Laser package, and method for producing a laser package
Patent Information
- Application Number
- PCT/EP2026/055321
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-27
- Filing Date
- 2026-02-26
- Publication Date
- 2026-09-03
Smart Images
Figure EP2026055321_03092026_PF_FP_ABST
Abstract
Description
[0001] 2024PF01482
[0002] 1
[0003] LASER PACKAGE AND METHOD FOR MANUFACTURING A LASER PACKAGE
[0004] The present application claims priority over German patent application No. 10 2025 107 490.9 of 27 February 2025, the disclosure content of which is hereby incorporated into the present application by reference.
[0005] The present invention relates to a laser package and a method for manufacturing a laser package.
[0006] Background
[0007] When semiconductor lasers are operated in the open atmosphere, i.e., without a housing (unencapsulated / unhoused), material deposits are observed on the laser facet, which can lead to laser degradation. This degradation can reduce the laser's light output over its lifetime. It is assumed that the deposits are organic contaminants in the laser's surrounding air, which adhere to the laser facet and absorb the laser radiation in that area. This, in turn, can lead to an increase in temperature at the laser facet, potentially resulting in its destruction.
[0008] To avoid this, semiconductor lasers are usually housed in a casing during the manufacturing process. In particular, a hermetically sealed casing and inorganic materials are used within the casing, preventing organic molecules from the atmosphere from penetrating the casing or outgassing within it. Any volatile organic compounds (VOCs) that are present in the casing or outgassed can be bound by oxygen (O2) within the casing, preventing the VOCs from depositing on and damaging the laser facet. The function of the oxygen added to the protective gas atmosphere is, in particular, to selectively oxidize the VOCs emitted over the lifetime of the laser, resulting in reaction products that are harmless to the laser facet or the laser package.
[0009] 2
[0010] whose lifetime is... In this way, a large proportion of the VOCs are converted into non-critical reaction products (such as CO2), thus preventing the VOCs from burning onto the laser facet. This process is subsequently referred to as VOC removal.
[0011] A possible process for hermetically encapsulating a laser package may include the following steps:
[0012] • A semiconductor laser is first mounted onto a substrate. This can be done by soldering or gluing, whereby the thermal stability and mechanical strength of the connection are tested.
[0013] • The semiconductor laser is placed in a special housing.
[0014] These housings offer space for additional components such as mirrors, lenses, or optical windows.
[0015] The housing is sealed with a hermetically sealed lid, often using soldering. The housing is then filled with a protective gas to extend the lifespan of the semiconductor laser. Specifically, in addition to nitrogen, approximately 20% oxygen is introduced, which contributes to a longer lifespan for the semiconductor laser.
[0016] • After sealing, the housing's tightness is checked by leak tests to ensure that no moisture or gases can penetrate. For example, a test gas such as helium can be introduced into the housing before sealing.
[0017] However, the described method has a problem: while the oxygen used inside the housing is important because it can significantly increase the lifespan of the semiconductor laser (laser facet), its presence during the soldering process, used to hermetically seal the housing, can lead to a less than ideal solder joint between the housing and the lid. This, in turn, can result in process disadvantages, a reduced lifespan, or even component failure.
[0018] 52024PF01482
[0019] 3
[0020] Therefore, there is a need to specify a laser package, as well as a method for manufacturing a laser package, which counteracts at least one of the aforementioned problems.
[0021] 5 Summary of the invention
[0022] This need is met by a laser package as described in claim 1, and by the method for manufacturing a laser package as described in claim 15. Further embodiments are the subject of the dependent claims.
[0023] The inventors propose replacing the primary cleaning medium (oxygen) currently used for VOCs emitted over the laser's lifetime with other reactive substances. These are then used, for example, via catalytically moderated activation processes to remove the VOCs. In particular, due to the detrimental effects of oxygen during the hermetic sealing of the laser package using soldering processes, the fundamental idea is to replace the oxygen used to bind VOCs within the laser package with a substance that does not negatively affect the soldering process but simultaneously binds VOCs during the laser package's lifetime or reacts with them to form non-critical reaction products. This is achieved, for example, by introducing a suitable material or mixture, especially in gaseous form, into the protective gas atmosphere inside the laser package.Additionally, a catalyst can be introduced. The catalyst increases the reaction rate or enables the necessary radical formation or intermediate process steps to remove the VOCs. The substance, especially in combination with the catalyst, neutralizes molecules, particularly organic molecules, inside the laser package that cause degradation of the laser facet of a laser device.
