Evaporation device and substrate electroplating apparatus
Patent Information
- Application Number
- PCT/CN2025/146052
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-12
- Filing Date
- 2025-12-26
- Publication Date
- 2026-09-17
Smart Images
Figure CN2025146052_17092026_PF_FP_ABST
Abstract
Description
Evaporation equipment and substrate electroplating equipment Technical Field
[0001] This invention relates to the field of semiconductor manufacturing equipment, and in particular to an evaporation apparatus and a substrate electroplating apparatus. Background Technology
[0002] In the substrate electroplating process, the plated substrate needs to be cleaned in the electroplating tank to remove residual electroplating solution from its surface. During cleaning, the cleaning solution (e.g., deionized water) flows back into the storage tank through the return pipeline, diluting the electroplating solution and causing the liquid level in the storage tank to rise, thus affecting the normal operation of the electroplating process. Therefore, measures need to be taken to effectively remove excess water from the storage tank to maintain a stable liquid level and concentration of the electroplating solution.
[0003] In existing solutions, the evaporation of water in the electroplating solution is typically accelerated by purging the solution with gas. The water vapor in the solution is then promptly discharged with the purging gas through an exhaust system to maintain a stable concentration of the electroplating solution. To prevent the purging gas from carrying contaminants or reacting chemically with the electroplating solution, clean nitrogen or inert gases are usually used for purging.
[0004] In substrate electroplating processes, a large amount of cleaning solution typically enters the storage tank via the return pipeline. To remove excess moisture from the storage tank in a timely and effective manner, it is necessary to enhance the gas-liquid interaction efficiency, thereby increasing the evaporation rate, which consumes a significant amount of protective gas. Summary of the Invention
[0005] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide an evaporation apparatus and a substrate electroplating equipment to solve the technical problem of how to improve the liquid evaporation apparatus in the prior art to reduce the energy consumption of the process.
[0006] To achieve the above and other related objectives, one aspect of this application provides an evaporation apparatus for evaporating liquid in a storage tank, comprising: a gas supply assembly for supplying a protective gas to the storage tank, thereby filling the storage tank with the protective gas; a gas circulation pipeline having an extraction end and an exhaust end, the extraction end and the exhaust end being respectively connected to the storage tank; an exhaust assembly for allowing gas in the storage tank to enter the gas circulation pipeline from the extraction end and return to the storage tank from the exhaust end; a condensate drainage assembly including a cooling element and a drainage pipeline, the cooling element being used to condense the gas entering the gas circulation pipeline from the extraction end, and the drainage pipeline being used to discharge liquid water generated after the gas is condensed; and a temperature control assembly for regulating the gas after being processed by the condensate drainage assembly, so that the gas discharged from the exhaust end returns to the storage tank at a predetermined temperature.
[0007] Another aspect of this application provides a substrate electroplating apparatus, including an electroplating tank, a storage tank, and the aforementioned evaporation device.
[0008] As described above, this application provides an evaporation apparatus and a substrate electroplating equipment, which have at least the following beneficial effects:
[0009] (1) By recycling the protective gas, the consumption of protective gas is effectively reduced, which can maintain the concentration and level of the liquid in the storage tank while making the production process more energy-saving and environmentally friendly, and effectively reduce the production cost of the process.
[0010] (2) Since the storage tank is always filled with a positive pressure atmosphere of nitrogen and the gas circulates at a predetermined temperature, the stability of the chemical composition of the electroplating solution in the storage tank can be improved and the service life of the electroplating solution can be increased.
[0011] Overview of the attached figures
[0012] Figure 1 shows a schematic diagram of the evaporation apparatus in Embodiment 1 of this application;
[0013] Figure 2 shows a schematic diagram of the evaporation apparatus in Embodiment 2 of this application;
[0014] Figure 3 shows a schematic diagram of the substrate electroplating equipment in Embodiment 3 of this application.
[0015] Preferred embodiments of this application
[0016] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or adjusted based on different viewpoints and applications without departing from the spirit of this application.
[0017] It should be noted that the accompanying drawings are only schematic representations of the basic concept of this application. Although the drawings only show components related to this application and are not drawn according to the actual number, shape and size of the components, the shape, quantity and proportion of each component can be arbitrarily adjusted in actual implementation, and the layout of the components may also be more complex.
