Audio / video conference terminal and device

Abstract

The present application relates to an audio / video conference terminal and a device. The audio / video conference terminal comprises: a housing, a circuit assembly, a first heat dissipation assembly, and a second heat dissipation assembly. The housing comprises a first side wall, and a first end wall and a second end wall which are oppositely arranged, the first end wall is provided with a first air outlet, the second end wall is provided with a second air outlet, and the first side wall is provided with a first air inlet; a first air passing gap is formed between the circuit assembly and the first side wall; the first heat dissipation assembly comprises a first fan and a first heat pipe, one end of the first heat pipe is provided with a heat conducting plate, and the other end of the first heat pipe, the first fan and the first air inlet are located on the side of the circuit assembly close to the first end wall, so as to form a first heat exchange air channel; and the second heat dissipation assembly comprises a second fan, and the second fan is located on the side of the circuit assembly close to the second end wall, so as to form a second heat exchange air channel. In the audio / video conference terminal, the distribution of the area through which an airflow flows is improved, thereby improving the heat dissipation effect.

Description

Audio and video conferencing terminals and equipment Technical Field

[0001] This application relates to the field of audio and video terminal technology, and in particular to audio and video conferencing terminals and equipment. Background Technology

[0002] Audio and video conferencing terminals are commonly used in remote online meeting scenarios, and can meet various meeting needs such as online meetings, information exchange, and remote communication.

[0003] Some audio and video conferencing terminals in related technologies are developed based on the structure of soundbars. They retain the long, narrow appearance and audio playback function of soundbars, and can integrate various functional modules such as cameras, microphones, and circuit control modules. They can also be connected to external displays to meet various audio and video interaction needs. As audio and video conferencing terminals integrate more and more functions, their heat dissipation requirements are also increasing.

[0004] In related technologies, audio and video conferencing terminals have cooling fans installed inside their housings. The airflow generated by the fan carries heat generated by the heat-generating components outside the housing. However, in these terminals, the airflow is limited to a specific area, resulting in poor heat dissipation. Summary of the Invention

[0005] Therefore, it is necessary to provide an audio-visual conferencing terminal and device to address the problem that the airflow generated by the fan in the audio-visual conferencing terminal in the related technology is limited to a certain area, resulting in poor heat dissipation of the audio-visual conferencing terminal.

[0006] This application provides an audio / video conferencing terminal, which includes:

[0007] The housing includes a first side wall and a first end wall and a second end wall disposed opposite to each other. The two ends of the first side wall are respectively connected to the first end wall and the second end wall. The first end wall is provided with a first air outlet, the second end wall is provided with a second air outlet, and the first side wall is provided with a first air inlet.

[0008] The circuit assembly is installed inside the housing, and there is a first air passage gap between the circuit assembly and the first side wall;

[0009] The first heat dissipation component includes a first fan and a first heat pipe. One end of the first heat pipe is provided with a heat-conducting plate, which exchanges heat with the heat-concentrating area of ​​the circuit component. The first fan is used to introduce external cold air into the housing from the first air inlet. The other end of the first heat pipe, the first fan and the first air inlet are located on the side of the circuit component near the first end wall, so as to form a first heat exchange air duct through which airflow flows sequentially through the first air inlet, the first fan and the first air outlet.

[0010] The second heat dissipation component includes a second fan, which is located on the side of the circuit component near the second end wall. Under the action of the second fan, airflow is formed to flow sequentially through the first air inlet, the first air gap, the second fan, and the second air outlet in the second heat exchange duct.

[0011] The aforementioned audio and video conferencing terminal can not only quickly dissipate the heat generated in the heat-concentrating area of ​​the circuit components to the outside of the housing through the first heat dissipation component and the first heat exchange air duct, thus ensuring rapid heat dissipation in the heat-concentrating area; but also generate airflow along the second heat exchange air duct through the action of the second fan, thereby fully taking into account the heat dissipation needs of the entire area of ​​the circuit components along the first direction, improving the distribution of the area through which the airflow flows, enhancing the heat dissipation effect, and thus allowing more heat-generating devices to be distributed in different areas along the first direction on the circuit components.

[0012] In one embodiment, the housing further includes a second sidewall disposed opposite to the first sidewall, the two ends of the second sidewall being connected to the first sidewall and the second sidewall respectively; a second air gap is provided between the circuit assembly and the second sidewall;

[0013] A second air inlet is provided on the second side wall, and the second air inlet is located at the end of the circuit assembly near the first end wall; under the action of the second fan, a third heat exchange air duct is also formed, in which airflow flows sequentially through the second air inlet, the second air gap, the second fan and the second air outlet.

[0014] The airflow through the second and third heat exchange ducts can fully cover the entire circuit assembly along the first direction. In the second heat exchange duct, the first air gap is located between the circuit assembly and the first sidewall; therefore, the airflow through the second heat exchange duct primarily dissipates heat from the side of the circuit assembly closest to the first sidewall. Similarly, in the third heat exchange duct, the second air gap is located between the circuit assembly and the second sidewall; therefore, the airflow through the third heat exchange duct primarily dissipates heat from the side of the circuit assembly closest to the second sidewall. Thus, through the second and third heat exchange ducts, both sides of the circuit assembly closest to the first and second sidewalls can achieve full coverage along the first direction, further improving the distribution of airflow and allowing for the dispersed placement of more heat-generating components in more areas.

[0015] In one embodiment, the circuit assembly includes a motherboard, multiple board assemblies, and a main heating element. The main heating element is disposed on the side of the motherboard near the first sidewall, and the main heating element cooperates with the heat-conducting plate for heat exchange. The multiple board assemblies are located on the side of the motherboard opposite to the main heating element. The multiple board assemblies are located in a third heat exchange air duct.

[0016] The board assembly includes the board and a functional heating element. The board is electrically connected to the motherboard, and the functional heating element is located on the side of the board facing away from the motherboard and is electrically connected to the board.

[0017] In this embodiment, since the airflow flowing through the second heat exchange duct is mainly used to dissipate heat on the side of the circuit components near the first sidewall, and can fully cover all areas along the first direction, it can dissipate heat on all areas of the motherboard near the first sidewall along the first direction.

[0018] Multiple circuit board components are located on the side of the motherboard facing away from the main heat-generating components, i.e., the side of the motherboard closest to the second sidewall. Since the airflow flowing through the third heat exchange duct is mainly used to dissipate heat from the side of the circuit components closest to the second sidewall, and can fully cover all areas along the first direction, it can dissipate heat from the multiple circuit board components distributed along the first direction individually.

[0019] Therefore, it can be seen that the audio and video conferencing terminal of this embodiment, while ensuring good heat dissipation, can arrange multiple board components along the first direction, thereby further expanding the functions of the audio and video conferencing terminal.

[0020] In one embodiment, the audio-visual conferencing terminal further includes a first speaker and a second speaker. The first speaker is located between the circuit assembly and the first end wall, the first fan is located between the first speaker and the first side wall, the second speaker is located between the circuit assembly and the second end wall, and the second fan is located between the second speaker and the first side wall.