[0024] Depending on the oxidation chain, the necessary reaction sequences can already take place at room temperature, or the necessary activation energy is reduced by a suitable selection of the catalyst, at least to the extent that thermal activation of the Re-2024PF01482
[0025] 4
[0026] Action sequences are achieved at the operating point of the laser package. Alternatively or additionally, a suitable catalyst (photocatalytic material) can be selected to enable activation of the reaction sequences inside the laser package by internal or external light or laser light. The necessary catalyst can be introduced in various states of matter. For example, gaseous as a component of the protective gas atmosphere inside the laser package, liquid by being introduced into the laser package before it is hermetically sealed, or solid as a coating inside the laser package. Common catalysts generally have a solid state of matter in the working area of the laser package; accordingly, they can be vapor-deposited or otherwise introduced into the laser package as a coating.
[0027] Advantages that may arise from the use of a laser package according to the invention or a method for its production may include the following:
[0028] • Greater flexibility in the choice of process conditions and increased yield in the hermetic encapsulation process (soldering).
[0029] • Increased reliability of the laser package throughout its lifetime, due to improved VOC removal.
[0030] • Controllable radical formation and a correspondingly controllable purification reaction, so that potentially unwanted oxidation (on metals or other elements / surfaces inside the laser package) can be prevented or reduced.
[0031] According to at least one embodiment, a laser package comprises a housing base with at least one electrical contact surface on a top surface of the housing base, and a laser device arranged on the at least one electrical contact surface. The laser device is arranged on the at least one electrical contact surface and electrically coupled to it, and the laser device 5 is configured to emit laser radiation through at least one laser facet on a side surface of the laser device. A housing cover is also attached to the top surface of the housing base.
[0032] 5
[0033] The arrangement forms a cavity with the housing body. Within this cavity are arranged the laser device and a substance and / or a catalyst designed to react with volatile organic compounds present in the cavity and to convert or react them. The oxygen concentration in the cavity is at most 5%.
[0034] According to at least one embodiment, a reaction product of the substance and / or the catalyst with the volatile organic compounds (VOCs) located in the cavity comprises CO2, CO, H2O, and / or, for example, nitrogen N2. In particular, a substance and / or catalyst can be selected such that a reaction product of the substance and / or the catalyst with the volatile organic compounds located in the cavity is non-critical for the lifetime of the laser package or the laser facet of the laser device.
[0035] According to at least one embodiment, the substance N0 comprises x and / or NO2. Such a substance, especially in combination with a suitable catalyst, can lead to a reaction product of the substance and / or the catalyst with the volatile organic compounds located in the cavity being non-critical for the lifetime of the laser package or the laser facet of the laser device.
[0036] According to at least one embodiment, an oxidation chain of acrylonitrile proceeds using a silver-based catalyst, in particular Ag₂O. In this reaction sequence, acrylonitrile is oxidized to form intermediates such as ammonia and acrylic acid. These intermediates can be further reacted at metallic silver sites to form nitrogen (N₂), carbon monoxide (CO), and carbon dioxide (CO₂). When using catalysts containing silver on support materials such as ZrO₂ or MgO, the catalytic oxidation of acrylonitrile leads mainly to the formation of significant amounts of nitrogen oxides (NOx, N₂O). Alternatively, acrylonitrile can be oxidized on the active silver phase of an Ag-ZSM-5 catalyst to nitrogen-containing products and various hydrocarbons. 2024PF01482
[0037] 6
[0038] According to at least one embodiment, an oxidation chain for the catalytic oxidation of chlorine-containing hydrocarbons, in particular trichloroethylene (TCE) and chlorobenzene, proceeds using a palladium-based catalyst on aluminum oxide (Pd / Al₂O₃). Gaseous oxygen molecules are chemisorbed at the active site of the catalyst. According to the Eley-Rideal mechanism (ER model), TCE can react directly with the adsorbed oxygen, forming carbon oxides (CO₂ and CO). The reaction sequence further includes the dissociation of the chemical C-Cl bond in interaction with the catalyst, forming noble metal chloride species on Al₂O₃ and Al₂C₃. These species decompose into molecular chlorine (Cl₂) and, after transfer to a double bond, can react further with TCE.
