Flexible array antenna structure and electronic device comprising same

Abstract

The present disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate beyond 4G communication systems such as LTE. An antenna device including a flexible array antenna according to one embodiment of the present disclosure may comprise: a first layer (L1) on which the flexible array antenna is disposed; a second layer (L2) stacked under the first layer (L1) and composed of a ground (GND); a third layer (L3) stacked under the second layer (L2) and on which a plurality of flexible radio frequency (RF) lines for transmission of RF signals and a ground (GND) are disposed; and a fourth layer (L4) stacked under the third layer (L3) and composed of a ground (GND).

Description

Flexible array antenna structure and electronic device including the same

[0001] The present disclosure relates to a flexible array antenna structure and an electronic device including the same.

[0002] Looking back at the evolution of wireless communication through successive generations, technologies have been developed primarily for human-oriented services, such as voice, multimedia, and data. Following the commercialization of 5G (5th-generation) communication systems, connected devices, which have been increasing explosively, are expected to be connected to communication networks. Examples of networked objects include vehicles, robots, drones, home appliances, displays, smart sensors installed in various infrastructures, construction machinery, and factory equipment. Mobile devices are expected to evolve into various form factors, such as augmented reality glasses, virtual reality headsets, and holographic devices. In the 6G (6th-generation) era, efforts are underway to develop improved 6G communication systems to connect hundreds of billions of devices and objects to provide diverse services. For this reason, 6G communication systems are being referred to as "beyond 5G" systems.

[0003] In the 6G communication system predicted to be realized around 2030, the maximum transmission speed is tera (i.e., 1,000 gigabit) bps, and the wireless latency is 100 microseconds (μsec). In other words, compared to the 5G communication system, the transmission speed in the 6G communication system is 50 times faster, and the wireless latency is reduced to one-tenth.

[0004] To achieve such high data transmission speeds and ultra-low latency, 6G communication systems are being considered for implementation in the terahertz band (e.g., the 95 GHz to 3 terahertz (3 THz) band). In the terahertz band, due to more severe path loss and atmospheric absorption compared to the millimeter wave (mmWave) band introduced in 5G, the importance of technology capable of guaranteeing signal reach, or coverage, is expected to increase. As key technologies to ensure coverage, radio frequency (RF) devices, antennas, new waveforms that offer better coverage than orthogonal frequency division multiplexing (OFDM), beamforming, and multi-antenna transmission technologies such as massive multiple-input and multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, and large-scale antennas must be developed. In addition, new technologies such as metamaterial-based lenses and antennas, high-dimensional spatial multiplexing technology using orbital angular momentum (OAM), and reconfigurable intelligent surface (RIS) are being discussed to improve coverage of terahertz band signals.

[0005] In addition, to improve frequency efficiency and system network, development is underway in 6G communication systems for full duplex technology, in which uplink and downlink simultaneously utilize the same frequency resources at the same time; network technology that integrates satellites and HAPS (high-altitude platform stations); network structure innovation technology that supports mobile base stations and enables network operation optimization and automation; dynamic spectrum sharing technology through collision avoidance based on spectrum usage prediction; AI-based communication technology that utilizes AI (artificial intelligence) from the design stage and internalizes end-to-end AI support functions to realize system optimization; and next-generation distributed computing technology that realizes services of complexity exceeding the limits of terminal computing capabilities by utilizing ultra-high performance communication and computing resources (mobile edge computing (MEC), cloud, etc.). In addition, attempts are continuing to further strengthen connectivity between devices, further optimize networks, promote the softwareization of network entities, and increase the openness of wireless communication through the design of new protocols to be used in 6G communication systems, the implementation of hardware-based security environments, the development of mechanisms for the safe utilization of data, and the development of technologies regarding privacy maintenance methods.

[0006] Due to the research and development of such 6G communication systems, it is expected that a new dimension of hyper-connected experience will become possible through the hyper-connectivity of 6G communication systems, which encompasses not only connections between objects but also connections between people and objects. Specifically, it is projected that 6G communication systems will enable the provision of services such as truly immersive extended reality (truly immersive XR), high-fidelity mobile holograms, and digital replicas. Furthermore, services such as remote surgery, industrial automation, and emergency response, which are provided through 6G communication systems with enhanced security and reliability, will be applied in various fields including industry, healthcare, automotive, and home appliances.

[0007] Meanwhile, although the size of the terminal has not changed significantly, the number of RF (Radio Frequency) bands that must be supported continues to increase as communication performance advances. As communication generations have recently advanced to 6G, base stations and terminals must cover the frequency bands of the new communication generation. In the case of terminals, it may be more difficult to secure space for antenna mounting because they must cover existing frequency bands while simultaneously covering more additional antenna bands and adding performance capabilities such as MIMO and diversity.

[0008] The present disclosure proposes a method for efficiently designing and placing an antenna within a limited space in a terminal.

[0009] According to one embodiment of the present disclosure, an antenna device may include: a first layer (L1) on which a flexible array antenna is disposed; a second layer (L2) stacked below the first layer (L1) and composed of a ground (GND); a third layer (L3) stacked below the second layer (L2) and having a plurality of flexible RF lines for transmitting an RF (radio frequency) signal and a ground (GND) disposed therein; and a fourth layer (L4) stacked below the third layer (L3) and composed of a ground (GND).

[0010] According to one embodiment, the flexible array antenna disposed in the first layer (L1) may be positioned vertically with respect to at least some of the plurality of flexible RF lines disposed in the third layer (L3).

[0011] According to one embodiment, the flexible array antenna disposed on the first layer (L1) is positioned vertically with respect to at least a portion of the battery and can be electrically connected to at least a portion of the plurality of flexible RF lines.

[0012] According to one embodiment, a first flexible array antenna disposed in the first layer (L1) may be positioned vertically with respect to at least a portion of the first flexible RF line disposed in the third layer (L3). According to one embodiment, a second flexible array antenna disposed in the first layer (L1) may be positioned vertically with respect to at least a portion of the second flexible RF line disposed in the third layer (L3).

[0013] According to one embodiment, the antenna device may further include a ground via (GND via) that is electrically connected to at least a portion of each of the first layer (L1), the second layer (L2), the third layer (L3), and the fourth layer (L4) and shares a ground (GND).

[0014] According to one embodiment, the flexible array antenna may include at least one of a linear array antenna arranged in a line, a planar array antenna capable of beam steering in a two-dimensional array in a vertical and horizontal direction, a circular array antenna capable of radiating signals in all directions in a circularly arranged structure, and a phased array antenna capable of controlling the beam direction in real time by controlling the phase deviation.

