Camera module and electronic device

Abstract

A camera module according to one embodiment of the present disclosure comprises: a housing; a lens assembly at least partially accommodated in the housing; and a sensor shifting structure disposed below the lens assembly so as to be spaced apart therefrom, and configured such that a portion thereof is movable. The sensor shifting structure comprises an image sensor disposed substantially perpendicular to the optical axis of the lens assembly, and a first printed circuit board (PCB) having one surface on which the image sensor is disposed, wherein the first PCB comprises a first connector disposed on the one surface. The sensor shifting structure comprises a second PCB disposed between the lens assembly and the first PCB. The second PCB includes a fixed area at least partially attached to the housing, an elastic area connected to the fixed area, and a connection area connected to the elastic area and spaced apart from the fixed area. The second PCB may comprise a second connector disposed in the connection area and electrically coupled to the first connector. Various other embodiments are also possible.

Description

Camera Module and Electronic Device

[0001] The present disclosure relates to a camera module and an electronic device including the camera module, for example, to a sensor-shift type camera module capable of reducing the area of ​​a printed circuit board (PCB) and an electronic device including the camera module.

[0002] With the development of digital technology, various types of electronic devices, such as smartphones, digital cameras, and / or wearable devices, are widely used. These electronic devices may include at least one camera device (e.g., a camera module) capable of capturing images. Recently, the use of video recording functions by electronic devices by users has been increasing. For example, users can capture video and audio without restrictions on time and / or place (or space) by using portable electronic devices.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] Various methods can be applied to compensate for camera shake. Lens shifting can be used for camera calibration or image distortion correction. Lens shifting corrects or modifies images by optically moving the position of the lens (e.g., moving it perpendicular to the lens's optical axis or horizontally to the image sensor). Due to the requirement for high-resolution and high-performance sensors in mobile phone cameras, lenses have become larger. As the lens size increases, the driving force required to move it also increases. Consequently, the driving unit for moving the lens has become larger, leading to the adoption of sensor shifting, which moves the image sensor rather than the lens.

[0005] Unlike the lens shift method, the sensor shift method can correct photo blur by physically moving the image sensor.

[0006] In the case of a sensor shift type camera module, the image sensor PCB on which the image sensor is placed can be moved in a specified direction (e.g., x-axis or y-axis direction) while maintaining an electrical connection from the image sensor to the connector connected to the external system.

[0007] In such a sensor-shift type camera module, the image sensor PCB (printed circuit board), moving FPCB (flexible printed circuit board) (e.g., moving wiring), first PCB (e.g., image sensor PCB), and second PCB are substantially placed on the same plane (e.g., horizontally), which can increase the area of ​​the entire PCB. As a result, the size of the camera module increases, and there may be restrictions on placing the camera module in an electronic device.

[0008] The technical problems to be solved in this document are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this invention belongs from the description below.

[0009] The present invention is described in the appended claims.

[0010] A camera module according to one embodiment of the present disclosure comprises a housing, a lens assembly partially accommodated in the housing, and a sensor shifting structure spaced apart from the lens assembly and configured to be able to move a portion of its position. The sensor shifting structure comprises an image sensor positioned substantially perpendicular to the optical axis of the lens assembly, a first printed circuit board (PCB) having the image sensor positioned on one surface, and a first connector positioned on the first surface of the first PCB. The sensor shifting structure comprises a second PCB positioned between the lens assembly and the first PCB. The second PCB comprises a fixed region partially attached to the housing, an elastic region connected to the fixed region, and a connecting region connected to the elastic region and spaced apart from the fixed region. The second PCB may include a second connector positioned in the connecting region and electrically detachably coupled to the first connector.

[0011] The camera module and electronic device according to the embodiment of the present disclosure can reduce the size of the camera module by reducing the area of ​​the printed circuit board (PCB) of the camera module.

[0012] An electronic device according to an embodiment of the present disclosure can reduce the size of the camera module so that a plurality of camera modules can be arranged within a limited space of the electronic device.

[0013] A camera module and electronic device according to an embodiment of the present disclosure can reduce the area of ​​the entire printed circuit board (PCB) by arranging at least a portion of a first printed circuit board on which an image sensor is placed and at least a portion of a second printed circuit board so as to overlap, and electrically connecting a first connector of the first printed circuit board and a second connector of the second printed circuit board.

[0014] A camera module and electronic device according to an embodiment of the present disclosure can correct hand shake by moving a first PCB (e.g., image sensor PCB) in the x-axis, y-axis, and / or z-axis direction to correspond to shake during camera shooting.

[0015] A camera module and electronic device according to an embodiment of the present disclosure are formed such that a first connector part (e.g., a first PCB connector, a lower connector) and a second connector part (e.g., a second PCB connector, an upper connector) surround four sides of an image sensor (e.g., a sealed structure), thereby preventing (e.g., blocking) foreign substances from entering the image sensor.

[0016] In addition, various effects that can be identified directly or indirectly through this document may be provided.

[0017] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure pertains from the description below.

[0018] In relation to the description of the drawings, the same (or similar) reference numerals may be used to describe identical (or similar) components, features, and structures.

[0019] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present disclosure.

[0020] FIG. 2 is a front perspective view of an electronic device (e.g., mobile electronic device) according to various embodiments of the present disclosure.

[0021] FIG. 3 is a perspective view of the rear of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0022] FIG. 4 is a block diagram of a camera module according to one embodiment.

[0023] Figure 5 is a diagram showing a sensor shift type camera module.

[0024] Figure 6 is a diagram showing that a sensor PCB including an image sensor is moved in the x-axis or y-axis direction by the movement of a moving PCB.

[0025] FIG. 7a is a drawing showing a camera module according to one embodiment of the present disclosure.

[0026] FIG. 7b is a drawing showing a camera module according to one embodiment of the present disclosure.

[0027] FIG. 7c is a diagram showing the method in which a first connector placed on a first printed circuit board and a second connector placed on a second printed circuit board are electrically coupled.

[0028] FIG. 7d is a diagram showing the method in which a first connector placed on a first printed circuit board and a second connector placed on a second printed circuit board are electrically coupled.

[0029] FIG. 8 is a drawing showing that a first printed circuit board of a camera module according to one embodiment of the present disclosure is positioned on the lower side and a second printed circuit board is positioned on the upper side.

[0030] FIG. 9 is a drawing showing a first printed circuit board of a camera module according to one embodiment of the present disclosure.

[0031] FIG. 10 is a drawing showing a second printed circuit board of a camera module according to one embodiment of the present disclosure.

[0032] FIG. 11 is a cross-sectional view showing a camera module according to one embodiment of the present disclosure.

[0033] FIG. 12 is a drawing showing that a first printed circuit board and a second printed circuit board of a camera module according to one embodiment of the present disclosure are electrically coupled.

[0034] FIGS. 13 and 14 are drawings showing how to reduce the area of ​​a printed circuit board (PCB) of a camera module by arranging at least a portion of a first printed circuit board and at least a portion of a second printed circuit board so as to overlap.

[0035] Figure 15 is a diagram showing an infrared filter placed in a camera module.

[0036] Figure 16 is a diagram showing an infrared filter placed in a camera module.

[0037] FIG. 17 is a drawing showing the shape of a first connector placed on a first printed circuit board and a second connector placed on a second printed circuit board.

[0038] FIG. 18 is a drawing showing the shape of a first connector placed on a first printed circuit board and a second connector placed on a second printed circuit board.

[0039] Various embodiments are possible in addition to the embodiments shown in the drawings. At least two or more embodiments shown in the drawings may be combined.

[0040] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0041] The following description, with reference to the attached drawings, is provided to facilitate a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. While various specific details are included to aid understanding, they should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications to the various embodiments described herein may be made without departing from the scope and spirit of the disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0042] The terms and words used in the following description and claims are not limited to their literary meanings and are merely used by the applicant to enable a clear and consistent understanding of this document. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of this document is provided for illustrative purposes only and is not intended to limit this document as defined by the appended claims and their equivalents.

[0043] The singular form should be understood to include plural referents unless the context clearly indicates otherwise. Thus, for example, a reference to "component surfaces" may include a reference to one or more of such surfaces.

[0044] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present disclosure.

