Liquid cooling heat dissipation device and server

Abstract

The present application relates to the technical field of server heat dissipation, and discloses a liquid cooling heat dissipation device and a server. The liquid cooling heat dissipation device comprises: a main heat exchange flow channel; and a board heat exchange mechanism, comprising a fixed shaft, a quick locking assembly, and board heat exchange sub-boards, wherein the board heat exchange sub-boards are sleeved on the fixed shaft, so that the board heat exchange sub-boards rotate around the fixed shaft and slide in the axial direction of the fixed shaft, the board heat exchange sub-boards are used for clamping corresponding boards, and the quick locking assembly is used for abutting the board heat exchange sub-boards against the main heat exchange flow channel. When a board needs to be replaced, only the quick locking assembly needs to be opened, and the corresponding board heat exchange sub-board is rotated around the fixed shaft, so that the board can be taken out and replaced with a new board, without detaching the board heat exchange sub-board for demounting and mounting. The present application supports independent maintenance involving demounting and mounting of a board, greatly improving the flexibility, convenience, and safety of production, testing, and operation and maintenance.

Description

Liquid cooling heat dissipation device and server

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202510222608.7, filed on February 27, 2025, entitled "Liquid Cooling Device and Server", and to Chinese Patent Application No. 202510222702.2, filed on February 27, 2025, entitled "Liquid Cooling Device and Server", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of server heat dissipation technology, and in particular to a liquid cooling heat dissipation device and a server. Background Technology

[0004] With the development of society and the economy, especially with the advancement of artificial intelligence technology, higher demands are being placed on the computing power of IT equipment such as servers, leading to a rapid increase in the power consumption of server boards. At the same time, higher requirements are being placed on the deployment density of IT equipment such as servers, making liquid cooling technology the best choice to meet the high-density, high-power heat dissipation needs of servers.

[0005] However, in related technologies, with the iterative upgrades of servers, the spacing between adjacent card slots in servers is becoming smaller and smaller, while the frequency of card replacement is relatively high. As a result, the liquid cooling device for dissipating heat from the cards in the server faces difficulties in installation, operation and maintenance.

[0006] Furthermore, in related technologies, due to the increasingly compact layout of processors and memory in servers, liquid cooling devices for server heat dissipation present difficulties in installation, operation, and maintenance. Summary of the Invention

[0007] This application provides a liquid cooling heat dissipation device and a server to at least solve the problems of difficult installation and operation and maintenance of circuit boards and liquid cooling heat dissipation devices in the related art, as well as the problems of difficult installation and operation and maintenance of memory and liquid cooling heat dissipation devices in the related art.

[0008] This application provides a liquid cooling heat dissipation device, including:

[0009] Main heat exchanger flow channel;

[0010] The plate heat exchange mechanism includes a fixed shaft, a quick-locking assembly, and multiple plate heat exchange sub-plates. The plate heat exchange sub-plates are mounted on the fixed shaft to allow them to rotate around the fixed shaft and slide axially along the fixed shaft. The plate heat exchange sub-plates are used to clamp corresponding plates. The quick-locking assembly is used to fix the multiple plate heat exchange sub-plates and abut them against the main heat exchange channel so that the plate heat exchange sub-plates can exchange heat with the main heat exchange channel.

[0011] This application also provides another liquid cooling heat dissipation device, including:

[0012] Main heat exchanger flow channel;

[0013] The processor heat exchange mechanism is used to dissipate heat from the processor. The processor heat exchange mechanism is detachably connected to the main heat exchange channel via a quick connector assembly, so that the processor heat exchange mechanism is connected to the main heat exchange channel.

[0014] The memory heat exchange mechanism includes a fixed shaft, a quick-locking assembly, and multiple memory heat exchange sub-plates. The memory heat exchange sub-plates are mounted on the fixed shaft to allow them to rotate around the fixed shaft and slide axially along the fixed shaft. The memory heat exchange sub-plates are used to clamp the corresponding memory modules. The quick-locking assembly is used to fix the multiple memory heat exchange sub-plates and abut them against the main heat exchange channel so that the memory heat exchange sub-plates can exchange heat with the main heat exchange channel.

[0015] This application also provides a server, including any of the liquid cooling heat dissipation devices described above.

[0016] The liquid cooling heat dissipation device of this application simplifies the installation and disassembly process of the heat exchange subplate, which is mounted on a fixed shaft and secured by a quick-locking assembly, and abuts against the main heat exchange channel. The heat exchange subplate is used to clamp the corresponding circuit board, reducing operation time and improving maintenance efficiency. Therefore, when a circuit board needs to be replaced, only the quick-locking assembly needs to be opened, and the corresponding circuit board's heat exchange subplate rotated around the fixed shaft to remove the circuit board and replace it with a new one, without needing to remove the heat exchange subplate for disassembly and assembly. Since the heat exchange subplate is mounted on the fixed shaft, it can move freely along the axial direction of the fixed shaft. During actual assembly, it can self-adapt and precisely adjust its position according to the circuit board's location to ensure optimal fit. This application supports independent disassembly and maintenance of circuit boards, greatly improving the flexibility, maintainability, convenience, and safety of production, testing, and maintenance.

[0017] The other liquid cooling device of this application uses a quick-connect assembly to detachably connect the processor heat exchange mechanism to the main heat exchange channel. Therefore, when only the processor or the processor heat exchange mechanism needs to be replaced, the quick-connect assembly allows for quick connection and disconnection between the processor heat exchange mechanism and the main heat exchange channel. The processor heat exchange mechanism can then be disassembled and installed separately without disassembling the memory heat exchange mechanism and memory together. The memory heat exchange sub-plate passes through the fixed shaft and is fixed by a quick-locking assembly, abutting against the main heat exchange channel. The memory heat exchange sub-plate clamps the corresponding memory. Therefore, when the memory needs to be replaced, only the quick-locking assembly needs to be opened, and the memory heat exchange sub-plate of the corresponding memory needs to be rotated around the fixed shaft to remove the memory and replace it with a new memory. There is no need to remove the memory heat exchange sub-plate for disassembly and assembly. Since the memory heat exchange sub-plate passes through the fixed shaft, it can move freely along the axial direction of the fixed shaft. During actual assembly, the memory heat exchange sub-plate can self-adapt and precisely adjust its position according to the position of the memory to ensure optimal fit with the memory. This application supports independent disassembly and maintenance of the processor and memory, greatly improving the flexibility, maintainability, convenience and security of production, testing and operation. Attached Figure Description

[0018] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 is a schematic diagram of the structure of a server provided in some embodiments of this application;

[0020] Figure 2 is a schematic diagram of the liquid cooling heat dissipation device of the server shown in Figure 1;

[0021] Figure 3 is a schematic diagram of the liquid cooling heat dissipation device shown in Figure 2;

[0022] Figure 4 is a partially exploded structural diagram of the liquid cooling heat dissipation device of the server shown in Figure 2.

[0023] Figure 5 is a schematic diagram of the main heat exchange channel of the liquid cooling heat dissipation device shown in Figure 3;

[0024] Figure 6 is a structural schematic diagram of the main heat exchange channel shown in Figure 5 from another perspective.

[0025] Figure 7 is a partial exploded structural diagram of the main heat exchange channel shown in Figure 5.

[0026] Figure 8 is an enlarged schematic diagram of a local structure of the main heat exchange channel shown in Figure 7;

[0027] Figure 9 is a cross-sectional view of the main heat exchange channel shown in Figure 5;

[0028] Figure 10 is a schematic diagram of the heat exchange subplate of the liquid cooling heat dissipation device shown in Figure 3.

[0029] Figure 11 is one of the partial exploded structural diagrams of the heat exchange subplate shown in Figure 10;

[0030] Figure 12 is a partial exploded structural diagram of the heat exchange subplate shown in Figure 10;

[0031] Figure 13 is a schematic diagram of the main cold plate of the heat exchange subplate shown in Figure 10;

[0032] Figure 14 is a structural schematic diagram of the heat exchange subplate shown in Figure 10 from another perspective.

[0033] Figure 15 is a cross-sectional view of the heat exchange subplate shown in Figure 10;

[0034] Figure 16 is a schematic diagram of the heat exchange mechanism of the plate in the liquid cooling heat dissipation device shown in Figure 3.

[0035] Figure 17 is a schematic diagram of the assembly of the plate heat exchange mechanism shown in Figure 16;

[0036] Figure 18 is a schematic diagram of the assembled plate heat exchange mechanism shown in Figure 16;

[0037] Figure 19 is a schematic diagram of the quick-locking assembly of the plate heat exchange mechanism shown in Figure 18;

[0038] Figure 20 is a structural schematic diagram of the plate heat exchange mechanism shown in Figure 18 after assembly from another perspective.

[0039] Figure 21 is a partially exploded structural diagram of the leakage detection mechanism of the liquid cooling heat dissipation device shown in Figure 3.

[0040] Figure 22 is a partially enlarged schematic diagram of the leakage detection mechanism shown in Figure 21;

[0041] Figure 23 is a schematic diagram of the liquid cooling heat dissipation device shown in Figure 3 during assembly;

[0042] Figure 24 is a schematic diagram of another server structure provided in some embodiments of this application;

[0043] Figure 25 is a schematic diagram of the liquid cooling heat dissipation device of the server shown in Figure 24;

[0044] Figure 26 is a schematic diagram of the liquid cooling heat dissipation device shown in Figure 25;

[0045] Figure 27 is a partially exploded structural diagram of the liquid cooling heat dissipation device of the server shown in Figure 25.

[0046] Figure 28 is a schematic diagram of the main heat exchange channel of the liquid cooling heat dissipation device shown in Figure 26;

[0047] Figure 29 is a structural schematic diagram of the main heat exchange channel shown in Figure 28 from another perspective;

[0048] Figure 30 is a partial exploded structural diagram of the main heat exchange channel shown in Figure 28.

[0049] Figure 31 is an enlarged schematic diagram of the main heat exchange channel shown in Figure 30;

[0050] Figure 32 is a cross-sectional view of the main heat exchange channel shown in Figure 28;

[0051] Figure 33 is a schematic diagram of the memory heat exchange sub-board of the liquid cooling heat dissipation device shown in Figure 26.

[0052] Figure 34 is one of the partial exploded structural diagrams of the memory heat exchange subplate shown in Figure 33;

[0053] Figure 35 is a second partially exploded structural diagram of the memory heat exchange subplate shown in Figure 33;

[0054] Figure 36 is a schematic diagram of the main cold plate of the memory heat exchange sub-board shown in Figure 33;

[0055] Figure 37 is a structural schematic diagram of the memory heat exchange subplate shown in Figure 33 from another perspective.

[0056] Figure 38 is a cross-sectional view of the memory heat exchange subplate shown in Figure 33;

[0057] Figure 39 is a schematic diagram of the memory heat exchange mechanism of the liquid cooling heat dissipation device shown in Figure 26;

[0058] Figure 40 is a schematic diagram of the memory heat exchange mechanism shown in Figure 39 during assembly;

[0059] Figure 41 is a schematic diagram of the assembled memory heat exchange mechanism shown in Figure 39;

[0060] Figure 42 is a schematic diagram of the quick-locking assembly of the memory heat exchange mechanism shown in Figure 41;

[0061] Figure 43 is a structural schematic diagram of the memory heat exchange mechanism shown in Figure 41 after assembly from another perspective.

[0062] Figure 44 is a partially exploded structural diagram of the leakage detection mechanism of the liquid cooling heat dissipation device shown in Figure 26.

[0063] Figure 45 is a partially enlarged schematic diagram of the leakage detection mechanism shown in Figure 44.

[0064] Figure 46 is a schematic diagram of the liquid cooling heat dissipation device shown in Figure 26 during assembly.

[0065] The above-mentioned figures include the following reference numerals: 100-Liquid cooling heat dissipation device; 10-Main heat exchange channel; 11-Main heat exchange sub-channel; 111-First main heat exchange sub-channel; 112-Second main heat exchange sub-channel; 113-Third main heat exchange sub-channel; 114-Distribution port; 115-Collection port; 116-Sub-channel connector; 12-Connecting pipe; 121-First branch connecting pipe; 122-Second branch connecting pipe; 13-Cover plate; 131-Channel cavity; 132-Rib structure; 133-Heat conduction groove; 134-Heat exchange pad; 14-Base plate; 141-Tooth structure; 15- 16-Import; 17-Export; 18-Second positioning hole; 19-Second non-removable screw; 30-Fixed seat; 31-Plate heat exchange mechanism; 32-Fixed shaft; 32-Quick locking assembly; 321-Pressure rod bracket; 322-Pressure rod; 323-Lock; 3231-Locking pin; 3232-Guide slope; 324-Locking plate; 3241-Baffle plate; 3242-Pulley; 325-Limit screw; 326-Pressure rod sleeve; 327-Spring; 328-Protruding structure; 33-Plate heat exchange subplate; 331-Main cold plate; 3311-Base Plate; 3312-Reinforced frame; 3313-Limiting groove; 3314-Heat pipe groove; 3315-Heat pipe; 3316-Guide pin; 332-Secondary cold plate; 3321-Heat conductive pad groove; 3322-Guide hole; 333-Heat conductive pad; 334-Locking switch assembly; 3341-Cam wrench; 3342-Cam shaft; 3343-Pressure slider; 3344-Guide shaft; 3345-Cam part; 3346-Handle part; 3347-Compression spring; 3348-Guide groove; 3349-Guide block; 335-Anti-scratch film; 3 36-Through hole; 40-Leakage detection mechanism; 41-First guide channel; 42-Detection line channel; 43-Leakage detection line; 44-Second guide channel; 50-Supply and return liquid connector assembly; 51-Inlet pipe; 52-Return pipe; 80-Cold plate bracket; 81-First positioning pin; 82-First non-removable screw; 83-Second positioning pin; 84-Bracket screw hole; 200-Server; 201-Motherboard; 202-Processor; 203-Board; 204-First positioning hole; 205-Motherboard screw hole; 206-Supply and return liquid quick connector; 1000 - Liquid cooling heat dissipation device; 20 - Processor heat exchange mechanism; 21 - Quick connector assembly; 211 - Liquid inlet quick connector; 212 - Liquid outlet quick connector; 22 - Fastening screw hole; 23 - Processor heat exchange connection pipeline; 24 - Processor liquid inlet pipeline; 25 - Processor liquid outlet pipeline; 90 - Memory heat exchange mechanism; 93 - Memory heat exchange daughterboard; 2000 - Server; 903 - Memory; 207 - Stud. Detailed Implementation

[0066] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0067] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0068] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0069] As shown in Figures 1, 2, and 3, some embodiments of this application provide a liquid cooling heat dissipation device 100 used in a server 200. The server 200 includes a motherboard 201, a processor 202, a circuit board 203, and the liquid cooling heat dissipation device 100. The processor 202 and the circuit board 203 are mounted on the motherboard 201. The liquid cooling heat dissipation device 100 is used to perform liquid cooling heat dissipation and temperature reduction on the circuit board 203.

[0070] In some possible implementations, server 200 is a dual-socket general-purpose server.

[0071] In some possible implementations, board 203 is memory, but it is not limited to this.

[0072] The liquid cooling heat dissipation device 100 includes a main heat exchange channel 10 and a plate heat exchange mechanism 30. The main heat exchange channel 10 is used to communicate with the coolant flow path. The plate heat exchange mechanism 30 is in heat exchange contact with the main heat exchange channel 10. The plate heat exchange mechanism 30 clamps a plate 203 for cooling the plate 203.

[0073] Please also refer to Figure 5. In some possible implementations, the board heat exchange mechanism 30 provides heat exchange for the memory and can serve as a memory heat exchange mechanism. The board heat exchange mechanism 30 includes a fixed shaft 31, a quick-locking assembly 32, and multiple board heat exchange sub-plates 33. The board heat exchange sub-plates 33 are mounted on the fixed shaft 31, allowing them to rotate around and slide axially along the fixed shaft 31. The board heat exchange sub-plates 33 are used to clamp onto the corresponding board 203. The quick-locking assembly 32 is used to fix the multiple board heat exchange sub-plates 33 and abut against the main heat exchange channel 10, so that the board heat exchange sub-plates 33 exchange heat with the main heat exchange channel 10.

[0074] Specifically, the quick-locking assembly 32 applies pressure to the plate heat exchange subplate 33, causing the plate heat exchange subplate 33 to press onto the main heat exchange channel 10, thereby enabling the plate heat exchange subplate 33 to exchange heat with the main heat exchange channel 10.

[0075] In some possible implementations, multiple boards 203 are arranged sequentially on the main board 201, the axis of the fixed shaft 31 is parallel to the arrangement direction of the multiple boards 203, the quick-locking assembly 32 is located on one side of the boards 203, and along the arrangement direction of the multiple boards 203, the multiple heat exchange subplates 33 of the boards 203 rotatably mounted on the fixed shaft 31 are pressed against the corresponding boards 203.

[0076] The heat exchange subplate 33 is mounted on the fixed shaft 31 and secured by the quick-locking assembly 32, abutting against the main heat exchange channel 10. The heat exchange subplate 33 clamps the corresponding plate 203. Therefore, when replacing the plate 203, simply open the quick-locking assembly 32 and rotate the heat exchange subplate 33 of the corresponding plate 203 around the fixed shaft 31 to remove the plate 203 and replace it with a new one. There is no need to remove the heat exchange subplate 33 for disassembly and assembly, greatly improving efficiency. The replacement process of board 203 is greatly simplified; the board heat exchange subplate 33 is mounted on the fixed shaft 31, so the board heat exchange subplate 33 can move freely on the fixed shaft 31. In actual assembly, the board heat exchange subplate 33 can adapt to the position of board 203 and adjust its own position precisely to ensure the best contact and heat exchange efficiency between board 203 and board 203, achieve the best fit, improve the structural compatibility and reliability of board heat exchange subplate 33, and improve the heat dissipation effect.

[0077] Because the liquid cooling heat dissipation device 100 of this application supports independent disassembly and maintenance of the board 203, maintenance personnel can replace and maintain components more quickly, reducing unnecessary disassembly and assembly of the required heat dissipation electronic components. This greatly improves the flexibility, maintainability, convenience and safety of production, testing and maintenance, reduces downtime, improves the availability and maintenance efficiency of the server 200, and improves the structural compatibility and reliability of the board heat exchange mechanism 30. It can meet various maintenance scenarios in data centers, and is conducive to reducing the failure rate of liquid cooling components and electronic components, and reducing development and maintenance costs.

[0078] Meanwhile, the application of the quick-locking component 32 enables tool-free installation, reduces the risk of misoperation during disassembly and assembly, and enhances the safety and reliability of the system.

[0079] In some possible implementations, the main heat exchange channel 10 includes multiple main heat exchange sub-channels 11, which are connected sequentially via connecting pipes 12.

