Display panel, display apparatus, and manufacturing method

Abstract

A display panel (000), a display apparatus, and a manufacturing method. The display panel (000) comprises a driving backplane (001), light-emitting devices (003), a microlens layer (009), and a lens protective layer (010), wherein the microlens layer (009) is located on the side of the plurality of light-emitting devices (003) facing away from the driving backplane (001); the lens protective layer (010) is located on the side of the microlens layer (009) facing away from the driving backplane (001), the refractive index of the lens protective layer (010) is smaller than that of the microlens layer (009), and low-refractive-index particles (010a) are mixed within the lens protective layer (010); and the orthographic projection of the low-refractive-index particles (010a) on the driving backplane (001) does not overlap with a region where bonding pins (001d) are located. The low-refractive-index particles (010a) precipitated during the formation of the lens protective layer (010) are removed so as to remove the low-refractive-index particles (010a) located on the bonding pins (001d), thereby ensuring that when the microlens layer (009) and the lens protective layer (010) of the display panel (000) are formed, no low-refractive-index particles (010a) remain on the bonding pins (001d) of the display panel (000), and improving the yield of bonding between the bonding pins (001d) and a bonded chip.

Description

Display panel, display device and manufacturing method Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, display device, and manufacturing method. Background Technology

[0002] With the advancement of display panel technology, people's performance requirements for display panels are becoming increasingly diverse, such as color gamut, narrow bezels, and privacy protection. Currently, display panels with privacy protection functions are already being used in various fields such as automotive, medical, and finance. Summary of the Invention

[0003] This application provides a display panel, a display device, and a manufacturing method. The technical solution is as follows:

[0004] On the one hand, a display panel is provided, including: a driving backplane, a light-emitting device, a microlens layer, and a lens protective layer;

[0005] The drive backplane has a display area and a non-display area located around the display area, the non-display area including a bonding area; bonding pins are distributed in the bonding area;

[0006] The number of light-emitting devices is multiple, and the multiple light-emitting devices are located on one side of the driving back plate and distributed within the display area;

[0007] The microlens layer is located on the side of the plurality of light-emitting devices away from the driving backplate. The microlens layer has a plurality of microlenses, which correspond to at least a portion of the light-emitting devices. The orthographic projection of the microlens on the driving backplate at least partially overlaps with the orthographic projection of the light-emitting devices on the driving backplate.

[0008] The lens protective layer is located on the side of the microlens layer opposite to the drive backplate. The refractive index of the lens protective layer is less than that of the microlens layer, and the lens protective layer contains low-refractive-index particles.

[0009] The orthographic projection of the low-refractive particle onto the drive backplate does not coincide with the area where the bonding pin is located.

[0010] Optionally, the orthographic projection of all low-reflection particles in the display panel onto the driving backplate is located within the orthographic projection of the lens protective layer onto the driving backplate.

[0011] Optionally, the display panel further includes: an inorganic insulating layer; the inorganic insulating layer is located on the side of the lens protective layer facing the driving back plate, and the orthographic projection of the inorganic insulating layer on the driving back plate is located within the orthographic projection of the lens protective layer on the driving back plate.

[0012] Optionally, the inorganic insulating layer is distributed on the side of the microlens layer facing the drive backplate, and the side of the inorganic insulating layer away from the drive backplate is in direct contact with the side of the microlens layer facing the drive backplate.

[0013] Alternatively, the inorganic insulating layer is distributed between the microlens layer and the lens protective layer, and the side of the inorganic insulating layer facing the drive backplate is in direct contact with the side of the microlens layer away from the drive backplate, and the side of the inorganic insulating layer away from the drive backplate is in direct contact with the side of the lens protective layer facing the drive backplate; wherein, the refractive index of the inorganic insulating layer is equal to the refractive index of the microlens layer, or the refractive index of the inorganic insulating layer is equal to the refractive index of the lens protective layer.

[0014] Optionally, the display panel further includes: a touch layer; the touch layer is located on the side of the inorganic insulating layer facing the driving back plate, and the touch layer includes: a first metal touch layer, a touch insulating layer and a second metal touch layer stacked in a direction away from the driving back plate;

[0015] The orthographic projection of the touch insulating layer on the drive back plate is located within the orthographic projection of the lens protective layer on the drive back plate.

[0016] Optionally, the display panel further includes: an organic cover layer; the organic cover layer is located on the side of the microlens layer facing the driving backplate; the portion of the organic cover layer not covered by the lens protection layer is the organic portion, and the portion of the organic cover layer covered by the lens protection layer is the covered portion;

[0017] The thickness of the organic portion is less than the thickness of the portion of the covering portion covered by the microlens layer.

[0018] Optionally, the display panel further includes: an organic cover layer; the organic cover layer is located on the side of the microlens layer facing the driving backplate; the portion of the organic cover layer not covered by the lens protection layer is the organic portion, and the portion of the organic cover layer covered by the lens protection layer is the covered portion;

[0019] The thickness of the portion of the covered part covered by the microlens layer is greater than the thickness of the portion of the covered part not covered by the microlens layer.

[0020] Optionally, the covering portion has a first groove on the side opposite to the drive back plate, and the orthographic projection of the first groove on the drive back plate does not coincide with the orthographic projection of the microlens layer on the drive back plate.

[0021] Optionally, the display panel further includes: a touch layer; the touch layer is located on the side of the organic cover layer facing the driving backplate;

[0022] The side of the touch layer facing away from the driving backplate is in direct contact with the side of the organic cover layer facing the driving backplate, and the side of the organic cover layer facing the driving backplate is in direct contact with the side of the microlens layer facing the driving backplate.

[0023] Optionally, the display panel further includes: an encapsulation layer, a light-shielding layer, and a first organic planarization layer;

[0024] The encapsulation layer is located on the side of the plurality of light-emitting devices opposite to the driving backplate; the light-shielding layer is located on the side of the encapsulation layer opposite to the driving backplate; the first organic planarization layer is located on the side of the light-shielding layer opposite to the driving backplate; and the touch layer is located on the side of the first organic planarization layer opposite to the driving backplate.

[0025] Optionally, the display panel further includes: a light-shielding layer; the light-shielding layer is located on the side of the microlens layer facing the driving back plate, and the side of the light-shielding layer away from the driving back plate is in direct contact with the side of the microlens layer facing the driving back plate;

[0026] The light-shielding layer has a second groove on the side opposite to the drive back plate, and the orthographic projection of the second groove on the drive back plate does not coincide with the orthographic projection of the microlens layer on the drive back plate.

[0027] Optionally, the thickness of the portion of the second organic planarization layer of the drive backplate not covered by the lens protection layer is less than the thickness of the portion of the second organic planarization layer covered by the microlens layer.

[0028] Optionally, the display panel further includes: an encapsulation layer, a touch layer, and a protective cover layer;

[0029] The encapsulation layer is located on the side of the plurality of light-emitting devices opposite to the driving backplate; the light-shielding layer is located on the side of the encapsulation layer opposite to the driving backplate; the touch layer is located on the side of the lens protection layer opposite to the driving backplate; and the cover protection layer is located on the side of the touch layer opposite to the driving backplate.

[0030] Optionally, the display panel further includes: a touch layer; the touch layer is located on the side of the lens protection layer facing the driving back plate, and the touch layer is located on the side of the microlens layer away from the driving back plate; the touch layer includes: a first metal touch layer, a touch insulating layer and a second metal touch layer stacked in a direction away from the driving back plate;

[0031] The side of the touch insulating layer facing the driving back plate is in direct contact with the side of the microlens layer facing away from the driving back plate, and the side of the touch insulating layer facing away from the driving back plate is in direct contact with the side of the lens protective layer facing the driving back plate; the refractive index of the touch insulating layer is equal to the refractive index of the microlens layer, or the refractive index of the touch insulating layer is equal to the refractive index of the lens protective layer.

[0032] The orthographic projection of the touch insulating layer on the drive back plate is located within the orthographic projection of the lens protective layer on the drive back plate.

[0033] Alternatively, a portion of the touch insulating layer in its orthographic projection onto the drive back panel is located within the orthographic projection of the lens protective layer onto the drive back panel, while another portion is located outside the lens protective layer; and the thickness of the portion of the touch insulating layer not covered by the second metal touch layer is less than or equal to the thickness of the portion of the touch insulating layer covered by the second metal touch layer.

[0034] Optionally, the display panel has multiple sub-pixel areas; the multiple light-emitting devices include: multiple privacy light-emitting devices and multiple shared light-emitting devices; at least one shared light-emitting device and multiple privacy light-emitting devices are distributed within the same sub-pixel area;

[0035] The driving backplane includes: a substrate, and a plurality of shared pixel driving circuits and a plurality of privacy pixel driving circuits located on one side of the substrate;

[0036] In this configuration, at least one shared light-emitting device within the same sub-pixel region is electrically connected to the same shared pixel driving circuit; and multiple privacy-protecting light-emitting devices within the same sub-pixel region are electrically connected to the same privacy-protecting pixel driving circuit.

