Light-absorbing compound, temporary adhesive composition, method for producing laminate, method for peeling laminate, and method for cleaning substrate

Abstract

The present invention is a light-absorbing compound that is a polymer of (A) a compound of general formula (1), (B) a hydrogen polyorganosiloxane, and (C) a compound of general formula (2). Provided thereby are: a compound that can be used as a temporary adhesive material for semiconductor processing; and a temporary adhesive composition that enables a temporarily fixed laminate to be easily peeled off by light irradiation, and the residue after peeling to be easily removed.

Description

Light-absorbing compound, temporary adhesive composition, method for manufacturing a laminate, method for peeling off a laminate, and method for cleaning a substrate.

[0001] The present invention relates to a light-absorbing compound, a temporary adhesive composition, a method for manufacturing a laminate, a method for peeling off a laminate, and a method for cleaning a substrate.

[0002] Light absorbers have the function of absorbing light rays through a chemical mechanism and converting them into other forms of energy such as heat. This function can be used to impart weather resistance to synthetic resins that are susceptible to degradation and discoloration due to light exposure. On the other hand, they are also sometimes added to synthetic resins to intentionally alter the surrounding resin by generating heat through light irradiation.

[0003] An example of intentionally altering surrounding synthetic resins through light irradiation is a temporary adhesive material for semiconductor processing that peels off when exposed to light. Temporary adhesive materials for semiconductor processing are used to prevent damage to semiconductor substrates during processes such as back-side grinding, TSV (Total Surface Vectoring), and back-side electrode formation, by bonding the semiconductor substrate to a support such as silicon or glass via an adhesive layer. Furthermore, the semiconductor substrate bonded with the adhesive must be easily detachable in the final stage of the semiconductor processing process. A composition that bonds the semiconductor substrate and support during the processing process and can be easily detached at any desired timing is called a "temporary adhesive composition." To achieve this detachability, a method of adding a light absorber to the adhesive layer is often employed.

[0004] Patent documents 1 to 4 describe such temporary adhesive compositions for semiconductors. Specifically, these are temporary adhesive materials composed of an adhesive component and a light-absorbing component, and which can be peeled off by light irradiation.

[0005] International Publication No. 2020 / 105586, Japanese Patent Publication No. 2022-182451, Japanese Patent Publication No. 2023-125710, Japanese Patent Publication No. 2024-072835

[0006] However, as described in prior patent documents 1 to 3, these added light-absorbing components are often added individually, and in cases where they are exposed to organic solvents during the semiconductor component manufacturing process, the light-absorbing components may dissolve, making it impossible to maintain their original peeling function.

[0007] Furthermore, semiconductor substrates bonded with a temporary adhesive material for semiconductor processing are peeled off after processing by any method, such as light irradiation. At this time, some of the temporary adhesive material may remain on the surface of the semiconductor substrate, and this remaining temporary adhesive material needs to be easily removed in the cleaning process. As described in Prior Patent Document 4, in the case of a method in which an insoluble substance is added as a light-absorbing component, there is a risk that the insoluble substance may not be sufficiently removed in the temporary adhesive material removal process, leading to a decrease in yield due to poor connections.

[0008] The present invention has been made in view of the above, and aims to provide a compound that can be used as a temporary adhesive material for semiconductor processing, and a temporary adhesive composition in which the compound reacts with a crosslinking agent to form a crosslinked product, wherein a laminate temporarily fixed with the composition can be easily peeled off by light irradiation, and the residue after peeling can be easily removed.

[0009] To solve the above problems, the present invention provides a light-absorbing compound which is a polymer of (A) a compound represented by the following general formula (1), (B) a hydrogen polyorganosiloxane containing two silicon-hydrogen bonds, and (C) a compound represented by the following general formula (2) containing two carbon-carbon double bonds and at least one epoxide or phenolic hydroxyl group. (In the formula, V is, A divalent organic group selected from either of the following, where p is 0 or 1. Also, R １ and R ２ and R ３ Each of these is a hydrogen atom, a hydroxyl group, an oxyalkyl group, or an alkyl group, and R １ and R ３ At least one of them is a hydroxyl group. (In the formula, W is, A divalent organic group selected from either of the above, where q is 0 or 1. Also, R ４ (This is either a hydrogen atom or an alkylene oxide group.)

[0010] With such a structure, the present invention can provide a compound that contains, within the same molecule, a light-absorbing component usable as a temporary adhesive material for semiconductor processing and a siloxane structure, and a temporary adhesive composition in which the compound reacts with a crosslinking agent to form a crosslinked product, wherein the laminate temporarily fixed by the composition can be easily peeled off by light irradiation, and the residue after peeling can be easily removed.

[0011] Further, the component (B) each has R ５ R ６ R ７ SiO １／２ M units represented by, R ８ R ９ SiO ２／２ D units represented by, R １０ SiO ３／２ T units represented by or SiO ４／２ Q units represented by, the component (B) is composed of at least one selected from the foregoing, and the substituents R ５ , R ６ , R ７ , R ８ , R ９ , R １０ are each a methyl group, a phenyl group or a hydrogen atom, and it is preferable that one molecule contains two silicon-hydrogen bonds.

[0012] As component (B), such compounds can be particularly suitably used.

[0013] Further, when the total number of moles of the component (A) and the component (B) is 100 mol%, the composition preferably contains 5 to 95 mol% of the component (A) and 5 to 95 mol% of the component (B).