[0045] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0046] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0047] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0048] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0049] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0050] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0051] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0052] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0053] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0054] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0055] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0056] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0057] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0058] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0059] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0060] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0061] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0062] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0063] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0064] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0065] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0066] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0067] An electronic device according to one embodiment disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiment of this document is not limited to the aforementioned devices.

[0068] The embodiments of the present disclosure and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of such embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another corresponding component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., by wire), wirelessly, or through a third component.

[0069] As used in one embodiment of the present disclosure, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0070] One embodiment of the present disclosure may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0071] According to one embodiment, the method according to one embodiment disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0072] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0073] FIG. 2 is a front perspective view of an electronic device (101) (e.g., mobile electronic device) according to various embodiments of the present disclosure.

[0074] FIG. 3 is a rear perspective view of the electronic device (101) of FIG. 1 according to various embodiments of the present disclosure.

[0075] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In another embodiment, the housing (210) may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIG. 1.

[0076] According to one embodiment, the first surface (210A) may be formed by a front plate (202) in which at least a portion is substantially transparent (e.g., a glass plate or a polymer plate containing various coating layers). The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. The side (210C) may be formed by a side bezel structure (218) (or "side member") comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0077] In an embodiment, the front plate (202) may include a first region (210D) that is curved from the first surface (210A) toward the rear plate (211) and extends seamlessly at both ends of the long edge of the front plate (202).

[0078] In an embodiment, the rear plate (211) may include a second region (210E) that is curved from the second surface (210B) toward the front plate (202) and extends seamlessly at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B).

[0079] In the embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as described above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0080] According to one embodiment, the electronic device (101) may include at least one of a display (201) (e.g., the display module (160) of FIG. 1), an input device (203) (e.g., the input module (150) of FIG. 1), an audio output device (207, 214) (e.g., the audio output module (155) of FIG. 1), a sensor module (204, 219) (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212) (e.g., the camera module (180) of FIG. 1), a key input device (217), an indicator, and a connector (208). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the key input device (217), or the indicator) or additionally include other components.

[0081] According to one embodiment, the display (201) may be exposed through the upper portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming a first area (210D) of the first surface (210A) and side (210C). The display (201) may be combined with or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0082] According to one embodiment, the input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound.

[0083] According to one embodiment, the acoustic output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a receiver (214) for communication. In some embodiments, the microphone (203), speakers (207, 214), and connector (208) may be placed in at least part of the internal space of the electronic device (101) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone (203) and the speakers (207, 214). In some embodiments, the acoustic output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates with the hole formed in the housing (210) excluded.

[0084] According to one embodiment, the sensor module (204, 219) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., home key button), a portion of the second surface (210B), and / or below the display (201).

[0085] According to one embodiment, the electronic device (101) may further include at least one sensor module not illustrated, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0086] According to one embodiment, the camera module (205, 212) may include a first camera module (205) disposed on a first surface (210A) of the electronic device (101), a second camera module (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101).

[0087] According to one embodiment, the key input device (217) may be placed on the side (210C) of the housing (210). In another embodiment, the electronic device (101) may not include some or all of the mentioned key input devices (217), and the key input device (217) not included may be implemented in other forms, such as soft keys, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0088] According to one embodiment, an indicator may be disposed on a first surface (210A) of a housing (210). The indicator may, for example, provide status information of an electronic device (101) in the form of light (e.g., a light-emitting element). In another embodiment, the light-emitting element may, for example, provide a light source that is coupled with the operation of a camera module (205). The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0089] According to one embodiment, the connector hole (208) may include a first connector hole (208) capable of receiving a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0090] According to one embodiment, some camera modules (205) among the camera modules (205, 212), some sensor modules (204) among the sensor modules (204, 219), or an indicator may be positioned to be exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be positioned in the internal space of the electronic device (101) to come into contact with the external environment through a through hole perforated to the front plate (202) of the display (201). In another embodiment, some sensor modules (204) may be positioned to perform their function without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, the area of ​​the display (201) facing the sensor module may not require a through hole.

[0091] According to one embodiment, the electronic device (101) may include a processor (e.g., the processor (120) of FIG. 1).

[0092] According to one embodiment, a processor (120) (e.g., a processing circuit) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing operations. The processor (120) may include at least one electrical circuit and may process instructions (or programs, data) stored in memory (e.g., memory (130) of FIG. 1) individually or collectively in a distributed manner. The processor (120) may include a processor assembly comprising one or more processing circuits. The processor (120) may include any processing circuit that is operative to control the performance and operations of one or more components of the electronic device (101) (e.g., memory (130), display module (e.g., display module (160) of FIG. 1), sensor module (e.g., sensor module (176) of FIG. 1 or sensor), camera module (180) (e.g., camera module (180) of FIG. 1, camera module (180) of FIG. 4, image sensor) and / or communication module (e.g., communication module (190) of FIG. 1, communication circuit)).

[0093] For example, a processor (120) (e.g., an application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (120) may be implemented as a plurality of cores (or at least one core circuit), a plurality of chips, or a plurality of chipsets. For example, the processor (120) may include one or more processing circuits. For example, the processor (120) may include one or more processing circuits configured to perform the various functions of the present disclosure individually and / or collectively. As an example without limitation, at least a portion of the processor (120) may be included in a first chip of the electronic device (101), and at least another portion of the processor (120) may be included in a second chip of the electronic device (101) different from the first chip of the electronic device (101).

[0094] According to one embodiment, the number of processors (120) may be one or more. For example, the processor (120) may have the structure of a multi-core processor such as a dual core, quad core, hexa core, or octa core. The processor (120) can control the operations of the electronic device (101) by executing instructions stored in memory (130). For example, the processor (120) may correspond to a plurality of processors that collectively perform a plurality of operations by dividing them among the processors.

[0095] FIG. 4 is a block diagram of a camera module according to one embodiment.

[0096] Referring to FIG. 4, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 2 and FIG. 3) may include at least one camera module (180) (e.g., the camera module (180) of FIG. 1).

[0097] According to one embodiment, the camera module (180) may include a lens assembly (410), a flash (420), an image sensor (430), an image stabilizer (440), a memory (450) (e.g., a buffer memory), or an image signal processor (460).

[0098] According to one embodiment, the lens assembly (410) can collect light emitted from a subject that is the subject of image capture. The lens assembly (410) may include one or more lenses.

[0099] According to one embodiment, the camera module (180) may include a plurality of lens assemblies (410). For example, the camera module (180) may form a dual camera, a 360-degree camera, or a spherical camera. For example, some of the plurality of lens assemblies (410) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom). For example, at least one lens assembly may have one or more lens properties different from the lens properties of other lens assemblies. For example, the lens assembly (410) may include a wide-angle lens or a telephoto lens.

[0100] According to one embodiment, the flash (420) may emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (420) may include one or more light-emitting diodes (e.g., RGB (red-green-blue) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp.

[0101] According to one embodiment, the image sensor (430) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (410) into an electrical signal. For example, the image sensor (430) may include one image sensor selected from image sensors with different attributes, such as an RGB sensor, a BW (black and white) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same attribute, or a plurality of image sensors having different attributes. For example, each image sensor included in the image sensor (430) may be implemented using a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0102] According to one embodiment, the image stabilizer (440) can move at least one lens or image sensor (430) included in the lens assembly (410) in a specific direction in response to the movement of the camera module (180) or the electronic device including the same (e.g., the electronic device (101) of FIG. 1, the electronic device (101) of FIG. 2 and FIG. 3). In response to the movement of the camera module (180) or the electronic device including the same (e.g., the electronic device (101) of FIG. 1, the electronic device (101) of FIG. 2 and FIG. 3), the operating characteristics of the image sensor (430) can be controlled (e.g., adjusting read-out timing, etc.). For example, the camera module (180) can control the operation of the image sensor (430) by taking into account the operation of the image stabilizer (440).

[0103] According to one embodiment, the image stabilizer (440) can detect movement (e.g., shaking) of the camera module (180) or electronic device (101) or camera module (180) by using a gyroscope sensor (not shown) or an accelerometer sensor (not shown) placed inside or outside the camera module (180).

[0104] For example, when the image is shaken due to the movement (e.g., shaking) of the electronic device (or camera module) during shooting, an image stabilizer (440) can be used to compensate for the image not shaking.

