A system for transferring electronic components from a wafer to a flexible substrate as well as a bonding module for use in such system

Abstract

An electronic component transfer module is proposed for implementation in a system for transferring electronic components from a wafer to a flexible substrate and bonding – through thermocompression bonding – the electronic component with a droplet of adhesive deposited at a designated location on the flexible substrate, wherein the bonding module comprises at least one thermode structured to be displaced to and from the designated location of the flexible substrate, the thermode having a thermode contacting surface made of a first heat conductive material as well as an insert element accommodated in the thermode contacting surface, the insert element being made of a second heat conductive material different from the first heat conductive material.

Description

[0001] TITLE

[0002] A system for transferring electronic components from a wafer to a flexible substrate as well as a bonding module for use in such system.

[0003] TECHNICAL FIELD

[0004] The present disclosure relates to techniques for handling, processing and transferring of large numbers of individual electronic components in a semiconductor manufacturing process. In particular, the present disclosure describe a technique for the fast and reliable transferring of such electronic components from a semiconductor wafer onto a flexible substrate, such as a web or tape, e.g. for packaging purposes.

[0005] BACKGROUND OF THE DISCLOSURE

[0006] Conventional semiconductor chip manufacturing involves the processing of semiconductor wafers with on one side an array of semiconductor devices. These wafers are then sliced into individual chips or dies using known dicing techniques after being mounted on flexible, adhesive wafer handling tape or film. The flexible, adhesive film holds the plurality of individual semiconductor dies and aids in transport during the subsequent semiconductor die handling and mounting process steps.

[0007] Certain types of electronic products may be manufactured on flexible substrates, such paper or plastic substrates (e.g., polymer textile carriers), which is sometimes referred to as a "web". The use of such a web (flexible substrate) allows the electronic components to be manufactured in high volume and in an efficient manner.

[0008] In a known application, large numbers of electronic components such as RFID Smart labels or RFID tags are mounted and electronically connected - through a thermocompression bonding process - with metal antenna traces present on an elongated flexible substrate. A drawback of the known process is the long processing time of approx. 5 seconds to properly bond an electronic components with the substrate thereby guaranteeing a proper electric connection with minimal loss of faulty semi-finished products.Accordingly, it is a goal of the present disclosure to provide an improved system capable of processing large numbers of electronic components and bonding each individual electronic component at a designated location on a semi-endless, elongated flexible substrate or web with a significant reduced bond time.

[0009] It should be noted that the present disclosure is applicable for the processing and handling of a variety of electronic components, not limited to semiconductor devices, optical components and micromechanical components arranged on a flexible substrate, such as capacitors, resistors, LEDs, memory chips, MEMS, etc. etc..

[0010] SUMMARY OF THE DISCLOSURE

[0011] According to a first example of the disclosure, a system for transferring electronic components from a wafer to e.g. a semi-endless, elongated flexible substrate is proposed. The system is composed of or designed along a substrate transport mechanism, through which a semi-endless, elongated flexible substrate or flexible web is transported from an inlet or entrance point towards an outlet of exit point.

[0012] The substrate transport mechanism transports the semi-endless, elongated flexible substrate or flexible web along a transport path through the system and during its transport the elongated flexible substrate is subjected to a variety of process steps at a plurality of process modules being located along the transport path.

[0013] For executing a number of non-limiting process steps the system comprises an adhesive deposit module, which is structured to deposit a certain amount of adhesive to a designated location of the elongated flexible substrate. A subsequent process step is performed by an electronic component transfer module structured to transfer an electronic component from a wafer onto the amount of adhesive deposited on the designated location of the elongated flexible substrate.

[0014] One of the final, finishing process steps involves a bonding step in a bonding (curing) module, which is structured to bond the electronic component, for example by means of thermo-compression bonding, with the amount of adhesive deposited on the designated location of the elongated flexible substrate.

[0015] In order to significantly reduce the bonding time for each individual electronic component the bonding module comprises at least one thermode structured to be displaced to and from the designated location of the elongated flexible substrate,the thermode having a thermode contacting surface made of a first heat conductive material as well as an insert element accommodated in the thermode contacting surface, the insert element being made of a second heat conductive material different from the first heat conductive material. With this configuration, a significant reduction of the bonding time for each individual electronic component can be achieved.

