Display module and display apparatus

Abstract

A display module and a display apparatus. The display module comprises: a display panel; a circuit board located on a read side of the display panel and bonded and connected to the display panel; and an anti-warping structure located on a side of the circuit board facing away from the display panel, or located between the circuit board and the display panel, wherein an orthographic projection of the anti-warping structure on the display panel at least partially overlaps with an orthographic projection of a location on the circuit board prone to warping on the display panel.

Description

Display module and display device TECHNICAL FIELD

[0001] The embodiments of the present disclosure belong to the technical field of display, and particularly relate to a display module and a display device. BACKGROUND

[0002] OLED (Organic Light-Emitting Diode) display screens are widely concerned due to their advantages of self-emission, low power consumption, thinness, flexibility, bright colors, high contrast, fast response rate, and the like. SUMMARY

[0003] In a first aspect, the present disclosure provides a display module, comprising a display panel,

[0004] a circuit board located at a back side of the display panel and bonded to the display panel;

[0005] a warping prevention structure located at a side of the circuit board away from the display panel, or located between the circuit board and the display panel,

[0006] a normal projection of the warping prevention structure and a warping-prone position of the circuit board on the display panel at least partially overlap.

[0007] In some embodiments, a normal projection of the warping prevention structure on the display panel covers a normal projection of at least part of an edge and / or corner position of the circuit board on the display panel.

[0008] In some embodiments, the circuit board comprises a bonding end and a first end, the bonding end is bonded to the display panel, and the first end and the bonding end are oppositely arranged,

[0009] a normal projection of the warping prevention structure on the display panel covers a normal projection of at least part of an edge and / or corner position of the first end of the circuit board on the display panel.

[0010] In some embodiments, the warping prevention structure comprises a base layer and a first adhesive layer,

[0011] the first adhesive layer and the base layer are sequentially stacked at a side of the circuit board away from the display panel,

[0012] a normal projection of the first adhesive layer and the base layer on the display panel coincides;

[0013] a normal projection of the first adhesive layer and the base layer on the display panel covers a normal projection of part of the corner position and part of the edge position of the first end on the display panel.

[0014] In some embodiments, the anti-warping structure is provided with a first notch,

[0015] A projection of the first notch on the display panel covers a projection of the corner position of the first end on the display panel.

[0016] In some embodiments, the anti-warping structure comprises a first region and a second region, the second region is located at a periphery of the first region,

[0017] A projection of the first region and the circuit board on the display panel overlaps, and a projection of the second region and the circuit board on the display panel does not overlap.

[0018] The first region and the circuit board are attached and bonded; at least a part of the second region away from the first region and the display panel are attached and bonded.

[0019] In some embodiments, a projection of a local edge of the first notch on the display panel is located within a projection area of the corner position of the first end on the display panel,

[0020] A distance between a projection of the local edge of the first notch and a projection of the edge of the corner position of the first end on which the first notch is located on the display panel ranges from 0.2 to 0.3 mm.

[0021] In some embodiments, a width of the second region in a direction away from the first region ranges from 5 to 10 mm.

[0022] In some embodiments, the circuit board comprises a detection point located on a side of the first end away from the display panel, and a projection of the detection point and a projection of the corner position of the first end on the display panel do not overlap.

[0023] The anti-warping structure is provided with a second notch,

[0024] A projection of the second notch on the display panel covers a projection of the detection point on the display panel.

[0025] In some embodiments, the display panel comprises a substrate and a circuit element, the circuit element is located on a side of the substrate close to the circuit board, and a projection of the circuit element and the circuit board on the substrate does not overlap.

[0026] The base layer and the first bonding layer further extend to cover a side of the circuit element away from the substrate.

[0027] In some embodiments, the anti-warping structure comprises a base layer and a first bonding layer,

[0028] The first adhesive layer and the base layer are sequentially stacked on the side of the circuit board opposite to the display panel.

[0029] The first adhesive layer and the base layer overlap in their orthographic projection on the display panel;

[0030] The orthographic projection of the first adhesive layer and the base layer on the display panel covers the orthographic projection of the corner position of the first end on the display panel.

[0031] In some embodiments, the anti-warping structure further includes a second adhesive layer located between the first adhesive layer and the display panel, and situated at the periphery of the corner position of the first end.

[0032] The orthographic projection of the first adhesive layer on the display panel covers the orthographic projection of the second adhesive layer on the display panel, and the orthographic projections of the second adhesive layer and the circuit board on the display panel do not overlap;

[0033] The first adhesive layer and the corner position of the first end, as well as the side of the second adhesive layer facing away from the display panel, are attached and bonded together;

[0034] The side of the second adhesive layer closest to the display panel is attached to and bonded to the display panel.

[0035] In some embodiments, the surface of the base layer facing away from the display panel is a plane, and any point on the plane is equidistant from the display panel.

[0036] In some embodiments, the second adhesive layer is made of an elastic material, including foam adhesive.

[0037] In some embodiments, the width of the second adhesive layer along the direction away from the circuit board ranges from 3 to 5 mm.

[0038] In some embodiments, the edge facets at the corner positions of the second adhesive layer and the first end are spaced apart from each other.

[0039] The distance between the second adhesive layer and the edge face at the corner of the first end is in the range of 0.2 to 0.3 mm.

[0040] In some embodiments, the circuit board includes a first shielding layer, a first insulating layer, a first conductive layer, a substrate, a second conductive layer, a second insulating layer, and a second shielding layer, which are stacked sequentially in a direction away from the display panel.

[0041] The first insulating layer and the second insulating layer have the same structure. The first insulating layer includes a first sub-layer and a second sub-layer, and the first sub-layer and the second sub-layer are stacked sequentially along a direction away from the display panel.

[0042] The first sub-layer of the first insulating layer and the first sub-layer of the second insulating layer are mirror-symmetrical about the substrate as the center plane of symmetry.

[0043] The second sub-layer of the first insulating layer and the second sub-layer of the second insulating layer are mirror-symmetrical about the substrate as the center plane of symmetry.

[0044] The first conductive layer and the second conductive layer have the same structure. The first conductive layer includes a third sub-layer and a fourth sub-layer, which are stacked sequentially in a direction away from the display panel.

[0045] The third sublayer of the first conductive layer and the third sublayer of the second conductive layer are mirror-symmetrical about the substrate as the center plane of symmetry;

[0046] The fourth sublayer of the first conductive layer and the fourth sublayer of the second conductive layer are mirror-symmetrical about the substrate as the center plane of symmetry.

[0047] In some embodiments, the anti-warping structure and the second shielding layer do not overlap in their orthographic projections onto the display panel.

[0048] The distance between the first part of the anti-warping structure and the display panel on the side facing away from the display panel is less than or equal to the distance between the second shielding layer and the display panel on the side facing away from the display panel.

[0049] The first part is the portion where the anti-warping structure overlaps with the orthographic projection of the circuit board on the display panel.

[0050] In some embodiments, the anti-warping structure and the orthographic projection of the second insulating layer on the display panel do not overlap.

[0051] In some embodiments, the material of the base layer includes metal or metal alloy;

[0052] The anti-warping structure and the second conductive layer do not overlap in their orthographic projections on the display panel.

