Substrate assembly, method for manufacturing substrate assembly, and power device

Abstract

The present invention may provide a substrate assembly comprising: a substrate; and a terminal which is mounted on the substrate and on which a component is mounted, wherein the substrate includes a first pad and a second pad which are spaced apart from each other and connected through a bridge, and the terminal is connected to a conductive paste formed on both the first pad and the second pad. Accordingly, by automatically mounting the terminal on the substrate, the manufacturing process can be simplified and the manufacturing time can be reduced.

Description

Substrate assembly, method of manufacturing substrate assembly, and power device

[0001] The embodiments relate to a substrate assembly, a method for manufacturing a substrate assembly, and a power device.

[0002] A power device can supply data and power. The power device can be used to directly supply data and power to access points (APs), such as internet phones, network cameras, and wireless LANs. Such a power device may include a housing, a circuit board located inside the housing, and a plug connected to the circuit board. If the power device can be directly connected to an outlet, the plug of the power device is inserted into the outlet.

[0003] A substrate is formed by printing a circuit line pattern using a conductive material, such as copper, onto an electrically insulating substrate, and is defined as a board immediately before mounting electronic components. The substrate forms a circuit pattern with conductive paste applied to specific areas using a mask. Subsequently, electronic components can be mounted onto the automatically applied solder paste using a mounting device. Afterward, the electronic components can be firmly attached to the substrate through reflow soldering.

[0004] Meanwhile, electronic components can also be attached to the circuit board via separate terminals. Connecting electronic components through terminals allows for direct connection of external wiring to the terminals, which facilitates easy replacement or modification of the wiring and offers the advantage of increasing mechanical strength when connecting the components to the circuit board.

[0005] However, when mounting electronic components onto a substrate via terminals, the terminals cannot be fixed to the substrate using an automated device. Consequently, while electronic components that do not require terminals are automatically mounted to the substrate using an automated device, components mounted via terminals require manual assembly of the terminals to the substrate after reflow soldering, which results in a complex process and increased manufacturing time.

[0006] Additionally, the plug can be electrically connected to the circuit board via soldering. However, when connecting the plug to the board using soldering, the process becomes complex and time-consuming, and there is a high probability of defects occurring in the board's components due to contact issues arising during the soldering process.

[0007] Accordingly, the embodiment aims to solve the above-mentioned problems and provides a substrate assembly and a method for manufacturing the substrate assembly that can simplify the manufacturing process and reduce manufacturing time by automatically mounting a terminal to the substrate.

[0008] The problems that the embodiments aim to solve are not limited to those mentioned above, and other problems not mentioned herein will be clearly understood by those skilled in the art from the description below.

[0009] An embodiment for achieving the above objective may provide a substrate assembly comprising a substrate and a terminal mounted on the substrate and having a component mounted thereon, wherein the substrate comprises a first pad and a second pad that are spaced apart from each other and connected through a bridge, and the terminal is connected to a conductive paste formed together on the first pad and the second pad.

[0010] The first pad above may consist of a plurality of pads spaced apart from each other.

[0011] The second pad above may consist of a plurality of pads spaced apart from each other.

[0012] The above terminal includes a base on which a component is seated, and a first lead and a second lead extending from each side of the base and including a flat contact surface, and the first lead and the second lead can each be connected to a different first pad.

[0013] The above terminal includes a leg portion extending from the base, and the substrate includes a first hole formed in the second pad, and the leg portion can be fixed to the conductive paste where the first hole is located.

[0014] The above leg portion may include a first leg extending from the side of the base where the first lead is located, and a second leg extending from the side of the base where the second lead is located.

[0015] The above leg portion may have a convex curved shape.

[0016] The above terminal includes a screw cover formed on the base, the base includes a second hole, and the screw cover may be positioned in the second hole.

[0017] An embodiment may provide a method for manufacturing a substrate assembly comprising: a) forming a first pad and a second pad on a substrate that are spaced apart from each other and connected through a bridge; b) forming a hole corresponding to the first pad and stacking a mask that covers the second pad and applying a conductive paste; c) mounting a terminal on the conductive paste of the first pad; and d) reflow soldering so that the conductive paste applied to the first pad flows to the second pad.

[0018] In step a) above, the second pad may be formed to include an area where the first hole of the substrate is located.

[0019] The above terminal includes a base on which a component is seated, and a first lead and a second lead extending from each side of the base and including a flat contact surface, and in step c), the first lead and the twelfth lead can be mounted to a conductive paste located on the first pad.