[0016] In a detailed example, the thermode contacting surface made of the first heat conductive material is a metal, for example is the metal selected from the group consisting of but not limited to tungsten, molybdenum, titanium alloy, or copper, or alloys of these metals. These metals are durable, and exhibit excellent thermal conductivity necessary to reduce the bonding time for each individual electronic component.

[0017] In a further advantageous example, the thermode contacting surface can be provided with an anti-sticking film. This enables easy release of each individual electronic component from the thermode and prevents any disruption of the process line and avoids standstill. This optional example of the thermode configuration may consists of a coating (anti-sticking film) of gold or e.g. in the form of a balanit coating, which allows cleaning of the contacting surface more efficient.

[0018] More in particular, the insert element made of the second heat conductive material is a carbon based material. Preferably the carbon based material is selected from the group consisting of but not limited to diamond, graphene, carbon nanotubes. The unique combination of a carbon based insert element with a metal thermode contacting surface as outlined above provides the optimal combination of high heat conductivity and robustness against wear, thus providing a thermode configuration enabling fast thermocompression bonding process.

[0019] Where the conventional process takes 5.0 seconds to cure the adhesive and create the mechanical and electrical bonding between the electronic component and any metal trace present on the flexible substrate, with the present disclosure bonding take only 45-75 milliseconds, even 50-60 milliseconds.

[0020] The main advantage of the present disclosure is a 40% better Total Cost of Ownership (TCO) by solving the bottleneck in the individual component bonding cycle. The simplification of the thermocompression bonding step leads to a better controlled process, lower set-up and service times, and higher production yield. In the new thermocompression process, only one preferably two thermode units are required compared to 60 thermode units in the state-of-the-art.In a further detail, the insert element exhibits an insert contacting surface which amounts 2%-9% of the thermode contacting surface.

[0021] In an advantageous example, the thermode contacting surface is provided with an elevated surface section and the insert element is accommodated at the elevated surface section. This provides a better heat transfer from the insert element towards the electronic component and the amount of adhesive positioned on the flexible substrate, thus further achieving the above mentioned short bonding time intervals.

[0022] Preferably, the thermode is provided with a temperature sensor as well as at least one vision camera to monitor the bonding of the electronic component with the amount of adhesive deposited on the designated location of the elongated flexible substrate.

[0023] As the system furthermore comprises a control unit structured to control the bonding module such that the bonding time of the electronic component with the amount of adhesive deposited on the designated location of the elongated flexible substrate ranges between 45-75 milliseconds, in particular ranges between 50-60 milliseconds, thus enabling fast thermocompression bonding processes. Proper feedback can be achieved with the temperature sensor and the at least one vision camera in order to monitor and adjust - if necessary - the thermocompression process.

[0024] The disclosure also pertains to a bonding module structured to bond an electronic component with a certain amount of adhesive deposited on a designated location of an elongated flexible substrate, comprising at least one thermode structured to be displaced to and from the designated location of the elongated flexible substrate, the thermode having a thermode contacting surface made of a first heat conductive material as well as an insert element accommodated in the thermode contacting surface, the insert element being made of a second heat conductive material different from the first heat conductive material.

[0025] With this configuration, a significant reduction of the bonding time for each individual electronic component can be achieved.

[0026] In a detailed example, the thermode contacting surface made of the first heat conductive material is a metal, for example is the metal selected from the group consisting of but not limited to tungsten, molybdenum, titanium alloy, or copper, or alloys of these metals. These metals are durable, and exhibit excellent thermalconductivity necessary to reduce the bonding time for each individual electronic component.

[0027] In a further advantageous example, the thermode contacting surface can be provided with an anti-sticking film . This enables easy release of each individual electronic component from the thermode and prevents any disruption of the process line and avoids standstill.

[0028] More in particular, the insert element made of the second heat conductive material is a carbon based material. Preferably the carbon based material is selected from the group consisting of but not limited to diamond, graphene, carbon nanotubes. The unique combination of a carbon based insert element with a metal thermode contacting surface as outlined above provides the optimal combination of high heat conductivity and robustness against wear, thus providing a thermode configuration enabling fast thermocompression bonding process.

[0029] Where the conventional process takes 5.0 seconds to cure the adhesive and create the mechanical and electrical bonding between the electronic component and any metal trace present on the flexible substrate, with the present disclosure bonding take only 45-75 milliseconds, even 50-60 milliseconds.

