Formed product assembly, formed product, method for manufacturing formed product assembly, and method for manufacturing formed product

Abstract

A formed product assembly 1 comprises a formed product 10, and a housing 80 having an accommodating space 81 for accommodating the formed product 10, wherein: the formed product 10 comprises a wiring layer 50 with an electrically conductive layer 52, and a film-like substrate 30 that is deformed into a three-dimensional shape having an annular cross-sectional shape and that holds the wiring layer 50 on the outer side thereof; and the housing 80 has openings 82A, 82B for exposing parts 521C, 521D of the electrically conductive layer 52.

Description

Molded article assembly, molded article, method for manufacturing molded article assembly, and method for manufacturing molded article

[0001] The present invention relates to a molded article assembly including a molded article having a three-dimensional shape and a housing that accommodates the molded article, a molded article used for the molded article assembly, a method for manufacturing the molded article assembly, and a method for manufacturing the molded article used for the molded article assembly. For designated countries where incorporation by reference is permitted, the content described in Japanese Patent Application No. 2025-038674 filed in Japan on March 11, 2025 is incorporated herein by reference and made part of the description of the present specification.

[0002] A technique is known in which a roughened portion is formed by laser processing on an insulating layer covering the surface of a three-dimensional molded body, and a conductive layer is formed by electroless copper plating and electrolytic copper plating (see, for example, Patent Document 1).

[0003] Japanese Unexamined Patent Publication No. 2019-186432

[0004] In the above technique, since laser processing is used, it is difficult to form a conductive layer inside the three-dimensional molded body, which may limit the degree of freedom in design.

[0005] The problem to be solved by the present invention is to provide a molded article assembly, a molded article, a method for manufacturing a molded article assembly, and a method for manufacturing a molded article that can improve the degree of freedom in design.

[0006] [1] Aspect 1 of the present invention is a molded article assembly including a molded article and a housing having an accommodation space for accommodating the molded article, wherein the molded article includes a wiring layer having a conductive layer, and a film-shaped substrate that is deformed into a three-dimensional shape having an annular cross-sectional shape and holds the wiring layer on the outside, and the housing has a first opening that exposes a part of the conductive layer.

[0007] [2] Aspect 2 of the present invention may be the molded article assembly according to Aspect 1, wherein the substrate includes a pair of molded portions having a convex cross-sectional shape and a connecting portion that connects the pair of molded portions, the substrate is bent around the connecting portion, and the pair of molded portions face each other.

[0008] [3] A third aspect of the present invention is a molded product assembly of the second aspect, wherein the molded product is a molded product assembly having a joint that joins portions that are in close proximity to each other in the pair of molded parts.

[0009] [4] Embodiment 4 of the present invention is a molded product assembly according to Embodiment 2 or 3, wherein the molded product comprises a pair of adhesive portions interposed between the substrate and the wiring layer, and the gap between the pair of adhesive portions is opposite to the connecting portion.

[0010] [5] Embodiment 5 of the present invention is a molded product assembly in any one of embodiments 2 to 4, wherein the molded product is a molded product assembly comprising a reinforcing member attached to the wiring layer so as to face the connecting portion.

[0011] [6] Embodiment 6 of the present invention is a molded product assembly in any one of embodiments 2 to 5, wherein the wiring layer comprises a first insulating layer on which the conductive layer is provided, and the conductive layer comprises a pair of first conductive patterns arranged on the first insulating layer so as to correspond to the pair of molded parts, and a second conductive pattern arranged on the first insulating layer so as to correspond to the connecting part and connecting the pair of conductive patterns.

[0012] [7] Embodiment 7 of the present invention is a molded product assembly in any one of embodiments 1 to 6, wherein the wiring layer comprises a first insulating layer on which the conductive layer is provided, and a second insulating layer superimposed on the first insulating layer so as to cover the conductive layer, the second insulating layer having a second opening facing the first opening, and the conductive layer having a connecting portion exposed from the second opening.

[0013] [8] Embodiment 8 of the present invention is a molded product comprising a film-like substrate and a wiring layer held on the substrate, wherein the substrate has a convex cross-sectional shape and comprises a pair of molded parts that hold the wiring layer outward and a connecting part that connects the pair of molded parts, the substrate is bent around the connecting part and the pair of molded parts face each other.

[0014] [9] Embodiment 9 of the present invention is a method for manufacturing a molded article assembly, comprising: a first step of preparing a molded article; a second step of preparing a housing having a first opening; and a third step of housing the molded article in a housing space of the housing, wherein the first step includes a fourth step of preparing a wiring layer having a conductive layer and a film-like substrate holding the wiring layer; and a fifth step of deforming the substrate into a three-dimensional shape having an annular cross-sectional shape such that the wiring layer is located on the outside of the substrate, and the third step includes exposing a part of the conductive layer through the first opening.