[0014] By including the component (A) and the component (B) in such a ratio, the effects of the present invention can be more sufficiently exhibited.

[0015] Further, the total number of moles of vinyl groups M ｖｉ of the vinyl group-containing component (A) and the component (C), and the total number of moles of silicon-hydrogen bonds M ｓｉ－Ｈ of the silicon-hydrogen bond-containing component (B) satisfy the relational expression 0.5≦M ｓｉ－Ｈ / M ｖｉ ≦1.5, which is preferable.

[0016] The effects of the present invention can be more fully realized when the ratio of moles of vinyl groups to the number of moles of silicon-hydrogen bonds is such that the present invention can be fully realized.

[0017] The present invention also provides a temporary adhesive composition comprising (D) the above-mentioned light-absorbing compound, (E) a crosslinking agent, (F) a catalyst, and (G) a solvent.

[0018] With such a composition, it is possible to provide a temporary adhesive composition in which the compound of the present invention reacts with a crosslinking agent to form a crosslinked product, and in which a laminate temporarily fixed with the composition can be easily peeled off by light irradiation, and the residue after peeling can be easily removed.

[0019] Furthermore, it is preferable that component (E) contains at least two functional groups in one molecule that react with the epoxide or phenolic hydroxyl group contained in component (D).

[0020] Furthermore, it is preferable that component (E) contains at least two or more epoxide or phenolic hydroxyl groups.

[0021] In this way, the effects of the present invention can be more fully realized.

[0022] Furthermore, it is preferable that the component (F) generates an acid or base upon heating.

[0023] The following are particularly suitable as component (F).

[0024] Furthermore, it is preferable that the relation satisfies 0.5 ≤ MD / ME ≤ 1.5, where MD is the number of moles of epoxide or phenolic hydroxyl groups contained in a unit weight of component (D), and ME is the number of moles of epoxide or phenolic hydroxyl groups contained in a unit weight of component (E).

[0025] The effects of the present invention can be more fully realized when the number of moles of epoxide or phenolic hydroxyl groups is in such a ratio.

[0026] The present invention also provides a method for manufacturing a laminate, comprising: (1) forming a temporary adhesive layer made of the above-mentioned temporary adhesive composition on the bonding surface of a substrate; (2) bonding the substrate and the other substrate so that the bonding surface of the temporary adhesive layer formed on the substrate and the bonding surface of the other substrate face each other to form a laminate; and (3) curing the temporary adhesive layer of the laminate.

[0027] Furthermore, the present invention provides a method for delaminating a laminate in which a substrate, a temporary adhesive layer made of the above-mentioned temporary adhesive composition, and another substrate are stacked in this order, by irradiating the laminate with light to separate the substrate and the other substrate.

[0028] Furthermore, the present invention provides a method for cleaning a substrate to which residue of the above-mentioned temporary adhesive composition is attached is brought into contact with a liquid containing a cleaning component, thereby decomposing and dissolving the residue and removing it from the substrate.

[0029] By using the temporary adhesive composition containing the light-absorbing compound of the present invention, temporary bonding, separation, and subsequent removal of residues of laminates can be effectively performed.

[0030] According to the present invention, it is possible to provide a light-absorbing compound obtained by polymerizing a compound having two polymerization-reactive functional groups and two light-absorbing triazine derivatives with a compound containing a siloxane structure.

[0031] By forming a crosslinked compound containing the light-absorbing component of the present invention, the workpiece and support are temporarily fixed together. This prevents the light-absorbing component from leaching out even when the laminate is exposed to an organic solvent, thus maintaining the peel-off function required for a temporary adhesive composition. Furthermore, by incorporating a siloxane structure into the compound of the present invention, decomposition can be achieved using a cleaning agent containing fluoride ions, which are effective in breaking siloxane bonds, without using strong acids or bases that corrode semiconductor substrates. The decomposed products can then be easily removed without residue by dissolving them in the cleaning agent.

[0032] As described above, there has been a need for the development of a compound that can be used as a temporary adhesive material for semiconductor processing, and a temporary adhesive composition in which the compound reacts with a crosslinking agent to form a crosslinked product, wherein the laminate temporarily fixed with the composition can be easily peeled off by light irradiation, and the residue after peeling can be easily removed.

[0033] As a result of extensive research to achieve the above objective, the inventors discovered a compound containing a light-absorbing triazine derivative in the side chain and a siloxane structure in the main chain. Furthermore, they found that a laminate temporarily fixed with a temporary adhesive composition in which this compound forms a crosslinked structure can be easily peeled off by light irradiation even after exposure to an organic solvent, and the residue after peeling can be easily removed, thus completing the present invention.

[0034] In other words, the present invention is a light-absorbing compound that is a polymer of (A) a compound represented by the above general formula (1), (B) a hydrogen polyorganosiloxane containing two silicon-hydrogen bonds, and (C) a compound represented by the above general formula (2) containing two carbon-carbon double bonds and at least one epoxide or phenolic hydroxyl group.

[0035] The present invention will be described in detail below, but is not limited thereto. In this specification, the weight-average molecular weight (Mw) and number-average molecular weight (Mn) are polystyrene-converted values ​​obtained using a calibration curve with standard polystyrene by gel permeation chromatography (GPC).

