Laser module and aerosol-generating device

Abstract

A laser module (100) and an aerosol-generating device (1000). The laser module (100) is applied in the aerosol-generating device (1000). The laser module (100) comprises a chip (10), an electrode layer (20), a heat dissipation member (30) and an insulating member (40), wherein the chip (10) is configured to emit laser light; the electrode layer (20) comprises a positive electrode (21) and a negative electrode (22) which are arranged spaced apart from each other, and both the positive electrode (21) and the negative electrode (22) are electrically connected to the chip (10); the heat dissipation member (30) is arranged on one side of the chip (10); and the insulating member (40) isolates the electrode layer (20) from the heat dissipation member (30) and is thermally connected to the heat dissipation member (30).

Description

Laser module and aerosol generation device

[0001] Priority information

[0002] This application claims priority and benefits to patent application No. 202520460331.7, filed with the China National Intellectual Property Administration on March 14, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of atomization technology, and more particularly to a laser module and an aerosol generating device. Background Technology

[0004] An aerosol generating device is a small device that uses heating without combustion technology to act on an aerosol generating matrix and produce aerosols. Specifically, an aerosol generating device typically heats the aerosol generating matrix to a temperature that is sufficient to produce aerosols but not hot enough to burn, thus allowing the aerosol generating matrix to produce aerosols for users to inhale without combustion.

[0005] Currently, laser chips are generally used to emit lasers to heat aerosol-generated products. During laser emission, the laser chip generates a large amount of heat, causing its temperature to rise and reducing its emission efficiency. Therefore, heat sinks are used to absorb the residual heat and cool the laser chip. In related technologies, the surface of the laser chip in contact with the heat sink becomes charged, causing the heat sink to become charged, which in turn affects the operation of the entire hardware system. Summary of the Invention

[0006] This application provides a laser module and an aerosol generating apparatus.

[0007] The laser module of this application is used in an aerosol generating device. The laser module includes a chip, an electrode layer, a heat sink, and an insulating component. The chip is used to emit laser light. The electrode layer includes a positive electrode and a negative electrode that are spaced apart. Both the positive electrode and the negative electrode are electrically connected to the chip. The heat sink is disposed on one side of the chip. The insulating component isolates the electrode layer and the heat sink and is thermally connected to the heat sink.

[0008] In the laser module of this application embodiment, the electrode layer can supply power to the chip, enabling the chip to emit laser. The heat sink can absorb the heat generated by the chip when emitting laser, which is beneficial to improving the heat dissipation efficiency of the laser module. In addition, the heat sink and the electrode layer are isolated by an insulating component, so that the heat sink is not charged, thereby reducing the impact on the hardware system.

[0009] In some embodiments, the insulating element includes an insulating substrate, an electrode layer and a heat sink are respectively disposed on both sides of the insulating substrate in the thickness direction, and the chip and the electrode layer are disposed on the same side of the insulating substrate.

[0010] In this way, the insulating substrate can act as an insulator, preventing current from flowing from the electrode layer to the heat sink.

[0011] In some implementations, the laser module includes a thermally conductive layer that connects an insulating substrate and a heat sink.

[0012] In this way, the heat-conducting layer can play a role in conducting heat, which helps to improve heat dissipation efficiency.

[0013] In some embodiments, both the negative and positive electrodes are disposed on the surface of an insulating substrate, and the chip includes a first electrode and a second electrode facing away from each other. The first electrode is connected to the positive electrode via a lead, and the chip is disposed on the negative electrode via the second electrode.

[0014] This allows the chip and electrode layer to be on the same side of the insulating substrate, and enables both the positive and negative electrodes to be electrically connected to the chip.

[0015] In some embodiments, the insulating component includes an insulating substrate and an insulating layer, wherein the insulating substrate, the electrode layer, the insulating layer and the heat sink are stacked in sequence, and the chip is located on the side of the insulating substrate away from the electrode layer.

[0016] In this way, the insulating layer can act as an insulator, preventing current from flowing from the electrode layer to the heat sink.

