Substrate processing method and substrate processing apparatus

Abstract

In this substrate processing method and this substrate processing apparatus for filling, with a filler, a gap between a first substrate and a second substrate constituting a laminated substrate, the present invention prevents air bubbles from being mixed when the abovementioned gap is filled with the filler. The laminated substrate in which the first substrate and the second substrate are bonded rotates around a rotation center axis in a posture in which the rotation center axis is parallel or inclined with respect to a horizontal plane and in a state in which a peripheral portion of the first substrate and a peripheral portion of the second substrate are immersed in the filler stored in a storage part. Thus, it is possible to fill the filler into the gap between the peripheral portion of the first substrate and the peripheral portion of the second substrate while preventing air bubbles from being mixed into the filler.

Description

Substrate Processing Method and Substrate Processing Apparatus

[0001] The present invention relates to a substrate processing technology for reinforcing an end face portion of a laminated substrate formed by bonding a first substrate and a second substrate with a filler. The disclosure content in the specification, drawings and claims of the following Japanese application is hereby incorporated by reference in its entirety into the present document: Japanese Patent Application No. 2025-40422 (filed on March 13, 2025).

[0002] In recent years, development of three-dimensional lamination technology, which forms highly integrated and high-density semiconductor chips by stacking circuits in three dimensions to improve device communication speed, power efficiency and other aspects, has been active. Among these issues, cracking, chipping, and peeling in the unbonded region of the end face portion of the laminated substrate during conveyance, polishing, and cutting processes of the laminated substrate in semiconductor chip manufacturing have become problematic. In order to solve these problems, for example, as described in Patent Document 1, a substrate processing technology has been proposed in which after filling the unbonded region of the end face portion of a laminated substrate held in a horizontal position with a thermosetting filler, the filler is cured by heating the laminated substrate. In addition, Patent Document 2 describes an apparatus that fills the filler while holding the laminated substrate in a vertical position.

[0003] Japanese Unexamined Patent Publication No. 2022-38834, Japanese Unexamined Patent Publication No. 2024-10745

[0004] In the substrate processing technology described in Patent Document 1, the coating module is arranged at a position horizontally spaced apart from the horizontally oriented laminated substrate. The coating module has a syringe mechanism. The filler is horizontally discharged from the syringe mechanism toward the gap between the first substrate and the second substrate. In addition, in the substrate processing technology described in Patent Document 2, the supply nozzle is arranged at a position spaced upward from the vertically oriented laminated substrate. The supply nozzle drops the filler in droplet form toward the gap between the first substrate and the second substrate. In this way, the filler is supplied from a position spaced apart from the laminated substrate to fill the gap between the first substrate and the second substrate. Therefore, air bubbles are easily mixed into the filler filled in the gap between the first substrate and the second substrate. Air bubble entrainment is one of the main factors that cause defects in the substrate.

[0005] This invention has been made in view of the above problems, and aims to prevent air bubbles from being mixed in when filling the gap between a first substrate and a second substrate that constitute a laminated substrate with a filler in a substrate processing method and substrate processing apparatus.

[0006] One aspect of the present invention is a substrate processing method, characterized by comprising: (a) holding a laminated substrate, in which a first substrate and a second substrate are joined, in a position in which its rotational axis is parallel to or inclined with respect to the horizontal plane; and (b) rotating the laminated substrate around its rotational axis while immersing the peripheral edge of the laminated substrate in a filler stored in a storage unit, thereby filling the gap between the peripheral edge of the first substrate and the peripheral edge of the second substrate with the filler.

[0007] Another aspect of the present invention is a substrate processing apparatus comprising: a storage unit for storing a filler; a rotation and holding unit for rotating a laminated substrate, in which a first substrate and a second substrate are joined, around a rotation and holding unit while holding the laminated substrate in a position where its rotation and holding unit is parallel to or inclined with respect to the horizontal plane; a moving unit for moving at least one of the storage unit and the rotation and holding unit; and a control unit for controlling the rotation and holding unit and the moving unit such that the laminated substrate rotates around its rotation and holding unit while the peripheral edge of the laminated substrate is immersed in the filler stored in the storage unit, thereby filling the gap between the peripheral edge of the first substrate and the peripheral edge of the second substrate.

[0008] In the invention configured in this way, the laminated substrate, in which the first substrate and the second substrate are joined, rotates around its rotational axis with its rotational axis parallel to or inclined with respect to the horizontal plane, and its peripheral edge immersed in the filler stored in the reservoir. As a result, the filler is filled into the gap between the peripheral edge of the first substrate and the peripheral edge of the second substrate.

[0009] As described above, according to the present invention, the gap between the peripheral edge of the first substrate and the peripheral edge of the second substrate is filled with filler by rotating the laminated substrate around its rotational axis while immersing the peripheral edge of the laminated substrate in filler. Therefore, it is possible to prevent air bubbles from being introduced when filling the gap with filler. Not all of the multiple components of each aspect of the present invention described above are essential, and it is possible to modify, delete, replace with other new components, or delete some of the limitations of some of the multiple components as appropriate in order to solve some or all of the above-described problems or to achieve some or all of the effects described herein. Furthermore, in order to solve some or all of the above-described problems or to achieve some or all of the effects described herein, it is also possible to combine some or all of the technical features included in one aspect of the present invention described above with some or all of the technical features included in another aspect of the present invention described above to form an independent form of the present invention.

[0010] This is a plan view showing the schematic configuration of a substrate processing system capable of executing the first embodiment of the substrate processing method according to the present invention. This is a diagram showing the first embodiment of the substrate processing apparatus according to the present invention. This is a perspective view showing the main configuration and operation of the substrate processing apparatus shown in Figure 2. This is a timing chart and schematic operation diagram showing the operation of each part of the apparatus for performing a filling process using the substrate processing apparatus shown in Figure 2. This is a diagram schematically showing the appearance of the peripheral edge of a laminated substrate that has undergone a filling process, a pre-curing process, a cleaning process, and a final curing process. This is a plan view showing the schematic configuration of a substrate processing system capable of executing the second embodiment of the substrate processing method according to the present invention. This is a diagram schematically showing the appearance of the peripheral edge of a laminated substrate that has undergone a filling process, a cleaning process, a pre-curing process, and a final curing process in the second embodiment. This is a diagram showing the third embodiment of the substrate processing apparatus according to the present invention. This is a timing chart showing the operation of each part of the apparatus for performing a filling process and a pre-curing process in the substrate processing apparatus shown in Figure 8. This is a diagram showing the fourth embodiment of the substrate processing apparatus according to the present invention. This is a timing chart showing the operation of each part of the apparatus for performing a filling process, a pre-curing process, and a bevel cleaning process in the substrate processing apparatus shown in Figure 10. This is a diagram showing the fifth embodiment of the substrate processing apparatus according to the present invention. This is a timing chart showing the operation of each part of the substrate processing apparatus shown in Figure 12 for performing the filling process, pre-curing process, bevel cleaning process, and final curing process. This figure shows a sixth embodiment of the substrate processing apparatus according to the present invention. This is a timing chart showing the operation of each part of the substrate processing apparatus shown in Figure 14 for performing the filling process and bevel cleaning process. This figure schematically shows a combination of multiple apparatuses that constitute a substrate processing system. This figure shows another holding position of the laminated substrate in the substrate processing apparatus according to the present invention.

