Photosensitive resin composition, photosensitive coloring composition, and color filter

Abstract

A photosensitive resin composition containing a resin (A), a reactive diluent (B), a photopolymerization initiator (C), and a solvent (D), wherein the acid value of the resin (A) is 20-300 mg KOH / g, and the resin (A) has a structure (X1) derived from alkyl glycidyl ether in which the alkyl group has 1-10 carbon atoms, or a structure (Y1) derived from a saturated aliphatic carboxylic acid having 2-11 carbon atoms.

Description

Photosensitive resin composition, photosensitive colored composition, and color filter

[0001] This disclosure relates to a photosensitive resin composition, a photosensitive colored composition, a color filter, and an image display element.

[0002] In recent years, with the widespread adoption of liquid crystal displays (LCDs), there has been extensive research being conducted on color filters used as components of LCDs, as well as on the overcoat layers and interlayer insulating films provided on these color filters.

[0003] Japanese Patent Publication No. 2019-53266

[0004] This disclosure provides a photosensitive resin composition and a photosensitive coloring composition that have good developability and provide a resin cured film with excellent adhesion. Furthermore, this disclosure provides a color filter having a colored pattern which is a cured product of the photosensitive coloring composition, and an image display element comprising the same.

[0005] The present disclosure includes the following aspects: [1] A photosensitive resin composition comprising: a resin (A); a reactive diluent (B); a photopolymerization initiator (C); and a solvent (D), wherein the acid value of the resin (A) is 20 to 300 mgKOH / g, and the resin (A) has a structure (X1) derived from an alkyl glycidyl ether having 1 to 10 carbon atoms in the alkyl group, or a structure (Y1) derived from a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms. [2] The photosensitive resin composition according to [1], wherein the resin (A) has the structure (X1), the copolymer precursor (PA1) is a copolymer containing a constituent unit (a-1) having an acid group, and the resin (A) is a resin in which a part of the acid group of the copolymer precursor (PA1) is modified. [3] The photosensitive resin composition according to [2], wherein the acid group is a carboxyl group, and the structure (X1) is a structure in which an alkyl glycidyl ether having 1 to 10 carbon atoms in the alkyl group is added to a part of the acid group of the copolymer precursor (PA1). [4] The photosensitive resin composition according to [1], wherein the resin (A) has the structure (Y1), the copolymer precursor (PA2) is a copolymer containing a constituent unit (a-2) having an epoxy group, the resin (A) is a resin in which at least a part of the epoxy group of the copolymer precursor (PA2) is modified, and the structure (Y1) is a structure in which a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms is added to at least a part of the epoxy group of the copolymer precursor (PA2). [5] The photosensitive resin composition according to [4], wherein the resin (A) further comprises a structure (Z) derived from a polybasic acid or polybasic acid anhydride, and the structure (Z) is a structure in which a polybasic acid or polybasic acid anhydride is added to a part of the hydroxyl group formed by ring opening of the epoxy group. [6] The photosensitive resin composition according to any one of [2] to [5], wherein the copolymer precursor (PA1) or the copolymer precursor (PA2) further comprises a constituent unit (a-3) having a crosslinked cyclic hydrocarbon group having 7 to 20 carbon atoms. [7] The photosensitive resin composition according to any one of [2] to [6], wherein the copolymer precursor (PA1) or the copolymer precursor (PA2) further comprises a constituent unit (a-4) having an aromatic ring.[8] The photosensitive resin composition according to any one of [1] to [3], [6] and [7], wherein the content of the structure (X1) is 5 to 95 moles when the total amount of constituent units of resin (A) is 100 moles. [9] The photosensitive resin composition according to any one of [1] and [4] to [7], wherein the content of the structure (Y1) is 40 to 95 moles when the total amount of constituent units of resin (A) is 100 moles.

[10] The photosensitive resin composition according to any one of [3] and [6] to [8], wherein the amount of the structure (X1) is 5 to 90 moles per 100 moles of the constituent unit (a-1) having the acid group in the copolymer precursor (PA1).

[11] The photosensitive resin composition according to any one of [4] to [7] and [9], wherein the amount of the structure (Y1) is 50 to 100 moles per 100 moles of the constituent unit (a-2) having the epoxy group in the copolymer precursor (PA2).

[12] A photosensitive resin composition according to any one of [1] to

[11] , wherein it optionally contains another resin having an ethylenically unsaturated group other than the resin (A), the total content of the resin (A) and the other resin being 10 to 90% by mass with respect to the total of the resin (A), the other resin and the reactive diluent (B), the content of the reactive diluent (B) being 90 to 10% by mass, the content of the photopolymerization initiator (C) being 0.1 to 30 parts by mass with respect to 100 parts by mass of the total of the resin (A), the other resin and the reactive diluent (B), and the content of the solvent (D) being 30 to 1,000 parts by mass with respect to 100 parts by mass of the total of the components excluding the solvent (D).

[13] A photosensitive colored composition comprising the photosensitive resin composition according to any one of [1] to

[12] and a colorant (E).

[14] A resin cured film which is a cured product of the photosensitive resin composition according to any one of [1] to

[12] .

[15] A color filter having a colored pattern which is a cured product of the photosensitive colored composition described in

[13] .

[16] An image display element comprising the color filter described in

[15] .

[0006] According to this disclosure, it is possible to provide a photosensitive resin composition and a photosensitive coloring composition that have good developability and provide a resin cured film with excellent adhesion. Furthermore, it is possible to provide a color filter having a colored pattern which is a cured product of the photosensitive coloring composition, and an image display element equipped therewith.

[0007] Embodiments of the present invention will be described in detail below. However, the present invention is not limited to the embodiments shown below.

[0008] In this specification, when "~" is used for a numerical range, the numbers at both ends are the upper and lower limits, respectively, and are included in the numerical range. If multiple upper or lower limits are listed, a numerical range can be created from all combinations of upper and lower limits. Similarly, if multiple numerical ranges are listed, separate numerical ranges can be created by individually selecting and combining upper and lower limits from those ranges.

[0009] In this specification, "(meth)acrylic acid" means methacrylic acid or acrylic acid, "(meth)acrylate" means acrylate or methacrylate, and "(meth)acryloyloxy" means acryloyloxy or methacryloyloxy. In this specification, "(poly)alkylene glycol" means alkylene glycol or polyalkylene glycol.

[0010] In this specification, "ethylenically unsaturated bond" means a double bond formed between carbon atoms excluding the carbon atoms forming the aromatic ring, "ethylenically unsaturated group" means a group having an ethylenically unsaturated bond, and "ethylenically unsaturated compound" means a compound having an ethylenically unsaturated bond.

[0011] In this specification, "constituent unit" means a unit derived from the polymerizable compound used as a monomer, or a unit obtained by further modifying a unit derived from the polymerizable compound used as a monomer after polymerization.

[0012] <Photosensitive Resin Composition> The photosensitive resin composition of one embodiment contains a resin (A), a reactive diluent (B), a photopolymerization initiator (C), and a solvent (D). The photosensitive resin composition can polymerize and harden upon irradiation with light to form a cured resin film. The photosensitive resin composition may also contain other resins having ethylenically unsaturated groups other than resin (A).

[0013] [Resin (A)] Resin (A) has a structure (X1) derived from an alkyl glycidyl ether with 1 to 10 carbon atoms in the alkyl group (also simply called "structure (X1)") or a structure (Y1) derived from a saturated aliphatic carboxylic acid with 2 to 11 carbon atoms (also simply called "structure (Y1)"). Because resin (A) has a side-chain alkyl structure introduced by structure (X1) or structure (Y1), when used as a photosensitive resin composition or photosensitive colored composition, developability is improved. A cured resin film obtained by curing a photosensitive resin composition or photosensitive colored composition containing resin (A) having a side-chain alkyl structure has good adhesion. Although not bound by any theory, the introduction of a side-chain alkyl structure lowers the glass transition temperature (Tg) of resin (A) and improves its mobility. As a result, the degree of contact with the substrate is improved during the coating, drying, and heating processes of the photosensitive resin composition or photosensitive colored composition, thus improving adhesion.

[0014] In the first embodiment, resin (A) has structure (X1). In this embodiment, resin (A) is a resin in which a portion of the acid groups of a copolymer precursor (PA1) (also simply referred to as "polymer precursor (PA1)") containing a constituent unit (a-1) (also simply referred to as "constituent unit (a-1)") having an acid group is modified. Preferably, resin (A) is a resin in which an alkylglycidyl ether having 1 to 10 carbon atoms in the alkyl group is added to a portion of the acid groups of a copolymer precursor (PA1) in which the acid group of the constituent unit (a-1) is a carboxyl group. Resin (A) may also be a resin in which an alkylglycidyl ether having 1 to 10 carbon atoms in the alkyl group and an epoxy group-containing ethylenically unsaturated compound are added to a portion of the acid groups of a copolymer precursor (PA1) in which the acid group of the constituent unit (a-1) is a carboxyl group. In this embodiment, resin (A) has structure (X1) and structure (X2) (also simply referred to as "structure (X2)") derived from the epoxy group-containing ethylenically unsaturated compound.

[0015] The copolymer precursor (PA1) may optionally contain at least one selected from the group consisting of a constituent unit (a-3) having a crosslinked cyclic hydrocarbon group having 7 to 20 carbon atoms (also simply referred to as "constituent unit (a-3)"), a constituent unit (a-4) having an aromatic ring (also simply referred to as "constituent unit (a-4)"), and other constituent units (a-5) other than constituent units (a-1) to (a-4) (also simply referred to as "constituent unit (a-5)").

[0016] In the second embodiment, resin (A) has structure (Y1). In this embodiment, resin (A) is a resin in which at least a portion of the epoxy groups of a copolymer precursor (PA2) containing epoxy group-containing constituent units (a-2) (also simply referred to as "constituent unit (a-2)") is modified. Preferably, resin (A) is a resin in which a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms is added to at least a portion of the epoxy groups of the copolymer precursor (PA2). Resin (A) may also be a resin in which a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms and a carboxyl group-containing ethylenically unsaturated compound are added to at least a portion of the epoxy groups of the copolymer precursor (PA2). In this embodiment, resin (A) has structure (Y1) and structure (Y2) derived from the carboxyl group-containing ethylenically unsaturated compound (also simply referred to as "structure (Y2)").

[0017] In a second embodiment, resin (A) may further have a structure (Z) derived from a polybasic acid or polybasic acid anhydride (also simply referred to as "structure (Z)"). Structure (Z) is a structure in which a polybasic acid or polybasic acid anhydride is added to a portion of the hydroxyl groups formed by ring-opening of the epoxy groups by an addition reaction of the copolymer precursor (PA2) to the epoxy groups. Resin (A) may also be a resin in which a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms is added to at least a portion of the epoxy groups of the copolymer precursor (PA2), and a polybasic acid or polybasic acid anhydride is added to a portion of the hydroxyl groups formed by ring-opening of the epoxy groups.

[0018] The copolymer precursor (PA2) may optionally contain at least one selected from the group consisting of a-3 (a-3) having a crosslinked cyclic hydrocarbon group having 7 to 20 carbon atoms, a-4 (a-4) having an aromatic ring, and other constituent units (a-5) other than (a-1) to (a-4).

[0019] When resin (A) has ethylenically unsaturated groups, the amount of ethylenically unsaturated groups in resin (A) is preferably 200 μmol / g or more, more preferably 300 μmol / g or more, and even more preferably 400 μmol / g or more. In the second embodiment, it is possible to increase the content of the constituent unit (a-2) having epoxy groups and to increase the amount of carboxyl group-containing ethylenically unsaturated compound added. Therefore, in the second embodiment, the amount of ethylenically unsaturated groups in resin (A) may be 800 μmol / g or more, or 1,000 μmol / g or more. The amount of ethylenically unsaturated groups in resin (A) is preferably 4,000 μmol / g or less, more preferably 3,000 μmol / g or less, and even more preferably 2,000 μmol / g or less. In the first embodiment, from the viewpoint of ensuring the acid value derived from the constituent unit (a-1) having an acid group, the amount of ethylenically unsaturated groups in resin (A) may be 1,000 μmol / g or less, or 900 μmol / g or less. When the amount of ethylenically unsaturated groups in resin (A) is 200 μmol / g or more, the curability of the photosensitive resin composition or photosensitive colored composition is better. When the amount of ethylenically unsaturated groups in resin (A) is 200 μmol / g or more, the adhesion of the cured resin film is better. When the amount of ethylenically unsaturated groups in resin (A) is 4,000 μmol / g or less, the storage stability of the photosensitive resin composition or photosensitive colored composition tends to be good.