[0015] According to one embodiment, each of the plurality of flexible RF lines may be any one of a display line connecting a main board and a screen, an RF line connecting a sub-board and the main board, and a mmW line connecting an antenna module that supports the mmW band.

[0016] According to one embodiment, the second layer (L2) may include a polarizer and a ring structure for bandwidth expansion in place of the ground (GND).

[0017] According to one embodiment, the flexible array antenna may be located on the top of the battery and have rear radiation characteristics.

[0018] According to one embodiment, the antenna device further comprises N layers located below the third layer (L3) and above the fourth layer (L4), wherein a plurality of flexible RF lines for transmitting the RF signal and a ground (GND) are arranged, and N may be a natural number greater than or equal to 1.

[0019] According to one embodiment of the present disclosure, a terminal may include at least one antenna device. Each of the at least one antenna device may include: a first layer (L1) on which the flexible array antenna is disposed; a second layer (L2) stacked below the first layer (L1) and composed of ground (GND); a third layer (L3) stacked below the second layer (L2) and having a plurality of flexible RF lines for transmitting an RF (radio frequency) signal and ground (GND) disposed therein; and a fourth layer (L4) stacked below the third layer (L3) and composed of ground (GND).

[0020] The device according to an embodiment of the present disclosure can enable space-efficient antenna placement by designing a rear-radiating array antenna using a flexible line located on the upper part of the battery.

[0021] The device according to an embodiment of the present disclosure can add an array antenna having a gain similar to that of a conventional patch antenna while solving physical problems such as interference and thickness by extending a flexible line to add an array antenna.

[0022] FIG. 1 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to an embodiment of the present disclosure.

[0023] FIG. 2 is a drawing showing an electronic device including an antenna module according to an embodiment of the present disclosure.

[0024] Figure 3 is an example diagram showing the antenna location of the terminal.

[0025] Figure 4 is an example diagram of a flexible line connecting the top and bottom of a terminal.

[0026] FIG. 5 is an exemplary drawing of a multilayer flexible RF line according to one embodiment of the present disclosure.

[0027] FIG. 6 is an exemplary drawing of a 4-layer flexible RF line and antenna according to one embodiment of the present disclosure.

[0028] FIG. 7 is an exemplary drawing of a 6-layer flexible RF line and antenna according to one embodiment of the present disclosure.

[0029] FIG. 8 is an exemplary drawing of an antenna disposed on an FPCB according to one embodiment of the present disclosure.

[0030] FIGS. 9a and 9b are exemplary drawings of an antenna arranged in the form of a linear array on an FPCB according to one embodiment of the present disclosure.

[0031] FIGS. 10a and FIGS. 10b are exemplary drawings of an antenna arranged in the form of a planar array on an FPCB according to one embodiment of the present disclosure.

[0032] FIGS. 11a and FIGS. 11b are exemplary drawings of an antenna arranged in a divided form on an FPCB according to one embodiment of the present disclosure.

[0033] FIG. 12 is an exemplary drawing of an antenna including a polarizer and a ring structure according to one embodiment of the present disclosure.

[0034] FIG. 13 is an example drawing of an FPCB array antenna that serves as a sub-role of a metal bezel antenna according to one embodiment of the present disclosure.

[0035] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

[0036] In describing the embodiments, technical details that are well known in the art to which this disclosure belongs and are not directly related to this disclosure are omitted. This is intended to convey the essence of this disclosure more clearly without obscuring it by omitting unnecessary explanations.

[0037] For the same reason, some components in the attached drawings have been exaggerated, omitted, or schematically depicted. Additionally, the size of each component does not entirely reflect its actual dimensions. Identical or corresponding components in each drawing have been assigned the same reference numbers.

[0038] The advantages and features of the present disclosure and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to make the present disclosure complete and to fully inform those skilled in the art of the scope of the invention, and the present disclosure is defined only by the scope of the claims. Throughout the specification, like reference numerals refer to like components.

[0039] At this time, it will be understood that each block of the process flow diagrams and combinations of the flow diagrams can be executed by computer program instructions. Since these computer program instructions can be loaded into the processor of a general-purpose computer, a special-purpose computer, or other programmable data processing equipment, the instructions executed through the processor of the computer or other programmable data processing equipment create means to perform the functions described in the flow diagram block(s). Since these computer program instructions can also be stored in computer-available or computer-readable memory that can be directed toward the computer or other programmable data processing equipment to implement the function in a specific way, the instructions stored in computer-available or computer-readable memory can also produce a manufactured item containing the means of instruction to perform the function described in the flow diagram block(s). Since computer program instructions can be loaded onto a computer or other programmable data processing equipment, instructions that perform a series of operation steps on the computer or other programmable data processing equipment to create a process executed by the computer can also provide steps for executing the functions described in the flowchart block(s).

[0040] Additionally, each block may represent a module, segment, or part of code containing one or more executable instructions for executing a specified logical function(s). It should also be noted that in some alternative execution examples, the functions mentioned in the blocks may occur out of order. For instance, two blocks described in succession may actually be executed substantially simultaneously, or the blocks may be executed in reverse order according to their corresponding functions.

[0041] In this embodiment, the term "part" refers to a software or hardware component, such as an FPGA or ASIC, and the "part" performs certain roles. However, the meaning of "part" is not limited to software or hardware. The "part" may be configured to reside in an addressable storage medium or configured to operate one or more processors. Thus, as an example, the "part" includes components such as software components, object-oriented software components, class components, and task components, as well as processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables. The functions provided within the components and "parts" may be combined into a smaller number of components and "parts" or further separated into additional components and "parts." Furthermore, the components and "parts" may be implemented to operate one or more CPUs within a device or secure multimedia card. In addition, in the embodiments, '~part' may include one or more processors.

[0042] FIG. 1 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to an embodiment of the present disclosure.

[0043] Referring to FIG. 1, the electronic device (101) may include at least one of a processor (120), a memory (130), a first communication processor (112), a second communication processor (114), a first RFIC (radio frequency integrated circuit) (222), a second RFIC (124), a third RFIC (126), a fourth RFIC (128), a first RFFE (radio frequency front end) (132), a second RFFE (134), a first antenna module (142), a second antenna module (144), a third antenna module (146), and antennas (148).