[0020] The terminal includes a leg portion extending from the base, and in step c), the leg portion can be inserted into the first hole.

[0021] In step d) above, the conductive paste applied to the first pad can flow into the first hole of the second pad and fix the leg portion to the substrate.

[0022] An embodiment for achieving the above objective may provide a power device comprising a housing having a hole formed therein, a substrate fixed to the housing, a plug having a first groove formed therein located in the hole, and a fastening member located in the first groove, wherein the housing includes a first screw thread formed on the inner surface of the hole, the plug includes a second screw thread formed on the inner surface of the first groove and formed continuously with the first screw thread, and the fastening member penetrates the substrate and is fastened together with the first screw thread and the second screw thread.

[0023] The above hole includes a first region where the fastening member is located and a plurality of second regions where the plug is located, and the first groove of the plug can be aligned with the first region.

[0024] The above plug includes a first end and a second end formed with the first groove in between, and the first end and the second end may each be located in the plurality of second regions.

[0025] The first screw thread is formed in the first region, and the second screw thread can be formed in the first end and the second end.

[0026] The horizontal separation distance between the first end and the second end may be smaller than the outer diameter of the body of the fastening member.

[0027] The above substrate includes a first conductive portion formed on one side and a second conductive portion formed on the other side that is electrically connected to the first conductive portion, and the first conductive portion may contact the fastening member and the second conductive portion may contact the plug.

[0028] The head of the above-mentioned fastening member contacts the first conductive part, and the body of the above-mentioned fastening member extending from the head can contact the plug.

[0029] The above plug includes a first end and a second end formed with the first groove in between, and the first end and the second end can come into contact with the second conductive part.

[0030] According to the embodiment, by configuring the terminal to automatically mount on the substrate, the manufacturing process can be simplified and the manufacturing time can be reduced.

[0031] According to an embodiment, by connecting the first pad and the second pad through a bridge so that conductive paste flows from the first pad to the second pad during the reflow soldering process, there is an advantage of being able to automatically mount the terminal while firmly fixing the terminal to the substrate. That is, the first lead and the second lead of the terminal come into contact with the conductive paste located on the first pad, and the leg portion of the terminal comes into contact with the conductive paste flowing into the first hole of the second pad, thereby allowing the terminal to be firmly fixed to the substrate.

[0032] According to the embodiment, by assembling the plug to the substrate through a rotary fastening member without using soldering, there is an advantage in that the process is rapid and simplified and defects can be reduced.

[0033] According to the embodiment, since the housing is screw-fastened together with the plug, there is an advantage in that the fastening member is prevented from loosening while maintaining electrical contact with the plug, thereby ensuring the fastening force between the plug and the substrate.

[0034] According to an embodiment, a plug is electrically in contact with one side of a substrate, and a fastening member connected to the plug on the other side of the substrate is electrically in contact with the substrate. Thus, even if the contact between the plug and the substrate is broken, there is an advantage in that the substrate and the plug maintain electrical contact through the fastening member.

[0035] FIG. 1 is a diagram illustrating the process of mounting electronic components onto a substrate.

[0036] FIG. 2 is a drawing illustrating an electronic component mounted on a terminal,

[0037] Fig. 3 is a perspective view of the terminal seen from above.

[0038] Fig. 4 is a perspective view of the terminal seen from below.

[0039] FIG. 5 is a side view of the terminal,

[0040] FIG. 6 is a drawing illustrating a method for manufacturing a substrate assembly according to an embodiment.

[0041] FIG. 7 is a drawing illustrating the first pad and the second pad of a substrate,

[0042] FIG. 8 is a side cross-sectional view showing the first pad and the second pad of the substrate based on AA of FIG. 7,

[0043] FIG. 9 is a drawing showing a state in which a mask is laminated on a substrate.

[0044] FIG. 10 is a drawing showing a state in which a conductive paste is applied to a first pad.

[0045] FIG. 11 is a diagram illustrating the process of mounting a terminal onto a substrate.

[0046] FIG. 12 is a drawing illustrating the state in which the conductive paste of the first pad moves to the second pad during the reflow soldering process.

[0047] FIG. 13 is a cross-sectional view illustrating the state in which the conductive paste of the first pad moves to the second pad during the reflow soldering process.

[0048] FIG. 14 is a drawing illustrating a system including a power device according to an embodiment.