[0020] If necessary, other resins having ethylenically unsaturated groups may be used in combination. The other resins having ethylenically unsaturated groups are not particularly limited as long as they are resins having ethylenically unsaturated groups other than resin (A). The preferred range for the amount of ethylenically unsaturated groups in the other resins having ethylenically unsaturated groups is the same as that for resin (A). By using other resins having ethylenically unsaturated groups in combination, the solvent resistance of the cured product of the photosensitive resin composition or photosensitive colored composition tends to improve. Examples of other resins having ethylenically unsaturated groups include resins in which the structure (X1) of resin (A) is entirely replaced by structure (X2).

[0021] The amount of ethylenically unsaturated groups refers to the number of micromoles of ethylenically unsaturated groups in 1 g of resin. The amount of ethylenically unsaturated groups can be determined by dividing the number of ethylenically unsaturated groups in the resin by the mass of the resin (μmol / g). In this specification, the amount of ethylenically unsaturated groups in the resin is a theoretical value calculated from the amount of raw materials used in the production of the resin.

[0022] The acid value of resin (A) is 20 mg KOH / g or more, preferably 30 mg KOH / g or more, and more preferably 40 mg KOH / g or more. The acid value of resin (A) is 300 mg KOH / g or less, preferably 200 mg KOH / g or less, and more preferably 150 mg KOH / g or less. When the acid value of resin (A) is 20 mg KOH / g or more, the developability of the photosensitive resin composition or photosensitive colored composition is good. When the acid value of resin (A) is 300 mg KOH / g or less, the storage stability of the photosensitive resin composition or photosensitive colored composition tends to be good.

[0023] The acid value of resin (A) is the acid value of the curable polymer measured according to JIS K6901:2008 5.3. That is, the acid value represents the number of mg of potassium hydroxide required to neutralize the acidic components contained in 1 g of resin. The acid value of resin (A) is measured by the method described in the examples.

[0024] The weight-average molecular weight (Mw) of resin (A) is preferably 1,000 or more, more preferably 2,000 or more, even more preferably 4,000 or more, and even more preferably 8,000 or more. The weight-average molecular weight of resin (A) is preferably 50,000 or less, more preferably 30,000 or less, and even more preferably 15,000 or less. When the weight-average molecular weight of resin (A) is 1,000 or more, the curability of the photosensitive resin composition or photosensitive colored composition tends to be good. When the weight-average molecular weight of resin (A) is 50,000 or less, the storage stability of the photosensitive resin composition or photosensitive colored composition tends to be good.

[0025] The molecular weight distribution (Mw / Mn) of resin (A) is preferably 1.3 or higher, more preferably 1.5 or higher, even more preferably 1.7 or higher, and particularly preferably 1.9 or higher. The molecular weight distribution (Mw / Mn) of resin (A) is preferably 5.0 or lower, more preferably 4.5 or lower, even more preferably 4.0 or lower, and particularly preferably 3.5 or lower. When the molecular weight distribution (Mw / Mn) of resin (A) is 1.3 or higher, it tends to be easier to control the manufacturing conditions during the synthesis of resin (A). When the molecular weight distribution (Mw / Mn) of resin (A) is 5.0 or lower, it tends to have good storage stability.

[0026] In this specification, the weight-average molecular weight (Mw) and number-average molecular weight (Mn) are defined as values ​​obtained by measuring using gel permeation chromatography (GPC) under the following conditions and using a standard polystyrene calibration curve. Column: Two Showdex® LF-804 columns (Resonac Co., Ltd.) connected in series. Column temperature: 40°C. Sample: 0.2% by mass tetrahydrofuran solution of the substance to be measured. Developing solvent: Tetrahydrofuran. Detector: Differential refractometer (Showdex® RI-71S) (Resonac Co., Ltd.). Flow rate: 1 mL / min.

[0027] The total content of resin (A) and other optionally selected resins having ethylenically unsaturated groups in the photosensitive resin composition or photosensitive colored composition is preferably 10% by mass or more, more preferably 25% by mass or more, and even more preferably 40% by mass or more, relative to the total of resin (A), reactive diluent (B), and other optionally selected resins having ethylenically unsaturated groups. The total content of resin (A) and other optionally selected resins having ethylenically unsaturated groups is preferably 90% by mass or less, more preferably 75% by mass or less, and even more preferably 60% by mass or less, relative to the total of resin (A), reactive diluent (B), and other optionally selected resins having ethylenically unsaturated groups. When the total content of resin (A) and other optionally selected resins having ethylenically unsaturated groups is within the above range, the viscosity of the photosensitive resin composition or photosensitive colored composition becomes suitable for handling, and in addition, the photocurability tends to be better.

[0028] When resin (A) is used in combination with another resin having an ethylenically unsaturated group, the ratio (mass ratio) of resin (A) to the other resin is preferably 90:10 to 10:90, and more preferably 60:40 to 40:60.

[0029] (Structure (X1) derived from alkylglycidyl ether having 1 to 10 carbon atoms in the alkyl group) Structure (X1) is a structure derived from alkylglycidyl ether having 1 to 10 carbon atoms in the alkyl group. There may be only one type of structure (X1) or two or more types. The presence of structure (X1) in resin (A) improves the developability of the photosensitive resin composition or photosensitive colored composition. Resin (A) can be produced relatively easily by introducing structure (X1) by an addition reaction of alkylglycidyl ether having 1 to 10 carbon atoms in the alkyl group.

[0030] In one embodiment, structure (X1) is a copolymer precursor (PA1) in which the acid group of the constituent unit (a-1) is a carboxyl group, and an alkylglycidyl ether having 1 to 10 carbon atoms in the alkyl group is added to a portion of the acid group.

[0031] Examples of alkylglycidyl ethers having 1 to 10 carbon atoms in the alkyl group include ethyl glycidyl ether, propyl glycidyl ether, butyl glycidyl ether, hexyl glycidyl ether, decyl glycidyl ether, and 2-ethylhexyl glycidyl ether. Alkyl glycidyl ethers having 1 to 10 carbon atoms in the alkyl group may be used alone or in combination of two or more types. From the viewpoint of the developability of the photosensitive resin composition or photosensitive colored composition, linear alkyl glycidyl ethers are preferred, and linear alkyl glycidyl ethers having 2 to 6 carbon atoms in the alkyl group are more preferred.

[0032] The content of structure (X1) is preferably 5 moles or more, more preferably 7.5 moles or more, and even more preferably 10 moles or more, when the total amount of constituent units of resin (A) is 100 moles. The content of structure (X1) is preferably 95 moles or less, more preferably 75 moles or less, and even more preferably 60 moles or less, when the total amount of constituent units of resin (A) is 100 moles. When the content of structure (X1) is 5 moles or more, a sufficient amount of alkyl groups introduced into the side chains can be ensured, resulting in better developability of the photosensitive resin composition or photosensitive colored composition. When the content of structure (X1) is 95 moles or less, a sufficient amount of acid groups derived from constituent unit (a-1) can be ensured in resin (A), resulting in better developability of the photosensitive resin composition or photosensitive colored composition.

[0033] When the acid group of the constituent unit (a-1) is a carboxyl group, the amount of structure (X1) is preferably 5 moles or more, more preferably 10 moles or more, and even more preferably 20 moles or more, per 100 moles of the constituent unit (a-1) having an acid group in the copolymer precursor (PA1). When the acid group of the constituent unit (a-1) is a carboxyl group, the amount of structure (X1) is preferably 90 moles or less, more preferably 80 moles or less, and even more preferably 70 moles or less, per 100 moles of the constituent unit (a-1) having an acid group in the copolymer precursor (PA1). When the amount of structure (X1) is 5 moles or more, a sufficient amount of alkyl group introduced into the side chain can be secured, and the developability of the photosensitive resin composition or photosensitive colored composition is better. When the amount of structure (X1) is 90 moles or less, a sufficient content of acid groups derived from the constituent unit (a-1) can be secured in the resin (A), and the developability of the photosensitive resin composition or photosensitive colored composition is better.

[0034] (Structure (X2) derived from epoxy group-containing ethylenically unsaturated compound) The resin (A) may optionally have the structure (X2). The structure (X2) may be of only one type, or may be of two or more types. When the resin (A) has the structure (X2), the solvent resistance of a cured product of the photosensitive resin composition or the photosensitive colored composition and the adhesion of the cured resin film tend to be improved. Since the structure (X2) is introduced through an addition reaction of an epoxy group-containing ethylenically unsaturated compound, the resin (A) having the structure (X2) can be produced relatively easily.

[0035] In one embodiment, the structure (X2) is a structure in which an epoxy group-containing ethylenically unsaturated compound is added to a part of the acid groups of a copolymer precursor (PA1) in which the acid group of the structural unit (a-1) is a carboxy group.

[0036] Specific examples and preferred examples of the epoxy group-containing ethylenically unsaturated compound include the same compounds as the epoxy group-containing monomer (ma-2) described later.

[0037] When the resin (A) contains the structure (X2), the content of the structure (X2) is preferably 1 mol or more, more preferably 3 mol or more, and still more preferably 5 mol or more, when the total of the structural units of the resin (A) is taken as 100 mol. The content of the structure (X2) is preferably 50 mol or less, more preferably 30 mol or less, and still more preferably 20 mol or less, when the total of the structural units of the resin (A) is taken as 100 mol. When the content of the structure (X2) is 1 mol or more, a sufficient amount of ethylenically unsaturated groups introduced into the side chains can be ensured, and the solvent resistance of a cured product of the photosensitive resin composition or the photosensitive colored composition and the adhesion of the cured resin film are further improved. When the content of the structure (X2) is 50 mol or less, sufficient contents of the acid groups derived from the structural unit (a-1) and the structure (X1) in the resin (A) can be ensured, and the developability of the photosensitive resin composition or the photosensitive colored composition is further improved. When the content of the structure (X2) is 50 mol or less, unintended curing of the photosensitive resin composition or the photosensitive colored composition before exposure is suppressed, resulting in better developability.

[0038] When the acid group of the structural unit (a-1) is a carboxy group, the amount of the structure (X2) is preferably 1 mol or more, more preferably 5 mol or more, still more preferably 10 mol or more, per 100 mol of the structural unit (a-1) having an acid group in the copolymer precursor (PA1). When the acid group of the structural unit (a-1) is a carboxy group, the amount of the structure (X2) is preferably 50 mol or less, more preferably 40 mol or less, still more preferably 30 mol or less, per 100 mol of the structural unit (a-1) having an acid group in the copolymer precursor (PA1). When the amount of the structure (X2) is 1 mol or more, a sufficient introduction amount of ethylenically unsaturated groups into side chains can be ensured, and the solvent resistance of a cured product of the photosensitive resin composition or the photosensitive colored composition and the adhesion of a cured resin film are better. When the amount of the structure (X2) is 50 mol or less, the content of acid groups derived from the structural unit (a-1) and the content of the structure (X1) in the resin (A) can be sufficiently ensured, and the developability of the photosensitive resin composition or the photosensitive colored composition is better. When the content of the structure (X2) is 50 mol or less, unintended curing of the photosensitive resin composition or the photosensitive colored composition before exposure is suppressed, and developability is better.

[0039] The ratio (molar ratio) of the structure (X1) to the structure (X2) is preferably 90:10 to 10:90, more preferably 60:40 to 40:60.

[0040] (Structure (Y1) derived from saturated aliphatic carboxylic acid having 2 to 11 carbon atoms) The structure (Y1) is a structure derived from a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms. The structure (Y1) may be only one type, or may be two or more types. When the resin (A) has the structure (Y1), the developability of the photosensitive resin composition or the photosensitive colored composition is improved. Since the structure (Y1) is introduced through an addition reaction of a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms, the resin (A) can be produced relatively easily.

[0041] In one embodiment, the structure (Y1) is a structure in which a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms is added to at least a part of the epoxy groups of the copolymer precursor (PA2) containing the structural unit (a-2) having an epoxy group.

