MEMS structure, air pump apparatus, and electronic device

Abstract

A MEMS structure, an air pump apparatus, and an electronic device. The MEMS structure comprises: a base layer and piezoelectric layers. The base layer comprises a support portion and functional portions, each functional portion comprises a first functional region and a second functional region arranged opposite to each other, the first functional region comprises a primary cantilever beam and a secondary cantilever beam, the primary cantilever beam is connected to the support portion, the secondary cantilever beam is connected to the end of the primary cantilever beam away from the support portion, and the secondary cantilever beam is comb-shaped and can be interlocked with the second functional region. The piezoelectric layer is made of a piezoelectric material. The piezoelectric layers cover at least the surfaces of the first functional regions, and when energized, the piezoelectric layers may drive the primary cantilever beams and the secondary cantilever beams to respectively bend upwards or downwards, so that the functional portions can enable airflow to flow upwards or downwards. When applied to the air pump apparatus, the MEMS structure can not only provide a pumping flow rate for the air pump, but also reduce the size of the air pump.

Description

MEMS structure, air pump device and electronic equipment

[0001] This disclosure claims priority to Chinese Patent Application No. 202510229179.6, filed on February 27, 2025, entitled "MEMS Structure, Air Pump Device and Electronic Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of heat dissipation devices, and more specifically, to a MEMS structure, an air pump device, and an electronic device. Background Technology

[0003] With the increasing performance of consumer electronics products such as smartphones, thin and light laptops, and AR / VR devices, the resulting increase in heat generation has put significant pressure on heat dissipation. Traditional heat dissipation methods include active and passive cooling: active cooling mainly uses copper pipes and fans, but it has inherent drawbacks such as large size and high noise; passive cooling mainly uses solutions including heat sinks and vapor chambers, but its heat dissipation efficiency is low and it is difficult to meet the heat dissipation requirements of high-performance products. Summary of the Invention

[0004] One object of this disclosure is to provide a new technical solution for MEMS structures, air pump devices, and electronic devices.

[0005] According to a first aspect of this disclosure, a MEMS structure is provided for use in an air pump device, comprising:

[0006] The base layer includes a support portion and a functional portion. The functional portion includes a first functional area and a second functional area disposed opposite to each other. The first functional area includes a primary cantilever beam and a secondary cantilever beam. The primary cantilever beam is connected to the support portion, and the secondary cantilever beam is connected to the end of the primary cantilever beam away from the support portion. The secondary cantilever beam is interdigitated and can intersect with the second functional area.

[0007] The piezoelectric layer is made of piezoelectric material and covers at least the surface of the first functional area. When energized, the piezoelectric layer can cause the primary cantilever beam and the secondary cantilever beam to bend upward or downward, respectively, so that the functional part can make the airflow flow upward or downward.

[0008] Optionally, the second functional area has the same structure as the first functional area;

[0009] The piezoelectric layer includes a first piezoelectric region and a second piezoelectric region, the first piezoelectric region covering each of the first-stage cantilever beams, and the second piezoelectric region covering each of the second-stage cantilever beams;

[0010] The first piezoelectric region can cause each of the first-stage cantilever beams to bend upwards or downwards, and the second piezoelectric region can cause each of the second-stage cantilever beams to bend upwards or downwards.

[0011] Optionally, when the piezoelectric layer is energized, the functional part can have an upward stroke and a downward stroke;

[0012] When the functional part is in the upward stroke, the first piezoelectric region causes the first-stage cantilever beam to move from a downward bending state to an upward bending state, and the second piezoelectric region causes the second-stage cantilever beam to always be in a downward bending state, so that the functional part can allow airflow to pass through.

[0013] When the functional part is in the downward stroke, the first piezoelectric region causes the primary cantilever beam to move from an upward bending state to a downward bending state, and the second piezoelectric region causes the secondary cantilever beam to move from a downward bending state to an upward bending state, so that the functional part can block the airflow.

[0014] Optionally, multiple functional parts are provided, and all of the multiple functional parts are provided on the support part;

[0015] When the first piezoelectric region and the second piezoelectric region are energized, each of the functional units can cause the airflow to flow upward or downward simultaneously.