[0036] [Light-absorbing compound] The light-absorbing compound of the present invention is a polymer of (A) a compound represented by the following general formula (1), (B) a hydrogen polyorganosiloxane containing two silicon-hydrogen bonds, and (C) a compound represented by the following general formula (2) containing two carbon-carbon double bonds and at least one epoxide or phenolic hydroxyl group. (In the formula, V is, A divalent organic group selected from either of the following, where p is 0 or 1. Also, R １ and R ２ and R ３Each of these is a hydrogen atom, a hydroxyl group, an oxyalkyl group, or an alkyl group, and R １ and R ３ At least one of them is a hydroxyl group. (In the formula, W is, A divalent organic group selected from either of the above, where q is 0 or 1. Also, R ４ (This is either a hydrogen atom or an alkylene oxide group.)

[0037] <Component (A)> Component (A) is a compound represented by the following general formula (1). (In the formula, V is, A divalent organic group selected from either of the following, where p is 0 or 1. Also, R １ and R ２ and R ３ Each of these is a hydrogen atom, a hydroxyl group, an oxyalkyl group, or an alkyl group, and R １ and R ３ At least one of them is a hydroxyl group.

[0038] Examples of the oxyalkyl groups include hydrocarbon groups having 1 to 7 carbon atoms, such as methoxy or ethoxy groups, propoxy groups, isopropoxy groups, butoxy groups, isobutoxy groups, tert-butoxy groups, pentyloxy groups, neopentyloxy groups, hexyloxy groups, and heptyloxy groups, with the methoxy group being the most representative.

[0039] Examples of the alkyl groups include alkyl groups with 1 to 7 carbon atoms, such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, neopentyl, hexyl, and heptyl groups, with the methyl group being the most representative.

[0040] As representative examples of compounds represented by such a general formula (1), compounds (3) to (14) can be shown below.

[0041]

[0042]

[0043]

[0044]

[0045] The compound represented by the general formula (1) may be used alone or in combination of two or more types.

[0046] <Component (B)> Component (B) is a hydrogen polyorganosiloxane containing two silicon-hydrogen bonds.

[0047] Component (B) is R ５ R ６ R ７ SiO １／２ M units, R ８ R ９ SiO ２／２ The D unit is represented by R １０ SiO ３／２ T units or SiO, represented by T units. ４／２ It consists of at least one of the Q units represented by and a substituent R ５ , R ６ , R ７ , R ８ , R ９ , R １０ The group is a methyl group, a phenyl group, or a hydrogen atom, and it is preferable that the molecule contains two silicon-hydrogen bonds.

[0048] The number-average molecular weight (Mn) of the hydrogen polyorganosiloxane of component (B) is not particularly limited, but is, for example, 200 to 20,000, preferably 500 to 10,000, and more preferably 1,000 to 5,000.

[0049] The hydrogen polyorganosiloxane may be linear, branched, or cyclic, with a linear configuration having one silicon-hydrogen bond at each end being particularly preferred. The degree of polymerization (number of D units constituting the linear chain) is preferably 5 to 100, and more preferably 10 to 50.

[0050] The aforementioned hydrogen polyorganosiloxane may be used alone or in combination of two or more types.

[0051] <Component (C)> Component (C) is a compound represented by the following general formula (2), comprising two carbon-carbon double bonds and at least one epoxide or phenolic hydroxyl group. (In the formula, W is, A divalent organic group selected from either of the above, where q is 0 or 1. Also, R ４ (This is either a hydrogen atom or an alkylene oxide group.)

[0052] The alkylene oxide group is not particularly limited, but examples include a 2,3-epoxypropyl group, a 3,4-epoxybutyl group, and a 4,5-epoxypentyl group.

[0053] [Synthesis Method for Light-Absorbing Compounds] The light-absorbing compounds of the present invention can be obtained by polymerizing components (A), (B), and (C) dissolved in a solvent using a catalyst. More specifically, the vinyl groups of components (A) and (C) react with the Si-H groups of component (B) to increase molecular weight, thereby obtaining a light-absorbing compound that is a polymer of components (A), (B), and (C).

[0054] The above solvent is not particularly limited, but aprotic organic solvents are preferred, and examples include ethers such as diethyl ether, tetrahydrofuran, and dioxane; aromatic hydrocarbons such as benzene, toluene, and xylene; halogenated hydrocarbons such as dichloroethane, chloroform, and chlorobenzene; amides such as N,N-dimethylformamide, N,N-dimethylacetamide, N,N-dimethylpropionamide, N-methylpyrrolidone, and N-ethylpyrrolidone; and sulfoxides such as dimethyl sulfoxide.

[0055] The amount of solvent is not particularly limited, but is preferably an amount sufficient to sufficiently dissolve the compounds represented by components (A), (B), and (C). It is preferably 0.30 M or less, more preferably 0.25 M or less, and even more preferably 0.20 M, relative to the total number of moles of the compounds represented by components (A), (B), and (C).

[0056] The catalyst is not particularly limited and examples include platinum catalysts, palladium catalysts, ruthenium catalysts, and rhodium catalysts, but platinum catalysts can be used particularly favorably.