[0039] According to at least one embodiment, an oxidation chain for the catalytic oxidation of chlorobenzene proceeds using a ruthenium-based catalyst with a CeO support layer. In this process, the C-Cl bond is decomposed under the influence of the Ce. 3 + / Ce 4 The active sites exhibit increased efficiency compared to other catalytic systems. The final reaction mechanism involves the oxidation of volatile organic compounds (VOCs) at surface or lattice oxygen atoms to carbon dioxide (CO2) and water (H2O). The catalyst can be deactivated by the adsorption of chlorine species onto the active sites. Therefore, reaction mechanisms for regeneration or prevention of this deactivation through appropriate catalyst treatments can also be provided.
[0040] According to at least one embodiment, the laser package comprises a coating on the housing base and / or the housing cover, wherein the coating comprises the catalyst. For example, the coating can be formed by a porous layer that allows storage of the catalyst. By arranging such a porous storage layer comprising a catalyst within the common housing, the catalyst can desorb from the porous layer during intended use of the laser device and, together with the substance or mixture of substances, neutralize the organic molecules in the region of the laser facet. 2024PF01482
[0041] The catalyst is stored in a reservoir within the laser package and can be released during operation of the laser device. A reservoir with a large specific surface area is advantageous, as the catalyst can be deposited or adsorbed onto it, allowing it to gradually desorb during laser operation. Sponge-like structures or porous layers are therefore beneficial.
[0042] According to at least one embodiment, the housing body comprises a radiation-impermeable base plate as a support for the laser device, and the base plate is provided on both sides with metallic electrical connection areas. These connection areas are designed, for example, as electrical conductors and / or electrical contact surfaces. In particular, the connection areas are configured for soldering and / or for attaching bond wires. Corresponding connection areas on different sides of the base plate are preferably electrically connected to each other by vias. It is possible that, viewed from above on the mounting side, the vias are located entirely within the base plate, i.e., completely surrounded by an electrically insulating material of the base plate.
[0043] According to at least one embodiment, the housing base body is based on one or more ceramics. For example, the housing base body comprises a base plate made of AIN or A12O3. The fact that the housing base body is based on at least one ceramic can mean that the only electrically insulating material of the housing base body is the at least one ceramic.
[0044] According to at least one embodiment, the housing base body comprises one or more support rings on a side facing the housing cover. The at least one support ring acts as a spacer 5 between the housing base body and the housing cover. The height of a cavity formed by the housing base body can be determined by the geometry of the support ring and / or by the number of support rings.
[0045] will and in which the laser device is arranged, adjust efficiently.
[0046] In one aspect, the housing cover forms a cavity in which the laser device is at least partially arranged. Specifically, the housing cover can be designed as a cap that is placed on the housing base and, together with it, encapsulates the laser device. The housing cover can be placed directly on a flat base plate of the housing base and form a cavity such that the side walls of the cavity extend from the base plate over the laser device, thus extending the housing cover laterally to the laser device. Alternatively, the housing base may also contain a cavity in which the laser device is arranged, with the laser device projecting beyond the cavity. In this case, a cap-shaped housing cover is not necessary to hermetically seal the housing without damaging the internal components.In such a case, the housing cover can comprise a substantially flat substrate, or the housing cover can comprise a substantially flat substrate from which a frame extends towards the housing base body, forming the cavity in the housing cover. A combination is also possible in which the housing base body forms a cavity and the housing cover can simultaneously be designed as a cap arranged on the housing base body.
[0047] According to at least one embodiment, the cavity contains at least one optical element for radiation generated during operation of the laser package. The at least one optical element is, for example, a deflecting mirror, a movable mirror such as a MEMS mirror, and / or a focusing component such as a converging lens, and / or a collimating component, and / or a light homogenizing component.
[0048] For example, the optics can be designed to deflect radiation generated by the laser device towards the housing cover.
[0049] 5 In particular, if the at least one optoelectronic semiconductor chip is an edge-emitting element, the optics can be configured to be one of the laser device2024PF01482
[0050] 9
[0051] to deflect the generated radiation towards the housing cover by essentially 90°.
