Substrate processing system, control method, and end effector

Abstract

A substrate processing system according to the present disclosure comprises a substrate processing chamber, a vacuum transfer chamber, a transfer robot, a stocker, and a control unit. The transfer robot has a transfer arm and a holding mechanism. The holding mechanism is configured so as to detachably hold a first end effector. The stocker is connected to the substrate processing chamber. The control unit is configured so as to execute: controlling the transfer arm to move the first end effector to the stocker; controlling the holding mechanism to cause the holding mechanism to release the holding of the first end effector; controlling the transfer arm and the holding mechanism to cause the holding mechanism to hold a second end effector accommodated in the stocker; and controlling the transfer arm to move the second end effector to the vacuum transfer chamber.

Description

Substrate processing system, control method, and end effector

[0001] Exemplary embodiments of the present disclosure relate to a substrate processing system, a control method, and an end effector.

[0002] Transfer robots that transfer semiconductor substrates are known. For example, the transfer robot disclosed in Patent Document 1 is configured to transfer a substrate from a vacuum transfer chamber to a substrate processing chamber. A semiconductor substrate is placed on an end effector connected to a transfer arm of the transfer robot. The end effector is mechanically attached to the transfer arm of the robot by an end effector fastener such as a screw.

[0003] Japanese National Publication of International Patent Application No. 2019-519913

[0004] The present disclosure provides a technique for replacing an end effector in a substrate processing system.

[0005] In one exemplary embodiment, a substrate processing system is provided. The substrate processing system includes a substrate processing chamber, a vacuum transfer chamber, a transfer robot, a stocker, and a control unit. The vacuum transfer chamber is connected to the substrate processing chamber. The transfer robot is disposed in the vacuum transfer chamber. The transfer robot has a transfer arm and a holding mechanism. The holding mechanism is located at the end of the transfer arm. The holding mechanism is configured to detachably hold a first end effector. The transfer robot is configured to move the first end effector between the substrate processing chamber and the vacuum transfer chamber. The stocker is connected to the vacuum transfer chamber. The control unit is configured to control the transfer robot. The control unit is configured to perform: controlling the transfer arm to move the first end effector to the stocker; controlling the holding mechanism to release the holding of the first end effector by the holding mechanism; controlling the transfer arm and the holding mechanism to cause the holding mechanism to hold a second end effector stored in the stocker; and controlling the transfer arm to move the second end effector into the vacuum transfer chamber.

[0006] According to one exemplary embodiment, a technique for replacing end effectors in a substrate processing system is provided.

[0007] Figure 1 is a diagram showing a substrate processing system according to one exemplary embodiment. Figure 2 is a diagram illustrating an example configuration of a plasma processing system. Figure 3 is a diagram illustrating an example configuration of a capacitively coupled plasma processing apparatus. Figure 4 is a perspective view of a holding mechanism and end effector according to one exemplary embodiment. Figure 5 is a side view of a holding mechanism and end effector according to one exemplary embodiment. Figure 6 is a diagram schematically showing the configuration of a stocker according to one exemplary embodiment. Figure 7 is a top view of a robot according to one exemplary embodiment. Figure 8 is a side view of a robot according to one exemplary embodiment. Figure 9 is a top view of a holding mechanism and end effector according to another exemplary embodiment. Figure 10 is a top view of a holding mechanism and end effector according to yet another exemplary embodiment. Figure 11 is a cross-sectional view of an end effector according to yet another exemplary embodiment. Figure 12 is a flowchart showing a control method according to one exemplary embodiment. Figure 13 is a top view of an end effector according to yet another exemplary embodiment. Figure 14 is a cross-sectional view of an end effector according to yet another exemplary embodiment. Figure 15 is a top view of an end effector according to yet another exemplary embodiment.

[0008] Various exemplary embodiments will be described in detail below with reference to the drawings. In each drawing, the same or corresponding parts will be denoted by the same reference numerals.

[0009] Figure 1 shows a substrate processing system according to one exemplary embodiment. As shown in Figure 1, the substrate processing system PS comprises a plurality of process modules PM1 to PM6, a vacuum module VTM, a stocker 5, and a control unit MC. The substrate processing system PS only needs to include at least one process module. In one embodiment, the substrate processing system PS may further include load ports LP1 to LP4, an aligner AN, and load lock modules LL1 and LL2.

[0010] The substrate processing system PS may further include a loader module LM. The loader module LM is an example of an atmospheric vacuum module. The loader module LM includes an atmospheric chamber ACH. The pressure in the atmospheric chamber ACH of the loader module LM is set to atmospheric pressure. The loader module LM may have an FFU (Fan Filter Unit). The loader module LM is, for example, an EFEM (Equipment Front End Module). The loader module LM is positioned between each of the load ports LP1 to LP4 and each of the load lock modules LL1 and LL2. The load ports LP1 to LP4 are arranged along one of a pair of edges along the longitudinal direction of the loader module LM. The load lock modules LL1 and LL2 are arranged along the other of a pair of edges along the longitudinal direction of the loader module LM. Load ports LP1 to LP4 are configured to support cassettes CST1 to 4, respectively. Each of cassettes CST1 to 4 is a container that houses multiple substrates W or ring members. For example, each of cassettes CST1 to 3 houses a substrate W, and cassette CST4 houses a ring member. Each of cassettes CST1 to 4 is, for example, a FOUP (Front-Opening Unified Pod). The ring member is either an edge ring or a covering ring.

[0011] The loader module LM includes a transport robot TR3. The transport robot TR3 is located inside the atmospheric chamber ACH of the loader module LM. The transport robot TR3 may also include a transport arm AR31 and an end effector FK31. The end effector FK31 is attached to the tip of the transport arm AR31 and is configured to support the substrate W or ring member R placed on it. The transport robot TR3 is an example of a transport robot having a transport arm. The transport arm AR31 is an example of a transport arm. The transport robot TR3 transports the substrate W or ring member R based on operation instructions output by the control unit MC, which will be described later. The transport robot TR3 transports the substrate W or ring member R between any two of the cassettes CST1 to CST4, load lock modules LL1 and LL2, and aligner AN.

[0012] The aligner AN may be positioned along one of a pair of edges of the loader module LM along its short direction. The aligner AN may be positioned along the edge of the loader module LM along its long direction. The aligner AN may be positioned inside the atmospheric chamber ACH of the loader module LM.

[0013] Each of the load lock modules LL1 and LL2 is positioned between the vacuum module VTM and the loader module LM. Each of the load lock modules LL1 and LL2 provides a depressurization chamber DCH1 and DCH2. Each of the load lock modules LL1 and LL2 is connected to the loader module LM via a gate valve G3. Each of the load lock modules LL1 and LL2 is connected to the vacuum module VTM via a gate valve G2.

[0014] The vacuum module VTM includes a vacuum transport chamber VCH. In the example shown in Figure 1, the vacuum module VTM is configured to transport the substrate W through a reduced-pressure space within the vacuum transport chamber VCH. The vacuum transport chamber VCH is connected to load lock modules LL1 and LL2, respectively, via gate valve G2. Process modules PM1 to PM6 are connected to the vacuum transport chamber VCH via gate valve G1. The stocker 5 is connected to the vacuum transport chamber VCH. Details of the stocker 5 will be described later.

[0015] In one embodiment, the vacuum module VTM has a transport robot TR including transport arms AR11 and AR12. In one example, the transport robot TR is configured to transport a substrate W. The transport robot TR is an example of a transport device having at least one transport arm. Transport arms AR11 and AR12 are examples of at least one transport arm. The transport robot TR is located inside the vacuum transport chamber VCH. In the example shown in Figure 1, transport arms AR11 and AR12 detachably hold end effectors FK11 and FK12, respectively. End effector FK11 is held at the tip of transport arm AR11 and is configured to support the substrate W placed on it. End effector FK12 is held at the tip of transport arm AR12 and is configured to support the substrate W placed on it. The transport robot TR has a holding mechanism. Details of the holding mechanism will be described later.

[0016] The transport robot TR holds the substrate W with end effectors FK11 and FK12. The transport robot TR transports the substrate W based on the operation instructions output by the control unit MC, which will be described later. The transport robot TR transports the substrate W through any two of the paths between the load lock modules LL1 and LL2, the process modules PM1 to PM6, and the vacuum transport chamber VCH of the vacuum module VTM.

[0017] In one embodiment, each of the process modules PM1 to PM6 is configured to perform a dedicated process on the substrate W. At least one of the process modules PM1 to PM6 is a substrate processing system, such as the plasma processing apparatus 1 described later.

[0018] The control unit MC is, for example, a computer. The control unit MC may consist of a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and auxiliary storage devices. The CPU operates based on a program stored in the ROM or auxiliary storage device and controls each part of the board processing system PS.

