High-precision detachable optical interconnect

Abstract

Some examples of the present disclosure are directed to a detachable connector for a co-packaged optics (CPO) device. The detachable connector may include a kinematic mount, where the kinematic mount includes a first kinematic interface configured to engage a corresponding kinematic interface of the CPO device. In some examples, the kinematic mount is configured for repeated detachment and attachment with substantially identical alignment between the detachable connector and the CPO device within a predetermined sub-micron tolerance. Furthermore, in an attached state, the kinematic mount may be configured to provide an optical transmission path between the CPO device and the detachable connector, where a transmission loss along the optical transmission path remains within a predetermined threshold tolerance.

Description

HIGH-PRECISION DETACHABLE OPTICAL INTERCONNECTCROSS-REFERENCE TO RELATED APPLICATION

[0001] This application is a continuation-in-part of U.S. Application Serial No. 19 / 401,106, filed November 25, 2025, which claims the benefit of U.S. Patent Application No. 63 / 771,913 for a “Detachable CPO Connector and Associated Methods” filed March 14, 2025, which is hereby incorporated by reference in its entirety.BACKGROUND

[0002] With demand for high-speed and high-volume data communication increasing, communications providers are increasingly adopting optics-based communication solutions. To meet these demands, methods of improving the performance of optical elements are being developed.GENERAL DESCRIPTION

[0003] In one aspect, a detachable connector is presented. The detachable connector may include a kinematic mount, where the kinematic mount includes a first kinematic interface configured to engage a corresponding kinematic interface of a co-packaged optics (CPO) device. The kinematic mount may be configured for repeated detachment and attachment with substantially identical alignment between the detachable connector and the CPO device within a predetermined sub-micron tolerance. In an attached state, the kinematic mount may be configured to provide an optical transmission path between the CPO device and the detachable connector, where a transmission loss along the optical transmission path remains within a predetermined threshold tolerance.

[0004] In some aspects, the first kinematic interface includes a plurality of alignment spheres and the second kinematic interface includes a plurality of alignment grooves configured to, in the attached state, engage a corresponding alignment sphere of the plurality of alignment spheres.

[0005] In some aspects, the plurality of alignment grooves includes three alignment grooves and the plurality of alignment spheres includes three alignment spheres.Page 1 of 8014386240v 1

[0006] In some aspects, the kinematic mount further includes at least one rough alignment cavity configured to, in the attached state, receive at least one corresponding rough alignment element.

[0007] In some aspects, the at least one rough alignment cavity is configured to selfalign with the at least one corresponding first rough alignment element by receiving the at least one corresponding rough alignment element via a first portion of the rough alignment cavity having a first diameter and allowing the at least one corresponding rough alignment element to slide along an inner surface of the rough alignment cavity toward a second portion of the rough alignment cavity, the second portion having a second diameter narrower than the first diameter.

[0008] In another aspect, a system is presented. The system may include a mounting element configured to be attached to a photonic integrated circuit (PIC), where the mounting element includes a planar body defining an optical window and a first kinematic interface supported by the planar body, the first kinematic interface including at least one first rough alignment element and a plurality of first fine alignment elements. The system may further include an attachment element configured to be attached to a fiber array unit (FAU), where the attachment element includes a second kinematic interface, the second kinematic interface including at least one second rough alignment element configured to engage the at least one first rough alignment element of the mounting element and a plurality of second fine alignment elements, where each second fine alignment element is configured to engage a corresponding first fine alignment element of the plurality of first fine alignment elements. In an instance in which the mounting element is attached to the PIC and the attachment element is attached to the FAU, the attachment element may be configured to be detachably coupled to the mounting element such that each fiber of the FAU is aligned with a corresponding optical aperture of the PIC.

[0009] In some aspects, at least one of the at least one first rough alignment element or the at least one second rough alignment element includes a column, and the other of the at least one first rough alignment element or the at least one second rough alignment element includes a cavity configured to receive the column.

[0010] In some aspects, one of the plurality of first fine alignment elements or the plurality of second fine alignment elements includes a sphere, and the other of the plurality ofPage 2 of 80ATTY DKT. NO. 048833-000255 14386240v 1first fine alignment elements or the plurality of second fine alignment elements includes a groove configured to receive the sphere.

[0011] In some aspects, the groove includes a friction-reducing coating.

[0012] In some aspects, each second fine alignment element includes a sphere, and each first fine alignment element includes a groove configured to receive the sphere.

[0013] In some aspects, a bottom surface of the attachment element includes at least one concavity, and the sphere is adhered within the concavity to form the first fine alignment element.

[0014] In some aspects, a bottom surface of the attachment element includes at least one concavity, and the sphere is integrally formed within the concavity to form the first fine alignment element.

[0015] In some aspects, the attachment element includes three first fine alignment elements.

[0016] In some aspects, the first fine alignment elements are arranged on the attachment element in a triangular configuration.

[0017] In some aspects, the attachment element further includes a bonding surface configured to couple with a corresponding surface of the FAU, where the bonding surface is positioned at an angle with respect to the second kinematic interface.

[0018] In some aspects, the angle is a predetermined angle selected to minimize a working distance between an end of each fiber of the FAU and a corresponding optical aperture of the PIC.

[0019] In another aspect, a mounting element is presented. The mounting element may include a planar body defining an optical window and a first kinematic interface on a first surface of the planar body, the first kinematic interface comprising at least one rough alignment element and a plurality of fine alignment elements. A second surface of the planar body may be configured to be attached to a photonic integrated circuit (PIC). The first kinematic interface may be configured to be detachably coupled to a second kinematic interface of an attachment element, the attachment element being attached to a fiber array unit (FAU). In an instance in which the mounting element is attached to the PIC and the attachment element is attached to the FAU, the mounting element may be configured to be detachablyPage 3 of 80ATTY DKT. NO. 048833-000255 14386240v 1coupled to the attachment element such that each fiber of the FAU is aligned with a corresponding optical aperture of the PIC.

[0020] In some aspects, the at least one rough alignment element includes a column extending from the first kinematic interface and configured to be engaged by a cavity of the second kinematic interface.

[0021] In some aspects, the at least one rough alignment element includes a cavity configured to receive a column extending from the second kinematic interface.

[0022] In some aspects, the plurality of fine alignment elements includes a groove configured to receive a sphere of the second kinematic interface.

[0023] In some aspects, the second kinematic interface includes a concavity, where the sphere is adhered within the concavity to form the fine alignment element.

[0024] In some aspects, the second kinematic interface includes a concavity, where the sphere is integrally formed within the concavity to form the fine alignment element.

[0025] In some aspects, the plurality of fine alignment elements includes three fine alignment elements.

[0026] In some aspects, the three fine alignment elements are arranged on the first kinematic interface in a triangular configuration.

[0027] In some aspects, the plurality of fine alignment elements includes a plurality of grooves, each groove being configured to receive a sphere of the second kinematic interface.

[0028] In some aspects, each groove includes a friction-reducing coating.

[0029] In another aspect, an attachment element is presented. The attachment element may include a first kinematic interface, the first kinematic interface including at least one rough alignment element and a plurality of fine alignment elements, where the attachment element is configured to be coupled to a fiber array unit (FAU). The first kinematic interface may be configured to be detachably coupled to a second kinematic interface of a mounting element, the mounting element being coupled to a photonics integrated circuit (PIC). In an instance in which the mounting element is attached to the PIC and the attachment element is attached to the FAU, the attachment element may be configured to be detachably coupled to the mounting element such that each fiber of the FAU is aligned with a corresponding optical aperture of the PIC.Page 4 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0030] In some aspects, the at least one rough alignment element includes a column configured to be engaged by a cavity of the mounting element.

[0031] In some aspects, the at least one rough alignment element includes a cavity configured to receive a column extending from the mounting element.

[0032] In some aspects, the plurality of fine alignment elements includes a plurality of spheres, each sphere being configured to be received by a groove of the mounting element.

[0033] In some aspects, the plurality of fine alignment elements includes a plurality of grooves, each groove being configured to receive a sphere of the mounting element.

[0034] In some aspects, each groove includes a friction-reducing coating.

[0035] In some aspects, the attachment element further includes a bonding surface configured to couple with a corresponding surface of the FAU, where the bonding surface is positioned at an angle with respect to the first kinematic interface.

[0036] In some aspects, the angle is a predetermined angle selected to minimize a working distance between an end of each fiber of the FAU and a corresponding optical aperture of the PIC.

[0037] In another aspect, a method of manufacturing a detachable connector for a copackaged optics (CPO) device is presented. The method may include aligning a planar body of a mounting element with respect to a photonics integrated circuit (PIC), the mounting element comprising a first kinematic interface; aligning an optical window of the mounting element with respect to the PIC based on receiving feedback from one or more test fibers; bonding the mounting element to the PIC; aligning a fiber array unit (FAU) with respect to an attachment element, the attachment element including a second kinematic interface configured for repeated detachment and attachment with substantially identical alignment between the first kinematic interface and the second kinematic interface within a predetermined sub-micron tolerance, and bonding the FAU to the attachment element.

[0038] In some aspects, a detachable connector is provided. The detachable connector may comprise: a kinematic mount, wherein the kinematic mount comprises a first kinematic interface configured to engage a corresponding second kinematic interface of a co-packaged optics (CPO) device, wherein the kinematic mount comprises, at least one rough alignment element on the first kinematic interface, and at least one fine alignment element on the first kinematic interface, wherein the at least one rough alignment element has a greater tolerance Page 5 of 80ATTY DKT. NO. 048833-000255 14386240v 1for alignment between the detachable connector and the CPO device than the at least one fine alignment element.

[0039] In some aspects, the at least one fine alignment element comprises at least one convex alignment feature.

[0040] In some aspects, the second kinematic interface comprises at least one alignment groove configured to, in an attached state, engage the convex alignment feature.

[0041] In some aspects, the at least one fine alignment element comprises three convex alignment features, and the at least one alignment groove comprises three alignment grooves.

[0042] In some aspects, the rough alignment element on the first kinematic interface comprises at least one cavity configured to, in an attached state, receive at least one corresponding rough alignment element on the second kinematic interface.

[0043] In some aspects, the at least cavity is configured to self-align with the at least one corresponding rough alignment element by: receiving the at least one corresponding rough alignment element via a first portion of the cavity having a first diameter; and allowing the at least one corresponding rough alignment element to slide along an inner surface of the cavity toward a second portion of the cavity, the second portion having a second diameter narrower than the first diameter.

[0044] In some aspects, the detachable connector is configured to be attached to a fiber array unit (FAU).

[0045] In some aspects, the at least one rough alignment element has a greater tolerance for alignment between the detachable connector and the CPO device than the at least one fine alignment element by at least a factor of 10.

[0046] In some aspects, the detachable connector further comprises a polarization-selective optical element plate with at least one polarization portion and at least one nonpolarization portion.

[0047] In some aspects, a system is provided. The system may comprise: the detachable connector as provided in some aspects; a mounting element comprising the second kinematic interface, wherein the mounting element is provided on the CPO device; and a force application mechanism configured to apply a force to the detachable connector, wherein the force is applied to a center of a triangular configuration formed by the at least one fine alignment element on the first kinematic interface.Page 6 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0048] In some aspects, the at least one rough alignment element on the first kinematic interface is configured to interface with a corresponding rough alignment element of the second kinematic interface, prior to the at least one fine alignment on the first interface with a corresponding fine alignment element of the second kinematic interface.

[0049] In some aspects, the at least one rough alignment element comprises a tapered configuration that constrains the detachable connector in order to allow the at least one fine alignment element with the corresponding fine alignment element.

[0050] In some aspects, the at least one fine alignment element has a convex alignment feature and the corresponding fine alignment element is a groove.

[0051] In some aspects, a mounting element is provided. The mounting element may be configured to be attached to a photonic integrated circuit (PIC) and configured to engage a detachable connector coupled to an FAU, the mounting element comprising: a planar body defining an optical window; at least one rough alignment element formed on the planar body; and at least one fine alignment element on the planar body, wherein the at least one rough alignment element has a greater tolerance for alignment between the mounting element and the detachable connector than the at least one fine alignment element.

[0052] In some aspects, the detachable connector is configured to be detachably coupled to the mounting element such that each fiber of the FAU is aligned within the optical window.

[0053] In some aspects, the detachable connector is configured to be detachably coupled to the mounting element such that each fiber of the FAU is aligned with a corresponding optical aperture in the PIC.

[0054] In some aspects, the at least one rough alignment element comprises a column, and wherein the detachable connector comprises a cavity configured to receive the column.

[0055] In some aspects, the at least one fine alignment element comprises a groove.

[0056] In some aspects, the groove is configured to receive a convex alignment element from the detachable connector.

[0057] In some aspects, at least three grooves are arranged on the planar body, and at least three corresponding convex alignment elements are provided on the detachable connector.

[0058] In some aspects, the at least three grooves are arranged so that longitudinal axes of the at least three grooves pass through an interior region of a triangle formed by the grooves.Page 7 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0059] In some aspects, a system is provided. The system may comprise: the mounting element as provided in some aspects; and the detachable connector coupled to an FAU, wherein the at least one rough alignment element formed on the planar body is configured to interface with a corresponding rough alignment element of the detachable connector, prior to the at least one fine alignment on the planar body with a corresponding fine alignment element of the detachable connector.

[0060] In some aspects, a co-packaged optical system is provided. The co-packaged optical system may comprise: a photonic integrated circuit (PIC) supported by a substrate; a mounting element bonded to the PIC, the mounting element defining an optical window and comprising a first kinematic interface; and a detachable connector comprising an attachment element coupled to a fiber array unit (FAU), the attachment element comprising a second kinematic interface; wherein the first and second kinematic interfaces are configured to detachably mate to provide an optical transmission path between the FAU and the PIC.

[0061] In some aspects, the system may further comprise a force application mechanism configured to apply a vertical force to a top surface of the attachment element to lock the second kinematic interface against the first kinematic interface.

[0062] In some aspects, the mounting element and attachment element are configured to allow the FAU to be detached from the PIC during a thermal reflow process and reattached subsequently.

[0063] In some aspects, a detachable optical connector is provided. The detachable optical connector may comprise: an attachment element having a body with a bottom kinematic interface and a top surface; and a fiber array unit (FAU) bonded to a first bonding surface of the attachment element, wherein the first bonding surface is positioned at a non-orthogonal angle relative to the bottom kinematic interface to minimize an optical working distance.

[0064] In some aspects, the attachment element has a maximum width configured to permit side-by-side placement with identical connectors on a shared photonic integrated circuit.

[0065] In some aspects, the body of the attachment element comprises a material with a coefficient of thermal expansion (CTE) substantially matching that of an underlying silicon substrate.Page 8 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0066] In some aspects, a method of aligning a mounting element to a photonic integrated circuit (PIC) is provided. The method may comprise: positioning a mounting element having an optical window with respect to the PIC; transmitting optical signals through one or more test fibers; receiving optical feedback measurements from the one or more test fibers through the optical window of the mounting element; and adjusting or maintaining a positioning of the mounting element with respect to the PIC based on the optical feedback measurements.

[0067] In some aspects, the method may further comprise bonding the mounting element to the PIC while maintaining the position of the mounting element.

[0068] In some aspects, the mounting element comprises a planar body and one or more fine alignment elements on the planar body.

[0069] In some aspects, the one or more test fibers are positioned with respect to the mounting element based on positioning of the one or more fine alignment elements.

[0070] In some aspects, the mounting element comprises one or more rough alignment elements on the planar body, wherein the one or more rough alignment elements provides a lower degree of positioning precision than the one or more fine alignment elements.

[0071] In some aspects, an alignment jig for positioning a mounting element relative to a photonic integrated circuit (PIC) is provided. The jig may comprise: a body configured to temporarily engage the mounting element; a magnetic coupling element configured to magnetically couple to the mounting element and controllably adjust a position of the mounting element relative to the PIC; and one or more test fiber interfaces configured to hold test fibers for optical feedback measurements.

[0072] In some aspects, the jig is configured to maintain the position of the mounting element while bonding agent is applied between the mounting element and the PIC, and to release the mounting element after bonding is complete.

[0073] In some aspects, the magnetic coupling is configured to controllably adjust the position of the mounting element with a submicron precision.

[0074] In some aspects, the magnetic coupling is configured to controllably adjust the position of the mounting element while optical signals are delivered through the one or more test fibers.Page 9 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0075] In some aspects, a blind-mating optical connector system may be provided. The system may comprise: a first connector component comprising: at least one rough alignment element configured to provide an initial alignment with a predetermined first tolerance; and at least one fine alignment element configured to provide a secondary alignment with a predetermined second tolerance less than the first tolerance; and a second connector component comprising: at least one mating rough alignment element configured to engage with the at least one rough alignment element of the first connector component and guide the first connector component during initial engagement; and at least one mating fine alignment element configured to engage the at least one fine alignment element.

[0076] In some aspects, the at least one rough alignment element is configured to engage the at least one mating rough alignment element prior to engagement of the at least one fine alignment element with the at least one mating fine alignment element.

[0077] In some aspects, the at least one mating rough alignment element comprises a tapered cavity configured to receive the at least one rough alignment element of the first connector component.

[0078] In some aspects, the at least one rough alignment element constrains the system to a capture range that is smaller than a diameter of the at least one fine alignment element, such that the fine alignment elements are guided into their respective mating features without manual intervention.

