Electronic device

Abstract

The present application relates to the technical field of electronic products, and discloses an electronic device. The electronic device comprises: a housing, the housing forming an accommodating cavity; a main board, the main board being arranged in the accommodating cavity; a light-emitting module, the light-emitting module being electrically connected to the main board; a decorative ring support, the decorative ring support being arranged on the side of the housing facing away from the accommodating cavity, the side of the decorative ring support facing the housing comprising a first region, the peripheral side of the first region being provided with a flange structure, and the first region comprising a first light-transmitting portion; a light-shielding film, the light-shielding film being sealedly connected to the flange structure to form a shielding space; and a light guide assembly, the light guide assembly being arranged in the shielding space, and light emitted by the light-emitting module being transmitted to the first light-transmitting portion by means of the light guide assembly.

Description

electronic devices

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202510299406.2, filed in China on March 13, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application belongs to the field of electronic product technology, and specifically relates to an electronic device. Background Technology

[0004] Currently, electronic devices commonly use breathing lights as optical interactive components for information prompting.

[0005] In related technologies, the breathing light is usually integrated into the back cover of electronic devices or set up in a decorative ring around the rear camera module.

[0006] However, due to the assembly gap between the decorative ring and the back cover, unintended light diffusion can easily occur, resulting in an indistinct working area of ​​the breathing light or causing optical crosstalk problems. For example, the light emitted by the breathing light when it is working may crosstalk to the viewing window area of ​​the camera module, affecting the camera's shooting function. Summary of the Invention

[0007] The purpose of this application is to provide an electronic device that can solve the problem of an unclear light-emitting working area of ​​a breathing light or optical crosstalk caused by unintended light diffusion.

[0008] In a first aspect, embodiments of this application provide an electronic device, including:

[0009] The housing forms a receiving cavity;

[0010] The motherboard is disposed within the receiving cavity;

[0011] A light-emitting module, which is electrically connected to the motherboard;

[0012] The decorative ring bracket is disposed on the side of the housing away from the receiving cavity. The side of the decorative ring bracket facing the housing includes a first region. The periphery of the first region is provided with a flange structure. The first region includes a first light-transmitting portion.

[0013] A first light-shielding film is sealed to the flange structure to form a shielding space;

[0014] A light guide component is disposed within the shielding space, and the light emitted by the light-emitting module is transmitted to the first light-transmitting part through the light guide component.

[0015] In some embodiments, the light-emitting module is disposed within the shielding space;

[0016] The first light-shielding film has an opening, through which the light-emitting module is electrically connected to the motherboard.

[0017] In some embodiments, the electronic device further includes:

[0018] A motherboard bracket is provided with an angled mounting slot. One end of the light-emitting module is assembled into the angled mounting slot, and the other end of the light-emitting module is fixedly connected to the motherboard bracket.

[0019] The bottom of the angled mounting slot is provided with a first through hole, through which the light-emitting module is electrically connected to the motherboard.

[0020] In some embodiments, the light-emitting module includes:

[0021] A circuit board, wherein a light-emitting element is provided on the circuit board;

[0022] A shielding cover is provided on the light-emitting element, and the shielding cover has a light-emitting port that is directly opposite the light-inlet port of the light guide assembly.

[0023] In some embodiments, the electronic device further includes:

[0024] A motherboard bracket is fixedly connected to a second region on the first light-shielding film, the second region being directly opposite the light-emitting module and surrounding the opening.

[0025] In some embodiments, a heightening pad is provided at one end of the light guide assembly near the light-emitting module, and the heightening pad 50 is provided on the side of the light guide assembly away from the decorative ring bracket.

[0026] In some embodiments, the light guide assembly includes: a first emitting film, a light guide film, a second emitting film, a lens, a diffuser film, and a second light-shielding film;

[0027] The light guide film is stacked on the first emitting film, the second emitting film and the lens are stacked side by side on the light guide film, the diffusion film is stacked on the lens, and the second light-shielding film is stacked on the diffusion film, the second light-shielding film being smaller than the diffusion film;

[0028] The lens and the diffusion film are directly opposite the first light-transmitting portion.

[0029] In some embodiments, the electronic device further includes:

[0030] An exterior decorative piece, wherein the exterior decorative piece is disposed on the side of the decorative ring bracket opposite to the housing;

[0031] The decorative piece has a second light-transmitting part, which is directly opposite the first light-transmitting part.

