Light-emitting module and light-emitting device including same

Abstract

The present invention relates to a light-emitting module and a light-emitting device including same and, more specifically, to a light-emitting module including a plurality of light-emitting elements and a light-emitting device including same. According to the present invention, the light-emitting module includes: a substrate; and a plurality of light-emitting elements disposed on the substrate.

Description

Light-emitting module and light-emitting device including the same

[0001] The present invention relates to a light-emitting module and a light-emitting device including the same, and more specifically, to a light-emitting module including a plurality of light-emitting elements and a light-emitting device including the same.

[0002] Light-emitting diodes (LEDs) are widely used recently as a type of light source. LEDs utilize the properties of compound semiconductors to convert electrical signals into forms of light such as infrared, visible light, and ultraviolet light.

[0003] As the light efficiency of light-emitting diodes increases, light-emitting devices are being applied in various fields, including display devices, lighting fixtures, and automotive lamps.

[0004] Recently, smart televisions, VR (Virtual Reality), and AR ( Augmented Reality) utilize light-emitting diodes to display images. Meanwhile, as the demand for high-quality displays increases, there is a growing need for low power consumption and fast response speeds.

[0005] In particular, display devices in which LEDs are placed on transparent substrates or flexible substrates are also being actively developed recently.

[0006] The present invention can provide a light-emitting module capable of ensuring sufficient transparency and a light-emitting device including the same.

[0007] An embodiment of the present invention can provide a light-emitting module with a high color reproduction rate using red, green, and blue light-emitting elements, and a light-emitting device including the same.

[0008] An embodiment of the present invention can provide a light-emitting module with improved driving reliability by reducing heat generation of a plurality of light-emitting elements, and a light-emitting device including the same.

[0009] Embodiments of the present invention can provide a light-emitting module and a light-emitting device including the same, in which structural stability can be improved even in a flexible structure.

[0010] In addition, embodiments of the present invention can provide a light-emitting module and a light-emitting device including the same, which can prevent the light-emitting element from falling off or the solder for mounting the light-emitting element from being damaged when a flexible substrate is bent.

[0011] Embodiments of the present invention can provide a light-emitting module capable of improving reliability in a flexible structure and a light-emitting device including the same.

[0012] Embodiments of the present invention can provide a light-emitting module capable of preventing short circuits in a flexible structure and a light-emitting device including the same.

[0013] A light-emitting module according to one embodiment of the present invention includes a substrate and a plurality of light-emitting elements disposed on the substrate, and the spacing between the plurality of light-emitting elements may be 50 μm or more.

[0014] In one embodiment, the substrate may be a light-transmitting substrate.

[0015] In one embodiment, the light-emitting module may further include a plurality of IC drivers disposed on the substrate to drive the plurality of light-emitting elements.

[0016] In one embodiment, the spacing between the plurality of light-emitting elements may be 10 times or more the length of one side of one of the plurality of light-emitting elements.

[0017] In one embodiment, the spacing between the plurality of IC drivers may be at least 10 times the length of one side of one of the plurality of IC drivers.

[0018] In one embodiment, the area of ​​the placement region in which the plurality of light-emitting elements and the plurality of IC drivers are placed on the substrate may be 25% or less of the total area of ​​the substrate.

[0019] In one embodiment, the device may further include a common wiring disposed on one surface of the substrate and connected in common to the plurality of light-emitting elements, and a plurality of auxiliary wirings each connected to the plurality of light-emitting elements.

[0020] In one embodiment, the thickness of the auxiliary wiring may be 0.25 times or less the side length of one of the plurality of light-emitting elements.

[0021] In one embodiment, the plurality of light-emitting elements may be disposed on one side of the substrate, and the plurality of IC drivers may be disposed on the other side of the substrate.

[0022] In one embodiment, at least one of the plurality of light-emitting elements may be stacked vertically with one of the plurality of IC drivers.

[0023] In one embodiment, the light-emitting module may further include a light path control layer disposed in at least a portion of one surface of the substrate.

[0024] In one embodiment, the optical path control layer may include a cloaking layer for concealing the plurality of light-emitting elements and the plurality of IC drivers so that they are not visible to the naked eye.

[0025] In one embodiment, when the number of the plurality of IC drivers is X (where X is a natural number greater than or equal to 1), the number of the plurality of light-emitting elements may be X*Y (where Y is a natural number greater than or equal to 2).

[0026] In one embodiment, the area of ​​the solder for mounting the light-emitting element on the substrate may be 25% to 50% of the area of ​​the light-emitting element.

[0027] In one embodiment, the thickness of the solder may be 5 μm or more.

[0028] In one embodiment, one of the plurality of light-emitting elements may include a semiconductor layer comprising a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer, and a plurality of electrode pads connected to the semiconductor layer.

[0029] In one embodiment, the spacing between the electrode pads between two adjacent light-emitting elements may be 70 μm or more.

[0030] In one embodiment, the spacing between the plurality of electrode pads may be 50 μm or more.

[0031] In one embodiment, one of the plurality of light-emitting elements may include a plurality of light-emitting stacks vertically stacked and emitting light of different peak wavelengths, a common electrode pad connected to the plurality of light-emitting stacks in common, and a plurality of individual electrode pads each connected to the plurality of light-emitting stacks.

[0032] In one embodiment, the light-emitting stack may include a first conductive semiconductor layer, an active layer disposed in a portion of the upper surface of the first conductive semiconductor layer, a second conductive semiconductor layer disposed on the active layer, an insulating layer covering the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer, a first electrode pad disposed on the insulating layer and connected to the first conductive semiconductor layer exposed through a first opening of the insulating layer, and a second electrode pad disposed on the insulating layer and connected to the second conductive semiconductor layer exposed through a second opening of the insulating layer.

[0033] In one embodiment, the diameters of the first opening and the second opening may each be at least 15% of the diameters of the first electrode pad and the second electrode pad.

[0034] A light-emitting module according to one embodiment of the present invention comprises a substrate, a plurality of light-emitting elements disposed on the substrate, and a plurality of IC drivers disposed on the substrate to drive the plurality of light-emitting elements, wherein the spacing between the plurality of light-emitting elements may be 10 times or more the length of one side of the light-emitting element.

[0035] A light-emitting module according to one embodiment of the present invention comprises a substrate and a plurality of light-emitting elements disposed on the substrate, wherein one of the plurality of light-emitting elements comprises a semiconductor layer including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer, an insulating layer covering the semiconductor layer, and a plurality of electrode pads connected to the semiconductor layer through an opening of the insulating layer, and the distance between the electrode pads between two adjacent light-emitting elements may be 70 μm or more.

[0036] The present invention can provide a light-emitting module capable of ensuring sufficient transparency and a light-emitting device including the same.

[0037] An embodiment of the present invention can provide a light-emitting module with a high color reproduction rate using red, green, and blue light-emitting elements, and a light-emitting device including the same.

[0038] An embodiment of the present invention can provide a light-emitting module with improved driving reliability by reducing heat generation of a plurality of light-emitting elements, and a light-emitting device including the same.

[0039] Embodiments of the present invention can provide a light-emitting module and a light-emitting device including the same, in which structural stability can be improved even in a flexible structure.

[0040] In addition, embodiments of the present invention can provide a light-emitting module and a light-emitting device including the same, which can prevent the light-emitting element from falling off or the solder for mounting the light-emitting element from being damaged when the flexible substrate is bent.

[0041] Embodiments of the present invention can provide a light-emitting module capable of improving reliability in a flexible structure and a light-emitting device including the same.

[0042] Embodiments of the present invention can provide a light-emitting module capable of preventing short circuits in a flexible structure and a light-emitting device including the same.

[0043] FIG. 1 is a plan view showing a light-emitting module according to one embodiment of the present invention.

[0044] Figure 2 is an enlarged view showing A of Figure 1.

[0045] FIG. 3 is a side cross-sectional view showing a light-emitting element according to one embodiment of the present invention.

[0046] Figure 4 is a bottom view of the light-emitting element of Figure 3.

[0047] FIG. 5 is a side cross-sectional view showing a part of a light-emitting module according to another embodiment of the present invention.

[0048] Figure 6 is a variation of Figure 5.

[0049] Fig. 7 is another variation of Fig. 5.

[0050] FIG. 8 is a bottom view of a light-emitting element according to another embodiment of the present invention.

[0051] Figure 9 is a cross-sectional view showing the light-emitting element of Figure 8.

[0052] FIG. 10 is a side view showing a light-emitting element according to another embodiment of the present invention.

[0053] Figure 11 is a bottom view of the light-emitting element of Figure 10.

[0054] FIG. 12a is a cross-sectional view in the I-I' direction of FIG. 11.

[0055] FIG. 12b is a cross-sectional view in the II-II' direction of FIG. 11.

[0056] FIG. 13 is a plan view showing a light-emitting module according to another embodiment of the present invention.

[0057] FIG. 14 is a plan view showing a light-emitting module according to another embodiment of the present invention.

[0058] Figure 15 is an enlarged view showing B of Figure 14.

[0059] FIG. 16 is a drawing illustrating a light-emitting module according to another embodiment of the present invention and a vehicle including the same.

[0060] FIG. 17 is a drawing illustrating a light-emitting module and a light-emitting device including the same according to another embodiment of the present invention.

