Display substrate, display panel, display device, and manufacturing method

Abstract

Provided in the embodiments of the present disclosure are a display substrate, a display panel, a display device, and a manufacturing method. The display substrate has an opening area, an active area, and a transition area connecting the active area and the opening area, wherein the opening area has an opening. The display substrate comprises: a first barrier group comprising at least one first barrier structure and at least one compensation structure, a first distance being defined between the surface of the compensation structure away from a substrate and the substrate, and a second distance being defined between the surface of the first barrier structure away from the substrate and the substrate, wherein the first distance is different from the second distance; and an encapsulation layer comprising a first inorganic encapsulation layer and an organic encapsulation layer, the organic encapsulation layer comprising a plurality of encapsulation portions, and the orthographic projection of at least one of the plurality of encapsulation portions on the substrate being located in the region between the orthographic projections of adjacent first barrier structures on the substrate.

Description

Display substrate, display panel, display device, and manufacturing method Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display substrate, a display panel, a display device, and a manufacturing method. Background Technology

[0002] To enhance user experience, display devices are evolving towards full-screen designs. Among these, punch-hole displays represent a trend in full-screen development, involving the creation of openings in the display panel to increase the screen-to-body ratio. Summary of the Invention

[0003] This disclosure provides a display substrate, a display panel, a display device, and a manufacturing method. The display substrate has an opening area, a display area, and a transition area connecting the display area and the opening area. The opening area has an opening. The display substrate includes:

[0004] Substrate;

[0005] A first barrier group is located on one side of the substrate and in the transition region; the first barrier group includes: at least one first barrier structure and at least one compensation structure; in the direction from the opening area to the display area, the first barrier structure and the compensation structure alternately surround the opening, the surface of the compensation structure facing away from the substrate has a first distance from the substrate, and the surface of the first barrier structure facing away from the substrate has a second distance from the substrate, the first distance and the second distance being different;

[0006] An encapsulation layer is located on the side of the first barrier group away from the substrate. The encapsulation layer includes: a first inorganic encapsulation layer and an organic encapsulation layer located on the side of the first inorganic encapsulation layer away from the first barrier group. The organic encapsulation layer includes: a plurality of encapsulation portions. At least one of the plurality of encapsulation portions has its orthographic projection on the substrate located in the region between the orthographic projections of adjacent first barrier structures on the substrate.

[0007] In one possible implementation, the package includes: two sub-packages and a first gap between the two sub-packages; the orthographic projections of the two sub-packages of the same package on the substrate are respectively located on both sides of the orthographic projection of the compensation structure on the substrate; the orthographic projection of the first gap on the substrate overlaps with the orthographic projection of the compensation structure on the substrate.

[0008] In one possible implementation, a second gap exists between the compensation structure and the first barrier structure; the first inorganic encapsulation layer covers the first barrier structure, the compensation structure, and fills the second gap.

[0009] In one possible implementation, the first inorganic encapsulation layer includes: a first sub-encapsulation portion, a second sub-encapsulation portion, and a third sub-encapsulation portion; the orthographic projection of the first sub-encapsulation portion on the substrate overlaps with the orthographic projection of the first barrier structure on the substrate, the orthographic projection of the third sub-encapsulation portion on the substrate overlaps with the orthographic projection of the compensation structure on the substrate, and the second sub-encapsulation portion connects the first sub-encapsulation portion and the third sub-encapsulation portion.

[0010] The first sub-package portion has a third distance between itself and the substrate on the side facing away from the substrate, which is greater than the third sub-package portion has a fourth distance between itself and the substrate on the side facing away from the substrate, and the third distance is greater than the fourth distance.

[0011] In one possible implementation, the first sub-package portion, the second sub-package portion, and the third sub-package portion form a recess on the side opposite to the substrate, and the sub-package portion fills the recess.

[0012] In one possible implementation, the first distance is smaller than the second distance.

[0013] In one possible implementation, the encapsulation layer further includes: a second inorganic encapsulation layer located on the side of the organic encapsulation layer opposite to the first inorganic encapsulation layer;

[0014] In the region between the first barrier structure and the compensation structure, the second inorganic encapsulation layer has the sub-encapsulation portion between it and the first inorganic encapsulation layer; in the region where the compensation structure is located, the second inorganic encapsulation layer is in contact with the first inorganic encapsulation layer.

[0015] In one possible implementation, the display substrate includes: an insulating layer located between the first barrier group and the substrate; the insulating layer includes: a first insulating portion and a second insulating portion; the second insulating portion is located on the side of the first insulating portion facing the opening, and the thickness of the second insulating portion in the direction perpendicular to the substrate is less than the thickness of the first insulating portion in the direction perpendicular to the substrate; the first barrier group is located in the region where the first insulating portion is located, and the orthographic projection of the first barrier group on the substrate does not overlap with the orthographic projection of the second insulating portion on the substrate;

[0016] The display substrate further includes: an integral and continuous protective structure located between the insulating layer and the encapsulation layer; the protective structure partially covers the surface of the first insulating portion away from the substrate, partially covers the sidewall of the first insulating portion, and partially covers the surface of the second insulating portion away from the substrate.

[0017] In one possible implementation, the protective structure and the compensation structure are in the same layer and made of the same material.

[0018] In one possible implementation, the display substrate further includes: a protective layer located between the substrate and the encapsulation layer; the compensation structure is of the same layer and material as the protective layer.

[0019] In one possible implementation, the display substrate further includes an interlayer dielectric layer located between the substrate and the encapsulation layer; the compensation structure is of the same layer and material as the interlayer dielectric layer.

[0020] In one possible implementation, the display substrate further includes: a first gate layer located between the substrate and the encapsulation layer, a second gate layer located between the first gate layer and the encapsulation layer, and a third gate layer located between the second gate layer and the encapsulation layer;

[0021] The compensation structure is made of the same material as the third gate layer.

[0022] In one possible implementation, the display substrate further includes: a first gate layer located between the substrate and the encapsulation layer, a second gate layer located between the first gate layer and the encapsulation layer, a third gate layer located between the second gate layer and the encapsulation layer, and a protective layer located between the third gate layer and the encapsulation layer;

[0023] The compensation structure includes: a first patterned portion and a second patterned portion located on the side of the first patterned portion away from the substrate; the first patterned portion is in the same layer and material as the third gate layer, and the second patterned portion is in the same layer and material as the protective layer.

[0024] In one possible implementation, the display substrate further includes: an interlayer dielectric layer located on one side of the substrate; the interlayer dielectric layer includes: a plurality of first dielectric portions and a plurality of second dielectric portions; the first dielectric portions and the second dielectric portions are separated from each other, and a first groove is formed between them;

[0025] The first dielectric portion is located between the first barrier structure and the substrate, and the orthographic projection of the first dielectric portion on the substrate overlaps with the orthographic projection of the first barrier structure on the substrate; the second dielectric portion serves as the compensation structure.

[0026] In one possible implementation, the display substrate further includes a barrier structure located between the substrate and the encapsulation layer, and between the first barrier group and the display area;

[0027] The surface of the retaining wall structure facing away from the substrate has a fifth distance from the substrate, which is greater than the second distance.

[0028] In one possible implementation, the display substrate further includes: a power-off structure located between the substrate and the encapsulation layer; the power-off structure is located between the two first barrier structures closest to the barrier structure, and the power-off structure covers at least a portion of the surface of the first barrier structure facing away from the substrate.

[0029] In one possible implementation, the display substrate further includes a second barrier group located between the substrate and the encapsulation layer, and between the barrier structure and the display area; the second barrier group includes at least one second barrier structure; the second barrier structure has the same configuration as the first barrier structure.