[0017] In some embodiments, the laser module includes a first conductive layer, the first conductive layer and the chip are disposed on the same side of an insulating substrate, the first conductive layer includes a first conductive portion and a second conductive portion, the first conductive portion is electrically connected to a positive electrode, the second conductive portion is electrically connected to a negative electrode, the chip includes a first electrode and a second electrode opposite to each other, the first electrode is connected to the first conductive portion through a lead, and the chip is disposed on the second conductive portion through the second electrode.

[0018] In this way, the current of the electrode layer can be conducted to the chip through the first conductive layer, realizing the electrical connection between the positive and negative electrodes and the chip.

[0019] In some embodiments, the laser module includes a second conductive layer disposed between the electrode layer and the insulating substrate, and the electrode layer is electrically connected to the first conductive layer through the second conductive layer.

[0020] In this way, the current of the electrode layer can be conducted to the first conductive layer through the second conductive layer, realizing the electrical connection between the first conductive layer and the electrode layer.

[0021] In some embodiments, an insulating substrate is formed through a via along its thickness direction, and a conductive material is disposed in the via, the conductive material connecting the first conductive layer and the second conductive layer.

[0022] In this way, the first conductive layer and the second conductive layer are electrically connected through the conductive material in the via, which can improve the stability of the electrical connection performance between the first conductive layer and the second conductive layer.

[0023] In some embodiments, there are multiple chips connected in parallel to form a light-emitting unit. There are multiple light-emitting units connected in series. The electrode layer includes a negative electrode and at least one positive electrode. At least one light-emitting unit is connected in series between the negative electrode and the positive electrode.

[0024] In this way, multiple chips connected in parallel can make them independent of each other, which can reduce the impact of one chip failure on other chips. By selectively connecting the negative electrode to at least one of the positive electrodes, different light-emitting units can be controlled to emit lasers, which is beneficial to realize the separate control of multiple light-emitting units.

[0025] The aerosol generating apparatus of this application includes a laser module and a housing, the housing forming a receiving cavity, and the laser module disposed within the receiving cavity.

[0026] In this way, the heat sink and electrode layer of the laser module are isolated by an insulating component, so that the heat sink is not charged, thereby reducing the impact on the hardware system of the aerosol generation device.

[0027] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0028] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, wherein:

[0029] Figure 1 is a schematic diagram of the structure of a laser module according to one embodiment of this application;

[0030] Figure 2 is a schematic diagram of the structure of a laser module according to one embodiment of this application;

[0031] Figure 3 is a schematic diagram of the structure of the electrode layer according to an embodiment of this application;

[0032] Figure 4 is a schematic diagram of the structure of a laser module according to another embodiment of this application;

[0033] Figure 5 is a schematic diagram of the structure of a laser module according to another embodiment of this application;

[0034] Figure 6 is a schematic diagram of the structure of the first conductive layer according to an embodiment of this application;

[0035] Figure 7 is a schematic diagram of the connection between the chip and the electrode layer according to an embodiment of this application;

[0036] Figure 8 is a schematic diagram of the aerosol generating apparatus according to an embodiment of this application.

[0037] Explanation of reference numerals in the attached drawings: 100, laser module; 10, chip; 11, first electrode; 12, second electrode; 13, lead wire; 14, light-emitting unit; 20, electrode layer; 21, positive electrode; 22, negative electrode; 23, first positive electrode; 24, second positive electrode; 25, third positive electrode; 26, fourth positive electrode; 30, heat sink; 40, insulating component; 41, insulating substrate; 42, insulating layer; 43, via; 50, thermally conductive layer; 60, first conductive layer; 61, first conductive part; 62, second conductive part; 70, second conductive layer; 80, cover plate; 200, housing; 210, receiving cavity; 1000, aerosol generating device. Embodiments of the present invention

[0038] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0039] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0040] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0042] The following disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0043] Please refer to Figures 1-3. The laser module 100 of this application embodiment is used in the aerosol generating device 1000. The laser module 100 includes a chip 10, an electrode layer 20, a heat sink 30, and an insulating component 40. The chip 10 is used to emit laser light. The electrode layer 20 includes a positive electrode 21 and a negative electrode 22 that are spaced apart. Both the positive electrode 21 and the negative electrode 22 are electrically connected to the chip 10. The heat sink 30 is disposed on one side of the chip 10. The insulating component 40 isolates the electrode layer 20 and the heat sink 30 and is thermally connected to the heat sink 30.

