Epoxy composition, curable composition comprising same, and processed product

Abstract

The present invention relates to an epoxy composition capable of implementing a processed product that has excellent properties and is easy to recycle and reprocess, a curable composition comprising same, and a processed product comprising a cured product of the curable composition.

Description

Epoxy composition, curable composition including the same, and processed material

[0001] The present invention relates to an epoxy composition, a curable composition containing the same, and a processed product.

[0002]

[0003] Epoxy resins are widely used as matrix materials for composites due to their excellent mechanical and thermal properties and superior processability. However, unlike thermoplastic resins, epoxy resins are thermosetting resins that cannot be reprocessed or recycled; consequently, the issue of waste disposal for expired epoxy composites is emerging as a social problem.

[0004] To address these issues, attempts have been made to use acrylates and various types of curing agents; however, there were difficulties in applying them to actual industries due to excessively fast curing speeds, low mechanical strength, and poor thermal properties when applied to composite materials.

[0005] Accordingly, there is a need to develop technology for epoxy systems that enable stable curing, possess properties that facilitate easy application to composite materials, and are recyclable.

[0006]

[0007] The present invention provides an epoxy composition capable of realizing a processed product having excellent physical properties and being easy to recycle and reprocess, a curable composition comprising the same, and a processed product comprising a cured product of the curable composition.

[0008] However, the problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned problems will be clearly understood by those skilled in the art from the description below.

[0009]

[0010] One embodiment of the present invention provides an epoxy composition comprising one or more epoxy compounds; and a first (meth)acrylate compound having a viscosity of 3 cP or more and 50 cP or less.

[0011] In addition, one embodiment of the present invention provides a curable composition comprising the epoxy composition and an amine-based curing agent.

[0012] In addition, one embodiment of the present invention provides a processed article comprising a cured product of the curable composition.

[0013]

[0014] An epoxy composition according to one embodiment of the present invention can easily realize a processed product having excellent physical properties and being easy to recycle and reprocess.

[0015] A curable composition according to one embodiment of the present invention can easily realize a processed product that has excellent physical properties and is easy to recycle and reprocess.

[0016] A workpiece according to one embodiment of the present invention has excellent physical properties and can be easily recycled and reprocessed.

[0017] However, the effects of the present invention are not limited to the effects described above and may be extended in various ways without departing from the spirit and scope of the present invention.

[0018]

[0019] Figure 1 is a photograph showing the results of an evaluation of the degradability of the cured product prepared in Example 2-1 of the present invention.

[0020] Figure 2 is a diagram showing the structure of a specimen for performing an evaluation of the adhesion of a cured product prepared in an embodiment of the present invention.

[0021] Figure 3 is a figure showing the FT-IR measurement results for the cured product of the curable composition prepared in Example 2-1, and Figure 4 is a figure showing the FT-IR measurement results for the cured product of the curable composition prepared in Comparative Example 2-1.

[0022] Figure 5 is a photograph confirming that the processability of the curable composition prepared in Comparative Examples 2-5 is very inferior.

[0023]

[0024] Throughout this specification, when a part is described as "comprising" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0025] Throughout the entire specification, "at least one of a, b and c" may include a, b, or c alone, or two or more combinations selected from the group consisting of a, b, and c.

[0026] Throughout the entire specification, the unit "parts by weight" may refer to the ratio of weight between each component.

[0027] Throughout this specification, terms including ordinal numbers, such as "first" and "second," are used for the purpose of distinguishing one component from another and are not limited by said ordinal numbers. For example, within the scope of the invention, the first component may also be named the second component, and similarly, the second component may be named the first component.

[0028] Throughout this specification, "(meth)acrylate" is used to refer collectively to acrylates and methacrylates.

[0029] Throughout the entire specification, the viscosity of a compound (or composition) may be a value measured by a Brookfield viscometer at a corresponding temperature. Specifically, after degassing the compound (or composition) to a bubble-free state, 0.5 mL is sampled using a 5 mL syringe, and the viscosity is measured for 10 minutes while maintaining a constant temperature (25 °C or 30 °C) at 200 rpm using the Brookfield CAP 2000 viscometer spindle No. 9, and the average cP value of the measured viscosity values ​​is calculated.

[0030] Throughout the entire specification, the “glass temperature (Tg)” can be measured using Differential Scanning Analysis (DSC). Specifically, using a Differential Scanning Calorimeter (DSC-3, METTLER TOLEDO), the sample is heated at a rate of 5°C within a temperature range of -60°C to 150°C, and the glass temperature can be obtained by conducting one cycle of the experiment in the above range and measuring the midpoint of the DSC curve created at the point where the amount of heat change is present.

[0031]

[0032] The present specification will be described in more detail below.

[0033] One embodiment of the present invention provides an epoxy composition comprising one or more epoxy compounds; and a first (meth)acrylate compound having a viscosity of 3 cP or more and 50 cP or less.

[0034] An epoxy composition according to one embodiment of the present invention can easily realize a processed product having excellent physical properties and being easy to recycle and reprocess.

[0035] According to one embodiment of the present invention, the epoxy composition comprises an epoxy-based compound. Specifically, the epoxy-based compound may comprise one or more epoxy-based compounds.

[0036] According to one embodiment of the present invention, the epoxy compound may include at least one of an aromatic epoxy compound, a chain-type epoxy compound, and a cycloaliphatic epoxy compound. By using an epoxy compound comprising at least one of an aromatic epoxy compound, a chain-type epoxy compound, and a cycloaliphatic epoxy compound, the epoxy composition can easily realize a cured product with excellent mechanical and thermal properties. Specifically, the epoxy compound may include at least one of an aromatic epoxy compound and a chain-type epoxy compound.

[0037] According to one embodiment of the present invention, the aromatic epoxy compound may contain an aromatic group within its structure. The aromatic group may be an aromatic ring having 6 to 30 carbon atoms. Additionally, the aromatic epoxy compound may contain two or more epoxy groups. Specifically, the number of epoxy groups contained in the aromatic epoxy compound may be 2 or more and 4 or less, 2 or more and 3 or less, or 2.

[0038] According to one embodiment of the present invention, the chain-type epoxy compound may contain a chain-type hydrocarbon group within its structure. The chain-type epoxy compound may not contain any other cyclic structure other than the epoxy group within its structure. The chain-type hydrocarbon group may be a straight-chain or branched-chain alkyl group having 1 to 20 carbon atoms. Additionally, the chain-type epoxy compound may contain one or more epoxy groups. Specifically, the number of epoxy groups contained in the chain-type epoxy compound may be 1 or more and 3 or less, 1 or more and 2 or less, or one.

[0039] According to one embodiment of the present invention, the cycloaliphatic epoxy compound may contain a cycloaliphatic ring having 5 to 10 carbon atoms in its structure. Additionally, the cycloaliphatic epoxy compound may contain one or more epoxy groups. Specifically, the number of epoxy groups contained in the cycloaliphatic epoxy compound may be 1 or more and 3 or less, 1 or more and 2 or less, or 2.

