Lighting device and automobile emblem
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2026-02-05
- Publication Date
- 2026-08-13
Smart Images

Figure KR2026002178_13082026_PF_FP_ABST
Abstract
Description
Lighting devices and car emblems
[0001] An embodiment of the invention relates to a lighting device.
[0002] An embodiment of the invention relates to an automobile emblem.
[0003] Lighting applications include not only automotive lighting but also backlights for displays and signage. Light-emitting devices, such as light-emitting diodes (LEDs), offer advantages over conventional light sources like fluorescent and incandescent lamps, including low power consumption, a semi-permanent lifespan, fast response speed, safety, and environmental friendliness. These light-emitting devices are applied to various lighting devices, such as display systems, interior lights, and exterior lights. Recently, lamps employing light-emitting devices have been proposed as automotive light sources. Compared to incandescent lamps, light-emitting devices are advantageous in that they consume less power. However, because the emission angle of light from the light-emitting device is small, there is a requirement to increase the light-emitting surface area when using light-emitting devices for automotive lamps. Since light-emitting devices are small, they allow for greater design freedom, and their semi-permanent lifespan provides economic benefits.
[0004] Recently, research and development are underway to apply modules using light-emitting elements as lighting devices to various vehicle components.
[0005] One of the technical problems of the present invention is to provide a lighting device and an automobile emblem having a thin thickness.
[0006] In addition, one of the other technical objectives of the present invention is to provide a lighting device capable of forming a surface light source and an automobile emblem.
[0007] A lighting device according to an embodiment comprises a substrate, a plurality of light sources disposed on the substrate, a resin layer sealing the plurality of light sources, a diffusion layer on the resin layer, a pattern layer disposed between the resin layer and the diffusion layer, and a light-transmitting cover covering the upper surface and side surfaces of the diffusion layer, wherein the light-transmitting cover includes an extension portion that extends to the upper surface of the substrate and contacts the upper surface of the substrate, and the pattern layer has a plurality of through holes and can contact at least one of the resin layer and the diffusion layer.
[0008] In addition, the number of the plurality of through holes per unit area may increase as it moves in the radial direction, based on the area that overlaps vertically with each of the plurality of light sources.
[0009] In addition, at least one end of the pattern layer may extend to the upper side of the resin layer.
[0010] In addition, at least one end of the pattern layer may extend to the lower side of the diffusion layer.
[0011] Additionally, it includes a housing disposed on the lower surface of the substrate, and the housing may include a side cover portion that covers the side of the substrate.
[0012] In addition, the side cover portion may be positioned lower than the bottom height of the pattern layer.
[0013] In addition, the side cover portion can cover the outer side of the extension portion of the transparent cover.
[0014] Additionally, it includes a light-blocking member disposed on the light-transmitting cover, wherein the light-transmitting cover has a recess concave in the direction of the substrate, and the light-blocking member may be disposed on the recess.
[0015] In addition, the light-blocking part may be superimposed in a vertical direction with each of the plurality of light sources.
[0016] In addition, the above-mentioned transparent cover may be a decorative film.
[0017] Additionally, the diffusion layer may include a first diffusion portion that does not overlap in a vertical direction with the recess and a second diffusion portion that overlaps in a vertical direction with the recess.
[0018] In addition, the lower surface of the first diffusion section and the lower surface of the second diffusion section may be arranged on the same plane.
[0019] In addition, the thickness of the first diffusion section may be greater than the thickness of the second diffusion section.
[0020] In addition, the thickness of the resin layer overlapping in the vertical direction of the first diffusion section and the thickness of the resin layer overlapping in the vertical direction of the second diffusion section may be the same.
[0021] In addition, the pattern layer may overlap the resin layer or the diffusion layer in a horizontal direction.
[0022] In addition, the resin layer may have a first protrusion disposed in the through hole of the pattern layer.
[0023] In addition, the diffusion layer may have a second protrusion disposed in the through hole of the pattern layer.
[0024] In addition, the light-blocking portion may also be placed on the side of the light-transmitting cover.
[0025] In addition, the light-blocking part may overlap horizontally with the first diffusion part or / and the second diffusion part.
[0026] In addition, the thickness of the above-mentioned transparent cover may be 300 to 400 μm.
[0027] In addition, the total thickness of the lighting device may be 5 mm or less.
[0028] The automobile emblem according to the embodiment may include any one of the lighting devices.