[0079] The features, functions, and advantages that have been discussed may be achieved independently in various examples of the present disclosure or may be combined with yet other examples, further details of which may be seen with reference to the following description and drawings.BRIEF DESCRIPTION OF THE DRAWINGS

[0080] Having thus described examples of the disclosure in general terms, reference will now be made to the accompanying drawings, wherein:Page 10 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0081] Figure 1A illustrates a system for detachable coupling including an electronic module and a detachable connector in a detached state, in accordance with an example of the disclosure;

[0082] Figure IB illustrates a system for detachable coupling including an electronic module and a detachable connector in an attached state, in accordance with an example of the disclosure;

[0083] Figure 1C shows an example of a mounting element with spherical fine alignment elements, in accordance with an example of the disclosure;

[0084] Figure ID shows an example of an attachment element with recessed fine alignment elements, in accordance with an example of the disclosure;

[0085] Figure IE shows a positioning tool positioning spherical fine alignment elements with respect to a mounting element, in accordance with an example of the disclosure;

[0086] Figure 2 illustrates a top plan view of an electronic module, in accordance with an example of the disclosure;

[0087] Figure 3 illustrates a perspective view of the electronic module of Figure 2, in accordance with an example of the disclosure;

[0088] Figure 4 A illustrates a top view of a mounting element for a detachable connector, in accordance with an example of the disclosure;

[0089] Figure 4B illustrates a perspective view of the mounting element of Figure 4 A, in accordance with an example of the disclosure;

[0090] Figure 5 A is a perspective view from the top of a mounting element and an attachment element in a detached state, in accordance with an example of the disclosure;

[0091] Figure 5B is a perspective view from the bottom of a mounting element and an attachment element in a detached state, in accordance with an example of the disclosure;

[0092] Figure 5C is a bottom view of an attachment element, in accordance with an example of the disclosure;

[0093] Figure 5D illustrates rough alignment elements coming together, in accordance with an example of the disclosure;

[0094] Figure 5E illustrates fine alignment elements coming together, in accordance with an example of the disclosure;Page 11 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0095] Figure 6A illustrates a perspective view of a detachable connector of an optical device including an attachment element and a fiber array unit (FAU), in accordance with an example of the disclosure;

[0096] Figure 6B illustrates the FAU of the detachable connector of Figure 6A, in accordance with an example of the disclosure;

[0097] Figure 6C illustrates a side view of the attachment element and a portion of the FAU of Figure 6A, in accordance with an example of the disclosure;

[0098] Figure 6D illustrates a bottom view of the attachment element and a portion of the FAU of Figure 6A, in accordance with an example of the disclosure;

[0099] Figure 6E illustrates a perspective view of an electronic module and a detachable connector in an attached state, in accordance with an example of the disclosure;

[0100] Figure 7A is a flowchart illustrating a method of assembling a detachable connector for detachably coupling an electronic module and an FAU, in accordance with an example of the present disclosure;

[0101] Figure 7B is a flowchart illustrating a method of detachably coupling an electronic module and an FAU, in accordance with an example of the present disclosure;

[0102] Figure 8 A illustrates a detachable connector, in accordance with an example of the present disclosure;

[0103] Figure 8B illustrates a detachable connector, in accordance with an example of the present disclosure;

[0104] Figure 8C illustrates a connection portion of a detachable connector, in accordance with an example of the present disclosure;

[0105] Figure 8D illustrates a connection portion of a detachable connector including a polarization-selective optical element, in accordance with an example of the present disclosure;

[0106] Figure 8E illustrates a plurality of fibers of a detachable connector, in accordance with an example of the present disclosure;

[0107] Figure 8F illustrates a polarization-selective optical element, in accordance with examples of the present disclosure;

[0108] Figure 8G shows a polarization-selective optical element with a polarization portion and non-polarization portions, in accordance with an example of the disclosure;Page 12 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0109] Figure 8H illustrates a polarization-selective optical element that may be attached to a connector, in accordance with an example of the disclosure;

[0110] Figure 9 illustrates an example network architecture, in accordance with an example of the disclosure;

[0111] Figure 10 illustrates an example datacenter network topology, in accordance with an example of the disclosure;

[0112] Figure 11 illustrates a co-packaged networking device, in accordance with an example of the disclosure;

[0113] Figure 12A is a flowchart illustrating a method for providing optical communications via a silicon photonics collimator, in accordance with an example of the disclosure;

[0114] Figure 12B is a flowchart illustrating an example method for providing optical communications via a silicon photonics collimator in accordance with an example of the disclosure;

[0115] Figure 12C illustrates a computing system, in accordance with an example of the disclosure;

[0116] Figure 13A illustrates a cross-sectional view of an optoelectronic component, in accordance with an example of the disclosure;

[0117] Figure 13B illustrates a top plan view of an optoelectronic component, in accordance with an example of the disclosure;

[0118] Figure 13C illustrates a portion of an optoelectronic component, in accordance with an example of the disclosure; and

[0119] Figure 13D illustrates a portion of an optoelectronic component, in accordance with an example of the disclosure;DETAILED DESCRIPTION OF EMBODIMENTS

[0120] Examples of the present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all, examples of the disclosure are shown. Indeed, the disclosure may be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these examples are provided so that this disclosure will satisfy applicable legal requirements. Where possible, any Page 13 of 80ATTY DKT. NO. 048833-000255 14386240v 1terms expressed in the singular form herein are meant to also include the plural form and vice versa, unless explicitly stated otherwise. Also, as used herein, the term “a” and / or “an” shall mean “one or more,” even though the phrase “one or more” is also used herein. Further, as used herein, the article “the” is intended to include one or more items referenced in connection with the article “the” and may be used interchangeably with “the one or more.” Furthermore, as used herein, the term “set” is intended to include one or more items (e.g., related items, unrelated items, a combination of related and unrelated items, etc.), and may be used interchangeably with “one or more.” Where only one item is intended, the phrase “only one” or similar language is used. Also, as used herein, the terms “has,” “have,” “having,” or the like are intended to be open-ended terms. Furthermore, when it is said herein that something is “based on” something else, it may be based on one or more other things as well. In other words, unless expressly indicated otherwise, as used herein “based on” means “based at least in part on” or “based at least partially on.” Also, as used herein, the term “or” is intended to be inclusive when used in a series and may be used interchangeably with “and / or,” unless explicitly stated otherwise (e.g., if used in combination with “either” or “only one of’). Like numbers refer to like elements throughout. No element, act, or instruction used herein should be construed as critical or essential unless explicitly described as such.

[0121] As used herein, “operatively coupled” may mean that the components are electronically or optically coupled and / or are in electrical or optical communication with one another. Furthermore, “operatively coupled” may mean that the components may be formed integrally with each other or may be formed separately and coupled together. Furthermore, “operatively coupled” may mean that the components may be directly connected to each other or may be connected to each other with one or more components (e.g., connectors) located between the components that are operatively coupled together. Furthermore, “operatively coupled” may mean that the components are detachable from each other or that they are permanently coupled together.

[0122] As used herein, “determining” may encompass a variety of actions. For example, “determining” may include calculating, computing, processing, deriving, investigating, ascertaining, and / or the like. Furthermore, “determining” may also include receiving (e.g., receiving information), accessing (e.g., accessing data in a memory), and / or the like. Also, “determining” may include resolving, selecting, choosing, calculating, establishing, and / or the Page 14 of 80ATTY DKT. NO. 048833-000255 14386240v 1like. Determining may also include ascertaining that a parameter matches a predetermined criterion, including that a threshold has been met, passed, exceeded, satisfied, etc.

[0123] Furthermore, as would be evident to one of ordinary skill in the art in light of the present disclosure, the terms “substantially” and “approximately” indicate that the referenced element or associated description is accurate to within applicable engineering tolerances.

[0124] Silicon Photonics (SiP) is a technology that enables optical systems to be manufactured using silicon processes with silicon as the optical medium. Various optical components, such as interconnects and signal processing components, may be fabricated and integrated in a single SiP device. Some SiP devices are fabricated on a silica substrate or over a silica layer on a silicon substrate, a technology that is often referred to as Silicon on Insulator (SOI). In certain optical systems, a SiP device is attached to an external device to facilitate optical communications. However, there are significant challenges to accurately align light signals on the SiP with an external device that transmits or receives the light, in particular a fiber array unit (FAU) with the silicon photonics chip which emits light from the top surface.

[0125] For instance, long-range transmission of light signals is generally performed within optical fibers. When optical signals are generated or processed in a SiP device for transmission over optical fibers, the light needs to be propagated between the SiP device and the optical fibers. Coupling the SiP device and the optical fibers is challenging because the diameter of the waveguides within the SiP device are generally smaller than the diameter of the optical fibers. As such, a “world-to-chip” interface problem often arises in SiP technologies where coupling of light between Si wire waveguides and optical fibers, and vice versa, is generally inefficient. Furthermore, to increase coupling efficiency, it is also necessary to match the light modes between the optical fibers and the Si wire waveguides, which results in increased placement demands in free space optics.

[0126] Furthermore, during reflow processes involved in manufacturing SiP devices, optical fibers typically cannot be present on the SiP device due to the relatively high thermal sensitivity of the optical fibers. Specifically, the high temperatures applied to the SiP devices during reflow may degrade the optical fibers themselves, as well as degrade adhesives or epoxies used to attach the optical fibers to the SiP. Thus, it is preferable to removably attach optical fibers to a SiP device such that the optical fibers can be detached during a reflowPage 15 of 80ATTY DKT. NO. 048833-000255 14386240v 1process and reattached afterward using non-adhesive-based coupling techniques (e.g., using mechanical coupling techniques).

[0127] There is also a need to minimize the size, or footprint, of a SiP device in an optical system in order to increase the overall integration density of the optical system. Accordingly, the present disclosure provides a relatively compact package with a decreased footprint that allows for integration into space-constrained devices, as well as increases the overall functionality per unit area of the system. Furthermore, the decreased footprint requires less material, as well as allows for more units to be produced per wafer or panel, which increases production efficiency and can lower cost. As such, it is preferable that the coupling between SiP devices and the optical fibers does not substantially increase the overall footprint of the SiP device. For example, a single photonic integrated circuit (PIC) may have a width of roughly 7mm. Therefore, it is preferable that the width of the detachable coupling not exceed 7mm (or preferably, not exceed 6.8mm), such that multiple PICs may be positioned side-by-side in a system without the need to account for the additional width of a detachable coupling.

[0128] Furthermore, detachably connecting optical fibers is preferred for facilitating operative considerations, such as device replacement, maintenance, and servicing. Thus, the present disclosure provides a detachable mechanism that allows accurate positioning (location and mating) of the optical connector relative to an optical source with minimum tolerances. The detachable mechanism is capable of connecting and disconnecting to all CPO devices with a low power insertion loss of the light. A common connector is used across all packages. The assembly process of the connector ensures the optical performance. Specifically, the present disclosure is directed to the use of a kinematic mount (e.g., a deterministic mount, kinematic coupling, repeatable positioning mount, or the like) to removably couple and align an attachment element for a fiber array unit (FAU) to a mounting element in a highly precise and stable manner. The removable coupling and alignment is also highly repeatable, enabling the connector to be detached and reattached as needed (e.g., during a reflow process). The use of the kinematic mount of the present disclosure enables a high-precision mechanical alignment, particularly significant for single-mode fiber optics requiring precise beam alignment in terms of angle and position relative to the photonic IC for good optical performance. In an example, the attachment element may be bonded to the FAU and the mounting element bonded to the PIC, with the kinematic mount providing the mechanical interface.Page 16 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0129] A kinematic mount, as contemplated herein, uses a defined set of contact points between mechanical components to constrain a certain number of degrees of freedom (DOF), while minimizing overall stress on the components. For example, in some examples, the kinematic mount includes three spherical contact points (e.g., a Maxwell kinematic mount, a three-sphere kinematic mount, or the like) between the attachment element and the mounting element, such that movement in all six DOF (X-translation, Y-translation, Z-translation, pitching, yawing, and rolling) is constrained. As described in greater detail below, examples of the present disclosure provide for a three-sphere kinematic mount, where each of the three spheres may be positioned within a corresponding groove (e.g., a V-shaped groove), such that each groove engages each sphere at two contact points, for a total of six contact points in the kinematic mount to achieve mechanical alignment and detachability.

[0130] Accordingly, the present disclosure includes a detachable connector for a copackaged optics (CPO) device, the detachable connector including a kinematic mount mechanism. The kinematic mount mechanism may include a first kinematic interface configured to engage a corresponding kinematic interface of the CPO device, where the kinematic mount mechanism is configured for repeated detachment and attachment with substantially identical alignment between the detachable connector and the CPO device within a predetermined sub-micron tolerance. In an attached state, the kinematic mount mechanism may be further configured to provide an optical transmission path between the CPO device and the detachable connector, wherein a transmission loss along the optical transmission path remains within a predetermined threshold tolerance.

[0131] As described in greater detail below, the present disclosure is directed to mechanical connectors for detachably connecting FAUs to electronic modules such as SiP devices or the like. For example, a mechanical connector may be used to detachably connect an FAU to a PIC located on an SiP device, in order to allow propagation of light signals between the SiP device and the optical fibers of the FAU. A mechanical connector may include an FAU and an attachment element affixed to the FAU. The FAU may include a plurality of fiber couplers (e.g., v-grooves, u-grooves, and / or the like) into which optical fibers (e.g., single mode fibers, multi-mode fibers, polarization maintaining fibers, and / or the like) may be positioned and held in place (e.g., using an adhesive). The FAU may be formed from a substrate, and the fiber couplers may be formed in a surface of the substrate (e.g., using a Page 17 of 80ATTY DKT. NO. 048833-000255 14386240v 1beveled blade with a dicing saw machine, by chemical etching of the substrate, and / or the like). The fiber couplers may extend substantially parallel to each other on the surface of the substrate.

[0132] The disclosed systems and methods may be implemented using co-packaged optical (CPO) solutions integrated with electronic switch ASICs, network processors, or Al accelerators. Optical components such as modulators, drivers, photodetectors, and laser sources may be co-packaged directly on or near the host silicon using advanced packaging technologies including 2.5D interposers or silicon bridges. In some configurations, mid-board optical modules (MBOMs) are employed as part of the optical I / O strategy. MBOMs are positioned centrally on the PCB (between the front panel and the host die), enabling shorter electrical traces and improved signal integrity while maintaining separation between optics and high-power ASICs for thermal management. In some configurations, near-packaged optics may also be used, placing optical engines in close proximity to the host device without full copackaging, allowing for modular deployment and gradual migration from pluggable optics.

[0133] The disclosed systems and methods may support optical connectivity through edge couplers, fiber ribbon interfaces, on-board photonic waveguides, or grating couplers. Silicon photonics may be used to implement optical engines within the CPO or MBOM units, with support for modulation schemes such as PAM4, coherent signaling, or WDM. These components may be interconnected via high-speed electrical interfaces such as SerDes lanes, and coordinated via on-board controllers that handle lane training, optical power tuning, and health monitoring.

[0134] Examples of the present disclosure may scale from 400G to 1 ,6T and beyond, supporting deployment in high-performance computing, Al clusters, and data center switching platforms. Integration strategies may include air-cooled and liquid-cooled packages, supporting advanced thermal designs to handle the combined electrical and optical power densities. In some configurations, the disclosed systems may be implemented in modular switch platforms, Al training fabrics, or other environments requiring high-density, low-latency interconnect.

[0135] In some configurations, the disclosed systems may be implemented in copackaged datacenter switches or similar networking devices. Co-packaging may refer to the close integration of different electrical and / or optoelectronic chips in the same package. The different chips that constitute the co-packaged system are assembled on a single substrate in Page 18 of 80ATTY DKT. NO. 048833-000255 14386240v 1what is typically called a multi-chip module (MCM) assembly. An MCM assembly can include switching circuitry surrounded by one or more peripheral chips.Example System for Detachable Coupling

[0136] Figures 1A and IB illustrate a system 6100 for detachable coupling between a fiber array unit (FAU) and a photonic integrated circuit (PIC), in accordance with examples of the disclosure. Specifically, Figure 1A illustrates an example of the system in a detached state, and Figure IB illustrates an example of the system in an attached state. As illustrated, the system may include an optical connector 600 comprising an FAU 610 coupled to an attachment element 510 (e.g., a carrier). The system may further include an electronic module 6300, which may comprise a PIC 6318 on a substrate 6312 and a mounting element 322 (e.g., a receptacle).

[0137] Figure IB illustrates the system in an attached state, in which the attachment element 510 of the connector 600 is coupled with the mounting element 322 of the electronic module 6300, which allows for an optical signal to be transmitted between the PIC 6318 and the FAU 610. Specifically, the mounting element 322 may comprise a plurality of first rough alignment elements configured to provide an initial alignment between the mounting element 322 and the attachment element 510, the initial alignment having a first predetermined tolerance. The attachment element 510 may comprise a plurality of first fine alignment elements configured to provide a secondary alignment between the mounting element 322 and the attachment element 510, the secondary alignment having a second predetermined tolerance less than the first predetermined tolerance. In some examples, the second predetermined tolerance is a sub-micron tolerance. The plurality of first rough alignment elements and the plurality of first fine alignment elements (described in greater detail with respect to Figures 4A-4B) may allow the attachment element 510, in an attached state in which it is engaged with the FAU 610, to be detachably coupled to the mounting element 322 such that given fibers of the FAU 610 are aligned with a corresponding optical port of the PIC 6318 within the submicron tolerance. Although a single system including a single PIC-mounting element assembly and a single attachment element-FAU assembly is shown in Figures 1 A and IB, one skilled in the art in view of this disclosure will understand that multiple PIC-mounting element assemblies and attachment element-FAU assemblies may be positioned or arranged in proximity to each other. For example, in some examples eight PIC-mounting element assemblies may be positioned in a side-by-side fashion and may be configured to engage eight Page 19 of 80ATTY DKT. NO. 048833-000255 14386240v 1corresponding atachment element-FAU assemblies. In addition, one skilled in the art in view of this disclosure will recognize that other geometries and arrangements of the kinematic mounting configuration described herein may be possible (e.g., the first rough alignment elements and / or the first fine alignment elements may be positioned on the mounting element, while second rough alignment elements (e.g., rough alignment cavities) and / or second fine alignment elements (e.g., fine alignment grooves) may be positioned on the atachment element, or each may be positioned on both).

[0138] Figure 1C shows an example of a mounting element 322 with rough alignment elements 416 and spherical fine alignment elements 422, in accordance with an example of the disclosure. In some examples, the rough alignment elements 416 may be alignment pins that may provide rough alignment. As described elsewhere herein, the second fine alignment elements provided on the mounting element 322 may be grooves or may be spheres. The fine alignment elements 422 may provide fine alignment. In some examples, the spheres may be located on the mounting element 322. The spheres may be precisely positioned as described elsewhere herein.

[0139] Figure ID shows an example of an atachment element 510 with recessed rough alignment elements 512 and recessed fine alignment elements 522, in accordance with an example of the disclosure. In some examples, the rough alignment elements 512 may be recessed cavities that may be configured to interface with rough alignment elements 416, such as pins in order to provide rough alignment. As described elsewhere herein, the first fine alignment elements provided on the atachment element 510 may be spheres or grooves. The fine alignment elements 522 may provide fine alignment. In some examples, the grooves may be located on the attachment element 510. The grooves may be precisely positioned as described elsewhere herein.

[0140] Any description herein relating to the fine alignment elements may apply, whether the spheres are attached to the mounting element or the atachment element. Similarly, regardless of whether the grooves are provided on the attachment element or the mounting element, the same features and characteristics may apply.

[0141] In some examples, it may be desirable to have the spherical fine alignment elements on the attachment element 510 to reduce the likelihood of detachment of the spherical fine alignment elements during a reflow process. Providing the spherical fine alignment elements Page 20 of 80ATTY DKT. NO. 048833-000255 14386240v 1on the attachment element 510 rather than the mounting element 322 may increase the reliability of the attachment of the spherical fine alignment elements.

[0142] A reflow process may occur when attaching an electronic module 6300 to a substrate. In some examples, additional reflow processes may occur, such as when a CoW is also attached to the substrate, or when the substrate is attached as part of the package. A reflow process may allow for electrical components to be connected. In some examples, one or more optical elements may be connected during a reflow process. During a reflow process, high temperatures may be achieved, such as at least 230, 240, 250, 260, or 270 degrees C. Having the spheres on the attachment element 510 rather than the mounting element 322 may reduce the likelihood of the spheres coming off during the reflow process. Having the grooves on the mounting element may not have a detrimental effect, as the grooves may be formed into the mounting element and may not include separate parts that may come off during the reflow process. In some examples, it may be desirable to have the spheres on the mounting element side and the grooves on the attachment element side, as illustrated.

[0143] As described elsewhere herein, in order to reduce the likelihood of detachment of spherical fine alignment elements 422, it may be desirable for the spherical fine alignment elements to be supported on the attachment element 510 as illustrated and further described elsewhere herein. Similarly, it may be desirable for the groove fine alignment elements 522 to be formed into the mounting element 322, as illustrated and further described elsewhere herein.