[0015]

[10] Embodiment 10 of the present invention is a method for manufacturing a molded product assembly according to Embodiment 9, wherein the fifth step is a sixth step of forming a pair of molded parts having a convex cross-sectional shape on the substrate such that the wiring layer is located on the outside of the substrate, and a seventh step of bending the substrate around a connecting part that connects the pair of molded parts to bring the pair of molded parts facing each other.

[0016]

[11] Embodiment 11 of the present invention is a method for manufacturing a molded article assembly according to Embodiment 10, wherein the fifth step is an eighth step of joining adjacent portions in the pair of molded parts.

[0017]

[12] Embodiment 12 of the present invention is a method for manufacturing a molded product assembly according to Embodiment 10 or 11, wherein the sixth step is to press the substrate against a pair of shaping portions provided in a mold to form the pair of molded portions.

[0018]

[13] Embodiment 13 of the present invention is a method for manufacturing a molded article assembly in any one of embodiments 10 to 12, wherein the fourth step includes preparing a pair of adhesive portions interposed between the substrate and the wiring layer, and the sixth step includes forming the pair of molded portions such that the connecting portion faces the portion between the pair of adhesive portions.

[0019]

[14] Embodiment 14 of the present invention is a method for manufacturing a molded product assembly, in which the fourth step includes preparing a reinforcing member attached to the wiring layer, and the sixth step includes forming the pair of molded parts such that the connecting part faces the reinforcing member.

[0020]

[15] Embodiment 15 of the present invention is a method for manufacturing a molded article assembly in any one of embodiments 9 to 14, wherein the wiring layer comprises a first insulating layer on which the conductive layer is provided, and a second insulating layer having a second opening and superimposed on the first insulating layer so as to cover the conductive layer, the conductive layer comprises a connecting portion exposed from the second opening, and the third step is a method for manufacturing a molded article assembly that includes bringing the second opening to face the first opening.

[0021]

[16] Embodiment 16 of the present invention is a method for manufacturing a molded product comprising: a fourth step of preparing a film-like substrate and a wiring layer held on the substrate; a sixth step of forming a pair of molded portions having a convex cross-sectional shape on the substrate such that the wiring layer is located on the outside of the substrate; and a seventh step of bending the substrate around a connecting portion that connects the pair of molded portions to face the pair of molded portions.

[0022] In this invention, a molded product is housed in a housing that includes a substrate that has been deformed into a three-dimensional shape having an annular cross-sectional shape and that holds the wiring layer on the outside, with a portion of the conductive layer exposed through a first opening in the housing. Furthermore, in this invention, the substrate is deformed into a three-dimensional shape having an annular cross-sectional shape so that the wiring layer is located on the outside of the substrate, and a portion of the conductive layer is exposed through the first opening in the housing when the molded product is housed in the housing. Therefore, in this invention, the conductive layer can be placed inside the molded product assembly, improving the design flexibility of the molded product assembly.

[0023] Figure 1 is a plan view showing a wiring board in an embodiment of the present invention. Figure 2 is a cross-sectional view showing a wiring board in an embodiment of the present invention, and is a cross-sectional view taken along line II-II in Figure 1. Figure 3 is a perspective view showing a molded product assembly in an embodiment of the present invention. Figure 4 is an exploded perspective view showing a molded product assembly in an embodiment of the present invention. Figure 5 is a cross-sectional view showing a molded product assembly in an embodiment of the present invention, and is a cross-sectional view taken along line VV in Figure 3. Figures 6(a) to 6(h) show a method for manufacturing a wiring board in an embodiment of the present invention. Figures 7(a) to 7(d) show a method for manufacturing a molded product in an embodiment of the present invention.

[0024] Embodiments of the present invention will be described below with reference to the drawings.

[0025] Figure 1 is a plan view showing the wiring board 20 in this embodiment. Figure 2 is a cross-sectional view showing the wiring board 20 in this embodiment, and is a cross-sectional view taken along line II-II in Figure 1.

[0026] The wiring board 20 in this embodiment is a moldable wiring board that is formed into a predetermined three-dimensional shape by thermoforming. As shown in Figures 1 and 2, the wiring board 20 comprises a substrate 30, adhesive portions 40A and 40B, a wiring layer 50, and a reinforcing member 60.

[0027] The substrate 30 is a thermoformable resin film. While not particularly limited, examples of the resin material constituting the substrate 30 include thermoplastic resins that soften at approximately 100°C to 200°C. Specific examples of thermoplastic resins constituting the substrate 30 include, for example, polycarbonate (PC), acrylonitrile butadiene styrene (ABS) resin, acrylic resins such as polymethyl methacrylate (PMMA), cyclic olefin resins, polyesters (PEs), and polyarylate (PAR). After heating the substrate 30 to the above-mentioned softening temperature, it is molded into a predetermined three-dimensional shape using a mold, and then solidified while maintaining its three-dimensional shape by cooling.

