Imaging device

Abstract

Provided is an imaging device capable of improving heat dissipating effects with respect to heat from a sensor and an electronic substrate.　An imaging device (10) includes, inside a housing (11): a first heat dissipation member (22) that dissipates heat from a sensor (20); and a second heat dissipation member (23) that dissipates heat from an electronic substrate (21). The first heat dissipation member (22) and the second heat dissipation member (23) contact a top surface section (11c) of the housing (11). The housing (11) is configured so that at least one of the first heat dissipation member (22) and the second heat dissipation member (23) includes an exposed section (25) that can be exposed to the outside of the housing (11).

Description

Imaging apparatus

[0001] The present invention relates to an imaging apparatus that dissipates heat generated internally.

[0002] Patent Document 1 describes that a lower-left heat dissipation member thermally coupled to a control board is fixed to an upper heat dissipation member, and that a sensor heat dissipation plate is fixed to the upper heat dissipation member in a state of being integrated with a reinforcing holder of the sensor.

[0003] Japanese Unexamined Patent Application Publication No. 2020-101754

[0004] An object of the present invention is to provide an imaging apparatus capable of improving the heat dissipation effect for heat from a sensor and an electronic substrate.

[0005] The imaging apparatus of the present invention includes, inside a housing, a first heat dissipation member that dissipates heat from a sensor and a second heat dissipation member that dissipates heat from an electronic substrate, wherein the first heat dissipation member and the second heat dissipation member are in contact with a top surface portion of the housing, and the housing has an exposed portion through which at least one of the first heat dissipation member or the second heat dissipation member can be exposed to the outside of the housing.

[0006] It is preferable that the first heat dissipation member and the second heat dissipation member are in contact with each other. It is preferable that the first heat dissipation member and the second heat dissipation member are an integrated member.

[0007] It is preferable to have means for dissipating heat contained in at least one of the first heat dissipation member or the second heat dissipation member to the outside of the housing from the exposed portion. It is preferable to include a third heat dissipation member attached to the exposed portion. It is preferable that the housing has an accessory attachment portion, and the third heat dissipation member is connected to the accessory attachment portion. It is preferable that the third heat dissipation member is a fan.

[0008] It is preferable to have a cover member that covers the exposed portion. It is preferable that the cover member covers the exposed portion when the third heat dissipation member is removed.

[0009] It is preferable to include a fourth heat dissipation member movable between a position where the exposed portion is exposed to the outside and a position where the exposed portion is covered. It is preferable that the fourth heat dissipation member moves to a position where the exposed portion is exposed to the outside during heat dissipation, and moves to a position covering the exposed portion during non-heat dissipation.

[0010] It is preferable that the top surface of the sensor and the first heat dissipation member are in contact. It is preferable that the sensor section having the sensor has an in-body image blur correction mechanism.

[0011] According to the present invention, the heat dissipation effect of sensors and electronic substrates can be enhanced.

[0012] This is a front view of the imaging device. This is a rear view of the imaging device. (A) is an explanatory diagram showing the interior of the imaging device (including exposed parts) when viewed from the side, and (B) is an explanatory diagram showing the heat flow of the sensor or electronic circuit board. (A) is an explanatory diagram showing the interior of the imaging device (including exposed parts and the third heat dissipation member) when viewed from the side, and (B) is an explanatory diagram showing the natural convection that occurs inside the imaging device. This is a perspective view of the rear side of the imaging device and the third heat dissipation member. This is an explanatory diagram showing the interior of the imaging device (including exposed parts and the cover member) when viewed from the side. This is an explanatory diagram showing the interior of the imaging device (including exposed parts and the fourth heat dissipation member) when viewed from the side.

[0013] As shown in Figures 1 and 2, the imaging device 10 comprises a housing 11 and a lens barrel 12. The housing 11 is a horizontally elongated box shape, with its left-right dimension being longer than its vertical dimension. The lens barrel 12 is fixed to the housing 11 and has an imaging optical system (not shown) that focuses light from the subject onto a sensor 20 (see Figure 3). In the following, when the photographer is photographing a subject located horizontally in the X direction, the surface on the subject side in the optical axis direction Z (see Figure 3), which is parallel to the optical axis O of the imaging optical system, is referred to as the front part 11a, the surface on the photographer side in the optical axis direction Z is referred to as the rear part 11b, the upper surface in the vertical direction Y, which is perpendicular to the horizontal direction X and the optical axis direction Z, is referred to as the top part 11c, and the lower surface in the vertical direction Y is referred to as the bottom part 11d. The imaging device 10 may be a digital camera or a film camera.