[0040] According to one embodiment of the present invention, the aromatic epoxy compound may include a compound represented by the following chemical formula 1.

[0041] [Chemical Formula 1]

[0042]

[0043] In the above chemical formula 1, R 11 is a substituted or unsubstituted straight-chain or branched-chain alkylene having 1 to 3 carbon atoms, and R 12 and R 13 Each is independently a direct bond; or a straight-chain or branched-chain alkylene having 1 to 3 carbon atoms; and the substituted alkylene comprises one or more substituents, wherein the substituent is an alkyl group having 1 to 5 carbon atoms.

[0044] When including an aromatic epoxy compound represented by the above chemical formula 1, the curable composition prepared using the above epoxy composition can effectively provide a cured product having properties suitable for composite materials used for various applications.

[0045] According to one embodiment of the present invention, the aromatic epoxy compound may include a compound represented by the following chemical formula 1-1.

[0046] [Chemical Formula 1-1]

[0047]

[0048] R in the above chemical formula 1-1 11 to R 13...is the same as that defined in Chemical Formula 1 above. The compound represented by Chemical Formula 1-1, with respect to the compound represented by Chemical Formula 1, R 11 to R 13 By specifying the bonding location, the curable composition prepared using the epoxy composition can more effectively provide a cured product having properties suitable for composite materials used in various applications.

[0049] According to one embodiment of the present invention, the aromatic epoxy compound may include at least one of the following compounds 1-1 and 1-2.

[0050] [Compound 1-1]

[0051]

[0052] [Compound 1-2]

[0053]

[0054] According to one embodiment of the present invention, the chain-type epoxy compound may include at least one of a compound represented by the following chemical formula 2-1 and a compound represented by the following chemical formula 2-2.

[0055] [Chemical Formula 2-1]

[0056]

[0057] [Chemical Formula 2-2]

[0058]

[0059] R in the above chemical formula 2-1 21 is a straight-chain or branched-chain alkyl group having 5 to 15 carbon atoms, and R in Formula 2-2 above. 22 is a straight-chain or branched-chain alkylene having 2 to 10 carbon atoms. Specifically, R 21 The number of carbon atoms included in the alkyl group of may be 6 or more and 13 or less, 8 or more and 12 or less, 5 or more and 10 or less, or 8 or more and 15 or less. In addition, R 22The number of carbon atoms included in the alkylene may be 3 or more and 8 or less, 4 or more and 6 or less, 2 or more and 7 or less, or 5 or more and 10 or less. When the above-mentioned chain-type epoxy compound is included, the curable composition prepared using the above-mentioned epoxy composition can effectively provide a cured product having physical properties suitable for composite materials used for various applications.

[0060] According to one embodiment of the present invention, the chain-type epoxy compound may include at least one of the following compounds 2-1 to 2-4.

[0061] [Compound 2-1]

[0062]

[0063] [Compound 2-2]

[0064]

[0065] [Compound 2-3]

[0066]

[0067] [Compound 2-4]

[0068]

[0069] According to one embodiment of the present invention, the cycloaliphatic epoxy compound may include a compound represented by the following chemical formula 3.

[0070] [Chemical Formula 3]

[0071]

[0072] In the above chemical formula 3, R 31 is a cycloaliphatic ring having 5 to 10 carbon atoms, and R 32 and R 33 Each is independently a direct bond; a straight-chain or branched-chain alkylene having 1 to 3 carbon atoms; or a carbonyl (C=O).

[0073] When a curable composition prepared using the epoxy composition includes a cycloaliphatic epoxy compound represented by the above chemical formula 3, the curable composition can effectively provide a cured product having properties suitable for composite materials used for various applications.

[0074] According to one embodiment of the present invention, the cycloaliphatic epoxy compound may include a compound represented by the following chemical formula 3-1.

[0075] [Chemical Formula 3-1]

[0076]

[0077] R in the above chemical formula 3-1 32 to R 33 ...is the same as that defined in Chemical Formula 3 above. The compound represented by Chemical Formula 3-1 is, with respect to the compound represented by Chemical Formula 3, R 31 By specifying the type of, the curable composition prepared using the above epoxy composition can more effectively provide a cured product having properties suitable for composite materials used for various applications.

[0078] According to one embodiment of the present invention, the cycloaliphatic epoxy compound may include at least one of the following compounds 3-1 and 3-2.

[0079] [Compound 3-1]

[0080]

[0081] [Compound 3-2]

[0082]

[0083] According to one embodiment of the present invention, the epoxy compound comprises an aromatic epoxy compound and a chain-type epoxy compound, and the content of the chain-type epoxy compound may be 1 part by weight or more and 30 parts by weight or less per 100 parts by weight of the aromatic epoxy compound. By simultaneously including the aromatic epoxy compound and the chain-type epoxy compound in the epoxy compound, an epoxy composition capable of effectively realizing a cured product with improved mechanical and thermal properties can be provided.

[0084] Specifically, with respect to 100 parts by weight of the aromatic epoxy compound, the content of the chain-type epoxy compound may be 1 part by weight or more and 25 parts by weight or less, 1 part by weight or more and 20 parts by weight or less, 1 part by weight or more and 15 parts by weight or less, 1 part by weight or more and 10 parts by weight or less, 1 part by weight or more and 5 parts by weight or less, 3 parts by weight or more and 10 parts by weight or less, 3 parts by weight or more and 7.5 parts by weight or less, 3 parts by weight or more and 5 parts by weight or less, 10 parts by weight or more and 20 parts by weight or less, 15 parts by weight or more and 30 parts by weight or less, 20 parts by weight or more and 30 parts by weight or less, or 25 parts by weight or more and 30 parts by weight or less. When the content of the aromatic epoxy compound and the chain-type epoxy compound included in the epoxy composition is within the aforementioned ranges, the epoxy composition can effectively form a cured product with excellent mechanical and thermal properties.

[0085] According to one embodiment of the present invention, the first (meth)acrylate-based compound may have a viscosity of 2 cP or more and 50 cP or less when measured at 25 ℃. Specifically, the first (meth)acrylate-based compound may have a viscosity of 2 cP or more and 45 cP or less, 2 cP or more and 40 cP or less, 2 cP or more and 35 cP or less, 2 cP or more and 30 cP or less, 2 cP or more and 25 cP or less, 2 cP or more and 20 cP or less, 2 cP or more and 15 cP or less, 3 cP or more and 10 cP or less, 15 cP or more and 50 cP or less, 20 cP or more and 45 cP or less, 25 cP or more and 40 cP or less, or 30 cP or more and 35 cP or less. When using the first (meth)acrylate-based compound having the aforementioned viscosity range, processability can be improved without adding a diluent to the epoxy composition. That is, the epoxy composition may not contain a diluent. Furthermore, when the first (meth)acrylate-based compound has the aforementioned viscosity range, it may react easily with an amine-based curing agent included in the curable composition described below. Through this, the curable composition can effectively realize a processed product with excellent physical properties and easy recycling and reprocessing.