[0042] Examples of saturated aliphatic carboxylic acids having 2 to 11 carbon atoms include acetic acid, propionic acid, butyric acid, caproic acid, and 2-ethylhexanoic acid. Saturated aliphatic carboxylic acids having 2 to 11 carbon atoms may be used alone or in combination of two or more. From the viewpoint of the developability of the photosensitive resin composition or photosensitive colored composition, linear saturated aliphatic carboxylic acids are preferred, and linear saturated aliphatic carboxylic acids having 3 to 6 carbon atoms are more preferred.

[0043] The content of structure (Y1) is preferably 40 moles or more, more preferably 50 moles or more, even more preferably 60 moles or more, and even more preferably 70 moles or more, when the total amount of constituent units of resin (A) is 100 moles. The content of structure (Y1) is preferably 95 moles or less, more preferably 90 moles or less, and even more preferably 85 moles or less, when the total amount of constituent units of resin (A) is 100 moles. When the content of structure (Y1) is 40 moles or more, a sufficient amount of alkyl groups can be introduced into the side chains, resulting in better developability of the photosensitive resin composition or photosensitive colored composition. When the content of structure (Y1) is 95 moles or less, the content of other constituent units can be secured, resulting in a better balance of performance such as curability of the photosensitive resin composition or photosensitive colored composition and solvent resistance of the cured film.

[0044] The amount of structure (Y1) is preferably 50 moles or more, more preferably 80 moles or more, and even more preferably 95 moles or more, based on 100 moles of epoxy group-containing structural units (a-2) in the copolymer precursor (PA2). The amount of structure (Y1) is preferably 100 moles or less, more preferably 99 moles or less, and even more preferably 98 moles or less, based on 100 moles of epoxy group-containing structural units (a-2) in the copolymer precursor (PA2). When the amount of structure (Y1) is 50 moles or more, a sufficient amount of alkyl groups can be introduced into the side chains, resulting in better developability of the photosensitive resin composition or photosensitive colored composition.

[0045] (Structure (Y2) derived from a carboxyl group-containing ethylenically unsaturated compound) Resin (A) may optionally have structure (Y2). Structure (Y2) may be one type or two or more types. The presence of structure (Y2) in resin (A) tends to improve the solvent resistance of the cured product of the photosensitive resin composition or photosensitive colored composition and the adhesion of the cured resin film. Resin (A) having structure (Y2) can be produced relatively easily by introducing structure (Y2) by an addition reaction of a carboxyl group-containing ethylenically unsaturated compound.

[0046] In one embodiment, the structure (Y2) is a structure in which a carboxyl group-containing ethylenically unsaturated compound is added to a portion of the epoxy groups of the copolymer precursor (PA2).

[0047] Specific and preferred examples of carboxyl group-containing ethylenically unsaturated compounds include, for example, compounds similar to the unsaturated carboxylic acids in the acid group-containing monomers (ma-1) described later.

[0048] The content of structure (Y2) is preferably 1 mole or more, more preferably 10 moles or more, and even more preferably 20 moles or more, when the total amount of constituent units of resin (A) is 100 moles. The content of structure (Y2) is preferably 80 moles or less, more preferably 60 moles or less, and even more preferably 50 moles or less, when the total amount of constituent units of resin (A) is 100 moles. When the content of structure (Y2) is 1 mole or more, a sufficient amount of ethylenically unsaturated groups can be introduced into the side chains, resulting in better solvent resistance and adhesion of the cured resin film of the photosensitive resin composition or photosensitive colored composition. When the content of structure (Y2) is 80 moles or less, a sufficient amount of structure (Y1) can be ensured, resulting in better developability of the photosensitive resin composition or photosensitive colored composition. When the content of structure (Y2) is 80 moles or less, unintended curing of the photosensitive resin composition or photosensitive colored composition before exposure is suppressed, resulting in better developability.

[0049] When resin (A) contains structure (Y2), the amount of structure (Y2) is preferably 10 moles or more, more preferably 20 moles or more, and even more preferably 30 moles or more, per 100 moles of epoxy group-containing structural units (a-2) in the copolymer precursor (PA2). The amount of structure (Y2) is preferably 70 moles or less, more preferably 60 moles or less, and even more preferably 50 moles or less, per 100 moles of epoxy group-containing structural units (a-2) in the copolymer precursor (PA2). When the amount of structure (Y2) is 10 moles or more, a sufficient amount of ethylenically unsaturated groups can be introduced into the side chains, resulting in better solvent resistance and adhesion of the cured resin film of the photosensitive resin composition or photosensitive colored composition. When the amount of structure (Y2) is 70 moles or less, a sufficient content of structure (Y1) can be ensured, resulting in better developability of the photosensitive resin composition or photosensitive colored composition. When the content of structure (Y2) is 70 moles or less, unintended curing of the photosensitive resin composition or photosensitive colored composition before exposure is suppressed, resulting in better developability.

[0050] The ratio (molar ratio) of structure (Y1) to structure (Y2) is preferably 90:10 to 10:90, and more preferably 60:40 to 40:60.

[0051] (Structure (Z) derived from polybasic acid or polybasic acid anhydride) Structure (Z) is a structure derived from a polybasic acid or polybasic acid anhydride. There may be only one type of structure (Z) or two or more types. The presence of structure (Z) in resin (A) tends to improve the developability of the photosensitive resin composition or photosensitive colored composition. By introducing structure (Z) by an addition reaction of a polybasic acid or polybasic acid anhydride, resin (A) having structure (Z) can be produced relatively easily.

[0052] In one embodiment, structure (Z) is a structure in which a polybasic acid or polybasic anhydride is added to a portion of the hydroxyl groups formed by ring-opening of the epoxy group of the constituent unit (a-2) through an addition reaction with the copolymer precursor (PA2).

[0053] Polybasic acids or polybasic acid anhydrides are compounds having two or more carboxyl groups or their anhydrides. Examples of polybasic acids include adipic acid, itaconic acid, succinic acid, oxalic acid, malonic acid, phthalic acid, fumaric acid, maleic acid, glutaric acid, tartaric acid, glutamic acid, and sebacic acid. Examples of polybasic acid anhydrides include tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, maleic anhydride, itaconic anhydride, ethyl maleic anhydride, methylitaconic anhydride, chlormaleic anhydride, citraconic anhydride, 2-norvonene-5,6-dicarboxylic acid anhydride, 4-[2-(methacryloyloxy)ethoxycarbonyl]phthalic anhydride, succinic anhydride, and cyclohexanetricarboxylic acid anhydride. From the viewpoint of raw material procurement and reactivity during addition reactions, polybasic acid anhydrides are preferred as polybasic acids or polybasic acid anhydrides, and at least one selected from maleic anhydride, itaconic anhydride, ethyl maleic anhydride, methyl itaconic anhydride, chlormaleic anhydride, citraconic anhydride, 2-norvonene-5,6-dicarboxylic acid anhydride, 4-[2-(methacryloyloxy)ethoxycarbonyl]phthalic anhydride, succinic anhydride, tetrahydrophthalic anhydride, and cyclohexanetricarboxylic acid anhydride is preferred, and polybasic acid anhydrides having an alicyclic structure such as 2-norvonene-5,6-dicarboxylic acid anhydride and cyclohexanetricarboxylic acid anhydride are more preferred. From the viewpoint of increasing the amount of carboxyl group introduced and improving the development speed of the photosensitive resin composition, at least one selected from tetrahydrophthalic anhydride and cyclohexanetricarboxylic acid anhydride is preferred.

[0054] The content of structure (Z) is preferably 1 mole or more, more preferably 5 moles or more, even more preferably 10 moles or more, and even more preferably 20 moles or more, when the total amount of constituent units of resin (A) is 100 moles. The content of structure (Z) is preferably 50 moles or less, more preferably 40 moles or less, and even more preferably 35 moles or less, when the total amount of constituent units of resin (A) is 100 moles. When the content of structure (Z) is 1 mole or more, a sufficient amount of carboxyl groups can be introduced into the side chains, and the developability of the photosensitive resin composition or photosensitive colored composition is better. When the content of structure (Z) is 50 moles or less, the patterning of the exposed area is good, and the developability of the photosensitive resin composition or photosensitive colored composition is better.

[0055] The amount of structure (Z) is preferably 5 moles or more, more preferably 20 moles or more, and even more preferably 30 moles or more, per 100 moles of epoxy group-containing constituent units (a-2) in the copolymer precursor (PA2). The amount of structure (Z) is preferably 90 moles or less, more preferably 70 moles or less, and even more preferably 60 moles or less, per 100 moles of epoxy group-containing constituent units (a-2) in the copolymer precursor (PA2). When the amount of structure (Z) is 5 moles or more, a sufficient amount of carboxyl groups can be introduced into the side chains, resulting in better developability of the photosensitive resin composition or photosensitive colored composition. When the content of structure (Z) is 90 moles or less, the patterning of the exposed area is good, and the developability of the photosensitive resin composition or photosensitive colored composition is better.

[0056] (Constituent unit (a-1) having an acid group) The constituent unit (a-1) having an acid group is not particularly limited as long as it is a constituent unit having an acid group. There may be only one type of constituent unit (a-1) or two or more types. The constituent unit (a-1) is a constituent unit derived from an acid group-containing monomer (ma-1) (hereinafter also simply referred to as "monomer (ma-1)"). The addition reaction of the constituent unit (a-1) of the copolymer precursor (PA1) to the acid group is carried out on a portion of the constituent unit (a-1) that the copolymer precursor (PA1) has. Therefore, since the resulting resin (A) has an acid group derived from monomer (ma-1), the photosensitive resin composition or photosensitive colored composition has good developability.

[0057] Examples of acidic groups in the constituent unit (a-1) include carboxyl groups, sulfo groups, and phospho groups (-P(=O)(OH)). ２ Examples include the following. Among these acid groups, a carboxyl group is preferred as the acid group of the constituent unit (a-1) due to its availability.

[0058] The monomer (ma-1) is preferably a monomer having an ethylenically unsaturated bond and an acid group. Examples of monomers (ma-1) include unsaturated carboxylic acids or their anhydrides, unsaturated sulfonic acids, unsaturated phosphonic acids, and the like.

[0059] Examples of monomers (ma-1) include unsaturated carboxylic acids or their anhydrides such as (meth)acrylic acid, 2-methacryloyloxyethyl succinic acid, 2-acryloyloxyethyl succinic acid, α-bromo(meth)acrylic acid, β-furyl(meth)acrylic acid, crotonic acid, propiolic acid, cinnamic acid, α-cyanocinnamic acid, maleic acid, maleic anhydride, monomethyl maleate, monoethyl maleate, monoisopropyl maleate, fumaric acid, itaconic acid, itaconic anhydride, citraconic acid, and citraconic anhydride; unsaturated sulfonic acids such as 2-acrylamido-2-methylpropanesulfonic acid, tert-butylacrylamidosulfonic acid, and p-styrenesulfonic acid; and unsaturated phosphonic acids such as vinylphosphonic acid. Monomers (ma-1) may be used alone or in combination of two or more types.

[0060] As the monomer (ma-1), among these monomers, it is preferable to use an unsaturated carboxylic acid, and more preferably (meth)acrylic acid, because it is readily available and the photosensitive resin composition or photosensitive colored composition containing resin (A) has excellent alkali developability.

[0061] The content of constituent unit (a-1) is preferably 10 mol% or more, more preferably 20 mol% or more, even more preferably 30 mol% or more, and even more preferably 40 mol% or more, of the total constituent units of the copolymer precursor (PA1). The content of constituent unit (a-1) is, for example, 97 mol% or less, preferably 95 mol% or less, more preferably 85 mol% or less, and even more preferably 80 mol% or less, of the total constituent units of the copolymer precursor (PA1). When the content of constituent unit (a-1) is 10 mol% or more, the developability of the photosensitive resin composition or photosensitive colored composition is better. When the content of constituent unit (a-1) is 95 mol% or less, the storage stability of the photosensitive resin composition or photosensitive colored composition tends to be good.

[0062] (Epoxy group-containing constituent unit (a-2)) Constituent unit (a-2) is not particularly limited as long as it does not have an acid group and has an epoxy group. Constituent unit (a-2) may be one type or two or more types. Constituent unit (a-2) is a constituent unit derived from an epoxy group-containing monomer (ma-2) (hereinafter also simply referred to as "monomer (ma-2)"). Constituent unit (a-2) can serve as a reaction site when introducing structure (Y1) into resin (A). Therefore, by having constituent unit (a-2) in the copolymer precursor (PA2), a resin (A) having structure (Y1) can be easily obtained. When epoxy groups derived from the epoxy group-containing monomer (ma-2) remain in resin (A), the curability tends to be good.

