Conductive sealant composition for electromagnetic wave shielding and door assembly for home appliances employing same

Abstract

The present invention relates to a conductive sealant composition for electromagnetic wave shielding and a door assembly employing same. Particularly, by employing a conductive filler comprising a first filler including conductive particles and a second filler including conductive fibers, the sealant composition of the present invention can be provided as a conductive sealant composition for electromagnetic wave shielding that ensures conductivity, electromagnetic wave shielding properties, heat resistance, moisture resistance, and workability.

Description

Conductive sealant composition for electromagnetic shielding and door assembly for home appliances applying the same

[0001] The present invention relates to a conductive sealant composition for electromagnetic shielding and a door assembly for a home appliance to which the same is applied.

[0002] Unlike cooking appliances that rely on heat conduction or radiation, home appliances such as microwave ovens and lightwave ovens cook food by irradiating it with electromagnetic waves, utilizing dielectric heating caused by the translational motion of water molecules contained within the food.

[0003] At this time, while the aforementioned electromagnetic waves can rapidly heat food, if they leak outside the cooking chamber, the cooking efficiency of the appliance may decrease, and in particular, damage to the user's body may occur due to electromagnetic waves that are harmful to the human body.

[0004] Various technologies for shielding such electromagnetic waves are known. One known technology involves applying a porous plate to the door of home appliances to shield electromagnetic waves. However, porous plates are made of thick metal material, and holes are arranged at regular intervals to shield the waves. The structure of such porous plates reduces the visibility of the front glass installed on the appliance.

[0005] In addition, a technology for shielding electromagnetic waves using metal wires with a mesh structure is known. The width of the metal wire is 100 nm to 30 μm, which allows for improved visibility compared to the porous plate described above. However, to fabricate the mesh structure of the metal wire, a pattern must be formed through the exposure-development-etching-stripping process. Consequently, the mesh structure of the metal wire involves a very complex and costly process. Furthermore, the mesh structure of the metal wire can easily be stripped, which may cause leakage of electromagnetic waves, and electromagnetic waves may concentrate at defective areas, potentially leading to a fire.

[0006] However, if the porous plate is removed from the door of the home appliance, electromagnetic waves such as microwaves may leak from the fine gap between the door frame and the glass.

[0007] Accordingly, there is a need for microwave shielding technology that can ensure visibility while possessing excellent electromagnetic shielding performance, and can also be manufactured using a relatively simple method.

[0008] The object of the present invention is to provide a novel conductive sealant composition for electromagnetic shielding capable of preventing leakage of electromagnetic waves such as microwaves.

[0009] In addition, an object of the present invention is to provide a novel conductive sealant composition for electromagnetic shielding having conductivity, heat resistance, and moisture resistance.

[0010] In addition, the objective of the present invention is to provide a door assembly for a home appliance that can prevent electromagnetic wave leakage while excluding a porous plate.

[0011] In addition, the objective of the present invention is to provide a novel door assembly for a home appliance that ensures reliability even at the operating temperature of the home appliance.

[0012] The objects of the present invention are not limited to those mentioned above, and other unmentioned objects and advantages of the present invention may be understood from the following description and will be more clearly understood by the embodiments of the present invention. Furthermore, it will be readily apparent that the objects and advantages of the present invention can be realized by the means and combinations thereof set forth in the claims.

[0013] In order to solve the aforementioned technical problem, the present invention provides a sealant composition comprising conductive particles and conductive fibers as filler components for shielding electromagnetic waves leaking from gaps in the joints and connecting parts of a door assembly.

[0014] Specifically, the conductive sealant composition for electromagnetic shielding of the present invention comprises a silicone resin; and a conductive filler, wherein the conductive filler comprises a first filler comprising conductive particles and a second filler comprising conductive fibers.

[0015] Here, the conductive filler may be included in an amount of 20 to 80 weight%, and preferably, the ratio of the first filler to the second filler may satisfy 9:1 to 3:1.

