Electronic device comprising vapor chamber

Abstract

An electronic device, according to one embodiment, may comprise: a display; a support member disposed on a rear surface of the display; a processor disposed in one region of the support member; and a vapor chamber absorbing heat generated by the processor. According to one embodiment, the vapor chamber may be integrally formed with a cover covering the processor.

Description

Electronic device including a vapor chamber

[0001] The present disclosure relates to an electronic device provided with a vapor chamber.

[0002] In smartphones, a vapor chamber is a cooling technology designed to efficiently manage heat generation. Vapor chambers are primarily used in high-performance or gaming smartphones and serve to effectively dissipate heat generated internally.

[0003] Smartphones are equipped with a Thermal Interface Material (TIM) along with a vapor chamber, which is a type of heat transfer material. TIM is a material used to increase the heat transfer efficiency between heat-generating components (e.g., CPU, GPU) and a heat sink or cooling solution.

[0004] Since the vapor chamber, TIM, and rear mid-frame that secures the printed circuit board each have their own thickness, the thickness occupied by each can become a factor that hinders the slimming of the smartphone.

[0005] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0006] An electronic device according to one embodiment may include a display, a support member disposed on the rear of the display, a processor disposed in a region of the support member, and a vapor chamber that absorbs heat generated from the processor. According to one embodiment, the vapor chamber may be formed integrally with a cover that covers the processor.

[0007] An electronic device according to one embodiment may include a support member, a display coupled to one side of the support member, a substrate coupled to the other side of the support member, a battery disposed on one side of the substrate, and a vapor chamber that absorbs heat generated from the battery. According to one embodiment, the vapor chamber may be formed integrally with a cover that covers the battery.

[0008] According to the present disclosure, an apparatus as described in the appended independent claims may be provided. Other features of the present disclosure will become apparent from the dependent claims and the following detailed description.

[0009] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment.

[0010] FIG. 2a is a perspective view of the front of an electronic device according to one embodiment.

[0011] FIG. 2b is a rear perspective view of an electronic device according to one embodiment.

[0012] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

[0013] Figure 4 is a diagram illustrating the location and heat transfer path of a vapor chamber of the prior art.

[0014] FIG. 5 is an exploded perspective view of an electronic device including a vapor chamber according to one embodiment.

[0015] FIG. 6 is a rear view of an electronic device according to one embodiment.

[0016] FIG. 7 is a cross-sectional view of an electronic device according to one embodiment, viewed from the rear.

[0017] FIG. 8 illustrates a configuration diagram of a vapor chamber according to one embodiment.

[0018] FIG. 9 illustrates a configuration diagram of a cover of a vapor chamber according to one embodiment.

[0019] FIG. 10 illustrates a heat transfer path of an electronic device according to one embodiment.

[0020] FIG. 11 illustrates the heat dissipation path of a vapor chamber according to one embodiment.

[0021] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0022] Unless otherwise defined, all terms used herein (including technical and scientific terms) may be used in a meaning commonly understood by those skilled in the art to which the present invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise. The terms used herein are for describing embodiments and are not intended to limit the present invention. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text.

[0023] As used in the specification, "comprises" and / or "comprising" do not exclude the presence or addition of one or more other components, steps, actions, and / or elements to the mentioned components, steps, actions, and / or elements.

[0024] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0025] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0026] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0027] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, software (e.g., program (140)) and input data or output data for related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0028] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0029] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0030] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0031] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0032] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0033] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0035] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0037] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0038] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0039] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0041] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0042] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0043] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0044] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0045] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0046] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 2b is a rear perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0047] The electronic device (200) described below may include at least one of the components of the electronic device (101) described above in FIG. 1. As shown in FIG. 2A and FIG. 2B, the electronic device (200) may include a smartphone.

[0048] Referring to FIGS. 2a and 2b, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In one embodiment (not shown), the housing may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIG. 2a. According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate having various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (218) (or "side member") comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0049] In the illustrated embodiment, the front plate (202) may include a first region (210D) that curves seamlessly from the first surface (210A) toward the rear plate at both ends of the long edge of the front plate. In the illustrated embodiment (see FIG. 2b), the rear plate (211) may include a second region (210E) that curves seamlessly from the second surface (210B) toward the front plate at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0050] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or an indicator) or additionally include other components.

[0051] The display (201) may be visually exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0052] The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The sound output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), speakers (207, 214), and connector (208) may be placed in at least part of the internal space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone (203) and the speakers (207, 214). In some embodiments, the acoustic output device (207, 214) may include a speaker (e.g., a piezo speaker) that is operated with the hole formed in the housing (210) excluded.