[0061] In the following description, numerous specific details are described for the purpose of explanation and to provide a complete understanding of the various embodiments or implementations of the present disclosure. As used herein, “Embodiments” and “Implementations” are interchangeable terms indicating non-limiting examples of devices or methods utilizing one or more of the concepts of the invention disclosed herein. However, it will be apparent that various embodiments may be implemented without utilizing these specific details or by utilizing one or more equivalent arrangements. In other examples, known structures and devices are illustrated in block diagram form to avoid unnecessarily obscuring the various embodiments. Furthermore, while various embodiments may differ from one another, they do not need to be exclusive. For example, specific shapes, configurations, and characteristics of an embodiment may be used or implemented in other embodiments without departing from the scope of the concept of the invention.

[0062] Unless otherwise specified, the illustrated embodiments should be understood as providing exemplary features of varying details in some ways in which the concept of the present invention can actually be realized. Therefore, unless otherwise specified, features, components, modules, layers, membranes, panels, regions and / or modes of various embodiments (hereinafter referred to individually or collectively as “elements”) may be combined, separated, interchanged, and / or rearranged differently without departing from the scope of the concept of the present invention.

[0063] The use of cross-hatching and / or shading in the attached drawings is generally provided to clarify the boundaries between adjacent elements. As such, the presence or absence of cross-hatching or shading, unless otherwise specified, does not imply or indicate any preference or requirement regarding the specific material, material properties, dimensions, proportions, commonalities between the exemplified elements, or any other features, attributes, and characteristics of the elements. Additionally, in the attached drawings, the size and relative size of the elements may be exaggerated for clarity and / or illustrative purposes. When embodiments are implemented differently, specific process sequences may be performed differently from the described order. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to the described order. Also, the same reference numerals indicate the same elements.

[0064] When an element such as a layer is referred to as being "on", "connected to," or "coupled to" another element or layer, said element may be directly on, connected to, or coupled to the other element or layer, or an interposed element or layer may exist. However, when an element or layer is referred to as being "directly on", "directly connected to," or "directly coupled to" another element or layer, no interposed element or layer exists. To this end, the term "connected" may refer to a physical, electrical, and / or fluid connection with or without an interposed element. Furthermore, the DR1-axis, DR2-axis, and DR3-axis are not limited to the three axes of an orthogonal coordinate system, such as the x, y, and z axes, and may be interpreted in a broader sense. For example, the DR1-axis, DR2-axis, and DR3-axis may be perpendicular to each other, or they may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “one or more of X, Y, and Z” and “one or more selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed articles.

[0065] Although terms such as “first,” “second,” etc., may be used herein to describe various forms of elements, these elements shall not be limited by these terms. These terms are used to distinguish one element from another. Therefore, the first element discussed below may be named the second element without departing from the teachings of the present disclosure.

[0066] Spatially relative terms such as “below,” “under,” “immediately below,” “lower,” “above,” “upper,” “upper,” “higher,” and “side” (e.g., as in “side wall”) may be used for descriptive purposes and thereby to describe the relationship between one element and another element(s) as illustrated in the drawings. Spatially relative terms are intended to include different orientations of the device in use, operation, and / or manufacture in addition to the orientations illustrated in the drawings. For example, if the device in the drawings is inverted, the element described as “below” or “under” another element or feature will be oriented “above” the other element or feature. Therefore, the exemplary term “below” may include both upper and lower orientations. Additionally, the device may be oriented differently (e.g., rotated 90° or oriented in a different orientation), and thus, spatially relative descriptors used herein may also be interpreted accordingly.

[0067] The technical terms used in this specification are intended to describe specific embodiments and are not limiting. The singular form used in this specification also includes the plural form unless the context clearly indicates otherwise. Additionally, the terms “comprising,” “comprising,” “comprising,” and / or “comprising” used in this specification specify the presence of the mentioned features, integers, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Furthermore, the terms “substantially,” “about,” and other similar terms used in this specification are used to indicate approximation rather than degree, and are used to describe inherent deviations of measured, calculated, and / or provided values ​​that may be recognized by a person of ordinary knowledge in the art.

[0068] Various embodiments are described below with reference to cross-sectional and / or exploded drawings, which are schematic examples of idealized embodiments and / or intermediate structures. As such, variations from the shapes in the drawings may be expected, for example, as a result of manufacturing techniques and / or tolerances. Therefore, the embodiments disclosed herein should not be interpreted as being limited to the shapes of specific illustrated regions, but should be interpreted to include, for example, variations in shape resulting from manufacturing. In this way, the regions illustrated in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and thus are not intended to have a limiting meaning.

[0069] As is customary in the art, some embodiments may be illustrated and described in the accompanying drawings in terms of functional blocks, units, and / or modules. Those skilled in the art will understand that these blocks, units, and / or modules are physically implemented by electronic (or optical) circuits, such as logic circuits, discrete components, microprocessors, wiring circuits, memory elements, and wiring connections, formed using semiconductor-based manufacturing technology or other manufacturing technology. Where blocks, units, and / or modules are implemented by microprocessors or other similar hardware, they may be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and may optionally be driven by firmware and / or software. Additionally, each block, unit, and / or module may be implemented by dedicated hardware, or as a combination of dedicated hardware for performing some functions and a processor for performing other functions (e.g., one or more programmed processors and associated circuits). Additionally, each of the blocks, units, and / or modules of some embodiments may be physically separated into two or more interacting and individual blocks, units, and / or modules without departing from the scope of the concept of the present invention. Additionally, the blocks, units, and / or modules of some embodiments may be physically combined into more complex blocks, units, and / or modules without departing from the scope of the concept of the present invention.

[0070] Unless otherwise defined, all terms used herein (including technical or scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with that meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this specification.

[0071] The present invention may provide a light-emitting module comprising a substrate and a plurality of light-emitting elements disposed on the substrate. The light-emitting module may further include a plurality of IC drivers disposed on the substrate to drive the plurality of light-emitting elements. Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the attached drawings.

[0072] FIG. 1 illustrates a light-emitting module (100) according to an embodiment of the present invention, and FIG. 2 is an enlarged view showing A of FIG. 1. Referring to FIG. 1 and FIG. 2, a light-emitting module (100) according to an embodiment of the present invention may include a substrate (110) and a plurality of light-emitting elements (120) disposed on the substrate (110). The light-emitting module (100) may further include a plurality of IC drivers (130) disposed on the substrate (110) to drive the plurality of light-emitting elements (120).

[0073] The above substrate (110) can be configured in various ways to support the light-emitting element (120). For example, the above substrate (110) may be a light-transmitting substrate. Specifically, the above substrate (110) may include a base material capable of transmitting light, such as glass, transparent plastic, or a transparent film.

[0074] Additionally, the substrate (110) may be a transparent and flexible substrate. For example, the substrate (110) may be a substrate comprising glass, sapphire, polyimide, acrylic such as PMMA (Polymethyl Methacrylate), PC (Polycarbonate) resin, COP (Cyclo Olefin Polymer), acrylic resin, PE (Polyethylene), or epoxy resin, which have light-transmitting properties. Alternatively, the substrate (110) may be made of materials such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), PVB, or ultra-thin glass (UTG), which have bendable properties.

[0075] FIG. 1 illustrates an example in which the substrate (110) has a rectangular shape, but the present invention is not limited thereto.

[0076] The light-emitting module (100) may include a metal pattern disposed on one side of the substrate (110). The metal pattern may be disposed on only one side of the substrate (110) or on both sides. A light-emitting element (120) may be mounted on the metal pattern.

[0077] The above metal pattern can be composed of various materials. The above metal pattern has a resistivity of 1×10 -4 It may be made of a material having a resistivity of Ω·cm or less. More preferably, the metal pattern has a resistivity of 3×10 -6It may include materials with a Ω·cm or lower. For example, the metal pattern may be made of metal materials such as Cu, Au, AuSn, Fe, Al, Ag, W, etc. In addition, the metal pattern may be made of a transparent electrode made of a compound of the metal or an oxide such as indium tin oxide (ITO) or manganese oxide, PEDOT, silver nanowire, or nanowire such as carbon nanotube.

[0078] In addition, the metal pattern can reduce interference or increase transparency by thinly arranging the metal material. For example, the metal pattern can ensure light transmittance and electrical conductivity by using a metal mesh. In this case, to ensure light transmittance, the width of the metal pattern may be 50 μm or less. In addition, the spacing between the wires of the metal pattern may be 50 μm or more. For example, the spacing between the wires of the metal pattern may be 200 μm.

[0079] In addition, the metal pattern may be made of a transparent electrode having transmittance, such as indium tin oxide (ITO), ZnO, aluminum-doped zinc oxide (AZO), or gallium-doped zinc oxide (GZO), in order to increase transparency.

[0080] The metal patterns may be provided in multiple numbers, and one of the metal patterns may be made of a different material from the other metal patterns. Additionally, the widths of the metal patterns may be the same or different from each other. The area or thickness of the metal patterns may be designed considering the power consumption of the light-emitting element connected to the metal patterns. For example, the width of a metal pattern connected to one light-emitting element (120) may be narrower than the width of a conductive pattern connected to multiple light-emitting elements (120). Additionally, the metal patterns may be spaced apart from each other in a vertical direction for complex connections. The conductive patterns may be placed on different layers of the substrate (110).

[0081] Some of the metal patterns may have a potential difference. The on / off operation of the light-emitting element (120) can be controlled by adjusting the potential difference. For operation control, some of the metal patterns may serve as the drain and gate of the light-emitting element (120). Some regions of the metal patterns may include a thin-film transistor (TFT) circuit.

