper surface of the support member (not shown) may be in contact with the lower surface of the bulkhead module (1300), and the inner surface of each hole of the support member may be in contact with the outer surface of the assembly edge (1350) of the bulkhead module (1300). Here, the lower surface of the assembly edge (1350) of the bulkhead module (1300) may be in contact with the upper surface of the substrate (1100).

[0107] In some cases, the lower surface of the assembly edge (1350) of the bulkhead module (1300) may be separated from the upper surface of the substrate (1100).

[0108] In addition, the support member (not shown) may include at least one of an adhesive material and an elastic material.

[0109] FIGS. 6 and FIGS. 7 are perspective views showing the upper and lower surfaces of a fixed frame of a lighting device according to one embodiment, FIG. 6 is a perspective view showing the upper surface of the fixed frame, and FIG. 7 is a perspective view showing the lower surface of the fixed frame.

[0110] As illustrated in FIGS. 6 and 7, a fixed frame (1500) may have a plurality of through holes (1510) formed that are aligned with each pixel hole (1310) of a partition module (1300 in FIG. 5), and on the lower surface of the fixed frame (1500), a fixing projection (1530) may be formed around each through hole (1510) and protrude in the direction of the partition module (1300) to fix a pattern mask (1400 in FIG. 10). Here, the fixing projection (1530) of the fixed frame (1500) may be inserted into and fastened within the assembly seating groove (1330) of the partition module (1300 in FIG. 4). At this time, the fixing projection (1530) of the fixed frame (1500) can be inserted into the assembly seating groove (1330) of the bulkhead module (1300) and positioned to face the edge area of ​​the pattern mask (1400).

[0111] For example, a fixed projection (1530) of a fixed frame (1500) may be inserted into an assembly seating groove (1330) of a bulkhead module (1300) such that the lower surface of the fixed projection (1530) contacts the upper edge area of ​​a pattern mask (1400), and the side surface of the fixed projection (1530) contacts the side surface of the assembly seating groove (1330) of the bulkhead module (1300).

[0112] As another example, the fixing projection (1530) of the fixed frame (1500) may be inserted into the assembly seating groove (1330) of the bulkhead module (1300) so that the lower surface of the fixing projection (1530) contacts the upper edge area of ​​the pattern mask (1400), and the side of the fixing projection (1530) may not contact the side of the assembly seating groove (1330) of the bulkhead module (1300). Here, the non-contact space between the side of the fixing projection (1530) of the fixed frame (1500) and the side of the assembly seating groove (1330) of the bulkhead module (1300) may be filled with air or an adhesive layer.

[0113] As another example, the fixing projection (1530) of the fixed frame (1500) may be inserted into the assembly seating groove (1330) of the bulkhead module (1300) so that the lower surface of the fixing projection (1530) does not come into contact with the upper edge area of ​​the pattern mask (1400), and the side surface of the fixing projection (1530) may come into contact with the side surface of the assembly seating groove (1330) of the bulkhead module (1300). Here, the non-contact space between the lower surface of the fixing projection (1530) of the fixed frame (1500) and the upper edge area of ​​the pattern mask (1400) may be filled with air or an adhesive layer.

[0114] As another example, the fixing projection (1530) of the fixed frame (1500) may be inserted into the assembly seating groove (1330) of the partition module (1300) so that the lower surface of the fixing projection (1530) does not come into contact with the upper surface edge area of ​​the pattern mask (1400), and the side surface of the fixing projection (1530) does not come into contact with the side surface of the assembly seating groove (1330) of the partition module (1300). Here, air or an adhesive layer may be filled in the non-contact space between the lower surface of the fixing projection (1530) of the fixed frame (1500) and the upper surface edge area of ​​the pattern mask (1400), and between the side surface of the fixing projection (1530) of the fixed frame (1500) and the side surface of the assembly seating groove (1330) of the partition module (1300).

