Substrate processing chamber

Abstract

A substrate processing chamber includes a first actuator coupled to a first shaft to raise and lower a substrate support, and a second actuator coupled to a second shaft to raise and lower a seal plate disposed below the substrate support. The processing chamber further includes a third actuator coupled to a third shaft to raise and lower a hoop plate to operate a plurality of lift pins.

Description

PATENTAttorney Docket No.: 44025319WO01SUBSTRATE PROCESSING CHAMBERBACKGROUNDField

[0001] Embodiments of the present disclosure generally relate to substrate processing chambers, and particularly to mechanisms for manipulating components within substrate processing chambers.Description of the Related Art

[0002] Substrate processing chambers, such as those used in semiconductor processing or the like, typically have a substrate support that can be moved vertically between a lowered position and a raised position. The substrate support is moved to the raised position to facilitate the processing of a substrate disposed thereon. The substrate support is moved to the lowered position to facilitate the transfer of a substrate into, and out of, the processing chamber. Lift pins are typically used to support and position a substrate during substrate transfer operations. In some processing chambers, the lift pins are actuated by a mechanism that is coupled to the mechanism that raises and lowers the substrate support. In some processing chambers, a seal plate is disposed below the substrate support. The seal plate is configured to form a seal with another chamber component, such as a liner assembly, when the substrate support is in the raised position.

[0003] In some processing chambers, when the substrate support is in the raised position, the seal between the seal plate and the chamber component can be compromised by misalignment of the seal plate with respect to the chamber component. The compromised seal can result in a waste of processing gases or the deposition of contaminants in various regions of the processing chamber.

[0004] There is a need for improved systems and processes that facilitate actuation of the substrate support and the lift pins, and effective sealing of the seal plate.PATENTAttorney Docket No.: 44025319WO01SUMMARY

[0005] The present disclosure generally relates to substrate processing chambers. In one aspect, a processing chamber includes a chamber body that includes a floor. A substrate support is disposed in the chamber body. A first shaft is coupled to the substrate support, and extends through the floor to a first actuator that is configured to raise and lower the first shaft and the substrate support. A seal plate is disposed in the chamber body below the substrate support. A second shaft is coupled to the seal plate, and extends through the floor to a second actuator that is configured to raise and lower the second shaft and the seal plate. A plurality of lift pins extends through the seal plate. A hoop plate is disposed in the chamber body below the plurality of lift pins. A third shaft is coupled to the hoop plate, and extends through the floor to a third actuator that is configured to raise and lower the third shaft and the hoop plate.

[0006] In another aspect, a processing chamber includes a chamber body that includes a floor. A substrate support is disposed in the chamber body. A first shaft is coupled to the substrate support, and extends through a first aperture in the floor to a first actuator that is configured to raise and lower the first shaft and the substrate support. A seal plate is disposed in the chamber body below the substrate support. A second shaft is coupled to the seal plate, and extends through a second aperture in the floor to a second actuator that is configured to raise and lower the second shaft and the seal plate with respect to the substrate support.

[0007] In another aspect, a processing chamber includes a chamber body that includes a floor. A seal plate is disposed in the chamber body. A first shaft is coupled to the seal plate, and extends through the floor to a first actuator that is configured to raise and lower the first shaft and the seal plate. A plurality of lift pins extends through the seal plate. A hoop plate is disposed in the chamber body below the plurality of lift pins. A second shaft is coupled to the hoop plate, and extends through the floor to a second actuator that is configured to raise and lower the second shaft and the hoop plate. The first shaft extends through the second shaft.PATENTAttorney Docket No.: 44025319WO01BRIEF DESCRIPTION OF THE DRAWINGS

[0008] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of the scope of the disclosure, as the disclosure may admit to other equally effective embodiments.

[0009] Figure 1 is a schematic cross-sectional view of a processing chamber.

[0010] Figure 2 schematically illustrates an embodiment of certain components of the processing chamber of Figure 1.

[0011] Figures 3A and 3B schematically illustrate the embodiment of Figure 2 in operation.

[0012] Figures 4A and 4B schematically illustrate another embodiment of certain components of the processing chamber of Figure 1 in operation.

[0013] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. One or more elements or features of any one embodiment or example may be beneficially incorporated in any one or more other non-mutually exclusive embodiments or examples.DETAILED DESCRIPTION

[0014] The present disclosure concerns substrate processing chambers, and particularly to mechanisms for manipulating components within substrate processing chambers.

[0015] Figure 1 is a schematic cross-sectional view of a processing chamber 100. In general, the processing chamber 100 can be configured as any one orPATENTAttorney Docket No.: 44025319WO01more of an atomic layer deposition (ALD) chamber, chemical vapor deposition (CVD) chamber, physical vapor deposition (PVD) chamber, etch chamber, degas chamber, an ion implantation chamber, ashing chamber, cleaning chamber, a thermal processing chamber (e.g., rapid thermal processing, anneal, cool down, thermal management control), a plasma processing chamber, or other type of substrate processing chamber.

