Aerosol generating apparatus and microwave heating assembly therefor

WO2026189223A1PCT designated stage Publication Date: 2026-09-17SMOORE INTERNATIONAL HOLDINGS LIMITED +1
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Patent Information

Application Number
PCT/CN2026/081444
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-13
Filing Date
2026-03-04
Publication Date
2026-09-17

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Abstract

An aerosol generation apparatus (100) and a microwave heating assembly therefor. The microwave heating assembly comprises: an outer conductor (21); a microwave feeding unit (30) mounted on the outer conductor (21); a heat dissipation structure (40) connected to the outer conductor (21), extending in the axial direction of the outer conductor (21), and integrally formed with the outer conductor (21); and a microwave generation unit (50) connected to the microwave feeding unit (30) and provided on the heat dissipation structure (40), to dissipate heat by means of the heat dissipation structure (40). The arrangement optimizes the layout of components in the aerosol generating apparatus (100), makes the structure more compact, and facilitates the miniaturization design of the aerosol generating apparatus (100). Additionally, the heat dissipation structure (40) and the outer conductor (21) are integrally formed, thereby simplifying the disassembly and assembly process and reducing the risk of microwave leakage from a gap.
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Description

Aerosol generating device and its microwave heating component Technical Field

[0001] This invention relates to the field of aerosol generation technology, and more particularly to an aerosol generating device and its microwave heating component. Background Technology

[0002] Currently, most aerosol generating devices on the market employ heated non-combustible (HNC) technology. This technology uses a heat source to heat the aerosol-generating matrix, typically operating at temperatures between 250℃ and 350℃. Compared to conventional combustion heating methods, HNC significantly reduces the release of harmful substances from the aerosol-generating matrix while preserving traditional flavor. Another heating method, microwave heating, also exists. Microwave heating offers the advantages of rapid heating and fast aerosol generation. Microwave-heated aerosol generating devices are generally based on the quarter-wavelength coaxial resonant cavity principle. The heating cavity forms an electromagnetic resonance within a frequency range of 2.4GHz to 2.5GHz. The aerosol-generating matrix absorbs electromagnetic energy and rapidly heats up, thus generating aerosols.

[0003] In related technologies, aerosol generating devices that use microwave heating typically have separate outer conductors and heat dissipation structures for cooling the microwave generating unit. This not only makes the aerosol generating device cumbersome to disassemble and assemble and hinders the miniaturization design of the aerosol generating device, but also makes it easy for gaps to exist between the two, leading to microwave leakage. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a microwave heating assembly, comprising:

[0005] outer conductor;

[0006] A microwave feed unit is mounted on the outer conductor;

[0007] A heat dissipation structure is connected to the outer conductor, extends along the axial direction of the outer conductor, and is integrally formed with the outer conductor;

[0008] A microwave generating unit is connected to the microwave feeding unit and is disposed on the heat dissipation structure for heat dissipation.

[0009] In some embodiments, a cavity is formed inside the outer conductor, and the outer conductor includes an opening communicating with the cavity and a support wall disposed opposite to the opening;

[0010] One end of the heat dissipation structure is connected to the support wall and extends away from the opening.

[0011] In some embodiments, the heat dissipation structure has a first receiving groove, and the microwave generating unit is housed in the first receiving groove.

[0012] In some embodiments, the heat dissipation structure includes a bottom wall extending along the axial direction of the outer conductor and two side walls disposed on two opposite sides of the bottom wall, the bottom wall and the two side walls defining the first receiving groove;

[0013] A second receiving groove is provided on the bottom wall, which is used to receive functional components.

[0014] In some embodiments, the microwave heating assembly further includes a temperature sensing structure, the temperature sensing structure including a temperature sensing lead extending from the outer conductor.

[0015] In some embodiments, the microwave heating assembly further includes a shielding structure that isolates the temperature sensing lead and the microwave generating unit, the shielding structure and the heat dissipation structure working together to define an electromagnetic shielding cavity.

[0016] In some embodiments, the microwave heating assembly includes a control board disposed on the side of the shielding structure opposite to the microwave generating unit;

[0017] The temperature measuring lead is connected to the control board.

[0018] In some embodiments, the shielding structure is provided with a void-avoiding structure.

[0019] In some embodiments, an inner conductor unit is further included, which is disposed in the outer conductor and connected to the outer conductor;

[0020] The microwave feed unit is inserted into the outer conductor and connected to the inner conductor.