[0049] FIG. 15 is a perspective view illustrating a power device according to an embodiment,

[0050] FIG. 16 is an exploded view of the power device shown in FIG. 15,

[0051] FIG. 17 is a drawing illustrating a housing including a hole,

[0052] FIG. 18 is a drawing showing a hole in the housing,

[0053] FIG. 19 is a drawing showing a substrate,

[0054] FIG. 20 is a side cross-sectional view of a substrate around a through-hole,

[0055] FIG. 21 is a drawing illustrating a plug,

[0056] FIG. 22 is a drawing illustrating the process of a fastening member, a plug, and a housing being fastened to a hole.

[0057] FIG. 23 is a drawing showing a hole in the housing where the plug is located.

[0058] FIG. 24 is a drawing illustrating the first screw thread and the second screw thread,

[0059] FIG. 25 is a side cross-sectional view based on AA of FIG. 15,

[0060] FIG. 26 is a side cross-sectional view based on BB of FIG. 15,

[0061] FIG. 27 is a diagram illustrating the conductive state of the substrate, the plug, and the fastening bolt.

[0062] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0063] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0064] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0065] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0066] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as “at least one of A and B, C (or more than one of them),” it may include one or more of all combinations that can be formed from A, B, and C.

[0067] In addition, terms such as first, second, A, B, (a), (b), etc. may be used when describing the components of the embodiments of the present invention.

[0068] These terms are intended merely to distinguish a component from other components and are not limited by the nature, order, sequence, etc., of the said component.

[0069] And, where it is stated that a component is 'connected', 'combined', or 'joined' to another component, this may include not only cases where the component is directly connected, combined, or joined to the other component, but also cases where it is 'connected', 'combined', or 'joined' due to another component located between the component and the other component.

[0070] Furthermore, when described as being formed or placed on the “top or bottom” of each component, “top or bottom” includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as “top or bottom,” it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0071] Electronic components can be directly attached to conductive paste applied to the pads of a substrate. Here, the pads of the substrate refer to areas of the substrate where the insulator has been removed to expose the metal layer. When electronic components are directly attached to the conductive paste, they can be automatically mounted to the substrate using a mounting device. However, if the components are large or require separate wiring, they can be mounted to the substrate via terminals. Generally, this requires inserting the terminal legs into holes in the substrate and soldering the terminal pins one by one, which complicates the process and increases the time required.

[0072] The substrate assembly and the method for manufacturing the substrate assembly according to the embodiment are devices and methods that, in order to fundamentally solve this problem, secure a configuration for automatically mounting the terminal while ensuring the bondability of the terminal by directly attaching the terminal to a conductive paste and fixing the leg portion of the terminal through an additional conductive paste implemented during the reflow soldering process.

[0073] In addition, the power device can be directly connected to an outlet via a plug. The outlet can be installed indoors or outdoors. While soldering is generally used to electrically connect the plug to the circuit board, the soldering process is not easy given the limited space inside the power device. Since a portion of the plug is exposed outside the power device's housing while another portion must be soldered inside the housing, the process is inevitably complex and time-consuming.

[0074] The power device according to the embodiment is a device that, in order to fundamentally solve this problem, completely changes the assembly method of the substrate and the plug, and secures the electrical connection between the substrate and the plug while simultaneously connecting the substrate, the plug, and the housing through a fastening member.

[0075] Figure 1 is a diagram illustrating the process of mounting electronic components onto a substrate.

[0076] Referring to FIG. 1, electronic components can be automatically mounted on a substrate through an automatic mounting device. However, some of the electronic components (1) may be mounted on the substrate (100) through terminals due to their size and wiring. The substrate assembly and the method of manufacturing the substrate assembly according to the embodiment make it possible to automatically mount terminals on the substrate (100).

[0077] FIG. 2 is a drawing showing an electronic component mounted on a terminal (200), FIG. 3 is a perspective view of the terminal (200) viewed from above, FIG. 4 is a perspective view of the terminal (200) viewed from below, and FIG. 5 is a side view of the terminal (200).

[0078] Referring to FIGS. 2 to 5, an electronic component can be mounted on a terminal (200). An electronic component (2) can be coupled to the terminal (200) through a fastening member (3). The terminal (200) may include a base (210), a first lead (220), a second lead (230), a leg portion (240), and a screw cover (250).