[0053] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., home key button), a portion of the second surface (210B), and / or below the display (201). The electronic device (200) may further include at least one of the unillustrated sensor modules, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0054] The camera module (205, 212) may include a first camera module (205) disposed on a first surface (210A) of the electronic device (200), a second camera module (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0055] A key input device (217) may be placed on the side (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input device (217) that is not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0056] An indicator may be disposed, for example, on a first surface (210A) of a housing (210). The indicator may provide status information of an electronic device (200), for example, in the form of light (e.g., a light-emitting element). In one embodiment, the light-emitting element may provide a light source that corresponds to the operation of a camera module (205), for example. The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0057] The connector hole (208) may include a first connector hole (208) capable of receiving a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (not shown) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0058] Some camera modules (205) among the camera modules (205, 212), some sensor modules (204) among the sensor modules (204, 219), or an indicator may be positioned to be visually exposed through the display (201). For example, the camera module (205), sensor module (204), or indicator may be positioned to come into contact with the external environment through an opening or a transparent area perforated to the front plate (202) of the display (201) within the internal space of the electronic device (200). According to one embodiment, the area facing the display (201) and the camera module (205) may be formed as a transparent area having a certain transmittance as part of the area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. These transparent areas may include an area that overlaps with the effective area (e.g., field of view area) of the camera module (205) through which light passes to form an image with an image sensor to generate an image. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be positioned to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device. For example, in this case, the area of ​​the display (201) facing the sensor modules may not require a perforated opening.

[0059] According to one embodiment, the electronic device (200) has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device (200) may be part of a foldable electronic device, a slideable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms "foldable electronic device," "slidable electronic device," "stretchable electronic device," and / or "rollable electronic device" may mean an electronic device that is capable of bending deformation of a display (e.g., display (330) in FIG. 3), so that at least a portion may be folded, wound or rolled, at least a portion of the area may be expanded, and / or can be housed inside a housing (e.g., housing (210) in FIG. 2a and 2b). Foldable electronic devices, slideable electronic devices, stretchable electronic devices and / or rollable electronic devices can be used by expanding the screen display area by unfolding the display or by exposing a larger area of ​​the display to the outside, depending on the user's needs.

[0060] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0061] The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (200) of FIG. 2a and FIG. 2b, or may include other embodiments of the electronic device.

[0062] Referring to FIG. 3, an electronic device (300) (e.g., the electronic device (200) of FIG. 2a or FIG. 2b) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or support structure), a front plate (320) (e.g., a front cover), a display (330) (e.g., the display (201) of FIG. 2a), a substrate (340) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., a rear cover). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or additionally include other components. At least one of the components of the electronic device (300) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2a or FIG. 2b, and redundant descriptions are omitted below.

[0063] The first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310), or may be formed integrally with the side member (310). The first support member (311) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. The first support member (311) may have a display (330) attached to one side and a substrate (340) attached to the other side. The substrate (340) may be equipped with a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0064] Memory may include, for example, volatile memory or non-volatile memory.

[0065] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (300) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0066] The battery (350) is a device for supplying power to at least one component of the electronic device (300) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, the substrate (340). The battery (350) may be integrally disposed inside the electronic device (300). In one embodiment, the battery (350) may be disposed detachably from the electronic device (300).

[0067] An antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a part or combination thereof of the side bezel structure (310) and / or the first support member (311).

[0068] Figure 4 is a diagram illustrating the location and heat transfer path of a vapor chamber of the prior art.

[0069] In FIG. 4, the first direction (+z direction) is the direction facing the rear of the electronic device (400), and the second direction (-z direction) is the direction facing the front (display direction) of the electronic device (400).

[0070] Referring to FIG. 4, the electronic device (400) may include a processor (410), a support member (420, 311 in FIG. 3), a tape (430), and a vapor chamber (440).

[0071] The processor (410) may be an application processor serving as the primary heat source among the components of the electronic device (400). The processor (410) may be positioned on the first direction side relative to the support member (420). Although not illustrated, a thermal interface material (TIM) may be placed between the processor (410) and the support member (420) so that heat generated from the processor (410) can be easily transferred to the vapor chamber (440). Additionally, the processor (410) may be mounted on a main printed board assembly (not illustrated) and protected by a cover (not illustrated) together with the main printed board assembly. The cover has a shape wider than the processor (410), and multiple holes may be formed in the periphery of the cover to which fastening members (e.g., screws) can be fastened. At this time, the cover may be fastened to the support member (420) through the fastening members while covering the processor (410).