[0057] The reaction ratio of components (A), (B), and (C) is not particularly limited, but the total number of moles of vinyl groups M of components (A) and (C), which are vinyl group-containing components, is important. ｖｉ The total number of silicon-hydrogen bond moles M is the number of silicon-hydrogen bond moles of component (B), which is a silicon-hydrogen bond-containing component. ｓｉ－Ｈ The relationship is α≦M ｓｉ－Ｈ / M ｖｉ When expressed as ≤β, α = 0.5 and β = 1.5 are preferred, α = 0.8 and β = 1.2 are more preferred, and α = 0.99 and β = 1.01 are most preferred.

[0058] The ratio of component (A) to component (B) is not particularly limited, but when component (A) is α mol% and component (B) is 100 - α mol%, that is, when the sum of component (A) and component (B) is 100 mol%, it is preferable that 5 ≤ α ≤ 95. Alternatively, when used as a temporary adhesive composition, considering adhesion and release properties, it is preferable that 5 ≤ α < 25, more preferably 25 ≤ α < 50, even more preferably 50 ≤ α < 80, and most preferably 80 ≤ α < 95.

[0059] Furthermore, there are no particular restrictions on the molar ratio of component (A) and component (C), which are vinyl group-containing components. For example, component (A):component (C) can be 98:2 to 2:98, preferably 98:2 to 50:50, and more preferably 95:5 to 70:30.

[0060] The weight-average molecular weight Mw of the light-absorbing compound of the present invention (polymer of components (A), (B), and (C)) is not particularly limited, but is, for example, 5,000 to 100,000, preferably 10,000 to 50,000, and more preferably 20,000 to 40,000.

[0061] [Temporary Adhesive Composition] The present invention also provides a temporary adhesive composition comprising (D) the light-absorbing compound of the present invention, (E) a crosslinking agent, (F) a catalyst, and (G) a solvent.

[0062] <Component (D)> Component (D) is the light-absorbing compound of the present invention, as described above.

[0063] <Component (E)> Component (E) is a crosslinking agent. The crosslinking agent used in the temporary adhesive composition of the present invention is not particularly limited as long as it can react with the epoxide or phenolic hydroxyl group (hydroxyl group) of component (D) to form a covalent bond and construct a crosslinking system with the light-absorbing compound (component (D)) obtained by polymerizing components (A), (B), and (C). If component (C) in the light-absorbing compound contains an epoxide, a compound having at least two phenolic hydroxyl groups is preferably used as the crosslinking agent, or if component (C) in the light-absorbing compound contains a phenolic hydroxyl group, a compound having at least two epoxides is preferably used as the crosslinking agent.

[0064] The following compounds are specific examples of crosslinking agents for component (E).

[0065] <Component (F)> Component (F) is a catalyst. The catalyst added to the above temporary adhesive composition can be activated by light or heat, but is not particularly limited. Compounds that generate an acid or base upon activation are preferably used.

[0066] As the catalyst for component (F), for example, U-CAT SA506, U-CAT SA810, U-CAT SA603 (manufactured by Sunapro Co., Ltd.) can be used.

[0067] <Component (G)> Component (G) is a solvent. The solvent added to the above temporary adhesive composition is not particularly limited as long as it sufficiently dissolves components (D), (E), and (F). For example, the solvents exemplified in the synthesis of the light-absorbing compounds of the present invention can be used.

[0068] The mixing ratio of component (D) and component (E) is not particularly limited, but when MD is the number of moles of epoxide or phenolic hydroxyl groups contained in a unit weight of component (D) and ME is the number of moles of epoxide or phenolic hydroxyl groups contained in a unit weight of component (E), the relationship MD / ME is preferably 0.5 to 1.5, more preferably 0.75 to 1.25, even more preferably 0.9 to 1.1, and most preferably 0.99 to 1.01.

[0069] Furthermore, there are no particular restrictions on the amounts of components (D) to (G) blended in the temporary adhesive composition, but for example, per 100 parts by mass of component (D), component (E) may be 0.1 to 20 parts by mass; component (F) may be 0.01 to 10 parts by mass, preferably 0.1 to 5 parts by mass; and component (G) may be 10 to 500 parts by mass, preferably 50 to 200 parts by mass.

[0070] [Method for Manufacturing a Laminate] The present invention also provides a method for manufacturing a laminate, comprising: (1) forming a temporary adhesive layer made of the above-mentioned temporary adhesive composition on the bonding surface of a substrate; (2) bonding the substrate and the other substrate so that the bonding surface of the temporary adhesive layer formed on the substrate and the bonding surface of the other substrate face each other to form a laminate; and (3) curing the temporary adhesive layer of the laminate.

[0071] [Method for peeling off a laminate] The present invention also provides a method for peeling off a laminate, in which a substrate, a temporary adhesive layer made of the above-mentioned temporary adhesive composition, and another substrate are laminated in this order, by irradiating the laminate with light to separate the substrate and the other substrate.

[0072] [Method for cleaning substrates] The present invention also provides a method for cleaning substrates to which residue of the above-mentioned temporary adhesive composition is attached is brought into contact with a liquid containing a cleaning component, thereby decomposing and dissolving the residue and removing it from the substrate.

[0073] The above-mentioned temporary adhesive composition is used in the process of manufacturing a thinned wafer when a laminate is produced by bonding a substrate with a circuit formed on its surface to a support via the temporary adhesive composition. For example, the process consists of the steps of forming a temporary adhesive composition layer on a substrate, bonding the substrate and the support via the temporary adhesive composition to form a laminate, curing the temporary adhesive composition in the laminate, irradiating the laminate with light to separate the two substrates (substrate and support), and removing any remaining residue of the temporary adhesive composition on the peeled substrate.