[0019] The substrate processing system PS is not necessarily limited to the one shown in Figure 1. For example, the number of process modules and / or vacuum modules in the substrate processing system may differ from those shown in Figure 1. For example, the number of load ports may be five or more, and the number of load ports may be any number. The substrate processing system may also be a system in which multiple module groups, each including process modules and load lock modules, are connected to a loader module (a so-called loader type system). The substrate processing system may also be a system in which two or more process modules are arranged around a vacuum module and connected in a manner that surrounds the vacuum module (a so-called cluster type system).

[0020] Figure 2 is a diagram illustrating an example configuration of a plasma processing system. In one embodiment, the plasma processing system includes a plasma processing apparatus 1 and a control unit 2. The plasma processing system is an example of a substrate processing system, and the plasma processing apparatus 1 is an example of a substrate processing apparatus. The plasma processing apparatus 1 includes a plasma processing chamber 10, a substrate support unit 11, and a plasma generation unit 12. The plasma processing chamber 10 has a plasma processing space. The plasma processing chamber 10 also has at least one gas supply port for supplying at least one processing gas to the plasma processing space, and at least one gas outlet for discharging gas from the plasma processing space. The gas supply port is connected to a gas supply unit 20, which will be described later, and the gas outlet is connected to an exhaust system 40, which will be described later. The substrate support unit 11 is located in the plasma processing space and has a substrate support surface for supporting a substrate.

[0021] The plasma generation unit 12 is configured to generate plasma from at least one processing gas supplied into the plasma processing space. The plasma formed in the plasma processing space may be capacitively coupled plasma (CCP), inductively coupled plasma (ICP), ECR (Electron Cyclotron Resonance) plasma, helicon wave excited plasma (HWP), or surface wave plasma (SWP), etc. Various types of plasma generation units, including AC (Alternating Current) plasma generation units and DC (Direct Current) plasma generation units, may also be used. In one embodiment, the AC signal (AC power) used in the AC plasma generation unit has a frequency in the range of 100 kHz to 10 GHz. Therefore, the AC signal includes an RF (Radio Frequency) signal and a microwave signal. In one embodiment, the RF signal has a frequency in the range of 100 kHz to 150 MHz.

[0022] The control unit 2 processes computer-executable instructions that cause the plasma processing apparatus 1 to perform the various processes described herein. The control unit 2 may be configured to control the elements of the plasma processing apparatus 1 to perform the various processes described herein. In one embodiment, part or all of the control unit 2 may be included in the plasma processing apparatus 1. The control unit 2 is implemented, for example, by a computer 2a. The control unit 2 may include a processing unit 2a1, a storage unit 2a2, and a communication interface 2a3. The functions realized by the processing unit 2a1 described herein may be implemented in a circuit or processing circuit, including a general-purpose processor, an application-specific processor, integrated circuits, ASICs (Application Specific Integrated Circuits), a CPU (Central Processing Unit), a conventional circuit, and / or a combination thereof, programmed to realize the described functions. The processor is considered to be a circuit or processing circuit, including transistors and other circuits. The processor may be a programmed processor that executes a program stored in the storage unit 2a2. This program may be pre-stored in the storage unit 2a2 or retrieved via a medium when needed. The acquired program is stored in the storage unit 2a2 and read from the storage unit 2a2 and executed by the processing unit 2a1. The medium may be various storage media readable by the computer 2a, or it may be a communication line connected to the communication interface 2a3. The storage unit 2a2 may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface 2a3 may communicate with the plasma processing device 1 via a communication line such as a LAN (Local Area Network).In this disclosure, circuits, units, and means are hardware programmed to perform or configured to perform the functions described. Such hardware may be any hardware described in this disclosure, or any hardware known to be programmed to perform or execute the functions described. If such hardware is a processor that is considered to be a type of circuit, such circuit, means, or unit is a combination of hardware and software used to constitute such hardware and / or processor.

[0023] The following describes an example configuration of a capacitively coupled plasma processing apparatus as an example of a plasma processing apparatus 1. Figure 3 is a diagram illustrating an example configuration of a capacitively coupled plasma processing apparatus.

[0024] The capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply unit 20, a power supply system 30, and an exhaust system 40. The plasma processing apparatus 1 also includes a substrate support unit 11 and a gas introduction unit. The gas introduction unit is configured to introduce at least one processing gas into the plasma processing chamber 10. The gas introduction unit includes a shower head 13. The substrate support unit 11 is located inside the plasma processing chamber 10. The shower head 13 is located above the substrate support unit 11. In one embodiment, the shower head 13 constitutes at least a portion of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the shower head 13, the side walls 10a of the plasma processing chamber 10, and the substrate support unit 11. The plasma processing chamber 10 is grounded. The shower head 13 and the substrate support unit 11 are electrically insulated from the housing of the plasma processing chamber 10.

[0025] The substrate support portion 11 includes a main body portion 111 and a ring assembly 112. The main body portion 111 has a central region 111a for supporting the substrate W and an annular region 111b for supporting the ring assembly 112. A wafer is an example of a substrate W. The annular region 111b of the main body portion 111 surrounds the central region 111a of the main body portion 111 in a plan view. The substrate W is placed on the central region 111a of the main body portion 111, and the ring assembly 112 is placed on the annular region 111b of the main body portion 111 so as to surround the substrate W on the central region 111a of the main body portion 111. Therefore, the central region 111a is also called the substrate support surface for supporting the substrate W, and the annular region 111b is also called the ring support surface for supporting the ring assembly 112.

[0026] In one embodiment, the main body 111 includes a base 1110 and an electrostatic chuck 1111. The base 1110 includes a conductive member. The conductive member of the base 1110 can function as a lower electrode. The electrostatic chuck 1111 is placed on the base 1110. The electrostatic chuck 1111 includes a ceramic member 1111a and an electrostatic chuck electrode 1111b placed within the ceramic member 1111a. The electrostatic chuck electrode 1111b is also called a clamping electrode. In one embodiment, the electrostatic chuck electrode 1111b is electrically connected or coupled to a chuck power supply. The chuck power supply may be a DC power supply or an AC power supply. The ceramic member 1111a has a central region 111a. In one embodiment, the ceramic member 1111a also has an annular region 111b. Furthermore, other members surrounding the electrostatic chuck 1111, such as an annular electrostatic chuck or an annular insulating member, may have an annular region 111b. In this case, the ring assembly 112 may be placed on the annular electrostatic chuck or the annular insulating member, or it may be placed on both the electrostatic chuck 1111 and the annular insulating member. In addition, at least one bias electrode, which is electrically connected or coupled to the power supply 31 and / or power supply 32 described later, may be placed inside the ceramic member 1111a. In this case, at least one bias electrode functions as a lower electrode. Also, the conductive member of the base 1110 and the bias electrode inside the ceramic member 1111a may function as multiple lower electrodes. In one embodiment, the first voltage generation unit 32a, which functions as a voltage pulse generation unit described later, is electrically connected or coupled to the bias electrode inside the ceramic member 1111a, and the first RF generation unit 31a, described later, is electrically connected or coupled to the conductive member of the base 1110. Furthermore, the electrostatic chuck electrode 1111b may function as a lower electrode. Therefore, the substrate support portion 11 includes at least one lower electrode.

[0027] The ring assembly 112 includes one or more annular members. In one embodiment, the one or more annular members include one or more edge rings and at least one covering ring. The edge rings are formed of a conductive or insulating material, and the covering rings are formed of an insulating material.

[0028] The substrate support section 11 may also include a temperature control module configured to adjust at least one of the electrostatic chuck 1111, the ring assembly 112, and the substrate to a target temperature. The temperature control module may include a heater, a heat transfer medium, a flow path 1110a, or a combination thereof. A heat transfer fluid such as brine or gas flows through the flow path 1110a. In one embodiment, the flow path 1110a is formed within the base 1110, and one or more heaters are arranged within the ceramic member 1111a of the electrostatic chuck 1111. The substrate support section 11 may also include a heat transfer gas supply section configured to supply heat transfer gas to the gap between the back surface of the substrate W and the central region 111a.

[0029] The showerhead 13 is configured to introduce at least one processing gas from the gas supply unit 20 into the plasma processing space 10s. The showerhead 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and a plurality of gas inlet ports 13c. The processing gas supplied to the gas supply port 13a passes through the gas diffusion chamber 13b and is introduced into the plasma processing space 10s through the plurality of gas inlet ports 13c. The showerhead 13 also includes at least one upper electrode. In addition to the showerhead 13, the gas introduction unit may also include one or more side gas injectors (SGIs) attached to one or more openings formed in the side wall 10a.

[0030] The gas supply unit 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply unit 20 is configured to supply at least one processing gas to the shower head 13 from a corresponding gas source 21 via a corresponding flow controller 22. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Furthermore, the gas supply unit 20 may include at least one flow modulation device that modulates or pulses the flow rate of at least one processing gas.