[0030] In one possible implementation, the display substrate further includes: a first source-drain layer located between the substrate and the encapsulation layer, and a second source-drain layer located between the first source-drain layer and the encapsulation layer;

[0031] One of the first source-drain layer and the second source-drain layer is made of the same layer and material as the first barrier structure.

[0032] In one possible implementation, the first barrier structure includes: a first barrier portion, a second barrier portion located on the side of the first barrier portion away from the substrate, and a third barrier portion located on the side of the second barrier portion away from the substrate.

[0033] In the direction from the display area to the opening area, the width of the second barrier is smaller than the width of the first barrier and smaller than the width of the third barrier.

[0034] In one possible implementation, the display substrate further includes: a light-emitting layer located between the first barrier group and the encapsulation layer, and a common electrode layer located between the light-emitting layer and the encapsulation layer; the light-emitting layer includes: a plurality of first light-emitting portions and a plurality of second light-emitting portions; the common electrode layer includes: a plurality of first common electrode portions and a plurality of second common electrode portions;

[0035] The orthographic projection of the first light-emitting part onto the substrate overlaps with the orthographic projection of the first barrier structure onto the substrate; the orthographic projection of the second light-emitting part onto the substrate is located on both sides of the orthographic projection of the first barrier structure onto the substrate; at least a portion of the first light-emitting part is disconnected from the adjacent second light-emitting part.

[0036] The orthographic projection of the first common electrode portion onto the substrate overlaps with the orthographic projection of the first barrier structure onto the substrate; the orthographic projection of the second common electrode portion onto the substrate is located on both sides of the orthographic projection of the first barrier structure onto the substrate; at least a portion of the first common electrode portion is disconnected from the adjacent second common electrode portion.

[0037] This disclosure also provides a display panel, which includes the display substrate as described in this disclosure.

[0038] This disclosure also provides a display device, which includes the display panel as described in this disclosure.

[0039] This disclosure also provides a method for manufacturing a display substrate as described in this disclosure, comprising:

[0040] A first barrier group is formed on one side of the substrate; wherein the first barrier group includes: at least one first barrier structure and at least one compensation structure;

[0041] An inorganic encapsulation layer and an organic encapsulation layer are formed on the side of the first barrier group facing away from the substrate; wherein the organic encapsulation layer includes: a plurality of encapsulation portions;

[0042] The encapsulation portion between two adjacent first isolation structures is thinned by an etching process.

[0043] In one possible implementation, the thinning of the package portion between two adjacent first isolation structures by etching includes:

[0044] The encapsulation portion between two adjacent first isolation structures is thinned by an etching process, so that the encapsulation portion is disconnected on both sides of the compensation structure.

[0045] In one possible implementation, the formation of a first inorganic encapsulation layer on the side of the first barrier group opposite to the substrate, and the organic encapsulation layer, include:

[0046] The first inorganic encapsulation layer is formed on the side of the first barrier group that is away from the substrate;

[0047] Using the sidewall of the barrier structure facing the display area as the outer boundary, an organic liquid is printed to form the organic encapsulation layer. Attached Figure Description

[0048] Figure 1 is a partial top view of the display substrate provided in an embodiment of this disclosure;

[0049] Figure 2 is a schematic diagram of the cross section along the dashed line e1 in Figure 1;

[0050] Figure 3 is an enlarged schematic diagram of Figure 2 at the dashed box S1;

[0051] Figure 4 is one of the partial cross-sectional schematic diagrams of the display substrate provided in the embodiments of this disclosure;

[0052] Figure 5 is a second partial cross-sectional schematic diagram of the display substrate provided in the embodiments of this disclosure;

[0053] Figure 6 is a third partial cross-sectional schematic diagram of the display substrate provided in the embodiments of this disclosure;

[0054] Figure 7 is a fourth partial cross-sectional schematic diagram of the display substrate provided in the embodiments of this disclosure;

[0055] Figure 8 is an enlarged schematic diagram of Figure 2 at the dashed box S2;

[0056] Figure 9A is a schematic diagram of the stacking corresponding to the transition zone 200 in Figure 2;

[0057] Figure 9B is a schematic diagram of the single membrane layer of the first diaphragm layer in the transition zone 200 of Figure 2;

[0058] Figure 9C is a schematic diagram of the single membrane layer of the second diaphragm layer in the transition zone 200 of Figure 2;

[0059] Figure 9D is a schematic diagram of the thinning of the interlayer dielectric layer in the transition region 200 of Figure 2;

[0060] Figure 9E is a schematic diagram of the single-layer compensation structure in the transition region 200 of Figure 2;

[0061] Figure 9F is a schematic diagram of the single film layer of the first planarization layer in the transition region 200 of Figure 2;

[0062] Figure 9G is a schematic diagram of a single membrane layer of the first barrier structure in the transition region 200 of Figure 2.

[0063] Figure 9H is a schematic diagram of the single film layer of the second planar layer in the transition region 200 of Figure 2;

[0064] Figure 9I is a schematic diagram of a single film layer of the pixel defining layer in the transition region 200 of Figure 2;

[0065] Figure 9J is a schematic diagram of a single membrane layer of the septum layer in the transition zone 200 of Figure 2;

[0066] Figure 10 is a schematic diagram of the manufacturing process of the display substrate provided in the embodiments of this disclosure. Detailed Implementation

[0067] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0068] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0069] As used herein, “approximately” or “substantially the same” includes the stated value and means within an acceptable range of deviations from the specific value, as determined by a person skilled in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., limitations of the measurement system). For example, “substantially the same” may mean a difference relative to the stated value within one or more standard deviations, or within ±30%, 20%, 10%, or 5%.

[0070] In the accompanying drawings, the thicknesses of layers, films, panels, regions, etc., are enlarged for clarity. Exemplary embodiments are described herein with reference to cross-sectional views that are schematic diagrams of idealized embodiments. Thus, deviations from the shapes shown in the drawings will be expected as a result of, for example, manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but rather include deviations in shape caused, for example, by manufacturing processes. For example, regions illustrated or described as flat may typically have rough and / or non-linear characteristics. Furthermore, sharp corners illustrated may be rounded. Thus, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0071] To keep the following description of the embodiments of this disclosure clear and concise, detailed descriptions of known functions and known components are omitted.

[0072] For display panels with openings, a barrier is usually placed around the opening to prevent the organic encapsulation material from overflowing. Between the barrier and the opening, an isolation pillar is placed to separate the light-emitting material layer and the common electrode. However, the placement of the isolation pillar will result in a poor overall morphology of the encapsulation layer above, which is prone to cracking around the opening. Moreover, when the opening is subjected to pressure (for example, when a camera is installed, it may cause compressive stress on the film layer around the opening), cracks in the encapsulation layer are also prone to appear around the opening. These cracks become pathways for water and oxygen intrusion, which leads to corrosion and failure of the light-emitting material layer, affecting normal display.

[0073] In view of the above, this disclosure provides a display substrate, as shown in Figures 1-3, wherein Figure 2 is a cross-sectional view along the dashed line e1 in Figure 1, and Figure 3 is an enlarged view at the dashed frame S1 in Figure 2. The display substrate has an opening area 300, a display area 100, and a transition area 200 connecting the display area 100 and the opening area 300. The opening area 300 has an opening 30. The display substrate includes:

[0074] Substrate 11;

[0075] The first barrier group Z is located on one side of the substrate 11 and in the transition region 200. The first barrier group Z includes at least one first barrier structure Z1 and at least one compensation structure Z2. In the direction from the opening region 300 to the display region 100, the first barrier structure Z1 and the compensation structure Z2 alternately surround the opening 30. The surface of the compensation structure Z2 facing away from the substrate 11 has a first distance d1 with the substrate 11, and the surface of the first barrier structure Z1 facing away from the substrate 11 has a second distance d2 with the substrate. The first distance d2 is different from the second distance d1.