[0082] The light-emitting element (120) can be configured in various ways as a light source disposed on the upper surface of the substrate (110). For example, the light-emitting element (120) may be a light-emitting diode including a semiconductor layer formed on a growth substrate.

[0083] The growth substrate is not limited to a specific substrate as long as it is a substrate capable of growing a nitride-based semiconductor, and may include heterogeneous substrates such as, for example, a sapphire substrate, a gallium arsenide substrate, a silicon substrate, a silicon carbide substrate, or a spinel substrate, and may also include homogeneous substrates such as a gallium nitride substrate or an aluminum nitride substrate. The growth substrate may be removed after the semiconductor layer is grown.

[0084] The light-emitting element (120) may include a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer and generating light.

[0085] The first conductivity type semiconductor layer may be a semiconductor layer grown on one side of a growth substrate, and a buffer layer (not shown) may be additionally formed between the first conductivity type semiconductor layer and the growth substrate.

[0086] The first conductivity type semiconductor layer may include a phosphide or nitride-based semiconductor such as (Al, Ga, In)P or (Al, Ga, In)N, and may be formed by growing on a growth substrate using methods such as MOCVD, MBE, HVPE, etc. Additionally, the first conductivity type semiconductor layer may be doped as n-type by including one or more impurities such as Si, C, Ge, Sn, Te, Pb, etc. However, not limited thereto, the first conductivity type semiconductor layer may be doped as an opposite conductivity type by including a p-type dopant.

[0087] Furthermore, the first conductivity semiconductor layer may be composed of a single layer or multiple layers. Furthermore, the first conductivity semiconductor layer may additionally include a contact layer, a modulation doping layer, an electron injection layer, etc.

[0088] The above active layer is a light-emitting layer disposed on one surface of a first conductivity-type semiconductor layer, and may include a phosphide or nitride semiconductor such as (Al, Ga, In)P or (Al, Ga, In)N, and may be grown on the first conductivity-type semiconductor layer using a technology such as MOCVD, MBE, or HVPE.

[0089] Additionally, the active layer may include a quantum well structure (QW) comprising at least two barrier layers and at least one well layer, and furthermore, may include a multiple quantum well structure (MQW) comprising a plurality of barrier layers and a plurality of well layers.

[0090] The wavelength of light emitted from the active layer can be controlled by controlling the composition ratio of the material constituting the well layer. In this case, the well layer may commonly contain the same element, and may include, for example, In.

[0091] The second conductivity semiconductor layer may be a semiconductor layer disposed on one side of the active layer. The second conductivity semiconductor layer may include a phosphide-based or nitride-based semiconductor such as (Al, Ga, In)P or (Al, Ga, In)N, and may be grown using techniques such as MOCVD, MBE, or HVPE. The second conductivity semiconductor layer may be doped with a conductivity type opposite to that of the first conductivity semiconductor layer. For example, the second conductivity semiconductor layer may be doped with a p-type by including impurities such as Mg.

[0092] The above second conductivity type semiconductor layer may be formed as a single layer having a composition such as p-GaN, but is not limited thereto, and may further include an AlGaN layer internally.

[0093] Additionally, the light-emitting element (120) may further include an insulating layer covering the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer, and first and second electrode pads connected to the first conductive semiconductor layer and the second conductive semiconductor layer, respectively, through an opening provided in the insulating layer. The first electrode pad is disposed on the insulating layer and may be connected to the first conductive semiconductor layer exposed through the first opening of the insulating layer. The second electrode pad is disposed on the insulating layer and may be connected to the second conductive semiconductor layer exposed through the second opening of the insulating layer.

[0094] At this time, the diameters of the first opening and the second opening may each be at least 15% of the diameters of the first electrode pad and the second electrode pad. The areas of the first opening and the second opening may each be at least 25% of the areas of the first electrode pad and the second electrode pad.

[0095] The first and second electrode pads may be electrically connected to the substrate (110) through a connecting electrode. However, the embodiments of the present invention are not limited thereto, and the electrode pads may be connected to the metal pattern of the substrate (110) through a bonding material by forming bumps on the electrode pads without a connecting electrode, or the electrode pads may be electrically connected to the metal pattern of the substrate (110) through soldering. Of course, various other mounting methods are also possible.

[0096] The first and second electrode pads have a resistivity of 1×10 to supply current to the first and second conductivity type semiconductor layers of the light-emitting element (120). -4 It may include materials with a Ωcm or lower. To satisfy these conditions, the electrode pad may be made of metal materials such as copper, gold, silver, tin, iron, or aluminum. Alternatively, the electrode pad may be made of a transparent electrode composed of a compound of the metal or an oxide such as indium tin oxide (ITO) or manganese oxide, a conductive polymer (PEDOT:PSS, Poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate)), a silver nanowire, or a carbon nanotube.

[0097] Meanwhile, the first conductivity semiconductor layer, the active layer, and the second conductivity semiconductor layer form a single light-emitting stack, and the light-emitting element (120) may include a single light-emitting stack or a plurality of light-emitting stacks. Alternatively, the single light-emitting element (120) may be composed of a plurality of light-emitting diodes. For example, the light-emitting element (120) may include a plurality of light-emitting diodes having three or more different frequencies. For example, the first light-emitting diode may have a frequency between 400 nm and 470 nm, the second light-emitting diode may have a frequency between 600 nm and 700 nm, and the third light-emitting diode may have a frequency between 500 nm and 540 nm. In this way, when using a plurality of light-emitting diodes having three different frequencies, it is possible to express various colors through color mixing as well as the three primary colors of light, and the quality of the image can be improved.

[0098] Additionally, the peak wavelength of light emitted from each light-emitting element (120) may be the same or different from one another. Alternatively, the light-emitting elements (120) may be composed of elements that emit light of the same color range, for example, the difference in dominant wavelength between adjacent light-emitting elements (120) may be 2 nm to 15 nm. This allows for the realization of more vivid colors.

[0099] For example, one of the light-emitting elements (120) is a diode that emits blue light (Blue), and may be a blue light-emitting diode having a peak wavelength within the blue wavelength region, and the difference between the peak wavelength and the dominant wavelength of the blue light-emitting diode may be between 2 nm and 15 nm. Specifically, the blue light-emitting diode may have a peak wavelength between 430 nm and 475 nm and a dominant wavelength between 460 nm and 480 nm. Maintaining the difference in wavelengths reduces color deviation, making it possible to achieve a clearer color expression. The peak wavelength of the blue light-emitting diode may be shorter than the dominant wavelength. This allows for increased light energy while correcting visual sensitivity, thereby reducing the difficulty of design.

[0100] One of the light-emitting elements (120) is a diode that emits green light (Green), and may be a green light-emitting diode having a peak wavelength within the green wavelength range, and the difference between the peak wavelength and the frequency of the green light-emitting diode may be between 5 and 20 nm. Specifically, the green light-emitting diode may have a peak wavelength between 510 nm and 540 nm and a main wavelength between 525 nm and 545 nm. Maintaining the difference in frequency reduces color deviation, making it possible to achieve a clearer color expression. The peak wavelength of the green light-emitting diode may be shorter than the main wavelength. This allows for increased light energy while correcting visual sensitivity, thereby reducing the difficulty of design.

[0101] One of the light-emitting elements (120) is a diode that emits red light (Red), and may be a red light-emitting diode having a peak wavelength within the red wavelength region, and the difference between the peak wavelength and the main wavelength of the red light-emitting diode may be between 5 and 30 nm. Specifically, the red light-emitting diode may have a peak wavelength between 620 nm and 640 nm and a main wavelength between 600 nm and 630 nm. Maintaining the difference in wavelengths reduces color deviation, making it possible to achieve a clearer color expression. The peak wavelength of the red light-emitting diode may be longer than the main wavelength. This allows for increased light energy while correcting visual sensitivity, thereby reducing the difficulty of design.

[0102] The light-emitting element (120) may be configured to emit orange light, yellow light, purple light, or ultraviolet light in addition to blue light, green light, and red light. The light-emitting element (120) may further include a wavelength conversion material for emitting light of various colors.

[0103] The light-emitting element (120) may have various shapes, and may be formed in a rectangular shape, for example, as shown in FIG. 2. The light-emitting element (120) may have a square shape or a rectangular shape having a long side and a short side. For example, the light-emitting element (120) may have a rectangular shape in which the length of the side parallel to the first direction is L1 and the length of the side parallel to the second direction perpendicular to the first direction is L2. L1 and L2 may be 250 μm or less. Or L1 and L2 may be 100 μm or less. The length of the longest side of the light-emitting element (120) may be 250 μm or less. For example, L1 and L2 may be 225 μm.

[0104] A plurality of light-emitting elements (120) may be arranged in various patterns on the upper surface of the substrate (110). For example, as shown in FIGS. 1 and 2, the light-emitting elements (120) may be arranged in a matrix form along the first direction and the second direction. For example, three light-emitting elements (120) each emitting red, green, and blue light may be arranged at regular intervals to form a group or pixel. The light-emitting elements (120) can reproduce light with a wide color range using red, green, and blue light. As another example, a pixel may be formed by including three light-emitting stacks that are vertically stacked, each emitting red, green, and blue light. As another example, a single light-emitting element (120) may each emit red, green, and blue light and may comprise a single pixel including horizontally arranged subpixels.