[0016] The processing chamber 100 includes a chamber body 110 including one or more sidewalls 112 and a floor 114. A liner 130 is disposed within the chamber body 110. The liner 130 may be made of a ceramic material, such as an aluminum oxide, aluminum nitride, or silicon carbide. Substrates (such as substrate 134) enter and exit the processing chamber 100 through an access port 136 at one of the sidewalls 112. A lid 140 is coupled to the chamber body 110. A conduit 142 through the lid 140 conveys process gases from a gas source 144 to a plenum 146 between the lid 140 and a showerhead 148.

[0017] In some embodiments that may be combined with other embodiments, the liner 130 at least partially forms an annular exhaust channel 120. The exhaust channel 120 provides a flow path for evacuating fluids, such as process gases, from at least a portion of the processing chamber 100. The exhaust channel 120 is fluidically coupled to a vacuum system 240 via an exhaust vent 122.

[0018] In some embodiments that may be combined with other embodiments, an atmosphere control system 250 is fluidically coupled to the processing chamber 100 at one or more ports 124. In some embodiments that may be combined with other embodiments, the atmosphere control system 250 includes one or more gas sources configured to provide one or more gases into the processing chamber 100. Exemplary gases include purge gases, or cleaning gases. In some embodiments that may be combined with other embodiments, the atmosphere control system 250 includes, or is coupled to, a vacuum system (such as the vacuum system 240) in order to adjust a pressure inside at least a portion of the processing chamber 100. In some embodimentsPATENTAttorney Docket No.: 44025319WO01that may be combined with other embodiments, the atmosphere control system 250 and / or the one or more ports 124 may be omitted.

[0019] A substrate support 150, such as a susceptor or a pedestal, is disposed in the processing chamber 100. The substrate support 150 may be metallic (e.g., a stainless steel), or may be made of a ceramic material, such as an aluminum oxide, aluminum nitride, or silicon carbide. The substrate support 150 includes a support surface on which the substrate 134 can be disposed for processing.

[0020] The substrate support 150 is coupled to a shaft, such as support shaft 156. The support shaft 156 extends through an aperture 126 in the floor 114 of the processing chamber 100, and is coupled (e.g., via a support bracket 158) to an actuator 160 that raises and lowers the substrate support 150 along the Z axis. In some examples that may be combined with other examples, the actuator 160 includes a motor 162, such as a stepper motor, that rotates a lead screw 164 that is disposed in a channel 166. A follower 168 is engaged with the lead screw 164. The follower 168 is coupled to the support shaft 156, such as via the support bracket 158. Rotation of the lead screw 164 by the motor 162 causes the follower 168 to move along the channel 166, and so raises or lowers the support shaft 156 and substrate support 150 accordingly. In some examples that may be combined with other examples, instead of the motor 162, the actuator 160 includes a piston that is coupled to the follower 168.

[0021] In some embodiments that may be combined with other embodiments, the support shaft 156 is coupled to another actuator 170, such as a motor, that rotates the substrate support 150 about the Z axis in the X-Y plane. In some examples, that may be combined with other examples, the actuator 170 is coupled to the support bracket 158.

[0022] A bellows 232 external to the processing chamber 100 is coupled between the support shaft 156 and the chamber body 110. The bellows 232 circumscribes the support shaft 156. As illustrated, in some embodiments that may be combined with other embodiments, the coupling between the bellowsPATENTAttorney Docket No.: 44025319WO01232 and the support shaft 156 is at the support bracket 158. In some embodiments that may be combined with other embodiments, the coupling between the bellows 232 and the support shaft 156 is at a portion of the support shaft 156. As illustrated, in some embodiments that may be combined with other embodiments, the coupling between the bellows 232 and the chamber body 110 is at the floor 114. The bellows 232 is sealingly coupled between the support shaft 156 and the chamber body 110 to isolate an environment within the bellows 232 from an environment external to the bellows 232. The bellows 232 is extendable and contractible along the Z axis in order to accommodate movement of the support shaft 156 along the Z axis with respect to the chamber body 110.

[0023] In some embodiments that may be combined with other embodiments, the substrate support 150 includes a chucking electrode. In some embodiments that may be combined with other embodiments, the substrate support 150 includes a heater. In some embodiments that may be combined with other embodiments, the substrate support 150 includes one or more coolant channels for flowing a cooling fluid, such as a glycol (e.g., ethylene glycol). As illustrated, in some embodiments that may be combined with other embodiments, an edge ring 154 is disposed on the substrate support 150. The edge ring 154 is an annular member that encircles the substrate 134 (disposed on the support surface 152) in the X-Y plane. In some embodiments that may be combined with other embodiments, any one or more of the heater, the chucking electrode, the one or more coolant channels, or the edge ring 154 may be omitted.

