Projector

Abstract

Provided is a projector. The projector comprises: an optical engine (1), comprising a light source module (11) and a housing (12), wherein the light source module (11) is provided with a light outlet, and the light outlet is in communication with an inner cavity of the housing (12); and a heat dissipation structure, comprising a semiconductor heat dissipation part (21) and a liquid cooling heat dissipation part (22), wherein the semiconductor heat dissipation part (21) is disposed on the housing (12), a first side of the semiconductor heat dissipation part (21) is located in the inner cavity of the housing (12), a second side of the semiconductor heat dissipation part (21) is exposed to the exterior of the housing (12), and the temperature of the first side of the semiconductor heat dissipation part (21) may be lower than that of the second side of the semiconductor heat dissipation part (21). The liquid cooling heat dissipation part (22) comprises a first liquid cooling part (a) and a second liquid cooling part (b). The first liquid cooling part (a) is connected to the second side of the semiconductor heat dissipation part (21), such that a coolant in the first liquid cooling part (a) exchanges heat with the second side of the semiconductor heat dissipation part (21). The second liquid cooling part (b) is connected to the outer side of the light source module (11), such that a coolant in the second liquid cooling part (b) exchanges heat with the light source module (11). In the projector, the semiconductor cooling and the liquid cooling heat dissipation are combined, such that the temperature of the optical engine (1) can be significantly reduced, and the display performance can be improved.

Description

A projector Technical Field

[0001] This application relates to the field of display device technology, and in particular to a projector. Background Technology

[0002] Currently, single-LCD projectors typically use air cooling (fans) to dissipate heat, with the fan carrying away the heat absorbed by the heatsink. This cooling structure is low-cost and simple, but highly dependent on the environment. Alternatively, some projectors employ thermoelectric cooling (also known as semiconductor cooling or TEC cooling), placing a cooling chip at the fan outlet within the projector's enclosed cavity to lower the cavity temperature. However, while cooling, the hot end of the cooling chip also generates a significant amount of heat, requiring a heatsink and other cooling methods to remove this heat. As the brightness requirements of single-LCD projectors increase, so do the power demands of the light source, creating an urgent need for a cooling solution that can significantly reduce the temperature of the projector's optical engine without affecting the display quality. Summary of the Invention

[0003] This application provides a projector in which the heat dissipation structure combines semiconductor cooling and liquid cooling, which can significantly reduce the temperature of the optical engine and improve the display effect.

[0004] To achieve the above objectives, this application provides the following technical solution:

[0005] A projector, comprising:

[0006] An optical engine, comprising a light source module and a housing, wherein the light source module has a light outlet that communicates with the inner cavity of the housing;

[0007] A heat dissipation structure, comprising a semiconductor heat dissipation section and a liquid cooling heat dissipation section;

[0008] The semiconductor heat sink is disposed on the housing, with a first side of the semiconductor heat sink located inside the housing and a second side of the semiconductor heat sink exposed outside the housing. The temperature of the first side of the semiconductor heat sink can be lower than the temperature of the second side of the semiconductor heat sink.

[0009] The liquid cooling heat dissipation unit includes a first liquid cooling unit and a second liquid cooling unit; the first liquid cooling unit is connected to the second side of the semiconductor heat dissipation unit so that the refrigerant in the first liquid cooling unit exchanges heat with the second side of the semiconductor heat dissipation unit; the second liquid cooling unit is connected to the outside of the light source module so that the refrigerant in the second liquid cooling unit exchanges heat with the light source module.

[0010] Optionally, the semiconductor heat dissipation section includes a cold-end heat sink and a semiconductor cooling chip;

[0011] The first side of the cold end heat sink extends into the inner cavity of the housing, and the second side of the cold end heat sink protrudes from the housing. The cold end heat sink is sealed to the housing.

[0012] The semiconductor refrigeration chip includes a cold end and a hot end, and the cold end of the semiconductor refrigeration chip is connected to the second side of the cold end heat sink.

[0013] The first liquid cooling section is connected to the hot end of the semiconductor cooling chip.

[0014] Optionally, the first liquid cooling section includes a first liquid cooling plate, the first liquid cooling plate having a first flow channel inside, and the outer side of the first liquid cooling plate having a first liquid inlet and a first liquid outlet communicating with the first flow channel.

[0015] Optionally, the first liquid cooling plate is fixedly connected to the housing or the cold end heat sink.

[0016] Optionally, the second liquid cooling section includes a second liquid cooling plate, which is fixed to the side of the light source module away from the light outlet. The second liquid cooling plate has a second flow channel inside and a second liquid inlet and a second liquid outlet communicating with the second flow channel on the outside.