[0021] An aerosol generating device is also constructed, which further includes a housing and a microwave heating component of the present invention housed in the housing, wherein the outer conductor and heat dissipation structure of the microwave heating component are disposed in the housing along the axial direction of the housing.

[0022] The aerosol generating device and its microwave heating assembly of the present invention have the following beneficial effects: The microwave heating assembly connects the heat dissipation structure for the microwave generating unit to the outer conductor and extends along the axial direction of the outer conductor, and is integrally formed with the outer conductor. Furthermore, by setting the microwave generating unit on the heat dissipation structure and connecting it to the microwave feed unit, and dissipating heat through the heat dissipation structure, the layout of each component in the aerosol generating device is optimized, making the structure more compact and facilitating the miniaturization design of the aerosol generating device. Moreover, by integrally forming the heat dissipation structure with the outer conductor, the disassembly and assembly process is simplified, the risk of microwave leakage from gaps is reduced, and electromagnetic shielding is made easier. Attached Figure Description

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0024] Figure 1 is a schematic diagram of the aerosol generating device in some embodiments of the present invention;

[0025] Figure 2 is a cross-sectional view of the aerosol generating device shown in Figure 1;

[0026] Figure 3 is a schematic diagram of the microwave heating component structure of the aerosol generating device shown in Figure 2.

[0027] Figure 4 is a partial structural cross-sectional view of the microwave heating assembly shown in Figure 3;

[0028] Figure 5 is a partial structural exploded view of the microwave heating assembly shown in Figure 4;

[0029] Figure 6 is a partial structural schematic diagram of the microwave heating assembly shown in Figure 4;

[0030] Figure 7 is a schematic diagram of the fixed unit structure of the microwave heating assembly shown in Figure 4;

[0031] Figure 8 is a cross-sectional view of the fixing unit of the microwave heating assembly shown in Figure 7;

[0032] Figure 9 is a schematic diagram of the radiation structure of the inner conductor unit in the microwave heating assembly shown in Figure 4;

[0033] Figure 10 is a schematic diagram of the inner conductor body structure of the inner conductor unit in the microwave heating assembly shown in Figure 4.

[0034] Figure 11 is a schematic diagram of the inner conductor body shown in Figure 10 from another angle;

[0035] Figure 12 is a cross-sectional view of the inner conductor body shown in Figure 10;

[0036] Figure 13 is a schematic diagram of the shielding structure of the microwave heating assembly shown in Figure 5. Detailed Implementation

[0037] To provide a clearer understanding of the technical features, objectives, and effects of the present invention, specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, it should be understood that the terms "upper," "bottom," "inner," "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing the technical solution and do not indicate that the device or element referred to must have a specific orientation; therefore, they should not be construed as limitations on the present invention.

[0038] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," "third," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0039] Figures 1 and 2 illustrate some preferred embodiments of the aerosol generating device 100 of the present invention. The aerosol generating device 100 generates aerosols for user inhalation by feeding microwaves to heat the aerosol generating matrix. The aerosol generating matrix is ​​detachably disposed within the aerosol generating device 100. In some embodiments, the aerosol generating matrix is ​​columnar; specifically, it can be cylindrical and can be a filamentous, granular, or sheet-like solid material made from plant leaves, flowers, and / or stems, and aroma components can be further added to this solid material.

[0040] As shown in Figures 1 and 2, in some embodiments, the aerosol generating device 100 is generally cylindrical, and may be roughly similar in shape to a pen. The aerosol generating device 100 includes a housing 10 and a microwave heating component; the housing 10 is used to house the microwave heating component. The microwave heating component is housed in the housing 10, and after being exposed to microwaves, it generates a microwave energy field inside, thereby heating the aerosol generating matrix.

[0041] In some embodiments, the outer casing 10 is generally cylindrical and is a hollow structure with both ends open. One end of the outer casing 10 may be provided with a plug-in port 11, which can be used for inserting and installing the aerosol generation matrix. In some embodiments, the outer casing 10 can be a metal or plastic shell. The material of the outer casing 10 is generally aluminum alloy, but in some embodiments it can also be stainless steel, iron alloy, titanium alloy, or other metal materials. In some embodiments, it can also be made of plastic materials such as ABS, PC, and PPSU. The outer casing 10 generally serves a decorative and aesthetic purpose.