[0030] In an preferred detail, the insert element exhibits an insert contacting surface which amounts 2%-9% of the thermode contacting surface. Alternatively, the insert element may have a length / width dimension of 3mmx3mm to 5mmx5mm.

[0031] In an advantageous example, the thermode contacting surface is provided with an elevated surface section and the insert element is accommodated at the elevated surface section. This provides a better heat transfer from the insert element towards the electronic component and the amount of adhesive positioned on the flexible substrate, thus further achieving the above mentioned short bonding time intervals.

[0032] In addition, the thermode may be provided with a temperature sensor to monitor the bonding of the electronic component with the amount of adhesive deposited on the designated location of the elongated flexible substrate.

[0033] BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The disclosure will now be discussed with reference to the drawings, which show in:Figure 1 a schematic view of a system for transferring electronic components from a wafer to a flexible substrate implementing an example of a bonding module according to the disclosure;

[0035] Figures 2a and 2b further details of the system and bonding module according to the disclosure;

[0036] Figures 3-6 further details of the bonding module according to the disclosure.

[0037] DETAILED DESCRIPTION OF THE DISCLOSURE

[0038] For a proper understanding of the disclosure, in the detailed description below corresponding elements or parts of the disclosure will be denoted with identical reference numerals in the drawings.

[0039] Figure 1 describes a general overview of a system according to the disclosure, capable of processing a large number of electronic components and transferring and mounting these components on a flexible substrate. Throughout this application reference numeral 11 denotes either an individual electronic component or a group of electronic components processed in the system according to the disclosure. Again, it should be noted that the present disclosure is applicable for the processing and handling of a variety of electronic components, not limited to semiconductor devices, optical components and micromechanical components arranged on a flexible substrate, such as capacitors, resistors, LEDs, memory chips, MEMS, etc. etc..

[0040] In prior art applications, such large numbers of electronic components such as RFID Smart labels or RFID tags are mounted and electronically connected -through a thermocompression bonding process - with metal antenna traces present on an elongated flexible substrate. A drawback of the known process is the long processing time of approx. 5 seconds to properly bond an electronic components with the substrate thereby guaranteeing a proper electric connection with minimal loss of faulty semi-finished products.

[0041] Turning back to Figure 1, the system for transferring electronic components from a wafer to an elongated flexible substrate is denoted with refence numeral 1000. The system 1000 is built along a substrate transport mechanism which processes an elongated flexible substrate 111, which may also be referred to herein as a "web". The flexible substrate 111 can be made of any flexible material. As anexample, the flexible substrate may be, but not limited to, a long strip of paper, a long strip of polymer textile carrier or a long strip of flexible metal. In some applications, the web 111 may include electrical structures or traces 113 formed thereon, as shown in more detail in Figures 2a and 2b.

[0042] For more clarification, the substrate transport mechanism has an inlet or entrance 1001a and an outlet or exit 1001b. The system 1000 is designed to transport and guide the web 111 from the inlet 1001a through the substrate transport mechanism along a transport path 1001 so that one or more processes can be performed on the web 111, such as pick-and-place process of electronic components 11 (such as integrated circuit (IC) chips or any other type of electronic components) onto the web 111.

[0043] As described in more detail below, the substrate transport mechanism operates to transport the substrate or web 111 through the system 100 in a high precision manner along the transport path 1001 along a plurality of process modules or process stations. These process modules, denoted with reference numerals 110-120-130-200-140-160 and 170, are deposited along the transport path 1001 and are separated from each other by some distance. The various process modules (or stations) are each designed to perform a particular process on the web 111 and / or the electronic component 11.

[0044] Initially, reference numeral 110 denotes in a schematic manner a supply station which supplies - for example from a supply spool - the flexible substrate or web 111 via the inlet 1001 a into the system 1000 (and the substrate transport mechanism). The flexible substrate or web 111 has a first, top surface side 111a and a second, bottom surface side 111b. The first, top surface side 111a may comprise at dedicated distances from each other electrical structures or traces 113 on which electronic components 11 are to be mounted and bonded using an adhesive 12. The adhesive 12 may be e.g. a solder material and also may contain a conductive paste.

