Method for manufacturing light-emitting package

Abstract

The present invention relates to a method for manufacturing a light-emitting package. The method for manufacturing a light-emitting package comprises the steps of: arranging a release film; applying a primer to one surface of the release film so as to form a primer layer; applying an adhesive onto the primer layer so as to form an adhesive layer; positioning a fluorescent film part on the adhesive layer so as to attach the fluorescent film part to the adhesive layer; positioning a light-emitting part on the fluorescent film part; and injecting a material for a reflective part into the vicinity of the light-emitting part so as to form a reflective part in contact with the exposed top of the adhesive layer, the exposed lateral side and upper surface of the fluorescent film part and the exposed lateral side of the light-emitting part.

Description

Method for manufacturing a luminescent package

[0001] The present invention relates to a method for manufacturing a light-emitting package.

[0002] As the functions of electronic devices become more diverse, the types and number of components mounted on them also increase.

[0003] In addition, as the trend toward miniaturization of electronic devices continues and the trend toward larger screens persists, there is a growing demand for even smaller components embedded in these devices.

[0004] Therefore, light-emitting modules, such as light-emitting diode modules, were initially manufactured using a structure that utilized lead frames constituting the electrodes, but they evolved into a Chip Scale Package (CSP) structure to reduce size.

[0005] Therefore, a chip-scale package in which a light-emitting part, such as a light-emitting diode chip and a fluorescent film part, is located on a circuit board is fabricated first, and then the fabricated chip-scale package is assembled back onto the circuit board to complete the light-emitting diode module.

[0006] As such, when the light-emitting package is manufactured separately as a chip-scale package, there was a problem in that foreign substances, such as adhesive residue, were not cleanly removed during the manufacturing process of the light-emitting package.

[0007] Therefore, due to foreign substances adhering to the light emission surface, problems arose in which the light output conditions, such as the light output efficiency and uniformity of the light-emitting module, deteriorated.

[0008] The problem that the present invention aims to solve is to improve the output state of light emitted from a light-emitting module.

[0009] Another problem that the present invention aims to solve is to reduce the defect rate of the light-emitting module.

[0010] A method for manufacturing a light-emitting package according to one feature of the present invention comprises the steps of: placing a release film; applying a primer to one side of the release film to form a primer layer; applying an adhesive to the primer layer to form an adhesive layer; positioning a fluorescent film portion on the adhesive layer to attach the fluorescent film portion to the adhesive layer; positioning a light-emitting portion on the fluorescent film portion; and injecting a reflective material around the light-emitting portion to form a reflective portion that contacts the exposed adhesive layer, the side and top surfaces of the exposed fluorescent film portion, and the side surface of the exposed light-emitting portion.

[0011] The bonding force between the release film and the adhesive layer may be greater than the bonding force between the adhesive layer and the fluorescent film portion.

[0012] The surface roughness of one side of the release film in contact with the primer layer may be greater than the surface roughness of one side of the fluorescent film portion in contact with the adhesive layer.

[0013] One side of the release film to which the primer layer is applied may be a textured surface.

[0014] The surface roughness of one side of the above-mentioned release film may be greater than the surface roughness of one side of the fluorescent film portion attached to the above-mentioned adhesive layer.

[0015] The entire surface of the above-mentioned release film may be an uneven surface.

[0016] A portion of the above-mentioned release film may be an uneven surface and the remaining portion may be a flat surface.

[0017] The fluorescent film portion above may be located on the uneven surface.

[0018] The surface height of the above-mentioned reflective part may be the same as or lower than the height of the side of the above-mentioned emitting part.

[0019] A method for manufacturing a light-emitting package according to the above features may further include the step of forming a preliminary light-emitting package by cutting between adjacent light-emitting parts and the step of manufacturing a light-emitting package by removing the release film from the preliminary light-emitting package.

[0020] The surface of the above-mentioned reflective part may be a curved surface.

[0021] The surface height of the above-mentioned reflective part may decrease as it moves further away from the above-mentioned emitting part.