[0076] The encapsulation layer 17 is located on the side of the first barrier group Z opposite to the substrate 11. The encapsulation layer 17 includes a first inorganic encapsulation layer 171 and an organic encapsulation layer 172 located on the side of the first inorganic encapsulation layer 171 opposite to the first barrier group Z1. The organic encapsulation layer 172 includes a plurality of encapsulation portions 1720. The orthographic projection of at least one of the plurality of encapsulation portions 1720 onto the substrate 11 is located in the region between the orthographic projections of adjacent first barrier structures Z1 onto the substrate 11. Optionally, the organic encapsulation layer 172 is not only provided in the display area 100, but also between adjacent first barrier structures Z1 in the transition area 200.

[0077] In this embodiment, the organic encapsulation layer 172 includes an encapsulation portion 1720 located between two adjacent first barrier structures Z1. The encapsulation portion 1720 can mitigate the surface morphology of the film layer (e.g., the second inorganic encapsulation layer 173) above the organic encapsulation layer 1720, resulting in a better morphology of the film layer (e.g., the second inorganic encapsulation layer 173) and improving the encapsulation effect. Moreover, the first barrier group Z includes a first barrier structure Z1 and a compensation structure Z2 alternately surrounding the opening 30. The maximum distance d2 between the compensation structure Z2 and the substrate 11 is different from the maximum distance d1 between the first barrier structure Z1 and the substrate 11. That is, the heights of the compensation structure Z2 and the first barrier structure Z1 are different. In this way, the first inorganic encapsulation layer Z1 above the first barrier group Z can be encapsulated. The organic encapsulation layer 171 forms a wavy, bent shape in this area, making the morphology of the first inorganic encapsulation layer 171 "spring-like". The bent first inorganic encapsulation layer 171 can relieve the stress when the opening is squeezed, reducing the probability of cracking. In addition, the setting of the compensation structure Z2 is beneficial to block the upper encapsulation part 1720. While maintaining the good morphology of the second inorganic encapsulation layer 173 above the organic encapsulation layer 172, it can reduce or avoid the formation of an integrally connected encapsulation part 1720 between the two first barrier structures Z1 (due to the water absorption properties of the organic encapsulation part 1720, when it is integrally connected, water vapor can easily invade along the integral channel formed by the encapsulation part 1720, leading to encapsulation failure), thus improving the encapsulation effect of the display substrate.

[0078] In one possible implementation, referring to FIG3, the encapsulation portion 1720 includes: two sub-encapsulation portions 1721, and a first gap 1722 located between the two sub-encapsulation portions 1721; the two sub-encapsulation portions 1721 of the same encapsulation portion 1720 are spaced apart from each other, and their orthogonal projections on the substrate 11 are respectively located on both sides of the orthogonal projection of the compensation structure Z2 on the substrate 11; the orthogonal projection of the first gap 1722 on the substrate 11 overlaps with the orthogonal projection of the compensation structure Z2 on the substrate 11. In this embodiment of the present disclosure, the same encapsulation portion 1720 is divided into two spaced-apart sub-encapsulation portions 1721 by the compensation structure Z2, which can completely block the encapsulation portion 1720 from forming an integrally connected structure, thereby preventing the integrally connected organic encapsulation portion 1720 from forming a channel for moisture intrusion.

[0079] In one possible implementation, referring to Figure 3, a second gap G0 exists between the compensation structure Z2 and the first barrier structure Z1; the first inorganic encapsulation layer 171 covers the first barrier structure Z1, the compensation structure Z2, and fills the second gap G0. In this embodiment, the second gap G0 between the compensation structure Z2 and the first barrier structure Z1 allows the upper first inorganic encapsulation layer 171 to sink at the second gap G0 and bulge at the first barrier structure Z1 and the compensation structure Z2, thereby forming a undulating "spring-like" morphology, improving the resistance to compression and cracking.

[0080] In one possible implementation, referring to FIG3, the first inorganic encapsulation layer 171 includes: a first sub-encapsulation portion 1711, a second sub-encapsulation portion 1712, and a third sub-encapsulation portion 1713; the orthographic projection of the first sub-encapsulation portion 1711 onto the substrate 11 overlaps with the orthographic projection of the first barrier structure Z1 onto the substrate 11, the orthographic projection of the third sub-encapsulation portion 1713 onto the substrate 11 overlaps with the orthographic projection of the compensation structure Z2 onto the substrate 11, and the second sub-encapsulation portion 1712 connects the first sub-encapsulation portion 1711 and the third sub-encapsulation portion 1713; that is, the first... The portion of the inorganic encapsulation layer 171 located above the first barrier structure Z1 serves as the first sub-encapsulation portion 1711, the portion located above the compensation structure Z2 serves as the third sub-encapsulation portion 1713, and the portion located between the first sub-encapsulation portion 1711 and the third sub-encapsulation portion 1713 serves as the second sub-encapsulation portion 1712. The side of the first sub-encapsulation portion 1711 facing away from the substrate 11 has a third distance d3 with the substrate 11, and the side of the third sub-encapsulation portion 1713 facing away from the substrate has a fourth distance d4 with the substrate. The third distance d1 is greater than the fourth distance d4. In this embodiment, the third distance d1 being greater than the fourth distance d4 allows the first inorganic encapsulation layer 171 to form a undulating "spring-like" morphology, improving its resistance to compression and cracking.

[0081] In one possible implementation, as shown in FIG3, the first sub-encapsulation portion 1711, the second sub-encapsulation portion 1712, and the third sub-encapsulation portion 1713 form a pit P on the side away from the substrate 11, thereby forming a undulating "spring-like" morphology, which improves the effect of compression resistance and crack prevention. The sub-encapsulation portion 1721 fills the pit P, thereby smoothing the surface of the upper film layer (such as the second inorganic encapsulation layer 173), making the surface of the upper film layer (such as the second inorganic encapsulation layer 173) smooth and having a better encapsulation effect.

[0082] In one possible implementation, as shown in FIG3, the first distance d1 is smaller than the second distance d2. In this embodiment of the present disclosure, the first distance d1 being smaller than the second distance d2 is advantageous for forming the compensation structure Z2 through the film layer (e.g., protective layer 137) below the first barrier structure Z1, reducing the manufacturing difficulty of the compensation structure Z2. This avoids the situation where, if the thickness of the compensation structure Z2 is large, it cannot be effectively utilized to manufacture the existing film layer of the display substrate, or multiple film layers are required, which would increase the manufacturing difficulty and cost of the display substrate.

[0083] In one possible implementation, referring to FIG3, the encapsulation layer 17 further includes: a second inorganic encapsulation layer 173 located on the side of the organic encapsulation layer 172 opposite to the first inorganic encapsulation layer 171; a sub-encapsulation portion 1721 between the second inorganic encapsulation layer 173 and the first inorganic encapsulation layer 171 in the region between the first barrier structure Z1 and the compensation structure Z2; and the second inorganic encapsulation layer 173 contacting the first inorganic encapsulation layer 171 in the region where the compensation structure Z2 is located.

[0084] The display substrate structure involved in the embodiments of this disclosure will be described in detail below with reference to specific examples.