[0079] The base (210) provides a flat upper surface on which an electronic component can be placed. Although the base (210) is illustrated as a plate having a rectangular upper surface, the present invention is not limited thereto and can be modified in various ways depending on the size and shape of the electronic component. The base (210) may include a plurality of guides (211, 212) protruding from the edge of the upper surface. For example, the first guide (211) and the second guide (212) may be positioned facing each other. The first guide (211) and the second guide (212) each serve to guide the electronic component placed on the base (210) so that it is aligned with the base (210).

[0080] The first lead (220) and the second lead (230) each come into contact with the conductive paste applied to the substrate (100). The first lead (220) may extend downward from one side of the base (210). Specifically, the first lead (220) extends downward from one side of the base (210) and is then folded horizontally to form a flat contact surface (CT) that can come into contact with the conductive paste applied to the substrate (100). The second lead (230) may extend downward from the other side of the base (210). Specifically, the second lead (230) extends downward from the other side of the base (210) and is then folded horizontally to form a flat contact surface (CT) that can come into contact with the conductive paste applied to the substrate (100). These first lead (220) and second lead (230) may be positioned offset when viewing the terminal (200) from above. Meanwhile, the first lead (220) and the second lead (230) can be extended and formed on the side of the base (210) where there is no guide of the base (210).

[0081] The leg portion (240) is inserted into a first hole (H1) formed in the substrate (100) and is fixed by a conductive paste flowing into the first hole (H1), thereby securing the bonding force between the terminal (200) and the substrate (100). This leg portion (240) may include a first leg (241) and a second leg (242).

[0082] The first leg (241) may be formed to extend downward from one side of the base (210) on which the first lead (220) is formed. That is, the first lead (220) and the first leg (241) may be formed together on one side of the base (210). The first leg (241) is inserted into the first hole (H1) of the substrate (100) to align the mounting position of the terminal (200). The first leg (241) has a bar shape and may be formed to have a cross-section smaller than the size of the first hole (H1) by taking into account the size of the first hole (H1) of the substrate (100).

[0083] The second leg (242) may be formed extending downward from the other side of the base (210) where the second lead (230) is formed. That is, the second lead (230) and the second leg (242) may be formed together on the other side of the base (210). The second leg (242) is inserted into another first hole (H1) of the substrate (100) and, together with the first leg (241), aligns the mounting position of the terminal (200). The second leg (242) also has a bar shape and may be formed to have a cross-section smaller than the size of the first hole (H1), taking into account the size of the first hole (H1) of the substrate (100).

[0084] The first leg (241) and the second leg (242) may each have a convex, curved shape toward the outside of the base (210). Since the conductive paste holds the first leg (241) and the second leg (242) with the convex, it is possible to prevent the first leg (241) and the second leg (242) from coming out of the first hole (H1) of the substrate (100).

[0085] The screw cover (250) is intended to cover the fastening member (3) that secures the electronic component to the terminal (200). The screw cover (250) may be implemented in a cylindrical shape with a hollow portion, and the bottom of the hollow portion may be formed to be closed. The fastening member (3) may be screw-fastened into the hollow portion of the screw cover (250). Scrap that may be generated during the screw fastening process can be stored in the hollow portion to prevent it from leaking out of the terminal (200). This screw cover (250) may be located in the center of the base (210). The screw cover (250) may be molded integrally with the base (210) or may be coupled to the base (210) as a separate part.

[0086] FIG. 6 is a drawing illustrating a method for manufacturing a substrate assembly according to an embodiment, FIG. 7 is a drawing illustrating a first pad (P1) and a second pad (P2) of a substrate (100), and FIG. 8 is a side cross-sectional view illustrating the first pad (P1) and the second pad (P2) of a substrate (100) based on AA of FIG. 7.

[0087] Referring to FIGS. 6 to 8, the method for manufacturing a substrate assembly according to an embodiment may form a first pad (P1) and a second pad (P2) on a substrate (100) that are spaced apart from each other and connected through a bridge (B). (S100)

[0088] The first pad (P1) and the second pad (P2) each correspond to an area of ​​the substrate (100) where an insulator (120) is removed from the substrate (100) and a metal layer (110), such as copper, is exposed. The first pad (P1) corresponds to an area where conductive paste is applied for mounting the terminal (200). The second pad (P2) is an area separated from the first pad (P1) and connected via a bridge (B), and is an area where the conductive paste applied to the first pad (P1) flows into during the reflow soldering process.