[0080] In some possible implementations, the main heat exchange channel 10 includes a first main heat exchange sub-channel 111, a second main heat exchange sub-channel 112, and a third main heat exchange sub-channel 113. The connecting pipe 12 includes a first branch connecting pipe 121 and a second branch connecting pipe 122. The first main heat exchange sub-channel 111 and the second main heat exchange sub-channel 112 are connected through the first branch connecting pipe 121, and the second main heat exchange sub-channel 112 and the third main heat exchange channel 113 are connected through the second branch connecting pipe 122.

[0081] By dividing the main heat exchange channel into multiple sub-channels, segmented heat dissipation can be achieved. Each sub-channel can focus on the heat management of a specific area or component, thereby improving the overall heat dissipation efficiency.

[0082] In some possible implementations, the first main heat exchanger sub-channel 111 and the third main heat exchanger sub-channel 113 are located in the same row and are arranged opposite to the second main heat exchanger sub-channel 112.

[0083] In some possible implementations, the first main heat exchanger sub-channel 111 and the third main heat exchanger sub-channel 113 are located on the rear side of the processor 202 and the board 203, and the second main heat exchanger sub-channel 112 is located on the front side of the processor 202 and the board 203.

[0084] Please also refer to Figure 6. In some possible implementations, the first main heat exchange sub-channel 111 is provided with a liquid distribution port 114, and the third main heat exchange sub-channel 113 is provided with a liquid collection port 115. The liquid cooling heat dissipation device 100 also includes a second heat exchange mechanism. The liquid distribution port 114 and the liquid collection port 115 are respectively connected to the second heat exchange mechanism, so that the second heat exchange mechanism is connected to the main heat exchange channel 10 through the liquid distribution port 114 and the liquid collection port 115.

[0085] In some possible implementations, the second heat exchange mechanism is a processor heat exchange mechanism. When the processor heat exchange mechanism is connected to the main heat exchange channel 10 through the liquid distribution port 114 and the liquid collection port 115, the first branch enters the processor heat exchange mechanism from the liquid distribution port 114 on the side wall of the first main heat exchange sub-channel 111, continuously carrying away the heat generated by the processor 202 chip during operation to ensure that the temperature of the processor 202 chip remains within the normal range. Subsequently, the coolant flows out into the main heat exchange channel 10 through the liquid collection port 115.

[0086] The second branch flows through the channel within the first main heat exchanger sub-channel 111 on the rear side. After changing the coolant flow direction via the first branch connecting pipe 121, it reaches the second main heat exchanger sub-channel 112 near the front of the chassis. In the second main heat exchanger sub-channel 112 on the front side, the coolant absorbs heat transferred from the board heat exchanger sub-plate 33 and flows out. Then, it reaches the third main heat exchanger sub-channel 113 on the rear side via the second branch connecting pipe 122. Subsequently, it flows along the channel within the third main heat exchanger sub-channel 113 on the rear side and merges with the coolant from the first branch at the collector port 115.

[0087] In some possible implementations, the ends of the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113 opposite to each other, and both ends of the second main heat exchange sub-channel 112, are respectively provided with sub-channel connectors 116. The sub-channel connector 116 of the first main heat exchange sub-channel 111 is connected to the sub-channel connector 116 on one side of the second main heat exchange sub-channel 112 through a first branch connecting pipe 121. The sub-channel connector 116 on the other side of the second main heat exchange sub-channel 112 is connected to the sub-channel connector 116 of the third main heat exchange sub-channel 113 through a second branch connecting pipe 122.

[0088] Please refer to Figures 7, 8, and 9 simultaneously. In some possible implementations, the main heat exchanger sub-channel 11 includes a cover plate 13 and a base plate 14. The cover plate 13 has a flow channel cavity 131, and the base plate 14 covers the flow channel cavity 131. The plate heat exchanger sub-plate 33 abuts against the cover plate 13.

[0089] The combination of cover plate 13 and base plate 14 provides a closed and robust structure, ensuring the integrity and sealing of the flow channel cavity 131, preventing coolant leakage, and improving system reliability. Simultaneously, the design of the flow channel cavity 131 can be optimized for fluid paths according to specific heat dissipation requirements, ensuring maximum contact between the coolant and the heat source during flow, thereby improving heat exchange efficiency.

[0090] The design of the flow channel cavity 131 allows coolant to flow inside the cover plate 13 and directly communicate with the second heat exchange mechanism, achieving efficient heat exchange and quickly removing the heat generated by the processor 202, thus improving heat dissipation efficiency. Due to the direct communication between the second heat exchange mechanism and the flow channel cavity 131, the second heat exchange mechanism can be easily disassembled and replaced during maintenance without affecting the installation of the board heat exchange sub-board 33, improving system maintainability.

[0091] The heat exchange subplate 33 of the board directly abuts against the cover plate 13, which allows the heat exchange subplate 33 to exchange heat with the coolant in the flow channel cavity 131 more flexibly, reducing the thermal resistance in the heat transfer path, and allowing the heat generated by the board 203 to be transferred to the coolant more quickly.

[0092] In some possible implementations, a rib structure 132 is provided in the flow channel cavity 131, the rib structure 132 protrudes from the flow channel cavity 131 and is arranged along the extension direction of the flow channel cavity 131.

[0093] The rib structure 132 increases the surface area within the flow channel cavity 131, thereby expanding the contact area between the coolant and the flow channel wall, improving heat exchange efficiency, and enabling heat to be transferred more quickly from the heat source to the coolant. The rib structure 132 can guide the flow path of the coolant within the flow channel cavity 131, ensuring that the fluid is evenly distributed throughout the flow channel and avoiding flow dead zones or localized overheating.

[0094] Meanwhile, the rib structure 132 can disturb the flow of coolant and promote the formation of turbulence. Compared with laminar flow, fluid in turbulent flow has a higher heat transfer capacity, thereby improving the convective heat transfer between the flow channel cavity 131 and the coolant, and can more effectively remove heat.

[0095] The rib structure 132 not only helps to improve heat exchange efficiency, but also enhances the structural strength of the flow channel cavity 131, acting as a reinforcing rib to improve the flow channel cavity 131's ability to withstand liquid pressure and prevent deformation or rupture under high pressure conditions.

[0096] The shape and spacing of the rib structure 132 can be designed and adjusted according to specific heat dissipation requirements to achieve the best thermal management effect.

[0097] In some possible implementations, the base plate 14 is provided with a shovel-tooth structure 141, which is located in the flow channel cavity 131 along the extension direction of the flow channel cavity 131. The shovel-tooth structure 141 is distributed directly below the contact area between the flow channel cavity 131 and the plate heat exchange subplate 33.

[0098] The shovel-tooth structure 141 increases the surface area within the flow channel cavity 131, thereby expanding the contact area between the coolant and the flow channel wall, improving heat exchange efficiency, and enabling heat to be transferred more quickly from the heat source to the coolant. The shovel-tooth structure 141 can guide the flow path of the coolant within the flow channel cavity 131, ensuring that the fluid is evenly distributed throughout the flow channel and avoiding flow dead zones or localized overheating.

[0099] Meanwhile, the toothed structure 141 can disturb the flow of coolant and promote the formation of turbulence. Compared with laminar flow, fluid in turbulent flow has a higher heat transfer capacity and can more effectively remove heat.

[0100] The shovel tooth structure 141 not only helps to improve heat exchange efficiency, but also enhances the structural strength of the flow channel cavity 131, improves its pressure resistance, and prevents deformation or cracking under high pressure conditions.

[0101] The shape, length, height, and spacing of the shovel tooth structure 141 can be designed and adjusted according to specific heat dissipation requirements to achieve the best thermal management effect.

[0102] In some possible implementations, the rib structure 132 is located in the middle of the flow channel cavity 131 to divide the flow channel cavity 131 into two parts, and multiple shovel tooth structures 141 are located in the flow channel cavities 131 on both sides respectively. The tooth tips of the shovel tooth structures 141 are welded to the cover plate 13 to further divert the flow in the flow channel cavity 131 to form multiple microchannels.

[0103] In some possible implementations, the first main heat exchanger sub-channel 111 is provided with an inlet 15. The third main heat exchanger sub-channel 113 is provided with an outlet 16. The inlet 15 and the outlet 16 are located in the middle of the first main heat exchanger sub-channel 111 and the third main heat exchanger sub-channel 113, respectively, and the flow baffle structure is divided in the flow channel cavity 131 of the first main heat exchanger sub-channel 111 and the third main heat exchanger sub-channel 113 by the rib structure 132.

[0104] After the coolant enters the first main heat exchange sub-channel 111 through inlet 15, a portion of the liquid enters the second heat exchange mechanism through distributor 114, forming the first branch. The other portion flows along the flow channel cavity 131 of the first main heat exchange sub-channel 111, forming the second branch. After flowing towards the third main heat exchange sub-channel 113 in the first main heat exchange sub-channel 111, it undergoes a deflection and flows away from the third main heat exchange sub-channel 113. Then, it enters the first branch connecting pipe 121 through sub-channel connector 116, passes through the second main heat exchange sub-channel 112, and reaches the rear third main heat exchange sub-channel 113 through the second branch connecting pipe 122. Subsequently, it flows towards the first main heat exchange sub-channel 111 along the flow channel in the rear third main heat exchange sub-channel 113, undergoes a deflection, and merges with the coolant from the first branch at collector 115, then flows out of the main heat exchange channel 10 through outlet 16.

[0105] In some possible implementations, the fixed shaft 31 is provided on the cover plate 13, and the axial direction of the fixed shaft 31 is the same as the extension direction of the flow channel cavity 131 in the cover plate 13, so that multiple plate heat exchange sub-plates 33 are arranged sequentially along the extension direction of the flow channel cavity 131.

[0106] Please also refer to Figure 10. In some possible implementations, multiple heat exchange subplates 33 are divided into two groups along the length of the board 203. The two groups of heat exchange subplates 33 are arranged opposite to each other, and each group of heat exchange subplates 33 clamps one end of the corresponding board 203 along the length of the board 203. The heat exchange subplates 33 at both ends are axially symmetrical to each other, and are combined to form a set of heat exchange subplates 33, which together dissipate heat for one board 203.

[0107] By dividing the heat exchange sub-plates 33 into two groups and clamping one end of the board 203 along its length, the length of the heat exchange sub-plates 33 is reduced. This reduction in length improves the sub-plates' resistance to stress bending and deformation, effectively increasing the rigidity of each sub-plate. This reduces the risk of deformation during contact and insertion / removal of the sub-plates 33 with the board 203, improving the overall structural stability and ensuring good contact between the sub-plates 33 and the board 203 during installation and disassembly, thus guaranteeing heat dissipation performance. Furthermore, the separation between the two sub-plates 33 effectively prevents damage to the protruding chip in the center of the board 203 during insertion and removal.

[0108] The heat exchange subplate 33 is connected to the main heat exchange channel 10 via a fixed shaft 31, allowing it to move freely on the fixed shaft 31. During actual assembly, the heat exchange subplate 33 can adaptively and precisely adjust its position according to the position of the board 203, effectively resolving the issue of poor fit between the heat exchange subplate 33 and the board 203 caused by assembly tolerances of related components within the server 200, thus ensuring optimal fit with the board 203.

[0109] Please refer to Figures 11, 12, 13, and 14 simultaneously. In some possible implementations, the heat exchange subplate 33 includes a main cold plate 331, a secondary cold plate 332, a thermal pad 333, and a locking switch assembly 334. Along the thickness direction of the board 203, the main cold plate 331 is located on one side of the board 203. The secondary cold plate 332 is movably mounted on the main cold plate 331 and located on the other side of the board 203. The thermal pad 333 is located on the side of the main cold plate 331 and the secondary cold plate 332 facing the board 203. The main cold plate 331 and the secondary cold plate 332 pass through the fixed shaft 31. The locking switch assembly 334 is disposed on the main cold plate 331. The locking switch assembly 334 is used to drive the secondary cold plate 332 to move toward the main cold plate 331 so as to press the secondary cold plate 332 and the heat-conducting pad 333 on the main cold plate 331 onto the board 203.

[0110] The thermal pad 333 is placed on the side of the main cold plate 331 and the secondary cold plate 332 facing the board 203, ensuring good thermal contact between the board heat exchange sub-board 33 and the board 203, improving the heat conduction efficiency, and enabling more effective transfer of the heat generated by the board 203 to the board heat exchange sub-board 33 for heat dissipation.

[0111] The auxiliary cold plate 332 is movably mounted on the main cold plate 331 and is adjustable via the locking switch assembly 334. This allows for adjustment during installation based on the actual thickness of the board 203, ensuring close contact between the heat exchange subplate 33 and the board 203.

[0112] The locking switch assembly 334 drives the auxiliary cold plate 332 towards the main cold plate 331, achieving rapid locking. This simplifies the installation and removal process of the heat exchange sub-plate 33, reduces operation time, and improves maintenance efficiency. Adjustment of the locking switch assembly 334 provides appropriate clamping force, preventing excessive mechanical stress on the board 203 and reducing the risk of damage. The locking switch assembly 334 enhances the overall reliability of the system, ensuring good thermal contact between the heat exchange sub-plate 33 and the board 203 under various operating conditions.

[0113] The heat exchange sub-board 33 improves the structural compatibility, reliability, and operational flexibility of the board's cold plate, solving problems such as difficulty in inserting and removing the current board 203, poor contact of the heat dissipation surface, and cumbersome replacement procedures. The heat exchange sub-board 33 is designed as a two-end split type, meaning two sets of heat exchange sub-boards 33, each approximately half the length of the board 203, are combined to achieve heat dissipation for each board 203. Each set of heat exchange sub-boards 33 is equipped with a locking switch assembly 334 for quick locking. This not only provides adjustable spring force to ensure good contact and required clamping force between the thermal pad 333 and the board 203, but also allows for manual quick locking and unlocking of the heat exchange sub-board 33 and the board 203, reducing the failure rate of the board 203 and further extending its service life.

[0114] In some possible implementations, the main cold plate 331 includes a base plate 3311 and a reinforcing frame 3312. The base plate 3311 is mounted on the fixed shaft 31, the reinforcing frame 3312 is mounted on the base plate 3311, the secondary cold plate 332 is movably mounted on the reinforcing frame 3312, and the locking switch assembly 334 is mounted on the reinforcing frame 3312.

[0115] In some possible implementations, the reinforcing frame 3312 is designed on the top of the substrate 3311. On the one hand, it is used to strengthen the rigidity of the substrate 3311 and prevent deformation caused by squeezing with the board 203 during use. On the other hand, the reinforcing frame 3312 can provide mounting holes for the locking switch assembly 334 and will not interfere with the board 203 during operation.

[0116] The introduction of the reinforcing frame 3312 improves the overall rigidity and strength of the main cold plate 331, reduces possible deformation of the heat exchange subplate 33 during installation and use, ensures stable contact between the heat exchange subplate 33 and the board 203, and improves heat dissipation efficiency. The reinforcing frame 3312 helps to evenly distribute the pressure applied to the locking switch assembly 334 during the locking process, avoiding excessive local stress on the board 203 and reducing the risk of damage to the board 203.

[0117] In some possible implementations, the substrate 3311 is provided with a limiting groove 3313 for accommodating the thermal pad 333.

[0118] The limiting groove 3313 provides a clear mounting position for the thermal pad 333, ensuring its precise positioning between the main cold plate 331 and the board 203. This helps maintain the effective contact area of ​​the thermal pad 333 and improves heat transfer efficiency. The limiting groove 3313 also effectively prevents the thermal pad 333 from moving or sliding during installation and use, ensuring it remains in the optimal position and avoiding a decrease in heat dissipation performance due to positional deviation.

[0119] The limiting groove 3313 provides a fixed position for the thermal pad 333, simplifying the installation process, reducing the possibility of installation errors, and improving operational efficiency. At the same time, the limiting groove 3313 can also protect the edges of the thermal pad 333 to a certain extent, reducing damage caused by mechanical stress or friction, thereby extending the service life of the thermal pad 333.

[0120] In some possible implementations, a heat pipe groove 3314 is provided on the side of the substrate 3311 away from the limiting groove 3313, and the heat pipe groove 3314 is used to embed the heat pipe 3315.

[0121] The heat pipe 3315 is a highly efficient heat transfer device that can quickly transfer heat. By embedding the heat pipe 3315 on the substrate 3311, heat can be transferred more quickly from the board 203 area to other parts, improving the heat dissipation efficiency of the main cold plate 331.

[0122] The design of the heat pipe groove 3314 allows the heat pipe 3315 to be tightly embedded in the substrate 3311, ensuring that heat is evenly distributed along the length of the heat pipe 3315. This helps to avoid localized overheating and improves the temperature uniformity of the board 203. Embedding the heat pipe 3315 into the substrate 3311 through the heat pipe groove 3314 makes the main cold plate 331 more compact and does not significantly increase the volume of the heat exchange sub-board 33. The heat pipe groove 3314 ensures close contact between the heat pipe 3315 and the substrate 3311, reducing thermal resistance in the heat transfer path and improving heat conduction efficiency.

[0123] In some possible implementations, the side of the secondary cold plate 332 facing the board 203 is provided with a thermal pad groove 3321, which is used to accommodate the thermal pad 333.

[0124] The thermal pad groove 3321 provides a clear mounting position for the thermal pad 333, ensuring its precise positioning between the secondary cold plate 332 and the board 203. This helps maintain the effective contact area of ​​the thermal pad 333 and improves heat transfer efficiency. The thermal pad groove 3321 also effectively prevents the thermal pad 333 from moving or sliding during installation and use, ensuring it remains in the optimal position and avoiding a decrease in heat dissipation performance due to misalignment.

[0125] The thermal pad groove 3321 provides a fixed position for the thermal pad 333, simplifying the installation process, reducing the possibility of installation errors, and improving operational efficiency. At the same time, the thermal pad groove 3321 can also protect the edges of the thermal pad 333 to a certain extent, reducing damage caused by mechanical stress or friction, thereby extending the service life of the thermal pad 333.

[0126] The thermal pads 333 on the main cold plate 331 and the auxiliary cold plate 332 have the same hardness. Therefore, the force applied by the locking switch assembly 334 to the main cold plate 331 and the auxiliary cold plate 332 is the same. As a result, the fastening force on the two sides of the board 203 is also consistent. This avoids the problem of different forces caused by different contact methods or dimensional deviations on the two sides of the board 203 in previous solutions, which would cause the board 203 to tilt to one side. It also avoids stress damage to the gold fingers of the board 203 and the board slot, which helps to reduce the failure rate of the board 203 and further improve its service life.

[0127] In some possible implementations, one of the main cold plate 331 and the secondary cold plate 332 is provided with a guide pin 3316, and the other is provided with a guide hole 3322 opposite to the guide pin 3316.

[0128] The design of guide pin 3316 and guide hole 3322 ensures that the main cold plate 331 and the auxiliary cold plate 332 can be precisely aligned during installation, which helps to ensure good contact between the heat exchange subplate 33 and the board 203 and improve heat transfer efficiency.