[0042] In some embodiments, a top cover 12 may be provided at one end of the housing 10. The top cover 12 may be annular, and the insertion / removal port 11 may be formed in the top cover 12. The top cover 12 can be used to fix the microwave heating component in the housing 10 and can also serve a sealing function. In some embodiments, the top cover 12 may be a metal or plastic housing. The material of the top cover 12 is generally aluminum alloy, but in some embodiments it may also be stainless steel, iron alloy, titanium alloy, or other metal materials. In some embodiments it may also be made of plastic materials such as ABS, PC, and PPSU. The top cover 12 generally serves a decorative and aesthetic purpose.

[0043] In some embodiments, a bottom cover 13 may be provided at the other end of the housing 10. The bottom cover 13 may be made of metal or plastic, and is generally made of metal materials such as stainless steel, iron alloy, and titanium alloy. In other embodiments, the housing 10 may also be made of plastic materials such as ABS, PC, and PPSU. The bottom cover 13 is used to seal the bottom of the housing 10. In some embodiments, a charging interface may be provided on the bottom cover 13 for external power supply access.

[0044] As shown in Figures 2 to 5, in some embodiments, the microwave heating assembly may include a microwave heating unit 20, a microwave feed unit 30, a heat dissipation structure 40, and a microwave generating unit 50. The microwave heating unit 20 can generate a microwave energy field within itself after microwaves are introduced, thereby heating the aerosol generation matrix. In some embodiments, the microwave heating unit 20 includes an outer conductor 21. The microwave feed unit 30 is mounted on the outer conductor 21 and is used to feed microwaves. The heat dissipation structure 40 can be connected to the outer conductor 21 and can extend along the axial direction of the outer conductor 21. In some embodiments, the heat dissipation structure 40 can be integrally formed with the outer conductor 21, thereby optimizing the layout of the components in the housing 10, making the component structure more compact, which is beneficial for the miniaturization design of the aerosol generation device 100. Furthermore, by integrally forming the heat dissipation structure 40 with the outer conductor 21, the assembly and disassembly process is simplified, the risk of microwave leakage from gaps is reduced, and electromagnetic shielding is easier. The microwave generating unit 50 can be connected to the microwave feeding unit 30, and the microwaves generated by the microwave generating unit 50 can be fed into the outer conductor 21 through the microwave feeding unit 30.

[0045] As shown in Figures 2 and 6, in some embodiments, the outer conductor 21 is made of metal or other highly conductive materials to confine the microwave capability within it. Generally, the outer conductor 21 can be made of gold, silver, copper, aluminum, iron, gold-containing alloys, aluminum-containing alloys, copper-containing alloys, iron-containing alloys, stainless steel, etc. In some embodiments, the outer conductor 21 has a cylindrical structure and can be a regular shape, such as a cuboid or cylinder. In some embodiments, the outer conductor 21 can be an irregular shape. Specifically, in this embodiment, the outer conductor 21 has an irregular shape formed by partial outward convexity or inward concavity.

[0046] In some embodiments, a cavity 210 is formed inside the outer conductor 21. The outer conductor 21 may include an opening 211 and a support wall 212. The cavity 210 is formed between the opening 211 and the support wall 212. The opening 211 communicates with the cavity 210 and may be disposed opposite to the insertion / removal port 11. The support wall 212 may be disposed opposite to the opening 211.

[0047] In some embodiments, a positioning hole 2121 may be provided on the support wall 212. The positioning hole 2121 may be located at the central axis of the support wall 212 and may be used for positioning and installing the inner conductor unit 23. In some embodiments, the positioning hole 2121 may be a circular through hole. In some embodiments, at least two through holes 2122 may be provided on the support wall 212, and the at least two through holes 2122 may be spaced apart circumferentially along the positioning hole 2121. In some embodiments, there may be two, three, or four through holes, etc., for fasteners 241 to pass through. Generally, there may be two through holes 2122, and the two through holes 2122 may be located on two opposite sides of the central axis of the support wall 212. The two through holes may be symmetrically arranged with the central axis of the support wall 212 as the axis of symmetry, which is beneficial for the installation and positioning of the inner conductor unit 23 and can make the inner conductor unit 23 be subjected to uniform force during installation. In some embodiments, the through hole 2122 may be a circular through hole. In some embodiments, a fixing hole 2123 may be provided on the support wall 212. The fixing hole 2123 may be provided on one side of the positioning hole 2121 and located between the two through holes 2122. The fixing hole 2123 can be used to install and fix the microwave feed unit 30. In some embodiments, one of the at least two through holes 2122 may be selected as the fixing hole 2123. In some embodiments, the fixing hole 2123 may be a circular through hole. In other embodiments, the fixing hole 2123 may not be limited to being provided on the support wall 212, and may be provided on the side wall of the outer conductor 21.