[0016] At this time, the first filler may be composed of conductive non-metallic particles, and the first filler may include one or more of graphite, carbon black, and activated carbon.

[0017] In addition, the second filler may be composed of conductive non-metallic fibers, and the second filler may include one or more of carbon fibers, carbon nanotubes, graphene fibers, and graphite fibers.

[0018]

[0019] Next, the door assembly for a home appliance according to the present invention comprises: glass; a door frame coupled to the glass; and a sealing portion formed to seal a gap formed between the glass and the door frame; wherein the sealing portion is formed from a conductive sealant composition for electromagnetic shielding comprising silicone resin and a conductive filler, and the conductive filler comprises a first filler comprising conductive particles and a second filler comprising conductive fibers.

[0020] In addition, a door assembly for a home appliance according to another embodiment of the present invention comprises: a door panel; a front glass disposed on the front portion of the door panel; a door frame disposed on the back portion of the door panel; a microwave shielding glass disposed between the door panel and the door frame; and a sealing portion formed to seal a gap formed between the microwave shielding glass and the door frame or a gap formed between the microwave shielding glass and the door panel; wherein the sealing portion is formed from a conductive sealant composition for electromagnetic shielding comprising a silicone resin and a conductive filler, and the conductive filler comprises a first filler comprising conductive particles and a second filler comprising conductive fibers.

[0021] According to the present invention, a novel conductive sealant composition for electromagnetic shielding capable of shielding electromagnetic waves such as microwaves can be provided.

[0022] Conventional conductive sealant compositions for electromagnetic shielding utilize metals or the like as the conductive component. Consequently, these conventional compositions are uneconomical, and their conductivity decreases and shielding performance deteriorates in high-temperature and high-humidity environments. However, the conductive sealant composition for electromagnetic shielding according to the present invention is more economical and exhibits excellent heat resistance and moisture resistance.

[0023] In addition, the present invention can provide a door assembly that can be manufactured using a relatively simple method and has excellent electromagnetic shielding capabilities.

[0024] In addition, the present invention can provide a novel door assembly that ensures reliability even at the operating temperature of a home appliance.

[0025] In addition to the effects described above, the specific effects of the present invention are described together with the specific details for implementing the invention below.

[0026] Figure 1 is an SEM image of a sealing portion formed from a conductive sealant composition for electromagnetic shielding.

[0027] FIG. 2 is an exploded perspective view of a door assembly for a home appliance according to an embodiment of the present invention.

[0028] FIG. 3 is a cross-sectional view of a door assembly for a home appliance according to an embodiment of the present invention.

[0029] FIG. 4 is an exploded perspective view of a door assembly according to another embodiment of the present invention.

[0030] FIG. 5 is an exploded perspective view of a door assembly according to another embodiment of the present invention.

[0031]

[0032] The aforementioned objectives, features, and advantages are described in detail below with reference to the attached drawings, thereby enabling those skilled in the art to easily implement the technical concept of the present invention. In describing the present invention, detailed descriptions of known technologies related to the present invention are omitted if it is determined that such descriptions would unnecessarily obscure the essence of the invention. Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the attached drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

[0033] Singular expressions used in this specification include plural expressions unless the context clearly indicates otherwise. In this application, terms such as "composed of" or "comprising" should not be interpreted as necessarily including all of the various components or steps described in the specification, and should be interpreted as meaning that some of the components or steps may be omitted or additional components or steps may be included.

[0034] Hereinafter, a microwave shielding coating according to the present invention and a door assembly for a home appliance to which the same is applied will be described in detail with reference to the drawings.

[0035]

[0036] Conductive sealant composition for electromagnetic shielding

[0037]

[0038] The conductive sealant composition for electromagnetic shielding of the present invention comprises a silicone resin; and a conductive filler, wherein the conductive filler comprises a first filler comprising conductive particles and a second filler comprising conductive fibers.

[0039]

[0040] First, the above-mentioned silicone resin will be described. The above-mentioned silicone resin acts as a dispersion medium within the sealant composition.