[0018] In the following description, when referring to the accompanying drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses consistent with some aspects of this application as detailed in the appended claims.
[0019] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0020] In the description of this application, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.
[0021] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another.
[0022] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., which may be used to indicate the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0023] Example 1
[0024] One aspect of this application provides an evaporation apparatus for evaporating liquid in a storage tank to maintain a stable concentration and level of the liquid in the tank. Referring to Figure 1, Figure 1 shows a schematic diagram of the evaporation apparatus in Embodiment 1 of this application.
[0025] As an application example, in some embodiments, the evaporation device 10 is used to evaporate the electroplating solution in the storage tank 20 of the substrate electroplating equipment. In the substrate electroplating process, the plated substrate needs to be cleaned within the electroplating tank to remove residual electroplating solution from its surface. During cleaning, the cleaning solution (e.g., deionized water) enters the storage tank 20 via the return line, diluting the electroplating solution and causing the liquid level in the storage tank 20 to rise, thus affecting the normal operation of the electroplating process. Therefore, measures need to be taken to effectively remove excess water from the storage tank to maintain a stable liquid level and concentration of the electroplating solution.
[0026] In an exemplary embodiment of this application, as shown in FIG1, the evaporation device 10 includes a gas supply assembly 11, a gas circulation pipeline 12, an exhaust assembly 13, a condensate drain assembly 14, and a temperature control assembly 15. The gas supply assembly 11 supplies protective gas to the liquid storage tank 20, filling the tank 20 with protective gas. The gas circulation pipeline 12 has an extraction end 121 and an exhaust end 122, which are respectively connected to the liquid storage tank 20. The exhaust assembly 13 allows gas in the liquid storage tank 20 to enter the gas circulation pipeline 12 from the extraction end 121 and return to the tank 20 from the exhaust end 122, thereby achieving gas circulation between the liquid storage tank 20 and the gas circulation pipeline 12. Exemplarily, the exhaust assembly 13 includes a fan for allowing gas in the liquid storage tank 20 to enter the gas circulation pipeline 12 from the extraction end 121 and return to the tank 20 from the exhaust end 122. It should be understood that the gas in the storage tank 20 includes at least the protective gas from the gas supply assembly 11 and gaseous water formed after the liquid in the storage tank 20 evaporates. During the circulation process, the gas can purge and evaporate the liquid in the storage tank 20, allowing excess water in the storage tank 20 to enter the gas circulation pipeline 12 in gaseous form. The condensate drain assembly 14 is installed on the gas circulation pipeline 12 and includes a cooling element 141 and a drain line 142. The cooling element 141 is used to condense the gas entering the gas circulation pipeline 12 from the extraction end 121, and the drain line 142 is used to discharge the liquid water generated after the gas is condensed. Under the condensing action of the condensate drain assembly 14, the water carried in the gas is condensed into liquid water and discharged from the gas circulation pipeline 12, thereby effectively removing excess water from the storage tank 20. The temperature control component 15 is located near the exhaust end 122 of the gas circulation pipeline 12 and is used to regulate the gas after it has been processed by the condensate drain component 14 so that the gas discharged from the exhaust end 122 returns to the storage tank 20 at a predetermined temperature.
[0027] It should be noted that the protective gas refers to a gas that will not contaminate the electroplating solution in the storage tank 20 and will not chemically react with the electroplating solution in the storage tank 20, such as nitrogen, inert gases, and other gases with relatively stable chemical properties. Optionally, in some embodiments, the protective gas includes one or more of nitrogen and inert gases. The liquid level of the electroplating solution in the storage tank 20 should generally be maintained at a preset height, and the area above the liquid level is usually mixed with air. To avoid air contamination and oxidation of the electroplating solution in the storage tank 20, optionally, in some embodiments, the gas supply component 11 continuously supplies a protective gas, such as nitrogen, into the storage tank 20, displacing the air in the storage tank 20 and maintaining a positive pressure atmosphere filled with protective gas in the storage tank 20, preventing air or other contaminants from outside the storage tank 20 from flowing back into the storage tank 20.