[0045] The substrate transport mechanism may comprise a variety of drums or rollers 120z-130z-200z-140z-170z disposed oriented along the transport path 1001. The flexible substrate or web 111 is transported with its second, bottom surface side 111b over the cluster of rollers 120z-130z-200z-140z-170z, of which some or all may be rotatably driven in a suitable manner, not relevant for a proper understanding of the disclosure. For example, the substrate transport mechanism may comprise suitable drive units for rotatably driving of the variety of rollers, as well as one or more web tension units for maintaining a proper web tension in the flexible substrate 111during its transport over the rollers from the inlet 1001a through the system 1000 towards the outlet 1001b. Other control units assisting in the transport of the substrate 111 through the system 1000 may consists of a web indexer, a reeling unit, and a control unit.

[0046] The system 1000 may further comprise a plurality of vision cameras 120a-120b, 130a-130b, 131 z, 200a-200b and 150 disposed at suitable locations along the transport path 1001 for monitoring and inspecting the substrate 111 and / or the various process steps performed on the substrate 111 and / or the electronic component 11.

[0047] Seen along the direction of transport - from the inlet 1001a towards the outlet 1001b, reference numeral 110 denotes a substrate supply module (or station), 120 an adhesive deposit module (or station), 130 an electronic component transfer module (or station), 140 a transport guide, 160 an end product collection module (or station) near the outlet 1001b and 170 a covering layer supply module (or station).

[0048] The flexible substrate 111 is transported over the transport roller or transport drum 120z of the adhesive deposit module 120 which deposits a certain amount of adhesive 12 as a droplet to a designated location Q (see Figure 2a) on the first surface side 111a of the elongated flexible substrate 111. The adhesive deposit module 120 may comprise an adhesive dispenser (or adhesive ejector) 122 which ejects via nozzle 122 the adhesive droplet 12 on the designated location Q. As shown in Figure 1 (and Figures 2a and 2b), subsequent droplets 12 are deposited on various locations Q on the surface side 111a of the substrate 111.

[0049] The substrate 111 with the series of droplets 12 deposited at distinct indexed positions Q is further transported over transport roller or transport drum 130z of the electronic component transfer module 130. This module 130 transfers an electronic component 11 from a wafer 10 onto each adhesive droplet 12. Transfer module 130 comprises a pick up device 131 and a transfer device 132, located in a side-by-side orientation and above the transport drum 130z. Both pick up device 131 and transfer device 132 are composed of a rotatable drum 131a and 132a. Both pick up drum 131a and transfer drum 132a are provided with various component attachment units 131b-132b (also known as vacuum pipets). In a known pick-up and transfer mechanism, pick up device 131 picks up electronic components 11 mounted on a wafer 10, which electronic components 11 are all individually and in a sequential manner separated from the wafer 10 by means of an ejector unit 133.The pick up device 131 - through rotation of the pick up drum 131a -transfers the separated electronic components 11 onto the rotating transfer drum 132a, which in turn mounts each electronic component 11 on an adhesive droplet 12 on the first surface side 111 a of the flexible substrate 111. The whole pick-up, transfer and mounting process is properly monitored and inspected by means of vision cameras 130a-130b and 131z. See for more detail, Figure 2a.

[0050] Each electronic component 11 has a first (top or contacting) electronic component side 11a and a second (bottom or mounting) electronic component side 11b. Each electronic component 11 has also one or more electric contacts or terminals 1100a-1100b intended to be connected electrically with corresponding contacts or traces 113 present on the first surface side 111 a of the substrate 111.

[0051] T o this end, the electronic component transfer module 130 ensures, with the assistance of the vision cameras 130a-130 that each electronic component 11 is correctly mounted with its second mounting side 11b at the designated location Q on the first surface side 111a of the substrate 111 thereby ensuring that the terminals 1100a-1100b are correctly oriented and aligned with the corresponding traces 113.

[0052] Accordingly, for a proper bonding of the electronic component 11 to the substrate 111 bonding module 200 is implemented, which performs thermocompression bonding.

[0053] An example of the bonding module 200 according to the disclosure is depicted in the detailed Figures 2b, 3, 4, 5 and 6. This example of the bonding module 200 is able to significantly reduce the bonding time for each individual electronic component 11 at their designated location Q on the substrate 111. The bonding module 200 implements at least one thermode 201, but preferably at least two thermodes 201 and 202 for dual bonding of electronic components 11 at the same time on their designated locations on the substrate 111. Each thermode 201-202 can be displaced to and from the designated location Q of the elongated flexible substrate 111 using suitable drive means (not shown), at which location Q a droplet of adhesive 12 is disposed by the adhesive deposit module 120, on which droplet 12 an electronic component is subsequently mounted by means of the electronic component transfer module 130.