[0037] On the other hand, a display device is provided, including: a driver chip, and a display panel bonded to the driver chip, wherein the display panel is any of the display panels described above.

[0038] On the other hand, a method for manufacturing a display panel is provided, the method comprising:

[0039] A driving backplane is provided; the driving backplane has a display area and a non-display area located around the display area, the non-display area including a bonding area; bonding pins are distributed in the bonding area;

[0040] Multiple light-emitting devices are formed on one side of the driving backplate, and the multiple light-emitting devices are located within the display area;

[0041] A patterned microlens layer and a patterned lens protection layer are formed on the side of the plurality of light-emitting devices away from the driving backplate, and low-refractive particles precipitated during the formation of the lens protection layer are removed to remove low-refractive particles located on the bonding pins.

[0042] The lens protective layer is located on the side of the microlens layer opposite to the drive backplate. The refractive index of the microlens layer is greater than that of the lens protective layer, and the lens protective layer contains low-refractive-index particles.

[0043] Optionally, the low-refractive-index particles precipitated during the formation of the lens protective layer are removed, including:

[0044] Before forming the lens protective layer and after forming the microlens layer, the display panel with the microlens layer formed is modified, and the patterned lens protective layer is cleaned to remove low-refractive particles in areas of the display panel not covered by the lens protective layer.

[0045] Optionally, after the patterned lens protective layer is formed, the portion of the display panel that is not covered by the lens protective layer and is exposed is an organic portion, and the precipitated low-refractive particles are distributed on the organic portion;

[0046] The display panel on which the microlens layer is formed is modified, and the patterned lens protective layer is cleaned, including:

[0047] At least the surface of the organic portion is modified to make the surface of the organic portion hydrophilic;

[0048] After the patterned lens protective layer is formed, the display panel on which the lens protective layer is formed is cleaned.

[0049] Optionally, the manufacturing method further includes:

[0050] Before forming the microlens layer, a patterned organic capping layer is formed; wherein, the side of the organic capping layer away from the drive backplate is in direct contact with the side of the microlens layer facing the drive backplate; the organic portion is the part of the organic capping layer not covered by the lens protection layer, and the part of the organic capping layer covered by the lens protection layer is the capping portion;

[0051] At least the surface of the organic portion is modified, including:

[0052] After the microlens layer is formed, the display panel on which the microlens layer is formed is subjected to plasma bombardment treatment to modify the surface of the organic portion in the organic cover layer.

[0053] Wherein, the thickness of the surface-modified organic portion is less than the thickness of the portion of the covering portion covered by the microlens layer;

[0054] or,

[0055] The manufacturing method further includes:

[0056] Before forming the microlens layer, a patterned light-shielding layer is formed; wherein the side of the light-shielding layer away from the drive backplate is in direct contact with the side of the microlens layer facing the drive backplate; the organic portion is the portion of the second organic planarization layer of the drive backplate that is not covered by the lens protection layer.

[0057] At least the surface of the organic portion is modified, including:

[0058] After the microlens layer is formed, the display panel on which the microlens layer is formed is subjected to plasma bombardment treatment to modify the surface of the organic portion in the second organic planarization layer.

[0059] The thickness of the surface-modified organic portion is less than the thickness of the portion of the second organic planarization layer covered by the microlens layer. Attached Figure Description

[0060] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0061] Figure 1 is a schematic diagram of the structure of the display panel provided in an embodiment of this application;

[0062] Figure 2 is a schematic diagram of the first type of film structure of the display panel shown in Figure 1 at A-A';

[0063] Figure 3 is a schematic diagram of the first film structure at B-B' of the display panel shown in Figure 1 after the lens protective layer patterning process is completed;

[0064] Figure 4 is a schematic diagram of the first type of film structure of the display panel at B-B' shown in Figure 1;

[0065] Figure 5 is a flowchart illustrating the manufacturing method of the display panel provided in an embodiment of this application;

[0066] Figure 6 is a schematic diagram of the second type of film layer structure of the display panel shown in Figure 1 at point A-A';

[0067] Figure 7 is a schematic diagram of the third type of film layer structure of the display panel at A-A' shown in Figure 1;

[0068] Figure 8 is a schematic diagram of the third film layer structure at B-B' of the display panel shown in Figure 1 after the lens protective layer patterning process is completed;

[0069] Figure 9 is a schematic diagram of the third film layer structure of the display panel at B-B' shown in Figure 1;

[0070] Figure 10 is a schematic diagram of the fourth type of film layer structure of the display panel at A-A' shown in Figure 1;

[0071] Figure 11 is a schematic diagram of the fourth film structure at B-B' of the display panel shown in Figure 1 after the lens protective layer patterning process is completed;

[0072] Figure 12 is a schematic diagram of the fourth film layer structure of the display panel at B-B' shown in Figure 1;

[0073] Figure 13 is a schematic diagram of the fifth film layer structure of the display panel at A-A' shown in Figure 1;

[0074] Figure 14 is a schematic diagram of the fifth film layer structure at B-B' of the display panel shown in Figure 1 after the lens protective layer patterning process is completed;

[0075] Figure 15 is a schematic diagram of the fifth film layer structure of the display panel at B-B' shown in Figure 1;

[0076] Figure 16 is a schematic diagram of the sixth film layer structure of the display panel at A-A' shown in Figure 1;

[0077] Figure 17 is a schematic diagram of the sixth film layer structure at B-B' of the display panel shown in Figure 1 after the lens protective layer patterning process is completed;

[0078] Figure 18 is a schematic diagram of the sixth film layer structure of the display panel at B-B' shown in Figure 1;

[0079] Figure 19 is a schematic diagram of the seventh film layer structure at B-B' of the display panel shown in Figure 1 after the lens protective layer patterning process is completed;

[0080] Figure 20 is a schematic diagram of the seventh film layer structure of the display panel at B-B' shown in Figure 1;

[0081] Figure 21 is a schematic diagram of the seventh film layer structure of the display panel at A-A' shown in Figure 1;

[0082] Figure 22 is a schematic diagram of a display panel in the binding area;

[0083] Figure 23 is a schematic diagram of the display panel in the binding area provided in the embodiment of this application. Detailed Implementation

[0084] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0085] As display panels develop and are applied, an increasing number of scenarios require privacy features. For example, in the automotive industry, in-vehicle displays can cause reflections on the windshield at night, posing a safety hazard. Therefore, in-vehicle displays need to achieve a reflection-free effect and narrow vertical viewing angles. Similarly, for displays used in passenger entertainment systems, a narrow viewing angle is also necessary to avoid interfering with the driver's experience. Furthermore, privacy features are required in scenarios involving personal information, such as bank counters and medical equipment.

[0086] This type of display panel with privacy protection has a smaller aperture ratio. The reduced aperture ratio means that the display panel needs a higher driving current to maintain the same brightness level. This increases the power consumption and heat generation of the display panel, thereby accelerating the aging of the device and shortening its lifespan.

[0087] Currently, display panels with privacy protection features can improve light output efficiency by setting up microlens structures to control the direction of light propagation. These microlens structures typically include a high-refractive-index microlens layer and a low-refractive-index lens protective layer.

[0088] For the microlens layer and lens protective layer, to ensure the light extraction efficiency of the light-emitting device, the difference in refractive index between the microlens layer and the lens protective layer needs to meet certain requirements, such as a difference greater than or equal to 0.1. Since the side of the microlens facing away from the driving back needs to be convex, for example, the microlens may be hemispherical, semi-cylindrical, etc., and the cross-section generally needs to be hemispherical, spherical, or rectangular, the microlens layer needs to be patterned to form multiple microlenses. Currently, for microlens layers and lens protective layers formed from organic materials, the refractive index of the lens protective layer is reduced by doping it with low-refractive-index particles.

[0089] However, during the patterning process of the lens protective layer doped with low-refractive-index particles, these particles easily precipitate and adhere to the areas of the display panel not covered by the lens protective layer. These uncovered areas contain bonding pins, which also become covered by these particles. Consequently, when the driver chip is subsequently bonded to the bonding area of ​​the display panel, this affects the electrical connection between the bonding pins and the pins in the driver chip, resulting in a low yield rate for the bonding connection between the display panel's bonding area and the driver chip.

