Cartridge for an analyser, method and device for producing a cartridge

Abstract

The invention relates to a cartridge (100) for an analyser. The cartridge (100) comprises at least an analysis element (105) and a carrier layer (110). The carrier layer (110) has at least one channel for conducting compressed air and / or at least one channel for conducting a fluid to be analysed to the analysis element (105). In the carrier layer (110), the at least one analysis element (105) is received on a step (120) of a cavity (115) and is held by means of a projection. The projection is arranged on an opposite side of the step (120) and / or engages in at least one part of the analysis element (105).

Description

[0001] R. 417075

[0002] - 1 -

[0003] Description

[0004] title

[0005] Cartridge for an analyzer, method and apparatus for manufacturing a cartridge

[0006] State of the art

[0007] The invention relates to a cartridge for an analytical instrument, a method, and a device for manufacturing a cartridge according to the preamble of the independent claims. The present invention also relates to a computer program.

[0008] An analyzer may have a cartridge that can be used, for example, to analyze a patient's sample as a fluid.

[0009] Disclosure of the invention

[0010] Against this background, the approach presented here introduces a cartridge for an analytical instrument, a method and a device that uses this method, and finally a corresponding computer program according to the main claims. Advantageous further developments and improvements of the device specified in the independent claim are possible through the measures listed in the dependent claims.

[0011] The advantages achievable with the approach presented here lie in particular in the creation of a cartridge that enables a reliable force-fit and / or form-fit arrangement of at least one analysis element in a carrier layer of the cartridge. R. 417075

[0012] - 2 -

[0013] A cartridge for an analyzer is presented. The cartridge comprises at least one analyzer element and a carrier layer. The carrier layer has at least one channel for conveying compressed air and / or at least one channel for conveying a fluid to be analyzed to the analyzer element. Within the carrier layer, the at least one analyzer element is mounted on a step of a cavity and held in place by a projection. The projection is located on the opposite side of the step and / or engages in at least a portion of the analyzer element.

[0014] The analyzer can be a compact device for molecular diagnostics. It can accommodate a cartridge, which can be a familiar lab-on-a-chip cartridge used, for example, to analyze a patient sample as a fluid. The cartridge can include a microfluidic network for processing fluids. The substrate layer can be a fluid layer and / or a pneumatic layer. Furthermore, the substrate layer can have at least one connection for attaching the cartridge to a pump and / or the analyzer. More precisely, the cartridge can consist of different layers, such as a pneumatic layer and a fluid layer, each of which can be made of transparent polycarbonate (PC). The pneumatic layer can contain various channels that conduct compressed air or have connections to pumps and the analyzer.Aqueous solutions and subsequently oils can flow through the channels of the fluid layer. A thin black thermoplastic polyurethane film, or TPU for short, can separate the fluid layer from the pneumatic layer.

[0015] An adhesive and / or sealant may be applied or can be applied to the cavity in the step area. The analyzer can be reliably and securely positioned on the adhesive and / or sealant. The adhesive may have a high viscosity. The sealant may be a wet seal or a dry seal / insert seal.

[0016] The adhesive and / or sealant can be arranged in a recess on a wall of the step. This enables a secure seal or bond between the analysis element and the substrate. R. 417075

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[0018] The adhesive and / or sealant can be UV-curable. This allows for the simple production of such a cartridge.

[0019] The projection can be designed as a locking lug. In this way, the projection can function as a fastening element and reliably and cost-effectively position or hold the analysis element in the cavity of the substrate layer.

[0020] The projection can be formed from the substrate layer using thermoformed material, or can be formed from it. Hot forming allows the substrate layer to be deformed advantageously and cost-effectively, enabling the projection to be created.

[0021] The projection can be arranged around the entire cavity. This allows for a reliable and secure positioning of the analysis element within the cavity.

[0022] The analytical element can be configured at least partially as a semiconductor element and / or at least partially as a thermal interface material. The semiconductor element can be a chip, for example, a silicon chip. The thermal interface material can be a gap pad. Due to its high thermal conductivity and cost-effective manufacturing capabilities, the semiconductor element can be used in medical technology. The fine microcavities / structures within the semiconductor element can contain a fluorescent, test-relevant agent. In PCR testing, for example, the enzymatic reaction can take place within the fine microcavity structures of the semiconductor element. The high thermal conductivity of the semiconductor element allows for the rapid transfer of high temperatures / temperature changes from external sources (heating) to the microcavities / structures via the thermal interface material.A temperature change may be required for the enzymatic reaction. R. 417075.

[0023] - 4 -

[0024] The substrate layer can be made of a plastic material, especially polycarbonate. Polycarbonate can be highly durable and extremely impact-resistant.

[0025] A method for manufacturing an embodiment of a cartridge mentioned herein comprises a provisioning step and an arranging step. In the provisioning step, the at least one analysis element and the carrier layer are provided. The carrier layer has at least one channel for guiding compressed air and / or at least one channel for guiding a fluid to be analyzed to the analysis element, wherein the carrier layer has at least one step in a cavity. In the arranging step, the analysis element is arranged on the step, further comprising a projection of the carrier layer such that the projection is located on a side of the analysis element opposite the step and / or that the projection engages in at least a portion of the analysis element.

[0026] The positioning step can be carried out by thermoplastically deforming the carrier layer to form the projection and / or by snapping a locking lug into place as a projection.

[0027] In the arranging step, an adhesive and / or a sealant can be applied to at least part of the stage before the analysis element is inserted.

[0028] This process can be implemented, for example, in software or hardware, or in a hybrid form of software and hardware, for example in a control unit.