[0105] According to one embodiment, the memory (450) may temporarily store at least a portion of an image acquired through the image sensor (430) for the next image processing operation. For example, if image acquisition by the shutter is delayed or multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (450), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160). Subsequently, when a specified condition is satisfied (e.g., user input or system command), at least a portion of the original image stored in the memory (450) can be acquired and processed by the image signal processor (460).

[0106] According to one embodiment, the memory (450) may be composed of at least a part of the memory (130) of the electronic device (101).

[0107] According to one embodiment, the memory (450) may be configured as a separate memory that operates independently of the memory (130) of the electronic device (101).

[0108] According to one embodiment, an image signal processor (460) may perform one or more image processing on an image obtained through an image sensor (430) or an image stored in memory (450). The one or more image processing may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softing).

[0109] For example, the image signal processor (460) can perform control (e.g., exposure time control, or readout timing control, etc.) over at least one of the components included in the camera module (180) (e.g., image sensor (430)). The image processed by the image signal processor (460) may be stored back in memory (450) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), an external electronic device (e.g., electronic device (102), electronic device (104) of FIG. 1), or an external server (e.g., server (108) of FIG. 1).

[0110] According to one embodiment, the image signal processor (460) may be configured as at least part of the processor (120) or as a separate processor that operates independently of the processor (120). If the image signal processor (460) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (460) may be displayed through the display module (160) as is or after additional image processing by the processor (120).

[0111] According to one embodiment, the electronic device (101) may include a plurality of camera modules (180) each having different attributes (e.g., angle of view) or functions. In this case, for example, the plurality of camera modules (180) may include at least one of a wide-angle camera, a telephoto camera, or an IR camera (e.g., a ToF camera (time of flight camera), a structured light camera). For example, a plurality of camera modules including lenses having different angles of view may be configured, and the electronic device (101, 200) may be controlled to change the angle of view by varying according to the user's selection.

[0112] According to one embodiment, at least one of the plurality of camera modules (180) may be a front camera and at least one other may be a rear camera.

[0113] Figure 5 is a diagram showing a sensor shift type camera module.

[0114] Figure 6 is a diagram showing that a sensor PCB including an image sensor is moved in the x-axis or y-axis direction by the movement of a moving PCB.

[0115] Referring to FIGS. 5 and 6, an electronic device (e.g., the electronic device (101) of FIG. 1, the electronic device (101) of FIG. 2 and 3) may include a sensor-shift type camera module (500).

[0116] According to one embodiment, a sensor-shift type camera module (500) may include a first PCB (510) (e.g., image sensor PCB), an image sensor (520), a second PCB (540), a moving FPCB (flexible printed circuit board) (530) (e.g., moving wiring), and a moving driving unit (not shown). Even if the phrases “sensor-shift type” or “sensor-shift” are used in this disclosure, such phrases are intended to emphasize the inventive concept of this disclosure for illustrative purposes. The specific technical meaning of such phrases is realized by the structural definition of the camera module, for example, a vertical stacking arrangement of related components (e.g., including a movable or moving PCB) may be realized. Accordingly, the term “sensor-shift type camera module” may be used interchangeably or interchangeably with the term “camera module” throughout this disclosure.

[0117] For example, the general term “sensor shifting structure” (and a general description of its configuration (e.g., for moving the position of a part thereof and / or for being spaced downward from the lens assembly)) may be used as a comprehensive term to refer, where mentioned, to an image sensor, a first PCB and / or a second PCB and / or additional components (e.g., a movable FPCB or movable wires), and thus may be omitted if one or more of the individual components are defined as, for example, movable or configured to move. The sensor shifting structure may be understood as realizing the sensor-shift type camera module described in this disclosure. Accordingly, a camera module including such a sensor shifting structure may be considered to be of the sensor-shift type. However, there is no limitation on whether any specific one or more of the components (excluding, for example, the lens assembly) are movable to realize the sensor-shift type camera module.

[0118] For example, an image sensor (520) may be placed on the first PCB (510). The first PCB (510) and the second PCB (540) may be spaced apart at a certain distance so that a space is formed between the first PCB (510) and the second PCB (540). A moving FPCB (530) may be placed between the first PCB (510) and the second PCB (540). The moving FPCB (530) may electrically connect the first PCB (510) and the second PCB (540).

[0119] For example, a moving drive unit may operate to move the first PCB (510) in the x-axis or y-axis direction. At this time, the wiring of the moving FPCB (530) may move flexibly to move the first PCB (510) in the x-axis or y-axis direction. The first PCB (510) may be moved in the x-axis or y-axis direction to compensate for shaking during camera shooting, thereby correcting hand shake. In this sensor shift type camera module (500), the first PCB (510), the moving FPCB (530), and the second PCB (540) are arranged on the same plane (e.g., horizontally), so the total area of ​​the PCBs may increase. As a result, the size of the camera module (500) increases, and there may be restrictions on placing the camera module (500) in an electronic device.

[0120] FIGS. 7a and FIGS. 7b are drawings showing a camera module according to one embodiment of the present disclosure.

[0121] Referring to FIGS. 2, FIGS. 3, FIGS. 4, FIGS. 7a, and FIGS. 7b, a camera module (700) according to one embodiment of the present disclosure (e.g., camera module (180) of FIGS. 1 and FIGS. 4) may include a sensor shift type camera module. In the description referring to the drawings, “upper” may mean the upper (z-axis direction) relative to the z-axis direction (e.g., optical axis direction (701)). “Lower” may mean the lower (-z-axis direction) relative to the z-axis direction (e.g., optical axis direction (701)).

[0122] According to one embodiment, the camera module (700) may include a bottom cover (710, bottom cover) (e.g., bottom housing), a first PCB (720) (e.g., image sensor PCB), peripheral circuits (722), an image sensor (730) (e.g., image sensor (430) of FIG. 4), a first connector part (740) (e.g., first PCB connector, bottom connector), a second PCB (760) (e.g., moving PCB, moving FPCB), a second connector part (750) (e.g., second PCB connector, top connector), a third PCB (770) (e.g., fixed PCB), a third connector part (712), a bracket (714), an infrared filter (780, IR filter), a moving driving part (790), a top cover (716, top cover) (e.g., top housing), and a lens assembly (718) (e.g., lens assembly (410)). For example, the moving drive unit (790) may include a magnet (792) and a coil (794).

[0123] According to one embodiment, a bottom cover (710, bottom cover) (e.g., bottom housing) and a top cover (716, top cover) (e.g., top housing) may be arranged to come into contact with each other to form a space inside.

[0124] For example, a first PCB (720) (e.g., image sensor PCB), peripheral circuits (722), image sensor (730) (e.g., image sensor (430) of FIG. 4), a first connector part (740) (e.g., first PCB connector, bottom connector), a second PCB (760) (e.g., moving PCB, moving FPCB), a second connector part (750) (e.g., second PCB connector, top connector), a third PCB (770) (e.g., fixed PCB), a third connector part (712), a bracket (714), an infrared filter (780, IR filter), a moving drive part (790), and a lens assembly (718) (e.g., lens assembly (410)) may be disposed in the internal space formed by a bottom cover (710, bottom cover) (e.g., bottom housing) and a top cover (716, top cover) (e.g., top housing). For example, the first PCB (720) (e.g., image sensor PCB) and the second PCB (760) (e.g., moving PCB, moving FPCB) may be placed inside the housing (710, 716). The third PCB (770) (e.g., fixed PCB) may be placed outside the housing (710, 716). The first side of the third PCB (770) (e.g., fixed PCB) may be electrically connected to the second PCB (760) (e.g., moving PCB, moving FPCB), and the second side may be electrically connected to the third connector part (712). The third PCB (770) (e.g., fixed PCB) may include a flexible FPCB so that it can be electrically connected to a processor (e.g., application processor, image signal processor) outside the housing (710, 716).

[0125] For example, at least a portion of the upper surface of the top cover (716, top cover) (e.g., top housing) is opened to form an upper hole, and at least a portion of the lens assembly (718) (e.g., lens assembly (410)) may be exposed to the outside through the upper hole of the top cover (716, top cover) (e.g., top housing).

[0126] For example, a side hole is formed on the side of the part where the bottom cover (710, bottom cover) (e.g., bottom housing) and the top cover (716, top cover) (e.g., top housing) meet, and at least a portion of the third PCB (770) (e.g., fixed PCB) can be exposed to the outside through the side hole.

