Optical network device

Abstract

An optical network device, applied to FTTH or FTTR systems. The optical network device comprises a housing (1), an optical network component (2) and a first heat sink (3). The optical network component (2) is located inside the housing (1); the optical network component (2) comprises a photoelectric converter (22), and the housing wall of the housing (1) opposite the photoelectric converter (22) comprises a first opening (111). The first heat sink (3) comprises a first plate body (31) and a first boss (32), wherein the first plate body (31) is located outside the housing (1), and the first boss (32) passes through the first opening and is thermally connected to the photoelectric converter (22).

Description

Optical network equipment

[0001] This disclosure claims priority to Chinese Patent Application No. 202520320220.6, filed on February 25, 2025, entitled "Optical Network Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of communication technology, and in particular to an optical network device. Background Technology

[0003] Optical network equipment, such as optical network units (ONUs) or optical network terminals (ONTs), includes photoelectric converters (PDCs) for performing photoelectric conversion. PDCs are heat-sensitive components. Therefore, improving the heat dissipation efficiency of PDCs is a key technical issue. Summary of the Invention

[0004] This disclosure provides an optical network device. The photoelectric converter of the optical network device is cooled by an independent heat sink, resulting in high heat dissipation efficiency. The technical solution of the optical network device is described below.

[0005] This disclosure provides an optical network device. The optical network device includes a housing, an optical network device, and a first heat sink. The optical network device is located inside the housing and includes a photoelectric converter. The housing wall opposite the photoelectric converter includes a first opening. The first heat sink includes a first plate and a first boss. The first plate is located outside the housing, and the first boss passes through the first opening and is thermally connected to the photoelectric converter.

[0006] Among them, optical network devices are used to realize the corresponding functions of optical network equipment. Optical network devices include circuit boards and various electrical and optical components located on the circuit boards. The first boss is thermally connected to the photoelectric converter; this can be achieved by the first boss abutting against the photoelectric converter, or by placing a thermal pad between the first boss and the photoelectric converter, with one side of the thermal pad adhering to the first boss and the other side adhering to the photoelectric converter.

[0007] The technical solution provided in this disclosure provides a first opening in the housing, and a first protrusion of a first heat sink passes through the first opening and is thermally connected to the photoelectric converter. This allows the photoelectric converter to dissipate heat through an independent first heat sink, reducing the impact of heat dissipated by other heat-generating devices in the optical network device on the photoelectric converter and improving the heat dissipation efficiency of the photoelectric converter.

[0008] In one implementation, a plurality of protrusions are provided between the shell and the first plate, with one end of the protrusion abutting against the outer wall of the shell and the other end abutting against the first plate, so that there is a first gap between the first plate and the shell.

[0009] The technical solution provided in this disclosure reduces the thermal conductivity between the first plate and the housing by setting a first gap between them. This prevents heat from other heat-generating components in the optical network device from being conducted to the housing and then further transferred to the first heat sink, thus reducing the impact of heat from other components on the photoelectric converter and improving its reliability.

[0010] In one implementation, the protrusion is fixed to the outer wall of the housing. The protrusion can be integrally formed onto the outer wall of the housing.

[0011] In one implementation, the first heat sink further includes a shielding plate that passes through the first opening and surrounds the photoelectric converter. In this way, the first heat sink can not only dissipate heat from the photoelectric converter but also provide electromagnetic shielding.

[0012] In one implementation, the shielding enclosure surrounds the first protrusion, or the shielding enclosure is located on the side of the first protrusion facing the photoelectric converter.

[0013] In one implementation, the optical network device further includes a heat-generating device, which is located on the same circuit board as the photoelectric converter. The housing wall opposite the heat-generating device includes a second opening. The optical network device also includes a second heat sink, which includes a second plate and a second boss. The second plate is located outside the housing, and the second boss passes through the second opening and is thermally connected to the heat-generating device.

[0014] The technical solution provided in this disclosure improves the heat dissipation efficiency of heat-generating devices by providing a second protrusion on the second heat sink to thermally connect with the heat-generating devices on the first circuit board, excluding the photoelectric converter. Furthermore, since the heat-generating devices dissipate heat through the second heat sink, rather than sharing the first heat sink with the photoelectric converter, the impact of heat dissipation from the heat-generating devices on the photoelectric converter is reduced, thus improving the reliability of the photoelectric converter.

[0015] In one implementation, a second gap exists between the first plate and the second plate. This results in a lower thermal conductivity between the first and second heat sinks, reducing the impact of heat from the second heat sink on the photoelectric converter.