[0016] Optionally, when a first driving voltage is input to the first piezoelectric region and a second driving voltage is input to the second piezoelectric region, the first driving voltage and the second driving voltage can make the upward airflow and the downward airflow different.

[0017] Optionally, the piezoelectric layer has a top electrode and a bottom electrode, the bottom electrode being grounded, and the top electrode being used to pass the first driving voltage and the second driving voltage.

[0018] Optionally, the dimension of the primary cantilever beam in its extension direction is greater than or equal to the dimension of the secondary cantilever beam.

[0019] According to a second aspect of this disclosure, an air pump device is provided, comprising:

[0020] The PCB board and the MEMS structure described in the first aspect, wherein the substrate layer is disposed on the PCB board and the piezoelectric layer is electrically connected to the PCB board.

[0021] Optionally, it also includes:

[0022] A cover plate is provided on the side of the MEMS structure away from the PCB board, and a first vent is provided on the cover plate at the position corresponding to the functional part;

[0023] The PCB board has a second vent at the position corresponding to the functional part, and cavities are formed between the functional part, the cover plate, and the PCB board.

[0024] According to a third aspect of this disclosure, an electronic device is provided, characterized in that it comprises:

[0025] The MEMS structure described in the first aspect; or including,

[0026] The air pump device described in the second aspect.

[0027] The MEMS structure disclosed herein has a functional part formed by two opposing first and second functional regions in its base layer. The functional part is intersected with the second functional region by an interdigitated secondary cantilever beam, so that it can serve as a structural basis for controlling airflow when applied to an air pump device.

[0028] The piezoelectric layer allows at least the first functional area to bend upwards or downwards by driving the first and second cantilever beams when energized, enabling it to function as a drive structure when applied to an air pump device. Based on its structural characteristics and working principle, it realizes the air pump device's intake or exhaust stroke, providing external heat dissipation for the air pump device while reducing its size, making it suitable for various electronic devices.

[0029] Other features and advantages of this disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0030] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the present disclosure and, together with their description, serve to explain the principles of the present disclosure.

[0031] Figure 1 is a schematic diagram of the MEMS structure provided in this disclosure.

[0032] Figure 2 is a schematic diagram of the back side of the MEMS structure in Figure 1.

[0033] Figure 3 is a structural schematic diagram of the first functional area provided in this disclosure.

[0034] Figures 4a-4c are schematic diagrams of the state of the MEMS structure provided in this disclosure when it is in the upward stroke.

[0035] Figures 5a-5c are schematic diagrams of the state of the MEMS structure provided in this disclosure when it is in the downward stroke.

[0036] Figure 6 is a waveform diagram of the first driving voltage and the second driving voltage provided in this disclosure.

[0037] Figure 7 is a schematic diagram of the air pump device provided in this disclosure.

[0038] Explanation of reference numerals in the attached drawings: 1. MEMS structure; 11. Substrate layer; 111. Support section; 112. Functional section; 1121. First functional area; 1122. Second functional area; 1123. Primary cantilever beam; 1124. Secondary cantilever beam; 12. Piezoelectric layer; 121. First piezoelectric region; 122. Second piezoelectric region; 123. Electrode pin; 13. Cavity; 2. Cover plate; 21. First vent; 3. PCB board; 31. Second vent. Detailed Implementation

[0039] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.

[0040] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this disclosure or its application or use.

[0041] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0042] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0043] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0044] As shown in Figures 1 to 3, according to a first aspect of this disclosure, a MEMS (Micro-Electro-Mechanical) is provided. System (Micro-Electro-Mechanical System) structure 1, applied to an air pump device, includes: a base layer 11 and a piezoelectric layer 12. The base layer 11 includes a support portion 111 and a functional portion 112. The functional portion 112 includes a first functional area 1121 and a second functional area 1122 arranged opposite to each other. The first functional area 1121 includes a primary cantilever beam 1123 and a secondary cantilever beam 1124. The primary cantilever beam 1123 is connected to the support portion 111, and the secondary cantilever beam 1124 is connected to the end of the primary cantilever beam 1123 away from the support portion 111. The secondary cantilever beam 1124 is interdigitated and can intersect with the second functional area 1122. The piezoelectric layer 12 is made of piezoelectric material and at least covers the surface of the first functional area 1121. When energized, the piezoelectric layer 12 can drive the primary cantilever beam 1123 and the secondary cantilever beam 1124 to bend upward or downward respectively, so that the functional portion 112 can make the airflow flow upward or downward.