[0031] The power supply system 30 includes a power supply 31 that is electrically connected to or coupled to the plasma processing chamber 10. In one embodiment, the power supply 31 is electrically connected to or coupled to the plasma processing chamber 10 via at least one impedance matcher. The impedance matcher may be a mechanically controlled matcher or an electronically controlled matcher. The power supply 31 is configured to supply at least one RF signal (RF power) to at least one lower electrode and / or at least one upper electrode. This generates plasma from at least one processing gas supplied to the plasma processing space 10s. Therefore, the power supply 31 can function as at least part of the plasma generation unit 12. In addition, by supplying a bias RF signal to at least one lower electrode, a bias potential is generated on the substrate W, and ionic components in the formed plasma can be drawn into the substrate W.

[0032] The power supply 31 includes a first RF generation unit 31a and a second RF generation unit 31b. The first RF generation unit 31a is electrically connected or coupled to at least one lower electrode and / or at least one upper electrode and is configured to generate a source RF signal (source RF power) to generate plasma in the plasma processing space 10s. In one embodiment, the first RF generation unit 31a is electrically connected or coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matcher. In one embodiment, the source RF signal has a frequency in the range of 10 MHz to 150 MHz. In one embodiment, the first RF generation unit 31a may be configured to generate a plurality of source RF signals having different frequencies. One or more generated source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.

[0033] The second RF generation unit 31b is electrically connected to or coupled to at least one lower electrode and is configured to generate a bias RF signal (bias RF power). In one embodiment, the second RF generation unit 31b is electrically connected to or coupled to at least one lower electrode via at least one impedance matcher. When the first RF generation unit 31a is electrically connected to or coupled to a lower electrode, the second RF generation unit 31b may be electrically connected to or coupled to the same lower electrode, or it may be electrically connected to or coupled to a different lower electrode. The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency lower than the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 100 kHz to 60 MHz. In one embodiment, the second RF generation unit 31b may be configured to generate a plurality of bias RF signals having different frequencies. The generated one or more bias RF signals are supplied to at least one lower electrode. In various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0034] The power supply system 30 may also include a power supply 32 that is electrically connected to or coupled to the plasma processing chamber 10. The power supply 32 includes a first voltage generation unit 32a and a second voltage generation unit 32b. In one embodiment, the first voltage generation unit 32a is electrically connected to or coupled to at least one lower electrode and is configured to generate a first voltage signal. The generated first voltage signal is applied to at least one lower electrode. In one embodiment, the second voltage generation unit 32b is electrically connected to or coupled to at least one upper electrode and is configured to generate a second voltage signal. The generated second voltage signal is applied to at least one upper electrode.

[0035] In various embodiments, the first and / or second voltage signals may be pulsed. In this case, the first voltage generation unit 32a and / or the second voltage generation unit 32b function as voltage pulse generation units configured to generate a sequence of voltage pulses. Thus, the sequence of voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. In one embodiment, the sequence of voltage pulses has a plurality of cycles, each cycle including a burst of voltage pulses in a first period and a constant reference voltage in a second period. That is, in the sequence of voltage pulses, the burst of voltage pulses is repeated. The absolute value of the voltage level of the voltage pulse is greater than the absolute value of the voltage level of the reference voltage. The voltage pulse may have an arbitrary waveform having a rectangle, trapezoid, triangle, or a combination thereof, and the arbitrary waveform may change over time. The voltage pulse may have positive polarity or negative polarity. The sequence of voltage pulses may also include one or more positive voltage pulses and one or more negative voltage pulses within one cycle. The first and second voltage generation units 32a and 32b may be provided in addition to the power supply 31, and the first voltage generation unit 32a may be provided in place of the second RF generation unit 31b.

[0036] The exhaust system 40 may be connected to, for example, a gas outlet 10e located at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure regulating valve regulates the pressure in the plasma processing space 10s. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0037] As described above, each of the multiple process modules PM1 to PM6 has a substrate processing chamber 10. The vacuum transfer chamber VCH is connected to the substrate processing chamber 10. The transfer robot TR is located inside the vacuum transfer chamber VCH. The control unit MC is configured to control the transfer robot TR. The stocker 5 is connected to the vacuum transfer chamber VCH. The control unit MC and the control unit 2 may be integrated. The substrate processing system PS comprises the substrate processing chamber 10, the vacuum transfer chamber VCH, the transfer robot TR, the stocker 5, and the control unit MC. The transfer robot TR, having transfer arms AR11 and AR12, is one embodiment of a transfer device having transfer arms. The transfer robot TR only needs to have at least one transfer arm.

[0038] The configuration of a substrate processing system PS according to one exemplary embodiment will be described below with reference to Figures 4 to 6. Figure 4 is a perspective view of the holding mechanism and end effector according to one exemplary embodiment. Figure 5 is a side view of the holding mechanism and end effector according to one exemplary embodiment. Figure 6 is a schematic diagram showing the configuration of a stocker according to one exemplary embodiment.

[0039] The transport robot TR has a transport arm AR11 and a holding mechanism 6. The holding mechanism 6 is located at the end of the transport arm AR11. As shown in Figure 6, the holding mechanism 6 is configured to detachably hold an end effector AT1 (an example of a first end effector). The transport robot TR is configured to move the end effector AT1 between the substrate processing chamber 10 and the vacuum transport chamber VCH.

[0040] In one embodiment, the stocker 5 may have a plurality of storage sections 50. Each of the storage sections 50 is configured to accommodate a plurality of end effectors AT. For example, the plurality of storage sections 50 are arranged in the vertical direction. The plurality of storage sections 50 may have a shelf shape. The plurality of storage sections 50 may include a plurality of support plates. The plurality of end effectors AT housed in the plurality of storage sections 50 are each supported by the plurality of support plates. In one example, the plurality of storage sections 50 include a storage section 51 (an example of a first storage section), a storage section 52 (an example of a second storage section), and a storage section 53. The storage sections 51, 52, and 53 are arranged vertically from top to bottom in the order of storage section 52, storage section 53, and storage section 51. In one example, the plurality of end effectors AT include end effector AT1, end effector AT2 (an example of a second end effector), and end effector AT3. The substrate processing system PS may include end effector AT1. The substrate processing system PS may include an end effector AT2. In one embodiment, the end effector AT1 and / or the end effector AT2 include at least one selected from the group consisting of a distance sensor, a capacitance sensor, and a camera sensor.

[0041] The control unit MC is configured to control the transport robot TR to replace the end effector AT1 held by the transport arm AR11 with another end effector AT2 housed in the stocker 5. The control unit MC is configured to perform the following steps: (a) control the transport arm AR11 to move the end effector AT1 to the stocker 5; (b) control the holding mechanism 6 to release the holding mechanism 6 from holding the end effector AT1; (c) control the transport arm AR11 and the holding mechanism 6 to have the end effector AT2 housed in the stocker 5 held by the holding mechanism 6; and (d) control the transport arm AR11 to move the end effector AT2 to the vacuum transport chamber VCH.

[0042] According to the substrate processing system PS, the end effector AT1 held by the transport arm AR11 can be replaced with another end effector AT2 housed in the stocker 5. Therefore, in the substrate processing system PS, the end effector AT1 of the transport robot TR is replaced with another end effector AT2 without opening the vacuum transport chamber VCH to the atmosphere. In one embodiment, the end effector AT1 and / or end effector AT2 include at least one selected from the group consisting of a distance sensor, a capacitance sensor, and a camera sensor. Therefore, it is replaced with an end effector corresponding to the operation performed in the substrate processing chamber 10.

[0043] In one embodiment, as shown in Figures 4 and 5, the end effector AT2 has an end portion 7. The end portion 7 is configured to be held by a holding mechanism 6. The end portion 7 includes a surface 71 (an example of a first surface), a surface 72 (an example of a second surface), and a surface 73 (an example of a third surface). Surfaces 71, 72, and 73 intersect each other. For example, surfaces 71, 72, and 73 are planes perpendicular to the direction in which they intersect each other. The holding mechanism 6 includes a surface 61 (an example of a fourth surface), a surface 62 (an example of a fifth surface), and a surface 63 (an example of a sixth surface). Surface 61 abuts against surface 71 in direction D1 (an example of a first direction). For example, each of surfaces 61 and 73 is a plane perpendicular to direction D1. Surface 62 abuts against surface 72 in direction D2 (an example of a second direction). For example, each of surfaces 62 and 72 is perpendicular to direction D2. Surface 63 abuts surface 73 in direction D3 (an example of a third direction). For example, each of surfaces 63 and 73 is a plane perpendicular to direction D3. In one example, direction D3 is along the vertical direction.