[0016] In one implementation, there is a gap between the first plate and the shell, the second plate is attached to the shell, and the thickness of the second plate is greater than the thickness of the first plate, so that the bottom walls of the first plate and the second plate are flush or nearly flush.

[0017] In one implementation, the photoelectric converter includes a bidirectional optical sub-assembly (BOSA), which is mounted on a circuit board in a BOSA-on-board (BOB) configuration. This BOSA facilitates heat dissipation compared to using a complete optical module as the photoelectric converter.

[0018] In one implementation, the housing includes a bottom shell and a front panel, with a receiving cavity formed between the bottom shell and the front panel for accommodating optical network devices. The bottom shell includes a bottom wall disposed opposite to the front panel, and the bottom wall includes a first opening. Attached Figure Description

[0019] Figure 1 is a schematic diagram of an FTTH system architecture;

[0020] Figure 2 is a schematic diagram of a home network system;

[0021] Figure 3 is a schematic diagram of another home network system;

[0022] Figure 4 is a schematic diagram of an optical network device provided in an embodiment of this disclosure;

[0023] Figure 5 is a schematic diagram of an optical network device provided in an embodiment of this disclosure;

[0024] Figure 6 is an exploded view of an optical network device provided in an embodiment of this disclosure;

[0025] Figure 7 is a schematic diagram of an optical network device provided in an embodiment of this disclosure;

[0026] Figure 8 is a schematic diagram of the bottom of an optical network device provided in an embodiment of this disclosure;

[0027] Figure 9 is a schematic diagram of a housing, a first heat sink, and a photoelectric converter provided in an embodiment of this disclosure;

[0028] Figure 10 is a schematic diagram of a first heat sink provided in an embodiment of this disclosure;

[0029] Figure 11 is a schematic diagram of a first heat sink and a photoelectric converter provided in an embodiment of this disclosure;

[0030] Figure 12 is a partial schematic diagram of an optical network device provided in an embodiment of this disclosure;

[0031] Figure 13 is a schematic diagram of another first heat sink provided in an embodiment of this disclosure;

[0032] Figure 14 is a schematic diagram of another first heat sink and photoelectric converter provided in an embodiment of this disclosure;

[0033] Figure 15 is a schematic diagram of a first circuit board and related devices provided in an embodiment of this disclosure;

[0034] Figure 16 is a schematic diagram of a housing, a first radiator, and a second radiator provided in an embodiment of this disclosure;

[0035] Figure 17 is a schematic diagram of a second heat sink provided in an embodiment of this disclosure.

[0036] Legend: 1. Housing, 11. Bottom shell, 110. Protrusion, 111. First opening, 112. Second opening, 12. Front panel; 2. Optical network device, 201. First circuit board, 202. Second circuit board, 203. Third circuit board, 204. Fourth circuit board, 21. Optical port connector, 22. Optoelectronic converter, 23. Main chip, 24. First network port connector, 25. Power interface connector, 26. Transformer, 27. Ethernet physical layer chip, 28. Second network port connector; 3. First heat sink, 30. First gap, 31. First plate, 32. First boss, 33. Shielding enclosure, 331. Opening; 4. Second heat sink, 40. Second gap, 41. Second plate, 42. Second boss; 5. Thermal pad. Detailed Implementation

[0037] Fiber to the home (FTTH) refers to a carrier's network directly connecting to a home via an optical distribution network (ODN) and then linking to an optical network unit (ONU) installed inside the home. Figure 1 shows a schematic diagram of an FTTH system architecture. As shown in Figure 1, an FTTH system includes an optical line terminal (OLT), an ODN, and ONUs. The OLT is located in a central equipment room and is connected to a switch. The OLT connects to the ONUs inside the home via the ODN. The ODN includes a splitter, a backbone fiber connecting the splitter and the OLT, and branch fibers connecting the splitter and the ONUs. The OLT, ONUs, and the ODN located between the OLT and ONUs constitute a passive optical network (PON). The ONU can also be replaced by an optical network terminal (ONT).

[0038] After fiber optic cables are installed in the home, there are two technical solutions to address the signal coverage issue in each room. As shown in Figure 2, the first solution involves an ONU containing multiple network port connectors. These connectors are connected to terminal devices in each room via multiple network cables. These terminal devices can be computers, cameras, or wireless access points (APs), etc.