[0063] Monomers (ma-2) are monomers that do not have an acid group and have an ethylenically unsaturated bond and an epoxy group. Examples of monomers (ma-2) include epoxy-group-containing (meth)acrylic acid ester derivatives such as oxyranyl (meth)acrylate, glycidyl (meth)acrylate, 2-methylglycidyl (meth)acrylate, 2-ethylglycidyl (meth)acrylate, 2-oxyranylethyl (meth)acrylate, 2-glycidyloxyethyl (meth)acrylate, 3-glycidyloxypropyl (meth)acrylate, and glycidyloxyphenyl (meth)acrylate; and 3,4-epoxycyclohexyl (meth)acrylate, 3,4-epoxycyclohexyl (meth)acrylate. Examples include epoxy group-containing (meth)acrylates such as chlorohexylmethyl (meth)acrylate, 2-(3,4-epoxycyclohexyl)ethyl (meth)acrylate, 2-(3,4-epoxycyclohexylmethyloxy)ethyl (meth)acrylate, and 3-(3,4-epoxycyclohexylmethyloxy)propyl (meth)acrylate, which contain epoxy group-containing alicyclic carbocyclic rings such as 3,4-epoxycyclohexane rings; vinyl ether compounds containing epoxy groups; and allyl ether compounds containing epoxy groups. Among these, epoxy group-containing (meth)acrylates such as oxyranyl (meth)acrylate, glycidyl (meth)acrylate, 2-methylglycidyl (meth)acrylate, 2-ethylglycidyl (meth)acrylate, 2-oxyranylethyl (meth)acrylate, 2-glycidyloxyethyl (meth)acrylate, 3-glycidyloxypropyl (meth)acrylate, and glycidyloxyphenyl (meth)acrylate are preferred from the viewpoint of polymerizability and ease of availability, and glycidyl (meth)acrylate is more preferred.

[0064] The monomer (ma-2) may be used alone or in combination of two or more types.

[0065] The content of constituent unit (a-2) is preferably 30 mol% or more, more preferably 50 mol% or more, and even more preferably 70 mol% or more, of the total constituent units of the copolymer precursor (PA2). The content of constituent unit (a-2) is preferably 95 mol% or less, more preferably 90 mol% or less, and even more preferably 85 mol% or less, of the total constituent units of the copolymer precursor (PA2). When the content of constituent unit (a-2) is 30 mol% or more, the amount of structure (Y1) and the acid value of resin (A) can be sufficiently secured, and the developability of the photosensitive resin composition or photosensitive colored composition is better. When the content of constituent unit (a-2) is 95 mol% or less, the storage stability of the photosensitive resin composition or photosensitive colored composition tends to be good.

[0066] (Constituent unit (a-3) having a cross-linked cyclic hydrocarbon group having 7 to 20 carbon atoms) Constituent unit (a-3) is not particularly limited as long as it does not have acid groups or epoxy groups and has a cross-linked cyclic hydrocarbon group having 7 to 20 carbon atoms. The cross-linked cyclic hydrocarbon group may be incorporated into the main chain of the copolymer precursor (PA1) or copolymer precursor (PA2). There may be only one type of constituent unit (a-3) or two or more types. Constituent unit (a-3) is a constituent unit derived from a monomer (ma-3) containing a cross-linked cyclic hydrocarbon group having 7 to 20 carbon atoms (hereinafter also simply referred to as "monomer (ma-3)"). The presence of constituent unit (a-3) in the copolymer precursor (PA1) or copolymer precursor (PA2) improves the heat resistance of the resulting resin (A) and tends to improve the brightness when used as a material for an image display element.

[0067] Monomer (ma-3) is a monomer that does not have an acid group or an epoxy group, and has an ethylenically unsaturated bond and a bridged cyclic hydrocarbon group having 7 to 20 carbon atoms. The ethylenically unsaturated bond may be present in the bridged cyclic hydrocarbon group. Specific examples of the monomer (ma-3) include (meth)acrylates having a bridged cyclic hydrocarbon group having 7 to 20 carbon atoms such as adamantyl (meth)acrylate, dicyclopentenyl (meth)acrylate, isobornyl (meth)acrylate, and tricyclodecanyl (meth)acrylate, norbornene (bicyclo[2.2.1]hept-2-ene), 5-vinylbicyclo[2.2.1]hept-2-ene, tetracyclo[4.4.0.1 ２，５ .1 ７，１０ dodec-3-ene, 8-ethyltetracyclo[4.4.0.1 ２，５ .1 ７，１０ dodec-3-ene, dicyclopentadiene, tricyclo[5.2.1.0 ２，６ dec-8-ene, tricyclo[4.4.0.1 ２，５ undec-3-ene, tricyclo[6.2.1.0 １，８ undec-9-ene, tetracyclo[4.4.0.1 ２，５ .1 ７，１０ .0 １，６ dodec-3-ene, 8-ethylidenetetracyclo[4.4.0.1 ２，５ .1 ７，１２ dodec-3-ene, pentacyclo[6.5.1.1 ３，６ .0 ２，７ .0 ９，１３ pentadeca-4-ene, and the like. The monomer (ma-3) may be used alone, or may be used in combination of two or more types.

[0068] In particular, from the viewpoint of surface hardness, (meth)acrylates having a bridged cyclic hydrocarbon group having 7 to 20 carbon atoms are preferred, and tricyclodecanyl (meth)acrylate is more preferred.

[0069] When the copolymer precursor (PA1) or copolymer precursor (PA2) has a constituent unit (a-3), the content of the constituent unit (a-3) is preferably 1 mol% or more, more preferably 3 mol% or more, and even more preferably 5 mol% or more, of the total constituent units of the copolymer precursor (PA1) or copolymer precursor (PA2). The content of the constituent unit (a-3) is preferably 50 mol% or less, more preferably 30 mol% or less, and even more preferably 20 mol% or less, of the total constituent units of the copolymer precursor (PA1) or copolymer precursor (PA2). When the content of the constituent unit (a-3) is 1 mol% or more, the heat resistance of the photosensitive resin composition or photosensitive colored composition is improved, and the brightness tends to improve when used as a material for an image display element. When the content of the constituent unit (a-3) is 50 mol% or less, the amount of structure (X1) or structure (Y1) can be sufficiently secured, and the developability of the photosensitive resin composition or photosensitive colored composition is better.

[0070] (Aromatic ring-containing constituent unit (a-4)) Constituent unit (a-4) is not particularly limited as long as it is a constituent unit that does not have an acid group, an epoxy group, or a cross-linked cyclic hydrocarbon group having 7 to 20 carbon atoms, and has an aromatic ring. Constituent unit (a-4) may be one type or two or more types. Constituent unit (a-4) is a constituent unit derived from an aromatic ring-containing monomer (ma-4) (hereinafter also simply referred to as "monomer (ma-4)"). When the copolymer precursor (PA1) or copolymer precursor (PA2) has constituent unit (a-4), the affinity between the resin (A) and the colorant (E) described later is improved, and a photosensitive colored composition with good dispersibility tends to be obtained.

[0071] Monomers (ma-4) are monomers that do not have acid groups, epoxy groups, or cross-linked cyclic hydrocarbon groups having 7 to 20 carbon atoms, but have an ethylenically unsaturated bond and an aromatic ring. Specific examples of monomers (ma-4) include aromatic ring-containing (meth)acrylates, aromatic vinyl compounds, N-phenylmaleimide, and (meth)acrylic acid anthracenilamide. Monomers (ma-4) may be used alone or in combination of two or more.

[0072] Examples of aromatic ring-containing (meth)acrylates include o-phenoxybenzyl (meth)acrylate, m-phenoxybenzyl (meth)acrylate, p-phenoxybenzyl (meth)acrylate, 2-(o-phenylphenoxy)ethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-(1-naphthyloxy)ethyl (meth)acrylate, benzyl (meth)acrylate, triphenylmethyl (meth)acrylate, phenyl (meth)acrylate, cumyl (meth)acrylate, 4-phenoxyphenyl (meth)acrylate, phenoxypolyethylene glycol (meth)acrylate, nonylphenoxypolyethylene glycol mono (meth)acrylate, biphenyloxyethyl (meth)acrylate, naphthalene (meth)acrylate, anthracene (meth)acrylate, and ethoxylated phenyl (meth)acrylate.

[0073] Examples of aromatic vinyl compounds include styrene, α-methylstyrene, o-vinyltoluene, p-vinyltoluene, o-chlorostyrene, m-chlorostyrene, methoxystyrene, p-nitrostyrene, p-cyanostyrene, p-acetylaminostyrene, vinyltoluene, and vinylpyridine.

[0074] In particular, from the standpoint of raw material procurement, styrene and benzyl (meth)acrylate are more preferred.

[0075] When the copolymer precursor (PA1) or copolymer precursor (PA2) has a constituent unit (a-4), the content of the constituent unit (a-4) is preferably 1 mol% or more, more preferably 5 mol% or more, even more preferably 10 mol% or more, and particularly preferably 20 mol% or more, of the total constituent units of the copolymer precursor (PA1) or copolymer precursor (PA2). The content of the constituent unit (a-4) is preferably 80 mol% or less, more preferably 75 mol% or less, and even more preferably 60 mol% or less, of the total constituent units of the copolymer precursor (PA1) or copolymer precursor (PA2). When the content of the constituent unit (a-4) is 1 mol% or more, the affinity between the resin (A) and the colorant (E) described later is improved, and a photosensitive colored composition with good dispersibility tends to be obtained. When the content of the constituent unit (a-4) is 80 mol% or less, the amount of structure (X1) or structure (Y1) can be sufficiently secured, and the developability of the photosensitive resin composition or photosensitive colored composition is better.

[0076] (Other constituent units (a-5)) Constituent units (a-5) are not particularly limited as long as they do not have acid groups, epoxy groups, cross-linked cyclic hydrocarbon groups having 7 to 20 carbon atoms, or aromatic rings. There may be only one type of constituent unit (a-5) or two or more types. Constituent units (a-5) are constituent units derived from other monomers (ma-5) (hereinafter also simply referred to as "monomer (ma-5)"). By having constituent units (a-5) in the copolymer precursor (PA1) or copolymer precursor (PA2), it is possible to adjust the developability of the photosensitive resin composition or photosensitive colored composition or to add other properties.

[0077] Monomer (ma-5) is a monomer that does not have an acid group, epoxy group, crosslinked cyclic hydrocarbon group having 7 to 20 carbon atoms, or aromatic ring, and is copolymerizable with monomers (ma-1) to (ma-4). Specific examples of monomer (ma-5) include dienes, (meth)acrylic acid esters, (meth)acrylamides, vinyl compounds, unsaturated dicarboxylic acid diesters, monomaleimides, (meth)acrylic acid anilides, (meth)acrylonitriles, and acrolein.

[0078] Examples of dienes include butadiene, isoprene, and chloroprene.

[0079] Examples of (meth)acrylic acid esters include alkyl (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, isopropyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, isoamyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, dodecyl (meth)acrylate, cyclohexyl (meth)acrylate, and methylcyclohexyl (meth)acrylate; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 2,3-dihydroxypropyl (meth)acrylate, and 4-hydroxypropyl (meth)acrylate. Examples include hydroxyalkyl (meth)acrylates such as tyl (meth)acrylate; 2-(2-hydroxyethoxy)ethyl (meth)acrylate, 2-[2-[2-(2-hydroxyethoxy)ethoxy]ethoxy]ethyl (meth)acrylate, hexaethylene glycol mono(meth)acrylate, octaethylene glycol mono(meth)acrylate, rosin (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 1,1,1-trifluoroethyl (meth)acrylate, perfluoroethyl (meth)acrylate, perfluoro-n-propyl (meth)acrylate, and 3-(N,N-dimethylamino)propyl (meth)acrylate.

[0080] Examples of (meth)acrylamide include (meth)acrylamide, (meth)acrylate N,N-dimethylamide, and (meth)acrylate N,N-diisopropylamide.

[0081] Examples of vinyl compounds include vinyl chloride, vinylidene chloride, vinyl fluoride, vinylidene fluoride, N-vinylpyrrolidone, and vinyl acetate.

[0082] Examples of unsaturated dicarboxylic acid diesters include diethyl citraconate, diethyl maleate, diethyl fumarate, and diethyl itaconate.