[0044] The electronic device (101) described in the present disclosure may be implemented in various forms of devices. The electronic device (101) may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device (101) according to an embodiment of the present disclosure is not limited to the aforementioned devices. According to an embodiment, the electronic device (101) may be a device that communicates based on LTE communication technology, 5G communication technology, and / or 6G communication technology. According to an embodiment, the electronic device (101) may be implemented within a base station (or network entity) that communicates based on LTE communication technology, 5G communication technology, and / or 6G communication technology.

[0045] The processor (120) can, for example, execute software (e.g., a program) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module or a communication module (192)) in volatile memory, process the commands or data stored in volatile memory, and store the resulting data in non-volatile memory. According to one embodiment, the processor (120) may include a main processor (e.g., a central processing unit or an application processor) or an auxiliary processor (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with it. For example, if the electronic device (101) includes a main processor and an auxiliary processor, the auxiliary processor may be configured to use less power than the main processor or to be specialized for a designated function. The auxiliary processor can be implemented separately from the main processor or as part of it.

[0046] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module). The data may include, for example, software (e.g., program) and input data or output data for related commands. The memory (130) may include volatile memory and / or non-volatile memory.

[0047] The network (199) may include a first cellular network (192) and a second cellular network (194). According to one embodiment, the electronic device (101) may further include at least one of the components described in FIG. 1, and the second network (199) may further include at least one other network. According to one embodiment, the first communication processor (112), the second communication processor (114), the first RFIC (122), the second RFIC (124), the fourth RFIC (128), the first RFFE (132), and the second RFFE (134) may form at least a part of the wireless communication module (192). According to one embodiment, the fourth RFIC (128) may be omitted or included as part of the third RFIC (126).

[0048] The first communication processor (112) can support the establishment of a communication channel in a band to be used for wireless communication with the first cellular network (192), and legacy network communication through the established communication channel. According to one embodiment, the first cellular network (192) may be a legacy network including a second generation (2G), 3G, 4G, or LTE (long term evolution) network.

[0049] The second communication processor (114) can support the establishment of a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second cellular network (194), and 5G or 6G network communication through the established communication channel. According to one embodiment, the second cellular network (194) may be a 5G network as defined by 3GPP. According to one embodiment, the second cellular network (194) may be a 6G network. According to one embodiment, the first communication processor (112) or the second communication processor (114) can support the establishment of a communication channel corresponding to another designated band among the bands to be used for wireless communication with the second cellular network (194), and 5G or 6G network communication through the established communication channel.

[0050] The first communication processor (112) can transmit and receive data with the second communication processor (114). For example, data classified to be transmitted through the second cellular network (194) can be changed to be transmitted through the first cellular network (192). In this case, the first communication processor (112) can receive transmitted data from the second communication processor (114). For example, the first communication processor (112) can transmit and receive data with the second communication processor (114) through the processor interface (113). The above inter-processor interface (113) may be implemented, for example, as a UART (universal asynchronous receiver / transmitter) interface (e.g., HS-UART (high speed-UART) or PCIe (peripheral component interconnect bus express), but there is no limitation on the type. Alternatively, the first communication processor (112) and the second communication processor (114) may exchange control information and packet data information, for example, using shared memory. The first communication processor (112) may transmit and receive various information, such as sensing information, information on output strength, and RB (resource block) allocation information, to and from the second communication processor (114).

[0051] Depending on the implementation, the first communication processor (112) may not be directly connected to the second communication processor (114). In this case, the first communication processor (112) may transmit and receive data to and from the second communication processor (114) through a processor (120) (e.g., an application processor). For example, the first communication processor (112) and the second communication processor (114) may transmit and receive data to and from the processor (120) (e.g., an application processor) through an HS-UART interface or a PCIe interface, but there is no limitation on the type of interface. Alternatively, the first communication processor (112) and the second communication processor (114) may exchange control information and packet data information with the processor (120) (e.g., an application processor) using shared memory.

[0052] According to one embodiment, the first communication processor (112) and the second communication processor (114) may be implemented within a single chip or a single package. According to one embodiment, the first communication processor (112) or the second communication processor (114) may be formed within a single chip or a single package with the processor (120), the auxiliary processor, or the communication module (192). According to one embodiment, the first communication processor (112) and the second communication processor (114) may be implemented as an integrated communication processor, and the integrated communication processor may support functions for communication with both the first cellular network (192) and the second cellular network (194).

[0053] At least one of the processor (120), the first communication processor (112), the second communication processor (114), or the integrated communication processor may be implemented as a single chip or a single package. In this case, the single chip or single package may include a memory (or storage means) for storing an instruction that causes the execution of at least some of the operations performed according to various embodiments, and a processing circuit (or, not limited to its name, such as an operation circuit) for executing the instruction.

[0054] The first RFIC (112) can convert a baseband signal generated by the first communication processor (112) during transmission into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first cellular network (192) (e.g., legacy network). During reception, the RF signal is acquired from the first network (192) (e.g., legacy network) through an antenna (e.g., first antenna module (142)) and can be preprocessed through an RFFE (e.g., first RFFE (132)). The first RFIC (122) can convert the preprocessed RF signal into a baseband signal so that it can be processed by the first communication processor (112).

[0055] The second RFIC (124) can convert a baseband signal generated by the first communication processor (112) or the second communication processor (114) into an RF signal in a band used by the second cellular network (194) (e.g., a 5G network) during transmission. During reception, the RF signal is acquired from the second cellular network (194) (e.g., a 5G or 6G network) through an antenna (e.g., a second antenna module (144)) and can be preprocessed through an RFFE (e.g., a second RFFE (134)). The second RFIC (124) can convert the preprocessed RF signal into a baseband signal so that it can be processed by the corresponding communication processor among the first communication processor (112) or the second communication processor (114).

[0056] The third RFIC (126) can convert a baseband signal generated by the second communication processor (114) into an RF signal of a band to be used in the second cellular network (194) (e.g., a 5G or 6G network). Upon reception, the RF signal may be acquired from the second cellular network (194) (e.g., a 5G or 6G network) via an antenna (e.g., antenna (148)) and preprocessed via the third RFFE (136). The third RFIC (126) can convert the preprocessed RF signal into a baseband signal so that it can be processed by the second communication processor (114). According to one embodiment, the third RFFE (136) may be formed as part of the third RFIC (126).

[0057] According to one embodiment, the electronic device (101) may include a fourth RFIC (128) separately from or at least as part of the third RFIC (126). In this case, the fourth RFIC (128) may convert a baseband signal generated by the second communication processor (114) into an intermediate frequency band RF signal (hereinafter, IF signal) and then transmit the IF signal to the third RFIC (126). The third RFIC (126) may convert the IF signal into an RF signal. Upon reception, the RF signal may be received from the second cellular network (194) (e.g., 5G or 6G network) through an antenna (e.g., antenna (148)) and converted into an IF signal by the third RFIC (126). The fourth RFIC (128) may convert the IF signal into a baseband signal so that the second communication processor (114) can process it.