[0053] In some embodiments, the base layer is made of organic resin material.

[0054] In some embodiments, the edge end face of the first portion of the anti-warping structure near the circuit board and the edge end face of the circuit board near the first portion are spaced apart from each other.

[0055] The distance between the edge end face of the first part near the side of the circuit board and the edge end face of the circuit board near the first part is in the range of 0.2 to 0.3 mm.

[0056] In some embodiments, the anti-warping structure includes a first portion, a second portion, and a third adhesive layer.

[0057] The first end, the first portion, and the second portion of the circuit board are arranged sequentially along the first direction and connected sequentially. The third adhesive layer is located on the side of the second portion closer to the display panel.

[0058] The first end includes multiple membrane layers, which are stacked sequentially.

[0059] The second portion has the same film structure as the first end, but the first portion has one less film layer compared to the second portion.

[0060] The first portion can be bent toward the side of the first end near the display panel, so that the second portion is located between the display panel and the side of the first end near the display panel, and the third adhesive layer is located between the second portion and the side of the first end near the display panel.

[0061] The third adhesive layer is respectively attached and bonded to the second portion and the side of the first end near the display panel.

[0062] In some embodiments, the circuit board includes detection points located on the side of the first end opposite to the display panel and at a corner position of the first end.

[0063] In some embodiments, the anti-warping structure is located on the side of the first end away from the binding end.

[0064] The anti-warping structure is aligned with the entire edge of the first end on the side furthest from the binding end.

[0065] In some embodiments, the anti-warping structure is located on the side of the first end away from the binding end.

[0066] The anti-warping structure is aligned with the edge of the first end at a corner position away from the binding end.

[0067] In some embodiments, a fourth adhesive layer is further included, located between the display panel and the circuit board, and is respectively attached to and bonded to the display panel and the circuit board;

[0068] The second portion and the fourth adhesive layer do not overlap in their orthographic projections on the display panel, and the total thickness of the second portion and the third adhesive layer is the same as the thickness of the fourth adhesive layer.

[0069] In some embodiments, the orthographic projections of the second portion and the fourth adhesive layer onto the display panel are located within the orthographic projection area of ​​the circuit board onto the display panel.

[0070] The orthographic projections of the second portion and the fourth adhesive layer on the display panel are spaced apart from each other, and the distance between the orthographic projections of the second portion and the fourth adhesive layer on the display panel is in the range of 0.2 to 0.3 mm.

[0071] In some embodiments, the circuit board includes a bonding end and a first end, the bonding end being bonded to the display panel, and the first end and the bonding end being disposed opposite to each other.

[0072] The anti-warping structure is located between the first end and the display panel.

[0073] The anti-warping structure includes a fifth adhesive layer, a support layer, and a sixth adhesive layer, and the fifth adhesive layer, the support layer, and the sixth adhesive layer are stacked sequentially in a direction away from the display panel;

[0074] The fifth adhesive layer, the support layer, and the sixth adhesive layer have their orthographic projections on the display panel coincide and are located within the orthographic projection area of ​​the first end on the display panel;

[0075] The orthographic projections of the fifth adhesive layer, the support layer, and the sixth adhesive layer on the display panel are spaced apart from the orthographic projections of the edge of the first end on the display panel.

[0076] The distance between the orthographic projections of the fifth adhesive layer, the support layer, and the sixth adhesive layer on the display panel and the orthographic projection of the edge of the first end on the display panel ranges from 0.2 to 0.3 mm.

[0077] In some embodiments, the material of the support layer includes metal or metal alloy.

[0078] Secondly, embodiments of this disclosure also provide a display device, which includes the above-described display module.

[0079] The display module provided in this embodiment of the present disclosure provides an anti-lifting structure on the side of the circuit board away from the display panel or between the circuit board and the display panel. The anti-lifting structure and the easily liftable position of the circuit board are at least partially overlapped on the orthogonal projection of the anti-lifting structure and the circuit board on the display panel. The anti-lifting structure can effectively smooth and fix the easily liftable position of the circuit board, thereby effectively improving or avoiding the problem of the easily liftable position lifting after the circuit board is pasted in the display module. In turn, it improves or avoids the problem of top imprint caused by the corresponding position of the display module pressing on the front of the screen (i.e., the display surface) after the display module is assembled into a whole machine due to the lifting of the easily liftable position.

[0080] The display device provided in this embodiment of the present disclosure, by adopting the above-mentioned display module, can effectively improve or avoid the problem of top imprint caused by the corresponding position of the display module pressing against the front (i.e. display surface) of the display device after the display device is assembled, which is prone to warping. This not only ensures the appearance of the display device, but also ensures the display quality of the display device. Attached Figure Description

[0081] The accompanying drawings are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the detailed description of exemplary embodiments with reference to the accompanying drawings, in which:

[0082] Figure 1a is a front view of an FPC in the related technology.

[0083] Figure 1b is a schematic diagram of the back side of an FPC in the related technology.

[0084] Figure 1c is a structural cross-sectional view along the AA' section line in Figure 1b.

[0085] Figure 2a is a top view of the back of a display module according to an embodiment of this disclosure.

[0086] Figure 2b is a schematic cross-sectional view of the structure along the DD' section line in Figure 2a.

[0087] Figure 2c is a top view of the rear side of another display module in an embodiment of this disclosure.

[0088] Figure 2d is a schematic cross-sectional view of a structure along the FF' section line in Figure 2a.

[0089] Figure 2e is a schematic cross-sectional view of another structure along the FF' section line in Figure 2a.

[0090] Figure 3a is a top view of the rear side of another display module in an embodiment of this disclosure.

[0091] Figure 3b is a schematic cross-sectional view of a structure along the EE' section line in Figure 3a.

[0092] Figure 3c is a schematic cross-sectional view of another structure along the EE' section line in Figure 3a.

[0093] Figure 3d is a schematic cross-sectional view of another structure along the EE' section line in Figure 3a.

[0094] Figure 3e is a schematic cross-sectional view of another structure along the EE' section line in Figure 3a.

[0095] Figure 4a is a top view of the rear side of another display module in an embodiment of this disclosure.

[0096] Figure 4b is a top view of the rear side of another display module in an embodiment of this disclosure.

[0097] Figure 4c is a cross-sectional view of the module shown in Figures 4a and 4b along the HH' section line when the first section is not bent.

[0098] Figure 4d is a side view of the module after it has been bent in the first section, as shown in Figures 4a and 4b.

[0099] Figure 5a is a top view of the rear side of another display module in an embodiment of this disclosure.

[0100] Figure 5b is a schematic cross-sectional view of the structure along the GG' section line in Figure 5a.

[0101] Figure 5c is a cross-sectional schematic diagram of the anti-warping structure in Figure 5a. Detailed Implementation

[0102] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, a display module and display device provided by the embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0103] Embodiments of this disclosure will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms and should not be construed as limited to the embodiments set forth in this disclosure. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of this disclosure.

[0104] This disclosure is not limited to the embodiments shown in the accompanying drawings, but includes modifications to the configuration based on the manufacturing process. Therefore, the areas illustrated in the drawings are schematic, and the shapes of the areas shown illustrate specific shapes of the areas, but are not intended to be limiting.