[0029] The approach presented here further creates a device designed to carry out, control, and implement the steps of a variant of the method presented here in appropriate facilities. This embodiment of the invention in the form of a device also allows the problem underlying the invention to be solved quickly and efficiently. R. 417075

[0030] - 5 -

[0031] For this purpose, the device may have at least one processing unit for processing signals or data, at least one storage unit for storing signals or data, at least one interface to a sensor or actuator for reading sensor signals from the sensor or for outputting data or control signals to the actuator, and / or at least one communication interface for reading or outputting data embedded in a communication protocol. The processing unit may, for example, be a signal processor, a microcontroller, or the like, and the storage unit may be flash memory or a magnetic storage unit.The communication interface can be configured to read or output data wirelessly and / or via wired connections, whereby a communication interface that can read or output wired data can, for example, read this data electrically or optically from or output it into a corresponding data transmission line.

[0032] In this context, a device can be understood as an electrical device that processes sensor signals and outputs control and / or data signals accordingly. The device may have an interface, which can be implemented in hardware and / or software. In the case of a hardware-based interface, the interfaces can, for example, be part of a so-called system ASIC, which incorporates various functions of the device. However, it is also possible that the interfaces are separate integrated circuits or consist at least partially of discrete components. In the case of a software-based interface, the interfaces can be software modules, which, for example, are present on a microcontroller alongside other software modules.

[0033] Also advantageous is a computer program product or computer program with program code that may be stored on a machine-readable carrier or storage medium such as semiconductor memory, hard disk memory, or optical memory and is used to carry out, implement, and / or control the steps of the method according to one of the embodiments described above, particularly if the program product or program is executed on a computer or device. R. 417075

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[0035] Examples of the approach presented here are shown in the drawings and explained in more detail in the following description. It shows:

[0036] Fig. 1 shows a schematic representation of an exemplary embodiment of a cartridge;

[0037] Fig. 2 shows a schematic representation of an exemplary embodiment of a cartridge;

[0038] Fig. 3 shows a schematic representation of an exemplary embodiment of a cartridge;

[0039] Fig. 4 shows a schematic representation of a pressure element to illustrate an exemplary embodiment of a cartridge;

[0040] Fig. 5 shows a schematic representation of an exemplary embodiment of a cartridge;

[0041] Fig. 6 shows a schematic representation of an exemplary embodiment of a cartridge;

[0042] Fig. 7 shows a schematic representation of an exemplary embodiment of a cartridge;

[0043] Fig. 8 shows a schematic representation of an exemplary embodiment of a cartridge;

[0044] Fig. 9 shows a schematic representation of an exemplary embodiment of a cartridge;

[0045] Fig. 10 is a schematic representation of an exemplary embodiment of a cartridge; R. 417075

[0046] - 7 -

[0047] Fig. 11 shows a schematic representation of an exemplary embodiment of a cartridge;

[0048] Fig. 12 shows a schematic representation of an exemplary embodiment of a cartridge;

[0049] Fig. 13 shows a schematic representation of an exemplary embodiment of a cartridge;

[0050] Fig. 14 shows a schematic representation of an exemplary embodiment of a cartridge;

[0051] Fig. 15 shows a schematic representation of an exemplary embodiment of a cartridge;

[0052] Fig. 16 shows a schematic representation of an exemplary embodiment of a cartridge;

[0053] Fig. 17 shows a schematic representation of an exemplary embodiment of a cartridge;

[0054] Fig. 18 shows a schematic representation of an exemplary embodiment of a cartridge;

[0055] Fig. 19 shows a schematic representation of a carrier layer to illustrate an exemplary embodiment of a cartridge;

[0056] Fig. 20 shows a schematic representation of a method for producing an exemplary embodiment of a cartridge;

[0057] Fig. 21 shows a schematic representation of a device for manufacturing an exemplary embodiment of a cartridge;

[0058] Fig. 22 is a schematic representation of a device for manufacturing an embodiment of a cartridge; R. 417075

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[0060] Fig. 23 shows a schematic representation of a device for manufacturing an exemplary embodiment of a cartridge;

[0061] Fig. 24 shows a schematic representation of an exemplary embodiment of a cartridge;

[0062] Fig. 25 is a schematic representation of a template to illustrate an exemplary embodiment of a cartridge;

[0063] Fig. 26 is a schematic representation of a printing process using a stencil to illustrate an exemplary embodiment of a cartridge;

[0064] Fig. 27 shows a schematic representation of an application process using a roller to illustrate an exemplary embodiment of a cartridge;

[0065] Fig. 28 is a schematic representation of a roller to illustrate an exemplary embodiment of a cartridge;

[0066] Fig. 29 shows a schematic partial representation of a roller to illustrate an exemplary embodiment of a cartridge;

[0067] Fig. 30 shows a schematic partial representation of a roller to illustrate an exemplary embodiment of a cartridge;

[0068] Fig. 31 shows a schematic representation of an application process using a roller to illustrate an exemplary embodiment of a cartridge;

[0069] Fig. 32 shows a flowchart of an embodiment of a method for manufacturing a cartridge; and

[0070] Fig. 33 shows a block diagram of an exemplary embodiment of a device for manufacturing a cartridge. R. 417075

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[0072] In the following description of favorable embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and acting similarly, without repeating these elements.

[0073] Fig. 1 shows a schematic representation of an embodiment of a cartridge 100 for an analyzer. More precisely, a section of the cartridge 100 is shown in sectional view.

[0074] The cartridge 100 contains at least one analytical element 105 and a carrier layer 110. The carrier layer 110 is, for example, made of polycarbonate and has a cavity 115, wherein the cavity 115 forms at least one step 120. For illustrative purposes only, the cavity 115 forms step 120 and a further step 125. The analytical element 105 is incorporated at steps 120 and 125 within the cavity 115.