[0074] In the step of forming a temporary adhesive composition layer on the substrate, a film of the temporary adhesive composition may be used when laminating the temporary adhesive composition layer. Alternatively, a solution of the temporary adhesive composition may be laminated by methods such as spin coating, slit coating, or spray coating. Preferably, it is laminated by spin coating. In this case, after spin coating, pre-baking is usually performed at a temperature of preferably 80 to 250°C, more preferably 100 to 230°C, depending on the volatilization conditions of the solvent contained in the temporary adhesive composition.

[0075] The temporary adhesive composition layer is preferably formed to have a film thickness of 10 to 150 μm. If it is 10 μm or more, the substrate and the support can be bonded together without gaps and can withstand the grinding process described later. If it is 150 μm or less, resin deformation during heat treatment processes such as the TSV formation process described later can be suppressed and it can be used in practice.

[0076] In the process of bonding the substrate and the support, one method for bonding the substrate and the support is, for example, to uniformly press the substrate under reduced pressure at a temperature of preferably 40 to 250°C, more preferably 60 to 200°C. Commercial wafer bonding equipment, such as the EVG520IS and 850TB (product names) from EVG Corporation, the XBC300 (product name) from SUSS Corporation, and the Synapse V (product name) from Tokyo Electron Limited, can be used for bonding.

[0077] The uncured temporary adhesive composition layer is cured by heating it, for example, preferably at 120 to 250°C, more preferably at 140 to 200°C, for a period of 10 minutes to 4 hours, and more preferably 30 minutes to 2 hours.

[0078] The substrate is typically a semiconductor wafer. Examples of semiconductor wafers include silicon wafers, germanium wafers, gallium-arsenide wafers, gallium-phosphorus wafers, and gallium-arsenide-aluminum wafers. There are no particular restrictions on the thickness of the wafer, but it is typically 600 to 800 μm, and more typically 625 to 775 μm.

[0079] Examples of support substrates include silicon wafers, glass wafers, and quartz wafers, with glass plates or quartz wafers being preferred from the viewpoint of light transmittance.

[0080] The light transmittance of the support is not particularly limited as long as it transmits the light irradiated to separate the substrate from the support, but a transmittance of 80% or more is preferred, and 90% or more is more preferred.

[0081] The laminate is delaminated by light irradiation, and while the type of light is not particularly limited, laser light is preferably used. If the substrate does not peel off naturally after light irradiation, it may be mechanically separated by inserting a blade between the substrates.

[0082] The area of ​​light irradiation is not particularly limited; the entire wafer may be irradiated at once, or it may be irradiated in multiple spots. Furthermore, the starting and ending positions of irradiation are not particularly limited; irradiation may be performed from the center of the wafer toward the outer edge, or from a point on the outer edge of the wafer toward a point on the opposite side, drawing a parallel line.

[0083] Regarding the removal of residue, the main component of the cleaning agent is not particularly limited as long as it can sufficiently decompose the cured product of the temporary adhesive composition, and examples include acids, bases, or fluoride salts. However, fluoride salts are preferably used from the viewpoint of easily decomposing the siloxane structure and having low corrosiveness to the substrate.

[0084] The solvent in the cleaning agent is not particularly limited as long as it can sufficiently dissolve the decomposition products of the temporary adhesive composition, and acid amide solvents are particularly preferred.

[0085] The present invention will be specifically described below with reference to examples, but the present invention is not limited to the following examples.

[0086] [Example 1] (Preparation of Compounds) 200 g of compound (3), 17.3 g of compound (15), and 2400 g of toluene were added to a 3 L separable flask equipped with a thermometer and a Dean-Stark apparatus, and dehydration was carried out by reflux for 8 hours. Next, 3 drops of platinum catalyst CAT-PL-50T (manufactured by Shin-Etsu Chemical Co., Ltd.) were added and the mixture was stirred thoroughly and heated to 80°C. Then, 409 g of hydrogen polyorganosiloxane represented by (M-1) below (molecular weight 1988, manufactured by Shin-Etsu Chemical Co., Ltd.) was added dropwise, and the reaction was carried out at 80°C for 10 hours. After cooling to room temperature, the mixture was washed with pure water five times. Compound A1 was obtained by adding the crude product dropwise to methanol, recovering the precipitate, and concentrating it. In this example, M ｓｉ－Ｈ / M ｖｉ The result was 1, and the weight-average molecular weight (GPC) of compound A1 was 35,000.

[0087] Compound (3)

[0088] (Preparation of temporary adhesive composition containing compounds) 100 g of compound A1, 1.9 g of crosslinking component BisP-AP (manufactured by Honshu Chemical Co., Ltd.; compound (X1)), 3.0 g of catalyst U-CAT SA506 (manufactured by Sunapro Co., Ltd.; compound (Y1)), and 105 g of solvent toluene were added and thoroughly stirred. In this way, temporary adhesive composition A2 was obtained.

[0089] (Fabrication of a laminate using a temporary adhesive composition) A temporary adhesive composition A2 prepared above was spin-coated onto a 300 mm silicon wafer (mirror finish, 725 μm thick) as the substrate, and then heated on a hot plate at 50°C for 3 minutes to form a temporary adhesive composition layer (25 μm thick). Next, it was bonded to a 300 mm glass wafer (700 μm thick) as the support. Bonding was performed using a wafer bonding apparatus (EVG520IS (product name) manufactured by EVG Corporation). The bonding temperature was 50°C, the chamber pressure during bonding was 10⁻³ mbar or less, and the load was 10 kN. After bonding, the bonded substrate was heated in an oven at 200°C for 2 hours to cure the temporary adhesive composition layer, and then cooled to room temperature. In this way, a substrate laminate A3 was obtained.