[0105] Currently, customers are particularly concerned about the molding (or top-printing) effect on the front (display surface) of the display module, as this directly affects the product's quality and subjective impression. There are many reasons for molding (or top-printing), one of which is caused by the warping of the FPC (Flexible Printed Circuit) after lamination. The FPC is bonded to the display panel in the display module, located on the back side of the display panel. The FPC is bonded to the back side of the display panel via adhesive. Due to the compression requirements of the overall thickness of the display module, the thickness of the FPC adhesive (used to bond the FPC to the display panel) is further reduced, which inevitably affects the bonding and fixing effect of the FPC. This is especially true in the corner areas of two-layer FPCs (where each side of the substrate has a conductive circuit layer). Because the FPC manufacturing process requires multiple high-temperature baking steps, the final FPC inevitably has warping issues. Warping at the corners of the FPC will cause a pressure-type top-printing effect on the front (display surface) of the screen after the display module is assembled into a complete unit.

[0106] In related technologies, referring to Figures 1a-1c, Figure 1a is a front view of the FPC in the related technology; Figure 1b is a back view of the FPC in the related technology; Figure 1c is a structural cross-sectional view along the AA' section line in Figure 1b; wherein, one end of the FPC5 is bonded to the display panel 1. In conventional designs, the corners of the FPC5 away from its bonding end B, especially the two corners, are areas prone to lifting. Although the back of the FPC5 that is bonded to the display panel 1 is provided with adhesive 6, the adhesive performance of the adhesive 6 will be affected by further compression of its thickness (e.g., the thickness of the adhesive 6 after compression is less than 0.05mm), resulting in a decrease in adhesive performance. When the adhesive force of the adhesive 6 cannot support the stress deformation released at the corners of the FPC5, the problem of lifting at the corners of the FPC5 is likely to occur.

[0107] In related technologies, referring to Figure 1b, the edges of the adhesive backing 6 and the corner of the FPC 5 away from its bonding end B do not overlap. For example, the adhesive backing 6 is recessed by 0.2 to 0.3 mm relative to the corner of the FPC 5 away from its bonding end B. This can prevent the adhesive backing 6 from overflowing beyond the edge of the FPC 5 during the application process, thereby preventing the overflowing adhesive from forming a protrusion that will cause a top mark on the front of the screen, and also affecting the appearance of the back side of the display module.

[0108] In related technologies, referring to Figure 1a, the front side of the FPC5 opposite to the display panel 1 has a component area 7 and an internal circuit detection point Q. The component area 7 is used to house circuit components; the internal circuit detection point Q is used to test the internal circuit of the FPC5 using external testing equipment. The FPC5 is bonded to the motherboard via a connector 8. Referring to Figure 1b, adhesive 6 is applied to the end of the FPC5 closest to the back side of the display panel 1, away from the bonding end B. The back side of the FPC5 also has a component area reinforcing steel sheet 9, and adhesive 6 is also applied around the component area reinforcing steel sheet 9 to enhance the adhesion between the FPC5 and the display panel 1.

[0109] In related technologies, referring to FIG1c, FPC5 includes a first shielding layer 21, a first insulating layer 22, a first conductive layer 23, a substrate 20, a second conductive layer 24, a second insulating layer 25, and a second shielding layer 26 stacked sequentially along a direction away from the display panel 1; the first insulating layer 22 includes two stacked sub-layers, and the second insulating layer 25 has the same structure as the first insulating layer 22; the first conductive layer 23 includes two stacked sub-layers, and the second conductive layer 24 has the same structure as the first conductive layer 23.

[0110] To address the aforementioned problems in the related technologies, in a first aspect, embodiments of this disclosure provide a display module, referring to Figures 2a-2e, 3a-3e, 4a-4d, and 5a-5c, wherein the display module includes a display panel 1, a circuit board 2 located on the back side of the display panel 1 and bonded to the display panel 1; and an anti-warping structure 3 located on the side of the circuit board 2 opposite to the display panel 1, or located between the circuit board 2 and the display panel 1, wherein the orthographic projections of the anti-warping structure 3 and the easily warped position of the circuit board 2 on the display panel 1 at least partially overlap.

[0111] The display panel 1 can be an OLED display panel. The display panel 1 includes a display substrate and a back film, with the back film attached to the back side of the display substrate. The circuit board 2 can be a flexible printed circuit board, which is bonded to the display panel 1 and also bonded to the motherboard, enabling the motherboard to provide various power or drive signals to the display panel 1 through the circuit board 2. The circuit board 2 is attached to the side of the back film facing away from the display substrate.

[0112] In this embodiment, by setting an anti-lifting structure 3 on the side of the circuit board 2 away from the display panel 1 or between the circuit board 2 and the display panel 1, and by making the anti-lifting structure 3 and the easily lifted position of the circuit board 2 at least partially overlap on the orthogonal projection on the display panel 1, the anti-lifting structure 3 can effectively smooth and fix the easily lifted position of the circuit board 2, thereby effectively improving or avoiding the problem of the easily lifted position lifting that may occur after the circuit board 2 is pasted in the display module, and further improving or avoiding the problem of top imprint caused by the corresponding position of the display module pressing on the front of the screen (i.e., the display surface) after the display module is assembled, the problem of top imprint caused by the lifting of the easily lifted position.

[0113] In some embodiments, the orthographic projection of the anti-warping structure 3 on the display panel 1 covers the orthographic projection of at least a portion of the edges and / or corners of the circuit board 2 on the display panel 1. That is, the edges and corners of the circuit board 2 are the locations prone to warping.

[0114] In some embodiments, referring to FIG2a, which is a rear top view of a display module according to an embodiment of the present disclosure, the circuit board 2 includes a bonding end B and a first end C. The bonding end B is bonded to the display panel 1, and the first end C and the bonding end B are disposed opposite to each other. The orthographic projection of the anti-lifting structure 3 on the display panel 1 covers the orthographic projection of at least a portion of the edge and / or corner positions of the first end C of the circuit board 2 on the display panel 1. In this embodiment, the edge and corner positions of the first end C of the circuit board 2 are the most prone to lifting.

[0115] In some embodiments, referring to FIG2b, which is a structural cross-sectional view along the DD' section line in FIG2a, the anti-warping structure 3 includes a base layer 30 and a first adhesive layer 31. The first adhesive layer 31 and the base layer 30 are stacked sequentially on the side of the circuit board 2 away from the display panel 1. The orthographic projections of the first adhesive layer 31 and the base layer 30 on the display panel 1 coincide. The orthographic projections of the first adhesive layer 31 and the base layer 30 on the display panel 1 cover the orthographic projections of a portion of the corner position and a portion of the edge position of the first end C on the display panel 1.

[0116] In this design, by placing the anti-warping structure 3 on the side of the circuit board 2 away from the display panel 1, and making the orthographic projection of the anti-warping structure 3 on the display panel 1 cover the orthographic projection of part of the corner and part of the edge of the first end C on the display panel 1, the anti-warping structure 3 can effectively smooth and fix the corner and part of the edge of the first end C of the circuit board 2 that are prone to warping. This effectively improves or avoids the problem of warping at the easily warped position after the circuit board 2 is pasted in the display module. In turn, it improves or avoids the problem of top imprint caused by the pressure of the corresponding position on the front of the screen (i.e., the display surface) after the display module is assembled, due to the warping at the easily warped position.