[0054] Each thermode 201-202 has a housing 220 in which a heating module 227 is accommodated. The heating module 227 is properly energized by heating control lines 26, which are connected with a control device (not depicted) . The heating modules 227 is in heat exchanging contact with a thermode contacting surface 210.To ensure a proper thermo-compression bonding of the electronic component 11 with the substrate 111, the thermode 201-202 is displaced towards the designated location Q, such that the heated thermode contacting surface 210 contacts the first component surface side 11a of the component 11 and presses the electronic component 11 with its second component surface side 11b towards the substrate 111.

[0055] Herewith it is ensured that the electric contacts 1100a-1100b are brought in electrical contact with the traces 113 on the substrate 111 and that the adhesive droplet 12 present between the component 11 and the first surface side 111a of the substrate 111 is cured, thus establishing a permanent mechanical and electrical connection.

[0056] The heated thermode contacting surface 210 is made of a first heat conductive material and is provided with an insert element 211. Insert element 211 is accommodated in the thermode contacting surface 210 and made of a second heat conductive material, which is different from the first heat conductive material. IN particular, the thermode contacting surface 210 made of the first heat conductive material is a metal, for example is the metal selected from the group consisting of but not limited to tungsten, molybdenum, titanium alloy, or copper, or alloys of these metals. These metals are durable, and exhibit excellent thermal conductivity necessary to reduce the bonding time for each individual electronic component 11.

[0057] The insert element 211 as made of the second heat conductive material is a carbon based material. Preferably the carbon based material is selected from the group consisting of but not limited to diamond, graphene, carbon nanotubes. The unique combination of a carbon based insert element 211 with a metal thermode contacting surface 210 provides the optimal combination of high heat conductivity and robustness against wear, thus providing a thermode configuration enabling fast thermocompression bonding process.

[0058] With this configuration, a significant reduction of the bonding time for each individual electronic component 11 can be achieved. Where the conventional process takes 5.0 seconds to cure the adhesive 12 and create the mechanical and electrical bonding between the electronic component 11 and any metal trace 113 present on the flexible substrate 111, with the present disclosure bonding take only 45-75 milliseconds, even 50-60 milliseconds.

[0059] The main advantage of the present disclosure is a 40% better T otal Cost of Ownership (TCO) by solving the bottleneck in the individual component bonding cycle. The simplification of the thermocompression bonding step leads to a bettercontrolled process, lower set-up and service times, and higher production yield. In the new thermocompression process, only one preferably two thermode units 201-202 are required compared to 60 thermode units in the state-of-the-art.

[0060] The thermode contacting surface 210 can be provided with an antisticking film (not shown). This enables easy release of each individual electronic component 11 from the thermode 201-202 and prevents any disruption of the process line and avoids standstill. This optional example of the thermode configuration may consists of a coating (anti-sticking film) of gold or e.g. in the form of a balanit coating, which allows cleaning of the contacting surface 210 more efficient.

[0061] The insert element 211 exhibits an insert contacting surface which amounts 2-5% of the thermode contacting surface 210. Alternatively, the insert element 211 may have a length / width dimension of 3mmx3mm to 5mmx5mm.

[0062] As shown in the details of Figure 4, 5 and 6, the thermode contacting surface 210 may be provided with an elevated surface section 210a. As depicted, the insert element 211 is accommodated at the elevated surface section 210a, thus ensuring and providing an improved heat transfer from the insert element 211 towards the electronic component 11. This ensures the desired reduction in bonding time as stipulated above from several seconds to several tens of milliseconds.

[0063] In all possible configurations, it is noted that the insert element 211 is properly connected to the thermode contacting surface 210 allowing an proper (excellent) heat exchanging contact between the first heat conductive material of the thermode contacting surface 210 and the second heat conductive material of the insert element 211. To ensure that both components (insert element 211 and thermode contacting surface 210) are quickly and adequately heated and reach optimal heat equalization, the mechanical connection between both components is preferably achieved through hard soldering.