[0022] The surface height of the above-mentioned reflective part may increase as it moves further away from the above-mentioned emitting part.

[0023] The above-mentioned reflective material may contain trisiloxane or titanium dioxide (TiO2), and the ratio of trisiloxane or titanium dioxide may be 10% to 40%.

[0024] An apparatus according to another feature of the present invention is an apparatus for manufacturing a light-emitting package according to the method for manufacturing a light-emitting package described above.

[0025] According to these characteristics, due to the presence of the primer layer, the bonding force between the release film and the adhesive layer can be much greater than the bonding force between the adhesive layer and the fluorescent film portion.

[0026] In addition, due to the bonding treatment of the release film, the bonding strength between the release film and the adhesive layer can be further increased.

[0027] As a result, when the release film is removed, the adhesive layer attached to the release film and the fluorescent film portion can be easily detached from the fluorescent film portion and removed by the removal of the release film.

[0028] Therefore, since there is no residue of the adhesive layer on the upper surface of the fluorescent film portion, a clean and undamaged emission surface can be exposed, so the light emitted from the light-emitting surface of the light-emitting portion can pass through the fluorescent film portion, which is free of foreign substances or scratches, and be emitted to the outside, thereby improving the light output efficiency of the light-emitting module.

[0029] In addition, the defect rate caused by adhesive adhering to the emission surface of the fluorescent film is significantly reduced, which can also significantly reduce the defect rate of the light-emitting module.

[0030] FIG. 1 is a cross-sectional view of a light-emitting package according to one embodiment of the present invention.

[0031] FIGS. 2a to 2h are drawings sequentially illustrating an example of a method for manufacturing a light-emitting package according to an embodiment of the present invention.

[0032] FIGS. 3a and FIGS. 3b are cross-sectional views of a release film in a light-emitting package according to another embodiment of the present invention.

[0033] FIGS. 4a and FIGS. 4b are drawings illustrating examples of planar shapes of a reflective portion of a light-emitting package according to an embodiment of the present invention.

[0034] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols are assigned the same reference number, and redundant descriptions thereof will be omitted. Furthermore, in describing the embodiments disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the embodiments disclosed in this specification, such detailed description will be omitted.

[0035] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0036] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0037] In this application, each step described may be performed regardless of the order listed, except where it must be performed in the order listed by a particular causal relationship.

[0038] In this application, terms such as “comprising” or “having” are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0039] Hereinafter, a light-emitting module according to one embodiment of the present invention will be described with reference to the attached drawings.

[0040] First, referring to FIG. 1, a light-emitting module (1) according to one embodiment of the present invention may have a light-emitting package (10) and a circuit board (20) on which the light-emitting package (10) is mounted.

[0041] The circuit board (20) can be electrically and physically connected to the mounted light-emitting package (10).

[0042] Accordingly, the circuit board (20) may have a signal transmission pattern (P20), such as a pad and a signal line for connection with the light-emitting package (10), an electrical component (not shown) which is at least one of a passive component and an active component that controls the operation of the light-emitting module (1), and a control unit (not shown) that controls the overall operation of the light-emitting module (1). At this time, the control unit may be a control chip having the form of a chip and may be equipped with a processor.

[0043] This circuit board (20) can form the bottom surface of the light-emitting module (1) and can be a hard printed circuit board (HPCB), a flexible printed circuit board (FPCB), or a rigid flexible printed circuit board (RFPCB), etc.

[0044] The light-emitting package (10) operates under the control of the control unit to output light of a desired color so that the corresponding light can be output to the outside of the light-emitting module (1).

[0045] This light-emitting package (10) may have a light-emitting part (11), a fluorescent film part (12) located on the light-emitting part (11), and a reflective part (13) surrounding the sides of the light-emitting part (11) and the fluorescent film part (12).

[0046] The light-emitting part (11) outputs light of a predetermined color (e.g., one of red, green, and blue) and may include, for example, a light-emitting diode.