[0045] Specifically, the MEMS structure 1 provided in this embodiment includes a base layer 11 comprising a support portion 111 mainly used to support the entire structure and a functional portion 112 mainly used for functional implementation. The base layer 11 is typically made of materials such as silicon or silicon dioxide. The piezoelectric layer 12 is made of a piezoelectric material, such as PZT (Lead Zirconate Titanate) or AIN (Aluminum Nitride). Based on the inverse piezoelectric effect, when the piezoelectric layer 12 is energized, it can drive the primary cantilever beam 1123 and the secondary cantilever beam 1124 of the functional portion 112 to bend upwards or downwards by adjusting the driving voltage. This allows the functional portion 112 to drive the airflow above or below it to flow in a specific direction. The airflow enables the air pump device to actively dissipate heat from the electronic device. Compared with traditional heat sinks or heat pipes, this can meet the heat dissipation requirements of high-performance products and is smaller in size.

[0046] Furthermore, in this embodiment, the functional unit 112 is designed as a first functional area 1121 and a second functional area 1122 arranged opposite to each other. Each first functional area includes a primary cantilever beam 1123 connected to the support 111 and a secondary cantilever beam 1124 connected in an interdigital shape to one end of the primary cantilever beam 1123 away from the support 111. As shown in Figures 1 and 3, the primary cantilever beam 1123 is a single cantilever beam extending from the support 111, while the secondary cantilever beam 1124 is an interdigital shape formed by multiple cantilever beams extending from the free end of the primary cantilever beam 1123. The cantilever beam array, the interdigitated secondary cantilever beams 1124 of the first functional area 1121 can be interlocked with the second functional area 1122. That is, the second functional area 1122 can be designed with the same structure as the first functional area 1121, or it can only be provided with an interdigitated structure formed by multiple cantilever beams. This allows the first functional area 1121 and the second functional area 1122 to be arranged opposite each other, and the interdigitated structure can be used to form the functional part 112. That is, when the piezoelectric layer 12 is not energized, the functional part 112 can at least block most of the airflow on its upper and lower sides from flowing to each other.

[0047] When the MEMS structure 1 is applied to the air pump device, since the piezoelectric layer 12 covers at least the surface of the primary cantilever beam 1123 and the surface of the secondary cantilever beam 1124, the MEMS structure 1 can bend the primary cantilever beam 1123 and the secondary cantilever beam upward or downward respectively by applying a specific driving voltage to the piezoelectric layer 12. This allows the functional part 112 to drive the airflow downward or upward, thus realizing the outflow and return of the airflow, enabling the air pump device to be used for heat dissipation of electronic devices.

[0048] In the above embodiments, the driving voltages of the piezoelectric layer 12 on the surface of the primary cantilever beam 1123 and the piezoelectric layer 12 on the surface of the secondary cantilever beam 1124 can be the same or different, so as to achieve unidirectional or opposite bending of the primary cantilever beam 1123 and the secondary cantilever beam 1124, thereby achieving regulation of the outflow and return flow of the airflow. This disclosure does not limit this. Based on its structural characteristics and working principle, the MEMS structure 1 provided by this disclosure can improve its heat dissipation efficiency, reduce power consumption and noise, and reduce the size of the air pump device when applied to an air pump device by adjusting the magnitude of the driving voltage at different positions of the piezoelectric layer 12.

[0049] Optionally, the second functional area 1122 has the same structure as the first functional area 1121; the piezoelectric layer 12 includes a first piezoelectric region 121 and a second piezoelectric region 122, the first piezoelectric region 121 covers each primary cantilever beam 1123, and the second piezoelectric region 122 covers each secondary cantilever beam 1124; wherein, the first piezoelectric region 121 can drive each primary cantilever beam 1123 to bend upward or downward, and the second piezoelectric region 122 can drive each secondary cantilever beam 1124 to bend upward or downward.