[0028] The adhesive portions 40A and 40B are adhesive layers interposed between the substrate 30 and the wiring layer 50, and bond the substrate 30 and the wiring layer 50 together. In this embodiment, the adhesive portions 40A and 40B are made of an adhesive resin material. That is, these adhesive portions 40A and 40B are formed by an adhesive. Although not particularly limited, specific examples of the resin material constituting these adhesive portions 40A and 40B include acrylic resins. Alternatively, the adhesive layers 40A and 40B may be formed with an adhesive that hardens with heat or ultraviolet light instead of an adhesive.

[0029] This pair of adhesive portions 40A and 40B are provided on the main surface 301 of the substrate 30 with a gap between them. As will be described later, this main surface 301 of the substrate 30 becomes the outer surface of the substrate 30 when the wiring board 20 is thermoformed to form the molded product 10.

[0030] Specifically, one adhesive portion 40A is located in one first region 303A of the substrate 30, while the other adhesive portion 40B is located in the other first region 303B of the substrate 30. Here, one first region 303A is the region of the substrate 30 that becomes one molded portion 31A (described later) by thermoforming, and the other first region 303B is the region of the substrate 30 that becomes the other molded portion 31B (described later) by thermoforming.

[0031] A gap 41 is formed between this pair of adhesive portions 40A and 40B. The second region 304 between the first regions 303A and 303B faces this gap 41. This second region 304 is the region that will become the connecting portion 32 (described later) of the substrate 30 by thermoforming.

[0032] The wiring layer 50 is held to the substrate 30 via adhesive portions 40A and 40B. This wiring layer 50 comprises a resist layer 51, a conductive layer 52, and a resist layer 53. The resist layer 51 corresponds to an example of the "first insulating layer" in an embodiment of the present invention, and the resist layer 53 corresponds to an example of the "second resist layer" in an embodiment of the present invention.

[0033] In this embodiment, the wiring layer 50 comprises only one conductive layer 52, but the wiring layer 50 may comprise multiple conductive layers 52. That is, the wiring layer 50 may have a multilayer wiring structure. Also, although not shown in the figures, the wiring layer 50 may comprise a tail portion that electrically connects the conductive layer 52 to external equipment or other wiring terminals.

[0034] The resist layer 51 is superimposed on the adhesive portions 40A and 40B. This resist layer 51 is composed of a resist material. While not particularly limited, specific examples of materials constituting the resist layer 51 include urethane acrylate resin, polyester resin, polyurethane resin, acrylic resin, and silicone resin. In addition to the resist material, the resist layer 51 may also contain talc or silica.

[0035] The resist layer 51 comprises a pair of third regions 511A and 511B and a fourth region 512. The pair of third regions 511A and 511B are provided on a pair of adhesive portions 40A and 40B, respectively. The fourth region 512 corresponds to the second region 304 of the substrate 30 and connects the pair of third regions 511A and 511B. The width W of this fourth region 512 is... ２ The width W of the third region 511A, 511B is １ It is smaller than (W ２ <W １ ), slits 513A and 513B are formed between the third regions 511A and 511B. Note that the resist layer 51 does not necessarily have to have slits 513A and 513B.

[0036] The conductive layer 52 is provided on the resist layer 51. This conductive layer 52 comprises conductive particles and a binder in which the conductive particles are dispersed, and is stretchable. The stretchability of the conductive layer 52 is imparted to this binder because it is made of a stretchable material.

[0037] It is preferable to use an elastomer as the binder. Examples of elastomers that can be used include acrylic rubber, urethane rubber, nitrile rubber, silicone rubber, fluororubber, or composites of two or more of these. Furthermore, as conductive particles, metallic materials consisting of metals such as gold, silver, platinum, ruthenium, lead, tin, zinc, bismuth, or alloys thereof, or nonmetallic materials such as carbon can be used. The conductive particles are preferably in the form of flakes or an irregular shape.

[0038] The conductive layer 52 may also comprise a flexible resin, although this is not particularly limited. This flexible resin has a granular shape and is dispersed in the binder. Examples of materials that constitute this flexible resin include those similar to the binder material described above. For example, the binder and the flexible resin may be made of the same material. In this case, a plasticizer or the like is added to the flexible resin to make it softer than the binder resin.

[0039] The conductive layer 52 comprises a pair of first conductive patterns 521A and 521B and a second conductive pattern 522. The pair of first conductive patterns 521A and 521B are provided in a pair of third regions 511A and 511B of the resist layer 51, respectively. The second conductive pattern 522 is provided in a fourth region 512 of the resist layer 51.

[0040] The pair of first conductive patterns 521A and 521B each include, for example, linearly extending wiring and circular connecting portions 521C and 521D. The second conductive pattern 522 also includes, for example, linearly extending wiring. The pair of first conductive patterns 521A and 521B are connected via this second conductive pattern 522.

[0041] The pattern shapes of the conductive patterns 521A, 521B, and 522 are not particularly limited to the example shown in Figure 1, and can be any shape. Furthermore, the pattern shape of one first conductive pattern 521A and the pattern shape of the other first conductive pattern 521B may be different from each other.