[0058] According to one embodiment, the first RFIC (122) and the second RFIC (124) may be implemented as at least part of a single chip or a single package. According to one embodiment, when the first RFIC (122) and the second RFIC (124) are implemented as a single chip or a single package, they may be implemented as an integrated RFIC. In this case, the integrated RFIC may be connected to the first RFFE (132) and the second RFFE (134) to convert a baseband signal into a signal in a band supported by the first RFFE (132) and / or the second RFFE (134), and transmit the converted signal to either the first RFFE (132) or the second RFFE (134). According to one embodiment, the first RFFE (132) and the second RFFE (134) may be implemented as at least part of a single chip or a single package. According to one embodiment, at least one of the first antenna module (142) or the second antenna module (144) may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.

[0059] According to one embodiment, the third RFIC (126) and the antenna (148) may be placed on the same substrate to form a third antenna module (146). For example, a wireless communication module (192) or a processor (120) may be placed on a first substrate (e.g., a main PCB (Printed Circuit Board)). In this case, the third RFIC (126) may be placed on a portion of a second substrate (e.g., a sub PCB) separate from the first substrate (e.g., a bottom surface), and the antenna (148) may be placed on another portion of a second substrate (e.g., a sub PCB) to form a third antenna module (146). By placing the third RFIC (126) and the antenna (148) on the same substrate, it is possible to reduce the length of the transmission line between them. This can reduce the loss (e.g., attenuation) of signals in the high-frequency band (e.g., about 6 GHz to about 60 GHz) used for 5G or 6G network communication by the transmission line. As a result, the electronic device (101) can improve the quality or speed of communication with the second network (194) (e.g., 5G or 6G network).

[0060] According to one embodiment, the antenna (148) may be formed as an antenna array comprising a plurality of antenna elements that can be used for beamforming. In this case, the third RFIC (126) may include, for example, a plurality of phase shifters (138) corresponding to the plurality of antenna elements as part of the third RFFE (136). During transmission, each of the plurality of phase shifters (138) can change the phase of an RF signal to be transmitted to the outside of the electronic device (101) (e.g., a base station of a 5G network) through the corresponding antenna element. During reception, each of the plurality of phase shifters (138) can change the phase of an RF signal received from the outside through the corresponding antenna element to the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device (101) and the outside.

[0061] The second cellular network (194) (e.g., 5G or 6G network) may be operated independently of the first cellular network (192) (e.g., legacy network) (e.g., Stand-Alone (SA)) or connected to it (e.g., Non-Stand Alone (NSA)).

[0062] FIG. 2 is a drawing showing an electronic device including an antenna module according to an embodiment of the present disclosure.

[0063] Referring to FIG. 2, the electronic device (200) may include a communication module (210), a controller (220), a memory (230), and an antenna module set (240). The antenna module set (240) may include a first antenna module (241), a second antenna module (242), and an nth antenna module (where n is a natural number greater than or equal to 3) (243). For convenience of explanation, FIG. 2 illustrates that the antenna module set (240) includes n antenna modules, but the technical concept of the present disclosure is not limited thereto, and the antenna module set (240) of the present disclosure may include one or more antenna modules.

[0064] The communication module (210) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (200) and an external electronic device, and the performance of communication through the established communication channel. The communication module (210) operates independently of the controller (220) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module (210) may include a wireless communication module (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module (e.g., a LAN (local area network) communication module, or a power line communication module). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips).

[0065] The controller (220) may, for example, execute software to control at least one other component (e.g., a hardware or software component) of the electronic device (200) connected to the controller (220) and may perform various data processing or operations. According to an embodiment, as at least part of the data processing or operations, the controller (220) may store commands or data received from other components (e.g., a communication module (210) or an antenna module set (240)) in memory (230), process the commands or data stored in memory (230), and store result data in memory (230). According to an embodiment, the controller (220) may include a main processor (e.g., a central processing unit or an application processor) or an auxiliary processor that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (200) includes a main processor and an auxiliary processor, the auxiliary processor may be configured to use less power than the main processor or to be specialized for a designated function. The auxiliary processor may be implemented separately from the main processor or as part thereof.

[0066] The memory (230) can store various data used by at least one component of the electronic device (200) (e.g., a communication module (210), a controller (220), or an antenna module set (240)). The data may include, for example, input data or output data for software and related commands. The memory (230) may include volatile memory or non-volatile memory.

[0067] An antenna module set (240) can transmit a signal or power to an external source (e.g., an external electronic device) or receive it from an external source. According to an embodiment, the antenna module set (240) may include at least one antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to an embodiment, a first antenna module (241) may include a plurality of antennas (e.g., an array antenna), a second antenna module (242) may include a plurality of antennas (e.g., an array antenna), and an nth antenna module (243) may include a plurality of antennas (e.g., an array antenna).

[0068] Figure 3 is an example diagram showing the antenna location of the terminal.

[0069] Referring to FIG. 3, the terminal (300) may be the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2. The terminal (300) may use many bands from 2G to 5G bands and may include multiple antennas to support them. The terminal (300) may include antennas in the form of a metal bezel on the outside of the terminal, and may reduce mutual interference by segmenting the metal bezel to cover multiple bands. The terminal (300) may include upper terminal antennas (Sub1~Sub6), lower terminal antennas (Main1~Main4), mmWave-H (horizontal millimeter wave antenna), mmWave-V (vertical millimeter wave antenna), and UWB Chip ANT (UWB patch antenna).

[0070] The upper antennas (Sub1~Sub6) of the terminal are positioned at the top of the terminal (300) and can support the terminal (300) to communicate through at least one of the LTE band, 5G band, Wi-Fi 2.4GHz band, Wi-Fi 5GHz band, Wi-Fi 6GHz band, and UWB (ultra wide band) band. The GND of the Side Key area and the Sub 6 antenna are integrated with the button area to minimize electrical interference and allow for efficient use of space.

[0071] The terminal bottom antennas (Main1~Main4) are positioned at the bottom of the terminal (300) and can support the terminal (300) to communicate through at least one of the LTE band, 5G band, Wi-Fi 2.4GHz band, Wi-Fi 5GHz band, and Wi-Fi 6GHz band.