[0089] The first pad (P1) is where the first lead (220) or the second lead (230) of the terminal (200) is mounted. The shape of the first pad (P1) may correspond to the shape of the contact surface (CT) of the first lead (220) or the shape of the contact surface (CT) of the second lead (230). For example, the shape of the first pad (P1) is illustrated as a rectangle, but the present invention is not limited thereto and may have a convex curved surface or be implemented as a circle. Multiple first pads (P1) corresponding to one terminal (200) may be provided. For example, one first pad (P1) corresponding to the first lead (220) and another first pad (P1) corresponding to the second lead (230) may be provided. The position of the first pad (P1) may be set to correspond to the first lead (220) and the second lead (230) of the terminal (200).

[0090] The second pad (P2) is configured to include a first hole (H1) into which the leg portion (240) of the terminal (200) is inserted. The second pad (P2) is located separately from the first pad (P1). The second pad (P2) can be connected to the second pad (P2) through a bridge (B). The bridge (B) is an area connecting the first pad (P1) and the second pad (P2), and may correspond to an area of ​​the substrate (100) where an insulator is removed from the substrate (100) and a metal layer, such as copper, is exposed. The second pad (P2) may be formed larger than the area of ​​the first pad (P1) so that the conductive paste applied to the first pad (P1) during the reflow soldering process can sufficiently flow in. The substrate (100) includes a first hole (H1) located at the second pad (P2). The first hole (H1) is a hole that penetrates the upper and lower surfaces of the substrate (100) and is where the leg portion (240) of the terminal (200) is inserted. The first hole (H1) is also where the conductive paste applied to the first pad (P1) flows in during the reflow soldering process. This first hole (H1) may be located adjacent to the bridge (B). Accordingly, the conductive paste flowing into the second pad (P2) through the bridge (B) can be quickly introduced into the first hole (H1). Meanwhile, the substrate (100) may include a second hole (H2) into which the screw cover portion (250) of the terminal (200) is inserted.

[0091] FIG. 9 is a drawing showing a state in which a mask is laminated on a substrate (100), and FIG. 10 is a drawing showing a state in which a conductive paste is applied to a first pad (P1).

[0092] Next, a mask (M) can be laminated onto a substrate (100) and a conductive paste can be applied (S200). A hole (H3) corresponding to the first pad (P1) can be formed in the mask (M). The mask (M) can be formed to cover the second pad (P2) and the first hole (H1). As shown in FIG. 10, when a conductive paste (PA) is applied over such a mask (M), the conductive paste (PA) is applied only to the first pad (P1).

[0093] FIG. 11 is a drawing illustrating the process of mounting a terminal (200) onto a substrate (100).

[0094] Referring to FIGS. 6 and FIGS. 11, next, the terminal (200) can be mounted to the conductive paste (PA) of the first pad (P1) (S300). When the terminal (200) is mounted to the substrate (100), the first lead (220) and the second lead (230) are mounted to the conductive paste (PA) of the first pad (P1) of the terminal (200). At the same time, the leg portion (240) of the terminal (200) is inserted into the first hole (H1) of the second pad (P2). The leg portion (240) can guide the position of the terminal (200) during the process of mounting the terminal (200) to the substrate (100). This mounting process of the terminal (200) can be performed automatically through an automatic device. Therefore, a separate manual process for soldering the terminal (200) is not required, which can reduce the manufacturing process and manufacturing time.

[0095] FIG. 12 is a diagram illustrating the state in which the conductive paste (PA) of the first pad (P1) moves to the second pad (P2) during the reflow soldering process, and FIG. 13 is a side cross-sectional view illustrating the state in which the conductive paste (PA) of the first pad (P1) moves to the second pad (P2) during the reflow soldering process.

[0096] Referring to FIGS. 6, FIGS. 12, and FIGS. 13, next, reflow soldering is performed (S400).

[0097] A substrate (100) with a terminal (200) mounted thereon is placed into a reflow oven, and as the substrate (100) placed into the reflow oven is heated, the conductive paste (PA) applied to the first pad (P1) melts. The melted conductive paste (PA) moves to the second pad (P2) through the bridge (B). The conductive paste (PA) that has moved to the second pad (P2) flows into the first hole (H1) and fills the first hole (H1). The conductive paste (PA) filled in the first hole (H1) surrounds the leg portion (240) of the terminal (200). As cooling proceeds in the cooling area of ​​the oven, the conductive paste (PA) hardens and firmly fixes the terminal (200) to the substrate (100).

[0098] In particular, as the conductive paste (PA) filled in the first hole (H1) of the substrate (100) hardens, it firmly fixes the leg portion (240) of the terminal (200), so the terminal (200) can be firmly fixed to the substrate (100).

