Heat dissipation module and assembly method therefor, and electronic device

Abstract

The present disclosure provides a heat dissipation module and an assembly method therefor, and an electronic device. The heat dissipation module is used for dissipating heat from a heat source on a circuit board. The heat dissipation module comprises a fixing base, a coupling frame, and a heat sink. The fixing base is arranged on the circuit board, allowing the heat source to be located at or near the center of the fixing base. The fixing base is provided with multiple first fasteners. The coupling frame is provided a limiting structure and multiple second fasteners; the second fasteners are respectively snap-fitted with the first fasteners, allowing the coupling frame to be fixed on the fixing base; and the limiting structure limits the heat sink, allowing at least a portion of the heat sink to be limited within the coupling frame and allowing the heat sink to be vertically attached to the heat source. Thus, the heat sink can be quickly, stably and precisely installed on the circuit board and tightly attached to the heat source, and the heat sink is prevented from deforming due to excessive or uneven stress during installation.

Description

Heat dissipation module, its assembly method and electronic device Technical Field

[0001] This disclosure relates to the field of heat dissipation, and more particularly to a heat dissipation module, its assembly method, and electronic device. Background Technology

[0002] With the rapid development of technology, various electronic devices are gradually becoming thinner and more efficient, which generates a lot of heat during operation. Therefore, many electronic devices are equipped with heat sinks to cool the heat sources and ensure that the operating temperature is within an appropriate range to maintain working efficiency and service life.

[0003] However, most existing heat sinks rely on four screws inserted at the four corners to secure them to the circuit board or housing. Therefore, these screws must be tightened sequentially and alternately, with force applied slowly to prevent uneven pressure that could damage the heat source. Furthermore, care must be taken to ensure the heat sink and heat source are not misaligned during tightening. In addition, after tightening, uneven stress often causes deformation and bulging in the center of the heat sink, affecting the adhesion and heat transfer efficiency between the heat sink and the heat source.

[0004] In view of this, the author has devoted himself to researching and applying theoretical principles to address the shortcomings of the prior art, and has made every effort to solve the aforementioned problems, which has become the goal of the author's improvement.

[0005] Public content

[0006] The main purpose of this disclosure is to enable the heat sink to be installed quickly, stably and accurately on the circuit board and closely attached to the heat source, while avoiding deformation of the heat sink due to excessive or uneven force during installation.

[0007] To achieve the above objectives, this disclosure provides a heat dissipation module for cooling a heat source on a circuit board. The heat dissipation module includes a mounting base, a connecting frame, and a heat sink. The mounting base is disposed on the circuit board such that the heat source is located at or near the center of the mounting base. The mounting base has a plurality of first latches, and the connecting frame has a limiting structure and a plurality of second latches. Each second latch engages with a first latch to fix the connecting frame to the mounting base. The limiting structure restricts the heat sink so that at least a portion of the heat sink is confined within the connecting frame and the heat sink is attached to the heat source in a vertical direction.

[0008] In one embodiment of this disclosure, the limiting structure includes a plurality of third latches, each third latch engaging the heat sink to restrict the heat sink in the vertical direction via the connecting frame.

[0009] In one embodiment of this disclosure, the connecting frame is a hollow rectangle surrounding the heat source, and the heat sink is disposed within the connecting frame such that the connecting frame restricts the heat sink along a longitudinal direction and a transverse direction, the longitudinal direction, the transverse direction and the vertical direction being perpendicular to each other.

[0010] In one embodiment of this disclosure, the connecting frame has a positioning hole, and the fixing seat has a positioning pin. The positioning hole is fitted with the positioning pin to position the connecting frame on the fixing seat.

[0011] In one embodiment of this disclosure, a locking assembly is further included. The locking assembly includes a pressure plate and a plurality of spring bolts. The pressure plate includes a pressing part and a pair of connecting parts connecting opposite ends of the pressing part. The fixing seat has a plurality of studs. Each spring bolt passes through each connecting part and is locked to each stud, so that the pressing part presses the radiator against and attaches it to the heat source.