[0041]

[0042] The silicone resin used in the present invention may preferably be a room temperature moisture-curing silicone resin. A room temperature moisture-curing type means that when extruded from a container and left in the air for use, a cross-linking reaction proceeds due to the moisture, thereby obtaining a rubber elastomer.

[0043] Such room temperature moisture-curing silicone resins can be preferably used in the present invention due to their workability and suitability as sealing materials.

[0044] Room temperature moisture-curing silicone resins may include one-component silicone resins of the deoxygenated, deamined, or deacetic acid type.

[0045] The content of the silicone resin used in the present invention is preferably 20 to 80 weight percent based on the total sealant composition. If the content of the silicone resin exceeds 80 weight percent, the electromagnetic shielding efficiency may decrease. On the other hand, if the content of the silicone resin is less than 20 weight percent, the viscosity becomes excessively high, which reduces workability and causes a problem where it cannot function as a sealing material.

[0046]

[0047] Next, conductive fillers will be explained.

[0048] The conductive filler is a component that imparts electrical conductivity to the sealant composition.

[0049] In the present invention, the conductive filler comprises a first filler comprising conductive particles and a second filler comprising conductive fibers.

[0050]

[0051] Referring to Fig. 1, an SEM image of a sealing material formed from a sealant composition can be seen.

[0052] (A) of FIG. 1 is a sealing material composed mainly of a silicon matrix and graphite particles (carbon particles), (B) is a sealing material composed mainly of a silicon matrix and carbon fibers (carbon fabric), and (C) is a sealing material composed mainly of a silicon matrix, graphite particles (carbon particles), and carbon fibers (carbon fabric).

[0053] The sealing material formed from the electromagnetic shielding conductive sealant composition of the present invention comprises a first filler containing conductive particles and a second filler containing conductive fibers, as shown in (C) of FIG. 1.

[0054] The first filler and the second filler can form a network with each other, and the sealing material exhibits excellent electrical properties even when used in small amounts. Furthermore, due to the first and second fillers, the sealing material can possess excellent electromagnetic shielding, heat resistance, moisture resistance, and workability in addition to electrical properties.

[0055]

[0056] The conductive filler may be included in an amount of 20 to 80 weight percent based on 100 weight percent of the composition. If the conductive filler is used in an amount of less than 20 weight percent, the conductivity, adhesion, heat resistance, and moisture resistance of the sealant composition may be reduced. On the other hand, if the conductive filler exceeds 80 weight percent, the fluidity of the sealant composition may be reduced and the viscosity of the sealant composition may increase rapidly.

[0057]

[0058] Here, the first filler may be composed of conductive non-metallic particles. Conventional paste compositions for electromagnetic shielding use metal particles as fillers. In this case, metal particles may oxidize or corrode in high-temperature and high-humidity environments. However, the conductive sealant composition for electromagnetic shielding according to the present invention includes a first filler composed of non-metallic particles, thereby possessing excellent conductivity and electromagnetic shielding properties, as well as excellent heat resistance and moisture resistance.

[0059] In addition, preferably, the first filler may include one or more of graphite, carbon black, and activated carbon.

[0060] As described above, the first filler may have a particle shape and, preferably, a spherical particle shape. The average particle size of the first filler may be 0.1 to 70 μm, and preferably 1 to 50 μm. If the average particle size of the first filler is less than 0.1 μm, the particles may aggregate, reducing dispersibility and decreasing conductivity. Additionally, if the average particle size of the first filler exceeds 70 μm, the continuity of the sealing material surface may decrease, and conductivity may decrease.

[0061]

[0062] Here, the second filler may be composed of conductive non-metallic fibers. As described above, conventional conductive sealant compositions for electromagnetic shielding use metal particles as fillers. In this case, the metal particles may oxidize or corrode in high-temperature and high-humidity environments. However, the conductive sealant composition for electromagnetic shielding according to the present invention includes a second filler composed of non-metallic fibers, thereby possessing excellent conductivity and electromagnetic shielding properties, as well as excellent heat resistance and moisture resistance.