[0024] A seal plate 180 is disposed in the chamber body 110 below the substrate support 150. The seal plate 180 is an annular member disposed around the support shaft 156. The seal plate 180 may be metallic (e.g., a stainless steel), or may be made of a ceramic material, such as an aluminum oxide, aluminum nitride, or silicon carbide. In some embodiments that may be combined with other embodiments, one or more seal members 184 are disposed at a periphery of the seal plate 180. As illustrated, in some examplesPATENTAttorney Docket No.: 44025319WO01that may be combined with other examples, the one or more seal members 184 includes a lip seal. In some examples that may be combined with other examples, the one or more seal members 184 includes an o-ring, an x-ring, or a labyrinth seal. In some examples that may be combined with other examples, the one or more seal members 184 includes an RF gasket.

[0025] The one or more seal members 184 are configured to make sealing contact with the liner 130. As illustrated, in some examples that may be combined with other examples, the one or more seal members 184 are disposed at an upward-facing surface of the seal plate 180, and are configured to make sealing contact with an under surface 132 of the liner 130. The under surface 132 extends in the X-Y plane. In some examples that may be combined with other examples, the one or more seal members 184 are disposed at a radially outwardly-facing surface of the seal plate 180, and are configured to make sealing contact with an inwardly-facing surface of the liner 130.

[0026] The seal plate 180 is coupled to a shaft, such as seal shaft 186. The seal shaft 186 extends through an aperture 128 in the floor 114 of the processing chamber 100. As illustrated, in some embodiments that may be combined with other embodiments, the aperture 128 is separate from the aperture 126. The seal shaft 186 is coupled (e.g., via a seal bracket 188) to an actuator 190 that raises and lowers the seal plate 180 along the Z axis. In some examples that may be combined with other examples, the actuator 190 includes a motor 192, such as a stepper motor, that rotates a lead screw 194 that is disposed in a channel 196. A follower 198 is engaged with the lead screw 194. The follower 198 is coupled to the seal shaft 186, such as via the seal bracket 188. Rotation of the lead screw 194 by the motor 192 causes the follower 198 to move along the channel 196, and so raises or lowers the seal shaft 186 and seal plate 180 accordingly. In some examples that may be combined with other examples, instead of the motor 192, the actuator 190 includes a piston that is coupled to the follower 198.

[0027] In embodiments in which the one or more seal members 184 are disposed at an upward-facing surface of the seal plate 180, movement of thePATENTAttorney Docket No.: 44025319WO01seal plate 180 along the Z axis moves the one or more seal members 184 into and out of sealing contact with the liner 130. The seal plate 180 is illustrated in a raised position with the one or more seal members 184 in sealing contact with the under surface 132 of the liner 130.

[0028] A bellows 234 in the processing chamber 100 is coupled between the seal plate 180 and the chamber body 110. The bellows 234 circumscribes the support shaft 156. As illustrated, in some embodiments that may be combined with other embodiments, the bellows 234 is coupled to a neck 182 of the seal plate 180. As illustrated, in some embodiments that may be combined with other embodiments, the coupling between the bellows 234 and the chamber body 110 is at a base 115 of the chamber body 110. In some embodiments that may be combined with other embodiments, the coupling between the bellows 234 and the chamber body 110 is at the floor 114. The bellows 234 is sealingly coupled between the seal plate 180 and the chamber body 110 to isolate an environment within the bellows 234 from an environment external to the bellows 234. The bellows 234 is extendable and contractible along the Z axis in order to accommodate movement of the seal plate 180 along the Z axis with respect to the chamber body 110.

[0029] A plurality of lift pins 210 is coupled to the seal plate 180 and to the substrate support 150. In some embodiments there are three lift pins 210, although other quantities, such as four, five, or six lift pins 210 are contemplated. Each lift pin 210 extends through the seal plate 180 and into the substrate support 150. A portion of each lift pin 210 extends below the seal plate 180.

[0030] Each lift pin 210 is coupled to a corresponding bellows 235, such as at a base 212 of each lift pin 210 below the seal plate 180. Each bellows 235 circumscribes the corresponding lift pin 210, and is coupled to the seal plate 180. Each bellows 235 is sealingly coupled between the seal plate 180 and the corresponding lift pin 210 to isolate an environment within the bellows 235 from an environment external to the bellows 235. Each bellows 235 is extendablePATENTAttorney Docket No.: 44025319WO01and contractible along the Z axis in order to accommodate movement of each corresponding lift pin 210 along the Z axis with respect to the seal plate 180.