[0017] Optionally, the light source module includes a light source housing and a lamp board located inside the light source housing, the light source housing having the light outlet, and the light outlet being disposed opposite to the lamp board;

[0018] The second liquid cooling plate is connected to the light source housing and the lamp plate.

[0019] Optionally, a thermally conductive medium is filled between the cold-end heat sink and the semiconductor cooling chip, a thermally conductive medium is filled between the first liquid cooling plate and the semiconductor cooling chip, and a thermally conductive medium is filled between the second liquid cooling plate and the light source module.

[0020] Optionally, the liquid cooling heat dissipation unit further includes a cooling fan and a liquid cooling radiator disposed opposite to each other;

[0021] The liquid cooling radiator has a third flow channel inside, and a third liquid inlet and a third liquid outlet communicating with the third flow channel on the outside.

[0022] The third flow channel is connected to the second and first flow channels to form a refrigerant circulation loop.

[0023] Optionally, the liquid cooling heat dissipation unit further includes a refrigerant pump, and a refrigerant circulation is formed between the first flow channel, the second flow channel and the third flow channel through the refrigerant pump.

[0024] Optionally, the first liquid outlet is connected to the liquid inlet of the refrigerant pump, the liquid outlet of the refrigerant pump is connected to the third liquid inlet, the third liquid outlet is connected to the second liquid inlet, and the second liquid outlet is connected to the first liquid inlet.

[0025] Optionally, the first liquid cooling plate is positioned higher than the refrigerant pump.

[0026] Optionally, it also includes at least one temperature sensor and a control module;

[0027] The temperature sensor is located inside the optomechanic;

[0028] The control module is connected to the temperature sensor, the thermoelectric cooler, the refrigerant pump, and the cooling fan via signals. The control module is used for:

[0029] Based on the temperature detected by the temperature sensor, the current input to the semiconductor refrigeration chip, the speed of the refrigerant pump, and the speed of the cooling fan are controlled.

[0030] Optionally, it also includes an internal circulation fan located inside the housing cavity.

[0031] This application provides a projector that includes an optical engine and a heat dissipation structure. The heat dissipation structure includes a semiconductor heat sink and a liquid cooling heat sink. The semiconductor heat sink can be disposed on the housing of the optical engine and can cool the optical components inside the housing. The liquid cooling heat sink can include a first liquid cooling unit and a second liquid cooling unit. The first liquid cooling unit can be connected to a second side of the semiconductor heat sink and can cool the second side of the semiconductor heat sink. The second liquid cooling unit can be disposed on the outside of the light source module of the optical engine and can cool the light source module, thereby achieving overall cooling of the optical engine. Because the liquid refrigerant in the liquid cooling heat sink has a higher density and specific heat characteristics compared to the gas in related technologies, the heat dissipation structure has greater heat dissipation performance. The above-mentioned projector provides a new heat dissipation method that combines semiconductor cooling and liquid cooling. This heat dissipation structure has greater heat dissipation performance, can significantly cool the optical engine, and can increase the power of the light source module and the overall power of the projector, thereby increasing the overall brightness of the projector and improving the display effect. Attached Figure Description

[0032] Figure 1 is a schematic diagram of a projector provided in the related art;

[0033] Figure 2 is a schematic diagram of the structure of a projector provided in an embodiment of this application;

[0034] Figure 3 is an exploded view of a projector provided in an embodiment of this application;

[0035] Figure 4 is a schematic diagram of a heat dissipation structure provided in an embodiment of this application;

[0036] Figure 5 is an exploded view of a heat dissipation structure provided in an embodiment of this application;

[0037] Figure 6 is a schematic diagram of the structure of a top cover provided in an embodiment of this application;

[0038] Figure 7 is a schematic diagram of the structure of a top cover provided in an embodiment of this application;

[0039] Figure 8 is a structural schematic diagram of a first liquid cooling plate provided in an embodiment of this application;

[0040] Figure 9 is a side view of a projector provided in an embodiment of this application;

[0041] Figure 10 is a side view of a heat dissipation structure provided in an embodiment of this application;

[0042] Figure 11 is a structural schematic diagram of a second liquid cooling plate provided in an embodiment of this application;

[0043] Figure 12 is a schematic diagram of the heat flow of a projector provided in an embodiment of this application;

[0044] Figure 13 is a schematic diagram of a liquid cooling radiator provided in an embodiment of this application;

[0045] Figure 14 is a top view of a projector provided in an embodiment of this application;

[0046] Figure 15 is a top view of a heat dissipation structure provided in an embodiment of this application.