[0144] The present disclosure contemplates various configurations for the kinematic interface. In an initial example (e.g., as illustrated in Figures 1C, 7A), the spherical fine alignment elements may be located on the mounting element 322 (the chip side). However, to reduce the likelihood of the spheres detaching during high-temperature reflow processes, it is highly advantageous to utilize a 'flipped' configuration. In this highly advantageous configuration (e.g., as illustrated in Figures 1A-1B, 2-5C, 6A, 6C), the spherical fine alignment elements 422 are securely located on the attachment element 510 (the connector side), and the second fine alignment elements 522 (e.g., grooves) are formed into the mounting element 322.

[0145] Figure IE shows a positioning tool 1300 positioning spherical fine alignment elements 422 with respect to an attachment element 510 or a mounting element 322, in accordance with an example of the disclosure. In some examples, a positioning tool may hold the fine alignment elements at a precise position while the fine alignment elements are bonded Page 21 of 80ATTY DKT. NO. 048833-000255 14386240v 1to the attachment element or mounting element. The positioning tool may include one or more cavities 1330 that may hold the spherical fine alignment elements. The cavities may be in fluid communication with one or more internal fluid passageways 1342 that may provide fluidic communication with a vacuum source. The spherical fine alignment elements may be held using a pressure differential, such as vacuum pressure. It can be understood that to reduce the risk of detachment of the spheres during a reflow process, the spherical fine alignment elements may be attached to the attachment element 510. However, in some examples, they may be attached to a mounting element 322 instead.

[0146] The spherical fine alignment elements 422 may be held at a precise position with the aid of the positioning tool 1300. The spherical fine alignment elements may be held to one or more concavities 426 of the attachment element 510 or the mounting element 322. The spherical fine alignment elements may be bonded within the cavities of the attachment element or mounting element with the aid of a bonding agent 323. The bonding agent may be soldering, brazing, welding, or other materials, or an adhesive material. The bonding agent may harden or cure in order to keep the spherical fine alignment elements in place. In some examples, application of air, time, heat, additional agents, or other steps may be taken to cause the bonding agent to harden. During the hardening process, the positioning tool may keep the spherical fine alignment elements in place. Once the hardening is sufficiently complete, the positioning tool may release the spherical fine alignment elements, which may be bonded to the attachment element or the mounting element. In some examples, additional curing or hardening steps may occur after the positioning tool releases the spherical fine alignment elements. In some examples, further steps are not needed. When the spherical fine alignment elements are released by the positioning tool, they may be precisely positioned on the mounting element to a submicron degree of precision, or any other degree of precision as provided elsewhere herein. As illustrated, the positioning tool may provide a desired pitch, distance, or height at a desired submicron accuracy of the spherical fine alignment elements, or any other degree of precision and accuracy as provided elsewhere herein.

[0147] Turning now to Figures 2 and 3, an electronic module 6300 (e.g., an electronic device, a co-packaged optics (CPO) package, a chip-on-wafer device, a silicon PIC, a photonic wafer, and / or the like) is shown, where the electronic module comprises the PIC 6318 and the mounting element 322 shown in Figure 1A. The electronic module 6300 may be configured to Page 22 of 80ATTY DKT. NO. 048833-000255 14386240v 1operate within or in conjunction with a broader network architecture. Various components of the electronic module 6300 described herein may interact with the network architecture to facilitate communication, data processing, and overall system management. In particular, the electronic module 6300 may leverage the underlying network topology (e.g., datacenter network topology) for efficient data transmission, whether through high-speed interconnections or optimized routing protocols.

[0148] As shown in Figures 2 and 3, the electronic module 6300 may include a substrate 6312 and at least one optical device depicted as a PIC 6318 (e.g., a chip containing a plurality of photonic components that may form a functioning circuit and / or that may generate, transmit, detect, and / or process light). The substrate 6312, for example, may be a printed circuit board, a metal carrier, an organic carrier, and / or a ceramic carrier. For example, the PIC 6318 may be an electro-optic modulator, a photodiode, a transmitter optical sub-assembly, and / or a receiver optical sub-assembly. As will be appreciated by those of ordinary skill in the art in view of this disclosure, the PIC 6318 is an example of an optical device with which mechanical couplers for detachably connecting FAUs may be used. Other example optical devices may include surface emitting / absorbing electro-optics devices such as VCSELs, SiP devices (e.g., grating couplers, edge couplers), photodetectors, and / or the like.

[0149] With continued reference to Figures 2 and 3, the PIC 6318 may be positioned on a peripheral portion of the substrate 6312, depicted in Figures 2 and 3 on the righthand side of the substrate. As shown in Figures 2 and 3, the mounting element 322 (described in greater detail with respect to Figures 4A-4B) may include an optical window 321, which may be positioned with respect to the PICs 6318 such that the PIC 6318 is accessible via the optical window 321. The optical window 321 may comprise an aperture (e.g., a cut-out portion or the like) through the material of the mounting element 322 configured to allow the fibers of the FAU 610 to propagate light through the optical window 321 into the PIC 6318. In some examples, a planar microlens array (PMLA) may be provided in the optical window or within the PIC. The optical window may provide optical access to the PMLA. In some examples, the mounting element 322 may be precisely positioned relative to the substrate. In some examples, the mounting element may be positioned with an accuracy of about 0.1 pm, 0.5 pm, 1 pm, 1.5 pm, 2 pm, 3 pm, 5 pm, or 10 pm of the substrate. The mounting element may be preciselyPage 23 of 80ATTY DKT. NO. 048833-000255 14386240v 1positioned by being held with a pickup head that may measure optical power to align to the substrate 6312. This may allow for precise positioning of the PIC through the optical window.

[0150] In some examples, the mounting element 322 may be bonded and actively aligned to the PIC 6318 to form a SiP with mounting element stack during manufacturing. In some examples, active alignment may be required during a manufacturing process. The active alignment may require that an active light source is provided through the mounting element and / or the attachment element during manufacturing. The mounting element may be bonded to the PIC while the light source is provided in order to ensure that a desired alignment is achieved. The position of the mounting element may be adjusted until the desired alignment is achieved. In some examples, the positioning of one or more fine or rough alignment elements may occur during an active alignment process. The mounting element 322 may be configured to removably engage with the attachment element 510 (illustrated in Figures 5A-5B). The attachment element 510, in turn, may be attached to an FAU to form a detachable connector 600 (as illustrated in Figures 1A-1B), which may further be connected via optical fibers of the FAU to an optical connector (e.g., an MPO connector, an attachment element of another detachable connector, and / or the like) that is in optical communication with one or more optical devices (not pictured). In this way, the mounting element 322 and the attachment element 510 may be configured to detachably optically connect the PIC 6318 of the electronic module 6300 to one or more other optical devices in a network. In some examples, the PIC 6318 may be configured to convert electrical signals to optical signals and transmit the optical signals via the detachable connector 600 to one or more optical devices. Additionally, or alternatively, the PIC 6318 may be configured to receive optical signals from one or more optical devices and convert the optical signals to electrical signals.

[0151] Figures 4A-4B schematically depict a kinematic interface 700 of the mounting element 322 of the electronic module 6300, in accordance with an example of the present disclosure. As depicted, the mounting element 322 may comprise a substantially planar body 411 that defines the optical window 321. The optical window 321 may be configured to allow optical signals to pass between the PIC 6318 and the detachable connector 600. The optical window may be formed as an opening or cutout through which optical signals may pass. The optical window need not have any material within the optical window. In some examples, one or more optical elements may be provided within the window.Page 24 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0152] The planar body may comprise a material having a relatively low coefficient of thermal expansion (CTE), such as glass or metal (e.g., Kovar® alloy, Invar® alloy, copper, or the like). In some examples, the planar body may be formed from a material having a CTE of less than or equal to about 2.0, 2.5, 3.0, 3.5, 4.0, 4.5, 5.0, 6.0, 7.0, 10.0, 15.0, 20.0, 25.0 ppm / C at room temperature. Furthermore, the planar body may comprise a material having a CTE approximately similar to the CTE of the substrate 6312 to prevent deformation and maintain optical performance during temperature changes. In some examples, the planar body may comprise a material with a CTE that varies less than 1%, 3%, 5%, 7%, 10%, 15%, or 20% compared to a CTE of the substrate.

[0153] In some examples, the kinematic interface 700 of mounting element 322 may comprise at least one first rough alignment element supported by the planar body 411, such as two first rough alignment elements 416, as shown in the depicted example. Each first rough alignment element 416 may extend from the planar body 411 and may be configured to provide rough alignment of the mounting element 322 with the attachment element 510, as described in greater detail below. In the depicted example, for example, each first rough alignment element 416 is disposed in a corner of the mounting element 322; however, other arrangements of the first rough alignment elements are possible.

[0154] Each first rough alignment element may be substantially column-shaped (e.g., a peg, pillar, cylinder, prism, cone, pyramid or the like). In some examples, the rough alignment elements may protrude outward from a surface of the planar body. It can be appreciated that although a protruding rough alignment element is illustrated and described, the rough alignment element may be a recessed element or any other complementary shape or feature that may be configured to engage with another corresponding element. The rough alignment elements may be formed integrally with the planar body or may be affixed to the planar body during a manufacturing process, such as via welding or use of an adhesive.

[0155] The kinematic interface 700 of the mounting element 322 may further comprise a plurality of second fine alignment elements 522 (e.g., fine alignment grooves, as depicted) positioned on the planar body 411, where each second fine alignment element 522 is configured to receive a corresponding first fine alignment element 422 of a second kinematic interface 701, described in greater detail with respect to Figures 5A-5C. In some examples, each second fine alignment element 522 is a recessed element, such as a groove. The second Page 25 of 80ATTY DKT. NO. 048833-000255 14386240v 1fine alignment elements may include a slit, trough, indentation, cavity or any other configuration. Any description herein of a groove may apply to any other type of second fine alignment element. In some examples, the groove may be substantially V-shaped, such that each first fine alignment element 422 (e.g., each sphere in the example depicted in Figures 5A-5C) contacts the inner surface of each second fine alignment element 522 (e.g., each groove in the depicted example) at two points, when engaged. In other examples, each second fine alignment element 522 may be structured other than a V-shaped groove. The groove may have any other shape or profile, such as a U-shaped groove, a trapezoidal groove, or a groove with straight or curved sides. The sides may be concave or convex.

[0156] The fine alignment elements may be recessed alignment elements that need not protrude from the planar body. In some examples, the fine alignment elements may protrude from the planar body and still allow for precise positioning when engaged with the first fine element 422. In some examples, two parallel cylinders or sections of cylinders may be used to provide two points of contact with each first fine alignment element 422, when engaged. The fine alignment elements may be configured to allow for two points of contact when the first fine alignment elements are engaged. The fine alignment elements may allow for at least two points of contact, or no more than two points of contact. In some examples, the fine alignment elements having a linear or elongated orientation may advantageously allow for some manufacturing tolerance while still maintaining high degrees of precision for placement.

[0157] In some examples, the second fine alignment elements 522 comprise a material having a hardness of around 36-40 on the Rockwell C scale. The hardness may be greater than 25, 30, 35, 36, 38, 40, 45, 50, or 60 on the Rockwell C scale. This may prevent damage or deformation to the alignment elements, and prevent the preciseness of the placement from degrading over time. The second fine alignment elements may be formed from a material with a CTE of around 8.6 x 10A-6 / K (e.g., titanium) to maintain precision and reduce stress under heat. The second fine alignment elements may have a CTE of at least any value provided herein, less than any CTE value provided herein, or falling within a range between any two of the CTE values provided herein.

[0158] Furthermore, the second fine alignment elements 522 may each comprise a frictionreducing coating (e.g., a diamond-like carbon (DLC) coating, molybdenum disulfide coating, tungsten disulfide coating, or the like) configured to prevent or reduce an amount of friction Page 26 of 80ATTY DKT. NO. 048833-000255 14386240v 1created at the contact points between the second fine alignment elements 522 and the first fine alignment elements 422. The coating may increase the hardness of the second fine alignment elements (e.g., to approximately 48-55 on the Rockwell C Scale). In some examples, a DLC coating increases the surface hardness of the first and / or second fine alignment elements to a range of 48-55 on the Rockwell C Scale. The DLC coating may be applied on a surface of the second fine alignment elements to increase the hardness. In some examples, the entirety of the second fine alignment elements may be coated with the DLC coating or a portion of the second fine alignment elements (e.g., at least at the contact points) may be covered with the DLC coating.

[0159] The second fine alignment elements 522 may be integrally formed in the mounting element 322 via an injection molding process or may be formed by removing material from the mounting element 322 via a metal machining process. In some examples, the kinematic interface 700 may comprise three second fine alignment elements 522 arranged in a triangular configuration on the planar body 411, where the optical window 321 is at least partially located within the triangle 401 formed by the first fine alignment elements 422. In some examples, the second fine alignment elements may have an elongated shape, where a longitudinal axis of the elongated shape may pass through an interior region of the triangle. In some examples, the longitudinal axis may pass through a center or centroid of the triangle. In some examples, three corresponding longitudinal axes may be provided for three fine alignment elements, and the respective longitudinal axes may pass through the interior region of the triangle and / or intersect at a center or centroid of the triangle. The second fine alignment elements may be oriented so that they radiate in / out along the vertices of the triangle.

[0160] In some examples, the fine alignment elements may be more precisely positioned or allow for more precise relative positioning compared to the rough alignment elements. For example, the fine alignment elements may be precisely positioned to within 0.1 microns, 0.3 microns, 0.5 microns, 0.7 microns, 1 micron, 1.5 microns, 2 microns, 3 microns, 5 microns, 10 microns, 15 microns, 20 microns, 25 microns, 30 microns, or 50 microns. The fine alignment elements may allow for precise positioning between the planar body and a mounting element to within such degrees of precision. The rough alignment element may allow for positioning to within at least 1 micron, 3 microns, 5 microns, 10 microns, 15 microns, 20 microns, 30 microns, 50 microns, 70 microns, 100 microns, 200 microns, 300 microns, 500 microns, or 1Page 27 of 80ATTY DKT. NO. 048833-000255 14386240v 1mm. In some examples, the fine alignment elements may allow for lx, 2x, 3x, 5x, lOx, 15x, 20x, 3 Ox, 5 Ox, lOOx, 200x, or 300x more precise alignment compared to the rough alignment elements.

[0161] The planar body 411 of the mounting element 322 may be substantially rectangular or square in shape, and in some examples the peripheral edge of the planar body may include one or more indentations, cutouts, or transmission windows (e.g., a cutout 430) configured to accommodate one or more system components (e.g., portions of the detachable connector 600, one or more tools used during installation and / or maintenance, and / or the like). In some examples, one or more fine alignment elements may be provided entirely within the planar body so that the fine alignment elements may have ends that start and terminate within the planar body. In some examples, the ends of the fine alignment elements may be provided at the peripheral edge of the planar body. For example, a groove may reach the peripheral edge of the body such that an indentation of the groove is provided at the peripheral edge of the body.

[0162] In some examples, wherein the cutout 430 comprises a transmission window, the transmission window may comprise a material associated with an optical wavelength that matches a predetermined optical wavelength (e.g., glass, silicon, or the like) and may further comprise an antireflective coating on a top and / or bottom side. In some examples, an antireflective coating may be provided on the sidewalls of the transmission window. In some examples, the transmission window may be empty and may not require any material.

[0163] Furthermore, the planar body 411 may comprise a substantially planar top surface and / or bottom surface in some examples, whereas in other examples the planar body may comprise one or more ridges (e.g., raised portions, bevels, textures, and / or the like) on one or both of the top and bottom surfaces, depending on one or more system requirements, user preferences, and / or manufacturing considerations (e.g., improved bonding between the mounting element 322 and the substrate 6312, providing access to the optical window 321 for cleaning or maintenance, and / or the like).

[0164] In some examples, the mounting element 322 may have a width of approximately 6-7mm and a height of approximately 5-7mm. The optical window 321 may have a width of approximately 4-5mm and a height of approximately 0.75-lmm. Similarly, other dimensions can be provided. The cutout 430 may have a width of approximately 2.7-3mm and a height of Page 28 of 80ATTY DKT. NO. 048833-000255 14386240v 1approximately 1.2-1.5mm. In some examples, the bottom side of the mounting element may include one or more cavities or channels having a width of approximately 1-1.5mm, and a height of approximately 1.5-2mm. Such dimensions are provided by way of example only, and other dimensions may be provided, such as those that vary by at least 1%, 3%, 5%, 10%, or 20% from the dimensions as provided.

[0165] In some examples, one or more channels may be provided on an underside of the mounting element or upper side of the mounting element. These may include the cavities and / or channels having a width of approximately 1-1.5mm, as described herein, or any other dimensions. In some examples, fluid may flow through the channels. The fluid may flow from an RCP opening through the channels to the optical window. The fluid may be a liquid or gaseous fluid that may help clean the optical window 321. In some examples, air may be flowed through the channels to help clear the optical window. In some examples, a liquid cleaning solution may flow over the window and help clean the optical window. In some examples, cleaning the optical window may be desirable to ensure desired optical performance. During a reflow process as described elsewhere herein, a residue may be formed. The fluid may be a liquid or gaseous fluid that helps to remove the residue following the high-temperature reflow process.

[0166] Figures 5A-5C depict perspective views of the kinematic interface 700 of the mounting element 322 and a corresponding kinematic interface 701 of an attachment element 510. The attachment element 510 may comprise a material having a relatively low coefficient of thermal expansion (CTE), such as glass or metal (e.g., Kovar® alloy, Invar® alloy, copper, silicon, or the like). In some examples, the attachment element 510 may comprise Kovar® and may further comprise an outer plating (e.g., a nickel plating). For example, the CTE may match silicon's CTE (approx. 2.6 pm / m °C). The attachment element 510 may be formed of the same material as the mounting element 322 and / or have one or more material characteristics that may be the same or similar to the material of the mounting element 322, and vice versa.

[0167] As described in greater detail with respect to Figures 6A-6B, the attachment element 510 may be attached to a fiber array unit (FAU) to form the detachable connector 600. The attachment element may be provided at an end of the FAU. The attachment element 510 may be configured to interface with the mounting element 322. In some examples, a kinematic Page 29 of 80ATTY DKT. NO. 048833-000255 14386240v 1interface 701 of the attachment element 510 may face the kinematic interface 700 of the mounting element 322 when they are attached.

[0168] The kinematic interface 701 of the attachment element 510 may comprise at least one second rough alignment element 512 (e.g., a rough alignment cavity) (shown in Figures 5B and 5C), where each second rough alignment element 512 is configured to engage a corresponding first rough alignment element 416 of the kinematic interface 700 of the mounting element 322. The second rough alignment element 512 may be a rough alignment cavity that may, for example, have a tapered inner surface, such that a diameter of the cavity proximate a bottom surface 513 of the attachment element is larger than a diameter of the cavity more distal from the bottom surface. In this way, each second rough alignment element 512 of the kinematic interface 701 may self-align with a corresponding first rough alignment element 416 of the kinematic interface 700 by receiving the first rough alignment element via the larger diameter portions of the cavity and allowing the first rough alignment element to slide along the inner surface of the cavity toward the narrower diameter portions of the cavity, thereby adjusting the location of the first rough alignment element with respect to the attachment element 510. Additionally or alternatively, the kinematic interface 701 may comprise one or more first rough alignment elements 416 as described with respect to Figures 4A-4B, and the kinematic interface 700 of the mounting element 322 may comprise one or more corresponding second rough alignment elements 512, in order to provide a rough alignment of the mounting element 322 with the attachment element 510.