[0029] The lighting device of an embodiment of the invention may have a thin thickness.
[0030] In addition, the lighting device of the embodiment may have a surface light source.
[0031] In addition, the lighting device of the embodiment can prevent the hot spot phenomenon.
[0032] In addition, the lighting device of the embodiment may have improved moisture resistance, heat resistance, and corrosion resistance.
[0033] Figure 1 shows an emblem according to an embodiment of the present invention.
[0034] Figure 2 shows an emblem according to another embodiment.
[0035] Figure 3 roughly illustrates a light source placed inside an emblem.
[0036] Figure 4 is a cross-sectional view of A-A' in Figure 1.
[0037] Figure 5 is an enlarged view of area C in Figure 4.
[0038] Figure 6 is a modified example of region C of Figure 4.
[0039] Figure 7 shows a pattern layer according to an embodiment.
[0040] FIG. 8 shows an example of a modified pattern layer according to an embodiment.
[0041] FIG. 9 shows a first modified example of the AA' cross-section of FIG. 1.
[0042] FIG. 10 shows a second modified example of the AA' cross-section of FIG. 1.
[0043] FIG. 11 shows a third modified example of the AA' cross-section of FIG. 1.
[0044] Figure 12 is a cross-sectional view of B-B' in Figure 2.
[0045] Fig. 13 is a modified example of the BB of Fig. 2.
[0046] FIG. 14 illustrates a method for manufacturing a transparent cover according to an embodiment.
[0047] FIG. 15 shows a method for manufacturing a lighting device according to an embodiment.
[0048] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. The suffixes 'module' and 'part' for components used in the following description are assigned or used interchangeably for the sake of ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, the attached drawings are intended to facilitate an easy understanding of the embodiments disclosed in this specification, and the technical concepts disclosed in this specification are not limited by the attached drawings. Additionally, when an element such as a layer, region, or substrate is referred to as existing 'on' another component, this includes existing directly on the other element or having other intermediate elements existing between them.
[0049]
[0050] FIG. 1 shows an emblem according to an embodiment of the present invention, FIG. 2 shows an emblem according to another embodiment, FIG. 3 roughly discloses a light source placed inside the emblem, FIG. 4 is a cross-sectional view along A-A' of FIG. 1, FIG. 5 is an enlarged view of region C of FIG. 4, and FIG. 6 is a modified example of region C of FIG. 4.
[0051] FIG. 1(a) shows an image of the emblem (1000) of the embodiment not lit, FIG. 1(b) shows the emblem (1000) of the embodiment lit, and FIG. 3 shows another example of the emblem (1000) of the embodiment.
[0052] Referring to FIGS. 1 to 3, the emblem (1000) according to the embodiment may have thickness and form a three-dimensional effect. Additionally, the emblem (1000) may have various shapes such as letters, characters, logos, pictures, and symbols. The emblem (1000) may provide an aesthetic impression of a metallic material when not illuminated. As another example, the emblem (1000) may form a surface with various textures. When illuminated, the emblem (1000) may emit light from at least one of the upper surface and the side surface of the emblem (1000).
[0053] The above emblem (1000) has a lighting device (10) inside, and the lighting device (10) has a plurality of light sources (150), and the plurality of light sources (150) can be arranged according to the shape of the emblem (1000).
[0054] The emblem (1000) according to the embodiment may have a light-blocking portion (500) placed on a light-transmitting cover (300) to express a shape, letter, or signature logo (R), etc. The light-transmitting cover (300) may be a decorative film.
[0055] Referring to FIGS. 4 to 6, a lighting device (10) according to an embodiment may include a substrate (100), a plurality of light sources (150) disposed on the substrate (100), an optical layer (200) that seals the light sources (150), and a light-transmitting cover (300) that covers the optical layer (200).
[0056] The substrate (100) may include a printed circuit board (PCB). The substrate (100) may include, for example, at least one of a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 substrate. If the substrate (100) is a flexible PCB, the lighting device (10) may have flexible characteristics. The substrate (100) may be electrically connected to the plurality of light sources (150). The substrate (100) may be a single-layer substrate having a single wiring layer or a multi-layer substrate having a plurality of wiring layers.