[0083] Examples of monomaleimides include N-cyclohexylmaleimide and N-laurylmaleimide.

[0084] The monomer (ma-5) may be used alone or in combination of two or more types.

[0085] When the copolymer precursor (PA1) or copolymer precursor (PA2) contains a constituent unit (a-5), the content of the constituent unit (a-5) is preferably 1 mol% or more, more preferably 2 mol% or more, even more preferably 5 mol% or more, and particularly preferably 10 mol% or more, of the total constituent units of the copolymer precursor (PA1) or copolymer precursor (PA2). The content of the constituent unit (a-5) is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less, of the total constituent units of the copolymer precursor (PA1) or copolymer precursor (PA2). When the content of the constituent unit (a-5) is 1 mol% or more, it tends to impart the necessary functions to the photosensitive resin composition or photosensitive colored composition. When the content of the constituent unit (a-5) is 50 mol% or less, the content of the structure (X1) or the structure (Y1) can be sufficiently secured, and the developability of the photosensitive resin composition or photosensitive colored composition is better.

[0086] [Reactive Diluent (B)] The reactive diluent (B) may be any low molecular weight compound having at least one ethylenically unsaturated group, and is not particularly limited. In this specification, a low molecular weight compound is a compound with a molecular weight of less than 1,000. Examples of ethylenically unsaturated groups include vinyl groups, allyl groups, (meth)acryloyloxy groups, etc. From the viewpoint of improving curability, a polyfunctional reactive diluent having multiple ethylenically unsaturated groups is preferred. Specific examples of the reactive diluent (B) include aromatic vinyl compounds; aromatic allyl compounds such as diallyl phthalate and diallylbenzenephosphonate; vinyl carboxylates such as vinyl acetate and vinyl adipate; monofunctional (meth)acrylates; polyfunctional (meth)acrylates; triallyl cyanurate, etc.

[0087] Specific examples of aromatic vinyl compounds include styrene, α-methylstyrene, α-chloromethylstyrene, vinyltoluene, and divinylbenzene.

[0088] Specific examples of monofunctional (meth)acrylates include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, β-hydroxyethyl (meth)acrylate, and hydroxypropyl (meth)acrylate.

[0089] Specific examples of polyfunctional (meth)acrylates include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and tri(meth)acrylate of tris(hydroxyethyl) isocyanurate.

[0090] Among these, as the reactive diluent (B), polyfunctional (meth)acrylates are preferred in order to improve reactivity, and at least one selected from dipentaerythritol penta(meth)acrylate and dipentaerythritol hexa(meth)acrylate is particularly preferred.

[0091] The reactive diluent (B) may be used alone or in combination of two or more types.

[0092] The content of reactive diluent (B) in the photosensitive resin composition or photosensitive colored composition is preferably 10% by mass or more, more preferably 25% by mass or more, and even more preferably 40% by mass or more, relative to the total of resin (A), reactive diluent (B), and other resins having an optional ethylenically unsaturated group. The content of reactive diluent (B) is preferably 90% by mass or less, more preferably 75% by mass or less, and even more preferably 60% by mass or less, relative to the total of resin (A), reactive diluent (B), and other resins having an optional ethylenically unsaturated group. When the content of reactive diluent (B) is within the above range, the viscosity of the photosensitive resin composition or photosensitive colored composition becomes suitable for handling, and in addition, the photocurability tends to be better.

[0093] [Photopolymerization initiator (C)] The photopolymerization initiator (C) is not particularly limited, but examples include 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl-]-,-1-(O-acetyloxime); benzoin and its alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin butyl ether; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, and 4'-(1-t-butyldioxy-1-methylethyl)acetophenone; 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one; 2-benzyl-2-dimethylamino-1-(4-morpholino Examples include anthraquinone compounds such as nophenyl)butanone-1, 2-methylanthraquinone, 2-amylanthraquinone, 2-t-butylanthraquinone, and 1-chloroanthraquinone; xanthones; thioxanthone compounds such as thioxanthone, 2,4-dimethylthioxanthone, 2,4-diisopropylthioxanthone, and 2-chlorothioxanthone; ketal compounds such as acetophenone dimethyl ketal and benzyl dimethyl ketal; benzophenone compounds such as benzophenone, 4-(1-t-butyldioxy-1-methylethyl)benzophenone, and 3,3',4,4'-tetrakis(t-butyldioxycarbonyl)benzophenone; and acylphosphine oxide-based photopolymerization initiators. The photopolymerization initiator (C) may be used alone or in combination of two or more types.

[0094] The content of the photopolymerization initiator (C) in the photosensitive resin composition or photosensitive colored composition is preferably 0.1 parts by mass or more, more preferably 0.5 parts by mass or more, and even more preferably 1.0 part by mass or more, based on 100 parts by mass of the total of the resin (A), reactive diluent (B), and other resins having an optional ethylenically unsaturated group. The content of the photopolymerization initiator (C) in the photosensitive resin composition or photosensitive colored composition is preferably 30 parts by mass or less, more preferably 15 parts by mass or less, and even more preferably 10 parts by mass or less, based on 100 parts by mass of the total of the resin (A), reactive diluent (B), and other resins having an optional ethylenically unsaturated group. When the content of the photopolymerization initiator (C) is 0.1 parts by mass or more, there is a tendency to obtain a photosensitive resin composition or photosensitive colored composition with good photocurability. When the content of the photopolymerization initiator (C) is 30 parts by mass or less, it tends to prevent adverse effects on the physical properties of the cured product of the photosensitive resin composition or photosensitive colored composition due to an excessive amount of the photopolymerization initiator (C).

[0095] [Solvent (D)] Examples of solvent (D) include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether, diethylene glycol monoalkyl ethers such as diethylene glycol monomethyl ether and diethylene glycol mono-n-butyl ether, propylene glycol monoalkyl ethers such as triethylene glycol monomethyl ether, propylene glycol monomethyl ether and propylene glycol monoethyl ether, dipropylene glycol monoalkyl ethers such as dipropylene glycol monomethyl ether and dipropylene glycol monoalkyl ether, tripropylene glycol monoalkyl ethers such as tripropylene glycol monoethyl ether and (poly)alkylene glycol monoalkyl ethers such as 3-methoxy-1-butanol; hydroxyl group-containing carboxylic acid esters such as methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyethyl acetate, and methyl 2-hydroxy-3-methylbutyrate; and diethylene glycol Hydroxyl group-containing organic solvents such as chol; and (poly)alkylene glycol monoalkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, and propylene glycol monoethyl ether acetate; ethers such as diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, and tetrahydrofuran; methyl ethyl ketone, cyclohexanone, Ketones such as 2-heptanone and 3-heptanone; esters such as methyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl ethoxyacetate, methyl-3-methoxybutyl acetate, methyl-3-methoxybutylpropionate, ethyl acetate, n-butyl acetate, i-propyl acetate, i-butyl acetate, n-amyl acetate, i-amyl acetate, n-butyl propionate, ethyl butyrate, n-propyl butyrate, i-propyl butyrate, ethyl pyruvate, n-propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, ethyl 2-oxobutyrate;Examples include aromatic hydrocarbons such as toluene and xylene; and hydroxyl-free organic solvents such as carboxylic acid amides such as N-methylpyrrolidone, N,N-dimethylformamide, and N,N-dimethylacetamide. Solvent (D) may be used alone or in combination of two or more.

[0096] Among these solvents (D), it is preferable to use compounds having an ether structure from the viewpoint of ease of availability, cost, and stability during resist preparation. More specifically, it is more preferable to use at least one selected from propylene glycol monomethyl ether acetate, diethylene glycol methyl ethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, and 3-methoxy-1-butanol.

[0097] The content of solvent (D) in the photosensitive resin composition or photosensitive colored composition is preferably 30 parts by mass or more, and more preferably 50 parts by mass or more, based on 100 parts by mass of the total components excluding solvent (D). The content of solvent (D) in the photosensitive resin composition or photosensitive colored composition is preferably 1,000 parts by mass or less, and more preferably 800 parts by mass or less, based on 100 parts by mass of the total components excluding solvent (D). When the content of solvent (D) is 30 parts by mass or more, the viscosity of the photosensitive resin composition or photosensitive colored composition tends to be within an appropriate range. When the content of solvent (D) is 1,000 parts by mass or less, the solvent (D) tends to be easily removed when removing it from a coating film formed by applying the photosensitive resin composition or photosensitive colored composition to a substrate.

[0098] <Photosensitive Colored Composition> The photosensitive colored composition contains a coloring agent (E) in addition to the above-mentioned photosensitive resin composition. The photosensitive colored composition containing the coloring agent (E) can be used as a material for color filters.

[0099] [Coloring agent (E)] The coloring agent (E) is not particularly limited as long as it is soluble or dispersed in the solvent (D), and examples include dyes and pigments.

[0100] As dyes, it is preferable to use acidic dyes having acidic groups such as carboxyl groups and sulfo groups, salts of acidic dyes with nitrogen compounds, and sulfonamide adducts of acidic dyes, from the viewpoint of solubility in solvent (D) and alkaline developer, interaction with other components in the photosensitive coloring composition, and heat resistance.

[0101] Examples of such dyes include acid alizarin violet N; acid black 1, 2, 24, 48; acid blue 1, 7, 9, 25, 29, 40, 45, 62, 70, 74, 80, 83, 90, 92, 112, 113, 120, 129, 147; solvent blue 38, 44, 70; acid chrome violet K; acid Fuchsin; acid green 1, 3, 5, 25, 27, 50; acid orange 6, 7, 8, 10, 12, 50, 51, 52, 56, 63, 74, 95; acid red 1, 4, 8, 14, 17, 18, 26, 27, 29, 31, 34, 35, 37, 42, 44, 50, 51, 52, 57, 69, 73, 80, 87, 88, 91, 92, 94, 97, 103, 111, 114 ,129,133,134,138,143,145,150,151,158,176,183,198,211,215,216,217,249,252,257,260,266,274;acid violet 6B, 7, 9, 17, 19; acid yellow Examples include 1, 3, 9, 11, 17, 23, 25, 29, 34, 36, 42, 54, 72, 73, 76, 79, 98, 99, 111, 112, 114, 116; food yellow 3 and derivatives thereof. Among these, azo, xanthene, anthraquinone, or phthalocyanine acid dyes are preferred. The dyes may be used individually or in combination of two or more.

[0102] Examples of pigments include yellow pigments such as C.I. Pigment Yellow 1, 3, 12, 13, 14, 15, 16, 17, 20, 24, 31, 53, 83, 86, 93, 94, 109, 110, 117, 125, 128, 137, 138, 139, 147, 148, 150, 153, 154, 166, 173, 194, 214; orange pigments such as C.I. Pigment Orange 13, 31, 36, 38, 40, 42, 43, 51, 55, 59, 61, 64, 65, 71, 73; C.I. Examples include red pigments such as Pigment Red 9, 97, 105, 122, 123, 144, 149, 166, 168, 176, 177, 180, 192, 209, 215, 216, 224, 242, 254, 255, 264, and 265; blue pigments such as C.I. Pigment Blue 15, 15:3, 15:4, 15:6, and 60; violet pigments such as C.I. Pigment Violet 1, 19, 23, 29, 32, 36, and 38; green pigments such as C.I. Pigment Green 7, 36, 58, and 59; brown pigments such as C.I. Pigment Brown 23 and 25; and black pigments such as C.I. Pigment Black 1, 7, carbon black, titanium black, and iron oxide. Pigments may be used individually or in combination of two or more types.

[0103] The colorant (E) can be appropriately determined, for example, according to the desired coloring pattern, i.e., the color of the black matrix and pixels. The colorant (E) may be used alone or in combination of two or more types. When using two or more types of colorant (E), a combination of dyes and pigments may be used.

[0104] When a pigment is used as the coloring agent (E), a known dispersant may be added to the photosensitive coloring composition from the viewpoint of improving the dispersibility of the pigment. As the dispersant, it is preferable to use a polymeric dispersant that has excellent dispersion stability over time. Examples of polymeric dispersants include urethane-based dispersants, polyethyleneimine-based dispersants, polyoxyethylene alkyl ether-based dispersants, polyoxyethylene glycol diester-based dispersants, sorbitan aliphatic ester-based dispersants, and aliphatic-modified ester-based dispersants. As polymeric dispersants, commercially available products under trade names such as EFKA (EFKA Chemicals B.V.), Disperbyk (Vic Chemie), Disparon (Kusumoto Chemicals Co., Ltd.), and SOLSPERSE (Lubrisol) may be used. The content of the dispersant should be appropriately set according to the type and amount of pigment used as the coloring agent (E).