[0169] The kinematic interface 701 of the attachment element 510 may further comprise a plurality of first fine alignment elements 422 positioned on the bottom surface 513 of the attachment element 510. In some examples, as depicted in Figures 5A-5C, each of the plurality of first fine alignment elements 422 may comprise a convex alignment feature. The convex alignment feature may have a curved surface. In some examples, the convex alignment surface may include a surface of a sphere, semi-sphere, ellipsoid, semi-ellipsoid, cylinder, semicylinder, spherocylinder, semi-spherocylinder, or any other shape. The fine alignment elements may be spheres, or any other shapes, including those described herein. In some examples, the kinematic interface 701 may comprise three first fine alignment elements 422 arranged in a triangle 501 corresponding to the triangle 401 formed by the first fine alignment elements 422 of the kinematic interface 700.Page 30 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0170] Furthermore, the first fine alignment elements 422 may each comprise a frictionreducing coating (e.g., a diamond-like carbon (DLC) coating, molybdenum disulfide coating, tungsten disulfide coating, or the like) configured to prevent or reduce an amount of friction created at the contact points between the second fine alignment elements 522 and the first fine alignment elements 422. The coating may increase the hardness of the first fine alignment elements (e.g., to approximately 48-55 on the Rockwell C Scale). In some examples, at least one of the first fine alignment elements 422 and the second fine alignment elements 522 may have a coating, such as a friction-reducing coating, or a hardness increasing coating. Such coatings may be provided at or near contact points between the first and second fine alignment elements when they come together.

[0171] In some examples, each first fine alignment element 422 may be positioned such that a pitch of the first fine alignment elements 422 with respect to each other is within a predetermined range of final pitches (e.g., within ±0.1 degree , ±0.3 degrees, ±0.5 degrees, ±1 degree, ±3 degrees, or ±5 degrees). For example, in examples in which the first fine alignment elements 422 form a triangle 501, the first fine alignment elements may be positioned with respect to each other such that a distance 424 between two first fine alignment elements 422 is within a predetermined range of distances (e.g., within ±l-3pm of a predetermined distance, or within ±1 pm, ±1.5 pm, ±2 pm, ±3 pm, ±4 pm, ±5 pm, ±10 pm, or ±20 pm within a predetermined distance). The final pitch of the spheres is controlled to a distance tolerance of 1-3 pm. Additionally or alternatively, the first fine alignment elements 422 may be positioned such that a height 403 of the top of each first fine alignment element 422 with respect to a surface of the attachment element 510 is substantially the same (e.g., ±1-3 pm from a predetermined height, or within ±0.5 pm, ±1 pm, ±1.5 pm, ±2 pm, ±3 pm, ±4 pm, ±5 pm, ±10 pm, or ±20 pm from a predetermined height). These fine alignment elements may allow for a corresponding level of preciseness when the kinematic interface 701 of the attachment element 510 is brought into connection with the kinematic interface 700 of the mounting element 322. An engagement between the first fine alignment elements 422 and the second fine alignment elements 522 may allow for such a level of accuracy and precision in pitch, distance, and height.Page 31 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0172] As described elsewhere herein, rough alignment elements may be provided between the kinematic interface 701 of the attachment element 510 and the kinematic interface 700 of the mounting element 322.

[0173] In some examples, each first rough alignment element 416 or second rough alignment element 512 may be positioned such that a pitch of the first rough alignment elements 416 or second rough alignment elements 512 with respect to each other is within a predetermined range of final pitches (e.g., within ±1 degree, ±2 degrees, ±3 degrees, ±5 degrees, ±7 degrees, or ±10 degrees). For example, in examples in which the first rough alignment elements 416 or second rough alignment elements 512 form a triangle, the first rough alignment elements or second rough alignment elements may be positioned with respect to each other such that a distance between two first rough alignment elements 416 or second rough alignment elements 512 is within a predetermined range of distances (e.g., within ±3 pm ±5 pm, ±10 pm, ±15 pm, ±20 pm, ±30 pm, ±50 pm, ±100 pm, or ±200 pm, within a predetermined distance). Additionally or alternatively, the first rough alignment elements 416 or second rough alignment elements 512 may be positioned such that a height 403 of the top of each first fine alignment element 422 with respect to a surface of the attachment element 510 is substantially the same (e.g., ±l-3pm from a predetermined height, or within 5 pm, ±10 pm, ±15 pm, ±20 pm, ±30 pm, ±50 pm, ±100 pm, or ±200 pm from a predetermined height). In some examples, the height of the first rough alignment elements 416 or second rough alignment elements 512 need not be provided to a high degree of precision or accuracy. In some examples, a pair of rough alignment elements may be provided.

[0174] In some examples, rough alignment elements of the kinematic interface 701 of the attachment element 510 and the kinematic interface 700 of the mounting element 322 may have less of a degree of accuracy and / or precision compared to fine alignment elements. For instance, predetermined pitches, distances, or heights between rough alignment elements may have a tolerance of at least 0.5x, lx, 2x, 3x, 5x, 7x, lOx, 15x, 20x, 50x, lOOx, 200x, or 300x greater than the fine alignment elements. In some examples, the fine alignment elements may obtain a position within about ±1 pm accuracy while a rough alignment will have about a ±100 pm range. The rough alignment elements may define a capture range (e.g., ±100 pm range or any other range described elsewhere herein) that may be less than a diameter of a fine alignment concavity. In some examples, a capture range of the rough alignment elements may Page 32 of 80ATTY DKT. NO. 048833-000255 14386240v 1be greater than a diameter of a corresponding mating rough alignment element. The at least one rough alignment element may constrain a system to a capture range that is smaller than a diameter of the at least one fine alignment element, such that the fine alignment elements are guided into their respective mating features without manual intervention

[0175] In some examples the rough alignment elements may come into contact with one another or engage with one another prior to the fine alignment elements. This may allow the kinematic interface 701 of the attachment element 510 to be roughly aligned with the kinematic interface 700 of the mounting element 322 prior to the fine alignment elements engaging with one another (e.g., first fine alignment elements engaging with the second alignment elements). The rough alignment may ensure that the corresponding parts are properly locked in place through the fine alignment. Allowing the rough alignment elements to engage first may provide more tolerance for initial engagement while still subsequently allowing the fine alignment elements to then engage for a higher degree of accuracy. In some examples, the rough alignment elements may engage first by having a first or second rough alignment element with a greater height than the fine alignment elements, which may cause the rough alignment elements to engage with one another first when the kinematic interfaces 700, 701 are brought together.

[0176] The kinematic interface 701 may further comprise a plurality of concavities 426, with each concavity 426 being configured to receive a first fine alignment element 422. For example, each concavity 426 may comprise a semicircular or a hemispherical shape. In some examples, the first fine alignment elements 422 may comprise a ceramic material and may be fixed within and with respect to the concavities 426, such as via an adhesive, epoxy, bonding, or the like. In some examples, the first fine alignment elements 422 may comprise glass and may be directly mounted to the attachment element 510 or integrally formed within the plurality of concavities during a manufacturing process. In some examples, the kinematic interface may further comprise a plurality of additional cavities 508 configured to receive a plurality of magnets (not depicted), the plurality of magnets being configured to provide additional adhesion and stability between the attachment element 510 and the mounting element 322 when the detachable connector 600 is in an attached state.In some examples, the mounting element 322 may comprise a plurality of concavities 426, with each concavity being configured to receive a first fine alignment element 422, as Page 33 of 80ATTY DKT. NO. 048833-000255 14386240v 1described with respect to Figures 1A-4B, and the attachment element 510 may comprise a plurality of corresponding second fine alignment elements 522 (e.g., fine alignment grooves) (e.g., as depicted in Figures 6A-6D).

[0177] Figure 5D shows and illustrates rough alignment elements coming together. For example, a first rough alignment element 416 may be positioned on a mounting element 322. A second rough alignment element 512 may be provided on an attachment element 510 which may be provided at a proximal end of a detachable connector 600. A single set of rough alignment elements can be provided, although it can be appreciated that multiple sets of rough alignment elements can come together to form a connection. For example, three sets of rough alignment elements in a triangular arrangement may come together. In some examples, a pair of rough alignment elements may come together.

[0178] The second rough alignment element 512 may include a recess, cavity, hole or other concave portion that may be configured to receive a first rough alignment element 416. The first rough alignment element 416 may be a guiding pin or shape, protrusion, column, pillar, or any other type of convex shape that may extend out from a surface of the mounting element 322. It can be appreciated that a reverse configuration may be provided where the first rough alignment element has a convex shape and the second rough alignment element has a concave shape. Any description herein may apply to any variation of these configurations.

[0179] In some examples, a guiding pin or other first rough alignment element 416 may be inserted into a cavity or other second alignment element 512 to come together. Some tolerance may be provided such that a dimension (e.g., diameter, diagonal, length, width, circumference, or perimeter) of the first rough alignment element may be less than a corresponding dimension (e.g., diameter, diagonal, length, width, circumference, or perimeter) of a second rough alignment element. This may allow for some tolerance in lateral configuration between the first rough alignment element and the second rough alignment element. In some examples, the dimension of the first rough alignment element may be at least 0.001 mm, 0.005 mm, 0.01 mm, 0.05 mm, 0.1 mm or 0.5 mm less than a dimension of the second rough alignment element.

[0180] In some examples, the second rough alignment element may have a tapered opening 417. The tapered opening may be an entry funnel. For example, the dimension (e.g., diameter, diagonal, length, width, circumference, or perimeter) at the opening of the first rough alignment element may be greater than the corresponding dimension (e.g., diameter, diagonal,Page 34 of 80ATTY DKT. NO. 048833-000255 14386240v 1length, width, circumference, or perimeter) of the first rough alignment element. The dimension may be greater by at least 0.001 mm, 0.005 mm, 0.01 mm, 0.05 mm, 0.1 mm or 0.5 mm. In some examples, the tapered opening may have a pitch angle of at least 5 degrees, 10 degrees, 15 degrees, 20 degrees, 25 degrees, 30 degrees, 35 degrees, 40 degrees, 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, or 75 degrees relative to the longitudinal axis of the second rough alignment element. In some examples, an entry funnel may have an opening angle of about 60 degrees, or any other degree value as described herein. The tapered opening may allow for greater tolerance when aligning the attachment element 510 with the mounting element 322. The tapered opening may guide the first rough alignment element to a more central position while the first rough alignment element enters the second rough alignment element. For example, an entry funnel may provide a leading angle for a first rough alignment element (e.g., guide pin) that may enter the second rough alignment element.

[0181] The tapered portion may be provided at a first section of the second rough alignment element. The second rough alignment element may have a second section. In some examples, the second section may have a substantially cylindrical or conical shape. In some examples, the diameter or other dimension within the first section may be greater than the diameter or other dimension in the second section. The diameter or other dimension may be gradually decreased from an opening at the second section to the portion of the second section that interfaces with the first section.

[0182] The configuration of the rough alignment may allow for blind mating to occur between the attachment element and the mounting element. The initial rough alignment may have a higher tolerance to allow for mating to occur, and then finer alignment may be provided to allow for a desired degree of precision in alignment.

[0183] Such configurations may allow for blind mating to occur. A blind-mating functionality of the system may allow the attachment element and mounting element to be coupled without requiring visual alignment or manual guidance of the fine alignment elements. During a mating operation, the at least one rough alignment element of one component is brought into proximity with the at least one mating rough alignment element of the other component. A tapered cavity or entry funnel of the mating rough alignment element may receive the rough alignment element and provides initial lateral and angular guidance, constraining the relative position of the two components within the first tolerance range. As the Page 35 of 80ATTY DKT. NO. 048833-000255 14386240v 1two components are brought closer together, the rough alignment elements guide the components into coarse alignment, reducing the lateral offset and angular misalignment.

[0184] Once the rough alignment elements are substantially engaged, continued vertical motion brings the fine alignment elements into proximity. The fine alignment elements, which may comprise spheres and grooves as described elsewhere herein, then engage to provide the secondary alignment with the second tolerance, which is substantially less than the first tolerance (e.g., sub-micron precision). The sequential engagement of coarse alignment followed by fine alignment enables the blind-mating operation, as the coarse alignment elements provide sufficient initial guidance to ensure that the fine alignment elements can subsequently engage without interference or damage. This two-stage alignment process allows for repeatable, high-precision optical coupling without requiring external alignment tools or visual inspection during the mating process.

[0185] Figure 5E illustrates fine alignment elements coming together. For example, a second fine alignment element 522 may be positioned on a mounting element. A first fine alignment element 422 may be provided on an attachment element. A single set of fine alignment elements can be provided, although it can be appreciated that multiple sets of fine alignment elements can come together to form a connection. For example, three sets of fine alignment elements in a triangular arrangement may come together.

[0186] In some examples, a second fine alignment element 522 may include a recess or groove that may be configured to accept a first fine alignment element 422. In some examples, two contact points 523 may be provided between the first fine alignment element and the second fine alignment element. When a force F is applied to bring the first and second fine alignment elements together, the shape of the first and second fine alignment elements may be such that they are pushed together into a precise position for height due to the two contact points. The first fine alignment element may be pushed as far into the second fine alignment element as geometrically possible. This may allow for the highly precise relative height arrangement between the mounting element and the attachment element.

[0187] In some examples, an arrangement of multiple second fine alignment elements 522 may be configured to accept an arrangement of multiple first fine alignment elements 422. In some examples, three second fine alignment elements may accept a corresponding three first fine alignment elements. In some examples, two contact points may be provided between each Page 36 of 80ATTY DKT. NO. 048833-000255 14386240v 1set of first fine alignment elements and the second fine alignment elements. When three sets of first and second fine alignment elements are provided, this may allow for six attachment elements. Three sets of first and second alignment elements may have a triangular arrangement. This may allow for a unique single lateral positioning to occur between the mounting element and the attachment element. When a force F is applied to bring the first and second fine alignment elements together, the first and second fine alignment elements may be pushed together into a precise position for height due to the two contact points. The force may also cause the lateral alignment to reach the unique single lateral positioning as illustrated. This may allow for the highly precise relative lateral arrangement between the mounting element and the attachment element. This precise lateral arrangement may include relative location and / or angular orientation between the mounting element and the attachment element.

[0188] With reference to Figures 5A-5C, the attachment element 510 may be configured to receive and optically couple with an FAU 610 so as to form a detachable optical connector 600. In some examples, the detachable optical connector 600 may comprise a strain relief harness (e.g., a boot) 601 coupled to the FAU 610, which may be coupled to one or more other system components (not pictured) to relieve strain on the fibers 602 of the FAU 610 during shipment, assembly, and operation. The FAU 610 and the attachment element 510 may be configured such that the attachment element 510 may receive the FAU 610 and both mechanically and optically couple the optical fibers 602 of the FAU 610 to the electronic module 6300. In particular, and as described further herein, the FAU 610 and the attachment element 510 may be configured to precisely mechanically align with each other such that when the attachment element 510 is coupled to the mounting element 322 via the kinematic interfaces 700 and 701, each of the optical fibers 602 is precisely optically aligned with a corresponding optical aperture (e.g., an optical channel or lens configured to allow light (e.g., an optical signal) to pass therethrough) and waveguide of the PIC 6318 of the electronic module 6300.

[0189] As shown in Figures 5A and 6C, the attachment element 510 may comprise a first bonding surface 620 configured to couple with a corresponding surface of the FAU 610. As depicted, the first bonding surface 620 may be positioned at an angle a ’ with respect to a second bonding surface 530 (e.g., a bottom surface and / or the kinematic interface 701) of the attachment element 510, where the angle is selected to minimize a working distance wd Page 37 of 80ATTY DKT. NO. 048833-000255 14386240v 1between the end of each fiber 602 of the FAU 610 and the corresponding optical ports (not shown in Figure 6C) of the electronic module 6300. The first bonding surface may be tilted with respect to a kinematic interface 701. The first bonding surface may be positioned at a non-orthogonal angle relative to the bottom kinematic interface to minimize or reduce the optical working distance. As illustrated in Figure 6C, the angle a ’ minimizes the distance wd between the FAU 610 and the second bonding surface 530 of the attachment element, but still allows for enough clearance considering the height of the second fine alignment elements 522 or the plurality of concavities 426 formed in the attachment element. Specifically, the angle a ’ is selected in order to allow the end of each fiber 602 to be positioned as closely as possible to the second bonding surface 530, while providing space for the second fine alignment elements 522 (e.g., the grooves) to extend upward into the body of the attachment element 510. The detachable connector 600 may further comprise a gap 640 between the body of the attachment element 510 and the fibers 602 of the FAU 610, in order to provide strain relief to the fibers 602 and to otherwise minimize mechanical forces acting on the fibers 602. As illustrated in Figure 6D, which depicts a partial bottom view of the detachable connector 600, the attachment element 510 may have a width l (e.g., approximately 7-7.4mm), while the FAU 610 may have a width w2 (e.g., approximately 5.2-5.7mm). Width w2 may be slightly shorter than width wl, such that a gap having a width w2 ’ (e.g., approximately 0.1-0.2mm) is created on either side of the FAU 610 when coupled to the attachment element 510. Figure 6E depicts an example of the electronic module 6300 detachably coupled to the detachable connector 600, with the FAU 610 affixed to the attachment element 510 and the mounting element 322 affixed to the PIC 6318. In some examples, the attachment element 510 and the mounting element 322 are maintained in a coupled configuration using a force application mechanism that applies a force F to a push plate 650 that is applied or attached to a top surface of the attachment element 510, as shown in Figures 6C and 6E.

[0190] In this regard, the push plate 650 may be attached to the top surface of the attachment element 510, such that when a downward force F is applied to the push plate, the second fine alignment elements 522 (e.g., grooves) of kinematic interface 700 engage with the first fine alignment elements 422 of the kinematic interface 701, preventing the attachment element 510 from moving with respect to the mounting element 322. In some examples, the force application mechanism may be configured to apply a force of approximately 2N-10N Page 38 of 80ATTY DKT. NO. 048833-000255 14386240v 1(e.g., around 4N, in some examples) to the push plate 650. Moreover, in some examples, the push plate 650 may be positioned at least partially within the triangular configuration 501 formed by the first fine alignment elements 422, such that the location of the push plate causes a net downward force to be applied by the force application mechanism. In some examples, for example, the net downward force is applied to the center of the triangular configuration 501 (shown in Figure 5C), thereby evenly distributing the force among the first fine alignment elements 422 and facilitating a more precise alignment of the first fine alignment elements 422 within the second fine alignment elements 522.

[0191] In some examples, the force F that may be applied to attachment element may be provided in a centralized manner. For example, a single vertical force may be provided on a top surface of the attachment element. The force may be provided at or near a central region of the top surface of the attachment element. The force may be sufficient to cause the selfalignment of the attachment element to the mounting element. The centralized application of force may allow for optimization of kinematic constraint.