[0042] Furthermore, the planar shapes of the connecting portions 521C and 521D are not particularly limited to those described above. For example, the connecting portions 521C and 521D may have a belt-like planar shape. Alternatively, the connecting portions 521C and 521D may have a comb-tooth planar shape. The number of connecting portions 521C (521D) included in one first conductive pattern 521A (521B) is also not particularly limited to the above, and one first conductive pattern 521A (521B) may include a plurality of connecting portions 521C (521D). In addition, the position of the connecting portion 521C (521D) in the first conductive pattern 521A (521B) is also not particularly limited to the above. In one first conductive pattern 521A (521B), a plurality of connecting portions 521C (521D) may be provided so as to face each other.

[0043] The resist layer 53 is superimposed on the resist layer 51 so as to cover the conductive layer 52. This resist layer 53 has the same planar shape as the resist layer 51. In the present embodiment, the resist layer 53 has circular openings 531A and 531B at positions corresponding to the connecting portions 521C and 521D of the conductive layer 52. The connecting portions 521C and 521D are exposed from the resist layer 53 via the openings 531A and 531B. Although not particularly limited, examples of the material constituting the resist layer 53 include the same resin materials as those constituting the resist layer 51 described above. The openings 531A and 531B correspond to an example of the "second opening" in the aspect of the present invention.

[0044] It should be noted that the planar shape of the resist layer 53 may be different from the planar shape of the resist layer 51. In addition, the shape, number, and position of the openings 531A and 531B are not particularly limited to the above, and can be set according to the connecting portions 521C and 521D of the conductive layer 52.

[0045] The reinforcing member 60 is an adhesive film including a base material and an adhesive layer superimposed on one main surface of the base material. The base material is a film-shaped substrate. Specific examples of the material constituting this base material include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyester, and the like. Further, specific examples of the resin material constituting the adhesive layer include acrylic resins and the like.

[0046] The reinforcing member 60 is affixed to the resist layer 51 of the wiring layer 50. Specifically, the reinforcing member 60 is affixed to a fourth region 512 of the resist layer 51, and faces a second region 304 of the substrate 30 via a gap 41 between adhesive portions 40A and 40B.

[0047] Figure 3 is a perspective view showing the molded product assembly 1 according to the present embodiment, and Figure 4 is an exploded perspective view showing the molded product assembly 1 according to the present embodiment. Further, Figure 5 is a cross-sectional view showing the molded product assembly 1 according to the present embodiment, which is a cross-sectional view taken along line V-V in Figure 3.

[0048] As shown in Figures 3 to 5, the molded product assembly 1 includes a molded product 10 and a housing 80. Although not particularly limited, the molded product assembly 1 can be used, for example, as a module component mounted in automobiles or home appliances. Note that the application of the molded product assembly 1 is not particularly limited thereto.

[0049] The molded product 10 shown in Figures 4 and 5 is produced by thermoforming the wiring board 20 described above. This molded product 10 includes the thermoformed wiring board 20 and a joint portion 70. Note that the molded product 10 may not include the joint portion 70.

[0050] When the wiring board 20 is thermoformed, the substrate 30 includes a pair of molded portions 31A, 31B and a connecting portion 32. The pair of molded portions 31A, 31B are portions obtained by thermoforming first regions 303A, 303B of the substrate 30. The pair of molded portions 31A, 31B each have a semi-cylindrical shape. In these molded portions 31A, 31B, the wiring layer 50 is located on the outer side relative to the substrate 30. The connecting portion 32 is a portion corresponding to the second region 304 of the substrate 30. The connecting portion 32 connects the pair of molded portions 31A, 31B.

[0051] The substrate 30 is bent around the connecting portion 32, and a pair of molded portions 31A and 31B face each other. Therefore, the molded product 10 has a cylindrical shape overall and is provided with a wiring layer 50 on its outer surface. The connecting portions 521C and 521D of the conductive layer 52 are exposed from the resist layer 53 toward the radially outward direction of the molded product 10 through openings 531A and 531B in the resist layer 53.

[0052] Furthermore, as long as the pair of molded parts 31A and 31B have a convex cross-sectional shape, the shape of the molded parts 31A and 31B is not particularly limited to those described above. For example, the molded parts 31A and 31B may have a hemispherical shape, and the molded product 10 as a whole may have a spherical shape. Alternatively, the molded parts 31A and 31B may have a rectangular convex cross-sectional shape, and the molded product 10 as a whole may have a prismatic shape. Alternatively, the molded parts 31A and 31B may have a rectangular convex cross-sectional shape, and the molded product 10 as a whole may have a box shape.

[0053] The joint 70 joins the parts of the molded parts 31A and 31B that are in close proximity to each other. When the molded product 10 is cylindrical, the parts of the molded parts 31A and 31B that are in close proximity to each other are, for example, the ends of the molded parts 31A and 31B opposite to the ends to which the connecting part 32 is connected. When the molded product 10 is spherical, the parts of the molded parts 31A and 31B that are in close proximity to each other are, for example, the parts of the hemispherical molded parts 31A and 31B excluding the parts to which the connecting part 32 is connected.