[0044] In the laser module 100 of this application embodiment, the electrode layer 20 can supply power to the chip 10, enabling the chip 10 to emit laser. The heat sink 30 can absorb the heat generated by the chip 10 when emitting laser, which is beneficial to improving the heat dissipation efficiency of the laser module 100. In addition, the heat sink 30 and the electrode layer 20 are isolated by an insulating component 40, so that the heat sink 30 is not charged, thereby reducing the impact on the hardware system.

[0045] Specifically, chip 10 can be a vertical-cavity surface-emitting laser (VCSEL) chip. VCSEL chips generally use semiconductor materials, and their emission wavelength is typically limited by the material's bandgap. The ideal wavelength range for heating is 780-1100nm in the near-infrared to infrared band. VCSEL chips can be gallium arsenide or indium phosphide chips, with photoelectric conversion efficiencies generally between 30% and 70%. Furthermore, VCSEL chips can achieve maximum photoelectric conversion efficiency at specific temperatures through epitaxial design. VCSEL chips also offer advantages such as high reliability at high temperatures, more competitive pricing compared to edge-emitting chips, moderate beam quality, and better suitability for microstructures.

[0046] The electrode layer 20 can be a copper layer. The positive electrode 21 and the negative electrode 22 are traced by copper plating, so that the current from the external power supply can be conducted to the chip 10, enabling the chip 10 to emit laser. The positive electrode 21 and the negative electrode 22 can be separated by insulating materials such as ink.

[0047] The heat sink 30 can be made of a material with high thermal conductivity and high heat melt flow, such as aluminum, aluminum alloy, copper, or copper alloy. The size of the heat sink 30 can be greater than or equal to the size of the insulating component 40.

[0048] The insulating component 40 can be made of insulating and high thermal conductivity material. The insulating component 40 can be a single-layer structure or a multi-layer structure. The multi-layer structures can be fixed by bonding or integrally molded.

[0049] Referring to Figure 1, in some embodiments, the insulating element 40 includes an insulating substrate 41, the electrode layer 20 and the heat sink 30 are respectively disposed on both sides of the insulating substrate 41 in the thickness direction, and the chip 10 and the electrode layer 20 are disposed on the same side of the insulating substrate 41.

[0050] Thus, the insulating substrate 41 can serve as an insulator, preventing current from flowing from the electrode layer 20 to the heat sink 30.

[0051] Specifically, the insulating substrate 41 can be a ceramic substrate, and the material of the ceramic substrate includes one or any combination of aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride. The ceramic substrate can provide insulation while also conducting heat, transferring the heat generated by the chip 10 to the heat sink 30.

[0052] The electrode layer 20 can be formed by plating copper on the surface of the insulating substrate 41 away from the heat sink 30.

[0053] Please refer to Figure 1. In some embodiments, the laser module 100 includes a thermally conductive layer 50, which connects the insulating substrate 41 and the heat sink 30.

[0054] Thus, the heat-conducting layer 50 can play a role in conducting heat, which helps to improve heat dissipation efficiency.

[0055] Specifically, the thermally conductive layer 50 can be a metal layer, such as a copper layer or a silver layer. The thermally conductive layer 50 can be formed by plating copper on the surface of the insulating substrate 41 facing the heat sink 30. The thermally conductive layer 50 can be fixedly connected to the heat sink 30 by solder paste or silver paste, thereby improving the connection stability between the insulating substrate 41 and the heat sink 30 while conducting heat.