[0127] According to one embodiment, a first PCB (720) (e.g., image sensor PCB) may be placed in the space formed by a bottom cover (710, bottom cover) (e.g., bottom housing) and a top cover (716, top cover) (e.g., top housing) with respect to the z-axis direction.

[0128] For example, an image sensor (730) may be placed on the first PCB (720) (e.g., image sensor PCB).

[0129] According to one embodiment, a first connector part (740) (e.g., first PCB connector, lower connector) may be disposed on the upper part of a first PCB (720) (e.g., image sensor PCB).

[0130] For example, a first PCB (720) (e.g., image sensor PCB) may have a plurality of signal wires electrically connected to an image sensor (730).

[0131] For example, the first connector part (740) (e.g., first PCB connector, lower connector) may include a plurality of connector sockets (e.g., first connector socket (741) of FIG. 7b) or a plurality of connector pins (e.g., first connector pin (742) of FIG. 7c).

[0132] For example, each of the plurality of signal wires of the first PCB (720) (e.g., image sensor PCB) can be electrically connected to each of the plurality of connector sockets (741) and / or the plurality of connector pins (742).

[0133] According to one embodiment, a second connector part (750) (e.g., second PCB connector, upper connector) may be disposed on the upper side of a first connector part (740) (e.g., first PCB connector, lower connector) disposed on a first PCB (720) (e.g., image sensor PCB) with respect to the z-axis direction.

[0134] According to one embodiment, a second PCB (760) (e.g., moving PCB, moving FPCB) may be placed on the upper part of a second connector part (750) (e.g., second PCB connector, upper connector) with respect to the z-axis direction.

[0135] According to one embodiment, a bracket (714) and an infrared filter (780, IR filter) may be placed on the upper part of a second PCB (760) (e.g., moving PCB, moving FPCB) with respect to the z-axis direction.

[0136] For example, the bracket (714) includes a step, and an infrared filter (780, IR filter) may be placed on the step of the bracket (714). For example, the infrared filter (780, IR filter) may include an infrared cut filter and an infrared pass filter.

[0137] According to one embodiment, a moving drive unit (790) may be positioned on the upper part of a bracket (714). For example, the moving drive unit (790) may include a pair of a magnet (792) and a coil (794). For example, the moving drive unit (790) may include a drive unit configured to provide a moving force to a connection area where a second PCB (760) (e.g., moving PCB, moving FPCB) is positioned. With respect to the z-axis direction, the drive unit of the moving drive unit (790) may be positioned to be located on the upper part of a second connector unit (750) (e.g., second PCB connector, upper connector).

[0138] According to one embodiment, a lens assembly (718) may be placed on top of an infrared filter (780, IR filter).

[0139] According to one embodiment, a first connector part (740) (e.g., first PCB connector, lower connector) may be disposed on the outer edge of the image sensor (730).

[0140] According to one embodiment, a second connector part (750) (e.g., second PCB connector, upper connector) may be disposed on the lower part of the second PCB (760) (e.g., moving PCB, moving FPCB) so as to overlap with at least a part of the second PCB (760) (e.g., moving PCB, moving FPCB).

[0141] According to one embodiment, the second PCB (760) (e.g., moving PCB, moving FPCB) may include moving wires (761). For example, the shape of the second PCB (760) may vary depending on whether the second PCB (760) includes a PCB or an FPCB.

[0142] For example, a second connector part (750) (e.g., second PCB connector, upper connector) may be positioned to overlap with the upper portion of at least part of the moving wiring (761).

[0143] For example, the second connector part (750) (e.g., second PCB connector, upper connector) may include a plurality of connector pins (e.g., first connector pin (751) in FIG. 7b) or a plurality of connector sockets (e.g., second connector socket (741) in FIG. 7b).

[0144] For example, each of the moving wires (761) can be electrically connected to each of the plurality of connector pins (751) and / or the plurality of connector sockets (741).

[0145] According to one embodiment, a first connector part (740) (e.g., first PCB connector, lower connector) placed on a first PCB (720) (e.g., image sensor PCB) and a second connector part (750) (e.g., second PCB connector, upper connector) placed on a second PCB (760) (e.g., moving PCB, moving FPCB) can be detachably coupled and electrically connected.

[0146] According to one embodiment, the height (e.g., height in the z-axis direction) at which the first connector part (740) (e.g., first PCB connector, lower connector) and the second connector part (750) (e.g., second PCB connector, upper connector) are combined may be higher than the height (e.g., height in the z-axis direction) of the surrounding circuits (722).

[0147] According to one embodiment, the height (e.g., height in the z-axis direction) at which the first connector part (740) (e.g., first PCB connector, lower connector) and the second connector part (750) (e.g., second PCB connector, upper connector) are combined may be higher than the height (e.g., height in the z-axis direction) of the image sensor (730).

[0148] According to one embodiment, one side of the second PCB (760) (e.g., moving PCB, moving FPCB) may be electrically connected to the third PCB (770) (e.g., fixed PCB).

[0149] For example, the third connector portion (712) of the third PCB (770) (e.g., fixed PCB) can be electrically coupled to the connector of the PCB on which the image signal processor (e.g., image signal processor (460) of FIG. 4) is placed, or the connector of the PCB on which the processor (e.g., processor (120) of FIG. 1) is placed.

[0150] For example, as shown in FIG. 7b, the moving drive unit (790) can be arranged so that the magnet (792) and the coil (794) overlap in the x-axis or y-axis direction.

[0151] According to one embodiment, a first PCB (720) (e.g., image sensor PCB) on which an image sensor (730) is placed can be moved in the x-axis, y-axis, and / or z-axis directions by driving a moving drive unit (790). At this time, the moving wiring (761) of a second PCB (760) (e.g., moving PCB, moving FPCB) can be moved in the x-axis, y-axis, and / or z-axis directions so that the first PCB (720) (e.g., image sensor PCB) can be moved in at least one of the x-axis or y-axis directions to compensate for hand shake when shooting with a camera. Additionally, when driving AF, the first PCB (720) (e.g., image sensor PCB) can be moved in either the z-axis or -z-axis direction to automatically adjust the focus.

[0152] FIG. 7c is a diagram showing the method in which a first connector placed on a first printed circuit board and a second connector placed on a second printed circuit board are electrically coupled.

[0153] Referring to FIGS. 7a through 7c, according to one embodiment, a first connector portion (740) (e.g., a first PCB connector, a lower connector) may include first connector sockets (741). FIG. 7b shows one of the first connector sockets (741).

[0154] For example, each of the multiple signal wires of the first PCB (720) (e.g., image sensor PCB) can be electrically connected to each of the first connector sockets (741).

[0155] According to one embodiment, the second connector portion (750) (e.g., second PCB connector, upper connector) may include first connector pins (751). In FIG. 7b, one of the first connector pins (751) may be included.

[0156] For example, each of the moving wires (761) can be electrically connected to each of the first connector pins (751).

[0157] According to one embodiment, first connector sockets (741) placed on a first PCB (720) (e.g., image sensor PCB) and first connector pins (751) placed on a second PCB (760) (e.g., moving PCB, moving FPCB) can be detachably coupled and electrically connected.

[0158] FIG. 7d is a diagram showing the method in which a first connector placed on a first printed circuit board and a second connector placed on a second printed circuit board are electrically coupled.

[0159] Referring to FIGS. 7a through 7d, according to one embodiment, a first connector portion (740) (e.g., a first PCB connector, a lower connector) may include second connector pins (742). In FIG. 7c, one of the second connector pins (742) is shown.

[0160] For example, each of the multiple signal wires of the first PCB (720) (e.g., image sensor PCB) can be electrically connected to each of the second connector pins (742).

[0161] According to one embodiment, the second connector portion (750) (e.g., second PCB connector, upper connector) may include second connector sockets (752). In FIG. 7c, one of the second connector sockets (752) may be included.

[0162] For example, each of the moving wires (761) can be electrically connected to each of the second connector sockets (752).

[0163] According to one embodiment, second connector pins (742) placed on a first PCB (720) (e.g., image sensor PCB) and second connector sockets (752) placed on a second PCB (760) (e.g., moving PCB, moving FPCB) can be detachably coupled and electrically connected.