[0032] In some embodiments, the electronic device further includes: a first lens decoration ring assembly and a second lens decoration ring assembly;

[0033] The decorative panel also has a second through hole and a third through hole;

[0034] The first lens decorative ring assembly is fixedly connected to the decorative ring bracket through the second through hole, and the second lens decorative ring assembly is fixedly connected to the decorative ring bracket through the third through hole.

[0035] In some embodiments, the second through hole, the third through hole, and the second light-transmitting portion are arranged side by side and spaced apart on the exterior decorative sheet.

[0036] In this embodiment, the electronic device includes a housing, a motherboard, a light-emitting module, a decorative ring bracket, a second light-shielding film, and a light guide assembly. The motherboard is disposed within a receiving cavity formed by the housing, and the light-emitting module is electrically connected to the motherboard. The decorative ring bracket is disposed on the side of the housing away from the receiving cavity, and the side of the decorative ring bracket facing the housing includes a first region. A flange structure is provided on the periphery of the first region, and the first region includes a first light-transmitting portion. The first light-shielding film is sealed to the flange structure to form a shielding space. The light guide assembly is disposed within the shielding space, and the light emitted by the light-emitting module is transmitted to the first light-transmitting portion via the light guide assembly. Thus, by placing the light guide assembly within the shielding space formed by the sealed connection of the first light-shielding film and the flange structure, unintended light diffusion of the light emitted by the light-emitting module can be avoided, ensuring that the first light-transmitting portion has a significant light-emitting effect, while avoiding the problem of optical crosstalk. Attached Figure Description

[0037] Figure 1 shows an exploded view of the decorative ring assembly according to an embodiment of this application;

[0038] Figure 2 shows one of the structural schematic diagrams of the decorative ring assembly according to an embodiment of this application;

[0039] Figure 3 shows a second structural schematic diagram of the decorative ring assembly according to an embodiment of this application;

[0040] Figure 4 shows a schematic diagram of the structure of the light guide assembly according to an embodiment of this application;

[0041] Figure 5 shows one of the exploded views of the light guide assembly according to an embodiment of this application;

[0042] Figure 6 shows a second exploded view of the light guide assembly according to an embodiment of this application;

[0043] Figure 7 shows one of the assembly structure diagrams of the light guide component and the light emission module according to an embodiment of this application;

[0044] Figure 8 shows a second schematic diagram of the assembly structure of the light guide component and the light emission module according to an embodiment of this application;

[0045] Figure 9 shows a third schematic diagram of the assembly structure of the light guide component and the light emission module according to an embodiment of this application;

[0046] Figure 10 shows a fourth schematic diagram of the assembly structure of the light guide component and the light emission module according to an embodiment of this application;

[0047] Figure 11 shows the fifth schematic diagram of the assembly structure of the light guide component and the light emission module according to an embodiment of this application;

[0048] Figure 12 shows a sixth schematic diagram of the assembly structure of the light guide component and the light emission module according to an embodiment of this application;

[0049] Figure 13 shows one of the partial cross-sectional schematic diagrams of an electronic device according to an embodiment of this application;

[0050] Figure 14 shows a second partial cross-sectional schematic diagram of the electronic device according to an embodiment of this application;

[0051] Figure 15 shows a third partial cross-sectional schematic diagram of the electronic device according to an embodiment of this application;

[0052] Figure 16 shows a schematic diagram of the oblique insertion mounting slot according to an embodiment of this application;

[0053] Figure 17 shows a schematic diagram of the installation process of the light-emitting module according to an embodiment of this application;

[0054] Figure 18 shows a schematic diagram of the installation state of the light-emitting module according to an embodiment of this application;

[0055] Figure 19 shows an exploded view of an electronic device according to an embodiment of this application;

[0056] Figure 20 shows a schematic diagram of the internal structure of an electronic device according to an embodiment of this application;

[0057] Figure 21 shows a schematic diagram of the external structure of an electronic device according to an embodiment of this application.