[0044] In one embodiment, the control unit MC is configured to perform: a step of controlling the transfer arm AR11 to bring the surface 71, the surface 72, and the surface 73 into contact with the surface 61, the surface 62, and the surface 63 respectively; and a step of controlling the holding mechanism 6 to cause the holding mechanism 6 to hold the end effector AT2. According to the substrate processing system PS according to one embodiment, the end effector AT2 is held after the end effector AT2 and the holding mechanism 6 abut against each other. Therefore, according to the substrate processing system PS, the end effector AT2 is held by the holding mechanism 6 at an appropriate position.

[0045] In one embodiment, the holding mechanism 6 may include an electromagnet 64. The end effector AT2 may include a ferromagnetic body 74 corresponding to the electromagnet 64. The electromagnet 64 is connected to a power supply configured to supply current to the electromagnet 64. For example, the electromagnet 64 is configured to fix at least one of the surfaces 71, 72, and 73 to at least one of the surfaces 61, 62, and 63. For example, the electromagnet 64 may be disposed in the surface 63, the ferromagnetic body 74 may be disposed in the surface 73, and the electromagnet 64 may be configured to fix the surface 73 to the surface 63.

[0046] The control unit MC may be configured to perform: a step of controlling the current supplied from the power supply to the electromagnet 64 to release the end effector AT1 from the holding mechanism 6; and a step of controlling the current supplied from the power supply to the electromagnet 64 to cause the holding mechanism 6 to hold the end effector AT2. Note that the holding mechanism 6 may include a mechanism that mechanically holds the end effector AT2 instead of the electromagnet 64. For example, the holding mechanism 6 may include a mechanism that clamps the end effector AT2.

[0047] In one embodiment, the holding mechanism 6 may include a sensor 6a (an example of at least one first sensor), a sensor 6b (an example of at least one second sensor), and a sensor 6c (an example of at least one third sensor). The sensor 6a is attached to a surface 61. The sensor 6a is configured to detect that a surface 71 abuts against the surface 61. The sensor 6b is attached to a surface 62. The sensor 6b is configured to detect that a surface 72 abuts against the surface 62. As shown in FIG. 4, a pair of sensors 6b may be attached to the surface 62. The sensor 6c is attached to a surface 63. The sensor 6c is configured to detect that a surface 73 abuts against the surface 63. In one example, each of the sensors 6a, 6b, and 6c is a position sensor. The position sensor may be any one of a contact sensor, a magnetic sensor, an optical sensor, or a capacitive sensor. The holding mechanism 6 only needs to include at least one sensor. The at least one sensor only needs to be attached to at least one of the surfaces 61, 62, and 63. The at least one sensor only needs to be configured to detect that the end portion 7 abuts against the at least one surface.

[0048] The control unit MC may be configured such that after the sensor 6a detects that the surface 71 abuts against the surface 61, the sensor 6b detects that the surface 72 abuts against the surface 62, and the sensor 6c detects that the surface 73 abuts against the surface 63, the control unit MC controls the holding mechanism 6 to cause the holding mechanism 6 to hold the end effector AT2. It should be noted that the control unit MC only needs to be configured to control the holding mechanism 6 to hold the end effector AT2 after at least one sensor detects that the end portion 7 abuts against at least one surface. According to the substrate processing system PS according to one embodiment, the end effector AT2 is held after the end effector AT2 and the holding mechanism 6 reliably abut against each other.

[0049] The configuration of the transport robot TR will be described below with reference to Figures 7 and 8. Figure 7 is a top view of a transport robot according to one exemplary embodiment. Figure 8 is a side view of a transport robot according to one exemplary embodiment. The transport robot TR is, for example, a horizontal articulated transport robot. The transport arm AR11 includes a plurality of joints and a plurality of motors 80. The plurality of motors 80 are configured to move each of the plurality of joints. The plurality of motors 80 are connected to a drive power supply configured to supply current to each of the plurality of motors 80. The drive power supply is configured to measure the magnitude of the current supplied to each of the plurality of motors 80. The control unit MC is configured to control the current supplied from the drive power supply to each of the plurality of motors 80. The control unit MC is configured to control each of the plurality of motors 80 to move the transport arm AR11 in order to move the holding mechanism 6.

[0050] In one example, the torque generated by motors 81 and 82 moves the holding mechanism 6 along direction D1 or direction D2. The torque generated by motor 83 moves the holding mechanism 6 along direction D3. When the moving holding mechanism 6 comes into contact with the end effector AT2, the holding mechanism 6 is pressed against the end effector AT2, so the current supplied to each of the motors 80 increases. For example, the control unit MC may be configured to vector decompose the torque generated by each of the motors 80 from each angle of the multiple joints into torque along direction D1, torque along direction D2, and torque along direction D3.

[0051] The control unit MC may be configured to perform the following steps: control the current supplied from the drive power supply to each of the multiple motors 80 to move the holding mechanism 6 located at the end of the transport arm AR11 along at least one of directions D1, D2, and D3; and after detecting from the magnitude of the current that at least one of surfaces 71, 72, and 73 has come into contact with at least one of surfaces 61, 62, and 63, control the holding mechanism 6 to hold the end effector AT2 in the holding mechanism 6.

[0052] The control unit MC may be configured to control the current supplied from the drive power supply to each of the multiple motors 80 to move the holding mechanism 6 along direction D1, along direction D2, and along direction D3. The control unit MC may be configured to detect from the magnitude of the current that surface 71 has come into contact with surface 61, that surface 72 has come into contact with surface 62, and that surface 73 has come into contact with surface 63, and then control the holding mechanism 6 to hold the end effector AT2 in the holding mechanism 6. According to the substrate processing system PS of one embodiment, contact between the end effector AT2 and the holding mechanism 6 can be detected by the magnitude of the power supplied to each of the multiple motors 80.

[0053] In one embodiment, the transport arm AR11 may include at least one torque sensor 80t attached to at least one of the multiple joints. In the example shown in Figures 7 and 8, the at least one torque sensor 80t is multiple torque sensors 80t. The multiple torque sensors 80t include torque sensor 81t, torque sensor 82t, and torque sensor 83t. Torque sensor 81t is attached to the joint driven by motor 81. Torque sensor 82t is attached to the joint driven by motor 82. Torque sensor 83t is attached to the joint driven by motor 83.

[0054] At least one torque sensor 80t is configured to measure the torque applied to the holding mechanism 6 located at the end of the transport arm AR11. At least one torque sensor 80t is configured to measure the torque along at least one of directions D1, D2, and D3. For example, multiple torque sensors 80t may be configured to measure the rotational torque of multiple joints, each of which is separate. For example, the control unit MC may be configured to vector decompose the torque generated at each of the multiple joints from each joint's angle into torque along direction D1, torque along direction D2, and torque along direction D3.

[0055] The control unit MC may be configured to control the holding mechanism 6 after detecting from the magnitude of the torque along at least one of directions D1, D2, and D3 that at least one of surfaces 71, 72, and 73 is in contact with at least one of surfaces 61, 62, and 63, so that the end effector AT2 is held in the holding mechanism 6.

[0056] At least one torque sensor 80t may be configured to measure a first torque along the direction D1 applied to the holding mechanism 6. At least one torque sensor 80t may be configured to measure a second torque along the direction D2 applied to the holding mechanism 6. At least one torque sensor 80t may be configured to measure a third torque along the direction D3 applied to the holding mechanism 6.

[0057] The control unit MC may be configured to detect when surface 71 contacts surface 61 based on the magnitude of a first torque, when surface 72 contacts surface 62 based on the magnitude of a second torque, and when surface 73 contacts surface 63 based on the magnitude of a third torque, and then control the holding mechanism 6 to hold the end effector AT2 in the holding mechanism 6. According to the substrate processing system PS of one embodiment, contact between the end effector AT2 and the holding mechanism 6 is reliably detected by at least one torque sensor 80t.

[0058] The configuration of the holding mechanism 6 and stocker 5 according to another exemplary embodiment will be described below with reference to Figures 6 and 9. Figure 9 is a top view of the holding mechanism and end effector according to another exemplary embodiment. In one embodiment, the stocker 5 may have at least one camera CR disposed within the stocker 5. In the example shown in Figure 6, the stocker 5 has cameras CR1 and CR2. Camera CR1 is located above the plurality of housings 50. Camera CR2 is located below the plurality of housings 50. Camera CR2 may be located above the plurality of housings 50.

[0059] The control unit MC may be configured to control the holding mechanism 6 to hold the end effector AT2 after determining from the image acquired by at least one camera CR that the holding mechanism 6 is positioned to hold the end effector AT2. For example, the control unit MC may determine that the holding mechanism 6 is positioned to hold the end effector AT2 by obtaining the positional relationship between the image of the holding mechanism 6 and the image of the end effector AT2 from the image acquired by camera CR1. According to the substrate processing system PS of one embodiment, it is confirmed by at least one camera CR that the holding mechanism 6 is positioned to hold the end effector AT2.