[0117] In some embodiments, referring to FIG2a, the anti-warping structure 3 has a first notch P1, the orthographic projection of the first notch P1 on the display panel 1 covering the orthographic projection of the edge at the corner position of the first end C on the display panel 1. That is, the first notch P1 is made at the edge corresponding to the corner position of the first end C of the anti-warping structure 3, which can avoid the problem of wrinkles in the first adhesive layer 31 and the base layer 30 when the anti-warping structure 3 completely covers the edge at the corner position of the first end C, thereby ensuring the effectiveness of the fixed adhesion of the anti-warping structure 3.

[0118] In some embodiments, referring to FIG2a, the anti-warping structure 3 includes a first region S1 and a second region S2. The second region S2 is located around the first region S1. The orthographic projections of the first region S1 and the circuit board 2 on the display panel 1 overlap, while the orthographic projections of the second region S2 and the circuit board 2 on the display panel 1 do not overlap. The first region S1 and the circuit board 2 are attached and bonded. At least a portion of the second region S2 that is away from the first region S1 is attached and bonded to the display panel 1. With this configuration, the anti-warping structure 3 can completely cover a portion of the edge of the first end C, thereby better smoothing and fixing the portion of the edge of the first end C, and thus preventing the portion of the first end C covered by the anti-warping structure 3 from warping.

[0119] In some embodiments, referring to FIG2a, the orthographic projection of the partial edge m of the first notch P1 on the display panel 1 is located within the orthographic projection area of ​​the corner position of the first end C on the display panel 1, and the distance n1 between the partial edge m of the first notch P1 and the orthographic projection of the corner position of the first end C where the first notch P1 is located on the display panel 1 ranges from 0.2 to 0.3 mm. This configuration ensures that the portion of the anti-warping structure 3 corresponding to the corner position of the first end C will not wrinkle, and also ensures that the anti-warping structure 3 firmly smooths and fixes the corner position of the first end C, thereby preventing the corner position of the first end C from warping. Furthermore, the fact that the partial edge m of the anti-warping structure 3 is recessed by 0.2 to 0.3 mm relative to the edge of the corner position of the first end C also prevents the first adhesive layer 31 from overflowing beyond the edge of the corner position of the first end C during the application process, thereby preventing the overflowing adhesive from forming a protrusion that creates a top mark on the front side (i.e., the display surface) of the display module, while ensuring the appearance of the back side of the display module.

[0120] In some embodiments, referring to FIG2b, the width n2 of the second region S2 along the direction away from the first region S1 ranges from 5 to 10 mm. This configuration ensures that the anti-lifting structure 3 more firmly smooths and fixes the easily lifted parts of the circuit board 2.

[0121] In some embodiments, referring to FIG2b, the anti-warping structure 3 begins to slope downwards from the edge of the first end C of the circuit board 2 until it contacts and adheres to the back side of the display panel 1. The sloped downward slope of the anti-warping structure 3 is mainly to avoid the bonding fixture of the anti-warping structure 3, so as to prevent the bonding fixture from causing pressure damage to the edge of the first end C of the circuit board 2. If the bonding fixture does not need to be avoided, the anti-warping structure 3 can also be sloped downwards vertically along the edge end face of the first end C of the circuit board 2, that is, the anti-warping structure 3 can be directly adhered to the edge end face of the first end C of the circuit board 2.

[0122] In some embodiments, referring to FIG2a, the circuit board 2 includes a detection point Q located on the side of the first end C facing away from the display panel 1. The orthographic projections of the detection point Q and the corner position of the first end C on the display panel 1 do not overlap. The anti-warping structure 3 has a second notch P2, and the orthographic projection of the second notch P2 on the display panel 1 covers the orthographic projection of the detection point Q on the display panel 1. With this configuration, the anti-warping structure 3 can avoid the detection point Q, that is, the detection point Q remains exposed, thereby facilitating the testing of the internal circuitry of the circuit board 2 by external testing equipment.

[0123] In some embodiments, referring to FIG2c, a rear top view of another display module in an embodiment of the present disclosure is shown; wherein, the display panel 1 includes a substrate 10 and a circuit element 11, the circuit element 11 is located on the side of the substrate 10 near the circuit board 2, and the orthographic projections of the circuit element 11 and the circuit board 2 on the substrate 10 do not overlap; the base layer 30 and the first adhesive layer 31 also extend to cover the side of the circuit element 11 away from the substrate 10.

[0124] The circuit element 11 includes a display driver chip, etc. A protective layer needs to be attached to the side of the circuit element 11 facing away from the substrate 10. In this embodiment, the anti-warping structure 3 and the protective layer attached to the side of the circuit element 11 facing away from the substrate 10 are combined into a single design, which can save process steps and process costs. In addition, a heat dissipation layer (such as a graphite layer) and a shielding layer (such as a metal layer) can also be attached to the side of the circuit element 11 facing away from the substrate 10.

[0125] It should be noted that the anti-warping structure 3 located on the side of the circuit element 11 away from the substrate 10 and the anti-warping structure 3 located on the side of the first end C of the circuit board 2 away from the display panel 1 can also be designed independently.

[0126] In some embodiments, referring to FIG3a, which is a rear top view of another display module in an embodiment of the present disclosure; wherein, the anti-warping structure 3 includes a base layer 30 and a first adhesive layer 31, the first adhesive layer 31 and the base layer 30 are stacked sequentially on the side of the circuit board 2 away from the display panel 1, and the orthographic projections of the first adhesive layer 31 and the base layer 30 on the display panel 1 coincide; the orthographic projections of the first adhesive layer 31 and the base layer 30 on the display panel 1 cover the orthographic projection of the corner position of the first end C on the display panel 1.

[0127] In this design, by placing the anti-warping structure 3 on the side of the circuit board 2 away from the display panel 1, and making the orthographic projection of the anti-warping structure 3 on the display panel 1 cover the orthographic projection of the corner position of the first end C on the display panel 1, the anti-warping structure 3 can effectively smooth and fix the corner position of the first end C of the circuit board 2 that is prone to warping. This effectively improves or avoids the problem of warping at the easily warped position after the circuit board 2 is pasted in the display module. In turn, it improves or avoids the problem of top imprint caused by the corresponding position of the display module pressing against the front of the screen (i.e., the display surface) after the display module is assembled, due to the warping at the easily warped position.

[0128] In some embodiments, referring to FIG3b, a cross-sectional view of a structure along the EE' section line in FIG3a is provided. The anti-warping structure 3 includes a first region S1 and a second region S2. The second region S2 is located outside the first region S1. The orthographic projections of the first region S1 and the circuit board 2 on the display panel 1 overlap, while the orthographic projections of the second region S2 and the circuit board 2 on the display panel 1 do not overlap. The first region S1 and the circuit board 2 are attached and bonded. At least a portion of the second region S2 that is away from the first region S1 is attached and bonded to the display panel 1. With this configuration, the anti-warping structure 3 can completely cover the corner position of the first end C, thereby better smoothing and fixing the corner position of the first end C, and thus preventing the corner position of the first end C covered by the anti-warping structure 3 from warping.