[0058] Explanation of reference numerals in the attached drawings: 1-Housing; 1a-Back cover; 1b-Frame; 1c-Main board top cover; 2-Main board; k1-First spring contact; k2-Second spring contact; h-First adhesive area; 3-Light-emitting module; 31-Circuit board; 32-Light-emitting component; 33-Shielding cover; d-Chamfer; g1-First exposed copper area; g2-Second exposed copper area; A-Decorative ring assembly; 4-Decorative ring bracket; 41-Flange structure; 42-First light-transmitting part; 5-Light guide assembly; 50-Heightening pad; 51-First emitting film; 52-Light guide film; 53-Second emitting film; 54-Lens; 55-Diffuser film ; 56-Second light-shielding film; e1-First optical-grade transparent double-sided adhesive layer; e2-Second optical-grade transparent double-sided adhesive layer; e3-First backing adhesive layer; f1-First foam; f2-Second backing adhesive layer; 6-First light-shielding film; 61-Opening; 7-Main board bracket; 71-Angled mounting slot; 710-First through hole; m-Second adhesive area; 8-Decorative piece; 81-Second light-transmitting part; 82-Second through hole; 83-Third through hole; 91-First lens decorative ring assembly; 92-Second lens decorative ring assembly; B-Battery module; C-Speaker assembly. Detailed Implementation

[0059] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0060] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0061] The control method provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0062] Please refer to Figures 1 to 21. An embodiment of this application provides an electronic device, including:

[0063] Shell 1, shell 1 forms a receiving cavity;

[0064] Mainboard 2, is located inside the receiving cavity;

[0065] Light-emitting module 3 is electrically connected to motherboard 2;

[0066] Decorative ring bracket 4 is disposed on the side of housing 1 away from the receiving cavity. The side of decorative ring bracket 4 facing housing 1 includes a first region. A flange structure 41 is provided on the periphery of the first region. The first region includes a first light-transmitting part 42.

[0067] The first light-shielding film 6 is sealed to the flange structure 41 to form a shielding space.

[0068] The light guide component 5 is disposed in the shielding space, and the light emitted by the light-emitting module 3 is transmitted to the first light-transmitting part 42 through the light guide component 5.

[0069] In this embodiment, the decorative ring bracket 4 is used to support the decorative ring assembly A, and the decorative ring assembly A is fixedly connected to the outer surface of the housing 1 away from the receiving cavity through the decorative ring bracket 4. By providing a flange structure 41 on the decorative ring bracket 4 and adding a first light-shielding film 6, the first light-shielding film 6 and the flange structure 41 are sealed together to form a shielding space. By placing the light guide assembly 5 in the shielding space, the unexpected light diffusion of the light emitted by the light-emitting module 3 can be avoided, ensuring that the first light-transmitting part 42 has a significant light-emitting effect, while avoiding the problem of optical crosstalk.

[0070] For example, as shown in FIG19, the housing 1 includes a rear cover 1a, a frame 1b, and a motherboard cover 1c. The frame 1b is a frame structure, which is located around the motherboard cover 1c as the four-sided exterior parts of the electronic device. The motherboard cover 1c is connected to the inner wall of the frame 1b. One side of the motherboard cover 1c is used to support the display screen, and the other side of the motherboard cover 1c forms a receiving surface for the motherboard 2. The motherboard cover 1c and the frame 1b together form a battery compartment, and the battery module B is disposed in the battery compartment. The rear cover 1a is connected to the frame 1b, and the frame 1b is located between the display screen and the rear cover 1a. The rear cover 1a, the frame 1b, and the motherboard cover 1c together form a receiving cavity. Optionally, the receiving cavity is used to accommodate components such as the motherboard 2, the motherboard bracket 7, and the speaker assembly C.

[0071] For example, the decorative ring bracket 4 is assembled to the outer surface of the back cover 1a by adhesive backing.

[0072] For example, the light-emitting module 3 is a light-emitting diode (LED) lamp circuit board.

[0073] For example, the first light-shielding film 6 is made of black polyethylene terephthalate (PET).

[0074] In some embodiments, the light-emitting module 3 is disposed in the shielding space; as shown in FIG2, the first light-shielding film 6 is provided with an opening 61, and the light-emitting module 3 is electrically connected to the motherboard 2 through the opening 61.

[0075] The two openings 61 on the first light-shielding film 6 correspond to the first exposed copper area g1 and the second exposed copper area g2 of the light-emitting module 3, respectively. That is, the first light-shielding film 6 is designed with openings to avoid gaps in the exposed copper area of ​​the light-emitting module 3. Figure 3 shows a schematic diagram after the first light-shielding film 6 is hidden, and Figure 2 shows a schematic diagram with the first light-shielding film 6 attached.