[0012] To achieve the above objectives, this disclosure also provides a method for assembling a heat dissipation module, mainly including a pre-installation step, a first assembly step, and a second assembly step. The pre-installation step involves providing a circuit board and a mounting base. The circuit board has a heat source, and the mounting base has a plurality of first clips. The mounting base is placed on the circuit board so that the heat source is located at or near the center of the mounting base. The first assembly step involves providing a connecting frame and a heat sink. The connecting frame has a limiting structure and a plurality of second clips. The connecting frame is combined with one of the mounting base and the heat sink to form a semi-finished component. The second assembly step involves combining the other of the mounting base and the heat sink with the semi-finished component, so that each second clip engages with each first clip to fix the connecting frame to the mounting base, while the limiting structure restricts at least a portion of the heat sink so that the heat sink is attached to the heat source.

[0013] In one embodiment of this disclosure, a fixing step is further included. The fixing step provides a pressure plate and a plurality of spring bolts. The pressure plate includes a pressing part and a pair of connecting parts connecting opposite ends of the pressing part. Each spring bolt is passed through the connecting part and locked to the fixing seat so that the pressing part presses the heat sink against the heat source.

[0014] To achieve the above objectives, this disclosure also provides an electronic device, including a housing, a circuit board, a mounting base, a connecting frame, and a heat sink. The circuit board is disposed within the housing and has a heat source. The mounting base is disposed on the circuit board such that the heat source is located at or near the center of the mounting base. The mounting base has a plurality of first latches. The connecting frame has a limiting structure and a plurality of second latches. Each second latch engages with each first latch to fix the connecting frame to the mounting base. The limiting structure restricts the heat sink so that at least a portion of the heat sink is confined within the connecting frame and the heat sink is attached to the heat source in a vertical direction.

[0015] In one embodiment of this disclosure, the limiting structure includes a plurality of third latches, each third latch engaging the heat sink to restrict the heat sink in the vertical direction via the connecting frame.

[0016] In one embodiment of this disclosure, the connecting frame is a hollow rectangle surrounding the heat source, and the heat sink is disposed within the connecting frame such that the connecting frame restricts the heat sink along a longitudinal direction and a transverse direction, the longitudinal direction, the transverse direction and the vertical direction being perpendicular to each other.

[0017] In one embodiment of this disclosure, the connecting frame has a positioning hole, and the fixing seat has a positioning pin. The positioning hole is fitted with the positioning pin to position the connecting frame on the fixing seat.

[0018] In one embodiment of this disclosure, a locking assembly is further included. The locking assembly includes a pressure plate and a plurality of spring bolts. The pressure plate includes a pressing part and a pair of connecting parts connecting opposite ends of the pressing part. The fixing seat has a plurality of studs. Each spring bolt passes through each connecting part and is locked to each stud, so that the pressing part presses the radiator against and attaches it to the heat source.

[0019] The heat dissipation module and electronic device disclosed herein use the first buckles of the fixing base to respectively engage with the second buckles of the connecting frame, and the limiting structure of the connecting frame to restrict the heat sink. Therefore, the heat sink can be quickly, stably and accurately installed on the circuit board and tightly attached to the heat source, and the heat sink is prevented from deforming due to excessive force or uneven force during installation. Attached Figure Description

[0020] Figure 1 is an exploded perspective view of the heat dissipation module disclosed herein.

[0021] Figure 2 is a three-dimensional view of the heat dissipation module disclosed herein.

[0022] Figure 3 is a cross-sectional side view of the heat dissipation module disclosed herein.

[0023] Figure 4 is another cross-sectional side view of the heat dissipation module disclosed herein.

[0024] Figure 5 is a cross-sectional front view of the heat dissipation module disclosed herein.

[0025] Figure 6 is a flowchart of the assembly method of the heat dissipation module disclosed herein.

[0026] Figure 7 is a partial perspective view of the electronic device disclosed herein. Detailed Implementation

[0027] In the description of this disclosure, it should be understood that the terms "front side", "rear side", "left side", "right side", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0028] As used herein, terms such as “first,” “second,” “third,” “fourth,” and “fifth” describe various elements, components, regions, hierarchies, and / or parts, which should not be limited by these terms. These terms are used only to distinguish one element, component, region, hierarchy, or part from another. Unless the context clearly indicates otherwise, the use of terms such as “first,” “second,” “third,” “fourth,” and “fifth” herein does not imply order or sequence.