[0129] The guide pin 3316 and guide hole 3322 provide a simple and effective alignment mechanism, making the installation process more intuitive and convenient, reducing the possibility of installation errors, and improving operational efficiency. During use, the guide pin 3316 and guide hole 3322 can effectively prevent relative misalignment between the main cold plate 331 and the auxiliary cold plate 332, ensuring that the heat exchange subplate 33 of the plate card maintains a stable structure during operation.

[0130] In some possible implementations, the substrate 3311 and the auxiliary cold plate 332 are provided with through holes 336 for passing through the fixed shaft 31. The through holes 336 and the fixed shaft 31 cooperate to form a hinge structure, allowing the substrate 3311 and the auxiliary cold plate 332 to rotate on the fixed shaft 31.

[0131] In some possible implementations, the secondary cold plate 332 has no heat pipe grooves, so its thickness can be appropriately reduced to meet the spacing requirements of the board 203.

[0132] Referring also to Figure 15, in some possible implementations, the locking switch assembly 334 includes a cam wrench 3341, a cam shaft 3342, a clamping slider 3343, and a guide shaft 3344. The cam wrench 3341 is rotatably mounted on the reinforcing frame 3312 via the cam shaft 3342. The guide shaft 3344 is mounted on the reinforcing frame 3312. The secondary cold plate 332 passes through the guide shaft 3344, and the clamping slider 3343 is mounted on the secondary cold plate 332 and faces the cam wrench 3341. The cam wrench 3341 is used to push the clamping slider 3343 to move axially along the guide shaft 3344, so that the secondary cold plate 332 moves towards the main cold plate 331.

[0133] When installing the heat exchange subplate 33 onto the board 203, the main cold plate 331 and the auxiliary cold plate 332 rotate together around the fixed shaft 31 to both sides of the board 203 until they contact the main heat exchange sub-channel 11. At this point, the quick-locking assembly 32 is lowered and locked. Finally, the cam wrench 3341 is moved from the vertical position to the horizontal position to lock it in place. During the process, the cam of the cam wrench 3341 moves from the small diameter to the large diameter, pushing the clamping slider 3343 to translate along the guide shaft 3344. During the above process, the pressing slider 3343 will drive the auxiliary cold plate 332 to move horizontally. The thermal pads 333 on the main cold plate 331 and the auxiliary cold plate 332 will first come into contact with the board 203. As the main cold plate 331 and the auxiliary cold plate 332 continue to move horizontally under the thrust of the cam and clamp the board 203, the thermal pads 333 can be further compressed to ensure that the thermal pads 333 and the board 203 meet the required pre-tightening force, reduce the contact thermal resistance, and achieve the best heat dissipation effect.

[0134] The tight engagement and unlocking of the heat exchanger subplate 33 and the board 203 only requires turning the cam wrench 3341, which is quick and reliable, effectively reducing the failure rate and operation time of electronic component replacement. The use of the cam wrench 3341 makes the locking and unlocking process simple and intuitive, allowing operators to quickly complete the installation and removal of the heat exchanger subplate 33 and the board 203, thus improving operational efficiency.

[0135] The cam wrench 3341 can precisely control the movement of the clamping slider 3343 by rotating the cam shaft 3342, allowing precise clamping force to be applied to the auxiliary cold plate 332, ensuring good thermal contact between the heat exchange subplate 33 and the board 203.

[0136] The guide shaft 3344 provides a stable sliding path, preventing the auxiliary cold plate 332 from shifting or tilting during movement, and ensuring the stability of the heat exchange subplate 33. Through the cam mechanism, the pressing slider 3343 can move smoothly along the axial direction of the guide shaft 3344, ensuring that the force applied to the auxiliary cold plate 332 is uniform, reducing local stress concentration, and lowering the risk of damage to the board 203.

[0137] In some possible implementations, the cam wrench 3341 has a cam portion 3345 and a handle portion 3346. The cam portion 3345 is rotatably mounted on a cam shaft 3342 and abuts against a pressing slider 3343. The handle portion 3346 is connected to the cam portion 3345.

[0138] The cam portion 3345, through its abutting engagement with the clamping slider 3343, can convert rotational motion into linear motion, thereby precisely controlling the clamping force applied to the auxiliary cold plate 332. This helps ensure good thermal contact between the heat exchange subplate 33 and the board 203, improving heat dissipation efficiency.

[0139] The handle 3346 provides an easy-to-grip and operate interface, allowing users to easily rotate the cam wrench 3341, improving installation and removal efficiency and reducing operation time. By adjusting the rotation angle of the handle 3346, users can easily adjust the clamping force, allowing for flexible adjustments according to specific installation needs to ensure optimal clamping effect.

[0140] In some possible implementations, the mating surface between the cam portion 3345 and the pressing slider 3343 is an arc surface, which can ensure smooth sliding during the mating process.

[0141] In some possible implementations, the cam portion 3345 is provided with a self-locking surface, which can cooperate with the pressing slider 3343 to achieve self-locking of the cam wrench 3341, preventing accidental loosening or movement, and ensuring that the locking switch assembly 334 remains stable during operation, maintaining precise alignment and position, thereby improving the accuracy and performance of the entire system and enhancing the overall reliability of the system.

[0142] In some possible implementations, the locking switch assembly 334 also includes a compression spring 3347, which is sleeved on the guide shaft 3344 and located on the side of the clamping slider 3343 away from the cam wrench 3341. One side of the compression spring 3347 is connected to the reinforcing frame 3312, and the other side is connected to the clamping slider 3343.

[0143] Compression spring 3347 provides a buffering mechanism that can absorb and mitigate mechanical shocks and vibrations that may occur during installation and use, helping to protect the heat exchange subplate 33 and the board 203 and extend their service life.

[0144] The difference between the major and minor diameters of the cam portion 3345 represents the horizontal displacement of the auxiliary cold plate 332. Based on this, parameters such as the compression of the heat-conducting pad 333 can be further calculated, facilitating design selection. When maintenance or unlocking of the heat exchange sub-board 33 is required, the cam wrench 3341 is moved from the horizontal to the vertical position, thus opening the locking switch device. During this process, the cam portion 3345 rotates from the major diameter to the minor diameter, and the compression spring 3347 pushes the clamping slider 3343 to move in the releasing direction during its rebound. At this time, the heat-conducting pads 333 of the main cold plate 331 and auxiliary cold plate 332 and the board 203 change from a compressed state to a non-contact state. Therefore, after unlocking the quick-locking assembly 32, opening the board slot switch allows the board 203 to be easily removed from the main board 201, achieving tool-free and quick replacement.

[0145] In some possible implementations, one of the pressing slider 3343 and the guide shaft 3344 is provided with a guide groove 3348, and the other is provided with a guide block 3349 opposite to the guide groove 3348.

[0146] The combined use of guide groove 3348 and guide block 3349 ensures that the main cold plate 331 and the secondary cold plate 332 will not tilt during translation, thereby improving the accuracy of bonding with board 203.

[0147] The combination of guide groove 3348 and guide block 3349 ensures precise linear movement of the clamping slider 3343 along guide shaft 3344, helping to prevent the clamping slider 3343 from deviating or tilting during movement, and ensuring that the applied clamping force is uniform and stable. The design of guide groove 3348 and guide block 3349 provides a clear movement path, reducing friction and wear between the clamping slider 3343 and other components, thereby extending the service life of the components. The precise guiding mechanism improves the reliability of locking and unlocking operations, ensuring that the expected clamping effect is achieved with each operation, and enhancing the overall reliability of the system.

[0148] In some possible implementations, the heat exchange subplate 33 of the board also includes a scratch-resistant film 335, which is attached to the thermal pad 333, the main cold plate 331 and the auxiliary cold plate 332.

[0149] The anti-scratch film 335 can effectively protect the surfaces of the thermal pad 333, the main cold plate 331, and the auxiliary cold plate 332, reduce friction during installation, and prevent scratches, wear, or other physical damage during installation, operation, and maintenance, thereby extending the service life of the components, maintaining the integrity and thermal conductivity of the thermal pad 333, and ensuring that heat can be efficiently transferred from the board 203 to the heat exchange subplate 33.

[0150] The scratch-resistant film 335 also prevents dust, grease, and other contaminants from adhering to the surfaces of the thermal pad 333, the main cooling plate 331, and the secondary cooling plate 332, keeping the components clean and improving heat dissipation efficiency. The presence of the scratch-resistant film 335 simplifies the cleaning and maintenance process, allowing users to easily wipe away dirt without worrying about damaging the surfaces of the thermal pad 333 or the main cooling plate 331 and the secondary cooling plate 332.

[0151] In some possible implementations, the cover plate 13 is provided with a heat conduction groove 133, and a heat exchange pad 134 is provided in the heat conduction groove 133, with the plate heat exchange subplate 33 abutting against the heat exchange pad 134.

[0152] The design of the heat conduction groove 133 can reduce the thermal resistance of the heat from the board 203 being transferred to the main heat exchange channel 11 through the heat exchange subplate 33. On the one hand, it can reduce the wall thickness of the main heat exchange channel 11 in the heat conduction area, thereby reducing its thermal resistance; on the other hand, it can better fix the position of the heat exchange pad 134, preventing it from moving, wrinkling or falling off after being compressed, thereby improving its service life.

[0153] The heat exchange pad 134 effectively fills the gap in the thermally conductive area between the heat exchange subplate 33 and the cover plate 13, ensuring close contact between the two and reducing contact thermal resistance. This improves heat conduction efficiency, allowing the heat generated by the board 203 to be transferred to the cover plate 13 for heat dissipation more quickly.

[0154] The combined design of the heat conduction groove 133 and the heat exchange pad 134 reduces the thermal resistance in the heat transfer path, ensuring that heat can be efficiently transferred from the heat exchange subplate 33 to the cover plate 13.

[0155] The heat conduction groove 133 provides a clear location for placing the heat exchange pad 134, which simplifies the installation process, ensures the correct positioning of the heat exchange pad 134, and improves operating efficiency.

[0156] The heat exchange pad 134 has a certain degree of flexibility, which can compensate for the unevenness that may exist on the surface of the heat exchange subplate 33 and the cover plate 13, thereby improving the contact area and heat transfer efficiency.

[0157] Please refer to Figures 16, 17, 18, 19, and 20 simultaneously. In some possible implementations, the quick-locking assembly 32 includes a pressure rod bracket 321, a pressure rod 322, a locking buckle 323, and a locking plate 324. The locking buckle 323 is located on the main heat exchange channel 10. One end of the pressure rod 322 is rotatably mounted on the pressure rod bracket 321, and the other end of the pressure rod 322 is provided with a locking plate 324. The locking buckle 323 and the locking plate 324 cooperate to lock the pressure rod 322 and make the pressure rod 322 abut against the side of the plate heat exchange sub-plate 33 away from the main heat exchange channel 10, so that the plate heat exchange sub-plate 33 abuts against the main heat exchange channel 10.

[0158] The quick-locking assembly 32 is used to apply a certain locking force to the heat exchange subplate 33 of the board, further improving the thermal conductivity of the heat exchange subplate 33 and the main heat exchange sub-channel 11 and reducing their contact thermal resistance.

[0159] The design of the quick-locking assembly 32 allows users to quickly lock or release the heat exchange subplate 33 of the plate by simply operating the lever 322, which greatly simplifies the installation and disassembly process and improves operating efficiency.

[0160] The engagement of the latch 323 and the locking plate 324 provides a stable mechanical connection, ensuring that the pressure rod 322 can firmly hold the plate heat exchanger subplate 33 against the main heat exchange channel 10, preventing loosening or displacement during use. The design of the pressure rod 322 ensures that the force applied to the plate heat exchanger subplate 33 is uniform, ensuring good contact between the plate heat exchanger subplate 33 and the main heat exchange channel 10, and improving heat transfer efficiency.

[0161] In some possible implementations, the pressure rod bracket 321 and the latch 323 are respectively disposed on the main heat exchange channel 10 and located on both sides of the multiple sequentially arranged plates 203. When the latch 323 engages with the locking plate 324, the extension direction of the pressure rod 322 is the same as the direction in which the multiple plates 203 are arranged sequentially, thereby pressing the multiple plate heat exchange subplates 33 simultaneously onto the corresponding plates 203.

[0162] In some possible implementations, the quick-locking assembly 32 also includes a limiting screw 325. The limiting screw 325 is mounted on the pressure rod bracket 321, and one end of the pressure rod 322 is provided with a pressure rod sleeve 326, which passes through the limiting screw 325.

[0163] The limiting screw 325 provides a clear limiting function, ensuring that the pressure rod 322 remains in a predetermined position during operation, which helps to ensure a stable connection between the plate heat exchanger subplate 33 and the main heat exchange channel 10. By limiting the range of movement of the pressure rod 322, the limiting screw 325 can prevent excessive force, thereby avoiding damage to the plate heat exchanger subplate 33 and other components.

[0164] The pressure rod sleeve 326 passes through the limit screw 325, providing additional support and guidance, enhancing the stability of the pressure rod 322, and reducing possible shaking or deviation during operation.

[0165] In some possible implementations, the pressure bar 322 is provided with a spring piece 327 on the side facing the plate heat exchange subplate 33, and the spring piece 327 is provided with a protrusion structure 328 relative to the plate heat exchange subplate 33.

[0166] The spring plate 327 has a certain degree of elasticity, which can provide additional buffer and support when the pressure rod 322 applies force, adapt to small dimensional changes caused by thermal expansion or other factors, and ensure stable contact between the heat exchange subplate 33 and the main heat exchange channel 10. The spring plate 327 and the raised structure 328 help to improve heat conduction efficiency and enhance heat dissipation effect.

[0167] The raised structure 328 can concentrate the force on a specific area, ensuring that the pressure applied to the heat exchange subplate 33 of the board is uniform, reducing local stress concentration and lowering the risk of component damage.

[0168] The height of the protrusion 328 on the corresponding spring plate 327 can be designed according to the required compression amount of the heat exchange pad 134. When the pressure rod 322 is lowered and locked, the protrusion 328 on the spring plate 327 will squeeze the plate heat exchange sub-plate 33, causing the spring plate 327 to undergo elastic deformation and generate a certain elastic force on the plate heat exchange sub-plate 33. This force is transmitted through the plate heat exchange sub-plate 33 and compresses the heat exchange pad 134 in the heat conduction groove 133 to meet its fastening force requirements.

[0169] In some possible implementations, the latch 323 includes a locking pin 3231 and a guide ramp 3232. The locking plate 324 is provided with a stop plate 3241 and a lever 3242. The locking pin 3231 is in a limiting engagement with the stop plate 3241, and the lever 3242 is connected to the stop plate 3241. When the pressure rod 322 is pressed until the locking pin 3231 and the stop plate 3241 are in a limiting engagement, locking is achieved. When the lever 3242 is moved to disengage the locking pin 3231 from the stop plate 3241, unlocking is achieved, enabling tool-free installation and improving operational efficiency.

[0170] The locking pin 3231 and the baffle 3241 provide a secure locking mechanism, ensuring that the pressure rod 322 will not loosen when locked, thus maintaining a stable connection between the plate heat exchanger subplate 33 and the main heat exchange channel 10. The guide ramp 3232 helps guide the locking plate 324 into the correct position, reducing the need for precise alignment during operation and making the locking and unlocking process smoother and more intuitive. The presence of the guide ramp 3232 also reduces direct friction between the locking plate 324 and the locking pin 3231, reducing wear and extending the component's lifespan. The design of the lever 3242 allows users to quickly release the locking mechanism with a simple action, simplifying the disassembly process and improving operational efficiency.

[0171] In some embodiments of this application, by unlocking the quick-locking assembly 32 and the locking switch assembly 334, the heat exchange sub-plate 33 of the circuit board can be rotated and lifted along the fixed axis 31, fully exposing the circuit board slot switch. With no components obstructing the upper area, this allows operators to directly unlock the circuit board slot switch. This effectively solves the difficulty of unlocking the memory slot switch through tools between adjacent memory cold plates in existing memory cold plate solutions, greatly improving operational efficiency and safety.

[0172] Please refer to Figures 21 and 22 at the same time. In some possible implementations, the liquid cooling heat dissipation device 100 also includes a leakage detection mechanism 40, which includes a processor leakage detection component and a board leakage detection component.

[0173] The leak detection unit 40 can quickly detect any leaks in the liquid cooling system, promptly issuing alarms or taking automatic protective measures to prevent damage caused by liquid leaks. The processor 202 and board 203 are critical components of the computer system; the leak detection unit 40 specifically monitors these areas, helping to protect these critical components from liquid damage and extend their service life. By quickly detecting and responding to leaks, the system can be repaired before the problem escalates, reducing unexpected downtime caused by liquid leaks and improving system availability. The leak detection unit 40 can be integrated with the system's automated management and monitoring system to achieve real-time monitoring and automated response of the liquid cooling system, improving management efficiency. To meet flexibility requirements, the processor leak detection component and the board leak detection component are designed independently, each with its own independent signal interface connected to the motherboard 201.

[0174] In some possible implementations, the processor leakage detection component includes a second heat exchange mechanism detection element, a second heat exchange mechanism and connecting pipe connection detection element, and a second heat exchange mechanism connecting pipe connection detection element.

[0175] The processor leak detection component is located at various points, including the welded joint of the second heat exchange mechanism, the connection between the second heat exchange mechanism and the connecting pipe, and below the connecting pipes of the second heat exchange mechanism and the maintenance joint. The leak detection line can be secured to metal parts such as the cold plate and joints by wrapping it around the outer diameter of the metal parts, using acetate tape, waterproof tape, or clips. The leak detection line can be secured to the connecting pipes by wrapping the leak detection line and connecting pipes inside a heat-shrink tubing and then heat-shrinking it.

[0176] By installing multiple detection devices at key locations, the system can comprehensively monitor the secondary heat exchange mechanism, connecting pipes, and their connection points, ensuring that any potential leakage problems are detected in a timely manner. Comprehensive leak detection improves the overall reliability of the liquid cooling system, ensuring safe operation under various operating conditions and reducing the risk of failure due to liquid leaks.

[0177] In some possible implementations, the liquid cooling heat dissipation device 100 also includes a cold plate support 80, and the circuit board leakage detection component includes a first guide channel 41, a detection line channel 42, and a leakage detection line 43. The main heat exchange channel 10 is disposed on the cold plate support 80, and the cold plate support 80 has a detection line channel 42 and multiple first guide channels 41 on the side facing the main heat exchange channel 10. The multiple first guide channels 41 are spaced apart, the detection line channel 42 connects the multiple first guide channels 41, and the leakage detection line 43 is disposed in the detection line channel 42. The first guide channels 41 are used to collect and guide the leaked liquid in the main heat exchange channel 10 to prevent the leaked liquid in the main heat exchange channel 10 from spreading to the motherboard 201 and damaging the circuit. The detection trough 42 serves two purposes: firstly, to place and protect the leak detection line 43 from being pulled or rubbed and damaged; secondly, to receive the leaked liquid diverted from the first diversion trough 41. Once a liquid leak is detected, the electrical signal of the leak detection line 43 changes and triggers an alarm. After receiving the alarm signal, the server management module immediately issues an instruction to shut down the server power to avoid loss of equipment and data.

