VC vapor chamber
Patent Information
- Application Number
- PCT/CN2026/090486
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-08-11
- Filing Date
- 2026-04-14
- Publication Date
- 2026-09-17
Smart Images
Figure CN2026090486_17092026_PF_FP_ABST
Abstract
Description
A VC heat spreader Technical fields:
[0001] This invention relates to the field of vapor chamber design technology, and specifically to a VC vapor chamber. Background technology:
[0002] Currently, most smart devices use VC (Vacuum Coil) heat sinks for cooling. The basic principle is that the liquid in the vacuum chamber of the VC heat sink dissipates heat through rapid evaporation and condensation. Most VC heat sinks used in current consumer electronics applications are flat, and their connection to the mid-plate is often a bonding method. Therefore, the thickness of both the mid-plate and the VC heat sink in the final device application results in a relatively large overall device thickness. Summary of the Invention:
[0003] In view of this, the present invention provides a VC heat exchange plate to solve the problem of the large overall thickness caused by the bonding of the middle plate and the VC heat exchange plate.
[0004] This invention provides a VC heat spreader, comprising:
[0005] The middle plate is equipped with a receiving groove;
[0006] The cover plate is fixed inside the receiving groove, forming a vacuum cavity with the bottom of the receiving groove;
[0007] A support structure is provided between the cover plate and the bottom of the receiving groove, and there is a gap between adjacent support structures;
[0008] Capillary structures are arranged on the side of the cover plate facing the vacuum chamber;
[0009] The vacuum chamber is filled with a cooling medium.
[0010] In this application, the vacuum chamber, supporting structure, and capillary structure form the physical basis of the VC vapor chamber. Integrating the traditional middle plate into the VC vapor chamber eliminates the thickness accumulation caused by the independent middle plate, thus reducing the overall thickness of the device. The cooling medium within the vacuum chamber achieves efficient heat transfer through phase change circulation, while the gaps in the supporting structure ensure unobstructed vapor flow channels. Specifically, heat from the hot end can be conducted from the side of the cover plate into the vacuum chamber, causing the cooling medium to vaporize and flow to the cold end. The vapor condenses at the cold end, releasing heat, and the condensed liquid returns to the hot end under the capillary action of the capillary structure, thereby achieving cyclic heat dissipation.
[0011] In one alternative embodiment, the surfaces of the cover plate and the middle plate are flush.
[0012] In this application, the flush surface of the cover plate and the middle plate avoids height differences, achieving a flat upper surface for the module. This provides greater flexibility in the layout of other electronic components and prevents protruding structures from encroaching on the space of devices such as batteries and cameras. The flush surface allows heat to easily and evenly diffuse from the hot end to the cold end, preventing the formation of localized hot spots. Surface flushness also avoids stress concentration problems caused by height misalignment, improving structural reliability.
[0013] In one alternative embodiment, the surface area of the middle plate is greater than the surface area of the cover plate.
[0014] In this application, the key design feature of a middle plate with a larger surface area than the cover plate enables the VC heat sink to simultaneously fulfill both mechanical support and heat dissipation functions. The middle plate provides ample mechanical bearing surface, supporting both the motherboard and the sub-board areas.
[0015] In one alternative embodiment, the surface area of the cover plate is 20% to 90% of the surface area of the middle plate.
[0016] In this application, limiting the cover plate area to a specific ratio range of the middle plate area balances the heat dissipation efficiency and structural strength of the VC vapor chamber. The lower limit of the ratio ensures that the cover plate has sufficient heat dissipation area to maintain the efficiency of the evaporation-condensation cycle; the upper limit of the ratio reserves sufficient edge area of the middle plate for the deployment of connection structures and assembly positioning holes, while also meeting mechanical strength requirements. Too low a ratio will result in insufficient heat dissipation capacity, while too high a ratio will weaken structural integrity.
[0017] In one alternative embodiment, the distance between the edge of the cover plate and the edge of the middle plate is greater than a preset value.
[0018] In this application, the edge of the cover plate and the edge of the middle plate maintain a specific distance, forming a protective buffer area. Sufficient distance prevents heat generated during welding of the middle plate edge to the middle frame from affecting the cover plate, thus ensuring the vacuum chamber's airtightness and preventing leakage due to thermal deformation. The buffer area also provides deployment space for edge connection structures, allowing for stable shaping of the connection structure. The spacing design also disperses assembly stress; when the middle frame is connected to the VC heat spreader, mechanical stress is transferred through the edge area of the middle plate, preventing direct action on the cover plate and thus avoiding capillary damage.