[0099] As such, since the first leg (241) and the second leg (242) of the terminal (200) are each mounted to the first pad (P1), the terminal (200) can be automatically mounted to the substrate (100) through a mounting device, and at the same time, since the leg portion (240) of the terminal (200) is fixed to the second pad (P2), mechanical rigidity for supporting the terminal (200) can also be secured.

[0100] FIG. 14 is a drawing illustrating a system including a power device (10) according to an embodiment.

[0101] Referring to FIG. 14, the power device (10) according to the embodiment may be a POE and may be connected to an indoor power source to provide power to multiple devices and simultaneously transmit / receive data. That is, the power device (10) may receive power from an indoor power source and transmit data along with power to multiple devices through a cable. At this time, the power device (10) may have a separate cable for transmitting / receiving data connected to a network and may transmit / receive data wirelessly. The devices (20) located indoors may be APs, lights, speakers, telephones, IoT devices, etc., and the devices (30) located outdoors may be IP cameras, lights, etc. Since the installation location of such a power device (10) is not restricted by the location of the power outlet for the devices (20, 30), the risk of noise or power supply failure can be reduced.

[0102] FIG. 15 is a perspective view illustrating a power device (10) according to an embodiment, and FIG. 16 is an exploded view of the power device (10) illustrated in FIG. 15.

[0103] Referring to FIGS. 15 and 16, a power device (10) according to an embodiment may include a housing (1100), a substrate (1200), a plug (1300), and a fastening member (1400). The housing (1100) includes a hole (1110). The hole (1110) connects the inside and outside of the housing (1100). The substrate (1200) may be located inside the housing (1100). The plug (1300) enters the inside of the housing (1100) through the hole (1110) and is connected to the substrate (1200). For example, two holes (1110) may be provided, and two plugs (1300) may be located in the holes (1110). The ends of the plugs (1300) placed in the holes (1110) are exposed outside the housing (1100). The plug (1300) and the housing (1100) can be integrally molded through insert injection. The fastening member (1400) can pass through the substrate (1200) and be fastened to the plug (1300) to fix the plug (1300) to the substrate (1200). Additionally, the fastening member (1400) can pass through the substrate (1200) and be fastened to the hole (1110) of the housing (1100) to fix the substrate (1200) to the housing (1100). The power device (10) according to this embodiment combines the substrate (1200) and the plug (1300) through the fastening member (1400).

[0104] FIG. 17 is a drawing showing a housing (1100) including a hole (1110), and FIG. 18 is a drawing showing the hole (1110) of the housing (1100).

[0105] Referring to FIGS. 17 and 18, the housing (1100) may include a plurality of holes (1110). The holes (1110) may be formed during the insert injection process with the plug (1300). The housing (1100) may also include a boss (1111) formed along the circumference of the holes (1110). The holes (1110) are where the plug (1300) and the fastening member (1400) are located.

[0106] The hole (1110) may be formed to have an overall rectangular shape. However, it is not limited to this, and the shape of the hole (1110) may change depending on the shape of the plug (1300). The hole (1110) may be divided into a first area (A1) and a second area (A2). The first area (A1) is the area where the fastening member (1400) is located. The second area (A2) is the area where the plug (1300) is located. The first area (A1) may be located between two second areas (A2) that are spaced apart from each other. The first area (A1) may be located in the center of the hole (1110). The first area (A1) is the area where the fastening member (1400) is rotatably fastened to form the first screw thread (SW1 in FIG. 24). The inner wall of the first region (A1) can be formed as a curved surface, and the second region (A2) can be formed as a flat surface.

[0107] FIG. 19 is a drawing showing a substrate (1200), and FIG. 20 is a side cross-sectional view of the substrate (1200) around a through hole (TH).

[0108] Referring to FIGS. 19 and 20, the substrate (1200) may include a through-hole (TH) through which a fastening member (1400) passes. Plating may be applied inside the through-hole (TH) to electrically connect one side of the substrate (1200) and the other side. Additionally, the substrate (1200) may include a first conductive portion (1210) and a second conductive portion (1220). The first conductive portion (1210) may be formed on one side of the substrate (1200), and the second conductive portion (1220) may be formed on the other side of the substrate (1200). The first conductive portion (1210) and the second conductive portion (1220) may each be formed around the through-hole (TH) and electrically connected through the through-hole (TH). The first conductive part (1210) contacts the fastening member (1400) and the second conductive part (1220) contacts the plug (1300).