[0178] If the circuit board leak detection component adopts the same installation scheme as the processor leak detection component, the leak detection line needs to be fixed to the main heat exchanger sub-channel 11 with tape to detect leaking liquid. However, in actual use, due to the different structure of the circuit board heat exchanger sub-board 33 and the need for frequent operation of the circuit board 203, the above method is difficult to fix the leak detection line flat and securely on the circuit board heat exchanger sub-board 33. It is easy for the leak detection line to loosen or shift and interfere with the circuit board slot switch during opening and closing, causing damage to the leak detection line due to wear and pulling, and interference with the circuit board slot switch, resulting in failure to lock and causing the circuit board 203 to not be installed properly. Increasing the amount of fixing tape will absorb and isolate some of the leaking liquid, affecting the accuracy of the leak detection system. Therefore, in some embodiments of this application, the circuit board leak detection component takes into account both the convenience of installation and maintenance and the accuracy of the detection function.

[0179] The arrangement of multiple first flow channels 41 effectively guides any potential leaks to specific detection channels 42, ensuring rapid collection and detection of leaks and reducing liquid diffusion within the system. By setting multiple spaced first flow channels 41 and detection channels 42 on the cold plate bracket 80, the system can cover a larger area, ensuring that leaks at any location can be detected, thus improving overall detection coverage. The interconnected design of the detection channels 42 and multiple first flow channels 41 allows the leak detection line 43 to quickly detect liquid in any first flow channel 41, providing timely leak alarms and preventing liquid damage to the system. This design enables efficient and reliable leak detection within a limited space, minimizes interference with the board 203, ensures secure fixation and good contact, and is less prone to damage during installation and maintenance. It reduces the difficulty of production and maintenance operations, effectively improves detection accuracy and installation / maintenance efficiency, and saves server downtime.

[0180] In some possible implementations, a mounting base 19 is provided on the main heat exchange channel 10, which is used to connect the second heat exchange mechanism.

[0181] The fixed base 19 is equipped with a connector. One of the connectors is a female connector and the other is a male connector. The two connectors are mated together to connect the second heat exchange mechanism.

[0182] In some possible implementations, a second guide groove 44 is provided on the main heat exchange channel 10 below the connection port between the second heat exchange mechanism and the fixed base 19, and the second guide groove 44 is connected to the detection line groove 42.

[0183] The second guide channel 44 effectively guides any leaks from the connection port of the second heat exchange mechanism, allowing them to quickly flow into the detection line channel 42, thereby improving the efficiency of leak detection. By connecting the second guide channel 44 to the detection line channel 42, the system can cover a larger detection area, not only limited to the area of ​​board 203, but also including the area near the connection port of the second heat exchange mechanism, ensuring comprehensive monitoring. Since the second guide channel 44 directly penetrates the main heat exchange channel 10, any leaks can be quickly guided to the leak detection line 43 in the detection line channel 42. Therefore, when a leak occurs at the connection port of the second heat exchange mechanism, the leaking liquid will drip onto the surface of the main heat exchange channel 10 under gravity. When the liquid accumulates to a certain volume, it will flow along the second guide channel 44 to the detection line channel 42. The leak detection line 43 arranged in the detection line channel 42 will immediately trigger an alarm after being wetted, thereby achieving a rapid response and reducing the potential damage of the liquid to the system. This design makes the leak detection system more integrated and simplified, reducing the need for additional sensors or complex wiring, and lowering system complexity and cost.

[0184] In some possible implementations, the width of the second guide channel 44 covers the area where leakage may occur at the connection between the fixed base 19 and the second heat exchange mechanism. That is, the width of the second guide channel 44 is greater than the gap between the female and male connectors, so that leakage at the connection of the second heat exchange mechanism can be detected more comprehensively.

[0185] In some possible implementations, the inlet 15 is arranged adjacent to one of the fixed seats 19, and the outlet 16 is arranged adjacent to the other fixed seat 19. The length of the second guide channel 44 covers the inlet 15 and one of the fixed seats 19, or the outlet 16 and the fixed seat 19, so as to simultaneously detect leakage at the inlet 15 and the fixed seat 19, or the outlet 16 and the fixed seat 19.

[0186] The leak detection mechanism 40 of this application effectively solves the leak detection problem at the connection port of the second heat exchange mechanism within a limited space. For movable components such as quick-connect couplings that may be used in the second heat exchange mechanism, which need to be connected during operation and disconnected during maintenance, the accuracy and service life of their leak detection are crucial. If the leak detection line is directly laid along the connection direction of the quick-connect coupling and fixed to it, a terminal block must be provided in the middle of the leak detection line to allow for connection and disconnection. Therefore, in actual use, before unlocking and disconnecting the quick-connect coupling, the terminal block of the leak detection line must be disconnected first, and after the quick-connect coupling is connected and locked, the terminal block of the leak detection line must be reconnected. These operational steps inevitably increase the difficulty and time required for operation, and slight carelessness can cause the leak detection line to be damaged by external force. At the same time, the quick-connect coupling is often a continuous curved surface in the axial direction, making it difficult for the leak detection line to fit well and be fixed to the quick-connect coupling, and it also fails to cover the entire area of ​​the leaking droplet, which also leads to low detection accuracy. The leakage detection mechanism 40 in some embodiments of this application not only avoids the complex leakage detection wire loops wound on the heat exchange subboard 33, solving the interference problem that is easy to occur in practical applications, but also effectively improves the detection accuracy and installation and maintenance efficiency, saving server downtime.

[0187] In some possible implementations, the cold plate bracket 80 is provided with a first positioning pin 81 and a first non-detachable screw 82. The first positioning pin 81 corresponds to the first positioning hole 204 on the motherboard 201, and the first non-detachable screw 82 corresponds to the motherboard screw hole 205 on the motherboard.

[0188] The first locating pin 81 corresponds to the locating hole 204 on the motherboard, ensuring that the cold plate bracket 80 can be accurately positioned on the motherboard 201. This helps ensure proper alignment of the cold plate bracket 80 with the processor 202 or other components, thereby optimizing heat transfer efficiency. The design of the first locating pin 81 and the first captive screw 82 makes the installation process simpler and more intuitive, reducing the possibility of installation errors, improving operational efficiency, and facilitating the maintenance and replacement of the cold plate bracket 80 and related components. Users can easily remove and reinstall these components, reducing maintenance costs. Users can easily fix the cold plate bracket 80 in place without complex adjustments. The design of the first captive screw 82 ensures that the screw will not fall out during installation and maintenance, reducing the risk of losing screws, while ensuring that the cold plate bracket 80 remains stable during use, preventing loosening due to vibration or movement.

[0189] In some possible implementations, the main heat exchange channel 10 is provided with a second positioning hole 17 and a second captive screw 18, and the cold plate bracket 80 is provided with a second positioning pin 83 and a bracket screw hole 84. The second positioning pin 83 corresponds to the second positioning hole 17, and the second captive screw 18 corresponds to the bracket screw hole 84.

[0190] The second positioning pin 83 corresponds to the second positioning hole 17, ensuring the precise alignment of the cold plate bracket 80 and the main heat exchange channel 10, which helps to optimize the liquid flow path and heat transfer efficiency, and ensures the efficient operation of the system.

[0191] The design of the second locating pin 83 and the second captive screw 18 makes the installation process simpler and more intuitive. Users can easily fix the main heat exchange channel 10 to the cold plate bracket 80 without complicated adjustments, reducing the possibility of installation errors and facilitating the maintenance and replacement of the main heat exchange channel 10 and related components. Users can easily remove and reinstall these components, reducing maintenance costs. The design of the second captive screw 18 ensures that the screw will not fall out during installation and maintenance, reducing the risk of lost screws and screwdriver slippage, while ensuring that the main heat exchange channel 10 remains stable during use and preventing loosening due to vibration or movement.

[0192] In some possible implementations, the liquid cooling heat dissipation device 100 also includes a liquid supply and return connector assembly 50, which is connected to the main heat exchange channel 10. The liquid supply and return connector assembly 50 is mainly used to open and close the cooling liquid flow path inside the server 200.

[0193] The introduction of the supply and return fluid connector assembly 50 allows the coolant to circulate within the main heat exchange channel 10, carrying away heat generated by electronic components such as the processor 202 and board 203, thereby achieving efficient thermal management and heat dissipation. The supply and return fluid connector assembly 50 can be integrated with external cooling systems (such as chillers or radiators) to provide flexible heat dissipation solutions adaptable to different application requirements and environmental conditions. Through continuous liquid circulation, the liquid cooling device 100 can maintain a stable temperature within the system, preventing overheating and improving the performance and reliability of electronic equipment.

[0194] In some possible implementations, the coolant supply and return connector assembly 50 is fixed to the far left of the rear window of the server 200. After being connected to the cabinet-side water distributor through the coolant supply and return quick connector 206, the coolant circuit is made open, achieving maximum separation of water and electricity from the power module on the right side of the server 200.

[0195] In some possible implementations, the supply and return liquid connection assembly 50 includes an inlet liquid line 51 and a return liquid line 52, with the inlet liquid line 51 connected to one side of the main heat exchange channel 10 and the return liquid line 52 connected to the other side of the main heat exchange channel 10.

[0196] The coolant enters the liquid cooling heat dissipation device 100 of the server 200 through the supply and return quick connector 206, and reaches the first main heat exchange sub-channel 111 through the inlet pipe 51. The coolant flowing out of the third main heat exchange sub-channel 113 is returned to the supply and return quick connector 206 through the return pipe 52, thus completing the entire circulation process of the coolant in the server 200.

[0197] By connecting the inlet pipe 51 and the return pipe 52 to both sides of the main heat exchange channel 10, a complete circulation path is formed, ensuring that the coolant can effectively flow through the entire main heat exchange channel 10, carrying away the heat generated by the equipment and achieving efficient heat exchange. This design allows for flexible configuration of the coolant flow direction and flow rate to adapt to different heat dissipation requirements and system configurations, providing greater design and application flexibility.

[0198] Please refer to Figure 23. During installation, the first step is to install the cold plate bracket 80. Align all the first positioning pins 81 on the cold plate bracket 80 with the first positioning holes 204 on the main board 201. At this time, the first captive screws 82 can also be aligned with the screw holes 205 on the main board. Tighten the first captive screws 82 in place. The second step is to lift the pressure rod 322 and rotate all the heat exchange subplates 33 around the fixed axis 31 to the maximum elevation angle. Then, lower the pressure rod 322 and lock it. Then, rotate all the heat exchange subplates 33 around the fixed axis 31 in the opposite direction and rest them against the pressure rod 322. The pressure rod 322 acts as a stop and limit for the heat exchange subplates 33, preventing them from falling further. The third step is to align the second positioning hole 17 on the main heat exchange channel 10 with the second positioning pins 83 on the cold plate bracket 80, and lower the main heat exchange channel 10 and the heat exchange subplates 33 together. At this point, the second captive screw 18 on the main heat exchange channel 10 is aligned with the bracket screw hole 84 on the cold plate bracket 80, and the second captive screw 18 is tightened into place. Then, the supply and return liquid connector assembly 50 is fixed to the rear window of the chassis by screws. Fourth step, install the board heat exchange sub-plate 33, insert the board 203, and lift the pressure rod 322 to rotate all the board heat exchange sub-plates 33 around the fixed axis 31 to the position covering the particles of the board 203, then lower and lock the pressure rod 322, and finally pull the locking switch assembly 334 to press the board 203. Fifth step, install the leakage detection line signal interface. Connect the leakage detection line signal interfaces of the second heat exchange mechanism and the board heat exchange sub-plate 33 to the motherboard 201 according to the tag number to complete the installation of the entire liquid cooling system.

[0199] The liquid cooling heat dissipation device 100 provided in some embodiments of this application includes a main heat exchange channel 10 and a plate heat exchange mechanism 30. The plate heat exchange mechanism 30 includes a fixed shaft 31, a quick-locking assembly 32 and a plurality of plate heat exchange sub-plates 33. The plate heat exchange sub-plates 33 are inserted through the fixed shaft 31 and clamped with corresponding plates 203. The quick-locking assembly 32 is used to fix the plate heat exchange sub-plates 33 and abut against the main heat exchange channel 10 so that the plate heat exchange sub-plates 33 and the main heat exchange channel 10 can exchange heat. The heat exchange subplate 33 includes a main cold plate 331, a secondary cold plate 332, a thermal pad 333, and a locking switch assembly 334. Along the thickness direction of the board 203, the main cold plate 331 is located on one side of the board 203, and the secondary cold plate 332 is movably disposed on the main cold plate 331 and located on the other side of the board 203. The thermal pad 333 is disposed on the side of the main cold plate 331 and the secondary cold plate 332 facing the board 203. The main cold plate 331 and the secondary cold plate 332 are mounted on the fixed shaft 31. The locking switch assembly 334 is disposed on the main cold plate 331 and is used to drive the secondary cold plate 332 to move toward the main cold plate 331 so as to press the secondary cold plate 332 and the thermal pad 333 on the main cold plate 331 onto the board 203.

[0200] The heat exchange subplate 33 is mounted on the fixed shaft 31 and fixed by the quick-locking assembly 32, abutting against the main heat exchange channel 10. The heat exchange subplate 33 clamps the corresponding board 203. Therefore, when it is necessary to replace the board 203, it is only necessary to open the quick-locking assembly 32 and rotate the heat exchange subplate 33 of the corresponding board 203 around the fixed shaft 31 to remove the board 203 and replace it with a new board 203. There is no need to remove the heat exchange subplate 33 for disassembly and assembly, which greatly simplifies the replacement process of the board 203. The heat exchange subplate 33 is mounted on the fixed shaft 31, so it can move freely on the fixed shaft 31. During actual assembly, it can self-adapt and precisely adjust its position according to the position of the board 203 to ensure the best contact and heat exchange efficiency between the heat exchange subplate 33 and the board 203, achieve the best fit, and improve the heat dissipation effect.

[0201] Because the liquid cooling heat dissipation device 100 of this application supports independent disassembly and maintenance of the processor 202 and the board 203, maintenance personnel can replace and maintain components more quickly, which greatly improves the flexibility, maintainability, convenience and security of production, testing and maintenance, reduces downtime and improves the availability and maintenance efficiency of the server 200.

[0202] In addition, some embodiments of this application also provide a server 200, including a motherboard 201, a processor 202, a board 203 and the above-mentioned liquid cooling heat dissipation device 100. The processor 202 and the board 203 are disposed on the motherboard 201, and the liquid cooling heat dissipation device 100 is used to dissipate heat for the board 203.

[0203] Given that the server 200 includes the liquid cooling heat dissipation device 100 described in any of the above embodiments in some embodiments of this application, the structure and beneficial effects of the liquid cooling heat dissipation device 100 in the server 200 will not be described in detail here.

[0204] As shown in Figures 24, 25, and 26, the liquid cooling device 1000 provided in some embodiments of this application is used in a server 2000. The server 2000 includes a motherboard 201, a processor 202, memory 903, and the liquid cooling device 1000. The processor 202 and memory 903 are mounted on the motherboard 201. The liquid cooling device 1000 is used to perform liquid cooling to reduce the temperature of the processor 202 and memory 903.

[0205] In some possible implementations, processor 202 includes a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit).

[0206] In some possible implementations, Server 2000 is a dual-socket general-purpose server.

[0207] The liquid cooling system 1000 includes a main heat exchange channel 10, a processor heat exchange mechanism 20, and a memory heat exchange mechanism 90. The main heat exchange channel 10 is connected to the coolant flow path. The processor heat exchange mechanism 20 is connected to the main heat exchange channel 10. The processor heat exchange mechanism 20 is mounted on the processor 202 and is used to cool the processor 202. The memory heat exchange mechanism 90 makes heat exchange contact with the main heat exchange channel 10. The memory heat exchange mechanism 90 holds the memory module 903 and is used to cool the memory module 903.

[0208] In some possible implementations, the processor heat exchange mechanism 20 is detachably connected to the main heat exchange channel 10 via a quick-connect assembly 21, so that the processor heat exchange mechanism 20 is in communication with the main heat exchange channel 10.

[0209] Referring also to Figure 28, in some possible implementations, the memory heat exchange mechanism 90 includes a fixed shaft 31, a quick-locking assembly 32, and multiple memory heat exchange sub-plates 93. The memory heat exchange sub-plates 93 are mounted on the fixed shaft 31, allowing them to rotate around and slide axially along the fixed shaft 31. The memory heat exchange sub-plates 93 are used to clamp onto corresponding memory modules 903. The quick-locking assembly 32 secures and abuts the multiple memory heat exchange sub-plates 93 against the main heat exchange channel 10, enabling heat exchange between the memory heat exchange sub-plates 93 and the main heat exchange channel 10.

[0210] Specifically, the quick-locking assembly 32 applies pressure to the memory heat exchange subplate 93, causing the memory heat exchange subplate 93 to press against the main heat exchange channel 10, thereby enabling the memory heat exchange subplate 93 to exchange heat with the main heat exchange channel 10.

[0211] In some possible implementations, multiple memory modules 903 are arranged sequentially on the motherboard 201. The axis of the fixed shaft 31 is parallel to the arrangement direction of the multiple memory modules 903. The quick-locking component 32 is located on one side of the memory modules 903 and presses the multiple memory heat exchange subplates 93 rotatably mounted on the fixed shaft 31 onto the corresponding memory modules 903 along the arrangement direction of the multiple memory modules 903.

[0212] Because the processor heat exchange mechanism 20 is connected to the main heat exchange channel 10 by using the quick connector assembly 21, when only the processor 202 or the processor heat exchange mechanism 20 needs to be replaced, the processor heat exchange mechanism 20 and the main heat exchange channel 10 can be quickly connected and disconnected by the quick connector assembly 21. Then the processor heat exchange mechanism 20 can be disassembled and installed separately without having to disassemble the memory heat exchange mechanism 90 and the memory 903 together.

[0213] The memory heat exchange subplate 93 is mounted on the fixed shaft 31 and fixed by the quick-locking assembly 32, abutting against the main heat exchange channel 10. The memory heat exchange subplate 93 clamps the corresponding memory 903. Therefore, when the memory 903 needs to be replaced, it is only necessary to open the quick-locking assembly 32 and rotate the memory heat exchange subplate 93 corresponding to the memory 903 around the fixed shaft 31 to remove the memory 903 and replace it with a new memory 903. There is no need to remove the memory heat exchange subplate 93 for disassembly and assembly, which greatly simplifies the replacement process of the memory 903. The memory heat exchange subplate 93 is mounted on the fixed shaft 31, so it can move freely on the fixed shaft 31. During actual assembly, it can self-adapt and precisely adjust its position according to the position of the memory 903 to ensure the best contact and heat exchange efficiency between the memory heat exchange subplate 93 and the memory 903, achieve the best fit, improve the structural compatibility and reliability of the memory heat exchange subplate 93, and improve the heat dissipation effect.