[0072] The vapor chamber (440) is provided in a second direction relative to the support member (420) and may occupy a portion of the support member (420). The vapor chamber (440) extends in the +x direction and can absorb some of the vapor generated from a display (not shown) and a battery (not shown) located in the second direction. The vapor chamber (440) may be secured by a tape (430) placed between the support member (420) and the vapor chamber (440). In this case, the tape (430) may be a double-sided tape and may provide adhesive force to the vapor chamber (440) and the support member (420).

[0073] Meanwhile, conventionally, the vapor chamber (440) was placed in the second direction rather than the first direction based on the support member (420). Since there are various parts on the first direction side, making installation difficult, it was placed on the second direction side, which is a relatively flat space. At this time, a tape (430) is used to place the vapor chamber (440) on the second direction side of the support member (420). However, in terms of recycling, there is a problem that damage occurs when removing the vapor chamber (440) fixed to the tape (430).

[0074] Additionally, as shown in FIG. 4, heat generated in the processor (410) is transferred in the order of support member (420) -> tape (430) -> vapor chamber (440), resulting in relatively low heat transfer efficiency, and residual heat that is not substantially transferred is transferred to other parts, which can lead to problems with overall durability.

[0075] As described above, considering that the main heat source inside the electronic device (400) is the processor (410), changing the structure, shape, and arrangement of the vapor chamber (440) can reduce the thickness of the electronic device (400) and simultaneously increase the heat transfer efficiency. Various embodiments for this purpose will be described with reference to FIGS. 5 to 11.

[0076] FIG. 5 is an exploded perspective view of an electronic device including a vapor chamber according to one embodiment.

[0077] An electronic device (500) according to one embodiment includes a display (330 in FIG. 3), a support member (510), a processor (530), and a vapor chamber (560).

[0078] In one embodiment, the electronic device (500) may include a display (330) and a support member (510) disposed on the rear of the display (330). In one embodiment, the support member (510) provides structural rigidity to the electronic device (500) and serves to support various electronic components.

[0079] In one embodiment, a processor (530) is disposed in a region of the support member (510). According to one embodiment, the processor (530) may be an application processor. The processor (530) is a core component that performs computation and control of the electronic device (500), and heat may be generated during operation. Therefore, a heat dissipation structure is required to efficiently manage the heat generated by the processor (530).

[0080] In one embodiment, the electronic device (500) may include a vapor chamber (560). The vapor chamber (560) is a heat dissipation device for maximizing heat transfer efficiency, contains a working fluid inside, and can effectively disperse and transfer heat through a phase change process.

[0081] The vapor chamber (560) may be composed of a cooling section (561) and a cover (563). The cover (563) has a hole (5633) through which a fastening member (5631), such as a screw, can pass, and the vapor chamber (560) may be fixed to a support member (510) by fastening the fastening member (5631). At least one hole (5633) may be formed in the cover (563), and the fastening member (5631) may be provided to correspond to the number of at least one hole (5633).

[0082] According to one embodiment, the vapor chamber (560) may be formed integrally with a cover (563) covering the processor (530). According to one embodiment, the cover (563) protects the upper part of the processor (530) and, by being formed integrally with the vapor chamber (560), improves heat dissipation performance. This integrated structure can dissipate heat generated from the processor (530) more quickly and efficiently, thereby improving the thermal management performance of the electronic device (500). Furthermore, the electronic device (500) according to one embodiment increases space efficiency (slimming down) and improves thermal management performance through the integrated structure of the vapor chamber (560) and the cover (563). This contributes to improving the overall performance and reliability of the electronic device (500). Additionally, the vapor chamber (560) efficiently dissipates heat from the processor (530), thereby increasing the durability of the electronic device (500).

[0083] In this way, the electronic device (500) according to the present embodiment is designed to effectively absorb and release heat generated from the processor (530), thereby improving the performance and stability of the electronic device.

[0084] According to one embodiment, the cooling unit (561) serves to absorb and disperse heat generated from the processor (530), and the cover (563) protects the cooling unit (561) and provides structural stability to the vapor chamber (560).

[0085] According to one embodiment, a hole (5633) may be formed in the cover (563) through which a fastening member (5631), such as a screw, can pass. The hole (5633) facilitates the insertion and fastening of the fastening member (5631) to secure the cover (563) to the support member (510). The fastening member (5631) can connect the cover (563) and the support member (510) to allow the vapor chamber (560) to be stably secured to the support member (510).