[0090] This application provides a display panel. Please refer to Figures 1 to 4. Figure 1 is a structural schematic diagram of the display panel provided in this application embodiment. Figure 2 is a schematic diagram of the first film layer structure of the display panel at A-A' shown in Figure 1. Figure 3 is a schematic diagram of the first film layer structure of the display panel at B-B' after the lens protection layer patterning process is completed. Figure 4 is a schematic diagram of the first film layer structure of the display panel at B-B' shown in Figure 1. Figures 3 and 4 correspond to Figure 2. As shown in Figure 1, the display panel 000 has a display area 000a and a non-display area located around the display area 000a. The non-display area includes a bonding area 000b. The display panel 000 may include: a driving backplate 001, a light-emitting device 003, a microlens layer 009, and a lens protection layer 010.

[0091] The driver backplane 001 may also have a display area and a non-display area located around the display area. The non-display area may include a bonding area; bonding pins 001d are distributed in the bonding area.

[0092] For example, the driving backplane 001 may include: a substrate 001a, a driving circuit layer 001b located on one side of the substrate 001a and a bonding pin 001d, and a second organic planarization layer 001c located on the side of the driving circuit layer 001b and the bonding pin 001d away from the substrate 001a, wherein the driving circuit layer 001b is located in the display area 000a and the bonding pin 001d is located in the bonding area 000b.

[0093] The number of light-emitting devices 003 can be multiple, and these multiple light-emitting devices 003 are located on one side of the driving backplate 001 and distributed within the display area 000a. Here, the light-emitting devices 003 may include multiple shared light-emitting devices and multiple privacy light-emitting devices. In some embodiments, only privacy light-emitting devices may be included, without shared light-emitting devices.

[0094] At least some of the light-emitting devices 003 may have microlenses on the side facing away from the driving backplate 001. For example, some light-emitting devices 003 may have microlenses on the side facing away from the driving backplate 001, while others may not have microlenses on the side facing away from the driving backplate 001. For example, a microlens may be provided at the location corresponding to the privacy light-emitting device, while a microlens may not be provided at the location corresponding to the shared light-emitting device. Of course, all light-emitting devices 003 may have microlenses on the side facing away from the driving backplate 001. For example, microlenses may be provided at the locations corresponding to the privacy pixel and the shared pixel. In privacy mode, only the privacy light-emitting device is turned on to achieve the privacy function; in sharing mode, only the shared light-emitting device is turned on, or both the privacy light-emitting device and the shared light-emitting device are turned on to achieve the sharing function. Here, the light-emitting device 003 may include an anode 003a, a light-emitting layer 003b, and a cathode (not shown in the figure). The anode 003a is electrically connected to the driving circuit layer 001b of the driving backplate 001.

[0095] A microlens layer 009 is located on the side of the plurality of light-emitting devices 003 facing away from the driving backplate 001. The microlens layer 009 has a plurality of microlenses, which correspond to at least a portion of the light-emitting devices 003. The orthographic projection of the microlens on the driving backplate 001 at least partially overlaps with the orthographic projection of the light-emitting device 003 on the driving backplate 001. For example, the orthographic projection of the microlens on the driving backplate 001 covers the orthographic projection of the light-emitting device 003 on the driving backplate 001.

[0096] The lens protection layer 010 is located on the side of the microlens layer 009 away from the drive backplate 001. The refractive index of the lens protection layer 010 is less than that of the microlens layer 009, and the lens protection layer 010 contains low-refractive-index particles 010a.

[0097] In this case, the orthographic projection of the low-refractive particles 010a on the driving backplate 001 does not coincide with the area where the bonding pin 001d is located. For example, the orthographic projections of all the low-refractive particles 010a in the display panel 000 on the driving backplate 001 are located within the orthographic projection of the lens protective layer 010 on the driving backplate 001. That is to say, the precipitated low-refractive particles 010a are completely removed, and only the low-refractive particles 010a within the lens protective layer 010 are retained.

[0098] In some possible implementations, the display panel 000 may further include: a pixel definition layer 002, which is located on one side of the pixel driving circuit layer 001b, and the pixel definition layer 002 has a plurality of pixel openings; the orthographic projection of the light-emitting device 003 on the substrate 001a overlaps with the orthographic projection of the corresponding pixel opening on the substrate 001a.

[0099] Referring to Figure 3, in this embodiment, low-refractive-index particles such as hollow silicon oxide are used to reduce the refractive index of the lens protective layer 010. During the patterning or development process of the lens protective layer 010, the low-refractive-index particles 010a are precipitated from the portion of the lens protective layer 010 that has been patterned away. These precipitated low-refractive-index particles 010a then adhere to the bonding pins 001d and the area near the bonding openings corresponding to the bonding pins 001d. In existing display panel manufacturing processes, the lens protective layer 010 is cleaned during the development process of the display panel 000. However, the low-refractive-index particles 010a themselves, or the material of the lens protective layer 010 adhered to the surface of the low-refractive-index particles 010a, adhere to the film layer on the side of the bonding pins 001d facing away from the substrate 001a, such as on the groove wall of the aforementioned bonding opening. Thus, the low-refractive-index particles 010a also fall back onto the bonding pins 001d during the cleaning process. Therefore, the cleaning process in the current development process cannot effectively remove the low-refractive-index particles 010a precipitated from the lens protective layer 010. Here, the low-bend particles 010a remaining on the bonding pin 001d will affect the bonding yield between the bonding pin 001d and the driver chip.

[0100] It is evident that the above problems are difficult to solve in existing manufacturing processes. Therefore, this application also provides a method for manufacturing a display panel.

[0101] The manufacturing method provided in the embodiments of this application will be described below. Please refer to Figure 5, which is a schematic flowchart of the manufacturing method of the display panel provided in the embodiments of this application. The manufacturing method may include:

[0102] Step S001: Provide a driving backplane; the driving backplane has a display area and a non-display area located around the display area, the non-display area may include a bonding area; bonding pins are distributed in the bonding area.

[0103] Step S002: Multiple light-emitting devices are formed on one side of the driving backplate, and the multiple light-emitting devices are located in the display area.

[0104] Step S003: A patterned microlens layer and a patterned lens protection layer are formed on the side of the multiple light-emitting devices away from the driving backplate, and the low-refractive particles precipitated during the formation of the lens protection layer are removed to remove the low-refractive particles located on the bonding pins.

[0105] The lens protection layer 010 is located on the side of the microlens layer 009 away from the drive backplate 001. The refractive index of the microlens layer 009 is greater than that of the lens protection layer 010, and the lens protection layer 010 contains low-refractive-index particles 010a.

[0106] In the above manufacturing method, the low-refractive-index particles 010a precipitated during the formation of the lens protective layer 010 are removed. Thus, as shown in FIG4, in the display panel 000 provided in this application embodiment, the low-refractive-index particles 010a in the area where the bonding pin 001d is located are removed. Therefore, the display panel 000 provided in this application embodiment can guarantee the bonding yield between the bonding pin 001d and the driver chip.

[0107] Depending on the specific structure of the display panel, the manufacturing method provided in this application embodiment also has different process steps, which will be described in detail below.

[0108] In some possible implementations, the removal of low-refractive-index particles precipitated during the formation of the lens protective layer in step 003 above may include:

[0109] Step S101: Use the patterned lens protective layer as a mask and etch the display panel on which the lens protective layer is formed to remove low-refractive particles in the area of ​​the display panel not covered by the lens protective layer.

[0110] As shown in Figures 3 and 4, a dry etching method can be used. The patterned lens protective layer 010 is used as a mask to etch the display panel 000 on which the lens protective layer 010 is formed. This removes the low-refractive index particles 010a. However, the patterned lens protective layer 010, acting as a mask, is also thinned. Therefore, the thickness of the lens protective layer 010 needs to be increased during the formation process. Using the patterned lens protective layer 010 as a mask and etching to remove the low-refractive index particles 010a on the bonding pins 001d eliminates the need for photoresist, saving the cost of one photolithography step. For example, dry etching is simple to operate; only the etching time and power parameters need to be controlled to completely remove the low-refractive index particles 010a.

[0111] For example, within the bonding area 000b, other film layers may be disposed between the second organic planarization layer 001c and the lens protection layer 010, such as an organic capping layer (e.g., the first organic planarization layer 006, the capping protection layer 008a), a touch insulating layer 007b, and an inorganic insulating layer 008. In step S101 above, during the removal of the low-refractive particles 010a, these other film layers may also be thinned or removed. Thus, compared to the bonding area 000b shown in FIG3, in FIG4, the bonding area 000b of the display panel 000 provided in this application embodiment, in addition to the removal of the low-refractive particles 010a, also has the aforementioned film layers removed or thinned.