[0105] Referring to FIG. 2, the spacing (S1, S2) between the plurality of light-emitting elements (120) may be at least 10 times the length of one side (L1, L2) of the light-emitting element (120). For example, when the length of one side (L1, L2) of the light-emitting element (120) is 250 μm, the spacing (S1, S2) between the light-emitting elements (120) may be at least 2.5 mm. The transparency of the light-emitting module (100) can be secured by arranging the light-emitting elements (120) at a sufficiently wide spacing.

[0106] FIG. 3 illustrates a light-emitting element (120) according to an embodiment of the present invention. Referring to FIG. 3, the light-emitting element (120) may include a plurality of light-emitting stacks (301, 302, 303) stacked vertically. The plurality of light-emitting stacks (301, 302, 303) may emit light of different peak wavelengths.

[0107] The light-emitting element (120) may include a first light-emitting stack (301), a second light-emitting stack (302) disposed on one side of the first light-emitting stack (301), and a third light-emitting stack (303) disposed on one side of the second light-emitting stack (302).

[0108] Each of the first to third light-emitting stacks (301, 302, 303) may include a first conductivity semiconductor layer, an active layer, and a second conductivity semiconductor layer. Additionally, the light-emitting element (120) may include an adhesive layer, an insulating layer, and electrode pads for bonding the first to third light-emitting stacks (301, 302, 303). FIG. 4 illustrates one side of the light-emitting element (120) of FIG. 3, in which electrode pads (PD1, PD2, PD3, PD4) of the light-emitting element (120) may be arranged.

[0109] The electrode pads (PD1, PD2, PD3, PD4) may include a common electrode pad (PD1) that is commonly connected to a plurality of light-emitting stacks (301, 302, 303), and a plurality of individual electrode pads (PD2, PD3, PD4) that are each connected to the plurality of light-emitting stacks (301, 302, 303). The plurality of light-emitting stacks (301, 302, 303) may be electrically connected to a substrate (110) through the plurality of electrode pads (PD1, PD2, PD3, PD4).

[0110] The electrode pads (PD1, PD2, PD3, PD4) may have various shapes, for example, may have an overall rectangular planar shape. For example, the side length (P1, P2) of the electrode pads (PD1, PD2, PD3, PD4) may be 75 μm or less. For example, the side length (P1, P2) of the electrode pads (PD1, PD2, PD3, PD4) may be 72.5 μm. To maintain transparency, the area of ​​the electrode pads (PD1, PD2, PD3, PD4) may be less than 40% of the area of ​​the light-emitting element (120). However, to prevent the light-emitting element (120) from falling off due to external impact, the area of ​​the electrode pads (PD1, PD2, PD3, PD4) may have an area of ​​at least 20% of the area of ​​the light-emitting element (120).

[0111] In addition, the spacing (G1, G2) between the electrode pads (PD1, PD2, PD3, PD4) within the light-emitting element (120) may be 45 μm or more. For example, the spacing (G1, G2) may be 50 μm. This prevents short circuits between each electrode pad (PD1, PD2, PD3, PD4), thereby improving reliability.

[0112] The first to third light-emitting stacks (301, 302, 303) may each be a light-emitting stack that emits red light, a light-emitting stack that emits green light, and a light-emitting stack that emits blue light. Accordingly, a stacked light-emitting element (120) comprising the first to third light-emitting stacks (301, 302, 303) can display the RGB primary colors as pixels.

[0113] However, the light-emitting element (120) is not limited to a specific structure and can be implemented by modifying it into various structures. It is obvious that the light-emitting element (120) can be modified into various structures such as flip-chip type, vertical type, and horizontal type. In addition, depending on the shape of the light-emitting element (120), the growth substrate may be omitted.

[0114] Referring again to FIGS. 1 and FIGS. 2, the light-emitting module (100) may further include a plurality of IC drivers (130) for driving the plurality of light-emitting elements (120) disposed on the substrate (110). The IC drivers (130) may be disposed in various numbers at various locations on the substrate (110). The IC drivers (130) may be disposed on the side of the substrate (110) where the light-emitting elements (120) are disposed, or on the opposite side thereof. Additionally, a connector connection part (CN) for connecting the IC drivers (130) and a processor may be disposed on one side of the edge of the substrate (110).

[0115] The IC driver (130) can be configured in various ways to drive the plurality of light-emitting elements (120). The IC driver (130) can provide the necessary current and voltage to the light-emitting elements (120) and control on / off operations. The IC driver (130) can be connected to a processor through a connector connection part (CN).

[0116] The IC driver (130) may have a rectangular shape in a planar form. For example, the IC driver (130) may have a rectangular shape in which the length of the side parallel to the first direction is L3 and the length of the side parallel to the second direction perpendicular to the first direction is L4. L3 and L4 may be 650 μm or less. The specifications of the IC driver (130) may be configured in various ways according to the design and are not limited to a specific size. At this time, the length of the long side of the light-emitting element (120) may be 650 μm or less. For example, L1 and L2 may be 600 μm.

[0117] The IC drivers (130) may be arranged in various patterns on one side of the substrate (110). For example, as shown in FIGS. 1 and 2, the IC drivers (130) may be arranged in a matrix form along the first direction and the second direction, but are not limited thereto.

[0118] At this time, the spacing (S3) between the plurality of IC drivers (130) may be at least 10 times the length of one side (L3, L4) of the plurality of IC drivers (130). For example, if the length of one side (L3, L4) of the IC driver (130) is 400 µm, the spacing (S3) of the IC driver (130) may be at least 4 mm. The plurality of IC drivers (130) may be spaced apart with respect to the first direction or the second direction. The spacing (S3) between adjacent IC drivers (130) with respect to the first direction or the second direction may be at least 4 mm. Transparency of the light-emitting module (100) can be secured by arranging the IC drivers (130) at a sufficiently wide spacing.

[0119] The area of ​​the IC driver (130) may be larger than the area of ​​the light-emitting element (120). For example, the area of ​​the IC driver (130) may be at least seven times the area of ​​the light-emitting element (120), but this is merely an example and the present invention is not limited thereto.

[0120] To ensure transparency, the IC driver (130) can drive a plurality of light-emitting elements (120). Each IC driver (130) can be connected to a plurality of light-emitting elements (120). Consequently, the number of the plurality of IC drivers (130) placed on the substrate (110) may be less than the number of the plurality of light-emitting elements (120). For example, each of the plurality of IC drivers (130) can be connected to Y light-emitting elements (120) (Y is a natural number greater than or equal to 2). One IC driver (130) can be connected to Y light-emitting elements (120) to drive Y light-emitting elements (120).

[0121] When the number of the plurality of IC drivers (130) is X (where X is a natural number greater than or equal to 1), the number of the plurality of light-emitting elements (120) may be X*Y (where Y is a natural number greater than or equal to 2). One IC driver (130) and Y light-emitting elements (120) connected thereto may constitute one light-emitting unit (U). The light-emitting units (U) may be arranged along a first direction and a second direction. By arranging the number of IC drivers (130) that are relatively large in size less than the number of light-emitting elements (120), the transparency and flexibility of the light-emitting module (100) can be maintained.

[0122] For example, referring to FIG. 2, one IC driver (130) may be connected to four light-emitting elements (120). The IC driver (130) may be surrounded by Y connected light-emitting elements (120). The IC driver (130) may be placed in the inner center of a rectangular area formed by the four light-emitting elements (120). However, the present invention is not limited thereto, and the IC driver (130) may be placed in a part of the light-emitting module (100) spaced apart from the light-emitting elements (120).

[0123] The area of ​​the placement region (in this case, an opaque region) in which the plurality of light-emitting elements (120) and the plurality of IC drivers (130) are placed on the substrate (110) may be 25% or less of the total area. In particular, the area of ​​the placement region (in this case, an opaque region) occupied by the light-emitting elements (120) and one IC driver (130) within one light-emitting unit (U) may be 25% or less of the area of ​​the light-emitting unit (U). The area of ​​the IC driver (130) may be 1.8 times or less the area occupied by the Y light-emitting elements (120) connected to the IC driver (130). More preferably, the area of ​​the IC driver (130) may be 1.4 times or less the area occupied by the Y light-emitting elements (120) connected to the IC driver (130). Additionally, to ensure transparency, the spacing (S3) between IC drivers (130) may be larger than the spacing (S1, S2) between light-emitting elements (120). This prevents the transparency from being reduced by IC drivers (130) with a wide placement area. Furthermore, this ensures that the flexibility of the light-emitting module (100) is not compromised.

[0124] Meanwhile, the gap (M) between the IC driver (130) and the adjacent light-emitting element (120) may be 70 μm or more. Preferably, the gap (M) may be 70 μm or more.

[0125] The electrode pads (PD1, PD2, PD3, PD4) of the light-emitting element (120) may be electrically connected to a metal pattern disposed on one surface of the substrate (110). Referring to FIG. 2, the metal pattern may include a common wiring (140) that is commonly connected to a plurality of light-emitting elements (120), and a plurality of auxiliary wirings (161, 162, 163, 164) that are each connected to the plurality of light-emitting elements (120).

[0126] The above common wiring (140) is connected to an external processor through a connector connection part (CN) disposed on one side of the substrate (110), and may be wiring for providing a common negative or a common power supply (Vcc).

[0127] The common wiring (140) may be positioned outside the edge of the substrate (110). More specifically, the common wiring (140) may be extended along a first direction (or a second direction) outside the edge of one side of the substrate (110).