[0047] Icons: 1-Optical engine; 11-Light source module; 12-Casing; 121-Lower cover; 122-Upper cover; 123-Middle shell; 21-Semiconductor heat sink; 211-Cold end heat sink; 212-Semiconductor cooling chip; 22-Liquid cooling unit; a-First liquid cooling unit; b-Second liquid cooling unit; 221-First liquid cooling plate; 2211-First flow channel; 2212-First liquid inlet; 2213-First liquid outlet; 2214-First connecting hole; 222 - Second liquid cooling plate; 2221- Second liquid inlet; 2222- Second liquid outlet; 2223- Second connecting hole; 223- Cooling fan; 224- Liquid cooling radiator; 2241- Third flow channel; 2242- Third liquid inlet; 2243- Third liquid outlet; 225- Refrigerant pump; 2261- First liquid cooling pipe; 2262- Second liquid cooling pipe; 2263- Third liquid cooling pipe; 2264- Fourth liquid cooling pipe; 227- Internal circulation fan. Detailed Implementation

[0048] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0049] In related technologies, the structure of a single liquid crystal display panel (LCD) projector can be as shown in Figure 1, including an optical engine and a heat dissipation structure. The optical engine may include a light source module 01, a housing 02, and optical components located within the housing 02. The light-emitting side of the light source module 01 is connected to the inner cavity of the housing 02. The housing 02 may include a top shell 021, a bottom shell 022, and a middle shell 023 located between the bottom shell 021 and the top shell 022. The heat dissipation structure may include an axial fan 031 and heat dissipation fins 032 located on the side of the light source module 01 away from the housing 02, and a side heat sink and a first centrifugal fan located on the side of the housing 02 away from the light source structure, so that the heat from the optical engine is transferred in the direction indicated by the arrow in Figure 1; a copper plate may be disposed between the heat dissipation fins 032 and the light source module 01; the heat dissipation structure also includes a second centrifugal fan located inside the housing.

[0050] In addition, the heat dissipation structure can combine air cooling with TEC (Thermal Design Temperature) cooling. TEC cooling utilizes the Peltier effect, cooling one end and heating the other. The temperature difference between the hot and cold ends of a single TEC can reach 60-70°C, with the cold end temperature reaching -20 to -10°C, offering features such as quiet operation and cooling. Placing the thermoelectric cooler (TEC) at the fan outlet within the projector's enclosed cavity can reduce the internal cavity temperature. However, since the TEC generates significant heat at its hot end while cooling, a heat sink is needed, along with other heat dissipation methods to remove the heat. One approach is to connect the hot end of the TEC to a side heat sink via heat pipes.

[0051] In a closed optical engine, when the power of the light source module increases, the temperature of the LCD screen and other optical components, such as transparent glass, Fresnel lenses, and reflectors, becomes very high due to the illumination of the light source. Cooling solutions that rely solely on air cooling or a combination of TEC and air cooling can solve the heat dissipation problem to some extent, but the heat dissipation capacity is limited. Currently, the power consumption limit of a single LCD projector is about 130W. When higher power consumption needs to be addressed, a completely new heat dissipation solution is required.

[0052] To address the aforementioned technical problems, embodiments of this application provide a projector, as shown in Figures 2 to 5, comprising:

[0053] Optical engine 1 includes a light source module 11 and a housing 12. The light source module 11 has a light outlet, which is connected to the inner cavity of the housing 12.

[0054] The heat dissipation structure includes a semiconductor heat dissipation part 21 and a liquid cooling heat dissipation part 22.

[0055] The semiconductor heat sink 21 is disposed on the housing 12. The first side of the semiconductor heat sink 21 is located in the inner cavity of the housing 12, and the second side of the semiconductor heat sink 21 is exposed on the outer side of the housing 12. The temperature of the first side of the semiconductor heat sink 21 can be lower than the temperature of the second side of the semiconductor heat sink 21.

[0056] The liquid cooling heat dissipation unit 22 includes a first liquid cooling unit a and a second liquid cooling unit b; the first liquid cooling unit a is connected to the second side of the semiconductor heat dissipation unit 21 so that the refrigerant in the first liquid cooling unit a exchanges heat with the second side of the semiconductor heat dissipation unit 21; the second liquid cooling unit b is connected to the outside of the light source module 11 so that the refrigerant in the second liquid cooling unit b exchanges heat with the light source module 11.

