Method for determining authenticity of electronic component packaging tape, carrier tape, and electronic component packaging tape

Abstract

The present inventions provides: a method for determining the authenticity of electronic component packaging tape which makes it possible to easily distinguish between an imitation product and a genuine product; a carrier tape; and an electronic component packaging tape.　Provided is a method for determining the authenticity of electronic component packaging tape 1 that is provided with a long carrier tape 80 in which a plurality of accommodation sections 1a are provided along the lengthwise direction, at least one cover tape (40, 50) which is provided so as to cover the accommodation sections 1a, and a plurality of electronic components 100 which are respectively accommodated in the plurality of accommodation sections 1a, wherein: the carrier tape 80 has a first base material 10 and a second base material 20 joined to the first base material 10; an authenticity determination mark 91 is provided between the first base material 10 and the second base material 20; and authenticity is determined by pulling apart the joined part of the first base material 10 and the second base material 20 and confirming the authenticity determination mark 91.

Description

Method for Authenticity Determination of Electronic Component Packaging Tape, Carrier Tape, and Electronic Component Packaging Tape

[0001] The present disclosure relates to a method for authenticity determination of electronic component packaging tape, a carrier tape, and an electronic component packaging tape.

[0002] As packaging forms for electronic components, an elongated electronic component packaging tape compatible with mounters for automatic mounting, and a carrier tape constituting the electronic component packaging tape are known (see, for example, Patent Document 1). The electronic component packaging tape includes a carrier tape having a plurality of accommodating portions arranged at equal intervals in the longitudinal direction, and a cover tape attached to the carrier tape so as to cover openings of the plurality of accommodating portions. An electronic component is accommodated in each of the plurality of accommodating portions.

[0003] Japanese Unexamined Patent Publication No. 10-218281

[0004] However, electronic components accommodated in electronic component packaging tapes are often very small, and it may sometimes be difficult to easily confirm whether the accommodated components are genuine. Therefore, conventionally, even if counterfeit products that are not genuine are accommodated in an electronic component packaging tape, it has not been possible to determine whether they are counterfeit, and there has been a risk that low-reliability counterfeit electronic components would be distributed in the market.

[0005] An object of the present disclosure is to provide a method for authenticity determination of an electronic component packaging tape, a carrier tape, and an electronic component packaging tape that can easily distinguish counterfeit products from genuine products.

[0006] A first disclosure is a method for authenticity determination of an electronic component packaging tape, the electronic component packaging tape comprising: an elongated carrier tape having a plurality of accommodating portions provided along a longitudinal direction; at least one layer of cover tape provided to cover the accommodating portions; and a plurality of electronic components (100) respectively accommodated in the plurality of accommodating portions, wherein the carrier tape includes a first base material and a second base material joined to the first base material, an authenticity determination mark is provided between the first base material and the second base material, and authenticity determination is performed by tearing a joint between the first base material and the second base material to check the authenticity determination mark.

[0007] Another disclosure is a long carrier tape having a plurality of housing sections (1a) for housing a plurality of electronic components provided along its longitudinal direction, comprising a first substrate and a second substrate directly or indirectly joined to the first substrate, wherein an authenticity mark is provided between the first substrate and the second substrate.

[0008] The carrier tape, and other disclosures, include an electronic component packaging tape comprising at least one layer of cover tape provided to cover the housing portion, and a plurality of electronic components housed in each of the plurality of housing portions.

[0009] According to this disclosure, it is possible to provide a method for determining the authenticity of electronic component packaging tape, a carrier tape, and electronic component packaging tape that can easily distinguish between counterfeit and genuine products.

[0010] This figure shows the electronic component packaging tape 1 of the first embodiment. This is a cross-sectional view of the electronic component packaging tape 1 cut at the position of arrow A-A in Figure 1. This figure shows part of the manufacturing process of the carrier tape 80 equipped with a genuineness determination mark 91. This figure illustrates the method for determining the genuineness of the electronic component packaging tape 1. This figure shows the electronic component packaging tape 1B of the second embodiment. This is a cross-sectional view of the electronic component packaging tape 1B cut at the position of arrow B-B in Figure 5. This figure shows part of the manufacturing process of the carrier tape 80B equipped with a genuineness determination mark 92.

[0011] The following describes one embodiment for implementing this disclosure with reference to drawings and other documents.