[0072] mmWave-H (horizontal millimeter wave antenna) and mmWave-V (vertical millimeter wave antenna) are deployed for efficient transmission and reception of high-frequency communication and can meet various directional requirements. A UWB Chip ANT (UWB patch antenna) can support precise location tracking and / or short-range communication of a terminal (300).

[0073] The terminal (300) can enhance 5G and high-frequency communication performance by simultaneously supporting Sub-6GHz and mmWave by including multiple antennas, and can maximize space utilization through antenna placement evenly distributed within the terminal (300) and frame. The terminal (300) can suppress electrical interference and improve signal quality through GND design, and can support stable signal transmission using a multiple input and output (MIMO) system.

[0074] In FIG. 3, the terminal (300) utilizes an outer metal bezel to implement antennas for the 2G to 5G bands, excluding the mmW band. Since the existing bands have large wavelengths and the structural characteristics of the metal bezel, the antenna is designed using an IFA (Inverted F Antenna), which is a type of monopole antenna. While such an antenna has the advantage of covering a wide angle due to its large beam width, it has the disadvantage of being unfavorable for beam steering because the gain is small and it is impossible to implement an array antenna. Furthermore, since the terminal (300) is not only optimized to cover various antenna bands but also difficult to expand in size to add a new structure, the design must be done by adding bands within the currently established structure. This method is a good approach if antennas of similar shape and performance are required, but it may not be suitable if one intends to design and add an antenna with completely new performance.

[0075] Figure 4 is an example diagram of a flexible line connecting the top and bottom of a terminal.

[0076] Referring to FIG. 4, the terminal (400) may be the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2. Within the terminal (400), there may be many flexible lines connecting the top and bottom. The flexible lines may be placed on the top of the battery of the terminal (400).

[0077] The terminal (400) may include a display line (Mainboard to screen) connecting a mainboard located at the top and a screen located at the bottom, an RF line (Mainboard to sub-board) connecting a sub-board (or antenna) located at the bottom and a mainboard located at the top, and a mmW line connecting an antenna module that supports the mmW band.

[0078] The present disclosure proposes a method of adding a structure in the form of an array antenna with high gain and beam steering capability to a terminal. The present disclosure proposes a method of adding a high-gain rear-radiating array antenna capable of beam steering to the top by separating RF lines within a multilayer flexible RF line connecting the top and bottom of the terminal to ground.

[0079] FIG. 5 is an exemplary drawing of a multilayer flexible RF line according to one embodiment of the present disclosure.

[0080] Referring to FIG. 5, the terminal (500) may be the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2. A plurality of flexible RF lines within the terminal (500) may exist in a low-profile form on the battery. A plurality of transmission lines may exist within the flexible RF layer. The structure of the flexible RF lines within the terminal (500) is composed of a stacked multilayer and may be designed, for example, as two layers, four layers, six layers, etc.

[0081] The present disclosure proposes an array antenna structure that utilizes a space separated from the transmission line within a multilayer line.

[0082] FIG. 6 is an exemplary drawing of a 4-layer flexible RF line and antenna according to one embodiment of the present disclosure.

[0083] Referring to FIG. 6, the terminal (600) may be the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2. The terminal (600) may include a 4-layer FPCB (Flexible Printed Circuit Board) line composed of L1 (layer 1) to L4 (layer 4). The 4-Layer FPCB Line refers to an FPCB with a 4-layer structure, and an FPCB may refer to a printed circuit board that can be bent or folded using a flexible material. Through the 4-Layer structure, the FPCB is composed of 4 layers, and each layer can perform functions such as signal transmission, power supply, and ground (GND).

[0084] An antenna may be placed on L1 (layer 1), L2 (layer 2) may be configured as ground (GND), an RF transmission line for RF signals and ground (GND) may be placed on L3 (layer 3), and L4 (layer 4) may be configured as ground (GND). At least a portion of each of L1 (layer 1) to L4 (layer 4) may be connected to a via structure (GND via) used to connect GND signals in an FPCB. GND vias may be used to connect GND signals to multiple layers in a multilayer PCB to ensure signal stability and minimize EMI (electromagnetic interference).

[0085] The terminal (600) has an RF transmission line placed at L3 (layer 3), L2 (layer 2) configured as a ground (GND), and an antenna structure added to L1 (layer 1). In this case, the ground (GND) of L2 (layer 2) is responsible for isolation between the antenna of L1 (layer 1) and the RF transmission line of L3 (layer 3), thereby ensuring the performance of each of the RF transmission line and the antenna.

[0086] FIG. 7 is an exemplary drawing of a 6-layer flexible RF line and antenna according to one embodiment of the present disclosure.

[0087] Referring to FIG. 7, the terminal (700) may be the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2. The terminal (700) may include a 6-layer FPCB line composed of L1 (layer 1) to L6 (layer 4). The 6-Layer FPCB Line refers to an FPCB with a 6-layer structure, and an FPCB may refer to a printed circuit board that can be bent or folded using a flexible material. Through the 6-Layer structure, the FPCB is composed of 4 layers, and each layer can perform functions such as signal transmission, power supply, and ground (GND).

[0088] An antenna may be placed on L1 (layer 1), L2 (layer 2) may be configured as ground (GND), RF transmission lines for RF signals and ground (GND) may be placed on L3 (layer 3) to L5 (layer 5), and L6 (layer 4) may be configured as ground (GND). At least a portion of each of L1 (layer 1) to L6 (layer 6) may be connected to a via structure (GND via) used to connect GND signals in an FPCB. GND vias may be used to connect GND signals to multiple layers in a multilayer PCB to ensure signal stability and minimize EMI (electromagnetic interference).

[0089] The terminal (700) may include a total of 6 layers of multi-layers, including an antenna layer and a ground layer. The terminal (700) may add an antenna while maintaining the form of a 4-layer flexible line (FPCB line).

[0090] For convenience of explanation, the terminal (600) of FIG. 6 is illustrated as having a 4-layer FPCB line and the terminal (700) of FIG. 7 is illustrated as having a 6-layer FPCB line, but the technical concept of the present disclosure is not limited thereto and the terminal may be implemented to include an N-layer FPCB line (where N is a natural number greater than or equal to 4). An N-Layer FPCB Line refers to an FPCB with an N-layer structure, and each layer can perform roles such as signal transmission, power supply, and grounding (GND).

[0091] FIG. 8 is an exemplary drawing of an antenna disposed on an FPCB according to one embodiment of the present disclosure.