[0164] According to one embodiment, at least a portion of the first connector portion (740) (e.g., first PCB connector, lower connector) and at least a portion of the second connector portion (750) (e.g., second PCB connector, upper connector) can be fixed (e.g., attached) through an adhesive member.

[0165] FIG. 8 is a drawing showing that a first printed circuit board of a camera module according to one embodiment of the present disclosure is positioned on the lower side and a second printed circuit board is positioned on the upper side.

[0166] FIG. 9 is a drawing showing a first printed circuit board of a camera module according to one embodiment of the present disclosure.

[0167] FIG. 10 is a drawing showing a second printed circuit board of a camera module according to one embodiment of the present disclosure.

[0168] Referring to FIGS. 7a, 7b, and FIGS. 8 through 10, according to one embodiment, the first connector part (740) (e.g., first PCB connector, lower connector) may be formed to surround four sides of the image sensor (730) (e.g., a sealed structure). However, not limited thereto, when the first connector part (740) (e.g., first PCB connector, lower connector) is formed to surround four sides of the image sensor (730), it may be formed to be open in the upper (e.g., z-axis direction) and lower (e.g., -z-axis direction) directions, and the corner portions of the first connector part (740) (e.g., first PCB connector, lower connector) in the side direction (e.g., x-axis or y-axis direction) may be open.

[0169] For example, the first connector part (740) (e.g., first PCB connector, lower connector) may be formed to correspond to two or three sides of the image sensor (730).

[0170] For example, when the first connector part (740) (e.g., first PCB connector, lower connector) is formed to surround the four sides of the image sensor (730), it may be formed to be open in the upper (e.g., z-axis direction) and lower (e.g., -z-axis direction) directions, and without any open portion in the lateral direction (e.g., x-axis or y-axis direction) of the first connector part (740) (e.g., first PCB connector, lower connector).

[0171] According to one embodiment, the second connector portion (750) (e.g., second PCB connector, upper connector) is positioned on top of the first connector portion (740) (e.g., first PCB connector, lower connector) and may be formed to correspond to four sides of the image sensor (730) (e.g., a sealed structure). However, it is not limited thereto, and the second connector portion (750) (e.g., second PCB connector, upper connector) may be formed to correspond to two or three sides of the image sensor (730).

[0172] For example, if the first connector part (740) (e.g., first PCB connector, lower connector) and the second connector part (750) (e.g., second PCB connector, upper connector) are formed to surround the four sides of the image sensor (730) (e.g., a sealed structure), it is possible to prevent (e.g., block) foreign matter from entering the image sensor (730).

[0173] For example, the second connector part (750) (e.g., second PCB connector, upper connector) may be formed to be open in the upper (e.g., z-axis direction) and lower (e.g., -z-axis direction) directions, and without any open portion in the lateral direction (e.g., x-axis or y-axis direction) of the first connector part (740) (e.g., first PCB connector, lower connector). However, it is not limited thereto, and the second connector part (750) (e.g., second PCB connector, upper connector) may be formed to be open in the upper (e.g., z-axis direction) and lower (e.g., -z-axis direction) directions, and the corner portion in the lateral direction (e.g., x-axis or y-axis direction) of the first connector part (740) (e.g., first PCB connector, lower connector) may be formed to be open.

[0174] For example, the first connector part (740) (e.g., first PCB connector, lower connector) may be formed in a closed-loop shape, and the second connector part (750) (e.g., second PCB connector, upper connector) may be formed so that at least some of the four sides are open.

[0175] For example, the first connector part (740) (e.g., first PCB connector, lower connector) may be formed in a closed-loop shape, and the second connector part (750) (e.g., second PCB connector, upper connector) may be formed so that at least some of the four corners are open.

[0176] FIG. 11 is a cross-sectional view showing a camera module according to one embodiment of the present disclosure.

[0177] FIG. 12 is a drawing showing that a first printed circuit board and a second printed circuit board of a camera module according to one embodiment of the present disclosure are electrically coupled.

[0178] Referring to FIGS. 11 and 12, according to one embodiment, a first connector part (740) (e.g., first PCB connector, lower connector) may be placed on the upper part of a first PCB (720) (e.g., image sensor PCB) with respect to the z-axis direction.

[0179] According to one embodiment, a second connector part (750) (e.g., second PCB connector, upper connector) may be disposed on the upper side of a first connector part (740) (e.g., first PCB connector, lower connector) disposed on a first PCB (720) (e.g., image sensor PCB) with respect to the z-axis direction.

[0180] According to one embodiment, a second PCB (760) (e.g., moving PCB, moving FPCB) may be placed on top of a second connector part (750) (e.g., second PCB connector, upper connector) with respect to the z-axis direction. For example, the second connector part (750) (e.g., second PCB connector, upper connector) may be placed to overlap with at least a portion of the second PCB (760) (e.g., moving PCB, moving FPCB).

[0181] According to one embodiment, a first connector part (740) (e.g., first PCB connector, lower connector) disposed on a first PCB (720) (e.g., image sensor PCB) may be pressed in the -z axis direction, and a second connector part (750) (e.g., second PCB connector, upper connector) disposed on a second PCB (760) (e.g., moving PCB, moving FPCB) may be pressed in the z axis direction. Through this, the first connector part (740) (e.g., first PCB connector, lower connector) and the second connector part (750) (e.g., second PCB connector, upper connector) may be detachably coupled and electrically connected.

[0182] Not limited thereto, the first connector part (740) (e.g., first PCB connector, lower connector) and the second connector part (750) (e.g., second PCB connector, upper connector) may be detachably coupled (e.g., electrically connected).

[0183] According to one embodiment, a first connector part (740) (e.g., a first PCB connector, a lower connector) and a second connector part (750) (e.g., a second PCB connector, an upper connector) can be electrically connected by being joined without deformation (or destruction) of the structure and shape of the connector pins and connector sockets.

[0184] According to one embodiment, the first connector part (740) (e.g., first PCB connector, lower connector) and the second connector part (750) (e.g., second PCB connector, upper connector) can be joined so that the connector pins and connector sockets are not separated from each other.

[0185] Not limited thereto, the first connector part (740) (e.g., first PCB connector, lower connector) and the second connector part (750) (e.g., second PCB connector, upper connector) can be detachably coupled (e.g., electrically connected) without deformation (or destruction) of the structure and shape of the connector pins and connector sockets.

[0186] FIGS. 13 and 14 are drawings showing how to reduce the area of ​​a printed circuit board (PCB) of a camera module by arranging at least a portion of a first printed circuit board and at least a portion of a second printed circuit board so as to overlap.

[0187] Referring to FIGS. 5, 13, and 14, the camera module (1301) of the comparative example (e.g., the camera module (500) of FIG. 5) can have the PCBs arranged in a first width (w1) because the first PCB (510), the moving FPCB (530), and the second PCB (540) are arranged on the same plane (e.g., horizontally). As a result, the total area of ​​the PCBs in the camera module (1301) of the comparative example can be increased.

[0188] According to one embodiment, a camera module (1302) according to an embodiment of the present disclosure may have a first connector portion (740) (e.g., a first PCB connector, a lower connector) disposed on the outer edge of an image sensor (730).

[0189] According to one embodiment, a second connector part (750) (e.g., second PCB connector, upper connector) may be positioned on the lower part of the second PCB (760) (e.g., moving PCB, moving FPCB) so as to overlap with at least a portion of the second PCB (760) (e.g., moving PCB, moving FPCB) with respect to the z-axis direction.

[0190] According to one embodiment, a first connector part (740) (e.g., first PCB connector, lower connector) and a second connector part (750) (e.g., second PCB connector, upper connector) may be arranged to overlap with respect to the z-axis direction.

[0191] According to one embodiment, a first connector part (740) (e.g., first PCB connector, lower connector) and a second connector part (750) (e.g., second PCB connector, upper connector) can be detachably coupled and electrically connected.

[0192] A camera module (1302) according to an embodiment of the present disclosure (e.g., camera module (700) of FIG. 7a, FIG. 7b and FIG. 8) has a second connector portion (750) arranged to overlap with at least a portion of a second PCB (760) (e.g., moving PCB, moving FPCB), and a first connector portion (740) (e.g., first PCB connector, lower connector) and a second connector portion (750) (e.g., second PCB connector, upper connector) are combined so that PCBs that are relatively narrower than the first width (w1) can be arranged with a second width (w2).