[0076] Among them, the first exposed copper area g1 and the second exposed copper area g2 are the power supply areas of the light-emitting module 3. The light-emitting module 3 is electrically connected to the first spring contact k1 and the second spring contact k2 on the motherboard 2 through the first exposed copper area g1 and the second exposed copper area g2.

[0077] For example, as shown in Figure 20, the first spring piece k1 and the second spring piece k2 are distributed in a figure-eight shape around the screw to make full use of the installation space.

[0078] As shown in Figure 1, the first region includes a continuous area from the area where the light-emitting module 3 is installed to the first light-transmitting part 42. A flange structure 41 is disposed at the edge of the first region, forming a continuous annular enclosure structure. The flange structure 41 can achieve a side-shielding effect, and can also limit and fix the installation position of the light-emitting module 3 and the light guide assembly 5.

[0079] In this embodiment, a shielding space is formed by the flange structure 41 and the first light-shielding film 6, and the light-emitting module 3 and the light-guiding component 5 are jointly placed in the shielding space, which can provide protection and light shielding. Moreover, assembling the light-emitting module 3 and the light-guiding component 5 together on the decorative ring bracket 4 can improve the relative positional accuracy of the light-emitting module 3 and the light-guiding component 5, thereby improving the light guiding efficiency and light uniformity.

[0080] In some embodiments, the motherboard bracket 7 is provided with a first adhesive area h, which is fixedly connected to the decorative ring bracket 4 to prevent the decorative ring bracket 4 from floating up and causing an assembly gap.

[0081] In some embodiments, as shown in FIG16, the electronic device further includes:

[0082] The motherboard bracket 7 has an angled mounting slot 71. One end of the light-emitting module 3 is fitted into the angled mounting slot 71, and the other end of the light-emitting module 3 is fixedly connected to the motherboard bracket 7.

[0083] The bottom of the angled mounting slot 71 is provided with a first through hole 710, through which the light-emitting module 3 is electrically connected to the motherboard 2.

[0084] Optionally, the first region includes a continuous region formed by the light-emitting port of the light-emitting module 3 to the first light-transmitting part 42. The flange structure 41 is disposed at the edge of the first region, forming a continuous U-shaped enclosure structure, the opening of the U-shaped enclosure structure facing the light-emitting port of the light-emitting module 3.

[0085] In this embodiment, the light-emitting module 3 is independently mounted on the motherboard bracket 7, and the light guide component 5 is assembled into the shielding space on the decorative ring bracket 4. After the decorative ring bracket 4 is fixedly connected to the housing 1, a hollow area is provided on the housing 1. The light-emitting module 3 mounted on the motherboard bracket 7 passes through the hollow area, so that the light outlet of the light-emitting module 3 is aligned with the opening of the U-shaped enclosure structure, ultimately achieving alignment between the light outlet of the light-emitting module 3 and the light inlet of the light guide component 5.

[0086] Figures 16 and 17 show the installation process of the light-emitting module. After one end of the light-emitting module 3 is inserted into the inclined mounting slot 71, the other end of the light-emitting module 3 is pressed down. The other end of the light-emitting module 3 is provided with double-sided adhesive, which is used to fix and connect it to the second adhesive area m of the motherboard bracket 7.

[0087] As shown in Figure 15, the insertion end of the light-emitting module 3 adopts a support scheme without adhesive backing. The first spring contact k1 and the second spring contact k2 on the motherboard 2 respectively abut against the power supply area of ​​the light-emitting module 3, pressing the insertion end of the light-emitting module 3 into the inclined mounting slot 71 of the motherboard bracket 7. At the same time, the motherboard bracket 7 is locked to the motherboard cover 1c by screws. In this way, on the one hand, it can avoid the floating gap and sealing problems of the light-emitting module 3 caused by the pre-pressing force of the spring contact on the motherboard 2, and on the other hand, it can achieve electrical connection between the light-emitting module 3 and the motherboard 2 within a limited space.