[0057] The projector provided in this application embodiment includes an optical engine 1 and a heat dissipation structure. The heat dissipation structure may include a semiconductor heat sink 21 and a liquid-cooled heat sink 22. The semiconductor heat sink 21 can be disposed on the housing 12 of the optical engine 1 and can cool the optical components inside the housing 12. The liquid-cooled heat sink 22 may include a first liquid-cooling part a and a second liquid-cooling part b. The first liquid-cooling part a can be connected to the second side of the semiconductor heat sink 21 and can cool the second side of the semiconductor heat sink 21. The second liquid-cooling part b can be disposed on the outside of the light source module 11 of the optical engine 1 and can cool the light source module 11 of the optical engine 1, thereby achieving overall cooling of the optical engine 1. Since the liquid refrigerant in the liquid-cooled heat sink 22 has a relatively large density and specific heat characteristics compared with the gas in related technologies, the heat dissipation structure can have a relatively large heat dissipation performance. The aforementioned projector provides a new heat dissipation method. The heat dissipation structure combines semiconductor cooling with liquid cooling. This heat dissipation structure has a relatively large heat dissipation performance, which can significantly reduce the temperature of the optical engine, increase the power of the light source module, and increase the power of the projector as a whole, thereby increasing the brightness of the projector and improving the display effect.

[0058] In this embodiment of the application, as shown in Figures 2 to 5, the semiconductor heat dissipation part 21 may include a cold end heat sink 211 and a semiconductor cooling chip 212; the first side of the cold end heat sink 211 extends into the inner cavity of the housing 12, the second side of the cold end heat sink 211 protrudes from the housing 12, and the cold end heat sink 211 is sealed to the housing 12; the semiconductor cooling chip 212 includes a cold end and a hot end, the cold end of the semiconductor cooling chip 212 is connected to the second side of the cold end heat sink 211, and the first liquid cooling part a is connected to the hot end of the semiconductor cooling chip.

[0059] The first side of the cold end heat sink 211 can be the first side of the semiconductor heat sink 21, and the hot end of the semiconductor cooling chip 212 can be the second side of the semiconductor heat sink 21. When current is input to the semiconductor cooling chip 212, the temperature of the first side of the semiconductor heat sink 21 can be lower than the temperature of the second side of the semiconductor heat sink 22.

[0060] In the projector described above, the first side of the cold-end heat sink 211 extends into the inner cavity of the housing 12, while the second side of the cold-end heat sink 211 protrudes from the housing 12, enabling the heat inside the housing 12 to be conducted to the outside of the housing 12. The cold end of the thermoelectric cooler 212 is connected to the second side of the cold-end heat sink 211. The thermoelectric cooler 212 utilizes the thermoelectric effect of semiconductor materials. When a DC current is input to the thermoelectric cooler 212, the thermoelectric cooler 212 can transfer heat from the cold end to the hot end. That is, the thermoelectric cooler 212 can conduct heat from the cold-end heat sink 211 to the hot end of the thermoelectric cooler 212, and then dissipate heat from the hot end of the thermoelectric cooler 212 through the first liquid cooling section a, which can achieve a significant heat dissipation effect.

[0061] Specifically, a thermally conductive medium can be filled between the cold end of the cold-end heat sink 211 and the cold end of the thermoelectric cooler 212. The cold-end heat sink 211 and the cold end of the thermoelectric cooler 212 are connected by the thermally conductive medium, which serves to fill the gap and conduct heat. The thermally conductive medium can improve the thermal conductivity between the cold end heat sink 211 and the cold end of the thermoelectric cooler 212.

[0062] The thermally conductive medium can be a thermally conductive adhesive or a thermally conductive pad, and the material of the thermally conductive medium is not limited here, but depends on the actual situation.

[0063] Specifically, the aforementioned cold end heat sink 211 and semiconductor cooling chip 212 can be installed at any position on the housing 12, without any restrictions, depending on the actual situation.

[0064] Specifically, as shown in Figures 2 and 3, the housing 12 of the optical engine 1 may include an upper cover 122, a lower cover 121, and a middle shell 123. The upper cover 122 is opposite to the lower cover 121, and the middle shell 123 is located between the upper cover 122 and the lower cover 121. The middle shell 123 can be connected to the light source module 11. The upper cover 122, the lower cover 121, and the middle shell 123 can cooperate to form a sealed inner cavity. As shown in Figures 6 and 7, the cold end heat sink 211 and the semiconductor cooling chip 212 can be located at the upper cover 122, the lower cover 121, a corner of the housing 12, or on the back of the reflector inside the housing 12, etc.

[0065] Specifically, the shape of the cold-end heat sink 211 is not limited here and can be determined according to the actual situation. For example, the shape of the cold-end heat sink 211 can be heat dissipation fins, and the heat dissipation fins can have multiple protrusions. The shape of the protrusions on the fins can be cylindrical, square prism, polyhedron, strip, etc. As shown in Figure 6, the shape of the protrusions on the heat dissipation fins can be cylindrical, which has high heat dissipation efficiency.