[0029] Unless otherwise defined, the terms "substantially" and "approximately" are used to describe and narrate small changes. When combined with an event or situation, the term may include the exact moment the event or situation occurred, or an approximate point in time. For example, when combined with a numerical value, the term may include a range of variation less than or equal to ±10% of the value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0030] The detailed description and technical content of this disclosure will be explained below in conjunction with the accompanying drawings. However, the accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0031] This disclosure provides a heat dissipation module for cooling a heat source 110 (e.g., a chip) on a circuit board 100. Referring to Figures 1 to 5, the heat dissipation module mainly includes a mounting base 200, a connecting frame 300, and a heat sink 400. In this embodiment, the heat sink 400 is a liquid cooling head made of a metal with good thermal conductivity, such as copper or aluminum, and is used with a coolant. However, this disclosure is not limited to this; for example, the heat sink 400 can also be a general heat sink.

[0032] In this embodiment, the mounting base 200 is made of metal to ensure the structural strength of the heat dissipation module of this disclosure, but this disclosure is not limited thereto. The mounting base 200 is disposed on the circuit board 100, thereby placing the heat source 110 at or near the center of the mounting base 200. Specifically, in this embodiment, the mounting base 200 is a hollow rectangular plate surrounding the heat source 110, but this disclosure is not limited thereto. For example, the mounting base 200 can also be a plurality of rectangular, arc-shaped, or L-shaped blocks or plates, as long as they can surround the heat source 110 at or near the center. Furthermore, in this embodiment, the fixing base 200 is secured to the circuit board 100 by a plurality of screws (see Figures 1 and 2, not labeled) sequentially passing through the fixing base 200 and the circuit board 100, and then locking them to at least one clamping member (see Figures 3 to 5, not labeled), thereby firmly fixing the fixing base 200 to the circuit board 100. The clamping member can be a metal seat with a plurality of screw holes or a nut; this disclosure does not impose further limitations on this. The fixing base 200 has a plurality of first latches 210. Each first latch 210 extends from the fixing base 200 along a vertical direction D1 (i.e., the up-down direction in the figures) in a direction away from the circuit board 100.

[0033] In this embodiment, the connecting frame 300 is integrally molded from plastic injection molding, thereby allowing the connecting frame 300 to retain a certain degree of elastic deformation capability after forming the required structural shape, but this disclosure is not limited thereto. The connecting frame 300 has a limiting structure 310 and a plurality of second latches 320. Each second latch 320 extends from the connecting frame 300 toward the fixing base 200 and the circuit board 100. Each second latch 320 respectively engages with each first latch 210, thereby fixing the connecting frame 300 to the fixing base 200. Specifically, in this embodiment, each second buckle 320 has a barb 321 at its end, and each first buckle 210 has a buckle hole 211, so that each barb 321 can be engaged in the buckle hole 211 to form a fastening connection. However, this disclosure is not limited to this. For example, the barb 321 can also be provided in the first buckle 210, and the buckle hole 211 can be provided in the second buckle 320, or each first buckle 210 and each second buckle 320 can be provided with a barb 321. The limiting structure 310 restricts the heat sink 400, so that at least a portion of the heat sink 400 is limited within the connecting frame 300. In this way, the heat sink 400 is restricted by the limiting structure 310 of the frame 300, and the first buckle 210 of the fixing seat 200 is fastened by the second buckle 320 of the frame 300 to form a fixation. Therefore, the heat sink 400 can be quickly, stably and accurately attached to the heat source 110 along the vertical direction D1, and the heat sink 400 is prevented from deforming due to excessive force or uneven force during installation.

[0034] To further explain, the connecting frame 300 in this embodiment is a hollow rectangular frame, and the limiting structure 310 of the connecting frame 300 includes a plurality of third buckles 311 extending along the vertical direction D1. Each third buckle 311 together fastens the heat sink 400 so that the connecting frame 300 restricts the heat sink 400 along the vertical direction D1, but this disclosure is not limited thereto. For example, the connecting frame 300 can also be a hollow rectangular plate with a groove formed at the bottom to cover the top periphery of the heat sink 400, which can also achieve the effect of restricting the heat sink 400. In this embodiment, the heat sink 400 has a plurality of slots 410 located at its four top corners, and each third buckle 311 is respectively fastened to each slot 410 to avoid the third buckles 311 protruding from the heat sink 400 and causing interference. Furthermore, the radiator 400 in this embodiment also has a plurality of guide slopes 420 corresponding to each slot 410. Each guide slope 420 is respectively located at the four corners of the bottom of the radiator 400, thereby guiding each third buckle 311 and preventing jamming during assembly.