[0050] Specifically, in this embodiment, the fact that the second functional area 1122 has the same structure as the first functional area 1121 means that the second functional area 1122 also has a primary cantilever beam 1123 connected to the support portion 111 and an interdigitated secondary cantilever beam 1124 connected to the end of the primary cantilever beam 1123 away from the support portion 111, so that the first functional area 1121 and the second functional area 1122 can be interlocked through the two secondary cantilever beams 1124. The dimensions of the two primary cantilever beams 1123 of the first functional area 1121 and the second functional area 1122 can be the same or different, and the dimensions of the two secondary cantilever beams 1124 can also be the same or different. The design can be tailored to actual needs, and this disclosure does not impose any limitations on this.

[0051] In this embodiment, the first piezoelectric region 121 covering each primary cantilever beam 1123 means that the first piezoelectric region 121 covers the primary cantilever beam 1123 of the first functional region 1121 and the primary cantilever beam 1123 of the second functional region 1122. Similarly, the second piezoelectric region 122 covering each secondary cantilever beam 1124 means that the second piezoelectric region 122 covers the secondary cantilever beam 1124 of the first functional region 1121 and the secondary cantilever beam 1124 of the second functional region 1122. Based on this, when the above MEMS structure is applied to an air pump structure, the first piezoelectric region, when the first driving voltage V1 is applied, can cause the two primary cantilever beams 1123 to bend upwards or downwards, while the second piezoelectric region 122, when the second driving voltage V2 is applied, can cause the two secondary cantilever beams 1124 to bend upwards or downwards. This allows the piezoelectric layer 12 to cause the entire functional section 112 to bend upwards or downwards, thereby achieving airflow outflow and return. In the above embodiments, the upward or downward bending of the primary cantilever beam 1123 and the secondary cantilever beam 1124 only refers to the fact that the first piezoelectric region 121 or the second piezoelectric region 122 can drive the primary cantilever beam 1123 and the secondary cantilever beam 1124 to bend in two different opposite directions, so as to realize the function of the functional part 112 driving the airflow out and back. The upward or downward bending state can be flexibly understood according to the placement direction of the MEMS structure 1.

[0052] In addition, the first piezoelectric region 121 and the second piezoelectric region 122 can completely cover the primary cantilever beam 1123 and the secondary cantilever beam 1124, or they can cover a part of the primary cantilever beam 1123 and the secondary cantilever beam 1124, as long as the purpose of driving the airflow of the functional area can be achieved.

[0053] In addition, the upper and lower surfaces of the piezoelectric layer 12 can generally be regarded as the top electrode and the bottom electrode. The top electrode and the bottom electrode can be led out to the support portion 111 by wires or conductive materials to form electrode pins 123, so as to facilitate the connection between the MEMS structure 1 and the external circuit.

[0054] Optionally, referring to Figures 4a to 5c, in the energized state, the functional unit 112 can have an upward stroke and a downward stroke; when the functional unit 112 is in the upward stroke, the first piezoelectric region 121 causes the primary cantilever beam 1123 to move from a downward bending state to an upward bending state, and the second piezoelectric region 122 causes the secondary cantilever beam 1124 to always be in a downward bending state, so that the functional unit 112 can allow airflow to pass through; when the functional unit 112 is in the downward stroke, the first piezoelectric region 121 causes the primary cantilever beam 1123 to move from an upward bending state to a downward bending state, and the second piezoelectric region 122 causes the secondary cantilever beam 1124 to move from a downward bending state to an upward bending state, so that the functional unit 112 can block airflow from passing through.

[0055] Specifically, in this embodiment, the upward and downward strokes of the functional unit 112 can correspond to the airflow return stroke and airflow outflow stroke of the air pump device, respectively, to realize the heat dissipation function of the air pump device for electronic devices and other components. In one embodiment, both the first functional area 1121 and the second functional area 1122 are multi-stage cantilever beams. By applying a first driving voltage V1 to the first piezoelectric area 121 and a second driving voltage V2 to the second piezoelectric area 122, the bending degree and bending direction of the two primary cantilever beams 1123 and the secondary cantilever beams 1124 of the first and second functional areas 1121 can be controlled. The piezoelectric layer 12 typically has a top electrode and a bottom electrode. After grounding the bottom electrode, the top electrode is led out to the support part 111 or other structures through the electrode pin 123 to facilitate the control of the driving voltage of the first piezoelectric area 121 and the second piezoelectric area 122.

