Waveguide filter and communication device including same

Abstract

The waveguide filter may comprise a plurality of waveguide portions for providing a signal path between an input port and an output port. Each of at least one waveguide portion among the plurality of waveguide portions may have a resonance hole formed on one surface facing a first direction. A first waveguide portion including the input port among the plurality of waveguide portions may have: a resonance hole formed on a first surface of the first waveguide portion facing the first direction; and a slot including, within the first waveguide portion, a first opening formed on a second surface of the first waveguide portion facing a second direction opposite to the first direction and a second opening formed on a third surface of the first waveguide portion facing a third direction perpendicular to the first direction and the second direction. The second opening may be connected to the input port.

Description

Waveguide filter and communication device including the same

[0001] The present disclosure relates to a waveguide filter and a communication device including the same.

[0002] Products equipped with multiple antennas are being developed to enhance communication performance. It is expected that equipment featuring an even greater number of antennas will be used. As the number of antennas in communication devices increases, the number of RF components (e.g., filters) inevitably increases as well.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] A waveguide filter is provided. The waveguide filter may include a plurality of waveguide portions for providing a signal path between an input port and an output port. Among the plurality of waveguide portions, at least one waveguide portion may have a resonant hole formed on one surface facing a first direction. Among the plurality of waveguide portions, a first waveguide portion including the input port may have a resonant hole formed on the first surface of the first waveguide portion facing the first direction, and a slot within the first waveguide portion including a first opening formed on the second surface of the first waveguide portion facing a second direction opposite to the first direction, and a second opening formed on the third surface of the first waveguide portion facing a third direction perpendicular to the first direction and the second direction. The second opening may be connected to the input port.

[0005] A communication device is provided. The communication device may include a processor, an antenna, an RF processing circuit, a printed circuit board, and a waveguide filter disposed on one side of the printed circuit board. The waveguide filter may include a plurality of waveguide portions for providing a signal path between an input port and an output port. Among the plurality of waveguide portions, at least one waveguide portion may have a resonant hole formed on one side facing a first direction. Among the plurality of waveguide portions, a first waveguide portion including the input port may have a slot comprising a resonant hole formed on the first side of the first waveguide portion facing the first direction, and within the first waveguide portion, a first opening formed on the second side of the first waveguide portion facing a second direction opposite to the first direction, and a second opening formed on the third side of the first waveguide portion facing a third direction perpendicular to the first direction and the second direction. The second opening may be connected to the input port.

[0006] Figure 1 shows a wireless communication system.

[0007] Figure 2 shows examples of components of a communication device.

[0008] Figure 3 illustrates an example of a waveguide filter.

[0009] Figure 4 illustrates an example to explain the quality of a legacy waveguide filter.

[0010] Figure 5 illustrates an example of the quality of a waveguide filter according to the position of the input port.

[0011] FIGS. 6a and 6b illustrate examples of waveguide filters including loops.

[0012] FIGS. 7a to 7d illustrate examples of waveguide filters having slots.

[0013] Figure 8 illustrates an example of a slot.

[0014] FIG. 9 illustrates an example of a waveguide portion including a slot.

[0015] FIG. 10 illustrates an example showing a comparison of the quality of a waveguide filter according to one embodiment and the quality of a legacy waveguide filter.

[0016] FIG. 11 illustrates an example of a printed circuit board (PCB) including a plurality of waveguide filters.

[0017] Figure 12 shows an example of a communication device.

[0018] Figure 13 shows an example of a communication device.

[0019] Throughout the drawings, the same reference numerals will be understood to refer to the same parts, components, and structures.

[0020] The terms used in this disclosure are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. A singular expression may include a plural expression unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this disclosure. Terms used in this disclosure that are defined in a general dictionary may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this disclosure. In some cases, even terms defined in this disclosure are not to be interpreted to exclude the embodiments of this disclosure.

[0021] In the various embodiments of the present disclosure described below, a hardware-based approach is described as an example. However, since the various embodiments of the present disclosure include techniques using both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0022] Terms referring to device components used in the following description (e.g., insulating plate, substrate, non-conductive substrate, PCB (print circuit board), FPCB (flexible PCB), module, antenna, antenna element, antenna element, conductive pattern, conductive line, conductive part, stub part, circuit, amplifier circuit, processor, chip, component, device), terms referring to the shape of a component (e.g., opening, structure, support, contact, protrusion, slot, opening), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, assembly), terms referring to a circuit (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna line, conductive pattern, conductive part, conductive stub part, transmission line, stub, amplifier circuit, RF path, RF module, RF circuit, splitter, divider, coupler), Terms such as "combiner" are provided as examples for the convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. Furthermore, terms such as "...part," "...device," "...body," etc. used below may refer to at least one shape structure or a unit that processes a function.

[0023] Additionally, in this disclosure, expressions of "greater than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled; however, this is merely for the purpose of expressing an example and does not exclude descriptions of "greater than" or "less than." Conditions described as "greater than" may be replaced with "greater than," conditions described as "less than" may be replaced with "less than," and conditions described as "greater than and less than" may be replaced with "greater than and less than." Furthermore, "A" to "B" below refer to at least one of elements from A (including A) to B (including B). Below, "C" and / or "D" refers to including at least one of "C" or "D," i.e., {"C", "D", "C" and "D"}.

[0024] This disclosure describes various embodiments using terms used in some communication standards (e.g., 3GPP (3rd Generation Partnership Project), ETSI (European Telecommunications Standards Institute), xRAN (extensible radio access network), O-RAN (open-radio access network), but these are merely illustrative examples. Various embodiments of this disclosure can be easily modified and applied to other communication systems.

[0025] FIG. 1 illustrates a wireless communication system. The wireless communication environment of FIG. 1 exemplifies a base station (110) and a terminal (120) (e.g., a first terminal (120-1), a second terminal (120-2), a third terminal (120-3)) as a part of the nodes using a wireless channel.

[0026] Referring to FIG. 1, a base station (110) is a network infrastructure that provides wireless access to a terminal (120). The base station (110) has coverage based on the distance over which it can transmit signals. In addition to being a base station, the base station (110) may be referred to as an 'access point (AP)', 'eNodeB (eNB)', '5G node (5th generation node)', '5G NodeB (NB)', 'wireless point', 'transmission / reception point (TRP)', MMU (Massive MIMO (multiple input multiple output) Unit)), 'access unit', 'distributed unit (DU)', 'transmission / reception point (TRP)', 'radio unit (RU)', remote radio head (RRH)', communication device, or other terms having an equivalent technical meaning. The base station (110) can transmit downlink signals or receive uplink signals.

[0027] The terminal (120) is a device used by a user and performs communication with the base station (110) via a wireless channel. In some cases, the terminal (120) may be operated without user involvement. That is, the terminal (120) is a device that performs machine type communication (MTC) and may not be carried by the user. The terminal (120) may be referred to as 'user equipment (UE)', 'mobile station', 'subscriber station', 'customer premises equipment (CPE)', 'remote terminal', 'wireless terminal', 'electronic device', or 'vehicle terminal', 'user device', or other terms having an equivalent technical meaning.

[0028] Beamforming technology is utilized as one of the techniques to mitigate propagation path loss and increase the transmission distance of radio waves. Beamforming generally uses multiple antennas to concentrate the reach area of ​​radio waves or to increase the directivity of reception sensitivity in a specific direction. Therefore, to form beamforming coverage instead of forming a signal in an isotropic pattern using a single antenna, a base station (110) may be equipped with multiple antennas. A form in which multiple antennas are gathered may be referred to as an antenna array (130), and each antenna included in the array may be referred to as an array element or an antenna element. The antenna array (130) may be configured in various forms, such as a linear array or a planar array. The antenna array (130) may be referred to as a massive antenna array.

[0029] A key technology for enhancing the data capacity of 5G communication is beamforming technology using an antenna array connected to multiple RF paths. To achieve higher data capacity, the number of RF paths must be increased, or the power per RF path must be increased. However, increasing the number of RF paths leads to larger product sizes, and due to spatial constraints in installing actual base station equipment, it is currently impossible to increase them further. To increase antenna gain through high output without increasing the number of RF paths, antenna gain can be increased by connecting multiple antenna elements using dividers (or splitters) in the RF paths. Here, the antenna elements corresponding to the RF paths may be referred to as sub-arrays. As a non-limiting example, sub-array technology may be utilized to increase the signal radiation gain. An antenna array may include multiple sub-arrays. The antennas of the antenna array may be divided into the multiple sub-arrays. The signal may be radiated through each of the antennas of the sub-arrays.