[0086] According to one embodiment, the vapor chamber (560) can be fixed to the support member (510) by fastening the binding member (5631). This ensures that the vapor chamber (560) does not shake or move inside the electronic device (500) while maintaining contact with the processor (530). The method of fixing through the binding member (5631) simplifies the installation and maintenance of the vapor chamber (560) and efficiently improves the assembly process of the electronic device (500). Unlike illustrated in FIG. 4, in this embodiment, the vapor chamber (560) is not fixed by double-sided tape, so the vapor chamber (560) can be easily separated later.

[0087] Additionally, the combination of the hole (5633) formed in the cover (563) and the connecting member (5631) allows for precise adjustment of the position of the vapor chamber (560). By tightly adjusting the connecting member (5631), the vapor chamber (560) and the processor (530) can be made to be in closer contact. This maximizes the heat transfer efficiency between the processor (530) and the vapor chamber (560) and further improves the thermal management performance of the electronic device (500).

[0088] According to one embodiment, a thermal interface material (550) is positioned between the vapor chamber (560) and the processor (530), which helps to effectively transfer heat generated from the processor (530) to the vapor chamber (560). The thermal interface material (550) fills the fine gap between the surface of the processor (530) and the vapor chamber (560) to minimize heat transfer resistance, thereby rapidly dissipating heat from the processor (530) and increasing cooling efficiency.

[0089] Additionally, a printed circuit board (520) is positioned between the processor (530) and the support member (510), which serves to support the processor (530) and simultaneously provide an electrical connection. The printed circuit board (520) enables signal transmission between the processor (530) and other electronic components within the system, and structurally, it can also perform the function of stably fixing the processor (530).

[0090] FIG. 6 is a rear view of an electronic device according to one embodiment.

[0091] Referring to FIG. 6, it can be seen that the vapor chamber (560) is stably seated on the support member (510). The vapor chamber (560) can be seated on the support member (510) in the display direction (-x direction), and the lower surface of the vapor chamber (560) can be fixed in a state covered with a heat-conducting material (not shown) and a processor (not shown).

[0092] The vapor chamber (560) can be mounted to the support member (510) using fastening means such as screws or clamps, and this method may vary depending on the design.

[0093] The support member (510) serves to physically support the entire structure and can perform the function of fixing the processor (530) and related components, including the printed circuit board (520).

[0094] FIG. 7 is a cross-sectional view of an electronic device according to one embodiment, viewed from the rear.

[0095] An electronic device (700) according to one embodiment has a stacked structure in the order of a vapor chamber (560), a thermal conductive material (550), a processor (530), a printed circuit board (520), and a support member (510). However, to manufacture the illustrated stacked structure, the stacking may be reversed from the order described above, and the stacking order may be changed depending on the process. Such a stacked structure contributes to maximizing the cooling performance of the electronic device by effectively dissipating heat generated from the processor (530).

[0096] A support member (510) according to one embodiment forms an internal frame of an electronic device (700) and serves to support other components, including a display (330 in FIG. 3). This provides overall mechanical strength to the electronic device (700) and can be designed so that internal components can be stably fixed.

[0097] In one embodiment, a printed circuit board (520) is disposed on the upper portion of a support member (510), and various electronic components, including a processor (530), may be mounted on the printed circuit board (520). The printed circuit board (520) provides a key signal transmission path for the electronic device (700) and supports electrical connections between the processor (530) and other electronic components.

[0098] In one embodiment, a processor (530) may be mounted on the upper part of a printed circuit board (520). Since the processor (530) generates high heat during operation, effective heat management is essential.

[0099] In one embodiment, a thermal conductive material (550) is disposed on the upper portion of the processor (530), and the thermal conductive material (550) reduces the heat transfer resistance between the processor (530) and the vapor chamber (560) and helps to rapidly transfer heat generated from the processor (530) to the vapor chamber (560). The thermal conductive material (550) may generally include a high thermal conductive material such as Al2O₃ (aluminum oxide), AlN (aluminum nitride), or SiC (silicon carbide), thereby further improving the cooling performance of the processor (530).

[0100] In one embodiment, a vapor chamber (560) is located at the top layer and serves to effectively disperse heat transferred from the processor (530). The vapor chamber (560) is formed as a sealed structure containing a working fluid inside, and the heat transferred from the processor (530) rapidly diffuses as it vaporizes the working fluid. Subsequently, the vapor moves through the chamber to disperse heat, and after cooling, it liquefies again and has a structure that circulates repeatedly. This heat transfer method maximizes the cooling performance of the electronic device and enables stable operation of the processor (530) for a long time.