[0012] (First Embodiment) Figure 1 is a diagram showing the electronic component packaging tape 1 of the first embodiment. In Figure 1, each of the laminated layers is partially omitted to show the layer located in the lower layer. Figure 2 is a cross-sectional view of the electronic component packaging tape 1 cut at the position of arrow A-A in Figure 1. Note that the following diagrams, including Figures 1 and 2, are schematic diagrams, and the size and shape of each part are exaggerated or omitted as appropriate to facilitate understanding. In the following description, specific numerical values, shapes, materials, etc. will be shown and explained, but these can be changed as appropriate. In this specification, the terms sheet, film, etc. are used, but in general usage, they are used in the order of sheet, film, in order of increasing thickness, and this specification follows that usage. However, there is no technical significance to this distinction, so these terms can be replaced as appropriate. Also, in this disclosure, transparent means that it transmits at least the wavelength of light to be used. For example, even if it does not transmit visible light, if it transmits infrared light, it will be treated as transparent when used for infrared applications. Furthermore, for convenience, in the following explanation, the front side of Figure 1 (the side from which electronic components are removed in the normal usage scenario) will be referred to as "up" and the back side as "down" to indicate the top and bottom directions. However, the usage of the electronic component packaging tape 1 is not limited to this orientation.

[0013] The electronic component packaging tape 1 of this embodiment is formed in a long (tape-like) shape and has a plurality of storage compartments 1a arranged at equal intervals along its longitudinal direction. These storage compartments 1a are substantially rectangular parallelepiped-shaped spaces for housing electronic components 100. When the top cover tape 50 is not overlapping, the storage compartments 1a have openings that allow for the insertion and removal of electronic components 100.

[0014] Furthermore, the electronic component packaging tape 1 of this embodiment has a plurality of feed holes 1b arranged at equal intervals along its longitudinal direction. These feed holes 1b are provided in a circular shape and are used for transport when electronic components 100 are automatically mounted by a mounter (not shown). The electronic component packaging tape 1 is sometimes referred to as an electronic component string because the electronic components 100 are connected in a string.

[0015] The electronic component packaging tape 1 of this embodiment comprises a first base material 10, a second base material 20, a bonding layer 30, a bottom cover tape 40, and a top cover tape 50. In this embodiment, the top cover tape 50, the first base material 10, the bonding layer 30, the second base material 20, and the bottom cover tape 40 are arranged in this order from the top side (the side shown in Figure 1, and the top side in Figure 2) of the electronic component packaging tape 1. Note that in Figure 1, the bonding layer 30 is hidden beneath the first base material 10, and therefore the illustration of the bonding layer 30 is omitted.

[0016] The first base material 10 is a long, tape-shaped sheet member. The first base material 10 has parts of a plurality of receiving sections 1a arranged at equal intervals along its longitudinal direction. The first base material 10 also has parts of a plurality of feed holes 1b arranged at equal intervals along its longitudinal direction. The material of the first base material 10 is not particularly limited, but resin or paper can be used. In this embodiment, the first base material 10 is made of paper with a thickness of 0.55 mm.

[0017] The second base material 20 is joined to the first base material 10 via a bonding layer 30 and is a long, tape-shaped sheet member, similar to the first base material 10. The second base material 20 has parts of a plurality of receiving sections 1a arranged at equal intervals along its longitudinal direction, similar to the first base material 10. The second base material 20 also has parts of a plurality of feed holes 1b arranged at equal intervals along its longitudinal direction, similar to the first base material 10. The material of the second base material 20 is not particularly limited, but resin or paper can be used. In this embodiment, the second base material 20 is made of paper with a thickness of 0.55 mm, similar to the first base material 10.

[0018] The bonding layer 30 is a layer that joins the first base material 10 and the second base material 20, and is formed in a long, tape-like shape, similar to the first base material 10 and the second base material 20. The bonding layer 30 has parts of a plurality of receiving portions 1a arranged at equal intervals in its longitudinal direction, similar to the first base material 10 and the second base material 20. The bonding layer 30 also has parts of a plurality of feed holes 1b arranged at equal intervals in its longitudinal direction, similar to the first base material 10 and the second base material 20. The bonding layer 30 can be made of, for example, an adhesive or a tack. In this embodiment, the bonding layer 30 can be any resin-based adhesive material, such as an epoxy resin adhesive, a polyurethane resin adhesive, a silicone resin adhesive, or an acrylic resin adhesive.