[0011] <First Embodiment> Figure 1 is a plan view showing the schematic configuration of a substrate processing system capable of executing the first embodiment of the substrate processing method according to the present invention. This does not show the external appearance of the substrate processing system 100, but is a schematic diagram that clearly shows its internal structure by excluding the outer wall panels and other parts of the substrate processing system 100. This substrate processing system 100 is a single-wafer type device that is installed, for example, in a clean room and processes laminated substrates S one by one. In Figure 1 and the drawings described later, the XYZ orthogonal coordinate axes with the Z-axis direction as the vertical direction will be shown as appropriate. Also, as necessary, the side of each coordinate axis indicated by the arrow in the figure will be referred to as the positive side or (+ side), and the side of each coordinate axis indicated by the arrow in the figure will be referred to as the negative side or (- side).

[0012] In this embodiment, the "laminated substrate" is formed by joining the device surface of a first substrate (reference numeral S1 in Figure 3, which will be described later), on which an integrated circuit and electrical wiring are formed, to the device surface of a second substrate (reference numeral S2 in Figure 3, which will be described later), on which an integrated circuit and electrical wiring are similarly formed. Furthermore, three or more substrates may be joined together. For example, after the second substrate S2 joined to the first substrate S1 is processed, the third substrate may be joined to the second substrate, and the third substrate may be processed. In this specification, a configuration of multiple substrates joined together may be referred to as a "laminated substrate."

[0013] As shown in Figure 1, the substrate processing system 100 has a substrate processing area 110 for processing laminated substrates S. An indexer unit 120 is provided adjacent to this substrate processing area 110. The indexer unit 120 has a container holding unit 121 that can hold multiple containers C (such as FOUP (Front Opening Unified Pod), SMIF (Standard Mechanical Interface) pod, OC (Open Cassette), etc., which contain multiple laminated substrates S in a sealed state) for housing the laminated substrates S. The indexer unit 120 also includes an indexer robot 122 for accessing the containers C held by the container holding unit 121 to remove unprocessed laminated substrates S from the containers C or to store processed laminated substrates S in the containers C. Multiple laminated substrates S are housed in a nearly horizontal position in each container C.

[0014] The indexer robot 122 comprises a base portion 122a fixed to the device housing, a multi-joint arm 122b rotatably mounted on the base portion 122a around a vertical axis, and a hand 122c attached to the tip of the multi-joint arm 122b. The hand 122c is structured to hold a laminated substrate S placed on its upper surface. Since indexer robots having such a multi-joint arm and a hand for holding substrates are well known, a detailed explanation will be omitted.

[0015] In the substrate processing area 110, a mounting table 112 is provided on which laminated substrates S from the indexer robot 122 can be placed. In a plan view, a substrate transport robot 111 is positioned approximately in the center of the substrate processing area 110. Furthermore, a substrate processing apparatus 1A, a pre-curing apparatus 1B, a bevel cleaning apparatus 1C, and a main curing apparatus 1D are arranged to surround the substrate transport robot 111. The substrate processing apparatus 1A corresponds to the first embodiment of the substrate processing apparatus according to the present invention and performs a filling process in which a filler is applied to the end face of the laminated substrate S to fill the gap (reference numeral S1a in Figure 5) between the peripheral edge of the first substrate S1 (reference numeral S2a in Figure 5) and the peripheral edge of the second substrate S2 (reference numeral S2a in Figure 5). The pre-curing apparatus 1B is composed of a heating unit such as a hot plate unit and performs a pre-curing process to pre-cure the filler that has been filled into the gap of the laminated substrate S. The bevel cleaning device 1C performs a cleaning process to remove excess filler that has adhered to the peripheral edges of the laminated substrate S during filler application by the substrate processing device 1A. The curing device 1D performs a main curing process to completely cure the filler that has undergone the pre-curing process.

[0016] Here, "main curing" means curing the filler to a degree of curing sufficient to prevent cracking, chipping, and peeling in the unbonded region of the end face of the laminated substrate S (corresponding to the "first degree of curing" in the present invention). In contrast, "preliminary curing" means curing the filler only to a degree of curing lower than that of main curing, and this degree of curing corresponds to the "second degree of curing" in the present invention. In this embodiment, a filler containing a thermosetting resin is used, and the main curing process and the preliminary curing process are performed by setting the heating temperature in the main curing apparatus 1D to be higher than the heating temperature in the preliminary curing apparatus 1B.

[0017] These substrate processing devices 1A, pre-curing device 1B, bevel cleaning device 1C, and main curing device 1D are arranged to face the space where the substrate transport robot 111 is located. The substrate transport robot 111 has a configuration that allows it to transport the laminated substrate S in three dimensions while holding it with a hand (not shown in the figure). It accesses the loading table 112, picks up an unprocessed laminated substrate S from the loading table 112, and transports the laminated substrate S in the order shown by the dashed arrows in Figure 1, namely the substrate processing device 1A, pre-curing device 1B, bevel cleaning device 1C, and main curing device 1D, before returning it to the loading table 112. In this way, the laminated substrate S undergoes filling, pre-curing, cleaning, and main curing processes. The processed laminated substrate S returned to the loading table 112 is returned to the container C by the indexer robot 122 at an appropriate time. Note that if it is possible to directly transfer the substrate S between the substrate transport robot 111 and the indexer robot 122, the loading table 112 is not necessarily required. The substrate transport robot 111 may also be called a center robot.

[0018] The substrate processing system 100 shown in Figure 1 is equipped with a substrate processing device 1A, a pre-curing device 1B, a bevel cleaning device 1C, and a main curing device 1D, each performing different processes. Of these, all devices except the substrate processing device 1A have conventionally known configurations. In contrast, the substrate processing device 1A has a unique configuration different from the conventional technology, which effectively prevents air bubbles from being mixed into the filler. Therefore, in the following, the configurations of the pre-curing device 1B, the bevel cleaning device 1C, and the main curing device 1D will be omitted, while the configuration of the substrate processing device 1A will be described in detail. After that, the operation of the substrate processing system 100 will be described.

[0019] Figure 2 is a diagram showing a first embodiment of the substrate processing apparatus according to the present invention. Figure 3 is a perspective view showing the main configuration and operation of the substrate processing apparatus shown in Figure 2. The substrate processing apparatus 1A performs a filling process by applying a filler F to the peripheral edge Sa of a laminated substrate S in a position where the rotational axis AX is parallel to the horizontal plane (XY plane) (hereinafter referred to as the "vertical position"). The substrate processing apparatus 1A includes a storage unit 2 for storing the filler F, a spin chuck 3 positioned above the storage unit 2, a control unit 4, a tray vibration unit 5, and a circulation supply unit 6. These storage unit 2, spin chuck 3, control unit 4, tray vibration unit 5, and circulation supply unit 6 are arranged within the apparatus body 1A1 (Figure 1).