[0048] Understandably, in some other embodiments, the positioning hole 2121, through hole 2122, and fixing hole 2123 may not be limited to being circular; they may also be square, pentagonal, hexagonal, etc.

[0049] As shown in Figures 7 and 8, in some embodiments, the microwave heating unit 20 may further include a fixing unit 22. The fixing unit 22 is housed in the cavity 210 of the outer conductor 21. The fixing unit 22 may be coaxially and oppositely arranged with the insertion port 11. The fixing unit 22 can be used to fix the aerosol generating matrix and can form a heat insulation structure to reduce heat loss. In some embodiments, the fixing unit 22 may be cylindrical, and one end has an assembly port 221 communicating with the insertion port 11. An accommodating cavity 220 may be formed on the inner side of the fixing unit 22, which can be used to accommodate the aerosol generating matrix. The fixing unit 22 has a baffle wall 222, which can serve to support and block the aerosol generating matrix. In some embodiments, the baffle wall 222 may be provided with a through hole 2221, which may be located at the central axis of the baffle wall 222, for the inner conductor unit 23 to pass through. In some embodiments, the inner sidewall of the fixing unit 22 may be provided with an airflow channel 223, which may extend from the assembly port 221 to the baffle 222. Generally, the airflow channel 223 can be formed by opening an air guide groove or providing an air guide protrusion on the inner sidewall of the fixing unit 22 and the baffle 222. In some embodiments, the sidewall of the fixing unit 22 may be provided with an airflow hole 224, which may communicate with the airflow sensing structure for supplying airflow to trigger the airflow sensing structure. The airflow sensing structure may be a conventional airflow sensor.

[0050] In some embodiments, the fixing unit 22 may be made of an electrically insulating material with good wave transmission performance. For example, the fixing unit 22 may be made of polytetrafluoroethylene, PEEK, quartz glass, alumina, titanium dioxide, zirconium oxide, etc.

[0051] As shown in Figures 9 to 12, the microwave heating unit 20 may further include an inner conductor unit 23. The inner conductor unit 23 can be housed in the cavity 210 and can be connected and fixed to the outer conductor 21 by a fastening assembly 24. Specifically, the inner conductor unit 23 may include a radiating structure 231 and an inner conductor body 232. The radiating structure 231 can be clamped and fixed onto the inner conductor body 232, and can partially extend into the accommodating cavity 220. When the aerosol generating matrix is ​​assembled with the fixing unit 22, the radiating structure 231 can be partially inserted into the aerosol generating matrix and coaxially arranged with the aerosol generating matrix. The radiating structure 231 can heat the aerosol generating matrix by radiating microwaves to generate aerosols. The inner conductor body 232 can be sleeved on the outer periphery of the fixing unit 22 and can be partially fixed and installed through the positioning hole 2121. The inner conductor body 232 can contact the outer conductor 21 to form an ohmic contact.

[0052] In some embodiments, the radiating structure 231 may be made of a highly conductive metal material to radiate microwaves, such as 304 / 316 stainless steel. The radiating structure 231 may be columnar, specifically, it may be approximately needle-shaped, and may be a flat-tipped needle structure. Generally, the width of the flat-tipped needle ensures temperature measurement when in contact with the aerosol generating matrix, while its thinness and pointed tip facilitate piercing the blockage of the aerosol generating matrix. Simultaneously, the flat-tipped needle structure avoids the problem of needle adhesion after the aerosol generating matrix shrinks upon heating, i.e., the aerosol generating matrix shrinks and adheres to the outside of the radiating structure 231. In other embodiments, the radiating structure 231 is not limited to a flat-tipped needle structure; in some embodiments, the radiating structure 231 may also be a round needle structure.