[0086] According to one embodiment of the present invention, the first (meth)acrylate-based compound may include one or more (meth)acrylate groups and two or fewer (meth)acrylate groups. That is, the first (meth)acrylate-based compound may include one or more acrylate groups or two or fewer methacrylate groups. When the number of (meth)acrylate groups included in the first (meth)acrylate-based compound is within the aforementioned range, the recyclability of the cured product can be easily improved and reprocessability can be effectively enhanced through a reaction with an amine-based curing agent included in the curable composition described below.

[0087] According to one embodiment of the present invention, with respect to 100 parts by weight of the epoxy compound, the content of the first (meth)acrylate compound may be 10 parts by weight or more and 25 parts by weight or less. Specifically, the content of the first (meth)acrylate compound may be 10 parts by weight or more and 22.5 parts by weight or less, 10 parts by weight or more and 20 parts by weight or less, 10 parts by weight or more and 17.5 parts by weight or less, 10 parts by weight or more and 15 parts by weight or less, 15 parts by weight or more and 25 parts by weight or less, or 20 parts by weight or more and 25 parts by weight or less, with respect to 100 parts by weight of the epoxy compound. By controlling the content of the first (meth)acrylate compound to the aforementioned range, the epoxy composition can effectively provide a cured product that is easy to recycle and reprocess while having physical properties suitable for composite materials.

[0088] According to one embodiment of the present invention, the first (meth)acrylate-based compound may comprise at least one of 1,4-butanediol di(meth)acrylate, glycidyl (meth)acrylate, isooctyl (meth)acrylate, 2-propenic acid 2-[2-[(2-ethylhexyl)oxy]epoxy]ethyl, 3,3,5-trimethylcyclohexyl (meth)acrylate, benzyl (meth)acrylate, isodecyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 1,6-hexanediol di(meth)acrylate, and 1,6-hexanediol ethoxylate di(meth)acrylate.

[0089] According to one embodiment of the present invention, the epoxy composition may further include a second (meth)acrylate-based compound having a viscosity of 60 cP or more. Specifically, the second (meth)acrylate-based compound may have a viscosity measured at 25°C of 60 cP or more and 150 cP or less, 70 cP or more and 140 cP or less, 80 cP or more and 130 cP or less, 90 cP or more and 120 cP or less, 100 cP or more and 110 cP or less, 60 cP or more and 100 cP or less, 70 cP or more and 90 cP or less, 75 cP or more and 85 cP or less, 100 cP or more and 150 cP or less, 110 cP or more and 140 cP or less, or 120 cP or more and 130 cP or less. When using the second (meth)acrylate-based compound having the aforementioned viscosity range, it is possible to provide a curable composition that has excellent physical properties and is easy to recycle and reprocess without reducing the processability of the epoxy composition.

[0090] According to one embodiment of the present invention, the second (meth)acrylate-based compound may include three or more (meth)acrylate groups and eight or fewer (meth)acrylate groups. Specifically, the number of acrylate groups or methacrylate groups included in the second (meth)acrylate-based compound may be three or more and seven or fewer, three or more and six or fewer, three or more and five or fewer, or three or more and four or fewer. When the number of (meth)acrylate groups included in the second (meth)acrylate-based compound is within the aforementioned range, the mechanical and thermal properties of the cured product can be effectively improved through a reaction with an amine-based curing agent included in the curable composition described below.

[0091] According to one embodiment of the present invention, the content of the second (meth)acrylate compound may be 1 part by weight or more and 7.5 parts by weight or less with respect to 100 parts by weight of the epoxy compound. Specifically, the content of the second (meth)acrylate compound may be 1 part by weight or more and 5 parts by weight or less, 1 part by weight or more and 3 parts by weight or less, 2.5 parts by weight or more and 7.5 parts by weight or less, 4 parts by weight or more and 7.5 parts by weight or less, or 5 parts by weight or more and 7.5 parts by weight or less, with respect to 100 parts by weight of the epoxy compound. By controlling the content of the second (meth)acrylate compound to the aforementioned range, the epoxy composition can effectively provide a cured product that is easy to recycle and has improved reprocessability while possessing physical properties suitable for composite materials.

[0092] According to one embodiment of the present invention, the second (meth)acrylate-based compound may include at least one of glycerylpropoxy tri(meth)acrylate, 2-carboxyethyl (meth)acrylate, trimethylolpropanethoxylate tri(meth)acrylate, caprolactone (meth)acrylate, 3,3,5-trimethylcyclohexyl (meth)acrylate, tripropylene glycol di(meth)acrylate, and trimethylolpropanepropoxylate tri(meth)acrylate.

[0093] According to one embodiment of the present invention, the weight ratio of the first (meth)acrylate-based compound and the second (meth)acrylate-based compound may be 1:0.1 to 1:0.5, 1:0.2 to 1:0.4, 1:0.1 to 1:0.3, or 1:0.2 to 1:0.5. When the mixing ratio of the first (meth)acrylate-based compound and the second (meth)acrylate-based compound included in the epoxy composition is within the aforementioned range, the cured product of the curable composition described below may have excellent mechanical and thermal properties and may be easy to recycle and reprocess.

[0094] According to one embodiment of the present invention, the viscosity of the epoxy composition may be 500 cP or more and 2,000 cP or less. Specifically, the viscosity of the epoxy composition measured at 25°C may be 500 cP or more and 2,000 cP or less, 700 cP or more and 1,800 cP or less, 1,000 cP or more and 1,500 cP or less, 500 cP or more and 1,500 cP or less, 600 cP or more and 1,300 cP or less, 800 cP or more and 1,200 cP or less, 1,000 cP or more and 2,000 cP or less, 1,100 cP or more and 1,800 cP or less, 1,200 cP or more and 1,600 cP or less, or 1,200 cP or more and 1,400 cP or less. When the viscosity of the above epoxy composition is within the aforementioned range, the processability of the curable composition described below is excellent, and thereby, the manufacturing process efficiency can be effectively improved when manufacturing composite materials.

[0095]

[0096] One embodiment of the present invention provides a curable composition comprising the epoxy composition and an amine-based curing agent.

[0097] A curable composition according to one embodiment of the present invention can easily realize a processed product that has excellent physical properties and is easy to recycle and reprocess.

[0098] According to one embodiment of the present invention, the curable composition may be a thermosetting composition. That is, a thermosetting material can be obtained by heat-treating the curable composition.

[0099] According to one embodiment of the present invention, the first (meth)acrylate-based compound and the second (meth)acrylate-based compound included in the epoxy composition may react with the amine-based curing agent to form β-aminoester bonds. That is, the cured product of the curable composition may include β-aminoester bonds. By including β-aminoester bonds, the cured product can achieve properties suitable for composite materials used in various applications, and has the advantage of being easy to recycle and reprocess after use.