[0057] The plurality of light sources (150) may include one or more light-emitting diodes (LEDs). Each of the plurality of light sources (150) may include one or more light-emitting diodes (LEDs) and a phosphor layer (illustrated), and may selectively emit blue, green, red, or white light through the light-emitting diode, or the light-emitting diode and the phosphor layer. As another example, the light source (150) may include an organic light-emitting diode (OLED). For example, the light-emitting diode (LED) may include a package having an LED chip and a transparent resin molding member disposed on the LED chip. The molding member may include a phosphor inside and may function as a phosphor layer. The LED package may be a Chip Scale Package (CSP), and the LED chip may be a flip chip. Each of the light sources (150) may emit at least one of blue, green, red, or white light, and may emit white light, for example. When the light source (150) emits white light, the LED chip emits blue light, and the phosphor layer can emit yellow light. As another example, the light source (150) can emit light of various colors such as cyan and amber. A single light source (150) may be placed in the center of the subpixel, or multiple light sources may be spaced apart from each other in the pixel.
[0058] The optical layer (200) may include at least one of a resin layer (210), a diffusion layer (220), and a pattern layer (230).
[0059] The resin layer (210) is disposed on the substrate (100) and can seal the plurality of light sources (150). The resin layer (210) may be a resin material such as silicone or epoxy, or may include at least one of a plastic resin material such as polyester (PET) film, PMMA (Poly Methyl Methacrylate) material, or PC (Poly Carbonate). Preferably, the resin layer (200) may be silicone or PMMA. Alternatively, the resin layer (500) may use a resin material with urethane acrylate oligomer as the main raw material.
[0060] The above diffusion layer (220) may be disposed on the resin layer (210). The diffusion layer (220) diffuses light emitted from the plurality of light sources (150) into a uniform light distribution, so that the lighting device (10) can form a surface light source. The diffusion layer (220) may be formed of a resin material such as silicone or epoxy. The diffusion layer (220) may be a transparent resin material. The diffusion layer (220) may contain a diffusing agent (not shown) inside, and the diffusing agent may include at least one of Al2O3, TiO2, SiO2, ZnO, and ZrO2. The diffusion layer (220) may be formed of a transparent resin or a translucent resin material.
[0061] The pattern layer (230) may be disposed between the resin layer (210) and the diffusion layer (220). The pattern layer (230) may be patterned on the resin layer (210) or the diffusion layer (220). For example, the pattern layer (230) may include at least one of a silk screen, black ink, silicone ink, high refractive index ink, and a light-blocking film.
[0062] The pattern layer (230) and the resin layer (210) may be in contact and may not form an air gap. Additionally, the pattern layer (230) and the diffusion layer (220) may be in contact and may not form an air gap. Additionally, at least one end of the pattern layer (230) may extend to the upper side of the resin layer (210). Additionally, at least one end of the pattern layer (230) may extend to the lower side of the diffusion layer (220).
[0063]
[0064] Referring to FIGS. 4 to 6, the pattern layer (230) may have a plurality of through holes (TH) that penetrate vertically. Either the resin layer (210) or the diffusion layer (220) may be disposed inside the plurality of through holes (TH). That is, the pattern layer may overlap horizontally with either the resin layer (210) or the diffusion layer (220). For example, referring to FIG. 5, when the pattern layer (230) is disposed on the diffusion layer (200) after the diffusion layer (220) is formed according to the manufacturing order, and the resin layer (210) is disposed on the pattern layer (230), the resin layer (210) may include a plurality of first protrusions (211) disposed within the plurality of through holes (TH). Light (L) emitted from the plurality of light sources (150) through the first protrusion (211) can be emitted to the diffusion layer (220).
[0065] As another example, referring to FIG. 6, when the pattern layer (230) is placed on the resin layer (210) and the diffusion layer (220) is placed on the pattern layer (230) after the resin layer (210) is formed according to the manufacturing order, the diffusion layer (220) may include a plurality of second protrusions (221) placed within the plurality of through holes (TH). Light (L) emitted from the plurality of light sources (150) can be emitted to the diffusion layer (220) through the second protrusions (221).
[0066] FIG. 7 shows a pattern layer according to an embodiment, and FIG. 8 shows a modified example of a pattern layer according to an embodiment.
[0067] Referring to FIGS. 4 to 7, the pattern layer (230) according to the embodiment may have a plurality of through holes (TH) and a blocking area. The blocking area may have a central area (BA) that overlaps in the vertical direction of the plurality of light sources (150). The light (L) may be reflected in the blocking area. The size per unit area or the number per unit area of the plurality of through holes (TH) may be formed small in the area adjacent to the central area (BA) and may become larger as it moves radially away from the central area (BA).