[0028] Optionally, as shown in Figure 1, an outlet 21 adapted to the gas supply assembly 11 can be provided on the liquid storage tank 20. Gas in the liquid storage tank 20 can be partially discharged from the outlet 21, and the gas output of the outlet 21 is adapted to the gas intake of the gas supply assembly 11, thus maintaining a positive pressure atmosphere filled with protective gas within the liquid storage tank 20. It should be noted that the function of the gas supply assembly 11 is to supply protective gas to prevent the liquid in the liquid storage tank 20 from being contaminated and oxidized by air. Therefore, after the liquid storage tank 20 is filled with nitrogen, the gas supply assembly 11 only needs to continuously supply a small amount of nitrogen to maintain a positive pressure atmosphere filled with nitrogen within the liquid storage tank 20. During gas circulation, the gas supply volume of the gas supply assembly 11 and the gas output volume of the outlet 21 are much smaller than the gas flow rate in the gas circulation pipeline 12, and will not affect the gas circulation system between the gas circulation pipeline 12 and the liquid storage tank 20.
[0029] Exemplarily, in some embodiments, the refrigeration component 141 includes a refrigerant circulation mechanism 1411, an evaporator 1412, and a condenser 1413. The refrigerant circulation mechanism 1411 includes a compressor 14111 for circulating the refrigerant between the evaporator 1412 and the condenser 1413. Optionally, the refrigerant can be a common refrigerant such as Freon or ammonia. The evaporator 1412 is disposed on the gas circulation line 12 for evaporating the refrigerant to condense the gas, and the condenser 1413 is used to absorb heat from the refrigerant in the evaporator 1412. Specifically, when the gas in the liquid storage tank 20 flows through the evaporator 1412, the low-temperature refrigerant in the evaporator 1412 evaporates to absorb heat from the gas, thereby rapidly condensing the gas, causing the moisture in the gas to turn into liquid water, which is then discharged from the drain line 142. After absorbing heat and evaporating, the refrigerant enters the condenser 1413 via the refrigerant circulation mechanism 1411. The condenser 1413 includes a heat dissipation device that can absorb heat from the refrigerant through common heat exchange methods such as air cooling. Preferably, the refrigerant circulation mechanism 1411 also includes a throttling device 14112 for throttling and depressurizing the refrigerant from the evaporator 1412 and regulating its flow rate, thereby absorbing some of the heat from the refrigerant and ensuring stable circulation of the refrigerant between the evaporator 1412 and the condenser 1413. After releasing heat in the condenser 1413, the refrigerant returns to a low-temperature state and returns to the evaporator 1412 to continue evaporating and absorbing heat from the gas. This refrigerant circulation allows the condensate drain assembly 14 to continuously condense the gas in the gas circulation line 12 and discharge any moisture carried in the gas. It should be understood that the above-described refrigeration component 141 is merely exemplary. In other possible embodiments, other types of refrigeration components may also be used to condense the gas in the gas circulation line 12.
[0030] Referring again to Figure 1, the condensed gas enters the temperature control component 15 along the gas circulation pipeline 12. The temperature control component 15 is connected to the gas circulation pipeline 12 and is used to regulate the temperature of the gas entering the storage tank 20 from the exhaust end 121, ensuring that the gas discharged from the exhaust end 122 returns to the storage tank 20 at a predetermined temperature. The temperature control component 15 can be set to a predetermined temperature according to actual process requirements. Taking substrate electroplating as an example, many factors necessitate maintaining the electroplating solution at a suitable temperature to meet the process requirements. For example, electroplating solutions typically contain additives such as leveling agents and accelerators; an unsuitable temperature may cause these additives to become ineffective, thus affecting the electroplating results. Therefore, the temperature control component 15 needs to heat or cool the gas to regulate its temperature to a predetermined level, preventing the gas from affecting the temperature of the liquid in the storage tank 20 during circulation.
[0031] Optionally, in some embodiments, the predetermined temperature can be certain temperature values. In other embodiments, the predetermined temperature can also be certain temperature ranges. In the embodiment shown in FIG1, as an example, the suitable temperature of the electroplating solution is 25°C. Accordingly, in order to avoid the gas affecting the temperature of the electroplating solution during circulation, the predetermined temperature of the gas can be set to 25°C ± 5°C. The temperature of the gas after condensation is usually much lower than 25°C. Therefore, the temperature control component 15 should include a heating device. The gas entering the temperature control component 15 is heated to the predetermined temperature and then returns to the storage tank 20 from the exhaust end 122 of the gas circulation pipeline 12. Under the suction action of the exhaust component 13, the gas returning to the storage tank 20 will purge the liquid in the storage tank 20 and re-enter the gas circulation pipeline 12 from the suction end 121 of the gas circulation pipeline 12 to realize gas circulation and remove excess moisture in the storage tank 20 during the gas circulation process.