[0100] According to one embodiment of the present invention, the viscosity of the amine-based curing agent may be 5 cP or more and 200 cP or less. Specifically, the amine-based curing agent has a viscosity measured at 25°C of 5 cP or more and 180 cP or less, 5 cP or more and 160 cP or less, 5 cP or more and 140 cP or less, 5 cP or more and 120 cP or less, 5 cP or more and 100 cP or less, 5 cP or more and 80 cP or less, 5 cP or more and 60 cP or less, 5 cP or more and 50 cP or less, 5 cP or more and 40 cP or less, 5 cP or more and 30 cP or less, 7.5 cP or more and 25 cP or less, 9 cP or more and 20 cP or less, 12.5 cP or more and 17.5 cP or less, 5 cP or more and 15 cP or less, 5 cP or more and 10 cP or less, 10 cP or more and 30 cP or less, 15 cP or more and 25 cP or less, or 15 cP or more and 20 It may be less than cP. When the viscosity of the amine-based curing agent is within the aforementioned range, the curable composition may not include a separate diluent. That is, the curable composition may not include a diluent. Through this, the deterioration of the physical properties of the cured product of the curable composition can be effectively suppressed.

[0101] According to one embodiment of the present invention, the amine-based curing agent may include two or more amine groups. Specifically, the number of amine groups included in the amine-based curing agent may be two or more and four or less, two or more and three or less, or two. When the number of amine groups included in the amine-based curing agent is within the aforementioned range, the number of β-aminoester bonds included in the cured product is controlled to an appropriate level, so that the cured product has excellent mechanical and thermal properties, while also having improved decomposition properties, which can result in excellent recyclability and reprocessability.

[0102] According to one embodiment of the present invention, the amine-based curing agent may include at least one of a cyclic amine compound, a chain-type amine compound, and a heterocyclic amine compound. By using the aforementioned types of amine-based curing agents, the curable composition may be capable of stable curing. On the other hand, if the amine-based curing agent includes a heterocyclic amine compound, the mechanical and thermal properties of the cured product of the curable composition may be somewhat inferior, and the desired level of recyclability and reprocessability may not be achieved. Therefore, the amine-based curing agent may include at least one of a cyclic amine compound and a chain-type amine compound.

[0103] Meanwhile, the above amine-based curing agent may not include an aromatic amine-based compound. The above aromatic amine-based compound may contain an aromatic group having 6 to 30 carbon atoms in its structure. By not including an aromatic amine-based compound as an amine-based curing agent, it is possible to prevent the degradation of the recyclability and reprocessability properties of the cured product.

[0104] According to one embodiment of the present invention, the cyclic amine compound may contain a cyclic hydrocarbon group within its structure. The cyclic hydrocarbon group may be a substituted or unsubstituted cycloalkyl group having 5 to 10 carbon atoms. In this case, the number of substituents bonded to the cycloalkyl group may be 1 or more and 3 or less, and the substituents may be straight-chain or branched-chain alkyl groups having 1 to 5 carbon atoms. For example, the cyclic amine compound may include at least one of isophoronediamine (viscosity: 10 to 20 cP), 1,3-bicyclohexyldiamine (viscosity: 5 to 10 cP), 4,4'-methylenebis(cyclohexylamine) (viscosity: 50 to 80 cP), 4,4'-methylenebis(2-methylcyclohexylamine) (viscosity: 5 to 10 cP) and methylcyclohexyl diamine (viscosity: 5 to 20 cP).

[0105] According to one embodiment of the present invention, the chain-type amine compound may not include a cyclic structure within its structure. The chain-type amine compound may include a compound represented by the following chemical formula 4.

[0106] [Chemical Formula 4]

[0107]

[0108] In the above chemical formula 4, R 41 and R 42 Each is independently a straight-chain or branched-chain alkylene having 1 to 5 carbon atoms, and R 43 and R 44 Each is independently a straight-chain or branched-chain alkyl group having 1 to 3 carbon atoms, and R 45 is carbon or oxygen, and x can be 1 to 20.

[0109] According to one embodiment of the present invention, the heterocyclic amine compound may include a heterocyclic ring in its structure. The heterocyclic ring may be a pentagonal to heptagonal ring and may include at least one of oxygen and nitrogen as a heteroatom. For example, the heterocyclic amine compound may include an imidazole compound.

[0110] With respect to 100 parts by weight of the epoxy composition, the content of the amine-based curing agent may be 15 parts by weight or more and 50 parts by weight or less. Specifically, with respect to 100 parts by weight of the epoxy composition, the content of the amine-based curing agent may be 18 parts by weight or more and 45 parts by weight or less, 20 parts by weight or more and 40 parts by weight or less, 25 parts by weight or more and 35 parts by weight or less, 15 parts by weight or more and 40 parts by weight or less, 17.5 parts by weight or more and 37.5 parts by weight or less, 20 parts by weight or more and 35 parts by weight or less, 22.5 parts by weight or more and 32.5 parts by weight or less, 35 parts by weight or more and 30 parts by weight or less, 25 parts by weight or more and 50 parts by weight or less, 27.5 parts by weight or more and 47.5 parts by weight or less, or 30 parts by weight or more and 42.5 parts by weight or less. When the content of the amine-based curing agent included in the above-mentioned curable composition is within the aforementioned range, the curable composition may be capable of stable curing. In addition, by adjusting the content of the amine-based curing agent to the aforementioned range, the number of β-aminoester bonds included in the cured product can be controlled to an appropriate level. Through this, the cured product may have excellent mechanical and thermal properties, while also having improved decomposition properties, resulting in excellent recyclability and reprocessability.

[0111] According to one embodiment of the present invention, the amine-based curing agent may include the cyclic amine compound and the chain-type amine compound. Specifically, the weight ratio of the cyclic amine compound and the chain-type amine compound included in the amine-based curing agent may be 1:0.5 to 1:1.5, 1:0.7 to 1:1.3, 1:0.9 to 1:1.1, 1:0.5 to 1:1, or 1:1 to 1:1.5. When the weight ratio of the cyclic amine compound and the chain-type amine compound included in the amine-based curing agent is within the aforementioned range, the cured product may have excellent mechanical and thermal properties, while also having improved decomposition properties, resulting in excellent recyclability and reprocessability.

[0112] According to one embodiment of the present invention, the viscosity of the curable composition may be 150 cP or more and 300 cP or less. The curable composition having the aforementioned viscosity range has excellent processability, which can improve the manufacturing efficiency of composite materials and further reduce manufacturing time.

[0113] According to one embodiment of the present invention, the curable composition may have a time to reach a viscosity of 1,000 cP of 120 minutes or more. Specifically, the time to reach a viscosity of 1,000 cP of the curable composition may be 130 minutes or more, 140 minutes or more, 150 minutes or more, 160 minutes or more, 170 minutes or more, or 180 minutes or more. Additionally, the time to reach a viscosity of 1,000 cP of the curable composition may be 300 minutes or less, 250 minutes or less, or 200 minutes or less. When the time to reach a viscosity of 1,000 cP of the curable composition is within the aforementioned range, a stable curing reaction can be performed, and ease of processing can be effectively improved.

[0114] According to one embodiment of the present invention, the cured product of the curable composition may have a decomposition rate of 90% or more. Specifically, the decomposition rate of the cured product may be 90% or more and 98% or less. The cured product having the aforementioned decomposition rate may be easy to recycle.