[0085] As shown in Figures 1 to 3, the display substrate includes a substrate 11, a driving circuit layer 13, a planarization layer group 14, a light-emitting element 16, and an encapsulation layer 17. The driving circuit layer 13 is disposed on one side of the substrate 11, the planarization layer group 14 is disposed on the side of the driving circuit layer 13 away from the substrate 11, the light-emitting element 16 is disposed on the side of the planarization layer group 14 away from the substrate 11, and the encapsulation layer 17 is disposed on the side of the light-emitting element 16 away from the substrate 11. Additionally, the display panel may also include a buffer layer 12, which is disposed between the substrate 11 and the driving circuit layer 13.

[0086] The substrate 11 can be an inorganic material substrate 11 or an organic material substrate 11. For example, in one embodiment of this disclosure, the material of the substrate 11 can be a glass material such as soda-lime glass, quartz glass, or sapphire glass, or a metal material such as stainless steel, aluminum, or nickel.

[0087] In another embodiment of this disclosure, the substrate 11 may also be a flexible substrate 11, for example, the material of the substrate 11 may be polyimide (PI). The substrate 11 may also be a composite of multiple materials. For example, in one embodiment of this disclosure, the substrate 11 may include a bottom film, a pressure-sensitive adhesive layer, a first polyimide layer and a second polyimide layer stacked sequentially.

[0088] In the display area 100, the driving circuit layer 13 is provided with driving circuits for driving the light-emitting units. The driving circuits are located in the display area 100, and any driving circuit may include a transistor, which may be a thin-film transistor (TFT). The TFT may be selected from top-gate TFTs, bottom-gate TFTs, or dual-gate TFTs. Taking a top-gate TFT as an example, the driving circuit layer 13 may include a first active layer 131, a first gate insulating layer 1321, a first gate layer, a second gate insulating layer 1322, a second gate layer, and a third gate insulating layer 1323 sequentially disposed along a direction away from the substrate 11, wherein:

[0089] The first active layer 131 is disposed on one side of the substrate 11. The material of the first active layer 131 can be amorphous silicon semiconductor material, low-temperature polycrystalline silicon semiconductor material, metal oxide semiconductor material, organic semiconductor material, or other types of semiconductor material. Therefore, the thin film transistor can be an N-type thin film transistor or a P-type thin film transistor. The first active layer 131 may include a channel region and two doped regions of different doping types located on both sides of the channel region.

[0090] The first gate insulating layer 1321 is disposed on the side of the first active layer 131 away from the substrate 11. The first gate insulating layer 1321 can cover the first active layer 131 and the substrate 11. The first gate layer can include the first gate 1331. The first gate 1331 is disposed on the side of the first gate insulating layer 1321 away from the substrate 11 and is directly opposite to the first active layer 131. That is, the projection of the first gate 1331 on the substrate 11 is located within the projection range of the first active layer 131 on the substrate 11. For example, the projection of the first gate 1331 on the substrate 11 coincides with the projection of the channel region of the first active layer 131 on the substrate 11. The second gate insulating layer 1322 is disposed on the side of the first gate 1331 away from the substrate 11. The second gate insulating layer 1322 can cover the first gate 1331 and the first gate insulating layer 1321. The second gate layer can include a second gate 1332, which is disposed on the side of the second gate insulating layer 1322 away from the substrate 11 and is directly opposite the first active layer 131. The materials of the first gate insulating layer 1321 and the second gate insulating layer 1322 are both insulating materials such as silicon oxide.

[0091] In one possible implementation, the driving circuit layer 13 may further include a third gate layer located on the side of the third gate insulating layer 1323 away from the substrate 11, and a fourth gate insulating layer located on the side of the third gate layer away from the substrate.

[0092] The thin-film transistor may further include an interlayer dielectric layer 134, a first source / drain metal layer located on the side of the interlayer dielectric layer 134 away from the substrate 11, a protective layer 137 located on the side of the first source / drain metal layer away from the substrate, a first planarization layer 141 located on the side of the protective layer 137 away from the substrate 11, a second source / drain metal layer located on the side of the first planarization layer 141 away from the substrate 11, a second planarization layer 142 located on the side of the second source / drain metal layer facing away from the substrate, and a pixel defining layer 15 located on the side of the second planarization layer 142 away from the substrate 11; optionally, the side of the pixel defining layer 15 away from the substrate 11 may also include... A spacer layer 150 may be provided; that is, the display substrate includes: a first gate layer (which may include a first gate 1331) located between the substrate 11 and the first barrier group Z, a second gate layer (which may include a second gate 1332) located between the first gate layer and the first barrier group Z, a third gate layer (which may include a third gate) located between the second gate layer and the first barrier group Z, an interlayer dielectric layer 134 located between the third gate layer and the first barrier group Z, and a protective layer 137 located between the first barrier group Z and the encapsulation layer 17;

[0093] An interlayer dielectric layer 134 is disposed on the side of the second gate 1332 away from the substrate 11, and the interlayer dielectric layer 134 may cover the second gate 1332 and the third gate insulating layer 1323; the first source / drain metal layer may include a first source 135 and a first drain 136, which are connected to the first active layer 131. For example, the first source 135 and the first drain 136 are respectively connected to two doped regions of the corresponding first active layer 131 through vias; a protective layer 137 covers the first source 135 and the first drain 136; a first planarization layer 141 covers the protective layer 137, and the surface of the first planarization layer 141 away from the substrate 11 may be planar. The first source / drain metal layer may include: a first source 135 and a first drain 136; the second source / drain metal layer may include: a second source 138, which is connected to the first source 135. The second planarization layer 142 covers the second source 138 and the first planarization layer 141. The pixel defining layer 15 has multiple pixel openings, and the light-emitting element 16 may include multiple light-emitting units, each disposed within a different pixel opening. Each light-emitting unit may include a pixel electrode 161, a light-emitting layer 162, and a common electrode 163. The pixel electrode 161 is located on the surface of the first planarization layer 141 or the second planarization layer 142 away from the substrate 11. The light-emitting layer 162 is disposed on the surface of the pixel electrode 161 away from the substrate 11, and the common electrode 163 is disposed on the surface of the light-emitting layer 162 away from the substrate 11. The light-emitting layer 162 can be driven to emit light through the pixel electrode 161 and the common electrode 163 to display an image.

[0094] Pixel electrode 161 is connected to either the first source 135 or the second source 138. A pixel defining layer 15 is provided on the side of pixel electrode 161 away from the substrate 11. When the thin-film transistor includes only the first source 135, pixel electrode 161 is connected to the first source 135, and pixel defining layer 15 covers pixel electrode 161 and the first planarization layer 141. When the thin-film transistor also includes the second source 138, pixel electrode 161 is connected to the second source 138, and pixel defining layer 15 covers pixel electrode 161 and the second planarization layer 142.

[0095] The common electrode 163 can serve as the cathode, and the pixel electrode 161 can serve as the anode. The light-emitting layer 162 can be driven to emit light by applying a signal to the pixel electrode 161; the specific light-emitting principle will not be detailed here. The light-emitting layer 162 may contain electroluminescent organic light-emitting materials and can be formed using processes such as vapor deposition. For example, the light-emitting layer 162 may include a hole injection layer, a hole transport layer, a light generation layer, an electron transport layer, and an electron injection layer sequentially stacked on the pixel electrode 161 layer. It should be noted that the light-emitting layer 162 may include a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer, depending on the emitted color.