[0019] In one alternative embodiment, the middle plate has pre-drilled assembly positioning holes.
[0020] In this application, the assembly positioning holes facilitate the assembly of the middle plate with functional devices in the end application.
[0021] In one alternative embodiment, the distance between the assembly positioning hole and the edge of the cover plate is greater than the minimum safety distance.
[0022] In this application, the assembly positioning hole maintains a minimum safe distance from the edge of the cover plate, which can effectively isolate the mechanical stress of the drilling process and prevent microcracks from extending to the sealing area of the cover plate.
[0023] In one alternative implementation, it further includes:
[0024] The middle plate is connected to the middle frame via a connecting structure.
[0025] In one optional implementation, the connection structure includes:
[0026] An L-shaped connecting plate is disposed at the edge of the middle plate, and the L-shaped connecting plate is connected to the inner sidewall of the middle frame.
[0027] In this application, the L-shaped connecting plate at the edge of the middle plate is directly connected to the inner sidewall of the middle frame, which ensures the connection strength between the middle frame and the middle plate. The L-shaped connecting plate can serve as a mechanical extension of the middle plate, increasing the connection surface between the middle plate and the middle frame.
[0028] In one optional implementation, the connection structure includes:
[0029] A Z-shaped connecting plate is disposed at the edge of the middle plate, and a protrusion is provided on the inner side wall of the middle frame, and the Z-shaped connecting plate overlaps the protrusion.
[0030] In this application, the Z-shaped connecting plate overlaps the protrusion, forming a Z-shaped constraint. The mating surfaces of the Z-shaped connecting plate and the protrusion can be connected by welding, ensuring the connection strength between the Z-shaped connecting plate and the middle frame when encountering mechanical vibration. Attached Figure Description
[0031] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0032] Figure 1 is a schematic diagram of the assembly of a traditional VC heat spreader and middle plate;
[0033] Figure 2 is a schematic diagram of a traditional VC heat spreader structure;
[0034] Figure 3 is a schematic diagram of the VC heat spreader structure according to an embodiment of the present invention;
[0035] Figure 4 is a schematic diagram of the assembly positioning hole positions according to an embodiment of the present invention;
[0036] Figure 5 is a schematic diagram of the motherboard area location in an embodiment of the present invention;
[0037] Figure 6 is a schematic diagram of the position of the L-shaped connecting plate in an embodiment of the present invention;
[0038] Figure 7 is a schematic diagram of the position of the Z-shaped connecting plate in an embodiment of the present invention.
[0039] Explanation of reference numerals in the attached drawings: 1. Middle plate; 2. Cover plate; 3. Vacuum cavity; 4. Capillary structure; 5. Assembly positioning hole; 6. Support column; 7. L-shaped connecting plate; 8. Middle frame; 9. Z-shaped connecting plate; 10. Protrusion. Detailed implementation method:
[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0041] The high speed and low latency of the 5G era bring consumers a better experience, but it also significantly increases the power consumption of electronic devices, leading to increased heat generation. On the other hand, the functions of electronic devices in the 5G era are gradually increasing and becoming more complex, while the size of the devices themselves is gradually shrinking, thus placing higher demands on the heat dissipation capabilities and the thinner and lighter design of electronic devices.
[0042] Most current smartphones use VC (Vacuum Coil) heat dissipation plates for cooling. The basic principle is that the liquid in the vacuum chamber of the VC heat dissipates heat through rapid circulation of evaporation and condensation. Currently, most VC heat dissipation plates used in consumer electronics are flat, therefore, they are often bonded to the mid-plate, as shown in Figure 1. In this case, the Z-axis thickness of the smartphone's mid-plate and VC heat dissipation plate includes the mid-plate thickness (>0.35mm) and the VC heat dissipation plate thickness (0.2-0.5mm), preventing further reduction in the overall thickness of the device.
[0043] One of the main demands of consumers for smartphone products is that they be thinner and lighter. Therefore, this invention combines the functions of a VC heat dissipation plate and a middle plate to provide a VC heat dissipation plate that can replace the middle plate in current smartphone designs. In this case, the overall thickness of the VC heat dissipation plate and the middle plate is only the thickness of the VC heat dissipation plate, which can achieve weight reduction and thinning of the whole device.