[0109] Figure 21 is a drawing showing a plug (1300).

[0110] Referring to FIG. 21, the plug (1300) may have a long bar shape with a rectangular cross-section overall. The plug (1300) includes a first groove (1330) formed concavely at the end. The first groove (1330) is an area where a fastening member (1400) is fastened. The first groove (1330) may include two planar inner walls positioned facing each other. The fastening member (1400) is fastened to these two inner walls to form a second screw thread (SW2 in FIG. 24). The plug (1300) may include a first end (1310) and a second end (1320). The first end (1310) and the second end (1320) may be positioned with the first groove (1330) in between.

[0111] The edge formed by the end surface of the first end (1310) and the first groove (1330) is formed as a slanted first temper surface (CF1), and the edge formed by the end surface of the second end (1320) and the first groove (1330) is formed as a slanted second temper surface (CF2). As the entrance of the first groove (1330) is expanded by the first temper surface (CF1) and the second temper surface (CF2), when the fastening member (1400) enters the entrance of the first groove (1330), the fastening member (1400) is guided so that it does not get caught on the end surface of the first end (1310) and the end surface of the second end (1320). With the plug (1300) fixed to the housing (1100), the first groove (1330) is aligned with the first region (A1) of the hole (1110).

[0112] Meanwhile, the plug (1300) may include a plurality of second grooves (1340). The second grooves (1340) may be formed on the outer surface of the plug (1300). Some of the plurality of second grooves (1340) may be formed on the outer surface of the first end (1310) or the outer surface of the second end (1320). The second grooves (1340) are intended to increase the bonding strength between the housing (1100) and the plug (1300). When insert injection molding of the plug (1300) and the housing (1100), the mold material is injected into the second grooves (1340) to form a protrusion (1120 in FIG. 25) of the housing (1100) that engages with the second grooves (1340), thereby increasing the bonding strength between the housing (1100) and the plug (1300).

[0113] FIG. 22 is a drawing illustrating the process of a fastening member (1400) being fastened to a plug (1300) and a housing (1100) in a hole (1110), and FIG. 23 is a drawing illustrating a hole (1110) of a housing (1100) where the plug (1300) is located.

[0114] Referring to FIGS. 22 and 23, the fastening member (1400) can penetrate the substrate (1200) and be rotatably fastened to the hole (1110). The fastening member (1400) may be a tapped screw that forms threads during the rotatably fastening process. The fastening member (1400) is fastened by forming threads on the inner wall of the hole (1110) of the housing (1100) and the inner wall of the first groove (1330) of the plug (1300). Such a fastening member (1400) may include a head (1410) and a body (1420) extending from the head (1410). Threads may be formed on the outer surface of the body (1420). In order to form a second screw thread (SW2) as the fastening member (1400) is rotated and fastened, the horizontal distance (L) between the first end (1310) and the second end (1320) may be smaller than the outer diameter (D) of the body (1420) of the fastening member (1400).

[0115] FIG. 24 is a drawing illustrating the first screw thread (SW1) and the second screw thread (SW2).

[0116] Referring to FIGS. 22 to 24, a fastening member (1400) can be fastened between the first end (1310) and the second end (1320) of a plug (1300) located in the hole (1110). The fastening member (1400) is rotatably fastened by forming a first screw thread (SW1) in the hole (1110) of the housing (1100) and forming a second screw thread (SW2) on the first end (1310) and the second end (1320) of the plug (1300), respectively. Thus, the first screw thread (SW1) and the second screw thread (SW2) are formed continuously. As a result, the fastening member (1400) is fastened together with the plug (1300) and the housing (1100).

[0117] FIG. 25 is a side cross-sectional view based on AA of FIG. 15.

[0118] Referring to FIG. 25, the fastening member (1400) penetrates the substrate (1200) and is rotatably fastened to the plug (1300) while forming a second screw thread (SW2) on the plug (1300). As the fastening member (1400) is rotatably fastened to the plug (1300), the substrate (1200) is tightened and fixed to the plug (1300). The head (1410) of the fastening member (1400) contacts the substrate (1200), and the end of the plug (1300) contacts the substrate (1200). The boss portion (111) of the housing (1100) formed around the hole (1110) may include an inclined surface (111a)) in the upper portion in the area that contacts the plug (1300). The inclined surface (111a) may be an area intentionally created during the process of insert injection molding the housing (1100) with the plug (1300) so that the molded part does not go up the plug (1300) and the boss portion (111) is not formed higher than the top of the plug (1300).