[0075] According to one embodiment, the analysis element 105 is configured as a semiconductor element 130 and a thermal interface element 135. In Fig. 1, the semiconductor element 130 is arranged in the cavity 115 on the steps 120 and 125, and the thermal interface element 135 is arranged in the cavity 115 above the semiconductor element 130. The semiconductor element 130 is, for example, a silicon chip, and the thermal interface element 135 is, for example, a gap pad, so that the analysis element 105 can also be referred to as a gap pad / Si chip unit. The analysis element 105 has a lower height than the cavity 115, so that the analysis element 105 is completely contained within the cavity 115. By hot forming at least a section of the support layer, the analysis element 105 can be arranged in the support layer 110 in a form-fitting and / or material-fitting and / or force-fitting manner.This process is explained in more detail in Figures 2 to 11 below.

[0076] The approach presented in Figures 1 to 11 can also be described as a polycarbonate compound with a Si chip or with a gap pad / Si chip unit produced by hot forming for a cartridge of 100 with a preheated die. R. 417075

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[0078] To fix the semiconductor element 130 to the support layer 110 and to seal the fluid, the approach presented here describes a joining method by means of force-locking and form-locking hot forming of the support layer 110 made of polycarbonate.

[0079] A die with a contact surface, particularly a square one, is used for hot forming with the polycarbonate, as shown in Fig. 2 and subsequent figures. The size and shape, here a square, of the contact surface depend on the size and shape of the semiconductor element 130 and preferably the heat-conducting element. The semiconductor element 130 or the heat-conducting element 135, depending on the embodiment, is placed on the cavity 115. A groove or chamfer is provided on the heat-conducting element 135 or on the semiconductor element 130, respectively. The preheated die is placed on the support layer 110 at the edge of the semiconductor element 130, as shown in Fig. 2. Due to heat transfer from the die, the polycarbonate softens, and the die force presses the softened polycarbonate into the groove of the heat-conducting element 135, as shown in Fig. 7, or onto the end face of the heat-conducting element 135, as shown in Fig. 2, or of the semiconductor element 130, as shown in Fig. 10.The hot forming process of the polycarbonate, for example, is completed in a few hundred milliseconds. Through deformation, the polycarbonate is interlocked with the semiconductor element 130 or with the thermal conductivity element 135 as the analysis element 105, which can also be referred to as a SiChip unit, and combined into a single component, see Fig.

[0080] 3, 8.

[0081] According to one embodiment, the heat-conducting element 135 and the semiconductor element 130 are fixed at their end faces, as shown and described in Figures 1 to 5. The heat-conducting element 135 and the semiconductor element 130 are joined as a single unit at the end face of the heat-conducting element 135 by thermoplastic forming of the polycarbonate, creating a force-fit and form-fit connection. In this case, the heat-conducting element 135 has a chamfer to facilitate material displacement and reduce the potential for cracking in the displaced polycarbonate.

[0082] According to a further embodiment, the analysis element 105 is fixed laterally, as shown and described in Figures 6 to 8. R. 417075

[0083] - 11 -

[0084] A circumferential groove is generated in the heat-conducting element 135. The groove is filled by plastic thermoforming of the polycarbonate, creating a permanent, force-fit, and form-fit connection. This secures the analysis element 105 to the polycarbonate.

[0085] According to a further embodiment, the semiconductor element 130 is fixed at its end face, as shown and described in Figures 9 to 11. In this embodiment, the semiconductor element 130 is simply inserted into the cavity 115 with a chamfer. The semiconductor element 130 is fixed to the polycarbonate at its end face by thermoplastic forming, thereby creating a force-fit and form-fit connection, including a sealing function.

[0086] In other words, Figures 1 to 11 show that by hot forming using a preheated punch 200, the semiconductor element 130 or the analytical element 105 is precisely and precisely connected to polycarbonate in a force-fit, form-fit and tight manner.

[0087] The approach presented here enables a robust connection between semiconductor element 130 and polycarbonate, or between analytical element 105 and polycarbonate, without the need for any additional material or adhesive. This ensures the required tightness and mechanical stability between the semiconductor element 130 and the polycarbonate. Furthermore, it significantly simplifies the complex dispensing and curing processes, including UV curing, of the adhesive.

[0088] In hygienically demanding medical manufacturing, wet chemicals are avoided. This allows for high strength and tightness, resulting in a force-fit and form-fit connection, as well as a clean and precise joining process. Furthermore, the uniform hot forming on all sides significantly reduces cycle time, eliminating the need for adhesive application and UV curing. Costly adhesive sealing materials and related processes are also eliminated.

[0089] The approach presented here is for creating a robust bond between the polycarbonate plastic, i.e., the carrier layer 110, and the R. 417075.

[0090] - 12 -

[0091] Semiconductor element 130, particularly suitable for use on cartridges 100. Its presence on the product is detectable by visual inspection of the connection areas.

[0092] The approach presented here significantly reduces manufacturing times and saves costs. Sustainability is improved, for example, by eliminating the need for wet chemicals and / or adhesives. Furthermore, this approach enables higher sealing quality and reproducibility, resulting in a lower reject rate.

[0093] Fig. 2 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to or corresponds to the cartridge from Fig. 1.

[0094] The analysis element 105 is arranged in the cavity 115 of the carrier layer 110. A pressure element 200 is heated, for example, and pressed onto the analysis element 105, more precisely onto the heat-conducting element 135. The pressure element 200 is only shown as a stamp for illustrative purposes. An arrow 205 indicates, for illustrative purposes only, the direction in which the force of the pressure element 200 acts. A partial area 202 of the pressure element 200 is heated inductively to 140 to 150 degrees Celsius for illustrative purposes only. Due to the heat transfer from the pressure element 200, at least a part of the carrier layer 110 heats up, causing the heated carrier layer 110 to deform and, for illustrative purposes only, form a projection 210, which is designed, for example, as a locking hook.

[0095] Fig. 3 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to or corresponds to the cartridge in Fig. 2. Fig. 3 shows the state of the cartridge 100 after hot forming. The projection 210 is formed on the opposite side of the step 120 and engages in at least part of the analysis element 105, more precisely in the heat-conducting element 135. Fig. 3 shows the positive and force-fit connection of the analysis element 105 with the carrier layer 110.