[0063] Additionally, preferably, the second filler may include one or more of carbon fibers, carbon nanotubes, graphene fibers, and graphite fibers.

[0064] As described above, the second filler has a fiber form. The fibers of the second filler may have an average particle size of 5 to 10 μm and an average length of 50 to 150 μm. More preferably, the fibers of the second filler may have an average particle size of 6 to 8 μm and a length of 80 to 120 μm. In particular, if the average length of the second filler is less than 50 μm, conductivity may be reduced due to insufficient contact between the fillers. Additionally, if the average length of the second filler exceeds 150 μm, workability may be reduced.

[0065]

[0066] Preferably, the ratio of the first filler to the second filler may satisfy 9:1 to 3:1. When the above range is satisfied, the sealant composition of the present invention may have excellent conductivity, heat resistance, moisture resistance, electromagnetic shielding properties, and workability.

[0067]

[0068] In addition, the conductive sealant composition for electromagnetic shielding of the present invention may further include additional components such as an organosiloxane and an adhesion enhancer.

[0069]

[0070] The above organosiloxane can be used to control the curing time of the sealant composition and to adjust the viscosity.

[0071] The above organosiloxane may be a compound represented by the chemical formula 1 below.

[0072]

[0073] [Chemical Formula 1]

[0074]

[0075] In the above chemical formula 1, R1 and R2 may each be formed of a methyl group, a phenyl group, a hydrogen atom, a hydroxyl group, a fluoroalkyl group, a polyoxyalkyl group, a long-chain alkyl group, and an aminoalkyl group. m and n are integers of 1 or more. Preferably, m and n may be 5 or less.

[0076] The above-mentioned organosiloxane may be included in the composition in an amount of 10% by weight or less, preferably 5% by weight or less. If the above-mentioned organosiloxane exceeds 10% by weight, the extrusion performance of the composition of the present invention may be reduced, and workability during the curing process may be reduced.

[0077]

[0078] The above adhesion enhancer can be used to enhance the adhesion of the electromagnetic shielding conductive sealant composition of the present invention.

[0079] One or more of the above adhesion enhancers may be used among aminosilane, vinylsilane, epoxysilane, alkylsilane, acrylicsilane, and phenylsilane, and preferably, aminosilane may be used as the adhesion enhancer.

[0080] The above adhesive reinforcing agent may be used in an amount of 3 weight percent or less in the composition. If the above adhesive reinforcing agent exceeds 3 weight percent, the sealing portion formed from the composition of the present invention may become discolored and reliability may be reduced.

[0081]

[0082] Door assembly for home appliances

[0083]

[0084] Next, we will describe the door assembly for home appliances.

[0085]

[0086] FIG. 2 is an exploded perspective view illustrating a door assembly (10) for a home appliance according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of a door assembly (10) for a home appliance according to an embodiment of the present invention.

[0087] Referring to FIGS. 2 and 3, the door assembly (10) for a home appliance according to the present invention comprises a glass (1); a door frame (2) coupled to the glass (1); and a sealing portion (TC) formed to seal a gap formed between the glass (1) and the door frame (2). The sealing portion (TC) is formed from a conductive sealant composition for electromagnetic shielding comprising a silicone resin and a conductive filler, wherein the conductive filler comprises a first filler comprising conductive particles and a second filler comprising conductive fibers.

[0088]

[0089] First, the glass (1) may be made of a general glass material used for doors of home appliances. Here, preferably, a coating for shielding electromagnetic waves may be formed on one side of the glass (1).

[0090] The glass (1) can be joined to and fixed to the door frame (2). The method of joining the glass (1) and the door frame (2) is not particularly limited. At this time, a fine gap may be formed in the joint between the glass (1) and the door frame (2). The sealing part (TC) seals the gap formed between the glass (1) and the door frame (2) so as to eliminate all of the fine gaps described above.