[0192] In some examples, a one to one correspondence may be provided where a single attachment element may be configured to interface with a single mounting element which may be supported on a PIC. In some examples, a plurality of mounting elements may be provided on the PIC. In some examples, an attachment element has a maximum width configured to permit side-by-side placement with identical connectors on a shared photonic integrated circuit.

[0193] In some examples, the system may include a connector housing assembly configured to manage a plurality of detachable connectors in a ganged arrangement. The connector housing assembly may comprise a rigid frame structure having a plurality of connector receptacles, each receptacle configured to receive and secure an individual detachable connector in a predetermined spatial relationship with respect to adjacent connectors. The connector housing assembly may accommodate any number of detachable connectors. The detachable connectors may be arranged in any grouping, such as a row, column, array, staggered rows, or any other arrangement. In some examples, the connector housing assembly may accommodate eight detachable connectors arranged in a linear array. In some examples, each connector is positioned with a center-to-center spacing of approximatelyPage 39 of 80ATTY DKT. NO. 048833-000255 14386240v 17-7.4 mm to correspond with the pitch of eight side-by-side mounting elements on the electronic module.

[0194] The connector housing assembly may comprise a base plate having a plurality of alignment features configured to engage corresponding features on each attachment element, thereby ensuring consistent positioning of all connectors within the housing. The alignment features may include precision-machined guide rails, alignment pins, or registration slots that constrain lateral and rotational movement of each connector while allowing vertical motion during installation and removal operations.

[0195] The connector housing assembly may further comprise a top retention plate or clamping mechanism configured to apply a uniform downward force across all eight connectors simultaneously, distributing the force of approximately 2N-10N per connector through individual force application points positioned at or near the center of each attachment element's triangular kinematic interface configuration. The retention plate may be actuated by a single mechanical lever, cam mechanism, pneumatic actuator, or electromagnetic actuator that converts a single input motion into synchronized vertical force application across all eight connectors, thereby enabling simultaneous engagement or disengagement of all kinematic interfaces in the ganged assembly.

[0196] The connector housing assembly may be configured to maintain a predetermined pitch tolerance. Any tolerance values as described herein may be maintained. In some examples, the predetermined pitch tolerance may be of ±1 pm, ±3 pm or ±10 pm or less across all eight connectors to ensure proper alignment of each connector's kinematic interface with its corresponding mounting element on the electronic module during mating operations. In some examples, the connector housing assembly may include visual alignment indicators, registration marks, or mechanical stops to facilitate proper positioning of the housing assembly relative to the array of mounting elements on the electronic module prior to engagement.Example Method of Assembling a Detachable Connector

[0197] Figure 7A is a flowchart illustrating a method 900 of assembling a detachable connector for detachably coupling an FAU 610 to an electronic module 6300, in accordance with an example of the present disclosure. In some examples, the method 900 may begin at Block 910, comprising placing the planar body of the mounting element (e.g., the mounting Page 40 of 80ATTY DKT. NO. 048833-000255 14386240v 1element 322 of Figures 7-8 described above) in alignment with respect to the PIC 6318. In some examples, a magnet may be used to move the planar body of the mounting element with respect to the PIC 6318 to achieve alignment. In some examples, Block 910 comprises aligning each mounting element of a group of mounting elements to a corresponding group of PICs 6318 to form the electronic module 6300. In some examples, the planar body of the mounting element may be mounted to an alignment tool which mimics the attachment element 510.

[0198] With reference to Block 920, the optical window of the mounting element may then be aligned with respect to the PIC 6318 using one or more test fibers. The test fibers may, for example, form part of a testing system that is designed to mimic an attachment element and FAU. The testing system may be configured to obtain at least one optical feedback measurement via the one or more test fibers, and the feedback measurement may inform further movement of the mounting element with respect to the PIC 6318 to improve the alignment of the optical window with the PIC. Once the mounting element is aligned such that the one or more test fibers are sufficiently precisely aligned with the PIC 6318, the method may continue to Block 930, in which the mounting element is held in place with respect to the substrate 6312 while being bonded to form the electronic module (e.g., thermally bonded, adhesively bonded, or the like). In some examples, the alignment process of Block 920 is repeated with respect to each mounting element of the group of mounting elements.

[0199] In some examples, an active alignment method may be used to provide the alignment process of Block 920. The active alignment method may comprise positioning a mounting element having a planar body and an optical window with respect to the PIC, where the mounting element comprises a first kinematic interface including one or more fine alignment elements and one or more rough alignment elements. Test fibers may be positioned to simulate the final configuration of an attachment element and fiber array unit (FAU) that will mate with the mounting element.

[0200] Optical signals may be transmitted through the test fibers, and optical feedback measurements may be received through the optical window of the mounting element. These optical feedback measurements may include optical power levels, coupling efficiency, insertion loss, or other optical performance metrics that indicate the quality of alignment between the test fibers and the optical apertures of the PIC. The position of the mounting element may be iteratively adjusted with respect to the PIC based on the optical feedback Page 41 of 80ATTY DKT. NO. 048833-000255 14386240v 1measurements to maximize optical coupling efficiency or minimize insertion loss. Adjustments may be made in multiple degrees of freedom, including translational movement in X, Y, and Z axes, as well as rotational adjustments about one or more axes.

[0201] Once the optical feedback measurements indicate that the optical window is sufficiently aligned with the one or more optical apertures of the PIC (e.g., when insertion loss is minimized or coupling efficiency is maximized within a predetermined tolerance), the mounting element may be bonded to the PIC while maintaining the aligned position. The bonding process may comprise applying an adhesive, epoxy, or solder between the mounting element and the PIC or substrate, and allowing the bonding material to cure or solidify while the mounting element is held in the aligned position. After bonding, the resulting assembly comprises an electronic module configured for detachable coupling with an attachment element via the first kinematic interface, where the kinematic interface has been precisely positioned to ensure optimal optical alignment when the attachment element is subsequently coupled to the mounting element.

[0202] In some examples, an active alignment process may be facilitated by an alignment jig specifically configured to position and maintain the mounting element during the bonding process. The alignment jig may comprise a body configured to temporarily engage the mounting element while allowing optical signals to be transmitted through the optical window for feedback measurements. The jig body may include one or more magnetic coupling elements configured to magnetically couple to the mounting element and controllably adjust the position of the mounting element relative to the PIC with submicron precision. In some examples, the magnetic coupling element may comprise one or more electromagnets or permanent magnets positioned to exert controllable forces on magnetically responsive portions of the mounting element, thereby allowing fine adjustments in X, Y, Z, and rotational axes during the active alignment process.

[0203] The alignment jig may further comprise one or more test fiber interfaces configured to hold test fibers in predetermined positions that correspond to the expected locations of optical fibers in the FAU when the final detachable connector is assembled. These test fiber interfaces may comprise precision v-grooves, fiber holders, or ferrules that maintain the test fibers at the correct pitch and orientation to simulate the attachment element and FAU assembly.Page 42 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0204] During the alignment process, optical signals may be transmitted through the test fibers while the magnetic coupling element adjusts the position of the mounting element based on optical feedback measurements, such as optical power measurements, beam alignment measurements, or insertion loss measurements. Once optimal alignment is achieved, the alignment jig may be configured to maintain the position of the mounting element while a bonding agent (e.g., epoxy, adhesive, or solder) is applied between the mounting element and the PIC or substrate. The jig may maintain this fixed position during curing or solidification of the bonding agent to ensure that the aligned position is preserved. After bonding is complete, the magnetic coupling may be deactivated or the jig may be otherwise disengaged to release the mounting element, leaving the mounting element permanently bonded to the PIC in the precisely aligned position. In some examples, the alignment jig may be reusable and configured to sequentially align multiple mounting elements on the same PIC or on different PICs in a manufacturing process.

[0205] In Block 940, the FAU 610 may be aligned with respect to the attachment element 510. For example, in some examples, the attachment element 510 may be mounted on an optical engine configured to mimic components of the electronic module 6300. Then, the FAU 610 may be aligned to the attachment element 510 using one or more test fibers. The optical engine may be configured to obtain at least one optical feedback measurement via the one or more test fibers, and the feedback measurement may inform further movement of the FAU 610 with respect to the attachment element 510. Once the FAU 610 is aligned such that the one or more test fibers are sufficiently precisely aligned with the optical engine, the method may continue to Block 950.

[0206] In Block 950, the attachment element may be coupled to the FAU via the bonding surface of the attachment element, as described above with respect to Figure 6C. In some examples, a plurality of attachment elements 510 may be coupled to a plurality of FAUs 610 to form a group of connectors.

[0207] In some examples the method 900 may include additional steps, such as any single step or any combination of steps described herein. Although Figure 7A shows example blocks of the method 900, in some examples, the method 900 may include additional blocks, fewer blocks, different blocks, or differently arranged blocks than those depicted in Figure 7A.Page 43 of 80ATTY DKT. NO. 048833-000255 14386240v 1Additionally, or alternatively, two or more of the blocks of method 900 may be performed in parallel.Example Method of Detachably Coupling an Electronic Module to an FAU

[0208] Figure 7B is a flowchart illustrating a method 901 of detachably coupling an FAU 610 to an electronic module 6300, in accordance with an example of the present disclosure. In some examples, the method may begin at Block 960, where the at least one first rough alignment element of the mounting element may be positioned within the at least one second rough alignment element (e.g., a rough alignment cavity) of the attachment element. In some examples, Block 960 may comprise positioning at least one first rough alignment element of the attachment element within at least one second rough alignment element (e.g., a rough alignment cavity) of the mounting element. At Block 970, the plurality of first fine alignment elements (e.g., spheres) of the mounting element may be positioned within the plurality of second fine alignment elements (e.g., grooves) of the attachment element. In some examples, however, a plurality of first fine alignment elements (e.g., spheres) of the attachment element may be positioned within a plurality of second fine alignment elements (e.g., grooves) of the mounting element. In some examples, the steps of Blocks 960 and 970 may be performed simultaneously (e.g., by positioning the attachment element on top of the mounting element such that all corresponding components align with one another). Furthermore, in some examples, the steps of Blocks 950 and 960 may be performed simultaneously with respect to each connector 600 and corresponding mounting element 322 of the group of connectors and the group of mounting elements. Furthermore, in some examples, an initial alignment of the group of connectors with respect to the group of mounting elements may be achieved via an assembly rig configured to maintain the group of connectors 800 within a predetermined position during manufacturing, shipping, etc.

[0209] Once the attachment element and the mounting element are aligned and engaged, a vertical force may be applied to the attachment element at Block 980 via a force application mechanism such that the plurality of first fine alignment elements engages with the plurality of second fine alignment elements. In some examples, engaging the force application mechanism comprises applying a vertical downward force to the push plate positioned at the top of the attachment element, such that a net downward force is applied to an area within a triangle formed by the plurality of second fine alignment elements, as described above with respect to Page 44 of 80ATTY DKT. NO. 048833-000255 14386240v 1Figures 4A and 4B. In the attached state, the kinematic interface of the attachment element may be engaged with the corresponding kinematic interface of the mounting element such that optical signals are able to propagate between the fibers of the FAU and a corresponding PIC of the electronic module.

[0210] In some examples the method 901 may include additional steps, such as any single step or any combination of steps described herein. Although Figure 7B shows example blocks of the method 901, in some examples, the method 901 may include additional blocks, fewer blocks, different blocks, or differently arranged blocks than those depicted in Figure 7B.Additionally, or alternatively, two or more of the blocks of method 901 may be performed in parallel.Example Detachable Connector with Polarization-selective optical element

[0211] In some examples, the detachable connector may couple optical signals into two output waveguides. Because the two waveguides may exhibit different polarization-dependent loss (PDL) or polarization-dependent coupling efficiency, one polarization state may couple preferentially into one waveguide, while the orthogonal polarization couples preferentially into the other. This imbalance results in unequal power distribution (e.g., a power asymmetry) between the two outputs, which may result in degradation of system performance and, at high power, may result in damage to the PIC. Each rotation tolerance may add more power to the perpendicular axis.

[0212] To solve this problem, the detachable connector may integrate a linear polarizer to improve polarization control. The polarizer may be integrated into polarization-maintaining (PM) channels of the optical connectors to ensure correct polarization orientation into photonic integrated circuits (PICs), improving performance and reducing damage risks caused by fiber clocking tolerances. The polarizer may be configured to eliminate power in the orthogonal polarization, thereby ensuring an equal distribution of power between the two waveguides and preventing damage to the PIC. Specifically, the electric field vector (E) of the optical signals may comprise orthogonal components (Es) and parallel components (Ep). Assuming that = ^Cp~ = 1, where C refers to a power coefficient, it is desirable that the power output at the left waveguide (PL) is approximately equal to the power output at the right waveguide (PR), such that PL= \ES+ Ep\2= \ES— EP\2. The components Es and Ep may be derived from a Page 45 of 80ATTY DKT. NO. 048833-000255 14386240v 1known angle shift (0) such that Es= a0■ sin (0) and EP= a0■ cos (0). By using a polarizer to eliminate the orthogonal components Es, the system may achieve an even power distribution between the output channels. The goal is to ensure an approximately 50 / 50 split by the 2DGC coupling even if input beam polarization is not perfect due to tolerances.

[0213] Figures 8A-8D illustrate a detachable optical connector 600, in accordance with examples. Specifically, Figure 8C illustrates a detailed view of a connection portion 801 of the detachable optical connector 600 (shown in Figure 8B). With reference to Figures 8A-8C, the detachable optical connector 600 may comprise a laser interface device (LID) 810, a planar microlens array (PMLA) 820, and an FAU 610 configured to operate as an integrated optical pathway that converts electrical signals to optical signals with low transmission loss. The detachable optical connector 600 may further comprise a strain relief harness 601 as described with respect to Figures 6A-6B. The LID 810 may comprise an array of laser diodes or the like (e.g., vertical-cavity surface-emitting lasers) configured to serve as an active light source for one or more transmit channels. The LID 810 may further comprise one or more photodiodes configured to operate as receive channels. The PMLA 820 may comprise one or more microlenses and may be positioned adjacent to one or more fibers of the FAU 610 in order to collimate (e.g., focus) an optical signal from each of the one or more fibers into a specific optical aperture of the PIC 6318 (shown in Figure 6E).

[0214] The FAU 610 may be configured to provide a mechanical interface between the collimated beams and the terminating ends of the one or more fibers. During assembly, the alignment of the PMLA 820, FAU 610, and LID 810 may be adjusted in real time until maximum optical coupling efficiency is achieved across all channels. Once aligned, the components may be locked in place (e.g., using high-stability epoxies, solder bonding, and / or the like) to ensure mechanical robustness under thermal cycling and vibration. In operation, this arrangement minimizes insertion loss, reduces back reflection, and provides stable multichannel coupling between integrated photonic devices and fiber arrays, enabling high data rates and low error performance in an optical communication system.

[0215] Any description herein of a polarizer may apply to any polarization-selective optical element, and vice versa. Any description herein of a polarizer may apply to a polarization coating disposed on an optical surface, and vice versa. This may include a polarization plate or any other element that may have any other shape or form factor. Any description herein of a Page 46 of 80ATTY DKT. NO. 048833-000255 14386240v 1polarization plate may apply to any type of polarizer having any shape or form factor. A polarization plate may refer to a plate with a substantially planar structure, and any description herein of a polarization plate may be applied to any type of polarizer, such as a polarization-selective optical element, which need not have a planar shape, and vice versa. Any description herein of a polarizer or polarization plate may also apply to any type of polarization coating disposed on an optical surface.

[0216] In some examples, as illustrated in Figure 8D, the detachable optical connector may include a polarization-selective optical element 840 (e.g., a polarization beam splitter plate or the like). In some examples, the polarization-selective optical element 840 may be attached or detached to the detachable optical connector. Furthermore, in some examples, the polarization-selective optical element 840 may comprise one or more anti-reflective (AR) coated facets when coupled with other components providing partially-reflective (PR) facets, such as an external cavity mirror, a laser, or the like. The polarization-selective optical element 840 may be positioned adjacent to the PMLA 820 to control the polarization state of the transmitted light. For example, in some examples, the polarization-selective optical element may be configured to align all optical channels to a common polarization axis or to separate orthogonal polarizations for polarization-division multiplexing. In some examples, the polarization-selective optical element 840 is configured to ensure that optical signals from the LID 810 maintain a desired polarization orientation as they pass into the fibers of the FAU 610, thereby improving coupling efficiency in systems where the downstream photonic circuitry is polarization-sensitive. Additionally or alternatively, the polarization-selective optical element 840 may be used to split incoming optical signals into one or more distinct polarization channels, each directed toward separate detectors of the PIC 6318, thereby increasing the channel capacity without increasing fiber count. The polarization-selective optical element 840 may be precisely aligned with respect to the PMLA 820 and may be bonded in a fixed orientation (e.g., via glue, epoxy, or the like).

[0217] In some examples, as illustrated in Figures 8D-8E, only a subset of the fibers within the FAU are polarization-maintaining (PM) fibers 611, while the remaining channels may use standard single-mode fibers 612 that are not polarization sensitive. The standard single-mode fibers may provide transmit (Tx) or receive (Rx) channels or any combination thereof. This mixed configuration between PM fibers 611 and single-mode fibers 612 may provide for an Page 47 of 80ATTY DKT. NO. 048833-000255 14386240v 1optical communication system wherein certain wavelengths and / or signal paths carry polarization-encoded data (e.g., feed polarization-sensitive photonic integrated circuits), while other channels operate with conventional intensity-modulated signals.

[0218] In such examples, as illustrated in Figure 8F, the polarization-selective optical element 840 may comprise a polarization portion 842 selectively aligned to the subset of PM fibers 611 to ensure that their input polarization is properly oriented according to a predetermined configuration, thereby preserving the polarization extinction ratio (PER) of the optical signals passing therethrough. The polarization-selective optical element 840 may further comprise a non-polarizing portion 844 aligned with the single-mode fibers 612, which enables the single-mode fibers 612 to transmit light directly through the polarization-selective optical element 840 without polarization alignment. Thus, the polarization-selective optical element 840 may cover the full PMLA 820 for mechanical simplicity and ease of coupling to a corresponding PIC, but functionally, only those channels coupled into PM fibers 611 (e.g., channels overlaid by the polarization portion 842) experience polarization.