[0020] As shown in Figure 2, the storage section 2 includes a tray 22 having an opening 21 that opens vertically upward, and a recess 23 provided on the upper part of the tray 22 facing the opening 21, allowing the packing material F to be stored in the recess 23.

[0021] A tray vibrator 5 is connected to the tray 22. The tray vibrator 5 is electrically connected to the control unit 4. Therefore, when the tray vibrator 5 operates in response to a vibration command from the control unit 4, the vibrations generated by the tray vibrator 5 are transmitted to the filler F via the tray 22. As a result, the liquid level LL of the filler F stored in the tray 22 vibrates slightly. The tray vibrator 5 includes a vibrator. The tray vibrator 5 includes, for example, a piezoelectric element.

[0022] Furthermore, a circulating supply unit 6 for the filler F is connected to the recess 23 of the tray 22. The circulating supply unit 6 includes a circulating pipe 61 that connects different areas of the bottom surface of the recess 23 to form a circulation path, a pump 62 inserted into the circulating pipe 61, a supply pipe 63 that branches off from the circulating pipe 61, and a filler supply unit 64 connected to the supply pipe 63 so that new filler F is delivered via the supply pipe 63. The filler supply unit 64 includes a tank capable of storing the filler. When the pump 62 operates in response to a circulation command from the control unit 4, the filler F sucked in from one end of the circulating pipe 61 (the (+Y side) end in Figure 2) flows through the circulating pipe 61 by the pump 62 and is delivered to the recess 23 from the other end of the circulating pipe 61 (the (-Y side) end in Figure 2). By circulating the filler F in this way, uneven concentration of the filler F is prevented, and a constant concentration of filler F is always present in the recess 23.

[0023] Furthermore, as the filling process is repeated, the liquid level LL of the filler F stored in the recess 23 decreases. Therefore, the control unit 4 issues a replenishment command to the filler supply unit 64 at an appropriate timing. In response to this command, the filler supply unit 64 sends new filler F to the replenishment pipe 63, and it is replenished into the recess 23 by the flow of filler F that is circulating as described above. As a result, the relative position of the liquid level LL of the filler F with respect to the recess 23 is maintained at a nearly constant level.

[0024] Furthermore, a tray lifting unit 25 is connected to the tray 22. For example, the tray lifting unit 25 includes a motor and a ball screw. The tray lifting unit 25 has the function of raising and lowering the tray 22, the tray vibration unit 5, and the circulation supply unit 6 together in the vertical direction Z. Therefore, when the tray lifting unit 25 is operated in response to a lifting command from the control unit 4, the tray 22 and the like are raised and lowered. As a result, the absolute position of the liquid level LL of the filler F stored in the recess 23 in the vertical direction Z is changed, and the relative relationship between the peripheral edge of the laminated substrate S held by the spin chuck 3 and the liquid level LL of the filler F (the amount of immersion of the peripheral edge) can be adjusted, as will be explained next.

[0025] The spin chuck 3 has a spin base 31 capable of adsorbing and holding a second substrate S2 that constitutes the laminated substrate S. The spin base 31 has one side facing the (-Y side) direction, and its rotational axis ax extends in the X direction. Adsorption parts (not shown), such as adsorption grooves and adsorption holes, are provided on this side. These adsorption parts are connected to a suction unit 32, which is composed of a suction pump and an on / off valve. For example, the suction unit 32 has an aspirator. For example, the intake unit 32 has a vacuum ejector. Therefore, when an suction force generated by the suction unit 32 is applied to the spin base 31 in response to a suction command from the control unit 4, the laminated substrate S is adsorbed and held by the spin base 31. More specifically, when the spin chuck 3 is positioned at a substrate transfer position P1 located above the tray 22, an adsorption force is applied to the spin base 31 at the timing when the vertically oriented laminated substrate S is transported by a substrate transport robot (not shown), and the laminated substrate S is adsorbed and held by the spin base 31 while maintaining its vertical orientation. At this time, the substrate transport robot 111 (Figure 1) positions the laminated substrate S relative to the spin base 31 such that the rotational axis AX of the laminated substrate S coincides with the rotational axis ax of the spin base 31, as shown in Figure 3.

[0026] The other main surface of the spin base 31 is connected to the rotating shaft 331 of the motor 33. When the motor 33 rotates the rotating shaft 331 in response to a rotation command from the control unit 4, the spin base 31 rotates around the rotational axis ax while adsorbing and holding the laminated substrate S with the spin base 31.

[0027] As shown in Figure 2, the spin chuck 3 configured in this way is connected to a spin chuck lifting unit 35. The spin chuck lifting unit 35 includes a motor and a ball screw. The spin chuck lifting unit 35 has the function of raising and lowering the spin chuck 3 between a substrate transfer position P1 and a filling position P0. The filling position P0 is located vertically below the substrate transfer position P1, and by positioning the spin chuck 3 to the filling position P0, only the peripheral edge Sa of the laminated substrate S held by the spin chuck 3 is immersed in the filler F stored in the tray 22.

[0028] The control unit 4 consists of a well-known CPU (Central Processing Unit) for executing logical operations, a GPU (Graphics Processing Unit) for performing image-related calculations, a ROM (Read Only Memory) for storing initial settings, and a RAM (Random Access Memory) for temporarily storing various data during device operation. The control device 130 may also have an external storage device such as an SSD (Solid State Drive) or HDD (Hard Disk Drive) for storing various data.

[0029] Functionally, the control unit 4 includes an arithmetic processing unit 41, a storage unit 42, and the like. The storage unit 42 stores programs for performing the filling process, which will be described in detail below.

[0030] The above-mentioned arithmetic processing unit 41 has arithmetic functions such as a CPU, and controls the tray lifting unit 25, suction unit 32, spin chuck lifting unit 35, vibrator of the tray vibration unit 5 (not shown), pump 62, and filler supply unit 64, etc., according to the program stored in the storage unit 42. As a result, the arithmetic processing unit 41 performs a filling process that includes the process of holding the laminated substrate S in a vertical position, and the process of filling the gap (indicated as SP in Figure 5) between the peripheral edge Sa of the first substrate S1 (indicated as S1a in Figure 5) and the peripheral edge S2 of the second substrate S2 (indicated as S2a in Figure 5) by rotating the laminated substrate S around the rotation center axis AX while immersing the peripheral edge Sa of the laminated substrate S in the filler F stored in the storage unit 2, as will be described below.

[0031] Figure 4 is a timing chart and schematic diagram showing the operation of each part of the apparatus for performing the filling process using the substrate processing apparatus shown in Figure 2. Figure 5 is a schematic diagram showing the peripheral area of ​​a laminated substrate that has undergone filling, pre-curing, cleaning, and final curing processes. As shown in Figure 4, at timing T1, the spin chuck lifting unit 35 positions the spin chuck 3 at the substrate transfer position P1, as shown by the dashed line in Figure 3, and waits for the laminated substrate S to be loaded. In this embodiment, the tray vibration unit 5 and the pump 62 are operated continuously from immediately after power is turned on to the substrate processing apparatus 1A, thereby uniformly dispersing the thermosetting resin contained in the filler F within the tray 22.