[0030] In FIG. 1, the base station (110) of FIG. 1 is described as an example to explain a communication device including an antenna, but the embodiments of the present disclosure are not limited thereto. As a communication device according to the embodiments of the present disclosure, in addition to the base station (110), wireless equipment performing a function equivalent to that of a base station, wireless equipment connected to a base station (e.g., TRP), the terminal (120) of FIG. 1, or any other communication equipment used for 5G communication are all possible. Hereinafter, as a structure of multiple antennas for communication in a MIMO (Multiple Input Multiple Output) environment, the present disclosure describes an antenna array composed of sub-arrays as an example, but is not limited to examples where easy modifications for beamforming are possible.

[0031] FIG. 2 illustrates examples of components of a communication device. The communication device may be a base station (110) of FIG. 1 or a component of the base station (110). Meanwhile, unlike what is illustrated, the present disclosure does not exclude the possibility that the communication device may be implemented in a terminal (120).

[0032] Referring to FIG. 2, an exemplary functional configuration of a communication device (210) is illustrated. The communication device (210) may include an antenna section (211), a filter section (212), an RF (radio frequency) processing section (213), and a processor (214).

[0033] The antenna section (211) may include a plurality of antennas. The antennas may perform functions for transmitting and receiving signals over a wireless channel. The antennas may include a radiator made of a conductor (e.g., a metal structure) or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB), a non-conductive substrate (e.g., a plastic substrate)). The antennas may radiate upconverted signals over a wireless channel or acquire signals radiated by other devices. Each antenna may be referred to by an antenna element, an antenna component, an antenna radiator, a radiating part, a radiator, and / or equivalent technical terms. The antenna section (211) may include an antenna array in which a plurality of antenna elements form an array. The antenna section (211) may be electrically connected to the filter section (212) via RF signal lines. For example, a plurality of antenna elements of the antenna section (211) may be coupled to a board (e.g., a PCB). The antenna elements may be disposed on one side of the board, or a module on which the antenna elements are disposed (e.g., a module including a non-conductive substrate and a radiating structure disposed on the non-conductive substrate) may be disposed. The board may include RF signal lines connecting each antenna element and the RF filters of the filter section (212). The RF signal lines may be referred to as a feeding network. The board may be referred to as a wireless unit board, a wireless unit board, an antenna board, an antenna board, a radiating board, a radiating board, an RF board, an RF board, and / or an equivalent technical term.

[0034] The filter unit (212) can perform filtering to transmit a signal of a desired frequency. The filter unit (212) may include a plurality of RF filters. The RF filters can perform the function of selectively passing a frequency by forming resonance. The filter unit (212) may include at least one of a band-pass filter, a low-pass filter, a high-pass filter, or a band-reject filter. The filter unit (212) may include RF circuits for obtaining a signal in a frequency band for transmission or a frequency band for reception. Each RF filter of the filter unit (212) may be electrically connected to the antennas of the antenna unit (211) and the RF processing circuit of the RF processing unit (213).

[0035] The RF processing unit (213) may include a plurality of RF processing circuits. An RF processing circuit may be a unit for processing a signal received through an antenna or a signal radiated through an antenna. An RF processing circuit may include a plurality of paths corresponding to the antennas. At least one RF processing circuit may be referred to as an RF chain. An RF chain may include a plurality of RF elements. The RF elements may include an amplifier, a mixer, an oscillator, a DAC, an ADC, etc. For example, the RF processing unit (213) may include an up converter that up-converts a baseband digital transmission signal to a transmission frequency, and a digital-to-analog converter (DAC) that converts the up-converted digital transmission signal into an analog RF transmission signal. The up converter and the DAC form part of a transmission path. The transmission path may further include a power amplifier (PA) or a coupler (or combiner). Additionally, for example, the RF processing unit (213) may include an analog-to-digital converter (ADC) that converts an analog RF reception signal into a digital reception signal and a down converter that converts the digital reception signal into a baseband digital reception signal. The ADC and the down converter form part of the reception path. The reception path may further include a low-noise amplifier (LNA) or a coupler (or divider). The RF components of the RF processing unit (213) may be implemented on a PCB. The communication device (210) may include a stacked structure in the order of an antenna unit (211), a filter unit (212), and an RF processing unit (213). The antennas and the RF components of the RF processing unit (213) may be implemented on a PCB, and filters may be repeatedly connected between the PCBs to form multiple layers.For example, the RF processing unit (213) may include a communication chip (e.g., RFIC).

[0036] The processor (214) can control the overall operations of the communication device (210). The processor (214) may be referred to as a control unit, a controller, or a control unit. The processor (214) may include various modules for performing communication. The processor (214) may include at least one processor, such as a modem. The processor (214) may include modules for digital signal processing. For example, the processor (214) may include a modem. When transmitting data, the processor (214) generates complex symbols by encoding and modulating the transmitted bit sequence. Also, for example, when receiving data, the processor (214) restores the received bit sequence by demodulating and decoding the baseband signal. The processor (214) may perform the functions of a protocol stack required by the communication standard.

[0037] In FIG. 2, functional components of a communication device (210) are described as a communication device comprising a plurality of filters connected to a plurality of antennas. However, the example shown in FIG. 2 is merely an exemplary configuration of a communication device including a filter (e.g., waveguide filter) described below, and the embodiments of the present disclosure are not limited to the descriptions of the components of the communication device shown in FIG. 2. For example, even if some of the components of the communication device are omitted or the connection relationships of the components are different, any device (e.g., communication device, communication module) including a filter (e.g., waveguide filter) can be understood as an embodiment of the present disclosure.

[0038] As the number of RF paths in communication devices increased to achieve higher data capacity in beamforming technology, the number of components in the communication devices also increased. Consequently, the size of the communication devices also increased. Various measures are being proposed to miniaturize communication devices.

[0039] In the present disclosure, technology relating to a filter and a communication device including the filter may be described. Specifically, a filter according to the embodiments of the present disclosure may include a waveguide filter. An input / output port of the waveguide filter may be connected to a slot. The slot may be referenced or correspond to a tunnel structure penetrating from a first surface to a second surface of the waveguide filter. Due to the slot, the input / output port may be placed on the narrowest surface among the plurality of surfaces of the waveguide filter. By placing the input / output port on the narrowest surface among the plurality of surfaces of the waveguide filter, the assembly area of ​​the board required to accommodate the plurality of waveguide filters may be reduced. By reducing the assembly area of ​​the board, the size of the communication device may be reduced.

[0040] FIG. 3 illustrates an example of a waveguide filter. The waveguide filter (300) may be included in the filter section (212) of FIG. 2.

[0041] Referring to FIG. 3, the waveguide filter (300) may include a plurality of waveguide portions (301, 302, 303, 304, 305, 306, 307, 308). The plurality of waveguide portions may provide a signal path between the input port of the waveguide filter (300) and the output port of the waveguide filter (300). The plurality of waveguide portions (301, 302, 303, 304, 305, 306, 307, 308) may have or include resonant holes (310, 320, 330, 340, 350, 360, 370, 380). For example, each of the resonant holes (310, 320, 330, 340, 350, 360, 370, 380) can be coupled with a resonant hole adjacent to the corresponding resonant hole. In the waveguide filter (300), the RF signal can be propagated, radiated, or transmitted from the first resonant hole to the second resonant hole in the form of an electromagnetic wave.