[0214] In scenarios where only the memory heat exchange mechanism 90 needs replacement (i.e., the memory 903 uses air cooling), it is not necessary to disassemble the processor heat exchange mechanism 20, disconnect the quick connector assembly 21, or remove the main heat exchange channel 10 and related components such as the memory heat exchange mechanism 90. Simply connecting two supply and return fluid lines to the rack manifold via the quick connector assembly 21 is sufficient to allow coolant to flow, saving the time required to replace the processor heat exchange mechanism 20 and apply thermal paste.

[0215] Because the liquid cooling heat dissipation device 1000 of this application supports independent disassembly and maintenance of the processor 202 and memory 903, maintenance personnel can replace and maintain components more quickly, reducing unnecessary disassembly and assembly of the required heat dissipation electronic components. This greatly improves the flexibility, maintainability, convenience and security of production, testing and maintenance, reduces downtime, improves the availability and maintenance efficiency of the server 2000, and improves the structural compatibility and reliability of the memory heat exchange mechanism 90. It can meet various maintenance scenarios in data centers, and helps to reduce the failure rate of liquid cooling components and electronic components, and reduce development and maintenance costs.

[0216] Meanwhile, the application of quick-connect assembly 21 and quick-locking assembly 32 enables tool-free installation, reduces the risk of misoperation during disassembly and assembly, and enhances the safety and reliability of the system.

[0217] In some possible implementations, the quick connector assembly 21 includes an inlet quick connector 211 and an outlet quick connector 212. The inlet quick connector 211 connects one side of the main heat exchange channel 10 to the processor heat exchange mechanism 20, and the outlet quick connector 212 connects the other side of the main heat exchange channel 10 to the processor heat exchange mechanism 20.

[0218] The design of the inlet quick connector 211 and outlet quick connector 212 ensures that the coolant can circulate efficiently between the main heat exchange channel 10 and the processor heat exchange mechanism 20, carrying away the heat generated by the processor 202 and achieving efficient heat dissipation. The design of the inlet quick connector 211 and outlet quick connector 212 provides flexible system configuration options, allowing users to adjust the flow path and direction of the coolant according to specific needs, adapting to different heat dissipation requirements.

[0219] The quick-connect assembly 21 allows users to easily connect and disconnect the liquid lines of the processor heat exchange mechanism 20, simplifying the system installation and disassembly process and improving operational convenience and efficiency. Quick-connects typically have excellent sealing performance, effectively reducing the risk of liquid leakage and ensuring system safety and reliability.

[0220] Please also refer to Figure 27. In some possible implementations, the liquid cooling heat dissipation device 1000 includes multiple processor heat exchange mechanisms 20, and adjacent processor heat exchange mechanisms 20 are connected by processor heat exchange connection pipes 23.

[0221] Multiple processor heat exchange mechanisms 20 are connected via processor heat exchange connection pipes 23, allowing coolant to circulate among them, ensuring uniform temperature distribution within the system and preventing localized overheating. The series design of multiple processor heat exchange mechanisms 20 optimizes coolant flow paths, improves heat exchange efficiency, and ensures sufficient cooling for each processor 202. The modular design of the multiple processor heat exchange mechanisms 20 and processor heat exchange connection pipes 23 facilitates system expansion and upgrades, supports application scenarios of varying scales and complexities, and reduces manufacturing and maintenance costs.

[0222] In some possible implementations, the liquid cooling device 1000 includes two processor heat exchange mechanisms 20. A quick-connect liquid inlet 211 is connected to one of the processor heat exchange mechanisms 20 via a processor inlet pipe 24, and the two processor heat exchange mechanisms 20 are connected to each other via a processor heat exchange connection pipe 23. The other processor heat exchange mechanism 20 is connected to a quick-connect liquid outlet 212 via a processor outlet pipe 25, thereby connecting the two processor heat exchange mechanisms 20 to the main heat exchange channel 10.

[0223] The cooling liquid on one side of the main heat exchange channel 10 is divided into two branches by the inlet quick connector 211. The first branch enters the inlet quick connector 211 from the main heat exchange channel 10, then enters the first processor heat exchange mechanism 20 through the processor inlet pipe 24, then enters the second processor heat exchange mechanism 20 through the processor heat exchange connection pipe 23, and finally flows into the outlet quick connector 212 through the processor outlet pipe 25 and flows to the other side of the main heat exchange channel 10. The second branch passes through three sets of first main heat exchange sub-channels 111, second main heat exchange sub-channels 112 and third main heat exchange sub-channels 113 in sequence. After absorbing the heat conducted by the memory heat exchange mechanism 90, it merges with the first branch and returns to the supply and return quick connector 206 through the return pipe 52, forming a complete liquid loop within the server 2000.

[0224] In some possible implementations, the main heat exchange channel 10 includes multiple main heat exchange sub-channels 11, which are connected sequentially via connecting pipes 12.

[0225] In some possible implementations, the main heat exchange channel 10 includes a first main heat exchange sub-channel 111, a second main heat exchange sub-channel 112, and a third main heat exchange sub-channel 113. The connecting pipe 12 includes a first branch connecting pipe 121 and a second branch connecting pipe 122. The first main heat exchange sub-channel 111 and the second main heat exchange sub-channel 112 are connected through the first branch connecting pipe 121, and the second main heat exchange sub-channel 112 and the third main heat exchange channel 113 are connected through the second branch connecting pipe 122.

[0226] By dividing the main heat exchange channel into multiple sub-channels, segmented heat dissipation can be achieved. Each sub-channel can focus on the heat management of a specific area or component, thereby improving the overall heat dissipation efficiency.

[0227] In some possible implementations, the first main heat exchanger sub-channel 111 and the third main heat exchanger sub-channel 113 are located in the same row and are arranged opposite to the second main heat exchanger sub-channel 112.

[0228] In some possible implementations, the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113 are located behind the processor 202 and the memory 903, while the second main heat exchange sub-channel 112 is located in front of the processor 202 and the memory 903. The first main heat exchange sub-channel 111 is connected to the processor heat exchange mechanism 20 via a quick connector assembly 21, and the third main heat exchange sub-channel 113 is connected to the processor heat exchange mechanism 20 via a quick connector assembly 21, thereby diverting the fluid from the main heat exchange sub-channel 10 to the processor heat exchange mechanism 20.

[0229] Please also refer to Figure 29. In some possible implementations, the first main heat exchanger sub-channel 111 is provided with a liquid distribution port 114, and the third main heat exchanger sub-channel 113 is provided with a liquid collection port 115. The liquid inlet quick connector 211 is connected to the liquid distribution port 114, and the liquid outlet quick connector 212 is connected to the liquid collection port 115.

[0230] When the inlet quick connector 211 and outlet quick connector 212 are connected, the first branch enters the inlet quick connector 211 from the liquid distribution port 114 on the side wall of the first main heat exchange sub-channel 111. The coolant passes through the processor inlet pipe 24 and the processor heat exchange connection pipe 23 and enters the two processor heat exchange mechanisms 20 in sequence, continuously carrying away the heat generated by the processor 202 chip during operation to ensure that the temperature of the processor 202 chip remains within the normal range. Subsequently, the coolant passes through the processor outlet pipe 25 and the outlet quick connector 212 to reach the liquid collection port 115 on the third main heat exchange sub-channel 113.

[0231] The second branch flows through the channel within the first main heat exchanger sub-channel 111 on the rear side. After changing the coolant flow direction via the first branch connecting pipe 121, it reaches the second main heat exchanger sub-channel 112 near the front of the chassis. In the second main heat exchanger sub-channel 112 on the front side, the coolant absorbs heat transferred from the memory heat exchanger sub-plate 93 and flows out. Then, it reaches the third main heat exchanger sub-channel 113 on the rear side via the second branch connecting pipe 122. Subsequently, it flows along the channel within the third main heat exchanger sub-channel 113 on the rear side and merges with the coolant from the first branch at the collector port 115.

[0232] In some possible implementations, the ends of the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113 opposite to each other, and both ends of the second main heat exchange sub-channel 112, are respectively provided with sub-channel connectors 116. The sub-channel connector 116 of the first main heat exchange sub-channel 111 is connected to the sub-channel connector 116 on one side of the second main heat exchange sub-channel 112 through a first branch connecting pipe 121. The sub-channel connector 116 on the other side of the second main heat exchange sub-channel 112 is connected to the sub-channel connector 116 of the third main heat exchange sub-channel 113 through a second branch connecting pipe 122.

[0233] Please refer to Figures 30, 31, and 32 simultaneously. In some possible implementations, the main heat exchange sub-channel 11 includes a cover plate 13 and a base plate 14. The cover plate 13 has a flow channel cavity 131, and the base plate 14 covers the flow channel cavity 131. The processor heat exchange mechanism 20 is connected to the flow channel cavity 131, and the memory heat exchange sub-plate 93 abuts against the cover plate 13.

[0234] The combination of cover plate 13 and base plate 14 provides a closed and robust structure, ensuring the integrity and sealing of the flow channel cavity 131, preventing coolant leakage, and improving system reliability. Simultaneously, the design of the flow channel cavity 131 can be optimized for fluid paths according to specific heat dissipation requirements, ensuring maximum contact between the coolant and the heat source during flow, thereby improving heat exchange efficiency.

[0235] The design of the flow channel cavity 131 allows coolant to flow inside the cover plate 13 and directly communicate with the processor heat exchange mechanism 20, achieving efficient heat exchange and quickly removing the heat generated by the processor 202, thus improving heat dissipation efficiency. Due to the direct communication between the processor heat exchange mechanism 20 and the flow channel cavity 131, the processor heat exchange mechanism 20 can be easily disassembled and replaced during maintenance without affecting the installation of the memory heat exchange daughterboard 93, improving system maintainability.

[0236] The memory heat exchange subplate 93 is directly abutted against the cover plate 13, which allows the memory heat exchange subplate 93 to exchange heat with the coolant in the flow channel cavity 131 more flexibly, reducing the thermal resistance in the heat transfer path, and allowing the heat generated by the memory 903 to be transferred to the coolant more quickly.

[0237] In some possible implementations, a rib structure 132 is provided in the flow channel cavity 131, the rib structure 132 protrudes from the flow channel cavity 131 and is arranged along the extension direction of the flow channel cavity 131.

[0238] The rib structure 132 increases the surface area within the flow channel cavity 131, thereby expanding the contact area between the coolant and the flow channel wall, improving heat exchange efficiency, and enabling heat to be transferred more quickly from the heat source to the coolant. The rib structure 132 can guide the flow path of the coolant within the flow channel cavity 131, ensuring that the fluid is evenly distributed throughout the flow channel and avoiding flow dead zones or localized overheating.

[0239] Meanwhile, the rib structure 132 can disturb the flow of coolant and promote the formation of turbulence. Compared with laminar flow, fluid in turbulent flow has a higher heat transfer capacity, thereby improving the convective heat transfer between the flow channel cavity 131 and the coolant, and can more effectively remove heat.

[0240] The rib structure 132 not only helps to improve heat exchange efficiency, but also enhances the structural strength of the flow channel cavity 131, acting as a reinforcing rib to improve the flow channel cavity 131's ability to withstand liquid pressure and prevent deformation or rupture under high pressure conditions.

[0241] The shape and spacing of the rib structure 132 can be designed and adjusted according to specific heat dissipation requirements to achieve the best thermal management effect.

[0242] In some possible implementations, the base plate 14 is provided with a shovel-tooth structure 141, which is located in the flow channel cavity 131 along the extending direction of the flow channel cavity 131. The shovel-tooth structure 141 is distributed directly below the contact area between the flow channel cavity 131 and the internal heat exchange subplate 93.

[0243] The shovel-tooth structure 141 increases the surface area within the flow channel cavity 131, thereby expanding the contact area between the coolant and the flow channel wall, improving heat exchange efficiency, and enabling heat to be transferred more quickly from the heat source to the coolant. The shovel-tooth structure 141 can guide the flow path of the coolant within the flow channel cavity 131, ensuring that the fluid is evenly distributed throughout the flow channel and avoiding flow dead zones or localized overheating.

[0244] Meanwhile, the toothed structure 141 can disturb the flow of coolant and promote the formation of turbulence. Compared with laminar flow, fluid in turbulent flow has a higher heat transfer capacity and can more effectively remove heat.

[0245] The shovel tooth structure 141 not only helps to improve heat exchange efficiency, but also enhances the structural strength of the flow channel cavity 131, improves its pressure resistance, and prevents deformation or cracking under high pressure conditions.

[0246] The shape, length, height, and spacing of the shovel tooth structure 141 can be designed and adjusted according to specific heat dissipation requirements to achieve the best thermal management effect.

[0247] In some possible implementations, the rib structure 132 is located in the middle of the flow channel cavity 131 to divide the flow channel cavity 131 into two parts, and multiple shovel tooth structures 141 are located in the flow channel cavities 131 on both sides respectively. The tooth tips of the shovel tooth structures 141 are welded to the cover plate 13 to further divert the flow in the flow channel cavity 131 to form multiple microchannels.

[0248] In some possible implementations, the first main heat exchanger sub-channel 111 is provided with an inlet 15. The third main heat exchanger sub-channel 113 is provided with an outlet 16. The inlet 15 and the outlet 16 are located in the middle of the first main heat exchanger sub-channel 111 and the third main heat exchanger sub-channel 113, respectively, and the flow baffle structure is divided in the flow channel cavity 131 of the first main heat exchanger sub-channel 111 and the third main heat exchanger sub-channel 113 by the rib structure 132.

[0249] After the coolant enters the first main heat exchanger sub-channel 111 through inlet 15, part of the liquid enters the inlet quick connector 211 through the distributor port 114, forming the first branch. The other part flows along the flow channel cavity 131 of the first main heat exchanger sub-channel 111, forming the second branch. After flowing in the first main heat exchanger sub-channel 111 towards the third main heat exchanger sub-channel 113, it undergoes a deflection and flows away from the third main heat exchanger sub-channel 113. Then, it enters the first branch connecting pipe 121 through the sub-channel connector 116, passes through the second main heat exchanger sub-channel 112, and reaches the rear third main heat exchanger sub-channel 113 through the second branch connecting pipe 122. Subsequently, it flows along the channel in the third main heat exchanger channel 113 to the first main heat exchanger channel 111, and after one deflection, it merges with the coolant of the first branch at the liquid collection port 115, and flows out of the main heat exchanger channel 10 through the outlet 16.

[0250] In some possible implementations, the fixed shaft 31 is disposed on the cover plate 13, and the axial direction of the fixed shaft 31 is the same as the extension direction of the flow channel cavity 131 in the cover plate 13, thereby arranging multiple internal heat exchange subplates 93 sequentially along the extension direction of the flow channel cavity 131.

[0251] Please also refer to Figure 33. In some possible implementations, multiple memory heat exchange sub-plates 93 are divided into two groups along the length of the memory 903. The two groups of memory heat exchange sub-plates 93 are arranged opposite each other, and each group of memory heat exchange sub-plates 93 clamps one end of the corresponding memory 903 along the length of the memory 903. The memory heat exchange sub-plates 93 at both ends are axially symmetrical to each other, and are combined to form a set of memory heat exchange sub-plates 93, which together dissipate heat for one memory 903.

[0252] By dividing the memory heat exchange subplates 93 into two groups and clamping one end of the memory 903 along its length, the length of the memory heat exchange subplates 93 is reduced. This reduction in length improves the resistance to stress bending and deformation, effectively increasing the rigidity of each subplate and reducing the risk of deformation during contact and insertion / removal of the memory 903. This enhances the overall structural stability and helps maintain good contact between the subplates 93 and the memory 903 during installation and removal, ensuring excellent heat dissipation. Furthermore, the separation between the two subplates 93 effectively prevents damage to the protruding chip in the center of the memory 903 during insertion and removal.

[0253] The memory heat exchanger sub-board 93 is connected to the main heat exchange channel 10 via a fixed shaft 31, allowing it to move freely on the fixed shaft 31. During actual assembly, the memory heat exchanger sub-board 93 can adaptively and precisely adjust its position according to the location of the memory 903, effectively resolving the issue of poor fit between the memory heat exchanger sub-board 93 and the memory 903 caused by assembly tolerances of related components within the server 2000, ensuring optimal compatibility with the memory 903.

[0254] Please refer to Figures 34, 35, 36, and 37 simultaneously. In some possible implementations, the memory heat exchange subplate 93 includes a main cold plate 331, a secondary cold plate 332, a thermal pad 333, and a locking switch assembly 334. Along the thickness direction of the memory 903, the main cold plate 331 is located on one side of the memory 903. The secondary cold plate 332 is movably mounted on the main cold plate 331 and located on the other side of the memory 903. The thermal pad 333 is located on the side of the main cold plate 331 and the secondary cold plate 332 facing the memory 903. The main cold plate 331 and the secondary cold plate 332 pass through a fixed shaft 31. The locking switch assembly 334 is located on the main cold plate 331 and is used to drive the secondary cold plate 332 to move towards the main cold plate 331, thereby pressing the secondary cold plate 332 and the thermal pad 333 on the main cold plate 331 onto the memory 903.

[0255] Thermal pads 333 are placed on the side of the main cold plate 331 and the secondary cold plate 332 facing the memory 903, ensuring good thermal contact between the memory heat exchange sub-board 93 and the memory 903, improving heat conduction efficiency, and enabling more effective transfer of the heat generated by the memory 903 to the memory heat exchange sub-board 93 for heat dissipation.

[0256] The secondary cold plate 332 is movably mounted on the main cold plate 331 and is adjustable via the locking switch assembly 334, allowing adjustment during installation based on the actual thickness of the memory 903 to ensure tight contact between the memory heat exchange subplate 93 and the memory 903.

[0257] The locking switch assembly 334 drives the secondary cold plate 332 towards the main cold plate 331, achieving rapid locking. This simplifies the installation and removal process of the memory heat exchanger sub-board 93, reduces operation time, and improves maintenance efficiency. Adjustment of the locking switch assembly 334 provides appropriate clamping force, preventing excessive mechanical stress on the memory 903 and reducing the risk of damage. The locking switch assembly 334 enhances the overall reliability of the system, ensuring good thermal contact between the memory heat exchanger sub-board 93 and the memory 903 under various operating conditions.

[0258] The memory heat exchanger sub-board 93 improves the structural compatibility, reliability, and operational flexibility of the memory cold plate, solving problems such as difficulty in inserting and removing memory 903 modules, poor contact of the heat dissipation surface, and cumbersome replacement procedures. The memory heat exchanger sub-board 93 is designed as a two-part structure, with two sub-boards 93, each approximately half the length of a memory 903 module, combined to achieve heat dissipation for each memory 903 module. Each sub-board 93 is equipped with a locking switch assembly 334 for quick locking. This assembly not only provides adjustable spring force to ensure good contact and required clamping force between the thermal pad 333 and the memory 903 module, but also allows for manual quick locking and unlocking of the memory heat exchanger sub-board 93 and the memory 903 module, reducing the failure rate of the memory 903 module and further extending its lifespan.