[0088] Specifically, battery module B is used to power motherboard 2. The first contact spring k1 on motherboard 2 abuts against the first exposed copper area g1 on light-emitting module 3, and the second contact spring k2 on motherboard 2 abuts against the second exposed copper area g2 on light-emitting module 3, thereby achieving electrical connection between motherboard 2 and light-emitting module 3. Optionally, the light-emitting module includes LED surface mount devices.

[0089] In some embodiments, the light-emitting module 3 includes:

[0090] Circuit board 31, on which a light-emitting element 32 is provided;

[0091] The shield 33 is placed on the light-emitting element 32 and has a light-emitting port that is directly opposite the light-inlet port of the light guide component 5.

[0092] In this embodiment, the light-emitting port of the shield 33 faces the first light-transmitting part 42, enabling side-emitting light. By providing the shield 33 on the light-emitting element 32, on the one hand, in the scheme of assembling the light-emitting module 3 on the decorative ring bracket 4, the problem of damage to the light-emitting element 32 due to the light-emitting module 3 impacting the decorative ring bracket 4 can be avoided; on the other hand, in the scheme of setting the light-emitting module 3 on the motherboard bracket 7, the problem of light leakage of the light-emitting module 3 can be avoided.

[0093] For example, Figures 7 and 8 show the front view, side view and rear view of the light-emitting module 3 with the shielding cover 33 on the light-emitting element 32, respectively.

[0094] For example, as shown in Figures 9 to 11, the front view, side view and rear view of the light-emitting module 3 without the shielding cover 33 on the light-emitting element 32 are shown respectively.

[0095] In some embodiments, to achieve better light-shielding effect, in the embodiment where one end of the light-emitting module 3 is fitted into the oblique mounting slot 71 on the motherboard bracket 7, the flange structure 41 extends towards the light-emitting module 3 near its end, and the shield 33 partially overlaps with the flange structure 41. This prevents light leakage at the gap between the shield 33 and the flange structure 41.

[0096] In some embodiments, as shown in FIG7, the shield 33 has a chamfered angle d on the side away from the light outlet, which reduces the footprint of the shield 33.

[0097] In some embodiments, the electronic device further includes:

[0098] The motherboard bracket 7 is fixedly connected to the second area on the first light-shielding film 6. The second area is directly opposite the light-emitting module 3 and surrounds the opening 61.

[0099] As shown in Figure 2, the second area is the area surrounding the opening 61. The motherboard bracket 7 is provided with strong double-sided adhesive or a snap-fit ​​structure at the position corresponding to the second area to fix the Z-direction position of the light-emitting module 3 and prevent the light-emitting module 3 from floating due to the pre-pressing force generated by the spring sheet on the motherboard 2.

[0100] The motherboard bracket 7 consists of a steel insert and a plastic part, and is fixedly connected to the motherboard cover 1c. As shown in Figure 19, the motherboard 2 is sandwiched between the motherboard bracket 7 and the motherboard cover 1c; as shown in Figure 20, the motherboard bracket 7 has a clearance design in the area corresponding to the first spring k1 and the second spring k2, so that the first spring k1 and the second spring k2 can pass through the motherboard bracket 7 and abut against the power supply area on the light-emitting module 3.

[0101] Optionally, as shown in Figure 13, the area of ​​the motherboard bracket 7 used to support the light guide component 5 has a contoured design for the contact surface with the light guide component 5 to improve the support effect of the motherboard bracket 7 on the light guide component 5.

[0102] In some embodiments, as shown in Figures 5, 14 and 15, a heightening pad 50 is provided at one end of the light guide assembly 5 near the light-emitting module 3, and the heightening pad 50 is provided on one side of the decorative ring bracket 4 on the back of the light guide assembly 5.

[0103] As shown in Figure 6, the height-increasing pad 50 includes a first foam f1 and a second adhesive layer f2. The first foam f1 is fixedly connected to the light guide component 5 through the second adhesive layer f2.

[0104] In this embodiment, a heightening pad 50 is provided on the side of the light guide component 5 away from the decorative ring bracket 4. The heightening pad 50 supports the light guide component 5, making the light inlet of the light guide component 5 parallel and aligned with the light outlet of the light-emitting module 3. The heightening pad 50 is used for Z-axis limiting between the light guide component 5 and the light-emitting module 3 to prevent Z-axis misalignment from causing damage to the light guide rate and resulting in unstable brightness of the appearance display.