[0054] A specific example of this joint 70 is an adhesive joint where adjacent parts of the molded parts 31A and 31B are bonded to each other. Although not particularly limited, specific examples of adhesives constituting this adhesive joint include epoxy adhesives, acrylic adhesives, and the like.

[0055] The joint 70 may be formed by fusing adjacent parts of the molded parts 31A and 31B. Alternatively, the joint 70 may be formed by mechanically fixing adjacent parts of the molded parts 31A and 31B with pins or hooks.

[0056] As shown in Figures 3 to 5, the housing 80 is a molded product formed, for example, by injection molding, and is made of a resin material. Alternatively, the housing 80 may be made of a metal material instead of resin. The housing 80 has a cylindrical shape with a housing space 81. The housing 80 has an inner diameter larger than the outer diameter of the molded product 10, and the molded product 10 is housed within the housing space 81. A wiring pattern may be provided on the outer surface of the housing 80.

[0057] Furthermore, the shape of the housing 80 is not particularly limited as long as it can accommodate the molded product 10. For example, if the molded product 10 is spherical, the housing 80 may also have a spherical shape that can accommodate the molded product 10. Alternatively, if the molded product 10 is prism-shaped, the housing 80 may also have a prism-shaped shape that can accommodate the molded product 10. Alternatively, if the molded product 10 is box-shaped, the housing 80 may also have a box-shaped shape that can accommodate the molded product 10.

[0058] Although not specifically shown in the diagram, the molded product 10 housed in the housing 80 is fixed to the housing 80 by pins. The method of fixing the molded product 10 to the housing 80 is not limited to this. For example, the molded product 10 and the housing 80 may be fixed by adhesive. Alternatively, the molded product 10 and the housing 80 may be fixed by hooks.

[0059] Furthermore, the housing 80 has openings 82A and 82B. These openings 82A and 82B are positioned to correspond to the openings 531A and 531B of the molded product 10 housed within the housing 80. These openings 82A and 82B penetrate the wall surface of the housing 80 in the thickness direction. The connecting portions 521C and 521D of the molded product 10 are exposed from the housing 80 through these openings 82A and 82B.

[0060] Next, the manufacturing method of the molded product assembly 1 described above will be explained with reference to Figures 3 to 5, as well as Figures 6(a) to 7(d). Figures 6(a) to 6(h) show the manufacturing method of the wiring board 20 in this embodiment, and Figures 7(a) to 7(d) show the manufacturing method of the molded product 10 in this embodiment.

[0061] In this embodiment, after manufacturing the wiring board 20 by the method shown in Figures 6(a) to 6(h), the molded product 10 is manufactured by applying the processing shown in Figures 7(a) to 7(d) to the wiring board 20.

[0062] First, a transfer film 100 is prepared as shown in Figure 6(a). This transfer film 100 is a resin film that has been treated with a release agent. While not particularly limited, specific examples of resin materials that make up the resin film include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), and polystyrene (PS).

[0063] Specific examples of mold release treatment include, for instance, a method in which a mold release agent is applied to a resin film and the mold release agent is dried to form a release layer on the resin film. Specific examples of such mold release agents include, for example, silicone-based mold release agents and fluorine-based mold release agents.

[0064] Next, as shown in Figure 6(b), a resist layer 53 is formed on the transfer film 100. This resist layer 53 is formed by applying a resist material onto the transfer film 100 and curing it. At this time, openings 531A and 531B are formed in the resist layer 53.

[0065] The method for coating the resist material is not particularly limited, but either a contact coating method or a non-contact coating method may be used. Specific examples of contact coating methods include screen printing, gravure printing, offset printing, gravure offset printing, and flexographic printing. On the other hand, specific examples of non-contact coating methods include inkjet printing, spray coating, dispensing, and jet dispensing.

[0066] Furthermore, specific examples of curing methods for resist materials include irradiation with energy rays such as ultraviolet or infrared laser light, heating, heating and cooling, and drying. When heating is used as the curing method, for example, the resist layer 53 can be formed by heating the resist material to 80°C to 150°C using a far-infrared heating furnace (IR furnace).

[0067] Next, as shown in Figure 6(c), a conductive layer 52 is formed on the resist layer 53. This conductive layer 52 is formed by applying a conductive paste onto the resist layer 53 and curing it. At this time, the conductive paste fills the openings 531A and 531B of the resist layer 53, thereby forming the connection portions 521C and 521D of the conductive layer 52.

[0068] Specific examples of conductive pastes include those composed of conductive particles, a binder, water or a solvent, and various additives. Specific examples of solvents included in conductive pastes include butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, dipropylene glycol monobutyl ether, diethylene glycol monoethyl ether, cyclohexanone, isophorone, and terpineol.