[0101] Through such a stacked structure, the electronic device (700) according to the present disclosure can effectively manage heat generated from the processor (530), and as a result, optimize the performance of the electronic device and ensure stable operation even during long-term use.

[0102] According to one embodiment, a printed circuit board (520) may be disposed between the support member (510) and the vapor chamber (560), and a processor (530) may be mounted on the printed circuit board (520). The printed circuit board (520) provides an electrical connection between the processor (530) and other electronic components, thereby enabling signal transmission and power supply. Additionally, the printed circuit board (520) serves to structurally support the processor (530), thereby improving the durability and stability of the device.

[0103] According to one embodiment, a thermal interface material (550) may be placed between the processor (530) and the vapor chamber (560). The thermal interface material (550) fills the fine gap between the processor (530) and the vapor chamber (560) to reduce heat transfer resistance and allows heat generated from the processor (530) to be transferred more efficiently to the vapor chamber (560). This improves the cooling performance of the electronic device (500) and ensures the thermal stability of the processor (530).

[0104] According to one embodiment, a cover (563) covering a processor (530) is formed integrally with a vapor chamber (560), and a hole (5633) into which at least one binding member (5631) can be inserted may be formed on the outer edge of the cover (563). When the binding member (5631) is inserted through the hole (5633), the vapor chamber (560) is mounted more stably, and contact with the processor (530) is strengthened, thereby maximizing heat transfer efficiency.

[0105] According to one embodiment, at least one screw may be used as the fastening member (5631). The screw serves to firmly secure the vapor chamber (560) and the support member (510) or other components, and can increase the structural stability of the electronic device (500) during the assembly process.

[0106] According to one embodiment, the vapor chamber (560) can be designed so that the heat-conducting material and the processor are in closer contact by the rotational force of the screw. As the screw is tightened, the vapor chamber (560) is compressed toward the processor (530), causing the heat-conducting material to spread more uniformly, thereby optimizing heat transfer from the processor (530) to the vapor chamber (560).

[0107] According to one embodiment, the binding member (5631) can be coupled to the support member (510) by penetrating a hole (5633) formed in the cover (563). Through this, the vapor chamber (560) can be firmly fixed to the support member (510), and the durability of the electronic device (500) is improved. In addition, such structural coupling can increase the reliability of the device by increasing resistance to external shocks or vibrations.

[0108] According to one embodiment, a plurality of micro protrusions may be formed inside the vapor chamber (560) to improve heat transfer performance. The micro protrusions optimize the flow of vapor generated within the chamber and increase the internal surface area, thereby enabling faster heat diffusion. Through this structure, the cooling performance of the vapor chamber can be further improved.

[0109] According to one embodiment, the thermal conductive material (550) may include at least one of Al2O₃ (aluminum oxide), AlN (aluminum nitride), or SiC (silicon carbide). These materials have high thermal conductivity and serve to rapidly transfer heat generated from the processor (530) to the vapor chamber (560). Additionally, these materials have high durability, resulting in minimal performance degradation even during long-term use, and can contribute to improving the thermal management performance of the electronic device (500).

[0110] According to one embodiment, heat generated in the processor (530) is transferred to the vapor chamber (560) through a heat-conducting material and is then efficiently dispersed within the vapor chamber. In this process, the vapor chamber (560) performs the role of rapidly diffusing heat by circulating vapor inside, thereby maintaining a constant temperature of the processor (530). Consequently, by applying the structure of the present disclosure, the heat generation problem of the electronic device (500) can be effectively resolved, and stable operation without performance degradation is possible even during long-term use.

[0111] FIG. 8 illustrates a configuration diagram of a vapor chamber (560) according to one embodiment.

[0112] A vapor chamber (560) according to one embodiment is a heat dissipation device designed to improve the thermal management performance of an electronic device and has a sealed structure containing a working fluid inside. The vapor chamber (560) efficiently absorbs and diffuses heat generated from the processor (530) to stably maintain the temperature of the processor (530).

[0113] The vapor chamber (560) is composed of an upper surface (560-1) and a lower surface (560-2), and these two surfaces can be designed with consideration for heat transfer and structural strength.

[0114] The top surface (560-1) of the vapor chamber (560) is a surface where vapor generated inside the vapor chamber (560) condenses, helping to release heat to the outside. The top surface (560-1) may be structurally designed to be combined with additional heat dissipation fins or heat sinks. Additionally, it may be made of a material with high thermal conductivity to effectively release heat by increasing the contact area with the outside air.