[0014] Furthermore, in this specification, “parallel” includes not only perfect parallelism but also substantially parallelism, which includes errors that are generally acceptable in the art to which the disclosed art belongs, and which do not deviate from the disclosed art. Furthermore, in this specification, “orthogonal” includes not only perfect orthogonality but also substantially orthogonalism, which includes errors that are generally acceptable in the art to which the disclosed art belongs, and which do not deviate from the disclosed art.

[0015] The front portion 11a of the housing 11 is provided with a lens barrel 12 and a release switch 14. The rear portion 11b of the housing 11 is provided with a display 15. The top portion 11c of the housing 11 is provided with an accessory mounting portion 16. The bottom portion 11d of the housing 11 is provided with a tripod mounting portion (not shown) for attaching a tripod.

[0016] As shown in Figure 3(A), the housing 11 has a sensor 20 on the front side 11a and an electronic circuit board 21 on the rear side 11b that performs signal processing such as imaging signals obtained from the sensor 20 and storage processing with a recording medium that records the imaging signals. The housing 11 also has a first heat dissipation member 22 for dissipating heat from the sensor 20 and a second heat dissipation member 23 for dissipating heat from the electronic circuit board 21. The first heat dissipation member 22 and the second heat dissipation member 23 are in contact with the top surface 11c of the housing 11. The first heat dissipation member 22 or the second heat dissipation member 23 is preferably a heat sink, graphite sheet (GF sheet), gel, etc.

[0017] As shown in Figure 3(B), the heat Hs generated by the sensor 20 and the heat Hp generated by the electronic circuit board 21 flow towards the top surface 11c. A first heat dissipation member 22 and a second heat dissipation member 23 are provided on the top surface 11c to collect the heat Hs from the sensor 20 and the heat Hp from the electronic circuit board 21 and dissipate the heat from the top surface 11c. This enhances the heat dissipation effect.

[0018] Furthermore, the housing 11 has an exposed portion 25 on which at least one of the first heat dissipation member 22 or the second heat dissipation member 23 can be exposed to the outside of the housing 11. The exposed portion 25 is provided in a certain range on the front portion 11a side and the bottom portion 11d side from the part where the top portion 11c and the rear portion 11b are connected, and dissipates heat from at least one of the first heat dissipation member 22 or the second heat dissipation member 23 to the outside of the housing 11. The heat concentrated on the top portion 11c by the first heat dissipation member 22 or the second heat dissipation member 23 can be dissipated not only from the top portion 11c but also from the exposed portion 25, thereby further enhancing the heat dissipation effect. In cases such as continuous video recording over a long period of time, it is expected that the heat from the sensor 20 and the electronic circuit board 21 will increase, so in such cases, the exposed portion 25 is provided to actively dissipate heat from inside the imaging device 10. Furthermore, in order to improve the dustproof and dripproof performance of the exposed portion 25, it is preferable to provide a return structure or the like on the edge of the first heat dissipation member 22 or the second heat dissipation member 23 and arrange them so as to overlap with the edge of the exposed portion 25.

[0019] Furthermore, it is preferable that the first heat dissipation member 22 and the second heat dissipation member 23 are in contact with each other. This enhances the heat aggregation effect between the sensor 20 and the electronic substrate 21. It is also preferable that the first heat dissipation member 22 and the second heat dissipation member 23 are an integrated component. This reduces the cost of the first heat dissipation member 22 and the second heat dissipation member 23, and also reduces the work required to attach the first heat dissipation member 22 and the second heat dissipation member 23 to the housing 11. The integration of the first heat dissipation member 22 and the second heat dissipation member 23 is sufficient if the first heat dissipation member 22 and the second heat dissipation member 23 can be used as a single unit. For example, even if the first heat dissipation member 22 and the second heat dissipation member 23 can be separated by removing the connecting member that connects them, this is also included in the definition of "integration".