[0042] Resonant holes (310, 320, 330, 340, 350, 360, 370, 380) can perform the function of selectively passing or blocking a specific frequency (e.g., resonant frequency). Resonant holes (310, 320, 330, 340, 350, 360, 370, 380) can be formed on the first xy plane of the waveguide filter (300) facing the z-axis. For example, each of the resonant holes (310, 320, 330, 340, 350, 360, 370, 380) can be formed in the shape of a groove. For example, the waveguide portion (301) can have a resonant hole (310). For example, the waveguide portion (302) can have a resonant hole (320). For example, the waveguide portion (303) may have a resonant hole (330). For example, the waveguide portion (304) may have a resonant hole (340). For example, the waveguide portion (305) may have a resonant hole (350). For example, the waveguide portion (306) may have a resonant hole (360). For example, the waveguide portion (307) may have a resonant hole (370). For example, the waveguide portion (308) may have a resonant hole (380). The resonant frequency of the waveguide filter (300) may be determined according to the size of the resonant holes (310, 320, 330, 340, 350, 360, 370, 380). For example, the value of the resonant frequency can be determined according to the diameter of each of the resonant holes (310, 320, 330, 340, 350, 360, 370, 380) and / or the depth of each of the resonant holes (310, 320, 330, 340, 350, 360, 370, 380). For example, the larger the diameter of the resonant hole and / or the deeper the depth of the resonant hole, the lower the resonant frequency may be.As a non-limiting example, the resonant frequency of the waveguide filter (300) can be determined according to the distance between the resonant holes (310, 320, 330, 340, 350, 360, 370, 380).

[0043] In the waveguide filter (300), parts of the plurality of waveguide sections (301, 302, 303, 304, 305, 306, 307, 308) may be separated by a wall (e.g., wall (391), wall (392), wall (393)). For example, waveguide section (301) and waveguide section (304) may be separated by wall (391). For example, waveguide section (303) and waveguide section (306) may be separated by wall (392). For example, waveguide section (305) and waveguide section (308) may be separated by wall (393). In the waveguide filter (300), the strength of the coupling between the resonant holes (310, 320, 330, 340, 350, 360, 370, 380) of the waveguide parts (301, 302, 303, 304, 305, 306, 307, 308) can be determined according to the shape (e.g., width, size, shape) of the partitions (391, 392, 393) and the position of the partitions (391, 392, 393).

[0044] The plurality of waveguide portions (301, 302, 303, 304, 305, 306, 307, 308) exemplified in FIG. 3 are merely one embodiment, and the embodiments of the present disclosure are not limited to the descriptions of the plurality of waveguide portions in FIG. 3. For example, a waveguide filter (300) can be understood as an embodiment of the present disclosure even if some of the plurality of waveguide portions (301, 302, 303, 304, 305, 306, 307, 308) are omitted or additional waveguide portions are included. Additionally, it can be understood as an embodiment of the present disclosure even if a resonance hole of at least one of the plurality of waveguide portions (301, 302, 303, 304, 305, 306, 307, 308) is omitted.

[0045] According to one embodiment, the waveguide filter (300) may include a dielectric block. For example, the interior of the waveguide filter (300) may be filled with a dielectric. For example, the dielectric block may be formed or composed of a solid dielectric. For example, the solid dielectric may include ceramic, Teflon, alumina, sapphire, barium titanate, strontium titanate, and / or polymer. At least a portion of the surface of the waveguide filter (300) may be plated with a conductive material (e.g., metal). For example, the waveguide filter (300) may include a thin conductive film covering at least a portion of the dielectric block. For example, the waveguide filter (300) may be plated with a conductive material except for the area surrounding the input port and the output port.

[0046] According to one embodiment, the waveguide filter (300) may be placed on one side of a board (e.g., PCB) in a communication device (e.g., communication device (210)). For example, the waveguide filter (300) may be connected to other components (e.g., antenna, RF processing circuit) within the communication device (210) through the board. For example, the waveguide filter (300) may be positioned so that its input port and / or output port are in contact with the board for connection to other components.

[0047] The waveguide portion (301) may have an input port. The input port may be configured so that the waveguide portion (301) (or waveguide filter (300)) acquires a radio frequency (RF) signal. For example, the waveguide portion (301) may include a first xy plane of the waveguide portion (301) facing the z-axis and a second xy plane of the waveguide portion (301) facing in a direction opposite to the z-axis. For example, it may be assumed that a resonance hole (310) is formed in the first xy plane of the waveguide portion (301), and an input port is formed or included in the second xy plane of the waveguide portion (301). When an input port is formed in the second xy plane of the waveguide portion (301), the second xy plane of the waveguide filter (300) may be positioned to be in contact with one side of the board within the communication device (210). For example, a waveguide portion (301) in which a resonant hole (310) is formed in the first xy plane of the waveguide portion (301) and an input port is formed in the second xy plane may be referred to as a legacy waveguide portion. For example, a waveguide filter (300) in which resonant holes (310, 320, 330, 340, 350, 360, 370, 380) are formed in the first xy plane of the waveguide filter (300) and an input port is formed in the second xy plane may be referred to as a legacy waveguide filter. The quality of the legacy waveguide portion and the quality of the legacy waveguide filter will be described and illustrated in FIG. 4.

[0048] According to one embodiment, the assembly area when the second xy plane of the waveguide filter (300) is positioned to be in contact with one side of the board in the communication device (210) may be relatively large. For example, the assembly area when the second xy plane of the waveguide filter (300) is positioned to be in contact with one side of the board may be larger than the assembly area when the first yz plane of the waveguide filter (300) is positioned to be in contact with one side of the board. For example, the first yz plane of the waveguide filter (300) may be oriented toward the x-axis. For example, the greater the number of waveguide parts, the greater the increase in the area of ​​the second xy plane (or first xy plane) of the waveguide filter (300) may be than the increase in the area of ​​the first yz plane of the waveguide filter (300). For example, to miniaturize the communication device (210), a method may be required for the first yz plane of the waveguide filter (300) to be positioned in contact with one side of the board within the communication device (210). For example, an input port of the waveguide filter (300) may be formed on the first yz plane. A waveguide filter (300) having an input port formed on the first yz plane and having substantially the same quality as a legacy waveguide filter will be described and illustrated through FIGS. 5 to 13.

[0049] According to one embodiment, the waveguide portion (308) may have an output port. The output port may be configured to output an RF signal that has been filtered by the waveguide filter (300). However, it is not limited thereto. The configuration of the output port formed in the waveguide portion (308) may be substantially identical to or correspond to the configuration of the input port formed in the waveguide portion (301). The waveguide filter (300) may acquire an RF signal through the output port. The waveguide filter (300) may output the RF signal acquired through the output port through the input port. In this disclosure, the port formed in the waveguide portion (301) is referred to as the input port and the port formed in the waveguide portion (308) is referred to as the output port; however, this is merely for convenience of explanation and does not limit the embodiments. In terms of the input port of the waveguide filter (300) being able to output an RF signal, the input port may be referred to as an input / output port. In terms of the output port of the waveguide filter (300) being able to acquire an RF signal, the output port may be referred to as an input / output port. Since the output port formed in the waveguide portion (308) may be substantially the same as the input port formed in the waveguide portion (301), redundant descriptions will be omitted.

[0050] Figure 4 illustrates an example for explaining the quality of a legacy waveguide filter.

[0051] Referring to FIG. 4, Example (410) shows the electric field distribution of a plated dielectric block. For example, the plated dielectric block may not have resonant holes and / or input ports formed therein. The electric field distribution of Example (410) may be caused by electromagnetic waves propagating or radiating in the air. The electric field strength within the plated dielectric block may be higher in the central region of the upper surface of the plated dielectric block than in the peripheral region of the upper surface. For example, the electric field strength within the plated dielectric block may gradually decrease from the center of the upper surface of the plated dielectric block toward the periphery of the upper surface. For example, the electric field strength value at the center of the upper surface of the plated dielectric block may be 0.9673 [V / m], and the electric field strength value at the outer edge of the upper surface of the plated dielectric block may be 0 [V / m].

[0052] Example (420) shows the electric field distribution of a dielectric block cut along A-A' of Example (410). For example, the electric field strength in the plated dielectric block may be substantially the same in a direction parallel to the direction facing the top surface. For example, the electric field strength in the plated dielectric block may gradually decrease as it moves from the center of the plated dielectric block toward a direction perpendicular to the direction facing the top surface. The value of the electric field strength at the center of the plated dielectric block may be 0.9673 [V / m], and the value of the electric field strength at the outer edge of the plated dielectric block may be 0 [V / m].

[0053] Example (430) may show a cross-section of a legacy waveguide portion created based on the plated dielectric block of Example (410). The legacy waveguide portion may correspond to at least a part of a legacy waveguide filter. The legacy waveguide portion may include or have a resonance hole (431) and / or an input port (432). The resonance hole (431) and / or the input port (432) may be formed in a region of high electric field strength in the plated dielectric block of Example (410).