[0119] FIG. 26 is a side cross-sectional view based on BB of FIG. 15.

[0120] Referring to FIG. 26, the fastening member (1400) penetrates the substrate (1200) and is fastened to the plug (1300), thereby forming a first screw thread (SW1) in the hole (1110) of the housing (1100) and being rotatably fastened to the hole (1110) of the housing (1100). As the fastening member (1400) is rotatably fastened to the hole (1110), the substrate (1200) is tightened and fixed to the housing (1100).

[0121] FIG. 27 is a drawing illustrating the conductive state of a substrate (1200), a plug (1300), and a fastening bolt.

[0122] Referring to FIG. 27, when the fastening member (1400) is fastened to the hole (1110) of the plug (1300) and the housing (1100), the head (1410) of the fastening member (1400) comes into contact with the first conductive part (1210) of the substrate (1200). Accordingly, a conductive line consisting of the plug (1300) - fastening member (1400) - first conductive part (1210) is formed. Then, when the fastening member (1400) is fastened to the hole (1110) of the plug (1300) and the housing (1100), the end surface of the plug (1300) comes into contact with the second conductive part (1220) of the substrate (1200). Accordingly, another conductive line consisting of the plug (1300) - second conductive part (1220) is formed. As such, since the power device (10) according to the embodiment forms two conductive lines, even if the end surface of the plug (1300) is separated from the second conductive part (1220), current can be transmitted through the conductive line connecting the plug (1300) - the fastening member (1400) - the first conductive part (1210).

[0123] In the foregoing, although all components constituting the embodiments of the present invention have been described as being combined or operating together, the present invention is not necessarily limited to such embodiments. That is, within the scope of the purpose of the present invention, all such components may be selectively combined and operated in one or more ways. Furthermore, terms such as "include," "constitute," or "have" described above, unless specifically stated otherwise, mean that the relevant component may be inherent; thus, they should be interpreted as allowing for the inclusion of additional components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains, unless otherwise defined. Terms commonly used, such as those defined in advance, should be interpreted in accordance with their meaning in the context of the relevant technology and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the present invention.

[0124] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

[0125] The present invention can be used in various devices, such as vehicles or home appliances.

Claims

1. Substrate; and It includes a terminal mounted on the above substrate and on which a component is mounted, The above substrate includes a first pad and a second pad that are spaced apart from each other and connected through a bridge, and The above terminal is a substrate assembly connected to a conductive paste formed together on the first pad and the second pad.

2. In Paragraph 1, The first pad above is a substrate assembly composed of a plurality of pads spaced apart from each other.

3. In Paragraph 1, The above second pad is a substrate assembly composed of a plurality of pads spaced apart from each other.

4. In Paragraph 1, The above terminal is, A base on which the parts are seated; It includes a first lead and a second lead that extend from each side of the base and each include a flat contact surface, and A substrate assembly in which the first lead and the second lead are each connected to different first pads. 5.a) A step of forming a first pad and a second pad on a substrate that are spaced apart from each other and connected through a bridge; b) a step of forming a hole corresponding to the first pad, laminating a mask that covers the second pad, and applying a conductive paste; c) a step of mounting the terminal to the conductive paste of the first pad; and d) A method for manufacturing a substrate assembly comprising the step of reflow soldering so that the conductive paste applied to the first pad flows to the second pad.

6. Housing with a hole formed therein; A substrate fixed to the above housing; A plug having a first groove formed therein located in the above hole; and It includes a fastening member located in the first groove, and The above housing includes a first screw thread formed on the inner surface of the hole, and The plug includes a second screw thread formed on the inner surface of the first groove and formed continuously with the first screw thread, and The above fastening member penetrates the substrate and is a power device that is fastened together to the first screw thread and the second screw thread.

7. In Paragraph 6, The above hole includes a first region where the fastening member is located and a plurality of second regions where the plug is located, and The first groove of the above plug is a power device aligned with the first area.

8. In Paragraph 7, The above plug includes a first end and a second end formed with the first groove in between, and The first end and the second end are power devices located in the plurality of second regions, respectively.

9. In Paragraph 8, The first screw thread is formed in the first region, and The above second screw thread is a power device formed at the above first end and the above second end.

10. In Paragraph 8, A power device in which the horizontal separation distance between the first end and the second end is smaller than the outer diameter of the body of the fastening member.

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