[0096] Fig. 4 shows a schematic representation of a pressure element 200 to illustrate an exemplary embodiment of a cartridge. It is similar to or corresponds to R. 417075.

[0097] - 13 -

[0098] The printing element 200 corresponds to the printing element shown in Fig. 2. The printing element 200 is merely an example shaped as a stamp and has a heatable section 202 on one side surface.

[0099] Fig. 5 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to or corresponds to the cartridge in Fig. 2, except that a top view of the cartridge 100 is shown. The cartridge 100 is shown after hot forming. During hot forming, the carrier layer 110 forms the projection 210. The projection 210 is the displaced polycarbonate, which is hot-formed and thus forms the projection 210.

[0100] Fig. 6 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to or corresponds to the cartridge from Fig. 1, except that the heat-conducting element 135 has a groove 600 on its side. Figs. 6 to 8 show the lateral fixing of the analysis element 105 by hot forming of the polycarbonate of the carrier layer 110.

[0101] Fig. 7 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to or corresponds to the cartridge from Fig. 2, except that a lateral fixation of the analysis element 105 by a hot forming of the polycarbonate of the carrier layer 110 is shown.

[0102] Fig. 8 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to or corresponds to the cartridge in Fig. 3, except that the analysis element 105 is laterally fixed by hot forming the polycarbonate of the carrier layer 110. The projection 210 engages laterally in the thermal pad 135, so that a positive-locking and material-locking connection is formed between the carrier layer 110 and the analysis element.

[0103] Fig. 9 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to or corresponds to the cartridge in Fig. 1, except that the analysis element 105 is only the R. 417075

[0104] - 14 -

[0105] Semiconductor element 130, as shown in Figures 9 to 11, is fixed at the end face of the analysis element 105, more precisely the semiconductor element 130, by hot forming of the polycarbonate of the support layer 110.

[0106] Fig. 10 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to or corresponds to the cartridge from Fig. 2, except that the analysis element 105 only comprises the semiconductor element 130.

[0107] Fig. 11 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to or corresponds to the cartridge from Fig. 3, except that the analysis element 105 only comprises the semiconductor element 130.

[0108] Fig. 12 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to the cartridge from one of the figures described above, except that the analysis element is omitted.

[0109] The projection 210 is configured as a fastening element, with two projections 210, 1200 being formed by way of example, which are designed to engage with the analysis element, as shown by way of example in Fig. 15. The carrier layer 110 and the projections 210, 1200 are, for example, formed in one piece. A sealant 1210 is applied to the steps 120, 125 of the cavity 115 by means of a metering element 1205, by way of example. The metering element 1205 can also be referred to as a metering tube and the sealant 1210 can also be referred to as a sealant.

[0110] Figures 12 to 18 show a connection between the polycarbonate of the carrier layer 110 and the semiconductor element or the analytical element by means of the carrier layer 110 with the incorporated projections 210, 1200 for the cartridge 100. The carrier layer 110 can also be referred to as a PC injection molding unit with incorporated clips, wherein the projections 210, 1200 can be referred to as clips and / or clip elements. R. 417075

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[0112] Fig. 13 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to the cartridge in Fig. 12, except that the analysis element 105 is shown. The analysis element 105 can be inserted into the cavity 115, as shown in the following Figures 14 to 15.

[0113] The approach presented in Figures 12 to 18 enables the semiconductor element 130 to be fixed to the carrier layer 110 for sealing the fluid by means of a positive-locking clip connection. The clip connection is realized by the projections 210, 1200. Instead of a strength-optimized adhesive, a sealant 1210 optimized purely for sealing is used. This sealant 1210 is, for example, either a wet seal or a dry seal / insert seal.

[0114] In both cases, the connection strength is achieved via one or more projections 210, 1200, which are merely examples of locking lugs. The projections 210, 1200 are directly injection-molded onto the carrier layer 110, which can also be referred to as the pneumatic layer. The material is, for example, polycarbonate. An additional process is unnecessary, as the contours of the projections 210, 1200 are directly incorporated into the injection mold. This mold is required anyway to produce the "pneumatic layer" component. The projections 210, 1200 exert a reproducible, vertical clamping force on the analysis element 105 and thus also on the seal. When using an insert seal, this causes the seal material to be elastically deformed and permanently compressed. Only then is the sealing function ensured.In an air-curing wet sealant, the specified vertical clip force ensures uniform, reproducible displacement of the sealant. The clip force can be adjusted by the length from cavity 115 to the clip head.

[0115] Figures 12 to 15 show a process flow of the clip connection with the analysis element 105 and the carrier layer 110 using an air-curing wet sealant. The analysis element 105 can be attached with varying numbers of projections 210, 1200, see Figures 16 to 18. The projections 210, 1200 have a circumferential groove on their outer surface so that the R. 417075

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[0117] The spring function of the projections 210, 1200 is given. The semiconductor element 130 has a chamfer, for example 0.5 x 45 degrees, so that it can be easily pressed into the cavity 115 of the support layer 110, which can also be referred to as a pneumatic layer, during the pressing process. This is done, for example, by means of a pressure element. The chamfer also enables a kind of self-centering during the pressing process. In addition, an elastic spring element can be positioned under the projections 210, 1200, which maintains the clipping force even during settling or relaxation, for example of the heat-conducting element 135, by means of the spring action.

[0118] The method shown and described in Figures 12 to 15 enables a firm and robust connection between the analysis element 105 and the carrier layer 110, without additional effort, through the projections 210, 1200 designed as snap-fit ​​lugs. The sealant 1210 merely performs the function of the seal, thus eliminating a strength-relevant function. Furthermore, the aforementioned insert seal allows for the complete elimination of wet chemicals. This results in a significantly reduced cycle time by potentially eliminating adhesive application and UV curing. High strength, i.e., a positive-locking connection, and leak tightness are achieved. Spring-loaded projections 210, 1200 ensure that the clip force is maintained even during relaxation of the heat-conducting element 135. The vertical contact force of the analysis element 105 can be adjusted by changing the position of the clip head.A self-centering press-fit process allows for more generous tolerances and thus cost savings. A detachable connection technology, i.e., simple separation of the thermal interface element 135 and the semiconductor element 130 from the substrate layer 110, is possible, thus ensuring recyclability. The approach presented here represents a reproducible joining process.