[0092] Referring to FIG. 8, the terminal (800) may be the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2. An antenna may be placed on a flexible RF line on the FPCB of the terminal (800). A plurality of patch antennas may be placed on at least some of the flexible RF lines. A patch antenna is a planar antenna and can be used mainly in the microwave and millimeter wave bands. The patch antenna has a structure in which a thin metal patch is mounted on an FPCB (the substrate material is a dielectric) and can be utilized in various wireless communication systems due to its small and lightweight characteristics.

[0093] A patch antenna may include a metal patch that emits or receives electromagnetic waves, a dielectric substrate that determines propagation characteristics as a layer between the patch and a ground plane, a ground plane for signal reflection and enhancement of electromagnetic performance, and a feed line that serves as a path for transmitting signals. In a patch antenna, an electric field is formed between the metal patch and the ground plane, and electromagnetic waves may be emitted by causing resonance at a specific frequency.

[0094] In Fig. 8, a patch antenna is positioned above a flexible RF line, and a ground can exist between them to isolate the two. On the top layer, a coplanar ground can exist around the antenna to reduce coupling.

[0095] In FIG. 8, the antenna port is involved in signal transmission and reception and can direct a path where a specific wireless signal experiences the same Channel State Information (CSI). The antenna port is a component that enables multipath transmission, beamforming, and / or large-scale MIMO implementation, and can provide high data rates, reliability, and / or stability in various environments.

[0096] An array antenna can concentrate signals in a specific direction or form various radiation patterns by configuring a plurality of individual antenna elements in a specific array. An array antenna can improve signal gain and directivity. An array antenna may include elements of individual antenna units (e.g., patch, dipole, etc.), a feed network that transmits signals to each element and adjusts the phase, and an array structure (e.g., linear, planar, circular) that determines the radiation pattern according to the array shape. Electromagnetic waves emitted from each element within the array antenna may be combined in a specific direction (constructive interference) or canceled out (destructive interference) through interference.

[0097] The array antenna may include at least one of a linear array antenna arranged in a line (e.g., a radar system), a planar array antenna capable of beam steering in a two-dimensional array in a vertical and horizontal direction (e.g., 5G Massive MIMO), a circular array antenna capable of radiating signals in all directions (360 degrees) in a circularly arranged structure (e.g., a satellite communication system), and a phased array antenna capable of adjusting the beam direction in real time by controlling the phase deviation (e.g., a military radar and a 5G system).

[0098] Array antennas can be widely used in modern wireless communication, radar, autonomous driving, and satellite communication systems due to their signal gain, directivity, and / or flexible beam control capabilities. Array antennas can be used in 5G or 6G networks as components of Massive MIMO and beamforming technologies.

[0099] FIGS. 9a and 9b are exemplary drawings of an antenna arranged in the form of a linear array on an FPCB according to one embodiment of the present disclosure.

[0100] Referring to FIG. 9a, the terminal (900) may be the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2. The terminal (900) may include a plurality of antennas (920–950) in the form of a linear array on top of a flexible RF line (910) that connects the top and bottom of the terminal (900) along the side. The flexible RF line (910) may be an RF line connecting a main board located at the top of the terminal (900) and a sub-board located at the bottom of the terminal (900). According to one embodiment, at least one of the plurality of antennas (920–950) in the form of a linear array may serve as a sub for a 6G band antenna and improve MIMO performance.

[0101] Referring to FIGS. 9a and 9b, a plurality of antennas (920 to 950) in the form of a linear array can be placed on the upper part of the battery (960) and on one side of the terminal (900).

[0102] FIGS. 9a and 9b illustrate, for convenience of explanation, an example is shown in which a flexible RF line (910) located below a plurality of antennas (920 to 950) in the form of a linear array is an RF line (Mainboard to sub-board) arranged along the side of a terminal (900); however, the type or location of the flexible RF line (910) is not limited thereto, and the technical concept of the present disclosure can be applied to flexible RF lines of various types or locations. According to one embodiment, the flexible RF line (910) located below a plurality of antennas (920 to 950) in the form of a linear array may include at least one of a display line (Mainboard to screen) connecting the mainboard and the screen, an RF line (Mainboard to sub-board) connecting the sub-board (or antenna) and the mainboard, and a mmW line connecting an antenna module that supports the mmW band.

[0103] FIGS. 10a and FIGS. 10b are exemplary drawings of an antenna arranged in the form of a planar array on an FPCB according to one embodiment of the present disclosure.

[0104] Referring to FIG. 10a, the terminal (1000) may be the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2. A coil (1010) is present in the center of the terminal (1000), and a plurality of antennas (1020 to 1050) in the form of a planar array may be implemented below the coil (1010). The coil (1010) and the plurality of antennas (1020 to 1050) in the form of a planar array may be located above the battery (1060) within the terminal (1000). The plurality of antennas (1020 to 1050) in the form of a planar array may be electrically connected to a flexible RF line (1070) that connects the top and bottom of the terminal (900) along the side of the terminal (1000). According to one embodiment, the coil (1010) can support Near Field Communication (NFC) communication of the terminal (1000). NFC is a contactless wireless communication technology that uses a frequency of 13.56 MHz and is capable of exchanging data over a short distance (within about 10 cm). It can be mainly used for convenient data transmission and payment systems between various devices such as smartphones, tablets, and cards.

[0105] The flexible RF line (1070) may be an RF line connecting a main board located at the top of the terminal (1000) and a sub board located at the bottom of the terminal (1000). According to one embodiment, at least one of a plurality of antennas (1020 to 1050) in the form of a planar array may serve as a sub for a 6G band antenna and can improve MIMO performance.

[0106] Referring to FIGS. 10a and 10b, a plurality of antennas (1020 to 1050) in the form of a planar array may be placed on one side of the upper part of the battery (1060).

[0107] FIGS. 10a and 10b illustrate, for convenience of explanation, an example is shown in which a flexible RF line (1070) connected to a plurality of antennas (1020 to 1050) in the form of a planar array is an RF line (Mainboard to sub-board) arranged along the side of a terminal (1000); however, the type or location of the flexible RF line (1070) is not limited thereto, and the technical concept of the present disclosure can be applied to flexible RF lines of various types or locations. According to one embodiment, the flexible RF line (1070) connected to a plurality of antennas (1020 to 1050) in the form of a planar array may include at least one of a display line (Mainboard to screen) connecting the mainboard and the screen, an RF line (Mainboard to sub-board) connecting the sub-board (or antenna) and the mainboard, and a mmW line connecting an antenna module that supports the mmW band.