[0064] Thus, the thermode contacting surface 210 may be provided with a suitable recess 212 (e.g. provided in the elevated surface section 210a). The recess 212 has inner dimensions (length / width) conformal to the outer dimensions (length / width) of the insert element 211, thus ensuring a perfect fitting of the insert element 211, which fitting is further improved by means of the mechanical connection by means of hard soldering. Herewith the desired heating and heat equalization is achieved. The recess 212 and consequently the insert element 211 may have a square or rectangular configuration as shown in Figure 5, or may have a circular / elliptical configuration as shown in the example of Figure 6. Similarly, the depth of the recess212 may be conformal to the height / thickness of the insert element 211 resulting in a flush configuration of the thermode contacting surface 210 with the contacting surface of the insert element 211. Alternatively, the depth of the recess 212 may be slightly smaller that the height / thickness of the insert element 211 resulting in a insert element 211 slightly protruding above the thermode contacting surface 210.

[0065] Each thermode 201-202 may be provided with a temperature sensor 225 which monitors the bonding temperature of the thermode contacting surface 210 and the insert element 211. The temperature being sensed by the sensor 225 may be fed back to the aforementioned control unit (not shown) and used as an input for controlling the heating module or unit 227 (through proper control via the control signal lines 226). One or more vision cameras 200a-200b are implemented to monitor the bonding of the electronic component 11 with the amount of adhesive 12 deposited on the designated location Q on the elongated flexible substrate 111.

[0066] Once the bonding of the electronic component 11 on the designated location Q on the elongated flexible substrate 111 is completed, the elongated flexible substrate 111 (now with bonded electronic components 11) is transported further through the system 1000 along the substrate transport mechanism 1001, over transport rollers 140z and past a transport guide 140 in the direction of the outlet or exit 1001b of substrate transport mechanism 1001. There the elongated flexible substrate 111 with the bonded electronic components 11 is collected on an end product collection station 160.

[0067] Alternatively, prior to collection at station 160, the flexible substrate 111 with the bonded yet exposed electronic components 11 may undergo a final packaging process step with a semi-endless covering layer film 171, which is applied on top of the exposed electronic components 11, thereby providing additional protection for future transport and handling. The semi-endless covering layer film 171 is provided by covering layer supply station 170, and transported over transport roller 170z and combined in a known packaging manner with the flexible substrate 111, e.g. through adhesion.

[0068] This configuration of the system 1000 according to the disclosure as well as the bonding module 200'according to the disclosure, implementing at least one thermode 201 (preferably two thermodes 201-202) as described above, reduces the bonding time of the electronic component 11 with the amount of adhesive 12 deposited on the designated location Q of the elongated flexible substrate 111 significantly. Proper monitoring of the temperature of the thermode contacting surface 210 and theinsert element 211 with the temperature sensor 225 and inputting the temperature in a control unit for adequately controlling the heating module 227 may reduce the thermocompression bonding time for each component 11 from mere seconds to a range of 45-75 milliseconds, in particular ranges between 50-60 milliseconds.LIST OF REFERENCE NUMERALS USED

[0069] 10 wafer

[0070] 11 electronic component

[0071] 11a first (top or contacting) electronic component side

[0072] 11b second (bottom or mounting) electronic component side

[0073] 1100a-1100b terminals of electronic component

[0074] 12 droplet of adhesive

[0075] 1000 system according to the disclosure

[0076] 1001 substrate transport mechanism

[0077] 1001a inlet or entrance of substrate transport mechanism

[0078] 1001b outlet or exit of substrate transport mechanism

[0079] 110 substrate supply station

[0080] 111 flexible substrate or web

[0081] 111a first, top surface side of flexible substrate

[0082] 111b second, bottom surface side of flexible substrate

[0083] 113 electric contact or metal trace on flexible substrate

[0084] Q designated location on first, top surface side of flexible substrate 120 adhesive deposit module

[0085] 120a-120b vision camera of adhesive deposit module

[0086] 120z transport drum of adhesive deposit module

[0087] 121 adhesive ejector

[0088] 122 adhesive nozzle

[0089] 130 electronic component transfer module

[0090] 130a-130b vision camera

[0091] 130z transport drum

[0092] 131 pick up device

[0093] 131a-132a drum

[0094] 131b-132b component attachment unit (vacuum pipet)

[0095] 131z vision camera of individual pick and place device

[0096] 132 transfer device

[0097] 133 ejector unit

[0098] 140 transport guide

[0099] 140z transport roller

[0100] 150 inspection camera160 end product collection station

[0101] 170 covering layer supply station

[0102] 170z transport roller of covering layer supply station 171 covering layer film