[0115] According to one embodiment of the present invention, the cured product of the curable composition may have an adhesive strength of 0.5 kg / in or more. Specifically, the adhesive strength of the cured product may be 0.5 kg / in or more and 1.1 kg / in or less. The cured product having the aforementioned adhesive strength can be utilized for various applications as it achieves appropriate adhesive strength.

[0116] According to one embodiment of the present invention, the cured product of the curable composition is 1,700 cm² as a result of FT-IR measurement. -1 to 1,800 cm -1 It may exhibit a peak at the wave number. In addition, the cured product of the above-mentioned curable composition shows 3,200 cm⁻¹ as a result of FT-IR measurement. -1 to 3,400 cm -1 A peak can be shown in the wavenumber.

[0117] According to one embodiment of the present invention, the curable composition can be processed through various methods used in the art. For example, it can be processed into a workpiece described below using methods such as a resin infusion process, such as resin transfer molding (RTM), or a vacuum infusion process (VIP).

[0118]

[0119] One embodiment of the present invention provides a processed article comprising a cured product of the curable composition.

[0120] A workpiece according to one embodiment of the present invention has excellent physical properties and can be easily recycled and reprocessed.

[0121] According to one embodiment of the present invention, the workpiece may include a thermosetting product of the curable composition. By including the curing product, the workpiece may be easily used as a composite material applicable to various uses.

[0122] According to one embodiment of the present invention, the glass transition temperature of the cured product may be 50°C or higher and 100°C or lower, 60°C or higher and 90°C or lower, 70°C or higher and 80°C or lower, 50°C or higher and 80°C or lower, 55°C or higher and 75°C or lower, 60°C or higher and 70°C or lower, 70°C or higher and 100°C or lower, or 75°C or higher and 90°C or lower. The cured product having a glass transition temperature satisfying the aforementioned range may have excellent thermal properties. Specifically, the cured product may have excellent thermal stability.

[0123] According to one embodiment of the present invention, the tensile strength of the cured product may be 50 MPa or more and 100 MPa or less, 60 MPa or more and 90 MPa or less, 65 MPa or more and 80 MPa or less, 50 MPa or more and 85 MPa or less, 60 MPa or more and 85 MPa or less, 65 MPa or more and 100 MPa or less, 70 MPa or more and 100 MPa or less, or 75 MPa or more and 100 MPa or less. The cured product having a tensile strength satisfying the aforementioned range may have excellent mechanical properties. Specifically, the cured product may have excellent durability and physical stability.

[0124] According to one embodiment of the present invention, the workpiece may be applied to a blade used in a wind turbine. That is, one embodiment of the present invention may provide a wind turbine blade comprising the workpiece. Specifically, the workpiece may be used in a shell, which is an outer part that surrounds the core of a blade for a wind turbine.

[0125]

[0126] Hereinafter, the present invention will be described in detail with reference to examples to specifically explain the invention. However, the embodiments according to the present invention may be modified in various different forms, and the scope of the present invention is not to be interpreted as being limited to the embodiments described below. The embodiments of this specification are provided to more completely explain the present invention to those with average knowledge in the art.

[0127]

[0128] ingredient

[0129] epoxy compounds

[0130] As an aromatic epoxy compound, bisphenol A diglycidyl ether, compound 1-1, was prepared.

[0131] As a chain-type epoxy compound, Lauryl glycidyl ether, compound 2-1, was prepared.

[0132]

[0133] 1 (meth)acrylate compound

[0134] 1,4-butanediol dimethacrylate with a viscosity of 9 cP measured at 25 ℃ was prepared. 1,4-butanediol diacrylate with a viscosity of 8 cP measured at 25 ℃ was prepared.

[0135] In addition, glycidyl methacrylate with a viscosity of 2 cP measured at 25 ℃ was prepared.

[0136]

[0137] Second (meth)acrylate compound

[0138] Glyceryl propoxy triacrylate with a viscosity of 95 cP measured at 25 ℃ was prepared.

[0139] In addition, pentaerythritol triacrylate with a viscosity of 1,200 cP measured at 25 ℃ was prepared.

[0140]

[0141] Amine-based curing agent

[0142] Isophorone diamine was prepared as a cyclic amine compound with a viscosity of 16 cP measured at 25 ℃.

[0143] D230 (JEFFAMINE), a chain-type amine compound with a viscosity of 9.5 cP measured at 25 °C, was prepared. In this case, D230 corresponds to the compound represented by the following chemical formula 4-1, and x is 2.5.

[0144] [Chemical Formula 4-1]

[0145]

[0146] An imidazole was prepared as a heterocyclic amine compound that is in a solid state at 25°C.

[0147]

[0148] Preparation of epoxy composition

[0149] Example 1-1

[0150] An epoxy compound was prepared by mixing bisphenol A diglycidyl ether, an aromatic epoxy compound, and lauryl glycidyl ether, a chain-type epoxy compound. At this time, the content of the chain-type epoxy compound was 5 parts by weight per 100 parts by weight of the aromatic epoxy compound.

[0151] Subsequently, an epoxy composition was prepared by mixing an epoxy compound with a first (meth)acrylate compound, 1,4-butanediol dimethacrylate. At this time, the content of the first (meth)acrylate compound was about 14.3 parts by weight per 100 parts by weight of the epoxy compound (a mixture of bisphenol A diglycidyl ether and lauryl glycidyl ether).

[0152]

[0153] Examples 1-2 to 1-4

[0154] An epoxy composition was prepared in the same manner as in Example 1-1 above, except that the type and content of the compound used were adjusted as shown in Table 1 below.

[0155] Epoxy-based compound 1st (meth)acrylate-based compound 2nd (meth)acrylate-based compound Aromatic chain type Example 1-1 (1) 100 parts by weight (2) 5 parts by weight (3) 14.3 parts by weight - Example 1-2 (1) 100 parts by weight (2) 5 parts by weight (4) 14.3 parts by weight - Example 1-3 (1) 100 parts by weight (2) 5 parts by weight (3) 14.3 parts by weight (5) 4.8 parts by weight Example 1-4 (1) 100 parts by weight (2) 5 parts by weight (6) 14.3 parts by weight -

[0156] In Table 1 above, (1) is bisphenol A diglycidyl ether, (2) is lauryl glycidyl ether, (3) is 1,4-butanediol dimethacrylate, (4) is 1,4-butanediol diacrylate, (5) is glyceryl propoxy triacrylate, and (6) is glycidyl methacrylate. Also, in Table 1 above, the content (parts by weight) of the first (meth)acrylate compound and the second (meth)acrylate compound is based on 100 parts by weight of the epoxy compound (a mixture of bisphenol A diglycidyl ether and lauryl glycidyl ether).

[0157]

[0158] Comparative Examples 1-1 to 1-5

[0159] Comparative Example 1-1 was prepared by mixing bisphenol A diglycidyl ether and lauryl glycidyl ether to prepare an epoxy composition. At this time, the content of lauryl glycidyl ether was 5 parts by weight per 100 parts by weight of bisphenol A diglycidyl ether.