[0219] Accordingly, the detachable optical connector of Figures 8A-8D may comprise an FAU comprising a plurality of optical fibers arranged at a predetermined pitch, wherein at least one of the optical fibers comprises a PM fiber and at least one of the optical fibers comprises a single-mode fiber. The detachable optical connector may further comprise a polarization-selective optical element (e.g., the polarization-selective optical element illustrated in Figure 8F), the polarization-selective optical element comprising a first portion configured to align a polarization state of a first optical signal with a polarization axis of the PM fiber and a second portion configured to allow a second optical signal to pass therethrough without polarization alignment. Additionally or alternatively, the detachable optical connector of Figures 8A-8D may comprise an FAU comprising an array of optical fibers, wherein a first subset of the array comprises at least one PM fiber and wherein a second subset of the array comprises at least one single-mode fiber. The detachable optical connector may further include a polarization-selective optical element (e.g., the polarization-selective optical element illustrated in Figure 8F) positioned in an optical path of the array of the optical fibers, wherein the polarization-selective optical element comprises a polarizing portion arranged in an optical path of the at least one PM fiber and a non-polarizing portion arranged in an optical path of the at least one single-mode fiber.Page 48 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0220] Figure 8F shows a polarization-selective optical element 840 with a polarization portion 842 and one or more non-polarization portions 844. In some examples, the polarization portion may be provided between two or more non-polarization portions. In some examples, the polarization portion may extend longitudinally along a polarization-selective optical element. The polarization portion may extend as a strip or rectangular portion along a central longitudinal portion of the polarization-selective optical element. The polarization portion may allow for high transmission. The polarization portion may be a linear polarizer. The non-polarization portions may include an anti-reflective coating (ARC). A polarization-selective optical element may have any dimensions. In some examples, the polarization-selective optical element may include a length of at least 2 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 12 mm, 15 mm, or 20 mm. The polarization-selective optical element may have a length less than any of the dimensions provided or falling within a range between any two of the dimensions provided. Similarly, the polarization-selective optical element may have a width of at least 1 mm, 2 mm, 3 mm, 3.5 mm, 4 mm, 4.1 mm, 4.2 mm, 4.5 mm, 5 mm, 6 mm, 7 mm, 8 mm, or 10 mm.

[0221] The polarization-selective optical element may have a width greater than any of the dimensions provided or falling within a range between any two of the dimensions provided. In some examples, a clear aperture width may be provided along a width of the polarization-selective optical element. The clear aperture width may be centered along a central longitudinal axis of the polarization-selective optical element. The clear aperture width may be at least 0.5 mm, 1 mm, 2 mm, 3 mm, 3.3 mm, 3.5 mm, 3.7 mm, 4 mm, 4.5 mm, 5 mm, 6 mm, 7 mm, or 8 mm. The clear aperture width may be greater than any of the values provided or fall within a range between any two of the values provided. A clear aperture length may be provided along a length of the polarization-selective optical element. The clear aperture length may be provided at an end of the polarization-selective optical element or within a central region of the polarization-selective optical element. The clear aperture length may be at least 0.1 mm, 0.3 mm, 0.5 mm, 1 mm, 1.3 mm, 1.5 mm, 1.7 mm, 2 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, or 5 mm. A clear aperture length may be greater than any of the values provided or within a range between any two of the values provided. The portion of the polarization-selective optical element not included within the clear aperture may increase a mechanical interface. A mechanical interface may have a same width as the polarization-selective optical Page 49 of 80ATTY DKT. NO. 048833-000255 14386240v 1element. The mechanical interface may have a length that may be a length of the polarization-selective optical element less a clear aperture length.

[0222] Figure 8G shows a polarization-selective optical element 840 with a polarization portion 842 and non-polarization portions 844. A polarization maintaining (PM) fiber 845 is illustrated. The PM fiber orientation relative to the polarization portion 842 is illustrated. A polarization figure may be oriented along a height dimension of the polarization-selective optical element, which may be perpendicular to a length and / or width of the polarization-selective optical element. A plurality of PM fibers may be provided and oriented along the height dimension of the polarization-selective optical element. In some examples, a portion or all of the polarization portion may include PM fibers with orientations as provided. In some examples only a clear aperture area or a mechanical interface area, or both may have PM fibers with orientations as provided. A transverse electric (TE) polarization orientation 846 may be provided as illustrated. In some examples, the TE polarization orientation may be parallel to a width of the polarization-selective optical element.

[0223] A polarization portion may have any desired characteristics. In some examples, the polarization portion may be uncoated. The polarization portion may include a polymer film on a tri-acetate cellulose (TAC). The polarizer may allow for a range of wavelengths, which may include 415-1600 nm. In some examples, the surface quality may be 80-50. A polarization portion may have any other values or characteristics.

[0224] In some examples, the PM fibers may be oriented horizontally (e.g., with a pair of stress rods oriented horizontally). In some examples, the PM fibers may be oriented vertically (e.g., with the pair of stress rods oriented vertically). In some examples, the rotational alignment of these fibers may be clocked. In some examples, at least a 3 degree tolerance, or 5 degree tolerance may be provided. When the PM fibers are rotated, the polarization states may split across X and Y axes. The polarization-selective optical element may eliminate any unwanted polarization component on an axis. The polarization-selective optical element may ensure that a single polarization state remains.

[0225] In some examples, a polarizer or polarization portion may be applied to all channels without necessarily being limited to misaligned channels. This may allow for uniform optical characteristics across the channels.Page 50 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0226] Figure 8H illustrates a polarization-selective optical element 840 that may be attached to any connector 850 or photonic integrated circuit (PIC). The polarization-selective optical element may be actively aligned relative to polarization facets or fibers. In some examples, the positioning of the polarization-selective optical element may be adjusted while active optical signals are being provided to create a desired alignment.

[0227] A polarization-selective optical element may include a linear polarizer. The polarizer may allow for wavelength transmission in any range from 415-1600 nm. In some examples, the wavelength transmission may allow for wavelengths at about 500 ± 5 nm, 600 ± 5 nm, 700 ± 5 nm, 800 ± 5 nm, 900 ± 5 nm, 1000 ± 5 nm, 1100 ± 5 nm, 1200 ± 5 nm, 1300 ± 5 nm, 1310 ± 5 nm, 1320 ± 5 nm, 1400 ± 5 nm, 1500 ± 5 nm, or 1600 ± 5 nm. A polarizer transmission may be at least 80%, 90%, 93%, 95%, 95.5%, 96%, 97%, 98%, or 99%. A plate transmission may be at least 95%, 97%, 98%, 99%, 99.5%, or 99.9%. An optical operational power may be at least 200 mW, 250 mW, 300 mW, 350 mW, 400 mW, 450 mW, 500 mW, or 600 mW. An intensity may be at least 100 W / mm2, 150 W / mm2, 180 W / mm2, 200 W / mm2, 250 W / mm2, or 300 W / mm2. The configurations provided may allow for an angular alignment of the polarizer to be within ± 0.1 degrees, ± 0.5 degrees, ± 1 degree, ± 3 degrees relative to a nominal axis. An ARC reflection may be less than 0.1%, 0.3%, 0.5%, 1%, 2%, or 3%. An angle of incidence may fall in a range between any two of the following values: 3 degrees, 5 degrees, 7 degrees, 10 degrees, 11 degrees, 12 degrees, 13 degrees, 14 degrees, 15 degrees, 17 degrees, or 20 degrees. In some examples, an optical return loss for the system may be expected to be less than 20 dB, 30 dB, 40 dB, 45 dB, 50 dB, 55 dB, 60 dB, or 70 dB. The optical return loss may be greater than any of the values provided or fall within a range between any two of the values provided.Example Network Architecture

[0228] Datacenters and other networking systems may include connections between datacenters, switch systems, servers, racks, and devices in order to provide for signal transmission between one or more of these elements. These connections may be made using cables, transceivers, interconnects, interposers, and connector assemblies. For high bandwidth applications and / or connections over long distances, high powered optical communications may be preferred to ensure signal transmission integrity.Page 51 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0229] Figure 9 illustrates an example network architecture 10, in accordance with an example of the disclosure. As shown in Figure 9, the network architecture 10 may include a datacenter 12, a communication network 14, and network device(s) 16. It is to be understood that the network architecture 10 may depict the general computing architecture within which more specific systems and / or subsystems may function. The network architecture 10 may provide a broad, abstract representation of the overall infrastructure, allowing for the inclusion of various configurations and implementations of the individual components without limiting the scope of the disclosure.

[0230] The datacenter 12 may be a centralized facility designed to house computing resources and related components. The primary function of the datacenter 12 may be to support the infrastructure required for advanced computational tasks, for efficient, secure, and reliable operations. The datacenter 12 may include building and structural components, including power supplies, cooling systems, fire suppression systems, and physical security measures that are configured to maintain optimal operating conditions and protect the equipment from environmental hazards and unauthorized access. At its core, the datacenter 12 may include high-performance servers or compute nodes, often arranged in racks, and connected through high-speed networks, as described in more detail in Figure 10. These servers may include processors (e.g., central processing units (CPUs), graphics processing units (GPUs), a data processing unit (DPU), a quantum processing unit (QPU) or a physics processing unit (PPU) and / or the like), memory (e.g., RAM), and storage solutions (e.g., hard disk drives (HDDs), solid state drives (SSDs), and / or the like). QPUs may be configured to perform one or more operations associated with a quantum algorithm. In some examples, each of the one or more QPUs may include a plurality of qubits and the one or more QPUs may be in communication with each other via a quantum channel. Additionally, or alternatively, each of the plurality of qubits may include local qubits, global qubits, and / or synchronization qubits. In some examples, the local qubits of each QPU may be configured to perform the one or more operations associated with the quantum algorithm on the QPU that the local qubits are associated with. The hardware configuration may be optimized for parallel processing and high throughput, catering to the demands of high-performance computing (HPC) applications.

[0231] The datacenter 12 may include high-speed network equipment, such as network switches, routers, firewalls, and / or the like to facilitate fast and secure data transmission within Page 52 of 80ATTY DKT. NO. 048833-000255 14386240v 1the datacenter 12 (e.g., between the servers or compute nodes) and between external networks. The datacenter 12 may facilitate communication between servers or compute nodes through a network topology that ensures efficient data exchange, minimizes latency, and maximizes bandwidth. The network topology may dictate how various network devices, such as switches and routers, are interconnected for data flow. By implementing an effective network topology, the datacenter 12 can support high-performance computing tasks. Examples of various network topologies may include hierarchical networking topologies such as the fat tree topology, Slim Fly topology, Dragonfly topology, and / or the like.

[0232] The communication network 14 may operatively couple the datacenter 12 to network device(s) 16 and other external devices for data exchange and connectivity. Examples of a communication network 14 may include an Internet Protocol (IP) network, an Ethernet network, an InfiniBand (IB) network, a Fibre Channel network, the Internet, a cellular communication network, a wireless communication network, combinations thereof (e.g., Fibre Channel over Ethernet), variants thereof, and / or the like. Each type of network offers specific advantages tailored to different operational requirements. For instance, an IP network or Ethernet network may provide widespread compatibility and ease of integration, supporting various protocols and applications across the datacenter 12 and the network device(s) 16 (and / or external devices). An InfiniBand network may offer high throughput and low latency, ideal for HPC environments where rapid data transfer and minimal delay are required. Fibre Channel networks may be employed for their robust performance in storage area networks (SANs), ensuring fast and reliable access to storage resources. Cellular and wireless communication networks may be used to extend connectivity to remote and / or mobile devices for increased flexibility and / or accessibility. The ability of the communication network 14 to incorporate multiple network types and / or configurations allows the datacenter 12 to adapt to diverse application needs, from general data communication to specialized HPC tasks.

[0233] The network device(s) 16 may include a variety of computing devices capable of transmitting and receiving signals over the communication network 14. The network device(s) 16 may range from personal computing devices to complex server configurations. Examples include Personal Computers (PCs), laptops, tablets, smartphones, servers, and / or the like. The network device(s) 16 may facilitate user interactions with the datacenter 12, allowing for data input, retrieval, and / or processing from remote locations. In addition to individual Page 53 of 80ATTY DKT. NO. 048833-000255 14386240v 1computing devices, the network device(s) 16 may also include collections of servers and / or additional datacenters. For instance, these could be other datacenters similar to or the same as datacenter 12. Such an interconnection may allow for the formation of a distributed computing environment for improved redundancy, load balancing, and / or disaster recovery capabilities. By linking multiple datacenters, the network architecture 10 can leverage geographically dispersed resources, optimizing performance and / or ensuring high availability.

[0234] As described herein, the datacenter 12 and / or the network device(s) 16 may include storage devices and processing circuitry for executing computing tasks, such as controlling the flow of data internally and over the communication network 14. The processing circuitry may include software, hardware, or a combination thereof. For example, the processing circuitry may include a memory containing executable instructions and a processor (e.g., a microprocessor) that executes these instructions. The memory may correspond to any suitable type of memory device or collection of memory devices configured to store instructions. Non-limiting examples of suitable memory devices include Flash memory, Random Access Memory (RAM), Read Only Memory (ROM), variants thereof, combinations thereof, or similar technologies. In specific examples, the memory and processor may be integrated into a common device, such as a microprocessor with integrated memory. Additionally, or alternatively, the processing circuitry may comprise hardware components, such as an application-specific integrated circuit (ASIC). Other non-limiting examples of processing circuitry include Integrated Circuit (IC) chips, CPUs, GPUs, DPUs, QPUs, PPUs, microprocessors, Field-Programmable Gate Arrays (FPGAs), collections of logic gates or transistors, resistors, capacitors, inductors, and / or diodes. Some or all of the processing circuitry may be provided on a Printed Circuit Board (PCB) or a collection of PCBs. It should be appreciated that any appropriate type of electrical component or collection of electrical components may be suitable for inclusion in the processing circuitry.

[0235] In addition, although not explicitly shown, it should be appreciated that the datacenter 12 and network device(s) 16 may include one or more communication interfaces for facilitating wired and / or wireless communication between one another and other unillustrated elements of the network architecture 10. These communication interfaces may include a variety of technologies, including but not limited to Ethernet ports, fiber optic connections, Wi-Fi® transceivers, Bluetooth® modules, and cellular communication modules forPage 54 of 80ATTY DKT. NO. 048833-000255 14386240v 1integration and interoperability among the various components within the network architecture 10.

[0236] Furthermore, it should be understood that the network architecture 10 may include additional components and functionalities within the scope of the present disclosure. In some examples, the precise alignment that is formed at optical connections, such as the submicron alignment provided herein, may be incorporated within the networking architecture. The precise alignment may help meet the low-latency requirements of Al training fabrics, or any other functionalities provided by the network architecture. These components may comprise, without limitation, additional processing units, specialized accelerators (such as Tensor Processing Units or TPUs), enhanced security modules, and / or redundant power supplies. The inclusion of these elements is intended to ensure that the network architecture 10 is robust, scalable, and capable of meeting diverse operational requirements. Any variations, modifications, or adaptations of the described elements that fall within the spirit and scope of the disclosure are considered to be encompassed by the present disclosure. This includes any combinations, sub-combinations, or enhancements of the various described elements to achieve improved performance, reliability, and efficiency in the network architecture 10.Example Network Topology of the Network Architecture

[0237] Figure 10 illustrates an example datacenter network topology 20, in accordance with an example of the disclosure. As shown in Figure 10, the example datacenter network topology 20 is exemplified using a fat tree topology. However, it is to be understood that the fat tree topology merely serves as a representative model to describe the datacenter network architecture. Other network topologies may also be contemplated within the scope of the disclosure. Examples of such alternative topologies include, but are not limited to, Slim Fly topology, which is designed to reduce the number of hops and cable lengths between nodes; Dragonfly topology, which aims to enhance network scalability and reduce latency through a hierarchical group of interconnected switches; and other hierarchical or non-hierarchical topologies that may be optimized for specific performance, scalability, and / or cost considerations. The principles and innovations disclosed herein can be applied to these and other network topologies to achieve similar advantages and benefits. Any modifications, variations, or adaptations of the network topologies that fall within the spirit and scope of the present disclosure are considered to be encompassed by this disclosure.Page 55 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0238] As shown in Figure 10, the example datacenter network topology 20 may include three distinct layers: an edge layer 22, an aggregation layer 24, and a core layer 26. The edge layer 22, located at the bottom of the hierarchy, may incorporate Top-of-Rack (ToR) switches ELSi, ELS2, ..., ELSn. The edge layer 22 may serve as the initial point of aggregation for traffic originating from the servers operatively coupled to the ToR switches ELSi, ELS2, ..., ELSn in the edge layer 22. Each ToR switch may connect multiple servers within a rack, consolidating data traffic from those servers and forwarding it to the higher layers of the network. The edge layer 22 may be responsible for handling east-west traffic within the datacenter, facilitating efficient data exchange between servers located in different racks.

[0239] The aggregation layer 24 may be positioned above the edge layer 22 and may further consolidate traffic from multiple ToR switches. In one example, the aggregation layer 24 may include switches ALSi, ALS2, ..., ALSo that are configured to receive data traffic from the ToR switches in the edge layer 22. These aggregation switches may aggregate traffic and manage load balancing, ensuring that data flows efficiently between the edge layer 22 and the core layer 26. The aggregation layer 24 may also provide redundancy and fault tolerance, allowing data traffic to be rerouted in case of failures in the network.

[0240] At the top of the hierarchy, the core layer 26 may include high-speed switches CLSi, CLS2, ..., CLSm. The core layer 26 may serve as the backbone of the datacenter network, providing high-speed interconnectivity between the switches of the aggregation layer 24 and ensuring data can traverse the network quickly and efficiently. The core layer 26 may be responsible for managing north-south traffic, enabling communication between the datacenter and external networks or between different datacenters. In some examples, the core layer 26 may support multiple data paths and implement advanced routing protocols to optimize data transmission across long distances or between different geographic locations.

[0241] The datacenter network topology 20 may be configured to support high bandwidth and low-latency communication, enabling efficient handling of large-scale data transfers and computational tasks. By implementing a hierarchical network structure, with the edge layer 22, aggregation layer 24, and core layer 26, the datacenter network topology 20 may facilitate scalable and resilient network performance, accommodating the increasing demands of modern high-performance computing and cloud-based applications. As described herein, various network topologies, such as fat tree, Slim Fly, or Dragonfly topologies, may be Page 56 of 80ATTY DKT. NO. 048833-000255 14386240v 1implemented within this layered structure, depending on the specific requirements of the datacenter infrastructure.

[0242] Furthermore, the interconnections between the layers (e.g., the edge layer 22, aggregation layer 24, and core layer 26) may be established using high-speed networking technologies such as Ethernet®, InfiniBand®, or optical fiber, depending on the required data transfer rates and latency considerations. Each layer in the datacenter network topology 20 may be optimized to handle specific types of traffic and ensure smooth communication across the network, providing flexibility and scalability in various operational scenarios.

[0243] The switches (e.g., CLSi-m, ALSi-o, and ELSi-n) within each layer may be 1U switches, where “1U” refers to the industry-standard size for rack-mounted switches and servers. The switches may be electrical switches, optical switches, hybrid electro-optical switches, or any combination thereof. Each type of switch may include suitable hardware and / or software for routing signals within its respective domain.

[0244] An electrical switch may be configured to receive and route optical signals by first converting them into electrical signals. The conversion process may involve receivers that include components such as a transimpedance amplifier (TIA), a photodetector, and a controller, all of which work together to convert incoming optical signals into electrical signals. Once converted, the electrical signals may be routed through the internal circuitry of the switch. The electrical switch may also include transmitters that convert the routed electrical signals back into optical signals for transmission to another switch (either optical or electrical) within the network. These transmitters may include a light source, a modulator, and a controller to manage the modulator and light source. In some examples, the receiver and transmitter functions may be combined into a single transceiver to streamline signal conversion and transmission.