[0056] Please refer to Figures 1 and 2. In some embodiments, both the negative electrode 22 and the positive electrode 21 are disposed on the surface of the insulating substrate 41. The chip 10 includes a first electrode 11 and a second electrode 12 that are opposite to each other. The first electrode 11 is connected to the positive electrode 21 through a lead 13, and the chip 10 is disposed on the negative electrode 22 through the second electrode 12.

[0057] In this way, the chip 10 and the electrode layer 20 are on the same side of the insulating substrate 41, and both the positive electrode 21 and the negative electrode 22 can be electrically connected to the chip 10.

[0058] Specifically, the chip 10 may include a first surface and a second surface disposed opposite to each other along the thickness direction. A first electrode 11 is disposed on the first surface, and a second electrode 12 is disposed on the second surface. A lead 13 connects the positive electrode 21 and the first surface so that the first electrode 11 is connected to the positive electrode 21. The second surface may be fixed to the negative electrode 22 by silver paste so that the second electrode 12 is connected to the negative electrode 22.

[0059] Please refer to Figure 4. In some embodiments, the insulating component 40 includes an insulating substrate 41 and an insulating layer 42. The insulating substrate 41, the electrode layer 20, the insulating layer 42 and the heat sink 30 are stacked in sequence, and the chip 10 is located on the side of the insulating substrate 41 away from the electrode layer 20.

[0060] Thus, the insulating layer 42 can serve as an insulator, preventing current from flowing from the electrode layer 20 to the heat sink 30.

[0061] Specifically, the insulating substrate 41 can be a ceramic substrate, and the material of the ceramic substrate includes one or any combination of aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride. The ceramic substrate can provide insulation while also conducting heat, transferring the heat generated by the chip 10 to the heat sink 30.

[0062] The insulating layer 42 can be made of an insulating material with high thermal conductivity. The materials used for the insulating substrate 41 and the insulating layer 42 can be the same or different. The electrode layer 20 can be formed by plating copper on the surface of the insulating layer 42 away from the heat sink 30.

[0063] Please refer to Figures 4-6. In some embodiments, the laser module 100 includes a first conductive layer 60. The first conductive layer 60 and the chip 10 are disposed on the same side of the insulating substrate 41. The first conductive layer 60 includes a first conductive portion 61 and a second conductive portion 62. The first conductive portion 61 is electrically connected to the positive electrode 21, and the second conductive portion 62 is electrically connected to the negative electrode 22. The chip 10 includes a first electrode 11 and a second electrode 12 facing away from each other. The first electrode 11 is connected to the first conductive portion 61 through a lead 13, and the chip 10 is disposed on the second conductive portion 62 through the second electrode 12.

[0064] In this way, the current of the electrode layer 20 can be conducted to the chip 10 through the first conductive layer 60, so that the positive electrode 21 and the negative electrode 22 are electrically connected to the chip 10.

[0065] Specifically, the first conductive layer 60 can be a metal layer, such as a copper layer or a silver layer. Copper can be plated onto the surface of the insulating substrate 41 facing the chip 10 to form a spaced-apart first conductive portion 61 and a second conductive portion 62. The first conductive portion 61 and the second conductive portion 62 can be insulated from each other using an insulating material such as ink. The second electrode 12 of the chip 10 can be fixed to the second conductive portion 62 using silver paste.

[0066] Referring to Figure 4, in some embodiments, the laser module 100 includes a second conductive layer 70, which is disposed between the electrode layer 20 and the insulating substrate 41. The electrode layer 20 is electrically connected to the first conductive layer 60 through the second conductive layer 70.

[0067] Thus, the current in the electrode layer 20 can be conducted to the first conductive layer 60 through the second conductive layer 70, thereby achieving an electrical connection between the first conductive layer 60 and the electrode layer 20.

[0068] Specifically, the second conductive layer 70 can be a metal layer, such as a copper layer or a silver layer. The first conductive layer 60 and the second conductive layer 70 can be made of the same material or different materials. The second conductive layer 70 and the electrode layer 20 can be fixedly connected by solder.