[0035] In this embodiment, the connecting frame 300 is a hollow rectangle surrounding the heat source 110. Therefore, the heat sink 400 is disposed within the connecting frame 300, thereby restricting the side periphery of the heat sink 400 along a longitudinal direction D2 (i.e., the front-to-back direction in the figures) and a transverse direction D3 (i.e., the left-to-right direction in the figures). The longitudinal direction D2, the transverse direction D3, and the vertical direction D1 are substantially perpendicular to each other. In other words, the connecting frame 300 restricts the side periphery of the heat sink 400 through its hollow rectangular shape and is fastened to the heat sink 400 by each of the third latches 311, thereby completely restricting the heat sink 400. Furthermore, since the connecting frame 300 is fastened to the first latches 210 of the fixing base 200 by each of the second latches 320, the heat sink 400 can be effectively fixed to the circuit board 100 without deforming due to excessive force.

[0036] Further explanation: the connecting frame 300 has at least one positioning hole 330, and the fixing base 200 has at least one positioning pin 220. In this embodiment, the number of positioning holes 330 and the number of positioning pins 220 are both two, wherein each positioning hole 330 is arranged opposite to each other on opposite sides of the connecting frame 300, and each positioning pin 220 is also arranged opposite to each other on opposite sides of the fixing base 200, but this disclosure is not limited thereto. Each positioning hole 330 of the connecting frame 300 is respectively fitted with each positioning pin 220 of the fixing base 200, thereby positioning the connecting frame 300 on the fixing base 200. It is worth mentioning that, due to the high precision of the positioning pins 220 and positioning holes 330 during installation and processing, the connecting frame 300 can be effectively and accurately positioned in the required position on the fixing base 200, thereby ensuring that the heat sink 400 can be tightly attached to the heat source 110. Furthermore, since the fixing base 200 and the heat sink 400 in this embodiment are both made of metal, while the connecting frame 300 is made of plastic, the connecting frame 300 has lower structural strength and a certain degree of elastic deformation capability compared to the fixing base 200 and the heat sink 400. This allows the connecting frame 300 to undergo slight elastic deformation when it is fastened to the first buckles 210 of the fixing base 200 by the second buckles 320. This deformation helps to bridge the dimensional tolerances between the heat sink 400, the connecting frame 300, and the fixing base 200, thereby ensuring that the connecting frame 300, together with the heat sink 400, can be accurately fixed to the fixing base 200.

[0037] To further ensure the stability of the heat sink 400, the heat dissipation module of this disclosure also includes a locking component 500. The locking component 500 includes at least one pressure plate 510 and a plurality of spring bolts 520. In this embodiment, there are two pressure plates 510 and four spring bolts 520, but this disclosure is not limited thereto. For example, the number of pressure plates 510 may be only one or more, and the number of spring bolts 520 may be determined according to the number and form of the pressure plates 510. Each pressure plate 510 includes a pressing part 511 and a pair of connecting parts 512 connected to opposite ends of the pressing part 511. Specifically, each pressing part 511 is flat and can be flat against the top of the heat sink 400, and each connecting part 512 is connected to opposite ends of the corresponding pressing part 511 and located on opposite sides of the heat sink 400. Each spring bolt 520 passes through each connecting portion 512 and is locked to the fixing base 200, thereby causing the pressing portion 511 to press and attach the radiator 400 to the heat source 110. In this embodiment, the fixing base 200 has a plurality of studs 230, and each spring bolt 520 is locked to each stud 230 after passing through each connecting portion 512, but this disclosure is not limited thereto. In this way, by having each spring bolt 520 pass through each connecting portion 512 and be locked to the fixing base 200, each pressing portion 511 of each pressure plate 510 can tightly attach the radiator 400 to the heat source 110 and can firmly press and fix the radiator 400, thereby preventing the radiator 400 from deforming due to excessive or uneven force.

[0038] Please refer to Figure 6 and, together with Figures 1 to 5, this disclosure also provides a method for assembling a heat dissipation module, which mainly includes a pre-installation step a, a first assembly step c, and a second assembly step d.