[0069] The method of applying the conductive paste is not particularly limited, but either a contact application method or a non-contact application method may be used. Specific examples of contact application methods include screen printing, gravure printing, offset printing, gravure offset printing, and flexographic printing. On the other hand, specific examples of non-contact application methods include inkjet printing, spray application, dispensing application, and jet dispensing.

[0070] Furthermore, the heat source for curing the conductive paste is not particularly limited, but examples include electric ovens, infrared ovens, far-infrared (IR) furnaces, near-infrared (NIR) furnaces, and laser irradiation devices, and a combination of these heat treatments may also be used.

[0071] Next, as shown in Figure 6(d), a resist layer 51 is formed on the resist layer 53 so as to cover the conductive layer 52. This resist layer 51 is formed in the same way as the resist layer 53 described above, by applying a resist material onto the resist layer 53 and curing it. The method for applying and curing the resist material can be the same as the method for the resist layer 53 described above. The wiring layer 50 is formed by going through the steps shown in Figures 6(a) to 6(d) above.

[0072] Next, as shown in Figure 6(e), the reinforcing member 60 is attached to the resist layer 51. At this time, the reinforcing member 60 is placed on top of the fourth region 512 of the resist layer 51 (see Figures 1 and 2).

[0073] Next, as shown in Figure 6(f), adhesive is placed on the resist layer 51 to form adhesive portions 40A and 40B. At this time, the adhesive is placed on the resist layer 51 so that the adhesive portions 40A and 40B overlap with the third regions 511A and 511B of the resist layer 51 (see Figures 1 and 2). As a result, the reinforcing member 60 is sandwiched between the pair of adhesive portions 40A and 40B, and a gap 41 is formed between the pair of adhesive portions 40A and 40B.

[0074] Next, as shown in Figure 6(g), the substrate 30 is attached to the adhesive portions 40A and 40B.

[0075] Next, as shown in Figure 6(h), the transfer film 100 is peeled off from the resist layer 53.

[0076] The wiring board 20 is manufactured by going through the steps shown in Figures 6(a) to 6(h) above. The steps shown in Figures 6(a) to 6(h) correspond to an example of the "fourth step" in an embodiment of the present invention.

[0077] Furthermore, a wiring board 20 having a multilayer wiring structure may be manufactured by repeating the steps in Figures 6(c) and 6(d). Alternatively, another laminate 25 (a laminate consisting of adhesive parts 40A, 40B, a wiring layer 50, a reinforcing member 60, and a transfer film 100) may be prepared by going through Figures 6(a) to 6(f), and the wiring board 20 may be made into a double-sided wiring board by attaching this laminate 25 to the main surface 302 on the substrate 30 opposite to the main surface 301.

[0078] The molded product 10 is produced by applying the processes shown in Figures 7(a) to 7(d) to the wiring board 20 manufactured as described above.

[0079] First, as shown in Figures 7(a) and 7(b), the wiring board 20 is thermoformed using a mold 200 and a heater 300. The process shown in Figures 7(a) and 7(b) corresponds to an example of the "sixth step" in an embodiment of the present invention. The mold 200 is equipped with a pair of shaping parts 210A and 210B. These shaping parts 210A and 210B each have a concave shape corresponding to a semicylinder. This pair of shaping parts 210A and 210B extend parallel to each other.

[0080] Specifically, the wiring board 20 is placed between the mold 200 and the heater 300. In this case, the wiring layer 50 is positioned close to the mold 200 with respect to the substrate 30. Also, the first conductive patterns 521A, 521B, the third regions 511A, 511B of the resist layer 51, the adhesive portions 40A, 40B, and the first regions 303A, 303B of the substrate 30 are positioned opposite the shaping portions 210A, 210B. Furthermore, the second conductive pattern 522, the fourth region 512 of the resist layer 51, the reinforcing member 60, the gap 41, and the second region 304 of the substrate 30 are positioned opposite the portion of the mold 200 between the shaping portions 210A, 210B. Then, after heating the wiring board 20 with the heater 300 to a temperature at which the substrate 30 softens, a vacuum is created between the shaping parts 210A, 210B and the wiring board 20, and the wiring board 20 is pressed against the shaping parts 210A, 210B.

[0081] In this case, since a gap 41 is formed between the pair of adhesive portions 40A and 40B, stretching of the conductive layer 52 by the adhesive portions 40A and 40B can be suppressed, and the rupture of the conductive layer 52 can be suppressed. Furthermore, since the reinforcing member 60 is attached to the fourth region 512 of the resist layer 51, the rupture of the conductive layer 52 can be further suppressed.

[0082] Then, by cooling the wiring board 20 and fixing the shape of the substrate 30, molded portions 31A and 31B are formed on the substrate 30. In these molded portions 31A and 31B, the wiring layer 50 is located on the outside relative to the substrate 30. In this state, the connecting portion 32 between the molded portions 31A and 31B faces the portion between the adhesive portions 40A and 40B, and also faces the reinforcing member 60.

