Electronic device comprising antenna

WO2026168750A1PCT designated stage Publication Date: 2026-08-13SAMSUNG ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-12-24
Publication Date
2026-08-13

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Abstract

This electronic device may comprise: a wireless communication circuit; a metal frame including a side structure and a support structure, wherein a plurality of connection portions include a first connection portion, a second connection portion, and a third connection portion that connect the support structure and the side structure; and a dielectric material filling slots of the metal frame. The slots may include a first slot formed between the first connection portion and the second connection portion and defined by a conductive region of the side structure including a feed portion electrically connected to the wireless communication circuit, and a second slot formed between the second connection portion and the third connection portion and adjacent to the first slot along the outer side surface. The first slot may be spaced apart from the second slot by a distance of less than 6.5 mm (millimeter).
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Description

Electronic device including an antenna

[0001] Various embodiments of the present disclosure relate to an electronic device including an antenna.

[0002] An electronic device can transmit a signal through an antenna or receive a signal through an antenna. The electronic device may include multiple antennas to support various frequency bands. For example, a slot in the metal frame of the electronic device may function as a radiator for an antenna to transmit and / or receive a signal.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] According to embodiments of the present disclosure, an electronic device is provided. The electronic device may include a metal frame comprising a side bezel structure forming the exterior of the electronic device and a support structure extending inwardly from the side bezel structure; and a wireless communication circuit. The side bezel structure may include a conductive portion formed along the side of the electronic device. The metal frame may include a first connection portion to which the conductive portion and the support structure are connected, a second connection portion to which the conductive portion and the support structure are connected next to the first connection portion, and a third connection portion to which the support structure is connected next to the second connection portion. The metal frame may have a first slot formed between the first connection portion and the second connection portion and a second slot formed between the second connection portion and the third connection portion. The wireless communication circuit may be configured to perform communication based on the first slot and the second slot.

[0005] According to embodiments of the present disclosure, an electronic device is provided. The electronic device comprises a metal frame including a side bezel structure forming the exterior of the electronic device and a support structure extending inwardly from the side bezel structure; and the side bezel structure may include a conductive portion formed along the longitudinal direction of the electronic device. The metal frame may include a first connecting portion to which the conductive portion and the support structure are connected, a second connecting portion to which the conductive portion and the support structure are connected following the first connecting portion in the longitudinal direction, and a third connecting portion to which the support structure is connected following the second connecting portion in the longitudinal direction. The metal frame may have a first slot formed between the first connecting portion and the second connecting portion and a second slot formed between the second connecting portion and the third connecting portion. The slot size of the second slot may be 70% or more and less than 90% of the slot size of the first slot.

[0006] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a wireless communication circuit; a metal frame comprising a side structure forming an outer side of the electronic device and a support structure connected from the side structure through a plurality of connecting portions, wherein the plurality of connecting portions include a first connecting portion connecting the support structure and the side structure, a second connecting portion connecting the support structure and the side structure, and a third connecting portion connecting the support structure and the side structure; and a dielectric material filled in slots of the metal frame. The slots may include a first slot formed between the first connecting portion and the second connecting portion and formed by a conductive region of the side structure including a feed portion electrically connected to the wireless communication circuit, and a second slot formed between the second connecting portion and the third connecting portion and adjacent to the first slot along the outer side. The first slot may be spaced apart from the second slot by a distance of less than 6.5 mm (millimeter).

[0007] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a metal frame comprising a side structure forming an outer side of the electronic device and a support structure connected from the side structure through a plurality of connecting portions, wherein the plurality of connecting portions include a first connecting portion connecting the support structure and the side structure, a second connecting portion connecting the support structure and the side structure, and a third connecting portion connecting the support structure and the side structure; and may include a dielectric material filled in slots of the metal frame. The slots may include a first slot formed between the first connecting portion and the second connecting portion, and a second slot formed between the second connecting portion and the third connecting portion and adjacent to the first slot along the outer side. The slot size of the second slot may be 70% or more and less than 90% of the slot size of the first slot.

[0008] Figure 1 is a block diagram of an electronic device in a network environment.

[0009] Figures 2a and 2b show examples of bar-type electronic devices.

[0010] Figure 3 shows an example of the frame structure and slots of an electronic device.

[0011] Figure 4 shows an example of the electric field of a slot antenna.

[0012] Figure 5 shows the total radiation efficiency of a slot antenna using a feed slot and an adjacent slot.

[0013] Figure 6a shows examples of slot lengths of adjacent slots.

[0014] Figure 6b shows the total efficiency according to the slot length of adjacent slots.

[0015] Figures 7a, 7b, and 7c show the wire loss according to the slot length of adjacent slots.

[0016] Figure 8 shows examples of connection parts between a feed slot and an adjacent slot.

[0017] Figure 9 shows the overall efficiency according to the length of the connection part.

[0018] FIGS. 10a, FIGS. 10b, and FIGS. 10c show examples of electric fields of a slot antenna using at least one slot.

[0019] Figure 11 shows an example of a slot antenna using a feed slot and two contact slots.

[0020] Figure 12a shows the overall efficiency of a slot antenna using a feed slot and two adjacent slots.

[0021] FIG. 12b shows examples of electric fields of a slot antenna using at least one slot.

[0022] The terms used in this disclosure are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. A singular expression may include a plural expression unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this disclosure. Terms used in this disclosure that are defined in a general dictionary may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this disclosure. In some cases, even terms defined in this disclosure are not to be interpreted to exclude the embodiments of this disclosure.

[0023] In the various embodiments of the present disclosure described below, a hardware-based approach is described as an example. However, since the various embodiments of the present disclosure include techniques using both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0024] Terms referring to components of an electronic device used in the following description (e.g., substrate, PCB (print circuit board), FPCB (flexible PCB), PBA (printed board assembly), module, antenna, antenna element, circuit, processor, chip, component, or device), terms referring to the shape of a component (e.g., structure, structure, support, contact, or protrusion), terms referring to a part of a component (e.g., point, section, region), terms referring to connections between structures (e.g., connection part, joint part, contact part, weld part, connection part, contact part, support part, contact structure, conductive member, or assembly), terms referring to an open structure of an antenna (e.g., slot, slit, or opening), terms referring to a circuit (e.g., PCB, FPCB, signal line, ground line, feeding line, data line, RF signal line, antenna line, RF path, RF module, RF circuit, splitter, divider, coupler), Terms such as 'combiner' are provided as examples for convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. Furthermore, terms such as '...part', '...device', '...object', or '...body' used below may refer to at least one shape structure or a unit that processes a function.

[0025] Additionally, in this disclosure, expressions such as "greater than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled; however, this is merely for the purpose of expressing an example and does not exclude descriptions such as "greater than" or "less than." Conditions described as "greater than" may be replaced with "greater than," conditions described as "less than" may be replaced with "less than," and conditions described as "greater than and less than" may be replaced with "greater than and less than." Furthermore, "A" to "B" below refer to at least one of the elements from A (including A) to B (including B). Below, "C" and / or "D" refers to at least one of "C" or "D," i.e., including {"C," "D," and "C" and "D"}. Furthermore, below, the meaning of "approximately E" may be substituted with a value within an error range of ±5% or ±10% based on E.

[0026] Figure 1 is a block diagram of an electronic device in a network environment.

[0027] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0028] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0029] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0030] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, software (e.g., program (140)) and input or output data for related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0031] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0032] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0033] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0034] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0035] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0036] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0037] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0038] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0040] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0041] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0042] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0044] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0045] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0046] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0047] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0048] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] FIGS. 2A and FIGS. 2B show examples of bar-type electronic devices (e.g., electronic device (101)).

[0050] Referring to FIG. 2a, for example, an electronic device (101) may include a housing (210) that forms the exterior of the electronic device (101). For example, the housing (210) may include a front (200A), a rear (200B), and a side (200C) that surrounds the space between the front (200A) and the rear (200B). For example, the housing (210) may refer to a structure that forms at least some of the front (200A), the rear (200B), and / or the side (200C).