[0047] In this example, the light-emitting part (11) may be a light-emitting diode having a chip shape.

[0048] For example, the light-emitting part (11) of the present example may be a flip-chip type flip-chip light-emitting diode in which a terminal (P10) for connection with a circuit board (20) is located on the lower surface of the light-emitting part (11).

[0049] In this example, among the six faces of the radiating part (11) made of a cuboid, the radiating surface may be one face (e.g., the top face), and the actual radiating surface area on which light is emitted may be approximately 80% or less of the top face, which is the radiating surface, for example, 60% to 80%.

[0050] The fluorescent film portion (12) may be located on the upper surface of the light-emitting portion (11) and may have the form of a film containing a fluorescent material.

[0051] These fluorescent film parts (12) may be equipped with a fluorescent material of the corresponding color (e.g., yellow).

[0052] Accordingly, when the fluorescent film part (12) is equipped with a yellow phosphor and the light-emitting part (11) outputs blue light, a portion of the blue light output from the light-emitting part (11) excites the yellow phosphor so that yellow light can be output from the fluorescent film part (12).

[0053] In this way, when blue light is output from the light-emitting part (11) and yellow light is output from the fluorescent film part (12), the blue light and yellow light are mixed with each other so that the light output from the light-emitting module (1) can become white light.

[0054] The type of phosphor provided in the fluorescent film portion (12) can be determined according to the color of the light to be output from the light-emitting module (1) at the end.

[0055] This fluorescent film portion (12) may have a rectangular planar shape, and also the light-emitting surface of the light-emitting portion (11), that is, the upper surface of the light-emitting portion (11), may also have a rectangular planar shape.

[0056] At this time, the planar area of ​​the fluorescent film portion (12) may be larger than the planar area of ​​the upper surface of the light-emitting portion (11).

[0057] The fluorescent film portion (12) can be positioned on the upper surface of the light-emitting portion (11) in a manner that completely covers the upper surface of the light-emitting portion (11).

[0058] Accordingly, as illustrated in FIG. 1, the fluorescent film portion (12) may have a portion that completely covers the upper surface of the light-emitting portion (11) and a portion that is detached from the upper surface of the light-emitting portion (11). As a result, the fluorescent film portion (12) may have a first portion that is in contact with the upper surface of the light-emitting portion (11) and a second portion that surrounds the first portion and is in contact with the reflective portion (13).

[0059] There may not be any foreign substances such as adhesive on the upper surface of the fluorescent film portion (12), which is the final surface of the light emitted from the light-emitting portion (11) that is finally emitted, that is, the final surface of the light-emitting package (10).

[0060] Therefore, the light output from the light-emitting part (11) can be output to the outside well without being obstructed by foreign substances.

[0061] The reflector (13) reflects the light output from the light-emitting unit (11) back toward the light-emitting unit (11), so that the light output from the light-emitting unit (11) can pass through the emission surface and be output to the outside without loss if possible.

[0062] Accordingly, this reflective part (13) may contain at least one material among materials that reflect and block light.

[0063] The reflective part (13) of this example may surround the light-emitting part (11) on the circuit board (20).

[0064] In this example, the reflective material for the reflective part (13) may contain trisiloxane or titanium dioxide (TiO2), and the proportion of trisiloxane or titanium dioxide (TiO2) in the entire material constituting the reflective material may be 10% to 40%.

[0065] As illustrated in FIG. 1, the reflective portion (13) of the present example is in contact with the side of the light-emitting portion (11) and the side of the fluorescent film portion (12) and the exposed lower surface, and surrounds the side of the light-emitting portion (11) and the side of the fluorescent film portion (12) and the exposed lower surface.

[0066] On the other hand, the reflective part (13) is not located on the lower surface of the light-emitting part (11) and the upper surface of the fluorescent film part (12) that are exposed to the outside, so they can be exposed to the outside.

[0067] A light-emitting package (10) having such a structure can be mounted on the corresponding side of a circuit board (20), as previously described.

[0068] At this time, the electrical and physical connection between the light-emitting package (10) and the circuit board (20) can be made in various ways.