[0115] The bottom surface (560-2) of the vapor chamber (560) is a surface that comes into direct contact with the processor (530) or the heat-conducting material (550) and serves to rapidly absorb heat transferred from the processor (530). At this time, the heat-conducting material (550) may be placed between the processor (530) and the vapor chamber (560) to maximize heat transfer efficiency. The bottom surface (560-2) may be formed of a metal material with high thermal conductivity (e.g., copper or aluminum alloy) and may have a smooth surface to optimize the contact surface with the processor (530).

[0116] According to one embodiment, the interior of the vapor chamber (560) may include various structures to improve heat transfer performance, one of which may be micro protrusions (5611). According to one embodiment, a plurality of micro protrusions (5611) may be formed on the inner surface of the vapor chamber (560). According to one embodiment, the micro protrusions (5611) serve to optimize the flow of vapor and increase the heat transfer area during the process of vaporization and condensation of the working fluid inside the chamber. According to one embodiment, the shape of the micro protrusions (5611) may be processed into various forms such as conical, hemispherical, or nanostructure patterns, and such shapes may help to uniformly disperse the internal vapor flow and optimize heat exchange performance.

[0117] According to one embodiment, a wick structure may be included inside the vapor chamber (560), which serves to induce capillary flow of the working fluid. The wick structure is generally formed of a porous metal material (e.g., copper mesh or a sintered metal powder structure) and induces the condensed liquid to move toward the lower surface (560-2) that contacts the processor (530) again, thereby continuously maintaining cooling performance.

[0118] According to one embodiment, a working fluid that transfers heat may be enclosed inside the vapor chamber (560). The working fluid may be a substance such as water (H2O), methanol, or acetone that can vaporize at a low temperature, and it serves to effectively transfer heat by repeatedly vaporizing and condensing according to the internal pressure of the vapor chamber.

[0119] The structure of the vapor chamber (560) rapidly dissipates heat generated from the processor (530) and maximizes the cooling performance of the electronic device, enabling stable operation for a long time.

[0120] FIG. 9 illustrates a configuration diagram of a cover of a vapor chamber according to one embodiment.

[0121] As described above, the upper surface (560-1) of the vapor chamber (560) may be structured to be covered by a cover (563). The cover (563) protects the exterior of the vapor chamber (560) and seals off the vapor generated inside to support efficient heat management. Additionally, a plurality of holes (5633-1, 5633-2, 5633-3, 5633-4, 5633-N) may serve to connect and secure the vapor chamber (560) with external components.

[0122] The cover (563) is a structure that covers the top of the vapor chamber (560) and functions to seal and protect the vapor and working fluid inside the vapor chamber. This prevents the working fluid from leaking out and maintains efficient vaporization and condensation within the vapor chamber.

[0123] The cover (563) can be formed of a thermally conductive material and designed to release heat generated inside the vapor chamber to the outside. This contributes to increasing the heat transfer performance inside the vapor chamber. Heat dissipation fins or structures for heat dissipation may be added to the outer surface of the cover (563).

[0124] Multiple holes (5633-1, 5633-2, 5633-3, 5633-4, 5633-N) are formed on the outer edge of the cover (563), and these holes can serve as insertion holes for connecting members for joining the vapor chamber (560) with the support member (510) or other parts. Each hole is spaced at appropriate intervals to help the vapor chamber (560) be stably fixed.

[0125] When a connecting member (e.g., a screw) is inserted into the hole, the vapor chamber (560) and other parts are mechanically joined, and the vapor chamber (560) is stably mounted. As a result, heat transfer between the vapor chamber (560) and the processor (530) is optimized, and heat management becomes more efficient. As the vapor chamber (560) is fixed through the plurality of holes, the adhesion between the heat-conducting material (550) and the processor (530) is strengthened, thereby maximizing heat transfer performance.

[0126] Multiple holes (5633-1, 5633-2, 5633-3, 5633-4, 5633-N) support a stable connection between the vapor chamber (560) and other parts, allowing the device to operate stably with the vapor chamber fixed in place even against external shocks or vibrations.

[0127] Multiple holes (5633-1, 5633-2, 5633-3, 5633-4, 5633-N) contribute to optimizing heat dissipation and, together with the structure of the cover (563), serve to efficiently lower the temperature inside the device. This helps to release heat to the outside and keeps the electronic device from overheating.

[0128] FIG. 10 illustrates a heat transfer path of an electronic device according to one embodiment, and FIG. 11 illustrates a heat dissipation path of a vapor chamber according to one embodiment.

[0129] Referring to FIG. 10, heat is generated in the processor (530) and transferred to the vapor chamber (560) through the heat-conducting material (550, FIG. 5), and the heat can be absorbed and released to the outside by the vapor flow inside the vapor chamber (560).