[0052] Alternatively or additionally, the optics can also be designed to focus, collimate, and / or homogenize radiation generated by the laser device. For this purpose, the optics can comprise one or more elements that perform partial tasks of the aforementioned possibilities, or the optics can be a single unit designed to perform several of the aforementioned tasks simultaneously. For example, the optics can comprise at least one microlens array; a collimating lens; a converging lens; and a prism.
[0053] According to at least one embodiment, an optical element is arranged on the housing cover and / or an optical element is formed integrally with and integrated into the housing cover. The optical element can, for example, comprise a lens cast or molded into the housing cover or a microlens array cast or molded into the housing cover. Accordingly, the housing cover can include an optical element in the area where the light emitted by the laser device passes through the housing cover, which collimates and / or homogenizes and / or focuses the light emitted by the laser device. Additionally or alternatively, such an optical element can also be arranged on the housing cover.
[0054] According to at least one embodiment, the housing cover is configured as a radiation exit window for the radiation generated during operation, and the housing cover is made of a radiation-transparent material. The radiation exit window can be made, for example, of a ceramic material, or of glass or sapphire. Furthermore, the housing cover can be provided with one or more optically effective coatings, for example, antireflective coatings and / or optical filter layers.
[0055] 5 In particular, the housing cover may be coated with a reflective coating for the radiation except for an area of a radiation exit window. 2024PF01482
[0056] 10
[0057] According to at least one embodiment, the laser package further comprises a submount arranged between the housing base and the laser device. The submount can, for example, comprise a ceramic base carrier with an electrically conductive coating on both its upper and lower surfaces. For example, the base carrier can be made of a ceramic material such as aluminum nitride (AlN), and the electrically conductive coating can be a metal such as copper (Cu). For example, the submount can be attached to the housing base by means of a solder layer. Alternatively, the submount can also be attached to the housing base by means of a differently configured contact layer.
[0058] According to at least one embodiment, the housing cover is attached to the housing base body by means of a solder layer. The solder layer is, in particular, formed by an inorganic material, and the laser package can be hermetically encapsulated by means of the solder layer, the housing base body, and the housing cover.
[0059] The following are examples of possible catalyst materials that can be used alone or in combination with the aforementioned or other materials for the catalyst:
[0060] • Precious metal-based catalysts for the oxidation of VOCs, such as Ag-based catalysts, Au-based catalysts, Pd-based catalysts, Pt-based catalysts, Rh-based catalysts, Fe-based catalysts, Cr-based catalysts, Co-based catalysts, Mo-based catalysts, or V-based catalysts.
[0061] • Non-metal-based catalysts for the oxidation of VOCs, such as B-based catalysts, C-based catalysts, N-based catalysts, S-based catalysts, or F-based catalysts.
[0062] • Metal oxides (manganese oxide (MnO2) , cobalt oxide (Co3O4) and cerium oxide (CeO2) , ... ) .
[0063] 5 • Perov's kit catalysts (Perow's kit oxides (e.g. LaMnO3, LaCo03),
[0064] Carbon-based catalysts .2024PF01482
[0065] 11
[0066] • Zeolites .
[0067] According to at least one embodiment, the catalyst comprises or consists of a photocatalytic material such as TiO₂ as a photocatalyst. TiO₂ may, for example, be in anatase form.⁵ TiO₂ may be doped, thereby enabling excitation by visible light instead of UV radiation. For example, TiO₂ may be doped with a metal, such as Ag, Pt, Fe, Cr, Co, Mo, or V, or with a nonmetal, such as B, C, N, S, or F. Alternatively or additionally, the photocatalytic material may comprise or consist of one or more of the following materials as a photocatalyst: semiconductor materials based on dO transition metal cations, such as Ta⁵⁺ or Nb⁵⁺; nitrides or oxides of Ga⁺, In⁺, or Bi⁺; metal-organic frameworks (MOFs), such as MOF-5, UiO-66, or UiO-66(NH₂).
[0068] For example, photocatalytically active particles such as modified TiO2, bismuth-based photocatalysts, Cu nanoparticles, Au nanoparticles, Ag nanoparticles, or a ZnO composite material can also be provided inside the laser package.