[0096] The encapsulation layer 17 is disposed on the side of the light-emitting element 16 away from the substrate 11, thereby covering the light-emitting element 16 and preventing water and oxygen corrosion. The encapsulation layer 17 may be a single layer or a multi-layer structure, and the material of the encapsulation layer 17 may include organic or inorganic materials, without special limitation.

[0097] In this embodiment, the encapsulation layer 17 may include a first inorganic encapsulation layer 171, an organic encapsulation layer 172, and a second inorganic encapsulation layer 173. The first inorganic encapsulation layer 171 is disposed on the side of the light-emitting element 16 away from the substrate 11, the organic encapsulation layer 172 is disposed on the side of the first inorganic encapsulation layer 171 away from the substrate 11, and the second inorganic encapsulation layer 173 is disposed on the side of the organic encapsulation layer 172 away from the substrate 11.

[0098] The display substrate also includes an opening region 300 and a transition region 200. The opening region 300 has an opening 30, and the transition region 200 is located between the edge of the opening 30 and the edge of the display region 100. Because of the flow of liquid organic encapsulation material, overflow of the liquid organic encapsulation material is likely to occur. To prevent overflow, a barrier structure 20 is provided in the transition region 200. That is, the display substrate also includes a barrier structure 20 located between the substrate 11 and the encapsulation layer 17, and between the first barrier group Z and the display region 100. The surface of the barrier structure 20 facing away from the substrate 11 has a fifth distance d7 with the substrate 11, and the fifth distance d7 is greater than the second distance d2. The barrier structure 20 is arranged around the opening 30 and serves as a barrier. The cross-sectional shape of the barrier structure 20 can be rectangular or trapezoidal, and the barrier structure 20 has at least one beveled side near the display region 100; this is not limited here.

[0099] The stacked pattern of the barrier structure 20 includes an insulating layer group, which is disposed in the same material as one or more layers of the first planarization layer 141, the second planarization layer 142, and the pixel defining layer 15. As shown in Figure 2, the stacked pattern of the barrier structure 20 includes a first insulating layer 201, which is disposed in the same layer and with the same material as the first planarization layer 141. A second insulating layer 202 can also be disposed on the first insulating layer 201, which is disposed in the same layer and with the same material as the second planarization layer 142. A third insulating layer 203 can also be disposed on the second insulating layer 202, which is disposed in the same layer and with the same material as the pixel defining layer 15. On the side of the barrier structure 20 away from the substrate 11, a light-emitting layer 162, a common electrode 163, a first inorganic encapsulation layer 171, and a second inorganic encapsulation layer 173 can also be sequentially disposed. In one possible embodiment, the organic encapsulation layer 172 can also extend beyond the barrier structure 20 and overflow to the side of the barrier structure 20 away from the display area 100.

[0100] The first gate insulating layer 1321, the second gate insulating layer 1322, the third gate insulating layer 1323 and the interlayer dielectric layer 134 all extend from the display area 100 to the transition area 200, and from the transition area 200 to the edge of the opening 30.

[0101] The first barrier structure Z1 is located on the side of the interlayer dielectric layer 134 away from the substrate 11. In this embodiment, the first barrier structure Z1 can be disposed in the same layer and with the same material as the second source / drain metal layer. In other embodiments, the first barrier structure Z1 can also be disposed in the same layer and with the same material as the first source / drain metal layer. In other embodiments, the first barrier structure Z1 can also be disposed in the same layer and with the same material as the third source / drain metal layer.

[0102] Specifically, the first barrier structure Z1 can be configured as a structure that is wide at both ends and narrow in the middle, or it can be configured as an inverted trapezoidal structure with its width gradually decreasing from the end away from the substrate 11 to the end closer to the substrate 11, or it can be configured as other structures that are recessed (undercut) in its height direction. In this embodiment, the first barrier structure Z1 includes a first barrier portion Z11, a second barrier portion Z12, and a third barrier portion Z13 connected sequentially in the direction away from the substrate 11. The width of the second barrier portion Z12 is smaller than the width of the adjacent first barrier portions Z11 and the third barrier portions Z13, that is, in the direction from the display area to the opening area, the width of the second barrier portion Z12 is smaller than the width of the first barrier portion Z11 and smaller than the width of the third barrier portion Z13. For example, the first barrier portion Z11 and the third barrier portion Z13 can be made of titanium, and the second barrier portion Z12 can be made of aluminum.

[0103] A spacer structure 24 may also be formed on the side of the first barrier structure Z1 facing the substrate 11. The spacer structure 24 may include: a first spacer portion 241 and a second spacer portion 242 located on the side of the first spacer portion 241 away from the substrate 11. Optionally, the first spacer portion 241 may be in the same layer and made of the same material as the first gate 1331; the second spacer portion 242 may be in the same layer and made of the same material as the second gate 1332.

[0104] In the transition region 200, the light-emitting layer 162 includes a plurality of first light-emitting portions 1621 and a plurality of second light-emitting portions 1622; the common electrode layer 163 includes a plurality of first common electrode portions 1631 and a plurality of second common electrode portions 1632; the orthographic projection of the first light-emitting portion 1621 onto the substrate 11 overlaps with the orthographic projection of the first barrier structure Z1 onto the substrate 11; the orthographic projection of the second light-emitting portion 1622 onto the substrate 11 is located on both sides of the orthographic projection of the first barrier structure Z1 onto the substrate 11; at least a portion of the first light-emitting portion 1621 is disconnected from the adjacent second light-emitting portion 1622; the orthographic projection of the first common electrode portion 1631 onto the substrate 11 overlaps with the orthographic projection of the first barrier structure Z1 onto the substrate 11; the orthographic projection of the second common electrode portion 1631 onto the substrate 11 is located on both sides of the orthographic projection of the first barrier structure Z1 onto the substrate 11; at least a portion of the first common electrode portion 1631 is disconnected from the adjacent second common electrode portion 1632. That is, in the transition region 200, the light-emitting layer 162 is blocked by the first barrier structure Z1, forming a plurality of first light-emitting parts 1621 and a plurality of second light-emitting parts 1622. The common electrode 163 is also blocked by the first barrier structure Z1, forming a plurality of first common electrode parts 1631 and a plurality of second common electrode parts 1632.

[0105] The first light-emitting part 1621 is disposed on the side of the first barrier structure Z1 away from the substrate 11, and the second light-emitting part 1622 is disposed between two adjacent first barrier structures Z1. Similarly, the common electrode part 163 is divided into a first common electrode part 1631 and a second common electrode part 1632. The first common electrode part 1631 is disposed on the side of the first barrier structure Z1 away from the substrate 11, and the second common electrode part 1632 is disposed between two adjacent first barrier structures Z1. The second common electrode part 1632 conducts electricity between two adjacent first barrier structures Z1, thereby making at least a portion of the common electrode part 163 located in the transition region 200 charged. This causes the first barrier structure Z1 to be energized. Under the action of water and oxygen, the first barrier structure Z1 undergoes electrochemical corrosion, causing cracks to form in the encapsulation layer 17 in the transition region 200, forming a new water and oxygen intrusion path.

[0106] As shown in Figure 2, the display panel may further include a power-off structure 26 located between the substrate 11 and the encapsulation layer 17. The power-off structure 26 is disposed between the two first barrier structures Z11 closest to the barrier structure 20. The power-off structure 26 at least partially covers the side of the first barrier structure Z11 away from the substrate 11. In this way, the second common electrode portion 1632 between the two first barrier structures Z11 closest to the barrier structure 20 moves upward to the side of the power-off structure 26 away from the substrate 11. The second common electrode portion 1632 and the power-off structure 26 have a second light-emitting material portion 222. Therefore, the second common electrode portion 1632 between the two first barrier structures Z11 closest to the barrier structure 20 is disconnected from the two second common electrode portions 1632 on the side of the two first barrier structures Z11 closest to the barrier structure 20 that are far away from each other (for example, the second common electrode portion 1632 on the right side of the second first barrier structure Z1 from the left in the first barrier group Z in Figure 2), thus avoiding electrochemical corrosion of other first barrier structures Z11.