[0259] In some possible implementations, the main cold plate 331 includes a base plate 3311 and a reinforcing frame 3312. The base plate 3311 is mounted on the fixed shaft 31, the reinforcing frame 3312 is mounted on the base plate 3311, the secondary cold plate 332 is movably mounted on the reinforcing frame 3312, and the locking switch assembly 334 is mounted on the reinforcing frame 3312.

[0260] In some possible implementations, the reinforcing frame 3312 is designed on the top of the substrate 3311. On the one hand, it is used to strengthen the rigidity of the substrate 3311 and prevent deformation caused by squeezing with the memory 903 during use. On the other hand, the reinforcing frame 3312 can provide mounting holes for the locking switch assembly 334 and will not interfere with the memory 903 during operation.

[0261] The introduction of the reinforcing frame 3312 improves the overall rigidity and strength of the main cold plate 331, reduces possible deformation of the memory heat exchange subplate 93 during installation and use, ensures stable contact between the memory heat exchange subplate 93 and the memory 903, and improves heat dissipation efficiency. The reinforcing frame 3312 helps to evenly distribute the pressure applied to the locking switch assembly 334 during the locking process, avoiding excessive local stress on the memory 903 and reducing the risk of damage to the memory 903.

[0262] In some possible implementations, the substrate 3311 is provided with a limiting groove 3313 for accommodating the thermal pad 333.

[0263] The limiting groove 3313 provides a clear mounting position for the thermal pad 333, ensuring its precise positioning between the main cold plate 331 and the memory 903. This helps maintain the effective contact area of ​​the thermal pad 333 and improves heat transfer efficiency. The limiting groove 3313 also effectively prevents the thermal pad 333 from moving or sliding during installation and use, ensuring it remains in the optimal position and avoiding a decrease in heat dissipation performance due to misalignment.

[0264] The limiting groove 3313 provides a fixed position for the thermal pad 333, simplifying the installation process, reducing the possibility of installation errors, and improving operational efficiency. At the same time, the limiting groove 3313 can also protect the edges of the thermal pad 333 to a certain extent, reducing damage caused by mechanical stress or friction, thereby extending the service life of the thermal pad 333.

[0265] In some possible implementations, a heat pipe groove 3314 is provided on the side of the substrate 3311 away from the limiting groove 3313, and the heat pipe groove 3314 is used to embed the heat pipe 3315.

[0266] The heat pipe 3315 is a highly efficient heat transfer device that can quickly transfer heat. By embedding the heat pipe 3315 on the substrate 3311, heat can be transferred more quickly from the memory 903 area to other parts, improving the heat dissipation efficiency of the main cold plate 331.

[0267] The design of the heat pipe groove 3314 allows the heat pipe 3315 to be tightly embedded in the substrate 3311, ensuring that heat is evenly distributed along the length of the heat pipe 3315. This helps to avoid localized overheating and improves the temperature uniformity of the memory 903. Embedding the heat pipe 3315 into the substrate 3311 through the heat pipe groove 3314 makes the main cold plate 331 more compact and does not significantly increase the volume of the memory heat exchange sub-plate 93. The heat pipe groove 3314 ensures close contact between the heat pipe 3315 and the substrate 3311, reducing thermal resistance in the heat transfer path and improving heat conduction efficiency.

[0268] In some possible implementations, the secondary cold plate 332 has a thermal pad groove 3321 on the side facing the memory 903, which is used to accommodate the thermal pad 333.

[0269] The thermal pad groove 3321 provides a clear mounting position for the thermal pad 333, ensuring precise positioning of the thermal pad 333 between the secondary cold plate 332 and the memory 903. This helps maintain the effective contact area of ​​the thermal pad 333 and improves heat transfer efficiency. The thermal pad groove 3321 also effectively prevents the thermal pad 333 from moving or sliding during installation and use, ensuring that the thermal pad 333 is always in the optimal position and avoiding a decrease in heat dissipation performance due to positional misalignment.

[0270] The thermal pad groove 3321 provides a fixed position for the thermal pad 333, simplifying the installation process, reducing the possibility of installation errors, and improving operational efficiency. At the same time, the thermal pad groove 3321 can also protect the edges of the thermal pad 333 to a certain extent, reducing damage caused by mechanical stress or friction, thereby extending the service life of the thermal pad 333.

[0271] The thermal pads 333 on the main cold plate 331 and the secondary cold plate 332 have the same hardness. Therefore, the force applied by the locking switch assembly 334 to the main cold plate 331 and the secondary cold plate 332 is the same. As a result, the clamping force on the two sides of the memory 903 is also consistent. This avoids the problem of different contact methods or size deviations on both sides of the memory 903 causing different forces that would cause the memory 903 to tilt to one side. It also avoids stress damage to the gold fingers of the memory 903 and the memory slot, which helps to reduce the failure rate of the memory 903 and further improve its service life.

[0272] In some possible implementations, one of the main cold plate 331 and the secondary cold plate 332 is provided with a guide pin 3316, and the other is provided with a guide hole 3322 opposite to the guide pin 3316.

[0273] The design of guide pin 3316 and guide hole 3322 ensures that the main cold plate 331 and the secondary cold plate 332 can be precisely aligned during installation, which helps to ensure good contact between the memory heat exchange subplate 93 and the memory 903 and improves heat transfer efficiency.

[0274] Guide pins 3316 and guide holes 3322 provide a simple and effective alignment mechanism, making the installation process more intuitive and convenient, reducing the possibility of installation errors, and improving operational efficiency. During use, guide pins 3316 and guide holes 3322 effectively prevent relative misalignment between the main cold plate 331 and the secondary cold plate 332, ensuring that the internal heat exchange subplate 93 maintains a stable structure during operation.

[0275] In some possible implementations, the substrate 3311 and the auxiliary cold plate 332 are provided with through holes 336 for passing through the fixed shaft 31. The through holes 336 and the fixed shaft 31 cooperate to form a hinge structure, allowing the substrate 3311 and the auxiliary cold plate 332 to rotate on the fixed shaft 31.

[0276] In some possible implementations, the secondary cold plate 332 has no heat pipe grooves, so its thickness can be appropriately reduced to meet the requirements of the memory 903 spacing.

[0277] Referring also to Figure 38, in some possible implementations, the locking switch assembly 334 includes a cam wrench 3341, a cam shaft 3342, a clamping slider 3343, and a guide shaft 3344. The cam wrench 3341 is rotatably mounted on the reinforcing frame 3312 via the cam shaft 3342. The guide shaft 3344 is mounted on the reinforcing frame 3312. The secondary cold plate 332 passes through the guide shaft 3344, and the clamping slider 3343 is mounted on the secondary cold plate 332 and faces the cam wrench 3341. The cam wrench 3341 is used to push the clamping slider 3343 to move axially along the guide shaft 3344, so that the secondary cold plate 332 moves towards the main cold plate 331.

[0278] When installing the memory heat exchanger plate 93 onto the memory 903, the main cold plate 331 and the auxiliary cold plate 332 rotate together around the fixed shaft 31 to both sides of the memory 903 until they contact the main heat exchanger flow channel 11. At this point, the quick-locking assembly 32 is lowered and locked. Finally, the cam wrench 3341 is moved from the vertical position to the horizontal position to lock the memory. During the process, the cam of the cam wrench 3341 moves from the small diameter to the large diameter, pushing the clamping slider 3343 to translate along the guide shaft 3344. During the above process, the pressing slider 3343 will drive the auxiliary cold plate 332 to move horizontally. The thermal pads 333 on the main cold plate 331 and the auxiliary cold plate 332 will first come into contact with the memory 903. As the main cold plate 331 and the auxiliary cold plate 332 continue to move horizontally and clamp the memory 903 under the thrust of the cam, the thermal pads 333 can be further compressed to ensure that the thermal pads 333 and the memory 903 meet the required pre-tightening force, reduce the contact thermal resistance, and achieve the best heat dissipation effect.

[0279] The tight fit and unlocking of the memory heat exchanger sub-board 93 and the memory 903 only require turning the cam wrench 3341, which is quick and reliable, effectively reducing the failure rate and operation time of electronic component replacement. The use of the cam wrench 3341 makes the locking and unlocking process simple and intuitive, allowing operators to quickly complete the installation and removal of the memory heat exchanger sub-board 93 and the memory 903, thus improving operational efficiency.

[0280] The cam wrench 3341 can precisely control the movement of the clamping slider 3343 by rotating the cam shaft 3342, allowing precise clamping force to be applied to the auxiliary cold plate 332, ensuring good thermal contact between the memory heat exchange subplate 93 and the memory 903.

[0281] The guide shaft 3344 provides a stable sliding path, preventing the auxiliary cold plate 332 from shifting or tilting during movement, and ensuring the stability of the memory heat exchange subplate 93. Through the cam mechanism, the pressing slider 3343 can move smoothly along the axial direction of the guide shaft 3344, ensuring that the force applied to the auxiliary cold plate 332 is uniform, reducing local stress concentration, and lowering the risk of damage to the memory 903.

[0282] In some possible implementations, the cam wrench 3341 has a cam portion 3345 and a handle portion 3346. The cam portion 3345 is rotatably mounted on a cam shaft 3342 and abuts against a pressing slider 3343. The handle portion 3346 is connected to the cam portion 3345.

[0283] The cam portion 3345, through its abutting engagement with the pressing slider 3343, can convert rotational motion into linear motion, thereby precisely controlling the pressing force applied to the auxiliary cold plate 332. This helps to ensure good thermal contact between the memory heat exchange subplate 93 and the memory 903, and improves heat dissipation efficiency.

[0284] The handle 3346 provides an easy-to-grip and operate interface, allowing users to easily rotate the cam wrench 3341, improving installation and removal efficiency and reducing operation time. By adjusting the rotation angle of the handle 3346, users can easily adjust the clamping force, allowing for flexible adjustments according to specific installation needs to ensure optimal clamping effect.

[0285] In some possible implementations, the mating surface between the cam portion 3345 and the pressing slider 3343 is an arc surface, which can ensure smooth sliding during the mating process.

[0286] In some possible implementations, the locking switch assembly 334 also includes a compression spring 3347, which is sleeved on the guide shaft 3344 and located on the side of the clamping slider 3343 away from the cam wrench 3341. One side of the compression spring 3347 is connected to the reinforcing frame 3312, and the other side is connected to the clamping slider 3343.

[0287] Compression spring 3347 provides a buffering mechanism that can absorb and mitigate mechanical shocks and vibrations that may occur during installation and use, helping to protect the memory heat exchanger subboard 93 and memory 903 and extend their service life.

[0288] The difference between the major and minor diameters of the cam portion 3345 represents the horizontal displacement of the secondary cold plate 332. Based on this, parameters such as the compression of the heat-conducting pad 333 can be further calculated, facilitating design selection. When maintenance or unlocking of the memory heat exchange subboard 93 is required, the cam wrench 3341 is moved from the horizontal to the vertical position, thus opening the locking switch device. During this process, the cam portion 3345 rotates from the major diameter to the minor diameter, and the compression spring 3347 pushes the clamping slider 3343 to move in the releasing direction during its rebound. At this time, the heat-conducting pads 333 of the main cold plate 331 and the secondary cold plate 332, along with the memory 903, move from a compressed state to a non-contact state. Therefore, after unlocking the quick-locking assembly 32, opening the memory slot switch allows the memory 903 to be easily removed from the motherboard 201, achieving tool-free and quick replacement.

[0289] In some possible implementations, one of the pressing slider 3343 and the guide shaft 3344 is provided with a guide groove 3348, and the other is provided with a guide block 3349 opposite to the guide groove 3348.

[0290] The combined use of guide groove 3348 and guide block 3349 ensures that the main cold plate 331 and the secondary cold plate 332 will not tilt during translation, thereby improving the accuracy of fitting with memory 903.

[0291] The combination of guide groove 3348 and guide block 3349 ensures precise linear movement of the clamping slider 3343 along guide shaft 3344, helping to prevent the clamping slider 3343 from deviating or tilting during movement, and ensuring that the applied clamping force is uniform and stable. The design of guide groove 3348 and guide block 3349 provides a clear movement path, reducing friction and wear between the clamping slider 3343 and other components, thereby extending the service life of the components. The precise guiding mechanism improves the reliability of locking and unlocking operations, ensuring that the expected clamping effect is achieved with each operation, and enhancing the overall reliability of the system.

[0292] In some possible implementations, the memory heat exchange subboard 93 also includes a scratch-resistant film 335, which is attached to the thermal pad 333, the main cold plate 331, and the secondary cold plate 332.

[0293] The anti-scratch film 335 can effectively protect the surfaces of the thermal pad 333, the main cold plate 331, and the auxiliary cold plate 332, reduce friction during installation, and prevent scratches, wear, or other physical damage during installation, operation, and maintenance, thereby extending the service life of the components, maintaining the integrity and thermal conductivity of the thermal pad 333, and ensuring that heat can be efficiently transferred from the memory 903 to the memory heat exchanger subplate 93.

[0294] The scratch-resistant film 335 also prevents dust, grease, and other contaminants from adhering to the surfaces of the thermal pad 333, the main cooling plate 331, and the secondary cooling plate 332, keeping the components clean and improving heat dissipation efficiency. The presence of the scratch-resistant film 335 simplifies the cleaning and maintenance process, allowing users to easily wipe away dirt without worrying about damaging the surfaces of the thermal pad 333 or the main cooling plate 331 and the secondary cooling plate 332.

[0295] In some possible implementations, the cover plate 13 is provided with a heat conduction groove 133, and a heat exchange pad 134 is provided in the heat conduction groove 133, and the internal heat exchange sub-plate 93 abuts against the heat exchange pad 134.

[0296] The design of the heat conduction groove 133 can reduce the thermal resistance of the heat from the memory 903 being transferred to the main heat exchange channel 11 through the memory heat exchange subplate 93. On the one hand, it can reduce the wall thickness of the main heat exchange channel 11 in the heat conduction area, thereby reducing its thermal resistance; on the other hand, it can better fix the position of the heat exchange pad 134, preventing it from moving, wrinkling or falling off after being compressed, thereby improving its service life.

[0297] The heat exchange pad 134 effectively fills the gap in the thermally conductive area between the memory heat exchange subplate 93 and the cover plate 13, ensuring close contact between the two and reducing contact thermal resistance. This improves heat conduction efficiency, allowing the heat generated by the memory 903 to be transferred to the cover plate 13 for heat dissipation more quickly.

[0298] The combined design of the heat conduction groove 133 and the heat exchange pad 134 reduces the thermal resistance in the heat transfer path, ensuring that heat can be efficiently transferred from the memory heat exchange subplate 93 to the cover plate 13.

[0299] The heat conduction groove 133 provides a clear location for placing the heat exchange pad 134, which simplifies the installation process, ensures the correct positioning of the heat exchange pad 134, and improves operating efficiency.

[0300] The heat exchange pad 134 has a certain degree of flexibility, which can compensate for the unevenness that may exist on the surface of the internal heat exchange subplate 93 and the cover plate 13, thereby improving the contact area and heat transfer efficiency.

[0301] Please refer to Figures 39, 40, 41, 42, and 43 simultaneously. In some possible implementations, the quick-locking assembly 32 includes a pressure rod bracket 321, a pressure rod 322, a latch 323, and a locking plate 324. The latch 323 is located on the main heat exchange channel 10. One end of the pressure rod 322 is rotatably mounted on the pressure rod bracket 321, and the other end of the pressure rod 322 is provided with a locking plate 324. The latch 323 and the locking plate 324 cooperate to lock the pressure rod 322 and hold it against the side of the memory heat exchange subplate 93 away from the main heat exchange channel 10, so that the memory heat exchange subplate 93 abuts against the main heat exchange channel 10.

[0302] The quick-locking assembly 32 is used to apply a certain locking force to the memory heat exchange subplate 93, further improving the thermal conductivity of the memory heat exchange subplate 93 and the main heat exchange sub-channel 11, and reducing their contact thermal resistance.

[0303] The quick-locking assembly 32 is designed to allow users to quickly lock or release the memory heat exchanger subplate 93 by simply operating the lever 322, which greatly simplifies the installation and disassembly process and improves operational efficiency.

[0304] The engagement of the latch 323 and the locking plate 324 provides a stable mechanical connection, ensuring that the pressure rod 322 can firmly hold the memory heat exchanger subplate 93 against the main heat exchange channel 10, preventing loosening or displacement during use. The design of the pressure rod 322 ensures that the force applied to the memory heat exchanger subplate 93 is uniform, ensuring good contact between the memory heat exchanger subplate 93 and the main heat exchange channel 10, and improving heat transfer efficiency.

[0305] In some possible implementations, the pressure rod bracket 321 and the latch 323 are respectively disposed on the main heat exchange channel 10 and located on both sides of the multiple sequentially arranged memory modules 903. When the latch 323 engages with the locking plate 324, the extension direction of the pressure rod 322 is the same as the direction in which the multiple memory modules 903 are arranged sequentially, thereby pressing the multiple memory heat exchange subplates 93 simultaneously onto the corresponding memory modules 903.

[0306] In some possible implementations, the quick-locking assembly 32 also includes a limiting screw 325. The limiting screw 325 is mounted on the pressure rod bracket 321, and one end of the pressure rod 322 is provided with a pressure rod sleeve 326, which passes through the limiting screw 325.

[0307] The limiting screw 325 provides a clear limiting function, ensuring that the pressure rod 322 remains in a predetermined position during operation, which helps to ensure a stable connection between the memory heat exchanger subplate 93 and the main heat exchange channel 10. By limiting the range of movement of the pressure rod 322, the limiting screw 325 can prevent excessive force, thereby avoiding damage to the memory heat exchanger subplate 93 and other components.

[0308] The pressure rod sleeve 326 passes through the limit screw 325, providing additional support and guidance, enhancing the stability of the pressure rod 322, and reducing possible shaking or deviation during operation.

[0309] In some possible implementations, the pressure bar 322 has a spring piece 327 on the side facing the memory heat exchange subplate 93, and the spring piece 327 has a protrusion structure 328 relative to the memory heat exchange subplate 93.

[0310] The spring plate 327 has a certain degree of elasticity, which can provide additional buffer and support when the pressure rod 322 applies force, adapt to small dimensional changes caused by thermal expansion or other factors, and ensure stable contact between the memory heat exchange subplate 93 and the main heat exchange channel 10. The spring plate 327 and the raised structure 328 help to improve heat conduction efficiency and enhance heat dissipation.

[0311] The raised structure 328 can concentrate the force on a specific area, ensuring that the pressure applied to the memory heat exchanger subplate 93 is uniform, reducing local stress concentration and lowering the risk of component damage.