[0129] In some embodiments, referring to FIG3b, the anti-warping structure 3 begins to tilt downwards from the edge of the corner of the first end C of the circuit board 2 until the anti-warping structure 3 contacts and adheres to the back side of the display panel 1. The tilting downwards of the anti-warping structure 3 is mainly to avoid the bonding fixture of the anti-warping structure 3, so as to prevent the bonding fixture from causing pressure damage to the edge of the corner of the first end C of the circuit board 2. If the bonding fixture does not need to be avoided, the anti-warping structure 3 can also be tilted vertically downwards along the edge end face of the corner of the first end C of the circuit board 2, that is, the anti-warping structure 3 can be directly adhered to the edge end face of the corner of the first end C of the circuit board 2.

[0130] In some embodiments, referring to FIG3c, which is a cross-sectional view of another structure along the EE' section line in FIG3a; the anti-warping structure 3 further includes a second adhesive layer 32, located between the first adhesive layer 31 and the display panel 1, and located outside the corner position of the first end C. The orthographic projection of the first adhesive layer 31 on the display panel 1 covers the orthographic projection of the second adhesive layer 32 on the display panel 1, and the orthographic projections of the second adhesive layer 32 and the circuit board 2 on the display panel 1 do not overlap; the corner position of the first adhesive layer 31 and the first end C, as well as the side of the second adhesive layer 32 away from the display panel 1, are attached and bonded; the side of the second adhesive layer 32 near the display panel 1 is attached and bonded to the display panel 1.

[0131] In some embodiments, referring to FIG3c, the surface of the base layer 30 facing away from the display panel 1 is flat, and the distance between any point on the flat surface and the display panel 1 is equal. That is, the thickness of the second adhesive layer 32 is equal to the thickness of the circuit board 2. This configuration makes the surface of the anti-warping structure 3 facing away from the display panel 1 flat, without local protrusions, thereby ensuring the appearance of the back side of the display module.

[0132] In some embodiments, the second adhesive layer 32 is made of an elastic material, including foam adhesive. The foam adhesive is relatively thick and has a certain cushioning performance, which can provide a certain compressible space and cushioning performance during the application of the anti-warping structure 3 and the assembly of the display module, thereby effectively preventing the generation of top marks on the front of the display module.

[0133] In some embodiments, referring to FIG3c, the width n3 of the second adhesive layer 32 in the direction away from the circuit board 2 ranges from 3 to 5 mm. This configuration ensures that the anti-warping structure 3 more firmly smooths and fixes the first end C corner of the circuit board 2.

[0134] In some embodiments, referring to FIG3c, the edge faces of the second adhesive layer 32 and the corner positions of the first end C are spaced apart, and the spacing n4 between the edge faces of the second adhesive layer 32 and the corner positions of the first end C ranges from 0.2 to 0.3 mm. This configuration ensures that the assembly tolerance between the second adhesive layer 32 and the circuit board 2 meets the requirements.

[0135] In some embodiments, referring to Figures 2b, 3b, and 3c, the circuit board 2 includes a first shielding layer 21, a first insulating layer 22, a first conductive layer 23, a substrate 20, a second conductive layer 24, a second insulating layer 25, and a second shielding layer 26, which are stacked sequentially along a direction away from the display panel 1. The first insulating layer 22 and the second insulating layer 25 have the same structure. The first insulating layer 22 includes a first sub-layer 201 and a second sub-layer 202, which are stacked sequentially along a direction away from the display panel 1. The first sub-layer 201 of the first insulating layer 22 and the first sub-layer 201 of the second insulating layer 25 are mirror images of each other with the substrate 20 as the center plane of symmetry. The second sub-layer 202 of the first insulating layer 22 and the second sub-layer 202 of the second insulating layer 25 are mirror-symmetrical about the substrate 20 as the center plane of symmetry. The first conductive layer 23 and the second conductive layer 24 have the same structure. The first conductive layer 23 includes a third sub-layer 203 and a fourth sub-layer 204, which are stacked sequentially in a direction away from the display panel 1. The third sub-layer 203 of the first conductive layer 23 and the third sub-layer 203 of the second conductive layer 24 are mirror-symmetrical about the substrate 20 as the center plane of symmetry. The fourth sub-layer 204 of the first conductive layer 23 and the fourth sub-layer 204 of the second conductive layer 24 are mirror-symmetrical about the substrate 20 as the center plane of symmetry.

[0136] In some embodiments, the first sublayer 201 may be made of an organic polymer material, such as polyimide. The second sublayer 202 may be made of an insulating adhesive. The first conductive layer 23 and the second conductive layer 24 may be made of a metallic material, such as copper. The third sublayer 203 is a base copper layer, and the fourth sublayer 204 is a surface copper layer. The substrate 20 may be made of an organic polymer material, such as polyimide or polyester.

[0137] In some embodiments, referring to FIG2d, it is a structural cross-sectional view along the FF' section line in FIG2a; FIG3d is another structural cross-sectional view along the EE' section line in FIG3a; the orthographic projections of the anti-warping structure 3 and the second shielding layer 26 on the display panel 1 do not overlap, and the distance between the surface of the first part Z of the anti-warping structure 3 facing away from the display panel 1 and the display panel 1 is less than or equal to the distance between the surface of the second shielding layer 26 facing away from the display panel 1 and the display panel; the first part Z is the part of the anti-warping structure 3 that overlaps with the orthographic projection of the circuit board 2 on the display panel 1.

[0138] In this embodiment, referring to Figures 2d and 3d, an opening is designed in the second shielding layer 26. The first part Z of the anti-warping structure 3 is embedded in the opening of the second shielding layer 26, and the sum of the thicknesses of the base layer 30 and the first adhesive layer 31 in the anti-warping structure 3 is less than or equal to the thickness of the second shielding layer 26. In this way, on the one hand, the setting of the anti-warping structure 3 will not increase the stacking thickness of the circuit board 2, thereby not increasing the assembly space of the entire display module; on the other hand, by opening an opening in the second shielding layer 26, an alignment and bonding reference is increased when the anti-warping structure 3 is attached, thereby preventing the anti-warping structure 3 from being attached to an area outside the opening in the second shielding layer 26.

[0139] In some embodiments, referring to FIG2e, it is a schematic cross-sectional view of another structure along the FF' section line in FIG2a; based on the circuit board 2 structure in FIG2d, the anti-warping structure 3 and the second insulating layer 25 do not overlap on the orthographic projection of the display panel 1.