[0056] In this embodiment, the waveforms of the first driving voltage V1 and the second driving voltage V2 are shown in Figure 6. During the upward stroke, referring to Figures 4a to 4c, as the first driving voltage V1 changes, the primary cantilever beams 1123 of the first functional area 1121 and the second functional area 1122 gradually change from a downward bending state to an upward bending state, while the second driving voltage V2 remains constant, so that the secondary cantilever beams 1124 of the first functional area 1121 and the second functional area 1122 always remain in a downward bending state. During this process, a large number of gaps are formed between the first functional area 1121 and the second functional area 1122, so that the damping of the entire functional part 112 for the air is small, and only a small part of the air moves upward with the functional part 112, thereby achieving the purpose of reducing the flow rate of the return airflow.

[0057] During the downward stroke, referring to Figures 5a and 5b, as the first driving voltage V1 changes, the primary cantilever beams 1123 of the first functional area 1121 and the second functional area 1122 gradually change from their final state (i.e., the upward bending state) during the upward stroke to a downward bending state. Similarly, as the second driving voltage V2 changes, the secondary cantilever beams 1124 of the first functional area 1121 and the second functional area 1122 change from their final state (i.e., the downward bending state) during the upward stroke to an upward bending state. During this process, the gap between the first functional area 1121 and the second functional area 1122 is very small. At this time, the damping of the functional section 112 on the air is very large, allowing most of the air to move downwards with the functional section 112, thus increasing the outflow air volume and improving working efficiency.

[0058] When the aforementioned MEMS structure 1 is applied to an air pump structure, the upward and downward strokes can reciprocate in this manner, achieving a downward flow of the airflow as a whole, thus realizing unidirectional airflow without the need for a one-way valve. Furthermore, because it can increase the outflow airflow and decrease the return airflow, the air pump structure can improve the heat dissipation efficiency when used for cooling electronic devices. In addition, since the MEMS structure operates in the ultrasonic frequency band (>20kHz), its operating noise is relatively low, improving its adaptability to the operating environment. In practical applications, the specific direction and magnitude of the first driving voltage V1 and the second driving voltage V2 can be designed according to actual needs. For example, their operating frequency can be set to the first-order resonant frequency of the cantilever beam to reduce the driving voltages and thus reduce power consumption; this disclosure does not impose any limitations on this.

[0059] Optionally, when a first driving voltage V1 is input to the first piezoelectric region 121 and a second driving voltage V2 is input to the second piezoelectric region 122, the first driving voltage V1 and the second driving voltage V2 can make the upward airflow and the downward airflow different.

[0060] Specifically, when the above-mentioned MEMS structure is applied to an air pump device, the outflow rate, return flow rate, and flow direction of the airflow can all be adaptively adjusted by adjusting the magnitude and direction of the first driving voltage V1 and the second driving voltage V2. For example, by applying the driving voltage shown in Figure 6 to the first piezoelectric region 121 and the second piezoelectric region 122 respectively, the functional requirements of reducing backflow and increasing flow rate of the air pump device can be achieved.

[0061] Optionally, as shown in Figures 1 and 2, multiple functional units 112 are provided, and all multiple functional units 112 are provided on the support unit 111; when the first piezoelectric region 121 and the second piezoelectric region 122 are energized, each functional unit 112 can make the airflow flow upward or downward simultaneously.

[0062] Specifically, in this embodiment, to further increase the airflow rate of the MEMS structure 1, the number of functional units 112 can be increased according to actual needs. For example, the MEMS structure 1 in Figures 1 and 2 has four functional units 112, each with the same structure. They are respectively located at the four sides of the rectangular base layer 11, and the remaining part of the base layer 11 serves as a support unit 111 to improve the reliability of the entire structure. The bottom electrodes of the corresponding piezoelectric layers 12 on each functional unit 112 can be grounded, and the top electrodes can be connected in series or parallel according to actual needs. Finally, multiple electrode pins 123 can be designed to lead out to the support unit 111 for easy connection with circuits. This disclosure does not impose any limitations on this.