[0069] For example, solder (30) can be used through a soldering process to connect a terminal (P10) located on the lower surface of the light-emitting package (10), that is, on the lower surface of the light-emitting part (11), and a pad (P20) located on the upper surface, which is the corresponding surface of the circuit board (20).

[0070] When soldering, solder containing 70% to 90% tin can be used.

[0071] Next, with reference to FIGS. 2a to 2h, a method for manufacturing a light-emitting package (10) according to one embodiment of the present invention will be described.

[0072] First, as shown in FIG. 2a, a release film (31) can be placed in the production space.

[0073] In this example, the release film (31) may have a roughly rectangular flat shape.

[0074] In this example, the surface of the release film (31), for example, the upper surface exposed to the outside, may have a flat surface without concave and convex parts.

[0075] However, as illustrated in FIG. 3a and FIG. 3b, in an alternative example, one side of the release film (31), e.g., the upper surface exposed to the outside, may be a rough surface with much greater surface roughness than the lower surface located opposite the upper surface.

[0076] At this time, the surface roughness of the release film (31) can be increased by sanding the surface of the release film (31) or by treating the surface of the release film (31) by forming the surface of the release film (31) into an uneven surface.

[0077] Accordingly, one side of the release film (31) may be an uneven surface having concave and convex portions formed by a harmonizing treatment, and the other side located opposite the one side may be a flat surface that has not undergone a harmonizing treatment.

[0078] In FIG. 3a, the surface roughness of the entire corresponding surface of the release film (31) may be much rougher than that of the other surface. Therefore, in this case, the surface roughness of each surface of the release film (31) may be the same, and the surface roughness of different surfaces (e.g., front and back) may be different from each other.

[0079] However, in an alternative example as illustrated in FIG. 3b, only a portion of the corresponding surface of the release film (31) may have a rough surface.

[0080] Accordingly, as illustrated in FIG. 3b, in the release film (31), the same one side (e.g., front) may have a first portion having a first surface roughness depending on the position and a second portion having a second surface roughness smaller than the first surface roughness. Additionally, the other side (e.g., back) of the release film (31) may have a second surface roughness that is the same surface roughness as the second portion of the one side.

[0081] As a result, in the alternative example illustrated in FIG. 3b, one side of the release film (31) may have a flat surface and an uneven surface, and the other side may have a flat surface.

[0082] The portion of the release film (31) having the first surface roughness may be a portion where the fluorescent film portion (12) can be located in a subsequent process, and may be a portion facing the fluorescent film portion (12) on opposite sides.

[0083] As shown in FIG. 3b, in order to manufacture a release film (31) having different surface roughness on the same surface, when sanding, a mask or the like can be used so that sanding is performed only on the desired part of the surface, thereby increasing the surface roughness of the desired part.

[0084] In this way, the method for manufacturing a light-emitting package according to an alternative example may additionally include the step of forming a rough surface on the corresponding surface of the release film (31) before or after placing the release film (31) in the manufacturing space, when the desired surface of the release film (31) has a rough surface.

[0085] Next, as shown in FIG. 2b, a primer can be applied to the corresponding surface (e.g., top surface) of the release film (31) to form a primer layer (32).

[0086] Next, as shown in FIG. 2c, an adhesive layer (33) can be formed by applying an adhesive over the primer layer (32). The adhesive may be a silicone adhesive containing silicon.

[0087] In this example, the primer of the primer layer (32) may be intended to improve the bonding strength between the release film (31) located at the bottom and the silicone adhesive located at the top.

[0088] Accordingly, the primer can increase the bonding strength with the silicone adhesive located on the top, and thus can contain a material that can greatly improve the bonding strength between the upper surface of the release film (31) and the adhesive layer (33) that are in contact with each other.

[0089] Therefore, due to this primer layer (32), the bonding strength between the upper surface of the primer layer (32) and the lower surface of the adhesive layer (33) that are in contact with each other can be greatly increased, and the bonding strength between the release film (31) and the adhesive layer (33) with the primer layer (32) in between can also be greatly improved.