[0051] For example, the electronic device (101) may include a substantially transparent front plate (202). For example, the front plate (202) may form at least a portion of the front (200A). For example, the front plate (202) may include a glass plate or a polymer plate including various coating layers, but is not limited thereto.

[0052] For example, the electronic device (101) may include a substantially opaque back plate (211). For example, the back plate (211) may form at least a portion of the back (200B). For example, the back plate (211) may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.

[0053] For example, the electronic device (101) may include a side bezel structure (or side member) (218). For example, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of the side (200C) of the electronic device (101). For example, the side bezel structure (218) may form the entire side (200C) of the electronic device (101), or, for another example, the side bezel structure (218) may form the side (200C) of the electronic device (101) together with the front plate (202) and / or the rear plate (211).

[0054] Unlike the illustrated embodiment, where the side (200C) of the electronic device (101) is partially formed by the front plate (202) and / or the rear plate (211), the front plate (202) and / or the rear plate (211) may include a region that curves toward the rear plate (211) and / or the front plate (202) at its edge and extends seamlessly. The extended region of the front plate (202) and / or the rear plate (211) may be located, for example, at both ends of the long edge of the electronic device (101), but is not limited to the example described above.

[0055] For example, the side bezel structure (218) may comprise a metal and / or a polymer. For example, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum), but are not limited thereto. For example, the rear plate (211) and the side bezel structure (218) may be formed as separate components and / or may comprise different materials.

[0056] For example, the electronic device (101) may include at least one of a display (201) (e.g., display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., audio module (170) of FIG. 1), a sensor module (not shown) (e.g., sensor module (176) of FIG. 1), a camera module (205, 212) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), a light-emitting element (not shown), and / or a connector hole (208). For example, the electronic device (101) may omit at least one of the above components (e.g., key input device (217) or light-emitting element (not shown)) or additionally include other components.

[0057] For example, the display (201) may be visually exposed through a significant portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the front (200A). For example, the display (201) may be positioned on the back of the front plate (202).

[0058] For example, the outer shape of the display (201) may be formed to be generally the same as the outer shape of the front plate (202) adjacent to the display (201). For example, in order to expand the visually exposed area of ​​the display (201), the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be generally the same.

[0059] For example, the display (201) (or the front (200A) of the electronic device (101)) may include a screen display area (201A). For example, the display (201) may provide visual information to the user through the screen display area (201A). In the illustrated embodiment, when the front (200A) is viewed from the front, the screen display area (201A) is shown to be located on the inner side of the front (200A) and spaced apart from the outer edge of the front (200A), but is not limited thereto. In another embodiment, when the front (200A) is viewed from the front, at least a portion of the edge of the screen display area (201A) may substantially coincide with the edge of the front (200A) (or the front plate (202)).

[0060] For example, the screen display area (201A) may include a sensing area (201B) configured to acquire the user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" can be understood as at least a portion of the sensing area (201B) being overlapped with the screen display area (201A). For example, the sensing area (201B) may refer to an area that can display visual information by the display (201) just like other areas of the screen display area (201A), and additionally acquire the user's biometric information (e.g., fingerprint). For example, the sensing area (201B) may be formed on a key input device (217).

[0061] For example, the display (201) may include an area where the first camera (205) is located. For example, an opening may be formed in the area of ​​the display (201), and the first camera (205) (e.g., a punch-hole camera) may be placed at least partially within the opening so as to face the front (200A). In this case, the screen display area (201A) may surround at least a portion of the edge of the opening. For example, the first camera (205) (e.g., an under-display camera (UDC)) may be placed below the display (201) so as to overlap with the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera (205) may acquire an image corresponding to the direction facing the front (200A) through the area of ​​the display (201).

[0062] For example, the display (201) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type stylus pen.

[0063] For example, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0064] For example, the microphone holes (203, 204) may include a first microphone hole (203) formed in a part of the side (200C) and a second microphone hole (204) formed in a part of the rear (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound.

[0065] For example, a second microphone hole (204) formed in a part of the rear surface (200B) may be positioned adjacent to the camera module (205, 212). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212). However, it is not limited thereto.

[0066] The speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the side (200C) of the electronic device (101). For example, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in a different part of the side (200C). For example, the call receiver hole may be formed on the side (200C) opposite the external speaker hole (207). For example, based on the illustration in FIG. 2a, the external speaker hole (207) may be formed on the side (200C) corresponding to the bottom part of the electronic device (101), and the call receiver hole may be formed on the side (200C) corresponding to the top part of the electronic device (101). However, it is not limited thereto, and for example, the call receiver hole may be formed at a location other than the side (200C). For example, the call receiver hole may be formed by the spaced-apart space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0067] For example, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing through an external speaker hole (207) and / or a receiver hole for calls (not shown). For example, the speaker may include a piezo speaker configured to output audio by vibrating a diaphragm within the speaker using a piezoelectric element. However, it is not limited thereto.

[0068] For example, a sensor module (not shown) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, a heart rate monitor (HRM) sensor, a fingerprint sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0069] For example, the camera module (205, 212) may include a first camera (205) positioned to face the front (200A) of the electronic device (101), and a second camera (212) positioned to face the rear (200B).

[0070] For example, the second camera (212) may include a plurality of cameras (e.g., a dual camera, a triple camera, or a quad camera). However, the second camera (212) is not necessarily limited to including a plurality of cameras and may include a single camera.

[0071] For example, the first camera (205) and the second camera (212) may include one or more lenses, an image sensor, and / or an image signal processor.

[0072] For example, the electronic device (101) may include a flash (213) positioned to face the rear (200B). For example, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. For example, two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be positioned on one side of the electronic device (101).

[0073] For example, a key input device (217) may be placed on the side (200C) of the electronic device (101). For example, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201).

[0074] For example, a connector hole (208) may be formed on the side (200C) of the electronic device (101) so as to accommodate a connector of an external device. A connection terminal (e.g., connection terminal (178) of FIG. 1) that is electrically connected to the connector of the external device may be disposed within the connector hole (208). For example, the electronic device (101) may include an interface module (e.g., interface (177) of FIG. 1) for processing electrical signals transmitted and received through the connection terminal.

[0075] For example, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be placed on the front (200A) of the housing. The light-emitting element (not shown) may provide state information of the electronic device (101) in the form of light. For example, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0076] FIG. 2b is an exploded perspective view of an electronic device (101). In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above will be omitted.

[0077] Referring to FIG. 2b, for example, the electronic device (101) may include a display (201), a front plate (202), a rear plate (211), a frame structure (240), a first printed circuit board (250), a second printed circuit board (252), a cover plate (260), and a battery (270) (e.g., the battery (189) of FIG. 1).

[0078] For example, the frame structure (240) may include a side bezel structure (218) forming the exterior of the electronic device (101) (e.g., the side (200C) of FIG. 2a) and a support structure (243) extending inward from the side bezel structure (218). For example, the frame structure (240) may be positioned between the display (201) and the rear plate (211). For example, the side bezel structure (218) of the frame structure (240) may surround the space between the rear plate (211) and the front plate (202) (and / or the display (201)), and the support structure (243) of the frame structure (240) may extend from the side bezel structure (218) within the space.

[0079] For example, the frame structure (240) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be placed on one side of the frame structure (240) facing in one direction (e.g., the (+)z-axis direction), and the display (201) may be supported by a support structure (243) of the frame structure (240). For example, a first printed circuit board (250), a second printed circuit board (252), a battery (270), and a second camera (212) may be placed on the other side of the frame structure (240) facing in the opposite direction to the one direction (e.g., the (-)z-axis direction). The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera (212) can be seated in a recess defined by the side bezel structure (218) and / or support structure (243) of the frame structure (240).

[0080] For example, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may each be coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly positioned on the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly positioned on the frame structure (240) through an adhesive member (e.g., double-sided tape). However, it is not limited to the examples described above.