[0063] In practical applications, since heat dissipation usually requires a large airflow, the various functional units 112 need to be synchronized during operation, that is, simultaneously in the upward stroke or simultaneously in the downward stroke. The outflow direction of the airflow can be above or below the base layer 11. Multiple functional units 112 can also be arranged sequentially and side by side on the base layer 11, etc., depending on the product requirements, which improves the design flexibility and the rationality of space occupation.

[0064] Optionally, as shown in FIG2, the support portion 111 is provided with a through hole, the functional portion 112 is located inside the through hole, and the through hole forms a cavity 13 on the side of the functional portion 112.

[0065] Specifically, in this embodiment, the base layer 11 has a certain thickness, that is, when the functional part 112 is disposed in the through hole of the support part 111, one or both sides of the functional part 112 are cavity 13 structures, which can avoid the support part 111 from affecting the bending of each part of the functional part 112 and improve the reliability of the operation of the functional part 112.

[0066] Optionally, as shown in Figure 3, the secondary cantilever beam 1124 includes a plurality of interdigitated fingers arranged at intervals, with the interval between adjacent interdigitated fingers being greater than the width of the interdigitated fingers by 2 to 4 μm.

[0067] Specifically, in practical applications, the secondary cantilever beam 1124 consists of multiple interlocking finger-like structures arranged sequentially at intervals. The first functional area 1121 and the second functional area 1122 intersect through two secondary cantilever beams 1124, allowing the functional section 112 to both block and allow airflow, thereby enabling the MEMS structure 1 to achieve unidirectional airflow and reduce backflow. The distance between adjacent interlocking fingers (as shown in Figure 3, the distance between two interlocking fingers in the X direction) is designed to be 2–4 μm greater than the width of the interlocking fingers. This ensures that the bending motions of the two secondary cantilever beams 1124 do not interfere with each other during the upward and downward strokes, and that the excessive gap does not affect the outflow rate.

[0068] Optionally, as shown in Figure 3, the dimension of the primary cantilever beam 1123 in its extension direction is greater than or equal to the dimension of the secondary cantilever beam 1124.

[0069] Specifically, in this embodiment, the dimension of the primary cantilever beam 1123 along its extension direction (refer to the Y direction in Figure 3) is designed to be greater than or equal to the dimension of the secondary cantilever beam 1124. This ensures high structural reliability of the entire functional unit 112 and guarantees control over the outflow rate of the airflow. Of course, the dimensional difference between the two should not be too large to avoid an unsatisfactory effect on reducing the return flow rate.

[0070] As shown in Figure 7, according to a second aspect of this disclosure, an air pump device is provided, comprising: a PCB board 3 and a MEMS structure 1 of the first aspect, a substrate layer 11 disposed on the PCB board 3, and a piezoelectric layer electrically connected to the PCB board 3.

[0071] Specifically, in this embodiment, the MEMS structure 1 serves as the main functional structure of the air pump device, while the PCB board 3 facilitates the introduction of driving voltage into the piezoelectric layer. Through circuit design, it is also convenient to adjust the magnitude or direction of the driving voltage in different areas of the piezoelectric layer. The PCB board 3 can be a separately installed circuit board or a circuit board within an electronic device when the air pump device is applied to it; the specific design can be tailored to actual needs.

[0072] Optionally, the air pump device further includes: a cover plate 2, which covers the MEMS structure 1 on the side away from the PCB board 3, and the cover plate 2 is provided with a first air hole 21 at the position corresponding to the functional part 112; the PCB board 3 is provided with a second air hole 31 at the position corresponding to the functional part 112, and cavities 13 are formed between the functional part 112, the cover plate 2, and the PCB board 3, respectively.

[0073] Specifically, the cover plate 2 and PCB board 3 provide a certain degree of protection for the MEMS structure 1, while the arrangement of the first vent 21 and the second vent 31 ensures the inflow and outflow directions of airflow, thereby achieving the heat dissipation function of the air pump device. The number, size, and shape of the first vent 21 and the second vent 31 can be customized according to the functional part 112. The size of the first vent 21 and the second vent 31 is typically designed to be slightly larger than the edge of the functional part 112 to ensure smooth airflow and flow speed. Furthermore, the cavity 13 between the cover plate 2 and PCB board 3 facing the functional part 112 ensures that the bending of each part of the functional part 112 is not interfered with by the two devices, improving the reliability of the structure.