[0032] At timing T2, the substrate transfer robot 111 loads the laminated substrate S into the main body 1A1 of the substrate processing apparatus 1A in a vertical position, and brings the center of the second substrate S2 of the laminated substrate S into contact with the suction part of the spin chuck 3. Then, the suction part 32 is activated and starts to pick up the laminated substrate S, completing the transfer from the substrate transfer robot 111 to the spin chuck 3, that is, the loading of the laminated substrate S.

[0033] Following loading, the substrate transport robot 111 retracts from the main body 1A1, and the spin chuck lifting unit 35 begins to lower the spin chuck 3, which is holding the laminated substrate S while remaining in a vertical position, into the storage unit 2. During this descent, the motor 33 is activated to start the rotation of the laminated substrate S. In this embodiment, the rotation of the laminated substrate S begins just before the peripheral edge Sa of the laminated substrate S reaches the liquid level LL of the filler F. At the timing T3 immediately after this, the peripheral edge Sa of the laminated substrate S, which is rotating in a vertical position, is immersed in the filler F stored in the storage unit 2, and as shown in column (a) of Figure 5, the application of the filler F to the peripheral edge Sa of the laminated substrate S starts the process of filling the gap SP with the filler F. In this embodiment and the embodiments to be described later, in order to ensure that the gap is filled with the filler F, the rotation speed of the spin chuck 3, which is holding the laminated substrate S while being held, is controlled to a constant value of 10 deg / s or less.

[0034] As time progresses, the filler F fills the gaps in the laminated substrate S, as shown by the thick dotted line in the lower left diagram (a) of Figure 4. Then, as shown by the thick dotted line in the lower center diagram (b) of the same figure, at timing T4 when the filler F has been filled around the entire circumference of the laminated substrate S, the spin chuck lifting unit 35 begins to lift the laminated substrate S from the storage unit 2 of the spin chuck 3 that is holding it by suction. At the same time, the motor 33 stops operating and the rotation of the laminated substrate S stops.

[0035] As shown in the lower right figure (c) of the same figure, at timing T5 when the laminated substrate S reaches the substrate transfer position P1, the spin chuck lifting unit 35 stops lifting the spin chuck 3. Then, preparations for unloading the laminated substrate S are made, and at timing T6 when this is complete, the substrate transfer robot 111 enters the main body 1A1 of the apparatus and holds the processed laminated substrate S. Subsequently, the suction unit 32 stops adsorbing the laminated substrate S and transfers the laminated substrate S from the spin chuck 3 to the substrate transfer robot 111 (unloading). Then, the substrate transfer robot 111 moves away from the main body 1A1 of the substrate processing apparatus 1A, and after transporting the laminated substrate S in the order of pre-curing device 1B, bevel cleaning device 1C, and main curing device 1D, it is placed on the mounting table 112.

[0036] As shown in column (a) of Figure 5, the laminated substrate S, which is transported from the substrate processing apparatus 1A to the pre-curing apparatus 1B, has a filler F applied to cover the entire circumference of the peripheral edge Sa of the laminated substrate S. Then, in the pre-curing apparatus 1B, the laminated substrate S undergoes a pre-curing treatment. In this pre-curing apparatus 1B, a thermal curing treatment is performed on the laminated substrate S at a temperature lower than the temperature (hereinafter referred to as "low temperature") used in the main curing treatment that will be performed later (hereinafter referred to as "high temperature"). The applied filler F contains filler F2 that fills the gaps SP and filler F1 that surrounds the filler F2 (see column (b) of Figure 5).

[0037] The laminated substrate S, having undergone this pre-curing treatment, is transported from the pre-curing device 1B to the bevel cleaning device 1C by a substrate transport robot 111 (Figure 1). Then, as shown in column (c) of Figure 5, cleaning liquid is supplied to the peripheral edge Sa of the laminated substrate S in the bevel cleaning device 1C, and the pre-cured filler F is washed away. At this time, for example, the cleaning liquid is supplied to an area of ​​about 0.3 mm from the edge of the laminated substrate S toward the center. In this bevel cleaning device 1C, the supply of cleaning liquid is stopped when the filler F1 has been washed away. As a result, the filler F2 remains only in the gap SP of the laminated substrate S. For example, the cleaning liquid is thinner (OK73 thinner).

[0038] Once the bevel cleaning process is complete, the bevel-cleaned laminated substrate S is transported from the bevel cleaning device 1C to the curing device 1D by the substrate transport robot 111 (Figure 1). Then, as shown in column (d) of Figure 5, the laminated substrate S is heat-treated at a high temperature. This further heat-cures the partially cured filler F2, resulting in a more hardened filler F3. Subsequently, the laminated substrate S, with the filler F3 filling the gaps SP, is transported from the curing device 1D to the mounting table 112 by the substrate transport robot 111 (Figure 1), and then placed in the container C by the indexer robot 122.

[0039] As described above, according to the first embodiment, the substrate processing apparatus 1A fills the gap SP of the laminated substrate S, which is formed by joining a first substrate S1 and a second substrate S2, with the gap SP of the laminated substrate S by rotating it around the rotation axis AX with its rotation axis AX parallel to the horizontal plane (vertical position) and its peripheral edge Sa immersed in the filler F stored in the storage section 2. Therefore, problems that occurred in conventional technology, where the filling process was performed by dispensing or dropping droplets of filler F, namely cavitation and the generation of bubbles due to collisions between droplets of filler F, are avoided, and it is possible to effectively prevent bubbles from being mixed into the filler F that fills the gap SP. Furthermore, since the filler F is heat-cured and does not contain bubbles, it is possible to prevent cracking, chipping, or peeling in the unjointed area of ​​the edge face of the laminated substrate S, and a high-quality laminated substrate S can be manufactured.

[0040] The procedures for performing the filling process, pre-curing process, bevel cleaning process, and final curing process correspond to the "filling process," "pre-curing process," "cleaning process," and "final curing process," respectively. In particular, in the first embodiment, since the bevel cleaning process is performed after the pre-curing process, the bevel cleaning process may be referred to as the "post-pre-curing cleaning process," the cleaning process may be referred to as the "post-pre-curing cleaning process," or it may be referred to as the "first cleaning process" to distinguish it from the cleaning process in the second embodiment which will be described next.

[0041] Furthermore, in the first embodiment, the substrate transfer position P1 corresponds to an example of the "upper position" of the present invention. Also, the spin chuck 3 corresponds to an example of the "rotating holding part" of the present invention, and the spin chuck lifting part 35 that raises and lowers the spin chuck 3 functions as the "moving part" of the present invention.Here, the spin chuck 3 is raised to create a substrate transfer state, and the spin chuck 3 is lowered to create a filling process state.However, instead of raising and lowering the spin chuck 3, the tray lifting part 25 may raise and lower the tray 22, in which case the tray lifting part 25 corresponds to an example of the "moving part" of the present invention.Also, both the spin chuck lifting part 35 and the tray lifting part 25 may function as the "moving part" of the present invention.The same applies to the following embodiments.That is, in the present invention, the spin chuck 3 holding the unprocessed laminated substrate S is configured to move up and down relative to the tray 22.