[0019] The carrier tape 80 is composed of the first base material 10, the second base material 20, and the bonding layer 30. The carrier tape 80 is combined with the bottom cover tape 40 (described later), the electronic component 100, and the top cover tape 50 to form the electronic component packaging tape 1.

[0020] The bottom cover tape 40 is a long (tape-shaped) film material. The bottom cover tape 40 is attached to the lower side (bottom side) of the second substrate 20 so as to cover the openings on the lower side (bottom side) of the multiple housing sections 1a, and so as not to block the feed holes 1b. This allows each electronic component 100 to be placed (housed) in each housing section 1a. The bottom cover tape 40 is attached to the lower side of the second substrate 20 in a removable manner. However, the bottom cover tape 40 may be in a form that is difficult to peel off from the second substrate 20. The material of the bottom cover tape 40 is not particularly limited, but resin or paper can be used. The bottom cover tape 40 has an adhesive layer (not shown), and is attached to the lower side of the second substrate 20 by this adhesive layer.

[0021] The top cover tape 50 is a long (tape-shaped) film material. The top cover tape 50 is attached to the upper surface of the first substrate 10 so as to cover the upper openings of the multiple housing sections 1a and so as not to block the feed holes 1b. By providing the top cover tape 50 together with the bottom cover tape 40, each electronic component 100 is completely housed in each housing section 1a. The top cover tape 50 is attached to the upper surface of the first substrate 10 in a peelable manner. When removing the electronic component 100 with a mounter (not shown), usually only the top cover tape 50 is peeled off from the first substrate 10. The material of the top cover tape 50 is not particularly limited, but resin or paper can be used. The top cover tape 50 has an adhesive layer (not shown), and is attached to the upper surface of the first substrate 10 by this adhesive layer.

[0022] The electronic components 100 are housed in each of the multiple housing sections 1a. Examples of electronic components 100 include various surface-mount electronic components such as multilayer ceramic capacitors using dielectric ceramics, piezoelectric components using piezoelectric ceramics, thermistors using semiconductor ceramics, and inductors using magnetic ceramics, but other types of electronic components may also be used.

[0023] Furthermore, the electronic component packaging tape 1 of this embodiment has a genuineness determination mark 91. The genuineness determination mark 91 is provided between the first base material 10 and the second base material 20 and serves as an indicator that the electronic component packaging tape 1 is a genuine product. Specifically, in this embodiment, the genuineness determination mark 91 is formed by printing on the upper surface of the second base material 20 and is arranged corresponding to each of the multiple storage compartments 1a. In this embodiment, the genuineness determination mark 91 is exemplified as the letter "M", but the specific shape of the genuineness determination mark 91 can be anything. Therefore, the genuineness determination mark 91 can be a string of characters, or a figure, mark, or symbol formed in a unique shape. Also, the genuineness determination mark 91 may or may not include characters. Furthermore, the genuineness determination mark 91 may be composed of a single color or multiple colors. Furthermore, the authenticity determination mark 91 of this embodiment is provided on the upper surface of the second substrate 20 in a form that is visible under visible light when no other layers are overlapping the upper surface of the second substrate 20. In addition to the authenticity determination mark 91, marks indicating manufacturing information and marks indicating identification information may also be provided. Marks indicating identification information may be, for example, barcodes or two-dimensional barcodes.

[0024] Figure 3 shows a part of the manufacturing process for a carrier tape 80 equipped with an authenticity detection mark 91. The authenticity detection mark 91 is pre-printed on the upper surface of the second substrate 20. The specific printing method for printing the authenticity detection mark 91 can be any method, but examples include gravure printing using a gravure plate or inkjet printing. An adhesive or tack agent that will become a bonding layer 30 is applied to the upper surface of the second substrate 20 on which the authenticity detection mark 91 is formed, and the first substrate 10 is bonded to it to form the carrier tape 80. Note that in Figure 3, the structure of the roller part for applying the adhesive or tack agent that will become the bonding layer 30 is shown in a simplified manner. In addition, although not specifically shown, the carrier tape 80 undergoes processes such as cutting to the required width and opening the storage section 1a and feed holes 1b to obtain the final shape of the carrier tape 80. Furthermore, although the example in Figure 3 illustrates the application of the adhesive or adhesive that will form the bonding layer 30 to the upper surface of the second substrate 20, the adhesive or adhesive that will form the bonding layer 30 may also be applied to the lower surface of the first substrate 10, and can be modified as appropriate.