[0090] (Immersion in organic solvent) The above substrate laminate A3 was immersed in 300 mL of acetone for 10 minutes, and then dried in an oven maintained at 50°C for 1 hour.

[0091] (Delamination of the laminate) Dicing tape was attached to the silicon wafer side of substrate laminate A3, which had been immersed in an organic solvent, using a dicing frame. The laminate was then attached to the wafer chuck of a laser debonding device SELD-LASER (manufactured by Shin-Etsu Engineering Co., Ltd.), and a laser beam with a wavelength of 355 nm was irradiated onto the hardened temporary adhesive composition layer from the glass wafer side of substrate laminate A3 under the conditions of a scanning speed of 100 mm / sec (overlap 30%) and a beam size of 0.5 mm. Subsequently, the glass wafer was delaminated by lifting one point on the outer edge of the glass wafer with tweezers.

[0092] (Cleaning of the release substrate) The device wafer side of the release substrate was immersed for 10 minutes in 300 mL of a semiconductor cleaning solution obtained by thoroughly mixing 90 parts by mass of N,N-dimethylpropionamide and 10 parts by mass of tetrabutylammonium fluoride. After that, the device wafer was removed from the semiconductor cleaning solution, rinsed with isopropanol, and dried on a hot plate heated to 100°C for 10 minutes to obtain the cleaned device wafer A4.

[0093] (Analysis of Cleanability) The cleaned surface of the device wafer A4 after cleaning was analyzed using the ATR unit of an infrared spectrophotometer (Nicolet is50 FT-IR, manufactured by Thermo Fisher Scientific Inc.). For unused silicon wafers, 1100 cm² －１ Aside from a very strong peak in the vicinity, there are no other notable peaks. The same applies to the cleaned device wafer A4 at 1100 cm². －１ Since no significant peaks were observed outside the immediate vicinity, it was confirmed that the residue had been washed away.

[0094] [Example 2] (Preparation of Compound) 200 g of compound (7), 7.3 g of compound (15), and 1993 g of toluene were added to a 1 L separable flask equipped with a thermometer and a Dean-Stark apparatus, and dehydration was carried out by reflux for 8 hours. Next, 3 drops of platinum catalyst CAT-PL-50T (manufactured by Shin-Etsu Chemical Co., Ltd.) were added and the mixture was stirred thoroughly and heated to 80°C. Then, 535 g of hydrogen polyorganosiloxane represented by (M-2) below (molecular weight 3100, manufactured by Shin-Etsu Chemical Co., Ltd.) was added dropwise, and the reaction was carried out at 80°C for 10 hours. After cooling to room temperature, the mixture was washed with pure water five times. Compound B1 was obtained by adding the crude product dropwise to methanol, recovering the precipitate, and concentrating it. In this example, M ｓｉ－Ｈ / M ｖｉ The result was 1, and the weight-average molecular weight of compound B1 was 38,000.

[0095]

[0096] (Preparation of temporary adhesive composition containing compounds) 100 g of compound B1, 0.68 g of crosslinking component BisP-AP (manufactured by Honshu Chemical Co., Ltd.; compound (X1)), 3.0 g of catalyst U-CAT SA506 (manufactured by Sunapro Co., Ltd.; compound (Y1)), and 104 g of solvent toluene were added and thoroughly stirred. In this way, temporary adhesive composition B2 was obtained.

[0097] (Preparation of laminate using temporary adhesive composition) A substrate laminate B3 was obtained in the same manner as in Example 1.

[0098] (Immersion in organic solvent) The immersion treatment was carried out in the same manner as in Example 1.

[0099] (Delamination of the laminate) Substrate laminate B3 was delaminated in the same manner as in Example 1.

[0100] (Cleaning of the delamination substrate) Device wafer B4 was obtained after cleaning in the same manner as in Example 1.

[0101] (Analysis of cleanability) Device wafer B4 was analyzed after cleaning in the same manner as in Example 1. 1100 cm －１ Since no significant peaks were observed outside the immediate vicinity, it was confirmed that the residue had been washed away.

[0102] [Example 3] (Preparation of Compound) 200 g of compound (10), 15.6 g of compound (15), and 1860 g of toluene were added to a 1 L separable flask equipped with a thermometer and a Dean-Stark apparatus, and dehydration by reflux was carried out for 8 hours. Next, 3 drops of platinum catalyst CAT-PL-50T (manufactured by Shin-Etsu Chemical Co., Ltd.) were added and the mixture was stirred thoroughly and heated to 80°C. Then, 438 g of hydrogen polyorganosiloxane represented by (M-3) below (molecular weight 2360, manufactured by Shin-Etsu Chemical Co., Ltd.) was added dropwise, and the reaction was carried out at 80°C for 10 hours. After cooling to room temperature, the mixture was washed with pure water five times. Compound C1 was obtained by adding the crude product dropwise to methanol, recovering the precipitate, and concentrating it. In this example, M ｓｉ－Ｈ / M ｖｉ The result was 1, and the weight-average molecular weight of compound C1 was 36,000.