[0068] Light (L) emitted by the light source (150) may be reflected from the central region (BA) of the pattern layer (230) and directed toward the substrate (100) or the transparent cover (300). The light (L) directed toward the substrate (100) may be reflected again and transmitted through the through hole (TH) or emitted outward from the side of the transparent cover (300). For example, if a light-blocking portion is placed on the side of the transparent cover (300), it may be reflected from the side of the transparent cover (300) and directed toward the through hole (TH).
[0069] Referring to FIG. 8(a) and (b), a pattern layer (230a) according to a modified example may have a plurality of dot patterns (DT) disposed on a resin layer (210) or a diffusion layer (220) according to the manufacturing order of the lighting device. The plurality of dot patterns (DT) may include at least one of a silk screen, black ink, silicone ink, high refractive index ink, and a light-blocking film. For example, after the plurality of dot patterns (DT) are disposed on the resin layer (210), the diffusion layer (220) may be disposed in an area where the plurality of dot patterns (DT) are not disposed. For another example, after the plurality of dot patterns (DT) are disposed on the diffusion layer (220), the resin layer (210) may be disposed in an area where the plurality of dot patterns (DT) are not disposed.
[0070] Referring to FIG. 8(a), the plurality of dot patterns (DT) may also be placed in the central area (BA) which overlaps in a vertical direction with the plurality of light sources (150). The size per unit area or the number per unit area of the plurality of dot patterns (DT) may decrease as they move radially from the central area (BA). In other words, the density of the plurality of dot patterns (DT) may be greater in the central area (BA) and as they are adjacent to the central area (BA), and may decrease as they move toward the periphery.
[0071] Referring to FIG. 8(b), the pattern layer (230a) according to the modified example may include a central pattern disposed over the entire central region (BA). The plurality of dot patterns (DT) may be densely arranged at a location adjacent to the central region (BA) and may decrease as they extend radially from the central region (BA). The central pattern and the dot pattern (DT) may include at least one of a silk screen, black ink, silicone ink, high refractive index ink, and a light-blocking film.
[0072] Referring again to FIG. 4, the light-transmitting cover (300) can cover the optical layer (200). The light-transmitting cover (300) can come into contact with the upper surface and side surface of the optical layer (200). Specifically, the light-transmitting cover (300) can come into contact with the upper surface and side surface of the diffusion layer (220), and can come into contact with the side surface of the pattern layer (230) and the side surface of the resin layer (210).
[0073] The above-mentioned transparent cover (300) may come into contact with the upper surface of the substrate (100). The above-mentioned transparent cover (300) and the substrate (100) may be bonded together. The above-mentioned transparent cover (300) may include an extension portion (310) that extends parallel to the substrate (100) and comes into contact with the upper surface of the substrate (100). The extension portion (310) can increase the contact area with the substrate (100) to improve the bonding strength with the substrate (100).
[0074] The light-transmitting cover (300) can transmit light. The light-transmitting cover (300) may have a transmittance of 5% to 30%. The light-transmitting cover (300) may include metal or a specific color. The light-transmitting cover (300) may be a decorative film and may include silicone, PE, PP, PVC, PET, PU, EVA, PMMA, PC, etc. For example, the light-transmitting cover (300) may include a metal film made of a metal material. As another example, the light-transmitting cover (300) may form a metallic atmosphere by depositing a metal material such as tin, chromium, and alloys thereof onto a silicone material. The light-transmitting cover (300) may be manufactured through insert molding. The thickness (h1) of the light-transmitting cover (300) may have a range of 300㎛ to 400㎛. If the thickness (h1) of the transparent cover (300) is formed to be less than 300 μm, it may be vulnerable to external impact, and if the thickness (h1) of the transparent cover (300) exceeds 400 μm, the thickness of the entire emblem (1000) may increase and the light transmittance may decrease. The housing (400) may cover a portion of the substrate (100) and the transparent cover (300). The housing (400) may have a black color. The housing (400) may include a side cover portion (410) that contacts the lower surface and side of the substrate (100) and contacts the side of the extension portion (310) of the transparent cover (300).