[0105] The content of the colorant (E) in the photosensitive colored composition is preferably 0.1 parts by mass or more, more preferably 5 parts by mass or more, and even more preferably 10 parts by mass or more, based on 100 parts by mass of the total of the resin (A), reactive diluent (B), and other resins having an optional ethylenically unsaturated group. The content of the colorant (E) in the photosensitive colored composition is preferably 80 parts by mass or less, more preferably 70 parts by mass or less, and even more preferably 60 parts by mass or less, based on 100 parts by mass of the total of the resin (A), reactive diluent (B), and other resins having an optional ethylenically unsaturated group. When the content of the colorant (E) is 0.1 parts by mass or more, the effect of including the colorant (E) becomes significant, and a photosensitive colored composition suitable as a material for the coloring pattern of a color filter tends to be obtained. When the content of the colorant (E) is 80 parts by mass or less, the colorant (E) does not interfere with the curability of the photosensitive colored composition, and a photosensitive colored composition with good curability tends to be obtained.

[0106] [Other Components] In addition to the resin (A), reactive diluent (B), photopolymerization initiator (C), solvent (D), and optionally other resins and colorants (E) having ethylenically unsaturated groups, known additives such as coupling agents, leveling agents, and polymerization inhibitors may be added as needed. The amount of additives added is not particularly limited, as long as it does not hinder the effects of the present invention.

[0107] <Method for producing resin (A)> Resin (A) can be obtained, for example, by copolymerizing monomers to obtain a copolymer precursor, and then introducing structure (X1) and an optional structure (X2), or structure (Y1), an optional structure (Y2), and an optional structure (Z) into the obtained copolymer precursor.

[0108] The copolymerization reaction can be carried out in or without a solvent according to radical polymerization methods known in the art. For example, the monomer can be dissolved in an organic solvent, a polymerization initiator can be added to the solution, and the polymerization reaction can be carried out at 50 to 130°C for 1 to 20 hours.

[0109] As the solvent used in the copolymerization reaction, the same solvent as solvent (D) described above can be used. Other examples include propylene glycol monoaryl ether, 1,3-propanediol monoalkyl ether, 1,3-butanediol monoalkyl ether, 1,4-butanediol monoalkyl ether, glycerin monoalkyl ether, glycerin dialkyl ether, methanol, ethanol, propanol, C5-6 cycloalkanediol, C5-6 cycloalkanedimethanol, ethyl lactate, and diacetone alcohol, which are hydroxyl group-containing organic solvents. Note that "C5-6 cycloalkane" means that the cycloalkyl group has 5-6 carbon atoms. The solvent may be used alone or in combination of two or more types.

[0110] Polymerization initiators that can be used in copolymerization reactions are not particularly limited, but examples include azobisisobutyronitrile, azobisisovaleronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), benzoyl peroxide, and t-butylperoxy-2-ethylhexanoate. Polymerization initiators may be used alone or in combination of two or more. The amount of polymerization initiator used is generally 0.5 to 20 parts by mass, preferably 1.0 to 18 parts by mass, per 100 parts by mass of the total amount of monomer.

[0111] The resin (A) in the first embodiment can be produced by a method comprising the steps of: copolymerizing an acid group-containing monomer (ma-1), optionally a crosslinked cyclic hydrocarbon group-containing monomer (ma-3) having 7 to 20 carbon atoms, an aromatic ring-containing monomer (ma-4), and other monomers (ma-5) to obtain a copolymer precursor (PA1); and adding an alkyl glycidyl ether having 1 to 10 carbon atoms in the alkyl group and optionally an epoxy group-containing ethylenically unsaturated compound to a portion of the acid group of the constituent unit (a-1) of the copolymer precursor (PA1) to obtain resin (A). The proportions of constituent units (a-1), (a-3), (a-4), and (a-5) contained in the copolymer precursor (PA1) are equivalent to the proportions of each monomer (ma-1), monomer (ma-3), monomer (ma-4), and monomer (ma-5) in the total amount of all monomers used as raw materials for the copolymer precursor (PA1).

[0112] In this embodiment, the proportion of each monomer used in the copolymerization reaction to form the copolymer precursor (PA1) is not particularly limited. Preferably, monomer (ma-1) is 10 to 95 mol%, monomer (ma-3) is 1 to 50 mol%, and monomer (ma-4) is 1 to 80 mol%, more preferably monomer (ma-1) is 20 to 85 mol%, monomer (ma-3) is 3 to 30 mol%, and monomer (ma-4) is 5 to 75 mol%, even more preferably monomer (ma-1) is 30 to 80 mol%, monomer (ma-3) is 5 to 20 mol%, and monomer (ma-4) is 20 to 60 mol%, and even more preferably monomer (ma-1) is 30 to 70 mol%, monomer (ma-3) is 5 to 20 mol%, and monomer (ma-4) is 20 to 60 mol%. When other monomers (ma-5) are used, preferably, monomer (ma-1) is 10 to 95 mol%, monomer (ma-3) is 1 to 50 mol%, monomer (ma-4) is 1 to 80 mol%, and monomer (ma-5) is 1 to 50 mol%, more preferably, monomer (ma-1) is 20 to 85 mol%, monomer (ma-3) is 3 to 30 mol%, monomer (ma-4) is 5 to 75 mol%, and monomer (ma-5) is 5 to 40 mol%, and even more preferably, monomer (ma-1) is 30 to 70 mol%, monomer (ma-3) is 5 to 20 mol%, monomer (ma-4) is 20 to 60 mol%, and monomer (ma-5) is 5 to 30 mol%.

[0113] The resin (A) in the second embodiment can be produced by a method comprising, for example, the steps of: copolymerizing an epoxy group-containing monomer (ma-2), optionally a cross-linked cyclic hydrocarbon group-containing monomer (ma-3) having 7 to 20 carbon atoms, an aromatic ring-containing monomer (ma-4), and other monomers (ma-5) to obtain a copolymer precursor (PA2); adding a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms and optionally a carboxyl group-containing ethylenically unsaturated compound to at least a portion of the epoxy groups of the constituent units (a-2) of the copolymer precursor (PA2); and optionally adding a polybasic acid or polybasic acid anhydride to a portion of the hydroxyl groups formed by ring-opening of the epoxy groups by an addition reaction to the copolymer precursor (PA2) to obtain resin (A). The proportions of constituent units (a-2), (a-3), (a-4), and (a-5) contained in the copolymer precursor (PA2) are equivalent to the proportions of each monomer (ma-2), monomer (ma-3), monomer (ma-4), and monomer (ma-5) in the total amount of all monomers used as raw materials for the copolymer precursor (PA2).

[0114] In this embodiment, the proportions of each monomer used in the copolymerization reaction to form the copolymer precursor (PA2) are not particularly limited. Preferably, monomer (ma-2) is 30 to 95 mol%, monomer (ma-3) is 1 to 50 mol%, and monomer (ma-4) is 1 to 80 mol%, more preferably monomer (ma-2) is 50 to 90 mol%, monomer (ma-3) is 3 to 30 mol%, and monomer (ma-4) is 5 to 75 mol%, and even more preferably monomer (ma-2) is 70 to 85 mol%, monomer (ma-3) is 5 to 20 mol%, and monomer (ma-4) is 10 to 60 mol%. When other monomers (ma-5) are used, preferably, monomer (ma-2) is 30 to 95 mol%, monomer (ma-3) is 1 to 50 mol%, monomer (ma-4) is 1 to 80 mol%, and monomer (ma-5) is 1 to 50 mol%, more preferably, monomer (ma-2) is 50 to 90 mol%, monomer (ma-3) is 3 to 30 mol%, monomer (ma-4) is 5 to 75 mol%, and monomer (ma-5) is 2 to 40 mol%, and even more preferably, monomer (ma-2) is 70 to 85 mol%, monomer (ma-3) is 5 to 20 mol%, monomer (ma-4) is 5 to 60 mol%, and monomer (ma-5) is 5 to 30 mol%.

[0115] As a method for adding an alkylglycidyl ether having 1 to 10 carbon atoms in the alkyl group and an optionally selected epoxy group-containing ethylenically unsaturated compound, or a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms and an optionally selected carboxyl group-containing ethylenically unsaturated compound, known addition reactions can be used. For example, after adding a polymerization inhibitor and a catalyst to the reaction solution in which the copolymerization reaction has been carried out, an alkylglycidyl ether having 1 to 10 carbon atoms in the alkyl group and an optionally selected epoxy group-containing ethylenically unsaturated compound, or a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms and an optionally selected carboxyl group-containing ethylenically unsaturated compound can be added, and the addition reaction can be carried out under conditions of room temperature (23°C) to 150°C, preferably 50 to 120°C. As a method for adding a polybasic acid or polybasic acid anhydride, known addition reactions can be used. For example, a polybasic acid or polybasic anhydride may be added to a reaction solution obtained by the addition reaction of a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms and an optionally selected carboxyl-containing ethylenically unsaturated compound, and the addition reaction may be carried out under conditions of room temperature (23°C) to 150°C, preferably 50 to 120°C.

[0116] If resin (A) has ethylenically unsaturated groups, a polymerization inhibitor may be used to prevent side reactions of the introduced ethylenically unsaturated groups. Specific examples of polymerization inhibitors include hydroquinone, methyl hydroquinone, hydroquinone monomethyl ether, and dibutylhydroxytoluene.

[0117] Specific examples of catalysts include quaternary ammonium salts such as triethylbenzylammonium chloride, phosphorus compounds such as triphenylphosphine, triphenylphosphine-benzoquinone, tris(2,6-dimethoxyphenyl)phosphine, triparathylphosphine, tricyclohexylphosphine, tetraphenylphosphonium salts, and 4-hydroxy-2-(triphenylphosphonium)phenolate, as well as organometallic compounds containing metals such as chromium and tin. The amount of catalyst used is preferably 0.1 to 12 parts by mass, and more preferably 1.0 to 6.0 parts by mass, per 100 parts by mass of the total amount of monomers used in the copolymerization reaction of the copolymer precursor and compounds to be added to the copolymer precursor.

[0118] <Methods for producing photosensitive resin composition and photosensitive colored composition> The photosensitive resin composition of one embodiment can be produced by mixing a resin (A), a reactive diluent (B), a photopolymerization initiator (C), a solvent (D), and optionally an optional component using a known mixing apparatus. The photosensitive colored composition of one embodiment can be produced by mixing a resin (A), a reactive diluent (B), a photopolymerization initiator (C), a solvent (D), a colorant (E), and optionally an optional component using a known mixing apparatus.

[0119] When manufacturing a photosensitive resin composition or a photosensitive colored composition, the reaction solution used to manufacture resin (A) can be used as a raw material. In this case, the solvent contained in the reaction solution can be used as part or all of the solvent (D) contained in the photosensitive resin composition or the photosensitive colored composition.

[0120] When producing a photosensitive resin composition or a photosensitive colored composition, resin (A) isolated from a reaction solution containing resin (A) by a known method may be used as a raw material.

[0121] The resin (A) contained in the photosensitive resin composition or photosensitive colored composition has an acid value, and therefore the photosensitive resin composition and photosensitive colored composition have good alkali developability. Since such photosensitive resin compositions and photosensitive colored compositions have excellent alkali developability, for example, a cured product having a predetermined pattern shape can be formed by applying it to a substrate to form a coating film, exposing it through a photomask corresponding to a predetermined pattern shape, developing the unexposed areas with an alkaline aqueous solution, and then performing a baking treatment.

[0122] For these reasons, the photosensitive resin composition and the photosensitive colored composition are extremely useful as materials for forming components of image display elements, such as pixels in color filters, black matrices, color filter protective films, photospacers, liquid crystal alignment protrusions, microlenses, and insulating films for touch panels. Because the photosensitive resin composition and the photosensitive colored composition have excellent developability, they are particularly suitable for use in the manufacture of large panels.

[0123] <Resin-cured film> The resin-cured film of one embodiment is a cured product of a photosensitive resin composition or a photosensitive colored composition.