[0053] In some embodiments, the radiating structure 231 may include a radiating portion 231a and a radiating portion 231b. The radiating portion 231a may be inserted into the receiving cavity 220 and can be integrally inserted into the aerosol generating matrix. The radiating portion 231b may be disposed at one end of the radiating portion 231a and can be inserted and clamped to the inner conductor body 232. In some embodiments, the radiating portion 231a is flat, and a pointed structure 2311 may be provided at the end away from the radiating portion 231b. By providing the pointed structure 2311, it is beneficial for the radiating portion 231a to pass through the plug of the aerosol generating matrix and insert into the aerosol generating matrix. In some embodiments, the cross-section of the radiating portion 231a may be approximately elliptical, rectangular, or the like. The thickness of the radiating portion 231b may be greater than the thickness of the radiating portion 231a. The cross-section of the radiating portion 231b may be approximately circular or square. Generally, the radiating part 231b and the radiating part 231a can be an integrally formed structure. The radiating structure 231 can be a round needle-shaped preform. The flat radiating part 231a and the cylindrical radiating part 231b are formed by flattening the middle of the round needle-shaped preform.

[0054] In some embodiments, the inner side of the radiating structure 231 may be hollow, and the end away from the pointed structure 2311 may be open. A wiring channel 2312 may be formed inside the radiating structure 231, through which temperature sensing leads (such as NTC leads) may be led out.

[0055] In some embodiments, the inner conductor body 232 may be made of a metallic material or other highly conductive material. For example, the inner conductor body 232 may be made of gold, silver, copper, aluminum, iron, gold-containing alloys, aluminum-containing alloys, copper-containing alloys, iron-containing alloys, stainless steel, etc. The surface of the inner conductor body 232 may be plated with a conductive material to enhance conductivity and facilitate soldering. The conductive material may be silver.

[0056] The inner conductor body 232 may include a cylindrical body 232a and a protrusion 232b. The cylindrical body 232a may be sleeved on the outer periphery of a portion of the fixing unit 22. Specifically, the cylindrical body 232a may be sleeved on the outer periphery of a portion of the fixing unit 22. The cylindrical body 232a may be clearance-fitted with the fixing unit 22. The protrusion 232b is disposed at one end of the cylindrical body 232a, and a positioning boss 232c is provided on the side opposite to the cylindrical body 232a. The positioning boss 232c may be inserted into the positioning hole 2121 of the outer conductor 21, and may contact the outer conductor 21 to form an ohmic contact, thereby connecting the inner conductor unit 23 to the outer conductor 21. In some embodiments, the cylindrical body 232a, the protrusion 232b, and the positioning boss 232c are integrally formed structures.

[0057] In some embodiments, the cylindrical body 232a, the protrusion 232b, and the positioning boss 232c are coaxially arranged. The cylindrical body 232a can be a cylinder with a circular cross-section. In other embodiments, the cylindrical body 232a is not limited to being cylindrical. The cross-section of the protrusion 232b can be generally elliptical. Of course, it is understood that in other embodiments, the cross-section of the protrusion 232b is not limited to being elliptical; it can also be rectangular, and in other embodiments, it can also be circular. In some embodiments, the positioning boss 232c can be a circular boss. In other embodiments, the positioning boss 232c is not limited to being a circular boss.

[0058] In some embodiments, the inner conductor unit 23 has an end wall 2321 disposed toward the support wall 212. Specifically, the end wall 2321 is formed at one end of the cylindrical body 232a. A protrusion 232b is disposed on the end wall 2321 and extends toward the support wall 212. A sleeve interface 2322 may be disposed on the side of the cylindrical body 232a opposite to the end wall 2321, which can be used to fit with the fixing unit 22. A chamber 2320 may be formed inside the cylindrical body 232a. The end wall 2321 has a plug hole 2323 for the radiation structure 231 to be inserted and fixed. The plug hole 2323 is located at the central axis of the inner conductor body 232 and extends from the end wall 2321 to the positioning boss 232c. A clamping structure can be provided inside the plug hole 2323 to clamp and fix the radiation structure 231. Generally, in some embodiments, the clamping structure can be formed by providing a claw extending toward the radiation structure 231 on the hole wall of the plug hole 2323.