[0044] The embodiments of the present invention are described below with reference to Figures 1 to 7.
[0045] Example 1
[0046] According to an embodiment of the present invention, as shown in FIG3, a VC heat spreader is provided, comprising:
[0047] Middle plate 1 is provided with a receiving groove;
[0048] Cover plate 2 is fixed inside the receiving groove, forming a vacuum cavity 3 with the bottom of the receiving groove;
[0049] The middle plate 1 and the cover plate 2 can be made of the same material or different materials, including but not limited to copper, stainless steel, titanium, steel-copper composite materials, copper-aluminum composite materials, aluminum-based composite materials, etc.
[0050] A support structure is provided between the cover plate 2 and the bottom of the receiving groove, and there is a gap between adjacent support structures; the support structure can be a support column 6.
[0051] Capillary structure 4 is arranged on the side of cover plate 2 facing vacuum chamber 3;
[0052] The middle plate 1 and the cover plate 2 can be processed separately. The support column 6 is connected to the middle plate 1, and the structure of the support column 6 can be completed by etching or stamping. The capillary structure 4 can be made of the same material as the cover plate 2, and can be processed by etching or sintering copper mesh. The middle plate 1 and the cover plate 2 can be connected by, but are not limited to, thermal diffusion welding, laser welding, etc.
[0053] The vacuum chamber 3 is filled with a cooling medium, which can be water.
[0054] In this application, the vacuum chamber 3, the supporting structure, and the capillary structure 4 constitute the physical basis of the VC heat exchanger. As shown in Figure 2, a traditional VC heat exchanger includes an upper cover plate and a lower cover plate, forming a vacuum chamber in the middle. In this application, a middle plate with a receiving groove replaces the upper or lower cover plate, and together with the cover plate, forms a vacuum chamber. This application integrates the middle plate into the VC heat exchanger, eliminating the thickness superposition caused by the independent middle plate 1, thus reducing the overall thickness of the machine. The cooling medium in the vacuum chamber 3 achieves efficient heat transfer through phase change circulation, while the gaps in the supporting structure ensure unobstructed steam flow channels. Specifically, the heat at the hot end can be conducted from the side of the cover plate 2 into the vacuum chamber 3, causing the cooling medium to vaporize and flow to the cold end. The steam condenses at the cold end, releasing heat, and the condensed liquid can return to the hot end under the capillary action of the capillary structure 4, thereby achieving cyclic heat dissipation. This application combines the functional structure of the VC heat exchanger with the middle plate 1 to achieve Z-axis thinning, supporting the overall thinning and weight reduction of the machine. Here, the Z-axis refers to the thickness direction.
[0055] In one alternative embodiment, the surfaces of the cover plate 2 and the middle plate 1 are flush.
[0056] In this application, the flush surface of the cover plate 2 and the middle plate 1 avoids height differences and achieves a flat upper surface for the module. This provides greater flexibility in the layout of other electronic components and prevents the protruding structure 10 from encroaching on the space of devices such as batteries and cameras. The flush surface allows heat to easily and evenly diffuse from the hot end to the cold end, preventing the formation of localized hot spots. The flush surface also avoids stress concentration problems caused by height misalignment, improving structural reliability.
[0057] In one alternative embodiment, the surface area of the middle plate 1 is greater than the surface area of the cover plate 2. As shown in FIG4, the surface areas of the middle plate 1 and the cover plate 2 refer to the surface areas of the sides of the middle plate 1 and the cover plate 2 that are flush with each other.
[0058] In this application, the key design feature of the middle plate 1 having a larger surface area than the cover plate 2 enables the VC heat sink to simultaneously fulfill both mechanical support and heat dissipation functions. The middle plate 1 provides ample mechanical bearing surface, supporting both the motherboard area and the small board area.
[0059] In one optional embodiment, as shown in FIG4, the surface area of the cover plate 2 is 20% to 90% of the surface area of the middle plate 1. This allows for the assembly of the middle plate 1 with smartphone functional components (motherboard area, small board area, etc.) while ensuring sufficient heat dissipation. As shown in FIG5, the motherboard area can be fitted to the end of the cover plate 2.
[0060] In this application, limiting the area of the cover plate 2 to a specific ratio range relative to the area of the middle plate 1 balances the heat dissipation efficiency and structural strength of the VC heat sink. The lower limit of the ratio ensures that the cover plate 2 has sufficient heat dissipation area to maintain the efficiency of the evaporation-condensation cycle; the upper limit of the ratio reserves sufficient edge area of the middle plate 1 for the deployment of connection structures and assembly positioning holes 5, while also meeting mechanical strength requirements. Too low a ratio will result in insufficient heat dissipation capacity, while too high a ratio will weaken structural integrity.