[0160] Comparative Example 1-2 prepared an epoxy composition by mixing bisphenol A diglycidyl ether and 1,4-butanediol diacrylate. At this time, the content of 1,4-butanediol diacrylate was 60 parts by weight per 100 parts by weight of bisphenol A diglycidyl ether.

[0161] Comparative Examples 1-3 were prepared by using 100 parts by weight of bisphenol A diglycidyl ether as an epoxy composition.

[0162] Comparative Examples 1-4 prepared an epoxy composition by mixing bisphenol A diglycidyl ether and bisphenol A epoxy acrylate. At this time, the content of bisphenol A epoxy acrylate was 60 parts by weight per 100 parts by weight of bisphenol A diglycidyl ether.

[0163] Comparative Examples 1-5 prepared an epoxy compound by mixing bisphenol A diglycidyl ether and lauryl glycidyl ether. At this time, the content of lauryl glycidyl ether was 5 parts by weight per 100 parts by weight of bisphenol A diglycidyl ether.

[0164] Subsequently, an epoxy composition was prepared by mixing an epoxy compound with a second (meth)acrylate compound, pentaerythritol triacrylate. At this time, the content of the second (meth)acrylate compound was about 14.3 parts by weight per 100 parts by weight of the epoxy compound.

[0165]

[0166] Epoxy-based compound 1 (meth)acrylate-based compound 2 (meth)acrylate-based compound Aromatic chain type Comparative Example 1-1 (1) 100 parts by weight (2) 20 parts by weight -- Comparative Example 1-2 (1) 100 parts by weight - (4) 60 parts by weight - Comparative Example 1-3 (1) 100 parts by weight -- Comparative Example 1-4 (1) 100 parts by weight (7) 60 parts by weight -- Comparative Example 1-5 (1) 100 parts by weight (2) 20 parts by weight - (8) 14.3 parts by weight

[0167] In Table 1 above, (1) is bisphenol A diglycidyl ether, (2) is lauryl glycidyl ether, (4) is 1,4-butanediol diacrylate, (7) is bisphenol A epoxy acrylate, and (8) is pentaerythritol triacrylate. Also, in Table 2 above, the content (parts by weight) of the first (meth)acrylate compound and the second (meth)acrylate compound is based on 100 parts by weight of the epoxy compound.

[0168]

[0169] Comparative Examples 1-6 to 1-8

[0170] An epoxy composition was prepared in the same manner as in Example 1-1, except that the type and content of the compound used were adjusted as shown in Table 3 below.

[0171] Epoxy-based compound 1st (meth)acrylate-based compound 2nd (meth)acrylate-based compound Aromatic chain type Comparative Example 1-6 (1) 100 parts by weight (2) 0.1 parts by weight (3) 14.3 parts by weight - Comparative Example 1-7 (1) 100 parts by weight (2) 40 parts by weight (3) 14.3 parts by weight - Comparative Example 1-8 (1) 100 parts by weight (2) 5 parts by weight (3) 14.3 parts by weight (5) 14.3 parts by weight

[0172] In Table 3 above, (1) is bisphenol A diglycidyl ether, (2) is lauryl glycidyl ether, (3) is 1,4-butanediol dimethacrylate, and (5) is glyceryl propoxy triacrylate. Also, in Table 3 above, the content (parts by weight) of the first (meth)acrylate compound and the second (meth)acrylate compound is based on 100 parts by weight of the epoxy compound.

[0173]

[0174] Preparation of curable compositions and cured products

[0175] Example 2-1

[0176] The epoxy composition prepared in Example 1-1 above was prepared. Subsequently, isophoronediamine, a cyclic amine compound and an amine-based curing agent, and D230, a chain-based amine compound, were mixed with the epoxy composition to prepare a curable composition. At this time, with respect to 100 parts by weight of the epoxy composition, the content of isophoronediamine was 15 parts by weight and the content of D230 was 15 parts by weight.

[0177] Afterwards, the manufactured curable composition was placed in a convection oven and heat-cured at a temperature of 70°C to produce a cured product.

[0178]

[0179] Examples 2-2 to 2-8

[0180] A curable composition and a cured product were prepared in the same manner as in Example 2-1, except that the type and content of the epoxy composition and compound used were adjusted as shown in Table 4 below.

[0181]

[0182] Epoxy composition Amine-based curing agent Hydrographic amine compound Chain-based amine compound Example 2-1 Example 1-1 15 parts by weight 15 parts by weight Example 2-2 Example 1-2 15 parts by weight 15 parts by weight Example 2-3 Example 1-3 15 parts by weight 15 parts by weight Example 2-4 Example 1-4 15 parts by weight 15 parts by weight

[0183] In Table 4 above, the content (parts by weight) of the amine-based curing agent is based on 100 parts by weight of the epoxy composition.

[0184]

[0185] Reference Example 1

[0186] The epoxy composition prepared in Example 1-1 above was prepared. Subsequently, a curable composition was prepared by mixing imidazole, a heterocyclic amine compound, with the epoxy composition as an amine-based curing agent. At this time, the content of imidazole was 30 parts by weight per 100 parts by weight of the epoxy composition.

[0187] Afterwards, the manufactured curable composition was placed in a convection oven and heat-cured at a temperature of 70°C to produce a cured product.

[0188]

[0189] Comparative Examples 2-1 to 2-8

[0190] A curable composition and a cured product were prepared in the same manner as in Example 2-1, except that the type and content of the epoxy composition and compound used were adjusted as shown in Table 5 below.

[0191]

[0192] Epoxy composition Amine-based curing agent Cyclic amine-based compound Chain-based amine-based compound Heterocyclic amine-based compound Reference Example 1 Example 1-1 - 30 parts by weight Comparative Example 2-1 Comparative Example 1-1 - 15 parts by weight Comparative Example 2-2 Comparative Example 1-2 - 15 parts by weight Comparative Example 2-3 Comparative Example 1-3 - 15 parts by weight Comparative Example 2-4 Comparative Example 1-4 - 15 parts by weight Comparative Example 2-5 Comparative Example 1-5 - 15 parts by weight Comparative Example 2-6 Comparative Example 1-6 - 15 parts by weight Comparative Example 2-7 Comparative Example 1-7 - 15 parts by weight Comparative Example 2-8 Comparative Example 1-8 - 15 parts by weight Comparative Example 2-9 Example 1-10.5 Parts by weight 0.5 parts by weight - Comparative Example 2-10 Example 1-1100 parts by weight 100 parts by weight -

[0193] In Table 5 above, the content (parts by weight) of the amine-based curing agent is based on 100 parts by weight of the epoxy composition.

[0194]

[0195] Experimental Example

[0196] 1) Measurement of viscosity of epoxy composition

[0197] For the epoxy compositions prepared in Examples 1-1 to 1-4 and Comparative Examples 1-1 to 1-8, the viscosity at 30°C was measured using the method described above.

[0198]

[0199] 2) Measurement of viscosity of curable composition

[0200] For the curable compositions prepared in Examples 2-1 to 2-4, the curable composition prepared in Reference Example 1, and the curable compositions prepared in Comparative Examples 2-1 to 2-10, the viscosity at 30°C was measured using the method described above.