[0140] Referring to Figure 2e, the second shielding layer 26 and the second insulating layer 25 have the same pattern of openings, and the orthographic projections of the openings in the second shielding layer 26 and the second insulating layer 25 onto the substrate 20 coincide. The first part Z of the anti-warping structure 3 is embedded in the openings of the second shielding layer 26 and the second insulating layer 25, and the sum of the thicknesses of the base layer 30 and the first adhesive layer 31 in the anti-warping structure 3 is less than or equal to the sum of the thicknesses of the second shielding layer 26 and the second insulating layer 25. In this way, on the one hand, the anti-warping structure 3 will not increase the stacking thickness of the circuit board 2, thus not increasing the assembly space of the entire display module; on the other hand, by opening the opening in the second shielding layer 26 and the second insulating layer 25, the alignment and pasting reference when the anti-warping structure 3 is applied is increased, thus preventing the anti-warping structure 3 from being applied to areas outside the openings in the second shielding layer 26 and the second insulating layer 25; furthermore, the surface of the circuit board 2 where the second shielding layer 26 and the second insulating layer 25 are removed, which is in contact with the anti-warping structure 3, is the second conductive layer 24. The second conductive layer 24 is a copper layer, and the dyne value of the copper layer is higher than that of the second shielding layer 26, thus making the adhesion with the anti-warping structure 3 more secure.

[0141] In some embodiments, referring to Figures 2a-2e and 3a-3d, the base layer 30 may be made of organic resin materials, such as polyimide (PI) or polyethylene terephthalate (PET).

[0142] In some embodiments, referring to FIG3e, which is a cross-sectional view along the EE' section line in FIG3a, the base layer 30 is made of metal or metal alloy material, based on the circuit board 2 structure in FIG3c and FIG3d; the anti-warping structure 3 and the second conductive layer 24 do not overlap in their orthographic projections on the display panel 1. The base layer 30 has a high modulus, which improves the flattening effect at the corners of the circuit board 2.

[0143] Referring to Figure 3e, the second shielding layer 26, the second insulating layer 25, and the second conductive layer 24 have identical opening designs, and the orthographic projections of the openings in the second shielding layer 26, the second insulating layer 25, and the second conductive layer 24 on the substrate 20 coincide. The first part Z of the anti-warping structure 3 is embedded in the openings of the second shielding layer 26, the second insulating layer 25, and the second conductive layer 24, and the sum of the thicknesses of the base layer 30 and the first adhesive layer 31 in the anti-warping structure 3 is less than or equal to the sum of the thicknesses of the second shielding layer 26, the second insulating layer 25, and the second conductive layer 24. In this way, on the one hand, the setting of the anti-warping structure 3 will not increase the stacking thickness of the circuit board 2, thereby not increasing the assembly space of the entire display module; on the other hand, by opening the openings in the second shielding layer 26, the second insulating layer 25, and the second conductive layer 24, the alignment and bonding reference during the installation of the anti-warping structure 3 is increased, thereby preventing the anti-warping structure 3 from being installed in areas outside the openings in the second shielding layer 26, the second insulating layer 25, and the second conductive layer 24.

[0144] In some embodiments, referring to Figures 2d-2e and 3d-3e, the edge end face of the first portion Z of the anti-warping structure 3 near the circuit board 2 and the edge end face of the circuit board 2 near the first portion Z are spaced apart, and the spacing n5 between the edge end face of the first portion Z near the circuit board 2 and the edge end face of the circuit board 2 near the first portion Z is in the range of 0.2 to 0.3 mm. This arrangement ensures that the assembly tolerance meets the requirements when the first portion Z of the anti-warping structure 3 is embedded in the open film layer of the circuit board 2.

[0145] In some embodiments, referring to Figures 4a-4d, Figure 4a is a rear top view of another display module in an embodiment of the present disclosure; Figure 4b is a rear top view of another display module in an embodiment of the present disclosure; Figure 4c is a cross-sectional view of the display module in Figures 4a and 4b when the first portion is not bent along the HH' section line; Figure 4d is a side view of the display module in Figures 4a and 4b after the first portion is bent; wherein, the anti-warping structure 3 includes a first portion 33, a second portion 34 and a third adhesive layer 35, the first end C of the circuit board 2, the first portion 33 and the second portion 34 are arranged sequentially along the first direction L and are connected sequentially, the third adhesive layer 35. 5 is located on the side of the second portion 34 near the display panel 1; the first end C includes multiple film layers, which are stacked sequentially; the film layer structure of the second portion 34 and the first end C is the same, and the first portion 33 has at least one fewer film layer than the second portion 34; the first portion 33 can be bent toward the side of the first end C near the display panel 1 so that the second portion 34 is located between the display panel 1 and the side of the first end C near the display panel 1, and the third adhesive layer 35 is located between the second portion 34 and the side of the first end C near the display panel 1, and the third adhesive layer 35 is respectively attached and bonded to the second portion 34 and the side of the first end C near the display panel 1.

[0146] Referring to Figures 4a-4d, the film structure at the first end C of circuit board 2 can be the same as the film structure of circuit board 2 in Figures 2b, 3b, and 3c. The first portion 33 can be formed by removing part of the film layer (such as the first shielding layer 21, the first insulating layer 22, the second insulating layer 25, and the second shielding layer 26) at the first end C of circuit board 2. This reduces the bending stress of the first portion 33 and prevents it from bending and rebounding.

[0147] In this embodiment, due to the bending and bonding of the second portion 34, the overall strength of the corner area of ​​the first end C of the circuit board 2 is greatly improved, which can significantly improve or avoid the problem of warping at the corner of the first end C.

[0148] In some embodiments, referring to Figures 4a and 4b, the circuit board 2 includes a detection point Q located on the side of the first end C opposite to the display panel 1, and located at the corner of the first end C.

[0149] In some embodiments, referring to FIG4a, the anti-warping structure 3 is located on the side of the first end C away from the binding end B, and the anti-warping structure 3 and the entire edge of the side of the first end C away from the binding end B are mated.

[0150] In some embodiments, referring to FIG4b, the anti-warping structure 3 is located on the side of the first end C away from the binding end B, and the edge of the anti-warping structure 3 and the corner position of the side of the first end C away from the binding end B are joined.

[0151] In this embodiment, referring to Figures 4a and 4b, the detection point Q on the back side of the circuit board 2 is located at the corner of the first end C. The position of the first part 33 can be appropriately set according to the position of the detection point Q. For example, the first part 33 can be set in the entire edge area of ​​the first end C below the detection point Q (refer to Figure 4a), or the first part 33 can be set in the corner area of ​​the first end C below the detection point Q (refer to Figure 4b), etc.

[0152] In some embodiments, referring to Figures 4c and 4d, the display module further includes a fourth adhesive layer 4, located between the display panel 1 and the circuit board 2, and bonded to both the display panel 1 and the circuit board 2 respectively; the orthographic projections of the second portion 34 and the fourth adhesive layer 4 on the display panel 1 do not overlap, and the total thickness of the second portion 34 and the third adhesive layer 35 is the same as the thickness of the fourth adhesive layer 4. With this configuration, after the anti-warping structure 3 is bent and bonded to the back side of the circuit board 2, the side of the circuit board 2 facing away from the display panel 1 remains flat, thereby ensuring the appearance of the back side of the display module.

[0153] In some embodiments, referring to FIG4d, the orthographic projections of the second portion 34 and the fourth adhesive layer 4 on the display panel 1 are located within the orthographic projection area of ​​the circuit board 2 on the display panel 1. The orthographic projections of the second portion 34 and the fourth adhesive layer 4 on the display panel 1 are spaced apart from each other, and the spacing n6 between the orthographic projections of the second portion 34 and the fourth adhesive layer 4 on the display panel 1 ranges from 0.2 to 0.3 mm. This arrangement can prevent the fourth adhesive layer 4 from overflowing into the area where the anti-lifting structure 3 is located during the mounting of the circuit board 2, thereby preventing the fourth adhesive layer 4 from overflowing and causing the anti-lifting structure 3 and the circuit board 2 to be lifted, and thus preventing frontal mold marks from appearing on the display module during the overall assembly process.