[0128] The above common wiring (140) may be provided in multiple numbers. When the above common wiring (140) is formed to extend along a first direction, the multiple common wirings (140) may be spaced apart and arranged along a second direction. A light-emitting element (120) and an IC driver (130) may be arranged between the above common wirings (140). The distance (K) from the IC driver (130) to the above common wiring (140) may be 1.5 times or more and 2 times or less than the length (L3, L4) of one side of the IC driver (130). For example, when the length (L3, L4) of one side of the IC driver (130) is 650 µm, the distance (K) to the common wiring (140) may be 1.7 mm or less. For example, the distance (K) may be 1.6 mm or less.

[0129] Since the common wiring (140) is connected to a plurality of light-emitting elements (120) and a plurality of IC drivers (130), its thickness may be relatively thick. For example, the thickness of the common wiring (140) may be thicker than the side lengths (L1, L2) of the light-emitting elements (120). The thickness of the common wiring (140) may be 350 μm. Accordingly, based on one light-emitting unit (U), the common wiring (140) may be placed on the outside of the light-emitting unit (U). This prevents the relatively thick common wiring (140) from obscuring the light-emitting area of ​​the light-emitting unit (U).

[0130] The auxiliary wiring (161, 162, 163, 164) may be wiring connected to the light-emitting element (120). The thickness of the auxiliary wiring (161, 162, 163, 164) may be thinner than the thickness of the common wiring (140). For example, the thickness of the auxiliary wiring (161, 162, 163, 164) may be 0.25 times or less the side length (L1, L2) of the light-emitting element (120). As another example, the thickness of the auxiliary wiring (161, 162, 163, 164) may be 0.5 times or less the side length (P1, P2) of the electrode pads (PD1, PD2, PD3, PD4) of the light-emitting element (120).

[0131] The above auxiliary wiring (161, 162, 163, 164) is wiring placed adjacent to the light-emitting element (120), and transparency can be secured by making its thickness thin within the light-emitting unit (U), which is a transparent area. In addition, this can minimize the influence on the bending radius of the light-emitting module (100).

[0132] One of the auxiliary wires (161, 162, 163, 164) connected to a single light-emitting element (120) may be a branch wire branched from the common wire (140). The remaining auxiliary wires (162, 163, 164) may be connecting wires connecting the IC driver (130) and the light-emitting element (120). For example, when the light-emitting element (120) of FIG. 3 is placed on the substrate (110), the branch wire may be connected to the common electrode pad (PD1) of the light-emitting element (120), and the connecting wires may be connected to the individual electrode pads (PD2, PD3, PD4) of the light-emitting element (120).

[0133] Two of the above auxiliary wires (161, 162, 163, 164) may be arranged parallel to each other in a first direction in at least some sections. The second direction gap (D2) between the two auxiliary wires (161, 162, 163, 164) arranged parallel to each other in the first direction may be larger than the length of one side (L1, L2) of the light-emitting element (120). For example, when the light-emitting element (120) is 225 μm, the second direction gap (D2) between the two auxiliary wires (161, 162, 163, 164) may be 0.6 mm or less. For example, the second direction gap (D2) may be 0.58 mm.

[0134] Additionally, two of the auxiliary wires (161, 162, 163, 164) may be arranged parallel to each other in a second direction in at least some sections. The first direction gap (D1) between the two auxiliary wires (161, 162, 163, 164) arranged parallel to each other in the second direction may be smaller than the second direction gap (D2). For example, the first direction gap (D1) may be 0.13 mm or less. For example, the first direction gap (D1) may be 0.122 mm.

[0135] Meanwhile, the common wiring (140) or auxiliary wiring (161, 162, 163, 164) may be placed on one or both sides of the substrate (110). This simplifies complex wiring connections and improves transparency.

[0136] The above common wiring (140) can also be connected to the IC driver (130) through additional auxiliary wiring. Additionally, the metal pattern may further include signal wiring (152, 154) for transmitting control signals and clock signals to the IC driver (130).

[0137] FIGS. 1 and FIGS. 2 illustrate an example in which the light-emitting element (120) and the IC driver (130) are placed on the same surface of the substrate (110), but are not limited thereto. It is also possible for the light-emitting element (120) and the IC driver (130) to be placed on different surfaces of the substrate (110).

[0138] Next, FIG. 5 illustrates a light-emitting module (200) according to another embodiment of the present invention, wherein the light-emitting module (200) may include a substrate (210), light-emitting elements (220) disposed on one surface of the substrate (210), and a plurality of IC drivers (230) disposed on one surface of the substrate (210). The substrate (210) may be a transparent substrate.

[0139] The light-emitting module (200) above may be configured to be identical or similar to the light-emitting module (100) of FIGS. 1 and 2, except that it further includes a light path layer (290), so the description of the overlapping configuration is omitted. E in FIG. 5 is a conductive pattern and may likewise be configured to be identical or similar to the conductive pattern of FIG. 2, so a detailed description is omitted.

[0140] The optical path control layer (290) is a layer disposed in at least a portion of one surface of the substrate (210), and may be disposed on the opposite side of the substrate (210) where the light-emitting element (220) and IC driver (230) are disposed. Light emitted from the light-emitting element (220) may pass through the substrate (210) and be emitted to the outside through the optical path control layer (290).

[0141] For example, the optical path control layer (290) may include a cloaking layer to conceal the plurality of light-emitting elements (220) and the plurality of IC drivers (230) so that they are not visible to the naked eye. The cloaking layer may refract light so that the background behind the light-emitting elements (220) and IC drivers (230) appears on the surface of the cloaking layer. Accordingly, when viewed from the side of the cloaking layer, the light-emitting elements (220) and IC drivers (230) behind the cloaking layer may not be visible to the naked eye. Through this, the light-emitting module (200) can be implemented transparently.

[0142] As another example, the light path control layer (290) may include a liquid crystal layer that switches between a transparent state and an opaque state. The liquid crystal layer may be a PDLC (Polymer Dispersed Liquid Crystal) film in which a polymer liquid crystal is dispersed between two ITO films. Depending on power on / off, the liquid crystal layer may switch between a transparent state and an opaque state. Accordingly, the light-emitting module (200) can be utilized as a transparent display if necessary.

[0143] As another example, the optical path control layer (290) may include at least one of a coating layer, a lens, and a light absorption layer.

[0144] Next, FIG. 6 illustrates a light-emitting module (300) according to another embodiment of the present invention, wherein the light-emitting module (300) may include a substrate (310), light-emitting elements (320) disposed on one surface of the substrate (310), and a plurality of IC drivers (330) disposed on one surface of the substrate (310). The substrate (310) may be a transparent substrate.

[0145] The light-emitting module (300) above can be configured to be identical or similar to the light-emitting module (100) of FIGS. 1 and 2, except that the light-emitting element (320) and the IC driver (330) are vertically stacked and arranged; therefore, the description of the overlapping configuration is omitted. E in FIG. 6 is a conductive pattern, and likewise can be configured to be identical or similar to the conductive pattern of FIG. 2; therefore, a detailed description is omitted.

[0146] In FIG. 6, at least one of the plurality of light-emitting elements (320) may be stacked vertically with the IC driver (330). FIG. 6 illustrates an example in which the IC driver (330) is positioned above the light-emitting element (320), but it is also possible to have an example in which the light-emitting element (320) is positioned above the IC driver (330). This allows for greater transparency of the light-emitting module (300).

[0147] Next, FIG. 7 illustrates a light-emitting module (400) according to another embodiment of the present invention, wherein the light-emitting module (400) may include a substrate (410), light-emitting elements (420) disposed on one surface of the substrate (410), and a plurality of IC drivers (430) disposed on one surface of the substrate (410). Since the light-emitting module (400) may be configured identically or similarly to the light-emitting module (100) of FIG. 1 and FIG. 2 except that the light-emitting elements (420) and the IC drivers (430) are disposed on different surfaces of the substrate (410), the description of the overlapping configuration is omitted. E in FIG. 7 is a conductive pattern, and since it may be configured identically or similarly to the conductive pattern of FIG. 2, a detailed description is omitted.

[0148] In FIG. 7, the plurality of light-emitting elements (420) may be placed on one side of the substrate (410), and the plurality of IC drivers (430) may be placed on the other side of the substrate (410). The light-emitting elements (420) and IC drivers (430) placed on different sides of the substrate (410) may be stacked vertically. This allows for greater transparency of the light-emitting module (400).

[0149] The light-emitting modules (100, 200, 300, 400) of the above-described embodiment include a light-transmitting substrate (110, 210, 310, 410), and the geometric transparency (TP) of the light-emitting modules (100, 200, 300, 400) may be 50% or more. The geometric transparency (TP) can be calculated by the following formula (1).

[0150]

[0151] Here, the unit area may be the area of ​​a region including sets of light-emitting units (U) connected to a connector connection part (CN). The transparency (TP) may be a unitless value between 0 and 1, and the closer the transparency (TP) is to 1, the more transparent it may be evaluated.

[0152] Additionally, the geometric transparency (TP) of a single light-emitting unit (U) may be higher than the geometric transparency (TP) of sets of light-emitting units (U) including a connector connection (CN). To this end, the common wiring (140) may be placed on the outside of the light-emitting unit (U). This increases the light transmittance of the light-emitting area, thereby increasing visual transparency.