[0201]

[0202] 3) Measurement of the time to reach 1,000 cP of the curable composition

[0203] For the curable compositions prepared in Examples 2-1 to 2-4, the curable composition prepared in Reference Example 1, and the curable compositions prepared in Comparative Examples 2-1 to 2-10, the time it takes to reach a viscosity of 1,000 cP at 30 ℃ was measured using the method described above.

[0204] Specifically, the initial viscosity measurement was set to 0 minutes, and measurements were recorded by rotating the BROOKFIELD CAP2000 viscometer spindle No. 9 at 200 rpm at 5-minute intervals while maintaining a constant temperature at the corresponding temperature. A graph was obtained with time on the x-axis and viscosity on the y-axis, and the point at which the viscosity value reached 1,000 cP was calculated.

[0205]

[0206] 4) Measurement of the glass transition temperature of the cured material

[0207] For the cured products prepared in Examples 2-1 to 2-4, the cured product prepared in Reference Example 1, and the cured products prepared in Comparative Examples 2-1 to 2-10, the glass transition temperature (Tg) was measured using a DSC (Differential Scanning Calorimeter, DSC-3, METTLER TOLEDO) as described above.

[0208]

[0209] 5) Measurement of tensile strength of hardened material

[0210] For the cured products prepared in Examples 2-1 to 2-4, the cured product prepared in Reference Example 1, and the cured products prepared in Comparative Examples 2-1 to 2-10, the tensile strength was measured using the following method.

[0211] Specifically, a specimen was prepared by processing the hardened material according to ISO 527-2 standards. Subsequently, using a Universal Testing Machine (Roell Z0.5, Zwick), a force was applied in the tensile direction to measure the tensile strength at the fracture point of the specimen as the length increased relative to the initial length.

[0212]

[0213] 6) Evaluation of the degradability of the cured product

[0214] FIG. 1 is a photograph showing the results of an evaluation of the degradability of the cured product prepared in Example 2-1 of the present invention. FIG. 1 (a) is a photograph of the cured product before the degradability evaluation, and (b) is a photograph of the cured product after the degradability evaluation.

[0215] For the curable compositions prepared in Examples 2-1 to 2-4 above, the cured product prepared in Reference Example 1, and the cured products prepared in Comparative Examples 2-1 to 2-10, a degradability evaluation was performed as follows.

[0216] Specifically, the curable compositions prepared in Examples 2-1 to 2-4, the curable composition prepared in Reference Example 1, and the curable compositions prepared in Comparative Examples 2-1 to 2-10 were prepared. Glass fibers (WS-2000 E-Glass UD Fabric 16 ply) were added to the prepared curable compositions. At this time, the volume ratio of the curable composition to the glass fibers was 1:1.

[0217]

[0218] Subsequently, the prepared curable composition was placed in a convection oven and heat-cured at a temperature of 70°C to produce a cured product (glass fiber reinforced plastic). Subsequently, the cured product was placed in acetic acid and heated at a temperature of 80°C for 2 hours to decompose it.

[0219] The degradability evaluation was conducted using the following evaluation criteria.

[0220] X: Cured material does not decompose

[0221] △: Partial decomposition of the cured material and peeling of the fiber layer occur

[0222] ○: A state where all fiber layers of the cured material have been peeled off.

[0223]

[0224] In addition, the weight (W1) of the cured material before the degradability evaluation was measured. The degraded solid material after the degradability evaluation was collected and dried at a temperature of approximately 100°C to volatilize the acetic acid. Subsequently, the weight (W2) of the collected solid material was measured. Then, the degradability rate was calculated using the following Equation 1.

[0225] [Equation 1]

[0226] Decomposition rate (%) = (W1-W2) / W1 X 100

[0227]

[0228] 7) Evaluation of the adhesion of the cured product

[0229] FIG. 2 is a diagram showing the structure of a specimen for performing an evaluation of the adhesion of a cured product prepared in an embodiment of the present invention. Specifically, FIG. 2(a) shows the side structure of the specimen, and FIG. 2(b) shows the top structure of the specimen. In FIG. 2, A and B correspond to the cured product.

[0230] Adhesion evaluation was performed as follows on the curable compositions prepared in Examples 2-1 to 2-4, the cured product prepared in Reference Example 1, and the cured products prepared in Comparative Examples 2-1 to 2-10. The adhesion evaluation was conducted using a single lap shear test.

[0231] Two samples were prepared by processing the cured material prepared in Example 2-1 to a width of 2.5 cm, a length of 10 cm, and a thickness of 0.2 cm. Afterward, based on the length of the two samples, they were butted together so that the overlapping length was 2.5 cm, and then a pressure of 1 MPa was applied at a temperature of 150 ℃ to check whether the two samples were bonded to each other.

[0232] It was evaluated as "O" if they were bonded to each other, and "X" if they were not bonded.

[0233]

[0234] In addition, a single lap shear test was performed on a sample in which the two above samples were bonded, using a Universal Testing Machine (Roell Z0.5, Zwick) at a temperature of 25°C. At this time, the adhesion between the cured products was measured by applying force in the tensile direction and measuring until the point of peeling of the specimen.

[0235]

[0236] 8) IR measurement of the cured material

[0237] The cured product prepared in Example 2-1 and the cured product prepared in Comparative Example 2-1 were measured using FT-IR (Fourier-transform infrared spectroscopy).

[0238] Figure 3 is a figure showing the FT-IR measurement results for the cured product of the curable composition prepared in Example 2-1, and Figure 4 is a figure showing the FT-IR measurement results for the cured product of the curable composition prepared in Comparative Example 2-1.

[0239] Referring to Fig. 3, 1,715 cm -1 The appearance of a peak near the wave number indicates that an ester bond has been formed. Additionally, at 3,200 cm⁻¹ -1 to 3,400 cm -1 By observing the appearance of a broad peak at the wavenumber, it can be confirmed that "NH" bonds are present, indicating that aminoester bonds have been formed.

[0240] Meanwhile, referring to Fig. 4, 1,715 cm, different from Fig. 3 -1 Peak near the wavenumber, 3,200 cm -1 to 3,400 cm -1 It was confirmed that no broad peak was observed in the wavenumber.