[0115] Additionally, on the lower surface of the fixed frame (1500), a fastening groove for fastening with the bulkhead module (1300) is formed along the outer periphery of the fixed projection (1530), and on the upper surface of the bulkhead module (1300), a fastening projection (1340 in FIG. 4) for fastening with the fixed frame (1500) can be formed along the outer periphery of the assembly seating groove (1330). Here, the fastening projection (1340 in FIG. 4) of the bulkhead module (1300) can be inserted into the fastening groove of the fixed frame (1500) and fastened so that the bulkhead module (1300) and the fixed frame (1500) can be assembled together.

[0116] For example, the height value of the fastening projection (1340) of the bulkhead module (1300) may be equal to or smaller than the depth value of the fastening groove of the fixed frame (1500). This is so that the fastening projection (1340) of the bulkhead module (1300) can be smoothly inserted into the fastening groove of the fixed frame (1500) to improve assembly.

[0117] Next, at least one assembly projection may be formed on the upper surface of the fixed frame (1500) to be assembled with the optical module (1600). Here, the assembly projection (1520) of the fixed frame (1500) may be positioned in the outermost edge region of the fixed frame (1500).

[0118] Additionally, the cross-sectional area of ​​the through hole (1510) of the fixed frame (1500) may be equal to or larger than the cross-sectional area of ​​the pixel hole (1310) of the partition module (1300). This is to prevent light loss from occurring by blocking the light emitted upward through the pixel hole (1310) of the partition module (1300) due to the fixed frame (1500).

[0119] FIGS. 8 and FIGS. 9 are perspective views showing the upper and lower surfaces of an optical module of a lighting device according to one embodiment, FIG. 8 is a perspective view showing the upper surface of the optical module, and FIG. 9 is a perspective view showing the lower surface of the optical module.

[0120] As illustrated in FIGS. 8 and 9, at least one assembly groove (1610) may be formed on the side of the optical module (1600) to be assembled with a fixed frame (1500 in FIG. 6). Here, the assembly groove (1610) of the optical module (1600) may be positioned in the outermost edge region of the optical module (1600).

[0121] Next, the optical module (1600) may include a plurality of diffusers (1620) arranged to be aligned with each through hole (1510 in FIG. 6) of the fixed frame (1500 in FIG. 6). Here, the plurality of diffusers (1620) may be connected to each other by the optical frame of the optical module (1600).

[0122] Additionally, the optical module (1600) may include an optical frame having a plurality of mounting holes formed in each through hole (1510 in FIG. 6) of a fixed frame (1500), and a plurality of diffusers (1620) filled in each mounting hole of the optical frame.

[0123] For example, multiple diffusers (1620) may be made of transparent silicone material.

[0124] As another example, a plurality of diffusers (1620) may include a plurality of beads. Here, the composition ratio of the beads may be 1% to 10% of the total composition of the diffuser (1620), but this is only one example and is not limited thereto.

[0125] As another example, multiple diffusers (1620) may include a fluorescent material.

[0126] Additionally, the optical frame may be made of the same material as the diffuser (1620) or a different material.

[0127] For example, the optical frame may include a light-blocking material to prevent light mixing between adjacent pixels.

[0128] As another example, the optical frame may be made of a material comprising a composition in which a binder resin including an alkali-soluble resin and an epoxy resin is mixed with one or more coloring agents selected from carbon black, a mixture of organic black pigments and color organic pigments, metal oxide inorganic pigments and metal nitride inorganic pigments.

[0129] FIGS. 10 and FIGS. 11 are perspective views showing the upper and lower surfaces of a pattern mask of a lighting device according to one embodiment, FIG. 10 is a perspective view showing the upper surface of the pattern mask, and FIG. 11 is a perspective view showing the lower surface of the pattern mask.