[0025] (Method for determining the authenticity of electronic component packaging tape 1) In the electronic component packaging tape 1 of this embodiment, authenticity can be determined using the authenticity determination mark 91. Here, authenticity determination refers to confirming that the product is a genuine product of the company, and the authenticity determination mark 91 is a mark for confirming that the product is a genuine product of the company. Since the electronic component packaging tape 1 of this embodiment has the authenticity determination mark 91, counterfeit products and genuine products can be accurately and easily distinguished. Specifically, in this embodiment, the authenticity determination is to confirm that the electronic component 100 contained in the electronic component packaging tape 1 is a genuine product. Note that since the authenticity determination mark 91 is provided on the carrier tape 80 before the electronic component 100 is contained in it, it may also be used to determine the authenticity of the carrier tape 80.

[0026] The following describes a method for determining the authenticity of the electronic component packaging tape 1. Figure 4 is a diagram illustrating the method for determining the authenticity of the electronic component packaging tape 1. When determining the authenticity of the electronic component packaging tape 1 in this embodiment, the joint between the first base material 10 and the second base material 20 (in this embodiment, the joint layer 30) is peeled off and the presence or absence of the authenticity determination mark 91 is visually checked. If the authenticity determination mark 91 can be confirmed, it can be confirmed that the electronic component 100 contained in the electronic component packaging tape 1 is a genuine product. On the other hand, if the authenticity determination mark 91 cannot be confirmed, it can be confirmed that the electronic component 100 contained in the electronic component packaging tape 1 is a counterfeit product. In conventional electronic component packaging tapes, the carrier tape is made up of a single sheet or film material. Therefore, even if a malicious third party obtains a genuine electronic component packaging tape 1, it is difficult for them to notice that the carrier tape 80 is made up of multiple layers. Furthermore, it is difficult to know that the authenticity determination mark 91 is provided on the inside of the carrier tape 80, that is, between the first base material 10 and the second base material 20, making it difficult to manufacture counterfeit products.

[0027] If a mark for authenticity determination were to be placed on the surface of the carrier tape, the very act of placing that mark would be easily imitated. In that case, the purpose of using the mark for authenticity determination would be lost. In this embodiment, since the authenticity determination mark 91 is provided on the inside of the carrier tape 80, that is, between the first base material 10 and the second base material 20, it is difficult to imitate, and the authenticity determination mark 91 can be used for authenticity determination.

[0028] In this embodiment, the authenticity mark 91 in the electronic component packaging tape 1 is positioned between the first base material 10 and the second base material 20. Furthermore, the first base material 10 and the second base material 20 in this embodiment are made of paper. Therefore, in normal use, the authenticity mark 91 is not visible, making it difficult to counterfeit.

[0029] Furthermore, in the electronic component packaging tape 1 of this embodiment, the first substrate 10 and the second substrate 20 are joined by the bonding layer 30, so it is desirable that the bonding force of the bonding layer 30 with the first substrate 10 is greater than the bonding force with the second substrate 20. Alternatively, it is desirable that the bonding layer 30 has sufficient transparency to allow the authenticity determination mark 91 to be seen even if it remains on the second substrate 20.

[0030] As described above, with the electronic component packaging tape 1 of this embodiment, the authenticity determination mark 91 is positioned between the first base material 10 and the second base material 20, making it easy to distinguish between counterfeit and genuine products. Furthermore, since the authenticity determination mark 91 is difficult to see under normal use conditions, it is possible to prevent counterfeit products from being marked with a mark similar to the authenticity determination mark 91.

[0031] (Second Embodiment) Figure 5 is a diagram showing the electronic component packaging tape 1B of the second embodiment. In Figure 5, the layers arranged in the same manner as in Figure 1 are partially obscured to show the layers located below. Figure 6 is a cross-sectional view of the electronic component packaging tape 1B cut at the position of arrow B-B in Figure 5. The electronic component packaging tape 1B of the second embodiment differs from the electronic component packaging tape 1 of the first embodiment in that it comprises a third base material 60, and a genuine / counterfeit detection mark 92 is provided on the third base material 60, and consequently comprises a bonding layer 31 and a bonding layer 32. Therefore, parts that perform the same function as in the first embodiment described above are denoted by the same reference numerals, and redundant explanations are omitted as appropriate.