[0059] In some embodiments, at least two mounting holes 2324 are provided on the end wall 2321, and the at least two mounting holes 2324 are corresponding one-to-one with at least two through holes 2122, which can be used for mounting fasteners 241 of the fastening assembly 24. Specifically, there can be two mounting holes 2324, which can be formed on the boss 232b along the length direction of the protrusion 232b, and can be symmetrically arranged on two opposite sides of the central axis of the protrusion 232b, so that the inner conductor body 232 is subjected to uniform force when the inner conductor body 232 is installed with the outer conductor 21. The mounting holes 2324 can be round holes. By setting both the mounting holes 2324 and the through holes 2122 as round holes, the processing accuracy can be improved, and the concentricity during installation can be guaranteed.

[0060] In some embodiments, a connection hole 2325 for connecting to the microwave feed unit 30 may be provided on the end wall 2321. The connection hole 2325 may be provided on one side of the protrusion 232b and can be used for the microwave feed unit 30 to be inserted.

[0061] As shown in Figure 4, in some embodiments, the microwave heating unit 20 further includes a fastening assembly 24, which can be used to fasten the inner conductor unit 23 to the outer conductor 21. In some embodiments, the fastening assembly 24 may include at least two fasteners 241, which are disposed on the inner conductor unit 23 and the support wall 212 to fasten the inner conductor unit 23 to the support wall 212.

[0062] In some embodiments, there may be two fasteners 241, each corresponding to a through hole 2122 and a mounting hole 2324. The fastener passes through the through hole 2122 and is inserted into the mounting hole 2324, thereby fixing the inner conductor unit 23 to the support wall 212. This fully utilizes the internal space of the cavity 210 in the outer conductor 21, saving stacking space for the microwave generating unit 50 outside the cavity 210, thus facilitating the miniaturization of the entire device. In other embodiments, there may be more than two fasteners 241, such as three or four.

[0063] In some embodiments, the fastener 241 may have an external thread structure, which may be a countersunk screw with a thread diameter generally M1.2 to M2.5. Correspondingly, the inner wall of the mounting hole 2324 may be provided with an internal thread structure, which may be a threaded hole or a blind hole. The internal thread structure of the mounting hole 2324 may mate with the external thread structure of the fastener 241, that is, the fastener 241 may be locked and fixed in the mounting hole 2324.

[0064] As shown in Figure 2, in some embodiments, the microwave heating unit 20 further includes a temperature sensing structure 25. The temperature sensing structure 25 is disposed on the radiation structure 231 and can be used to detect the temperature in the fixing unit 22, thereby enabling temperature control. In some embodiments, the temperature sensing structure 25 may include a temperature sensing element and a temperature sensing lead 251. The temperature sensing element may be disposed on the surface of the radiation section 231a, and the temperature sensing lead 251 may be led out from the wiring channel 2312 in the temperature sensing structure 25 and from the outer conductor 21. In some embodiments, the temperature sensing lead 251 may be an NTC wire.

[0065] In some embodiments, a lead hole may be provided on the inner conductor unit 23. Specifically, the lead hole may be provided on the end wall 2321, which can be used for the temperature sensing lead 251 to be led out. Specifically, the lead hole is provided at the central axis of the inner conductor unit 23, specifically at the central axis of the end wall 2321, and it may be the same as the insertion hole 2323. In other embodiments, the lead hole may also be offset from the insertion hole 2323. The temperature sensing lead 251 can be led out from the insertion hole 2323 and the positioning hole 2121 and bent.

[0066] In some embodiments, the microwave feed unit 30 can be mounted on the fixing hole 2123. In some embodiments, the microwave feed unit 30 can be an RF connector, which is generally selected as a standard part. In other embodiments, the microwave feed unit 30 can also be customized as a non-standard part according to requirements. The microwave feed unit 30 includes a housing 31, an isolator 32, and a center conductor 33. The housing 31 is sleeved on the outer periphery of the isolator 32, and the center conductor 33 is arranged along the axial direction of the isolator 32, with both ends extending out of the isolator 32. In some embodiments, the housing 31 can be made of copper-plated gold material. The isolator 32 can be made of insulating material, such as glass or ceramic. The center conductor 33 can be a copper-plated gold needle. The center conductor 33 can pass through the cavity 210 and be inserted into the connection hole 2325 to connect with the inner conductor body 232, thereby feeding microwaves into the inner conductor unit 23. In some embodiments, one end of the center conductor 33 inserted into the connection hole 2325 can be welded and fixed to the inner conductor body 232. The end of the center conductor 33 away from the inner conductor body 232 can be welded and fixed to the microwave generating unit 50.