[0021] Since the first fan is located between the first speaker and the first sidewall, and the second fan is located between the second speaker and the first sidewall, the first fan and the second fan are relatively close to the first sidewall. This allows the airflow flowing through the first fan, the first air gap, and the second fan to be closer to the side of the circuit component near the first sidewall. As a result, the airflow can make more sufficient contact with the side of the circuit component near the first sidewall for heat conduction, so that the airflow can quickly and fully carry the heat to the outside of the housing.

[0022] In one embodiment, the audio and video conferencing terminal further includes a mounting structure located within the housing, the mounting structure including a support plate and multiple side plates;

[0023] The support plate is located between the motherboard and the board assembly, and the board assembly and the motherboard are respectively mounted on the support plate;

[0024] Multiple side panels are connected end to end and surround the support plate. The two ends of the side panels are connected to the support plate and the second side wall respectively, so that the support plate, multiple side panels and the second side wall form a second air passage gap.

[0025] The side panel adjacent to the second speaker is defined as the first side panel. The first side panel is spaced apart from the second speaker, and an air vent is provided on the first side panel.

[0026] The installation structure in this embodiment can not only effectively guide the airflow from the second air inlet to flow along the first direction through the side of the circuit assembly near the second sidewall and then to the second air outlet, but also the support plate can be used for the installation of the board assembly and the motherboard, thereby simplifying the internal structure of the audio and video conferencing terminal.

[0027] In one embodiment, the second sidewall includes a sidewall body and a cover, the sidewall body having an opening;

[0028] The cover is connected to the side wall body and covers the opening so that the cover and the mounting structure form a second air passage gap, and the second air inlet is located on the cover.

[0029] By creating an opening, the circuit board components and camera can be easily inserted into the mounting structure, facilitating their installation. Since the cover is positioned over the opening, it forms a second air passage gap with the mounting structure, allowing this gap to connect with the second air inlet and air guide. This enables the airflow from the second air inlet to be effectively guided by the second air passage gap and air guide.

[0030] In one embodiment, the audio and video conferencing terminal further includes a decorative panel connected to the housing, which covers the outside of the second sidewall and shields the connection between the cover and the sidewall body; a gap exists between the decorative panel and the second sidewall.

[0031] In this embodiment, by covering the second sidewall with a decorative panel, the second air inlet and the connection between the cover and the sidewall body can be concealed, maintaining the aesthetic appearance of the casing. External airflow can enter the second air inlet through the gap between the decorative panel and the second sidewall.

[0032] In one embodiment, the audio and video conferencing terminal includes a mounting plate assembly located within the housing, the mounting plate assembly being situated between the first sidewall and the motherboard;

[0033] The mounting plate assembly includes a first mounting plate, a second mounting plate, and a connecting plate, wherein the first mounting plate and the second mounting plate are respectively connected to both ends of the connecting plate;

[0034] The first fan is mounted on the side of the first mounting plate facing away from the motherboard, and the second fan is mounted on the side of the second mounting plate facing away from the motherboard.

[0035] The installation is convenient by mounting the first fan and the second fan onto the first mounting plate and the second mounting plate, respectively. The overall structure of the mounting plate assembly is stable by connecting the first mounting plate and the second mounting plate to the connecting plate.

[0036] In one embodiment, the audio and video conferencing terminal further includes a camera, which is electrically connected to the motherboard and located on the side of the motherboard facing away from the main heat-generating device; board components are respectively provided on both sides of the camera.

[0037] The audio and video conferencing terminal of this embodiment, while ensuring good heat dissipation, arranges a camera and board components located on both sides of the camera along the first direction, which can further and fully expand the functions of the audio and video conferencing terminal.

[0038] In one embodiment, the board assembly further includes a heat sink disposed on the side of the functional heat-generating device facing away from the board.

[0039] Since the heat sink is located on the side of the functional heat-generating device away from the board, it can come into contact with the functional heat-generating device, thereby further enhancing the heat dissipation effect on the functional heat-generating device.

[0040] In one embodiment, the first heat dissipation assembly further includes a first heat sink, which is located on the side of the first fan near the first air outlet, and the end of the first heat pipe away from the main heat-generating device exchanges heat with the first heat sink.

[0041] Since the first heat sink is located on the side of the first fan near the first air outlet along the first direction, the end of the first heat pipe away from the main heat-generating device exchanges heat with the first heat sink. Thus, the heat from the main heat-generating device conducted by the first heat pipe can be quickly dissipated towards the first air outlet through the first heat sink, thereby further and quickly dissipating the heat generated by the main heat-generating device to the outside of the casing.

[0042] In one embodiment, the second heat dissipation assembly further includes a second heat pipe, one end of which is used for heat exchange with the heat-generating device of the circuit assembly, and the other end of which extends to the side of the circuit assembly near the second fan.

[0043] Because one end of the second heat pipe extends to the side of the circuit assembly near the second fan, it can conduct heat from the heat-generating components on the circuit assembly to the side of the heat pipe near the second fan. Then, under the air pressure of the second fan, the heat conducted by the second heat pipe can flow with the airflow through the second fan to the second air outlet, and thus be discharged outside the casing. This further accelerates the heat dissipation from the circuit assembly.

[0044] In one embodiment, the second heat dissipation assembly further includes a second heat sink, which is located on the side of the second fan near the second air outlet, and the end of the second heat pipe near the second fan exchanges heat with the second heat sink.

[0045] Since the second heat sink is located on the side of the second fan near the second air outlet along the first direction, and the end of the second heat pipe near the second fan exchanges heat with the second heat sink, the heat from the heat-generating device conducted by the second heat pipe can be quickly dissipated towards the second air outlet through the second heat sink, and the heat can be further quickly discharged to the outside of the casing.

[0046] In one embodiment, the first heat dissipation component further includes a first air duct, which is located on the side of the first fan near the first air outlet.

[0047] The airflow from the first fan can flow through the first air duct and then exit through the first air outlet, thereby accurately and quickly expelling the heat from the self-heating device outside the casing, further enhancing the heat dissipation effect.

[0048] In one embodiment, the second heat dissipation assembly further includes a second air duct, which is located on the side of the second fan near the second air outlet.

[0049] The airflow from the second fan can flow through the second air duct and then exit through the second air outlet, thus accurately and quickly expelling the heat from the self-heating device outside the casing, further enhancing the heat dissipation effect.

[0050] One embodiment of this application provides an audio and video conferencing device, including a display device and an audio and video conferencing terminal according to any of the above embodiments, wherein the audio and video conferencing terminal is electrically connected to the display device.

[0051] The aforementioned audio and video conferencing equipment can not only quickly dissipate the heat generated in the heat-concentrating area of ​​the circuit components to the outside of the housing through the first heat dissipation component and the first heat exchange air duct, thus ensuring rapid heat dissipation in the heat-concentrating area; but also, through the action of the second fan, it generates airflow along the second heat exchange air duct, thereby fully taking into account the heat dissipation needs of the entire area of ​​the circuit components along the first direction, improving the distribution of the area through which the airflow flows, enhancing the heat dissipation effect, and thus allowing more heat-generating devices to be distributed in different areas along the first direction on the circuit components.