[0042] <Second Embodiment> Figure 6 is a plan view showing a schematic configuration of a substrate processing system capable of executing the second embodiment of the substrate processing method according to the present invention. Figure 7 is a schematic diagram showing the peripheral portion of a laminated substrate that has undergone filling, washing, pre-curing, and final curing processes in the second embodiment. The main difference between this second embodiment and the first embodiment is that, as shown in Figure 6, the positions of the pre-curing device 1B and the bevel washing device 1C are swapped in the substrate processing area 110, and the laminated substrate S is transported in the order of mounting table 112 - substrate processing device 1A - bevel washing device 1C - pre-curing device 1B - final curing device 1D - mounting table 112. Other aspects are the same as in the first embodiment.

[0043] Also in this second embodiment, similarly to the first embodiment, in the substrate processing apparatus 1A, the filler F is filled into the gap SP of the laminated substrate S by rotating the laminated substrate S about the rotation center axis AX in a state where the laminated substrate S is in a vertical posture and the peripheral edge portion Sa is immersed in the filler F stored in the storage portion 2. Therefore, it is possible to effectively prevent air bubbles from being mixed into the filler F filled in the gap SP. As a result, a high-quality laminated substrate S can be manufactured.

[0044] It should be noted that, in the second embodiment, since the bevel cleaning process is performed before the temporary curing process, the bevel cleaning process is referred to as "pre-temporary-curing cleaning", and the procedure for performing the bevel cleaning process may be referred to as a "second cleaning step" to distinguish it from the cleaning step in the first embodiment.

[0045] <Third Embodiment> FIG. 8 is a diagram showing a third embodiment of the substrate processing apparatus according to the present invention. FIG. 9 is a timing chart showing operations of each part of the apparatus for performing the filling process and the temporary curing process in the substrate processing apparatus shown in FIG. 8. The major difference between the third embodiment and the first embodiment is that a temporary curing section 7 for performing the temporary curing process is disposed in the apparatus main body 1A1 of the substrate processing apparatus 1A, and accordingly, the temporary curing apparatus 1B is removed from the substrate processing system 100. Other points are the same as those of the first embodiment. Therefore, the following description focuses on the differences from the first embodiment, and the same components are denoted by the same reference numerals and the description thereof is omitted.

[0046] In the third embodiment, as shown in FIG. 8, a temporary curing section 7 for performing the temporary curing process is additionally provided in the apparatus main body 1A1 of the substrate processing apparatus 1A. More specifically, the temporary curing section 7 has an infrared light emitting section (not shown) disposed to face the temporary curing area AR1 of the non-immersion area R0 of the laminated substrate S. Here, the non-immersion area R0 means an area excluding the area immersed in the filler F (hereinafter referred to as "immersion area R1") in the entire circumferential area of the laminated substrate S (the area indicated by the one-dot chain line in FIG. 8) when the spin chuck 3 is positioned at the filling position P0, that is, the area that is not immersed. Particularly in the third embodiment, the temporary curing section 7 is disposed near the downstream side of the immersion area R1 in the rotation direction RD of the laminated substrate S.

[0047] The preliminary curing unit 7 is connected to a spin chuck lifting / lowering section 35, and is capable of lifting and lowering integrally with the laminated substrate S. That is, the preliminary curing unit 7 can move in the vertical direction Z with an infrared light-emitting section always oriented toward the preliminary curing region AR1. The infrared light-emitting section is composed of, for example, an infrared irradiation element, and performs the preliminary curing process by heating the filler F applied in the gap SP through irradiating the infrared light emitted from the infrared irradiation element toward the preliminary curing region AR1. Therefore, since a lighting command is continuously supplied from the control section 4 to the preliminary curing unit 7, the preliminary curing process can be continued in any of the periods while the laminated substrate S is positioned at the filling position P0, while the laminated substrate S is lifted from the filling position P0 to the substrate transfer position P1, and while the laminated substrate S is positioned at the substrate transfer position P1.

[0048] In the substrate processing apparatus 1A configured as described above, each section of the apparatus operates in response to a command from the control section 4, whereby the preliminary curing process is executed in parallel with the filling process being executed in the same manner as in the first embodiment. Here, the description of the operations related to the filling process is omitted, while the preliminary curing process will be described in detail with reference to FIG. 9.

[0049] The filling process begins at timing T3, but a little later, at timing T3b, the peripheral area to which the filler F was first applied reaches the pre-curing region AR1. At this point, the infrared light-emitting part of the pre-curing unit 7 lights up in response to a lighting command from the control unit 4, and the pre-curing process begins. The laminated substrate S and the pre-curing unit 7 are positioned at the filling position P0 until the filling process is completed at timing T4, and the filling process and the pre-curing process are executed in parallel. Meanwhile, at timing T4, when the filling process is completed, the spin chuck lifting unit 35 raises the spin chuck 3, which is rotating in the rotation direction RD while holding the laminated substrate S, and the pre-curing unit 7, which still has its infrared light-emitting part lit, together to the substrate transfer position P1. This stops the filling process, and the filling process ends, but the rotation of the laminated substrate S and the pre-curing process by the pre-curing unit 7 continue. Subsequently, at the timing T5b when the peripheral portion to which the filler F was last applied has passed through the pre-cured region AR1, the control unit 4 outputs a shut-off command to the infrared light-emitting unit, causing the infrared light-emitting unit to turn off. This completes the pre-curing process. In this embodiment, the rotation of the laminated substrate S is stopped at this stage.

[0050] Once the filling process and pre-curing process are performed on the entire circumference of the laminated substrate S in the substrate processing apparatus 1A, the laminated substrate S is removed from the substrate processing apparatus 1A by the substrate transport robot 111 and transported in the order of bevel cleaning apparatus 1C and then main curing apparatus 1D. After undergoing bevel cleaning in the bevel cleaning apparatus 1C and main curing in the main curing apparatus 1D, it is transported to the mounting table 112.

[0051] As described above, according to the third embodiment, the filling process and the pre-curing process are performed in the same apparatus, i.e., in the substrate processing apparatus 1A, so the substrate processing system 100 is made more compact. Furthermore, since the filling process and the pre-curing process are performed partially in parallel in the substrate processing apparatus 1A, the cycle time can be shortened compared to the first and second embodiments.

[0052] <Fourth Embodiment> Figure 10 shows a fourth embodiment of the substrate processing apparatus according to the present invention. Figure 11 is a timing chart showing the operation of each part of the apparatus for performing the filling process, pre-curing process, and bevel cleaning process in the substrate processing apparatus shown in Figure 10. The main difference between the fourth embodiment and the third embodiment is that the bevel cleaning unit 8 for performing the cleaning process after pre-curing is located on the main body 1A1 of the substrate processing apparatus 1A, and consequently, the bevel cleaning device 1C is removed from the substrate processing system 100 along with the pre-curing device 1B. Other aspects are the same as in the third embodiment. Therefore, in the following, the differences from the third embodiment will be explained in detail, and the same components will be denoted by the same reference numerals and their explanations will be omitted.