[0032] In the second embodiment, the electronic component packaging tape 1B has the following components arranged in this order from the top side (the side shown in Figure 5, and the top side in Figure 6): top cover tape 50, first base material 10, bonding layer 31, third base material 60, bonding layer 32, second base material 20, and bottom cover tape 40. In other words, the second embodiment differs from the first embodiment in that the first base material 10 and the second base material 20 are indirectly bonded to each other via the third base material 60. Note that in Figure 5, bonding layers 31 and 32 are hidden beneath the first base material 10 and the third base material 60, respectively, and are therefore not shown.

[0033] The third base material 60 is positioned between the first base material 10 and the second base material 20. Therefore, the first base material 10 and the second base material 20 are indirectly joined with the third base material 60 sandwiched in between. The third base material 60 is a long (tape-shaped) sheet member, similar to the first base material 10 and the second base material 20. The third base material 60 has parts of a plurality of receiving sections 1a arranged at equal intervals in its longitudinal direction, similar to the first base material 10 and the second base material 20. The third base material 60 also has parts of a plurality of feed holes 1b arranged at equal intervals in its longitudinal direction, similar to the first base material 10 and the second base material 20. A resin film is used as the material for the third base material 60. For example, the third base material 60 can be made of epoxy resin, polyurethane resin, silicone resin, acrylic resin, or the like, and its thickness is preferably 0.05 mm or more and 0.1 mm or less. In this embodiment, the third base material 60 is made of a resin film with a thickness of 0.1 mm.

[0034] Furthermore, a genuineness determination mark 92 is formed on the upper surface of the third substrate 60. This genuineness determination mark 92 is the same as the genuineness determination mark 91 in the first embodiment and is provided for the purpose of determining authenticity. In this embodiment, since the genuineness determination mark 92 is provided on the third substrate 60, the genuineness determination mark 91 in the first embodiment is not provided.

[0035] The bonding layer 31 is a layer that bonds the first base material 10 and the third base material 60, and is formed in a long, tape-like shape, similar to the first base material 10 and the second base material 20. The bonding layer 32 is a layer that bonds the second base material 20 and the third base material 60, and is also formed in a long, tape-like shape, similar to the first base material 10 and the second base material 20. The bonding layers 31 and 32 have parts of a plurality of receiving portions 1a arranged at equal intervals in their longitudinal direction, similar to the first base material 10 and the second base material 20. The bonding layers 31 and 32 also have parts of a plurality of feed holes 1b arranged at equal intervals in their longitudinal direction, similar to the first base material 10 and the second base material 20. The bonding layers 31 and 32 can be made of, for example, an adhesive or a tack. In this embodiment, the bonding layers 31 and 32 use a resin-based adhesive. For example, epoxy resin adhesives, polyurethane resin adhesives, silicone resin adhesives, and acrylic resin adhesives are used.

[0036] The carrier tape 80B is composed of the first base material 10, the second base material 20, the third base material 60, and the bonding layers 31 and 32. The carrier tape 80B is combined with the bottom cover tape 40, the electronic component 100, and the top cover tape 50 to form the electronic component packaging tape 1B.

[0037] Figure 7 shows a part of the manufacturing process of a carrier tape 80B equipped with a genuineness determination mark 92. A genuineness determination mark 92 is formed in advance on the upper surface of the third base material 60 by printing. Any specific printing method can be used to print the genuineness determination mark 92, but examples include gravure printing using a gravure plate or inkjet printing. An adhesive or tack agent that will form a bonding layer 31 is applied to the upper surface of the third base material 60 on which the genuineness determination mark 92 is formed. An adhesive or tack agent that will form a bonding layer 32 is also applied to the upper surface of the second base material 20. Then, the carrier tape 80B can be formed by bonding the third base material 60 between the first base material 10 and the second base material 20. Although not specifically shown in the figures, the carrier tape 80B undergoes processes such as cutting to the required width and opening the storage section 1a and feed holes 1b to obtain the final shape of the carrier tape 80B. Furthermore, the surfaces to which the adhesive or tack agent forming the bonding layer 31 and bonding layer 32 is applied are not limited to the above example and can be changed as appropriate.