[0020] Furthermore, it is preferable that the top surface 11c of the sensor 20 and the first heat dissipation member 22 are in contact. This allows thermal contact between the first heat dissipation member 22 provided on the top surface 11c and the sensor 20 to be achieved at the shortest possible distance. Thermal contact includes not only direct contact between the top surface 11c of the sensor 20 and the surface of the first heat dissipation member 22, but also contact with a lubricant such as grease or oil in between.

[0021] Furthermore, if the sensor unit 26 having the sensor 20 has an in-body image blur correction mechanism 26a, it is preferable to attach the sensor mounting portion 22a to the upper part of the sensor 20, taking into consideration that the in-body image blur correction mechanism 26a shifts the sensor 20 in a direction that cancels out image blur such as user tremors or tremors when using a tripod, and that the first heat dissipation member 22 comes into contact with the top surface portion 11c. In addition, it is preferable to provide an electronic circuit board heat dissipation member 27 between the electronic circuit board 21 and the back surface portion 11b to dissipate heat from the electronic circuit board 21.

[0022] The imaging device 10 preferably has means for dissipating heat contained in at least one of the first heat dissipation member 22 or the second heat dissipation member 23 from the exposed portion 25 to the outside of the housing 11. By providing such means, the heat dissipation effect from the exposed portion 25 can be further enhanced. Specifically, as shown in Figure 4(A), it is preferable that the above means be carried out by a third heat dissipation member 30 attached to the exposed portion 25. The third heat dissipation member 30 is preferably a fan or the like. In this case, as shown in Figure 4(B), by transferring the heat from the first heat dissipation member 22 or the second heat dissipation member 23 to the third heat dissipation member 30, the temperature of the top surface portion 11c is lowered, natural convection S can be promoted, and heat exchange can be promoted.

[0023] Furthermore, it is preferable that the third heat dissipation member 30 is connected to the accessory mounting portion 16, as shown in Figure 5. In this case, it is preferable that the third heat dissipation member 30 is detachable and not fastened to the accessory mounting portion 16 with screws or the like. Also, power for heat dissipation may be supplied to the third heat dissipation member 30 via the accessory mounting portion 16.

[0024] The imaging device 10 preferably has a cover member 32 that covers the exposed portion 25, as shown in Figure 6. When the heat generated inside the imaging device 10 is low, such as when taking still images, compared to when taking continuous video for a long period of time, and when heat dissipation from the top surface portion 11c is sufficient, it is preferable to cover the exposed portion 25 with the cover member 32. For this reason, it is preferable to cover the exposed portion 25 with the cover member 32 when there is little need for heat dissipation from the exposed portion 25 and the third heat dissipation member 30 has been removed. Furthermore, covering the exposed portion 25 with the cover member 32 prevents damage to the first heat dissipation member 22 or the second heat dissipation member 23 that are exposed from the exposed portion 25.

[0025] The imaging device 10 preferably has a fourth heat dissipation member 34 that can move between a position P1 in which the exposed portion 25 is exposed to the outside of the housing 11 and a position P2 in which the exposed portion 25 is covered. Specifically, the fourth heat dissipation member 34 moves to position P1 in which the exposed portion 25 is exposed to the outside of the housing 11 when heat is being dissipated, and moves to position P2 in which the exposed portion 25 is covered when heat is not being dissipated. When heat is being dissipated, for example, when using continuous video for a long period of time, it is assumed that there is a need to actively release the heat of the sensor 20 or the electronic circuit board 21 to the outside of the housing 11 through the exposed portion 25. On the other hand, when heat is not being dissipated, for example, when using still images, it is assumed that there is no need to actively release the heat of the sensor 20 or the electronic circuit board 21 to the outside of the housing 11 through the exposed portion 25. Furthermore, the fourth heat dissipation member 34 may be provided with a mechanism that uses a biasing member (not shown), such as a spring, to automatically spring up from position P2 to position P1 when an exposed part release button (not shown) is operated.