[0053] In the fourth embodiment, as shown in Figure 10, a bevel cleaning unit 8 for performing a pre-curing cleaning process is additionally installed within the main body 1A1 of the substrate processing apparatus 1A. More specifically, the bevel cleaning unit 8 is positioned opposite the bevel cleaning area AR2 of the non-immersion area R0 of the laminated substrate S. In the fourth embodiment, the bevel cleaning unit 8 is positioned near the downstream side of the pre-curing unit 7 in the rotational direction RD of the laminated substrate S. Here, downstream refers to the side in the direction of rotation of the laminated substrate S.

[0054] The bevel cleaning unit 8 is connected to the spin chuck lifting unit 35 together with the pre-curing unit 7, and can move up and down integrally with the laminated substrate S. In other words, the bevel cleaning unit 8 can discharge cleaning liquid for cleaning and removing the filler F toward the bevel cleaning region AR2. Furthermore, the filler F that has been cleaned and removed from the peripheral Sa of the laminated substrate S by the cleaning liquid, as well as the used cleaning liquid, can be recovered from the laminated substrate S. Thus, the bevel cleaning unit 8 has a bevel cleaning function that cleans and removes excess filler F (filler F applied to areas other than the gap SP) from the laminated substrate S using cleaning liquid in the bevel cleaning region AR2. Therefore, by continuously supplying cleaning commands from the control unit 4 to the bevel cleaning unit 8, the bevel cleaning process (cleaning process after pre-curing) can be continued while the laminated substrate S is positioned at the filling position P0, while it is being lifted from the filling position P0 to the substrate transfer position P1, and while it is located at the substrate transfer position P1. The bevel cleaning unit includes a tank for storing cleaning fluid, piping for supplying the cleaning fluid, and a nozzle for discharging the cleaning fluid.

[0055] In the substrate processing apparatus 1A configured in this way, the filling process and pre-curing process are performed in the same manner as in the third embodiment, as each part of the apparatus operates in response to commands from the control unit 4, and the bevel cleaning process is performed in parallel. Here, the operation of the filling process and pre-curing process is omitted, but the bevel cleaning process (cleaning process after pre-curing) will be described in detail with reference to Figure 11.

[0056] At timing T3b, the pre-curing process begins, and a little later, at timing T3c, the peripheral portion where the filler F has been pre-cured first reaches the bevel cleaning area AR2. At this point, the bevel cleaning unit 8 is activated in response to a cleaning command from the control unit 4, and the bevel cleaning process begins. Then, until the filling process is completed at timing T4, the laminated substrate S, the pre-curing unit 7, and the bevel cleaning unit 8 are positioned at the filling position P0, and the filling process, pre-curing process, and bevel cleaning process are executed in parallel. Meanwhile, at timing T4, when the filling process is completed, the spin chuck lifting unit 35 integrally raises the spin chuck 3, which is rotating in the rotational direction RD while holding the laminated substrate S, the pre-curing unit 7, which keeps its infrared light-emitting unit lit, and the bevel cleaning unit 8, which continues to discharge and collect the cleaning liquid, to the substrate transfer position P1. This stops the filling process, and the filling process is completed, but the rotation of the laminated substrate S, the pre-curing process by the pre-curing unit 7, and the bevel cleaning process by the bevel cleaning unit 8 continue. At timing T5b, the pre-curing process by the pre-curing unit 7 is completed, but the rotation of the laminated substrate S and the bevel cleaning process by the bevel cleaning unit 8 continue. Subsequently, at timing T5c, when the entire peripheral portion where the filler F has pre-cured has passed through the bevel cleaning region AR2, the control unit 4 outputs a cleaning stop command, stopping the bevel cleaning process. This completes the bevel cleaning process. In this embodiment, the rotation of the laminated substrate S is stopped at this stage.

[0057] Once the filling process, pre-curing process, and bevel cleaning process (cleaning process after pre-curing) are performed on the entire circumference of the laminated substrate S in the substrate processing apparatus 1A, the laminated substrate S is removed from the substrate processing apparatus 1A by the substrate transport robot 111 and transported to the main curing apparatus 1D, where it undergoes the main curing process before being transported to the mounting table 112.

[0058] As described above, according to the fourth embodiment, the filling process, pre-curing process, and bevel cleaning process are performed in the same apparatus, i.e., in the substrate processing apparatus 1A, so the substrate processing system 100 is made even more compact. In addition, since the filling process, pre-curing process, and bevel cleaning process are performed partially in parallel in the substrate processing apparatus 1A, the cycle time can be shortened compared to the first to third embodiments.

[0059] <Fifth Embodiment> Figure 12 shows a fifth embodiment of the substrate processing apparatus according to the present invention. Figure 13 is a timing chart showing the operation of each part of the apparatus for performing the filling process, pre-curing process, bevel cleaning process, and main curing process in the substrate processing apparatus shown in Figure 12. The main difference between the fifth embodiment and the fourth embodiment is that the main curing unit 9 for performing the main curing process is located in the apparatus body 1A1 of the substrate processing apparatus 1A, and consequently, the main curing unit 1D, along with the pre-curing device 1B and the bevel cleaning device 1C, has been removed from the substrate processing system 100. Other aspects are the same as in the fourth embodiment. Therefore, in the following, the differences from the fourth embodiment will be explained in detail, and the same components will be denoted by the same reference numerals and their explanations will be omitted.

[0060] In the fifth embodiment, as shown in Figure 12, a main curing unit 9 for performing the main curing process is additionally installed within the main body 1A1 of the substrate processing apparatus 1A. More specifically, the main curing unit 9 has an infrared light-emitting unit (not shown) positioned opposite the main curing region AR3 of the non-immersed region R0 of the laminated substrate S. In other words, the main curing unit 9 is positioned near the downstream side of the bevel cleaning unit 8 in the rotational direction RD of the laminated substrate S. The main curing unit 9 has basically the same configuration as the pre-curing unit 7, but the light energy of the infrared light emitted from the infrared light-emitting unit is higher than that of the pre-curing unit 7, and the main curing region AR3 becomes hotter than the pre-curing region AR1. As a result, it is possible to increase the degree of curing of the filler F in the main curing region AR3 compared to the degree of curing in the pre-curing region AR1.

[0061] The hardening unit 9 is connected to the spin chuck lifting unit 35 and can move up and down integrally with the laminated substrate S. In other words, the hardening unit 9 can move vertically in the Z direction while keeping the infrared light-emitting unit always facing the hardening region AR3. The infrared light-emitting unit is composed of, for example, an infrared irradiation element, and is configured to heat the filler F applied to the gap SP by directing the infrared light emitted from the infrared irradiation element towards the hardening region AR3, thereby performing the hardening process. Therefore, by continuously supplying a lighting command from the control unit 4 to the hardening unit 9, the hardening process can be continued while the laminated substrate S is positioned at the filling position P0, while it is being lifted from the filling position P0 to the substrate transfer position P1, and while it is located at the substrate transfer position P1.

[0062] In the substrate processing apparatus 1A configured in this way, the filling process, pre-curing process, and bevel cleaning process are performed in parallel with the main curing process, as each part of the apparatus operates in response to commands from the control unit 4, similar to the fourth embodiment. Here, the operation descriptions for the filling process, pre-curing process, and bevel cleaning process are omitted, while the main curing process will be described in detail with reference to Figure 13.