[0119] The approach presented here is relevant for establishing a robust connection between the carrier layer 110, i.e., the PC plastic, and the semiconductor element 130, particularly on the cartridges 100. Quality problems can be solved with this approach. The presented approach can be verified by visual inspection of the connection areas. This approach enables higher product quality and improves sustainability, as it is a detachable connection technology. Furthermore, the approach presented here enables R. 417075

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[0121] The approach aims for higher sealing quality and reproducibility, and a lower reject rate.

[0122] Fig. 14 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to the cartridge in Fig. 13, except that the analysis element 105 is pressed into the carrier layer 110 by a pressure element. The semiconductor element 130 rests with its chamfer against the projections 210, 1200, creating a spring effect, which is only illustrated by way of example by means of a double arrow 1400.

[0123] Fig. 15 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to the cartridge from Fig. 14, except that the analysis element 105 is arranged in the carrier layer 110 and a positive-locking connection is created by means of the projections 210, 1200.

[0124] Fig. 16 shows a schematic representation of an embodiment of a cartridge 100. A top view of the cartridge 100 is shown. Figs. 16 to 18 show the carrier layer 110 with a different number of projections 210, 1200, 1600, 1605. The projections 210, 1200, 1600, 1605 are arranged circumferentially on or in the carrier layer 110, with the projections 210, 1200, 1600, 1605 having an identical length.

[0125] Fig. 17 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to the cartridge in Fig. 16, except that the carrier layer 100 forms a plurality of projections 210, 1200, the projections 210, 1200 being of different lengths only by way of example. The carrier layer 110 forms eight projections 210, 1200, only by way of example.

[0126] Fig. 18 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to the cartridge in Fig. 16, except that the projections 210, 1200, 1600, 1605 are of a shorter length. R. 417075

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[0128] Fig. 19 shows a schematic representation of a carrier layer 110 to illustrate an embodiment of a cartridge. More precisely, a manufacturing process of the cartridge 100 is shown. In Fig. 19a, only the carrier layer 110 with the steps 120 and 125 is shown. In Fig. 19b, adhesive dispensing takes place, whereby an adhesive 1900 is applied to the steps 120 and 125. Subsequently, in Fig. 19c, the adhesive 1900 is irradiated with UV light. In Fig. 19d, the semiconductor element 130 is then arranged in the cavity 115 on the adhesive 1900. Thermal curing then takes place, see Fig. 19e.

[0129] In other words, Fig. 19 shows a chip cavity design and a correspondingly simplified bonding process for a robust sealing connection between the carrier layer 110 and the semiconductor element 130 for the cartridge. In the approach presented here, a step 120, 125 with a height of approximately 100-200 micrometers at the edge is injection-molded together with the carrier layer 110, which can also be referred to as a pneumatic layer.

[0130] First, the UV-activated adhesive 1900 is dispensed into the cavity 115, see Fig. 19b, and then irradiated with UV radiation, see Fig. 19c. Within the open time, typically 30 to 50 seconds, during which the adhesive 1900 is still liquid, the semiconductor element 130 is inserted, see Fig. 19d. The semiconductor element 130 is fixed by curing or partial precuring of the UV adhesive 1900, see Fig. 19e. In a subsequent thermal process, the semiconductor element 130 is permanently mechanically fixed to the substrate 110 by the associated volumetric shrinkage.

[0131] The new cavity design and the corresponding process create a robust sealing connection through the volume shrinkage of the adhesive 1900 and the so-called "face-to-face" contact. Pre-application of the adhesive 1900 before joining the semiconductor element 130 provides more free space for the adhesive dispensing system. This allows any air bubbles that may have been dispensed along with the adhesive to escape, significantly reducing the risk of bubble formation. Pre-application of the adhesive 1900 also simplifies the dispensing process, as the dispensing needle has more room to move in the xyz direction. The approach presented here is suitable for the high-quality and reliable formation of the bond between the substrate layer 110 and the R. 417075.

[0132] - 19 -

[0133] Semiconductor element 130 is relevant, especially on the cartridges. The approach presented here can be verified on the product by visual inspection of the cavity design of semiconductor element 130.

[0134] Fig. 20 shows a schematic representation of a method for manufacturing an embodiment of a cartridge. The cavity 115 in the carrier layer 110 of the cartridge is shown (see Fig. 20a). A device 2000 is arranged above the cavity 115, the device 2000 being configured to apply an adhesive 2005 into the cavity 115. The adhesive 2005 is, for example, located on an underside of the device 2000. A pressure element 2010 is provided to press the device 2000 onto the carrier layer. In Fig. 20b, the device 2000 with the adhesive 2005 is arranged on the carrier layer 110, as the pressure element 2010 presses the device 2000 towards the carrier layer. In Fig. 20c, the adhesive 2005 is applied in the cavity 115. In Fig. 20d the semiconductor element 130 is added and in Fig. 20e the semiconductor element 130 is arranged in the cavity 115.

[0135] The approach presented here can also be understood as the connection of the carrier layer with semiconductor element 130 by a new application method for a cartridge with a product-specific device 2000 and a pressure element 2010.