[0090] As shown in FIG. 3a and FIG. 3b, when the upper surface of the release film (31) has a rough surface, the corresponding surface of the primer layer (32) and adhesive layer (33) located on the upper surface of the release film (31) can also maintain a rough surface due to the rough surface condition of the release film (31) located below.

[0091] Accordingly, the bonding strength between the primer layer (32) and the adhesive layer (33) located on the upper surface of the release film (31) and the release film (31) can be further improved compared to the case where there is no rough surface.

[0092] Next, as shown in FIG. 2d, at least one fluorescent film portion (12) can be attached to the adhesive layer (33) by positioning each fluorescent film portion (12) at a predetermined location on the adhesive layer (33).

[0093] When a plurality of fluorescent film portions (12) are positioned on the adhesive layer (33), the plurality of fluorescent film portions (12) can be arranged in a matrix form on the adhesive layer (33). Each fluorescent film portion (12) can have a planar shape of a rectangle (e.g., a square).

[0094] In the case of this example, due to the primer layer (32), the bonding force between the release film (31) and the adhesive layer (33) can be much greater than the bonding force between the adhesive layer (33) and each fluorescent film part (12).

[0095] In addition, if the corresponding surface (e.g., upper surface) of the release film (31) on which the adhesive layer (33) is located is treated with a textured surface, and the surface roughness of that surface is much greater than that of the other surface (e.g., rear surface) that is not treated with a textured surface, the bonding strength between the release film (31) and the adhesive of the adhesive layer (33) can be further increased.

[0096] Additionally, the surface roughness of the surface of the fluorescent film portion (12) in contact with the adhesive layer (33), for example, the surface roughness of the release surface, may be much smaller than the surface roughness of the release film (31). Therefore, the bonding force between the fluorescent film portion (12) and the adhesive layer (33) in contact with each other may be much smaller than the bonding force between the release film (31) and the adhesive layer (33).

[0097] At this time, the surface roughness of the output surface of the fluorescent film portion (12) is smaller than the surface roughness of the corresponding surface (e.g., upper surface) of the release film (31) that has undergone harmonization treatment, as well as the surface roughness of the corresponding surface (e.g., upper surface) of the release film (31) that has not undergone harmonization treatment, so it can be much smoother than the upper surface of the release film (31).

[0098] Due to this difference in surface roughness, even if the primer layer (32) is not present, the bonding force between the fluorescent film portion (12) and the adhesive layer (33) can be much smaller than the bonding force between the adhesive layer (33) and the release film (31). Therefore, when physical force is applied, the part of the adhesive layer (33) in contact with the fluorescent film portion (12) can be separated much more easily than the other part of the adhesive layer (33) in contact with the release film (31).

[0099] Then, as shown in FIG. 2e, one light-emitting part (11) is positioned at a designated location of each fluorescent film part (12) so that one light-emitting part (11) can be positioned and attached to one fluorescent film part (12).

[0100] At this time, the surface of the light-emitting part (11) attached to each fluorescent film part (12) may be the upper surface opposite the lower surface, i.e., the light-emitting surface, rather than the lower surface where the terminal (P10) for coupling with the circuit board (20) is located. Accordingly, the light-emitting surface of the corresponding light-emitting part (11) can be attached to the corresponding fluorescent film part (12).

[0101] The planar shape of the light-emitting part (11) may also have a rectangular (e.g., square) planar shape, just like the fluorescent film part (12). However, the planar area of ​​the fluorescent film part (12) may be larger than the planar area of ​​the light-emitting part (11).

[0102] Accordingly, each light-emitting part (11) may be located approximately in the center of the corresponding fluorescent film part (12), and the entire light-emitting surface of the light-emitting part (11) may be positioned in contact with a portion of the upper surface of the fluorescent film part (12) located below. On the other hand, the remaining portion of the upper surface of the fluorescent film part, for example, the edge portion, may remain in an exposed state where the light-emitting surface of the light-emitting part (11) is not located.