[0031] The lift pins 210 are moved along the Z axis with respect to the substrate support 150 and with respect to the seal plate 180 by a hoop plate 214 that circumscribes the support shaft 156. The lift pins 210 are moved along the Z axis between lowered and raised positions with respect to the substrate support 150 to facilitate transfer of substrates 134 into and out of the processing chamber 100. Upward movement of the lift pins 210 is achieved by moving the hoop plate 214 upwards along the Z axis to engage the base 212 of each lift pin 210. Further upward movement of the hoop plate 214 causes each lift pin 210 to move towards the raised position with respect to the substrate support 150. Each lift pin 210 moves through a corresponding aperture in the substrate support 150, such that an upper end of each lift pin 210 projects above the support surface 152 of the substrate support 150.

[0032] Downward movement of the lift pins 210 with respect to the substrate support 150 is achieved by moving the hoop plate 214 downwards along the Z axis with respect to the substrate support 150. The lift pins 210 move downwards towards the lowered position with respect to the substrate support 150 under gravity. In some embodiments that may be combined with other embodiments, each lift pin 210 is biased towards the lowered position with respect to the substrate support 150 by a corresponding biasing member, such as a spring. In some examples that may be combined with other examples, the bellows 235 acts as the biasing member.

[0033] The hoop plate 214 is coupled to a shaft, such as lift shaft 216. The lift shaft 216 extends through the aperture 128 in the floor 114 of the processing chamber 100, and is coupled (e.g., via a lift bracket 218) to an actuator 220 that raises and lowers the hoop plate 214 along the Z axis. In some examples that may be combined with other examples, the actuator 220 includes a motor 222, such as a stepper motor, that rotates a lead screw 224 that is disposed in a channel 226. A follower 228 is engaged with the lead screw 224. The follower 228 is coupled to the lift shaft 216, such as via the lift bracket 218. Rotation ofPATENTAttorney Docket No.: 44025319WO01the lead screw 224 by the motor 222 causes the follower 228 to move along the channel 226, and so raises or lowers the lift shaft 216 and hoop plate 214 accordingly. In some examples that may be combined with other examples, instead of the motor 222, the actuator 220 includes a piston that is coupled to the follower 228.

[0034] A bellows 236 external to the processing chamber 100 is coupled between the lift shaft 216 and the chamber body 110. The bellows 236 circumscribes the lift shaft 216. As illustrated, in some embodiments that may be combined with other embodiments, the coupling between the bellows 236 and the lift shaft 216 is at the lift bracket 218. In some embodiments that may be combined with other embodiments, the coupling between the bellows 236 and the lift shaft 216 is at a portion of the lift shaft 216. As illustrated, in some embodiments that may be combined with other embodiments, the coupling between the bellows 236 and the chamber body 110 is at the floor 114. The bellows 236 is sealingly coupled between the lift shaft 216 and the chamber body 110 to isolate an environment within the bellows 236 from an environment external to the bellows 236. The bellows 236 is extendable and contractible along the Z axis in order to accommodate movement of the lift shaft 216 along the Z axis with respect to the chamber body 110.

[0035] As illustrated, in some embodiments that may be combined with other embodiments, the lift shaft 216 is hollow. The seal shaft 186 is disposed though the lift shaft 216. In some embodiments that may be combined with other embodiments, the seal shaft 186 is coaxial with the lift shaft 216. The seal shaft 186 extends above and below the lift shaft 216. The seal shaft 186 extends through the lift bracket 218 to the seal bracket 188.

[0036] A bellows 238 is coupled between the lift bracket 218 and the seal bracket 188. The bellows 238 circumscribes the seal shaft 186. The bellows 238 is sealingly coupled between the lift bracket 218 and the seal bracket 188 to isolate an environment within the bellows 238 from an environment external to the bellows 238. The bellows 238 is extendable and contractible along thePATENTAttorney Docket No.: 44025319WO01Z axis in order to accommodate relative movement along the Z axis between the lift bracket 218 and the seal bracket 188.

[0037] In some embodiments that may be combined with other embodiments, operation of the processing chamber 100 is controlled by a controller 200. The controller 200 includes a central processing unit (CPU), a memory containing instructions, and support circuits for the CPU. The memory, or non-transitory computer readable medium, is one or more of a readily available memory such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, flash drive, or any other form of digital storage, local or remote. The support circuits are coupled to the CPU for supporting the CPU. The support circuits include cache, power supplies, clock circuits, input / output circuitry and subsystems, and the like. Operations and operating parameters are stored in the memory as a software routine that is executed or invoked to configure the controller 200 into a specific purpose controller to control the operations of the processing chamber 100. The controller 200 is configured to conduct one or more of the operations described herein. The instructions stored on the memory, when executed, cause one or more of the operations described herein to be conducted.

[0038] In some embodiments that may be combined with other embodiments, the controller 200 manages the operation of each actuator 160, 190, 220. In some embodiments that may be combined with other embodiments, the controller 200 manages the delivery of gas into the processing chamber 100 from the gas source 144. In some embodiments that may be combined with other embodiments, the controller 200 manages the operation of the vacuum system 240. In some embodiments that may be combined with other embodiments, the controller 200 manages the operation of the atmosphere control system 250. In some embodiments that may be combined with other embodiments, the controller 200 manages substrate transfer operations.PATENTAttorney Docket No.: 44025319WO01

[0039] The controller 200 includes, or is coupled to, a transmitter / receiver that facilitates communication with other devices, such as a base station or other controllers of other processing chambers or other systems.