[0061] In one optional embodiment, the distance between the edge of the cover plate 2 and the edge of the middle plate 1 is greater than a preset value. The cover plate 2 may be located in the middle of the middle plate 1. The preset value may be expressed as a distance determined by a specific numerical value, such as 5mm or 8mm. However, this embodiment is not limited to the aforementioned distance, and the selection of the specific preset value should be based on actual process requirements. The preset value may also be expressed as N times the thickness of the middle plate 1 or the cover plate 2, where N is an integer, and the specific selection of N should be based on actual process requirements.
[0062] In this application, the edge of the cover plate 2 and the edge of the middle plate 1 maintain a specific distance, forming a protective buffer area. Sufficient distance prevents heat generated during welding of the middle plate 1 to the middle frame 8 from affecting the cover plate 2, thus ensuring the airtightness of the vacuum chamber 3 and preventing leakage due to thermal deformation. The buffer area also provides deployment space for edge connection structures, allowing for stable shaping of the connection structure. The spacing design also disperses assembly stress; when the middle frame 8 is connected to the VC heat spreader, mechanical stress is transferred through the edge area of the middle plate 1, preventing direct application to the cover plate 2 and damage to the capillary structure 4.
[0063] In one alternative embodiment, as shown in FIG4, the middle plate 1 has pre-drilled assembly positioning holes 5.
[0064] In this application, the assembly positioning hole 5 facilitates the assembly of the middle plate 1 with functional components (main board area, small board area, etc.) in the terminal application.
[0065] In one alternative embodiment, the distance between the assembly positioning hole 5 and the edge of the cover plate 2 is greater than the minimum safety distance.
[0066] In this application, the assembly positioning hole 5 maintains a minimum safe distance from the edge of the cover plate 2, which can effectively isolate the mechanical stress of the drilling process and prevent microcracks from extending to the sealing area of the cover plate 2. The minimum safe distance can be expressed as a distance determined by a specific value such as 2mm or 3mm. This application embodiment is not limited to the aforementioned distance, and the specific selection of the minimum safe distance should be based on actual process requirements. The minimum safe distance can also be expressed as N times the thickness of the middle plate 1 or the cover plate 2, where N is an integer, and the specific selection of N should be based on actual process requirements.
[0067] In one alternative implementation, it further includes:
[0068] The middle plate 1 of the VC heat spreader is connected to the middle frame 8 through the connection structure.
[0069] In one optional implementation, as shown in FIG6, the connection structure includes:
[0070] An L-shaped connecting plate 7 is disposed at the edge of the middle plate 1 of the VC heat exchanger, and the L-shaped connecting plate 7 is connected to the inner sidewall of the middle frame 8. Specifically, the short side of the L-shaped connecting plate 7 is connected to the edge of the middle plate 1, and the surface of the long side is connected to the inner sidewall of the middle frame 8. The contact length between the surface of the long side and the inner sidewall of the middle frame 8 can be considered as the connection length, and the connection length is not less than 2mm.
[0071] In this application, the L-shaped connecting plate 7 at the edge of the middle plate 1 is directly connected to the inner sidewall of the middle frame 8, which ensures the connection strength between the middle frame 8 and the middle plate. The L-shaped connecting plate 7 can serve as a mechanical extension of the middle plate 1, increasing the connection surface between the middle plate 1 and the middle frame 8.
[0072] In one alternative implementation, as shown in FIG7, the connection structure includes:
[0073] A Z-shaped connecting plate 9 is disposed at the edge of the middle plate 1 of the VC heat exchanger. A protrusion 10 is provided on the inner sidewall of the middle frame 8. The shape of the Z-shaped connecting plate 9 is adapted to the protrusion 10, and the Z-shaped connecting plate 9 overlaps the protrusion 10. Specifically, the Z-shaped connecting plate 9 has a slot for the protrusion 10 to be inserted into, as shown in Figure 7. Both the horizontal and vertical surfaces of the Z-shaped connecting plate 9 are connected to the protrusion 10. The length of the connection between the horizontal surface of the Z-shaped connecting plate 9 and the protrusion 10 can be considered as the overlap width, which is not less than 2 mm.