[0245] An optical switch, by contrast, routes optical signals directly without converting them into electrical form. The optical switch may include optical receivers, such as photodetectors and wavelength-division multiplexing (WDM) demultiplexers, to receive and manage incoming optical signals. These signals may then be routed through internal optical switching components, such as micro-electromechanical systems (MEMS) mirrors, waveguides, or optical cross-connects, which guide the signals to their appropriate outputPage 57 of 80ATTY DKT. NO. 048833-000255 14386240v 1paths. The optical switch may further include optical transmitters, such as laser diodes and modulators, which transmit the routed optical signals to the next switch in the network.

[0246] The interconnections 28 between the switches within the network topology may be implemented using optical fibers and / or traditional electrical cables, depending on the specific requirements of the system. The interconnections 28 may serve as communication lanes, which may be constructed of dedicated differential cable pairs and / or fiber optics, with each option tailored to meet the performance demands of data transmission.

[0247] Dedicated differential cable pairs used in these interconnections may be composed of a variety of cable media, including copper, aluminum, gold, silver, nickel, or composite materials such as copper-clad aluminum, copper-clad steel, or bimetallic conductors. These materials may be selected based on their electrical conductivity and durability, ensuring reliable and efficient data transmission. In some implementations, a four-lane network may be employed, where each lane consists of its own dedicated copper cable, thereby providing isolated physical paths for each communication lane of a deserialized data stream, which helps maintain signal integrity and reduce crosstalk between the lanes.

[0248] Alternatively, fiber optic cables may be employed for the interconnections. Fiber optics are capable of transmitting data streams via different wavelengths of light, with each data stream assigned a unique wavelength. The use of fiber optic cables may allow multiple data streams to be transmitted simultaneously through a single fiber optic cable, significantly increasing the bandwidth and efficiency of the network, and particularly advantageous for long-distance data transmission and for applications requiring high data transfer rates. Various optical networking technologies, such as Time Division Multiplexing (TDM), Frequency Division Multiplexing (FDM), or Wavelength Division Multiplexing (WDM), can be used to transmit multiple optical signals (e.g., data signals or data streams) over a single optical fiber within an optical link with little to no optical signal interference. These optical networking technologies may be used to improve bandwidth efficiency and reduce the amount of infrastructure needed for data communication. In TDM, multiple optical signals can be transmitted over a single optical fiber by assigning each optical signal a respective time slot and transmitting an optical signal during its assigned time slot; in FDM, multiple optical signals can be transmitted over a single optical fiber by assigning each optical signal a respective frequency band; and in WDM, multiple optical signals having different Page 58 of 80ATTY DKT. NO. 048833-000255 14386240v 1wavelengths are combined into a single optical signal and transmitted over a single optical fiber.Example Multichip-Module (MCM Assembly)

[0249] Figure 11 is a block diagram that schematically illustrates a co-packaged networking device 1000, in accordance with an example that is disclosed herein. The different chips that constitute a co-packaged networking device are assembled on a single substrate in what is typically called the MCM assembly 1012. The MCM assembly 1012 can include a switching circuitry 1016 surrounded by peripheral or satellite chips 1020. In some examples, the switching circuitry 1016 and surrounding satellite chips 1020 are all mounted on a common substrate, although such a configuration is not required. The MCM assembly 1012 may be provided in a larger housing of the networking device 1000, positioned behind the front panel 1004. The switching circuitry 1016 may include one or more core digital Application Specific Integrated Circuits (ASICs), CPUs, GPUs, microprocessors, FPGAs, combinations thereof, and the like. The switching circuitry 1016 may include a number of input ports and / or output ports 1028. The Input / Output (I / O) ports 1024 may include electrical ports and / or optical ports. Additionally, the switching circuitry 1016 may include a combination of electrical blocks and optical blocks. The electrical blocks of the switching circuitry 1016 may include a number of electrical switches that are configured to route signals in an electrical domain. The optical blocks of the switching circuitry 1016 may include a number of optical components that are configured to generate, detect and route signals in an optical domain. The MCM assembly 1012, in some examples, may concern or include multiple satellitechips 1020 that are assembled on the same substrate as the switching circuitry 1016. In some examples, a configuration of the optical block(s) and a configuration of the electrical block(s) depend (e.g., is based on) on the number of optical ports in the I / O ports 1024.

[0250] As discussed above, optical I / Os 1008, which may also be referred to as optical connectors, are placed at the front panel 1004. As mentioned above, connectivity between the MCM assembly 1012 and optical I / Os 1008 may be transferred to the front panel 1004 through optical fibers. This connection may be made directly with an optical I / O 1024 of the switching circuitry or may be made with one or more of the satellite chips 1020. The connection is often made with one or more of the satellite chips 1020 because the satellite chips 1020 may include the electro-optic converters and, possibly, the SERDES to natively support the connection. The Page 59 of 80ATTY DKT. NO. 048833-000255 14386240v 1satellite chips 1020 may include one or more of a DSP processor, driver, trans-impedance amplifier, laser, modulator, photodiode, serializer-deserializer, or the like.

[0251] Some examples of the present disclosure are directed to a multi-chip module (MCM) with a centrally positioned main die and a plurality of peripherally positioned MCM sockets configured to mechanically receive and electrically connect mezzanine packages, which may include co-packaged optics (CPO) packages and co-packaged copper (CPC) packages. Each mezzanine package may include a package substrate including a connector portion that is configured to engage the MCM socket and a main portion extending beyond the periphery of the MCM substrate. The main portion of the mezzanine package may be configured to receive optical devices and / or integrated circuits, such as via mezzanine sockets, to allow connections to be made between the optical devices and / or integratedcircuits / RF copper cable connectors and the main die of the MCM. Due to the extension of the mezzanine package beyond the periphery of the MCM substrate, the physical size of the MCM substrate may remain small to reduce cost and avoid the previously discussed production challenges, while allowing connections to a number of optical devices and integrated circuits via the mezzanine packages, which occupy the relatively inexpensive space around the periphery of the MCM substrate. As used herein, the terms “co-packaged optic” (or “CPO”) and “co-packaged copper” (or “CPC”) may refer to an advanced heterogeneous integration of either optics and silicon or copper and silicon, in which either integration may be implemented on a single packaged substrate. The CPO may utilize pluggable optical modules that include an optical engine (OE) to convert optical signals to electrical signals and electrical signals to optical signals. The CPO may further be comprised of an optical component on a photonics die and an electrical component on an electrical die.

[0252] As used herein, a ball grid array (BGA) may be a type of surfacemount packaging used for integrated circuits. BGA packages use an array of metallic conductor balls arranged in a grid to permanently mount devices such as microprocessors on a PCB. The metallic conductor balls may then undergo the reflow process described above, wherein the metallic conductor balls may be preheated, then melted to bond the IC to a substrate to form an IC package.

[0253] As used herein, a flip chip (FC) may refer to a method for interconnecting dies, such as semiconductor devices, IC chips, integrated passive devices, andPage 60 of 80ATTY DKT. NO. 048833-000255 14386240v 1microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto chip pads. The solder bumps may be deposited onto chip pads on the top side of the wafer during final wafer processing. The chip may be mounted to external circuitry (such as a circuit board or another chip or wafer) by “flipping” the chip, such that the chip's top side faces down and is positioned to allow the pads of the chip to align with matching pads on the external circuit. Solder is reflowed to complete the interconnect.

[0254] An integrated photonics device as used herein refers to a device comprising a plurality of photonic components fabricated and co-located on a common substrate to guide, manipulate, generate, or detect optical signals. Integrated photonics devices are designed to perform high-speed, low-latency signal processing or communication tasks with reduced power consumption and improved signal integrity, often serving applications in data communications, telecommunications, sensing, quantum technologies, or biomedical systems.

[0255] The device typically includes waveguides, modulators, couplers, filters, detectors, and one or more integrated light sources, such as lasers, forming a compact, monolithically or heterogeneously integrated photonic circuit. The substrate may be formed from materials suitable for photonic integration, including but not limited to silicon, silicon nitride, indium phosphide, or other compound semiconductors. In some examples, the integrated laser is formed on the same substrate (monolithic integration), while in other examples, the laser is fabricated separately and bonded or coupled to the photonic circuit (hybrid or heterogeneous integration). The integrated laser may be a distributed feedback (DFB) laser, distributed Bragg reflector (DBR) laser, external cavity laser, or other suitable type depending on the target application.

[0256] The integrated laser provides an on-chip optical source, enabling self-contained optical transmission, modulation, and routing without reliance on external light sources. This allows for reduced system complexity, lower coupling loss, and improved scalability in densely packed photonic systems.

[0257] An integrated photonics device may further include electrical drivers and control circuitry co-packaged with the photonic components, forming a photonic-electronic integrated system. The design supports high-speed, low-power optical communication and signal processing across a range of applications, including data center interconnects, high-performance computing, telecommunications, optical sensing, and integrated LiDAR systems.Page 61 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0258] Packaging and coupling interfaces may be provided to facilitate optical I / O to and from the chip, such as edge couplers, grating couplers, or fiber array terminations. Thermal management structures may also be included to maintain performance stability of the integrated laser and surrounding photonic components. In certain examples, the photonic device may interface with electrical components, either on the same chip or through an adjacent electronic integrated circuit (EIC), to form a photonic-electronic co-integrated system. Packaging considerations may include fiber coupling interfaces, thermal management structures, and alignment features to ensure stable operation.Example Method for Providing Optical Communication via a Silicon Photonic Collimator

[0259] Figure 12A is a flowchart illustrating an example method 1400 A for providing optical communications via a silicon photonics collimator in accordance with one or more examples of the present disclosure. It will be understood that each block of the flowcharts, and combinations of blocks in the flowcharts, may be implemented by various means. In some example examples, certain ones of the operations herein may be modified or further amplified as described below. Moreover, in some examples additional optional operations may also be included. It should be appreciated that each of the modifications, optional additions, or amplifications described herein may be included with the operations herein either alone or in combination with any others among the features described herein. The operations illustrated in Figure 12A may, for example, be performed by an example computing system 1400C (shown in Figure 12C). In certain examples, the computing system 1400C can be embedded in an optical module (e.g., a silicon photonics transceiver module). In some examples, the computing system 1400C is a firmware computing system embedded in an optical module (e.g., a silicon photonics transceiver module). In one or more examples, at operation 1410, the computing system 1400C configures an optical signal for transmission via a set of optical waveguides of a silicon photonics device. In one or more examples, at operation 1420, the computing system 1400C transmits the optical signal via the set of optical waveguides, where a micro-optical passive element mounted on an edge of a cavity etched onto a silicon surface of the silicon photonics device is configured to direct the optical signal from the set of optical waveguides to an external optical element.Page 62 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0260] Figure 12B is a flowchart illustrating an example method 1400B for providing optical communications via a silicon photonics collimator in accordance with one or more examples of the present disclosure. It will be understood that each block of the flowcharts, and combinations of blocks in the flowcharts, may be implemented by various means. In some examples, certain ones of the operations herein may be modified or further amplified as described below. Moreover, in some examples additional optional operations may also be included. It should be appreciated that each of the modifications, optional additions, or amplifications described herein may be included with the operations herein either alone or in combination with any others among the features described herein. The operations illustrated in Figure 12B may, for example, be performed by an example computing system 1400C (shown in Figure 12C). In certain examples, the computing system 1400C can be embedded in an optical module (e.g., a silicon photonics transceiver module). In some examples, the computing system 1400C is a firmware computing system embedded in an optical module (e.g., a silicon photonics transceiver module). In one or more examples, at operation 1430, the computing system 1400C receives an optical signal associated with an external optical element, where a micro-optical passive element mounted on an edge of a cavity etched onto a silicon surface of a silicon photonics device is configured to direct the optical signal onto a set of optical waveguides of the silicon photonics device. In one or more examples, at operation 1440, the computing system 1400C processes the optical signal provided via the set of optical waveguides.

[0261] Figure 12C illustrates the computing system 1400C that may be embedded in an optical module (e.g., a silicon photonics transceiver module). In some cases, the computing system 1400C may be a firmware computing system communicatively coupled with, and configured to control, one or more circuit modules associated with an optical module (e.g., a silicon photonics transceiver module). For example, the computing system 1400C may be a firmware computing system and / or a controller computing system communicatively coupled with one or more circuit modules, such as an optical module (e.g., a silicon photonics transceiver module). The computing system 1400C may include or otherwise be in communication with a processor 1450, a memory circuitry 1460, and communication circuitry 1470. In some examples, the processor 1450 (which may include multiple or coprocessors or any other processing circuitry associated with the processor) may be inPage 63 of 80ATTY DKT. NO. 048833-000255 14386240v 1communication with the memory circuitry 1460. The memory circuitry 1460 may comprise non-transitory memory circuitry and may include one or more volatile and / or non-volatile memories. In some examples, the memory circuitry 1460 may be an electronic storage device (e.g., a computer readable storage medium) configured to store data that may be retrievable by the processor 1450. In some examples, the data stored in the memory circuitry 1460 may include classical communication protocol data and / or quantum communication protocol data, or the like for enabling the apparatus to carry out various functions or methods in accordance with examples of the present disclosure, described herein.

[0262] In some examples, the processor 1450 may be embodied in a number of different ways. For example, the processor may be embodied as one or more of various hardware processing means such as a microprocessor, a coprocessor, a digital signal processor (DSP), a controller, or a processing element with or without an accompanying DSP. The processor 1450 may also be embodied in various other processing circuitry including integrated circuits such as, for example, an FPGA (field programmable gate array), a microcontroller unit (MCU), an ASIC (application specific integrated circuit), a hardware accelerator, or a special-purpose electronic chip. Furthermore, in some examples, the processor may include one or more processing cores configured to perform independently. A multi-core processor may enable multiprocessing within a single physical package. Additionally or alternatively, the processor may include one or more processors configured in tandem via the bus to enable independent execution of instructions, pipelining, and / or multithreading. In some examples, the processor 1450 is a microprocessor.

[0263] In some examples, the processor 1450 may be configured to execute instructions, such as computer program code or instructions, stored in the memory circuitry 1460 or otherwise accessible to the processor 1450. Alternatively or additionally, the processor 1450 may be configured to execute hard-coded functionality. As such, whether configured by hardware or software instructions, or by a combination thereof, the processor 1450 may represent a computing entity (e.g., physically embodied in circuitry) configured to perform operations according to an example of the present disclosure described herein. For example, when the processor 1450 is embodied as an ASIC, FPGA, or similar, the processor may be configured as hardware for conducting the operations of an example of the disclosure. Alternatively, when the processor 1450 is embodied to execute software or Page 64 of 80ATTY DKT. NO. 048833-000255 14386240v 1computer program instructions, the instructions may specifically configure the processor 1450 to perform the algorithms and / or operations described herein when the instructions are executed. However, in some cases, the processor 1450 may be a processor of a device (e.g., a mobile terminal, a fixed computing device, a semiconductor fabrication device, a robot device, etc.) specifically configured to employ an example of the present disclosure by further configuration of the processor using instructions for performing the algorithms and / or operations described herein. The processor 1450 may further include a clock, an arithmetic logic unit (ALU) and logic gates configured to support operation of the processor 1450, among other things.

[0264] The computing system 1400C may optionally also include the communication circuitry 1470. The communication circuitry may be any means embodied in either hardware or a combination of hardware and software that is configured to receive and / or transmit data from / to a network and / or any other device or module in communication with the computing system 1400C. In this regard, the communication interface may include, for example, supporting hardware and / or software for enabling communications. As such, for example, the communication circuitry 1470 may include a communication modem and / or other hardware / software for supporting communication via cable, universal serial bus (USB), integrated circuit receiver, or other mechanisms.Example Optoelectronic Component

[0265] With reference to Figures 13A and 13B, a cross-sectional view and a top plan view, respectively, of an optoelectronic component 100 are illustrated. In some examples, the optoelectronic component 100 may include a substrate 102. The substrate 102, for example, may be a printed circuit board, a metal carrier, an organic carrier, and / or a ceramic carrier. In some examples, the height of the substrate 102 may vary. In this regard, for example, a first portion 102 A of the substrate 102 may have a height hl and a second portion 102B of the substrate 102 may have a height h2. In some examples, an electronic integratedcircuit 104 may be supported by the substrate 102. The electronic integrated circuit 104 may be any type of electronic integrated circuit. For example, the electronic integrated circuit 104 may be a digital signal processor, a modulator driver, and / or a transimpedance amplifier. In some examples, there may be more than one electronic integrated circuit supported by thePage 65 of 80ATTY DKT. NO. 048833-000255 14386240v 1substrate 102. In some examples, the electronic integrated circuit 104 may have a height h3. In some examples, the optoelectronic component 100 may support more than one electronic integrated circuit. In some examples, a photonic integrated circuit 106 may be supported by the substrate 102. The photonic integrated circuit 106 may be any type of photonic integrated circuit. For example, the photonic integrated circuit 106 may be an electro-optic modulator, a photodiode, a transmitter optical sub assembly and / or a receiver optical sub assembly. In some examples, the photonic integrated circuit 106 may comprise graphene. In some examples, there may be more than one photonic integrated circuit supported by the substrate 102. In some examples, the photonic integrated circuit 106 may have a height h4. In some examples, the heights hl, h2, h3, and h4 may be different. For example, depending on the electronic integrated circuit and photonic integrated circuit used, the height h3 may be greater than the height h4, or vice versa.

[0266] In some examples, the optoelectronic component 100 may include one or more optical fibers 118 connected to the photonic integrated circuit 106. The one or more optical fibers 118 may be configured to connect the optoelectronic component 100 to other optical components and / or devices. In some examples, a port 116 may be connected to the substrate 102. The port 116 may be configured to connect the optoelectronic component 100 to other electronic components and / or devices. In some examples, the optoelectronic component 100 may be configured to operate at speeds greater than 25 Gb / s.

[0267] The optoelectronic component 100 may include a plurality of substrate interconnect connectors 110 disposed on the substrate 102, a plurality of electronic integrated circuit interconnect connectors 112 disposed on the electronic integrated circuit 104, and a plurality of photonic integrated circuit interconnect connectors 114 disposed on the photonic integrated circuit 106. The plurality of substrate interconnect connectors 110, the plurality of electronic integrated circuit interconnect connectors 112, and the plurality of photonic integrated circuit interconnect connectors 114 may comprise any conductive material (e.g., conductive glue and / or solder). In some examples, the plurality of substrate interconnect connectors 110, the plurality of electronic integrated circuit interconnect connectors 112, and the plurality of photonic integrated circuit interconnect connectors 114 may be flexible. In other words, in some examples, the plurality of substrate interconnect connectors 110, the plurality of electronic integrated circuit interconnect connectors 112, and the plurality Page 66 of 80ATTY DKT. NO. 048833-000255 14386240v 1of photonic integrated circuit interconnect connectors 114 may be manipulated such that each may be capable of taking various shapes. In some examples, the plurality of substrate interconnect connectors 110 may have a pitch pl, the plurality of electronic integrated circuit interconnect connectors 112 may have a pitch p2, and the plurality of photonic integrated circuit interconnect connectors 114 may have a pitch p3. The pitch may refer to the distance between each of the plurality of interconnect connectors. In some examples, the pitch pl, pitch p2, pitch p3, may be different. For example, the pitch p2 of the plurality of electronic integrated circuit interconnect connectors 112 may be 1.25 mm while the pitch p3 of the plurality of photonic integrated circuits may be 1.5 mm.