[0136] In the approach presented here, a product-specific device 2000 is used for adhesive application. The device 2000 consists of two chambers. The outer chamber is filled with UV-curing adhesive 2005. To prevent adhesive flow into the gap, a stable, high-viscosity adhesive 2005 is used. The adhesive 2005 is applied into the PC cavity 115 by pressing the device 2000 with the pressure element 210. The height of the device 2000, which can also be referred to as an adhesive bead, is between 300 and 750 micrometers and can be determined by defining the pressure of the pressure element. The semiconductor element 130 can be inserted before or after the application of the adhesive 2005. Fig. 20 shows the application process; more precisely, Fig. 20 shows the application of the high-viscosity adhesive bead by pressing a device 2000 filled with UV-curing adhesive R. 417075

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[0138] In 2005, the device was filled in 2000 by means of a pressure element placed on it in 2010.

[0139] According to one embodiment, the inner chamber of the device 2000 is empty, see Figures 20 and 21. According to an alternative embodiment, the inner chamber is also filled with adhesive 2005. The inner chamber is connected to the outer chamber, for example, by one or more openings. In this case, the inner chamber serves, for example, as a "reservoir" for adhesive 2005 in the outer chamber. The corresponding pressure element 210 consists of two pressure surfaces / contact surfaces for the adhesive 2005: one pressure surface facing the outer chamber for applying the adhesive bead and another pressure surface facing the inner chamber for printing material from the inner chamber to the outer chamber, see Figures 22 and 23.

[0140] By using high-viscosity adhesives (2005), the flow of low-viscosity adhesives (2005) into the PC gap, which cannot be cured by UV radiation, is prevented. This ensures a reliable storage guarantee for the user. Furthermore, the approach presented here enables a fast process: the adhesive bead is applied by a single compression, significantly reducing cycle time. Additionally, the need for a costly precision dispensing system is eliminated, thus reducing manufacturing costs.

[0141] The approach presented here can be detected at the connection areas using analytical methods such as X-rays or CT scans, especially below the semiconductor element 130.

[0142] The approach presented here significantly reduces manufacturing times and saves costs. Furthermore, the method enables higher sealing quality and reproducibility.

[0143] Fig. 21 shows a schematic representation of a device 2000 for producing an exemplary embodiment of a cartridge. The device 2000 is similar to the device in Fig. 20. The adhesive is arranged in the outer chamber 2100 of the device 2000 only as an example. R. 417075

[0144] - 21 -

[0145] Fig. 22 shows a schematic representation of a device 2000 for manufacturing an exemplary embodiment of a cartridge. The device 2000 is similar to the device shown in Fig. 20.

[0146] The inner chamber 2200 in the device 2000 is filled with UV adhesive and connected to the outer chamber 2100 through openings 2205.

[0147] Fig. 23 shows a schematic representation of a device 2000 for producing an embodiment of a cartridge. The device 2000 is similar to the device in Fig. 21, except that the inner chamber 2200 and the outer chamber 2100 are filled with adhesive.

[0148] Fig. 24 shows a schematic representation of an embodiment of a cartridge 100. The cartridge 100 is similar to or corresponds to the cartridge shown in one of the figures described above. More precisely, the carrier layer 110 with the cavity 115 is shown. Between the cavity 115 and the carrier layer 110 is the step 120, which can also be described as a cavity for an adhesive.

[0149] Fig. 25 shows a schematic representation of a stencil 2500 to illustrate an embodiment of a cartridge. The stencil 2500 has a plurality of cavities 2505 for the adhesive; five cavities 2505 are shown by way of example. In other words, Fig. 25 shows the use of a product-specific stencil 2500 for applying a high-viscosity adhesive to bond the substrate layer 110 to the semiconductor element. The approach presented here is explained and illustrated in more detail in Fig. 26 below.

[0150] Fig. 26 shows a schematic representation of a printing process using stencil 2500 to illustrate an embodiment of a cartridge 100. More precisely, the printing process using stencil 2500, the joining of the semiconductor elements, and the curing of the adhesive are shown. Fig. 26a shows a plurality of cartridges 100, with five cartridges 100 being shown as examples. The cartridge 100 is similar to or corresponds to the cartridge in Fig. 24.

[0151] Figure 26b shows the template 2500, with the cartridges 100 from Figure 26a in R. 417075

[0152] - 22 -

[0153] Stencil 2500 is used. Stencil 2500 is similar to or corresponds to the stencil in Fig. 25. In Fig. 26b, a squeegee 2600 is shown, which is designed to distribute the adhesive 2605 in a squeegee travel direction 2610 on the top surface of stencil 2500. The adhesive 2605 is, for example, a UV adhesive. In Fig. 26c, the squeegee 2600 has been moved over the top surface of stencil 2500, more precisely over the cavities 2505, so that the adhesive 2605 is arranged in the cavities 2505 of the stencil 2500 and thus on the step of the carrier layer. Subsequently, the stencil 2500 is removed, so that the cartridges 100 containing the adhesive 2605 are shown on the steps 120, see Fig. 26d. The semiconductor element 130 or a plurality of semiconductor elements 130 is then inserted into the cavities 115 of the cartridges 100, see Fig. 26e. In a next step, UV curing is carried out using UV radiation 2610, see Fig. 26f.

[0154] The approach presented here can also be described as a connection of the carrier layer 110 with the semiconductor element 130 by means of a printing process for cartridge 100 with a product-specific stencil 2500. In the approach presented here, the stencil 2500 is manufactured specifically for the adhesive application, with the areas to be printed being the cavity 2505 for the adhesive 2605, see Fig. 25. Several cartridges 100 can be placed under the stencil 2500 at once. Stable adhesives 2605 are used in the printing process.

[0155] First, the adhesive 2605 is applied to the stencil 2500, see Fig.

[0156] 26b. The adhesive 2605 is homogeneously distributed and filled into the cavity 2505 by means of a squeegee. After the printing process, the squeegee 2600 and stencil 2500 retract. The squeegee speed is controllable by the printing system. The application of the adhesive 2605 and the printing process are very fast and take place within a few seconds. Subsequently, the semiconductor element 130 is inserted into the cavity 115, see Fig.

[0157] 26e. The adhesive 2605 around the semiconductor element 130 is cured by UV irradiation, see Fig. 26f.