[0060] In one embodiment, the end effector AT2 may include a first marker. The holding mechanism 6 may include a second marker. The first and second markers may be external shapes or patterns formed on their surfaces. One of the first and second markers may be a through hole. The other of the first and second markers may be a pattern smaller than the through hole. In the example shown in Figure 9, the first marker included in the end effector AT2 is a through hole h12. The second marker included in the holding mechanism 6 is a pattern p1 smaller than the through hole h12. In one example, the pattern p1 is a pattern formed on the surface of the holding mechanism 6. The pattern may be laser engraved. For example, the pattern p1 is formed on a surface 63. The surface 63 is configured to support the end of the end effector AT2 from below.

[0061] The control unit MC may be configured to determine that the holding mechanism 6 is positioned to hold the end effector AT2 based on the positional relationship between the image of a first marker and the image of a second marker in an image acquired by at least one camera CR. In the example shown in Figure 9, the control unit MC is configured to determine that the holding mechanism 6 is positioned to hold the end effector AT2 based on the positional relationship between the image of the edge of the through-hole h12 and the image of the pattern p1 exposed inside the through-hole h12 in an image acquired by at least one camera CR. For example, the through-hole h12 and the pattern p1 may be configured such that the holding mechanism 6 is positioned to hold the end effector AT2 when the image of the pattern p1 is centered relative to the image of the edge of the through-hole h12.

[0062] As shown in Figure 6, in one embodiment, the end effector AT1 may provide a through hole h11 (an example of a first through hole). The end effector AT2 may provide a through hole h12 (an example of a second through hole). Multiple end effectors AT may each provide multiple through holes h1. Multiple through holes h1 include through holes h11 and through holes h12. The through holes h11 and h12 are arranged in a straight line when the end effectors AT1 and AT2 are housed in the housing section 51 and housing section 52, respectively. Multiple through holes h1 are arranged in a straight line when the multiple end effectors AT are housed in the multiple housing sections 50, respectively. In one example, the straight line extends along direction D3.

[0063] In one embodiment, the camera CR1 is positioned above the position where the holding mechanism 6 holds the end effector AT2. The camera CR1 has a field of view along a straight line in which the through holes h11 and h12 are arranged when the end effectors AT1 and AT2 are housed in the housing section 51 and housing section 52, respectively. For example, in the image acquired by the camera CR1, the image of the edge of the through hole h13 of the end effector AT3 is exposed within the through hole h12 of the end effector AT2, and the image of the edge of the through hole h11 of the end effector AT1 is exposed within the through hole h13.

[0064] In one embodiment, the control unit MC may be configured to determine that the holding mechanism 6 is positioned to hold the end effector AT2 based on the positional relationship between the image of the edge of the through hole h12 and the image of the pattern p1 exposed inside the through hole h12 in the image acquired by the camera CR1. According to the substrate processing system PS of one embodiment, since the image of the edge of the through hole h12 of the end effector AT2 is exposed inside the multiple through holes h1 of the multiple end effectors AT, the control unit MC can determine the positional relationship between one of the multiple end effectors AT and the holding mechanism 6 using the camera CR1.

[0065] In one embodiment, the control unit MC may be configured to control the holding mechanism 6 after determining from an image acquired by at least one camera CR that the end effector AT1 is positioned in the housing section 51, causing the holding mechanism 6 to release the end effector AT1. For example, the control unit MC may determine that the end effector AT1 is positioned in the housing section 51 from the position of the image of the end effector AT1 in an image acquired by camera CR2. According to the substrate processing system PS of one embodiment, it is confirmed by at least one camera CR that the end effector AT1 is positioned in the housing section 51.

[0066] In one embodiment, the end effector AT1 may provide a through hole h21. The end effector AT2 may provide a through hole h22 (an example of another through hole). The end effector AT3 may provide a through hole h23. Multiple end effectors ATs may each provide multiple through holes h2. Multiple through holes h2 may include through holes h21, h22, and h23. Multiple through holes h2 may be multiple through holes other than the multiple through holes h1. Multiple through holes h2 are formed in multiple end effectors ATs in a portion separate from the end 7. For example, even if the through hole h11 of the end effector AT1 is covered by the holding mechanism 6 that holds the end effector AT1, the through hole h21 of the end effector AT1 may be exposed. The through holes h21 and h22 are configured to be arranged in a straight line when the end effectors AT1 and AT2 are housed in the housing portion 51 and housing portion 52, respectively. The multiple through holes h2 may be configured such that multiple end effectors AT are arranged in a straight line, each housed in one of the multiple housing sections 50.

[0067] The multiple support plates that support the multiple end effectors AT in the multiple housing sections 50 may have multiple through holes arranged in a straight line together with the multiple through holes h2. The diameter of each of the multiple through holes is larger than the diameter of each of the multiple through holes h2. Therefore, when viewed from a direction along the straight line, the edges of each of the multiple through holes h2 of each of the multiple end effectors AT may be exposed within each of the multiple through holes of each of the multiple support plates.

[0068] Camera CR2 has a field of view along a straight line in which through holes h21 and h22 are arranged with end effectors AT1 and AT2 housed in housing sections 51 and 52, respectively. In one embodiment, the control unit MC is configured to determine that end effector AT1 is positioned in the housing section 51 from the image of the edge of through hole h21 in the image acquired by camera CR2. According to the substrate processing system PS of one embodiment, the control unit MC can determine the position of one of the multiple end effectors AT using camera CR2.

[0069] Camera CR1 does not have to be positioned on the straight line through which through holes h11 and h12 are arranged when end effectors AT1 and AT2 are housed in housings 51 and 52, respectively. Camera CR2 does not have to be positioned on the straight line through which through holes h21 and h22 are arranged when end effectors AT1 and AT2 are housed in housings 51 and 52, respectively. The substrate processing system PS only needs to have at least one camera CR. Camera CR1 may have a field of view along the straight line through which through holes h21 and h22 are arranged when end effectors AT1 and AT2 are housed in housings 51 and 52, respectively. The control unit MC may be configured to determine that end effector AT1 is positioned in the housing location within housing 51 from the image of the edge of through hole h11 in the image acquired by camera CR1.

[0070] Hereinafter, an end effector AT3 of yet another exemplary embodiment will be described with reference to Figures 10 and 11. Figure 10 is a top view of an end effector and holding mechanism of yet another exemplary embodiment. Figure 11 is a cross-sectional view of an end effector of yet another exemplary embodiment. At least one of the multiple end effectors AT may have a cooling mechanism 90. As shown in Figures 10 and 11, the end effector AT3 (another example of the second end effector) has a cooling mechanism 90.

[0071] The end effector AT3 is an end effector. The end effector AT3 has a substantially U-shape when viewed from the vertical. The end effector AT3 includes a main body FKM and a pair of tip sections FKB. The pair of tip sections FKB protrude from the main body FKM. The substrate W is supported on the end effector AT3 such that its central axis passes through the gap. A gap is defined between the pair of tip sections FKB. In one example, a cooling mechanism 90 is attached to each of the pair of tip sections FKB.

[0072] In one embodiment, the substrate processing system PS may include electronic equipment 91. In the examples shown in Figures 10 and 11, electronic equipment 91 is attached to each of the pair of tip sections FKB. The electronic equipment 91 is arranged to be cooled by a cooling mechanism 90. The electronic equipment 91 may include one electronic device selected from a confocal sensor, a laser rangefinder, an interferometer, a camera, and an LED light source. The electronic equipment 91 may be part of the one electronic device.

[0073] As shown in Figure 11, in one embodiment, the cooling mechanism 90 includes refrigerant channels 93, 94, 95 and a Peltier element 92. The refrigerant channels 93, 94, 95 are configured so that a refrigerant flows through them. The refrigerant may be a liquid or a gas. For example, the refrigerant channels 93, 94, 95 are configured to supply refrigerant from the transport arm AR 11 to the end of the tip FKB via the refrigerant channels 93, 94, and return the refrigerant to the transport arm AR 11 via the refrigerant channel 95. The Peltier element 92 may be positioned adjacent to the electronic equipment 91. The Peltier element 92 may be positioned between the electronic equipment 91 and the refrigerant channel 93. The Peltier element 92 is positioned so that its heat-absorbing surface faces the electronic equipment 91 and its heat-dissipating surface faces the refrigerant channel 93. The Peltier element 92 is connected to wiring for supplying current to the Peltier element 92. The wiring for supplying current to the Peltier element 92 may be located in a cable groove 96 (not shown). The cooling mechanism 90 only needs to include at least one of the refrigerant flow paths 93, 94, and 95 and the Peltier element 92.