[0268] In some examples, the optoelectronic component 100 may include a first plurality of cable connectors 108. In some examples, each of the first plurality of cable connectors 108 may be connected to and in communication with the substrate 102, the electronic integrated circuit 104, and the photonic integrated circuit 106 via respective interconnect connectors. In other words, the first plurality of cable connectors 108 may be connected to and in communication with the substrate 102 via the plurality of substrate interconnect connectors 110, the electronic integrated circuit 104 via the plurality of electronic integrated circuit interconnect connectors 112, and the photonic integrated circuit 106 via the plurality of photonic integrated circuit interconnect connectors 114. As such, the first plurality of cable connectors 108 may be used to facilitate communication between the substrate 102, the electronic integrated circuit 104, and the photonic integrated circuit 106.

[0269] In some examples, the first plurality of cable connectors 108 may define a first layout. In some examples, the first layout may define the overall connectivity of the optoelectronic component 100. For example, with reference to Figure 13C, the connectivity defined by the first layout in the illustrated example is such that an electronic integrated circuit 304 is connected to a first photonic integrated circuit 306A and a second photonic integrated circuit 306B via cable connectors 308. In some examples, the first plurality of cable connectors 108 may be interchangeable with other pluralities of cable connectors that define different layouts. The different layouts may alter the overall connectivity of the optoelectronic component 100. For example, the first plurality of cable connectors 108 may be interchangeable with a second plurality of cable connectors that define a second layout which modifies the overall connectivity of the optoelectronic component 100. In this way, the Page 67 of 80ATTY DKT. NO. 048833-000255 14386240v 1optoelectronic component 100 may be easily modified to obtain desired capabilities by interchanging cable connectors.

[0270] In some examples, the first plurality of cable connectors 108 may be flexible. This may help ensure that the first plurality of cable connectors 108 may be used with a variety of substrates, electronic integrated circuits, and photonic integrated circuits. For example, the substrate, electronic integrated circuit, and / or photonic integrated circuit may be from different manufacturers, may be a different type of integrated circuit or substrate, and / or may have different capabilities. For example, the substrate 102, electronic integrated circuit 104, and the photonic integrated circuit 106 may have different heights (e.g., height h3 of the electronic integrated circuit 104 may be greater than height h4 of the photonic integrated circuit 106). The flexibility of the first plurality of cable connectors 108 enables the first plurality of cable connectors 108 to bend as needed, such that components of the optoelectroniccomponent 100 with different heights may be accommodated and connections may be made without any modifications to the configuration of the optoelectronic component 100 itself. Additionally, the flexibility of the first plurality of cable connectors 108 may enable the first plurality of cable connectors 108 to be used with a variety of substrates, electronic integrated circuits, and photonic integrated circuits that have interconnect connectors with different pitches. For example, if the pitch p2 of the plurality of electronic integrated circuit interconnect connectors 112 is less than the pitch p3 of the plurality of photonic integrated circuit interconnect connectors 114, the first plurality of cable connectors 108 may bend to account for the differences in pitch and connect the electronic integrated circuit 104 to the photonic integrated circuit 106.

[0271] With reference to Figure 13C a portion of an example optoelectronic component 300 is illustrated. For example, the example optoelectronic component 300 may be part of a 1.6 Tb / s demonstrator. The example optoelectronic component 300 includes a substrate 302, an electronic integrated circuit 304 supported by the substrate 302, afirst photonic integrated circuit 306A supported by the substrate 302, and a second photonic integrated circuit 306B supported by the substrate 302. The example optoelectronic component 300 may include a plurality of electronic integrated circuit interconnect connectors 312 disposed on the electronic integrated circuit 304 and a plurality of photonic integrated circuit interconnect connectors 314 disposed on the first photonic integrated Page 68 of 80ATTY DKT. NO. 048833-000255 14386240v 1circuit 306A and the second photonic integrated circuit 306B. The electronic integrated circuit 304 may be connected to and in communication with the first photonic integrated circuit 306A and the second photonic integrated circuit 306B via a plurality of cable connectors 308. In the example optoelectronic component 300, the electronic integrated circuit 304 and the first photonic integrated circuit 306A are situated on the substrate 302 such that the plurality of electronic integrated circuit interconnect connectors 312 and the plurality of photonic integrated circuit interconnect connectors 314 disposed on the first photonic integrated circuit 306A are not aligned with each other (e.g., one is not disposed directly opposite to the other). In such a situation, the flexibility of the plurality of cable connectors 308 facilitating communication between the electronic integrated circuit 304 and the first photonic integrated circuit 306A may allow the electronic integrated circuit 304 and the first photonic integrated circuit 306A to be connected through manipulation of the cable connectors to accommodate the misaligned locations.

[0272] With reference to Figure 13D, another example optoelectronic component 400 is illustrated. For example, the example optoelectronic component 400 may be part of an octal small form factor pluggable (OSFP) transceiver. The example optoelectroniccomponent 400 includes a substrate 402, an electronic integrated circuit 404 supported by the substrate 402, and a photonic integrated circuit 406 supported by the substrate 402. The example optoelectronic component 400 may include a plurality of electronic integrated circuit interconnect connectors 412 disposed on the electronic integrated circuit 404 and a plurality of photonic integrated circuit interconnect connectors 414 disposed on the photonic integrated circuit 406. The electronic integrated circuit 404 may be connected to and in communication with the photonic integrated circuit 406 via a plurality of cable connectors 408. In the example optoelectronic component 400, the pitch of the plurality of the electronic integrated circuit interconnect connectors 412 and the plurality of photonic integrated circuit interconnect connectors 414 is different. In this case, the flexibility of the plurality of cableconnectors 408 facilitating communication between the electronic integrated circuit 404 and the photonic integrated circuit 406 may be such that the electronic integrated circuit 404 and the photonic integrated circuit 406 can be connected despite the differences in pitch, such as through bending or other reshaping of the cable connectors to accommodate the differences.Page 69 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0273] When the light-transmitting medium is silicon, a suitable insulator includes, but is not limited to, silica and a suitable substrate includes a silicon substrate. A silicon-on-insulator wafer is a suitable platform for an optical device having a silicon light-transmitting medium positioned over a base having a silica insulator and a silicon substrate.

[0274] The device includes one or more waveguides that carry light signals to and / or from optical components. Examples of optical components that can be included on the device include, but are not limited to, one or more components selected from a group consisting of facets through which light signals can enter and / or exit a waveguide, entry / exit ports through which light signals can enter and / or exit a waveguide from above or below the device, multiplexers for combining multiple light signals onto a single waveguide, demultiplexers for separating multiple light signals such that different light signals are received on different waveguides, optical couplers, optical switches, lasers that act as a source of a light signal, amplifiers for amplifying the intensity of a light signal, attenuators for attenuating the intensity of a light signal, modulators for modulating a signal onto a light signal, modulators that convert a light signal to an electrical signal, and vias that provide an optical pathway for a light signal traveling through the device from the bottom side of the device to the top side of the device. Additionally, the device can optionally, include electrical components. For instance, the device can include electrical connections for applying a potential or current to a waveguide and / or for controlling other components on the optical device.

[0275] While certain examples have been described and shown in the accompanying drawings, it is to be understood that such examples are merely illustrative of and not restrictive on the broad disclosure, and that this disclosure is not limited to the specific constructions and arrangements shown and described, since various other changes, combinations, omissions, modifications, and substitutions, in addition to those set forth in the above paragraphs, are possible. Those skilled in the art will appreciate that various adaptations, modifications, and combinations of the just described examples may be configured without departing from the scope and spirit of the disclosure. For example, devices, modules, components, and / or elements shown in the figures are not necessarily drawn to scale and may vary from that shown without departing from the scope and spirit of the disclosure. Therefore, it is to be understood that the disclosure may be practiced other than as specifically described herein.Page 70 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0276] Some examples of the present disclosure include a method of manufacturing a detachable connector for a co-packaged optics (CPO) device, the method comprising aligning a planar body of a mounting element with respect to a photonics integrated circuit (PIC), the mounting element comprising a first kinematic interface, aligning an optical window of the mounting element with respect to the PIC based on receiving feedback from one or more test fibers, bonding the mounting element to the PIC, aligning a fiber array unit (FAU) with respect to an attachment element, the attachment element comprising a second kinematic interface configured for repeated detachment and attachment with substantially identical alignment between the first kinematic interface and the second kinematic interface within a predetermined sub-micron tolerance, and bonding the FAU to the attachment element.

[0277] Some examples of the present disclosure are directed to an attachment element comprising a first kinematic interface, the first kinematic interface comprising at least one rough alignment element and a plurality of fine alignment elements, where the attachment element is configured to be coupled to a fiber array unit (FAU), the first kinematic interface is configured to be detachably coupled to a second kinematic interface of a mounting element, the mounting element being coupled to a photonics integrated circuit (PIC), and, in an instance in which the mounting element is attached to the PIC and the attachment element is attached to the FAU, the attachment element is configured to be detachably coupled to the mounting element such that each fiber of the FAU is aligned with a corresponding optical aperture of the PIC. The rough alignment element may comprise a column configured to be engaged by a cavity of the mounting element, and / or the rough alignment element may comprise a cavity configured to receive a column extending from the mounting element. The plurality of fine alignment elements may comprise a plurality of spheres, each sphere being configured to be received by a groove of the mounting element, and / or the plurality of fine alignment elements may comprise a plurality of grooves, each groove being configured to receive a sphere of the mounting element. Each groove may comprise a friction-reducing coating. The attachment element may further comprise a bonding surface configured to couple with a corresponding surface of the FAU, where the bonding surface is positioned at an angle with respect to the first kinematic interface. The angle may be a predetermined angle selected to minimize a working distance between an end of each fiber of the FAU and a corresponding optical aperture of the PIC.Page 71 of 80ATTY DKT. NO. 048833-000255 14386240v 1

[0278] Some examples of the present disclosure include a method of manufacturing a detachable connector having a kinematic mount mechanism, as well as a positioning tool used to manufacture the kinematic mount mechanism. The method and positioning tool are described in greater detail in U.S. Patent Application No. [], titled “Devices and Methods for Manufacturing Detachable Co-Packaged Connectors,” filed concurrently herewith and incorporated by reference herein. Furthermore, some examples of the presented disclosure include a group of detachable connectors configured to attach and detach from an electronic module in a ganged fashion, as described in greater detail in U.S. Patent Application No. [], titled “Devices and Methods for Detachable Coupling of Co-Packaged Optical Connectors,” filed concurrently herewith and incorporated by reference herein.Page 72 of 80ATTY DKT. NO. 048833-000255 14386240v 1

Claims

WHAT IS CLAIMED IS:

1. A detachable connector comprising:a kinematic mount, wherein the kinematic mount comprises a first kinematic interface configured to engage a corresponding second kinematic interface of a copackaged optics (CPO) device, wherein the kinematic mount comprises,at least one rough alignment element on the first kinematic interface, and at least one fine alignment element on the first kinematic interface, wherein the at least one rough alignment element has a greater tolerance for alignment between the detachable connector and the CPO device than the at least one fine alignment element.

2. The detachable connector of claim 1, wherein the at least one fine alignment element comprises at least one convex alignment feature.

3. The detachable connector of claim 2, wherein the second kinematic interface comprises at least one alignment groove configured to, in an attached state, engage the convex alignment feature.

4. The detachable connector of claim 3, wherein the at least one fine alignment element comprises three convex alignment features, and the at least one alignment groove comprises three alignment grooves.

5. The detachable connector of claim 1, wherein the rough alignment element on the first kinematic interface comprises at least one cavity configured to, in an attached state, receive at least one corresponding rough alignment element on the second kinematic interface.

6. The detachable connector of claim 5, wherein the at least cavity is configured to selfalign with the at least one corresponding rough alignment element by:receiving the at least one corresponding rough alignment element via a first portion of the cavity having a first diameter; andPage 73 of 80ATTY DKT. NO. 048833-000255 14386240v 1allowing the at least one corresponding rough alignment element to slide along an inner surface of the cavity toward a second portion of the cavity, the second portion having a second diameter narrower than the first diameter.

7. The detachable connector of claim 1, wherein the detachable connector is configured to be attached to a fiber array unit (FAU).

8. The detachable connector of claim 1, wherein the at least one rough alignment element has a greater tolerance for alignment between the detachable connector and the CPO device than the at least one fine alignment element by at least a factor of 10.

9. The detachable connector of claim 1, further comprising a polarization-selective optical element plate with at least one polarization portion and at least one non-polarization portion.

10. A system comprising:the detachable connector of claim 1 ;a mounting element comprising the second kinematic interface, wherein the mounting element is provided on the CPO device; anda force application mechanism configured to apply a force to the detachable connector, wherein the force is applied to a center of a triangular configuration formed by the at least one fine alignment element on the first kinematic interface11. The system of claim 10, wherein the at least one rough alignment element on the first kinematic interface is configured to interface with a corresponding rough alignment element of the second kinematic interface, prior to the at least one fine alignment on the first interface with a corresponding fine alignment element of the second kinematic interface.Page 74 of 80ATTY DKT. NO. 048833-000255 14386240v 112. The system of claim 11, wherein the at least one rough alignment element comprises a tapered configuration that constrains the detachable connector in order to allow the at least one fine alignment element with the corresponding fine alignment element.

13. The system of claim 12, wherein the at least one fine alignment element has a convex alignment feature and the corresponding fine alignment element is a groove.

14. A mounting element configured to be attached to a photonic integrated circuit (PIC) and configured to engage a detachable connector coupled to an FAU, the mounting element comprising:a planar body defining an optical window;at least one rough alignment element formed on the planar body; and at least one fine alignment element on the planar body,wherein the at least one rough alignment element has a greater tolerance for alignment between the mounting element and the detachable connector than the at least one fine alignment element.

15. The mounting element of claim 14, wherein the detachable connector is configured to be detachably coupled to the mounting element such that each fiber of the FAU is aligned within the optical window.

16. The mounting element of claim 15, wherein the detachable connector is configured to be detachably coupled to the mounting element such that each fiber of the FAU is aligned with a corresponding optical aperture in the PIC.

17. The mounting element of claim 14, wherein the at least one rough alignment element comprises a column, and wherein the detachable connector comprises a cavity configured to receive the column.

18. The mounting element of claim 14, wherein the at least one fine alignment element comprises a groove.Page 75 of 80ATTY DKT. NO. 048833-000255 14386240v 119. The mounting element of claim 18, wherein the groove is configured to receive a convex alignment element from the detachable connector.

20. The mounting element of claim 19, wherein at least three grooves are arranged on the planar body, and at least three corresponding convex alignment elements are provided on the detachable connector.

21. The mounting element of claim 20, wherein the at least three grooves are arranged so that longitudinal axes of the at least three grooves pass through an interior region of a triangle formed by the grooves.

22. A system comprising:the mounting element of claim 14; andthe detachable connector coupled to an FAU, wherein the at least one rough alignment element formed on the planar body is configured to interface with a corresponding rough alignment element of the detachable connector, prior to the at least one fine alignment on the planar body with a corresponding fine alignment element of the detachable connector.

23. A co-packaged optical system comprising:a photonic integrated circuit (PIC) supported by a substrate;a mounting element bonded to the PIC, the mounting element defining an optical window and comprising a first kinematic interface; anda detachable connector comprising an attachment element coupled to a fiber array unit (FAU), the attachment element comprising a second kinematic interface;wherein the first and second kinematic interfaces are configured to detachably mate to provide an optical transmission path between the FAU and the PIC.

24. The system of claim 23, further comprising a force application mechanism configured to apply a vertical force to a top surface of the attachment element to lock the second kinematic interface against the first kinematic interface.Page 76 of 80ATTY DKT. NO. 048833-000255 14386240v 125. The system of claim 23, wherein the mounting element and attachment element are configured to allow the FAU to be detached from the PIC during a thermal reflow process and reattached subsequently.

26. A detachable optical connector comprising:an attachment element having a body with a bottom kinematic interface and a top surface; anda fiber array unit (FAU) bonded to a first bonding surface of the attachment element, wherein the first bonding surface is positioned at a non- orthogonal angle relative to the bottom kinematic interface to minimize an optical working distance.

27. The connector of claim 26, wherein the attachment element has a maximum width configured to permit side-by-side placement with identical connectors on a shared photonic integrated circuit.

28. The connector of claim 26, wherein the body of the attachment element comprises a material with a coefficient of thermal expansion (CTE) substantially matching that of an underlying silicon substrate.

29. A method of aligning a mounting element to a photonic integrated circuit (PIC), the method comprising:positioning a mounting element having an optical window with respect to the PIC; transmitting optical signals through one or more test fibers;receiving optical feedback measurements from the one or more test fibers through the optical window of the mounting element; andadjusting or maintaining a positioning of the mounting element with respect to the PIC based on the optical feedback measurements.

30. The method of claim 29 further comprising bonding the mounting element to the PIC while maintaining the position of the mounting element.

31. The method of claim 29, wherein the mounting element comprises a planar body and one or more fine alignment elements on the planar body.

32. The method of claim 31, wherein the one or more test fibers are positioned with respect to the mounting element based on positioning of the one or more fine alignment elements.Page 77 of 80ATTY DKT. NO. 048833-000255 14386240v 133. The method of claim 31, wherein the mounting element comprises one or more rough alignment elements on the planar body, wherein the one or more rough alignment elements provides a lower degree of positioning precision than the one or more fine alignment elements.

34. An alignment jig for positioning a mounting element relative to a photonic integrated circuit (PIC), the jig comprising:a body configured to temporarily engage the mounting element;a magnetic coupling element configured to magnetically couple to the mounting element and controllably adjust a position of the mounting element relative to the PIC; andone or more test fiber interfaces configured to hold test fibers for optical feedback measurements.

35. The jig of claim 34, wherein the jig is configured to maintain the position of the mounting element while bonding agent is applied between the mounting element and the PIC, and to release the mounting element after bonding is complete.

36. The jig of claim 34, wherein the magnetic coupling is configured to controllably adjust the position of the mounting element with a submicron precision.

37. The jig of claim 34, wherein the magnetic coupling is configured to controllably adjust the position of the mounting element while optical signals are delivered through the one or more test fibers.

38. A blind-mating optical connector system comprising:a first connector component comprising:at least one rough alignment element configured to provide an initial alignment with a predetermined first tolerance; andat least one fine alignment element configured to provide a secondary alignment with a predetermined second tolerance less than the first tolerance; anda second connector component comprising:at least one mating rough alignment element configured to engage with the at least one rough alignment element of the first connector component and guide the first connector component during initial engagement; andPage 78 of 80ATTY DKT. NO. 048833-000255 14386240v 1at least one mating fine alignment element configured to engage the at least one fine alignment element.

39. The system of claim 38, wherein the at least one rough alignment element is configured to engage the at least one mating rough alignment element prior to engagement of the at least one fine alignment element with the at least one mating fine alignment element.

40. The system of claim 38, wherein the at least one mating rough alignment element comprises a tapered cavity configured to receive the at least one rough alignment element of the first connector component.

41. The system of claim 40, wherein the at least one rough alignment element constrains the system to a capture range that is smaller than a diameter of the at least one fine alignment element, such that the fine alignment elements are guided into their respective mating features without manual intervention.Page 79 of 80ATTY DKT. NO. 048833-000255 14386240v 1

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