[0112] Among some possible implementation methods, please refer to Figures 2 and 6. Figure 6 is a schematic diagram of the second film layer structure of the display panel shown in Figure 1 along A-A'. The display panel 000 may also include: an inorganic insulating layer 008; the inorganic insulating layer 008 is located on the side of the lens protection layer 010 facing the driving back plate 001, and the orthographic projection of the inorganic insulating layer 008 on the driving back plate 001 is located within the orthographic projection of the lens protection layer 010 on the driving back plate 001.

[0113] The display panel 000 shown in Figures 2 and 6 above, and the schematic diagrams of the film structure before and after the removal process at point B-B' in Figure 1, can be found in Figures 3 and 4.

[0114] For example, referring to Figure 2, the inorganic insulating layer 008 is distributed on the side of the microlens layer 009 facing the drive back plate 001, and the side of the inorganic insulating layer 008 away from the drive back plate 001 is in direct contact with the side of the microlens layer 009 facing the drive back plate 001.

[0115] As another example, referring to Figure 6, the inorganic insulating layer 008 can be distributed between the microlens layer 009 and the lens protection layer 010. The side of the inorganic insulating layer 008 facing the driving backplate 001 directly contacts the side of the microlens layer 009 facing away from the driving backplate 001, and the side of the inorganic insulating layer 008 facing away from the driving backplate 001 directly contacts the side of the lens protection layer 010 facing the driving backplate 001. For example, the refractive index of the inorganic insulating layer 008 is equal to the refractive index of the microlens layer 009, or the refractive index of the inorganic insulating layer 008 is equal to the refractive index of the lens protection layer 010. Since the inorganic insulating layer 008 is distributed between the microlens layer 009 and the lens protection layer 010, in order to ensure the optical function of the microlens layer 009 and the lens protection layer 010, the refractive index of the inorganic insulating layer 008 should also be the same as one of them. In this way, the inorganic insulating layer 008 will not affect the performance of the display panel 000.

[0116] In some possible implementations, corresponding to the display panels shown in Figures 2 and 6, the manufacturing method provided in this application embodiment may further include:

[0117] Step S100: Before forming the patterned lens protective layer, an inorganic material thin film is formed in a continuous layer; wherein, after forming the patterned lens protective layer, the precipitated low-refractive-index particles are distributed on the portion of the inorganic material thin film not covered by the lens protective layer.

[0118] In step S101 above, using the patterned lens protective layer as a mask and etching the display panel on which the lens protective layer is formed, may include:

[0119] Step S101a: Using the patterned lens protective layer as a mask, etch the portion of the inorganic material thin film not covered by the lens protective layer to remove the portion of the inorganic material thin film not covered by the lens protective layer and the precipitated low-refractive particles, and obtain the patterned inorganic insulating layer.

[0120] The orthographic projection of the inorganic insulating layer onto the drive backplane is located within the orthographic projection of the lens protective layer onto the drive backplane.

[0121] Since the inorganic insulating layer 008 is located on the side of the lens protective layer 010 facing the driving backplate 001, as shown in FIG. 3, within the bonding area 000b, the inorganic insulating layer 008 is located on the side of the lens protective layer 010 facing the driving backplate 001. After the patterned lens protective layer 010 is formed, the precipitated low-refractive-index particles 010a are distributed on the side of the inorganic insulating layer 008 away from the substrate 001a. Thus, in the process of forming the inorganic insulating layer 008, it is not necessary to use a mask to pattern the inorganic insulating layer 008, nor is it necessary to perform windowing processing on the inorganic insulating layer 008 in the bonding area 000b. In step S101, the inorganic insulating layer 008 located on the side of the bonding pin 001d away from the substrate 001a can be removed together with the low-refractive-index particles 010a, while the bonding pin 001d is exposed.

[0122] In some possible implementations, referring to Figures 2 to 4 and Figure 6, the microlens layer 009 in the display panel has an inorganic material layer (specifically, an inorganic insulating layer 008) on the side facing the substrate 001a. Based on this, the display panel 000 may further include a touch layer 007. The touch layer 007 is located on the side of the inorganic insulating layer 008 facing the driving backplate 001, and the touch layer 007 may include a first metal touch layer 007a, a touch insulating layer 007b, and a second metal touch layer 007c stacked in a direction away from the driving backplate 001. The side of the inorganic material layer facing the driving backplate 001 can directly contact the side of the second metal touch layer 007c away from the driving backplate 001. Thus, the inorganic material layer can serve as a protective layer for the touch layer 007.

[0123] The orthographic projection of the touch insulating layer 007b on the drive backplate 001 is located within the orthographic projection of the lens protective layer 010 on the drive backplate 001.

[0124] In this embodiment, the display panel 000 may have a touch layer 007, and the touch insulating layer 007b of the touch layer 007 needs to be patterned. When the touch insulating layer 007b can also be distributed in the bonding area 000b, on the side of the bonding pin 001d facing away from the substrate 001a, the touch insulating layer 007b does not completely cover the bonding pin 001d, and patterning is performed corresponding to the bonding opening. As shown in Figures 3 and 4, when the touch insulating layer 007b uses an inorganic material layer, such as a silicon nitride layer, in step S101 above, depending on the degree of etching, the touch insulating layer 007b in the bonding area 000b can be simultaneously removed or thinned during the removal of low-refractive particles 010a, or it can be retained. The retention or removal of the touch insulating layer 007b in the bonding area 000b can be controlled according to the removal of low-refractive particles. To completely remove residual low-refractive particles, over-etching can be performed until the organic material layer is reached.

[0125] The current solution using an organic insulating layer as the touch protection layer requires patterning the organic insulating layer using a photomask. Corresponding to the display panel 000 shown in Figures 2 and 6, the inorganic insulating layer 008 can serve as the protective layer for the touch layer 007. This eliminates the need for patterning the inorganic insulating layer 008 in the bonding area 000b using a photomask, saving one photolithography step (i.e., saving the cost of one photomask).

[0126] As shown in Figure 2, the touch layer 007 is located on the side of the microlens layer 009 facing the driving backplate 001, and the microlens layer 009 is located on the side of the second touch electrode layer 007c facing away from the driving backplate 001. As shown in Figure 6, the first touch electrode layer 007a and the touch insulating layer 007b of the touch layer 007 are located on the side of the microlens layer 009 facing the driving backplate 001, and the second touch electrode layer 007c is located on the side of the touch insulating layer 007b facing away from the driving backplate 001, which is not covered by the microlens layer 009. That is to say, the second touch electrode layer 007c can be formed after the microlens layer 009.

[0127] The above embodiments describe a case where an inorganic material layer is provided on a layer of the display panel facing the driving backplate in which the lens protection layer or microlens layer is disposed, and the display panel and manufacturing method are described.

[0128] The following description pertains to the case where an organic material layer is disposed on a layer facing the driving backplane of the lens protection layer or microlens layer. The organic material layer may also be distributed within the bonding region, and at least a portion of the organic material layer has its orthogonal projection onto the substrate located within the region where the bonding pins are situated. The organic material layer may be an organic capping layer (such as an organic touch layer protection layer, an organic protective layer), or a second organic planarization layer, as described in the following embodiments.

[0129] In some possible implementations, the removal of low-refractive-index particles precipitated during the formation of the lens protective layer in step S003 above may include:

[0130] Step S102: Before forming the lens protective layer and after forming the microlens layer, the display panel with the microlens layer is modified, and the patterned lens protective layer is cleaned to remove low-refractive particles in areas of the display panel not covered by the lens protective layer.

[0131] In this embodiment, before forming the lens protection layer 010 and after forming the microlens layer 009, the display panel 000 with the microlens layer 009 is modified. This modifies the surface of the exposed film layer within the bonding area 000b. After the film layer surface is modified, low-refractive-index particles 010a are less likely to adhere. Therefore, during the cleaning process of the patterned lens protection layer 010, low-refractive-index particles 010a in areas of the display panel 000 not covered by the lens protection layer 010 can be removed.

[0132] In some possible implementations, after the patterned lens protective layer is formed, the portion of the display panel that is not covered by the lens protective layer and is exposed is the organic portion, and the precipitated low-refractive particles 010a are distributed on the organic portion.

[0133] In step S102, the display panel with the microlens layer is modified, and the patterned lens protective layer is cleaned. This may include:

[0134] Step S102a: At least the surface of the organic part is modified to make the surface of the organic part hydrophilic.

[0135] Step S102b: After forming the patterned lens protective layer, the display panel with the lens protective layer formed is cleaned.