[0153] As a modified example of the light-emitting module (100) of FIGS. 1 and FIG. 2 described above, the substrate (110) may be a transparent or opaque flexible substrate. The substrate (110) is flexible and configured to support a light-emitting element (120), and may be, for example, a flexible printed circuit board (FPCB). The flexible substrate (110) may be composed of polymer plastics such as polyimide (PI) or polyester film, but is not limited thereto.

[0154] The above substrate (110) is relatively thin and flexible, so that a display with space saving or a natural viewing angle can be implemented. The above substrate (110) may be a substrate that is flexible and has light-transmitting properties.

[0155] Specifically, the substrate (110) may be made of various materials such as PC (Polycarbonate), PES (Polyether Sulfone), PET (Polyethylene Terephthalate), PEN (Polyethylene Naphthalate), PI (Polyimide), PAR (Polyarylate), COC (Cyclo Olefin), composite material (FPR, Glass Fiber Reinforced Plastic), and polymethyl methacrylate (PMMA, Polymethyl methacrylate).

[0156] Additionally, the spacing (S1, S2) between the plurality of light-emitting elements (120) may be 50 μm or more and 250 μm or less. Specifically, the plurality of light-emitting elements (120) may be spaced apart with respect to the first direction or the second direction. The spacing (S1, S2) between adjacent light-emitting elements (120) with respect to the first direction or the second direction may be 50 μm or more and 250 μm or less. By sufficiently securing the spacing (S1, S2) between the light-emitting elements (120), problems such as the light-emitting elements (120) interfering with each other and falling off or being damaged can be prevented when the flexible substrate (110) is bent.

[0157] Meanwhile, the light-emitting element (120') of FIG. 8 is a modified example of the light-emitting element (120) described above, and illustrates the bottom surface of the light-emitting element (120'). Electrode pads (PD1, PD2) may be disposed on the bottom surface of the light-emitting element (120'). FIG. 9 is a cross-sectional view illustrating the light-emitting element (120') of FIG. 8 disposed on one surface of the substrate (110). The spacing (G) between the electrode pads (PD1, PD2) in the light-emitting element (120') may be 50 μm or more. This prevents short circuits between the electrode pads (PD1, PD2).

[0158] In addition, the spacing between the electrode pads (PD1, PD2) between two adjacent light-emitting elements (120') in FIG. 8 may be 70 μm or more. By sufficiently securing the spacing (G) between the electrode pads (PD1, PD2), damage such as interference cracks between the electrode pads (PD1, PD2) can be prevented when the flexible substrate (110) is bent.

[0159] The electrode pads (PD1, PD2) may have various shapes, for example, may have an overall rectangular planar shape. The length of one side (P1, P2) of the electrode pads (PD1, PD2) may be 2 mm or less. The length of one side (P1, P2) of the electrode pads (PD1, PD2) may be 20% or more and 80% or less of the length of one side (L1, L2) of the light-emitting element (120'). For example, the length of the side (P1) in the long axis direction (second direction) of the electrode pads (PD1, PD2) may be 20% or more of the length of the side in the long axis direction (first direction) of the light-emitting element (120'). This prevents a short circuit between the electrode pads (PD1, PD2). As another example, the lateral length (P2) in the short axis direction of the electrode pads (PD1, PD2) may have a length of less than 80% of the length in the short axis direction of the light-emitting element (120'). This allows for sufficient adhesion to be secured.

[0160] Meanwhile, in FIG. 9, E is a metal pattern disposed on one surface of the substrate (110), and the electrode pads (PD1, PD2) of the light-emitting element (120') can be connected to the metal pattern (E) of the substrate (110) through solder (SD). The solder (SD) can be configured in various ways for mounting the light-emitting element (120') on the substrate (110).

[0161] The thickness (T) of the solder (SD) may be 5 μm or more. This ensures adhesion. As another example, the thickness (T) of the solder (SD) may be 10 μm or less. This reduces tilting of the light-emitting element (120').

[0162] The bonding area of ​​the metal pattern (E) of the solder (SD) may be 25% to 50% of the planar area of ​​the light-emitting element (120'). By making the area of ​​the solder (SD) approximately 40% of the area of ​​the light-emitting element (120'), damage such as cracking of the solder (SD) can be prevented when the substrate (110) bends.

[0163] Referring to FIG. 9, the light-emitting module (100) may further include a molding layer (902) covering a light-emitting element (120') disposed on a flexible substrate (110). Additionally, the light-emitting module (100) may further include a coating layer (904) disposed on the molding layer (902). The molding layer (902) and the coating layer (904) may also be made of a flexible material.

[0164] The coating layer (904) may be composed of materials such as PET, silicone, epoxy, fused silica, borosilicate, soda-lime glass, aluminosilicate, fluoropolymer, polyphthalamide (PPA), polybutylene terephthalate (PBT), and polycarbonate (PC).

[0165] Alternatively, the coating layer (904) may be an anti-glare layer capable of preventing glare.

[0166] Alternatively, the coating layer (904) may be a film layer formed through a matt treatment. For example, the coating layer (904) may be a matt film layer with a surface treated matt film attached to the upper part of the molding layer (902). Additionally, additives such as TiO2, BaSO4, Cr, and C may be added to the coating layer (904) to modify the light path.

[0167] The thickness of the coating layer (904) can be formed to be thinner than the thickness of the molding layer (904). Additionally, it can become thicker from the center of the light-emitting module (100) toward the outer edge.

[0168] Next, the light-emitting element (120") of FIGS. 10 and 11 is a modified example of the light-emitting element (120, 120') described above, and the light-emitting element (120") may include a plurality of light-emitting stacks (1010, 1020, 1030) stacked vertically. The plurality of light-emitting stacks (1010, 1020, 1030) may emit light of different peak wavelengths.

[0169] The light-emitting element (120) may include a first light-emitting stack (1010), a second light-emitting stack (1020) disposed on one side of the first light-emitting stack (1010), and a third light-emitting stack (1030) disposed on one side of the second light-emitting stack (1020).

[0170] Each of the first to third light-emitting stacks (1010, 1020, 1030) may include a first conductivity semiconductor layer, an active layer, and a second conductivity semiconductor layer. Additionally, the light-emitting element (120) may include an adhesive layer, an insulating layer, and electrode pads for bonding the first to third light-emitting stacks (1010, 1020, 1030).

[0171] FIG. 11 illustrates one side of a light-emitting element (120) including first to third light-emitting stacks (1010, 1020, 1030), wherein electrode pads (PD1, PD2, PD3, PD4) of the light-emitting element (120) may be arranged.

[0172] The electrode pads (PD1, PD2, PD3, PD4) may include a common electrode pad (PD1) that is commonly connected to a plurality of light-emitting stacks (1010, 1020, 1030), and a plurality of individual electrode pads (PD2, PD3, PD4) that are each connected to the plurality of light-emitting stacks (1010, 1020, 1030). The plurality of light-emitting stacks (1010, 1020, 1030) may be electrically connected to a substrate (110) through the plurality of electrode pads (PD1, PD2, PD3, PD4).

[0173] The electrode pads (PD1, PD2, PD3, PD4) may have various shapes, for example, may have an overall rectangular planar shape. The length of one side of the electrode pads (PD1, PD2, PD3, PD4) may be 30% or more and 40% or less of the length of one side of the light-emitting element (120). For example, the length of one side of the electrode pads (PD1, PD2, PD3, PD4) may be 75 μm or less. For example, the length of the side of the electrode pads (PD1, PD2, PD3, PD4) may be 72.5 μm. In addition, the sum of the areas of the electrode pads (PD1, PD2, PD3, PD4) may be 40% or more and 55% or less of the area of ​​the light-emitting element (120). By securing a sufficient adhesive area, the opening of the adhesive solder that detaches when the substrate (110) is bent is reduced, and the short circuit of the solder (SD) during the process is reduced, thereby reducing the difficulty of the process.

[0174] Additionally, the spacing between the electrode pads (PD1, PD2, PD3, PD4) in the first or second direction within the light-emitting element (120) may be 20% or more and less than 30% relative to the length of one side of the light-emitting element (120). For example, the spacing between the electrode pads (PD1, PD2, PD3, PD4) in the first or second direction may be 55 μm or less. For example, the spacing may be 50 μm. This reduces the short circuit of the solder (SD) during the process, thereby reducing the difficulty of the process.

[0175] The first to third light-emitting stacks (1010, 1020, 1030) may each be a light-emitting stack that emits red light, a light-emitting stack that emits green light, and a light-emitting stack that emits blue light. Accordingly, a stacked light-emitting element (120) including the first to third light-emitting stacks (1010, 1020, 1030) can display the RGB primary colors as pixels.

[0176] FIGS. 12a and 12b are cross-sectional views in the I-I' and II-II' directions of the light-emitting element (120) of FIG. 11. Referring to FIGS. 12a and 12b, each light-emitting stack (1010, 1020, 1030) of the light-emitting element (120) may include a first conductivity semiconductor layer, an active layer disposed in a portion of the upper surface of the first conductivity semiconductor layer, a second conductivity semiconductor layer disposed on the active layer, and the first conductivity semiconductor layer. The first light-emitting stack (1010) may be disposed on a growth substrate (1001), and the growth substrate (1001) may be removed.

[0177] The light-emitting element (120) may include an adhesive layer (1002) that bonds the first light-emitting stack (1010) and the second light-emitting stack (1020) between the first light-emitting stack (1010) and the second light-emitting stack (1020), and an adhesive layer (1004) that bonds the second light-emitting stack (1020) and the third light-emitting stack (1030) between the second light-emitting stack (1020) and the third light-emitting stack (1030).