[0039] In pre-installation step a, a circuit board 100 and a mounting base 200 are provided. The circuit board 100 has a heat source 110, and the mounting base 200 has a plurality of first latches 210. The mounting base 200 is disposed on the circuit board 100 such that the heat source 110 is located at or near the center of the mounting base 200.

[0040] In the first assembly step c, a connecting frame 300 and a heat sink 400 are provided. The connecting frame 300 has a limiting structure 310 and a plurality of second latches 320. The connecting frame 300 is combined with one of the fixing base 200 and the heat sink 400 to form a half-finished component (not labeled in the figure).

[0041] In the second assembly step d, the other of the fixing base 200 and the heat sink 400 is combined with the semi-finished component, so that each second buckle 320 is respectively engaged with each first buckle 210 to fix the connecting frame 300 to the fixing base 200, while the limiting structure 310 restricts at least a part of the heat sink 400 so that the heat sink 400 is attached to the heat source 110.

[0042] In this way, the heat sink 400 is restricted by the limiting structure 310 of the frame 300, and the first buckle 210 of the fixing seat 200 is fastened by the second buckle 320 of the frame 300 to form a fixation. Therefore, the heat sink 400 can be installed on the circuit board 100 and closely attached to the heat source 110 quickly, stably and accurately, and the heat sink 400 is prevented from deforming due to excessive force or uneven force during installation.

[0043] Furthermore, the assembly method of the heat dissipation module disclosed herein also includes a positioning step b and a fixing step e, which are described in detail below.

[0044] In positioning step b, the connecting frame 300 also has at least one positioning hole 330, and the fixing seat 200 has at least one positioning pin 220. Before performing the first assembly step c or the second assembly step d, that is, before combining the connecting frame 300 and the fixing seat 200 into a semi-finished component, or before combining the fixing seat 200 with the semi-finished component, the positioning hole 330 of the connecting frame 300 is fitted with the positioning pin 220 of the fixing seat 200 to position the connecting frame 300 on the fixing seat 200, thereby controlling the assembly accuracy between the two. In this embodiment, the number of positioning holes 330 and the number of positioning pins 220 are both two, wherein each positioning hole 330 is arranged opposite to each other on opposite sides of the connecting frame 300, and each positioning pin 220 is also arranged opposite to each other on opposite sides of the fixing seat 200, but this disclosure is not limited thereto. Therefore, due to the high precision of the positioning pin 220 and the positioning hole 330 during installation and processing, the connecting frame 300 can be effectively and accurately positioned in the required position of the fixing seat 200, thereby ensuring that the heat sink 400 can be tightly attached to the heat source 110.

[0045] In the fixing step e, a locking assembly 500 is provided. The locking assembly 500 includes a pressure plate 510 and a plurality of spring bolts 520. The pressure plate 510 includes a pressing part 511 and a pair of connecting parts 512 connecting opposite ends of the pressing part 511. After completing the second assembly step d, each spring bolt 520 is passed through each connecting part 512 and locked to the fixing base 200, thereby causing the pressing part 511 to press and attach the radiator 400 to the heat source 110. In this way, by passing each spring bolt 520 through each connecting part 512 and locking it to the fixing base 200, each pressing part 511 of each pressure plate 510 can tightly attach the radiator 400 to the heat source 110 and can firmly press and fix the radiator 400, thereby preventing the radiator 400 from deforming due to excessive or uneven force.

[0046] It should be noted that the structures of the circuit board 100, fixing base 200, connecting frame 300, heat sink 400 and locking component 500 described in the assembly method of the heat dissipation module disclosed herein are the same as the structures of the circuit board 100, fixing base 200, connecting frame 300, heat sink 400 and locking component 500 in the aforementioned heat dissipation module, and therefore will not be described again here.

[0047] Referring to Figures 1 to 5 and Figure 7, this disclosure also provides an electronic device, which mainly includes a housing 600, a circuit board 100, a mounting base 200, a connecting frame 300, and a heat sink 400. In this embodiment, the heat sink 400 is a liquid cooling head made of a metal with good thermal conductivity, such as copper or aluminum, and is used with a coolant. However, this disclosure is not limited to this; for example, the heat sink 400 can also be a general heat sink.

[0048] The circuit board 100 is disposed within the housing 600. The circuit board 100 has at least one heat source 110. The heat source 110 may be a central processing unit (CPU), a graphics processing unit (GPU), a driver, an electronic component, a power supply, or other electronic component, and this disclosure does not impose any limitations on it.