[0040] In some embodiments that may be combined with other embodiments, each actuator 160, 190, 220 is controlled independently of each other actuator 160, 190, 220. In some examples that may be combined with other examples, the actuator 160 is operated to move the substrate support 150 while the actuator 190 and the actuator 220 remain dormant. In such examples, the actuator 160 moves the substrate support 150 with respect to the seal plate 180 and with respect to the hoop plate 214. In further examples that may be combined with other examples, the actuator 190 is operated to move the seal plate 180 while the actuator 160 and the actuator 220 remain dormant. In such examples, the actuator 160 moves the seal plate 180 with respect to the substrate support 150 and with respect to the hoop plate 214. In further examples that may be combined with other examples, the actuator 220 is operated to move the hoop plate 214 while the actuator 160 and the actuator 190 remain dormant. In such examples, the actuator 220 moves the hoop plate 214 with respect to the substrate support 150 and with respect to the seal plate 180.

[0041] In some embodiments that may be combined with other embodiments, operations of the actuator 160 (that raises and lowers the substrate support 150) and the actuator 190 (that raises and lowers the seal plate 180) are coordinated so as to avoid one of the substrate support 150 or the seal plate 180 impeding the movement of the other of the substrate support 150 or the seal plate 180. For example, operations of the actuators 160, 190 may be performed simultaneously. Alternatively, or additionally, operations of the actuators 160, 190 may be performed sequentially.

[0042] In some embodiments that may be combined with other embodiments, operations of the actuator 220 (that raises and lowers the hoop plate 214) and the actuator 190 (that raises and lowers the seal plate 180) are coordinated so as to avoid one of the hoop plate 214 or the seal plate 180PATENTAttorney Docket No.: 44025319WO01impeding the movement of the other of the hoop plate 214 or the seal plate 180. For example, operations of the actuators 190, 220 may be performed simultaneously. Alternatively, or additionally, operations of the actuators 190, 220 may be performed sequentially.

[0043] In some embodiments that may be combined with other embodiments, operations of the actuator 220 (that raises and lowers the hoop plate 214) and the actuator 190 (that raises and lowers the seal plate 180) are coordinated so as to avoid inadvertent actuation of the lift pins 210. For example, operations of the actuators 190, 220 may be performed simultaneously. Alternatively, or additionally, operations of the actuators 190, 200 may be performed sequentially.

[0044] In some embodiments that may be combined with other embodiments, operations of the actuator 220 (that raises and lowers the hoop plate 214) and the actuator 190 (that raises and lowers the seal plate 180) are coordinated so as to avoid one of the lift bracket 218 or the seal bracket 188 impeding the movement of the other of the lift bracket 218 or the seal bracket 188. For example, operations of the actuators 190, 220 may be performed simultaneously. Alternatively, or additionally, operations of the actuators 190, 220 may be performed sequentially.

[0045] In some embodiments that may be combined with other embodiments, operations of the actuator 160 (that raises and lowers the substrate support 150) and the actuator 220 (that raises and lowers the hoop plate 214) are coordinated so as to move the lift pins 210 when desired during a substrate transfer operation. For example, operations of the actuators 160, 220 may be performed simultaneously. Alternatively, or additionally, operations of the actuators 160, 220 may be performed sequentially.

[0046] In some embodiments that may be combined with other embodiments, operations of the actuator 160 (that raises and lowers the substrate support 150) and the actuator 220 (that raises and lowers the hoop plate 214) are coordinated so as to avoid inadvertent actuation of the lift pinsPATENTAttorney Docket No.: 44025319WO01210. For example, operations of the actuators 160, 220 may be performed simultaneously. Alternatively, or additionally, operations of the actuators 160, 220 may be performed sequentially.

[0047] As illustrated, when the seal plate 180 is positioned such that the one or more seal members 184 are in sealing contact with the liner 130, an interior of the processing chamber 100 is segregated into at least two distinct volumes. The distinct volumes include a processing volume 102 and an auxiliary volume 104.

[0048] The processing volume 102 is between the showerhead 148 and the seal plate 180, and includes the space in which the substrate 134 is disposed during processing. Additional space is in fluid communication with the processing volume 102. The additional space includes space inside each bellows 235 that circumscribes a corresponding lift pin 210, space inside the bellows 234 and base 115 that circumscribes the support shaft 156, and space inside the bellows 232 external to the processing chamber 100 that circumscribes the support shaft 156.