[0136] For example, the organic material layer is generally a hydrophobic material, which easily attracts low-refractive-index particles 010a. This is because the low-refractive-index particles 010a used to mix in the lens protective layer 010 need to be fully mixed with the material of the lens protective layer 010. Therefore, the low-refractive-index particles 010a are more likely to adhere to the organic film layer. Here, in this embodiment, the organic parts of the display panel 000 exposed outside the lens protective layer 010 are modified, for example, by bombarding the surface of the organic film layer with plasma gas (such as oxygen), causing oxygen ions to accumulate on the surface and the surface to change to hydrophilicity. In this embodiment, the modification of the organic parts of the display panel 000 exposed outside the lens protective layer 010 by plasma gas bombardment can be performed using dry etching equipment, without increasing the photolithography process and eliminating the need for additional mask costs.

[0137] In the display panel 000, there can be a variety of organic film layers, which will be illustrated with examples below.

[0138] Among some possible implementation methods, please refer to Figures 7 to 12. Figure 7 is a schematic diagram of the third film layer structure of the display panel at A-A' shown in Figure 1; Figure 8 is a schematic diagram of the third film layer structure of the display panel at B-B' after the lens protection layer patterning process is completed in Figure 1; Figure 9 is a schematic diagram of the third film layer structure of the display panel at B-B' shown in Figure 1; Figure 10 is a schematic diagram of the fourth film layer structure of the display panel at A-A' shown in Figure 1; Figure 11 is a schematic diagram of the fourth film layer structure of the display panel at B-B' after the lens protection layer patterning process is completed in Figure 1; and Figure 12 is a schematic diagram of the fourth film layer structure of the display panel at B-B' shown in Figure 1. Figures 8 and 9 correspond to Figure 7; Figures 11 and 12 correspond to Figure 10.

[0139] The display panel 000 may further include: an organic cover layer; the organic cover layer is located on the side of the microlens layer 009 facing the driving backplate 001; the portion of the organic cover layer not covered by the lens protection layer 010 is the organic portion P1, and the portion of the organic cover layer covered by the lens protection layer 010 is the covered portion P2. In this embodiment, the covering of the organic cover layer by the lens protection layer 010 does not limit whether the organic cover layer and the lens protection layer 010 are in direct contact. If the orthographic projection of the organic cover layer on the driving backplate 001 overlaps with the orthographic projection of the lens protection layer 010 on the driving backplate 001, then it can be considered that the organic cover layer has a portion covered by the lens protection layer 010.

[0140] The thickness of the organic portion P1 is less than the thickness of the portion of the covering portion P2 covered by the microlens layer 009. In other words, within the bonding region 000b, the portion of the organic covering layer not covered by the lens protection layer 010 is the organic portion P1. During the modification process using plasma gas, both the organic portion P1 and the portion of the covering portion P2 not covered by the microlens layer 009 will be thinned to some extent; therefore, the thickness of the organic portion P1 is less than the thickness of the portion of the covering portion P2 covered by the microlens layer 009.

[0141] For example, in Figures 8 and 9, the organic overlay can be a protective layer for the touch layer 007, namely, the protective overlay layer 008a; or, in Figures 11 and 12, the organic overlay can be a first organic planarization layer 006 that protects the light-shielding layer 005. Generally, the organic overlay also needs to be patterned; therefore, the organic overlay does not completely cover the bonding pins 001d within the bonding area 000b.

[0142] Among some possible implementation methods, the manufacturing method may also include:

[0143] Step S1021: Before forming the microlens layer, a patterned organic capping layer is formed; wherein, the side of the organic capping layer away from the driving backplate is in direct contact with the side of the microlens layer facing the driving backplate; the organic part is the part of the organic capping layer that is not covered by the lens protection layer, and the part of the organic capping layer that is covered by the lens protection layer is the capping part.

[0144] In step S102a, at least the surface of the organic portion is modified, which may include:

[0145] Step S201: After forming the microlens layer, the display panel with the microlens layer formed is subjected to plasma bombardment treatment to modify the surface of the organic portion in the organic coating layer.

[0146] The thickness of the surface-modified organic portion P1 is less than the thickness of the portion covered by the microlens layer in the covering portion P2.

[0147] In some possible implementations, referring to FIG7, the thickness of the portion of the covered portion P2 covered by the microlens layer 009 is greater than the thickness of the portion of the covered portion P2 not covered by the microlens layer 009. For example, in FIG7, within the display, the organic cover layer can be located on the side of the microlens layer 009 facing the drive backplate 001 and in direct contact. In the embodiments of this application, since the microlens layer 009 is patterned, there are intervals between the multiple microlenses. Therefore, when the organic portion P1 is modified, the portion of the organic cover layer exposed in the covered portion P2 within the display area 000a is also modified, that is, its thickness is also reduced.

[0148] For example, within the display area 000a, the covering portion P2 has a first groove U1 on the side facing away from the driving backplate 001. The orthographic projection of the first groove U1 onto the driving backplate 001 does not coincide with the orthographic projection of the microlens layer 009 onto the driving backplate 001. A portion of the lens protection layer 010 on the side facing the driving backplate 001 is located within the first groove U1. The thickness of the first groove U1, formed through a modification process, is typically 0-5000 angstroms.

[0149] As shown in Figure 7, the display panel 000 may further include a touch layer 007; the touch layer 007 is located on the side of the organic cover layer facing the driving back panel 001. The organic cover layer corresponds to the protective cover layer 008a.

[0150] Among them, the side of the touch layer 007 facing away from the driving backplate 001 is in direct contact with the side of the organic cover layer facing the driving backplate 001, and the side of the organic cover layer facing the driving backplate 001 is in direct contact with the side of the microlens layer 009 facing the driving backplate 001.

[0151] In some possible implementations, please refer to Figures 2, 6 and 7. In the above embodiments, the touch layer 007 in the display panel is located on the side of the microlens layer 010 facing the substrate 001a. In addition, the display panel 000 also includes an encapsulation layer 004, a light-shielding layer 005 and a first organic planarization layer 006.

[0152] The encapsulation layer 004 is located on the side of the plurality of light-emitting devices 003 away from the driving backplate 001; the light-shielding layer 005 is located on the side of the encapsulation layer 004 away from the driving backplate 001; the first organic planarization layer 006 is located on the side of the light-shielding layer 005 away from the driving backplate 001; and the touch layer 007 is located on the side of the first organic planarization layer 006 away from the driving backplate 001.

[0153] In these embodiments, the light-shielding layer 005 can be an organic light-shielding layer, a metal light-shielding layer, or a film layer with light-shielding capability reused from the touch layer 007. The specific material of the light-shielding layer 005 is not limited in the above embodiments.

[0154] In some possible implementations, referring to Figure 10, the display panel 000 may further include a touch layer 007. The touch layer 007 is located on the side of the lens protection layer 010 facing away from the drive backplate 001. The organic overlay layer corresponds to the first organic planarization layer 006.

[0155] Among them, the side of the touch layer 007 facing the drive back plate 001 is in direct contact with the side of the lens protection layer 010 away from the drive back plate 001; and the side of the microlens layer 009 facing the drive back plate 001 is in direct contact with the side of the organic cover layer away from the drive back plate 001.

[0156] For example, referring to FIG10, the display panel 000 may further include: an encapsulation layer 004, a light-shielding layer 005, and a protective cover layer 008a.

[0157] The encapsulation layer 004 is located on the side of the multiple light-emitting devices 003 that is away from the driving backplate 001; the light-shielding layer 005 is located on the side of the encapsulation layer 004 that is away from the driving backplate 001; the organic cover layer 006 is located on the side of the light-shielding layer 005 that is away from the driving backplate 001, and the light-shielding layer 005 is in direct contact with the organic cover layer; the cover protection layer 008a is located on the side of the touch layer 007 that is away from the driving backplate 001.

[0158] In these embodiments, the light-shielding layer 005 can be an organic light-shielding layer or a metallic light-shielding layer. It can also be a film layer with light-shielding capabilities reused from the touch layer 007. The specific material of the light-shielding layer 005 is not limited in the above embodiments.

[0159] In current display panel manufacturing processes, after patterning, the organic capping layer typically requires surface cleaning with plasma gas to remove residues in non-patterned areas (i.e., retaining the parts of the organic capping layer where the pattern needs to be formed) or to remove photoresist residues. However, in this embodiment, after forming the organic capping layer, plasma cleaning is not performed. Instead, a patterned microlens layer is formed on the side of the organic capping layer facing away from the substrate. Then, under the mask of the microlens layer, plasma gas is used to modify the organic portion of the organic capping layer. This eliminates the need for a separate plasma gas bombardment step compared to current display panel manufacturing processes, resulting in greater process savings.

[0160] Among some possible implementation methods, please refer to Figures 13 to 15. Figure 13 is a schematic diagram of the fifth film layer structure of the display panel at A-A' shown in Figure 1. Figure 14 is a schematic diagram of the fifth film layer structure of the display panel at B-B' after the lens protection layer patterning process is completed, as shown in Figure 1. Figure 15 is a schematic diagram of the fifth film layer structure of the display panel at B-B' shown in Figure 1. Figures 14 and 15 correspond to Figure 13.