[0178] Additionally, the light-emitting element (120) may include an insulating layer (1006) covering the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer. The insulating layer (1006) may be an insulating layer covering the first light-emitting stack (1010), the second light-emitting stack (1020), and the third light-emitting stack (1030). The insulating layer may be a single layer or may include multiple layers.

[0179] The light-emitting element (120) may include a common electrode pad (PD1) connected in common to the first to third light-emitting stacks (1010, 1020, 1030), and individual electrode pads (PD1, PD2, PD3, PD4) each connected to the first to third light-emitting stacks (1010, 1020, 1030).

[0180] The common electrode pad (PD1) can be connected to the first conductivity type semiconductor layer of the first to third light-emitting stacks (1010, 1020, 1030). The individual electrode pads (PD2, PD3, PD4) can each be connected to the second conductivity type semiconductor layer of the first to third light-emitting stacks (1010, 1020, 1030).

[0181] The insulating layer (1006) may include a sixth opening (OP6) that exposes a first conductive semiconductor layer of the first light-emitting stack (1010) and a fourth opening (OP4) that exposes a second conductive semiconductor layer of the first light-emitting stack (1010). The common electrode pad (PD1) may be a first electrode pad connected to the first conductive semiconductor layer of the first light-emitting stack (1010) through the sixth opening (OP6). Additionally, the individual electrode pad (PD4) may be a second electrode pad connected to the second conductive semiconductor layer of the first light-emitting stack (1010) through the fourth opening (OP4). With respect to the first light-emitting stack (1010), the sixth opening (OP6) may correspond to a first opening for the first electrode pad, and the fourth opening (OP4) may correspond to a second opening for the second electrode pad.

[0182] Similarly, the insulating layer (1006) may include a fifth opening (OP5) that exposes a first conductive semiconductor layer of the second light-emitting stack (1020) and a second opening (OP2) that exposes a second conductive semiconductor layer of the second light-emitting stack (1020). The common electrode pad (PD1) may be a first electrode pad connected to the first conductive semiconductor layer of the second light-emitting stack (1020) through the fifth opening (OP6). Additionally, the individual electrode pad (PD2) may be a second electrode pad connected to the second conductive semiconductor layer of the second light-emitting stack (1020) through the second opening (OP2). With respect to the second light-emitting stack (1020), the fifth opening (OP5) may correspond to a first opening for the first electrode pad, and the second opening (OP2) may correspond to a second opening for the second electrode pad.

[0183] Likewise, the insulating layer (1006) may include a first opening (OP1) that exposes a first conductive semiconductor layer of the third light-emitting stack (1030) and a third opening (OP3) that exposes a second conductive semiconductor layer of the third light-emitting stack (1030). The common electrode pad (PD1) may be a first electrode pad connected to the first conductive semiconductor layer of the third light-emitting stack (1030) through the first opening (OP1). Additionally, the individual electrode pad (PD3) may be a second electrode pad connected to the second conductive semiconductor layer of the third light-emitting stack (1030) through the third opening (OP3). With respect to the third light-emitting stack (1030), the first opening (OP1) may correspond to a first opening for the first electrode pad, and the third opening (OP3) may correspond to a second opening for the second electrode pad.

[0184] Referring to FIG. 12a, the diameter (N2) of the second opening hole (OP3) corresponding to the second opening of the third light-emitting stack (1030) may be at least 15% of the diameter (N1) of the individual electrode pad (PD3) corresponding to the second electrode pad. By ensuring a sufficient diameter of the second opening, the individual electrode pad (PD3) may be prevented from falling out of the second opening. Similarly, the diameter (N4) of the second opening hole (OP2) corresponding to the second opening of the second light-emitting stack (1020) may be at least 15% of the diameter (N3) of the individual electrode pad (PD2) corresponding to the second electrode pad. Additionally, the area of ​​the third opening hole (OP3) and the second opening hole (OP2) may each be at least 25% of the area of ​​the individual electrode pads (PD3, PD2).

[0185] Likewise, referring to FIG. 12b, the diameter (N6) of the fourth opening hole (OP4) corresponding to the second opening of the first light-emitting stack (1030) may be at least 15% of the diameter (N5) of the individual electrode pad (PD4) corresponding to the second electrode pad. By ensuring a sufficient diameter of the second opening, the individual electrode pad (PD4) may be prevented from falling out of the second opening. Similarly, the diameter (N9) of the sixth opening hole (OP6) corresponding to the first opening of the first light-emitting stack (1030) may be at least 15% of the diameter (N7) of the common electrode pad (PD1) corresponding to the first electrode pad. The diameter (N8) of the fifth opening hole (OP5) corresponding to the first opening of the second light-emitting stack (1020) may be at least 15% of the diameter (N7) of the common electrode pad (PD1) corresponding to the first electrode pad. The diameter (N10) of the first opening hole (OP1) corresponding to the first opening of the third light-emitting stack (1030) may be at least 15% of the diameter (N7) of the common electrode pad (PD1) corresponding to the first electrode pad. Additionally, the area of ​​the first, fourth, fifth, and sixth opening holes (OP1, OP4, OP5, OP6) may each be at least 25% of the area of ​​the individual electrode pad (PD1) or the individual electrode pad (PD4).

[0186] However, the light-emitting element (120, 120', 120") of the present invention described above is not limited to a specific structure and can be implemented by modifying it into various structures. It is obvious that the light-emitting element (120, 120', 120") can be modified into various structures such as flip-chip type, vertical type, and horizontal type. In addition, depending on the shape of the light-emitting element (120, 120', 120"), the growth substrate may be omitted.

[0187] Referring again to FIGS. 1 and FIG. 2, the spacing (S3) between the plurality of IC drivers (130) may be at least twice the length (L3, L4) of one side of the IC driver (130). The plurality of IC drivers (130) may be spaced apart with respect to the first direction or the second direction. The spacing (S3) between adjacent IC drivers (130) with respect to the first direction or the second direction may be at least 1.2 mm. Preferably, the spacing (S3) may be at least 1.23 mm. By arranging the IC drivers (130) at a sufficiently wide spacing, problems such as the IC drivers (130) interfering with each other and falling off or being damaged can be prevented when the light-emitting module (100) is bent. The flexibility of the light-emitting module (100) can be maintained by arranging the number of relatively large IC drivers (130) less than the number of light-emitting elements (120, 120', 120").

[0188] Meanwhile, the gap (M) between the IC driver (130) and the adjacent light-emitting element (120, 120', 120") may be longer than the length of one side of the IC driver (130). For example, it may be 700 μm or more. More preferably, the gap (M) may be 800 μm or more. Through this, problems such as the IC driver (130) and the light-emitting element (120, 120', 120") interfering with each other and falling off or being damaged can be prevented.

[0189] The electrode pads (PD, PD1, PD2, PD3, PD4) of the light-emitting elements (120, 120', 120") can be electrically connected to a metal pattern disposed on one surface of the substrate (110). Referring to FIG. 2, the metal pattern may include a common wiring (140) that is connected in common to a plurality of light-emitting elements (120, 120', 120"), and a plurality of auxiliary wirings (161, 162, 163, 164) that are each connected to the plurality of light-emitting elements (120, 120', 120"). In this case, the bending radius of the metal pattern may be larger than the bending radius of the substrate (100).

[0190] The above common wiring (140) may be placed on the outer edge of the substrate (100). More specifically, the common wiring (140) may be extended along a first direction (or a second direction) on the outer edge of one side of the substrate (100). By doing so, the bending radius of the light-emitting module (100) can be adjusted by placing the common wiring (140), which has a relatively large bending radius, on the outer side. Accordingly, when the light-emitting module (100) is bent, problems such as interference between components causing them to detach or be damaged can be prevented.

[0191] The above common wiring (140) may be provided in multiple numbers. When the above common wiring (140) is formed to extend along a first direction, the multiple common wirings (140) may be spaced apart and arranged along a second direction. A light-emitting element (120, 120', 120") and an IC driver (130) may be placed between the common wiring (140). The distance (K) from the IC driver (130) to the common wiring (140) may be 1.5 times or more and 2 times or less than the length (L3, L4) of one side of the IC driver (130). For example, when the length (L3, L4) of one side of the IC driver (130) is 650 µm, the distance (K) to the common wiring (140) may be 1.7 mm or less. For example, the distance (K) may be 1.6 mm or less. Through this, electrical signal interference in the common wiring (140) can be reduced, and problems such as the elements interfering with each other and falling off or being damaged when the light-emitting module (100) is bent can be prevented.

[0192] In addition, the auxiliary wiring (161, 162, 163, 164) is wiring placed adjacent to the light-emitting element (120, 120', 120"), and by making its thickness thin within the light-emitting unit (U), the influence on the bending radius of the light-emitting module (100) can be minimized.

[0193] Next, FIG. 13 illustrates a light-emitting module (500) according to another embodiment of the present invention, wherein the substrate (510) of the light-emitting module (500) may be a flexible substrate. Since the light-emitting module (500) may be configured identically or similarly to the light-emitting module (100) of FIG. 1 and FIG. 2, except for the shape of the metal pattern on the substrate (510) and the arrangement of the light-emitting elements (520) and the IC drivers (530), the description of the overlapping configuration is omitted. E in FIG. 13 is a metal pattern and may likewise be configured identically or similarly to the metal pattern of FIG. 2, so a detailed description is omitted.