[0038] (Method for determining authenticity of electronic component packaging tape 1B) In the electronic component packaging tape 1B of the second embodiment, authenticity can be determined using the authenticity determination mark 92, similar to the first embodiment. That is, when determining authenticity in the electronic component packaging tape 1B of the second embodiment, the joint between the first base material 10 and the second base material 20 (in this embodiment, either the joint layer 31 and the joint layer 32, or both) is peeled off and the presence or absence of the authenticity determination mark 92 is visually confirmed, similar to the first embodiment. Here, by making the third base material 60 a resin film, peeling (detaching) between the first base material 10 and the second base material 20 can be easily performed. Also, since the third base material 60 is a resin film, for example, if the third base material 60 is made of a transparent material, the authenticity determination mark 92 can be visually confirmed even if the second base material 20 and the third base material 60 are peeled off. Therefore, it is desirable that the third base material 60 be a transparent resin film.

[0039] As described above, with the electronic component packaging tape 1B of this embodiment, the authenticity determination mark 92 is provided on the third substrate 60, which is positioned between the first substrate 10 and the second substrate 20, making it easy to distinguish between counterfeit and genuine products. Furthermore, since the authenticity determination mark 92 is difficult to see under normal use conditions, it is possible to prevent counterfeit products from being marked with a mark similar to the authenticity determination mark 92. In addition, since the first substrate 10 and the second substrate 20 are indirectly joined with the third substrate 60 in between, it is possible to easily separate the first substrate 10 and the second substrate 20.

[0040] This disclosure includes the following forms. For ease of understanding, embodiments of this disclosure will be denoted by corresponding reference numerals, but will not be limited thereto.

[0041] The first disclosure is a method for determining the authenticity of an electronic component packaging tape (1, 1B) comprising: a long carrier tape (80, 80B) having a plurality of housing sections (1a) along its longitudinal direction; at least one layer of cover tape (40, 50) provided to cover the housing sections (1a); and a plurality of electronic components (100) housed in each of the plurality of housing sections (1a), wherein the carrier tape (80, 80B) is a first base This is a method for determining the authenticity of electronic component packaging tape (1, 1B), comprising a material (10) and a second base material (20) joined to the first base material (10), wherein authenticity determination marks (91, 92) are provided between the first base material (10) and the second base material (20), and authenticity determination is performed by tearing the joint portion (30, 31, 32) between the first base material (10) and the second base material (20) and checking the authenticity determination marks (91, 92).

[0042] The second disclosure is a method for determining the authenticity of electronic component packaging tape (1, 1B) as described in the first disclosure, characterized in that the authenticity determination marks (91, 92) are formed including an alphabet, and the authenticity determination is performed by confirming the content indicated by the authenticity determination marks (91, 92) including the alphabet when performing the authenticity determination.

[0043] The third disclosure provides an authenticity determination method for an electronic component packaging tape (1, 1B) according to the first disclosure or the second disclosure, wherein the authenticity determination mark (91, 92) is formed containing fluorescent ink, and excitation light that causes the fluorescent ink to emit light is irradiated when performing the authenticity determination, which is an authenticity determination method for an electronic component packaging tape (1, 1B).

[0044] The fourth disclosure provides an elongated carrier tape (80, 80B) in which a plurality of accommodating portions (1a) for accommodating a plurality of electronic components (100) are provided along the longitudinal direction, the carrier tape (80, 80B) comprising a first base material (10) and a second base material (20) directly or indirectly bonded to the first base material (10), wherein an authenticity determination mark (91, 92) is provided between the first base material (10) and the second base material (20).

[0045] The fifth disclosure provides a carrier tape (80, 80B) according to the fourth disclosure, wherein the authenticity determination mark (91, 92) is formed containing alphabets, which is a carrier tape (80, 80B).

[0046] The sixth disclosure provides a carrier tape (80, 80B) according to the fourth disclosure or the fifth disclosure, wherein the authenticity determination mark (91, 92) is formed containing fluorescent ink, which is a carrier tape (80, 80B).

[0047] The seventh disclosure provides a carrier tape (80, 80B) according to any one of the fourth disclosure to the sixth disclosure, wherein the first base material (10) and the second base material (20) are bonded with a third base material (60) interposed therebetween, and the authenticity determination mark (91, 92) is formed on the third base material (60), which is a carrier tape (80, 80B).

[0048] The eighth disclosure provides an electronic component packaging tape (1, 1B) comprising the carrier tape (80, 80B) according to any one of the fourth disclosure to the seventh disclosure, at least one layer of cover tape (40, 50) provided to cover the accommodating portions (1a), and a plurality of electronic components (100) respectively accommodated in the plurality of accommodating portions (1a).

[0049] (Modified Embodiment) The present invention is not limited to the embodiments described above, and various modifications and changes are possible, which are also within the scope of the present disclosure.