[0049] In some embodiments that may be combined with other embodiments, the size of the processing volume 102 is within a range of 0.3 litres to 5 litres (0.3 L to 5 L). In some examples that may be combined with other examples, the size of the processing volume 102 is greater than or equal to 0.4 L, such as greater than or equal to 0.5 L, 0.7 L, 1.0 L, 1.5 L, 2.0 L, 2.5 L, 3.0 L, 3.5 L, or 4.0 L. In some examples that may be combined with other examples, the size of the processing volume 102 is less than or equal to 4.5 L, such as less than or equal to 4.0 L, 3.5 L, 3.0 L, 2.5 L, 2.0 L, 1.5 L, or 1.0 L.

[0050] The auxiliary volume 104 is between the seal plate 180 and the floor 114. Additional space is in fluid communication with the auxiliary volume 104. The additional space includes space inside the bellows 236 that circumscribes the lift shaft 216, and includes space inside the bellows 238 that circumscribes the seal shaft 186.PATENTAttorney Docket No.: 44025319WO01

[0051] In some embodiments that may be combined with other embodiments, the size of the auxiliary volume 104 is greater than the size of the processing volume 102. In some examples that may be combined with other examples, the size of the auxiliary volume 104 is at least 1.5 times the size of the processing volume 102, such as at least 2.0 times, 2.5 times, 3.0 times, 3.5 times, or 4.0 times the size of the processing volume 102.

[0052] In some embodiments that may be combined with other embodiments, the processing volume 102 is fluidically isolated from the auxiliary volume 104 when the seal plate 180 is positioned such that the one or more seal members 184 are in sealing contact with the liner 130. In such embodiments, the exhaust channel 120 and the vacuum system 240 evacuate fluids, such as process gases, from the processing volume 102, but not from the auxiliary volume 104. Additionally, in such embodiments, the atmosphere control system 250 is fluidically coupled to the auxiliary volume 104 of the processing chamber 100, but not to the processing volume 102.

[0053] In some embodiments that may be combined with other embodiments, when the seal plate 180 is positioned such that the one or more seal members 184 are in sealing contact with the liner 130, the controller 200 manages the pressure and / or temperature within the processing volume 102. For example, the controller 200 manages at least one of the temperature of a heater of the substrate support 150, a flow of coolant through the substrate support 150, the delivery of gas into the processing chamber 100 from the gas source 144, or the operation of the vacuum system 240.

[0054] In some embodiments that may be combined with other embodiments, when the seal plate 180 is positioned such that the one or more seal members 184 are in sealing contact with the liner 130, the controller 200 manages the pressure and / or temperature within the auxiliary volume 104. For example, the controller 200 manages the operation of the atmosphere control system 250. In some examples that may be combined with other examples, the controller 200 regulates the pressure in the auxiliary volume 104 to be greater than the pressure in the processing volume 102 in order to hinderPATENTAttorney Docket No.: 44025319WO01leakage of process gases from the processing volume 102 to the auxiliary volume 104. In some examples that may be combined with other examples, the controller 200 regulates the pressure in the auxiliary volume 104 to be less than or equal to an ambient pressure external to the processing chamber 100.

[0055] Figure 2 schematically illustrates an embodiment of the coupling between the seal plate 180 and the seal shaft 186. The seal plate 180 is coupled to the seal shaft 186 by a ball joint 260. The upper end of the seal shaft 186 includes a ball 262 that is engaged with a corresponding socket 264 in the seal plate 180. The seal shaft 186 is secured to the seal plate 180 by a cover 266. The cover 266 encircles the seal shaft 186.

[0056] A gap 268 between the seal shaft 186 and the surrounding cover 266 permits the seal plate 180 to pivot on the ball 262 in the X-Z and Y-Z planes. The seal plate 180 can pivot on the ball 262 such that an orientation of a lateral axis 181 of the seal plate 180 varies from being perpendicular to a longitudinal axis 187 of the seal shaft 186 to being at an acute angle with respect to the longitudinal axis 187 of the seal shaft 186. In some embodiments that may be combined with other embodiments, the angle between the lateral axis 181 of the seal plate 180 and the longitudinal axis 187 of the seal shaft 186 is from 80 to 90 degrees, such as 82 to 90 degrees, 85 to 90 degrees, or 87 to 90 degrees.

[0057] Figures 3A and 3B schematically illustrate how the ball joint 260 facilitates the formation of a seal when the seal plate 180 is moved upwards along the Z axis towards the under surface 132 of the liner 130. Other components are omitted from the Figures for clarity. When the one or more seal members 184 are out of contact from the under surface 132 of the liner 130, gravity causes the seal plate 180 to tilt around the ball joint 260. The lateral axis 181 of the seal plate 180 is at an acute angle to the longitudinal axis 187 of the seal shaft 186, as depicted in Figure 3A.