[0039] As shown in Figure 3, the second technical solution involves using the ONU in Figure 1 as the master ONU and setting up slave ONUs in each room. The master ONU is connected to the slave ONUs in each room via multiple optical fibers. Each slave ONU includes a network connector, which connects to terminal devices in the room via network cables. These terminal devices can be computers, cameras, or access points (APs), etc. This technology is called Fiber to the Room (FTTR).

[0040] The optical network device provided in this disclosure can be an ONU as shown in Figure 2, a master ONU as shown in Figure 3, or a slave ONU. The ONU includes a photoelectric converter for performing photoelectric conversion. The photoelectric converter is a heat-sensitive component; therefore, improving its heat dissipation efficiency is a key technical issue. This is especially important for ONUs with small device size, high heat density, and limited installation space. For example, in ONUs conforming to the international M45 standard, the panel size is 45mm × Nmm, where N is an integer multiple of 45, such as 45 or 90.

[0041] In view of the above-mentioned technical problems, this disclosure provides an optical network device, which can be any of the aforementioned ONUs or ONTs. Figures 4 and 5 show external views of the optical network device. Figure 6 shows an exploded view of the optical network device. As shown in Figure 6, the optical network device includes a housing 1 (including a bottom housing 11 and a front panel 12) and an optical network device 2. The optical network device 2 is used to implement the relevant functions of the optical network device, and includes a circuit board and devices located on the circuit board. The optical network device 2 includes at least a photoelectric converter 22.

[0042] Figure 7 shows a schematic diagram of an optical network device 2. In some examples, as shown in Figure 7, the optical network device includes a first circuit board 201, a second circuit board 202, a third circuit board 203, and a fourth circuit board 204. The first circuit board 201 has an optical port connector 21 and a photoelectric converter 22. The second circuit board 202 has a power interface connector 25 and corresponding power management circuitry. The third circuit board 203 has a main chip 23. The fourth circuit board 204 has a first network port connector 24.

[0043] The optical connector 21 is optically connected to the opto-converter 22, and the main chip 23 is electrically connected to both the opto-converter 22 and the first network connector 24. When transmitting downlink signals, the opto-converter 22 receives the downlink optical signal through the optical connector 21, converts it into a downlink electrical signal, and sends it to the main chip 23. The main chip 23 processes the downlink electrical signal and sends it through the first network connector 24. When transmitting uplink signals, the main chip 23 receives the uplink electrical signal through the first network connector 24, processes it, and sends it to the opto-converter 22. The opto-converter 22 converts the uplink electrical signal into an uplink optical signal and sends it outwards through the optical connector 21. The main chip 23 can also be referred to as a system-on-a-chip (SOC).

[0044] It should be noted that the optical network device 2 shown in Figure 7 belongs to the ONU in Figure 2 or the slave ONU in Figure 3. In some other examples, the first network port connector 24 in the above-mentioned optical network device 2 can be replaced with an optical port connector, and a photoelectric converter is added between the optical port connector and the main chip 23. In this case, the optical network device 2 belongs to the master ONU in Figure 3. Of course, the optical network device 2 shown in Figure 7 is just an example, and the optical network device 2 can be of any form.

[0045] The heat dissipation method of the photoelectric converter 22 will be described below by way of example.

[0046] In some examples, as shown in Figures 8 and 9, the optical network device further includes a first heat sink 3, and a first opening 111 is included on the wall of the housing 1 opposite to the photoelectric converter 22. As shown in Figure 10, the first heat sink 3 includes a first plate 31 and a first boss 32. The first plate 31 is located outside the housing 1, and the first boss 32 passes through the first opening 111 and is thermally connected to the photoelectric converter 22 (as shown in Figure 11). The thermal connection between the first boss 32 and the photoelectric converter 22 can be achieved by the first boss 32 abutting against the photoelectric converter 22, or by a thermal pad 5 placed between the first boss 32 and the photoelectric converter 22, with one side of the thermal pad 5 adhering to the first boss 32 and the other side adhering to the photoelectric converter 22 (as shown in Figure 11).

[0047] The technical solution provided in this disclosure provides a first opening 111 in the housing 1, and a first protrusion 32 of the first heat sink 3 passes through the first opening 111 and is thermally connected to the photoelectric converter 22. This allows the photoelectric converter 22 to dissipate heat through an independent heat sink, reducing the impact of heat emitted by other heat-generating devices (such as the main chip 23) on the photoelectric converter 22, and improving the heat dissipation efficiency and reliability of the photoelectric converter 22.