[0312] The height of the protrusion 328 on the corresponding spring plate 327 can be designed according to the required compression amount of the heat exchange pad 134. When the pressure rod 322 is lowered and locked, the protrusion 328 on the spring plate 327 will squeeze the memory heat exchange subplate 93, causing the spring plate 327 to undergo elastic deformation and generate a certain elastic force on the memory heat exchange subplate 93. This force is transmitted through the memory heat exchange subplate 93 and compresses the heat exchange pad 134 in the heat conduction groove 133 to meet its fastening force requirements.

[0313] In some possible implementations, the latch 323 includes a locking pin 3231 and a guide ramp 3232. The locking plate 324 is provided with a stop plate 3241 and a lever 3242. The locking pin 3231 is in a limiting engagement with the stop plate 3241, and the lever 3242 is connected to the stop plate 3241. When the pressure rod 322 is pressed until the locking pin 3231 and the stop plate 3241 are in a limiting engagement, locking is achieved. When the lever 3242 is moved to disengage the locking pin 3231 from the stop plate 3241, unlocking is achieved, enabling tool-free installation and improving operational efficiency.

[0314] The locking pin 3231 and the retaining plate 3241 provide a secure locking mechanism, ensuring that the pressure rod 322 will not loosen when locked, thus maintaining a stable connection between the internal heat exchanger subplate 93 and the main heat exchange channel 10. The guide ramp 3232 helps guide the locking plate 324 into the correct position, reducing the need for precise alignment during operation and making the locking and unlocking process smoother and more intuitive. The presence of the guide ramp 3232 also reduces direct friction between the locking plate 324 and the locking pin 3231, reducing wear and extending the component's lifespan. The design of the lever 3242 allows users to quickly release the locking mechanism with a simple action, simplifying the disassembly process and improving operational efficiency.

[0315] In some embodiments of this application, by unlocking the quick-locking assembly 32 and the locking switch assembly 334, the memory heat exchange subplate 93 can be rotated and lifted along the fixed axis 31, fully exposing the memory slot switch. There are no obstructions in the upper area, making it easy for operators to directly unlock the memory slot switch. This effectively solves the difficulty of unlocking the memory slot switch through the gap between adjacent memory cold plates using tools, which is required in the existing solution, greatly improving operational efficiency and safety.

[0316] Please refer to Figures 44 and 45 at the same time. In some possible implementations, the liquid cooling heat dissipation device 1000 also includes a leakage detection mechanism 40, which includes a processor leakage detection component and a memory leakage detection component.

[0317] The leak detection unit 40 can quickly detect any leaks in the liquid cooling system, promptly issuing alarms or taking automatic protective measures to prevent damage caused by liquid leaks. The processor 202 and memory 903 are critical components of the computer system; the leak detection unit 40 specifically monitors these areas, helping to protect these critical components from liquid damage and extend their lifespan. By quickly detecting and responding to leaks, the system can be repaired before the problem escalates, reducing unexpected downtime caused by liquid leaks and improving system availability. The leak detection unit 40 can be integrated with the system's automated management and monitoring system to achieve real-time monitoring and automated response of the liquid cooling system, improving management efficiency. To meet flexibility requirements, the processor leak detection component and the memory leak detection component are designed independently, each with its own independent signal interface connected to the motherboard 201.

[0318] In some possible implementations, the processor leakage detection component includes a processor heat exchange mechanism detection component, a processor heat exchange mechanism and connecting pipe connection detection component, and a processor heat exchange mechanism connecting pipe connection detection component.

[0319] The processor leak detection assembly is located at various points, including the welded joints of the processor heat exchange mechanism, the connection between the processor heat exchange mechanism and the connecting pipes, and below the connecting pipes of the processor heat exchange mechanism and the maintenance joint. The leak detection line can be secured to metal parts such as the cold plate and joints by wrapping it around the outer diameter of the metal parts, using acetate tape, waterproof tape, or clips. The leak detection line can be secured to the connecting pipes by wrapping it inside heat-shrink tubing and then heat-shrinking it.

[0320] By installing multiple sensors at critical locations, the system can comprehensively monitor the processor's heat exchange mechanism, connecting pipes, and their connection points, ensuring that any potential leakage problems are detected promptly. Comprehensive leak detection improves the overall reliability of the liquid cooling system, ensuring safe operation under various conditions and reducing the risk of failure due to liquid leaks.

[0321] In some possible implementations, the liquid cooling heat dissipation device 1000 also includes a cold plate bracket 80, and the memory leakage detection component includes a first guide channel 41, a detection line channel 42, and a leakage detection line 43. The main heat exchange channel 10 is disposed on the cold plate bracket 80, and the cold plate bracket 80 has a detection line channel 42 and multiple first guide channels 41 on the side facing the main heat exchange channel 10. The multiple first guide channels 41 are spaced apart, the detection line channel 42 connects the multiple first guide channels 41, and the leakage detection line 43 is disposed in the detection line channel 42. The first guide channel 41 is used to collect and guide the leaked liquid in the main heat exchange channel 10 to prevent the leaked liquid in the main heat exchange channel 10 from spreading to the motherboard 201 and damaging the circuit. The detection trough 42 serves two purposes: firstly, to place and protect the leak detection line 43 from being pulled or rubbed and damaged; secondly, to receive the leaked liquid diverted from the first diversion trough 41. Once a liquid leak is detected, the electrical signal of the leak detection line 43 changes and triggers an alarm. After receiving the alarm signal, the server management module immediately issues an instruction to shut down the server power to avoid loss of equipment and data.

[0322] If the memory leak detection component adopts the same installation scheme as the processor leak detection component, the leak detection line needs to be fixed to the main heat exchange sub-channel 11 with tape to detect leaked liquid. However, in actual use, due to the different structure of the memory heat exchange sub-board 93 and the need for frequent operation of the memory 903, the above method is difficult to fix the leak detection line flat and securely on the memory heat exchange sub-board 93. This can easily lead to the leak detection line becoming loose or shifted, interfering with the memory slot switch during opening and closing, causing damage to the leak detection line due to wear and pulling, and preventing the memory 903 from being properly installed due to interference with the memory slot switch. Increasing the amount of fixing tape will absorb and isolate some of the leaked liquid, affecting the accuracy of the leak detection system. Therefore, in some embodiments of this application, the memory leak detection component considers both the convenience of installation and maintenance and the accuracy of the detection function.

[0323] The arrangement of multiple first guide channels 41 effectively guides any potential leaks to specific detection channels 42, ensuring rapid collection and detection of leaks and reducing liquid diffusion within the system. By setting multiple spaced first guide channels 41 and detection channels 42 on the cold plate bracket 80, the system can cover a larger area, ensuring that leaks at any location can be detected, thus improving overall detection coverage. The interconnected design of the detection channels 42 and multiple first guide channels 41 allows the leak detection line 43 to quickly detect liquid in any first guide channel 41, providing timely leak alarms and preventing liquid damage to the system. This system achieves efficient and reliable leak detection within a limited space, is less prone to interference with the memory 903, is securely fixed with good contact, and is not easily damaged during installation and maintenance, reducing the difficulty of production and maintenance operations, effectively improving detection accuracy and installation and maintenance efficiency, and saving server downtime.

[0324] In some possible implementations, the main heat exchange channel 10 is provided with a mounting base 19 for connection to the quick coupling assembly 21.

[0325] The mounting base 19 is equipped with a connector. One of the connectors in the quick connector assembly 21 is a female connector and the other is a male connector. The two connectors are mated together to connect the quick connector assembly 21.

[0326] In some possible implementations, a second guide groove 44 is provided on the main heat exchange channel 10 below the quick connector assembly 21, and the second guide groove 44 is connected to the detection line groove 42.

[0327] The second guide channel 44 effectively guides any leaks from the quick-connect assembly 21, allowing them to quickly flow into the detection line channel 42, thereby improving leak detection efficiency. By connecting the second guide channel 44 to the detection line channel 42, the system can cover a larger detection area, not only limited to the memory 903 area but also including the area near the quick-connect assembly 21, ensuring comprehensive monitoring. Since the second guide channel 44 directly penetrates the main heat exchange channel 10, any leaks can be quickly guided to the leak detection line 43 in the detection line channel 42. Therefore, when a leak occurs in the quick-connect assembly 21, the leaking liquid will drip onto the surface of the main heat exchange channel 10 under gravity. When the liquid accumulates to a certain volume, it will flow along the second guide channel 44 to the detection line channel 42. The leak detection line 43 arranged in the detection line channel 42 will immediately trigger an alarm after being wetted, thus achieving a rapid response and reducing potential damage to the system from the liquid. This design makes the leak detection system more integrated and simplified, reducing the need for additional sensors or complex wiring, and lowering system complexity and cost.

[0328] In some possible implementations, the width of the second guide groove 44 covers the area where leakage may occur in the quick connector assembly 21, that is, the width of the second guide groove 44 is greater than the gap between the female and male connectors, thereby enabling a more comprehensive detection of leakage in the quick connector assembly 21.

[0329] In some possible implementations, the inlet 15 is arranged adjacent to one of the fixed seats 19, and the outlet 16 is arranged adjacent to the other fixed seat 19. The length of the second guide channel 44 covers the inlet 15 and one of the fixed seats 19, or the outlet 16 and the fixed seat 19, so as to simultaneously detect leakage at the inlet 15 and the fixed seat 19, or the outlet 16 and the fixed seat 19.

[0330] The leakage detection mechanism 40 of this application effectively solves the leakage detection problem of quick-connect connection failure in quick-connect assembly 21 within a limited space. For moving parts like quick-connects, which need to be connected during operation and disconnected during maintenance, the accuracy and lifespan of leakage detection are crucial. If the leakage detection line is directly laid along the connection direction of the quick-connect and fixed to it, a terminal in the middle of the leakage detection line is required to enable connection and disconnection. Therefore, in actual use, before unlocking and disconnecting the quick-connect, the terminal of the leakage detection line must be disconnected, and after the quick-connect is connected and locked, the terminal of the leakage detection line must be reconnected. These operational steps inevitably increase the difficulty and time required for operation, and slight carelessness can cause the leakage detection line to be damaged by external force. At the same time, the shape of quick-connects is often a continuous curved surface in the axial direction, making it difficult for the leakage detection line to fit well and be fixed to the quick-connect, and also resulting in the inability to cover the entire area of ​​the leaking droplet, which also leads to low detection accuracy. The leakage detection mechanism 40 in some embodiments of this application not only avoids the complex leakage detection wire loops wound on the memory heat exchanger board 93, solving the interference problem that is easy to occur in practical applications, but also effectively improves the detection accuracy and installation and maintenance efficiency, saving server downtime.

[0331] In some possible implementations, the cold plate bracket 80 is provided with a first positioning pin 81 and a first non-detachable screw 82. The first positioning pin 81 corresponds to the first positioning hole 204 on the motherboard 201, and the first non-detachable screw 82 corresponds to the motherboard screw hole 205 on the motherboard.

[0332] The first locating pin 81 corresponds to the locating hole 204 on the motherboard, ensuring that the cold plate bracket 80 can be accurately positioned on the motherboard 201. This helps ensure proper alignment of the cold plate bracket 80 with the processor 202 or other components, thereby optimizing heat transfer efficiency. The design of the first locating pin 81 and the first captive screw 82 makes the installation process simpler and more intuitive, reducing the possibility of installation errors, improving operational efficiency, and facilitating the maintenance and replacement of the cold plate bracket 80 and related components. Users can easily remove and reinstall these components, reducing maintenance costs. Users can easily fix the cold plate bracket 80 in place without complex adjustments. The design of the first captive screw 82 ensures that the screw will not fall out during installation and maintenance, reducing the risk of losing screws, while ensuring that the cold plate bracket 80 remains stable during use, preventing loosening due to vibration or movement.

[0333] In some possible implementations, the main heat exchange channel 10 is provided with a second positioning hole 17 and a second captive screw 18, and the cold plate bracket 80 is provided with a second positioning pin 83 and a bracket screw hole 84. The second positioning pin 83 corresponds to the second positioning hole 17, and the second captive screw 18 corresponds to the bracket screw hole 84.

[0334] The second positioning pin 83 corresponds to the second positioning hole 17, ensuring the precise alignment of the cold plate bracket 80 and the main heat exchange channel 10, which helps to optimize the liquid flow path and heat transfer efficiency, and ensures the efficient operation of the system.

[0335] The design of the second locating pin 83 and the second captive screw 18 makes the installation process simpler and more intuitive. Users can easily fix the main heat exchange channel 10 to the cold plate bracket 80 without complicated adjustments, reducing the possibility of installation errors and facilitating the maintenance and replacement of the main heat exchange channel 10 and related components. Users can easily remove and reinstall these components, reducing maintenance costs. The design of the second captive screw 18 ensures that the screw will not fall out during installation and maintenance, reducing the risk of lost screws and screwdriver slippage, while ensuring that the main heat exchange channel 10 remains stable during use and preventing loosening due to vibration or movement.

[0336] In some possible implementations, the liquid cooling heat dissipation device 1000 also includes a liquid supply and return connector assembly 50, which is connected to the main heat exchange channel 10. The liquid supply and return connector assembly 50 is mainly used to open and close the cooling liquid flow path inside the server 2000.

[0337] The introduction of the supply and return fluid connector assembly 50 allows the coolant to circulate within the main heat exchange channel 10, carrying away heat generated by electronic components such as the processor 202 and memory 903, thereby achieving efficient thermal management and heat dissipation. The supply and return fluid connector assembly 50 can be integrated with external cooling systems (such as chillers or radiators) to provide flexible heat dissipation solutions adaptable to different application requirements and environmental conditions. Through continuous liquid circulation, the liquid cooling device 1000 can maintain a stable temperature within the system, preventing overheating and improving the performance and reliability of electronic equipment.

[0338] In some possible implementations, the coolant supply and return connector assembly 50 is fixed to the far left of the rear window of the server 2000. After being connected to the cabinet-side water distributor through the coolant supply and return quick connector 206, the coolant circuit is made open, achieving maximum separation of water and electricity from the power module on the right side of the server 2000.

[0339] In some possible implementations, the supply and return liquid connection assembly 50 includes an inlet liquid line 51 and a return liquid line 52, with the inlet liquid line 51 connected to one side of the main heat exchange channel 10 and the return liquid line 52 connected to the other side of the main heat exchange channel 10.

[0340] The coolant enters the liquid cooling heat dissipation device 1000 of the server 2000 through the supply and return quick connector 206, and reaches the first main heat exchange sub-channel 111 through the inlet pipe 51. The coolant flowing out of the third main heat exchange sub-channel 113 is returned to the supply and return quick connector 206 through the return pipe 52, thus completing the entire circulation process of the coolant in the server 2000.

[0341] By connecting the inlet pipe 51 and the return pipe 52 to both sides of the main heat exchange channel 10, a complete circulation path is formed, ensuring that the coolant can effectively flow through the entire main heat exchange channel 10, carrying away the heat generated by the equipment and achieving efficient heat exchange. This design allows for flexible configuration of the coolant flow direction and flow rate to adapt to different heat dissipation requirements and system configurations, providing greater design and application flexibility.

[0342] In some possible implementations, the processor heat exchange mechanism 20 is provided with fastening screw holes 22, which correspond to the studs 207 of the chip socket on the motherboard 201.

[0343] The corresponding design of the fastening screw hole 22 and the stud 207 ensures that the processor heat exchange mechanism 20 can be firmly fixed on the motherboard 201, preventing loosening or displacement during use, ensuring good contact between the processor heat exchange mechanism 20 and the processor 202, helping to optimize heat conduction efficiency, and quickly transferring the heat generated by the processor 202 to the processor heat exchange mechanism 20 for heat dissipation.

[0344] The corresponding design of the fastening screw holes 22 and studs 207 makes the installation process of the processor heat exchange mechanism 20 simpler and more intuitive, reducing the possibility of installation errors and improving operational efficiency. The design of the fastening screw holes 22 facilitates the maintenance and replacement of the processor 202 or the processor heat exchange mechanism 20, allowing users to easily remove and reinstall components, reducing maintenance costs.

[0345] The well-distributed fastening screw holes 22 can effectively disperse the pressure applied to the processor heat exchange mechanism 20, reduce stress concentration, and lower the risk of component damage.

[0346] Please refer to Figure 46. During installation, the first step is to install the cold plate bracket 80. Align all the first positioning pins 81 on the cold plate bracket 80 with the first positioning holes 204 on the motherboard 201. At this time, the first captive screws 82 can also be aligned with the motherboard screw holes 205. Tighten the first captive screws 82 in place. The second step is to lift the pressure rod 322 and rotate all the memory heat exchanger subplates 93 around the fixed axis 31 to the maximum elevation angle. At this time, lower the pressure rod 322 and lock it. Then rotate all the memory heat exchanger subplates 93 in the opposite direction around the fixed axis 31 and rest them against the pressure rod 322. The pressure rod 322 acts as a blocking and limiting mechanism for the memory heat exchanger subplates 93, preventing them from falling further. The third step is to align the second positioning hole 17 on the main heat exchange channel 10 with the second positioning pins 83 on the cold plate bracket 80, and lower the main heat exchange channel 10 and the memory heat exchanger subplates 93 together. At this point, the second captive screw 18 on the main heat exchange channel 10 is aligned with the bracket screw hole 84 on the cold plate bracket 80, and the second captive screw 18 is tightened into place. Then, the supply and return liquid connector assembly 50 is fixed to the rear window of the chassis by screws. Fourth step, install the memory heat exchange sub-board 93, insert the memory 903, and lift the pressure rod 322 to rotate all the memory heat exchange sub-boards 93 around the fixed axis 31 to cover the memory 903 chips. Then, lower and lock the pressure rod 322, and finally, pull the locking switch assembly 334 to press the memory 903. Fifth step, install the processor heat exchange mechanism 20. Align the fastening screw holes 22 of the processor heat exchange mechanism 20 with the studs 207 of the chip socket on the motherboard 201 and slowly lower it horizontally. Tighten all the fastening screw holes 22 to the required torque. Then, fix the processor heat exchange connection pipe 23 and connect the liquid inlet quick connector 211 and the liquid outlet quick connector 212. Sixth step, install the leak detection line signal interface. Connect the leakage detection signal interfaces of the processor heat exchange mechanism 20 and the memory heat exchange subboard 93 to the motherboard 201 according to their respective reference numbers to complete the installation of the entire liquid cooling system.

[0347] The liquid cooling heat dissipation device 1000 provided in some embodiments of this application includes a main heat exchange channel 10, a processor heat exchange mechanism 20, and a memory heat exchange mechanism 90. The processor heat exchange mechanism 20 is disposed on the processor 202 and is connected to the main heat exchange channel 10 through a quick connector assembly 21. The memory heat exchange mechanism 90 includes a fixed shaft 31, a quick locking assembly 32, and multiple memory heat exchange sub-plates 93. The memory heat exchange sub-plates 93 are inserted through the fixed shaft 31 and clamp corresponding memory 903. The quick locking assembly 32 is used to fix the memory heat exchange sub-plates 93 and abut against the main heat exchange channel 10 so that the memory heat exchange sub-plates 93 and the main heat exchange channel 10 can exchange heat.