[0075] The upper surface of the side cover portion (410) may be higher than or equal to the upper surface of the extension portion (310). The side cover portion (410) may be positioned lower than the lower height of the pattern layer (230). The side cover portion (410) may secure the substrate (100) and the transparent cover (300).
[0076] The housing (400) may include a silicone material. The housing (400) may mold a portion of the substrate (100) and the transparent cover (300). By the housing (400) molding the substrate (100) and the transparent cover (300), the moisture resistance, heat resistance, and corrosion resistance of the lighting device may be improved.
[0077] The thickness of the housing (400) may range from 0.5 mm to 1 mm. If the thickness of the housing (400) is less than 0.5 mm, it may be vulnerable to moisture and corrosion from the external environment, and if the thickness of the housing (400) exceeds 1 mm, the overall thickness of the lighting device (10) may increase.
[0078] The thickness (h2) from the lower surface of the substrate (100) to the upper surface of the optical layer (200), that is, the upper surface of the diffusion layer (220), may be 2 mm to 3 mm. If the thickness (h2) from the lower surface of the substrate (100) to the upper surface of the optical layer (200) is less than 2 mm, it may be difficult to form a surface light source because the light from the optical layer (200) cannot be sufficiently diffused, and if the thickness (h2) from the lower surface of the substrate (100) to the upper surface of the optical layer (200) exceeds 3 mm, the overall thickness of the lighting device (10) may be thick.
[0079] The total thickness (H) of the lighting device (10) may range from 3mm to 5mm. It is difficult to form the thickness (H) of the lighting device (10) to be less than 3mm, and even if it is formed to be less than 3mm, the emblem (1000) may be vulnerable to the external environment. In addition, if the total thickness (H) of the lighting device (10) exceeds 5mm, the emblem (1000) may protrude excessively, which may degrade the aesthetic appeal.
[0080]
[0081] FIG. 9 shows a first modified example of the AA' cross section of FIG. 1, FIG. 10 shows a second modified example of the AA' cross section of FIG. 1, and FIG. 11 shows a third modified example of the AA' cross section of FIG. 1.
[0082] Referring to FIG. 9, the light-transmitting cover (300) can form a first angle (R1) between the upper surface of the extension (310) and the side (320) of the light-transmitting cover. Since the light-transmitting cover (300) is manufactured by insert injection molding, the first angle (R1) between the side (320) of the light-transmitting cover (300) and the extension (310) can be selectively formed. For example, the first angle (R1) may be an acute angle. When the first angle (R1) is an acute angle, light emitted from the plurality of light sources (150) can be reflected by the side (320) of the light-transmitting cover (300) and evenly emitted to the upper surface of the light-transmitting cover (300).
[0083] The resin layer (210), the diffusion layer (220), and the pattern layer (230) of the optical layer (200) may have a side shape corresponding to the shape of the side (320) of the transparent cover (300).
[0084] Referring to FIG. 10, the optical layer (200) of the lighting device according to the embodiment has a resin layer (210) and a diffusion layer (220), and may not have a pattern layer (230).
[0085] Referring to FIG. 11, the optical layer (200) of the lighting device according to the embodiment may be formed only of a diffusion layer (230).
[0086] If the optical layer (200) has only a resin layer (210) and a diffusion layer (220), or has only the diffusion layer (220), the thickness (h2) from the lower surface of the substrate (100) to the upper surface of the optical layer (200) may have a range of 5 mm to 10 mm.
[0087] FIG. 12 is a cross-sectional view of B-B' of FIG. 2, and FIG. 13 is a modified example of BB of FIG. 2.
[0088] Referring to FIG. 12, a lighting device according to an embodiment may include a substrate (100), an optical layer (200) disposed on the substrate (100), a light-transmitting cover (300) covering the substrate (100) and the optical layer (200), and a housing (400) disposed on the lower part of the substrate (100).
[0089] The light-transmitting cover (300) may include a plurality of recesses (330). The lighting device may further include a plurality of light-blocking parts (500) disposed on the plurality of recesses (330). The light-blocking parts (500) may block light transmitted through the recesses (330).
[0090] The above recess (330) may be a concave groove facing the substrate (100). The above recess (330) may include a lower portion (331) and a side portion (332). The lower portion (331) and the side portion (332) of the above recess (330) may have a second angle (R2). The second angle (R2) may have any one of an acute angle, an obtuse angle, and a right angle. The second angle (R2) may be selectively formed according to the external shape of the emblem. Additionally, the plurality of above recesses (330) may each have the same or different second angles (R2). If the second angle (R2) has an acute angle, the light-blocking portion (500) may be prevented from being detached.