[0074] In one embodiment, the end effector AT3 includes at least one connector 75 (an example of a first connector). At least one connector 75 is connected to the cooling mechanism 90. The end effector AT3 may include a plurality of connectors 75a, 75b as at least one connector 75. For example, at least one connector 75 includes at least one of a flow path for circulating refrigerant in refrigerant flow paths 93, 94, 95 and wiring for supplying current to the Peltier element 92. In the example shown in Figure 10, each of the plurality of connectors 75a, 75b includes a flow path for circulating refrigerant and wiring for supplying current. At least one connector 75 is connected to the cooling mechanism 90 via the flow path and / or wiring.

[0075] In one embodiment, the transport arm AR11 may include at least one connector 65 (an example of a second connector). The transport arm AR11 may include a plurality of connectors 65a, 65b as at least one connector 65. At least one connector 75 includes at least one of a flow path for supplying refrigerant to the refrigerant flow paths 93, 94 and wiring for supplying current to the Peltier element 92. In the example shown in Figure 10, each of the plurality of connectors 65a, 65b includes a flow path for circulating refrigerant and wiring for supplying current.

[0076] In one embodiment, the control unit MC is configured to hold the end effector AT3 in the holding mechanism 6 and to connect at least one connector 75 and at least one connector 65. According to the substrate processing system PS of one embodiment, the electronic equipment 91 attached to the end effector AT3 can be cooled. Therefore, the electronic equipment 91 can operate stably. The operating rate of the end effector AT3 to which the electronic equipment 91 is attached can be improved.

[0077] Although various exemplary embodiments have been described above, the invention is not limited to the exemplary embodiments described above, and various additions, omissions, substitutions, and modifications may be made. Furthermore, it is possible to combine elements from different embodiments to form other embodiments.

[0078] Refer to Figure 12 below. Figure 12 is a flowchart showing a control method according to one exemplary embodiment. The control method shown in Figure 12 (hereinafter referred to as "Method MT") is a control method for a device having a transport arm. As an example of a device having a transport arm, the control method of a transport robot TR having a transport arm AR11 will be described as an example. As described above, the transport robot TR has a transport arm AR11 and a holding mechanism 6. The holding mechanism 6 is located at the end of the transport arm AR11 and is configured to hold the end effector AT1. The transport robot TR is located in a vacuum transport chamber VCH connected to a substrate processing chamber 10. The transport robot TR is configured to move the end effector AT1 into the processing space 10s within the substrate processing chamber 10.

[0079] Method MT begins in process STa. In process STa, the transport arm AR11 is controlled to move the end effector AT1 to the stocker 5 connected to the vacuum transport chamber VCH. Subsequently, in process STb, the holding mechanism 6 is controlled to release the end effector AT1 from its hold. Subsequently, in process STc, the transport arm AR11 and the holding mechanism 6 are controlled to hold the end effector AT2, which is housed in the stocker 5, in the holding mechanism 6. Finally, in process STd, the transport arm AR11 is controlled to move the end effector AT2 to the vacuum transport chamber VCH.

[0080] Hereinafter, an end effector AT4 according to yet another exemplary embodiment will be described with reference to Figures 13 and 14. Figure 13 is a top view of an end effector according to yet another exemplary embodiment. Figure 14 is a cross-sectional view of an end effector according to yet another exemplary embodiment. Hereinafter, the end effector AT4 will be described in terms of its differences from end effectors AT1, AT2, and AT3, and common components will be omitted from the description as appropriate. The end effector AT4 has at least one electrostatic electrode 210.

[0081] In the example shown in Figure 13, the end effector AT4 has at least one electrostatic electrode 210, consisting of electrostatic electrodes 211, 212, and 213. Electrostatic electrode 211 is located within the main body FKM of the end effector AT4. Electrostatic electrodes 212 and 213 are located within a pair of tip portions FKB of the end effector AT4, respectively. As shown in Figure 14, the end effector AT4 has a dielectric member 221. At least one electrostatic electrode 210 is located within the dielectric member 221. The upper surface of the dielectric member 221 is configured to support the substrate W. In one example, the dielectric member 221 may include a plurality of protrusions. The upper surface of the dielectric member 221 may be the upper surface of a plurality of protrusions. At least one electrostatic electrode 210 is connected to a power supply via at least one connector 75. At least one electrostatic electrode 210 and the dielectric member 221 constitute an electrostatic chuck. The end effector AT4 is configured to hold the substrate W supported on the dielectric member 221.

[0082] In one embodiment, the end effector AT4 may have a base material 222. The dielectric member 221 is disposed on the base material 222. The base material 222 includes at least one refrigerant flow path 230. In one example, at least one refrigerant flow path 230 includes a refrigerant flow path 230a and a refrigerant flow path 230b. At least one refrigerant flow path 230 is configured such that a refrigerant flows through it. The refrigerant may be a liquid or a gas. For example, the refrigerant flow path 230a is configured to supply refrigerant to the end of the tip portion FKB, and the refrigerant flow path 230b is configured to return the refrigerant supplied to the end of the tip portion FKB. The end effector AT4 is configured to cool a substrate W supported thereon.

[0083] Hereinafter, with reference to Figure 15, an end effector AT5 representing yet another exemplary embodiment will be described. Figure 15 is a top view of an end effector representing yet another exemplary embodiment. Hereinafter, the end effector AT5 will be described in terms of its differences from end effectors AT1, AT2, AT3, and AT4, and common components will be omitted from the description as appropriate. The end effector AT5 has at least one pad 240 and at least one vibration sensor 250.

[0084] In the example shown in Figure 15, the end effector AT5 has at least one pad 240, which consists of pads 241, 242, and 243. Pad 241 is positioned on the main body FKM of the end effector AT4. Pads 242 and 243 are positioned on a pair of tip portions FKB of the end effector AT4, respectively. In one example, at least one pad 240 is made of silicone resin. At least one pad 240 is configured to support a substrate on it.

[0085] The end effector AT5 has at least one vibration sensor 250, which includes vibration sensors 251, 252, and 253. Vibration sensor 251 is attached to the main body FKM of the end effector AT4. Vibration sensor 251 may be attached to the upper surface of the main body FKM, the lower surface of the main body FKM, or inside the main body FKM. Vibration sensors 252 and 253 are attached to a pair of tip sections FKB of the end effector AT4. Vibration sensors 252 and 253 may be attached to the upper surface of each tip section FKB, the lower surface of each tip section FKB, or inside each tip section FKB. At least one vibration sensor 250 is located near at least one pad 240. At least one vibration sensor 250 is configured to detect vibrations of the substrate W on at least one pad 240. In one example, at least one vibration sensor 250 is a piezo film sensor.

[0086] At least one vibration sensor 250 is connected to the control unit MC via at least one connector 75. For example, the control unit MC may detect deterioration of at least one pad 240 by vibration of the substrate W on at least one pad 240 acquired from at least one vibration sensor 250. For example, the control unit MC may detect deterioration of at least one pad 240 by pre-learning the vibration of the substrate W on at least one deteriorated pad 240. For example, the control unit MC may detect deterioration of at least one pad 240 by pre-learning the vibration of the substrate W on at least one new pad 240. The control unit MC may pre-learn the vibration of the substrate W on at least one pad 240 when the substrate W on the end effector AT5 is loaded into or unloaded from the load lock modules LL1 and LL2. Loading into or unloading from the load lock modules LL1 and LL2 is less affected by vibration errors due to the transport path. In one example, the control unit MC may, after detecting deterioration of at least one pad 240, issue a warning recommending the replacement of at least one pad 240, and may also reduce the transport speed of the substrate W on the end effector AT5.

[0087] Herein, various exemplary embodiments included in this disclosure are described in [E1] to [E19] below.