[0081] For example, the cover plate (260) may be placed between the first printed circuit board (250) and the back plate (211). For example, the cover plate (260) may be placed on the first printed circuit board (250). For example, the cover plate (260) may be placed on the surface facing the (-)z axis direction of the first printed circuit board (250).

[0082] For example, the cover plate (260) may overlap at least partially with the first printed circuit board (250) with respect to the z-axis. For example, the cover plate (260) may cover at least a portion of the first printed circuit board (250). By doing so, the cover plate (260) can protect the first printed circuit board (250) from physical impact or prevent the connector coupled to the first printed circuit board (250) from becoming detached.

[0083] For example, the cover plate (260) may be fixedly positioned on the first printed circuit board (250) through a connecting member (e.g., a screw) or may be coupled to the frame structure (240) together with the first printed circuit board (250) through said connecting member.

[0084] For example, the display (201) may be positioned between the frame structure (240) and the front plate (202). For example, the front plate (202) may be positioned on one side of the display (201) (e.g., in the (+)z-axis direction), and the frame structure (240) may be positioned on the other side (e.g., in the (-)z-axis direction).

[0085] For example, the front plate (202) can be combined with the display (201). For example, the front plate (202) and the display (201) can be bonded to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed between them.

[0086] For example, the front plate (202) may be combined with the frame structure (240). For example, the front plate (202) may include an outer portion extending outward from the display (201) when viewed in the z-axis direction, and may be bonded to the frame structure (240) through an adhesive member (e.g., double-sided tape) placed between the outer portion of the front plate (202) and the frame structure (240) (e.g., side bezel structure (218)). However, it is not limited to the examples described above.

[0087] For example, the first printed circuit board (250) and / or the second printed circuit board (252) may be equipped with a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory (e.g., volatile memory (132) of FIG. 1) or non-volatile memory (e.g., non-volatile memory (134) of FIG. 1). The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface can electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector. For example, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other through a connecting member (e.g., a flexible printed circuit board).

[0088] For example, the battery (270) can supply power to at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (250) and / or the second printed circuit board (252).

[0089] For example, the electronic device (101) may include an antenna module (not shown). For example, the antenna module may be placed between the rear plate (211) and the battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, communicate near-field with an external device or wirelessly transmit and receive power with an external device.

[0090] For example, the first camera (205) (e.g., front camera) may be placed in at least a part of the frame structure (240) (e.g., support structure (243)) so that the lens can receive external light through a part of the front plate (202) (e.g., front (200A) in FIG. 2a) (e.g., camera area (237)).

[0091] For example, a second camera (212) (e.g., a rear camera) may be positioned between the frame structure (240) and the rear plate (211). For example, the second camera (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). For example, the second camera (212) may be positioned so that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (101).

[0092] For example, the camera area (284) may be formed on the surface of the rear plate (211) (e.g., the rear (200B) of FIG. 2A). For example, the camera area (284) may be formed at least partially transparent so that external light can be incident on the lens of the second camera (212). For example, at least a portion of the camera area (284) may protrude a certain height from the surface of the rear plate (211). However, it is not limited thereto, and in other embodiments, the camera area (284) may form substantially the same plane as the surface of the rear plate (211).

[0093] For example, the housing of the electronic device (101) (e.g., the housing (210) of FIG. 2a) may mean a configuration or structure that forms at least a part of the exterior of the electronic device (101). In this regard, at least a part of the front plate (202), frame structure (240), and / or rear plate (211) that form the exterior of the electronic device (101) may be referred to as the housing (210) of the electronic device (101).

[0094] FIG. 3 shows an example of a frame structure (e.g., frame structure (240)) and slots of an electronic device (e.g., electronic device (101)).

[0095] Referring to FIG. 3, the electronic device (101) may include a frame structure (240). The frame structure (240) may include a side structure (e.g., a side bezel structure (218)) and a support structure connected to the side structure (e.g., a support structure (243) extending inward from the side bezel structure (218)). According to one embodiment, the frame structure (240) may include metal. The frame structure (240) may be referred to as a metal frame. According to one embodiment, the side bezel structure (218) may include a conductive portion (310) formed along one direction (e.g., the (-)y-axis direction). The conductive portion (310) of the side bezel structure (218) may be connected to a support structure (243) located inwardly of the electronic device (101). For example, a portion of the conductive part (310) of the side bezel structure (218) may be connected to a portion of the support structure (243) through welding (e.g., pole welding). For example, the side bezel structure (218) and the support structure (243) may be formed integrally through CNC (Computer Numerical Control Machining) processing.

[0096] The frame structure (240) may include connecting portions in which the conductive portion (310) of the side bezel structure (218) and the support structure (243) are connected. For example, the frame structure (240) may include, based on one direction (e.g., the (-)y-axis direction), a first connecting portion (351), a second connecting portion (352) following the first connecting portion (351), a third connecting portion (353) following the second connecting portion (352), a fourth connecting portion (354) following the third connecting portion (353), and / or a fifth connecting portion (355) following the fourth connecting portion (354). A slot may be formed between adjacent connecting portions. For example, a first slot (321) may be formed between the first connecting portion (351) and the second connecting portion (352). For example, a second slot (322) may be formed between the second connecting portion (352) and the third connecting portion (353). Although not shown in FIG. 3, the electronic device (101) may include a non-conductive material to fill the gaps or slots (e.g., the first slot (321), the second slot (322)) between the conductive portion (310) and other conductive portions (319) for appearance. The non-conductive material may be placed in the slots.

[0097] The electronic device (101) can transmit or receive a signal. The electronic device (101) can use slots as an antenna for transmitting a signal. In other words, the electronic device (101) can transmit or receive a signal through an antenna using slots (hereinafter, a slot antenna). For example, the conductive portion (310) may include a feed portion (340) formed between a first connection portion (351) and a second connection portion (352). The feed portion (340) may include a feed point where signals are provided from a wireless communication circuit (390) (e.g., a communication module (190)). For example, the wireless communication circuit (390) is placed on a printed circuit board, and a conductive connection member (e.g., a C-clip, a conductive pattern) electrically connected to the wireless communication circuit (390) may come into contact with the feed portion (340). The feed portion (340) may have a shape that protrudes inward. The power supply portion (340) may be located within the first slot (321). In terms of the conductive region forming the first slot (321) including the power supply portion (340), the first slot (321) may be referred to as a power supply slot.

[0098] As a method to improve the performance of the slot antenna, the shape of the first slot (321) may be considered to be symmetric with respect to the feed portion (340) on one plane (e.g., the xy plane). However, depending on the manufacturing method of the frame structure (240) or the position of the battery (270), it may not be easy to design the first slot (321) with a symmetric shape. For example, the first slot (321) may include a first part slot in the (+)y-axis direction and a second part slot in the (-)y-axis direction with respect to the feed portion (340). The first part slot and the second part slot may be asymmetric with respect to the feed portion (340). To reduce antenna performance due to asymmetry, the frame structure (240) according to embodiments of the present disclosure may have a feed slot (e.g., a first slot (321)) and a slot formed adjacent to the feed slot (hereinafter, an adjacent slot) (e.g., a second slot (322)). Antenna performance may be improved through the adjacent slot located within a certain distance from the feed slot.

[0099] The first slot (321) of the frame structure (240) represents a first space surrounded by a first connection part (351), a second connection part (352), a portion of the conductive part (310) from the first connection part (351) to the second connection part (352), and a portion of the support structure (243) from the second connection part (352) to the first connection part (351). A non-conductive material may be placed in the first space. The second slot (322) represents a second space surrounded by a second connection part (352), a third connection part (353), a portion of the conductive part (310) from the second connection part (352) to the third connection part (353), and a portion of the support structure (243) from the third connection part (353) to the second connection part (352). A non-conductive material may be placed in the second space. If there is no slot adjacent to the first slot (321) (e.g., second slot (322)), the electric field may be concentrated in the first slot (321). Dielectric loss due to non-conductive material within the first slot (321) may increase. To disperse the electric field in the first slot (321), the frame structure (240) according to the present disclosures may have a second slot (322) adjacent to the first slot (321) that includes a feed portion (340). As the electric field from the feed portion (340) is induced into the second slot (322), the electric field may be dispersed. As dielectric loss due to non-conductive material decreases, antenna performance (e.g., total radiation efficiency) may increase.