[0107] The display substrate further includes a second barrier group D located between the substrate 11 and the encapsulation layer 17, and between the barrier structure 20 and the display area 100. The second barrier group D includes at least one second barrier structure D1. The second barrier structure D1 has the same configuration as the first barrier structure Z1, that is, for example, the first barrier structure Z1 is in the same layer and made of the same material as the second source electrode 138, and the second barrier structure D1 is also in the same layer and made of the same material as the second source electrode 138; or for example, the first barrier structure Z1 is in the same layer and made of the same material as the first source electrode 135, and the second barrier structure D1 is also in the same layer and made of the same material as the first source electrode 135. Since the first barrier group Z is closer to the edge of the opening 30, the first barrier group Z plays a primary role in blocking moisture intrusion, and the second barrier group D plays a secondary role in blocking moisture intrusion. Therefore, the number of first barrier structures Z11 in the first barrier group Z can be greater than the number of second barrier structures D1 in the second barrier group D. For example, the first barrier group Z is equipped with seven first barrier structures Z11, and the second barrier group D is equipped with two second barrier structures D1.

[0108] In one possible implementation, referring to Figures 2, 8, and 9A-9J, Figure 8 is an enlarged schematic diagram of Figure 2 at the dashed frame S2, and Figures 9A-9J are schematic diagrams of the stacked layers and single film layers corresponding to the transition region 200 of Figure 2. The display substrate includes: an insulating layer J located between the first barrier group Z1 and the substrate 11; the insulating layer J includes: a first insulating portion J1 and a second insulating portion J2; the second insulating portion J2 is located on the side of the first insulating portion J1 facing the opening 30, and the thickness d6 of the second insulating portion J2 in the direction perpendicular to the substrate 11 is less than the thickness d5 of the first insulating portion J1 in the direction perpendicular to the substrate 11; the first barrier group Z is located in the area where the first insulating portion J1 is located, and the orthographic projection of the first barrier group Z on the substrate does not overlap with the orthographic projection of the second insulating portion J2 on the substrate 11;

[0109] The display substrate also includes: an integral and continuous protective structure Z3 located between the insulating layer J and the encapsulation layer 17; the protective structure Z3 partially covers the portion of the first insulating portion J1 on the side facing away from the substrate 11, partially covers the sidewall of the first insulating portion J1, and partially covers the portion of the second insulating portion J2 on the side facing away from the substrate 11.

[0110] In this embodiment of the present disclosure, the insulating layer J includes a first insulating portion J1 and a second insulating portion J2. The thickness of the second insulating portion J2 is less than the thickness of the first insulating portion J1. That is, by reducing the thickness of the insulating layer J on the side of the first barrier group Z facing the via area 300, the cutting difficulty when cutting to form the via 30 and the adverse risks generated during cutting can be reduced. Furthermore, by setting a protective structure Z3 in the boundary area with different thicknesses, the further propagation of cracks generated during cutting can be reduced or prevented, thereby enhancing the edge crack resistance.

[0111] Referring to Figures 9A-9J, in the transition region 200, as shown in Figure 9B, multiple first spacer portions 241 can be formed simultaneously with the formation of the first gate layer; as shown in Figure 9C, multiple second spacer portions 242 can be formed simultaneously with the formation of the second gate layer; as shown in Figure 9D, the interlayer dielectric layer 134 can be thinned on the side near the opening 30, that is, the interlayer dielectric layer 134 at the dashed box in Figure 9D is removed; as shown in Figure 9E, the compensation structure Z2 is formed simultaneously with the formation of the protective layer 137; as shown in Figure 9F, the first insulating layer 201 of the barrier structure 20 is formed simultaneously with the formation of the first planarization layer 141; as shown in Figure 9G... While forming the second source-drain layer, a first barrier structure Z1 is formed; referring to FIG9H, while forming the second planarization layer 142, a second insulating layer 202 of the barrier structure 20 is formed; referring to FIG9I, while forming the pixel defining layer 15, a third insulating layer 203 of the barrier structure 20 is formed; referring to FIG9J, while forming the spacer layer 150, a power-off structure 26 is formed, that is, the power-off structure 26 can be in the same layer and with the same material as the spacer layer 150; in another possible embodiment, in conjunction with FIG9I and FIG9J, the power-off structure 26 can also be a structure that combines the pattern of the pixel defining layer 15 with the pattern of the spacer layer 150.

[0112] In one possible implementation, as shown in Figure 2, the protective structure Z3 and the compensation structure Z2 are in the same layer and made of the same material. This allows the protective structure Z3 to be formed simultaneously with the compensation structure Z2, thereby reducing the fabrication complexity and cost of the display substrate.

[0113] In one possible implementation, the compensation structure Z2 is selected from one or a combination of the following:

[0114] First gate layer;

[0115] Second gate layer;

[0116] Third gate layer;

[0117] Interlayer dielectric layer 134;

[0118] Protective layer 137.

[0119] In one possible implementation, as shown in FIG3, the display substrate further includes: a protective layer 137 located between the substrate 11 and the encapsulation layer 17; and a compensation structure Z2 made of the same layer and material as the protective layer 137. That is, the compensation structure Z2 is formed simultaneously with the formation of the protective layer 137.

[0120] In one possible implementation, as shown in FIG4, the display substrate further includes: an interlayer dielectric layer 134 located between the substrate 11 and the encapsulation layer 17; and a compensation structure Z2 made of the same material as the interlayer dielectric layer 134. That is, the compensation structure Z2 is formed simultaneously with the formation of the interlayer dielectric layer 134. In other words, in addition to forming a conventional interlayer dielectric layer 134 pattern in the display area 100, multiple spaced-apart interlayer dielectric portions can be formed in the transition area 200 as the compensation structure Z2.

[0121] In one possible implementation, as shown in FIG5, the display substrate further includes: a first gate layer located between the substrate 11 and the encapsulation layer 17; a second gate layer located between the first gate layer and the encapsulation layer 17; and a third gate layer located between the second gate layer and the encapsulation layer 17. The compensation structure Z2 is in the same layer and made of the same material as the third gate layer. A second patterned portion 243 is formed concurrently with the formation of the third gate layer, serving as the compensation structure Z2.

[0122] In one possible implementation, as shown in FIG6, the display substrate further includes: a first gate layer located between the substrate 11 and the encapsulation layer 17, a second gate layer located between the first gate layer and the encapsulation layer 17, a third gate layer located between the second gate layer and the encapsulation layer 17, and a protective layer located between the third gate layer and the encapsulation layer 17; the compensation structure Z2 includes: a first pattern portion 1370, and a second pattern portion 243 located on the side of the first pattern portion 1370 away from the substrate 11; the first pattern portion 1370 is in the same layer and made of the same material as the third gate layer, and the second pattern portion 243 is in the same layer and made of the same material as the protective layer 137. That is, while forming the third gate layer, a second patterned portion 243 is also formed between the two first barrier structures Z1. While forming the protective layer 137, a first patterned portion 1370 is also formed between the two first barrier structures Z1. The second patterned portion 243 and the first patterned portion 1370 are stacked as a compensation structure Z2. This increases the height of the protrusion, thereby increasing the barrier capability against the organic encapsulation portion 1720. Furthermore, the gradually decreasing width of the compensation structure Z2 in the direction from the substrate 11 to the encapsulation layer 17 also facilitates the film formation of the first inorganic encapsulation layer 171. In some other embodiments, the compensation structure Z2 can also be a combination of the second patterned portion 243 and the interlayer dielectric portion; in other embodiments, the compensation structure Z2 can also be a combination of the second patterned portion 243, the interlayer dielectric portion, and the first patterned portion 1370.