[0054] For a legacy waveguide filter with a low group delay value, resonant holes (431) and / or input ports (432) may be designed to be formed in regions of high electric field strength in the plated dielectric block. The following mathematical formula may be referenced for the group delay.

[0055]

[0056] Group delay can be referred to as a parameter indicating how much the phase of a signal (e.g., an RF signal) changes with frequency. represents the phase of the signal. represents the frequency of the signal. A communication device (e.g., communication device (210)) requires a relatively low group delay over a wide frequency band to support broadband communication. The lower the value of the group delay, the higher the quality of the legacy waveguide filter.

[0057] For example, by forming a resonant hole (431) and / or an input port (432) in an area of ​​high electric field strength, the coupling strength of the resonant hole (431) and the input port (432) can be strengthened or increased. For example, by forming a resonant hole (431) and / or an input port (432) in an area of ​​high electric field strength, the power loss of the RF signal obtained through the input port (432) can be reduced. For example, as the coupling strength of the resonant hole (431) and the input port (432) increases, the value of the group delay can be reduced.

[0058] Figure 5 illustrates an example of the quality of a waveguide filter according to the position of the input port.

[0059] Referring to FIG. 5, Example (501) shows a cross-section of a legacy waveguide portion. For example, the legacy waveguide portion may correspond to at least a part of a legacy waveguide filter. The legacy waveguide portion of Example (501) may include a resonant groove (510) formed on the upper surface and / or an input port (511) formed on the lower surface. The input port (511) may be formed in the shape of a groove.

[0060] Example (502) shows a cross-section of a first waveguide portion according to one embodiment. The first waveguide portion may be an example of a waveguide portion (301) of FIG. 3. For example, the first waveguide portion may correspond to at least a part of a waveguide filter. The first waveguide portion of Example (502) may include a resonance hole (520) formed on the upper surface and / or an input port (521) formed on the side between the upper surface and the lower surface. The input port (521) may be formed in the shape of a groove.

[0061] Example (503) shows a cross-section of a second waveguide portion according to one embodiment. The second waveguide portion may be an example of the waveguide portion (301) of FIG. 3. For example, the second waveguide portion may correspond to at least a part of a waveguide filter. The second waveguide portion of Example (503) may include a resonance hole (530) formed on the upper surface and / or an input port (531) formed on the side between the upper surface and the lower surface. The input port (531) may be formed in the shape of a groove.

[0062] According to one embodiment, the size of the legacy waveguide portion of Example (501), the size of the first waveguide portion of Example (502), and the size of the second waveguide portion of Example (503) may be substantially the same as each other. The size of the resonant groove (510), the size of the resonant hole (520), and the size of the resonant hole (530) may be substantially the same.

[0063] According to one embodiment, the depth of the input port (531) of example (503) may be greater than the depth of the input port (521) of example (502). For example, the distance (d) between the input port (531) and the resonance hole (530) may be smaller than the distance between the input port (521) and the resonance hole (520). For example, the value of the distance (d) between the input port (531) and the resonance hole (530) may be about 0.33 mm.

[0064] Graph (504) represents the group delay of the legacy waveguide portion of Example (501), the group delay of the first waveguide portion of Example (502), and the group delay of the second waveguide portion of Example (503). The x-axis may represent frequency. The unit of the x-axis may be GHz (giga hertz). The y-axis may represent group delay. The unit of the y-axis may be ns. Line (541) of Graph (504) may correspond to the legacy waveguide portion of Example (501). Line (541) may have a group delay of 2.9835 ns at a frequency of 3.5 GHz. Line (542) of Graph (504) may correspond to the first waveguide portion of Example (502). Line (542) may have a group delay of 86.2047 ns at a frequency of 3.5 GHz. The line (543) of the graph (504) may correspond to the second waveguide portion of the example (503). The line (543) may have a group delay of 2.9081 ns at a frequency of 3.5 GHz. The graph (504) indicates that the value of the group delay of the legacy waveguide portion of the example (501) and the value of the group delay of the second waveguide portion of the example (503) are similar. The quality of the legacy waveguide portion of the example (501) may be similar to or substantially identical to the quality of the second waveguide portion of the example (503).

[0065] According to one embodiment, the second waveguide portion of the example (503) may be formed on a side perpendicular to the upper surface of the second waveguide portion where the resonance hole (530) is disposed, having a quality similar to or substantially identical to that of the legacy waveguide portion of the example (501).

[0066] FIGS. 6a and 6b illustrate examples of waveguide filters including loops.

[0067] Referring to FIG. 6a, Example (601) shows the magnetic field distribution of a plated dielectric block. For example, the plated dielectric block may not have resonant holes and / or input ports formed therein. The magnetic field distribution of Example (601) may be caused by electromagnetic waves propagating or radiating in the air. The magnetic field strength within the plated dielectric block may be relatively low in the central region of the upper surface of the plated dielectric block. The magnetic field strength in the central region of the upper surface of the plated dielectric block may be 0.0000001 [A / m]. The magnetic field strength within the plated dielectric block may be lower as it approaches the vertices of the plated dielectric block. The magnetic field strength at the vertices of the upper surface of the plated dielectric block may be 0.0000001 [A / m]. The magnetic field strength within the plated dielectric block may be relatively high in the central region of the side of the plated dielectric block. The magnetic field strength of the central region of the side of the plated dielectric block can be 0.0000035 [A / m].

[0068] Example (602) shows the magnetic field distribution of a dielectric block cut along B-B' of Example (601). For example, the magnetic field strength in the plated dielectric block may gradually increase as it moves from the center of the plated dielectric block toward a direction parallel to the direction toward the side. The value of the magnetic field strength at the center of the plated dielectric block may be 0.0000001 [A / m], and the value of the magnetic field strength at the outer edge of the plated dielectric block may be 0.0000035 [A / m].

[0069] Referring to FIG. 6b, example (603) shows a plated dielectric block according to one embodiment. The plated dielectric block may include a loop circuit (630) and / or an input port (631). For example, a signal (e.g., an electrical signal) obtained through the input port (631) in the plated dielectric block may flow through the loop circuit (630). For example, a magnetic field may be generated according to the signal flowing through the loop circuit (630) in the plated dielectric block.

[0070] Example (604) shows the distribution of a magnetic field generated according to a signal flowing through a loop circuit (630) in a plated dielectric block of Example (603). The magnetic field strength within the plated dielectric block may be relatively low in the central region of the upper surface of the plated dielectric block. The magnetic field strength in the central region of the upper surface of the plated dielectric block may be 0.0308 [A / m]. The magnetic field strength within the plated dielectric block may be lower as it approaches the vertices of the plated dielectric block. The magnetic field strength at the vertices of the upper surface of the plated dielectric block may be 0.0308 [A / m]. The magnetic field strength within the plated dielectric block may be relatively high in the central region of the side of the plated dielectric block. The magnetic field strength in the central region of the side of the plated dielectric block may be 7.000 [A / m].

[0071] Example (605) shows the magnetic field distribution of a dielectric block cut along C-C' of Example (604). For example, the magnetic field strength in the plated dielectric block may gradually increase as it moves from the center of the plated dielectric block toward a direction parallel to the direction toward the side. The value of the magnetic field strength at the center of the plated dielectric block may be 7.000 [A / m], and the value of the magnetic field strength at the outer edge of the plated dielectric block may be 0.0308 [A / m].

[0072] According to one embodiment, the distribution of the magnetic field in Example (601) may correspond to the distribution of the magnetic field in Example (604). For example, the heatmap of the magnetic field in Example (601) and the heatmap of Example (604) may appear similar. For example, in Example (601), the magnetic field strength may appear relatively low at the vertices of the plated dielectric block, and in Example (604), the magnetic field strength may also appear relatively low at the vertices of the plated dielectric block. For example, in Example (601), the magnetic field strength may appear relatively high in the central region of the side of the plated dielectric block, and in Example (604), the magnetic field strength may also appear relatively high in the central region of the side of the plated dielectric block.