[0069] Besides completely replacing O2 in the oxidizing gas atmosphere inside the laser package, one possibility is to significantly reduce the O2 concentration inside the laser package compared to known hermetically sealed laser packages, for example, to a value between 0.1% and 5% or between 0.5% and 2%. This way, the use of O2 as a reaction element for VOC purification is retained. Since O2 is often used only as a moderator of an oxidation chain in common reaction schemes, even lower concentrations of O2 are conceivable.
[0070] According to at least one embodiment, the laser package is surface-mountable. This means that the housing can be attached to an external mounting surface, such as a printed circuit board, using SMT (Surface Mount Technology).
[0071] 5 According to at least one embodiment, the laser device is formed by a laser diode, in particular by an edge-emitting laser diode. The laser diode can be used during its intended operation.-2024PF01482
[0072] - 12 - The device can be operated in pulsed mode, for example. However, in some embodiments, continuous operation may be desirable.
[0073] 5 According to at least one embodiment, the laser package comprises one or more laser devices and / or the laser device is formed by a multi-channel laser. The laser device is configured to generate radiation, which is in particular visible light. If several laser devices or a multi-channel laser are present, these preferably serve to generate radiation of different wavelengths, i.e., in particular to generate blue, green, and red light, so that different colored light can be emitted by controlling the laser device(s) / channels. The laser device is preferably a laser diode; however, light-emitting diodes (LEDs) or combinations of laser diodes and LEDs can also be used.
[0074] According to at least one embodiment, the laser package is a laser module for generating red, green, and blue light, i.e., an RGB module. Thus, the laser package preferably comprises several independently controllable, differently colored laser diodes.
[0075] According to at least one embodiment, the laser device is formed by a multi-ridge laser diode, in particular an edge-emitting multi-ridge laser diode, with at least one laser channel. However, the multi-ridge laser diode can also have several closely adjacent separate laser channels, each emitting light of at least slightly different wavelengths. It is also conceivable, however, that the laser channels emit light of essentially the same wavelength.
[0076] According to at least one embodiment, the laser device is designed to emit blue laser light or laser light with a wavelength in a wavelength range of approximately 400 nm to approximately 500 nm.
[0077] 5 However, this should not be understood as a limitation, because the laser device can also be designed to emit laser light of any other color, such as red, green, infrared or ultraviolet. 2024PF01482
[0078] 13
[0079] emit. In particular, the laser device can be configured to emit laser light with a high power density in the region of the laser facet, regardless of the size of the laser device. For example, the laser device can be a high-power laser diode.
[0080] Furthermore, a method for manufacturing a laser package is proposed, comprising the following steps:
[0081] Providing a housing base body with at least one electrical contact surface on a top side of the housing base body;
[0082] Arranging a laser device on the electrical contact surface;
[0083] Introducing a substance and / or a catalyst into a cavity formed by a housing cover on the housing base and the housing base itself, in which the laser device is arranged; and
[0084] hermetic sealing of the cavity;
[0085] wherein the substance and / or catalyst is designed to react with and bind volatile organic compounds (VOCs) present in the cavity; and
[0086] where the oxygen concentration in the cavity is at most 5%.
[0087] According to at least one embodiment, the hermetic sealing step comprises soldering the housing cover to the housing base body by means of a solder layer. In particular, a first solder layer can be provided on the housing base body, as well as a corresponding second solder layer on the housing cover, which are soldered together.
[0088] According to at least one embodiment, the hermetic sealing step takes place in an atmosphere with an oxygen concentration of at most 5%. In particular, the hermetic sealing step can take place in an atmosphere that is at least largely free of VOCs and with the addition of the substance and / or catalyst that is provided inside the laser package after the hermetic sealing. The hermetic sealing step-2024PF01482
[0089] 14
[0090] tens can therefore take place in an atmosphere in which the substance and / or the catalyst predominates.
[0091] According to at least one embodiment, the step of introducing the catalyst comprises forming a coating on the housing base and / or the housing cover, wherein the coating comprises the catalyst. Conventional catalysts generally have a solid state of matter in the working area of the laser package; accordingly, they can be vapor-deposited or otherwise introduced into the interior of the laser package in the form of a coating. Alternatively or additionally, the catalyst can be stored in a reservoir within the laser package and released during operation of the laser device. Advantageously, the reservoir has a large specific surface area on / in which the catalyst can be deposited or adsorbed, allowing it to gradually desorb during laser operation. Sponge-like structures or a porous layer can be advantageously used for this purpose.