[0194] In FIG. 13, the spacing (S1) between adjacent light-emitting elements (520) may be greater than or equal to the thickness of the light-emitting elements (520).

[0195] Next, FIG. 14 illustrates a light-emitting module (600) according to another embodiment of the present invention, wherein the substrate (610) of the light-emitting module (600) may be a flexible substrate. The light-emitting module (600) may further include a plurality of IC drivers disposed on one surface of the substrate (610). Since the light-emitting module (600) may be configured identically or similarly to the light-emitting module (100) of FIG. 1 and FIG. 2, except for the shape of the metal pattern on the substrate (610) and the arrangement shape of the light-emitting elements (620), the description of the overlapping configuration is omitted. E in FIG. 14 is a metal pattern and may likewise be configured identically or similarly to the metal pattern of FIG. 2, so a detailed description is omitted.

[0196] FIG. 15 is an enlarged view of B in FIG. 14, illustrating light-emitting elements (620) placed on a substrate (610) and solder (SD) for mounting the light-emitting elements (620) on a metal pattern (E). By maintaining a sufficient spacing (S1) between the light-emitting elements (620) and maintaining a sufficient spacing between the electrode pads (PDs) of adjacent light-emitting elements (620), mutual interference can be prevented when the substrate (610) is bent. Additionally, by configuring the area of ​​the solder (SD) to be approximately 30% of the area (L1*L2) of the light-emitting elements (620), damage such as the solder (SD) falling off or cracking can be prevented when the substrate (610) is bent.

[0197] Referring to FIG. 16, a light-emitting module (100, 200, 300, 400, 500, 600) and a light-emitting system (1) including the same according to an embodiment of the present invention will be described. For example, the light-emitting system (1) may be composed of a truck, a passenger car, a bus, etc. Such a light-emitting system (1) may include a vehicle body (10) and a light-emitting module (100, 200, 300, 400, 500, 600).

[0198] The above vehicle body (10) can provide the appearance of a light-emitting system (1). The vehicle body (10) can be configured to be movable on a road. A light-emitting module (100, 200, 300, 400, 500, 600) can be installed on the vehicle body (10).

[0199] Additionally, the vehicle body (10) may include a power supply device for supplying power to a light-emitting module (100, 200, 300, 400, 500, 600). The light-emitting module (100, 200, 300, 400, 500, 600) may emit light. For example, the light-emitting module (100, 200, 300, 400, 500, 600) may display characters, symbols, or images.

[0200] In addition, the light-emitting module (100, 200, 300, 400, 500, 600) may be composed of a vehicle window, windshield, rear window, taillight (rear lamp, tail lamp), headlight, interior light, brake light, grille lamp, etc.

[0201] In addition, the light-emitting module (100, 200, 300, 400, 500, 600) can be installed and applied in various places composed of plates having light transmittance, such as glass, as well as in vehicles. In other words, the light-emitting module (100, 200, 300, 400, 500, 600) can be applied to subway glass, bus glass, airplane windows, building exterior walls, building windows, outdoor advertisements, etc. For example, the light-emitting module (100, 200, 300, 400, 500, 600) can be installed on a subway window to display information such as a subway route map.

[0202] Next, with reference to FIG. 17, a light-emitting system (2) including a light-emitting module (100, 200, 300, 400, 500, 600) according to another embodiment of the present invention will be described. For example, the light-emitting system (2) may include the light-emitting module (100, 200, 300, 400, 500, 600). Additionally, the light-emitting system (2) may be formed transparently. Furthermore, the light-emitting system (2) may be configured as a display device, for example.

[0203] The light-emitting system (2) can display information and perform the role of outputting various visual content. Additionally, a frame (20) may be provided on the outer side of the light-emitting system (2). Electrical wiring may be added to one area of ​​the frame (20). Through this, the light-emitting system (2) can be electrically connected to an external power source and its operation can be controlled according to an electrical signal. Furthermore, the light-emitting system (2) can be controlled according to an external signal and can be operated in various ways.

[0204] In addition, the frame (20) can serve to reinforce the strength of the light-emitting system (2) and can be made of a material with higher strength than the light-emitting modules (100, 200, 300, 400, 500, 600). Through this, the frame (20) can also be utilized as a structural support connecting different light-emitting modules (100, 200, 300, 400, 500, 600). Various materials may be used for the frame (20) depending on mechanical strength, processability, etc. For example, the frame (20) may be made of a metal material such as aluminum, stainless steel, copper, etc. Furthermore, the frame (20) may be made of a polymer material such as polycarbonate, acrylic, polyamide, ABS, or a material such as carbon fiber reinforced plastic, glass fiber reinforced plastic, or ceramic.

[0205] Additionally, the frame (20) may be manufactured in a form that surrounds the light-emitting module (100, 200, 300, 400, 500, 600) to reinforce the strength of the light-emitting system (2), but is not limited thereto. The frame (20) may also be placed on only one side of the light-emitting module (100, 200, 300, 400, 500, 600) to increase the transparency of the light-emitting system (2).

[0206] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art or those with ordinary knowledge in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and technical scope of the invention as described in the claims set forth below.

[0207] Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims.

Claims

1. A substrate, and a plurality of light-emitting elements disposed on the substrate, and A light-emitting module in which the spacing between the plurality of light-emitting elements is 50 μm or more.

2. In Claim 1, The above substrate is a light-transmitting substrate, and It further includes a plurality of IC drivers disposed on the substrate to drive the plurality of light-emitting elements, and A light-emitting module in which the spacing between the plurality of light-emitting elements is at least 10 times the length of one side of one of the plurality of light-emitting elements.

3. In Claim 2, A light-emitting module in which the spacing between the plurality of IC drivers is at least 10 times the length of one side of one of the plurality of IC drivers.

4. In Claim 2, A light-emitting module in which the area of ​​the placement region in which the plurality of light-emitting elements and the plurality of IC drivers are placed among the substrate is 25% or less of the total area of ​​the substrate.

5. In Claim 2, It further includes a common wiring disposed on one surface of the substrate and connected in common to the plurality of light-emitting elements, and a plurality of auxiliary wirings each connected to the plurality of light-emitting elements. A light-emitting module in which the thickness of the auxiliary wiring is 0.25 times or less the side length of one of the plurality of light-emitting elements.

6. In Claim 2, A light-emitting module in which the plurality of light-emitting elements are disposed on one side of the substrate and the plurality of IC drivers are disposed on the other side of the substrate.

7. In Claim 2, At least one of the plurality of light-emitting elements is a light-emitting module that is vertically stacked with one of the plurality of IC drivers.

8. In Claim 2, A light-emitting module further comprising a light path control layer disposed in at least a portion of one surface of the above substrate.

9. In Claim 8, The light path control layer comprises a cloaking layer for concealing the plurality of light-emitting elements and the plurality of IC drivers so that they are not visible to the naked eye, in a light-emitting module.

10. In Claim 2, A light-emitting module in which the number of the plurality of IC drivers is X (where X is a natural number greater than or equal to 1), and the number of the plurality of light-emitting elements is X*Y (where Y is a natural number greater than or equal to 2).

11. In Claim 1, The above substrate is a flexible substrate, and A light-emitting module in which the solder area for mounting the light-emitting element on the substrate is 25% to 50% of the area of ​​the light-emitting element.

12. In Claim 11, A light-emitting module having a solder thickness of 5 μm or more.

13. In Claim 11, One of the plurality of light-emitting elements is a light-emitting module comprising a semiconductor layer including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer, and a plurality of electrode pads connected to the semiconductor layer.

14. In Claim 13, A light-emitting module in which the spacing between the electrode pads between two adjacent light-emitting elements is 70 μm or more.

15. In Claim 13, A light-emitting module in which the spacing between the plurality of electrode pads of the light-emitting element is 50 μm or more.

16. In Claim 11, A light-emitting module comprising a plurality of light-emitting stacks vertically stacked, each of which emits light of a different peak wavelength, a common electrode pad connected to the plurality of light-emitting stacks, and a plurality of individual electrode pads each connected to the plurality of light-emitting stacks.

17. In Claim 16, The light-emitting stack comprises a first conductive semiconductor layer, an active layer disposed in a portion of the upper surface of the first conductive semiconductor layer, a second conductive semiconductor layer disposed on the active layer, an insulating layer covering the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer, a first electrode pad disposed on the insulating layer and connected to the first conductive semiconductor layer exposed through a first opening of the insulating layer, and a second electrode pad disposed on the insulating layer and connected to the second conductive semiconductor layer exposed through a second opening of the insulating layer.

18. In Claim 17, A light-emitting module in which the diameters of the first opening and the second opening are each at least 15% of the diameters of the first electrode pad and the second electrode pad.

19. A substrate, a plurality of light-emitting elements disposed on the substrate, and a plurality of IC drivers disposed on the substrate for driving the plurality of light-emitting elements, A light-emitting module in which the spacing between the plurality of light-emitting elements is at least 10 times the length of one side of one of the plurality of light-emitting elements.

20. A substrate and a plurality of light-emitting elements disposed on the substrate, One of the plurality of light-emitting elements comprises a semiconductor layer including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer, an insulating layer covering the semiconductor layer, and a plurality of electrode pads connected to the semiconductor layer through an opening in the insulating layer. A light-emitting module in which the distance between the electrode pads between two adjacent light-emitting elements is 70 μm or more.

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