[0074] In this application, the Z-shaped connecting plate 9 overlaps the protrusion 10, forming a Z-shaped constraint. The mating surfaces of the Z-shaped connecting plate 9 and the protrusion 10 can be connected by welding, which can ensure the connection strength between the Z-shaped connecting plate 9 and the middle frame 8 when encountering mechanical vibration.
[0075] This application enables a reliable connection between the traditional VC heat exchange plate and the middle frame 8, and achieves a functional and structural integration between the traditional VC heat exchange plate and the middle frame 8. Compared with the currently commonly used flat VC heat exchange plate and middle plate bonding connection scheme, it can reduce the Z-axis thickness.
[0076] Example 2
[0077] As shown in Figure 7, the cover plate 2 and the middle plate 1 are made of titanium alloy, and the support column 6 and the capillary structure 4 are processed by etching. The thickness of the middle plate 1 is 0.2mm. The edge of the middle plate 1 is connected by a Z-shaped structure, with a Z-shaped connecting plate 9. The overlap width is 2mm, and the distance between the edge of the middle plate 1 and the edge of the cover plate 2 is 5mm. The area ratio of the cover plate 2 to the middle plate 1 is 50%, and the distance between the assembly positioning hole 5 and the edge of the cover plate 2 is 2mm.
[0078] Experiments show that, compared with the commonly used bonding VC heat spreader and middle plate 1 assembly structure in the industry, this structure can achieve an overall Z-axis thinning of 0.35mm-0.65mm.
[0079] Example 3
[0080] As shown in Figure 6, the cover plate 2 and the middle plate 1 are made of titanium alloy, and the support column 6 and the capillary structure 4 are processed by etching. The thickness of the middle plate 1 is 0.25mm. The edge of the middle plate 1 is connected by an L-shaped structure, which is connected to the L-shaped connecting plate 7. The overlap width is 2mm, and the distance from the edge of the middle plate 1 to the edge of the cover plate 2 is 5mm. The area ratio of the VC heat exchanger cover plate 2 to the middle plate 1 is 70%. The distance between the assembly positioning hole 5 and the edge of the VC heat exchanger cover plate 2 is 2mm.
[0081] Experiments show that, compared with the commonly used bonding VC heat spreader and middle plate 1 assembly structure in the industry, this structure can achieve an overall thickness reduction of 0.3mm-0.6mm in the Z direction.
[0082] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.
Claims
1. A VC heat spreader, characterized in that, include: The middle plate (1) is provided with a receiving groove; The cover plate (2) is fixed in the receiving groove, forming a vacuum cavity (3) with the bottom of the receiving groove; A support structure is provided between the cover plate (2) and the bottom of the receiving groove, and there is a gap between adjacent support structures; Capillary structure (4) is arranged on the side of the cover plate (2) facing the vacuum cavity (3); The vacuum chamber (3) is filled with a cooling medium.
2. The VC heat spreader according to claim 1, characterized in that, The surfaces of the cover plate (2) and the middle plate (1) are flush.
3. The VC heat spreader according to claim 1, characterized in that, The surface area of the middle plate (1) is greater than the surface area of the cover plate (2).
4. The VC heat spreader according to claim 3, characterized in that, The surface area of the cover plate (2) is 20% to 90% of the surface area of the middle plate (1).
5. The VC heat spreader according to claim 1, characterized in that, The distance between the edge of the cover plate (2) and the edge of the middle plate (1) is greater than a preset value.
6. The VC heat spreader according to claim 1, characterized in that, The middle plate (1) has pre-drilled assembly positioning holes (5).
7. The VC heat spreader according to claim 6, characterized in that, The distance between the assembly positioning hole (5) and the edge of the cover plate (2) is greater than the minimum safety distance.
8. The VC heat spreader according to claim 1, characterized in that, Also includes: The middle plate (1) is connected to the middle frame (8) through the connection structure.
9. The VC heat spreader according to claim 8, characterized in that, The connection structure includes: An L-shaped connecting plate (7) is disposed at the edge of the middle plate (1), and the L-shaped connecting plate (7) is connected to the inner sidewall of the middle frame (8).
10. The VC heat spreader according to claim 8, characterized in that, The connection structure includes: A Z-shaped connecting plate (9) is provided at the edge of the middle plate (1), and a protrusion (10) is provided on the inner side wall of the middle frame (8), and the Z-shaped connecting plate (9) overlaps the protrusion (10).