[0092] Brief description of the drawings
[0093] Exemplary embodiments of the invention are explained in more detail below with reference to the accompanying drawings. These show, schematically,
[0094] Fig. 1 shows a laser package comprising a laser device according to some aspects of the proposed principle; and
[0095] Figs. 2 and 3 show further embodiments of a laser package comprising a laser device according to some aspects of the proposed principle.
[0096] Detailed description
[0097] 5 The following embodiments and examples show various aspects and their combinations according to the proposed principle. The embodiments and examples are not always to scale. 2024PF01482
[0098] 15
[0099] Similarly, various elements can be enlarged or reduced in size to highlight individual aspects. It goes without saying that the individual aspects and features of the embodiments and examples shown in the figures can readily be combined without affecting the principle of the invention. Some aspects have a regular structure or shape. It should be noted that in practice, minor deviations from the ideal shape may occur without contradicting the inventive idea.
[0100] Furthermore, the individual figures, features, and aspects are not necessarily depicted at the correct size, and the proportions between the individual elements may not be entirely accurate. Some aspects and features are emphasized by being shown enlarged. However, terms such as "above," "above," "below," "below," "larger," "smaller," and the like are correctly represented in relation to the elements in the figures. Thus, it is possible to deduce such relationships between the elements from the illustrations.
[0101] Fig. 1 shows a laser package 10 comprising a housing body 11 with electrical contact surfaces 14a and 14b on a top surface 22 of a base plate 12a of the housing body 11. A laser device 18 is arranged on one of the electrical contact surfaces 14a, or on the housing body 11, by means of a solder layer 17, and is electrically coupled to the electrical contact surface 14a, or to the housing body 11. Furthermore, the laser device 18 is electrically coupled to the other electrical contact surface 14a, or to the housing body 11, by means of a bond wire 15. However, instead of the bond wire 15 shown, other electrical connecting means can also be used for the electrical connection of the laser device 18, or the laser device 18 can be designed as a horizontally contactable element, contrary to the illustration.
[0102] 5 The laser device 18 comprises a semiconductor body 15 comprising an active layer, on the upper and lower surfaces of which an electrically conductive coating 16a, 16b is formed. Lot-2024PF01482
[0103] 16
[0104] Layer 17 borders the electrically conductive coating 16a on the underside of the semiconductor body 15. For the sake of simplicity, only one laser device 18 is shown in each figure, although several laser devices 18 may also be present.
[0105] The laser device 18 is configured to emit laser radiation through a laser facet on a side surface of the laser device 18. Contrary to the illustration, the laser device 18 can also be arranged on a submount 14, for example, such that the laser facet lies essentially in the same plane as an underlying side surface of the submount or projects beyond it. This prevents so-called beam clipping of the laser radiation emitted by the laser device 18 by the submount.
[0106] The housing body 11 can be designed as a single piece (not shown), or the housing body 11 can be composed, as shown, of the base plate 12a and a support ring 12b. The support ring 12b can be composed of individual (ring) layers or of a single-piece element that is arranged on or laterally to the base plate 12a and connected to it.
[0107] In general, it is possible for either the housing base body 11 (as shown) or the housing cover 23, in the form of a cap, to form a cavity that is closed by the other part of the housing cover 23 or the housing base body 11, respectively, thus forming the cavity 24. Alternatively, however, it is also possible for both the housing base body 11 and the housing cover 23 to form part of a cavity, and for the partial cavities to be joined together to form the cavity 24 in which the laser device 18 is arranged.
[0108] A housing cover 23, made of a material optically transparent to the radiation generated by the semiconductor chip, is attached to the housing base body 11, creating a housing that defines a cavity 5 24 within it. A connection between the housing cover 23 and the housing base body 11, or between the base plate 12a and the support ring 12b, is achieved by processing a connection 2024PF01482.