[0067] As shown in Figures 2, 5, and 6, in some embodiments, the heat dissipation structure 40 can be integrally formed with the outer conductor 21 by injection molding or casting. In some embodiments, one end of the heat dissipation structure 40 can be connected to the support wall 212 and can extend away from the opening 211. In some embodiments, the heat dissipation structure 40 may include a bottom wall 41 extending along the axial direction of the outer conductor and side walls 42 disposed on two opposite sides of the bottom wall 41, the bottom wall 41 being generally rectangular. The side walls 42 can extend along the length direction of the bottom wall 41. A first receiving groove 43 can be provided on the heat dissipation structure 40, the first receiving groove 43 being defined by the bottom wall 41 and the two side walls 42, and is a semi-enclosed structure. The first receiving groove 43 can be used to accommodate the microwave generating unit 50. In some embodiments, a second receiving groove 411 can be formed on the bottom wall 41, the second receiving groove 411 being used to accommodate functional components, such as power amplifier chips. Of course, it is understood that in other embodiments, the functional components can be other high-power components.

[0068] In some embodiments, the microwave generating unit 50 may be disposed within the housing 10 along the axial direction of the outer conductor 21. In some embodiments, the microwave generating unit 50 may be an radio frequency board having a high-power high-frequency electromagnetic signal generating circuit to provide high-frequency electromagnetic heating energy to the cavity 210 in the outer conductor 21. The operating efficiency of the microwave generating unit 50 is typically between 60% and 65%, and continuous operation generates a large amount of heat. Generally, the microwave generating unit 50 is housed in the first receiving groove 43 and closely attached to the heat dissipation structure 40, through which heat is dissipated. Specifically, it may be closely attached to the bottom wall 41.

[0069] As shown in Figures 2, 5, and 13, in some embodiments, the microwave heating assembly further includes an isolation temperature sensing lead 251 and a shielding structure 60 for the microwave generating unit. The shielding structure 60 is disposed between the microwave generating unit 50 and the temperature sensing lead 251 to isolate the radio frequency signal and the temperature sensing signal, avoiding mutual interference between the temperature sensing lead and the radio frequency signal line. The shielding structure 60 can be placed on the heat dissipation structure 40 and cover the first receiving groove 43. The shielding structure 60 and the heat dissipation structure 40 can work together to define an electromagnetic shielding cavity, thereby preventing high-frequency electromagnetic signal leakage and preventing short circuits or metal interference to electronic components. In some embodiments, the shielding structure 60 can be connected and fixed to the outer conductor 21 and / or the heat dissipation structure 40 by providing a connecting component, which can be a screw assembly or a snap-fit ​​assembly, etc.

[0070] In some embodiments, the shielding structure 60 is a highly conductive material or a non-metallic material with a metallic coating, preferably an aluminum alloy, but may also be a metallic material such as stainless steel, iron alloy, or titanium alloy.

[0071] In some embodiments, the shielding structure 60 may include a first shielding portion 61, a second shielding portion 62, and a third shielding portion 63. The first shielding portion 61 may be disposed parallel to the bottom wall 41 and may be disposed on the side of the microwave generating unit 50 away from the heat dissipation structure 40. There are two second shielding portions 62, which are disposed on two opposite sides of the first shielding portion 61. Each second shielding portion 62 may extend toward the side wall 42 of the heat dissipation structure 40 and is disposed on the outer side of the side wall 42. The third shielding portion 63 may be disposed at one end of the first shielding portion 61 and may extend toward the end of the bottom wall 41 away from the outer conductor 21 to cover the slot of the first receiving groove 43 away from the outer conductor 21.

[0072] In some embodiments, a clearance structure 611 may be provided on the shielding structure 60. Specifically, the clearance structure 611 is formed on the side of the first shielding portion 61 opposite to the heat dissipation structure 40. In some embodiments, the clearance structure 611 may be a clearance groove, which can be used to prevent electronic components from short-circuiting or being interfered with by metal.

[0073] In some embodiments, the microwave heating assembly further includes a control board 70, which may be disposed on the side of the shielding structure 60 opposite to the microwave generating unit 50. The control board 70 can be isolated from the microwave generating unit 50 by the shielding structure 60 to prevent the components thereon from being subjected to electromagnetic interference. In some embodiments, the temperature sensing lead 251 may be led out from the outer conductor 21 and bent away from the heat dissipation structure 40 to connect with the control board 70.