[0049] The mounting base 200 is disposed on the circuit board 100, thereby positioning the heat source 110 at or near the center of the mounting base 200. Specifically, in this embodiment, the mounting base 200 is a hollow rectangular plate surrounding the heat source 110, but this disclosure is not limited thereto. For example, the mounting base 200 can also be a plurality of rectangular, arc-shaped, or L-shaped blocks or plates, as long as they can surround or near the center of the heat source 110. Furthermore, in this embodiment, the mounting base 200 is securely fixed to the circuit board 100 by a plurality of screws sequentially passing through the mounting base 200 and the circuit board 100 and then locking it to at least one clamping member. The clamping member can be a metal seat or nut with a plurality of screw holes, and this disclosure does not impose further limitations on this. The mounting base 200 has a plurality of first latches 210. Each first latch 210 extends from the fixing base 200 along a vertical direction D1 (i.e., the up-down direction in the figures) toward a direction away from the circuit board 100. In this embodiment, the fixing base 200 is made of metal to ensure its structural strength when it is connected and fixed to the heat sink 400, but this disclosure is not limited thereto.

[0050] In this embodiment, the connecting frame 300 is integrally molded from plastic injection molding, thereby allowing the connecting frame 300 to retain a certain degree of elastic deformation capability after forming the required structural shape, but this disclosure is not limited thereto. The connecting frame 300 has a limiting structure 310 and a plurality of second latches 320. Each second latch 320 extends from the connecting frame 300 toward the fixing base 200 and the circuit board 100. Each second latch 320 respectively engages with each first latch 210, thereby fixing the connecting frame 300 to the fixing base 200. Specifically, in this embodiment, each second buckle 320 has a barb 321 at its end, and each first buckle 210 has a buckle hole 211, so that each barb 321 can be engaged in the buckle hole 211 to form a fastening connection. However, this disclosure is not limited to this. For example, the barb 321 can also be provided in the first buckle 210, and the buckle hole 211 can be provided in the second buckle 320, or each first buckle 210 and each second buckle 320 can be provided with a barb 321. The limiting structure 310 restricts the heat sink 400, so that at least a portion of the heat sink 400 is limited within the connecting frame 300. In this way, the heat sink 400 is restricted by the limiting structure 310 of the frame 300, and the first buckle 210 of the fixing seat 200 is fastened by the second buckle 320 of the frame 300 to form a fixation. Therefore, the heat sink 400 can be quickly, stably and accurately attached to the heat source 110 along the vertical direction D1 to cool the heat source 110, and the heat sink 400 is prevented from deforming due to excessive force or uneven force during installation.

[0051] To further explain, the connecting frame 300 in this embodiment is a hollow rectangular frame, and the limiting structure 310 of the connecting frame 300 includes a plurality of third buckles 311 extending along the vertical direction D1. Each third buckle 311 together fastens the heat sink 400 so that the connecting frame 300 restricts the heat sink 400 along the vertical direction D1, but this disclosure is not limited thereto. For example, the connecting frame 300 can also be a hollow rectangular plate with a groove formed at the bottom to cover the top periphery of the heat sink 400, which can also achieve the effect of restricting the heat sink 400. In this embodiment, the heat sink 400 has a plurality of slots 410 located at its four top corners, and each third buckle 311 is respectively fastened to each slot 410 to avoid the third buckles 311 protruding from the heat sink 400 and causing interference. Furthermore, the radiator 400 in this embodiment also has a plurality of guide slopes 420 corresponding to each slot 410. Each guide slope 420 is respectively located at the four corners of the bottom of the radiator 400, thereby guiding each third buckle 311 and preventing jamming during assembly.

[0052] In this embodiment, the connecting frame 300 is a hollow rectangle surrounding the heat source 110. Therefore, the heat sink 400 is disposed within the connecting frame 300, thereby restricting the side periphery of the heat sink 400 along a longitudinal direction D2 (i.e., the front-to-back direction in the figures) and a transverse direction D3 (i.e., the left-to-right direction in the figures). The longitudinal direction D2, the transverse direction D3, and the vertical direction D1 are substantially perpendicular to each other. In other words, the connecting frame 300 restricts the side periphery of the heat sink 400 through its hollow rectangular shape and is fastened to the heat sink 400 by each of the third latches 311, thereby completely restricting the heat sink 400. Furthermore, since the connecting frame 300 is fastened to the first latches 210 of the fixing base 200 by each of the second latches 320, the heat sink 400 can be effectively fixed to the circuit board 100 without deforming due to excessive force.