[0158] The printing process using stencils 2500 has the following advantages: High-viscosity adhesives 2605 are used, resulting in a flow R. 417075

[0159] - 23 -

[0160] The adhesive, which is low-viscosity and not UV-curable, is prevented from seeping into the PC gap. This ensures a storage guarantee for the user.

[0161] Fast process. In the dispensing process, the dispensing needle is traced along an edge of the semiconductor element 130. In the printing process, the adhesive bead is not only applied all at once in a single print job, but the method allows for printing multiple cartridges 100 simultaneously. This enables a significant reduction in cycle time. Furthermore, manufacturing costs can be reduced, as a costly, precise dispensing system is no longer required.

[0162] The approach presented here is relevant for the high-quality and reliable formation of the bond between the carrier layer 110, which can also be described as PC plastic, and the semiconductor element 130, particularly in the cartridges 100. This approach can be identified by visual inspection of the bonded areas, as the stencil structure, for example, the grid structure, remains on the adhesive surface. Additionally, the bond can be detected using analytical methods such as X-rays or CT scans, etc., in the bonded areas, especially below the semiconductor element 130. With this approach, production times can be significantly reduced, and costs can be saved. Furthermore, this approach enables higher sealing quality and reproducibility, as well as a low reject rate.

[0163] Fig. 27 shows a schematic representation of an application process using roller 2700 to illustrate an exemplary embodiment of a cartridge. More precisely, a continuous application process using a roller 2700 for bonding the substrate layer to the semiconductor element for the cartridge is shown.

[0164] The roller 2700 has a structure 2705 and is arranged on a conveyor belt 2710. The roller 2700 is arranged adjacent to another roller 2715, and the conveyor belt 2710 is arranged adjacent to a container 2720. An adhesive 2725 is arranged in the container 2720. The other roller 2715R. 417075

[0165] - 24 -

[0166] is designed to take up the adhesive 2725 from the container 2720 by means of a rotary movement and transfer it to the structure 2705 of the roller 2700.

[0167] Fig. 28 shows a schematic representation of a roller 2700 to illustrate an embodiment of a cartridge. The roller 2700 is similar to or corresponds to the roller in Fig. 28. The adhesive 2725 is arranged in the structures 2705.

[0168] Fig. 29 shows a schematic partial view of a roller 2700 to illustrate an embodiment of a cartridge. A front view of the structure 2705, which can also be referred to as the structural unit, is shown, with the cylindrical roller 2700 viewed in the xy dimension. The structure 2705 has a zone 2900 for the adhesive and a cavity 2905 for the semiconductor element.

[0169] Fig. 30 shows a schematic partial view of a roller 2700 to illustrate an exemplary embodiment of a cartridge. A top view of the structure 2705 is shown, with the cylindrical roller 2700 viewed in the xy dimension.

[0170] Fig. 31 shows a schematic representation of an application process using roller 2700 to illustrate an embodiment of a cartridge 100. More precisely, the roller process using roller 2700, the joining of the semiconductor element, and the curing of the adhesive are shown. Fig. 31a shows a plurality of cartridges 100, with five cartridges 100 shown as examples. More precisely, the carrier layer with the cavity 115 is shown. Between the cavity 115 and the carrier layer, the step 120 is arranged, which can also be described as a cavity for the adhesive 2725. In Fig. 31b, the roller 2700 with the adhesive 2725 is arranged in the structures 2705 adjacent to the cartridges 100. The rolling direction of the roller 2700 is shown by way of an arrow 3100, but only as an example. The cartridges 100 lie on a movable belt 3105, the direction of belt travel being indicated by an arrow 3110. Fig.Figure 31c shows the cartridges 100 with the adhesive 2725 applied. Figure 31d shows the joining of the semiconductor elements 130 into the R. 417075.

[0171] - 25 -

[0172] Cartridge cavities 100. Subsequently, UV curing is carried out using UV radiation 3115, see Fig. 31 e.

[0173] The approach presented here describes a roller application process for adhesive, which enables a continuous flow throughout the entire manufacturing process. The structured roller 2700 is used. Figure 31 illustrates the application principle, and Figures 27 to 30 show the structure 2705 on the roller 2700. More precisely, Figures 27 to 30 show an application principle using a roller process with the structured roller 2700 and a representation of the structure 2705 of the roller 2700. The high-viscosity adhesive 2725 is transported from the container 2720, which can also be referred to as the material container, to the roller 2700 by the additional roller 2715 (see Figure 27). The roller 2700 has the structure 2705, and the adhesive 2725 on the structure 2705 is transferred to the cartridge 100.

[0174] The structure 2705 on the roller 2700 is designed for the application of the adhesive 2725. The cavity area for the semiconductor element 130 on the roller 2700 is deeper than the area for the adhesive 2725 on the roller 2700. This ensures that only the area for the adhesive 2725, and not the cavity area for the semiconductor element 130 on the roller 2700, contains the adhesive 2725 during the rolling process.

[0175] The roller application process enables a continuous flow throughout the entire cartridge manufacturing process, as the cartridges 100 travel on the conveyor belt 3105 at a defined speed, see Fig. 31b. The roller application process is automated. This can not only significantly reduce the cycle time but also increase the reproducibility of the application quality. After the roller application process, the adhesive 2725 is applied to the adhesive cavity 2725 on the cartridge 100, see Fig. 31c. Subsequently, the semiconductor element 130 is inserted into the cavity 115, see Fig. 31d, and the adhesive 2725 is cured around the semiconductor element 130 by UV irradiation, see Fig. 31 eR 417075

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[0177] The approach presented here offers the following advantages: High-viscosity adhesives (2725) are used, thus preventing the flow of low-viscosity adhesives, which cannot be cured by UV radiation, into the PC gap. This ensures storage stability for the user. The approach presented here is a continuous and automated process. In the dispensing process, the dispensing needle is guided along an edge of the semiconductor element (130). In the roller process, the adhesive contour is applied to several cartridges (100) simultaneously. This enables a significant reduction in cycle time and high reproducibility. Furthermore, manufacturing costs can be reduced, as a costly precision dispensing system is no longer required.