[0052] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0053] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0054] Figure 1 is a schematic diagram of the structure of an audio and video conferencing terminal according to an embodiment.

[0055] Figure 2 is a schematic diagram of the audio and video conferencing terminal in Figure 1, viewed from the side facing the first side wall.

[0056] Figure 3 is a schematic diagram of the AA cross section of Figure 2.

[0057] Figure 4 is a schematic diagram of the internal structure of the audio and video conferencing terminal in Figure 1 and its connection structure with the second side wall.

[0058] Figure 5 is a magnified view of region B in Figure 4.

[0059] Figure 6 is a schematic diagram of the audio and video conferencing terminal in Figure 1 without the cover and decorative panel installed.

[0060] Figure 7 is a schematic diagram of the connection structure between the structure shown in Figure 6 and the cover.

[0061] Explanation of reference numerals in the attached drawings: XX', First direction; YY', Second direction; ZZ', Third direction; 100, Housing; 110, First sidewall; 110a, First air inlet; 120, First endwall; 120a, First air outlet; 130, Second endwall; 130a, Second air outlet; 140, Second sidewall; 140a, Second air inlet; 141, Sidewall body; 141a, Opening; 142, Cover; 150, Third sidewall; 200, Circuit assembly; 201, First air gap; 202, Second air gap; 210, Main board; 211, Main heating element; 220, Board assembly; 221, Board; 222, Functional heating element; 223, Heat sink; 300, First heat dissipation component; 310, First fan; 320, First heat pipe; 321, Heat-conducting plate; 330, First radiator; 340, First air duct; 400, Second heat dissipation component; 410, Second fan; 420, Second heat pipe; 430, Second radiator; 440, Second air duct; 510, First speaker; 520, Second speaker; 600, Mounting structure; 610, Support plate; 620, Side plate; 621, First side plate; 601, Air vent; 700, Decorative panel; 810, First mounting plate; 820, Second mounting plate; 830, Connecting plate; 840, Third mounting plate; 900, Camera. Detailed Implementation

[0062] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0063] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0064] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0065] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0066] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0067] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0068] Some audio and video conferencing terminals in related technologies are developed based on the structure of soundbars. They retain the long, narrow appearance and audio playback function of soundbars, and can integrate various functional modules such as cameras, microphones, and circuit control modules. They can also be connected to external displays to meet various audio and video interaction needs. As audio and video conferencing terminals integrate more and more functions, their heat dissipation requirements are also increasing.

[0069] The audio and video conferencing terminal in related technologies includes a long, narrow housing, circuit components inside the housing, a fan, etc. As the airflow generated by the fan exits the housing, it carries away the heat generated by the heat-generating components of the circuitry.

[0070] However, in related audio and video conferencing terminals, the fans are mainly located on both sides of the internal length of the housing. The airflow generated by the fans mainly flows through the two sides of the housing along its length, rather than through the middle, resulting in poor heat dissipation for the heat-generating components located in the middle of the housing. Therefore, the placement of heat-generating components is also very limited, and they can only be concentrated in areas with better heat dissipation. This makes it difficult to accommodate a large number of heat-generating components and limits the functional expansion of the audio and video conferencing terminal.

[0071] It is evident that in audio and video conferencing terminals of related technologies, the airflow generated by the fan can only reach a limited area, resulting in poor heat dissipation performance.

[0072] In view of this, the present application provides an audio and video conferencing terminal that can not only quickly dissipate the heat generated in the heat-concentrated area of ​​the circuit component to the outside of the housing through the first heat dissipation component and the first heat exchange air duct, thus fully ensuring the rapid heat dissipation of the heat-concentrated area; but also generate airflow along the second heat exchange air duct through the action of the second fan, thereby fully taking into account the heat dissipation needs of the entire area of ​​the circuit component along the first direction, improving the distribution of the area through which the airflow flows, and thus allowing more heat-generating devices to be distributed in different areas along the first direction on the circuit component.

[0073] Referring to Figures 1 and 2, an audio-visual conferencing terminal is provided in an embodiment of this application. Referring further to Figures 3 and 4, the audio-visual conferencing terminal includes a housing 100, a circuit assembly 200, a first heat dissipation assembly 300, and a second heat dissipation assembly 400.

[0074] For ease of explanation of the technical solutions of the embodiments of this application, the following description uses a first direction XX', a second direction YY', and a third direction ZZ'. The first direction XX', the second direction YY', and the third direction ZZ' intersect each other. The first direction XX' is the arrangement direction of the first end wall 120 and the second end wall 130. Optionally, the first direction XX' is the length direction of the housing 100.

[0075] The housing 100 includes a first side wall 110 and a first end wall 120 and a second end wall 130 disposed opposite to each other. The two ends of the first side wall 110 are respectively connected to the first end wall 120 and the second end wall 130. The first end wall 120 is provided with a first air outlet 120a, the second end wall 130 is provided with a second air outlet 130a, and the first side wall 110 is provided with a first air inlet 110a.

[0076] The circuit assembly 200 is installed inside the housing 100, and there is a first air gap 201 between the circuit assembly 200 and the first side wall 110.

[0077] The first heat dissipation component 300 includes a first fan 310 and a first heat pipe 320. One end of the first heat pipe 320 is provided with a heat-conducting plate 321, which exchanges heat with the heat-concentrating area of ​​the circuit component 200. The first fan 310 is used to introduce external cold air into the housing 100 from the first air inlet 110a. The other end of the first heat pipe 320, the first fan 310 and the first air inlet 110a are located on the side of the circuit component 200 near the first end wall 120, so as to form a first heat exchange air duct through which airflow flows sequentially through the first air inlet 110a, the first fan 310 and the first air outlet 120a.

[0078] Under the action of the wind pressure generated by the first fan 310, the external cold air is introduced into the housing 100 from the first air inlet 110a, which can form an airflow that flows along the first heat exchange air duct, that is, the airflow that flows through the first air inlet 110a, the first fan 310 and the first air outlet 120a in sequence (as indicated by the dashed arrow in Figure 3).

[0079] The heat-conducting plate 321 can be made of copper or other materials that can conduct heat quickly.

[0080] Specifically, the end of the first heat pipe 320 with the heat-conducting plate 321 is located in the heat-concentrating area of ​​the circuit assembly 200. The heat-conducting plate 321 and the heat-concentrating area of ​​the circuit assembly 200 can conduct heat through contact, transferring the heat from the heat-concentrating area of ​​the circuit assembly 200 to the first heat pipe 320. Since the end of the first heat pipe 320 away from the heat-conducting plate 321 and the first fan 310 are located on the side of the circuit assembly 200 near the first end wall 120, the end of the first heat pipe 320 away from the heat-conducting plate 321 is close to the first fan 310, so that the airflow through the first fan 310 can carry the heat from the first heat pipe 320 to the first air outlet 120a.