[0066] In this embodiment of the application, as shown in Figures 2 and 8, the first liquid cooling section a may include a first liquid cooling plate 221. The first liquid cooling plate 221 has a first flow channel 2211 inside, and a first liquid inlet 2212 and a first liquid outlet 2213 communicating with the first flow channel 2211 on the outside.

[0067] In the projector described above, the first liquid cooling section a can be a first liquid cooling plate 221. Refrigerant enters the first flow channel 2211 through the first inlet 2212 of the first liquid cooling plate 221 and then flows out of the first flow channel 2211 through the first outlet 2213. The refrigerant flowing through the first liquid cooling plate 221 can exchange heat with the hot end of the semiconductor heat sink 21, thus achieving heat dissipation from the hot end of the semiconductor heat sink. The first liquid cooling section a has relatively high heat dissipation performance.

[0068] Specifically, the material of the first liquid cooling plate 221 can be metal or other heat-conducting materials. There are no restrictions here, and it depends on the actual situation.

[0069] Specifically, the shape of the first flow channel 2211 inside the first liquid cooling plate 221 is not limited and can be determined according to the actual situation. For example, as shown in Figure 8, the shape of the first flow channel 2211 can be a flow channel surrounded by heat dissipation fins; the first flow channel 2211 can also be a stamped flow channel, or it can also be circular, spiral, racetrack-shaped or cylindrical, etc.

[0070] Specifically, a heat-conducting medium can be filled between the first liquid cooling plate 221 and the semiconductor cooling chip 212. The first liquid cooling plate 221 is attached to the semiconductor cooling chip 212 through the heat-conducting medium, which can improve the heat conduction performance between the first liquid cooling plate 221 and the semiconductor cooling chip 212.

[0071] In this embodiment, the first liquid cooling plate 221 can be fixedly connected to the housing 12 or the cold end heat sink 211 to achieve the fixation of the first liquid cooling plate 221.

[0072] Specifically, as shown in Figure 8, a plurality of first connection holes 2214 can be provided on the first liquid cooling plate 221. The first liquid cooling plate 221 can be fixedly connected to the housing 12 or the cold end heat sink 211 by screws or bolts passing through the first connection holes 2214.

[0073] Alternatively, the structure of the first liquid cooling section a can also be other structures, which are not limited here and depend on the actual situation.

[0074] In this embodiment of the application, as shown in Figures 9 to 12, the second liquid cooling part b may include a second liquid cooling plate 222. The second liquid cooling plate 222 may be fixed on the side of the light source module 11 away from the light outlet. The second liquid cooling plate 222 has a second flow channel inside and a second liquid inlet 2221 and a second liquid outlet 2222 communicating with the second flow channel on the outside of the second liquid cooling plate 222.

[0075] In the projector described above, the second liquid cooling unit b can be a second liquid cooling plate 222 fixed to the side of the light source module 11 away from the light outlet. The refrigerant can enter the second flow channel through the second inlet 2221 of the second liquid cooling plate 222 and then flow out of the second flow channel through the second outlet 2222. The refrigerant flowing through the second liquid cooling plate 222 can exchange heat with the light source module 11, thus achieving heat dissipation for the light source module 11. The second liquid cooling plate 222 has relatively high heat dissipation performance.

[0076] Specifically, the light source module 11 may include a light source housing and a lamp board located inside the light source housing. The light source housing has a light outlet, which is opposite to the lamp board. The second liquid cooling plate 222 is connected to the light source housing and the lamp board.

[0077] The lamp board can be set inside the light source housing in the area opposite to the light outlet. The lamp board has an LED light source. When the projector is working, it is necessary to control the LED light source on the lamp board to emit light, which generates a lot of heat on the lamp board. The second liquid cooling plate 222 is located on the side of the light source module away from the light outlet. It can be connected to the light source housing and the lamp board by screws or bolts. The second liquid cooling plate 222 can cool the lamp board, realize the rapid heat dissipation of the lamp board, and ensure the display effect of the projector.

[0078] Specifically, as shown in Figure 12, multiple second connection holes 2223 can be provided in the area of ​​the second liquid cooling plate 222 where the second flow channel is not provided. By passing bolts or screws through the second connection holes 2223, a fixed connection with the light source housing and the lamp plate can be achieved.

[0079] Specifically, the shape of the second flow channel inside the second liquid cooling plate 222 is not limited and can be determined according to the actual situation. For example, the shape of the second flow channel can be a serpentine flow channel.

[0080] In this embodiment, a thermally conductive medium may be filled between the second liquid cooling plate 222 and the light source module 11. The second liquid cooling plate 222 can be attached to the light source module 11 through the thermally conductive medium, which can improve the heat conduction performance between the second liquid cooling plate 222 and the light source module 11.