[0124] A resin-cured film can be manufactured, for example, by applying a photosensitive resin composition or a photosensitive colored composition onto a substrate, volatilizing and removing the solvent (D) to form a coating film, exposing the coating film to light-curing, and then performing a baking treatment.

[0125] When forming a resin-cured film having a predetermined pattern shape, for example, the following method can be used. That is, a photosensitive resin composition or a photosensitive colored composition is applied to a substrate, and the solvent (D) is evaporated and removed to form a coating film. Next, the coating film is exposed to light through a photomask having a predetermined pattern shape to photocur the exposed portion. Then, the unexposed portion of the coating film is developed with an alkaline aqueous solution. After that, the developed coating film is subjected to a baking treatment to form a resin-cured film having a predetermined pattern shape.

[0126] When manufacturing a cured resin film, known methods can be used for applying the photosensitive resin composition or photosensitive colored composition, for exposing the applied film to light, and for developing the film.

[0127] The baking conditions performed when manufacturing the resin-cured film can be appropriately determined according to the composition of the photosensitive resin composition or photosensitive coloring composition, the film thickness of the coating, the material of the substrate, etc. The baking treatment can be carried out at a temperature of, for example, 70°C to 250°C. The baking treatment temperature is preferably 150°C or higher, and more preferably 200°C or higher.

[0128] The baking process performed when manufacturing the resin-cured film can be carried out for, for example, 10 minutes to 4 hours, preferably 20 minutes to 2 hours, and can be appropriately determined depending on the composition of the photosensitive resin composition or photosensitive coloring composition, the baking temperature, the film thickness of the coated film, etc.

[0129] The resin-cured film can be preferably used as a component of a transparent film, protective film, insulating film, overcoat, photospacer, black matrix, black column spacer, or color filter. The resin-cured film has particularly good adhesion to glass substrates.

[0130] <Color Filter> A color filter of one embodiment comprises a colored pattern which is a cured product of a photosensitive colored composition. Preferably, the color filter has a colored pattern which is a cured product of a photosensitive colored composition in which the total content of resin (A) and the other resin having an optional ethylenically unsaturated group is 10 to 90% by mass relative to the total of resin (A), reactive diluent (B), and other resin having an optional ethylenically unsaturated group is 10 to 90% by mass, the content of reactive diluent (B) is 10 to 90% by mass, the content of photopolymerization initiator (C) is 0.1 to 30 parts by mass, the content of colorant (E) is 0.1 to 80 parts by mass, and the content of solvent (D) is 30 to 1,000 parts by mass relative to the total of components excluding solvent (D).

[0131] A color filter may include, for example, a substrate, RGB pixels formed thereon, a black matrix formed at the boundary of each pixel, and a protective film formed on the pixels and the black matrix.

[0132] In the color filter, at least a portion of the pixels and black matrix are colored patterns which are cured products of the above-mentioned photosensitive colored composition. Other components of the color filter can be those known.

[0133] The substrate used in the color filter is not particularly limited, and glass substrates, silicon substrates, polycarbonate substrates, polyester substrates, polyamide substrates, polyamide-imide substrates, polyimide substrates, aluminum substrates, printed circuit boards, array substrates, etc., can be used as appropriate depending on the application.

[0134] <Method for Manufacturing Color Filters> Next, an example method for manufacturing color filters will be described. First, a colored pattern is formed on the substrate. Specifically, a colored pattern that will become the black matrix formed at the boundary of each pixel, and a colored pattern that will become each RGB pixel are sequentially formed on the substrate by the method shown below.

[0135] The colored pattern can be formed by photolithography. Specifically, a photosensitive colored composition is applied to a substrate to form a coating film. Then, the coating film is exposed to light through a photomask having a predetermined pattern shape, and the exposed areas are photocured. Next, the unexposed areas of the coating film are developed with an alkaline aqueous solution. After that, a baking treatment is performed on the developed coating film to form a colored pattern having a predetermined pattern shape.

[0136] The method for applying the photosensitive colored composition is not particularly limited, but known methods such as screen printing, roll coating, curtain coating, spray coating, and spin coating can be used.

[0137] Furthermore, after applying the photosensitive coloring composition to the substrate, the substrate may be heated using a heating means such as a circulating oven, infrared heater, or hot plate, if necessary, to volatilize and remove the solvent (D) contained in the coating film. The conditions for heating the substrate to remove the solvent (D) are not particularly limited and can be set appropriately according to the substrate material, the composition of the photosensitive coloring composition, the thickness of the coating film, etc. For example, the substrate can be heated at a temperature of 50°C to 120°C for 30 seconds to 30 minutes.

[0138] Next, the coated film formed in this manner is irradiated with an active energy ray, such as ultraviolet light or excimer laser light, through a negative-type photomask to partially expose it and photo-cure the exposed portion. The amount of active energy irradiated onto the coated film can be appropriately selected according to the composition of the photosensitive coloring composition, for example, 30 to 2000 mJ / cm². ２This can be done. The light source used for exposure is not particularly limited, but low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, xenon lamps, metal halide lamps, etc., can be used.

[0139] The alkaline aqueous solution used for developing the coating film is not particularly limited, but can be used: aqueous solutions of inorganic alkali compounds such as sodium carbonate, potassium carbonate, calcium carbonate, sodium hydroxide, and potassium hydroxide; aqueous solutions of amine compounds such as ethylamine, diethylamine, and dimethylethanolamine; aqueous solutions of quaternary ammonium salts such as tetramethylammonium sulfate, hydrochloride, or p-toluenesulfonate; aqueous solutions of aniline compounds and their salts such as 3-methyl-4-amino-N,N-diethylaniline, 3-methyl-4-amino-N-ethyl-N-β-hydroxyethylaniline, 3-methyl-4-amino-N-ethyl-N-β-methanesulfonamideethylaniline, 3-methyl-4-amino-N-ethyl-N-β-methoxyethylaniline, and their sulfates, hydrochloride, or p-toluenesulfonate; and aqueous solutions of p-phenylenediamine compounds and their salts. Additives such as defoamers and surfactants may be added to the alkaline aqueous solution as needed.

[0140] After developing the coating film using the above-mentioned alkaline aqueous solution, it is preferable to wash the coating film with water and dry it.

[0141] The baking conditions performed when manufacturing color filters can be appropriately determined according to the composition of the photosensitive coloring composition, the thickness of the coating film, the material of the substrate, etc. The baking temperature can be, for example, 70°C to 250°C. When the baking temperature is 70°C or higher, good curing properties are obtained, and a cured product with excellent solvent resistance tends to be obtained. The baking temperature is preferably 150°C or higher, and more preferably 200°C or higher. When the baking temperature is 230°C or lower, it is preferable because it is possible to use materials with low heat resistance, such as substrates with low heat resistance, as the material for the color filter.

[0142] The baking process performed when manufacturing color filters can be carried out for, for example, 10 minutes to 4 hours, preferably 20 minutes to 2 hours, and can be appropriately determined depending on the composition of the photosensitive coloring composition, the temperature of the baking process, the thickness of the coated film, etc.

[0143] Using the method for manufacturing the colored patterns described above, a colored pattern is formed to represent each RGB pixel, and a colored pattern is formed to represent the black matrix at the boundary of each pixel. Then, a protective film is formed on the colored patterns (each RGB pixel and the black matrix).

[0144] The method for manufacturing the protective film is not particularly limited and may be formed using the photosensitive resin composition of one embodiment, or using known materials and known methods.

[0145] A color filter can be obtained through the above process.

[0146] Here, we have described an example in which a colored pattern is produced using a photosensitive colored composition containing a photopolymerization initiator (C) and a method of photocuring the photosensitive colored composition. However, for example, instead of the photopolymerization initiator (C) contained in the photosensitive colored composition, a photosensitive colored composition containing a resin with increased content of a curing accelerator and epoxy groups derived from constituent unit (a-2) may be used, and a colored pattern, which is a cured product of the photosensitive colored composition containing resin (A), may be formed by applying it to a substrate using an inkjet method and then heating it.

[0147] <Image Display Element> An image display element in one embodiment includes a color filter. Other components of the image display element can be those known to be used. Specific examples of image display elements include solid-state image sensors such as liquid crystal display elements, organic EL display elements, CCD elements, and CMOS elements.

[0148] The components of an image display element other than the color filter can be manufactured by known methods. For example, when manufacturing a liquid crystal display element as an image display element, it can be manufactured using the method shown below. First, a color filter is formed on a substrate using the method described above. Then, electrodes, spacers, etc., are sequentially formed on the substrate having the color filter. Next, electrodes, etc., are formed on another substrate and bonded together with the substrate having the color filter, facing each other. Then, a predetermined amount of liquid crystal is injected between the opposing substrates and sealed.

[0149] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to the following examples.

[0150] <Method for measuring acid value> The number of mg of potassium hydroxide required to neutralize the acidic components contained in 1 g of resin was measured according to JIS K6901:2008 5.3.2. Measuring instrument: 776 Dosimat (Metrohm) Mixed indicator: Mixed indicator of bromothymol blue and phenol red

[0151] An example of resin (A) synthesis is shown below.

[0152] [Synthesis Example 1] 192 g of propylene glycol monomethyl ether acetate (Kuraray Trading Co., Ltd.) as solvent (D) was placed in a flask equipped with a stirrer, dropping funnel, condenser, thermometer, and gas inlet tube, and the mixture was stirred while purging with nitrogen gas, and the temperature was raised to 118°C.

[0153] Next, a raw material monomer solution was prepared by mixing 44 g (10 mol%) of TCDMA as monomer (ma-3), 148 g (42 mol%) of BZMA as monomer (ma-4), 83 g (48 mol%) of methacrylic acid as monomer (ma-1), 88 g (32 parts by mass per 100 parts by mass of the total monomer components) of propylene glycol monomethyl ether acetate as solvent (D), and 16 g (6.0 parts by mass per 100 parts by mass of the total monomer components) of TBO (t-butyl peroxy-2-ethylhexanoate, NOF Corporation) as a polymerization initiator.

[0154] The entire volume of the prepared raw material monomer solution was added dropwise over 1 hour using a dropping funnel to solvent (D) in a flask under atmospheric pressure and nitrogen gas atmosphere. After the addition was complete, the solution in the flask was stirred and polymerized at 120°C for 2 hours to obtain a liquid containing copolymer precursor (PA1) and solvent (D).

[0155] To a liquid containing copolymer precursor (PA1) and solvent (D) in a flask at atmospheric pressure under a 6 mol% oxygen gas atmosphere, 0.9 g of hydroquinone monomethyl ether (MEHQ) as a polymerization inhibitor (0.3 parts by mass per 100 parts by mass of the total monomer components of copolymer precursor (PA1) and the compound to be added to copolymer precursor (PA1)), 0.9 g of P-2 (triphenylphosphine-benzoquinone, Hokko Sangyo Co., Ltd.) as a catalyst (0.3 parts by mass per 100 parts by mass of the total monomer components of copolymer precursor (PA1) and the compound to be added to copolymer precursor (PA1)), and 40 g of butyl glycidyl ether as the compound to be added to copolymer precursor (PA1) (15 moles per 100 moles of the total monomer components of copolymer precursor (PA1)) were added. The mixture was kept at 120°C for 300 minutes with stirring to obtain a reaction solution containing resin (A) and solvent (D).

[0156] To the reaction solution containing the resin (A) obtained in this manner and solvent (D), propylene glycol monomethyl ether acetate (Kuraray Trading Co., Ltd.) was added as solvent (D) so that the components other than the solvent constituted 40% by mass, thereby obtaining a liquid containing resin (A) of Synthesis Example 1. The weight-average molecular weight, acid value, and amount of ethylenically unsaturated groups of resin (A) are shown in Table 1.

[0157] [Synthesis Examples 2-4, Comparative Synthesis Examples 2-4] Liquids containing resin (A) from Synthesis Examples 2-4 and liquids containing resin (cA) from Comparative Synthesis Examples 2-4 were obtained in the same manner as in Synthesis Example 1, except that the compounds and their proportions were used as shown in Table 1. The weight-average molecular weight, acid value, and amount of ethylenically unsaturated groups of resin (A) and resin (cA) are shown in Table 1.