[0103]

[0104] (Preparation of temporary adhesive composition containing compounds) 100 g of compound C1, 1.65 g of crosslinking component BisP-AP (manufactured by Honshu Chemical Co., Ltd.; compound (X1)), 3.0 g of catalyst U-CAT SA506 (manufactured by Sunapro Co., Ltd.; compound (Y1)), and 105 g of solvent toluene were added and thoroughly stirred. In this way, temporary adhesive composition C2 was obtained.

[0105] (Preparation of laminate using temporary adhesive composition) A substrate laminate C3 was obtained in the same manner as in Example 1.

[0106] (Immersion in organic solvent) The immersion treatment was carried out in the same manner as in Example 1.

[0107] (Delamination of the laminate) The substrate laminate C3 was delaminated in the same manner as in Example 1.

[0108] (Cleaning of the delaminate substrate) After cleaning in the same manner as in Example 1, a device wafer C4 was obtained.

[0109] (Analysis of cleanability) The device wafer C4 was analyzed after cleaning in the same manner as in Example 1. 1100 cm －１ Since no significant peaks were observed outside the immediate vicinity, it was confirmed that the residue had been washed away.

[0110] [Example 4] (Preparation of Compound) 200 g of compound (3), 12.7 g of compound (16) (manufactured by Tokyo Chemical Industry Co., Ltd.), and 2375 g of toluene were added to a 1 L separable flask equipped with a thermometer and a Dean-Stark apparatus, and dehydration treatment by reflux was carried out for 8 hours. Next, 3 drops of platinum catalyst CAT-PL-50T (manufactured by Shin-Etsu Chemical Co., Ltd.) were added and the mixture was thoroughly stirred and heated to 80°C. Then, 409 g of the hydrogen polyorganosiloxane represented by (M-1) (molecular weight 1988, manufactured by Shin-Etsu Chemical Co., Ltd.) was added dropwise, and the reaction was carried out at 80°C for 10 hours. After cooling to room temperature, the mixture was washed with pure water five times. Compound D1 was obtained by adding the crude product dropwise to methanol, recovering the precipitate, and concentrating it. In this example, M ｓｉ－Ｈ / M ｖｉ The result was 1, and the weight-average molecular weight of compound D1 was 34,000.

[0111] (Preparation of temporary adhesive composition containing compounds) 100 g of compound D1, 2.3 g of crosslinking component compound (X2) (manufactured by Tokyo Chemical Industry Co., Ltd.), 3 g of catalyst U-CAT SA506 (manufactured by Sunapro Co., Ltd.; compound (Y1)), and 105 g of solvent toluene were added and thoroughly stirred. In this way, temporary adhesive composition D2 was obtained.

[0112] (Preparation of laminate using temporary adhesive composition) A substrate laminate D3 was obtained in the same manner as in Example 1.

[0113] (Immersion in organic solvent) The immersion treatment was carried out in the same manner as in Example 1.

[0114] (Delamination of the laminate) The substrate laminate D3 was delaminated in the same manner as in Example 1.

[0115] (Cleaning of the delamination substrate) After cleaning in the same manner as in Example 1, a device wafer D4 was obtained.

[0116] (Analysis of cleanability) Device wafer D4 was analyzed after cleaning in the same manner as in Example 1. 1100 cm －１ Since no significant peaks were observed outside the immediate vicinity, it was confirmed that the residue had been washed away.

[0117] [Example 5] (Preparation of compound) The compound for Example 5 was compound A1 from Example 1.

[0118] (Preparation of temporary adhesive composition containing compounds) 100 g of compound A1, 1.8 g of crosslinking component Bis-Z (manufactured by Honshu Chemical Co., Ltd.; compound (X3)), 3.0 g of catalyst U-CAT SA506 (manufactured by Sunapro Co., Ltd.; compound (Y1)), and 104 g of solvent toluene were added and thoroughly stirred. In this way, temporary adhesive composition E2 was obtained.

[0119] (Preparation of laminate using temporary adhesive composition) A substrate laminate E3 was obtained in the same manner as in Example 1.

[0120] (Immersion in organic solvent) The immersion treatment was carried out in the same manner as in Example 1.

[0121] (Delamination of the laminate) The substrate laminate E3 was delaminated in the same manner as in Example 1.

[0122] (Cleaning of the delamination substrate) After cleaning in the same manner as in Example 1, a device wafer E4 was obtained.

[0123] (Analysis of cleanability) The device wafer E4 was analyzed after cleaning in the same manner as in Example 1. 1100 cm －１ Since no significant peaks were observed outside the immediate vicinity, it was confirmed that the residue had been washed away.

[0124] [Example 6] (Preparation of compound) The compound for Example 6 was compound A1 from Example 1.

[0125] (Preparation of temporary adhesive composition containing compounds) 100 g of compound A1, 12.1 g of crosslinking component BisP-AP (manufactured by Honshu Chemical Co., Ltd.; compound (X1)), 3.0 g of catalyst U-CAT SA810 (manufactured by Sunapro Co., Ltd.; compound (Y2)), and 115 g of solvent toluene were added and thoroughly stirred. In this way, temporary adhesive composition F2 was obtained.

[0126] (Preparation of laminate using temporary adhesive composition) A substrate laminate F3 was obtained in the same manner as in Example 1.