[0103] 200 bonding module

[0104] 200a-200b vision camera

[0105] 200z transport drum

[0106] 201 first thermode

[0107] 202 second thermode

[0108] 210 thermode contacting surface

[0109] 210a elevated surface section

[0110] 211 insert element

[0111] 212 recess in thermode contacting surface

[0112] 220 housing of thermode

[0113] 225 temperature sensor

[0114] 226 control lines for heating module

[0115] 227 heating module

Claims

CLAIMS1. A system for transferring electronic components from a wafer to a flexible substrate, the system comprising:a substrate transport mechanism anda plurality of process modules, whereinthe substrate transport mechanism is structured to transport a flexible substrate along a transport path through the system along the plurality of process modules, and whereinthe plurality of process modules being deposited along the transport path and at least comprising:• an adhesive deposit module structured to deposit a certain amount of adhesive to a designated location of the flexible substrate;• an electronic component transfer module structured to transfer an electronic component from a wafer onto the amount of adhesive deposited on the designated location of the flexible substrate; and• a bonding module structured to bond the electronic component with the amount of adhesive deposited on the designated location of the flexible substrate, whereinthe bonding module comprises at least one thermode structured to be displaced to and from the designated location of the flexible substrate, the thermode having a thermode contacting surface made of a first heat conductive material as well as an insert element accommodated in the thermode contacting surface, the insert element being made of a second heat conductive material different from the first heat conductive material.

2. The system according to claim 1, wherein the thermode contacting surface made of the first heat conductive material is a metal.

3. The system according to claim 2, wherein the metal is selected from the group consisting of but not limited to tungsten, molybdenum, titanium alloy, or copper, or alloys of these metals.

4. The system according to any one or more of the claims 1-3, wherein the thermode contacting surface is provided with an anti-sticking film.

5. The system according to any one or more of the claims 1-4, wherein the insert element made of the second heat conductive material is a carbon based material.

6. The system according to claim 5, wherein the carbon based material is selected from the group consisting of but not limited to diamond, graphene, carbon nanotubes.

7. The system according to any one or more of the claims 1-6, wherein the insert element exhibits an insert contacting surface which amounts 2%-9% of the thermode contacting surface.

8. The system according to any one or more of the claims 1-7, wherein the thermode contacting surface is provided with an elevated surface section and wherein the insert element is accommodated at the elevated surface section.

9. The system according to any one or more of the claims 1-8, wherein the thermode is provided with a temperature sensor.

10. The system according to any one or more of the claims 1-9, wherein the bonding module furthermore comprises at least one vision camera to monitor the bonding of the electronic component with the amount of adhesive deposited on the designated location of the flexible substrate.

11. The system according to any one or more of the claims 1-10, wherein the system furthermore comprises a control unit structured to control the bonding module such that the bonding time of the electronic component with the amount of adhesive deposited on the designated location of the flexible substrate ranges between 45-75 milliseconds, in particular ranges between 50-60 milliseconds.

12. A bonding module structured to bond an electronic component with a certain amount of adhesive deposited on a designated location of a flexible substrate, comprising at least one thermode structured to be displaced to and from the designated location of the flexible substrate, the thermode having a thermode contacting surface made of a first heat conductive material as well as an insert element accommodated in the thermode contacting surface, the insert element being made of a second heat conductive material different from the first heat conductive material.

13. The bonding module according to claim 12, wherein the thermode contacting surface made of the first heat conductive material is a metal.

14. The bonding module according to claim 13, wherein the metal is selected from the group consisting of but not limited to tungsten, molybdenum, titanium alloy, or copper, or alloys of these metals.

15. The bonding module according to any one or more of the claims 12-14, wherein the thermode contacting surface is provided with an anti-sticking film.

16. The bonding module according to any one or more of the claims 12-15, wherein the insert element made of the second heat conductive material is a carbon based material.

17. The bonding module according to claim 16, wherein the carbon based material is selected from the group consisting of but not limited to diamond, graphene, carbon nanotubes.

18. The bonding module according to any one or more of the claims 12-17, wherein the insert element exhibits an insert contacting surface which amounts 2%-9% of the thermode contacting surface.

19. The bonding module according to any one or more of the claims 12-18, wherein the thermode contacting surface is provided with an elevated surface section and wherein the insert element is accommodated at the elevated surface section.

20. The bonding module according to any one or more of the claims 12-19, wherein the thermode is provided with a temperature sensor.

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