[0105] Optionally, the thickness of the height-increasing pad 50 is approximately 0.25 mm, and the thickness of the height-increasing pad can be set according to actual needs.

[0106] Optionally, the light inlet of the light guide component 5 is larger than the light outlet of the light-emitting module 3, thereby enhancing the tolerance for left-right misalignment caused by assembly.

[0107] In some embodiments, the light guide assembly 5 includes: a first emitting film 51, a light guide film 52, a second emitting film 53, a lens 54, a diffusion film 55, and a second light-shielding film 56;

[0108] In this configuration, the light guide film 52 is stacked on the first emitting film 51, the second emitting film 53 and the lens 54 are stacked side by side on the light guide film 52, the lens 54 is stacked on the diffuser film 55, the diffuser film 55 is stacked on the diffuser film 55, and the second light-shielding film 56 is smaller than the diffuser film 55.

[0109] Lens 54 and diffuser 55 are directly opposite the first light-transmitting part 42.

[0110] The first emitting film 51 is used to reflect the downward-transmitted light in the light guide film 52 upward, so that the downward light returns to the light guide film layer, and finally realizes the change in the direction of side-emitting light to front-emitting light; the light guide film 52 is used to guide the light emitted from the side of the light-emitting module 3 to the first light-transmitting part 42; the second emitting film 53 is used to reflect the upward-transmitted light in the light guide film 52 downward, so that the upward light returns to the light guide film layer; the lens 54 is used to compensate for the thickness of the stack and realize the upward light guiding transition, and the thickness of the lens 54 is adjustable; the diffuser film 55 is used to uniformly diffuse the upward-transmitted light; the second light-shielding film 56 is used to shield the light in the non-appearance display area and assist in realizing the irregular light-emitting effect.

[0111] As shown in Figures 4 to 6, the first foam f1 is fixedly connected to the first emitting film 51 through the second adhesive layer f2, the light guide film 52 is stacked on the first emitting film 51, the second emitting film 53 and the lens 54 are stacked side by side on the light guide film 52, the second emitting film 53 is fixedly connected to the decorative ring bracket 4 through the first adhesive layer e3, the lens 54 is fixedly connected to the light guide film 52 through the first optical grade transparent double-sided adhesive layer e1, the diffuser film 55 is fixedly connected to the lens 54 through the second optical grade transparent double-sided adhesive layer e2, and the second light-shielding film 56 is attached to the diffuser film 55.

[0112] Among them, the second light-shielding film 56 is a light-shielding black film.

[0113] Optionally, the thickness of the first emitting film 51 is approximately 0.04 mm, the thickness of the first adhesive layer e3 is approximately 0.1 mm, the thickness of the second emitting film 53 is approximately 0.04 mm, and the thickness of the light guide film 52 is 0.125 mm. It should be noted that the thicknesses of the first emitting film 51, the first adhesive layer e3, the second emitting film 53, and the light guide film 52 are merely examples and are not intended to be limiting; they can be set according to actual needs in specific implementations.

[0114] Specifically, the light transmission path includes: light emitted by the light-emitting module 3 is directed into the light guide film 52, the first emitting film 51, and the second emitting film 53 respectively; wherein, the light directed into the first emitting film 51 is reflected into the light guide film 52, and the light directed into the second emitting film 53 is also reflected into the light guide film 52. The light is transmitted from the light guide film 52 to the lens 54. The light that penetrates the lens 54 passes through the diffusion film 55 and is emitted from the second light-transmitting part 81.

[0115] In the above embodiments, each light guide layer in the light guide component 5 achieves a high light guide rate through an ultra-thin stacked design, which reduces power consumption and enhances display brightness.

[0116] In some embodiments, as shown in FIG1, the electronic device further includes:

[0117] The decorative piece 8 is disposed on the side of the decorative ring bracket 4 facing away from the housing;

[0118] The decorative piece 8 has a second light-transmitting part 81, which is directly opposite the first light-transmitting part 42.

[0119] For example, the second light-transmitting portion 81 is an annular transparent area, serving as a light-emitting display area. The annular shape here is merely an example; in specific implementations, the second light-transmitting portion 81 can be adjusted to different shapes as needed.