[0241]

[0242] Viscosity Time to reach 1,000 cP (min) Tensile strength (MPa) Tg (°C) Epoxy composition (cP) Curable composition (cP) Example 1-1 Example 2-1 1,200 260 180 6268 Example 1-2 Example 2-2 1,200 260 120 6472 Example 1-3 Example 2-3 780 200 140 6878 Example 1-4 Example 2-4 1,100 250 180 6576

[0243]

[0244] Viscosity Time to reach 1,000 cP (min) Tensile strength (MPa) Tg (°C) Epoxy composition (cP) Curable composition (cP) Reference Example 1 1,200 1,500 -72 100 Comparative Example 1-1 Comparative Example 2-1 1,150 255 170 65 75 Comparative Example 1-2 Comparative Example 2-2 280 60 250 35 38 Comparative Example 1-3 Comparative Example 2-3 12,800 3,000 -70 120 Comparative Example 1-4 Comparative Example 2-4 210,000 50,000 -61 70 Comparative Example 1-5 Comparative Example 2-5 1,250 260 80 68 78 Comparative Example 1-6 Comparative Example 2-6 200 50 300 40 42 Comparative Example 1-7 Comparative Example 2-7 1,600 300 70 72 82 Comparative Example 1-8 Comparative Example 2-8 2,000 3,000 60 70 80 Comparative Example 2-9 1,200 1,100--- Comparative Example 2-10 1,200 80--

[0245]

[0246] Degradability Evaluation Adhesion Evaluation Degradation Degradation Rate (%) Adhesion Adhesion Strength (kg / in) Example 2-1: 9200.5 Example 2-2: 9400.87 Example 2-3: 9601.0 Example 2-4: 9000.6 Reference Example 1: XXXX Comparative Example 2-1: XXXX Comparative Example 2-2: 10000.5 Comparative Example 2-3: XXXX Comparative Example 2-4: 9501.3 Comparative Example 2-5: 9000.9 Comparative Example 2-6: 8201.0 Comparative Example 2-7: 9200.2 Comparative Example 2-8: 9501.2 Comparative Example 2-9: ----Comparative Example 2-10: ----

[0247]

[0248] Referring to Tables 6 to 8 above, it was confirmed that the curable compositions prepared in Examples 2-1 to 2-4 of the present invention have excellent processability, as the time to reach 1,000 cP is 120 minutes or more. In addition, it was confirmed that the curable compositions prepared in Examples 2-1 to 2-4 have excellent tensile strength, degradability, and adhesive properties.

[0249] Meanwhile, in the case of Comparative Examples 2-1 and 2-3, it was confirmed that degradability and adhesion were not achieved. In addition, in the case of Comparative Example 2-2, it was confirmed that the measured tensile strength and glass transition temperature values ​​were very low. Furthermore, in the case of Comparative Examples 2-3, 2-4, and 2-8, it was confirmed that the processability was very inferior because the viscosity of the curable composition was too high.

[0250] Figure 5 is a photograph confirming that the processability of the curable composition prepared in Comparative Example 2-5 is very inferior. Referring to Figure 5, in the case of Comparative Example 2-5, it was confirmed that the processability is very inferior because the viscosity increases rapidly, causing the viscosity to rise during the infusion process and curing during resin injection.

[0251] In the case of Comparative Example 2-6, it was confirmed that the degradability was very inferior. In the case of Comparative Example 2-7, it was confirmed that the adhesive strength was very inferior.

Claims

1. 1 or more epoxy compounds; and An epoxy composition comprising a first (meth)acrylate-based compound having a viscosity of 2 cP or more and 50 cP or less.

2. In Paragraph 1, An epoxy composition comprising at least one of an aromatic epoxy compound, a chain-type epoxy compound, and a cycloaliphatic epoxy compound.

3. In Paragraph 2, An epoxy composition wherein the above aromatic epoxy compound comprises a compound represented by the following chemical formula 1: [Chemical Formula 1] In the above chemical formula, R 11 It is a substituted or unsubstituted straight-chain or branched-chain alkylene having 1 to 3 carbon atoms, and R 12 and R 13 Each is independently a direct bond; or a straight-chain or branched-chain alkylene having 1 to 3 carbon atoms; and The above-mentioned substituted alkylene comprises one or more substituents, and the substituents are alkyl groups having 1 to 5 carbon atoms.

4. In Paragraph 2, An epoxy composition wherein the above-mentioned chain-type epoxy compound comprises at least one of a compound represented by the following chemical formula 2-1 and a compound represented by the following chemical formula 2-2: [Chemical Formula 2-1] [Chemical Formula 2-2] In the above chemical formula, R 21 is a straight-chain or branched-chain alkyl group having 5 to 15 carbon atoms, and R 22 It is a straight-chain or branched-chain alkylene having 2 to 10 carbon atoms.

5. In Paragraph 2, An epoxy composition wherein the above-mentioned cycloaliphatic epoxy compound comprises a compound represented by the following chemical formula 3: [Chemical Formula 3] In the above chemical formula, R 31 It is a cycloaliphatic ring having 5 to 10 carbon atoms, and R 32 and R 33 Each is independently a direct bond; a straight-chain or branched-chain alkylene having 1 to 3 carbon atoms; or a carbonyl (C=O).

6. In Paragraph 1, The above epoxy compounds include aromatic epoxy compounds and chain-type epoxy compounds, and An epoxy composition having a content of 1 part by weight or more and 30 parts by weight or less of the chain-type epoxy compound per 100 parts by weight of the aromatic epoxy compound.

7. In Paragraph 1, An epoxy composition having a content of 10 parts by weight or more and 25 parts by weight or less of the first (meth)acrylate compound per 100 parts by weight of the above epoxy compound.

8. In Paragraph 1, An epoxy composition comprising at least one of the above first (meth)acrylate-based compound, 1,4-butanediol di(meth)acrylate, glycidyl (meth)acrylate, isooctyl (meth)acrylate, 2-propenic acid 2-[2-[(2-ethylhexyl)oxy]epoxy]ethyl, 3,3,5-trimethylcyclohexyl (meth)acrylate, benzyl (meth)acrylate, isodecyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 1,6-hexanediol di(meth)acrylate, and 1,6-hexanediol ethoxylate di(meth)acrylate.

9. In Paragraph 1, An epoxy composition further comprising a second (meth)acrylate-based compound having a viscosity of 60 cP or higher.

10. In Paragraph 9, An epoxy composition having a content of 1 part by weight or more and 7.5 parts by weight or less of the second (meth)acrylate compound per 100 parts by weight of the above epoxy compound.

11. In Paragraph 9, An epoxy composition wherein the second (meth)acrylate-based compound comprises at least one of glycerylpropoxy tri(meth)acrylate, 2-carboxyethyl (meth)acrylate, trimethylolpropanethoxylate tri(meth)acrylate, caprolactone (meth)acrylate, 3,3,5-trimethylcyclohexyl (meth)acrylate, tripropylene glycol di(meth)acrylate, and trimethylolpropanepropoxylate tri(meth)acrylate.

12. In Paragraph 9, An epoxy composition in which the weight ratio of the first (meth)acrylate-based compound and the second (meth)acrylate-based compound is 1:0.1 to 1:0.

5.

13. Epoxy composition according to claim 1; and Curable composition comprising an amine-based curing agent.

14. In Paragraph 13, A curable composition having a viscosity of 5 cP or more and 200 cP or less of the above amine-based curing agent.

15. In Paragraph 13, The above amine-based curing agent is a curable composition comprising at least one of a cyclic amine compound, a chain-type amine compound, and a heterocyclic amine compound.

16. In Paragraph 13, A curable composition having a content of 15 parts by weight or more and 50 parts by weight or less of the amine-based curing agent per 100 parts by weight of the above epoxy composition.

17. A processed product comprising a cured product of a curable composition according to paragraph 13.

Images