[0091] The conductive sealant composition for electromagnetic shielding forming the sealing portion (TC) is as described above.

[0092]

[0093] Next, a door assembly for a home appliance according to another embodiment of the present invention will be described in detail.

[0094]

[0095] FIG. 4 is an exploded perspective view illustrating a door assembly (100) for a home appliance according to another embodiment of the present invention.

[0096] Referring to FIG. 4, a door assembly (100) for a home appliance according to the present invention comprises: a door panel (3); a front glass (4) disposed on the front portion of the door panel (3); a door frame (2) disposed on the back portion of the door panel (3); a microwave shielding glass (1) disposed between the door panel (3) and the door frame (2); and a sealing portion (not shown) formed to seal a gap formed between the microwave shielding glass (1) and the door frame (2) or a gap formed between the microwave shielding glass (1) and the door panel (3); wherein the sealing portion is formed from a conductive sealant composition for electromagnetic shielding comprising a silicone resin and a conductive filler, and the conductive filler comprises a first filler comprising conductive particles and a second filler comprising conductive fibers.

[0097]

[0098] The above door panel (3) is configured in the shape of a panel for installing a front glass (4). The above front glass (4) is a part that forms the front of the door assembly and is made of glass material. The above door frame (2) is configured to function as the body of the door assembly.

[0099]

[0100] The door assembly (100) for a home appliance according to the present invention includes a microwave shielding glass (1) disposed between the door panel (3) and the door frame (2). The microwave shielding glass (1) may be coupled and fixed to the door panel (3). Additionally, the microwave shielding glass (1) may be coupled and fixed to the door frame (2). At this time, the method of coupling the microwave shielding glass (1) with the door panel (3) or the door frame (2) is not particularly limited.

[0101] Here, preferably, a microwave shielding coating may be formed on one side of the microwave shielding glass (1).

[0102] At this time, a fine gap may be formed in the joint between the glass (1) and the door panel (3) or in the joint between the glass (1) and the door frame (2). The sealing part (not shown) seals the gap formed between the glass (1) and the door panel (3) or between the glass (1) and the door frame (2) so as to eliminate all of the fine gaps described above.

[0103] The conductive sealant composition for electromagnetic shielding forming the sealing portion is as described above.

[0104]

[0105] FIG. 5 is an exploded perspective view illustrating a door assembly (101) for a home appliance according to another embodiment of the present invention.

[0106] Referring to FIG. 5, the door assembly (101) for a home appliance according to the present invention may further include a second microwave shielding glass (6) located between the door panel (3) and the front glass (4); and a second sealing portion (not shown) formed to seal a gap formed between the second microwave shielding glass (6) and the door panel (2); wherein the second sealing portion is formed from a conductive sealant composition for electromagnetic shielding comprising a silicone resin and a conductive filler, and the conductive filler may include a first filler comprising conductive particles and a second filler comprising conductive fibers.

[0107] Here, a microwave shielding coating may be formed on one side of the second microwave shielding glass (6).

[0108] At this time, a fine gap may be formed in the joint between the second microwave shielding glass (6) and the door panel (3). The second sealing part (not shown) seals the gap formed between the glass (6) and the door panel (3) so as to eliminate all of the fine gaps described above.

[0109] The conductive sealant composition for electromagnetic shielding forming the second sealing portion is as described above.

[0110] Additionally, referring to FIG. 5, the door assembly (101) for a home appliance according to the present invention may further include a choke panel (5) on the back surface of the door frame (3). The leakage of microwaves and electromagnetic waves can be more firmly prevented by the choke panel (5).

[0111]

[0112] <Example>

[0113] The present invention will be described below based on preferred embodiments. However, the present invention is not limited by the embodiments.

[0114]

[0115] 1. Example 1

[0116] A door assembly with a structure as shown in Fig. 2 was fabricated. First, a glass substrate with a microwave shielding coating was prepared. Then, the glass substrate was joined to a door frame, and the joint between the glass substrate and the door frame was sealed using a conductive sealant composition for electromagnetic shielding as shown below.