[0073] According to one embodiment, the distribution of the magnetic field in Example (602) may correspond to the distribution of the magnetic field in Example (605). For example, the heatmap of the magnetic field in Example (602) and the heatmap of Example (605) may appear similar. For example, in Example (602), the magnetic field strength may appear relatively high in the central area of ​​the side of the plated dielectric block, and in Example (605), the magnetic field strength may also appear relatively high in the central area of ​​the side of the plated dielectric block. For example, in Example (602), the magnetic field strength may appear relatively low in the central area of ​​the upper surface and / or the central area of ​​the lower surface of the plated dielectric block, and in Example (605), the magnetic field strength may also appear relatively low in the central area of ​​the upper surface and / or the central area of ​​the lower surface of the plated dielectric block.

[0074] According to one embodiment, since the magnetic field distribution of Example (601) corresponds to the magnetic field distribution of Example (604) and the magnetic field distribution of Example (602) corresponds to the magnetic field distribution of Example (604), the waveguide filter according to the plated dielectric block of Example (603) can have reduced power loss. In addition, as power loss is reduced, the waveguide filter according to the plated dielectric block of Example (603) can have a relatively high transmission efficiency.

[0075] FIGS. 7a through 7d illustrate examples of waveguide filters having slots. The waveguide filter (700) may be an example of the waveguide filter (300) of FIG. 3.

[0076] Referring to FIG. 7a, the waveguide filter (700) may include a plurality of waveguide portions (301, 302, 303, 304, 305, 306, 307, 308). For the plurality of waveguide portions (301, 302, 303, 304, 305, 306, 307, 308), the descriptions of the plurality of waveguide portions (301, 302, 303, 304, 305, 306, 307, 308) of FIG. 3 may be referenced.

[0077] According to one embodiment, the waveguide filter (700) may include a waveguide portion (301). The waveguide portion (301) may have or include a resonant hole (310) in a first xy plane of the waveguide portion (301) oriented toward the z-axis. The waveguide portion (301) may include an input port (710) in a first yz plane of the waveguide portion (301) oriented toward the x-axis. For example, the input port (710) may be formed in the first yz plane of the waveguide portion (301). For example, the input port (710) may be formed in the first yz plane of the waveguide portion (301). The input port (710) may be configured so that the waveguide portion (301) (or waveguide filter (700)) acquires an RF signal. The input port (710) may include a conductive material. For example, the input port (710) can be created or formed by plating a conductive material on one region of the dielectric block.

[0078] The input port (710) may be connected to the slot (711). The slot (711) may include an opening (712) and an opening (713). For example, the input port (710) may be connected to the opening (712) of the slot (711). For example, the input port (710) may transmit an RF signal to the opening (712). For example, the slot (711) may propagate, radiate, or transmit at least a portion of the RF signal obtained through the opening (712) in the form of electromagnetic waves to the resonant hole (310). For example, the slot (711) may be coupled to the resonant hole (310). For example, the slot (711) may transmit a portion of the RF signal obtained through the opening (712) to the opening (713). For example, a portion of the RF signal may flow through the surface of the waveguide filter (700) through the opening (713). For example, a portion of the RF signal may flow through the second xy plane of the waveguide portion (301) facing the direction opposite to the z-axis and the first zx plane of the waveguide portion (301) facing the y-axis.

[0079] According to one embodiment, an RF signal obtained through an input port (710) flowing through a slot (711), a second xy plane, and a first zx plane may correspond to a signal flowing through a loop circuit (630) of the example (603) of FIG. 6b. The waveguide filter (700) may correspond to a waveguide filter according to the plated dielectric material of the example (603) of FIG. 6b. For example, the power loss of the waveguide filter (700) may be relatively low. For example, the waveguide filter (700) may have a relatively high transmission efficiency. For example, the strength of the coupling between the slot (711) and the resonant hole (310) in the waveguide filter (700) may be relatively high. The fact that the waveguide filter (700) corresponds to a waveguide filter according to the plated dielectric material of the example (603) of FIG. 6b will be described and illustrated with reference to FIG. 9.

[0080] According to one embodiment, the quality of the waveguide portion (301) (or waveguide filter (700)) can be determined according to the distance between the slot (711) and the resonance hole (310). For example, the group delay of the waveguide portion (301) (or waveguide filter (700)) can be adjusted according to the distance between the slot (711) and the resonance hole (310). For example, by adjusting the distance between the slot (711) and the resonance hole (310), a waveguide filter (700) having a quality corresponding to the quality of a legacy waveguide filter can be produced. By adjusting the distance between the slot (711) and the resonance hole (310), the quality of the waveguide filter (700) can correspond to the quality of a legacy waveguide filter. For example, the group delay of the waveguide filter (700) can correspond to the group delay of a legacy waveguide filter. The group delay of the waveguide filter (700) corresponding to the group delay of the legacy waveguide filter will be explained and illustrated with reference to FIG. 10.

[0081] According to one embodiment, the waveguide portion (301) may include a clearance (714) surrounding an input port (710). For example, the clearance (714) may be formed in the first yz plane of the waveguide portion (301). For example, the clearance (714) may be formed by removing plating in one area from the surface of the waveguide filter (700) plated with a conductive material. For example, the clearance (714) may be formed by plating a dielectric block with a conductive material except for the area surrounding the input port.

[0082] According to one embodiment, the area of ​​the first yz plane of the waveguide filter (700) facing the x-axis may be smaller than the area of ​​the second xy plane of the waveguide filter (700) facing the direction opposite to the z-axis. Since the input port (710) is formed in the first yz plane of the waveguide filter (700), the waveguide filter (700) may be positioned so that the first yz plane of the waveguide filter (700) contacts one side of a board (e.g., PCB) of a communication device (e.g., communication device (210)). For example, the assembly area of ​​the board required to position the waveguide filter (700) may be smaller than the assembly area of ​​the board required to position a legacy waveguide filter.

[0083] According to one embodiment, the waveguide filter (700) may include a waveguide portion (308). The waveguide portion (308) may have an output port (720). For example, since the output port (720) may be substantially identical to the input port (710), redundant descriptions are omitted. Since the input port (710), slot (711), opening (712), opening (713), and clearance (714) may each be substantially identical to the output port (720), slot (721), opening (722), opening (723), and clearance (724), redundant descriptions are omitted.

[0084] Referring to FIG. 7b, a waveguide filter (700) is shown viewed from a direction opposite to the z-axis. The waveguide filter (700) may include a plurality of waveguide portions (301, 302, 303, 304, 305, 306, 307, 308). The plurality of waveguide portions may provide a signal path between the input port (710) of the waveguide filter (700) and the output port (720) of the waveguide filter (700). According to one embodiment, an RF signal obtained through the input port (710) may be propagated, radiated, or transmitted to the resonance hole (310) in the form of an electromagnetic wave. For example, an RF signal received through the resonance hole (310) may be propagated, radiated, or transmitted to the resonance hole (320) in the form of an electromagnetic wave. For example, an RF signal received through the resonance hole (320) can be propagated, radiated, or transmitted to the resonance hole (330) in the form of electromagnetic waves. For example, an RF signal received through the resonance hole (330) can be propagated, radiated, or transmitted to the resonance hole (340) in the form of electromagnetic waves. For example, an RF signal received through the resonance hole (340) can be propagated, radiated, or transmitted to the resonance hole (350) in the form of electromagnetic waves. For example, an RF signal received through the resonance hole (350) can be propagated, radiated, or transmitted to the resonance hole (360) in the form of electromagnetic waves. For example, an RF signal received through the resonance hole (360) can be propagated, radiated, or transmitted to the resonance hole (370) in the form of electromagnetic waves. For example, the RF signal received through the resonance hole (370) can be propagated, radiated, or transmitted to the resonance hole (380) in the form of electromagnetic waves. For example, the RF signal received through the resonance hole (380) can be propagated, radiated, or transmitted to the output port (720) in the form of electromagnetic waves.

[0085] Referring to FIG. 7c, a waveguide filter (700) is shown viewed from a direction opposite to the x-axis. The waveguide portion (301) may have an input port (710). For example, the input port (710) may be formed in the first yz plane of the waveguide portion (301) facing the x-axis. The input port (710) may be connected to an opening (712) of a slot (711). A clearance (714) surrounding the input port (710) may be formed in the first yz plane of the waveguide portion (301). The clearance (714) may correspond to an area that is not plated with a conductive material.

[0086] According to one embodiment, the surface of the waveguide filter (700) may be plated with a conductive material, excluding the area occupied by the clearance (714) and the area occupied by the clearance (724). If the clearance (714) is composed of a conductive material, at least a portion of the RF signal obtained through the input port (710) may flow through the surface of the waveguide filter (700). That is, the clearance (714) may be used to transmit the RF signal obtained through the input port (710) in the waveguide filter (700) entirely to the slot (711).