[0032] Preferably, the gas absorbs some heat when purging the electroplating solution in the storage tank 20. Therefore, the predetermined temperature of the gas can be appropriately higher than the suitable temperature of the electroplating solution, for example, it can be set to 30°C. This not only reduces the impact of gas circulation on the temperature of the electroplating solution, but the higher temperature can also increase the evaporation rate of the evaporation device 10 to a certain extent. In addition, it should be noted that the temperature control component 15 is designed to reduce or even eliminate the adverse effects of gas circulation on the temperature of the electroplating solution. The above-mentioned setting of the predetermined temperature is only exemplary. In other possible embodiments, the suitable temperature of the electroplating solution can also be other temperatures, and the predetermined temperature can also be other suitable temperature values or temperature ranges. Those skilled in the art can set them reasonably according to the actual situation.
[0033] Using the evaporation apparatus 10 in the exemplary embodiment of this application, the gas rapidly evaporates the liquid in the storage tank 20 during circulation, thereby effectively removing moisture from the storage tank 20 and maintaining a stable concentration and level of the electroplating solution in the storage tank 20. By recycling the protective gas, the consumption of protective gas is effectively reduced, thereby maintaining a stable concentration and level of the electroplating solution in the storage tank 20 while effectively reducing production costs and making the production process more energy-efficient and environmentally friendly. Furthermore, since the storage tank 20 is always maintained at a positive pressure atmosphere filled with nitrogen, and the gas circulates at a predetermined temperature, the stability of the chemical composition of the electroplating solution in the storage tank 20 can be improved, extending the service life of the electroplating solution.
[0034] Referring again to Figure 1, in some embodiments, the evaporator 10 further includes an evaporation rate regulating component 16. The evaporation rate regulating component 16 is used to control the output power of the exhaust component 13 and / or the condensate drain component 14 to regulate the evaporation rate of the evaporator 10. Exemplarily, in some embodiments, the evaporation rate regulating component 16 includes a detection module 161 and a control module 162. The detection module 161 is used to acquire a first moisture content of the gas before it enters the condensate drain component 14, a second moisture content of the gas after it leaves the condensate drain component 14, and the gas flow rate, and sends the first moisture content, the second moisture content, and the flow rate to the control module 162. The control module 162 is used to acquire the evaporation rate of the evaporator 10 based on the difference between the first moisture content and the second moisture content and the flow rate, and to control the output power of the exhaust component 13 and / or the condensate drain component 14 to make the evaporation rate of the evaporator 10 consistent with the target evaporation rate. Optionally, in some embodiments, the detection module 161 can detect the relative humidity and temperature of the gas, and then calculate the moisture content W (in g / kg) of the gas using the relative humidity and temperature. The detection module 161 can also obtain the gas flow rate F (in kg / s). For example, at a certain moment T1, the first moisture content W1 before the gas enters the condensate drain assembly 14 and the second moisture content W2 after the gas leaves the condensate drain assembly 14 can be obtained. The evaporation rate v of the evaporation device 10 = (W2 - W1)F. The evaporation rate of the evaporation device 10 can be obtained according to the above formula. It should be understood that in other embodiments, the unit of moisture content W can also be g / m3, and correspondingly, the unit of flow rate F is m3 / s.
[0035] For example, the control module 162 can preset a target evaporation rate. When the evaporation rate of the evaporator 10 is lower than the target evaporation rate, the control module 162 can increase the output power of the exhaust assembly 13 to accelerate the gas circulation rate, thereby increasing the evaporation rate of the evaporator 10; or, the control module 162 can increase the output power of the condensate drain assembly 14 to accelerate the discharge of moisture from the gas, thereby increasing the evaporation rate of the evaporator 10. By setting the evaporation rate adjustment assembly 16, the evaporation rate of the evaporator 10 can be accurately controlled, improving the controllability and stability of the production process and better accommodating the needs of different production processes.
[0036] Furthermore, in some embodiments, as shown in FIG1, the evaporation device 10 further includes a filter assembly 17, which is disposed on the gas circulation line 12 for filtering the gas. By providing the filter assembly 17, the cleanliness of the gas during the circulation process can be further improved, thereby further protecting the cleanliness and stability of the electroplating solution in the storage tank 20.