[0069] The traces of the first conductive layer 60 correspond to the traces of the second conductive layer 70. For example, the second conductive layer 70 includes a third conductive portion and a fourth conductive portion. The traces of the third conductive portion are the same as the traces of the first conductive portion 61, and the traces of the fourth conductive portion are the same as the traces of the second conductive portion 62. The positive electrode 21 is electrically connected to the first conductive portion 61 through the third conductive portion, and the negative electrode 22 is electrically connected to the second conductive portion 62 through the fourth conductive portion.

[0070] Copper can be plated on the surface of the insulating substrate 41 away from the chip 10 to form a third conductive part and a fourth conductive part that are spaced apart. The third conductive part and the fourth conductive part can be insulated and separated by an insulating material such as ink.

[0071] Referring to Figure 4, in some embodiments, an insulating substrate 41 is formed through a via 43 along the thickness direction. A conductive material is disposed in the via 43, and the conductive material connects the first conductive layer 60 and the second conductive layer 70.

[0072] Thus, the first conductive layer 60 and the second conductive layer 70 are electrically connected through the conductive material in the via 43, which can improve the stability of the electrical connection performance between the first conductive layer 60 and the second conductive layer 70.

[0073] Specifically, the shape, size, number, and arrangement of vias 43 can be designed according to actual needs. There can be multiple vias 43, with some vias 43 connecting the first conductive part 61 and the third conductive part, and the remaining vias 43 connecting the second conductive part 62 and the fourth conductive part.

[0074] In one embodiment, the first conductive layer 60 and the electrode layer 20 are respectively disposed on both sides of the insulating substrate 41. The insulating substrate 41 is formed through a via 43 along the thickness direction. The via 43 is provided with conductive material, and the conductive material connects the first conductive layer 60 and the electrode layer 20.

[0075] Referring to Figure 4, in some embodiments, the laser module 100 includes a heat-conducting layer 50 disposed between the insulating layer 42 and the heat sink 30.

[0076] Thus, the heat-conducting layer 50 can play a role in conducting heat, which helps to improve heat dissipation efficiency.

[0077] Specifically, the thermally conductive layer 50 can be a metal layer, such as a copper layer or a silver layer. The thermally conductive layer 50 can be formed by plating copper on the back side of the insulating layer 42 facing the heat sink 30. The thermally conductive layer 50 can be fixedly connected to the heat sink 30 by solder paste or silver paste, which improves the connection stability between the insulating layer 42 and the heat sink 30 while conducting heat.

[0078] Referring to Figures 1 and 4, in some embodiments, the laser module 100 includes a cover plate 80 that covers the chip 10, with the positive electrode 21 and the negative electrode 22 located at least partially outside the cover plate 80.

[0079] In this way, the cover plate 80 can encapsulate and protect the chip 10, reducing contamination caused by the external environment and thus minimizing the impact on the luminous efficiency and reliability of the chip 10. The positive electrode 21 and the negative electrode 22 are at least partially located on the outside of the cover plate 80, facilitating connection of the positive electrode 21 and the negative electrode 22 to an external power supply.

[0080] Specifically, the cover plate 80 can be made of a high-transmittance material, such as epoxy resin-based material. Epoxy resin-based material is directly encapsulated on the surface of the chip 10, forming a sealed, small-scale, hermetically sealed structure after curing. This not only ensures non-contact heating of the aerosol-generated product by the laser, but also prevents aerosols, other organic matter, and particles formed by the atomization of the aerosol-generated product from contaminating the light-emitting surface of the chip 10, thus avoiding a decrease in the light output power or affecting the reliability of the chip 10. Simultaneously, it significantly improves the duty cycle of the chip 10, enabling it to operate in quasi-continuous (QCW) or continuous (CW) mode with a duty cycle of not less than 5%. The quasi-continuous (QCW) mode is a mode between pulsed mode and continuous (CW) mode. Of course, the cover plate 80 can also be other non-epoxy resin-based curable transparent optical materials, such as polyimide (PI), polymethyl methacrylate (PMMA), polycarbonate (PC), etc.