[0081] The second heat dissipation component 400 includes a second fan 410, which is located on the side of the circuit component 200 near the second end wall 130. Under the action of the second fan 410, airflow is formed to flow sequentially through the first air inlet 110a, the first air gap 201, the second fan 410, and the second air outlet 130a in a second heat exchange duct.

[0082] Under the wind pressure generated by the first fan 310, external cold air is introduced into the housing 100 through the first air inlet 110a. The airflow entering the housing 100 through the first air inlet 110a not only flows along the first heat exchange duct, but also, under the wind pressure generated by the second fan 410, a portion of the airflow is drawn to flow along the second heat exchange duct. In other words, the external cold air introduced into the housing 100 through the first air inlet 110a is divided into two parts: one part flows along the first heat exchange duct, and the other part flows along the second heat exchange duct under the wind pressure of the second fan 410.

[0083] The airflow along the second heat exchange duct flows sequentially through the first air inlet 110a, the first air gap 201, the second fan 410, and the second air outlet 130a. Since the first air inlet 110a is located on the side of the circuit assembly 200 near the first end wall 120, the second air outlet 130a is located on the second end wall 130, and the first air gap 201 is located between the circuit assembly 200 and the first side wall 110, the airflow along the second heat exchange duct can flow from the side of the circuit assembly 200 near the first end wall 120, through the first air gap 201, and then to the side of the circuit assembly 200 near the second end wall 130. Thus, the airflow along the second heat exchange duct can fully cover the entire circuit assembly 200 along the first direction XX', thereby fully considering the heat dissipation needs of the entire area of ​​the circuit assembly 200 along the first direction XX', and allowing for the dispersed arrangement of more heat-generating devices in different areas along the first direction XX' on the circuit assembly 200.

[0084] In the aforementioned audio and video conferencing terminal, the first fan 310 is used to introduce external cold air into the housing 100 from the first air inlet 110a. Under the action of the wind pressure generated by the first fan 310, an airflow can be formed along the first heat exchange duct, that is, the airflow flows through the first air inlet 110a, the first fan 310 and the first air outlet 120a in sequence (as indicated by the dashed arrow in Figure 3). Referring to Figure 5, since the heat-conducting plate 321 conducts the heat from the concentrated heat-generating area of ​​the circuit assembly 200 to the first heat pipe 320, and the end of the first heat pipe 320 away from the heat-conducting plate 321 and the first fan 310 are located on the side of the circuit assembly 200 near the first end wall 120, the cold air from the first air inlet 110a can carry the heat from the first heat pipe 320 at the same time as it flows through the first fan 310 and the first air inlet 110a, thereby conducting the heat from the first heat pipe 320 to the outside of the housing 100, and then the heat generated in the concentrated heat-generating area of ​​the circuit assembly 200 can be quickly conducted to the outside of the housing 100 through the first heat exchange air duct.

[0085] Under the wind pressure generated by the second fan 410, a portion of the airflow from the first air inlet 110a is drawn to flow along the second heat exchange duct. Since the first air inlet 110a is located on the side of the circuit assembly 200 near the first end wall 120, the second air outlet 130a is located on the second end wall 130, and the first air gap 201 is located between the circuit assembly 200 and the first side wall 110, the airflow flowing along the second heat exchange duct can flow from the side of the circuit assembly 200 near the first end wall 120, through the first air gap 201, and then to the side of the circuit assembly 200 near the second end wall 130. Thus, the airflow flowing along the second heat exchange duct can fully cover the entire circuit assembly 200 along the first direction XX'.

[0086] Therefore, the aforementioned audio and video conferencing terminal can not only quickly dissipate the heat generated in the heat-concentrated area of ​​the circuit component 200 to the outside of the housing 100 through the first heat dissipation component 300 and the first heat exchange air duct, thus ensuring rapid heat dissipation of the heat-concentrated area; but also, through the action of the second fan 410, an airflow is generated along the second heat exchange air duct, thereby fully taking into account the heat dissipation needs of the entire area of ​​the circuit component 200 along the first direction XX', improving the distribution of the area through which the airflow flows, enhancing the heat dissipation effect, and thus allowing more heat-generating devices to be distributed in different areas along the first direction XX' on the circuit component 200.

[0087] Understandably, in audio and video conferencing terminals, the heat-generating areas of circuit components 200 include at least the processor (e.g., CPU processor, GPU processor). The processor is the core component of the audio and video conferencing terminal, responsible for complex computational tasks such as video encoding / decoding, audio processing, and data transmission. Under high load (such as high-definition video conferencing or multitasking), the processor generates a significant amount of heat, and the heat dissipation rate is relatively fast. This is especially true for processors with integrated GPUs, which generate even more significant heat during video rendering or image processing.

[0088] Optionally, the heat-generating area of ​​the circuit assembly 200 also includes a power management module, which is responsible for providing a stable power supply to the entire device, including voltage conversion and current regulation. The power management module generates more heat during high power output or when voltage conversion efficiency is low.

[0089] Optionally, the heat-generating concentrated area of ​​the circuit assembly 200 may also include any one or more of the following: memory module, power amplifier, network interface chip, and voltage regulation module.

[0090] Referring to Figures 3 and 4, in one embodiment, the housing 100 further includes a second sidewall 140 disposed opposite to the first sidewall 110. The second direction YY' is the arrangement direction of the first endwall 120 and the second endwall 130. The two ends of the second sidewall 140 are respectively connected to the first endwall 120 and the second endwall 130. A second air gap 202 is provided between the circuit assembly 200 and the second sidewall 140.

[0091] A second air inlet 140a is provided on the second side wall 140, and the second air inlet 140a is located at the end of the circuit assembly 200 near the first end wall 120. Under the action of the second fan 410, a third heat exchange air duct is formed in which airflow flows sequentially through the second air inlet 140a, the second air gap 202, the second fan 410, and the second air outlet 130a.

[0092] Since the second air outlet 130a is located on the second end wall 130 and the second air inlet 140a is located at the end of the circuit assembly 200 near the first end wall 120, the second air outlet 130a and the second air inlet 140a are located at both ends of the circuit assembly 200 along the first direction XX', respectively. Thus, under the wind pressure generated by the second fan 410, external cold air can be drawn into the second air inlet 140a and sequentially flow through the second air gap 202, the second fan 410, and the second air outlet 130a before being discharged outside the housing 100. This means that the airflow along the third heat exchange air duct can fully cover the entire circuit assembly 200 along the first direction XX', improving the distribution of the airflow area and enhancing the heat dissipation effect. Furthermore, more heat-generating devices can be distributed and arranged in different areas along the first direction XX' on the circuit assembly 200.

[0093] The airflow through the second and third heat exchange ducts can fully cover the entire circuit assembly 200 along the first direction XX'. In the second heat exchange duct, the first air gap 201 is located between the circuit assembly 200 and the first sidewall 110; therefore, the airflow through the second heat exchange duct is mainly used to dissipate heat on the side of the circuit assembly closest to the first sidewall 110. Similarly, in the third heat exchange duct, the second air gap 202 is located between the circuit assembly 200 and the second sidewall 140; therefore, the airflow through the third heat exchange duct is mainly used to dissipate heat on the side of the circuit assembly 200 closest to the second sidewall 140. Thus, through the second and third heat exchange ducts, both the side of the circuit assembly 200 closest to the first sidewall 110 and the side closest to the second sidewall 140 can achieve full coverage along the first direction XX', further improving the distribution of the airflow and allowing for the dispersed arrangement of more heat-generating devices in more areas.