[0193] A camera module (700, 1302) according to an embodiment of the present disclosure can reduce the size of the camera module by reducing the area of ​​all printed circuit boards (PCBs).

[0194] An electronic device according to an embodiment of the present disclosure can reduce the size of the camera module (700, 1302) so that a plurality of camera modules (700, 1302) can be arranged within a limited space of an electronic device (e.g., the electronic device (101) of FIG. 2 and FIG. 3).

[0195] FIG. 15 is a drawing showing an infrared filter placed in a camera module. The camera module (1500) of FIG. 15 may include at least some components of the camera module (700) of FIG. 7a, FIG. 7b, and FIG. 8.

[0196] Referring to FIG. 15, a camera module (1500) according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 7a, FIG. 7b and FIG. 8) may include a sensor shift type camera module.

[0197] According to one embodiment, the camera module (1500) comprises a bottom cover (e.g., bottom cover (710, bottom housing) of FIG. 7a and 7b), a first PCB (720) (e.g., image sensor PCB), peripheral circuits (722), an image sensor (730), a first connector part (740) (e.g., first PCB connector, lower connector), a second PCB (760) (e.g., moving PCB, moving FPCB), a second connector part (750) (e.g., second PCB connector, upper connector), a third PCB (770) (e.g., fixed PCB), a third connector part (712), an infrared filter (780, IR filter), a moving drive part (e.g., moving drive part (790) of FIG. 7a and 7b), a top cover (e.g., top cover (716, top housing) of FIG. 7a and 7b), and a lens assembly (e.g., lens of FIG. 7a and 7b). It may include an assembly (718).

[0198] According to one embodiment, an image sensor (730) may be placed on a first PCB (720) (e.g., an image sensor PCB).

[0199] According to one embodiment, a first connector part (740) (e.g., first PCB connector, lower connector) may be placed on the upper part of a first PCB (720) (e.g., image sensor PCB) with respect to the z-axis direction.

[0200] According to one embodiment, a second connector part (750) (e.g., second PCB connector, upper connector) may be disposed on the upper side of a first connector part (740) (e.g., first PCB connector, lower connector) disposed on a first PCB (720) (e.g., image sensor PCB) with respect to the z-axis direction.

[0201] According to one embodiment, a second PCB (760) (e.g., moving PCB, moving FPCB) may be placed on the upper part of a second connector part (750) (e.g., second PCB connector, upper connector) with respect to the z-axis direction.

[0202] According to one embodiment, the first connector part (740) (e.g., first PCB connector, lower connector) may include a step (745) for the placement of an infrared filter (780, IR filter). For example, an infrared filter (780, IR filter) may be placed on the step (745) of the first connector part (740) (e.g., first PCB connector, lower connector) with respect to the z-axis direction. For example, by placing the infrared filter (780, IR filter) on the step (745) of the first connector part (740) (e.g., first PCB connector, lower connector), the inflow of foreign matter can be prevented, and the height in the z-axis direction can be reduced due to the placement of the infrared filter (780, IR filter).

[0203] According to one embodiment, a second PCB (760) (e.g., moving PCB, moving FPCB) may be positioned to press a portion of the upper part (e.g., edge) of the infrared filter (780, IR filter) with respect to the z-axis direction. For example, at least a portion of the second PCB (760) (e.g., moving PCB, moving FPCB) may be positioned to overlap with the portion of the upper edge of the infrared filter (780, IR filter) with respect to the z-axis direction.

[0204] According to one embodiment, a lens assembly (e.g., the lens assembly (718) of FIG. 7a and FIG. 7b) may be placed on top of an infrared filter (780, IR filter).

[0205] According to one embodiment, a second connector part (750) (e.g., second PCB connector, upper connector) may be disposed on the lower part of the second PCB (760) (e.g., moving PCB, moving FPCB) so as to overlap with at least a part of the second PCB (760) (e.g., moving PCB, moving FPCB).

[0206] According to one embodiment, a first connector part (740) (e.g., first PCB connector, lower connector) placed on a first PCB (720) (e.g., image sensor PCB) and a second connector part (750) (e.g., second PCB connector, upper connector) placed on a second PCB (760) (e.g., moving PCB, moving FPCB) can be detachably coupled and electrically connected.

[0207] According to one embodiment, one side of the second PCB (760) (e.g., moving PCB, moving FPCB) may be electrically connected to the third PCB (770) (e.g., fixed PCB).

[0208] The third connector portion (712) of the third PCB (770) (e.g., fixed PCB) can be electrically coupled to the connector of the PCB on which the image signal processor (e.g., image signal processor (460) of FIG. 4) is placed, or to the connector of the PCB on which the processor (e.g., processor (120) of FIG. 1) is placed.

[0209] FIG. 16 is a drawing showing an infrared filter placed in a camera module. The camera module (1600) of FIG. 16 may include at least some components of the camera module (700) of FIG. 7a, FIG. 7b, and FIG. 8.

[0210] Referring to FIG. 16, a camera module (1600) according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 7a, FIG. 7b and FIG. 8) may include a sensor shift type camera module.

[0211] According to one embodiment, the camera module (1600) may include a bottom cover (e.g., bottom cover (710, bottom housing) of FIG. 7a and 7b), a first PCB (720) (e.g., image sensor PCB), peripheral circuits (722), an image sensor (730), a first connector part (740) (e.g., first PCB connector, lower connector), a second PCB (760) (e.g., moving PCB, moving FPCB), a second connector part (750) (e.g., second PCB connector, upper connector), a third PCB (770) (e.g., fixed PCB), a third connector part (712), an infrared filter (780, IR filter), a moving drive part (e.g., moving drive part (790) of FIG. 7a), a top cover (e.g., top cover (716, top housing) of FIG. 7a and 7b), and a lens assembly (e.g., lens assembly (718) of FIG. 7a and 7b). there is.

[0212] According to one embodiment, an image sensor (730) may be placed on a first PCB (720) (e.g., an image sensor PCB).

[0213] According to one embodiment, a first connector part (740) (e.g., first PCB connector, lower connector) may be placed on the upper part of a first PCB (720) (e.g., image sensor PCB) with respect to the z-axis direction.

[0214] According to one embodiment, a second connector part (750) (e.g., second PCB connector, upper connector) may be disposed on the upper side of a first connector part (740) (e.g., first PCB connector, lower connector) disposed on a first PCB (720) (e.g., image sensor PCB) with respect to the z-axis direction.

[0215] According to one embodiment, a second PCB (760) (e.g., moving PCB, moving FPCB) may be placed on the upper part of a second connector part (750) (e.g., second PCB connector, upper connector) with respect to the z-axis direction.

[0216] According to one embodiment, an infrared filter (780, IR filter) may be placed on the upper surface of the second PCB (760) (e.g., moving PCB, moving FPCB) with respect to the z-axis direction. For example, an infrared filter (780, IR filter) may be placed on the upper surface of the second PCB (760) (e.g., moving PCB, moving FPCB) to form a sealed structure so that foreign substances do not enter the upper surface of the image sensor (730).

[0217] According to one embodiment, a lens assembly (e.g., the lens assembly (718) of FIG. 7a and FIG. 7b) may be placed on top of an infrared filter (780, IR filter).

[0218] According to one embodiment, a second connector part (750) (e.g., second PCB connector, upper connector) may be disposed on the lower part of the second PCB (760) (e.g., moving PCB, moving FPCB) so as to overlap with at least a part of the second PCB (760) (e.g., moving PCB, moving FPCB).

[0219] According to one embodiment, a first connector part (740) (e.g., first PCB connector, lower connector) placed on a first PCB (720) (e.g., image sensor PCB) and a second connector part (750) (e.g., second PCB connector, upper connector) placed on a second PCB (760) (e.g., moving PCB, moving FPCB) can be detachably coupled and electrically connected.

[0220] According to one embodiment, one side of the second PCB (760) (e.g., moving PCB, moving FPCB) may be electrically connected to the third PCB (770) (e.g., fixed PCB).

[0221] The third connector portion (712) of the third PCB (770) (e.g., fixed PCB) can be electrically coupled to the connector of the PCB on which the image signal processor (e.g., image signal processor (460) of FIG. 4) is placed, or to the connector of the PCB on which the processor (e.g., processor (120) of FIG. 1) is placed.