[0348] Because the processor heat exchange mechanism 20 is connected to the main heat exchange channel 10 by using the quick connector assembly 21, when only the processor 202 or the processor heat exchange mechanism 20 needs to be replaced, the processor heat exchange mechanism 20 and the main heat exchange channel 10 can be quickly connected and disconnected by the quick connector assembly 21. Then the processor heat exchange mechanism 20 can be disassembled and installed separately without having to disassemble the memory heat exchange mechanism 90 and the memory 903 together.

[0349] The memory heat exchange subplate 93 is mounted on the fixed shaft 31 and fixed by the quick-locking assembly 32, abutting against the main heat exchange channel 10. The memory heat exchange subplate 93 clamps the corresponding memory 903. Therefore, when it is necessary to replace the memory 903, it is only necessary to open the quick-locking assembly 32 and rotate the memory heat exchange subplate 93 corresponding to the memory 903 around the fixed shaft 31 to remove the memory 903 and replace it with a new memory 903. There is no need to remove the memory heat exchange subplate 93 for disassembly and assembly, which greatly simplifies the replacement process of the memory 903. The memory heat exchange subplate 93 is mounted on the fixed shaft 31, so it can move freely on the fixed shaft 31. During actual assembly, it can self-adapt and precisely adjust its position according to the position of the memory 903 to ensure the best contact and heat exchange efficiency between the memory heat exchange subplate 93 and the memory 903, achieve the best fit, and improve the heat dissipation effect.

[0350] Because the liquid cooling heat dissipation device 1000 of this application supports independent disassembly and maintenance of the processor 202 and memory 903, maintenance personnel can replace and maintain components more quickly, which greatly improves the flexibility, maintainability, convenience and security of production, testing and maintenance, reduces downtime and improves the availability and maintenance efficiency of the server 2000.

[0351] In addition, some embodiments of this application also provide a server 2000, including a motherboard 201, a processor 202, a memory 903 and the above-mentioned liquid cooling device 1000. The processor 202 and the memory 903 are disposed on the motherboard 201, and the liquid cooling device 1000 is used to dissipate heat for the processor 202 and the memory 903.

[0352] Given that the server 2000 in some embodiments of this application includes the liquid cooling heat dissipation device 1000 described in any of the above embodiments, the structure and beneficial effects of the liquid cooling heat dissipation device 1000 in the server 2000 will not be described in detail here.

[0353] The liquid cooling heat dissipation device and server provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A liquid cooling heat dissipation device, characterized in that, include: Main heat exchanger flow channel; A plate heat exchange mechanism includes a fixed shaft, a quick-locking assembly, and multiple plate heat exchange sub-plates. The plate heat exchange sub-plates are mounted on the fixed shaft to allow them to rotate around the fixed shaft and slide axially along the fixed shaft. The plate heat exchange sub-plates are configured to clamp corresponding plates. The quick-locking assembly is configured to fix and abut the multiple plate heat exchange sub-plates against the main heat exchange channel to allow the plate heat exchange sub-plates to exchange heat with the main heat exchange channel.

2. The liquid cooling heat dissipation device according to claim 1, characterized in that, The main heat exchange channel includes multiple main heat exchange sub-channels, which are connected sequentially by connecting pipes.

3. The liquid cooling heat dissipation device according to claim 2, characterized in that, The main heat exchange channel includes a first main heat exchange sub-channel, a second main heat exchange sub-channel, and a third main heat exchange sub-channel. The connecting pipeline includes a first branch connecting pipeline and a second branch connecting pipeline. The first main heat exchange sub-channel and the second main heat exchange sub-channel are connected through the first branch connecting pipeline, and the second main heat exchange sub-channel and the third main heat exchange sub-channel are connected through the second branch connecting pipeline.

4. The liquid cooling heat dissipation device according to claim 3, characterized in that, The first main heat exchange sub-channel is provided with a liquid distribution port, and the third main heat exchange sub-channel is provided with a liquid collection port. The liquid distribution port and the liquid collection port are respectively connected to the second heat exchange mechanism.

5. The liquid cooling heat dissipation device according to claim 3, characterized in that, The liquid cooling heat dissipation device also includes a liquid supply and return connector assembly, which is connected to the main heat exchange channel.

6. The liquid cooling heat dissipation device according to claim 5, characterized in that, The liquid supply and return connector assembly includes an inlet pipe and a return pipe. The inlet pipe is connected to the first main heat exchange sub-channel, and the return pipe is connected to the third main heat exchange sub-channel.

7. The liquid cooling heat dissipation device according to claim 1, characterized in that, The main heat exchange channel includes a cover plate and a bottom plate. The cover plate has a channel cavity, and the bottom plate covers the channel cavity. The plate heat exchange subplate abuts against the cover plate.

8. The liquid cooling heat dissipation device according to claim 7, characterized in that, The flow channel cavity is provided with a rib structure, which is arranged along the extension direction of the flow channel cavity.

9. The liquid cooling heat dissipation device according to claim 7, characterized in that, The base plate is provided with a shovel tooth structure, which is located in the flow channel cavity along the extension direction of the flow channel cavity.

10. The liquid cooling heat dissipation device according to claim 7, characterized in that, The cover plate is provided with a heat conduction groove, and a heat exchange pad is provided in the heat conduction groove. The heat exchange subplate of the plate card abuts against the heat exchange pad.

11. The liquid cooling heat dissipation device according to claim 1, characterized in that, The multiple heat exchange subplates of the board are divided into two groups along the length direction of the board. The two groups of heat exchange subplates are arranged opposite each other, and each group of heat exchange subplates clamps one end of the corresponding board along the length direction of the board.

12. The liquid cooling heat dissipation device according to claim 1, characterized in that, The heat exchange subplate includes a main cold plate, a secondary cold plate, a thermal pad, and a locking switch assembly. Along the thickness direction of the plate, the main cold plate is located on one side of the plate, and the secondary cold plate is movably disposed on the main cold plate and located on the other side of the plate. The thermal pad is disposed on the side of the main cold plate and the secondary cold plate facing the plate. The main cold plate and the secondary cold plate pass through the fixed shaft. The locking switch assembly is disposed on the main cold plate and is configured to drive the secondary cold plate to move toward the main cold plate to press the secondary cold plate and the thermal pad on the main cold plate onto the plate.

13. The liquid cooling heat dissipation device according to claim 12, characterized in that, The main cold plate includes a base plate and a reinforcing frame. The base plate is mounted on the fixed shaft, the reinforcing frame is mounted on the base plate, the secondary cold plate is movably mounted on the reinforcing frame, and the locking switch assembly is mounted on the reinforcing frame.

14. The liquid cooling heat dissipation device according to claim 13, characterized in that, The substrate is provided with a limiting groove, which is configured to accommodate the thermal pad.

15. The liquid cooling heat dissipation device according to claim 14, characterized in that, A heat pipe groove is provided on the side of the substrate away from the limiting groove, and the heat pipe groove is configured to embed a heat pipe.

16. The liquid cooling heat dissipation device according to claim 13, characterized in that, One of the main cold plate and the secondary cold plate is provided with a guide pin, and the other is provided with a guide hole opposite to the guide pin.

17. The liquid cooling heat dissipation device according to claim 13, characterized in that, The locking switch assembly includes a cam wrench, a cam shaft, a clamping slider, and a guide shaft. The cam wrench is rotatably mounted on the reinforcing frame via the cam shaft. The guide shaft is mounted on the reinforcing frame. The secondary cold plate passes through the guide shaft. The clamping slider is mounted on the secondary cold plate and faces the cam wrench. The cam wrench is configured to push the clamping slider to move axially along the guide shaft, so that the secondary cold plate moves toward the main cold plate.

18. The liquid cooling heat dissipation device according to claim 17, characterized in that, The cam wrench has a cam portion and a handle portion. The cam portion is rotatably mounted on the cam shaft and abuts against the clamping slider. The handle portion is connected to the cam portion.

19. The liquid cooling heat dissipation device according to claim 17, characterized in that, The locking switch assembly also includes a compression spring, which is sleeved on the guide shaft and located on the side of the clamping slider away from the cam wrench. One side of the compression spring is connected to the reinforcing frame, and the other side is connected to the clamping slider.

20. The liquid cooling heat dissipation device according to claim 17, characterized in that, One of the pressing slider and the guide shaft is provided with a guide groove, and the other is provided with a guide block opposite to the guide groove.

21. The liquid cooling heat dissipation device according to claim 12, characterized in that, The heat exchange subplate also includes an anti-scratch film, which is attached to the thermal pad, the main cold plate, and the auxiliary cold plate.

22. The liquid cooling heat dissipation device according to claim 1, characterized in that, The quick-locking assembly includes a pressure rod bracket, a pressure rod, a locking buckle, and a locking plate. The locking buckle is disposed on the main heat exchange channel. One end of the pressure rod is rotatably disposed on the pressure rod bracket, and the other end of the pressure rod is provided with the locking plate. The locking buckle and the locking plate cooperate to lock the pressure rod and make the pressure rod abut against the side of the plate heat exchange subplate away from the main heat exchange channel, so that the plate heat exchange subplate abuts against the main heat exchange channel.

23. The liquid cooling heat dissipation device according to claim 22, characterized in that, The pressure rod is provided with a spring piece on the side facing the heat exchange subplate of the plate, and the spring piece is provided with a protruding structure relative to the heat exchange subplate of the plate.

24. The liquid cooling heat dissipation device according to claim 22, characterized in that, The latch includes a locking pin and a guide bevel. The locking plate is provided with a stop plate and a lever plate. The locking pin is limited to the stop plate, and the lever plate is connected to the stop plate.

25. The liquid cooling heat dissipation device according to claim 1, characterized in that, The liquid cooling heat dissipation device further includes a leakage detection mechanism and a cold plate support. The leakage detection mechanism includes a first flow guide groove, a detection line groove, and a leakage detection line. The main heat exchange channel is disposed on the cold plate support. The cold plate support is provided with the detection line groove and a plurality of first flow guide grooves on one side facing the main heat exchange channel. The plurality of first flow guide grooves are spaced apart. The detection line groove connects the plurality of first flow guide grooves. The leakage detection line is disposed in the detection line groove.

26. The liquid cooling heat dissipation device according to claim 25, characterized in that, The main heat exchange channel is provided with a fixed seat, which is configured to connect to the second heat exchange mechanism.

27. The liquid cooling heat dissipation device according to claim 26, characterized in that, A second guide groove is provided on the main heat exchange channel below the connection port between the second heat exchange mechanism and the fixed base, and the second guide groove is connected to the detection line groove.

28. A liquid cooling heat dissipation device, characterized in that, include: Main heat exchanger flow channel; A processor heat exchange mechanism is configured to dissipate heat from the processor. The processor heat exchange mechanism is detachably connected to the main heat exchange channel via a quick-connect assembly, so that the processor heat exchange mechanism is in communication with the main heat exchange channel. A memory heat exchange mechanism includes a fixed shaft, a quick-locking assembly, and multiple memory heat exchange sub-plates. The memory heat exchange sub-plates are mounted on the fixed shaft to allow them to rotate around the fixed shaft and slide axially along the fixed shaft. The memory heat exchange sub-plates are configured to clamp corresponding memory modules. The quick-locking assembly is configured to fix the multiple memory heat exchange sub-plates and abut them against the main heat exchange channel to allow the memory heat exchange sub-plates to exchange heat with the main heat exchange channel.

29. The liquid cooling heat dissipation device according to claim 28, characterized in that, The main heat exchange channel includes multiple main heat exchange sub-channels, which are connected sequentially by connecting pipes.

30. The liquid cooling heat dissipation device according to claim 29, characterized in that, The main heat exchange channel includes a first main heat exchange sub-channel, a second main heat exchange sub-channel, and a third main heat exchange sub-channel. The connecting pipeline includes a first branch connecting pipeline and a second branch connecting pipeline. The first main heat exchange sub-channel and the second main heat exchange sub-channel are connected through the first branch connecting pipeline, and the second main heat exchange sub-channel and the third main heat exchange sub-channel are connected through the second branch connecting pipeline.

31. The liquid cooling heat dissipation device according to claim 30, characterized in that, The first main heat exchanger sub-channel is provided with a liquid distribution port, and the third main heat exchanger sub-channel is provided with a liquid collection port. The quick connector assembly includes a liquid inlet quick connector and a liquid outlet quick connector. The liquid inlet quick connector is connected to the liquid distribution port, and the liquid outlet quick connector is connected to the liquid collection port.

32. The liquid cooling heat dissipation device according to claim 30, characterized in that, The liquid cooling heat dissipation device also includes a liquid supply and return connector assembly, which is connected to the main heat exchange channel.

33. The liquid cooling heat dissipation device according to claim 32, characterized in that, The liquid supply and return connector assembly includes an inlet pipe and a return pipe. The inlet pipe is connected to the first main heat exchange sub-channel, and the return pipe is connected to the third main heat exchange sub-channel.

34. The liquid cooling heat dissipation device according to claim 29, characterized in that, The main heat exchange sub-channel includes a cover plate and a bottom plate. The cover plate has a flow channel cavity, and the bottom plate covers the flow channel cavity. The processor heat exchange mechanism is connected to the flow channel cavity, and the memory heat exchange sub-plate abuts against the cover plate.

35. The liquid cooling heat dissipation device according to claim 34, characterized in that, The flow channel cavity is provided with a rib structure, which is arranged along the extension direction of the flow channel cavity.

36. The liquid cooling heat dissipation device according to claim 34, characterized in that, The base plate is provided with a shovel tooth structure, which is located in the flow channel cavity along the extension direction of the flow channel cavity.

37. The liquid cooling heat dissipation device according to claim 34, characterized in that, The cover plate is provided with a heat conduction groove, and a heat exchange pad is provided in the heat conduction groove. The memory heat exchange sub-board abuts against the heat exchange pad.

38. The liquid cooling heat dissipation device according to any one of claims 28-37, characterized in that, The quick connector assembly includes an inlet quick connector and an outlet quick connector. The inlet quick connector connects one side of the main heat exchange channel to the processor heat exchange mechanism, and the outlet quick connector connects the other side of the main heat exchange channel to the processor heat exchange mechanism.

39. The liquid cooling heat dissipation device according to claim 38, characterized in that, The liquid cooling heat dissipation device includes multiple processor heat exchange mechanisms, and adjacent processor heat exchange mechanisms are connected by processor heat exchange connection pipes.

40. The liquid cooling heat dissipation device according to claim 39, characterized in that, The liquid cooling device includes two processor heat exchange mechanisms. The liquid inlet quick connector is connected to one of the processor heat exchange mechanisms through a processor liquid inlet pipe. The two processor heat exchange mechanisms are connected to each other through a processor heat exchange connection pipe. The other processor heat exchange mechanism is connected to the liquid outlet quick connector through a processor liquid outlet pipe.

41. The liquid cooling heat dissipation device according to claim 28, characterized in that, The multiple memory heat exchange sub-plates are divided into two groups along the length of the memory. The two groups of memory heat exchange sub-plates are arranged opposite each other, and each group of memory heat exchange sub-plates clamps one end of the corresponding memory along the length of the memory.

42. The liquid cooling heat dissipation device according to claim 28, characterized in that, The memory heat exchange subplate includes a main cold plate, a secondary cold plate, a thermal pad, and a locking switch assembly. Along the thickness direction of the memory, the main cold plate is located on one side of the memory, and the secondary cold plate is movably disposed on the main cold plate and located on the other side of the memory. The thermal pad is disposed on the side of the main cold plate and the secondary cold plate facing the memory. The main cold plate and the secondary cold plate pass through the fixed shaft. The locking switch assembly is disposed on the main cold plate and is configured to drive the secondary cold plate to move toward the main cold plate to press the secondary cold plate and the thermal pad on the main cold plate onto the memory.

43. The liquid cooling heat dissipation device according to claim 42, characterized in that, The locking switch assembly includes a cam wrench, a cam shaft, a clamping slider, and a guide shaft. The cam wrench is rotatably mounted on the main cold plate via the cam shaft. The guide shaft is mounted on the main cold plate, and the secondary cold plate passes through the guide shaft. The clamping slider is mounted on the secondary cold plate and faces the cam wrench. The cam wrench is configured to push the clamping slider to move axially along the guide shaft, so that the secondary cold plate moves toward the main cold plate.

44. The liquid cooling heat dissipation device according to claim 43, characterized in that, The locking switch assembly also includes a compression spring, which is sleeved on the guide shaft and located on the side of the clamping slider away from the cam wrench. One side of the compression spring is connected to the main cold plate, and the other side is connected to the clamping slider.

45. The liquid cooling heat dissipation device according to claim 42, characterized in that, The memory heat exchange subplate also includes an anti-scratch film, which is attached to the thermal pad, the main cold plate, and the secondary cold plate.

46. ​​The liquid cooling heat dissipation device according to claim 28, characterized in that, The quick-locking assembly includes a pressure rod bracket, a pressure rod, a locking buckle, and a locking plate. The locking buckle is disposed on the main heat exchange channel. One end of the pressure rod is rotatably disposed on the pressure rod bracket, and the other end of the pressure rod is provided with the locking plate. The locking buckle cooperates with the locking plate and is configured to lock the pressure rod and cause the pressure rod to abut against the side of the memory heat exchange subplate away from the main heat exchange channel, so that the memory heat exchange subplate abuts against the main heat exchange channel.

47. The liquid cooling heat dissipation device according to claim 46, characterized in that, The pressure bar has a spring piece on the side facing the memory heat exchange sub-plate, and the spring piece has a protrusion structure relative to the memory heat exchange sub-plate.

48. The liquid cooling heat dissipation device according to claim 28, characterized in that, The liquid cooling device also includes a leakage detection mechanism, which includes a processor leakage detection component and a memory leakage detection component.

49. The liquid cooling heat dissipation device according to claim 48, characterized in that, The liquid cooling heat dissipation device further includes a cold plate bracket, and the memory leakage detection component includes a first flow guide groove, a detection line groove, and a leakage detection line. The main heat exchange channel is disposed on the cold plate bracket. The cold plate bracket is provided with the detection line groove and a plurality of first flow guide grooves on one side facing the main heat exchange channel. The plurality of first flow guide grooves are spaced apart. The detection line groove connects the plurality of first flow guide grooves, and the leakage detection line is disposed in the detection line groove.

50. The liquid cooling heat dissipation device according to claim 49, characterized in that, The main heat exchange channel is provided with a fixing seat, which is configured to connect to the quick connector assembly.

51. The liquid cooling heat dissipation device according to claim 50, characterized in that, The main heat exchange channel below the quick connector assembly is provided with a second guide groove that runs through the main heat exchange channel, and the second guide groove is connected to the detection line groove.

52. A server, characterized in that, Includes the liquid cooling heat dissipation device as described in any one of claims 1-51.

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