[0074] According to a third aspect of this disclosure, an electronic device is provided, comprising: a MEMS structure 1 of the first aspect; or an air pump device of the second aspect.

[0075] Specifically, in this embodiment, the MEMS structure 1 provided in the first aspect or the air pump device provided in the second aspect is applied to an electronic device. Due to its advantages such as high heat dissipation efficiency, low power consumption, low noise, and small size, the electronic device can meet the design requirements of high heat dissipation and miniaturization. The electronic device can be a smartphone, a thin and light laptop, an AR / VR device, etc., and this disclosure does not limit its application.

[0076] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0077] While specific embodiments of this disclosure have been described in detail by way of example, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this disclosure. The scope of this disclosure is defined by the appended claims.

Claims

1. A MEMS structure applied to an air pump device, characterized in that, include: The base layer includes a support portion and a functional portion. The functional portion includes a first functional area and a second functional area disposed opposite to each other. The first functional area includes a primary cantilever beam and a secondary cantilever beam. The primary cantilever beam is connected to the support portion, and the secondary cantilever beam is connected to the end of the primary cantilever beam away from the support portion. The secondary cantilever beam is interdigitated and can intersect with the second functional area. The piezoelectric layer is made of piezoelectric material and covers at least the surface of the first functional area. When energized, the piezoelectric layer can cause the primary cantilever beam and the secondary cantilever beam to bend upward or downward, respectively, so that the functional part can make the airflow flow upward or downward.

2. The MEMS structure according to claim 1, characterized in that, The second functional area has the same structure as the first functional area; The piezoelectric layer includes a first piezoelectric region and a second piezoelectric region, the first piezoelectric region covering each of the first-stage cantilever beams, and the second piezoelectric region covering each of the second-stage cantilever beams; The first piezoelectric region can cause each of the first-stage cantilever beams to bend upwards or downwards, and the second piezoelectric region can cause each of the second-stage cantilever beams to bend upwards or downwards.

3. The MEMS structure according to claim 2, characterized in that, When the piezoelectric layer is energized, the functional part can have an upward stroke and a downward stroke; When the functional part is in the upward stroke, the first piezoelectric region causes the first-stage cantilever beam to move from a downward bending state to an upward bending state, and the second piezoelectric region causes the second-stage cantilever beam to always be in a downward bending state, so that the functional part can allow airflow to pass through. When the functional part is in the downward stroke, the first piezoelectric region causes the primary cantilever beam to move from an upward bending state to a downward bending state, and the second piezoelectric region causes the secondary cantilever beam to move from a downward bending state to an upward bending state, so that the functional part can block the airflow.

4. The MEMS structure according to claim 2 or 3, characterized in that, The functional parts are provided in multiple ways, and all of the functional parts are provided on the support part; When the first piezoelectric region and the second piezoelectric region are energized, each of the functional units can cause the airflow to flow upward or downward simultaneously.

5. The MEMS structure according to any one of claims 2-4, characterized in that, When a first driving voltage is input to the first piezoelectric region and a second driving voltage is input to the second piezoelectric region, the first driving voltage and the second driving voltage can make the upward airflow and the downward airflow different.

6. The MEMS structure according to claim 5, characterized in that, The piezoelectric layer has a top electrode and a bottom electrode, the bottom electrode is grounded, and the top electrode is used to pass the first driving voltage and the second driving voltage.

7. The MEMS structure according to any one of claims 1-6, characterized in that, The dimension of the primary cantilever beam in its extension direction is greater than or equal to the dimension of the secondary cantilever beam.

8. An air pump device, characterized in that, include: The PCB board and the MEMS structure according to any one of claims 1-7, wherein the substrate layer is disposed on the PCB board and the piezoelectric layer is electrically connected to the PCB board.

9. An air pump device according to claim 8, characterized in that, Also includes: A cover plate is provided on the side of the MEMS structure away from the PCB board, and a first vent is provided on the cover plate at the position corresponding to the functional part; The PCB board has a second vent at the position corresponding to the functional part, and cavities are formed between the functional part, the cover plate, and the PCB board.

10. An electronic device, characterized in that, include: The MEMS structure according to any one of claims 1-7; or include, The air pump device according to claim 8 or 9.

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