[0091] The above diffusion layer (220) may correspond to the shape of the above transparent cover (300). The above diffusion layer (220) may include a first diffusion section (221) that does not overlap vertically with the recess (330) and a second diffusion section (222) that overlaps vertically with the recess (330). The vertical thickness of the first diffusion section (221) may be different from the vertical thickness of the second diffusion section (222).
[0092] The resin layer (230) and the pattern layer (230) may have the same thickness in the vertical direction regardless of whether they overlap with the recess (330) in the vertical direction. That is, the upper surfaces of the resin layer (230) and the pattern layer (230) may be placed on the same plane regardless of whether they overlap with the recess (330) in the vertical direction. Additionally, the thickness of the resin layer overlapping with the first diffusion section (221) in the vertical direction and the thickness of the resin layer overlapping with the second diffusion section (222) in the vertical direction may be the same.
[0093] Meanwhile, the diffusion layer (220) may be implemented such that the vertical thickness of the first diffusion section (221), which does not overlap vertically with the recess (330), is thicker than the thickness of the second diffusion section (222), which overlaps vertically with the recess (330). Here, the vertical thickness may refer to the height from the lower surface in contact with the upper surface of the pattern layer (230) to the upper surface in contact with the lower surface of the transparent cover (300). Furthermore, the lower surfaces of the first diffusion section (221) and the second diffusion section (222) of the diffusion layer (220), which are in contact with the upper surface of the pattern layer (230), may be arranged on the same plane. The plurality of recesses (330) may be arranged at a position that does not overlap vertically with the plurality of light sources (150). As a result, the difference in the intensity of light emitted between the area where the plurality of recesses (330) are not placed and the area where the plurality of recesses (330) are formed may be greater.
[0094] The light-blocking portion (500) may also be placed on the side of the light-transmitting cover (300). By placing the light-blocking portion (500) on the side of the light-transmitting cover (300), light can be prevented from being emitted to the side of the lighting device. When the light-blocking portion (500) is placed on the side of the light-transmitting cover (300), the light-blocking portion (500) may overlap horizontally with the first diffusion portion (221) and / or the second diffusion portion.
[0095] Meanwhile, the light-transmitting cover (300) may include a plurality of regions with different heights from the upper surface of the substrate (100). For example, the light-transmitting cover (300) may include a first region (A1) having an upper surface greater than or equal to a first height, and a second region (A2) having an upper surface less than or equal to the first height. In addition, the light-transmitting cover (300) may not have a light-blocking part (500) disposed on the upper surface of the first region (A1), but may have a light-blocking part (500) disposed on the upper surface of the second region (A2). The first region (A1) may be an area corresponding to a letter or picture that the lighting device intends to display as an emblem, and the second region (A2) may be an area corresponding to a background other than the letter or picture that the emblem intends to display. The first height may be set in various ways depending on the design of the lighting device.
[0096] Referring to FIG. 13, the plurality of recesses (330) may overlap in a vertical direction with the plurality of light sources (150). That is, the recesses (330), the light-blocking part (500), and the light sources (150) may overlap in a vertical direction. As a result, it is possible to prevent hot spots from occurring in the transparent cover (300) area that overlaps in a vertical direction with the plurality of light sources (150). The remaining configuration of the lighting device may be substantially the same as the embodiment of FIG. 12, so a description is omitted.
[0097]
[0098] FIG. 14 illustrates a method for manufacturing a transparent cover according to an embodiment, and FIG. 15 illustrates a method for manufacturing a lighting device according to an embodiment.
[0099] Referring to FIG. 14, a process of heating can be performed on the transparent cover (300) according to the embodiment. Afterward, when the heated transparent cover (300) becomes flexible, a curvature can be formed in a desired direction through a blow process. Next, a process of applying a first mold (1) to the transparent cover (300) with the formed curvature is performed. At this time, the first mold (1) may have a shape corresponding to an emblem. That is, the first mold (1) may include a protrusion (not shown) for forming a plurality of recesses (330) of the transparent cover (300). In addition, when the first mold (1) applies pressure to the transparent cover (300), an extension (310) of the transparent cover (300) may be formed by the first mold (1). Afterward, a process of cooling the transparent cover (300) is performed. Finally, the mold (1) and the transparent cover (300) can be separated.