[0130] Referring to FIG. 11, heat generated in the processor (530) is transferred to the vapor chamber (560) through a heat-conducting material (550), and heat absorbed inside the vapor chamber (560) can be released to the outside through a cover (563, FIG. 5). The vapor chamber (560) is secured through a plurality of holes (5633-1, 5633-2, 5633-3, 5633-4, 5633-N), heat is efficiently transferred, and the temperature of the device can be maintained stably.

[0131] Meanwhile, the stacked structure for the processor (530) described above may also be applied to a battery (350 in FIG. 3). In this case, the electronic device may be stacked in the order of a display (330 in FIG. 3), a battery (350 in FIG. 3), a substrate (340 in FIG. 3), a thermal conductive material, and a vapor chamber (560). The battery (350) may be placed substantially on the same plane as the substrate (340), and depending on the embodiment, the thermal conductive material may be omitted.

[0132] As described above, the support member (510) is formed of a material selected to stably support key components such as the display (330), substrate (340), and battery (350) within the device, and can generally be made of metal or high-strength plastic. The display (330) can be attached to one side of the support member (510).

[0133] The substrate (340) can be attached to the other side of the support member (510). The substrate (340) is a key component that accommodates and connects the electronic components of the electronic device. The substrate is typically made of a printed circuit board (PCB) and can form an electronic circuit by mounting various electronic components. The substrate (340) can provide electrical connections so that the battery (350) and other internal components operate efficiently with each other.

[0134] The battery (350) is a device that is placed on one side of the substrate (340) and supplies power to the electronic device. The battery is generally composed of a rechargeable cell, such as a lithium-ion battery or a lithium-polymer battery, and provides energy for the entire operation of the electronic device. The battery (350) supplies a constant voltage and current to the device, and since heat generation is unavoidable, it is important to effectively manage the heat generated as a result. Therefore, the stacked structure applied to the processor (530) can be applied as is.

[0135] The vapor chamber (560) serves to absorb and disperse heat generated from the battery (350). After absorbing the heat generated from the battery (350), the vapor chamber (560) rapidly disperses the heat to other parts within the electronic device. This prevents the battery from overheating or being damaged by heat.

[0136] The cover of the vapor chamber (560) can be formed integrally to cover the battery (350). The cover maximizes the heat transfer performance inside the vapor chamber (560) and helps to efficiently release heat generated from the battery (350) to the outside through the vapor chamber (560). In addition, the cover also performs a mechanical protective role and has the function of protecting the vapor chamber and its internal components from the external environment. The cover serves to seal the outer perimeter of the vapor chamber, thereby optimizing the heat conduction path formed inside.

[0137] An electronic device (500 of FIG. 5) according to one embodiment may include a display (330 of FIG. 3), a support member (510 of FIG. 5) disposed on the rear of the display (330), a processor (530) disposed in a region of the support member (510 of FIG. 5), and a vapor chamber (560) that absorbs heat generated from the processor (530). According to one embodiment, the vapor chamber (560) may be formed integrally with a cover (563) that covers the processor (530).

[0138] An electronic device (500) according to one embodiment may further include a printed circuit board (520) disposed between a support member (510) and a vapor chamber (560). A processor (530) according to one embodiment may be mounted on the printed circuit board (520).

[0139] An electronic device (500) according to one embodiment may further include a thermal interface material (550) disposed between a processor (530) and a vapor chamber (560) to transfer heat generated from the processor (530) to the vapor chamber (560).

[0140] In one embodiment, the cover (563) may have at least one hole formed in the outer edge surrounding the vapor chamber (560) into which at least one binding member can be inserted.

[0141] At least one binding member (5631) according to one embodiment may include at least one screw.

[0142] In one embodiment, the vapor chamber (560) can be made so that the heat-conducting material (550) and the processor (530) are in close contact by the rotational force of at least one screw (5634).

[0143] According to one embodiment, at least one binding member can penetrate at least one hole (5633) and be coupled with a support member (510) so that the vapor chamber (560) is fixed to the support member (510).

[0144] A vapor chamber (560) according to one embodiment may have a plurality of micro protrusions (5611) formed inside to improve heat transfer.

[0145] A heat-conducting material (550) according to one embodiment may include at least one of Al2O₃ (aluminum oxide), AlN (aluminum nitride), or SiC (silicon carbide).

[0146] According to one embodiment, heat generated in the processor (530) is transferred to the vapor chamber (560) via a heat-conducting material (550) and can be dispersed in the vapor chamber (560).