[0094] Referring to Figures 4 to 6, in one embodiment, the circuit assembly 200 includes a motherboard 210, multiple board assemblies 220, and a main heating element 211. The main heating element 211 is disposed on the side of the motherboard 210 near the first sidewall 110, and the main heating element 211 cooperates with the heat-conducting plate 321 for heat exchange. The multiple board assemblies 220 are located on the side of the motherboard 210 opposite to the main heating element 211, that is, on the side of the motherboard 210 near the second sidewall 140. The multiple board assemblies 220 are located in a third heat exchange air duct.

[0095] The board assembly 220 includes a board 221 and a functional heating device 222. The board 221 is electrically connected to the motherboard 210, and the functional heating device 222 is located on the side of the board 221 facing away from the motherboard 210 and is electrically connected to the board 221.

[0096] Specifically, the main heat-generating device 211 is located in the heat concentration area and can be a power management chip, a power amplifier chip, an audio processing chip, etc. The functional heat-generating device 222 can be, for example, an AI computing chip, a graphics processing chip, etc. One or more functional heat-generating devices 222 can be installed on the board 221 of each board assembly 220.

[0097] In this embodiment, since the airflow flowing through the second heat exchange duct is mainly used to dissipate heat on the side of the circuit components near the first sidewall 110, and can fully cover all areas along the first direction XX', it can dissipate heat on all areas of the motherboard 210 near the first sidewall 110 along the first direction XX'.

[0098] Multiple circuit board components 220 are located on the side of the motherboard 210 facing away from the main heat-generating device 211, that is, on the side of the motherboard 210 closest to the second sidewall 140. Since the airflow through the third heat exchange duct is mainly used to dissipate heat from the side of the circuit components closest to the second sidewall 140, and can fully cover all areas along the first direction XX', it can dissipate heat from each of the multiple circuit board components 220. The multiple circuit board components 220 can be arranged along the first direction XX'.

[0099] Therefore, it can be seen that the audio and video conferencing terminal of this embodiment can be equipped with multiple board components 220 while ensuring good heat dissipation, thereby further expanding the functions of the audio and video conferencing terminal.

[0100] Please refer to Figures 3 and 4. In one embodiment, the audio and video conferencing terminal further includes a first speaker 510 and a second speaker 520. The first speaker 510 is located between the circuit assembly 200 and the first end wall 120. The first fan 310 is located between the first speaker 510 and the first side wall 110. The second speaker 520 is located between the circuit assembly 200 and the second end wall 130. The second fan 410 is located between the second speaker 520 and the first side wall 110.

[0101] The first speaker 510 and the second speaker 520 are used to implement audio playback function. Since the first fan 310 is located between the first speaker 510 and the first side wall 110, and the second fan 410 is located between the second speaker 520 and the first side wall 110, the first fan 310 and the second fan 410 are relatively close to the first side wall 110. This allows the airflow flowing through the first fan 310, the first air gap 201, and the second fan 410 to be closer to the side of the circuit assembly 200 near the first side wall 110. As a result, the airflow can more fully contact and conduct heat with the side of the circuit assembly 200 near the first side wall 110, so that the airflow can quickly and fully carry the heat to the outside of the housing 100.

[0102] Referring to Figure 3, in one embodiment, the first speaker 510 is located on the side of the second air inlet 140a away from the second air outlet 130a, thereby avoiding the first speaker 510 from blocking the airflow from the second air inlet 140a, which in turn facilitates the smooth flow of the airflow from the second air inlet 140a into the second air gap 202.

[0103] Referring to Figures 4 to 6, in one embodiment, the audio and video conferencing terminal further includes a mounting structure 600 located within the housing 100, the mounting structure 600 including a support plate 610 and a plurality of side plates 620.

[0104] The support plate 610 is located between the motherboard 210 and the board assembly 220, and the board assembly 220 and the motherboard 210 are respectively installed on the support plate 610.

[0105] Multiple side plates 620 are connected end to end and surround the support plate 610. The two ends of the side plates 620 are connected to the support plate 610 and the second side wall 140 respectively, so that the support plate 610, the multiple side plates 620 and the second side wall 140 form a second air passage gap 202.

[0106] The side plate 620 adjacent to the second speaker 520 is defined as the first side plate 621. The first side plate 621 is spaced apart from the second speaker 520, and the first side plate 621 is provided with an air vent 601.

[0107] In this embodiment, the support plate 610 is connected to the second sidewall 140 via the side plate 620. The support plate 610 is located between the main board 210 and the board assembly 220, so that the board assembly 220 and the main board 210 can be installed on the support plate 610 respectively, facilitating the installation of the board assembly 220 and the main board 210. The camera 900 can also be installed on the support plate 610.

[0108] The support plate 610 and the multiple side plates 620 can be an integrally formed structure or a structure formed separately and then connected to each other. The mounting structure 600 and the second side wall 140 can be an integrally formed structure or a structure formed separately and then connected to each other.

[0109] Understandably, the second air passage gap 202 formed by the support plate 610, multiple side plates 620, and the second side wall 140 is a space separated from the space outside the second air passage gap 202. Furthermore, since the side plate 620 adjacent to the second speaker 520 is the first side plate 621, and the first side plate 621 is provided with an air guide 601, the second air inlet 140a and the air guide 601 are located at opposite ends of the circuit assembly 200 along the first direction XX'. Thus, under the wind pressure of the second fan 410 and guided by the air guide 601, the airflow from the second air inlet 140a can flow along the first direction XX' through the second air passage gap 202, the air guide 601, the gap between the first side plate 621 and the second speaker 520, and then to the second air outlet 130a.

[0110] The mounting structure 600 in this embodiment can not only effectively guide the airflow from the second air inlet 140a to flow along the first direction XX' through the side of the circuit assembly 200 near the second side wall 140 and then to the second air outlet 130a, but also the support plate 610 can be used for the installation of the board assembly 220 and the motherboard 210, thereby simplifying the internal structure of the audio and video conferencing terminal.

[0111] Referring to Figures 4 to 7, in one embodiment, the second sidewall 140 includes a sidewall body 141 and a cover 142, and the sidewall body 141 is provided with an opening 141a.

[0112] The cover 142 is connected to the side wall body 141 and covers the opening 141a, so that the cover 142 and the mounting structure 600 form a second air passage gap 202, and the second air inlet 140a is provided on the cover 142.

[0113] Optionally, the mounting structure 600 and the sidewall body 141 can be assembled together by connecting two separately formed structures, or the mounting structure 600 and the sidewall body 141 can be an integrally formed structure.