[0108] FIGS. 11a and FIGS. 11b are exemplary drawings of an antenna arranged in a divided form on an FPCB according to one embodiment of the present disclosure.

[0109] Referring to FIG. 11a, the terminal (1100) may be the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2. The terminal (1100) may include a plurality of antennas (1130–1160) in the form of a linear array distributed on the upper portion of each of the plurality of flexible RF lines (1110–1120) connecting the upper portion and the lower portion of the terminal (1100).

[0110] The first flexible RF lines (1110) are mmW lines connecting antenna modules that support the mmW band, and the second flexible RF line (1120) may be an RF line connecting a main board located at the top of the terminal (1100) and a sub-board located at the bottom of the terminal (1100). According to one embodiment, at least one of a plurality of antennas (1130 to 1160) in the form of a linear array may serve as a sub-antenna for the 6G band antenna and can improve MIMO performance.

[0111] Referring to FIGS. 11a and 11b, a plurality of antennas (1130 to 1160) in the form of a linear array may be distributed and arranged on both sides of the upper part of the battery (1170) and the terminal (1100).

[0112] FIGS. 11a and 11b illustrate an example in which the first flexible RF lines (1110) are mmW lines and the second flexible RF line (1120) is an RF line (Mainboard to sub-board) for convenience of explanation, but the type or location of each of the first flexible RF lines (1110) and the second flexible RF line (1120) is not limited thereto, and the technical concept of the present disclosure can be applied to flexible RF lines of various types or locations. According to one embodiment, each of the first flexible RF lines (1110) and the second flexible RF line (1120) may be implemented as one of a display line (Mainboard to screen) connecting the mainboard and the screen, an RF line (Mainboard to sub-board) connecting the sub-board (or antenna) and the mainboard, or a mmW line connecting an antenna module that supports the mmW band.

[0113] FIG. 12 is an exemplary drawing of an antenna including a polarizer and a ring structure according to one embodiment of the present disclosure.

[0114] Referring to FIG. 12, the terminal (1200) may be the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2. The terminal (1200) may include an antenna (1210) configured with a stacked structure, a polarizer (1220), a ring structure (1230), and a flexible RF line (1240). A plurality of patch antennas may be disposed on at least a portion of the flexible RF line.

[0115] Since the antenna (1210) is designed with FPCB, there is a need to expand the bandwidth, and for isolation, a polarizer (1220) and a ring structure (1230) for bandwidth expansion can be added between the antenna (1210) and the flexible RF line (1240) instead of ground.

[0116] The polarizer (1220) acts as a filter that allows only light in a specific direction (polarization) to pass through, and can improve the clarity of the image and suppress reflections by controlling the light incident from the outside. The ring structure (1230) may be a structure designed primarily to optimize radiation characteristics in a specific frequency band or for the purpose of miniaturization and performance improvement, and may be designed in a circular or near-circular shape.

[0117] FIG. 13 is an example drawing of an FPCB array antenna that serves as a sub-role of a metal bezel antenna according to one embodiment of the present disclosure.

[0118] Referring to FIG. 13, the terminal (1300) may be the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2. The terminal (1300) may include a main antenna (1310), a first sub-antenna (Sub-1 antenna) (1320), and a second sub-antenna (Sub-2 antenna) (1330).

[0119] The second sub-antenna (1330) proposed in this disclosure can serve as a rear-radiating antenna within a MIMO system. The second sub-antenna (1330) does not operate alone but can operate together with the main antenna (1310) and / or the first sub-antenna (1320).

[0120] According to one embodiment, the second sub-antenna (1330) may support communication over the 6G band. The second sub-antenna (1330) may be implemented in an array form having rearward radiation characteristics on top of the battery and designed to improve MIMO performance while also enabling beam steering.

[0121] According to one embodiment, since the second sub-antenna (Sub-2 antenna) (1330) is a sub-antenna, it may exist in a zero-power state depending on the gripping condition or operating frequency, and power efficiency may be increased through on / off state switching.

[0122] Future 6G antennas may require beam steering at the terminal as well as MIMO. An array antenna structure is essential for beam steering, but it is not easy to add an array antenna structure to existing legacy antenna structures. Communication performance can be improved by adding a second sub-antenna (1330) that radiates from the rear in addition to the main antenna (1310) that radiates from the side.

[0123] In existing terminal structures, it was difficult to have a conventional array antenna due to the presence of a battery and coil, but by extending the FPCB RF line to add an array antenna, it is possible to add an array antenna with gain similar to a conventional patch antenna while solving physical problems such as interference and thickness.

[0124] According to one embodiment of the present disclosure, an antenna device may include: a first layer (L1) on which a flexible array antenna is disposed; a second layer (L2) stacked below the first layer (L1) and composed of a ground (GND); a third layer (L3) stacked below the second layer (L2) and having a plurality of flexible RF lines for transmitting an RF (radio frequency) signal and a ground (GND) disposed therein; and a fourth layer (L4) stacked below the third layer (L3) and composed of a ground (GND).

[0125] According to one embodiment, the flexible array antenna disposed in the first layer (L1) may be positioned vertically with respect to at least some of the plurality of flexible RF lines disposed in the third layer (L3).

[0126] According to one embodiment, the flexible array antenna disposed on the first layer (L1) is positioned vertically with respect to at least a portion of the battery and can be electrically connected to at least a portion of the plurality of flexible RF lines.

[0127] According to one embodiment, a first flexible array antenna disposed in the first layer (L1) may be positioned vertically with respect to at least a portion of the first flexible RF line disposed in the third layer (L3). According to one embodiment, a second flexible array antenna disposed in the first layer (L1) may be positioned vertically with respect to at least a portion of the second flexible RF line disposed in the third layer (L3).

[0128] According to one embodiment, the antenna device may further include a ground via (GND via) that is electrically connected to at least a portion of each of the first layer (L1), the second layer (L2), the third layer (L3), and the fourth layer (L4) and shares a ground (GND).

[0129] According to one embodiment, the flexible array antenna may include at least one of a linear array antenna arranged in a line, a planar array antenna capable of beam steering in a two-dimensional array in a vertical and horizontal direction, a circular array antenna capable of radiating signals in all directions in a circularly arranged structure, and a phased array antenna capable of controlling the beam direction in real time by controlling the phase deviation.

[0130] According to one embodiment, each of the plurality of flexible RF lines may be any one of a display line connecting a main board and a screen, an RF line connecting a sub-board and the main board, and a mmW line connecting an antenna module that supports the mmW band.