[0103] Next, as shown in FIG. 2f, a reflective material can be injected around the light-emitting part (11), and then a reflective part (13) can be formed through a heat treatment process or a natural drying process.

[0104] At this time, the injection space for the reflective material may be limited due to the dam (not shown) surrounding the release film (31).

[0105] Accordingly, the reflective material can be positioned on the exposed adhesive layer (33), in contact with the side and top surfaces of the exposed fluorescent film portion (12), and the side surface of the exposed light-emitting portion (11).

[0106] At this time, the reflective material can be filled into the space so as not to overflow to the surface of the light-emitting part (11) that is exposed to the outside, that is, to the lower surface of the light-emitting part (11) where the terminal (P10) is located.

[0107] Accordingly, as shown in FIG. 2f, the height of the finished reflector (13) may be the same as or lower than the height of the side of the light-emitting part (11).

[0108] When a reflective material is injected around the light-emitting part (11), the reflective material can also be filled between adjacent light-emitting parts (11), as shown in FIG. 4a and FIG. 4b.

[0109] At this time, the reflective material can completely fill the space between adjacent light-emitting parts (11).

[0110] As illustrated in FIGS. 4a and 4b, in an alternative example, the amount of material injected for the reflective part may not be filled to the same height as the corresponding surface of the emitting part (11) that is exposed [e.g., the lower surface where the terminal (P10) is located] (see FIG. 4a), or may be filled to a height higher than the corresponding surface of the emitting part (11) (see FIG. 4b), and may be located up to the upper side of the emitting part (11) due to surface tension, etc., of the side of the emitting part (11) that is in contact with the material for the reflective part.

[0111] Accordingly, as shown in FIG. 4a, when the amount of the reflective material injected is insufficient, the surface of the reflective material injected between adjacent light-emitting parts (11) may have a concave surface shape. On the other hand, as shown in FIG. 4b, when the amount of the reflective material injected is excessive, the surface of the reflective material injected between adjacent light-emitting parts (11) may have a convex surface shape, so that the reflective material does not flow into the exposed surface of the light-emitting part (11).

[0112] In this case, as illustrated in FIG. 4a and FIG. 4b, the height of the reflective part (13) formed by the injection of the reflective part material as well as the reflective part material in contact with the side of the light-emitting part (11) may vary depending on the position.

[0113] As in the case of FIG. 4a, the surface of the reflective material and the reflective part (13) may have a maximum height equal to the maximum height of the side of the light-emitting part (11), and the height of the surface of the reflective material and the reflective part (13) may decrease as it moves away from the side of the light-emitting part (11).

[0114] In the case of FIG. 4b, the surface of the reflective material and the reflective part (13) may have the same height as the highest height of the side of the light-emitting part (11), but the height of the surface of the reflective material and the reflective part (13) may increase as it moves away from the side of the light-emitting part (11) and then decrease again.

[0115] When the light-emitting package (10) is completed after the reflective material is injected in a state as shown in FIG. 4a and FIG. 4b, the lower surface of the reflective part (13) of the completed light-emitting package (10), that is, the surface adjacent to the circuit board (20), may be a curved surface. Accordingly, in the case of FIG. 4a, the height of the lower surface of the reflective part (13) may increase as it moves further away from the side of the light-emitting part (11), and in the case of FIG. 4b, the height of the lower surface of the reflective part (13) may decrease as it moves further away from the side of the light-emitting part (11).

[0116] As previously described, the reflective material may contain trisiloxane or titanium dioxide (TiO2), and the proportion of trisiloxane or titanium dioxide (TiO2) in the total material constituting the reflective material may be 10% to 40%.

[0117] In this way, when a reflective material is injected into a space where at least one light-emitting part (11) is located to form a reflective part (13), a cutting process (sawing) is performed to cut the light-emitting package unit between adjacent light-emitting parts (11) as shown in FIG. 2g, thereby forming a preliminary light-emitting package (101).