[0100] According to one embodiment, the second slot (322) may be formed adjacent to the first slot (321). To disperse the electric field generated in the first slot (321) corresponding to the feed slot, the second slot (322) may be located within a certain distance from the first slot (321). For example, the second connecting portion (352) may be positioned between the first slot (321) and the second slot (322). The length of the second connecting portion (352) along one axis (e.g., the y-axis) may affect the antenna performance of the slot antenna utilizing the first slot (321) and the second slot (322). For example, the length of the second connecting portion (352) along one axis (e.g., the y-axis) may be within approximately 7 mm. Descriptions regarding the length of the second connecting portion (352) are described in detail through FIGS. 8 to 10c.

[0101] According to one embodiment, the second slot (322) may be formed at a position corresponding to the longitudinal direction of the first slot (321). The longitudinal direction of the slot represents the direction in which it extends longest relative to the shape of the slot. The shape of the first slot (321) may be asymmetrical. The first slot (321) may include a first slot portion (321a) facing the (+)y-axis direction and a second slot portion (321b) facing the (-)y-axis direction. Since the second slot portion (321b) is longer than the first slot portion (321a) relative to the power supply portion (340), the longitudinal direction of the first slot (321) may be the (-)y-axis direction. The second slot (322) may be formed at a position corresponding to the (-)y-axis direction.

[0102] According to one embodiment, the slot size of the second slot (322) may be smaller than the slot size of the first slot (321). The slot size may affect dielectric loss. To reduce dielectric loss in the first slot (321) and dielectric loss in the second slot (322), the slot size of the second slot (322) may be determined relatively to the slot size of the first slot (321). For example, the slot size of the second slot (322) may be about 70% or more and less than about 90% of the slot size of the first slot (321). Descriptions of the slot sizes are described in detail through FIGS. 6a through 7c. As an example, but not limited to, the slot length may be used instead of the slot size, as the slot has a width that is relatively short compared to the slot length (e.g., the length of the path in the slot). For example, the slot length of the second slot (322) may be shorter than the slot length of the first slot (321). For example, the slot length of the second slot (322) may be about 70% or more and less than about 90% of the slot length of the first slot (321). As an example, but not limited to, the length direction of the second slot (322) may correspond to the length direction of the first slot (321). As an example, but not limited to, the length direction of the second slot (322) may be aligned with the length direction of the first slot (321).

[0103] Figure 4 shows an example of the electric field of a slot antenna.

[0104] Referring to FIG. 4, Example (401) shows the electric field of a slot antenna using only the first slot (321) corresponding to the feed slot without adjacent slots. Example (402) shows the electric field of a slot antenna using the first slot (321) corresponding to the feed slot and the second slot (322) corresponding to the adjacent slot in the frame structure (240) illustrated in FIG. 3. Referring to Example (401), it can be confirmed that the electric field of a slot antenna using only the first slot (321) has a distribution concentrated in the first slot (321). Referring to Example (402), it can be confirmed that the electric field of a slot antenna using both the first slot (321) and the second slot (322) is distributed to the first slot (321) and the second slot (322). As the electric field is distributed, dielectric loss can be reduced.

[0105] FIG. 5 shows the total radiation efficiency of a slot antenna using a feed slot (e.g., first slot (321)) and an adjacent slot (e.g., second slot (322)).

[0106] Referring to FIG. 5, the graph (500) represents the total radiation efficiency by frequency. The horizontal axis of the graph (500) represents frequency (unit: MHz (megahertz)), and the vertical axis of the graph (500) represents the total radiation efficiency (unit: dB (decibel)). The first line (501) represents the total radiation efficiency of a slot antenna using only the first slot (321) corresponding to the feed slot without adjacent slots. The second line (502) represents the total radiation efficiency of a slot antenna using the first slot (321) corresponding to the feed slot and the second slot (322) corresponding to the adjacent slot. By referring to the first line (501) and the second line (502), it can be confirmed that the peak gain increases due to the adjacent slot (e.g., the second slot (322)). Additionally, by referring to the first line (501) and the second line (502), it can be seen that within the n77 band (3300 MHz or more and less than 4200 MHz, TDD (time division duplex)), the bandwidth (e.g., a frequency range with an overall radiation efficiency of about -10 dB or more) is increased by about 240 MHz due to the adjacent slot (e.g., the second slot (322)).

[0107] Figure 6a shows examples of slot lengths of adjacent slots. Figure 6b shows the overall radiation efficiency according to the slot length of adjacent slots.

[0108] Referring to FIG. 6a, the frame structure (240) may include a first connection portion (351), a second connection portion (352), and a third connection portion (353) between the conductive portion (310) and the support structure (243). The frame structure (240) may have a first slot (321) between the first connection portion (351) and the second connection portion (352), and a second slot (322) between the second connection portion (352) and the third connection portion (353). The electronic device (101) may transmit or receive a signal through a slot antenna utilizing the first slot (321) and the second slot (322). For a connection between the first slot (321) and the wireless communication circuit (390) of the electronic device (101) (e.g., the communication module (190) of FIG. 1), the conductive portion (310) may include a feed portion (340). The feed portion (340) may have a feed point connected to a wireless communication circuit (390). The electric field of signals radiated through the conductive region forming the first slot (321) may be excited around the second slot (322). Depending on the slot size of the second slot (322), the electric field may vary. Therefore, depending on the slot size of the second slot (322), the radiation performance of the slot antenna using the first slot (321) and the second slot (322) may vary. For example, the slot length of the second slot (322) may be a first value (651). The first slot (321) may have a curved shape along the feed portion (340) between the first connection portion (351) and the second connection portion (352). The first value (651) may correspond to the slot length (641) of the first slot (321). For example, the first value (651) may be approximately 28.4 mm. For example, the slot length of the second slot (322) may be the second value (652). The second value (652) may correspond to the straight-line distance (642) from the starting point to the ending point of the first slot (321). For example, the second value (652) may be approximately 20.6 mm.For example, the slot length of the second slot (322) may be a third value (653). The third value (653) may correspond to the distance (643) of the path from the point of power supply of the power supply section (343) to the end point of the first slot (321). For example, the third value (653) may be approximately 19.4 mm. For example, the slot length of the second slot (322) may be a fourth value (654). The fourth value (654) may correspond to the straight-line distance (644) from the point of power supply of the power supply section (343) to the end point of the second slot (322). For example, the fourth value (654) may be approximately 15.4 mm.

[0109] Referring to FIG. 6b, graph (600b) represents the overall efficiency by frequency. The horizontal axis of graph (600b) represents frequency (unit: GHz), and the vertical axis of graph (600b) represents the overall efficiency (unit: dB). The first line (661) represents the overall efficiency of a slot antenna using a feed slot (e.g., the first slot (321)) in a frame structure without adjacent slots (e.g., the second slot (322)). The second line (662) represents the overall efficiency of a slot antenna using the first slot (321) and the second slot (322) having a slot length of the first value (651) of FIG. 6a. The third line (663) represents the overall efficiency of a slot antenna using the first slot (321) and the second slot (322) having a slot length of the second value (652) of FIG. 6a. The fourth line (664) represents the overall efficiency of a slot antenna using the first slot (321) and the second slot (322) having a slot length of the third value (653) of FIG. 6a. The fifth line (665) represents the overall efficiency of a slot antenna using the first slot (321) and the second slot (322) having a slot length of the fourth value (654) of FIG. 6a.