[0154] In some embodiments, referring to Figures 5a-5c, Figure 5a is a rear top view of another display module in an embodiment of the present disclosure; Figure 5b is a cross-sectional view along the GG' section line in Figure 5a; Figure 5c is a cross-sectional view of the anti-warping structure in Figure 5a; wherein, the circuit board 2 includes a bonding end B and a first end C, the bonding end B is bonded to the display panel 1, the first end C and the bonding end B are disposed opposite to each other, the anti-warping structure 3 is located between the first end C and the display panel 1, the anti-warping structure 3 includes a fifth adhesive layer 36, a support layer 37 and a sixth adhesive layer 38, and the fifth adhesive layer 36, the support layer 37 and the sixth adhesive layer 38 are... Layer 38 is stacked sequentially in a direction away from the display panel 1; the orthographic projections of the fifth adhesive layer 36, the support layer 37, and the sixth adhesive layer 38 on the display panel 1 coincide and are located within the orthographic projection area of ​​the first end C on the display panel 1; the orthographic projections of the fifth adhesive layer 36, the support layer 37, and the sixth adhesive layer 38 on the display panel 1 are spaced apart from the orthographic projections of the edge of the first end C on the display panel 1, and the interval n7 between the orthographic projections of the fifth adhesive layer 36, the support layer 37, and the sixth adhesive layer 38 on the display panel 1 and the orthographic projections of the edge of the first end C on the display panel 1 ranges from 0.2 to 0.3 mm.

[0155] This design ensures that the anti-lifting structure 3 firmly smooths and fixes the corners of the first end C, thus preventing the corners of the first end C from lifting. In addition, it also prevents the fifth adhesive layer 36 and the sixth adhesive layer 38 from overflowing beyond the edge of the corners of the first end C during the application process, thereby preventing the overflowing adhesive from forming a protrusion that will leave a mark on the front of the display module (i.e., the display surface), while ensuring the appearance of the back side of the display module.

[0156] In some embodiments, the material of the support layer 37 includes metal or metal alloy. Compared to the adhesive used in related technologies to bond the FPC and the display panel, the support layer 37 in this embodiment has a higher modulus strength, thereby providing stronger support for the first end C of the circuit board 2 and preventing the corners of the first end C of the circuit board 2 from lifting.

[0157] In some embodiments, the support layer 37 is formed by punching a support plate with a large area. In the actual assembly process of the anti-warping structure 3, the punching direction of the support layer 37 needs to be facing the display panel 1 side, even if the punching direction of the support layer 37 is away from the circuit board 2 side. This can prevent the burrs formed after punching the support layer 37 from damaging the circuits in the circuit board 2.

[0158] In some embodiments, the first adhesive layer 31, the third adhesive layer 35, the fourth adhesive layer 4, the fifth adhesive layer 36, and the sixth adhesive layer 38 can all be cured liquid adhesives or solid double-sided adhesives.

[0159] The display module provided in this embodiment of the present disclosure provides an anti-lifting structure on the side of the circuit board away from the display panel or between the circuit board and the display panel. The anti-lifting structure and the easily liftable position of the circuit board are at least partially overlapped on the orthogonal projection of the anti-lifting structure and the circuit board on the display panel. The anti-lifting structure can effectively smooth and fix the easily liftable position of the circuit board, thereby effectively improving or avoiding the problem of the easily liftable position lifting after the circuit board is pasted in the display module. In turn, it improves or avoids the problem of top imprint caused by the corresponding position of the display module pressing on the front of the screen (i.e., the display surface) after the display module is assembled into a whole machine due to the lifting of the easily liftable position.

[0160] Secondly, embodiments of this disclosure also provide a display device, including the display module in any of the above embodiments.

[0161] By adopting the display module in the above embodiments, the problem of top imprint caused by the pressure of the corresponding position on the front (i.e. display surface) of the display device after the display device is assembled can be effectively improved or avoided due to the easy-to-lift position of the display module lifting. This not only ensures the appearance of the display device, but also ensures the display quality of the display device.

[0162] The display device provided in this disclosure can be any product or component with display function, such as an OLED panel, OLED TV, OLED billboard, monitor, mobile phone, or navigator.

[0163] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A display module, wherein, Including the display panel, The circuit board is located on the back side of the display panel and is bonded to the display panel; The anti-warping structure is located on the side of the circuit board opposite to the display panel, or between the circuit board and the display panel. The anti-warping structure and the easily warped position of the circuit board at least partially overlap in their orthographic projections on the display panel.

2. The display module according to claim 1, wherein, The anti-warping structure's orthogonal projection on the display panel covers at least a portion of the circuit board's edge and / or corner positions' orthogonal projections on the display panel.

3. The display module according to claim 2, wherein, The circuit board includes a bonding end and a first end. The bonding end is bonded and connected to the display panel, and the first end and the bonding end are disposed opposite to each other. The anti-warping structure's orthogonal projection on the display panel covers at least a portion of the side and / or corner positions of the first end of the circuit board's orthogonal projection on the display panel.

4. The display module according to claim 3, wherein, The anti-warping structure includes a base layer and a first adhesive layer. The first adhesive layer and the base layer are sequentially stacked on the side of the circuit board opposite to the display panel. The first adhesive layer and the base layer overlap in their orthographic projection on the display panel; The orthographic projection of the first adhesive layer and the base layer on the display panel covers the orthographic projection of a portion of the corner position and a portion of the edge position of the first end on the display panel.

5. The display module according to claim 4, wherein, The anti-warping structure has a first notch. The orthographic projection of the first notch on the display panel covers the orthographic projection of the edge at the corner of the first end on the display panel.

6. The display module according to claim 5, wherein, The anti-warping structure includes a first region and a second region, wherein the second region is located on the periphery of the first region. The first region and the circuit board's orthographic projection on the display panel overlap, while the second region and the circuit board's orthographic projection on the display panel do not overlap. The first region and the circuit board are attached and bonded together; At least a portion of the second region that is far from the first region is attached and bonded to the display panel.

7. The display module according to claim 5, wherein, The orthographic projection of a portion of the first notch onto the display panel is located within the orthographic projection area of ​​the corner of the first end onto the display panel. The distance between the partial edge of the first notch and the edge of the corner of the first end where the first notch is located on the orthographic projection on the display panel is in the range of 0.2 to 0.3 mm.

8. The display module according to claim 6, wherein, The width of the second region in the direction away from the first region ranges from 5 to 10 mm.

9. The display module according to claim 4, wherein, The circuit board includes detection points located on the side of the first end away from the display panel, and the orthographic projections of the detection points and the corner positions of the first end on the display panel do not overlap. The anti-warping structure has a second notch. The orthographic projection of the second notch on the display panel covers the orthographic projection of the detection point on the display panel.