[0109] 17
[0110] by means of a solder, for example a soft solder, in particular AuSn, or a glass solder. In particular, the laser package 10 is encapsulated by means of a housing cover 23, which is arranged on the top of the housing base body 11. The housing cover 23 is in particular attached to the housing base body 11 by means of a solder layer 13a & 13b.
[0111] As shown, the housing cover 23 can be flush with the housing base 11, however, the housing cover 31 can also have smaller dimensions than the outer dimensions of the housing and only cover a central opening of the housing base 11.
[0112] The laser package 10 also includes a coating 26 on the top surface 22 of the housing base 11 or the base plate 12a and on side walls 21 of the housing base 11 or the support ring 12b, in which a catalyst 20 is stored. The size and position of the coating 26 shown here are merely exemplary, and it can also be positioned or formed at other locations inside the laser package. Furthermore, a substance 19, in particular a gaseous substance or mixture, is provided in the cavity 24. This substance, alone or in combination with the catalyst 20, is designed to react with volatile organic compounds (VOCs) present in the cavity 24 and to bind or remove them. The resulting reaction products 25 are less critical or non-critical for the laser device 18 and do not cause any damage within the laser package 10.to no degradation of the laser facet of the laser device 18.
[0113] An example of such a reaction sequence or oxidation chain of a VOC is shown using the bit. The VOC reacts with substance 19 under the catalytic influence of catalyst 20, yielding the reaction product(s) 25, which are less critical or non-critical for the laser device 18. The provision of catalyst 20 and substance 19 makes it possible to reduce the oxygen concentration within the protective gas atmosphere in the cavity or during the hermetic encapsulation of the laser package 10, so that a soldering process for the hermetic encapsulation of the laser package 10 can also take place in an atmosphere with a reduced oxygen concentration, and the solder joints-2024PF01482
[0114] 18
[0115] This allows them to be produced more reliably, easily, and with a longer lifespan. At the same time, the provision of catalyst 20 and substance 19 enables harmful molecules (VOCs) within the cavity 24 to be rendered harmless during the intended use of the laser package 10, thus also increasing the lifespan of the laser package.
[0116] Figures 2 and 3 also illustrate that the reaction sequence or oxidation chain requires an additional heat input Q or light input L to achieve the necessary thermal or optical activation energy and proceed as desired. According to Figure 2, the waste heat Q of the laser device 18 may be sufficient to initiate the reaction sequence, or a photocatalyst 20 may be provided which, as shown in Figure 3, exerts its catalytic effect through an external light input L, or (not shown) which initiates the reaction sequence for the purification of VOCs through light emitted by the laser device 18.
[0117] In another embodiment not shown, the housing cover 23 is arranged in the direct beam path of the laser device 18, which is designed as an edge-emitting chip. The housing cover 23 is not designed as a conventional cover that closes the housing, but rather as a window that is inserted or joined between the base plate 12a and another ceramic body. The base plate 12a, together with the ceramic body and the housing cover 23, form the housing in which the laser device 18 is arranged in the cavity 24. With this design, a side-emitting laser package 10 can also be provided, in contrast to the illustrations in Figures 1 to 3.Even if the housing cover 23 is designed as a cap extending to the base plate 12a of the housing body 11, it is possible to provide a side-emitting laser package 10, since the transparent material of the housing cover 23 is located laterally to the laser device 18 and thus, in the case of an edge-emitting semiconductor laser, in the beam path of the laser device 18. 2024PF01482.
[0118] - 19 - BE ZUGS ZEI CHENLI S TE
[0119] 10 Laserpackage
[0120] 11 housing base bodies
[0121] 12a Base plate
[0122] 12b Carrier ring
[0123] 13a, 13b Solder layer
[0124] 14a, 14b electrical contact surface
[0125] 15 Bond wire
[0126] 16a, 16b electrically conductive coating 17 solder layer
[0127] 18 Laser device
[0128] 19 fabric
[0129] 20 catalyst
[0130] 21 side surface
[0131] 22 Top
[0132] 23 Housing covers
[0133] 24 cavity
[0134] 25 reaction product
[0135] 26 Coating
[0136] Q Heat
[0137] L light
Claims
2024 PF01482 20 PATENT CLAIM 1. Laser package ( 10 ) comprising: a housing base body ( 11 ) with at least one electrical contact surface ( 14a ) on a top surface ( 22 ) of the housing base body ( 11 ); a laser device ( 18 ) which is arranged on the at least one electrical contact surface ( 14a ) and electrically coupled to it, and which is configured to emit laser radiation through at least one laser facet on a side surface of the laser device ( 18 ); a housing cover ( 23 ) which forms a cavity ( 24 ) with the housing base body ( 11 ); wherein the laser device ( 18 ) is arranged in the cavity ( 24 ); wherein a substance (19) and / or a catalyst (20) is arranged in the cavity (24) which is designed to react with and bind volatile organic compounds (VOCs) located in the cavity (24); and wherein the oxygen concentration in the cavity ( 24 ) is at most 5%; further comprising a coating ( 26 ) on the housing base body ( 11 ) and / or the housing cover ( 23 ) , wherein the coating ( 26 ) comprises the catalyst ( 20 ).