[0081] When the chip 10 is disposed on the electrode layer 20, part of the positive electrode 21 and part of the negative electrode 22 are located inside the cover plate 80, the remaining positive electrode 21 and the remaining negative electrode 22 are located outside the cover plate 80, and all the leads 13 and all the chips 10 are located inside the cover plate 80.

[0082] When the chip 10 is electrically connected to the electrode layer 20 through the first conductive layer 60 and the second conductive layer 70, the positive electrode 21 and the negative electrode 22 are all located outside the cover plate 80. Along the thickness direction of the first conductive layer 60, part of the positive electrode 21 and part of the negative electrode 22 are located in the area corresponding to the cover plate 80, and the remaining positive electrode 21 and the remaining negative electrode 22 are located outside the area corresponding to the cover plate 80.

[0083] When there are multiple positive electrodes 21 and negative electrodes 22, "partial positive electrode 21" refers to a portion of each positive electrode 21, and "remaining positive electrode 21" refers to the remaining portion of each positive electrode 21. Similarly, "partial negative electrode 22" refers to a portion of each negative electrode 22, and "remaining negative electrode 22" refers to the remaining portion of each negative electrode 22.

[0084] Referring to Figure 2, in some embodiments, there are multiple chips 10, and multiple chips 10 are connected in parallel to form light-emitting units 14. There are multiple light-emitting units 14, and multiple light-emitting units 14 are connected in series. The electrode layer 20 includes a negative electrode 22 and at least one positive electrode 21, and at least one light-emitting unit 14 is connected in series between the negative electrode 22 and the positive electrode 21.

[0085] Thus, the parallel connection of multiple chips 10 makes them independent of each other, which can reduce the impact of a failure of one chip 10 on the other chips 10. When the negative electrode 22 is selectively connected to at least one of the positive electrodes 21, different light-emitting units 14 can be controlled to emit lasers, which is beneficial to realize the separate control of multiple light-emitting units 14.

[0086] Referring to Figure 7, in one embodiment, four chips 10 are connected in parallel in one light-emitting unit 14, and the number of light-emitting units 14 is 6. The number of positive electrodes 21 is 4, namely the first positive electrode 23, the second positive electrode 24, the third positive electrode 25, and the fourth positive electrode 26. The first positive electrode 23 and the second positive electrode 24 are located on one side of the negative electrode 22, and the third positive electrode 25 and the fourth positive electrode 26 are located on the other side of the negative electrode 22. Three light-emitting units 14 are connected in series between the first positive electrode 23 and the negative electrode 22, that is, one light-emitting unit 14 is connected between the first positive electrode 23 and the second positive electrode 24, and two light-emitting units 14 are connected in series between the second positive electrode 24 and the negative electrode 22. Three light-emitting units 14 are connected in series between the fourth positive electrode 26 and the negative electrode 22, that is, two light-emitting units 14 are connected in series between the third positive electrode 25 and the negative electrode 22, and one light-emitting unit 14 is connected between the third positive electrode 25 and the fourth positive electrode 26.

[0087] The negative electrode 22 can be connected to the first positive electrode 23 or the second positive electrode 24, or to the third positive electrode 25 or the fourth positive electrode 26, or simultaneously connected to one of the first positive electrode 23 and the second positive electrode 24, or one of the third positive electrode 25 and the fourth positive electrode 26.

[0088] Please refer to Figure 8. The aerosol generating apparatus 1000 of this application embodiment includes a laser module 100 and a housing 200. The housing 200 forms a receiving cavity 210, and the laser module 100 is disposed in the receiving cavity 210.

[0089] Thus, the heat sink 30 and the electrode layer 20 of the laser module 100 are isolated by the insulating component 40, so that the heat sink 30 is not charged, thereby reducing the impact on the hardware system of the aerosol generating device 1000.