10. The display module according to claim 4, wherein, The display panel includes a substrate and circuit elements, the circuit elements being located on the side of the substrate closer to the circuit board, and the orthographic projections of the circuit elements and the circuit board on the substrate do not overlap; The base layer and the first adhesive layer also extend to cover the side of the circuit element facing away from the substrate.

11. The display module according to claim 3, wherein, The anti-warping structure includes a base layer and a first adhesive layer. The first adhesive layer and the base layer are sequentially stacked on the side of the circuit board opposite to the display panel. The first adhesive layer and the base layer overlap in their orthographic projection on the display panel; The orthographic projection of the first adhesive layer and the base layer on the display panel covers the orthographic projection of the corner position of the first end on the display panel.

12. The display module according to claim 11, wherein, The anti-warping structure further includes a second adhesive layer, located between the first adhesive layer and the display panel, and situated at the outer periphery of the corner position at the first end. The orthographic projection of the first adhesive layer on the display panel covers the orthographic projection of the second adhesive layer on the display panel, and the orthographic projections of the second adhesive layer and the circuit board on the display panel do not overlap; The first adhesive layer and the corner position of the first end, as well as the side of the second adhesive layer facing away from the display panel, are attached and bonded together; The side of the second adhesive layer closest to the display panel is attached to and bonded to the display panel.

13. The display module according to claim 12, wherein, The surface of the base layer facing away from the display panel is a plane, and the distance between any point on the plane and the display panel is equal.

14. The display module according to claim 12, wherein, The second adhesive layer is made of an elastic material, including foam adhesive.

15. The display module according to claim 12, wherein, The width of the second adhesive layer along the direction away from the circuit board ranges from 3 to 5 mm.

16. The display module according to claim 12, wherein, The second adhesive layer and the corner edge faces of the first end are spaced apart from each other. The distance between the second adhesive layer and the edge face at the corner of the first end is in the range of 0.2 to 0.3 mm.

17. The display module according to claim 4 or 12, wherein, The circuit board includes a first shielding layer, a first insulating layer, a first conductive layer, a substrate, a second conductive layer, a second insulating layer, and a second shielding layer, which are stacked sequentially in a direction away from the display panel. The first insulating layer and the second insulating layer have the same structure. The first insulating layer includes a first sub-layer and a second sub-layer, and the first sub-layer and the second sub-layer are stacked sequentially along a direction away from the display panel. The first sub-layer of the first insulating layer and the first sub-layer of the second insulating layer are mirror-symmetrical about the substrate as the center plane of symmetry. The second sub-layer of the first insulating layer and the second sub-layer of the second insulating layer are mirror-symmetrical about the substrate as the center plane of symmetry. The first conductive layer and the second conductive layer have the same structure. The first conductive layer includes a third sub-layer and a fourth sub-layer, which are stacked sequentially in a direction away from the display panel. The third sublayer of the first conductive layer and the third sublayer of the second conductive layer are mirror-symmetrical about the substrate as the center plane of symmetry; The fourth sublayer of the first conductive layer and the fourth sublayer of the second conductive layer are mirror-symmetrical about the substrate as the center plane of symmetry.

18. The display module according to claim 17, wherein, The anti-warping structure and the second shielding layer do not overlap in their orthographic projections on the display panel. The distance between the first part of the anti-warping structure and the display panel on the side facing away from the display panel is less than or equal to the distance between the second shielding layer and the display panel on the side facing away from the display panel. The first part is the portion where the anti-warping structure overlaps with the orthographic projection of the circuit board on the display panel.

19. The display module according to claim 18, wherein, The anti-warping structure and the second insulating layer do not overlap in their orthographic projections on the display panel.

20. The display module according to claim 19, wherein, The material of the base layer includes metal or metal alloy materials; The anti-warping structure and the second conductive layer do not overlap in their orthographic projections on the display panel.

21. The display module according to any one of claims 18-19, wherein, The base layer is made of organic resin material.

22. The display module according to any one of claims 18-20, wherein, The edge end face of the first part of the anti-warping structure near the circuit board and the edge end face of the circuit board near the first part are spaced apart from each other. The distance between the edge end face of the first part near the side of the circuit board and the edge end face of the circuit board near the first part is in the range of 0.2 to 0.3 mm.

23. The display module according to claim 3, wherein, The anti-warping structure includes a first section, a second section, and a third adhesive layer. The first end, the first portion, and the second portion of the circuit board are arranged sequentially along the first direction and connected sequentially. The third adhesive layer is located on the side of the second portion closer to the display panel. The first end includes multiple membrane layers, which are stacked sequentially. The second portion has the same film structure as the first end, but the first portion has one less film layer compared to the second portion. The first portion can be bent toward the side of the first end near the display panel, so that the second portion is located between the display panel and the side of the first end near the display panel, and the third adhesive layer is located between the second portion and the side of the first end near the display panel. The third adhesive layer is respectively attached and bonded to the second portion and the side of the first end near the display panel.

24. The display module according to claim 23, wherein, The circuit board includes detection points located on the side of the first end away from the display panel, and at a corner position of the first end.

25. The display module according to claim 24, wherein, The anti-warping structure is located on the side of the first end away from the binding end. The anti-warping structure is aligned with the entire edge of the first end on the side furthest from the binding end.

26. The display module according to claim 24, wherein, The anti-warping structure is located on the side of the first end away from the binding end. The anti-warping structure is aligned with the edge of the first end at a corner position away from the binding end.

27. The display module according to claim 25 or 26, wherein, It also includes a fourth adhesive layer, located between the display panel and the circuit board, and bonded to both the display panel and the circuit board respectively; The second portion and the fourth adhesive layer do not overlap in their orthographic projections on the display panel, and the total thickness of the second portion and the third adhesive layer is the same as the thickness of the fourth adhesive layer.

28. The display module according to claim 27, wherein, The second portion and the fourth adhesive layer are projected onto the display panel in the same direction as the circuit board in the same direction as the display panel. The orthographic projections of the second portion and the fourth adhesive layer on the display panel are spaced apart from each other, and the distance between the orthographic projections of the second portion and the fourth adhesive layer on the display panel is in the range of 0.2 to 0.3 mm.

29. The display module according to claim 1, wherein, The circuit board includes a bonding end and a first end. The bonding end is bonded and connected to the display panel, and the first end and the bonding end are disposed opposite to each other. The anti-warping structure is located between the first end and the display panel. The anti-warping structure includes a fifth adhesive layer, a support layer, and a sixth adhesive layer, and the fifth adhesive layer, the support layer, and the sixth adhesive layer are stacked sequentially in a direction away from the display panel; The fifth adhesive layer, the support layer, and the sixth adhesive layer have their orthographic projections on the display panel coincide and are located within the orthographic projection area of ​​the first end on the display panel; The orthographic projections of the fifth adhesive layer, the support layer, and the sixth adhesive layer on the display panel are spaced apart from the orthographic projections of the edge of the first end on the display panel. The distance between the orthographic projections of the fifth adhesive layer, the support layer, and the sixth adhesive layer on the display panel and the orthographic projection of the edge of the first end on the display panel ranges from 0.2 to 0.3 mm.

30. The display module according to claim 29, wherein, The material of the support layer includes metal or metal alloy.

31. A display device, wherein, Includes the display module as described in any one of claims 1-30.

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