[0083] In addition, as a method for thermoforming the wiring board 20, pressure forming, plug-assisted forming, or hot press forming may be used instead of the vacuum forming described above. Furthermore, the shapes of the shaped portions 210A and 210B are not particularly limited to those described above, and only need to have shapes corresponding to the molded portions 31A and 31B.

[0084] Next, as shown in Figure 7(c), the unnecessary portion of the substrate 30 is cut off to trim the outer shape of the molded product 10 to match the outer shape of the product.

[0085] Next, as shown in Figure 7(d), the substrate 30 is bent around the connecting portion 32 so that the pair of molded portions 31A and 31B face each other. Specifically, the substrate 30 is bent 180 degrees around the connecting portion 32 so that one molded portion 31A is rotated 90 degrees counterclockwise in the figure, and the other molded portion 31B is rotated 90 degrees clockwise in the figure. The steps shown in Figures 7(a) to 7(d) correspond to an example of the "fifth step" in an embodiment of the present invention, and the step shown in Figure 7(d) corresponds to an example of the "seventh step" in an embodiment of the present invention.

[0086] In this case, since a gap 41 is formed between the pair of adhesive portions 40A and 40B in the wiring board 20 before thermoforming (see Figure 2), the wiring layer 50 can be left unrestrained with respect to the greatly bent connecting portion 32, thereby suppressing the rupture of the conductive layer 52 when the substrate 30 is bent. Furthermore, since the reinforcing member 60 is attached to the fourth region 512 of the resist layer 51, the rupture of the conductive layer 52 when the substrate 30 is bent can be further suppressed. In addition, since the resist layer 51 has slits 513A and 513B, the substrate 30 is made easier to bend at the connecting portion 32.

[0087] Next, the adjacent parts of the molded parts 31A and 31B are bonded together with an adhesive to form a joint 70 (see Figures 3 to 5). This step corresponds to an example of the "eighth step" in an embodiment of the present invention.

[0088] A cylindrical molded product 10 is manufactured by going through the steps shown in Figures 6(a) to 7(d) above. The steps shown in Figures 6(a) to 7(d) correspond to an example of the "first step" in an embodiment of the present invention.

[0089] Next, as shown in Figure 4, the housing 80 is prepared. This step corresponds to an example of the "second step" in an embodiment of the present invention.

[0090] Next, the molded product 10 is inserted into the housing space 81 of the housing 80. This step corresponds to an example of the "third step" in an embodiment of the present invention. At this time, the openings 531A and 531B of the molded product 10 are positioned opposite the openings 82A and 82B of the housing 80, and the connecting portions 521C and 521D of the molded product 10 are exposed from the housing 80 through the openings 82A and 82B of the housing 80.

[0091] As described above, in this embodiment, a molded product 10 is housed in a housing 80, which has a substrate 30 that is deformed into a three-dimensional shape having an annular cross-sectional shape and holds the wiring layer 50 on the outside, and the connection portions 521C and 521D of the conductive layer 52 are exposed through the openings 82A and 82B of the housing 80. In addition, in this embodiment, the substrate 30 is deformed into a three-dimensional shape having an annular cross-sectional shape so that the wiring layer 50 is located on the outside of the substrate 30, and when the molded product 10 is housed in the housing 80, the connection portions 521C and 521D of the conductive layer 52 are exposed through the openings 82A and 82B of the housing 80. For this reason, in this embodiment, the conductive layer 52 can be placed inside the molded product assembly 1, which improves the design freedom of the molded product assembly 1.

[0092] For example, by providing an electrode pattern on the conductive layer 52 of the molded product 10, the function of a capacitive sensor can be added to the inside of the molded product assembly 1. Furthermore, by mounting components such as shorting bars, metal domes, or sliders on the outer surface of the housing 80 so that they face the openings 82A and 82B, the function of a switch can be added to the molded product assembly 1. In other words, by increasing the design flexibility of the molded product assembly 1, the functionality of the product can be enhanced.

[0093] Furthermore, in this embodiment, since the pair of adhesive portions 40A and 40B are arranged on the substrate 30 such that the gap 41 faces the connecting portion 32 of the substrate 30, it is possible to suppress the rupture of the conductive layer 52 when the wiring board 20 is thermoformed or when the wiring board 20 is bent.

[0094] Furthermore, in this embodiment, since the reinforcing member 60 is attached to the wiring layer 50 so as to face the connecting portion 32, it is possible to further suppress the rupture of the conductive layer 52 when the wiring board 20 is thermoformed or when the wiring board 20 is bent.