[0110] Referring to the first line (661), the second line (662), the third line (663), the fourth line (664), and the fifth line (665), it can be confirmed that the overall efficiency is highest in the second line (662). It can be confirmed that the overall efficiency when the slot length of the second slot (322) is the same as the slot length of the first slot (321) is lower than the overall efficiency when the slot length of the second slot (322) is shorter than the slot length of the first slot (321). According to one embodiment, the slot length of the second slot (322) may be shorter than the slot length of the first slot (321). According to one embodiment, the slot length of the second slot (322) may be a value of about 70% or more and less than about 90% of the slot length of the first slot (321). For example, if the slot length of the first slot (321) is about 28.4 mm, the slot length of the second slot (322) may be about 19.88 mm or more and less than about 25.56 mm. As an example, the slot length of the second slot (322) may be about 20.6 mm.

[0111] FIGS. 7a, 7b, and 7c show the line loss according to the slot length of adjacent slots. To verify the effect of dielectric loss according to the slot length of adjacent slots, a test environment may be defined. A metal structure having a feed slot and an adjacent slot may be used. The feed slot may have a slot length of approximately 42 mm. For the test environment, the adjacent slot may have a slot length of approximately 0 to 42 mm. The width of the feed slot may be the same as the width of the adjacent slot. A dielectric (e.g., a dielectric constant of approximately 3.5) may be filled in each of the adjacent slot and the dielectric slot.

[0112] Referring to FIG. 7a, graph (700a) shows the dielectric loss in the feed slot according to the slot length of the adjacent slot. The horizontal axis of graph (700a) represents the slot length of the adjacent slot (unit: mm), and the vertical axis of graph (700a) represents the dielectric loss in the feed slot (unit: none). Referring to graph (700a), it can be observed that as the slot length of the adjacent slot increases, the dielectric loss in the feed slot tends to decrease.

[0113] Referring to FIG. 7b, graph (700b) shows the dielectric loss in an adjacent slot according to the slot length of the adjacent slot. The horizontal axis of graph (700b) represents the slot length of the adjacent slot (unit: mm), and the vertical axis of graph (700b) represents the dielectric loss in the adjacent slot (unit: none). Referring to graph (700b), it can be confirmed that as the slot length of the adjacent slot increases, the dielectric loss in the adjacent slot tends to increase.

[0114] Referring to FIG. 7c, graph (700c) represents the total dielectric loss according to the slot length of adjacent slots. Total dielectric loss represents the sum of the dielectric loss in the feed slot and the dielectric loss in adjacent slots. The horizontal axis of graph (700c) represents the slot length of adjacent slots (unit: mm), and the vertical axis of graph (700c) represents the total dielectric loss (unit: none). By referring to graph (700c), the lowest total dielectric loss can be identified in region (750).

[0115] The values ​​of each of graphs (700a), (700b), and (700c) can be summarized in the table below.

[0116] Slot Length of Adjacent Slot Dielectric Loss in Feed Slot Dielectric Loss in Adjacent Slot Total Dielectric Loss 00.19 20.13 10.32 3100.18 80.12 90.31 8200.18 10.12 60.30 7300.16 80.12 40.29 2340.15 90.12 40.28 436 0.15 30.12 70.28 380.14 80.13 20.28 390.14 60.13 60.28 2400.14 50.14 30.28 7410.14 60.15 00.29 6420.15 10.15 90.310

[0117] Referring to [Table 1], for a feed slot having a slot length of approximately 42 mm, it can be confirmed that the total dielectric loss is lowest in an adjacent slot having a slot length of approximately 36 mm to 38 mm. According to one embodiment, the slot size of the adjacent slot may be a value in the range of approximately 70% or more and less than approximately 90% of the slot size of the feed slot. For example, if the difference between the width of the adjacent slot and the width of the feed slot is less than a reference value, or if the width of the adjacent slot and the width of the feed slot are each less than a threshold value, the slot size may be dependent on the slot length. The slot length of the adjacent slot may be a value in the range of approximately 70% or more and less than approximately 90% of the slot length of the feed slot.

[0118] Figure 8 shows examples of connection parts between a power supply slot and an adjacent slot. Figure 9 shows the overall efficiency according to the length of the connection part.

[0119] Referring to FIG. 8, the frame structure (240) may include a first connection portion (351), a second connection portion (352), and a third connection portion (353) between the conductive portion (310) and the support structure (243). The frame structure (240) may have a first slot (321) between the first connection portion (351) and the second connection portion (352), and a second slot (322) between the second connection portion (352) and the third connection portion (353). The electronic device (101) may transmit or receive a signal through a slot antenna utilizing the first slot (321) and the second slot (322). For a connection between the first slot (321) and the wireless communication circuit (390) of the electronic device (101) (e.g., the communication module (190) of FIG. 1), the conductive portion (310) may include a feed portion (340). The feed portion (340) may have a feed point connected to a wireless communication circuit (390). The electric field of signals radiated through the conductive region forming the first slot (321) may be excited around the second slot (322). Depending on how close the second slot (322) is to the first slot (321), the strength of the electric field excited to the second slot (322) may vary. A second connecting portion (352) may be placed between the first slot (321) and the second slot (322). Depending on the length of the second connecting portion (352) along one axis (e.g., the y-axis), the electric field in the second slot (322) may vary. Therefore, depending on the length of the second connecting portion (352) along one axis (e.g., the y-axis), the radiation performance of the slot antenna using the first slot (321) and the second slot (322) may vary.

[0120] In example (801), the length of the second connecting part (352) on one axis (e.g., y-axis) may be a first value (831). For example, the first value (831) may be about 0.5 mm. In example (802), the length of the second connecting part (352) on one axis (e.g., y-axis) may be a second value (832). For example, the second value (832) may be about 1.5 mm. In example (803), the length of the second connecting part (352) on one axis (e.g., y-axis) may be a third value (833). For example, the third value (833) may be about 4.5 mm. In example (804), the length of the second connecting part (352) on one axis (e.g., y-axis) may be a fourth value (834). For example, the fourth value (834) may be about 5.5 mm. In example (805), the length of the second connecting part (352) along one axis (e.g., y-axis) may be the fifth value (835). For example, the fifth value (835) may be about 6.5 mm. In an example that is not limited, the length of the second connecting part along the length direction (e.g., y-axis direction) of the first slot (321) may be about 0.5 mm or more and less than about 6.5 mm.

[0121] Referring to FIG. 9, the graph (900) represents the overall efficiency by frequency. The horizontal axis of the graph (900) represents frequency (unit: GHz), and the vertical axis of the graph (900) represents the overall efficiency (unit: dB). The first line (901) represents the overall efficiency of a slot antenna using a feed slot (e.g., the first slot (321)) in a frame structure without adjacent slots (e.g., the second slot (322)). The second line (902) represents the overall efficiency of a slot antenna using two slots (e.g., the first slot (321), the second slot (322)) adjacent to a second connecting part (352) having a length (e.g., about 0.5 mm) according to example (801). The third line (903) represents the overall efficiency of a slot antenna using two slots (e.g., first slot (321), second slot (322)) adjacent to a second connecting part (352) having a length (e.g., about 1.5 mm) according to example (802). The fourth line (6904) represents the overall efficiency of a slot antenna using two slots (e.g., first slot (321), second slot (322)) adjacent to a second connecting part (352) having a length (e.g., about 4.5 mm) according to example (803). The fifth line (905) represents the overall efficiency of a slot antenna using two slots (e.g., first slot (321), second slot (322)) adjacent to a second connecting part (352) having a length (e.g., about 5.5 mm) according to example (804). The sixth line (906) represents the overall efficiency of a slot antenna using two slots (e.g., first slot (321), second slot (322)) adjacent to a second connecting part (352) having a length (e.g., about 6.5 mm) according to example (805).