[0074] During installation, the microwave heating unit 20 can be assembled internally first, then the microwave generating unit 50 can be placed in the first receiving groove 43 of the heat dissipation structure 40 and connected to the microwave feed unit 30. A connecting assembly can be used to connect and fix the microwave generating unit 50 to the heat dissipation structure 40. Then, the shielding structure 60 is placed on top of the heat dissipation structure 40 and fixed using the connecting assembly. Finally, the control board 70 is installed on the side of the shielding structure 60 opposite to the heat dissipation structure 40. Generally, the connecting assembly can be a screw assembly or a snap-fit ​​assembly. The outer conductor 21, the heat dissipation structure 40, and the shielding structure 60 can form a compact structure to simultaneously dissipate heat from the microwave generating unit 50 when it generates a large amount of heat.

[0075] In some embodiments, the aerosol generating device 100 further includes a power supply bracket 80 and a power supply 90. The power supply bracket 80 may be disposed in the housing 10 and located at one end of the microwave heating assembly, and can be used to support and fix the power supply 90. In some embodiments, the power supply 90 may be a battery. The power supply 90 may be connected to the control board 70, and it can be repeatedly charged and discharged to provide power to the microwave generating unit 50.

[0076] It is understood that the above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of the present invention, and can also make several modifications and improvements, all of which fall within the protection scope of the present invention. Therefore, all equivalent transformations and modifications made with respect to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. A microwave heating assembly, characterized in that, include: Outer conductor (21); A microwave feed unit (30) is mounted on the outer conductor (21); A heat dissipation structure (40) is connected to the outer conductor (21) and extends along the axial direction of the outer conductor (21), and is integrally formed with the outer conductor (21); The microwave generating unit (50) is connected to the microwave feeding unit (30) and is disposed on the heat dissipation structure (40) to dissipate heat through the heat dissipation structure (40).

2. The microwave heating assembly according to claim 1, characterized in that, A cavity (210) is formed inside the outer conductor (21). The outer conductor (21) includes an opening (211) communicating with the cavity (210) and a support wall (212) disposed opposite to the opening (211). One end of the heat dissipation structure (40) is connected to the support wall (212) and extends away from the opening (211).

3. The microwave heating assembly according to claim 1, characterized in that, The heat dissipation structure (40) has a first receiving groove (43), and the microwave generating unit (50) is housed in the first receiving groove (43).

4. The microwave heating assembly according to claim 3, characterized in that, The heat dissipation structure (40) includes a bottom wall (41) extending axially along the outer conductor (21) and two side walls (42) disposed on two opposite sides of the bottom wall (41), the bottom wall (41) and the two side walls (42) defining the first receiving groove (43). A second receiving groove (411) is provided on the bottom wall (41), which is used to receive functional components.

5. The microwave heating assembly according to claim 1, characterized in that, The microwave heating assembly also includes a temperature measuring structure (25), which includes a temperature measuring lead (251) extending from the outer conductor (21).

6. The microwave heating assembly according to claim 5, characterized in that, The microwave heating assembly also includes a shielding structure (60) that isolates the temperature measuring lead (251) and the microwave generating unit (50). The shielding structure (60) and the heat dissipation structure (40) work together to define an electromagnetic shielding cavity.

7. The microwave heating assembly according to claim 6, characterized in that, The microwave heating assembly includes a control board (70), which is disposed on the side opposite to the shielding structure (60) and the microwave generating unit (50); The temperature measuring lead (251) is connected to the control board (70).

8. The microwave heating assembly according to claim 6, characterized in that, The shielding structure (60) is provided with an air-proof structure (611).

9. The microwave heating assembly according to claim 1, characterized in that, It also includes an inner conductor unit (23), which is disposed in the outer conductor (21) and connected to the outer conductor (21); The microwave feed unit (30) is inserted into the outer conductor (21) and connected to the inner conductor unit (23).

10. An aerosol generating device, characterized in that, The aerosol generating device further includes a housing (10) and a microwave heating component according to any one of claims 1 to 9 housed in the housing (10), wherein the outer conductor (21) and heat dissipation structure (40) of the microwave heating component are disposed in the housing (10) along the axial direction of the housing (10).