[0118] The cutting lines in Figs. 4a and 4b illustrate imaginary lines where cutting occurs during the cutting process.

[0119] In the pre-luminescent package (101) manufactured by this cutting process, a release film (31) attached to the fluorescent film portion (12) by an adhesive layer (33) may be positioned on the upper surface of the fluorescent film portion (12). Due to this release film (31), the upper surface of the fluorescent film portion (12), which is the light emission surface, can be prevented from being damaged or broken by external impact or the like during movement or during the manufacturing of the light-emitting module (1). Therefore, the defect rate of the light-emitting package (10) can be reduced.

[0120] These preliminary light-emitting packages (101) can be electrically and physically connected to pads located on the circuit board (20), for example, through a connection method using solder, to complete the light-emitting module (1).

[0121] In this way, a light-emitting package (10) can be manufactured by removing the release film (31) attached to the upper part of the fluorescent film portion (12) of the pre-light-emitting package (101) after the coupling with the circuit board (20) is completed or before coupling with the circuit board (20).

[0122] Accordingly, as illustrated in FIG. 2h, if a physical force is applied to the release film (31) located in the pre-luminescent package (101) and the release film (31) is pulled in a direction to be separated from the fluorescent film portion (12), the release film (31) can be removed from the fluorescent film portion (12), and thereby the light-emitting package (10) (see FIG. 1) can be completed.

[0123] By removing the release film (31), the adhesive layer (33) attached to the release film (31) can also be removed together with the release film (31).

[0124] As previously described, since a primer layer (32) exists between the release film (31) and the adhesive layer (33) to increase the bonding strength between the release film (31) and the adhesive layer (33), the bonding strength between the release film (31) and the adhesive layer (33) can be much greater than the bonding strength between the adhesive layer (33) and the fluorescent film portion (12).

[0125] Therefore, due to the pulling force of the release film (31), the portion of the adhesive layer (33) attached to the fluorescent film portion (12) is detached from the fluorescent film portion (12), while the portion of the adhesive layer (33) attached to the release film (31) is not separated from the release film (31).

[0126] As a result, the silicone-containing adhesive layer (33) is torn off from the fluorescent film portion (12) together with the release film (31) during the removal operation of the release film (31), so that no residue of the adhesive layer (33) remains on the extrusion surface, which is the exposed surface of the fluorescent film portion (12).

[0127] At this time, the surface roughness of the output surface of the fluorescent film portion (12) is much smaller and smoother than the surface roughness of the release film (31), so the adhesive layer (33) can be detached from the fluorescent film portion (12) more easily.

[0128] In an alternative example, due to the harmonization treatment of the corresponding surface (e.g., front) of the release film (31), not only the corresponding surface of the release film (31) but also the corresponding surfaces of the primer layer (32) and adhesive layer (33) located on the corresponding surface of the release film (31) can be maintained in a rough state.

[0129] In this case, regardless of the presence or absence of the primer layer (32), the bonding force between the release film (31) and the adhesive layer (33) can be much greater than the bonding force between the adhesive layer (33) and the fluorescent film portion (12). As a result, when the release film (31) is removed, the portion of the adhesive layer (33) attached to the fluorescent film portion (12) can easily detach from the fluorescent film portion (12), so that the adhesive layer (33) can be attached to the release film (31) and removed from the fluorescent film portion (12) together with the release film (31).

[0130] In this way, when the release film (31) attached to the fluorescent film portion (12) through the adhesive layer (33) is removed using a user or a designated device, the adhesive layer (33) attached to the release film (31) can also be removed together with the release film (31). Therefore, no residue of the adhesive layer (33) remains on the output surface, which is the upper surface of the fluorescent film portion (12), so a clean and undamaged output surface can be exposed.

[0131] In this way, since there is no residue of the adhesive layer (33) on the upper surface of the fluorescent film portion (12), which is the light emission surface, the light emitted from the light-emitting surface of the light-emitting portion (11) can pass through the fluorescent film portion (12), which is free of foreign substances or scratches, and be emitted to the outside.