[0122] Referring to the first line (901), the second line (902), the third line (903), the fourth line (904), the fifth line (905), and / or the sixth line (906), it can be seen that the peak gain is improved as the gap between the two slots, i.e., the length of the second connection part (352), is shortened. Referring to the first line (901), the second line (902), the third line (903), the fourth line (904), the fifth line (905), and / or the sixth line (906), it can be seen that the bandwidth (e.g., a frequency range of -8dB or higher) is increased as the length of the second connection part (352) is shortened. For example, by comparing the second line (902) and the sixth line (906), it can be seen that as the length of the second connection part (352) decreases along one axis (e.g., the y-axis), the bandwidth increases by about 100 MHz and the peak gain of the radiation efficiency increases by about 0.8 dB. According to one embodiment, the frame structure (240) of the electronic device (101) may have a feed slot (e.g., a first slot (321)) and an adjacent slot (e.g., a second slot (322)) positioned adjacently within a certain distance (e.g., about 0.5 mm or more and about 6.5 mm or less) from the feed slot. As an example, but not limited to, a gap between the feed slot and the adjacent slot may be determined according to the requirements for the length of the connection part (e.g., the second connection part (352)) and the required radiation gain (e.g., overall efficiency) according to the method for the frame structure (240).

[0123] FIGS. 10a, FIGS. 10b, and FIGS. 10c illustrate examples of electric fields of a slot antenna using at least one slot (e.g., a first slot (321) and / or a second slot (322)).

[0124] Referring to FIG. 10a, the first example (1000a) shows the electric field of a slot antenna using a feed slot (e.g., the first slot (321)) in a frame structure without an adjacent slot (e.g., the second slot (322)). Referring to FIG. 10b, the second example (1000b) shows the electric field of a slot antenna using two slots (e.g., the first slot (321), the second slot (322)) adjacent to a second connecting part (352) having a length (e.g., about 0.5 mm) according to example (801). Referring to FIG. 10c, the third example (1000c) shows the electric field of a slot antenna using two slots (e.g., first slot (321), second slot (322)) adjacent to a second connecting part (352) having a length (e.g., about 6.5 mm) according to example (805). Referring to the first example (1000a), the second example (1000b), and the third example (1000c), it can be seen that the electric field in the first slot (321) is dispersed.

[0125] Figure 11 shows an example of a slot antenna using a feed slot and two contact slots.

[0126] Referring to FIG. 11, the frame structure (240) may include a first connecting portion (351), a second connecting portion (352), a third connecting portion (353), and a fourth connecting portion (354) between the conductive portion (310) and the support structure (243). The frame structure (240) may have a first slot (321) between the first connecting portion (351) and the second connecting portion (352), a second slot (322) between the second connecting portion (352) and the third connecting portion (353), and a third slot (1123) between the third connecting portion (353) and the fourth connecting portion (354). The third slot (1123) of the frame structure (240) represents a space enclosed by the third connecting part (353), the fourth connecting part (354), a portion of the conductive part (310) from the third connecting part (353) to the fourth connecting part (354), and a portion of the support structure (243) from the fourth connecting part (354) to the third connecting part (353). For example, the straight distance of the first slot (321) along one axis (e.g., y-axis) may be about 20.6 mm. The straight distance of the second slot (322) along one axis (e.g., y-axis) may be about 20.6 mm. The straight distance of the third slot (323) along one axis (e.g., y-axis) may be about 20.6 mm.

[0127] According to one embodiment, the electronic device (101) may transmit or receive a signal through a slot antenna utilizing a plurality of slots to increase radiation gain. According to one embodiment, the electronic device (101) may additionally utilize a slot (e.g., a second slot (322)) adjacent to a feed slot (e.g., a first slot (321)) as well as another slot (e.g., a third slot (1123)). For example, the electronic device (101) may transmit or receive a signal through a slot antenna utilizing the first slot (321), the second slot (322), and the third slot (1123). According to one embodiment, the third slot (1123) may be formed at a position corresponding to the longitudinal direction of the first slot (321). For a connection between the wireless communication circuit (390) of the electronic device (101) (e.g., the communication module (190) of FIG. 1) and the first slot (321), the conductive portion (310) may include a feed portion (340). The feed portion (340) may have a feed point connected to the wireless communication circuit (390). The electric field of the signals radiated through the conductive region forming the first slot (321) may be excited around the second slot (322) and around the third slot (323). As the electric field is excited to the second slot (322) and the third slot (323), the radiation performance of the slot antenna may be improved.

[0128] FIG. 12a shows the overall efficiency of a slot antenna using a feed slot (e.g., first slot (321)) and two adjacent slots (e.g., second slot (322), third slot (1123)).

[0129] Referring to FIG. 12a, the graph (1200) represents the overall efficiency by frequency. The horizontal axis of the graph (1200) represents frequency (unit: GHz), and the vertical axis of the graph (1200) represents the overall efficiency (unit: dB). The first line (1201) represents the overall efficiency of a slot antenna using a feed slot (e.g., the first slot (321)) in a frame structure without adjacent slots (e.g., the second slot (322), the third slot (1123)). The second line (1202) represents the overall efficiency of a slot antenna using one adjacent slot (e.g., the second slot (322)) and a feed slot (e.g., the first slot (321)). The third line (1203) represents the overall efficiency of a slot antenna using two adjacent slots (e.g., the second slot (322) and the third slot (1123)) and a feed slot (e.g., the first slot (321)). Referring to the first line (1201), the second line (1202), and the third line (1203), it can be seen that the peak gain and bandwidth of the overall efficiency increase due to the adjacent slot. Referring to the second line (1202) and the third line (1203), it can be seen that the overall efficiency increases as the third slot (1123) adjacent to the second slot (322) is additionally arranged.

[0130] FIG. 12b shows examples of electric fields of a slot antenna using at least one slot (e.g., a first slot (321), a second slot (322), and / or a third slot (1123)).

[0131] Referring to FIG. 12b, the first example (1251) shows the electric field of a slot antenna using a feed slot (e.g., the first slot (321)) in a frame structure without adjacent slots (e.g., the second slot (322)). The second example (1252) shows the electric field of a slot antenna using one adjacent slot (e.g., the second slot (322)) and a feed slot (e.g., the first slot (321)). The third example (1253) shows the electric field of a slot antenna using two adjacent slots (e.g., the second slot (322) and the third slot (1123)) and a feed slot (e.g., the first slot (321)).

[0132] Referring to the first example (1251) and the second example (1252), it can be seen that the electric field is dispersed due to the adjacent slot (e.g., the second slot (322)). Referring to the second example (1252) and the third example (1253), it can be seen that the electric field is more dispersed when adjacent slots are arranged in an area corresponding to the length direction of the feed slot (e.g., the first slot (321)) than when only one adjacent slot is placed in said area. As the electric field is dispersed, dielectric loss can be reduced. As dielectric loss is reduced, antenna performance (e.g., overall efficiency) can be increased.

[0133] An electronic device (101) according to embodiments of the present disclosure may include a metal frame (e.g., a frame structure (240)) having slots (e.g., a first slot (321), a second slot (322), and / or a third slot (1123)). Depending on the capacity of a battery (e.g., a battery (270)) or the mounting conditions of the product and / or the thickness of the assembly, it may be difficult to form the feed slot of the slot antenna symmetrically with respect to the feed point. In addition to the feed slot of the slot antenna, through a metal frame in which at least one additional slot is formed, the gain of the slot antenna may be increased and broadband characteristics may be provided. As the slot is located in a region along the length direction of the slot antenna (e.g., the length direction of the feed slot), the electric field may be dispersed. As dielectric loss is lowered due to the dispersion of the electric field, bandwidth may be increased and peak performance may be improved.

[0134] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0135] According to embodiments of the present disclosure, an electronic device (101) is provided. The electronic device (101) may include a metal frame (240) comprising a side bezel structure (218) forming the exterior of the electronic device (101) and a support structure (243) extending inwardly from the side bezel structure (218); and a wireless communication circuit (390). The side bezel structure (218) may include a conductive portion (310) formed along the side of the electronic device (101). The metal frame (240) may include a first connection portion (351) to which the conductive portion (310) and the support structure (243) are connected, a second connection portion (352) to which the conductive portion (310) and the support structure (243) are connected next to the first connection portion (351), and a third connection portion (353) to which the support structure (243) is connected next to the second connection portion (352). The metal frame (240) may have a first slot (321) formed between the first connection portion (351) and the second connection portion (352), and a second slot (322) formed between the second connection portion (352) and the third connection portion (353). The wireless communication circuit (390) may be configured to perform communication based on the first slot (321) and the second slot (322).