[0120] In some embodiments, as shown in FIG1, the electronic device further includes: a first lens decoration ring assembly 91 and a second lens decoration ring assembly 92;

[0121] The decorative panel 8 is also provided with a second through hole 82 and a third through hole 83;

[0122] The first lens decorative ring assembly 91 is fixedly connected to the decorative ring bracket 4 through the second through hole 82, and the second lens decorative ring assembly 92 is fixedly connected to the decorative ring bracket 4 through the third through hole 83.

[0123] In a specific implementation, as shown in Figures 1 and 2, the decorative ring assembly A includes: a decorative ring bracket 4, an outer decorative piece 8, a light guide assembly 5, a first lens decorative ring assembly 91, and a second lens decorative ring assembly 92; wherein, the light guide assembly 5 is fixedly connected to one side of the decorative ring bracket 4, and the outer decorative piece 8 is fixedly connected to the other side of the decorative ring bracket 4. The first lens decorative ring assembly 91 and the second lens decorative ring assembly 92 are disposed on the side of the outer decorative piece 8 away from the decorative ring bracket 4, and the outer decorative piece 8 is sandwiched between the lens decorative ring assembly and the decorative ring bracket 4.

[0124] In some embodiments, as shown in FIG1, the second through hole 82, the third through hole 83, and the second light-transmitting portion 81 are arranged side by side and spaced apart on the exterior decorative piece 8.

[0125] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0126] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0127] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, comprising: The housing forms a receiving cavity; The motherboard is disposed within the receiving cavity; A light-emitting module, which is electrically connected to the motherboard; The decorative ring bracket is disposed on the side of the housing away from the receiving cavity. The side of the decorative ring bracket facing the housing includes a first region. The periphery of the first region is provided with a flange structure. The first region includes a first light-transmitting portion. A first light-shielding film is sealed to the flange structure to form a shielding space; A light guide component is disposed within the shielding space, and the light emitted by the light-emitting module is transmitted to the first light-transmitting part through the light guide component.

2. The electronic device of claim 1, wherein, The light-emitting module is disposed within the shielding space; The first light-shielding film has an opening, through which the light-emitting module is electrically connected to the motherboard. 3.The electronic device of claim 1, wherein, The electronic device also includes: A motherboard bracket is provided with an angled mounting slot. One end of the light-emitting module is assembled into the angled mounting slot, and the other end of the light-emitting module is fixedly connected to the motherboard bracket. The bottom of the angled mounting slot is provided with a first through hole, through which the light-emitting module is electrically connected to the motherboard.

4. The electronic device of claim 3, wherein, The light-emitting module includes: A circuit board, wherein a light-emitting element is provided on the circuit board; A shielding cover is provided on the light-emitting element, and the shielding cover has a light-emitting port that is directly opposite the light-inlet port of the light guide assembly. 5.The electronic device of claim 2, wherein, The electronic device also includes: A motherboard bracket is fixedly connected to a second region on the first light-shielding film, the second region being directly opposite the light-emitting module and surrounding the opening.

6. The electronic device according to claim 1, wherein, A heightening pad is provided at one end of the light guide assembly near the light-emitting module, and the heightening pad is located on the side of the light guide assembly away from the decorative ring bracket.

7. The electronic device of claim 1, wherein, The light guide assembly includes: a first emitting film, a light guide film, a second emitting film, a lens, a diffuser film, and a second light-shielding film; The light guide film is stacked on the first emitting film, the second emitting film and the lens are stacked side by side on the light guide film, the diffusion film is stacked on the lens, and the second light-shielding film is stacked on the diffusion film, the second light-shielding film being smaller than the diffusion film; The lens and the diffusion film are directly opposite the first light-transmitting portion.

8. The electronic device according to claim 1, wherein, The electronic device also includes: An exterior decorative piece, wherein the exterior decorative piece is disposed on the side of the decorative ring bracket opposite to the housing; The decorative piece has a second light-transmitting part, which is directly opposite the first light-transmitting part.

9. The electronic device of claim 8, wherein, The electronic device further includes: a first lens decorative ring assembly and a second lens decorative ring assembly; The decorative panel also has a second through hole and a third through hole; The first lens decorative ring assembly is fixedly connected to the decorative ring bracket through the second through hole, and the second lens decorative ring assembly is fixedly connected to the decorative ring bracket through the third through hole.

10. The electronic device of claim 9, wherein, The second through hole, the third through hole, and the second light-transmitting portion are arranged side by side and spaced apart on the exterior decorative piece.

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