[0131] According to one embodiment, the second layer (L2) may include a polarizer and a ring structure for bandwidth expansion in place of the ground (GND).

[0132] According to one embodiment, the flexible array antenna may be located on the top of the battery and have rear radiation characteristics.

[0133] According to one embodiment, the antenna device further comprises N layers located below the third layer (L3) and above the fourth layer (L4), wherein a plurality of flexible RF lines for transmitting the RF signal and a ground (GND) are arranged, and N may be a natural number greater than or equal to 1.

[0134] According to one embodiment of the present disclosure, a terminal may include at least one antenna device. Each of the at least one antenna device may include: a first layer (L1) on which the flexible array antenna is disposed; a second layer (L2) stacked below the first layer (L1) and composed of ground (GND); a third layer (L3) stacked below the second layer (L2) and having a plurality of flexible RF lines for transmitting an RF (radio frequency) signal and ground (GND) disposed therein; and a fourth layer (L4) stacked below the third layer (L3) and composed of ground (GND).

[0135] Methods according to the embodiments described in the claims or specification of the present invention may be implemented in the form of hardware, software, or a combination of hardware and software.

[0136] When implemented in software, a computer-readable storage medium may be provided for storing one or more programs (software modules). One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. One or more programs include instructions that cause the electronic device to execute methods according to embodiments described in the claims or specification of the present invention.

[0137] Such programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, ROM (Read Only Memory), Electrically Erasable Programmable Read Only Memory (EEPROM), magnetic disc storage devices, Compact Disc-ROM (CD-ROM), Digital Versatile Discs (DVDs), or other forms of optical storage devices, magnetic cassettes. Alternatively, they may be stored in memory composed of some or all of these. Additionally, each constituent memory may include multiple units.

[0138] In addition, the above program may be stored on an attachable storage device that can be accessed via a communication network such as the Internet, Intranet, Local Area Network (LAN), Wide LAN (WLAN), or Storage Area Network (SAN), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present invention through an external port. Additionally, a separate storage device on a communication network may be connected to a device performing an embodiment of the present invention.

[0139] In the specific embodiments of the present invention described above, the components included in the invention are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present invention is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed in the singular form, or even if a component is expressed in the singular form, it may be composed in the plural form.

[0140] Meanwhile, although specific embodiments have been described in the detailed description of the present invention, it is understood that various modifications are possible within the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims set forth below as well as equivalents thereof.

Claims

1. An antenna device including a flexible array antenna, A first layer (L1) on which the above flexible array antenna is placed; A second layer (L2) stacked on the lower part of the first layer (L1) and composed of ground (GND); A third layer (L3) stacked on the lower part of the second layer (L2) above, wherein a plurality of flexible RF lines for transmitting RF (radio frequency) signals and a ground (GND) are arranged; and A device characterized by including a fourth layer (L4) stacked on the lower part of the third layer (L3) and composed of ground (GND).

2. In claim 1, the flexible array antenna disposed on the first layer (L1) is, A device characterized by being positioned vertically with respect to at least some of the plurality of flexible RF lines disposed in the third layer (L3).

3. In claim 1, the flexible array antenna disposed on the first layer (L1) is, A device characterized by being positioned vertically with respect to at least a portion of the battery and electrically connected to at least a portion of the plurality of flexible RF lines.

4. In claim 1, the first flexible array antenna disposed in the first layer (L1) is positioned perpendicularly to at least a portion of the first flexible RF line disposed in the third layer (L3), and A device characterized in that a second flexible array antenna disposed in the first layer (L1) is positioned vertically with respect to at least a portion of a second flexible RF line disposed in the third layer (L3).

5. In paragraph 1, the antenna device is, A device characterized by further including a ground via that is electrically connected to at least a portion of each of the first layer (L1), the second layer (L2), the third layer (L3), and the fourth layer (L4) and shares a ground (GND).

6. In paragraph 1, the flexible array antenna is, An apparatus characterized by comprising at least one of a linear array antenna arranged in a line, a planar array antenna capable of beam steering in vertical and horizontal directions with a two-dimensional array, a circular array antenna capable of radiating signals in all directions with a circularly arranged structure, and a phased array antenna capable of adjusting the beam direction in real time by controlling the phase deviation.

7. In paragraph 1, each of the plurality of flexible RF lines is, A device characterized by being one of a display line connecting a main board and a screen, an RF line connecting a sub-board and the main board, and a mmW line connecting an antenna module that supports the mmW band.

8. An apparatus according to claim 1, wherein the second layer (L2) comprises a polarizer and a ring structure for bandwidth expansion in place of the ground (GND).

9. The device according to claim 1, characterized in that the flexible array antenna is located on the upper part of the battery and has rear radiation characteristics.

10. In paragraph 1, the antenna device is, An apparatus characterized by further comprising N layers located below the third layer (L3) and above the fourth layer (L4), wherein a plurality of flexible RF lines for transmitting the RF signal and a ground (GND) are arranged, and wherein N is a natural number greater than or equal to 1.

11. A terminal comprising at least one antenna device, Each of the above-mentioned at least one antenna device is, A first layer (L1) on which a flexible array antenna is placed; A second layer (L2) stacked on the lower part of the first layer (L1) and composed of ground (GND); A third layer (L3) stacked on the lower part of the second layer (L2) above, wherein a plurality of flexible RF lines for transmitting RF (radio frequency) signals and a ground (GND) are arranged; and A terminal characterized by including a fourth layer (L4) stacked on the lower part of the third layer (L3) and composed of ground (GND).

12. In claim 11, the flexible array antenna disposed on the first layer (L1) is, A terminal characterized by being positioned vertically with respect to at least some of the plurality of flexible RF lines disposed in the third layer (L3).

13. In claim 11, the flexible array antenna disposed on the first layer (L1) is, A terminal characterized by being positioned vertically with respect to at least a portion of the battery within the terminal and being electrically connected to at least a portion of the plurality of flexible RF lines.

14. In claim 11, the first flexible array antenna disposed in the first layer (L1) is positioned perpendicularly to at least a portion of the first flexible RF line disposed in the third layer (L3), and A terminal characterized in that the second flexible array antenna disposed in the first layer (L1) is positioned vertically with respect to at least a portion of the second flexible RF line disposed in the third layer (L3).

15. In paragraph 11, the antenna device is, A terminal characterized by further including a ground via that is electrically connected to at least a portion of each of the first layer (L1), the second layer (L2), the third layer (L3), and the fourth layer (L4) and shares a ground (GND).

Images