[0222] FIG. 17 is a drawing showing the shape of a first connector placed on a first printed circuit board and a second connector placed on a second printed circuit board.

[0223] Referring to FIG. 7a, FIG. 7b and FIG. 17, according to one embodiment, an image sensor (730) may be disposed on a first PCB (720) (e.g., an image sensor PCB). A first connector portion (1740) (e.g., a first PCB connector, a lower connector) may be disposed on the upper part of the first PCB (720) (e.g., an image sensor PCB).

[0224] According to one embodiment, the first connector portion (1740) (e.g., first PCB connector, lower connector) may be formed to correspond to two sides (two sides) of the image sensor (730).

[0225] For example, the first connector part (1740) (e.g., first PCB connector, lower connector) can be positioned to correspond to both sides of the image sensor (730) with respect to the x-axis direction.

[0226] For example, it may include a first support structure (1730) for preventing bending and twisting of the first connector part (1740) (e.g., first PCB connector, lower connector) and for fixing the first connector part (1740) (e.g., first PCB connector, lower connector).

[0227] According to one embodiment, a second connector part (1750) (e.g., second PCB connector, upper connector) may be disposed on the upper part of a first connector part (1740) (e.g., first PCB connector, lower connector).

[0228] For example, the second connector part (1750) (e.g., second PCB connector, upper connector) can be formed to correspond to two sides (two sides) of the image sensor (730).

[0229] For example, the second connector part (1750) (e.g., second PCB connector, upper connector) can be positioned to correspond to both sides of the image sensor (730) with respect to the x-axis direction.

[0230] For example, it may include a second support structure (1760) for preventing bending and twisting of the second connector part (1750) (e.g., second PCB connector, upper connector) and for fixing the second connector part (1750) (e.g., second PCB connector, upper connector).

[0231] FIG. 18 is a drawing showing the shape of a first connector placed on a first printed circuit board and a second connector placed on a second printed circuit board.

[0232] Referring to FIG. 7a, FIG. 7b and FIG. 18, according to one embodiment, an image sensor (730) may be disposed on a first PCB (720) (e.g., an image sensor PCB). A first connector portion (1840) (e.g., a first PCB connector, a lower connector) may be disposed on the upper part of the first PCB (720) (e.g., an image sensor PCB).

[0233] According to one embodiment, the first connector portion (1840) (e.g., first PCB connector, lower connector) may be formed to correspond to three sides (three sides) of the image sensor (730).

[0234] For example, the first connector part (1840) (e.g., first PCB connector, lower connector) can be formed in a 'C' shape.

[0235] For example, it may include a first support structure (1830) for preventing bending and twisting of the first connector part (1840) (e.g., first PCB connector, lower connector) and for fixing the first connector part (1840) (e.g., first PCB connector, lower connector).

[0236] According to one embodiment, a second connector part (1850) (e.g., second PCB connector, upper connector) may be disposed on the upper part of a first connector part (1840) (e.g., first PCB connector, lower connector).

[0237] For example, the second connector part (1850) (e.g., second PCB connector, upper connector) can be formed to correspond to three sides (three sides) of the image sensor (730).

[0238] For example, the second connector part (1850) (e.g., second PCB connector, upper connector) can be formed in a 'C' shape.

[0239] For example, it may include a second support structure (1860) for preventing bending and twisting of the second connector part (1850) (e.g., second PCB connector, upper connector) and for fixing the second connector part (1850) (e.g., second PCB connector, upper connector).

[0240] Each of the embodiments described with reference to the drawings of the present disclosure may be configured independently as a single embodiment. For example, each of the embodiments of FIGS. 1 to 16 may be configured independently of each other. Each of the embodiments described with reference to the drawings of the present disclosure may operate independently as a single embodiment. For example, each of the embodiments of FIGS. 1 to 18 may operate independently of each other.

[0241] At least some of the embodiments described with reference to the drawings of the present disclosure may be combined. For example, at least some of the embodiments of FIGS. 1 to 18 may be combined.

[0242] At least two of the embodiments described with reference to the drawings of the present disclosure may be combined. For example, at least a part of the embodiment of FIG. 1 and at least a part of the embodiment of FIG. 2 may be combined with each other. At least two of the embodiments described with reference to the drawings of the present disclosure may be combined and operated.

[0243] For example, at least a portion of the embodiment of FIG. 1 and at least a portion of the embodiments of FIG. 2 and FIG. 3 may be combined with each other to form a structure.

[0244] For example, at least a portion of FIG. 4 and at least a portion of the embodiment of FIG. 7a or FIG. 7b may be combined with each other to form a structure.

[0245] For example, at least a portion of FIG. 7a and at least a portion of the embodiment of FIG. 7c may be combined with each other.

[0246] For example, at least a portion of FIG. 7b and at least a portion of the embodiment of FIG. 7c may be combined with each other.

[0247] For example, at least a portion of FIG. 7a and at least a portion of the embodiment of FIG. 7d may be combined with each other.

[0248] For example, at least a portion of FIG. 7b and at least a portion of the embodiment of FIG. 7d may be combined with each other.

[0249] For example, at least some of the embodiments of FIGS. 7a to 8 and at least some of the embodiments of FIG. 14 may be combined with each other.

[0250] For example, at least some of the embodiments of FIGS. 7a to 8 and at least some of the embodiments of FIG. 15 may be combined with each other.

[0251] For example, at least some of the embodiments of FIGS. 7a to 8 and at least some of the embodiments of FIG. 16 may be combined with each other.

[0252] For example, at least some of the embodiments of FIGS. 7a to 8 and at least some of the embodiments of FIG. 17 may be combined with each other.

[0253] For example, at least some of the embodiments of FIGS. 7a to 8 and at least some of the embodiments of FIG. 18 may be combined with each other.

[0254] When at least two of the embodiments described with reference to the drawings of the present disclosure are combined, at least some of the configurations and / or at least some of the operations included in each embodiment may be omitted. For example, when the embodiment of FIG. 1 is combined with the embodiments of FIG. 2 and FIG. 3, at least some of the configurations and / or at least some of the operations included in the embodiment of FIG. 1 may be omitted, and at least some of the configurations and / or at least some of the operations included in the embodiments of FIG. 2 and FIG. 3 may be omitted.

[0255] An embodiment of the present disclosure can provide a sensor-shift type camera module that can reduce the area of ​​a printed circuit board (PCB) and an electronic device including the camera module.

[0256] An embodiment of the present disclosure may provide a sensor shift type camera module and an electronic device including the camera module, wherein at least a portion of a first printed circuit board (PCB) on which an image sensor is placed and at least a portion of a second printed circuit board (PCB) are arranged to overlap, and a first connector of the first printed circuit board and a second connector of the second printed circuit board are electrically coupled to reduce the area of ​​the printed circuit board (PCB).

[0257] The technical tasks intended to be accomplished in this document are not limited to those mentioned above, and other technical tasks not mentioned can be clearly understood by a person skilled in the art to which this document belongs from the description below.

[0258] The camera module and electronic device according to the embodiment of the present disclosure can reduce the size of the camera module by reducing the area of ​​the printed circuit board (PCB) of the camera module.

[0259] An electronic device according to an embodiment of the present disclosure can reduce the size of the camera module so that a plurality of camera modules can be arranged within a limited space of the electronic device.

[0260] A camera module and electronic device according to an embodiment of the present disclosure can reduce the area of ​​the entire printed circuit board (PCB) by arranging at least a portion of a first printed circuit board on which an image sensor is placed and at least a portion of a second printed circuit board so as to overlap, and electrically connecting a first connector of the first printed circuit board and a second connector of the second printed circuit board.

[0261] A camera module (700) according to one embodiment of the present disclosure comprises a housing (710, 716), a lens assembly (718) partially accommodated in the housing (710, 716), and a sensor shifting structure spaced apart from and positioned below the lens assembly (718) and configured to move a portion of its position. The sensor shifting structure comprises an image sensor (730) positioned substantially perpendicular to the optical axis of the lens assembly (718) (e.g., the optical axis (701) of FIG. 7a, FIG. 7b and FIG. 14), a first printed circuit board (PCB) (720) having the image sensor (730) positioned on one surface, and a first connector (740) positioned on the first PCB (720). The sensor shifting structure comprises a second PCB (760) positioned between the lens assembly (718) and the first PCB (720). The second PCB (760) includes a fixed area attached to at least a portion of the housing (710, 716), an elastic area connected to the fixed area, and a connection area connected to the elastic area and spaced apart from the fixed area. The second PCB (760) may include a second connector (750) disposed in the connection area and electrically detachably coupled to the first connector (740).