[0087] The waveguide portion (308) may have an output port (720). For example, since the output port (720) may be substantially identical to the input port (710), redundant descriptions are omitted. Since the input port (710), slot (711), opening (712), and clearance (714) may each be substantially identical to the output port (720), slot (721), opening (722), and clearance (724), redundant descriptions are omitted.

[0088] Referring to FIG. 7d, a waveguide filter (700) is shown viewed from a direction opposite to the z-axis. The waveguide portion (301) may have an opening (713). The opening (713) may be contained in a slot (711). An RF signal output through the opening (713) may flow over the surface of the waveguide filter (700).

[0089] The waveguide portion (308) may have an opening (723). For example, since the opening (723) may be substantially the same as the opening (713), a redundant description will be omitted.

[0090] Figure 8 illustrates an example of a slot.

[0091] Referring to FIG. 8, example (801) represents a waveguide portion (301). In example (801), the waveguide portion (301) may have a slot (811). The slot (811) may be an example of the slot (711) of FIG. 7a. The slot (811) may include a first portion (811-1) of the slot according to an opening (712) and a second portion (811-2) of the slot according to an opening (713). For example, the first portion (811-1) of the slot may be defined by the opening (712). For example, the second portion (811-2) of the slot may be defined by the opening (713). For example, the first portion (811-1) of the slot and the second portion (811-2) of the slot may be connected to each other in an intersecting manner. For example, the first part (811-1) of the slot and the second part (811-2) of the slot can be connected vertically. For example, the first part (811-1) of the slot and the second part (811-2) of the slot can be in contact vertically. For example, the first part (811-1) of the slot and the second part (811-2) of the slot can be connected in a cross shape and / or an L shape.

[0092] Example (802) represents a waveguide portion (301). In Example (802), the waveguide portion (301) may have a slot (821). The slot (821) may be an example of the slot (711) of FIG. 7A. The slot (821) may include a first portion (821-1) of the slot according to the opening (712) and a second portion (821-2) of the slot according to the opening (713). For example, the first portion (821-1) of the slot may be defined by the opening (712). For example, the second portion (821-2) of the slot may be defined by the opening (713).

[0093] For example, the first part (821-1) of the slot and the second part (821-2) of the slot can be connected in a curved shape. For example, the first part (821-1) of the slot and the second part (821-2) of the slot can be connected in a rounded shape. For example, the slot (821) can be formed continuously in a curved shape.

[0094] Example (803) represents a waveguide portion (301). In Example (803), the waveguide portion (301) may have a slot (831). The slot (831) may be an example of the slot (711) of FIG. 7A. The slot (831) may include a first portion (831-1) of the slot according to an opening (712) and a second portion (831-2) of the slot according to an opening (713). For example, the first portion (831-1) of the slot may be defined by the opening (712). For example, the second portion (831-2) of the slot may be defined by the opening (713). For example, the first portion (831-1) of the slot and the second portion (831-2) of the slot may be connected side by side. For example, the first part (831-1) of the slot and the second part (831-2) of the slot can be connected in a straight line. For example, the first part (831-1) of the slot and the second part (831-2) of the slot can be connected in a form corresponding to a straight line. For example, the slot (831) can be formed to correspond to a straight line from the opening (712) to the opening (713).

[0095] According to one embodiment, the difficulty of manufacturing a waveguide filter (e.g., waveguide filter (700)) including each of the slots (811, 821, 831) shown in Example (801), Example (802), and Example (803) may be easier than the difficulty of manufacturing a waveguide filter according to the plated dielectric block of Example (603) of FIG. 6b. The difficulty of manufacturing a waveguide filter (e.g., waveguide filter (700)) including each of the slots (811, 821, 831) shown in Example (801), Example (802), and Example (803) may be easier than the difficulty of manufacturing a waveguide filter of Example (503) of FIG. 5.

[0096] According to one embodiment, the slots (811, 821, 831) shown in Examples (801), (802), and (803) are merely examples for convenience of explanation and do not limit the embodiments.

[0097] FIG. 9 illustrates an example of a waveguide portion including a slot.

[0098] Referring to FIG. 9, example (901) shows a cross-section of a waveguide portion (301). The waveguide portion (301) may include a slot (811). The slot (811) may be an example of a slot (711).

[0099] According to one embodiment, the waveguide portion (301) can acquire an RF signal through an input port (710). For example, the RF signal may flow through an opening (712), a first part of a slot (811-1), a second part of a slot (811-2), an opening (713), and the surface of the waveguide portion (301). The RF signal output through the opening (713) may be prevented from being transmitted to the input port (710) by a clearance (714). For example, the flow of the RF signal may correspond to a signal flowing through the loop circuit (630) of the example (603) of FIG. 6b.

[0100] According to one embodiment, the waveguide portion (301) (or waveguide filter (700)) may have a group delay determined according to the length (d) and height (h) of the slot. For example, as the length (d) and height (h) of the slot increase, the slot (811) may be closer to the resonance hole (310). As the slot (811) is closer to the resonance hole (310), the time consumed for propagating the RF signal decreases, thereby reducing the degree of distortion of the RF signal. As the degree of distortion of the RF signal decreases, the value of the group delay of the waveguide filter (700) may be reduced. As the value of the group delay of the waveguide filter (700) decreases, the quality of the waveguide filter (700) may be improved.

[0101] Example (902) shows the distribution of a magnetic field generated according to an RF signal flowing through a slot (811) in a waveguide portion (301) of Example (901). The magnetic field strength within the waveguide portion (301) may be relatively low in the central region of the upper surface of the waveguide portion (301). The magnetic field strength in the central region of the upper surface of the waveguide portion (301) may be approximately 40.1005 [A / m]. The magnetic field strength within the waveguide portion (301) may be lower as it approaches the vertices of the waveguide portion (301). The magnetic field strength at the vertices of the upper surface of the waveguide portion (301) may be 10.1280 [A / m]. The magnetic field strength within the waveguide portion (301) may be relatively high in the central region of the side of the waveguide portion (301) where the input port (710) is formed. The magnetic field strength of the central region of the side of the waveguide part (301) where the input port (710) is formed can be 150.0000 [A / m].

[0102] Example (903) shows the magnetic field distribution of a dielectric block cut along D-D' of Example (902). For example, the magnetic field strength in the waveguide section (301) can gradually increase from the center of the waveguide section (301) toward the side where the input port (710) is formed. The value of the magnetic field strength at the center of the side of the waveguide section (301) can be 150.0000 [A / m].

[0103] According to one embodiment, the distribution of the magnetic field in Example (902) may partially correspond to the distribution of the magnetic field in Example (604) of FIG. 6B. For example, the heatmap of the magnetic field in the area adjacent to the input port (710) in the waveguide section (301) in Example (902) may appear similar to the heatmap of Example (604). According to one embodiment, the distribution of the magnetic field in Example (903) may partially correspond to the distribution of the magnetic field in Example (605) of FIG. 6B. For example, the heatmap of the magnetic field in the area adjacent to the input port (710) in the waveguide section (301) in Example (903) may appear similar to the heatmap of Example (605).

[0104] According to one embodiment, since the distribution of the magnetic field of example (902) partially corresponds to the distribution of the magnetic field of example (604) and the distribution of the magnetic field of example (903) corresponds to the distribution of the magnetic field of example (604), the waveguide filter (700) according to the waveguide portion (301) of example (903) can have reduced power loss. In addition, as power loss is reduced, the waveguide filter (700) can have a relatively high transmission efficiency.

[0105] FIG. 10 illustrates an example showing a comparison of the quality of a waveguide filter according to one embodiment and the quality of a legacy waveguide filter.

[0106] Referring to FIG. 10, the graph (1001) can represent the quality of the waveguide filter (700) and the quality of the legacy waveguide filter. For example, the x-axis of the graph (1001) can represent frequency. The unit of the x-axis can be GHz (giga hertz). The y-axis can represent group delay. The unit of the y-axis can be ns. Line (1011) can correspond to the legacy waveguide filter. Line (1012) can correspond to the waveguide filter (700).