[0161] The display panel 000 may further include: a light-shielding layer 005; the light-shielding layer 005 is located on the side of the microlens layer 009 facing the driving back plate 001, and the side of the light-shielding layer 005 away from the driving back plate 001 is in direct contact with the side of the microlens layer 009 facing the driving back plate 001.

[0162] The light-shielding layer 005 has a second groove U2 on the side facing away from the driving backplate 001. The orthographic projection of the second groove U2 onto the driving backplate 001 does not coincide with the orthographic projection of the microlens layer 009 onto the driving backplate 001. The light-shielding layer 005, also known as the black matrix layer, restricts the light emission angle of the corresponding light-emitting device 003, thereby achieving the privacy function of the display panel 000. A portion of the lens protection layer 010 on the side facing the driving backplate 001 is located within the second groove U2. The thickness of the second groove U2, formed through modification treatment, is typically 0-5000 angstroms.

[0163] Since the light-shielding layer 005 is only distributed within the display area 000a, the film layer containing the exposed organic portion within the bonding area 000b can be the second organic planarization layer 001c. In some possible implementations, the manufacturing method may also include:

[0164] Step S1022: Before forming the microlens layer, a patterned light-shielding layer is formed; wherein, the side of the light-shielding layer away from the driving backplate is in direct contact with the side of the microlens layer facing the driving backplate; the organic portion is the part of the second organic planarization layer of the driving backplate that is not covered by the lens protection layer.

[0165] In step S102a, at least the surface of the organic portion is modified, which may include:

[0166] Step S202: After forming the microlens layer, the display panel with the microlens layer formed is subjected to plasma bombardment treatment to modify the surface of the organic portion in the second organic planarization layer.

[0167] The thickness of the surface-modified organic portion is less than the thickness of the portion of the second organic planarization layer covered by the microlens layer.

[0168] For example, as shown in Figures 14 and 15, the thickness of the portion of the second organic planarization layer 001c of the drive backplate 001 not covered by the lens protection layer 010 is less than the thickness of the portion of the second organic planarization layer 001c covered by the microlens layer 009.

[0169] Referring to Figure 13, the microlens layer 009 and the lens protection layer 010 can serve as protective layers for the light-shielding layer 005. Therefore, compared to the display panel shown in Figure 10, the display panel shown in Figure 13 does not require the first organic planarization layer 006, thus saving on the manufacturing cost of the first organic planarization layer 006. In these embodiments, the light-shielding layer 005 can be an organic light-shielding layer. Thus, during the surface modification process of the organic portion, the portion of the organic light-shielding layer not covered by the microlens layer 009 will form a second groove U2.

[0170] Here, as shown in Figure 13, the display panel 000 may also include: an encapsulation layer 004, a touch layer 007, and a protective cover layer 008a.

[0171] The encapsulation layer 004 is located on the side of the multiple light-emitting devices 003 that is away from the driving backplate 001; the light-shielding layer 005 is located on the side of the encapsulation layer 004 that is away from the driving backplate 001; the touch layer 007 is located on the side of the lens protection layer 010 that is away from the driving backplate 001; and the cover protection layer 008a is located on the side of the touch layer 007 that is away from the driving backplate 001.

[0172] In this embodiment, the display panel 000 may have a touch layer 007, and the touch insulating layer 007b of the touch layer 007 needs to be patterned. When the touch insulating layer 007b is also distributed in the bonding area 000b, on the side of the bonding pin 001d facing away from the substrate 001a, the touch insulating layer 007b does not completely cover the bonding pin 001d, and the corresponding bonding opening is patterned.

[0173] Among some possible implementation methods, please refer to Figures 16 to 20. Figure 16 is a schematic diagram of the sixth film layer structure of the display panel at A-A' shown in Figure 1; Figure 17 is a schematic diagram of the sixth film layer structure of the display panel at B-B' after the lens protection layer patterning process is completed in Figure 1; Figure 18 is a schematic diagram of the sixth film layer structure of the display panel at B-B' shown in Figure 1; Figure 19 is a schematic diagram of the seventh film layer structure of the display panel at B-B' after the lens protection layer patterning process is completed in Figure 1; and Figure 20 is a schematic diagram of the seventh film layer structure of the display panel at B-B' shown in Figure 1. Figures 17 and 18 correspond to Figure 16; Figures 19 and 20 correspond to Figure 18.

[0174] The display panel 000 may further include: a touch layer 007; the touch layer 007 is located on the side of the lens protection layer 010 facing the driving back plate 001, and the touch layer 007 is located on the side of the microlens layer 009 away from the driving back plate 001; the touch layer 007 may include: a first metal touch layer 007a, a touch insulating layer 007b and a second metal touch layer 007c stacked in a direction away from the driving back plate 001.

[0175] The side of the touch insulating layer 007b facing the driving backplate 001 is in direct contact with the side of the microlens layer 009 facing away from the driving backplate 001, and the side of the touch insulating layer 007b facing away from the driving backplate 001 is in direct contact with the side of the lens protective layer 010 facing the driving backplate 001. The refractive index of the touch insulating layer 007b is equal to the refractive index of the microlens layer 009, or the refractive index of the touch insulating layer 007b is equal to the refractive index of the lens protective layer 010. Since the touch insulating layer 007b is distributed between the microlens layer 009 and the lens protective layer 010, in order to ensure the optical function of the microlens layer 009 and the lens protective layer 010, the refractive index of the touch insulating layer 007b should also be the same as one of them. In this way, the touch insulating layer 007b will not affect the performance of the display panel 000.

[0176] The orthographic projection of the touch insulating layer 007b onto the driving backplate 001 is located within the orthographic projection of the lens protective layer 010 onto the driving backplate 001. Since the touch insulating layer 007b can be made of organic or inorganic insulating materials, or when inorganic insulating materials can be modified to have a hydrophilic surface, the touch insulating layer 007b within the bonding area 000b can be etched or modified to remove the low-refractive particles 010a located on the bonding pin 001d within the bonding area 00b.

[0177] Here, as shown in Figure 16, the first metal touch layer 007a is formed after the microlens layer 009. The orthographic projection of the first metal touch layer 007a on the driving back plate 001 may not overlap with the orthographic projection of the microlens layer 009 on the driving back plate 001. The orthographic projection of the second metal touch layer 007c on the driving back plate 001 may not overlap with the orthographic projection of the microlens layer 009 on the driving back plate 001, or may partially overlap with the orthographic projection of the microlens layer 009 on the driving back plate 001.

[0178] Among some possible implementation methods, the manufacturing method may also include:

[0179] Step S1023: Before forming the lens protection layer, a touch layer is formed on the side of the microlens layer away from the driving backplate; the touch layer may include: a first metal touch layer, a touch insulating layer and a second metal touch layer stacked in a direction away from the driving backplate.

[0180] In step S003, the removal of low-refractive-index particles precipitated during the formation of the lens protective layer may include:

[0181] Step S301: Using the patterned lens protective layer as a mask, etch the portion of the touch insulating layer not covered by the lens protective layer to remove the portion of the touch insulating layer not covered by the lens protective layer and the precipitated low-refractive particles.

[0182] As shown in Figures 17 and 18, the orthographic projection of the touch insulating layer 007b on the drive back plate 001 is located within the orthographic projection of the lens protective layer 010 on the drive back plate 001.

[0183] In some other possible implementations, the removal of low-refractive-index particles precipitated during the formation of the lens protective layer in step S003 may include:

[0184] Step S302: Before forming the lens protective layer and after forming the touch insulating layer, the display panel with the touch insulating layer is modified, and the patterned lens protective layer is cleaned to remove low-refractive particles in areas of the display panel not covered by the lens protective layer.

[0185] As shown in Figures 19 and 20, a portion of the orthographic projection of the touch insulating layer 007b onto the drive back plate 001 is located within the orthographic projection of the lens protection layer 010 onto the drive back plate 001, while the other portion is located outside the lens protection layer 010; and the thickness of the portion of the touch insulating layer 007b not covered by the second metal touch layer 007c is less than or equal to the thickness of the portion of the touch insulating layer 007b covered by the second metal touch layer 007c.

[0186] Here, in step S302, if modification is performed after the formation of the touch insulating layer 007b, the thickness of the touch insulating layer 007b is the same in both the display area and the bonding area. If modification is performed after the formation of the patterned second metal touch layer 007c following the formation of the touch insulating layer 007b, the portion of the touch insulating layer 007b not covered by the second metal touch layer 007c will be thinned, and the thickness of this portion will be less than the thickness of the portion of the touch insulating layer 007b covered by the second metal touch layer 007c.