[0123] In another possible implementation, referring to FIG7, in the transition region 200, the interlayer dielectric layer 134 includes: a plurality of first dielectric portions 1341 and a plurality of second dielectric portions 1342; the first dielectric portions 1341 and the second dielectric portions 1342 are separated from each other and have a first groove between them; the first dielectric portions 1341 are located between the first barrier structure Z1 and the substrate 11, and the orthographic projection of the first dielectric portion 1341 on the substrate 11 overlaps with the orthographic projection of the first barrier structure Z1 on the substrate 11; the second dielectric portions 1342 serve as compensation structures Z2. In this embodiment, in the transition region 200, the interlayer dielectric layer 134 is grooved, that is, the portion of the interlayer dielectric layer 134 located between the first barrier structure Z1 and the compensation structure Z2 is removed to form multiple first dielectric portions 1341 and multiple second dielectric portions 1342. The grooves in the interlayer dielectric layer 134 are more conducive to storing the organic encapsulation portion 1720. The second dielectric portions 1342 in the middle separate the organic encapsulation portion 1720. Compared with the pattern in FIG4 where the interlayer dielectric layer is formed only in the regions of two adjacent first barrier structures Z1, FIG7 forms the second dielectric portions 1342 in the regions of two adjacent first barrier structures Z1 and the first dielectric portions 1341 at the location of the first barrier structure Z1. There are more film layers, which is more conducive to forming the first inorganic encapsulation layer 171 into a bent shape, enhancing the extrusion performance and fracture resistance, and improving the mechanical strength.

[0124] Based on the same inventive concept, embodiments of this disclosure also provide a display panel, which includes a display substrate as provided in embodiments of this disclosure.

[0125] Based on the same inventive concept, embodiments of this disclosure also provide a display device, which includes a display panel as provided in embodiments of this disclosure.

[0126] Referring to Figure 10, based on the same inventive concept, this disclosure also provides a method for manufacturing a display substrate as provided in this disclosure, comprising:

[0127] Step S100: Form a first barrier group on one side of the substrate; wherein the first barrier group includes: at least one first barrier structure and at least one compensation structure;

[0128] Step S200: A first inorganic encapsulation layer and an organic encapsulation layer are formed on the side of the first barrier group away from the substrate; wherein, the organic encapsulation layer includes: a plurality of encapsulation portions;

[0129] Step S300: Thin the packaging portion between two adjacent first isolation structures by etching process.

[0130] In one possible implementation, corresponding to step S300, the packaging portion between two adjacent first isolation structures is thinned by an etching process, including:

[0131] The encapsulation portion between two adjacent first isolation structures is thinned by etching, so that the encapsulation portion is disconnected on both sides of the compensation structure.

[0132] In one possible implementation, corresponding to step S200, a first inorganic encapsulation layer is formed on the side of the first barrier group facing away from the substrate. The organic encapsulation layer includes:

[0133] A first inorganic encapsulation layer is formed on the side of the first barrier group that is away from the substrate;

[0134] Using the sidewall of the barrier structure facing the display area as the outer boundary, an organic liquid is printed to form an organic encapsulation layer.

[0135] In conventional techniques, organic liquid is typically printed at the outer boundary of the display area (or at a preset distance from the outer boundary of the display area). Due to the fluidity of the organic liquid, it will flow to areas outside the display area, but is usually blocked by the baffle structure within the baffle structure. However, in this embodiment, since organic liquid also needs to be placed in the transition area, the organic liquid can be printed with the inner side of the baffle structure facing the display area as the outer boundary. Due to the fluidity of the organic liquid, it can cross the baffle structure and form organic liquid between two adjacent first barrier structures in the transition area, thereby forming the encapsulation part in the subsequent process.

[0136] In some embodiments, the display device provided in this disclosure can be any product or component with display function, such as a projector, 3D printer, virtual reality device, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, smartwatch, fitness wristband, or personal digital assistant. Optionally, the display device provided in this disclosure includes, but is not limited to, components such as a radio frequency unit, network module, audio output & input unit, sensor, display unit, user input unit, interface unit, and control chip. Optionally, the control chip is a central processing unit, digital signal processor, system-on-a-chip (SoC), etc. For example, the control chip may also include a memory, a power module, etc., and achieve power supply and signal input / output functions through additionally provided wires, signal lines, etc. For example, the control chip may also include hardware circuits and computer-executable code. The hardware circuit may include conventional very-large-scale integrated circuits (VLSI) or gate arrays, as well as existing semiconductors or other discrete components such as logic chips and transistors; the hardware circuit may also include field-programmable gate arrays, programmable array logic, programmable logic devices, etc. Furthermore, those skilled in the art will understand that the above structure does not constitute a limitation on the display device provided in the embodiments of this disclosure. In other words, the display device provided in the embodiments of this disclosure may include more or fewer of the above components, or combine certain components, or have different component arrangements.

[0137] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0138] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if these modifications and variations to the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations.