[0058] A first portion 272 of the one or more seal members 184 proximal to the seal shaft 186 is at a distance 276 to the under surface 132 of the liner 130. A second portion 274 of the one or more seal members 184 distal from the sealPATENTAttorney Docket No.: 44025319WO01shaft 186 is at a distance 278 to the under surface 132 of the liner 130. The distance 278 is greater than the distance 276. The one or more seal members 184 are annular, and the first portion 272 is diametrically opposite the second portion 276.

[0059] Moving the seal plate 180 upwards along the Z axis brings the first portion 272 of the one or more seal members 184 into contact with the under surface 132 of the liner 130. Additionally, or alternatively, moving the seal plate 180 upwards along the Z axis brings an edge of the seal plate 180 proximal to the first portion of the one or more seal members 184 into contact with the under surface 132 of the liner 130. As shown in Figure 3A, the second portion 274 of the one or more seal members 184 remains out of contact with the under surface 132 of the liner 130. Continued movement of the seal shaft 186 upwards along the Z axis causes the seal plate 180 to rotate about the ball 262. In the illustrated example, the seal plate 180 rotates about the ball 262 in the X-Z plane. The second portion 274 of the one or more seal members 184 moves towards the under surface 132 of the liner 130.

[0060] Figure 3B depicts the seal plate 180 positioned such that the lateral axis 181 of the seal plate 180 is substantially perpendicular to the longitudinal axis 187 of the seal shaft 186, such as within 1 degree, within 0.7 degrees, within 0.5 degrees, or within 0.2 degrees. The first portion 272 and the second portion 274 of the one or more seal members 184 are in contact with the under surface 132 of the liner 130. In such an arrangement, the one or more seal members 184 make sealing contact with the under surface 132 of the liner 130.

[0061] Figures 4A and 4B schematically illustrate an embodiment in which the seal plate 180 is used to raise and lower the substrate 134 along the Z axis with respect to the substrate support 150. In Figure 4A, the substrate 134 is shown disposed on the support surface 152 of the substrate support 150. The edge ring 154 is represented by edge ring 290. The edge ring 290 is disposed on a lower ledge 153 of the substrate support 150, and encircles the substrate 134 in the X-Y plane. The edge ring 290 includes a lip 292 that projects radially inwardly below the periphery of the substrate 134. The edge ring 290 includesPATENTAttorney Docket No.: 44025319WO01a skirt 294 that encircles the substrate support 150 in the X-Y plane and projects downwards along the Z axis. A lower end 296 of the skirt 294 is disposed at a level below a level of an underside of the substrate support 150.

[0062] The seal plate 180 is disposed below the substrate support 150. The seal shaft 186 is rigidly coupled to the seal plate 180 (e.g., via a connector bracket 282) such that the seal plate 180 is prevented from rotating with respect to the seal shaft 186. The lateral axis 181 of the seal plate 180 is substantially perpendicular to the longitudinal axis 187 of the seal shaft 186, such as within 1 degree, within 0.7 degrees, within 0.5 degrees, or within 0.2 degrees. As illustrated, the lateral axis 181 of the seal plate 180 lays in the X-Y plane, and the longitudinal axis 187 of the seal shaft 186 is aligned with the Z axis.

[0063] Moving the seal plate 180 upwards along the Z axis with respect to the substrate support 150 brings the seal plate 180 into contact with the lower end 296 of the skirt 294 of the edge ring 290. Continued movement of the seal shaft 186 upwards along the Z axis with respect to the substrate support 150 causes the seal plate 180 to lift the edge ring 290 off the lower ledge 153 of the substrate support 150. As shown in Figure 4B, further continued movement of the seal shaft 186 upwards along the Z axis with respect to the substrate support 150 causes the lip 292 of the edge ring 290 to contact the substrate 134, and lift the substrate 134 off the support surface 152 of the substrate support 150.

[0064] In some embodiments that may be combined with other embodiments, after lifting the substrate 134 off the support surface 152 of the substrate support 150, the substrate support 150 is rotated in the X-Y plane, such as by the actuator 170. In some examples, the substrate support 150 is rotated in the X-Y plane to place a feature of the substrate support 150 (such as a heater segment) in a different azimuthal orientation in the X-Y plane. In some embodiments that may be combined with other embodiments, rotation of the substrate support 150 is ceased, and then the seal plate 180 is lowered to replace the substrate 134 onto the support surface 152.PATENTAttorney Docket No.: 44025319WO01

[0065] Embodiments of the present disclosure provide apparatus, systems, and methods for manipulating components of a substrate processing chamber. The described embodiments facilitate independent control of the positioning of a substrate support, the positioning of a seal plate, and the operation of lift pins in a processing chamber. The described embodiments further facilitate operational flexibility of such components. The described embodiments facilitate the creation of a processing volume in the processing chamber that is smaller than a remaining auxiliary volume of the processing chamber, which enhances the efficiency of substrate processing compared to conventional processing chambers.