[0147] An electronic device according to one embodiment may include a support member (510), a display (330) coupled to one side of the support member (510), a substrate (340) coupled to the other side of the support member (510), a battery (350) disposed on one side of the substrate (340), and a vapor chamber (560) that absorbs heat generated from the battery (350). An electronic device according to one embodiment in which the vapor chamber (560) is formed integrally with a cover (563) covering the battery (350).

[0148] According to one embodiment, at least a portion of the battery (350) may be disposed substantially on the same plane as the substrate (340).

[0149] An electronic device according to one embodiment may further include a thermal interface material (550) disposed between a battery (350) and a vapor chamber (560) to transfer heat generated from the battery (350) to the vapor chamber (560).

[0150] In one embodiment, the cover (563) may have at least one hole formed in the outer edge surrounding the vapor chamber (560) into which at least one binding member (5631) can be inserted.

[0151] According to one embodiment, at least one binding member (5631) may include at least one screw (5635).

[0152] In one embodiment, the vapor chamber (560) can bring the heat-conducting material (550) and the battery (350) into close contact by the rotational force of at least one screw (5635).

[0153] According to one embodiment, at least one binding member (5631) can penetrate at least one hole (5633) and be coupled to the substrate (340) so that the vapor chamber (560) is fixed to the substrate (340).

[0154] A vapor chamber (560) according to one embodiment may have a plurality of micro protrusions (5611) formed inside to improve heat transfer.

[0155] A heat-conducting material (550) according to one embodiment may include at least one of Al2O₃ (aluminum oxide), AlN (aluminum nitride), or SiC (silicon carbide).

[0156] According to one embodiment, heat generated in the battery (350) is transferred to the vapor chamber (560) through the heat-conducting material (550) and can be dispersed in the vapor chamber (560).

[0157] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0158] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0159] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0160] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0161] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0162] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0163] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0164] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

Claims

1. In an electronic device, display; A support member disposed on the rear of the above display; A processor disposed in one area of ​​the above-mentioned support member; and It includes a vapor chamber that absorbs heat generated from the above processor, and The above vapor chamber is an electronic device formed integrally with a cover covering the processor.

2. In Paragraph 1, A printed circuit board disposed between the support member and the vapor chamber; further comprising The above processor is an electronic device mounted on the above printed circuit board.

3. In Paragraph 1 or 2, An electronic device further comprising a thermal interface material disposed between the processor and the vapor chamber to transfer heat generated from the processor to the vapor chamber.

4. In any one of paragraphs 1 to 3, The above cover is, An electronic device having at least one hole formed in the outer periphery surrounding the above vapor chamber, into which at least one binding member can be inserted.

5. In Paragraph 4, The above at least one binding member is, An electronic device that penetrates at least one hole and is coupled with the support member so that the vapor chamber is fixed to the support member.

6. In Paragraph 4 or 5, The above at least one binding member is, An electronic device comprising at least one screw.

7. In any one of paragraphs 3 through 5, The above vapor chamber is, An electronic device that causes the heat-conducting material and the processor to be in close contact by the rotational force of at least one screw.

8. In any one of paragraphs 1 through 7, The above vapor chamber is, An electronic device having multiple micro protrusions formed internally to improve heat transfer.

9. In any one of paragraphs 3 through 8, The above-mentioned heat-conducting material is, An electronic device comprising at least one of Al2O3 (aluminum oxide), AlN (aluminum nitride), or SiC (silicon carbide).

10. In any one of paragraphs 3 through 8, The heat generated by the above processor is, An electronic device that is transferred to the vapor chamber via the above-mentioned heat-conducting material and dispersed in the above-mentioned vapor chamber.

11. In an electronic device, Support member; A display coupled to one side of the above-mentioned support member; A substrate coupled to the other side of the above-mentioned support member; A battery disposed on one surface of the above substrate; It includes a vapor chamber that absorbs heat generated from the above battery, and The above vapor chamber is an electronic device formed integrally with a cover covering the battery.

12. In Paragraph 11, At least a portion of the above battery is placed substantially on the same plane as the above substrate in an electronic device.

13. In Paragraph 11 or 12, An electronic device further comprising a thermal interface material disposed between the battery and the vapor chamber to transfer heat generated from the battery to the vapor chamber.

14. In Paragraph 13, The above cover is, An electronic device having at least one hole formed in the outer periphery surrounding the above vapor chamber, into which at least one binding member can be inserted.

15. In Paragraph 14, The above at least one binding member is, An electronic device that penetrates at least one hole and is coupled with the support member so that the vapor chamber is fixed to the support member.

Images