[0037] Example 2
[0038] Embodiment 2 of this application provides an evaporation device. The main difference between the evaporation device in Embodiment 2 and the evaporation device in Embodiment 1 is that the condenser is located on the gas circulation pipeline and downstream of the evaporator, and is used to exchange heat with the condensed gas to absorb heat from the refrigerant in the evaporator.
[0039] Referring to Figure 2, which shows a schematic diagram of the evaporation device in Embodiment 2 of this application, the evaporation device 30 includes a condensate drain assembly 34 disposed on the gas circulation line 12. The condensate drain assembly 34 includes a refrigeration element 341 and a drain line 342. The refrigeration element 341 is used to condense the gas entering the gas circulation line 12 from the extraction end 121, and the drain line 342 is used to discharge the liquid water generated after the gas is condensed. The refrigeration element 341 includes a refrigerant circulation mechanism 3411, an evaporator 3412, and a condenser 3413. The refrigerant circulation mechanism 3411 is used to circulate the refrigerant between the evaporator 3412 and the condenser 3413. The evaporator 3412 is used to evaporate the refrigerant to condense the gas. The condenser 3413 is used to absorb heat from the refrigerant in the evaporator 3412. The condenser 3413 is located on the gas circulation line 12 and downstream of the evaporator 3412. It exchanges heat with the condensed gas to absorb heat from the refrigerant in the evaporator 3412. In the evaporator 3412, after heat exchange with the gas in the gas circulation line 12, the refrigerant enters the condenser 3413 at a high temperature, while the gas in the gas circulation line 12 remains at a low temperature. Therefore, placing the condenser 3413 on the gas circulation line 12 allows for heat exchange between the low-temperature gas in the gas circulation line 12 and the high-temperature refrigerant in the condenser 3413.
[0040] Furthermore, as mentioned above, the temperature control component 15 is used to regulate the temperature of the gas returning from the exhaust end 122 to the storage tank 20, ensuring that the gas discharged from the exhaust end 122 returns to the storage tank 20 at a predetermined temperature. After the low-temperature gas in the gas circulation pipeline 12 exchanges heat with the high-temperature refrigerant in the condenser 3413, the gas temperature will rise, typically exceeding the predetermined temperature. Therefore, in this second embodiment, the temperature control component 15 should include a cooling device to adjust the temperature of the gas returning from the exhaust end 122 to the storage tank 20 to the predetermined temperature. The cooling device can absorb heat from the gas through common heat exchange methods such as liquid cooling or air cooling to lower the gas temperature. It should be understood that for substrate electroplating processes, the suitable process temperature of the electroplating solution is usually above 25°C, such as 25°C or 35°C. Correspondingly, the predetermined temperature set by the temperature control component 15 should also be close to the suitable process temperature of the electroplating solution, and the cooling range of the cooling device is usually not very large. Compared to directly heating the condensed gas in Example 1, the evaporator 30 in Example 2 can recover and utilize the heat generated during the operation of the refrigeration unit 341, and use the condensed gas to cool the refrigerant. This not only heats the low-temperature gas but also assists the heat dissipation device in cooling the refrigerant, making it more energy-efficient and environmentally friendly. In applications requiring higher electroplating solution temperatures, the energy-saving and environmental advantages of the evaporator 30 in Example 2 are even more pronounced.
[0041] Example 3
[0042] This application provides a substrate electroplating apparatus according to Embodiment 3. Referring to FIG3, FIG3 shows a schematic diagram of the structure of the substrate electroplating apparatus 40 according to Embodiment 3. The substrate electroplating apparatus 40 includes an electroplating tank 41, a liquid storage tank 20, and an evaporation device 10 as described in Embodiment 1 of this application. Optionally, in other possible embodiments, the substrate electroplating apparatus 40 may also include the evaporation device 30 as described in Embodiment 2 of this application.
[0043] As shown in Figure 3, a supply line 42 and a return line 43 are provided between the electroplating tank 41 and the storage tank 20 to circulate the electroplating solution between them. The electroplating solution in the storage tank 20 enters the electroplating tank 41 via the supply line 42 and returns to the storage tank 20 via the return line 43. In the substrate electroplating process, the plated substrate needs to be cleaned in the electroplating tank 41 to remove residual electroplating solution from its surface. During the cleaning process, the cleaning solution (e.g., deionized water) enters the storage tank 20 via the return line 43, diluting the electroplating solution in the storage tank 20 and causing the liquid level in the storage tank 20 to rise, thus affecting the normal operation of the electroplating process.