[0262] According to one embodiment, the connection area may form an opening area such that it does not substantially overlap with the image sensor (730) when viewed from above.

[0263] According to one embodiment, the first connector (740) and the second connector (750) can be joined in a direction substantially parallel to the optical axis.

[0264] According to one embodiment, the first connector (740) may be formed to substantially surround at least three of the plurality of sides of the image sensor (730).

[0265] According to one embodiment, the first connector (740) may be formed to substantially surround at least four of the plurality of sides of the image sensor (730).

[0266] According to one embodiment, the first connector (740) includes a first wiring electrically connected to the image sensor (730). The second connector (750) includes a second wiring configured to be electrically connected to the first wiring. The elastic region includes a third wiring electrically connected to the second wiring. The image sensor (730) may be configured to transmit an image signal through the first wiring, the second wiring, and the third wiring.

[0267] According to one embodiment, the first PCB (720) includes another electronic component in addition to the image sensor (730) disposed on one side. At least a portion of the first connector (740) may be disposed between one side of the image sensor (730) and the other electronic component.

[0268] According to one embodiment, the sum of the height of the first connector (740) and the height of the second connector (750) when combined with each other may be greater than the height of the other electronic element.

[0269] According to one embodiment, the sum of the height of the first connector (740) and the height of the second connector (750) when combined with each other may be greater than the height of the image sensor (730).

[0270] According to one embodiment, the elastic region may overlap with at least a portion of the first PCB (720) when viewed from above.

[0271] According to one embodiment, a driving unit may further include a pair of a magnet and a coil and a driving unit configured to provide a moving force to the connection area, and the driving unit may be accommodated in the housing (710, 716) so as to be positioned above the second connector (750).

[0272] According to one embodiment, the first PCB (720) may be configured to move based at least partially on the moving force provided through the connection area, the second connector (750), and the first connector (740).

[0273] According to one embodiment, the lens assembly (718) may be set so as not to move by being fixed to at least part of the housing (710, 716).

[0274] According to one embodiment, a filter member disposed between the lens assembly (718) and the image sensor (730) may be further included. The filter member, the first connecting portion, the second connecting portion, and the second PCB (760) may be disposed together to substantially surround the image sensor (730). For example, the filter member may include an IR filter (780) as described in the present disclosure. However, it is not necessarily limited thereto.

[0275] According to one embodiment, one end portion of the filter member may be in contact with the first connector (740) or the second connector (750).

[0276] According to one embodiment, one end of the filter member may be in contact with the connection area.

[0277] According to one embodiment, the second connector (750) is positioned on a first surface of the connection area, and the end of the filter member may be in contact with a second surface opposite to the first surface of the connection area.

[0278] According to one embodiment, at least a portion of the first connector (740) and at least a portion of the second connector (750) can be fixed through an adhesive member.

[0279] According to one embodiment, the first connector (740) and the second connector (750) can be combined and electrically connected without deformation or destruction of their structure and shape.

[0280] According to one embodiment, the first connector (740) and the second connector (750) can be coupled so as not to be separated from each other.

[0281] A camera module and electronic device according to an embodiment of the present disclosure can correct hand shake by moving a first PCB (e.g., image sensor PCB) in at least one direction of the x-axis or y-axis to correspond to shake during camera shooting.

[0282] A camera module and electronic device according to an embodiment of the present disclosure can adjust the focus by moving a first PCB (e.g., image sensor PCB) in the z-axis direction when taking a picture with a camera.

[0283] A camera module and electronic device according to an embodiment of the present disclosure can correct hand shake by causing a first PCB (e.g., image sensor PCB) to rotate along at least one axis among the x-axis, y-axis, or z-axis when taking a picture with a camera.

[0284] A camera module and electronic device according to an embodiment of the present disclosure are formed such that a first connector part (e.g., a first PCB connector, a lower connector) and a second connector part (e.g., a second PCB connector, an upper connector) surround four sides of an image sensor (e.g., a sealed structure), thereby preventing (e.g., blocking) foreign substances from entering the image sensor.

[0285] A camera module and electronic device according to an embodiment of the present disclosure may have an infrared filter (IR filter) disposed on a step of a first connector part (e.g., a first PCB connector, a lower connector) to prevent the ingress of foreign substances and reduce the height in the z-axis direction due to the placement of the infrared filter (IR filter).

[0286] A camera module and electronic device according to an embodiment of the present disclosure may form a sealed structure so as not to allow foreign substances to enter the upper surface of an image sensor by placing an infrared filter (IR filter) on the upper surface of a second PCB (e.g., moving PCB, moving FPCB).

[0287] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure pertains from the description below.

[0288] Furthermore, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples provided to facilitate the explanation of the technical content according to the embodiments of the present disclosure and to aid in understanding the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of the various embodiments of the present disclosure should be interpreted to include all modifications or variations derived based on the technical concept of the various embodiments of the present disclosure, in addition to the embodiments disclosed herein.

Claims

In the camera module (700), Housing(710, 716); A lens assembly (718) partially accommodated in the above housings (710, 716); It includes a sensor shifting structure spaced apart and positioned below the lens assembly (718) and configured to move a portion of the position, and the sensor shifting structure: An image sensor (730) positioned substantially perpendicular to the optical axis (701) of the lens assembly (718); A first printed circuit board (PCB) (720) having the image sensor (730) disposed on one side, the first PCB (720) includes a first connector (740) disposed on the one side; and It includes a second PCB (760) positioned between the lens assembly (718) and the first PCB (720), and The second PCB (760) comprises a fixed area attached to at least a portion of the housing (710, 716), an elastic area connected to the fixed area, and a connection area connected to the elastic area and spaced apart from the fixed area, and the second PCB (760) comprises a second connector (750) disposed in the connection area and electrically coupled (detachably coupled) to the first connector (740). Camera module (700). In Article 1, The above connection area forms an opening area so as not to substantially overlap with the image sensor (730) when viewed from above. Camera module (700). In Article 1, The first connector (740) and the second connector (750) are coupled in a direction substantially parallel to the optical axis, Camera module (700). In Article 1, The first connector (740) is formed to substantially surround at least three of the plurality of sides of the image sensor (730), Camera module (700). In Article 1, The first connector (740) is formed to substantially surround at least four of the plurality of sides of the image sensor (730), Camera module (700). In Article 1, The first connector (740) includes a first wiring electrically connected to the image sensor (730), and The second connector (750) includes a second wire configured to be electrically connected to the first wire, and The above elastic region includes a third wiring electrically connected to the second wiring, and The image sensor (730) is configured to transmit an image signal through the first wiring, the second wiring and the third wiring, Camera module (700). In Article 1, The first PCB (720) includes another electronic component in addition to the image sensor (730) disposed on the one surface, and At least a portion of the first connector (740) is positioned between one side of the image sensor (730) and the other electronic component, Camera module (700). In Article 7, In a combined state, the sum of the height of the first connector (740) and the height of the second connector (750) is greater than the height of the other electronic component. Camera module (700). In Article 7, In a combined state, the sum of the height of the first connector (740) and the height of the second connector (750) is greater than the height of the image sensor (730). Camera module (700). In Article 1, The elastic region above overlaps with at least a portion of the first PCB (720) when viewed from above. Camera module (700). In Article 1, The device further comprises a driving unit (790) configured to provide a moving force to the connection area, wherein the driving unit (790) is housed in the housing (710, 716) so as to be positioned above the second connector (750). Camera module (700). In Article 11, The first PCB (720) is configured to move based at least partially on the moving force provided through the connection area, the second connector (750) and the first connector (740), Camera module (700). In Article 1, It further includes a filter member (780) disposed between the lens assembly (718) and the image sensor (730), and The filter member (780), the first connection part, the second connection part and the second PCB (760) together substantially surround the image sensor (730). Camera module (700). In Article 13, One end portion of the filter member (780) is in contact with the first connector (740) or the second connector (750). Camera module (700). In Article 13, One end of the filter member (780) is in contact with the connection area, Camera module (700).

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