[0114] By creating opening 141a, the board assembly 220 and the camera 900 can easily enter the mounting structure 600 through opening 141a, thus facilitating the installation of the board assembly 220 and the camera 900. Since the cover 142 covers the opening 141a, it can form a second air passage gap 202 with the mounting structure 600, and the second air passage gap 202 can communicate with the second air inlet 140a and the air guide 601, so that the airflow from the second air inlet 140a can be effectively guided by the second air passage gap 202 and the air guide 601.

[0115] In other embodiments, the second sidewall 140 may also be an integral part, that is, not a connection structure between the sidewall body and the cover.

[0116] Referring to Figures 1 and 7, in one embodiment, the audio / video conferencing terminal further includes a decorative panel 700, which is connected to the housing 100. The decorative panel 700 covers the second sidewall 140 and obscures the connection between the cover 142 and the sidewall body 141. A gap exists between the decorative panel 700 and the second sidewall 140.

[0117] The audio-visual conferencing terminal also includes a decorative panel 700, which is connected to the housing 100. The decorative panel 700 covers the outside of the first side wall 110 and blocks the connection between the cover 142 and the side wall body 141. There is a gap between the decorative panel 700 and the first side wall 110.

[0118] In this embodiment, by having the decorative panel 700 cover the second sidewall 140, the connection between the second air inlet 140a and the cover 142 and the sidewall body 141 can be concealed, maintaining the aesthetic appearance of the housing 100. External airflow can enter the second air inlet 140a through the gap between the decorative panel 700 and the second sidewall 140.

[0119] Referring again to Figures 4 to 6, in one embodiment, the video conferencing terminal includes a mounting plate assembly located within the housing 100. The mounting plate assembly is located between the first sidewall 110 and the mainboard 210.

[0120] The mounting plate assembly includes a first mounting plate 810, a second mounting plate 820, and a connecting plate 830. The first mounting plate 810 and the second mounting plate 820 are respectively connected to the two ends of the connecting plate 830 along a first direction XX'.

[0121] The first fan 310 is mounted on the side of the first mounting plate 810 facing away from the motherboard 210. The second fan 410 is mounted on the side of the second mounting plate 820 facing away from the motherboard 210.

[0122] The installation is facilitated by mounting the first fan 310 and the second fan 410 on the first mounting plate 810 and the second mounting plate 820, respectively. The overall structure of the mounting plate assembly is stabilized by connecting the first mounting plate 810 and the second mounting plate 820 to the connecting plate 830, respectively.

[0123] Furthermore, the mounting plate assembly can be connected to the support plate 610, thereby facilitating the fixing of the mounting plate assembly in position.

[0124] In one embodiment, the housing 100 further includes a third sidewall 150 and a fourth sidewall disposed opposite to each other. The first end wall 120, the second end wall 130, the first sidewall 110, and the second sidewall 140 are all connected to the third sidewall 150 on the same side, and to the fourth sidewall on the other side. The relative direction of the third sidewall 150 and the fourth sidewall is a third direction ZZ'. The third sidewall 150 and the fourth sidewall are respectively spaced apart from the mounting plate assembly. The gap between the mounting plate assembly and the main board 210 is a first air passage gap 201.

[0125] Since the first mounting plate 810 is located between the first side wall 110 and the motherboard 210, and the first fan 310 is installed on the side of the first mounting plate 810 facing away from the motherboard 210, when the cold air entering the housing 100 from the first air inlet 110a flows towards the first mounting plate 810 along the second direction YY', the first mounting plate 810 will block the cold air from flowing towards the motherboard 210 along the second direction YY', so that the airflow can flow towards the first air outlet 120a along the first direction XX', that is, form an airflow flowing along the first heat exchange duct.

[0126] However, under the wind pressure of the second fan 410, the airflow tends to flow along the second heat exchange duct. At this time, the airflow entering the housing 100 from the first air inlet 110a flows along the second direction YY' to the first mounting plate 810. It can then flow through the gap between the first mounting plate 810 and the third side wall 150, and the gap between the first mounting plate 810 and the fourth side wall, and thus flow to the side of the first mounting plate 810 close to the motherboard 210. This allows it to fully contact the heat-generating devices on the motherboard 210 for efficient heat dissipation.

[0127] When the airflow flowing through the first air gap 201 flows between the second mounting plate 820 and the main board 210, it can flow through the gap between the second mounting plate 820 and the third side wall 150, and the gap between the second mounting plate 820 and the fourth side wall, and thus flow to the side of the second mounting plate 820 facing away from the main board 210 (i.e. the side close to the second fan 410), and then the airflow can be discharged to the second air outlet 130a through the second fan 410.

[0128] Referring to Figures 4 to 6, in one embodiment, the audio-visual conferencing terminal further includes a camera 900. The camera 900 is electrically connected to the motherboard 210 and is located on the side of the motherboard 210 opposite to the main heat-generating device 211, that is, the camera 900 and the board assembly 220 are located on the same side of the motherboard 210. Board assemblies 220 are respectively provided on both sides of the camera 900 along the first direction XX'.

[0129] In this embodiment, the camera 900 can be configured to expand the functions of the audio and video conferencing terminal, such as video calling and intelligent monitoring. Board components 220 are respectively arranged on both sides of the camera 900 along the first direction XX'.

[0130] Since the area through which the airflow flows through the third heat exchange duct can fully cover the side of the circuit assembly 200 near the second sidewall 140 along the first direction XX', the area through which the airflow flows can fully meet the heat dissipation needs of the camera 900 and the board assembly 220 located on both sides of the camera 900 along the first direction XX'.

[0131] In this embodiment, the audio and video conferencing terminal, while ensuring good heat dissipation, arranges a camera 900 and board components 220 located on both sides of the camera 900 along the first direction XX', which can further fully expand the functions of the audio and video conferencing terminal.

[0132] Please refer to Figure 6. In one embodiment, the board assembly 220 also includes a heat sink 223, which is disposed on the side of the functional heat-generating device 222 facing away from the board 221.

[0133] Since the heat sink 223 is located on the side of the functional heat-generating device 222 away from the board 221, it can come into contact with the functional heat-generating device 222, thereby further enhancing the heat dissipation effect on the functional heat-generating device 222.

[0134] Referring to Figures 4 to 6, in one embodiment, the first heat dissipation assembly 300 further includes a first heat sink 330, which is located along the first direction XX' on the side of the first fan 310 near the first air outlet 120a, and the end of the first heat pipe 320 away from the main heat-generating device 211 exchanges heat with the first heat sink 330.

[0135] The end of the first heat pipe 320 furthest from the main heat-generating device 211 can directly contact the first heat sink 330. Specifically, the first heat sink 330 can be mounted on the first mounting plate 810. The end of the first heat pipe 320 furthest from the main heat-generating device 211 can also contact the first mounting plate 810, thereby indirectly contacting the first heat sink 330 through the first mounting plate 810 for heat conduction.