[0107] In graph (1001), the shape of line (1011) and the shape of line (1012) may be substantially the same. For example, line (1011) may have a group delay of 2.9835 ns at a frequency of 3.5 GHz. For example, line (1012) may have a group delay of 2.9988 ns at a frequency of 3.5 GHz. The difference between the group delay of the legacy waveguide filter and the group delay of the waveguide filter (700) may be 0.0153 ns at a frequency of 3.5 GHz.

[0108] FIG. 11 illustrates an example of a printed circuit board (PCB) including a plurality of waveguide filters.

[0109] Referring to FIG. 11, the PCB (1101) may include a plurality of waveguide filters (1110). For example, the plurality of waveguide filters (1110) may be disposed on one side of the PCB (1101). Each of the plurality of waveguide filters (1110) may be a waveguide filter (700) of FIG. 7a, FIG. 7b, FIG. 7c, and / or FIG. 7d.

[0110] According to one embodiment, each of the plurality of waveguide filters (1110) may include a waveguide portion (301). For the waveguide portion (301), the descriptions of the waveguide portion (301) in FIGS. 3 through 9 may be referenced. For example, the waveguide portion (301) may be positioned so that the first yz plane of the waveguide portion (301) facing the x-axis is in contact with the PCB (1101). For example, the waveguide portion (301) may be positioned so that the input port (710) is in contact with the PCB (1101).

[0111] According to one embodiment, the PCB (1101) and the waveguide portion (301) may be connected by a conductive material (1120). For example, the conductive material (1120) may include lead. For example, the input port (710) of the waveguide portion (301) may obtain an RF signal from the PCB (1101) through the conductive material (1120-2). For example, the clearance (714) may not come into contact with the conductive material (1120).

[0112] According to one embodiment, the assembly area of ​​the PCB (1101) may be reduced by the first yz plane of the waveguide portion (301) being in contact with the PCB (1101). For example, the area of ​​the first yz plane of the waveguide portion (301) may be smaller than the area of ​​the second xy plane of the waveguide portion (301) facing in a direction opposite to the z-axis. According to embodiments of the present disclosure, a communication device (e.g., communication device (210)) comprising a relatively small size PCB (1101) may be proposed. The size of the communication device may be relatively small.

[0113] Figure 12 shows an example of a communication device.

[0114] Referring to FIG. 12, the communication device (1200) may include a front cover (1201), an antenna plate (1202), a main PCB (1204), and a rear housing (1205). For example, the communication device (1200) may be referred to as a massive MIMO unit (MMU) or a radio unit (RU).

[0115] According to one embodiment, the front cover (1201) may be configured to surround the antenna plate (1202). The front cover (1201) may protect a plurality of antennas placed on the antenna plate (1202). For example, the front cover (1201) may be referred to as a radome. For example, the front cover (1201) may be configured to reduce transmission loss of the frequency band used in the communication device (1200). For example, the front cover (1201) may be composed of a material having excellent radio wave transmittance and excellent environmental resistance.

[0116] According to one embodiment, the antenna plate (1202) may include a plurality of antennas. For example, the antenna plate (1202) may include a plurality of antennas and an antenna substrate for arranging the plurality of antennas (e.g., antenna element, antenna array, antenna sub-array). For example, each of the plurality of antennas may include a radiating structure. The radiating structure may be formed of a conductive material. For the plurality of antennas, the description of the antenna portion (211) of FIG. 2 may be referenced. For example, the plurality of antennas may be arranged on the antenna substrate. The antenna substrate on which the plurality of antennas are arranged may be referred to as an insulating plate, an insulating plate, a radiating substrate, a radiating plate, and / or an equivalent technical term.

[0117] According to one embodiment, the antenna plate (1202) may be placed on the main PCB (1204). As an example, but not limited to, a shield can may be placed between the antenna plate (1202) and the main PCB (1204) so ​​as not to affect the signal emitted through the plurality of antennas included in the antenna plate (1202). The shield can may reduce the effect on the signal emitted through the plurality of antennas generated by the components placed on the main PCB (1204). According to one embodiment, a plurality of filters may be placed between the shield can and the antenna plate (1202). For the plurality of filters, the description of the filter section (212) of FIG. 2 may be referenced.

[0118] According to one embodiment, the main PCB (1204) may provide connections between components for transmitting signals through a plurality of antennas. For example, an RF processing circuit may be placed on a first surface of the main PCB (1204). A processor may be placed on a second surface opposite to the first surface of the main PCB (1204). For example, a plurality of waveguide filters (e.g., a plurality of waveguide filters (1110)) may be placed on the first surface of the main PCB (1204).

[0119] According to one embodiment, the rear housing (1205) may include a heat sink to provide protection and heat dissipation for the communication device (1200). The heat sink may be configured to dissipate heat generated by the components of the main PCB (1204) to the outside.

[0120] Figure 13 shows an example of a communication device.

[0121] Referring to FIG. 13, the communication device (1300) may include a front cover (1301), a PCB (1302), and a rear housing (1303). For example, the communication device (1300) may be referred to as a massive MIMO unit (MMU) or a radio unit (RU).

[0122] According to one embodiment, the front cover (1301) may be configured to enclose the PCB (1302). The front cover (1301) may protect the PCB (1302) and / or components placed on the PCB (1302). For example, the front cover (1301) may be referred to as a radome. For example, the front cover (1301) may be configured to reduce transmission loss of the frequency band used in the communication device (1300). For example, the front cover (1301) may be composed of a material having excellent radio wave transmittance and excellent environmental resistance. For example, the front cover (1301) may correspond to the front cover (1201) of FIG. 1200.

[0123] According to one embodiment, components including a plurality of antennas, a plurality of filters, a processor, and a power amplifier may be disposed on the PCB (1302). Components included in the antenna plate (1202) and the main PCB (1204) of FIG. 12 may be disposed on the PCB (1302).

[0124] For example, the PCB (1302) may include a plurality of antennas. A plurality of antennas may be disposed on a first surface (e.g., front) of the PCB (1302). For example, the plurality of antennas may include antenna elements and support portions. For example, each of the plurality of antennas may include a radiating structure. The radiating structure may be formed of a conductive material. For the plurality of antennas, the description of the antenna portion (211) of FIG. 2 may be referenced. For example, the antenna substrate on which the plurality of antennas are disposed may be referred to as an insulating plate, an insulating plate, a radiating substrate, a radiating plate, and / or an equivalent technical term.

[0125] According to an embodiment, an antenna substrate for a plurality of antennas may be disposed on a first surface (e.g., front surface) of a PCB (1302). A plurality of antennas may be disposed on the antenna substrate. For example, the plurality of antennas and the substrate on which the plurality of antennas are disposed may correspond to the antenna plate (1202) of FIG. 12.

[0126] For example, the PCB (1302) may provide connections between components for transmitting signals through a plurality of antennas. A plurality of antennas may be placed on a first surface (e.g., front) of the PCB (1302). A power amplifier circuit, an RF processing circuit, a circulator, and a plurality of filters may be placed on a second surface (e.g., rear) of the PCB (1302). The plurality of filters may include a plurality of waveguide filters (1110) of FIG. 11, but are not limited thereto. In addition to the components described above, the PCB (1302) may further include various components for transmitting signals from a communication device (1300).

[0127] According to one embodiment, the rear housing (1303) may include a heat sink to provide protection and heat dissipation for the communication device (1300). The heat sink may be configured to dissipate heat generated by the components of the PCB (1302) to the outside. According to an embodiment, the heat sink may provide the function of a shield can. According to an embodiment, the rear housing (1303) may include a heat sink and a shield can.

[0128] In an embodiment according to the present disclosure, an input / output port (e.g., input port (710)) of a waveguide filter (e.g., waveguide filter (700)) may be connected to a slot (e.g., slot (711)). Because of the slot (711), the input / output port (e.g., input port (710)) may be placed on the narrowest of the plurality of faces of the waveguide filter (700). By placing the input / output port (e.g., input port (710)) on the narrowest of the plurality of faces of the waveguide filter, the assembly area of ​​the board (e.g., PCB (1101)) required to accommodate the plurality of waveguide filters may be reduced. By reducing the assembly area of ​​the board, the size of the communication device (e.g., communication device (210)) may be reduced.