[0088] [E1] A substrate processing system comprising: a substrate processing chamber; a vacuum transfer chamber connected to the substrate processing chamber; a transfer robot disposed within the vacuum transfer chamber and having a transfer arm and a holding mechanism located at the end of the transfer arm and configured to detachably hold a first end effector, wherein the transfer robot is configured to move the first end effector to the processing space within the substrate processing chamber; a stocker connected to the vacuum transfer chamber and having a plurality of storage sections configured to accommodate a plurality of end effectors, respectively; and a control unit configured to control the transfer robot, wherein the control unit is configured to control the transfer robot to house the first end effector in the first storage section of the plurality of storage sections, and then release the holding mechanism from holding the first end effector; and to control the transfer robot to move the holding mechanism to the second storage section of the plurality of storage sections, and then have the holding mechanism hold the second end effector housed in the second storage section. [E2] The substrate processing system according to E1, wherein the second end effector has an end portion including a first surface, a second surface, and a third surface that intersect each other, the holding mechanism includes a fourth surface that abuts the first surface in a first direction, a fifth surface that abuts the second surface in a second direction that intersects the first direction, and a sixth surface that abuts the third surface in a third direction that intersects the first direction and the second direction, and the control unit is configured to control the transport robot to bring the first surface, the second surface, and the third surface into contact with the fourth surface, the fifth surface, and the sixth surface, respectively, and then to hold the second end effector in the holding mechanism.[E3] The substrate processing system according to E2, wherein the holding mechanism further includes an electromagnet configured to fix at least one of the first, second, and third surfaces to at least one of the fourth, fifth, and sixth surfaces, and the electromagnet is connected to a power supply configured to supply current to the electromagnet, and the control unit is configured to control the current supplied from the power supply to the electromagnet to release the first end effector from the holding mechanism, and to control the current supplied from the power supply to the electromagnet to hold the second end effector in the holding mechanism. [E4] The substrate processing system according to E2 or 3, wherein the holding mechanism further includes at least one sensor attached to at least one of the fourth surface, the fifth surface, and the sixth surface, the sensor configured to detect whether the end has come into contact with the at least one surface, and the control unit is configured to control the holding of the second end effector after the at least one sensor has detected that at least one of the first surface, the second surface, and the third surface has come into contact with the at least one surface. [E5] The substrate processing system according to any one of E2 to E4, wherein the at least one sensor includes at least one first sensor mounted on the fourth surface, at least one second sensor mounted on the fifth surface, and at least one third sensor mounted on the sixth surface, and the control unit is configured to control the holding of the second end effector after the at least one first sensor detects that the first surface is in contact with the fourth surface, the at least one second sensor detects that the second surface is in contact with the fifth surface, and the at least one third sensor detects that the third surface is in contact with the sixth surface.[E6] The transport robot is a robot having a transport arm as the transport arm, the transport arm includes a plurality of joints and a plurality of motors configured to move each of the plurality of joints, the plurality of motors being connected to a drive power supply configured to supply current to each of the plurality of motors, the control unit controls the current supplied from the drive power supply to each of the plurality of motors to move the holding mechanism located at the end of the transport arm along at least one of the first direction, the second direction and the third direction, and after detecting from the magnitude of the current that at least one of the first surface, the second surface and the third surface has come into contact with at least one of the fourth surface, the fifth surface and the sixth surface, the control unit is configured to hold the second end effector in the holding mechanism, the substrate processing system according to any one of E2 to E5. [E7] The substrate processing system according to E6, wherein the control unit controls the current to move the holding mechanism along the first direction, along the second direction, along the third direction, detects from the magnitude of the current that the first surface has come into contact with the fourth surface, detects from the magnitude of the current that the second surface has come into contact with the fifth surface, and detects from the magnitude of the current that the third surface has come into contact with the sixth surface, and then causes the second end effector to be held in the holding mechanism.[E8] The transport robot is a robot having a transport arm as the transport arm, the transport arm includes a plurality of joints and at least one torque sensor attached to at least one of the plurality of joints, the at least one torque sensor is configured to measure the torque applied to the holding mechanism located at the end of the transport arm, the torque along at least one of the first direction, the second direction and the third direction, and the control unit is configured to detect from the magnitude of the torque that at least one of the first surface, the second surface and the third surface has come into contact with at least one of the fourth surface, the fifth surface and the sixth surface, and then cause the holding mechanism to hold the second end effector, according to any one of E2 to E7. [E9] The substrate processing system according to E8, wherein the at least one torque sensor is configured to measure a first torque applied to the holding mechanism in the first direction, a second torque applied to the holding mechanism in the second direction, and a third torque applied to the holding mechanism in the third direction, and the control unit is configured to detect from the magnitude of the first torque that the first surface has come into contact with the fourth surface, from the magnitude of the second torque that the second surface has come into contact with the fifth surface, and from the magnitude of the third torque that the third surface has come into contact with the sixth surface, and then cause the holding mechanism to hold the second end effector. [E10] The substrate processing system according to any one of E1 to E9, wherein the stocker further comprises at least one camera disposed within the stocker, and the control unit is configured to determine from an image acquired by the at least one camera that the holding mechanism is positioned to hold the second end effector, and then cause the holding mechanism to hold the second end effector.[E11] The substrate processing system according to E10, wherein the second end effector includes a first marker, the holding mechanism includes a second marker, and the control unit is configured to determine from the positional relationship between the image of the first marker and the image of the second marker in the image acquired by the at least one camera that the holding mechanism is positioned to hold the second end effector. [E12] The substrate processing system according to E11, wherein one of the first and second markers is a through hole, the other of the first and second markers is a pattern smaller than the through hole, and the control unit is configured to determine from the positional relationship between the image of the edge of the through hole and the image of the pattern exposed in the through hole in the image acquired by the at least one camera that the holding mechanism is positioned to hold the second end effector. [E13] The substrate processing system according to E12, wherein the first marker is the through hole, the second marker is the pattern, the plurality of end effectors each provide a plurality of through holes including the through hole, the plurality of through holes are arranged in a straight line with the plurality of end effectors each housed in the plurality of housings, the holding mechanism is a surface that supports the end of the second end effector from below and includes the surface on which the pattern is formed, the at least one camera is positioned above the position for holding the second end effector and includes a camera having a field of view along the straight line, and the control unit is configured to determine that the holding mechanism is positioned for holding the second end effector based on the positional relationship between the image of the edge of the through hole exposed in the plurality of through holes arranged in the straight line and the image of the pattern exposed in the through hole in the image acquired by the camera.[E14] The substrate processing system according to any one of E1 to E13, wherein the stocker further comprises at least one camera disposed within the stocker, and the control unit is configured to release the first end effector from the holding mechanism after determining from an image acquired by the at least one camera that the first end effector is positioned in the housing location within the first housing. [E15] The substrate processing system according to E14, wherein the plurality of end effectors each provide a plurality of through holes configured such that the plurality of end effectors are arranged in a straight line with the plurality of end effectors housed in the plurality of housing locations, the at least one camera includes a camera having a field of view along the straight line, and the control unit is configured to determine from an image acquired by the camera of the edges of the through holes of the first end effector exposed in the plurality of through holes arranged in the straight line that the first end effector is positioned in the housing location within the first housing. [E16] The substrate processing system according to any one of E1 to 15, wherein the plurality of end effectors include at least one selected from the group consisting of end effectors, distance sensors, capacitance sensors, and camera sensors. [E17] The substrate processing system according to any one of E1 to 16, wherein at least one of the plurality of end effectors has a cooling mechanism. [E18] The substrate processing system according to E17, wherein the second end effector includes the cooling mechanism which includes at least one of a refrigerant flow path and a Peltier element, and at least one first connector connected to the cooling mechanism, the transport arm includes at least one second connector which includes at least one of a flow path for circulating refrigerant in the refrigerant flow path and wiring for supplying current to the Peltier element, and the control unit is configured to hold the second end effector in the holding mechanism and to connect the at least one first connector and the at least one second connector.[E19] A transport robot having a transport arm and a holding mechanism located at the end of the transport arm and configured to hold a first end effector, wherein the transport robot is placed in a vacuum transport chamber connected to a substrate processing chamber and configured to move the first end effector into the processing space within the substrate processing chamber, the control method comprising: (a) a step of releasing the first end effector from the holding mechanism after housing the first end effector in a first housing among a plurality of housings of a stocker connected to the vacuum transport chamber; and (b) a step of having the holding mechanism hold a second end effector housed in a second housing among the plurality of housings. [E20] An end effector comprising: an end portion configured to be detachably held by a holding mechanism of a transport robot of a substrate processing system; and a ferromagnetic material corresponding to an electromagnet of the holding mechanism.

[0089] The control method related to E19 may be performed in the substrate processing system PS related to any one of items E1 to E18.

[0090] From the above description, it will be understood that the various embodiments of this disclosure are described herein for illustrative purposes and can be modified in various ways without departing from the scope and spirit of this disclosure. Accordingly, the various embodiments disclosed herein are not intended to limit the scope and spirit, and the true scope and spirit are shown by the appended claims.

[0091] 5... Stocker, 6... Holding mechanism, 6a, 6b, 6c... Sensor, 7... End, 10... Substrate processing chamber, 10s... Processing space, 50... Housing section, 51, 52, 53... Housing section, 61, 62, 63... Surface, 64... Electromagnet, 65... Connector, 71, 72, 73... Surface, 75... Connector, 80... Motor, 80t... Torque sensor, 90... Cooling mechanism, 92... Peltier element, 93, 94, 95... Refrigerant flow path, AR11... Transfer arm, AT1... End effector, AT2... End effector, AT3... End effector, CR... Camera, CR1, CR2... Camera, D1, D2, D3... Direction, h1... Through hole, h2... Through hole, p1... Pattern, MC... Control unit, PS... Substrate processing system, TR... Transfer robot, VCH... Vacuum transfer chamber.