[0048] In some examples, as shown in Figures 9 and 12, a plurality of protrusions 110 are provided between the housing 1 and the first plate 31. One end of the protrusion 110 abuts against the outer wall of the housing 1 and the other end abuts against the first plate 31, so that there is a first gap 30 between the housing 1 and the first plate 31.

[0049] The technical solution provided in this disclosure reduces the thermal conductivity between the first plate 31 and the housing 1 by setting a first gap 30 between them. This reduces the thermal conductivity between the housing 1 and the first plate 31. Consequently, heat from other heat-generating components (such as the main chip 23) in the optical network device, after being conducted to the housing 1, is less likely to be conducted from the housing 1 to the first heat sink 3, further reducing the impact of heat dissipated by other heat-generating components on the photoelectric converter 22 and improving the heat dissipation efficiency and reliability of the photoelectric converter 22.

[0050] In some examples, as shown in Figure 9, the protrusion 110 is provided on the housing 1. For example, the protrusion 110 is integrally formed on the outer wall of the bottom housing 11.

[0051] In some examples, as shown in Figure 13, the first heat sink 3 further includes a shielding plate 33, which passes through the first opening 111 and surrounds the photoelectric converter 22 (as shown in Figure 14). In this way, the first heat sink 3 can not only dissipate heat from the photoelectric converter 22 but also provide electromagnetic shielding for it. Additionally, as shown in Figures 13 and 14, the shielding plate 33 includes an opening 331 through which the optical connector 21 or the optical portion of the photoelectric converter 22 passes.

[0052] In some examples, as shown in Figure 13, the shielding plate 33 surrounds the first boss 32. Alternatively, the shielding plate 33 is disposed on the side of the first boss 32 facing the photoelectric converter 22.

[0053] In some examples, as shown in Figure 7, the photoelectric converter 22 includes a bidirectional optical sub-assembly (BOSA), which is mounted on a circuit board in a BOSA-on-board (BOB) configuration. This allows for better heat dissipation compared to using a complete optical module as the photoelectric converter 22. The BOSA is thermally connected to the first boss 32 and is surrounded by a shielding plate 33.

[0054] In some examples, the optoelectronic network device also includes other heat-generating devices located on the same circuit board as the optoelectronic converter 22. For example, as shown in Figure 15, the first circuit board 201 has an optical port connector 21, an optoelectronic converter 22, a transformer 26, an Ethernet physical layer chip 27, and a second network port connector 28. The transformer 26 and the Ethernet physical layer chip 27 are heat-generating devices. The input of the transformer 26 is connected to the power board (second circuit board 202), and the output of the transformer 26 is connected to the optoelectronic converter 22 and the main chip 23, respectively. The transformer 26 is used to step down the voltage of the power output from the power board to supply power to the optoelectronic converter 22 and the main chip 23. The transformer 26 can be a 56V to 12V transformer. The Ethernet physical layer chip 27 is electrically connected to the main chip 23 and the second network port connector 28, respectively. The second network port connector 28 and the first network port connector 24 have different speeds. In some examples, the speed of the first network port connector 24 is GE, and the speed of the second network port connector 28 is 10GE. The Ethernet physical layer chip can also be called a PHY (physical layer chip) chip.

[0055] As shown in Figure 16, the wall of the housing 1 opposite to the heat-generating device also includes a second opening 112, which is disposed opposite to the heat-generating device. The optical network device also includes a second heat sink 4, as shown in Figure 17. The second heat sink 4 includes a second plate 41 and a second protrusion 42. The second plate 41 is located outside the bottom housing 11, and the second protrusion 42 passes through the second opening 112 and is thermally connected to the heat-generating device.

[0056] The technical solution provided in this disclosure improves the heat dissipation efficiency of heat-generating devices by providing a second protrusion 42 that is thermally connected to heat-generating devices on the first circuit board 201 other than the photoelectric converter 22. Furthermore, the heat-generating devices dissipate heat through the second heat sink 4, instead of sharing the first heat sink 3 with the photoelectric converter 22, reducing the impact of heat emitted by these devices on the photoelectric converter 22 and improving its reliability.