[0117]

[0118] <Components of a Conductive Sealant Composition for Electromagnetic Shielding>

[0119] Silicone resin: As a room-temperature moisture-curing silicone resin, a deoxygenated one-component silicone resin is used.

[0120] First filler: As shown in Table 1.

[0121] Second filler: As shown in Table 1.

[0122] Organosiloxane: Polydimethylsiloxane is used.

[0123] Adhesion curing agent: Aminosilane is used.

[0124]

[0125] The composition ratios of the above-mentioned components are as shown in Table 1 below.

[0126]

[0127] 2. Examples 2 to 3, Comparative Examples 1 to 3

[0128] Examples 2 to 3 and Comparative Examples 1 to 3 were prepared in the same manner as Example 1 described above, and the specific details are as shown in Table 1 below.

[0129]

[0130] Composition (wt%) Total Matrix Primary Filler Secondary Filler Silicone Resin Organic Siloxane Adhesion Reinforcer Graphite Carbon Black Carbon Fiber CNT Example 1 35.12.60.948.24.48.80100 Example 2 36.72.70.950.54.63.70.9100 Example 3 60.63.51.31.724.28.70100 Comparative Example 1 38.52.9152.94.700100 Comparative Example 2 20.23170.75.100100 Comparative Example 3 59.62.80.94.632.100100

[0131]

[0132] <Experimental Example>

[0133]

[0134] 1. Electromagnetic Shielding Performance Evaluation

[0135] The electromagnetic shielding performance of the above-described embodiments and comparative examples was evaluated.

[0136] The electromagnetic shielding performance was evaluated by measuring whether electromagnetic waves leaked from the above examples and comparative examples. The performance evaluation was performed by inserting an example sample into the middle of a waveguide and measuring using a Network Analyzer (Agilent E5071C). It was evaluated as NG if electromagnetic waves leaked and OK if they did not leak.

[0137]

[0138] 2. Reliability Evaluation

[0139] Reliability was evaluated by checking whether the electromagnetic shielding performance of the example samples deteriorated after leaving the example samples in a chamber at 220°C for 621 hours.

[0140]

[0141] 3. Evaluation Results

[0142] The results of the above-mentioned evaluation are listed in Table 2.

[0143]

[0144] Characteristic Reliability Evaluation Before Characteristic Evaluation Characteristic Evaluation Results After Reliability Evaluation Characteristic Evaluation Results Surface Resistance (Ω / □) Leakage Evaluation Surface Resistance (Ω / □) Leakage Evaluation Example 1 17OK 15OK Example 2 12OK 9OK Example 3 23OK 22OK Comparative Example 13 12NG 308NG Comparative Example 26 2OK 60OK Comparative Example 35 62NG 557NG

[0145]

[0146] As shown in Table 2, all embodiments of the present invention have excellent electromagnetic shielding performance. In particular, the embodiments of the present invention have relatively low sheet resistance and excellent electromagnetic shielding performance. Furthermore, the embodiments of the present invention have excellent performance even after reliability evaluation and also have excellent workability.

[0147] In contrast, the comparative examples have high sheet resistance and poor electromagnetic shielding performance. Comparative Example 2 shows excellent electromagnetic shielding performance because it has a high filler content, but it has a problem of high sheet resistance and poor workability because it does not include a second filler.

[0148] In summary, all embodiments of the present invention exhibit excellent electromagnetic shielding performance, conductivity, heat resistance, moisture resistance, and workability. Furthermore, all embodiments of the present invention exhibit excellent heat resistance at the operating temperatures of lightwave ovens or microwave ovens.