[0044] Referring again to Figure 3, optionally, in some embodiments, the liquid storage tank 20 includes a main tank 201 and a secondary tank 202 that are interconnected, and the evaporation device 10 is disposed on the secondary tank 202. The substrate electroplating equipment 40 includes a main body and auxiliary equipment. The main tank 201 is located inside the main body, and the secondary tank 202 is located outside the main body and is considered auxiliary equipment. The electroplating solution circulates within the main tank 201 and the secondary tank 202. The evaporation device 10 evaporates the electroplating solution in the secondary tank 202 to concentrate the electroplating solution within the secondary tank 202, thereby removing excess water from the electroplating solution and maintaining the stability of the concentration and level of the electroplating solution in the main tank 201. Those skilled in the art will understand that semiconductor equipment is a highly integrated device, and the installation space inside its main body is very limited. In some embodiments of this application, by designing the liquid storage tank 20 as a main tank 201 and a secondary tank 202, the evaporation device 10 and the secondary tank 202 are placed outside the main body of the machine, without occupying the internal space of the main body of the machine, making the installation and maintenance of the evaporation device 10 more flexible.
[0045] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.
Claims
1. An evaporation apparatus for evaporating liquid in a storage tank, characterized in that, include: A gas supply assembly is used to supply protective gas into the liquid storage tank, so that the liquid storage tank is in the atmosphere of the protective gas. A gas circulation pipeline has an extraction end and an exhaust end, which are respectively connected to the liquid storage tank; An exhaust assembly is used to allow gas in the liquid storage tank to enter the gas circulation pipeline from the suction end and return to the liquid storage tank from the exhaust end. A condensate drain assembly, comprising a cooling element and a drain line, wherein the cooling element is used to condense the gas entering the gas circulation line from the extraction end, and the drain line is used to discharge the liquid water generated after the gas is condensed; and A temperature control component is used to regulate the gas after it has been processed by the condensate draining component, so that the gas discharged from the exhaust end returns to the storage tank at a predetermined temperature.
2. The evaporation apparatus according to claim 1, characterized in that, The refrigeration components include a refrigerant circulation mechanism, an evaporator, and a condenser; The refrigerant circulation mechanism is used to circulate the refrigerant between the evaporator and the condenser; The evaporator is located on the gas circulation pipeline and is used to evaporate the refrigerant to condense the gas. The condenser is used to absorb heat from the refrigerant in the evaporator.
3. The evaporation apparatus according to claim 2, characterized in that, The condenser is located on the gas circulation pipeline and downstream of the evaporator, and is used to exchange heat with the condensed gas to absorb heat from the refrigerant in the evaporator.
4. The evaporation apparatus according to claim 1, characterized in that, It also includes a filter assembly disposed on the gas circulation line for filtering the gas.
5. The evaporation apparatus according to claim 1, characterized in that, It also includes an evaporation rate regulating component, which is used to control the output power of the exhaust component and / or the condensate drain component to regulate the evaporation rate of the evaporation device.
6. The evaporation apparatus according to claim 5, characterized in that, The evaporation rate regulating component includes a detection module and a control module. The detection module is used to obtain the first moisture content of the gas before it enters the condensate draining assembly, the second moisture content of the gas after it exits the condensate draining assembly, and the flow rate of the gas, and sends the first moisture content, the second moisture content, and the flow rate to the control module. The control module is used to obtain the evaporation rate of the evaporation device based on the difference between the first moisture content and the second moisture content and the flow rate, and to control the output power of the exhaust assembly and / or the condensate drainage assembly so that the evaporation rate is consistent with the target evaporation rate.
7. The evaporation apparatus according to claim 1, characterized in that, The protective gas includes one or more of nitrogen and inert gases.
8. A substrate electroplating apparatus, characterized in that, It includes an electroplating tank, a liquid storage tank, and an evaporation apparatus according to any one of claims 1 to 7.
9. The substrate electroplating equipment according to claim 8, characterized in that, The liquid storage tank includes a main tank and a secondary tank that are interconnected, and the evaporation device is installed on the secondary tank.