[0136] Since the first heat sink 330 is located on the side of the first fan 310 near the first air outlet 120a along the first direction XX', the end of the first heat pipe 320 away from the main heat-generating device 211 exchanges heat with the first heat sink 330. Thus, the heat from the main heat-generating device 211 conducted by the first heat pipe 320 can be quickly dissipated towards the first air outlet 120a through the first heat sink 330, thereby further quickly dissipating the heat generated by the main heat-generating device 211 to the outside of the casing 100.

[0137] Optionally, the first heat sink 330 is a finned heat sink, which includes a heat sink base and multiple heat sink fins disposed on the heat sink base. A heat dissipation gap is formed between adjacent heat sink fins, extending along a first direction XX'. The end of the first heat pipe 320 away from the main heat-generating device 211 is in thermal contact with the heat sink base. Heat from the main heat-generating device 211 can be transferred to the heat sink base of the first heat sink 330 via the first heat pipe 320, and then transferred to the heat sink fins via the heat sink base. The airflow passing through the first fan 310 can carry heat through the heat dissipation gap and be discharged outside the housing 100.

[0138] Referring to Figures 4 to 6, in one embodiment, the first heat dissipation component 300 further includes a first air duct 340, which is located along a first direction XX' on the side of the first fan 310 near the first air outlet 120a.

[0139] The airflow from the first fan 310 can flow through the first air duct 340 and then exit through the first air outlet 120a, thereby accurately and quickly expelling the heat from the self-heating device 211 outside the housing 100, further enhancing the heat dissipation effect.

[0140] Specifically, the first heat sink 330 can be located between the first air duct 340 and the first fan 310. The first air duct 340 is located on the side of the first heat sink 330 near the first air outlet 120a. Thus, the airflow from the first fan 310 can flow through the first heat sink 330 and the first air duct 340 in sequence before being discharged from the first air outlet 120a. This can accurately and quickly discharge the heat from the self-heating device 211 outside the housing 100, further enhancing the heat dissipation effect.

[0141] Referring to Figure 6, in one embodiment, the second heat dissipation assembly 400 further includes a second heat pipe 420. One end of the second heat pipe 420 is used for heat exchange with the heat-generating device of the circuit assembly 200, and the other end of the second heat pipe 420 extends to the side of the circuit assembly 200 near the second fan 410. The second heat dissipation assembly 400 and the first heat dissipation assembly 300 are located on the side of the circuit assembly 200 near the first sidewall 110.

[0142] One end of the second heat pipe 420 and one end of the first heat pipe 320 can be in thermal contact with the same heating device, or they can be in thermal contact with different heating devices. For example, one end of the second heat pipe 420 and the heat-conducting plate 321 at the end of the first heat pipe 320 can both be in contact with the same main heating device 211 for heat conduction.

[0143] Since one end of the second heat pipe 420 extends to the side of the circuit assembly 200 near the second fan 410, the second heat pipe 420 can conduct heat from the heat-generating devices on the circuit assembly 200 to the side of the second heat pipe 420 near the second fan 410. Therefore, under the air pressure of the second fan 410, the heat conducted by the second heat pipe 420 can flow with the airflow through the second fan 410 to the second air outlet 130a, and then be discharged outside the housing 100. This further accelerates the heat dissipation from the circuit assembly 200.

[0144] Referring to Figures 4 to 6, in one embodiment, the second heat dissipation assembly 400 further includes a second heat sink 430, which is located along the first direction XX' on the side of the second fan 410 near the second air outlet 130a, and the end of the second heat pipe 420 near the second fan 410 exchanges heat with the second heat sink 430.

[0145] One end of the second heat pipe 420 can be in direct contact with the second heat sink 430. Specifically, the second heat sink 430 can be mounted on the second mounting plate 820. One end of the second heat pipe 420 can also be in contact with the second mounting plate 820, thereby indirectly contacting the second heat sink 430 through the second mounting plate 820 for heat conduction.

[0146] Since the second heat sink 430 is located on the side of the second fan 410 near the second air outlet 130a along the first direction XX', the end of the second heat pipe 420 near the second fan 410 exchanges heat with the second heat sink 430. Thus, the heat from the heat-generating device conducted by the second heat pipe 420 can be quickly dissipated towards the second air outlet 130a through the second heat sink 430, and the heat can be further quickly conducted to the outside of the casing 100.

[0147] Optionally, the second radiator 430 is a finned radiator, which includes a heat dissipation base and multiple heat dissipation fins disposed on the heat dissipation base. A heat dissipation gap is formed between adjacent heat dissipation fins, extending along the first direction XX'. One end of the second heat pipe 420 is in thermal contact with the heat dissipation base. The second heat pipe 420 can transfer heat to the heat dissipation base of the second radiator 430, and then to the heat dissipation fins via the heat dissipation base. The airflow passing through the second fan 410 can carry the heat through the heat dissipation gap and be discharged outside the housing 100.

[0148] Referring to Figures 4 to 6, in one embodiment, the second heat dissipation assembly 400 further includes a second air duct 440, which is located along the first direction XX' on the side of the second fan 410 near the second air outlet 130a.

[0149] The airflow from the second fan 410 can flow through the second air duct 440 and then exit through the second air outlet 130a, thereby accurately and quickly expelling the heat from the self-heating device 211 outside the housing 100, further enhancing the heat dissipation effect.

[0150] Specifically, the second heat sink 430 can be located between the second air duct 440 and the second fan 410. The second air duct 440 is located on the side of the second heat sink 430 near the second air outlet 130a. Thus, the airflow from the second fan 410 can flow through the second heat sink 430 and the second air duct 440 in sequence before being discharged from the second air outlet 130a. This can accurately and quickly discharge the heat of the heat-generating device outside the housing 100, further enhancing the heat dissipation effect.

[0151] In other embodiments, the second heat dissipation component may also not include a second heat pipe and a second heat sink.

[0152] Referring to Figures 4 to 6, in one embodiment, the audio-visual conferencing terminal further includes a third mounting plate 840, on which the motherboard 210 is mounted. The third mounting plate 840 can be mounted on the support plate 610, thereby indirectly mounting the motherboard 210 on the support plate 610, facilitating the assembly of the motherboard 210.

[0153] One embodiment of this application provides an audio / video conferencing device, including a display device and an audio / video conferencing terminal as described in any of the above embodiments. The audio / video conferencing terminal is electrically connected to the display device.

[0154] The aforementioned audio and video conferencing equipment can not only quickly dissipate the heat generated in the heat-concentrated area of ​​the circuit component 200 to the outside of the housing 100 through the first heat dissipation component 300 and the first heat exchange air duct, thus ensuring rapid heat dissipation of the heat-concentrated area; but also, through the action of the second fan 410, airflow is generated along the second heat exchange air duct, thereby fully taking into account the heat dissipation needs of the entire area of ​​the circuit component 200 along the first direction XX', improving the distribution of the area through which the airflow flows, enhancing the heat dissipation effect, and thus allowing more heat-generating devices to be distributed in different areas along the first direction XX' on the circuit component 200.