[0178] The approach presented here is relevant for the high-quality and reliable formation of the connection between the carrier layer 110, which can also be described as PC plastic, and the semiconductor element 130, particularly in the cartridges 100. Additionally, the connection can be verified using analytical methods such as X-rays or CT scans, etc., at the connection points, especially below the semiconductor element 130. With this approach, manufacturing times can be significantly reduced and costs saved. Furthermore, this approach enables higher sealing quality and reproducibility, as well as a low reject rate.

[0179] Fig. 32 shows a flowchart of an embodiment of method 3200 for manufacturing a cartridge. Method 3200 is designed to manufacture a cartridge from one of the figures described above or a similar cartridge.

[0180] Method 3200 comprises a provisioning step 3205 and an arranging step 3210. In provisioning step 3205, the at least one analysis element and the support layer are provided. The support layer has at least one channel for guiding compressed air and / or at least one channel for guiding a fluid to be analyzed to the analysis element, wherein the support layer has at least one step in a cavity. In arranging step 3210, the analysis element is arranged on the step, and a projection of the support layer is further arranged as follows: R. 417075

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[0182] that the projection is located on a side of the analysis element opposite the stage and / or that the projection engages in at least part of the analysis element.

[0183] According to one embodiment, step 3210 of the arrangement is carried out by thermoplastically deforming the carrier layer to form the projection and / or by snapping a locking lug into place as a projection.

[0184] According to a further embodiment, in step 3210 of the arrangement, prior to the insertion of the analysis element, an adhesive and / or a sealant is applied to at least a part of the stage.

[0185] Fig. 33 shows a block diagram of an embodiment of a device 3300 for manufacturing a cartridge. The device 3300 is configured to control and / or execute the method from Fig. 32 or a similar method.

[0186] For this purpose, the device 3300 comprises a provisioning unit 3305 and a positioning unit 3310. The provisioning unit 3305 is designed to provide the analysis element and the support layer with the cavity.

[0187] The 3310 assembly unit is designed to arrange the analysis element on a step of the cavity, furthermore arranging a projection of the support layer such that the projection is arranged on a side of the analysis element opposite the step and / or that the projection engages in at least a part of the analysis element.

[0188] If an embodiment includes an “and / or” connection between a first feature and a second feature, this is to be read as meaning that the embodiment according to one embodiment has both the first feature and the second feature, and according to another embodiment has either only the first feature or only the second feature.

Claims

R. 417075 - 28 - Claims 1. Cartridge (100) for an analyzer, wherein the cartridge (100) has the following features: at least one analysis element (105); and a support layer (110) having at least one channel for guiding compressed air and / or at least one channel for guiding a fluid to be analyzed to the analysis element (105), wherein in the support layer (110) the at least one analysis element (105) is received on a step (120) of a cavity (115) and held by means of a projection (210), wherein the projection (210) is arranged on an opposite side of the step (120) and / or engages in at least a part of the analysis element (105).

2. Cartridge (100) according to claim 1, wherein an adhesive (1900; 2005; 2605; 2725) and / or a sealant (1210) is arranged or can be arranged on the cavity (115) in the area of ​​the step (120).

3. Cartridge (100) according to claim 2, wherein the adhesive (1900; 2005; 2605; 2725) and / or the sealant (1210) is arranged or can be arranged in a recess on a wall of the step (120).

4. Cartridge (100) according to one of claims 2 to 3, wherein the adhesive (1900; 2005; 2605; 2725) and / or the sealant (1210) is UV curable.

5. Cartridge (100) according to one of the preceding claims, wherein the projection (210; 1200; 1600; 1605) is designed as a locking lug. R. 417075 - 29 - 6. Cartridge (100) according to one of the preceding claims, wherein the projection (210) is formed or formable as thermo-formed material of the carrier layer (110).

7. Cartridge (100) according to one of the preceding claims, wherein the projection (210; 1200; 1600; 1605) is arranged circumferentially around the cavity (115).

8. Cartridge (100) according to one of the preceding claims, wherein the analysis element (105) is configured at least partially as a semiconductor element (130) and / or at least partially as a thermal conducting element (135).

9. Cartridge (100) according to one of the preceding claims, wherein the carrier layer (110) is formed from a plastic material, in particular polycarbonate.

10. Method (3200) for producing a cartridge (100) according to any one of the preceding claims 1 to 9, wherein the method (3200) comprises the following steps: Providing (3205) the at least one analysis element (105) and the support layer (110) which has at least one channel for guiding compressed air and / or at least one channel for guiding a fluid to be analyzed to the analysis element (105), wherein the support layer (110) has at least one step (120) in a cavity (115); and Arranging (3210) the analysis element (105) on the step (120), wherein furthermore a projection (210) of the support layer (110) is arranged such that the projection (210) is arranged on a side of the analysis element (105) opposite the step (120) and / or that the projection (210) engages in at least a part of the analysis element (105). R. 417075 - 30 - 11. Method (3200) according to claim 10, wherein the step (3210) of arranging is carried out by thermoplastically deforming the carrier layer (110) to form the projection (210) and / or by snapping a locking lug as a projection (210).

12. Method (3200) according to one of claims 10 to 11, wherein in the step (3210) of arranging prior to the insertion of the analysis element (105) an adhesive (1900; 2005; 2605; 2725) and / or a sealant (1210) is applied to at least a part of the stage (120).

13. Device (3300) configured to perform and / or control the steps (3205, 3210) of the method (3200) according to any one of claims 10 to 12 in corresponding units (3305, 3310).

14. Computer program configured to execute and / or control the steps of the method (3200) according to any one of claims 10 to 12.

15. Machine-readable storage medium on which the computer program according to claim 14 is stored.

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