[0081] Alternatively, the structure of the second liquid cooling section b can also be other structures, which are not limited here and depend on the actual situation.

[0082] Specifically, the material of the second liquid cooling plate 222 can be metal or other materials, without restriction, depending on the actual situation.

[0083] In this embodiment of the application, as shown in Figures 9 and 10, the liquid cooling heat dissipation unit 22 may further include a cooling fan 223 and a liquid cooling radiator 224 disposed opposite to each other; the interior of the liquid cooling radiator 224 may have a third flow channel 2241, and the exterior of the liquid cooling radiator 224 has a third liquid inlet 2242 and a third liquid outlet 2243 communicating with the third flow channel 2241; the third flow channel 2241 is connected to the second flow channel and the first flow channel 2211, and can form a refrigerant circulation loop.

[0084] In the aforementioned projector, the third flow channel 2241 of the liquid cooling radiator 224 is connected to the first flow channel 2211 of the first liquid cooling plate 221 and the second flow channel of the second liquid cooling plate 222, forming a refrigerant circulation loop. In the refrigerant circulation loop, the refrigerant flowing into the first flow channel 2211 can absorb the heat from the hot end of the semiconductor cooling chip 212, while flowing into the second flow channel can absorb the heat emitted by the light source module 11. When it flows into the third flow channel 2241, the refrigerant in the third flow channel 2241 can be cooled by the air cooling effect of the cooling fan 223 and the heat dissipation effect of the liquid cooling radiator 224, so that the refrigerant can continue to enter the next cooling cycle.

[0085] Specifically, the shape of the third flow channel 2241 within the liquid cooling radiator 224 is not limited here and depends on the actual situation. For example, as shown in Figure 13, the third flow channel 2241 can be divided into multiple interconnected sub-flow channels. Among them, heat dissipation fins can be arranged between adjacent sub-flow channels, and the shape of the heat dissipation fins is not limited, such as corrugated fins or elongated fins.

[0086] Specifically, as shown in Figures 9 and 10, the cooling fan 223 and the liquid cooling radiator 224 can be located on the side of the second liquid cooling plate 222 away from the light source module 11; or, the cooling fan 223 and the liquid cooling radiator 224 can also be located on one side of the second liquid cooling plate 222 along a first direction, the first direction being perpendicular to the arrangement direction of the second liquid cooling plate 222 and the light source module 11.

[0087] As shown in Figures 9 and 10, the liquid cooling radiator 224 can be located on the side of the cooling fan 223 away from the second liquid cooling plate 222. The airflow from the cooling fan 223 blows onto the liquid cooling radiator 224, dissipating heat from the projector. The heat flow on the projector can be as indicated by the arrow in Figure 11. Alternatively, the liquid cooling radiator 224 can be located on the side of the cooling fan 223 closer to the second liquid cooling plate 222. In this case, the cooling fan 223 can draw in heat from the liquid cooling radiator 224 and then dissipate it from the projector. Specifically, the placement of the liquid cooling radiator 224 and the cooling fan 223 is not limited here and depends on the actual situation.

[0088] Specifically, the projector may also have a housing on its outside, and the cooling fan 223 and liquid cooling radiator 224 may be fixedly connected to the housing with screws.

[0089] In this embodiment of the application, as shown in Figures 9 and 10, the liquid cooling heat dissipation unit 22 further includes a refrigerant pump 225, and a refrigerant circulation is formed between the first flow channel 2211, the second flow channel and the third flow channel 2241 through the refrigerant pump 225.

[0090] Specifically, the refrigerant pump 225 in the liquid cooling heat dissipation section 22 can provide power for the refrigerant circulation, so that the refrigerant circulates in the first flow channel 2211, the second flow channel and the third flow channel 2241.

[0091] Specifically, as shown in Figures 14 and 15, the first liquid outlet 2213 of the first liquid cooling plate 221 can be connected to the liquid inlet of the refrigerant pump 225, the liquid outlet of the refrigerant pump 225 is connected to the third liquid inlet 2242 of the liquid cooling radiator 224, the third liquid outlet 2243 of the liquid cooling radiator 224 is connected to the second liquid inlet 2221 of the second liquid cooling plate 222, and the second liquid outlet 2222 of the second liquid cooling plate 222 is connected to the first liquid inlet 2212 of the first liquid cooling plate 221, forming a refrigerant circulation loop, which enables the refrigerant to circulate through the refrigerant pump 225.