[0187] In the above embodiments, please refer to Figures 2, 6, 7, 10, 13, and 16. In these embodiments, when the display panel includes an encapsulation layer 004, the encapsulation layer 004 is at least distributed within the display area 000a. The encapsulation layer 004 may include multiple encapsulation layers, such as overlapping inorganic and organic encapsulation layers. The encapsulation layer 004 may also be distributed within the bonding area 000b. When the encapsulation layer 004 has a portion distributed within the bonding area 000b, etching or modification processing can be selected to remove the precipitated low-refractive-index particles 010a, depending on the positional relationship or formation order between the encapsulation layer 004 and the lens protection layer 010, and whether the encapsulation layer 004 has an exposed portion in the bonding area 000b.

[0188] Among some possible implementation methods, please refer to Figure 21. Figure 21 is a schematic diagram of the seventh film layer structure of the display panel at A-A' shown in Figure 1. The display panel 000 has multiple sub-pixel areas in the display area. The multiple light-emitting devices 003 may include: multiple privacy light-emitting devices 0032 and multiple shared light-emitting devices 0031. At least one shared light-emitting device 0031 and multiple privacy light-emitting devices 0032 are distributed in the same sub-pixel area.

[0189] The driving backplane 001 may include a substrate 001a and a driving circuit layer 001b located on one side of the substrate 001a. The driving circuit layer 001b may include a plurality of shared pixel driving circuits 0011 and a plurality of privacy pixel driving circuits 0012.

[0190] In this sub-pixel region, at least one shared light-emitting device 0031 is electrically connected to the same shared pixel driving circuit 0011; and multiple privacy-protecting light-emitting devices 0032 in the same sub-pixel region are electrically connected to the same privacy-protecting pixel driving circuit 0012.

[0191] Here, the display panel 000 may also include: a pixel definition layer 002 and a light-shielding layer 005.

[0192] The pixel definition layer 002 is located on one side of the driving backplate 001. The pixel definition layer 002 has multiple pixel openings. The multiple pixel openings correspond to multiple light-emitting devices 003. The light-emitting layer of the light-emitting device 003 is at least partially located in the corresponding pixel opening.

[0193] The light-shielding layer 005 is located on the side of the pixel definition layer 002 away from the driving backplate. The light-shielding layer has multiple light-transmitting holes, which correspond to multiple pixel openings. The orthographic projection of the light-transmitting hole on the driving backplate 001 overlaps with the orthographic projection of the corresponding pixel opening on the driving backplate 001.

[0194] Within the same sub-pixel region, the pixel opening includes at least one shared pixel opening 002b and multiple privacy pixel openings 002a; the light-transmitting hole includes at least one first light-transmitting hole 005a and multiple second light-transmitting holes 005b; the multiple privacy pixel openings 002a correspond to the multiple first light-transmitting holes 005a, and at least one shared pixel opening 002b corresponds to at least one second light-transmitting hole 005b. The area of ​​the orthographic projection of a shared pixel opening 002b onto the driving backplate 001 is greater than the area of ​​the orthographic projection of a privacy pixel opening 002a onto the driving backplate 001.

[0195] At least one shared light-emitting device 0031 corresponds to at least one shared pixel opening 002b, and multiple privacy pixel openings 002a correspond to multiple privacy light-emitting devices 0032.

[0196] The microlenses in the microlens layer 009 correspond to the first light-transmitting hole 005a, and the orthographic projection of the microlenses in the microlens layer 009 onto the drive back plate 001 overlaps with the orthographic projection of the first light-transmitting hole 005a onto the drive back plate 001.

[0197] In other words, in this embodiment, the display panel can have privacy pixels and shared pixels. Microlenses are disposed at the positions corresponding to the privacy pixels, while no microlenses are disposed at the positions corresponding to the shared pixels. The definition of the pixel layer 002, the light-shielding layer 005, and the microlens layer 009 in this embodiment can also be applied to the display panels shown in Figures 2, 6, 7, 10, 13, and 16. In these embodiments, the light-shielding layer 005 can be an organic light-shielding layer, a metal light-shielding layer, or a film layer with light-shielding capability reused from the touch layer 007. The specific material of the light-shielding layer 005 is not limited in the above embodiments.

[0198] Please refer to Figures 22 and 23. Figure 22 is a schematic diagram of a display panel in the bonding area, and Figure 23 is a schematic diagram of a display panel in the bonding area provided in an embodiment of this application. In Figure 22, in the current display panel, there are many low-refractive-index particles 010a remaining on the surface of the bonding pins in the bonding area 000b (corresponding to the dark spots in Figure 22). Furthermore, many low-refractive-index particles 010a also remain on the exposed film layer A (film layer A can be the inorganic insulating layer 008 in Figure 3, the protective covering layer 008a in Figure 8, the first organic planarization layer 006 in Figure 11, the second organic planarization layer 001c in Figure 14, the touch insulating layer 007b in Figure 17, and the touch insulating layer 007b in Figure 19) in the bonding area 000b. In Figure 23, the display panel 000 provided in this embodiment of the application has virtually no low-reflection particles 010a remaining on the surface of the bonding pin 001d in the bonding area 000b, and there are no residues on the film layer B exposed in the bonding area 000b (film layer B can be the first organic planarization layer 006 in Figure 4, the protective covering layer 008a in Figure 9, the first organic planarization layer 006 in Figure 12, the second organic planarization layer 001c in Figure 15, the first organic planarization layer 006 in Figure 18, and the touch insulating layer 007b in Figure 20).

[0199] This application also provides a display device, which may include: a driver chip and a display panel bonded to the driver chip, wherein the display panel is the display panel described in any of the above embodiments.

[0200] The display device can be a screen in a display device such as a mobile phone, tablet computer, laptop computer, or monitor. The display device can have the technical effects of the display panel described above, which will not be repeated here.

[0201] In summary, the display panel, display device, and manufacturing method provided in this application remove low-refractive-index particles precipitated during the formation of the lens protective layer, thereby removing low-refractive-index particles located on the bonding pins. This ensures that after the formation of the microlens layer and the lens protective layer, there are no low-refractive-index particles remaining on the bonding pins of the display panel, thus improving the bonding yield between the bonding pins and the bonding chip.

[0202] It should be noted that, in the embodiments of this application, the structural limitation of the display panel can also be applied to the limitation of the manufacturing method of the display panel; similarly, the limitation of the manufacturing method of the display panel can also be applied to the limitation of the structure of the display panel. In the embodiments of this application, the display panel can be an organic light-emitting diode (OLED) display panel, or it can be a QLED, LCD, or other display panels. The embodiments of this application use an OLED display panel as an example for illustration, and do not limit the application of the technical solution of this application in other types of display panels.

[0203] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0204] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0205] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, include: Drive backplane, light-emitting device, microlens layer and lens protective layer; The drive backplane has a display area and a non-display area located around the display area, the non-display area including a bonding area; bonding pins are distributed in the bonding area; The number of light-emitting devices is multiple, and the multiple light-emitting devices are located on one side of the driving back plate and distributed within the display area; The microlens layer is located on the side of the plurality of light-emitting devices away from the driving backplate. The microlens layer has a plurality of microlenses, which correspond to at least a portion of the light-emitting devices. The orthographic projection of the microlens on the driving backplate at least partially overlaps with the orthographic projection of the light-emitting devices on the driving backplate. The lens protective layer is located on the side of the microlens layer opposite to the drive backplate. The refractive index of the lens protective layer is less than that of the microlens layer, and the lens protective layer contains low-refractive-index particles. The orthographic projection of the low-refractive particle onto the drive backplate does not coincide with the area where the bonding pin is located.

2. The display panel according to claim 1, characterized in that, The orthographic projection of all low-reflection particles in the display panel onto the driving backplate is located within the orthographic projection of the lens protective layer onto the driving backplate.

3. The display panel according to claim 1, characterized in that, The display panel further includes an inorganic insulating layer; the inorganic insulating layer is located on the side of the lens protective layer facing the driving back plate, and the orthographic projection of the inorganic insulating layer on the driving back plate is located within the orthographic projection of the lens protective layer on the driving back plate.

4. The display panel according to claim 3, characterized in that, The inorganic insulating layer is distributed on the side of the microlens layer facing the drive back plate, and the side of the inorganic insulating layer away from the drive back plate is in direct contact with the side of the microlens layer facing the drive back plate. Alternatively, the inorganic insulating layer is distributed between the microlens layer and the lens protective layer, and the side of the inorganic insulating layer facing the drive backplate is in direct contact with the side of the microlens layer away from the drive backplate, and the side of the inorganic insulating layer away from the drive backplate is in direct contact with the side of the lens protective layer facing the drive backplate; wherein, the refractive index of the inorganic insulating layer is equal to the refractive index of the microlens layer, or the refractive index of the inorganic insulating layer is equal to the refractive index of the lens protective layer.