[0136] For example, the conductive portion (310) may include a power supply portion (340) protruding inwardly between the first connecting portion (351) and the second connecting portion (352). The first slot (321) may include a first portion slot and a second portion slot distinguished with respect to the power supply portion (340). The first portion slot and the second portion slot may be asymmetric with respect to the power supply portion (340).

[0137] For example, the slot length of the second part slot may be longer than the slot length of the first part slot. The second slot (322) may be more adjacent to the second part slot among the first part slot and the second part slot.

[0138] For example, the slot size of the second slot (322) may be 70% or more and less than 90% of the slot size of the first slot (321).

[0139] For example, the length of the second connecting part (352) based on the above length direction may be 0.5 mm (millimeter) or more and less than 6.5 mm.

[0140] For example, the first slot (321) may represent a first space surrounded by the first connection part (351), the second connection part (352), a portion of the conductive part (310) from the first connection part (351) to the second connection part (352), and a portion of the support structure (243) from the first connection part (351) to the second connection part (352). The second slot (322) may represent a second space surrounded by the second connection part (352), the third connection part (353), a portion of the conductive part (310) from the second connection part (352) to the third connection part (353), and a portion of the support structure (243) from the second connection part (352) to the third connection part (353). The slot size of the second slot (322) may be smaller than the slot size of the first slot (321).

[0141] For example, the slot length of the first slot (321) may represent the length of the path between the first connecting part (351) and the second connecting part (352) within the first space. The slot length of the second slot (322) may represent the length of the path between the second connecting part (352) and the third connecting part (353) within the second space.

[0142] For example, one region of the conductive portion (310) between the first connecting portion (351) and the second connecting portion (352) may include a feed portion (340) protruding inward. The first slot (321) may have a curved shape along the feed portion (340) between the first connecting portion (351) and the second connecting portion (352). The second slot (322) may have a straight shape formed from the second connecting portion (352) to the third connecting portion (353).

[0143] For example, the electronic device (101) may include a printed circuit board on which the wireless communication circuit (390) is placed; and a conductive connecting member connected to the wireless communication circuit (390). The conductive portion (310) may include a feed portion (340) protruding inwardly between the first connecting portion (351) and the second connecting portion (352). The conductive connecting member may be positioned to contact the protruding feed portion (340).

[0144] For example, the first connecting portion (351) may be formed through pole welding to connect the first portion of the conductive portion (310) and the first portion of the support structure (243) that overlap with respect to the direction toward the display of the electronic device (101). The second connecting portion (352) may be formed through pole welding to connect the second portion of the conductive portion (310) and the second portion of the support structure (243) that overlap with respect to said direction. The third connecting portion (353) may be formed through pole welding to connect the third portion of the conductive portion (310) and the third portion of the support structure (243) that overlap with said direction.

[0145] For example, the conductive region forming the first slot (321) may include a feed point electrically connected to the wireless communication circuit (390). The conductive region forming the second slot (322) may not include a feed point electrically connected to the wireless communication circuit (390).

[0146] For example, the metal frame (240) may include a fourth connection portion (354) to which the support structure (243) is connected, following the third connection portion (353) with respect to the length direction. The metal frame (240) may have a third slot (1123) formed between the third connection portion (353) and the fourth connection portion (354). The wireless communication circuit (390) may be configured to perform communication through the first slot (321), the second slot (322), and the third slot (1123).

[0147] For example, the slot size of the third slot (1123) may be 70% or more and less than 90% of the slot size of the first slot (321).

[0148] For example, the conductive region forming the third slot (1123) may not include a feed point electrically connected to the wireless communication circuit (390).

[0149] For example, the electronic device (101) may include a battery (270). At least a portion of the first slot (321) may be formed at a position higher than the top position of the battery (270). A power supply point connected to the wireless communication circuit (390) in the conductive region forming the first slot (321) may be formed at a position higher than the top position of the battery (270).

[0150] According to embodiments of the present disclosure, an electronic device (101) is provided. The electronic device (101) comprises a metal frame (240) including a side bezel structure (218) forming the exterior of the electronic device (101) and a support structure (243) extending inward from the side bezel structure (218); and the side bezel structure (218) may include a conductive portion (310) formed along the longitudinal direction of the electronic device (101). The metal frame (240) may include a first connecting portion (351) to which the conductive portion (310) and the support structure (243) are connected, a second connecting portion (352) to which the conductive portion (310) and the support structure (243) are connected following the first connecting portion (351) in the longitudinal direction, and a third connecting portion (353) to which the support structure (243) is connected following the second connecting portion (352) in the longitudinal direction. The metal frame (240) may have a first slot (321) formed between the first connecting part (351) and the second connecting part (352), and a second slot (322) formed between the second connecting part (352) and the third connecting part (353). The slot size of the second slot (322) may be 70% or more and less than 90% of the slot size of the first slot (321).

[0151] For example, the length of the second connecting part (352) based on the above length direction may be 0.5 mm (millimeter) or more and less than 6.5 mm.

[0152] For example, the slot length of the first slot (321) may be 28 mm (millimeter) or more and less than 29 mm. The slot length of the second slot (322) may be 20 mm or more and less than 21 mm. Based on the length direction, the length of the second connecting part (352) may be 5 mm or more and less than 6 mm.

[0153] For example, the conductive portion (310) may include a power supply portion (340) protruding inwardly between the first connecting portion (351) and the second connecting portion (352). The first slot (321) may include a first portion slot and a second portion slot distinguished based on the power supply portion (340). The slot length of the second portion slot may be longer than the slot length of the first portion slot. The second slot (322) may be more adjacent to the second portion slot among the first portion slot and the second portion slot.

[0154] For example, the first connecting portion (351) may be formed through pole welding to connect the first portion of the conductive portion (310) and the first portion of the support structure (243) that overlap with respect to the direction toward the display of the electronic device (101). The second connecting portion (352) may be formed through pole welding to connect the second portion of the conductive portion (310) and the second portion of the support structure (243) that overlap with respect to said direction. The third connecting portion (353) may be formed through pole welding to connect the third portion of the conductive portion (310) and the third portion of the support structure (243) that overlap with said direction.

[0155] For example, the metal frame (240) may include a fourth connecting portion (354) to which the support structure (243) is connected, following the third connecting portion (353) with respect to the length direction. The metal frame (240) may have a third slot (1123) formed between the third connecting portion (353) and the fourth connecting portion (354). The slot size of the third slot (1123) may be 70% or more and less than 90% of the slot size of the first slot (321).

[0156] In embodiments of the present disclosure, an electronic device (101) is provided. The electronic device (101) may include a wireless communication circuit; a metal frame comprising a side structure (218) forming an outer side of the electronic device (101) and a support structure (243) connected from the side structure (218) through a plurality of connecting portions, wherein the plurality of connecting portions include a first connecting portion (351) connecting the support structure (243) and the side structure (218), a second connecting portion (352) connecting the support structure (243) and the side structure (218), and a third connecting portion (353) connecting the support structure (243) and the side structure (218); and a dielectric material filled in the slots of the metal frame. The slots may include a first slot formed by a conductive region of the side structure (218) including a feed portion electrically connected to the wireless communication circuit, formed between the first connection portion (351) and the second connection portion (352), and a second slot formed between the second connection portion (352) and the third connection portion (353) and adjacent to the first slot along the outer side. The first slot may be spaced apart from the second slot by a distance of less than 6.5 mm (millimeter).