Claims

1. A substrate processing system comprising: a substrate processing chamber; a vacuum transfer chamber connected to the substrate processing chamber; a transfer robot disposed within the vacuum transfer chamber and having a transfer arm and a holding mechanism located at the end of the transfer arm and configured to detachably hold a first end effector, wherein the transfer robot is configured to move the first end effector between the substrate processing chamber and the vacuum transfer chamber; a stocker connected to the vacuum transfer chamber; and a control unit configured to control the transfer robot, wherein the control unit is configured to perform the following steps: controlling the transfer arm to move the first end effector to the stocker; controlling the holding mechanism to release the holding mechanism from holding the first end effector; controlling the transfer arm and the holding mechanism to have the holding mechanism hold a second end effector housed in the stocker; and controlling the transfer arm to move the second end effector to the vacuum transfer chamber.

2. The substrate processing system according to claim 1, wherein the second end effector has an end portion including a first surface, a second surface, and a third surface that intersect each other, the holding mechanism includes a fourth surface that abuts the first surface in a first direction, a fifth surface that abuts the second surface in a second direction that intersects the first direction, and a sixth surface that abuts the third surface in a third direction that intersects the first direction and the second direction, and the control unit is configured to perform the steps of: controlling the transport arm to bring the first surface, the second surface, and the third surface into contact with the fourth surface, the fifth surface, and the sixth surface, respectively, and controlling the holding mechanism to hold the second end effector in the holding mechanism.

3. The substrate processing system according to claim 2, wherein the holding mechanism further includes an electromagnet configured to fix at least one of the first, second, and third surfaces to at least one of the fourth, fifth, and sixth surfaces, and the electromagnet is connected to a power supply configured to supply current to the electromagnet, and the control unit is configured to perform the steps of: controlling the current supplied from the power supply to the electromagnet to release the first end effector from the holding mechanism; and controlling the current supplied from the power supply to the electromagnet to hold the second end effector in the holding mechanism.

4. The substrate processing system according to claim 2, wherein the holding mechanism further includes at least one sensor attached to at least one of the fourth, fifth, and sixth surfaces, the sensor configured to detect whether the end has come into contact with the at least one surface, and the control unit is configured to control the holding mechanism to hold the second end effector in the holding mechanism after the at least one sensor has detected that at least one of the first, second, and third surfaces has come into contact with the at least one surface, 5. The substrate processing system according to claim 4, wherein the at least one sensor includes at least one first sensor mounted on the fourth surface, at least one second sensor mounted on the fifth surface, and at least one third sensor mounted on the sixth surface, and the control unit is configured to control the holding mechanism to hold the second end effector in the holding mechanism after the at least one first sensor detects that the first surface is in contact with the fourth surface, the at least one second sensor detects that the second surface is in contact with the fifth surface, and the at least one third sensor detects that the third surface is in contact with the sixth surface.

6. The substrate processing system according to claim 2, wherein the transport arm includes a plurality of joints and a plurality of motors configured to move each of the plurality of joints, and the plurality of motors are connected to a drive power supply configured to supply current to each of the plurality of motors, and the control unit is configured to perform the steps of: controlling the current supplied from the drive power supply to each of the plurality of motors to move the holding mechanism located at the end of the transport arm along at least one of the first direction, the second direction, and the third direction; and after detecting from the magnitude of the current that at least one of the first surface, the second surface, and the third surface has come into contact with at least one of the fourth surface, the fifth surface, and the sixth surface, control the holding mechanism to hold the second end effector in the holding mechanism.

7. The substrate processing system according to claim 6, wherein the control unit is configured to perform the steps of: controlling the current to move the holding mechanism along the first direction, moving the holding mechanism along the second direction, and moving the holding mechanism along the third direction; detecting from the magnitude of the current that the first surface has come into contact with the fourth surface, detecting from the magnitude of the current that the second surface has come into contact with the fifth surface, and detecting from the magnitude of the current that the third surface has come into contact with the sixth surface, and then controlling the holding mechanism to hold the second end effector in the holding mechanism.

8. The substrate processing system according to claim 2, wherein the transport arm includes a plurality of joints and at least one torque sensor attached to at least one of the plurality of joints, the at least one torque sensor is configured to measure a torque applied to the holding mechanism located at the end of the transport arm, the torque along at least one of the first, second, and third directions, and the control unit is configured to control the holding mechanism after detecting from the magnitude of the torque that at least one of the first, second, and third surfaces has come into contact with at least one of the fourth, fifth, and sixth surfaces, causing the second end effector to be held by the holding mechanism.

9. The substrate processing system according to claim 8, wherein the at least one torque sensor is configured to measure a first torque applied to the holding mechanism in the first direction, a second torque applied to the holding mechanism in the second direction, and a third torque applied to the holding mechanism in the third direction, and the control unit is configured to detect from the magnitude of the first torque that the first surface is in contact with the fourth surface, from the magnitude of the second torque that the second surface is in contact with the fifth surface, and from the magnitude of the third torque that the third surface is in contact with the sixth surface, and then control the holding mechanism to hold the second end effector in the holding mechanism.

10. The substrate processing system according to claim 1, wherein the stocker further comprises at least one camera disposed within the stocker, and the control unit is configured to control the holding mechanism after determining from an image acquired by the at least one camera that the holding mechanism is positioned to hold the second end effector, thereby causing the holding mechanism to hold the second end effector.

11. The substrate processing system according to claim 10, wherein the second end effector includes a first marker, the holding mechanism includes a second marker, and the control unit is configured to determine from the positional relationship between the image of the first marker and the image of the second marker in the image acquired by the at least one camera that the holding mechanism is positioned to hold the second end effector.

12. The substrate processing system according to claim 11, wherein one of the first marker and the second marker is a through hole, the other of the first marker and the second marker is a pattern smaller than the through hole, and the control unit is configured to determine from the positional relationship between the image of the edge of the through hole and the image of the pattern exposed in the through hole in the image acquired by the at least one camera that the holding mechanism is positioned to hold the second end effector.

13. The first marker is the through hole, the second marker is the pattern, the first end effector provides a first through hole as the through hole, the second end effector provides a second through hole as the through hole, the stocker includes a first housing for housing the first end effector and a second housing for housing the second end effector, the first and second through holes are configured to be arranged in a straight line when the first and second end effectors are housed in the first and second housings, respectively, the holding mechanism includes a surface that supports the end of the second end effector from below, the surface on which the pattern is formed, and the at least one camera is positioned above the position for holding the second end effector and includes a camera having a field of view along the straight line. The substrate processing system according to claim 12, wherein the control unit is configured to determine that the holding mechanism is positioned for holding the second end effector based on the positional relationship between the image of the edge of the second through hole and the image of the pattern exposed inside the second through hole in the image acquired by the camera.

14. The substrate processing system according to claim 1, wherein the stocker further comprises at least one camera disposed within the stocker, and the control unit is configured to control the holding mechanism after determining from an image acquired by the at least one camera that the first end effector has been placed in a storage position for housing the first end effector, causing the holding mechanism to release the holding of the first end effector.

15. The substrate processing system according to claim 14, wherein the first end effector provides a through hole, the second end effector provides another through hole, the stocker includes a first housing for housing the first end effector and a second housing for housing the second end effector, the through hole and the other through hole are arranged in a straight line such that the first end effector and the second end effector are housed in the first housing and the second housing, respectively, the at least one camera includes a camera having a field of view along the straight line, and the control unit is configured to determine from the image of the edge of the through hole of the first end effector in the image acquired by the camera that the first end effector is positioned in the housing position within the first housing.

16. The substrate processing system according to any one of claims 1 to 15, wherein the first end effector and / or the second end effector includes at least one selected from the group consisting of a distance sensor, a capacitance sensor, and a camera sensor.

17. The substrate processing system according to any one of claims 1 to 15, wherein the first end effector and / or the second end effector have a cooling mechanism.

18. The substrate processing system according to claim 17, wherein the second end effector includes a cooling mechanism including at least one of a refrigerant flow path and a Peltier element, and at least one first connector connected to the cooling mechanism, the transport arm includes at least one second connector including at least one of a flow path for circulating a refrigerant in the refrigerant flow path and wiring for supplying current to the Peltier element, and the control unit is configured to control the transport arm and the holding mechanism to hold the second end effector in the holding mechanism and to connect the at least one first connector and the at least one second connector.

19. A transport robot having a transport arm and a holding mechanism located at the end of the transport arm and configured to hold a first end effector, wherein the transport robot is placed in a vacuum transport chamber connected to a substrate processing chamber and configured to move the first end effector between the substrate processing chamber and the vacuum transport chamber, the control method comprising: (a) controlling the transport arm to move the first end effector to a stocker connected to the vacuum transport chamber; (b) controlling the holding mechanism to release the holding mechanism from holding the first end effector; (c) controlling the transport arm and the holding mechanism to cause the holding mechanism to hold a second end effector housed in the stocker; and (d) controlling the transport arm to move the second end effector to the vacuum transport chamber.

20. An end effector comprising: an end portion configured to be detachably held by a holding mechanism of a transport robot of a substrate processing system; and a ferromagnetic material corresponding to an electromagnet of the holding mechanism.

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