2. Laser package according to claim 1, wherein a reaction product of the substance and / or the catalyst with the volatile organic compounds (VOCs) located in the cavity comprises CO2 and / or H2O.
3. Laser package according to claim 1 or 2, wherein the material (19) comprises NO2.
4. Laser package according to one of the preceding claims, wherein the 5 substance (19) is gaseous. 2024 PF01482 - 21 - 5. Laser package according to one of the preceding claims, wherein the catalyst ( 20 ) is gaseous.
6. Laser package according to one of the preceding claims, wherein the 5 catalyst (20) is liquid.
7. Laser package according to one of the preceding claims, wherein the catalyst (20) is solid.
8. Laser package according to one of the preceding claims, wherein the catalyst (20) is thermally activatable, and / or wherein the catalyst (20) is optically activatable.
9. Laser package according to one of the preceding claims, wherein the material (19) and / or catalyst (20) is configured to desorb from a porous storage layer during intended use of the laser package (10).
10. Laser package according to one of the preceding claims, further comprising a submount arranged between the housing base body ( 11 ) and the laser device ( 18 ).
11. Laser package according to one of the preceding claims, wherein the housing cover ( 23 ) is attached to the housing base body ( 11 ) by means of a solder layer ( 13a, 13b ), and wherein in particular the solder layer ( 13a, 13b ) is formed by an inorganic material .
12. Laser package according to one of the preceding claims, wherein the catalyst (20) comprises at least one of the following: Silver; Gold; Palladium; Platinum; 5 Rhodium; Iron; Chrome; 2024 PF01482 - 22 - Cobalt ; Molybdenum; Vanadium; a metal oxide such as magnesium oxide, cobalt oxide and 5 cerium oxide; Perovskite; Carbon; and Zeolite .
13. Laser package according to one of the preceding claims, wherein the catalyst (20) comprises at least one of the following: TiO2; Bismuth; and ZnO .
14. Method for manufacturing a laser package ( 10 ) comprising the steps: Providing a housing base body ( 11 ) with at least one electrical contact surface ( 14a ) on a top surface ( 22 ) of the housing base body ( 11 ); Arranging a laser device ( 18 ) on the at least one electrical contact surface ( 14a ); Introducing a substance (19) and / or a catalyst (20) into a cavity (24) formed by a housing cover (23) and the housing base body (11) in which the laser device (18) is arranged; and hermetic sealing of the cavity ( 24 ) ; wherein the substance (19) and / or the catalyst (20) is designed to react with and bind volatile organic compounds (VOCs) located in the cavity (24); and wherein the oxygen concentration in the cavity (24) is at most 5%; wherein the step of introducing the catalyst (20) comprises forming a coating (26) on the housing base body 5 (11) and / or the housing cover (23), wherein the coating (26) comprises the catalyst (20). 2024 PF01482 - 23 - 15. Method according to claim 14, wherein the step of hermetic sealing comprises soldering the housing cover ( 23 ) onto the housing base body ( 11 ) by means of a solder layer ( 13a, 13b ). 5 16. Method according to claim 14 or 15, wherein the step of hermetic sealing takes place in an atmosphere in which an oxygen concentration of at most 5% prevails.
17. Method according to any one of claims 14 to 16, wherein step 0 of the hermetic sealing takes place in an atmosphere in which the substance ( 19 ) and / or the catalyst ( 20 ) predominates.