[0095] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit it. Therefore, each element disclosed in the above embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0096] 1…Molded product assembly 10…Molded product 20…Wiring board 25…Laminate 30…Substrate 301, 302…Main surface 303A, 303B…First region 304…Second region 31A, 31B…Molded part 32…Connecting part 40A, 40B…Adhesive part 41…Gap 50…Wiring layer 51…Resist layer 511A, 511B…Third region 512…Fourth region 513A, 513B…Slit 52…Conductive layer 521A, 521B…First conductive pattern 521C, 521D…Connection part 522…Second conductive pattern 53…Resist layer 531A, 531B…Opening 60…Reinforcement member 70…Joint part 80…Housing 81…Housing space 82A, 82B…Opening 100...Transfer film 200...Mold 210A, 210B...Shaping parts 300...Heater

Claims

1. A molded product assembly comprising a molded product and a housing having a housing space for housing the molded product, wherein the molded product comprises a wiring layer having a conductive layer and a film-like substrate that is deformed into a three-dimensional shape having an annular cross-sectional shape and holds the wiring layer to the outside, and the housing has a first opening that exposes a part of the conductive layer.

2. A molded product assembly according to claim 1, wherein the substrate comprises a pair of molded parts having a convex cross-sectional shape and a connecting part connecting the pair of molded parts, the substrate is bent around the connecting part and the pair of molded parts face each other.

3. A molded article assembly according to claim 2, wherein the molded article is a molded article assembly comprising a joint that joins portions that are in close proximity to each other in the pair of molded parts.

4. A molded article assembly according to claim 2 or 3, wherein the molded article comprises a pair of adhesive portions interposed between the substrate and the wiring layer, and the gap between the pair of adhesive portions is opposite to the connecting portion.

5. A molded article assembly according to any one of claims 2 to 4, wherein the molded article comprises a reinforcing member attached to the wiring layer so as to face the connecting portion.

6. A molded article assembly according to any one of claims 2 to 5, wherein the wiring layer comprises a first insulating layer on which the conductive layer is provided, and the conductive layer comprises a pair of first conductive patterns disposed on the first insulating layer so as to correspond to the pair of molded portions, and a second conductive pattern disposed on the first insulating layer so as to correspond to the connecting portion and connecting the pair of conductive patterns.

7. A molded article assembly according to any one of claims 1 to 6, wherein the wiring layer comprises a first insulating layer on which the conductive layer is provided, and a second insulating layer superimposed on the first insulating layer so as to cover the conductive layer, the second insulating layer having a second opening facing the first opening, and the conductive layer having a connecting portion exposed from the second opening.

8. A molded product comprising a film-like substrate and a wiring layer held on the substrate, wherein the substrate has a convex cross-sectional shape and comprises a pair of molded parts that hold the wiring layer outward and a connecting part that connects the pair of molded parts, the substrate is bent around the connecting part and the pair of molded parts face each other.

9. A method for manufacturing a molded product assembly, comprising: a first step of preparing a molded product; a second step of preparing a housing having a first opening; and a third step of housing the molded product in a housing space of the housing, wherein the first step includes: a fourth step of preparing a wiring layer having a conductive layer and a film-like substrate holding the wiring layer; and a fifth step of deforming the substrate into a three-dimensional shape having an annular cross-sectional shape such that the wiring layer is located on the outside of the substrate, and the third step includes exposing a part of the conductive layer through the first opening.

10. A method for manufacturing a molded article assembly according to claim 9, wherein the fifth step is a sixth step of forming a pair of molded parts having a convex cross-sectional shape on the substrate such that the wiring layer is located on the outside of the substrate, and a seventh step of bending the substrate around a connecting part that connects the pair of molded parts to face the pair of molded parts.

11. A method for manufacturing a molded article assembly according to claim 10, wherein the fifth step includes an eighth step of joining portions of the pair of molded parts that are in close proximity to each other.

12. A method for manufacturing a molded article assembly according to claim 10 or 11, wherein the sixth step includes forming the pair of molded parts by pressing the substrate against a pair of shaping parts provided in a mold.

13. A method for manufacturing a molded article assembly according to any one of claims 10 to 12, wherein the fourth step includes preparing a pair of adhesive portions interposed between the substrate and the wiring layer, and the sixth step includes forming the pair of molded portions such that the connecting portion faces the portion between the pair of adhesive portions.

14. A method for manufacturing a molded article assembly according to any one of claims 10 to 13, wherein the fourth step includes preparing a reinforcing member attached to the wiring layer, and the sixth step includes forming the pair of molded parts such that the connecting part faces the reinforcing member.

15. A method for manufacturing a molded article assembly according to any one of claims 9 to 14, wherein the wiring layer comprises a first insulating layer on which the conductive layer is provided, and a second insulating layer having a second opening and superimposed on the first insulating layer so as to cover the conductive layer, the conductive layer comprises a connecting portion exposed from the second opening, and the third step comprises bringing the second opening to face the first opening.

16. A method for manufacturing a molded product, comprising: a fourth step of preparing a film-like substrate and a wiring layer held on the substrate; a sixth step of forming a pair of molded portions having a convex cross-sectional shape on the substrate such that the wiring layer is located on the outside of the substrate; and a seventh step of bending the substrate around a connecting portion that connects the pair of molded portions to bring the pair of molded portions facing each other.

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