5. The display panel according to claim 4, characterized in that, The display panel further includes: a touch layer; the touch layer is located on the side of the inorganic insulating layer facing the driving back plate, and the touch layer includes: a first metal touch layer, a touch insulating layer and a second metal touch layer stacked in a direction away from the driving back plate; The orthographic projection of the touch insulating layer on the drive back plate is located within the orthographic projection of the lens protective layer on the drive back plate.

6. The display panel according to claim 1, characterized in that, The display panel further includes: an organic cover layer; the organic cover layer is located on the side of the microlens layer facing the driving backplate; the portion of the organic cover layer not covered by the lens protection layer is the organic portion, and the portion of the organic cover layer covered by the lens protection layer is the covered portion; The thickness of the organic portion is less than the thickness of the portion of the covering portion covered by the microlens layer.

7. The display panel according to claim 1, characterized in that, The display panel further includes: an organic cover layer; the organic cover layer is located on the side of the microlens layer facing the driving backplate; the portion of the organic cover layer not covered by the lens protection layer is the organic portion, and the portion of the organic cover layer covered by the lens protection layer is the covered portion; The thickness of the portion of the covered part covered by the microlens layer is greater than the thickness of the portion of the covered part not covered by the microlens layer.

8. The display panel according to claim 6 or 7, characterized in that, The covered portion has a first groove on the side opposite to the drive back plate, and the orthographic projection of the first groove on the drive back plate does not coincide with the orthographic projection of the microlens layer on the drive back plate.

9. The display panel according to claim 8, characterized in that, The display panel further includes: a touch layer; the touch layer is located on the side of the organic cover layer facing the driving backplate; The side of the touch layer facing away from the driving backplate is in direct contact with the side of the organic cover layer facing the driving backplate, and the side of the organic cover layer facing the driving backplate is in direct contact with the side of the microlens layer facing the driving backplate.

10. The display panel according to claim 5 or 9, characterized in that, The display panel further includes: an encapsulation layer, a light-shielding layer, and a first organic planarization layer; The encapsulation layer is located on the side of the plurality of light-emitting devices opposite to the driving backplate; the light-shielding layer is located on the side of the encapsulation layer opposite to the driving backplate; the first organic planarization layer is located on the side of the light-shielding layer opposite to the driving backplate; and the touch layer is located on the side of the first organic planarization layer opposite to the driving backplate.

11. The display panel according to claim 1, characterized in that, The display panel further includes: a light-shielding layer; the light-shielding layer is located on the side of the microlens layer facing the driving back plate, and the side of the light-shielding layer away from the driving back plate is in direct contact with the side of the microlens layer facing the driving back plate; The light-shielding layer has a second groove on the side opposite to the drive back plate, and the orthographic projection of the second groove on the drive back plate does not coincide with the orthographic projection of the microlens layer on the drive back plate.

12. The display panel according to claim 11, characterized in that, The thickness of the portion of the second organic planarization layer of the drive backplate not covered by the lens protection layer is less than the thickness of the portion of the second organic planarization layer covered by the microlens layer.

13. The display panel according to claim 11, characterized in that, The display panel further includes: an encapsulation layer, a touch layer, and a protective cover layer; The encapsulation layer is located on the side of the plurality of light-emitting devices opposite to the driving backplate; the light-shielding layer is located on the side of the encapsulation layer opposite to the driving backplate; the touch layer is located on the side of the lens protection layer opposite to the driving backplate; and the cover protection layer is located on the side of the touch layer opposite to the driving backplate.

14. The display panel according to claim 1, characterized in that, The display panel further includes: a touch layer; the touch layer is located on the side of the lens protection layer facing the driving back plate, and the touch layer is located on the side of the microlens layer away from the driving back plate; the touch layer includes: a first metal touch layer, a touch insulating layer and a second metal touch layer stacked in a direction away from the driving back plate; The side of the touch insulating layer facing the driving back plate is in direct contact with the side of the microlens layer facing away from the driving back plate, and the side of the touch insulating layer facing away from the driving back plate is in direct contact with the side of the lens protective layer facing the driving back plate; the refractive index of the touch insulating layer is equal to the refractive index of the microlens layer, or the refractive index of the touch insulating layer is equal to the refractive index of the lens protective layer. The orthographic projection of the touch insulating layer on the drive back plate is located within the orthographic projection of the lens protective layer on the drive back plate. Alternatively, a portion of the touch insulating layer in its orthographic projection onto the drive back panel is located within the orthographic projection of the lens protective layer onto the drive back panel, while another portion is located outside the lens protective layer; and the thickness of the portion of the touch insulating layer not covered by the second metal touch layer is less than or equal to the thickness of the portion of the touch insulating layer covered by the second metal touch layer.

15. The display panel according to any one of claims 1-14, characterized in that, The display panel has multiple sub-pixel areas; the multiple light-emitting devices include: multiple privacy light-emitting devices and multiple shared light-emitting devices; at least one shared light-emitting device and multiple privacy light-emitting devices are distributed within the same sub-pixel area; The driving backplane includes: a substrate, and a plurality of shared pixel driving circuits and a plurality of privacy pixel driving circuits located on one side of the substrate; In this configuration, at least one shared light-emitting device within the same sub-pixel region is electrically connected to the same shared pixel driving circuit; and multiple privacy-protecting light-emitting devices within the same sub-pixel region are electrically connected to the same privacy-protecting pixel driving circuit.

16. A display device, characterized in that, include: A driver chip, and a display panel bonded to the driver chip, wherein the display panel is the display panel according to any one of claims 1-15.

17. A method for manufacturing a display panel, characterized in that, The manufacturing method includes: A driving backplane is provided; the driving backplane has a display area and a non-display area located around the display area, the non-display area including a bonding area; bonding pins are distributed in the bonding area; Multiple light-emitting devices are formed on one side of the driving backplate, and the multiple light-emitting devices are located within the display area; A patterned microlens layer and a patterned lens protection layer are formed on the side of the plurality of light-emitting devices away from the driving backplate, and low-refractive particles precipitated during the formation of the lens protection layer are removed to remove low-refractive particles located on the bonding pins. The lens protective layer is located on the side of the microlens layer opposite to the drive backplate. The refractive index of the microlens layer is greater than that of the lens protective layer, and the lens protective layer contains low-refractive-index particles.

18. The manufacturing method according to claim 17, characterized in that, The removal of low-refractive-index particles precipitated during the formation of the lens protective layer includes: Before forming the lens protective layer and after forming the microlens layer, the display panel with the microlens layer formed is modified, and the patterned lens protective layer is cleaned to remove low-refractive particles in areas of the display panel not covered by the lens protective layer.

19. The manufacturing method according to claim 18, characterized in that, After the patterned lens protective layer is formed, the portion of the display panel that is not covered by the lens protective layer and is exposed is the organic portion, and the precipitated low-refractive particles are distributed on the organic portion; The display panel on which the microlens layer is formed is modified, and the patterned lens protective layer is cleaned, including: At least the surface of the organic portion is modified to make the surface of the organic portion hydrophilic; After the patterned lens protective layer is formed, the display panel on which the lens protective layer is formed is cleaned.

20. The manufacturing method according to claim 19, characterized in that, The manufacturing method further includes: Before forming the microlens layer, a patterned organic capping layer is formed; wherein, the side of the organic capping layer away from the drive backplate is in direct contact with the side of the microlens layer facing the drive backplate; the organic portion is the part of the organic capping layer not covered by the lens protection layer, and the part of the organic capping layer covered by the lens protection layer is the capping portion; At least the surface of the organic portion is modified, including: After the microlens layer is formed, the display panel on which the microlens layer is formed is subjected to plasma bombardment treatment to modify the surface of the organic portion in the organic cover layer. Wherein, the thickness of the surface-modified organic portion is less than the thickness of the portion of the covering portion covered by the microlens layer; or, The manufacturing method further includes: Before forming the microlens layer, a patterned light-shielding layer is formed; wherein the side of the light-shielding layer away from the drive backplate is in direct contact with the side of the microlens layer facing the drive backplate; the organic portion is the portion of the second organic planarization layer of the drive backplate that is not covered by the lens protection layer. At least the surface of the organic portion is modified, including: After the microlens layer is formed, the display panel on which the microlens layer is formed is subjected to plasma bombardment treatment to modify the surface of the organic portion in the second organic planarization layer. The thickness of the surface-modified organic portion is less than the thickness of the portion of the second organic planarization layer covered by the microlens layer.

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