[0149]

[0150] Although the present invention has been described above with reference to the illustrated drawings, the present invention is not limited by the embodiments and drawings disclosed in this specification, and it is obvious that various modifications can be made by a person skilled in the art within the scope of the technical concept of the present invention. Furthermore, even if the effects of the configuration of the present invention were not explicitly described while explaining the embodiments of the present invention above, it is natural to acknowledge that the effects predictable by said configuration should also be recognized.

Claims

1. silicone resin; and conductive filler, comprising, The above conductive filler is A first filler comprising conductive particles and a second filler comprising conductive fibers Conductive sealant composition for electromagnetic shielding.

2. In Paragraph 1 The above conductive filler is Included in an amount of 20 to 80 weight% Conductive sealant composition for electromagnetic shielding.

3. In Paragraph 1 The ratio of the first filler and the second filler Satisfying 9:1 ~ 3:1 Conductive sealant composition for electromagnetic shielding.

4. In Paragraph 1 The first filler above is composed of conductive non-metallic particles, and The second filler above is composed of conductive non-metallic fibers. Conductive sealant composition for electromagnetic shielding.

5. In Paragraph 1 The first filler above is composed of conductive non-metallic particles, and The second filler above is composed of conductive non-metallic fibers. Conductive sealant composition for electromagnetic shielding.

6. In Paragraph 1 The above first filler is Includes one or more of graphite, carbon black, and activated carbon Conductive sealant composition for electromagnetic shielding.

7. In Paragraph 1 The above second filler is Includes one or more of carbon fibers, carbon nanotubes, graphene fibers, and graphite fibers Conductive sealant composition for electromagnetic shielding.

8. In Paragraph 1 further comprising organosiloxane and adhesion enhancer Conductive sealant composition for electromagnetic shielding.

9. Glass; A door frame combined with the above glass; and A sealing portion formed to seal the gap formed between the glass and the door frame; The above sealing part Formed from a conductive sealant composition for electromagnetic shielding comprising a silicone resin; and a conductive filler, The above conductive filler is A first filler comprising conductive particles and a second filler comprising conductive fibers Door assembly for home appliances.

10. Door panel; Front glass disposed on the front portion of the above door panel; A door frame positioned on the rear side of the above door panel; Microwave shielding glass disposed between the door panel and the door frame; and A sealing portion formed to seal a gap formed between the microwave shielding glass and the door frame or a gap formed between the microwave shielding glass and the door panel; comprising The above sealing part Formed from a conductive sealant composition for electromagnetic shielding comprising a silicone resin; and a conductive filler, The above conductive filler is A first filler comprising conductive particles and a second filler comprising conductive fibers Door assembly for home appliances.

11. In Paragraph 10, A second microwave shielding glass located between the door panel and the front glass; A second sealing portion formed to seal the gap formed between the second microwave shielding glass and the door panel; comprising The above second sealing part Formed from a conductive sealant composition for electromagnetic shielding comprising a silicone resin; and a conductive filler, The above conductive filler is A first filler comprising conductive particles and a second filler comprising conductive fibers Door assembly for home appliances.

12. In Paragraph 9 or 10 The above conductive filler is Included in an amount of 20 to 80 weight% Door assembly for home appliances.

13. In Paragraph 9 or 10 The ratio of the first filler and the second filler Satisfying 9:1 ~ 3:1 Door assembly for home appliances.

14. In Paragraph 9 or 10 The first filler above is composed of conductive non-metallic particles, and The second filler above is composed of conductive non-metallic fibers. Door assembly for home appliances.

15. In Paragraph 9 or 10 The first filler above is composed of conductive non-metallic particles, and The second filler above is composed of conductive non-metallic fibers. Door assembly for home appliances.

16. In Paragraph 9 or 10 The above first filler is Includes one or more of graphite, carbon black, and activated carbon Door assembly for home appliances.

17. In Paragraph 9 or 10 The above second filler is Includes one or more of carbon fibers, carbon nanotubes, graphene fibers, and graphite fibers Door assembly for home appliances.

18. In Paragraph 9 or 10 further comprising organosiloxane and adhesion enhancer Door assembly for home appliances.

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