[0130] A pattern mask (1400) may have a plurality of pattern holes (1410) formed therein to diffuse light emitted from a light source (1200) in an upward direction. Here, the pattern mask (1400) may have a plurality of pattern holes (1410) formed in a central area facing the pixel hole (1310) of the partition module (1300 in FIG. 4), and a plurality of pattern holes (1410) may not be formed in an edge area facing the assembly mounting groove (1330 in FIG. 4) of the partition module (1300).

[0131] Additionally, the density of the pattern holes (1410) of the pattern mask (1400) can increase as it moves away from the center of the pattern mask (1400).

[0132] In some cases, the number of pattern holes (1410) of the pattern mask (1400) may increase as they move away from the center of the pattern mask (1400).

[0133] In another case, the size of the pattern hole (1410) of the pattern mask (1400) may increase as it moves away from the center of the pattern mask (1400).

[0134] FIGS. 12 and FIGS. 13 are perspective views showing the upper and lower surfaces of a cover case of a lighting device according to one embodiment, FIG. 12 is a perspective view showing the upper surface of the cover case, and FIG. 13 is a perspective view showing the lower surface of the cover case.

[0135] As illustrated in FIGS. 12 and 13, the cover case (1700) may have a central hole (1720) formed therein that exposes the central region of the optical module (1600 in FIG. 8) to the outside. Here, the cover case (1700) may have a fastening hole (1710) formed therein so as to be fastened to the substrate (1100) through a fastening member.

[0136] For example, the central hole (1720) of the cover case (1700) may have a lower area larger than the upper area. This is so that the cover case (1700) can smoothly cover the entire side of the optical module (1600 in FIG. 8), the fixed frame (1500 in FIG. 6), and the partition module (1300 in FIG. 4) to block light loss.

[0137] The cover case (1700) may include an upper surface cover portion (1730) that covers the upper surface edge area of ​​the optical module (1600 in FIG. 8) and a side cover portion (1740) that covers the sides of the optical module (1600 in FIG. 8), the fixed frame (1500 in FIG. 6), and the partition module (1300 in FIG. 4). Here, the cover case (1700) may have a thickness in the vertical direction from the surface of the substrate (1100 in FIG. 2) that is greater than the total thickness obtained by summing the thickness of the optical module (1600), the thickness of the fixed frame (1500), and the thickness of the partition module (1300). This is so that the cover case (1700) can smoothly cover the entire sides of the optical module (1600), the fixed frame (1500), and the partition module (1300) to block light loss.

[0138] FIG. 14 is a plan view of a vehicle with a lighting device according to an embodiment, FIG. 15 is a drawing showing an example of a taillight and indicator lamp of the vehicle of FIG. 14, and FIG. 16 is an example of a symbol or character of an indicator lamp being displayed by the lighting device of FIG. 15.

[0139] Referring to FIGS. 14 and 15, the front lamp (2) of the moving body or vehicle (1) may include one or more lighting modules, and by individually controlling the driving timing of these lighting modules, it may provide not only the function of a normal headlight but also additional functions such as a welcome light or a celebration effect when the driver opens the vehicle door.

[0140] The lamps can be applied to daytime running lights, high beams, low beams, fog lights, or turn signals. Also, the taillights (2) of the vehicle (1) may have a plurality of lamp units, and the lamp units may be provided as taillights, brake lights, reverse lights, and turn signal lamps.

[0141] The lighting device (6000) may be positioned on one side or the other side relative to the taillight (2) of the vehicle (1), positioned on the upper or lower side, or installed in a part of the rear of the vehicle. The lighting device (6000) may be installed on the side of the vehicle or inside the vehicle.

[0142] This lighting device (6000) displays images or information such as symbols, logos, symbols, or characters by means of multiple pixel (111) regions and is provided as a lighting module or indicator lamp. That is, as shown in (a) and (b) of FIG. 16, it can be displayed as an exclamation mark such as ! or as a character such as STOP that can be seen by other drivers.