[0090] Specifically, the aerosol generating device 1000 is a structure capable of generating aerosols by acting on an aerosol generating matrix (not shown) through resistance heating, electromagnetic heating, microwave heating, laser irradiation, infrared light irradiation, ultrasound, or mechanical vibration. The aerosol generating matrix is ​​a plant leaf product that has been treated and heated to produce aerosols. The aerosol generating matrix can be in a fully solid or semi-solid state. When the aerosol generating matrix is ​​fully solid, it can be prepared using processes such as rolling, slurry preparation, die casting, or extrusion. The aerosol generating matrix can be a cylindrical structure similar to a cigarette pack, or it can be a sheet-like, strip-like, or block-like structure.

[0091] Aerosol generating matrix is ​​atomized by heating to form aerosols. Aerosols can be visible or invisible and may include vapors (e.g., fine particulate matter in a gaseous state, which are typically liquid or solid at room temperature) as well as liquid droplets of gas and condensed vapor. Users can inhale aerosols into their mouth, nasal cavity, or lungs through their mouth or nose. Aerosols inhaled into the user's respiratory system can be used for various purposes such as food, medicine, and health care.

[0092] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with the described embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0093] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A laser module for an aerosol-generating device, the laser module comprising: The laser module comprises: a chip for emitting laser light; an electrode layer comprising a positive electrode and a negative electrode arranged at intervals, both of which are electrically connected to the chip; a heat dissipation member arranged on one side of the chip; and an insulating member insulating the electrode layer and the heat dissipation member and being in thermal conduction connection with the heat dissipation member.

2. The laser module of claim 1, wherein, The insulating member comprises an insulating substrate, and the electrode layer and the heat dissipation member are arranged on both sides of the insulating substrate in the thickness direction, and the chip and the electrode layer are arranged on the same side of the insulating substrate.

3. The laser module of claim 2, wherein, The laser module comprises a thermal conduction layer connecting the insulating substrate and the heat dissipation member.

4. The laser module of claim 2, wherein, Both the negative electrode and the positive electrode are arranged on the surface of the insulating substrate, the chip comprises a first electrode and a second electrode facing away from each other, the first electrode is connected to the positive electrode through a lead wire, and the chip is arranged on the negative electrode through the second electrode.

5. The laser module of claim 1, wherein, The insulating member comprises an insulating substrate and an insulating layer, and the insulating substrate, the electrode layer, the insulating layer and the heat dissipation member are sequentially stacked, and the chip is located on the side of the insulating substrate away from the electrode layer.

6. The laser module of claim 5, wherein, The laser module comprises a first conductive layer, the first conductive layer and the chip are arranged on the same side of the insulating substrate, the first conductive layer comprises a first conductive part and a second conductive part, the first conductive part is electrically connected to the positive electrode, the second conductive part is electrically connected to the negative electrode, the chip comprises a first electrode and a second electrode facing away from each other, the first electrode is connected to the first conductive part through a lead wire, and the chip is arranged on the second conductive part through the second electrode.

7. The laser module of claim 6, wherein, The laser module comprises a second conductive layer arranged between the electrode layer and the insulating substrate, and the electrode layer is electrically connected through the second conductive layer and the first conductive layer.

8. The laser module of claim 7, wherein, The insulating substrate is formed with a via hole in the thickness direction, the via hole is provided with a conductive material, and the conductive material connects the first conductive layer and the second conductive layer.

9. The laser module of claim 1, wherein, The number of the chips is multiple, and the multiple chips are connected in parallel to form a light emitting unit, the number of the light emitting units is multiple, and the multiple light emitting units are connected in series, the electrode layer comprises one negative electrode and at least one positive electrode, and at least one light emitting unit is connected in series between the negative electrode and one positive electrode.

10. An aerosol-generating device comprising: The laser module comprises: the laser module of any one of claims 1-9; a housing forming a containing cavity, and the laser module is arranged in the containing cavity.

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