[0155] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0156] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An audio and video conferencing terminal, characterized in that, include: The housing (100) includes a first side wall (110) and a first end wall (120) and a second end wall (130) disposed opposite to each other. The two ends of the first side wall (110) are respectively connected to the first end wall (120) and the second end wall (130). The first end wall (120) is provided with a first air outlet (120a), the second end wall (130) is provided with a second air outlet (130a), and the first side wall (110) is provided with a first air inlet (110a). A circuit assembly (200) is installed inside the housing (100), and a first air gap (201) is formed between the circuit assembly (200) and the first sidewall (110); The first heat dissipation component (300) includes a first fan (310) and a first heat pipe (320). One end of the first heat pipe (320) is provided with a heat-conducting plate (321). The heat-conducting plate (321) exchanges heat with the heat-concentrating area of ​​the circuit component (200). The first fan (310) is used to introduce external cold air into the housing (100) from the first air inlet (110a). The other end of the first heat pipe (320), the first fan (310) and the first air inlet (110a) are located on the side of the circuit component (200) close to the first end wall (120) to form a first heat exchange air duct through which airflow flows sequentially through the first air inlet (110a), the first fan (310) and the first air outlet (120a). The second heat dissipation component (400) includes a second fan (410). The second fan (410) is located on the side of the circuit component (200) near the second end wall (130). Under the action of the second fan (410), airflow is formed to flow sequentially through the first air inlet (110a), the first air gap (201), the second fan (410), and the second air outlet (130a) in a second heat exchange duct.

2. The audio and video conferencing terminal according to claim 1, characterized in that, The housing (100) further includes a second sidewall (140) disposed opposite to the first sidewall (110), the two ends of the second sidewall (140) being connected to the first endwall (120) and the second endwall (130) respectively; a second air gap (202) is provided between the circuit assembly (200) and the second sidewall (140); The second sidewall (140) is provided with a second air inlet (140a), which is located at one end of the circuit assembly (200) near the first endwall (120). Under the action of the second fan (410), a third heat exchange duct is formed in which airflow flows sequentially through the second air inlet (140a), the second air gap (202), the second fan (410), and the second air outlet (130a).

3. The audio and video conferencing terminal according to claim 2, characterized in that, The circuit assembly (200) includes a motherboard (210), multiple board assemblies (220), and a main heating element (211). The main heating element (211) is disposed on the side of the motherboard (210) near the first sidewall (110). The main heating element (211) cooperates with the heat-conducting plate (321) for heat exchange. The multiple board assemblies (220) are located on the side of the motherboard (210) opposite to the main heating element (211). The multiple board assemblies (220) are located in the third heat exchange air duct. The board assembly (220) includes a board (221) and a functional heating device (222). The board (221) is electrically connected to the motherboard (210). The functional heating device (222) is located on the side of the board (221) facing away from the motherboard (210) and is electrically connected to the board (221).

4. The audio and video conferencing terminal according to claim 3, characterized in that, It also includes a first speaker (510) and a second speaker (520), the first speaker (510) being located between the circuit assembly (200) and the first end wall (120), the first fan (310) being located between the first speaker (510) and the first side wall (110), the second speaker (520) being located between the circuit assembly (200) and the second end wall (130), and the second fan (410) being located between the second speaker (520) and the first side wall (110).

5. The audio and video conferencing terminal according to claim 4, characterized in that, It also includes a mounting structure (600) located within the housing (100), the mounting structure (600) including a support plate (610) and a plurality of side plates (620); The support plate (610) is located between the motherboard (210) and the board assembly (220), and the board assembly (220) and the motherboard (210) are respectively mounted on the support plate (610); Multiple side plates (620) are connected end to end and surround the support plate (610). The two ends of each side plate (620) are connected to the support plate (610) and the second side wall (140) respectively, so that the support plate (610), the multiple side plates (620) and the second side wall (140) form the second air passage gap (202). The side plate (620) adjacent to the second speaker (520) is defined as the first side plate (621). The first side plate (621) is spaced apart from the second speaker (520), and the first side plate (621) is provided with an air vent (601).

6. The audio and video conferencing terminal according to claim 5, characterized in that, The second sidewall (140) includes a sidewall body (141) and a cover (142), wherein the sidewall body (141) is provided with an opening (141a); The cover (142) is connected to the side wall body (141) and covers the opening (141a) so that the cover (142) and the mounting structure (600) form the second air passage gap (202), and the second air inlet (140a) is provided on the cover (142).

7. The audio and video conferencing terminal according to claim 6, characterized in that, The audio and video conferencing terminal also includes a decorative panel (700), which is connected to the housing (100). The decorative panel (700) covers the second side wall (140) and blocks the connection between the cover (142) and the side wall body (141). There is a gap between the decorative panel (700) and the second side wall (140).

8. The audio and video conferencing terminal according to claim 3, characterized in that, The audio and video conferencing terminal includes a mounting plate assembly located within the housing (100), the mounting plate assembly being located between the first sidewall (110) and the motherboard (210); The mounting plate assembly includes a first mounting plate (810), a second mounting plate (820), and a connecting plate (830), wherein the first mounting plate (810) and the second mounting plate (820) are respectively connected to both ends of the connecting plate (830); The first fan (310) is mounted on the side of the first mounting plate (810) facing away from the motherboard (210), and the second fan (410) is mounted on the side of the second mounting plate (820) facing away from the motherboard (210).

9. The audio and video conferencing terminal according to claim 3, characterized in that, The audio and video conferencing terminal also includes a camera (900), which is electrically connected to the motherboard (210). The camera (900) is located on the side of the motherboard (210) facing away from the main heat-generating device (211). The board assembly (220) is provided on both sides of the camera.

10. The audio and video conferencing terminal according to claim 3, characterized in that, The board assembly (220) also includes a heat sink (223), which is disposed on the side of the functional heat-generating device (222) facing away from the board (221).

11. The audio and video conferencing terminal according to claim 1, characterized in that, The first heat dissipation assembly (300) further includes a first radiator (330), which is located on the side of the first fan (310) near the first air outlet (120a), and the end of the first heat pipe (320) away from the heat concentration area exchanges heat with the first radiator (330).

12. The audio and video conferencing terminal according to claim 1, characterized in that, The second heat dissipation assembly (400) further includes a second heat pipe (420), one end of which is used for heat exchange with the heat-generating device of the circuit assembly (200), and the other end of which extends to the side of the circuit assembly (200) near the second fan (410).

13. The audio and video conferencing terminal according to claim 12, characterized in that, The second heat dissipation assembly (400) further includes a second heat sink (430), which is located on the side of the second fan (410) near the second air outlet (130a), and the end of the second heat pipe (420) near the second fan (410) exchanges heat with the second heat sink (430).

14. The audio and video conferencing terminal according to claim 1, characterized in that, The first heat dissipation assembly (300) further includes a first air duct (340), which is located on the side of the first fan (310) near the first air outlet (120a); and / or, The second heat dissipation assembly (400) also includes a second air duct (440), which is located on the side of the second fan (410) near the second air outlet (130a).

15. An audio-visual conferencing device, characterized in that, It includes a display device and an audio / video conferencing terminal as described in any one of claims 1-14, wherein the audio / video conferencing terminal is electrically connected to the display device.

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