[0063] At timing T3c, the bevel cleaning process begins, and a little later, at timing T3d, the excess filler F is first cleaned and removed, and the peripheral portion where filler F exists only in the gap SP approaches the main curing region AR3. At this point, the infrared light-emitting part of the main curing unit 9 lights up in response to a lighting command from the control unit 4, and the preliminary curing process begins. Then, until the filling process is completed at timing T4, the laminated substrate S, the preliminary curing unit 7, the bevel cleaning unit 8, and the main curing unit 9 are positioned at the filling position P0, and the filling process, preliminary curing process, bevel cleaning process, and main curing process are executed in parallel. Meanwhile, at timing T4, when the filling process is completed, the spin chuck lifting unit 35 raises the spin chuck 3, which is rotating in the rotational direction RD while holding the laminated substrate S, the preliminary curing unit 7 and the main curing unit 9, which have their infrared light-emitting parts still lit, and the bevel cleaning unit 8, which continues to discharge and collect the cleaning liquid, together to the substrate transfer position P1. This stops the filling process, and the filling process is completed. Subsequently, at timings T5b and T5c, the preliminary curing process and bevel cleaning process are completed sequentially, but the rotation of the laminated substrate S and the main curing process by the main curing unit 9 continue. Then, at timing T5d, when the peripheral portion to which the filler F has been applied has last passed through the main curing region AR3, the control unit 4 outputs a power-off command to the infrared light-emitting unit, causing the infrared light-emitting unit to turn off. This completes the main curing process. In this embodiment, the rotation of the laminated substrate S is stopped at this stage.

[0064] Once the filling process, pre-curing process, bevel cleaning process (cleaning process after pre-curing), and main curing process are performed on the entire circumference of the laminated substrate S in the substrate processing apparatus 1A, the laminated substrate S is unloaded from the substrate processing apparatus 1A by the substrate transport robot 111 and transported to the mounting table 112.

[0065] As described above, according to the fifth embodiment, the filling process, pre-curing process, bevel cleaning process, and final curing process are performed within the same apparatus, i.e., in the substrate processing apparatus 1A, so the substrate processing system 100 is made even more compact. In addition, since the filling process, pre-curing process, bevel cleaning process, and final curing process are performed partially in parallel in the substrate processing apparatus 1A, the cycle time can be shortened compared to the first to fourth embodiments.

[0066] <Sixth Embodiment> Figure 14 shows a sixth embodiment of the substrate processing apparatus according to the present invention. Figure 15 is a timing chart showing the operation of each part of the apparatus for performing the filling process and the bevel cleaning process in the substrate processing apparatus shown in Figure 14. The main difference between the sixth embodiment and the second embodiment is that a bevel cleaning unit 8 for performing the bevel cleaning process before the pre-curing process is located on the main body 1A1 of the substrate processing apparatus 1A, and consequently the bevel cleaning device 1C has been removed from the substrate processing system 100. Other aspects are the same as in the second embodiment. Therefore, in the following, the differences from the second embodiment will be explained in detail, and the same components will be denoted by the same reference numerals and their explanations will be omitted.

[0067] In the sixth embodiment, as shown in Figure 14, a bevel cleaning unit 8 is added to the main body 1A1 of the substrate processing apparatus 1A to perform a so-called pre-curing cleaning process, which involves cleaning and removing excess filler F (filler F applied to areas other than gaps SP) from the laminated substrate S using a cleaning solution before performing the pre-curing process. The configuration of the bevel cleaning unit 8 is basically the same as that of the fourth embodiment, which performs the post-curing cleaning process.

[0068] In the fourth embodiment, as shown in Figure 14, a bevel cleaning unit 8 for performing cleaning after pre-curing is additionally installed inside the main body 1A1 of the substrate processing apparatus 1A. More specifically, the bevel cleaning unit 8 is positioned opposite the bevel cleaning area AR2 of the non-immersion area R0 of the laminated substrate S.

[0069] The bevel cleaning unit 8 is connected to the spin chuck lifting unit 35 and can move up and down integrally with the laminated substrate S. In other words, the bevel cleaning unit 8 can discharge cleaning liquid for cleaning and removing the filler F toward the bevel cleaning region AR2. Furthermore, the filler F that has been cleaned and removed from the peripheral Sa of the laminated substrate S by the cleaning liquid, as well as the used cleaning liquid, can be recovered from the laminated substrate S. Thus, the bevel cleaning unit 8 has a bevel cleaning function that cleans and removes excess filler F (filler F applied to areas other than the gap SP) from the laminated substrate S using cleaning liquid in the bevel cleaning region AR2. Therefore, by continuously supplying cleaning commands from the control unit 4 to the bevel cleaning unit 8, it is possible to continue the bevel cleaning process (pre-curing cleaning process) while the laminated substrate S is positioned at the filling position P0, while it is being lifted from the filling position P0 to the substrate transfer position P1, and while it is located at the substrate transfer position P1.

[0070] In the substrate processing apparatus 1A configured in this way, the filling process is performed in the same manner as in the second embodiment as each part of the apparatus operates in response to commands from the control unit 4, and the pre-curing cleaning process is performed in parallel. Here, the operation of the filling process will be omitted, but the pre-curing process will be described in detail with reference to Figure 15.

[0071] The filling process begins at timing T3, but at a later timing T3c, the peripheral area to which the filler F was first applied reaches the bevel cleaning area AR2. At this point, the bevel cleaning unit 8 is activated in response to a cleaning command from the control unit 4, and the bevel cleaning process begins. Until the filling process is completed at timing T4, the laminated substrate S and the bevel cleaning unit 8 are positioned at the filling position P0, and the filling process and the bevel cleaning process are executed in parallel. Meanwhile, at timing T4, when the filling process is completed, the spin chuck lifting unit 35 raises the spin chuck 3, which is holding the laminated substrate S and rotating it in the rotational direction RD, and the bevel cleaning unit 8, which continues to discharge and collect the cleaning liquid, together to the substrate transfer position P1. This stops the filling process, and the filling process ends, but the rotation of the laminated substrate S and the bevel cleaning process by the bevel cleaning unit 8 continue. Then, at the timing T5c when the peripheral portion filled with filler F has last passed through the bevel cleaning region AR2, the control unit 4 outputs a cleaning stop command, stopping the bevel cleaning process. This completes the bevel cleaning process. In this embodiment, the rotation of the laminated substrate S is stopped at this stage.

[0072] Once the filling process and bevel cleaning process (pre-curing cleaning process) are performed on the entire circumference of the laminated substrate S in the substrate processing apparatus 1A, the laminated substrate S is removed from the substrate processing apparatus 1A by the substrate transport robot 111 and transported in the order of pre-curing apparatus 1B and then main curing apparatus 1D. After undergoing pre-curing in the pre-curing apparatus 1B and main curing in the main curing apparatus 1D, it is transported to the mounting table 112.

[0073] As described above, according to the sixth embodiment, the filling process and the bevel cleaning process are performed in the same apparatus, i.e., in the substrate processing apparatus 1A, so the substrate processing system 100 can be made even more compact. In addition, since the filling process and the bevel cleaning process are performed partially in parallel in the substrate processing apparatus 1A, the cycle time can be shortened compared to the second embodiment.