[0050] (1) In each embodiment, an example has been described where the authenticity determination marks 91 and 92 are visible to the naked eye under visible light. The present invention is not limited to this. For example, the authenticity determination marks 91 and 92 are formed including a fluorescent light-emitting material such as fluorescent ink, and may be configured to be invisible or hardly visible to the naked eye under visible light. In this case, when performing authenticity determination, by irradiating excitation light that causes the fluorescent light-emitting material contained in the authenticity determination marks 91 and 92 to emit light, the authenticity determination marks 91 and 92 can be caused to emit light to perform authenticity determination. The excitation light for exciting the fluorescent light-emitting material to emit light can be irradiated using so-called black light that emits ultraviolet light. The fluorescent light-emitting material is not limited to a form that emits light using ultraviolet light as excitation light, and for example, may be a fluorescent light-emitting material that uses infrared light as excitation light.

[0051] (2) In each embodiment, an example is illustrated where the carrier tape 80 (or 80B) is also referred to as a punch tape, in which the accommodating portion 1a is formed as a through hole, and the upper and lower sides of the through hole are closed by a bottom cover tape 40 and a top cover tape 50 to enable accommodation of electronic components 100. The present invention is not limited to this. For example, the carrier tape may be of a form also called "press tape" or "embossed tape" in which one side of the accommodating portion is closed to provide a bottom surface, and an opening on the other side is closed by a cover tape to enable accommodation of electronic components, and the electronic component packaging tape may include such a carrier tape.

[0052] (3) In each embodiment, an additional layer may be further provided. For example, an easy-peeling layer for facilitating peeling between the first base material 10 and the second base material 20 may be provided, or a hiding layer for hiding the transparent visibility of the authenticity determination marks 91 and 92 may be provided.

[0053] (4) In each embodiment, the authenticity determination marks 91 and 92 were described in an example in which they are arranged in correspondence with each of the multiple storage sections 1a. However, the invention is not limited to this, and for example, a large number of authenticity determination marks may be arranged in a pattern (repeating pattern or design).

[0054] While each embodiment and its variations can be used in combination as appropriate, a detailed explanation is omitted. Furthermore, this disclosure is not limited to the embodiments described above.

[0055] 1, 1B Electronic component packaging tape 1a Storage section 1b Feed hole 10 First base material 20 Second base material 30, 31, 32 Bonding layer 40 Bottom cover tape 50 Top cover tape 60 Third base material 80, 80B Carrier tape 91, 92 Authenticity verification mark 100 Electronic component

Claims

1. A method for determining the authenticity of an electronic component packaging tape, comprising: a long carrier tape having a plurality of storage compartments along its longitudinal direction; at least one layer of cover tape provided to cover the storage compartments; and a plurality of electronic components housed in each of the plurality of storage compartments, wherein the carrier tape has a first base material and a second base material joined to the first base material, an authenticity determination mark is provided between the first base material and the second base material, and authenticity is determined by tearing the joint between the first base material and the second base material and confirming the authenticity determination mark.

2. A method for determining the authenticity of an electronic component packaging tape according to claim 1, wherein the authenticity determination mark is formed including an alphabet, and the authenticity determination is performed by confirming the content indicated by the authenticity determination mark including the alphabet when performing the authenticity determination.

3. A method for determining the authenticity of an electronic component packaging tape according to claim 1 or claim 2, characterized in that the authenticity determination mark is formed by including fluorescent ink, and when determining the authenticity, excitation light that causes the fluorescent ink to emit light is irradiated.

4. A long carrier tape having multiple housing sections for housing multiple electronic components provided along its longitudinal direction, comprising: a first substrate; and a second substrate directly or indirectly joined to the first substrate, wherein a genuineness determination mark is provided between the first substrate and the second substrate.

5. A carrier tape according to claim 4, characterized in that the authenticity determination mark is formed including an alphabet.

6. A carrier tape according to claim 4 or claim 5, characterized in that the authenticity determination mark is formed by including fluorescent ink.

7. A carrier tape according to any one of claims 4 to 6, characterized in that the first substrate and the second substrate are joined with a third substrate in between, and the authenticity determination mark is formed on the third substrate.

8. An electronic component packaging tape comprising: a carrier tape according to any one of claims 4 to 7; at least one layer of cover tape provided to cover the housing portion; and a plurality of electronic components housed in each of the plurality of housing portions.

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