[0157] For example, the power supply portion may be positioned to protrude inward between the first connection portion (351) and the second connection portion (352). The first slot may include a first portion slot above the power supply portion and a second portion slot below the power supply portion. The first portion slot and the second portion slot may be asymmetric with respect to the power supply portion.

[0158] For example, the electronic device (101) may include a battery. The power supply portion connected to the wireless communication circuit may be formed at a position higher than the top position of the battery. The slot length of the second portion slot may be longer than the slot length of the first portion slot.

[0159] For example, the first slot may have a curved shape formed between the first connecting part (351) and the second connecting part (352). The second slot may have a straight shape formed between the second connecting part (352) and the third connecting part (353).

[0160] For example, the first slot may represent a first space filled with dielectric material, surrounded by the first connection portion (351), the second connection portion (352), a region of the conductive portion of the side structure (218) from the first connection portion (351) to the second connection portion (352), and a region of the support structure (243) from the first connection portion (351) to the second connection portion (352). The second slot may represent a second space filled with dielectric material, surrounded by the second connection portion (352), the third connection portion (353), a region of the conductive portion from the second connection portion (352) to the third connection portion (353), and a region of the support structure (243) from the second connection portion (352) to the third connection portion (353). The slot size of the second slot may be smaller than the slot size of the first slot.

[0161] In embodiments of the present disclosure, an electronic device (101) is provided. The electronic device (101) may include a metal frame comprising a side structure (218) forming an outer side of the electronic device (101) and a support structure (243) connected from the side structure (218) through a plurality of connecting portions, the plurality of connecting portions may include a first connecting portion (351) connecting the support structure (243) and the side structure (218), a second connecting portion (352) connecting the support structure (243) and the side structure (218), and a third connecting portion (353) connecting the support structure (243) and the side structure (218); and a dielectric material filled in the slots of the metal frame. The slots may include a first slot formed by a conductive region of the side structure (218) formed between the first connecting portion (351) and the second connecting portion (352), and a second slot formed between the second connecting portion (352) and the third connecting portion (353) and adjacent to the first slot along the outer side. The slot size of the second slot may be 70% or more and less than 90% of the slot size of the first slot.

[0162] For example, the first slot may be spaced apart from the second slot by a distance of at least 0.5 mm and less than 6.5 mm.

[0163] For example, the conductive portion of the above-described side structure may include a power supply portion protruding inwardly between the first connection portion and the second connection portion. The first slot may include a first portion slot above the power supply portion and a second portion slot below the power supply portion. The slot length of the second portion slot may be longer than the slot length of the first portion slot.

[0164] For one or more embodiments, at least one of the components described in one or more of the prior art drawings may be configured to perform one or more operations, techniques, processes and / or methods as described in the present disclosure. For example, a processor (e.g., a baseband processor) described in the present disclosure in relation to one or more of the prior art drawings may be configured to operate according to one or more examples described in the present disclosure. As another example, circuits associated with user equipment (UE), a base station, a network element, etc., as described above in relation to one or more of the prior art drawings may be configured to operate according to one or more examples described herein.

[0165] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless otherwise explicitly stated. The foregoing description of one or more embodiments is for illustrative and explanatory purposes only, and is not intended to limit or exhaust the scope of the embodiments in the exact form disclosed. Modifications and variations are possible in light of the foregoing teachings or may be obtained from the practice of various embodiments.

[0166] The electronic devices according to the various embodiments disclosed in this document may be of various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or consumer electronics. The electronic devices according to the embodiments of this document are not limited to the devices described above.

[0167] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0168] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0169] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0170] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0171] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, Wireless communication circuit; A metal frame comprising a side structure forming an outer side of the electronic device and a support structure connected from the side structure through a plurality of connecting parts, wherein the plurality of connecting parts include a first connecting part connecting the support structure and the side structure, a second connecting part connecting the support structure and the side structure, and a third connecting part connecting the support structure and the side structure; and It includes a dielectric material that fills the slots of the metal frame, and The above slots are: A first slot formed by a conductive region of the side structure including a feed portion formed between the first connection portion and the second connection portion and electrically connected to the wireless communication circuit, and It includes a second slot formed between the second connecting portion and the third connecting portion and adjacent to the first slot along the outer side, The first slot is spaced apart from the second slot by a distance of less than 6.5 mm (millimeter). Electronic device.

2. In Claim 1, The above-mentioned power supply portion is positioned to protrude inward between the first connecting portion and the second connecting portion, and The first slot above includes a first part slot above the power supply portion and a second part slot below the power supply portion, and The first partial slot and the second partial slot are asymmetric with respect to the power supply portion. Electronic device.

3. In Claim 2, Includes more batteries, The power supply portion connected to the above wireless communication circuit is formed at a position higher than the top position of the battery, and The slot length of the second part slot is longer than the slot length of the first part slot. Electronic device.

4. In Claim 1, The first slot has a curved shape formed between the first connecting portion and the second connecting portion, The second slot above has a straight shape formed between the second connecting portion and the third connecting portion, Electronic device.

5. In Claim 1, The slot size of the second slot is 70% or more and less than 90% of the slot size of the first slot. Electronic device.

6. In Claim 1, The first slot is spaced apart from the second slot by a distance of 0.5 mm or more and less than 6.5 mm. Electronic device.

7. In Claim 1, The first slot is surrounded by the first connection portion, the second connection portion, a region of the conductive portion of the side structure from the first connection portion to the second connection portion, and a region of the support structure from the first connection portion to the second connection portion, and represents a first space filled with a dielectric material. The second slot is surrounded by the second connection portion, the third connection portion, a region of the conductive portion from the second connection portion to the third connection portion, and a region of the support structure from the second connection portion to the third connection portion, and represents a second space filled with dielectric material. The slot size of the second slot is smaller than the slot size of the first slot. Electronic device.

8. In Claim 7, The slot length of the first slot above represents the length of the path between the first connecting part and the second connecting part within the first space, and The slot length of the second slot above represents the length of the path between the second connecting part and the third connecting part within the second space, Electronic device.

9. In Claim 1, A printed circuit board on which the above wireless communication circuit is placed; and It includes a conductive connecting member connected to the above wireless communication circuit, The conductive connecting member is positioned to contact the power supply portion, Electronic device.

10. In Claim 1, The first connecting portion is formed through pole welding to connect the first portion of the conductive portion of the side structure and the first portion of the support structure, which overlap with respect to the direction toward the display of the electronic device. The second connecting portion is formed through pole welding to connect the second portion of the conductive portion and the second portion of the support structure that overlap with respect to the direction, and The third connecting portion is formed through pole welding to connect the third portion of the conductive portion and the third portion of the support structure that overlap with respect to the direction. Electronic device.

11. In Claim 1, The conductive region forming the second slot above does not include a feed point electrically connected to the wireless communication circuit, Electronic device.

12. In Claim 1, The metal frame includes a fourth connecting portion connected to the support structure, following the third connecting portion, and The above slots have a third slot formed between the third connecting part and the fourth connecting part, and The above wireless communication circuit is configured to perform communication through the first slot, the second slot, and the third slot, Electronic device.

13. In Claim 12, The slot size of the third slot is 70% or more and less than 90% of the slot size of the first slot. Electronic device.

14. In Claim 12, The conductive region forming the third slot above does not include a feed point electrically connected to the wireless communication circuit, Electronic device.

15. In electronic devices, A metal frame comprising a side structure forming an outer side of the electronic device and a support structure connected from the side structure through a plurality of connecting parts, wherein the plurality of connecting parts include a first connecting part connecting the support structure and the side structure, a second connecting part connecting the support structure and the side structure, and a third connecting part connecting the support structure and the side structure; and It includes a dielectric material that fills the slots of the metal frame, and The above slots are: A first slot formed between the first connecting portion and the second connecting portion, and It includes a second slot formed between the second connecting portion and the third connecting portion and adjacent to the first slot along the outer side, The slot size of the second slot is 70% or more and less than 90% of the slot size of the first slot. Electronic device.