[0026] This disclosure can also be implemented in the following forms: [Note 1] An imaging device having a first heat dissipation member for dissipating heat from a sensor and a second heat dissipation member for dissipating heat from an electronic substrate inside a housing, wherein the first heat dissipation member and the second heat dissipation member are in contact with the top surface of the housing, and the housing has an exposed portion to which at least one of the first heat dissipation member or the second heat dissipation member can be exposed to the outside of the housing. [Note 2] The imaging device according to Note 1, wherein the first heat dissipation member and the second heat dissipation member are in contact with each other. [Note 3] The imaging device according to Note 1 or 2, wherein the first heat dissipation member and the second heat dissipation member are an integrated member. [Note 4] The imaging device according to any one of Notes 1 to 3, further having means for dissipating heat contained in at least one of the first heat dissipation member or the second heat dissipation member from the exposed portion to the outside of the housing. [Note 5] The imaging device according to any one of Notes 1 to 4, further having a third heat dissipation member mounted on the exposed portion. [Note 6] The imaging device according to Note 5, wherein the housing has an accessory mounting portion, and the third heat dissipation member is connected to the accessory mounting portion. [Note 7] The imaging device according to Note 5, wherein the third heat dissipation member is a fan. [Note 8] The imaging device according to Note 5, wherein it has a cover member that covers the exposed portion. [Note 9] The imaging device according to Note 8, wherein the cover member covers the exposed portion when the third heat dissipation member is removed. [Note 10] The imaging device according to any one of Notes 1 to 9, wherein it has a fourth heat dissipation member that is movable between a position in which the exposed portion is exposed to the outside and a position in which the exposed portion is covered. [Note 11] The imaging device according to Note 10, wherein the fourth heat dissipation member moves to a position in which the exposed portion is exposed to the outside when dissipating heat, and moves to a position in which it covers the exposed portion when not dissipating heat. [Note 12] The imaging device according to any one of Notes 1 to 11, wherein the top surface side of the sensor and the first heat dissipation member are in contact. [Note 13] The sensor unit having the sensor is the imaging device described in Note 12, which has an in-body image blur correction mechanism.

[0027] 10 Imaging device 11 Housing 11a Front part 11b Rear part 11c Top part 11d Bottom part 12 Lens barrel 14 Release switch 15 Display 16 Accessory mounting part 20 Sensor 21 Electronic circuit board 22 First heat dissipation member 22a Sensor mounting part 23 Second heat dissipation member 25 Exposed part 26 Sensor part 26a In-body image blur correction mechanism 27 Heat dissipation member for electronic circuit board 30 Third heat dissipation member 32 Cover member 34 Fourth heat dissipation member P1, P2 Position Hs, Hp Heat S Natural convection

Claims

1. An imaging device having a first heat dissipation member for dissipating heat from a sensor and a second heat dissipation member for dissipating heat from an electronic circuit board inside a housing, wherein the first heat dissipation member and the second heat dissipation member are in contact with the top surface of the housing, and the housing has an exposed portion to which at least one of the first heat dissipation member or the second heat dissipation member can be exposed to the outside of the housing.

2. The imaging apparatus according to claim 1, wherein the first heat dissipation member and the second heat dissipation member are in contact with each other.

3. The imaging apparatus according to claim 1, wherein the first heat dissipation member and the second heat dissipation member are an integrated member.

4. The imaging apparatus according to claim 1, further comprising means for dissipating heat contained in at least one of the first heat dissipation member or the second heat dissipation member from the exposed portion to the outside of the housing.

5. The imaging device according to claim 1, further comprising a third heat dissipation member attached to the exposed portion.

6. The imaging device according to claim 5, wherein the housing has an accessory mounting portion, and the third heat dissipation member is connected to the accessory mounting portion.

7. The imaging apparatus according to claim 5, wherein the third heat dissipation member is a fan.

8. The imaging device according to claim 5, further comprising a cover member that covers the exposed portion.

9. The imaging device according to claim 8, wherein the cover member covers the exposed portion when the third heat dissipation member is removed.

10. The imaging device according to claim 1, further comprising a fourth heat dissipation member that is movable between a position in which the exposed portion is exposed to the outside and a position in which the exposed portion is covered.

11. The imaging device according to claim 10, wherein the fourth heat dissipation member moves to a position where the exposed portion is exposed to the outside when heat is being dissipated, and moves to a position where the exposed portion is covered when heat is not being dissipated.

12. The imaging device according to claim 1, wherein the top surface of the sensor and the first heat dissipation member are in contact.

13. The imaging device according to claim 12, wherein the sensor unit having the sensor has an in-body image blur correction mechanism.

Images