[0066] It is contemplated that any one or more elements or features of any one disclosed embodiment or example may be beneficially incorporated in any one or more other non-mutually exclusive embodiments or examples. While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

PATENTAttorney Docket No.: 44025319WO01What is claimed is:

1. A processing chamber comprising:a chamber body, including a floor;a substrate support disposed in the chamber body;a first shaft coupled to the substrate support, and extending through the floor to a first actuator that is configured to raise and lower the first shaft and the substrate support;a seal plate disposed in the chamber body below the substrate support; a second shaft coupled to the seal plate, and extending through the floor to a second actuator that is configured to raise and lower the second shaft and the seal plate;a plurality of lift pins extending through the seal plate;a hoop plate disposed in the chamber body below the plurality of lift pins; and a third shaft coupled to the hoop plate, and extending through the floor to a third actuator that is configured to raise and lower the third shaft and the hoop plate.

2. The processing chamber of claim 1 , wherein:the third shaft is hollow; andthe second shaft extends through the third shaft.

3. The processing chamber of claim 2, wherein:the third shaft is coupled to the third actuator by a bracket; andthe second shaft extends through the bracket to the second actuator.

4. The processing chamber of claim 1 , further comprising a controller operatively coupled to each of the first, second, and third actuators, and configured to control each of the first, second, and third actuators independently of each other of the first, second, and third actuators.PATENTAttorney Docket No.: 44025319WO015. The processing chamber of claim 4, wherein the controller controls:the first actuator to move the substrate support with respect to the seal plate and with respect to the hoop plate;the second actuator to move the seal plate with respect to the substrate support and with respect to the hoop plate; andthe third actuator to move the hoop plate with respect to the substrate support and with respect to the seal plate.

6. The processing chamber of claim 1 , further comprising:a seal member coupled to the seal plate; anda liner disposed in the chamber body;wherein the seal plate is movable by the second actuator between a first position in which the seal member is disengaged from the liner, and a second position in which the seal member is engaged with the liner.

7. The processing chamber of claim 1, wherein the seal plate is coupled to the second shaft by a ball joint.

8. The processing chamber of claim 1 , wherein:each of the first, second, and third actuators includes a stepper motor that rotates a corresponding lead screw;each lead screw is engaged with a corresponding follower such that rotation of the lead screw causes the corresponding follower to move along the lead screw; and each follower is coupled to a corresponding one of the first, second, or third shafts.

9. A processing chamber comprising:a chamber body, including a floor;a substrate support disposed in the chamber body;a first shaft coupled to the substrate support, and extending through a first aperture in the floor to a first actuator that is configured to raise and lower the first shaft and the substrate support;PATENTAttorney Docket No.: 44025319WO01a seal plate disposed in the chamber body below the substrate support; and a second shaft coupled to the seal plate, and extending through a second aperture in the floor to a second actuator that is configured to raise and lower the second shaft and the seal plate with respect to the substrate support.

10. The processing chamber of claim 9, further comprising a plurality of lift pins extending through the seal plate, each lift pin coupled to the seal plate by a bellows.

11. The processing chamber of claim 10, wherein the bellows isolates a first volume in the processing chamber above the seal plate from a second volume in the processing chamber below the seal plate.

12. The processing chamber of claim 9, further comprising:a hoop plate disposed in the chamber body below the plurality of lift pins; and a third shaft coupled to the hoop plate, and extending through the floor to a third actuator that is configured to raise and lower the third shaft and the hoop plate with respect to the seal plate.

13. The processing chamber of claim 12, wherein:the third shaft is hollow; andthe second shaft extends through the third shaft.

14. The processing chamber of claim 13, wherein:the third shaft is coupled to the third actuator by a bracket; andthe second shaft extends through the bracket to the second actuator.PATENTAttorney Docket No.: 44025319WO0115. A processing chamber comprising:a chamber body, including a floor;a seal plate disposed in the chamber body;a first shaft coupled to the seal plate, and extending through the floor to a first actuator that is configured to raise and lower the first shaft and the seal plate;a plurality of lift pins extending through the seal plate;a hoop plate disposed in the chamber body below the plurality of lift pins; a second shaft coupled to the hoop plate, and extending through the floor to a second actuator that is configured to raise and lower the second shaft and the hoop plate;wherein:the second shaft is hollow; andthe first shaft extends through the second shaft.

16. The processing chamber of claim 15, wherein:the first shaft is coupled to the first actuator by a first bracket;the second shaft is coupled to the second actuator by a second bracket; and the first shaft extends through the second bracket.

17. The processing chamber of claim 16, further comprising a first bellows encircling the first shaft, and coupled to the first bracket and to the second bracket.

18. The processing chamber of claim 17, further comprising a second bellows encircling the second shaft, and coupled to the second bracket and to the floor.

19. The processing chamber of claim 18, wherein each lift pin is coupled to the seal plate by a bellows.

20. The processing chamber of claim 19, wherein the bellows isolates a first volume in the processing chamber above the seal plate from a second volume in the processing chamber below the seal plate.

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