[0092] Specifically, as shown in Figures 14 and 15, the first liquid outlet 2213 of the first liquid cooling plate 221 is connected to the liquid inlet of the refrigerant plate via a first liquid cooling pipe 2261; the liquid outlet of the refrigerant pump 225 is connected to the third liquid inlet 2242 of the liquid cooling radiator 224 via a second liquid cooling pipe 2262; the third liquid outlet 2243 of the liquid cooling radiator 224 is connected to the second liquid inlet 2221 of the second liquid cooling plate 222 via a third liquid cooling pipe 2263; and the second liquid outlet 2222 of the second liquid cooling plate 222 is connected to the first liquid inlet 2212 of the first liquid cooling plate 221 via a fourth liquid cooling pipe 2264.

[0093] The materials of the first liquid cooling pipe 2261, the second liquid cooling pipe 2262, the third liquid cooling pipe 2263 and the fourth liquid cooling pipe 2264 can be metal pipes or plastic pipes, or other materials. There are no restrictions here, and it depends on the actual situation.

[0094] Specifically, the connection methods of the first liquid cooling pipe 2261, the second liquid cooling pipe 2262, the third liquid cooling pipe 2263 and the fourth liquid cooling pipe 2264 can be pagoda connection, threaded connection, quick-connect connection, etc., without restriction, depending on the actual situation.

[0095] Specifically, in the projector described above, as shown in Figures 9 and 10, the first liquid cooling plate 221 can be positioned higher than the refrigerant pump 225. Due to the inherent characteristics of the refrigerant pump 225, its inlet does not have a siphon effect. The first outlet 2213 of the first liquid cooling plate 221 is connected to the inlet of the refrigerant pump 225 via the first liquid cooling pipe 2261. Since the first liquid cooling plate 221 is positioned higher than the refrigerant pump 225, the refrigerant in the second liquid cooling plate 222 can flow to the inlet of the refrigerant pump 225 under the influence of gravity, thus ensuring sufficient liquid intake at the inlet of the refrigerant pump 225.

[0096] In this embodiment, the refrigerant can be water or other refrigerants, and there are no restrictions here; it depends on the actual situation.

[0097] In this embodiment of the application, the projector may further include at least one temperature sensor and a control module;

[0098] The temperature sensor is located inside the optomechanical unit 1; the control module is signal-connected to the temperature sensor, the semiconductor refrigeration chip 212, the refrigerant pump 225, and the cooling fan 223; the control module can be used for:

[0099] Based on the temperature detected by the temperature sensor, the current input to the thermoelectric cooler 212, the speed of the refrigerant pump 225, and the speed of the cooling fan 223 are controlled.

[0100] In the projector described above, a temperature sensor is installed inside the optical engine 1 to detect the internal temperature of the optical engine 1. The control module can automatically adjust the current input to the semiconductor cooling chip 212, the speed of the refrigerant pump 225, and the speed of the cooling fan 223, thereby achieving autonomous control of the internal temperature and making the projector more intelligent.

[0101] Specifically, multiple temperature sensors can be installed at different locations inside the optical engine 1. The internal temperature can be autonomously controlled by the control module based on the temperature values ​​detected by the multiple temperature sensors.

[0102] For example, when the temperature detected by the temperature sensor is higher than the target temperature, the control module can control the current input to the semiconductor cooling chip 212 to increase, the speed of the refrigerant pump 225 to increase, and the speed of the cooling fan 223 to increase.

[0103] When the temperature detected by the temperature sensor is lower than the target temperature, the control module can control the current input to the semiconductor cooling chip 212 to decrease, the speed of the refrigerant pump 225 to decrease, and the speed of the cooling fan 223 to decrease.

[0104] In this embodiment of the invention, as shown in FIG3, the projector may further include an internal circulation fan 227. The internal circulation fan 227 is located inside the cavity of the housing 12, which can dissipate the heat on the components inside the cavity of the housing 12 to the cavity of the housing 12, avoid the influence of high temperature on the components inside the housing 12, and ensure the normal display of the projector.

[0105] Specifically, the internal circulation fan 227 can be a centrifugal fan.

[0106] In this embodiment of the application, Figures 2 and 3 show a schematic diagram of the structure of a projector provided in this embodiment. Compared with the heat dissipation structure in related technologies, the heat dissipation structure of the projector in Figure 2 can save the side heat sink and the first centrifugal fan, and can eliminate structures such as heat pipes and heat dissipation fins for cooling the light source module. By using a liquid cooling unit to dissipate heat from the semiconductor cooling chip and the light source module, the heat dissipation effect of the projector can be significantly improved. Related experimental data shows that in related technologies, the upper limit of the power consumption of the entire projector is expected to be 100W, and the heat dissipation structure can keep the screen temperature of the LCD screen below 83 degrees Celsius; while in the projector provided in this embodiment, the upper limit of the power consumption of the entire projector is expected to be 170W, and the heat dissipation structure can keep the screen temperature of the LCD screen estimated to be below 75 degrees Celsius. The projector provided in this embodiment has a significant heat dissipation effect and can ensure the display effect.