[0057] In some examples, as shown in Figure 17, the second heat sink 4 includes three second protrusions 42. One second protrusion 42 supports the second network port connector 28, one second protrusion 42 is used for thermally conductive connection with the Ethernet physical layer chip 27, and the other second protrusion 42 is used for thermally conductive connection with the transformer 26. The thermal connection between the second protrusion 42 and the Ethernet physical layer chip 27 can be achieved by either the second protrusion 42 being attached to the Ethernet physical layer chip 27 or by a thermal pad 5 being placed between the second protrusion 42 and the Ethernet physical layer chip 27. Similarly, the thermal connection between the second protrusion 42 and the transformer 26 can also be achieved by either the second protrusion 42 being attached to the transformer 26 or by a thermal pad 5 being placed between the second protrusion 42 and the transformer 26.

[0058] In some examples, as shown in Figures 8 and 12, a second gap 40 is provided between the first heat sink 3 and the second heat sink 4. This reduces the thermal conductivity between the first heat sink 3 and the second heat sink 4, further reducing the heat dissipated by other heat-generating devices on the first circuit board 201 and its impact on the photoelectric converter 22.

[0059] In some examples, as shown in Figure 12, there is a first gap 30 between the first plate 31 and the bottom shell 11, and the second plate 41 is fitted to the bottom shell 11. Furthermore, the thickness of the second plate 41 is greater than the thickness of the first plate 31. This makes the bottom walls of the first plate 31 and the second plate 41 flush or nearly flush.

[0060] The specific locations of the first opening 111 and the second opening 112 described in this embodiment are not limited. In some examples, as shown in Figures 9 and 16, the housing 1 includes a bottom shell 11 and a front panel 12, with a receiving cavity formed between the bottom shell 11 and the front panel 12 for accommodating the optical network device 2. The bottom shell 11 includes a bottom wall, which is disposed opposite to the front panel 12, and the bottom wall includes the first opening 111, and may also include the second opening 112.

[0061] It should be noted that the optical network device provided in this embodiment can conform to the M45 standard, and the panel 102 of the optical network device has a size of 45mm × 90mm.

[0062] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. An optical network device, characterized in that, The optical network device includes a housing (1), an optical network device (2), and a first heat sink (3); The optical network device (2) is located inside the housing (1). The optical network device (2) includes a photoelectric converter (22). The housing wall of the housing (1) opposite to the photoelectric converter (22) includes a first opening (111). The first heat sink (3) includes a first plate (31) and a first boss (32). The first plate (31) is located outside the housing (1). The first boss (32) passes through the first opening (111) and is thermally connected to the photoelectric converter (22).

2. The optical network device according to claim 1, characterized in that, A plurality of protrusions (110) are provided between the housing (1) and the first plate (31). One end of the protrusion (110) abuts against the outer wall of the housing (1) and the other end abuts against the first plate (31) so that there is a first gap (30) between the first plate (31) and the housing (1).

3. The optical network device according to claim 2, characterized in that, The protrusion (110) is fixed to the outer wall of the housing (1).

4. The optical network device according to any one of claims 1-3, characterized in that, The first heat sink (3) also includes a shielding plate (33) that passes through the first opening (111) and surrounds the photoelectric converter (22).

5. The optical network device according to claim 4, characterized in that, The shielding plate (33) surrounds the first boss (32), or the shielding plate (33) is disposed on the side of the first boss (32) facing the photoelectric converter (22).

6. The optical network device according to any one of claims 1-5, characterized in that, The optical network device (2) also includes a heating device, which is located on the same circuit board as the photoelectric converter (22). The housing (1) has a second opening (112) on its shell wall opposite to the heating device. The optical network device further includes a second heat sink (4), which includes a second plate (41) and a second boss (42). The second plate (41) is located outside the housing (1), and the second boss (42) passes through the second opening (112) and is thermally connected to the heat-generating device.

7. The optical network device according to claim 6, characterized in that, There is a second gap (40) between the first plate (31) and the second plate (41).

8. The optical network device according to claim 6 or 7, characterized in that, There is a first gap (30) between the first plate (31) and the shell (1), the second plate (41) is attached to the shell (1), and the thickness of the second plate (41) is greater than the thickness of the first plate (31).

9. The optical network device according to any one of claims 1-8, characterized in that, The photoelectric converter (22) includes a bidirectional optical component (BOSA), which is mounted on a circuit board and is thermally connected to the first boss (32).

10. The optical network device according to any one of claims 1-9, characterized in that, The housing (1) includes a bottom shell (11) and a panel (12), and a receiving cavity for accommodating the optical network device (2) is formed between the bottom shell (11) and the panel (12); The bottom shell (11) includes a bottom wall, which is disposed opposite to the panel (12), and the bottom wall includes the first opening (111).

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