[0100] Referring to FIG. 15, the transparent cover (300), manufactured to have the shape of an emblem, may be placed in a second mold (2), and a resin liquid (200a) may be injected into the transparent cover (300). At this time, the second mold (2) may have a spaced-away space (S) that is spaced apart from the extension (310) of the transparent cover (300). The resin liquid (200a) may be cured to form an optical layer (200). If only the diffusion layer (220) of the optical layer (200) is included, the resin liquid (200a) corresponding to the diffusion layer (220) may be injected and cured. When the optical layer (200) includes a diffusion layer (220) and a resin layer (210), a resin liquid (200a) corresponding to the diffusion layer (220) can be injected and cured, and then a resin liquid (200a) corresponding to the resin layer (210) can be injected and cured. When the optical layer (200) includes a diffusion layer (220), a resin layer (210), and a pattern layer (230), a resin liquid (200a) corresponding to the diffusion layer (220) can be injected and cured, and after printing the pattern layer (230), a resin liquid (200a) corresponding to the resin layer (210) can be injected and cured. Next, before the resin liquid (200a) is completely cured, the substrate (100) on which the plurality of light sources (150) are arranged can be pressurized against the resin liquid (200a) and then cured. Subsequently, a step of coating the housing (400) on the substrate (100) may be performed. The housing (400) may be filled into the space (S) of the second mold (2) and may form a side cover portion (410) that covers the side of the substrate (100) and the side of the extension portion (310). Then, the second mold (2) may be removed. Optionally, if the transparent cover (300) has multiple recesses, a step of applying the light-blocking portion to the recesses and / or a step of applying the light-blocking portion to the side of the transparent cover (300) may be further performed.
[0101]
[0102] The lighting device of the present invention enables the implementation of a surface light source and the reduction of hot spots in a thin thickness, so it can be applied to various industrial fields. In particular, it can be applied to exhibitions, advertisements, signage, indoor and outdoor interior lighting, electronic device displays, and decorative lighting modules where a thin surface light source / decorative lighting is required.
[0103]
[0104] Although the above description has focused on the embodiments, this is merely an example and is not intended to limit the embodiments. A person skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments. For instance, each component specifically shown in the embodiments may be modified and implemented. Furthermore, differences related to such modifications and applications should be interpreted as being included within the scope of the embodiments set forth in the appended claims.
Claims
1. Substrate; A plurality of light sources disposed on the above substrate; A resin layer that seals the above plurality of light sources; A diffusion layer on the above resin layer; A pattern layer disposed between the resin layer and the diffusion layer; and It includes a transparent cover that covers the upper surface and sides of the above-mentioned diffusion layer, and The above-mentioned transparent cover includes an extension that extends to the upper surface of the substrate and contacts the upper surface of the substrate, and A lighting device having a plurality of through holes in the pattern layer and in contact with at least one of the resin layer and the diffusion layer.
2. In Paragraph 1, A lighting device in which the number of the plurality of through holes per unit area increases in the radial direction based on the area superimposed vertically with each of the plurality of light sources.
3. In Paragraph 1 or 2, It includes a housing disposed on the lower surface of the above substrate, The above housing is a lighting device comprising a side cover portion that covers the side of the substrate.
4. In Paragraph 3, The above side cover portion is a lighting device positioned lower than the bottom height of the pattern layer.
5. In Paragraph 3, The above side cover portion is a lighting device that covers the outer side of the extension portion of the above light-transmitting cover.
6. In Paragraph 1 or 2, It includes a light-blocking portion disposed on the above-mentioned light-transmitting cover, and The above-mentioned transparent cover has a concave recess in the direction of the substrate, and The light-blocking part is a lighting device placed on the recess.
7. In Paragraph 6, The light-blocking part is a lighting device that overlaps vertically with each of the plurality of light sources.
8. In Paragraph 6, A lighting device comprising a diffusion layer including a first diffusion portion that does not overlap in a vertical direction with the recess and a second diffusion portion that overlaps in a vertical direction with the recess.
9. In Paragraph 6, The light-blocking part is a lighting device that is also positioned on the side of the light-transmitting cover.
10. An automobile emblem including a lighting device according to claims 1 through 9.