[0129] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0130] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0131] As described above, a waveguide filter may include a plurality of waveguide portions for providing a signal path between an input port and an output port. Among the plurality of waveguide portions, at least one waveguide portion may have a resonant hole formed on one surface facing a first direction. Among the plurality of waveguide portions, a first waveguide portion including the input port may have a slot comprising a resonant hole formed on the first surface of the first waveguide portion facing the first direction, and within the first waveguide portion, a first opening formed on the second surface of the first waveguide portion facing a second direction opposite to the first direction, and a second opening formed on the third surface of the first waveguide portion facing a third direction perpendicular to the first direction and the second direction. The second opening may be connected to the input port.

[0132] According to one embodiment, the area of ​​one surface of the waveguide filter facing the third direction may be narrower than the area of ​​one surface of the waveguide filter facing the second direction.

[0133] According to one embodiment, the slot may be configured to propagate at least a portion of the RF (radio frequency) signal obtained through the second opening to the resonant hole formed on the first surface of the first waveguide portion.

[0134] According to one embodiment, the slot may include a first portion of the slot defined by the first opening and a second portion of the slot defined by the second opening. The first portion of the slot and the second portion of the slot may be vertically connected.

[0135] According to one embodiment, the slot may include a first portion of the slot defined by the first opening and a second portion of the slot defined by the second opening. The first portion of the slot and the second portion of the slot may be connected in a straight line.

[0136] According to one embodiment, the slot may include a first portion of the slot defined by the first opening and a second portion of the slot defined by the second opening. The first portion of the slot and the second portion of the slot may be connected in a curved shape.

[0137] According to one embodiment, the interior of the waveguide filter may be formed of a solid dielectric. The surface of the waveguide filter may be plated with a conductive material, except for the area surrounding the input port formed on the third surface of the first waveguide portion.

[0138] According to one embodiment, the solid dielectric may include ceramic.

[0139] According to one embodiment, the closer the slot and the resonant hole of the first waveguide portion are to each other, the higher the coupling strength between the slot and the resonant hole of the first waveguide portion may be.

[0140] A communication device as described above may include a processor, an antenna, an RF processing circuit, a printed circuit board, and a waveguide filter disposed on one side of the printed circuit board. The waveguide filter may include a plurality of waveguide portions for providing a signal path between an input port and an output port. Among the plurality of waveguide portions, at least one waveguide portion may have a resonant hole formed on one side facing a first direction. Among the plurality of waveguide portions, a first waveguide portion including the input port may have a slot comprising a resonant hole formed on the first side of the first waveguide portion facing the first direction, and within the first waveguide portion, a first opening formed on the second side of the first waveguide portion facing a second direction opposite to the first direction, and a second opening formed on the third side of the first waveguide portion facing a third direction perpendicular to the first direction and the second direction. The second opening may be connected to the input port.

[0141] According to one embodiment, the area of ​​one surface of the waveguide filter facing the third direction may be narrower than the area of ​​one surface of the waveguide filter facing the second direction.

[0142] According to one embodiment, the slot may be configured to propagate at least a portion of the RF (radio frequency) signal obtained through the second opening to the resonant hole formed on the first surface of the first waveguide portion.

[0143] According to one embodiment, the slot may include a first portion of the slot defined by the first opening and a second portion of the slot defined by the second opening. The first portion of the slot and the second portion of the slot may be vertically connected.

[0144] According to one embodiment, the slot may include a first portion of the slot defined by the first opening and a second portion of the slot defined by the second opening. The first portion of the slot and the second portion of the slot may be connected in a straight line.

[0145] According to one embodiment, the slot may include a first portion of the slot defined by the first opening and a second portion of the slot defined by the second opening. The first portion of the slot and the second portion of the slot may be connected in a curved shape.

[0146] According to one embodiment, the interior of the waveguide filter may be formed of a solid dielectric. The surface of the waveguide filter may be plated with a conductive material, except for the area surrounding the input port formed on the third surface of the first waveguide portion.

[0147] According to one embodiment, the solid dielectric may include ceramic.

[0148] According to one embodiment, the closer the slot and the resonant hole of the first waveguide portion are to each other, the higher the coupling strength between the slot and the resonant hole of the first waveguide portion may be.

[0149] According to one embodiment, the waveguide filter may be arranged such that one side of the waveguide filter facing the third direction contacts the surface of the printed circuit board.

[0150] According to one embodiment, the antenna may be placed on another side of the printed circuit board opposite to the side.

[0151] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0152] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0153] Various embodiments of this document may be implemented as software comprising one or more instructions stored in a storage medium (e.g., memory) that is readable by a machine (e.g., communication device (210) of FIG. 2). For example, a processor (e.g., processor (214)) of the machine (e.g., communication device (210)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0154] According to one embodiment, the method according to the various embodiments disclosed herein may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0155] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. Regarding waveguide filters, It includes a plurality of waveguide portions for providing a signal path between an input port and an output port, and each waveguide portion among the plurality of waveguide portions has a resonant hole formed on one surface facing a first direction. Among the plurality of waveguide portions above, the first waveguide portion including the input port is: A resonant hole formed on the first surface of the first waveguide portion facing the first direction; and A slot having, within the first waveguide portion, a first opening formed on a second surface of the first waveguide portion facing a second direction opposite to the first direction, and a second opening formed on a third surface of the first waveguide portion facing a third direction perpendicular to the first direction and the second direction, The above second opening is connected to the above input port, Waveguide filter.

2. In Claim 1, The area of ​​one surface of the waveguide filter facing the third direction is narrower than the area of ​​one surface of the waveguide filter facing the second direction. Waveguide filter.

3. In Claim 1, The slot is configured to propagate at least a portion of the RF (radio frequency) signal obtained through the second opening to the resonant hole formed on the first surface of the first waveguide portion. Waveguide filter.

4. In Claim 1, The slot comprises a first portion of the slot defined by the first opening and a second portion of the slot defined by the second opening, and The first part of the slot and the second part of the slot are vertically connected. Waveguide filter.

5. In Claim 1, The slot comprises a first portion of the slot defined by the first opening and a second portion of the slot defined by the second opening, and The first part of the slot and the second part of the slot are connected in a straight line. Waveguide filter.

6. In Claim 1, The slot comprises a first portion of the slot defined by the first opening and a second portion of the slot defined by the second opening, and The first part of the slot and the second part of the slot are connected in a curved shape. Waveguide filter.

7. In Claim 1, The interior of the above waveguide filter is formed of a solid dielectric, and The surface of the waveguide filter is plated with a conductive material, except for the area surrounding the input port formed on the third surface of the first waveguide portion. Waveguide filter.

8. In Claim 7, The above-mentioned solid dielectric comprises ceramic, Waveguide filter.

9. In Claim 1, The closer the slot and the resonance hole of the first waveguide portion are, the higher the coupling strength between the slot and the resonance hole of the first waveguide portion. Waveguide filter.

10. In a communication device, processor; antenna; RF processing circuit; Printed circuit board; It includes a waveguide filter disposed on one side of the printed circuit board, and The waveguide filter comprises a plurality of waveguide portions for providing a signal path between an input port and an output port, and each waveguide portion among the plurality of waveguide portions has a resonant hole formed on one surface facing a first direction, Among the plurality of waveguide portions above, the first waveguide portion including the input port is: A resonant hole formed on the first surface of the first waveguide portion facing the first direction; and A slot having, within the first waveguide portion, a first opening formed on a second surface of the first waveguide portion facing a second direction opposite to the first direction, and a second opening formed on a third surface of the first waveguide portion facing a third direction perpendicular to the first direction and the second direction, The above second opening is connected to the above input port, Communication device.

11. In Claim 10, The area of ​​one surface of the waveguide filter facing the third direction is narrower than the area of ​​one surface of the waveguide filter facing the second direction. Communication device.

12. In Claim 10, The slot is configured to propagate at least a portion of the RF (radio frequency) signal obtained through the second opening to the resonant hole formed on the first surface of the first waveguide portion. Communication device.

13. In Claim 10, The slot comprises a first portion of the slot defined by the first opening and a second portion of the slot defined by the second opening, and The first part of the slot and the second part of the slot are vertically connected. Communication device.

14. In Claim 10, The waveguide filter is arranged such that one surface of the waveguide filter facing the third direction contacts the surface of the printed circuit board. Communication device.

15. In Claim 10, The above antenna is disposed on another side of the above printed circuit board opposite to the above side, Communication device.

Images