[0158] [Comparative Synthesis Example 1] A liquid containing the resin (cA) and solvent (D) of Comparative Synthesis Example 1 was obtained in the same manner as in Synthesis Example 1, except that the compounds and their proportions were used as shown in Table 1. To the liquid containing the resin (cA) and solvent (D) thus obtained, propylene glycol monomethyl ether acetate (Kuraray Trading Co., Ltd.) was added as the solvent (D) so that the non-solvent components accounted for 40% by mass, to obtain a liquid containing the resin (cA) of Comparative Synthesis Example 1. The weight-average molecular weight, acid value, and amount of ethylenically unsaturated groups of the resin (cA) are shown in Table 1.

[0159] [Synthesis Example 5] In a flask equipped with a stirrer, dropping funnel, condenser, thermometer, and gas inlet tube, 259 g of propylene glycol monomethyl ether acetate (Kuraray Trading Co., Ltd.) was added as solvent (D), and the mixture was stirred while purging with nitrogen gas, and the temperature was raised to 118°C.

[0160] Next, a raw material monomer solution was prepared by mixing 44 g (10 mol%) of TCDMA as monomer (ma-3), 35 g (10 mol%) of BZMA as monomer (ma-4), 228 g (80 mol%) of glycidyl methacrylate as monomer (ma-2), 142 g (46 parts by mass per 100 parts by mass of the total monomer components) of propylene glycol monomethyl ether acetate as solvent (D), and 16 g (5.2 parts by mass per 100 parts by mass of the total monomer components) of TBO (t-butyl peroxy-2-ethylhexanoate, NOF Corporation) as a polymerization initiator.

[0161] The entire volume of the prepared raw material monomer solution was added dropwise over 1 hour using a dropping funnel to solvent (D) in a flask under atmospheric pressure and nitrogen gas atmosphere. After the addition was complete, the solution in the flask was stirred and polymerized at 120°C for 2 hours to obtain a liquid containing copolymer precursor (PA2) and solvent (D).

[0162] To a liquid containing copolymer precursor (PA2) and solvent (D) in a flask at atmospheric pressure under a 6 mol% oxygen gas atmosphere, 1.3 g of hydroquinone monomethyl ether (MEHQ) as a polymerization inhibitor (0.3 parts by mass per 100 parts by mass of the total monomer components of copolymer precursor (PA2) and the compound to be added to copolymer precursor (PA2)), 1.3 g of TPTP (triparatolylphosphine, Hokko Sangyo Co., Ltd.) as a catalyst (0.3 parts by mass per 100 parts by mass of the total monomer components of copolymer precursor (PA2) and the compound to be added to copolymer precursor (PA2)), and 115 g of propionic acid as the compound to be added to copolymer precursor (PA2) (80 moles per 100 moles of the total monomer components of copolymer precursor (PA2)) were added, and the mixture was kept at 120°C for 720 minutes with stirring to complete the addition reaction of the carboxylic acid to the epoxy group.

[0163] In a flask at atmospheric pressure under a 6 mol% oxygen gas atmosphere, a liquid containing a carboxylic acid adduct to the copolymer precursor (PA2) and solvent (D) was added. 64 g of succinic anhydride (32 moles per 100 moles of the total monomer components of the copolymer precursor (PA2)) was then added as a polybasic acid anhydride capable of reacting with the secondary hydroxyl group generated by the reaction of the epoxy group and carboxyl group. The mixture was stirred and maintained at 115°C for 120 minutes to obtain a reaction solution containing resin (A) and solvent (D).

[0164] To the reaction solution containing the resin (A) obtained in this manner and solvent (D), propylene glycol monomethyl ether acetate (Kuraray Trading Co., Ltd.) was added as solvent (D) so that the components other than the solvent constituted 40% by mass, to obtain a liquid containing resin (A) of Synthesis Example 5. The weight-average molecular weight, acid value, and amount of ethylenically unsaturated groups of resin (A) are shown in Table 1.

[0165] [Synthesis Examples 6-7, Comparative Synthesis Examples 5-6] Liquids containing resin (A) from Synthesis Examples 6-7 and liquids containing resin (cA) from Comparative Synthesis Examples 5-6 were obtained in the same manner as in Synthesis Example 5, except that the compounds and their proportions were used as shown in Table 1. The weight-average molecular weight, acid value, and amount of ethylenically unsaturated groups of resin (A) and resin (cA) are shown in Table 1.

[0166]

[0167] The compounds used in Table 1 are as follows: TCDMA: Tricyclodecanyl methacrylate (Resonac Co., Ltd.) BZMA: Benzyl methacrylate (Tokyo Chemical Industries, Ltd.) 2EHA: 2-Ethylhexyl acrylate (Toagosei Co., Ltd.) MAA: Methacrylic acid (Kuraray Co., Ltd.) AA: Acrylic acid (Tokyo Chemical Industries, Ltd.) GMA: Glycidyl methacrylate (Tokyo Chemical Industries, Ltd.) BGE: Butyl glycidyl ether (Tokyo Chemical Industries, Ltd.) PA: Propionic acid (Tokyo Chemical Industries, Ltd.) THPA: Tetrahydrophthalic anhydride (Shin-Nippon Rika Co., Ltd.) SA: Succinic anhydride (Shin-Nippon Rika Co., Ltd.)

[0168] [Examples 1-7, Comparative Examples 1-6] The resins (A) of Synthesis Examples 1-7 or (cA) of Comparative Synthesis Examples 1-6 shown in Table 2, dipentaerythritol pentaacrylate (Toagosei Co., Ltd.) as a reactive diluent (B), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl-]-,-1-(O-acetyloxime) (Ciba Japan Co., Ltd.) as a photopolymerization initiator (C), a mixture of propylene glycol monomethyl ether acetate and propylene glycol monomethyl ether (338 parts by mass and 257 parts by mass, respectively) as a solvent (D), and Valifast Blue 2620 (phthalocyanine dye, Orient Chemical Industry Co., Ltd.) as a colorant (E) were mixed in the proportions shown in Table 2 to prepare the photosensitive colored compositions of Examples 1-7 and Comparative Examples 1-6. The amounts of resin (A) or (cA) shown in Table 2 do not include the amount of solvent. The amount of solvent (D) shown in Table 2 is the sum of the amount of solvent contained in the liquid containing resin (A) or resin (cA) obtained in the synthesis example or comparative synthesis example, and the amount of solvent added during the preparation of the photosensitive colored composition.

[0169]

[0170] The developability of the photosensitive colored compositions was evaluated by development speed as follows. <Preparation of coating film> The photosensitive colored compositions of Examples 1 to 7 and Comparative Examples 1 to 6 were each applied by spin coating to an alkali-free glass substrate that was 5 cm long and 5 cm wide in plan view, so that the thickness after exposure was 1.5 μm, and a coating film was formed. Then, the solvent (D) in the coating film was evaporated and removed by heating at 100°C for 3 minutes.

[0171] <Evaluation of development speed> Next, using a high-pressure mercury lamp, 100 mJ / cm ２ Light was shone onto the surface of the dried coated film via a photomask (exposure step). The exposure step was performed with the photomask positioned 100 μm away from the coated film. The photomask used had a dot pattern with diameters of 3 to 20 μm at 1 μm intervals and a dot pattern with diameters of 20 to 35 μm at 5 μm intervals. The number of dots on the photomask was 5 for each diameter size, for a total of 110 dots. Next, semi-clean DL-A10 developer (Yokohama Oil & Fat Industry Co., Ltd.) (300-fold dilution) was sprayed onto the surface of the coated film for 60 seconds at a temperature of 23°C and a pressure of 0.1 MPa to remove the unexposed areas (development step). During spraying, the time at which development was completed and the pattern could be clearly seen was recorded, and the development speed was evaluated according to the following criteria. The evaluation results are shown in Table 2. 5: Development was completed within 45 seconds. 4: Development was completed between 45 and 50 seconds. 3: Development was completed between 50 and 55 seconds. 2: Development was completed between 55 and 60 seconds. 1: Development was not completed after 60 seconds of spraying.

[0172] <Evaluation of Pattern Adhesion> After the development speed test described above, the following immersion test was performed using the samples to evaluate pattern adhesion. The glass substrate with the cured film after the development process was immersed in propylene glycol monomethyl ether (PGME) at room temperature for 3 minutes, then the solvent was dried, and the dot pattern was observed with a microscope. Pattern adhesion was evaluated on a 5-point scale from 1 to 5 according to the following criteria. The evaluation results are shown in Table 2. 5: 40 or more remaining dots 4: 30 to 39 remaining dots 3: 20 to 29 remaining dots 2: 10 to 19 remaining dots 1: 9 or fewer remaining dots

Claims

1. A photosensitive resin composition comprising a resin (A), a reactive diluent (B), a photopolymerization initiator (C), and a solvent (D), wherein the acid value of the resin (A) is 20 to 300 mgKOH / g, and the resin (A) has a structure (X1) derived from an alkyl glycidyl ether having 1 to 10 carbon atoms in the alkyl group, or a structure (Y1) derived from a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms.

2. The photosensitive resin composition according to claim 1, wherein the resin (A) has the structure (X1), the copolymer precursor (PA1) is a copolymer containing a constituent unit (a-1) having an acid group, and the resin (A) is a resin in which a portion of the acid groups of the copolymer precursor (PA1) has been modified.

3. The photosensitive resin composition according to claim 2, wherein the acid group is a carboxyl group, and the structure (X1) is a structure in which an alkyl glycidyl ether having 1 to 10 carbon atoms in the alkyl group is added to a part of the acid group of the copolymer precursor (PA1).

4. The photosensitive resin composition according to claim 1, wherein the resin (A) has the structure (Y1), the copolymer precursor (PA2) is a copolymer containing a constituent unit (a-2) having an epoxy group, the resin (A) is a resin in which at least a portion of the epoxy groups of the copolymer precursor (PA2) is modified, and the structure (Y1) is a structure in which a saturated aliphatic carboxylic acid having 2 to 11 carbon atoms is added to at least a portion of the epoxy groups of the copolymer precursor (PA2).

5. The photosensitive resin composition according to claim 4, wherein the resin (A) further comprises a structure (Z) derived from a polybasic acid or polybasic acid anhydride, and the structure (Z) is a structure in which a polybasic acid or polybasic acid anhydride is attached to a part of the hydroxyl group formed by ring-opening of the epoxy group.

6. The photosensitive resin composition according to any one of claims 2 to 5, wherein the copolymer precursor (PA1) or the copolymer precursor (PA2) further comprises a constituent unit (a-3) having a crosslinked cyclic hydrocarbon group having 7 to 20 carbon atoms.

7. The photosensitive resin composition according to any one of claims 2 to 5, wherein the copolymer precursor (PA1) or the copolymer precursor (PA2) further comprises a constituent unit (a-4) having an aromatic ring.

8. The photosensitive resin composition according to any one of claims 1 to 3, wherein the content of the structure (X1) is 5 to 95 moles when the total amount of constituent units of the resin (A) is 100 moles.

9. The photosensitive resin composition according to any one of claims 1, 4, and 5, wherein the content of the structure (Y1) is 40 to 95 moles when the total amount of constituent units of the resin (A) is 100 moles.

10. The photosensitive resin composition according to claim 3, wherein the amount of structure (X1) is 5 to 90 moles per 100 moles of the acid group-containing constituent unit (a-1) in the copolymer precursor (PA1).

11. The photosensitive resin composition according to claim 4 or 5, wherein the amount of structure (Y1) is 50 to 100 moles per 100 moles of epoxy group-containing constituent unit (a-2) in the copolymer precursor (PA2).

12. A photosensitive resin composition according to any one of claims 1 to 5 and 10, wherein the composition optionally contains another resin having an ethylenically unsaturated group other than the resin (A), the total content of the resin (A) and the other resin being 10 to 90% by mass relative to the total of the resin (A), the other resin and the reactive diluent (B), the content of the reactive diluent (B) being 90 to 10% by mass, the content of the photopolymerization initiator (C) being 0.1 to 30 parts by mass per 100 parts by mass of the total of the resin (A), the other resin and the reactive diluent (B), and the content of the solvent (D) being 30 to 1,000 parts by mass per 100 parts by mass of the total of the components excluding the solvent (D).

13. A photosensitive colored composition comprising the photosensitive resin composition according to any one of claims 1 to 5 and 10 and a colorant (E).

14. A resin-cured film which is a cured product of the photosensitive resin composition according to any one of claims 1 to 5 and 10.

15. A color filter having a colored pattern which is a cured product of the photosensitive colored composition described in claim 13.

16. An image display element comprising the color filter described in claim 15.

Images