[0143] This lighting device (6000) can be assembled with a bulkhead module and an optical module manufactured by injection molding, and can be closely coupled to the surface of a vehicle housing or bracket and covered by a cover lens. That is, the lighting device (6000) may include a plurality of light sources disposed on a substrate, a bulkhead module having a plurality of pixel holes arranged in array with each light source, and an optical module inserted into each pixel hole of the bulkhead module. Here, the bulkhead module has an assembly mounting groove formed on its upper surface around the pixel hole, and the optical module has an assembly protrusion formed around its upper surface so that the assembly protrusion is seated in the assembly mounting groove of the bulkhead module and assembled, or the assembly protrusion can be detached from the assembly mounting groove of the bulkhead module and separated.

[0144] In this way, the lighting device according to the embodiment can improve assembly efficiency and cost competitiveness by minimizing the manufacturing and assembly processes, by manufacturing a partition module in which an assembly mounting groove for mounting a pattern mask is formed on the upper surface around each pixel hole using an injection molding method, and by aligning and assembling one pattern mask for each pixel hole using an individual assembly method.

[0145] In addition, the lighting device may be applied to a headlight or taillight to function as a headlight or taillight, or to display images or information in the headlight or taillight.

[0146] The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment may be combined or modified and implemented in other embodiments by a person skilled in the art to which the embodiments belong. Therefore, details regarding such combinations and modifications should be interpreted as being included within the scope of the present invention.

[0147] Furthermore, although the invention has been described above with reference to embodiments, this is merely illustrative and does not limit the invention. Those skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments. For example, each component specifically shown in the embodiments may be modified and implemented. Differences related to such modifications and applications should be interpreted as being included within the scope of the invention as defined in the appended claims.

Claims

1. Substrate; A partition module disposed on the above substrate and having a plurality of pixel holes formed therein; and, It includes a plurality of pattern masks aligned with each of the above pixel holes, and The above bulkhead module is, A lighting device having an assembly mounting groove formed on the upper surface around each pixel hole for mounting the pattern mask.

2. In Paragraph 1, The assembly mounting groove of the above bulkhead module is, A lighting device facing the lower edge area of ​​the above pattern mask.

3. In Paragraph 1, The above pattern mask is, A lighting device having a plurality of pattern holes formed to diffuse light emitted from a light source in an upward direction.

4. In Paragraph 1, A plurality of light sources disposed on the substrate and aligned with each pixel hole; A fixed frame disposed on the above bulkhead module and fixing the pattern mask; and, A lighting device further comprising an optical module disposed on the fixed frame.

5. In Paragraph 4, The above fixed frame is, A plurality of through holes are formed that are aligned with each pixel hole of the above bulkhead module, and On the lower surface of the above fixed frame, A lighting device having a fixing projection formed around each of the above-mentioned through holes, protruding in the direction of the bulkhead module to fix the pattern mask.

6. In Paragraph 4, On the side of the above optical module, A lighting device having at least one assembly groove formed therein to be assembled with the above-mentioned fixed frame.

7. In Paragraph 6, The above optical module is, A lighting device comprising a plurality of diffusers arranged to be aligned in each through hole of the fixed frame.

8. In Paragraph 7, The above plurality of diffusers are, Lighting devices connected to each other by the optical frames of the above optical modules.

9. In Paragraph 4, It further includes a cover case that covers the edge area of ​​the optical module, and The above cover case is, A lighting device having a central hole formed to expose the central area of ​​the above optical module to the outside.

10. In a display lamp comprising at least one lighting device, At least one lighting device in which a bulkhead module and an optical module are assembled; and, It includes a cover lens that covers the above lighting device, and The above lighting device is, Substrate; A partition module disposed on the above substrate and having a plurality of pixel holes formed therein; and, It includes a plurality of pattern masks aligned with each of the above pixel holes, The above bulkhead module is, A lighting device having an assembly mounting groove formed on the upper surface around each pixel hole for mounting the pattern mask.