[0053] Further explanation: the connecting frame 300 has at least one positioning hole 330, and the fixing base 200 has at least one positioning pin 220. In this embodiment, there are two positioning holes 330 and two positioning pins 220. Each positioning hole 330 is arranged opposite to each other on opposite sides of the connecting frame 300, and each positioning pin 220 is also arranged opposite to each other on opposite sides of the fixing base 200, but this disclosure is not limited thereto. Each positioning hole 330 of the connecting frame 300 is respectively fitted with each positioning pin 220 of the fixing base 200, thereby positioning the connecting frame 300 on the fixing base 200. It is worth mentioning that, due to the high precision of the positioning pins 220 and positioning holes 330 during installation and processing, the connecting frame 300 can be effectively and accurately positioned on the fixing base 200 at the required position, thereby ensuring that the heat sink 400 can be tightly attached to the heat source 110. Furthermore, since the fixing base 200 and the heat sink 400 in this embodiment are both made of metal, while the connecting frame 300 is made of plastic, the connecting frame 300 has lower structural strength and a certain degree of elastic deformation capability compared to the fixing base 200 and the heat sink 400. This allows the connecting frame 300 to undergo slight elastic deformation when it is fastened to the first buckles 210 of the fixing base 200 by the second buckles 320. This deformation helps to bridge the dimensional tolerances between the heat sink 400, the connecting frame 300, and the fixing base 200, thereby ensuring that the connecting frame 300, together with the heat sink 400, can be accurately fixed to the fixing base 200.

[0054] To further ensure the stability of the heat sink 400, the electronic device of this disclosure also includes a locking assembly 500. The locking assembly 500 includes at least one pressure plate 510 and a plurality of spring bolts 520. In this embodiment, there are two pressure plates 510 and four spring bolts 520, but this disclosure is not limited thereto. For example, the number of pressure plates 510 may be only one or more, and the number of spring bolts 520 may depend on the number and form of the pressure plates 510. Each pressure plate 510 includes a pressing portion 511 and a pair of connecting portions 512 connected to opposite ends of the pressing portion 511. Specifically, each pressing portion 511 is flat and can be flat against the top of the heat sink 400, and each connecting portion 512 connects to opposite ends of the corresponding pressing portion 511 and is located on opposite sides of the heat sink 400. Each spring bolt 520 passes through each connecting portion 512 and is locked to the fixing base 200, thereby pressing the radiator 400 against the heat source 110 by the pressing portion 511. In this embodiment, the fixing base 200 has a plurality of studs 230, and each spring bolt 520 is locked to each stud 230 after passing through each connecting portion 512, but this disclosure is not limited thereto. In this way, by locking each spring bolt 520 to the fixing base 200 after passing through each connecting portion 512, each pressing portion 511 of each pressure plate 510 can tightly attach the radiator 400 to the heat source 110 and can firmly press and fix the radiator 400, thereby preventing the radiator 400 from deforming due to excessive or uneven force.

[0055] The heat dissipation module and electronic device disclosed herein use the first snaps 210 of the fixing base 200 to snap onto the second snaps 320 of the connecting frame 300, and the limiting structure 310 of the connecting frame 300 to limit the heat sink 400. Therefore, the heat sink 400 can be installed on the circuit board 100 and closely attached to the heat source 110 quickly, stably and accurately, and the heat sink 400 is prevented from deforming due to excessive force or uneven force during installation.

[0056] In summary, the foregoing disclosure is intended to enable those skilled in the art to clearly understand the technical content of this disclosure and implement it accordingly, and is not intended to limit the scope of patent protection of this disclosure. In addition, this disclosure may naturally have other embodiments not listed. Without departing from the spirit and essence of this disclosure, those skilled in the art should be able to devise various corresponding changes and modifications based on this disclosure, but all such changes and modifications should fall within the scope of protection of the patents claimed in this disclosure.