[0074] <Other Embodiments> The present invention is not limited to the embodiments described above, and various modifications can be made to those described above without departing from the spirit of the invention.

[0075] Figure 16 summarizes the installation status of the substrate processing apparatus 1A, pre-curing apparatus 1B, bevel cleaning apparatus 1C, and main curing apparatus 1D in the substrate processing system 100 in the first to sixth embodiments described above, as well as the implementation status of the filling process, second cleaning process (cleaning before pre-curing), pre-curing process, first cleaning process (cleaning after pre-curing), and main curing process in the substrate processing apparatus 1A.

[0076] Figure 16 is a schematic diagram showing multiple device combinations that constitute a substrate processing system. Instead of the second embodiment, the substrate processing apparatus 1A may be configured to perform the filling process, the second cleaning process (cleaning before pre-curing), and the pre-curing process, as shown in the seventh embodiment in Figure 16. Furthermore, as shown in the eighth embodiment in Figure 16, the main curing process may also be configured to be performed in the substrate processing apparatus 1A.

[0077] Furthermore, in the substrate processing system 100 according to the first to eighth embodiments, the filling process, cleaning process (first or second cleaning process), pre-curing process, and main curing process are all performed. However, the cleaning process may be omitted, for example, as shown in the ninth to eleventh embodiments in Figure 16. Also, the pre-curing process may be omitted, for example, as shown in the twelfth to fourteenth embodiments in Figure 16. Moreover, both the cleaning process and the pre-curing process may be omitted, for example, as shown in the fifteenth to sixteenth embodiments in Figure 16. Even when some processes are omitted in this way, similar to the third to sixth embodiments, it is possible to make the substrate processing system 100 more compact and shorten the cycle time by adding processes other than the filling process in the substrate processing apparatus 1A.

[0078] Furthermore, in the above embodiment, the laminated substrate S is filled while in a vertical position, as shown in Figure 2 and other figures. However, the position of the laminated substrate S during the filling process is not limited to this. For example, as shown in Figure 17, the filling process may be performed with the rotational axis AX of the laminated substrate S tilted with respect to the horizontal plane.

[0079] Furthermore, although the above embodiment uses a filler F containing a thermosetting resin, a filler F containing another curable resin, such as a photocurable resin, may also be used. While the invention has been described in accordance with specific embodiments, this description is not intended to be interpreted restrictively. By referring to the description of the invention, various modifications of the disclosed embodiments will become apparent to those familiar with the art, as with other embodiments of the present invention. Therefore, the appended claims are intended to include such modifications or embodiments without departing from the true scope of the invention.

[0080] This invention can be applied to all substrate processing techniques for reinforcing the end faces of laminated substrates, in which a first substrate and a second substrate are joined, with a filler.

[0081] 1A...Substrate processing device 2...Storage unit 3...Spin chuck (rotating holding unit) 4...Control unit 35...Spin chuck lifting unit (moving unit) AX...Rotational axis (of the laminated substrate) F, F1, F2, F3...Filler P1...Substrate transfer position (upper position) S...Laminated substrate S1...First substrate S1a...Peripheral edge (of the first substrate) S2...Second substrate S2a...Peripheral edge (of the second substrate) SP...Gap Sa...Peripheral edge (of the laminated substrate)

Claims

1. A substrate processing method comprising: (a) holding a laminated substrate, in which a first substrate and a second substrate are joined, in a position in which its rotational axis is parallel to or inclined with respect to the horizontal plane; and (b) rotating the laminated substrate around the rotational axis while immersing the peripheral edge of the laminated substrate in a filler stored in a storage unit, thereby filling the gap between the peripheral edge of the first substrate and the peripheral edge of the second substrate with the filler.

2. A substrate processing method according to claim 1, wherein step (a) is a step of holding the laminated substrate at an upper position located above the liquid surface of the filler stored in the storage section, and step (b) is a step of (b-1) lowering the laminated substrate relative to a filling position in which the peripheral edge is immersed in the filler, and (b-2) starting the rotation of the laminated substrate about the rotation center axis during the execution of step (b-1).

3. A substrate processing method according to claim 2, wherein step (b) includes (b-3) a step of completing the filling of the filler by removing the laminated substrate from the filler when the filling of the filler into the gap over the entire circumference of the laminated substrate is complete.

4. A substrate processing method according to claim 1, further comprising (c) a step of curing the filler that has been filled into the gap to a first degree of curing.

5. A substrate processing method according to claim 4, wherein steps (a), (b), and (c) are performed within the same apparatus.

6. A substrate processing method according to claim 4, further comprising (d) a step of pre-curing the filler that has been filled into the gap prior to step (c) to a second degree of curing lower than the first degree of curing.

7. A substrate processing method according to claim 6, wherein steps (a), (b), and (d) are performed within the same apparatus.

8. A substrate processing method according to claim 4, further comprising (e) a step of removing the filler from the filler that has adhered to the peripheral edge of the laminated substrate by step (b) prior to step (c), excluding the filler that has filled the gap.

9. A substrate processing method according to claim 8, wherein steps (a), (b), and (e) are performed within the same apparatus.

10. A substrate processing method according to claim 8, comprising (d) a step of pre-curing the filler filled in the gap to a second degree of curing lower than the first degree of curing, wherein step (e) includes (e-1) a step of removing the filler that has adhered to the peripheral edge of the laminated substrate by step (b), excluding the filler that has been filled in the gap, prior to step (d).

11. A substrate processing method according to claim 8, comprising (d) a step of pre-curing the filler filled in the gap to a second degree of curing lower than the first degree of curing, wherein step (e) includes (e-2) a step of removing the filler that has adhered to the peripheral edge of the laminated substrate by step (b) between step (d) and step (c), excluding the filler that has been filled in the gap.

12. A substrate processing method according to claim 10 or 11, wherein step (a), step (b), step (d), and step (e) are performed within the same apparatus.

13. A substrate processing method according to any one of claims 1 to 11, wherein the rotation speed of the laminated substrate in step (b) is 10 deg / s.

14. A substrate processing method according to any one of claims 1 to 11, wherein step (b) includes (b-4) a step of circulating the filler inside the storage section.

15. A substrate processing method according to any one of claims 1 to 11, wherein step (b) includes (b-5) a step of applying vibration to the storage section.

16. A substrate processing method according to any one of claims 1 to 11, wherein step (b) includes (b-6) a step of adjusting the amount of immersion of the peripheral edge of the laminated substrate in the filler stored in the storage area.

17. A substrate processing apparatus comprising: a storage section for storing a filler; a rotation and holding section for rotating a laminated substrate, in which a first substrate and a second substrate are joined, around the rotation and holding section while the laminated substrate is held in a position where its rotation and holding section axis is parallel to or inclined with respect to the horizontal plane; a moving section for moving at least one of the storage section and the rotation and holding section; and a control section for controlling the rotation and holding section and the moving section so that the peripheral edge of the laminated substrate is immersed in the filler stored in the storage section while the laminated substrate rotates around the rotation and holding section axis, thereby filling the gap between the peripheral edge of the first substrate and the peripheral edge of the second substrate.

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