[0107] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this application without departing from the spirit and scope of this application. Therefore, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application also intends to include these modifications and variations.

Claims

1. A projector, wherein, include: An optical engine, comprising a light source module and a housing, wherein the light source module has a light outlet that communicates with the inner cavity of the housing; A heat dissipation structure, comprising a semiconductor heat dissipation section and a liquid cooling heat dissipation section; The semiconductor heat sink is disposed on the housing, with a first side of the semiconductor heat sink located inside the housing and a second side of the semiconductor heat sink exposed outside the housing. The temperature of the first side of the semiconductor heat sink can be lower than the temperature of the second side of the semiconductor heat sink. The liquid cooling heat dissipation unit includes a first liquid cooling unit and a second liquid cooling unit; the first liquid cooling unit is connected to the second side of the semiconductor heat dissipation unit so that the refrigerant in the first liquid cooling unit exchanges heat with the second side of the semiconductor heat dissipation unit; the second liquid cooling unit is connected to the outside of the light source module so that the refrigerant in the second liquid cooling unit exchanges heat with the light source module.

2. The projector according to claim 1, wherein, The semiconductor heat dissipation section includes a cold-end heat sink and a semiconductor cooling chip; The first side of the cold end heat sink extends into the inner cavity of the housing, and the second side of the cold end heat sink protrudes from the housing. The cold end heat sink is sealed to the housing. The semiconductor refrigeration chip includes a cold end and a hot end, and the cold end of the semiconductor refrigeration chip is connected to the second side of the cold end heat sink. The first liquid cooling section is connected to the hot end of the semiconductor cooling chip.

3. The projector according to claim 2, wherein, The first liquid cooling section includes a first liquid cooling plate, the first liquid cooling plate has a first flow channel inside, and the outer side of the first liquid cooling plate has a first liquid inlet and a first liquid outlet communicating with the first flow channel.

4. The projector according to claim 3, wherein, The first liquid cooling plate is fixedly connected to the housing or the cold end heat sink.

5. The projector according to claim 3 or 4, wherein, The second liquid cooling section includes a second liquid cooling plate, which is fixed to the side of the light source module away from the light outlet. The second liquid cooling plate has a second flow channel inside and a second liquid inlet and a second liquid outlet communicating with the second flow channel on the outside.

6. The projector according to claim 5, wherein, The light source module includes a light source housing and a lamp board located inside the light source housing. The light source housing has the light outlet, which is disposed opposite to the lamp board. The second liquid cooling plate is connected to the light source housing and the lamp plate.

7. The projector according to claim 5 or 6, wherein, A thermally conductive medium is filled between the cold end heat sink and the semiconductor cooling chip, a thermally conductive medium is filled between the first liquid cooling plate and the semiconductor cooling chip, and a thermally conductive medium is filled between the second liquid cooling plate and the light source module.

8. The projector according to any one of claims 5-7, wherein, The liquid cooling heat dissipation unit also includes a cooling fan and a liquid cooling radiator arranged opposite to each other; The liquid cooling radiator has a third flow channel inside, and a third liquid inlet and a third liquid outlet communicating with the third flow channel on the outside. The third flow channel is connected to the second and first flow channels to form a refrigerant circulation loop.

9. The projector according to claim 8, wherein, The liquid cooling heat dissipation unit also includes a refrigerant pump, and a refrigerant circulation is formed between the first flow channel, the second flow channel and the third flow channel through the refrigerant pump.

10. The projector according to claim 9, wherein, The first liquid outlet is connected to the liquid inlet of the refrigerant pump, the liquid outlet of the refrigerant pump is connected to the third liquid inlet, the third liquid outlet is connected to the second liquid inlet, and the second liquid outlet is connected to the first liquid inlet.

11. The projector according to claim 9 or 10, wherein, The first liquid cooling plate is positioned higher than the refrigerant pump.

12. The projector according to any one of claims 9-11, wherein, It also includes at least one temperature sensor and a control module; The temperature sensor is located inside the optomechanic; The control module is connected to the temperature sensor, the thermoelectric cooler, the refrigerant pump, and the cooling fan via signals. The control module is used for: Based on the temperature detected by the temperature sensor, the current input to the semiconductor refrigeration chip, the speed of the refrigerant pump, and the speed of the cooling fan are controlled.

13. The projector according to any one of claims 1-12, wherein, It also includes an internal circulation fan, which is located inside the cavity of the housing.

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