Claims

A display substrate has an opening area, a display area, and a transition area connecting the display area and the opening area, wherein the opening area has an opening, wherein... The display substrate includes: Substrate; A first barrier group is located on one side of the substrate and in the transition region; the first barrier group includes: at least one first barrier structure and at least one compensation structure; in the direction from the opening area to the display area, the first barrier structure and the compensation structure alternately surround the opening, the surface of the compensation structure facing away from the substrate has a first distance from the substrate, and the surface of the first barrier structure facing away from the substrate has a second distance from the substrate, the first distance and the second distance being different; An encapsulation layer is located on the side of the first barrier group away from the substrate. The encapsulation layer includes: a first inorganic encapsulation layer and an organic encapsulation layer located on the side of the first inorganic encapsulation layer away from the first barrier group. The organic encapsulation layer includes: a plurality of encapsulation portions. At least one of the plurality of encapsulation portions has its orthographic projection on the substrate located in the region between the orthographic projections of adjacent first barrier structures on the substrate. The display substrate as claimed in claim 1, wherein, The encapsulation portion includes: two sub-encapsulation portions and a first gap located between the two sub-encapsulation portions; the orthographic projections of the two sub-encapsulation portions of the same encapsulation portion on the substrate are respectively located on both sides of the orthographic projection of the compensation structure on the substrate; the orthographic projection of the first gap on the substrate overlaps with the orthographic projection of the compensation structure on the substrate. The display substrate as described in claim 1 or 2, wherein, The compensation structure and the first barrier structure have a second gap; the first inorganic encapsulation layer covers the first barrier structure, the compensation structure, and fills the second gap. The display substrate as described in any one of claims 1-3, wherein, The first inorganic encapsulation layer includes: a first sub-encapsulation portion, a second sub-encapsulation portion, and a third sub-encapsulation portion; the orthographic projection of the first sub-encapsulation portion on the substrate overlaps with the orthographic projection of the first barrier structure on the substrate, the orthographic projection of the third sub-encapsulation portion on the substrate overlaps with the orthographic projection of the compensation structure on the substrate, and the second sub-encapsulation portion connects the first sub-encapsulation portion and the third sub-encapsulation portion. The first sub-package portion has a third distance between itself and the substrate on the side facing away from the substrate, which is greater than the third sub-package portion has a fourth distance between itself and the substrate on the side facing away from the substrate, and the third distance is greater than the fourth distance. The display substrate as claimed in claim 4, wherein, The first sub-package portion, the second sub-package portion, and the third sub-package portion form a recess on the side away from the substrate, and the sub-package portion fills the recess. The display substrate according to any one of claims 1-5, wherein, The first distance is less than the second distance. The display substrate according to any one of claims 2-6, wherein, The encapsulation layer further includes: a second inorganic encapsulation layer located on the side of the organic encapsulation layer opposite to the first inorganic encapsulation layer; In the region between the first barrier structure and the compensation structure, the second inorganic encapsulation layer has the sub-encapsulation portion between the first inorganic encapsulation layer and the second inorganic encapsulation layer; in the region where the compensation structure is located, the second inorganic encapsulation layer is in contact with the first inorganic encapsulation layer. The display substrate as described in any one of claims 1-7, wherein, The display substrate includes: an insulating layer located between the first barrier group and the substrate; the insulating layer includes: a first insulating portion and a second insulating portion; the second insulating portion is located on the side of the first insulating portion facing the opening, and the thickness of the second insulating portion in the direction perpendicular to the substrate is less than the thickness of the first insulating portion in the direction perpendicular to the substrate; the first barrier group is located in the area where the first insulating portion is located, and the orthographic projection of the first barrier group on the substrate does not overlap with the orthographic projection of the second insulating portion on the substrate; The display substrate further includes: an integral and continuous protective structure located between the insulating layer and the encapsulation layer; the protective structure partially covers the surface of the first insulating portion away from the substrate, partially covers the sidewall of the first insulating portion, and partially covers the surface of the second insulating portion away from the substrate. The display substrate as claimed in claim 8, wherein, The protective structure and the compensation structure are made of the same layer and material. The display substrate according to any one of claims 1-9, wherein, The display substrate further includes: a protective layer located between the substrate and the encapsulation layer; the compensation structure is of the same layer and material as the protective layer. The display substrate according to any one of claims 1-9, wherein, The display substrate further includes: an interlayer dielectric layer located between the substrate and the encapsulation layer; the compensation structure is of the same layer and material as the interlayer dielectric layer. The display substrate according to any one of claims 1-9, wherein, The display substrate further includes: a first gate layer located between the substrate and the encapsulation layer, a second gate layer located between the first gate layer and the encapsulation layer, and a third gate layer located between the second gate layer and the encapsulation layer; The compensation structure is made of the same material as the third gate layer. The display substrate according to any one of claims 1-9, wherein, The display substrate further includes: a first gate layer located between the substrate and the encapsulation layer, a second gate layer located between the first gate layer and the encapsulation layer, a third gate layer located between the second gate layer and the encapsulation layer, and a protective layer located between the third gate layer and the encapsulation layer; The compensation structure includes: a first patterned portion and a second patterned portion located on the side of the first patterned portion away from the substrate; the first patterned portion is in the same layer and material as the third gate layer, and the second patterned portion is in the same layer and material as the protective layer. The display substrate according to any one of claims 1-9, wherein, The display substrate further includes an interlayer dielectric layer located on one side of the substrate; the interlayer dielectric layer includes a plurality of first dielectric portions and a plurality of second dielectric portions; the first dielectric portions and the second dielectric portions are separated from each other, and a first groove is formed between them; The first dielectric portion is located between the first barrier structure and the substrate, and the orthographic projection of the first dielectric portion on the substrate overlaps with the orthographic projection of the first barrier structure on the substrate; the second dielectric portion serves as the compensation structure. The display substrate according to any one of claims 1-14, wherein, The display substrate further includes: a barrier structure located between the substrate and the encapsulation layer, and between the first barrier group and the display area; The surface of the retaining wall structure facing away from the substrate has a fifth distance from the substrate, which is greater than the second distance. The display substrate as claimed in claim 15, wherein, The display substrate further includes: a power-off structure located between the substrate and the encapsulation layer; the power-off structure is located between the two first barrier structures closest to the barrier structure, and the power-off structure covers at least a portion of the surface of the first barrier structure facing away from the substrate. The display substrate as described in claim 15 or 16, wherein, The display substrate further includes a second barrier group located between the substrate and the encapsulation layer, and between the barrier structure and the display area; the second barrier group includes at least one second barrier structure; the second barrier structure has the same configuration as the first barrier structure. The display substrate according to any one of claims 1-17, wherein, The display substrate further includes: a first source-drain layer located between the substrate and the encapsulation layer, and a second source-drain layer located between the first source-drain layer and the encapsulation layer; One of the first source-drain layer and the second source-drain layer is made of the same layer and material as the first barrier structure. The display substrate as claimed in claim 18, wherein, The first barrier structure includes: a first barrier portion, a second barrier portion located on the side of the first barrier portion away from the substrate, and a third barrier portion located on the side of the second barrier portion away from the substrate; In the direction from the display area to the opening area, the width of the second barrier is smaller than the width of the first barrier and smaller than the width of the third barrier. The display substrate according to any one of claims 1-19, wherein, The display substrate further includes: a light-emitting layer located between the first barrier group and the encapsulation layer, and a common electrode layer located between the light-emitting layer and the encapsulation layer; the light-emitting layer includes: a plurality of first light-emitting portions and a plurality of second light-emitting portions; the common electrode layer includes: a plurality of first common electrode portions and a plurality of second common electrode portions; The orthographic projection of the first light-emitting part onto the substrate overlaps with the orthographic projection of the first barrier structure onto the substrate; the orthographic projection of the second light-emitting part onto the substrate is located on both sides of the orthographic projection of the first barrier structure onto the substrate; at least a portion of the first light-emitting part is disconnected from the adjacent second light-emitting part. The orthographic projection of the first common electrode portion onto the substrate overlaps with the orthographic projection of the first barrier structure onto the substrate; the orthographic projection of the second common electrode portion onto the substrate is located on both sides of the orthographic projection of the first barrier structure onto the substrate; at least a portion of the first common electrode portion is disconnected from the adjacent second common electrode portion. A display panel, wherein, Includes the display substrate as described in any one of claims 1-20. A display device, wherein, Includes the display panel as described in claim 21. A method for manufacturing a display substrate as described in any one of claims 1-20, wherein, include: A first barrier group is formed on one side of the substrate; wherein the first barrier group includes: at least one first barrier structure and at least one compensation structure; An inorganic encapsulation layer and an organic encapsulation layer are formed on the side of the first barrier group facing away from the substrate; wherein the organic encapsulation layer includes: a plurality of encapsulation portions; The encapsulation portion between two adjacent first isolation structures is thinned by an etching process. The manufacturing method as described in claim 23, wherein, The process of thinning the package portion between two adjacent first isolation structures through etching includes: The encapsulation portion between two adjacent first isolation structures is thinned by an etching process, so that the encapsulation portion is disconnected on both sides of the compensation structure. The manufacturing method as described in claim 23 or 24, wherein, The first inorganic encapsulation layer and the organic encapsulation layer are formed on the side of the first barrier group opposite to the substrate, comprising: The first inorganic encapsulation layer is formed on the side of the first barrier group that is away from the substrate; Using the sidewall of the barrier structure facing the display area as the outer boundary, an organic liquid is printed to form the organic encapsulation layer.

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