Claims

1. A heat dissipation module for cooling a heat source on a circuit board, the heat dissipation module comprising: A mounting base is disposed on the circuit board such that the heat source is located at or near the center of the mounting base, the mounting base having a plurality of first latches; A connecting frame having a limiting structure and a plurality of second latches, each of the second latches respectively engaging with the first latches to fix the connecting frame to the fixing base; and A heat sink, wherein the limiting structure restricts the heat sink such that at least a portion of the heat sink is confined within the connecting frame and the heat sink is attached to the heat source in a vertical direction.

2. The heat dissipation module as claimed in claim 1, wherein the limiting structure includes a plurality of third latches, each of the third latches engaging the heat sink so that the connecting frame restricts the heat sink along the vertical direction.

3. The heat dissipation module as claimed in claim 1, wherein the connecting frame is a hollow rectangle surrounding the heat source, and the heat sink is disposed within the connecting frame such that the connecting frame restricts the heat sink along a longitudinal direction and a transverse direction, the longitudinal direction, the transverse direction and the vertical direction being perpendicular to each other.

4. The heat dissipation module as claimed in claim 1, wherein the connecting frame has a positioning hole, the fixing seat has a positioning pin, and the positioning hole is fitted with the positioning pin to position the connecting frame on the fixing seat.

5. The heat dissipation module as claimed in claim 1, further comprising a locking assembly, the locking assembly comprising a pressure plate and a plurality of spring bolts, the pressure plate comprising a pressing portion and a pair of connecting portions connecting opposite ends of the pressing portion, the fixing base having a plurality of studs, each of the spring bolts passing through each of the connecting portions and locked to each of the studs, thereby causing the pressing portion to press and attach the heat sink to the heat source.

6. A method for assembling a heat dissipation module, comprising the following steps: A pre-installation step includes providing a circuit board and a mounting base. The circuit board has a heat source, and the mounting base has a plurality of first latches. The mounting base is placed on the circuit board such that the heat source is located at or near the center of the mounting base. A first assembly step involves providing a connecting frame and a heat sink, the connecting frame having a limiting structure and a plurality of second latches, and combining the connecting frame with one of the fixing base and the heat sink to form a half-finished component; and In the second assembly step, the other of the fixing base and the heat sink is combined with the semi-finished component, so that each of the second buckles is engaged with each of the first buckles to fix the connecting frame to the fixing base, while the limiting structure restricts at least a part of the heat sink so that the heat sink is attached to the heat source.

7. The assembly method of the heat dissipation module as described in claim 6 further includes a fixing step, wherein the fixing step provides a pressure plate and a plurality of spring bolts, the pressure plate includes a pressing part and a pair of connecting parts connecting opposite ends of the pressing part, and each of the spring bolts is passed through the connecting parts and locked to the fixing seat so that the pressing part presses the heat sink against the heat source.

8. An electronic device comprising: A shell; A circuit board, disposed within the housing, has a heat source; A mounting base is disposed on the circuit board such that the heat source is located at or near the center of the mounting base, the mounting base having a plurality of first latches; A connecting frame having a limiting structure and a plurality of second latches, each of the second latches respectively engaging with the first latches to fix the connecting frame to the fixing base; and A heat sink, wherein the limiting structure restricts the heat sink such that at least a portion of the heat sink is confined within the connecting frame and the heat sink is attached to the heat source in a vertical direction.

9. The electronic device of claim 8, wherein the limiting structure includes a plurality of third latches, each of the third latches engaging the heat sink to restrict the heat sink along the vertical direction by the connecting frame.

10. The electronic device of claim 8, wherein the connecting frame is a hollow rectangle surrounding the heat source, and the heat sink is disposed within the connecting frame such that the connecting frame restricts the heat sink in a longitudinal direction and a transverse direction, the longitudinal direction, the transverse direction and the vertical direction being perpendicular to each other.

11. The electronic device of claim 8, wherein the connecting frame has a positioning hole, the fixing seat has a positioning pin, and the positioning hole is fitted with the positioning pin to position the connecting frame on the fixing seat.

12. The electronic device of claim 8, further comprising a locking assembly including a pressure plate and a plurality of spring bolts, the pressure plate including a pressing portion and a pair of connecting portions connecting opposite ends of the pressing portion, the fixing base having a plurality of studs, each of the spring bolts passing through each of the connecting portions and locked to each of the studs such that the pressing portion presses the heat sink against the heat source.

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