[0132] Therefore, the light output efficiency of the light-emitting module (1) can be improved as no problems of light distortion or loss due to foreign substances or scratches occur. In addition, the defect rate caused by adhesive adhering to the upper surface of the fluorescent film part (12) is greatly reduced, and the defect rate of the light-emitting module (1) can also be greatly reduced.

[0133] The technical features disclosed in each embodiment of the present invention are not limited to that embodiment only, and as long as they are not mutually incompatible, the technical features disclosed in each embodiment may be combined and applied to different embodiments.

[0134] Therefore, in each embodiment, the technical features are described primarily, but as long as the technical features are not mutually incompatible, they may be combined and applied together.

[0135] The present invention is not limited to the embodiments described above and the attached drawings, and various modifications and variations may be possible from the perspective of those skilled in the art to which the present invention belongs. Accordingly, the scope of the present invention should be defined not only by the claims of this specification but also by equivalents thereof.

Claims

1. Step of placing a release film; A step of forming a primer layer by applying a primer to one side of the above-mentioned release film; A step of forming an adhesive layer by applying an adhesive onto the primer layer; A step of positioning a fluorescent film portion on the adhesive layer and attaching the fluorescent film portion to the adhesive layer; A step of positioning a light-emitting part on the fluorescent film part; and A step of injecting a reflective material around the light-emitting part to form a reflective part on the exposed adhesive layer, the side and top surfaces of the exposed fluorescent film part, and the side surface of the exposed light-emitting part. A method for manufacturing a light-emitting package including 2. In Paragraph 1, A method for manufacturing a light-emitting package in which the bonding force between the release film and the adhesive layer is greater than the bonding force between the adhesive layer and the fluorescent film portion.

3. In Paragraph 1, A method for manufacturing a light-emitting package in which the surface roughness of one side of the release film in contact with the primer layer is greater than the surface roughness of one side of the fluorescent film portion in contact with the adhesive layer.

4. In Paragraph 1, A method for manufacturing a light-emitting package in which one side of the release film to which the above primer layer is applied is a textured surface that has been treated for harmony.

5. In Paragraph 4, A method for manufacturing a light-emitting package in which the surface roughness of one side of the above-mentioned release film is greater than the surface roughness of one side of the above-mentioned fluorescent film portion attached to the above-mentioned adhesive layer.

6. In Paragraph 4, A method for manufacturing a light-emitting package in which the entire surface of the above-mentioned release film is an uneven surface.

7. In Paragraph 4, A method for manufacturing a light-emitting package in which a portion of one surface of the above-mentioned release film is an uneven surface and the remaining portion is a flat surface.

8. In Paragraph 7, A method for manufacturing a light-emitting package in which the above fluorescent film portion is located on the above uneven surface.

9. In Paragraph 1, A method for manufacturing a light-emitting package in which the surface height of the reflective portion is equal to or lower than the height of the side of the light-emitting portion.

10. In Paragraph 1, A step of forming a preliminary light-emitting package by cutting between adjacent light-emitting parts; and A method for manufacturing a light-emitting package, further comprising the step of removing the release film from the above-mentioned pre-light-emitting package to manufacture the light-emitting package.

11. In Paragraph 1, A method for manufacturing a light-emitting package in which the surface of the above-mentioned reflective portion is a curved surface.

12. In Paragraph 11, A method for manufacturing a light-emitting package in which the surface height of the reflective portion decreases as it moves away from the light-emitting portion.

13. In Paragraph 11, A method for manufacturing a light-emitting package in which the surface height of the reflective portion increases as it moves away from the light-emitting portion.

14. In Paragraph 1, A method for manufacturing a light-emitting package in which the above-mentioned reflective material contains trisiloxane or titanium dioxide (TiO2), and the ratio of trisiloxane or titanium dioxide is 10% to 40%.

15. An apparatus for manufacturing a light-emitting package according to the method for manufacturing a light-emitting package of any one of claims 1 to 14.

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