[0127] (Immersion in organic solvent) The immersion treatment was carried out in the same manner as in Example 1.

[0128] (Delamination of the laminate) The substrate laminate F3 was delaminated in the same manner as in Example 1.

[0129] (Cleaning of the delamination substrate) After cleaning in the same manner as in Example 1, a device wafer F4 was obtained.

[0130] (Analysis of cleanability) The device wafer F4 was analyzed after cleaning in the same manner as in Example 1. 1100 cm －１ Since no significant peaks were observed outside the immediate vicinity, it was confirmed that the residue had been washed away.

[0131] [Comparative Example 1] (Preparation of Compound) 100 g of compound (15) and 2745 g of toluene were added to a 1 L separable flask equipped with a thermometer and a Dean-Stark apparatus, and dehydration treatment by reflux was carried out for 8 hours. Next, 3 drops of platinum catalyst CAT-PL-50T (manufactured by Shin-Etsu Chemical Co., Ltd.) were added and stirred thoroughly, and the mixture was heated to 80°C. Then, 472 g of the hydrogen polyorganosiloxane represented by (M-1) (molecular weight 1988, manufactured by Shin-Etsu Chemical Co., Ltd.) was added dropwise, and the reaction was carried out at 80°C for 10 hours. After cooling to room temperature, the mixture was washed with pure water five times. Compound G1 was obtained by adding the crude product dropwise to methanol, recovering the precipitate, and concentrating it. In this example, M ｓｉ－Ｈ / M ｖｉ The result was 1, and the weight-average molecular weight of compound G1 was 28,000.

[0132] (Preparation of temporary adhesive composition containing compounds) 100 g of compound G1, 12.1 g of crosslinking component BisP-AP (manufactured by Honshu Chemical Co., Ltd.; compound (X1)), 3.0 g of catalyst U-CAT SA506 (manufactured by Sunapro Co., Ltd.; compound (Y1)), and 115 g of solvent toluene were added and thoroughly stirred. In this way, temporary adhesive composition G2 was obtained.

[0133] (Preparation of laminate using temporary adhesive composition) A substrate laminate G3 was obtained in the same manner as in Example 1.

[0134] (Immersion in organic solvent) The immersion treatment was carried out in the same manner as in Example 1.

[0135] (Delamination of the laminate) Laser light was irradiated onto the substrate laminate G3 in the same manner as in Example 1, but it could not be delaminated.

[0136] [Comparative Example 2] (Preparation of Compound) The compound for Comparative Example 2 was compound G1 from Comparative Example 1.

[0137] (Preparation of temporary adhesive composition containing compounds) 100 g of compound G1, 12.1 g of crosslinking component BisP-AP (manufactured by Honshu Chemical Co., Ltd.; compound (X1)), 3.0 g of catalyst U-CAT SA506 (manufactured by Sunapro Co., Ltd.; compound (Y1)), and 115 g of solvent toluene were added and thoroughly stirred. Furthermore, 31 g of compound (18) (manufactured by Tokyo Chemical Industry Co., Ltd.) was added as a light absorber and thoroughly stirred. In this way, temporary adhesive composition H2 was obtained.

[0138] (Preparation of laminate using temporary adhesive composition) A substrate laminate H3 was obtained in the same manner as in Example 1.

[0139] (Immersion in organic solvent) The immersion treatment was carried out in the same manner as in Example 1.

[0140] (Delamination of the laminate) Laser light was irradiated onto the substrate laminate H3 in the same manner as in Example 1, but the outer periphery of the laminate could not be peeled off.

[0141] [Comparative Example 3] (Preparation of Compounds) 200 g of compound (3), 17.3 g of compound (15), and 2380 g of toluene were added to a 1 L separable flask equipped with a thermometer and a Dean-Stark apparatus, and dehydration treatment by reflux was carried out for 8 hours. Next, 3 drops of platinum catalyst CAT-PL-50T (manufactured by Shin-Etsu Chemical Co., Ltd.) were added and the mixture was stirred thoroughly and heated to 80°C. Then, 40 g of an organic hydrosilane compound represented by the following chemical formula (19) (manufactured by Tokyo Chemical Industry Co., Ltd.) was added dropwise, and the reaction was carried out at 80°C for 10 hours. After cooling to room temperature, the mixture was washed with pure water five times. Compound I1 was obtained by adding the crude product dropwise to methanol, recovering the precipitate, and concentrating it. In this example, M ｓｉ－Ｈ / M ｖｉ The result was 1, and the weight-average molecular weight of compound I1 was 31,000.

[0142] (Preparation of temporary adhesive composition containing compounds) 100 g of compound I1, 4.6 g of crosslinking component BisP-AP (manufactured by Honshu Chemical Co., Ltd.; compound (X1)), 3.0 g of catalyst U-CAT SA506 (manufactured by Sunapro Co., Ltd.; compound (Y1)), and 108 g of solvent toluene were added and thoroughly stirred. Temporary adhesive composition I2 was obtained.

[0143] (Preparation of laminate using temporary adhesive composition) A substrate laminate I3 was obtained in the same manner as in Example 1.

[0144] (Immersion in organic solvent) The immersion treatment was carried out in the same manner as in Example 1.

[0145] (Delamination of the laminate) The substrate laminate I3 was delaminated in the same manner as in Example 1.

[0146] (Cleaning of the delamination substrate) After cleaning in the same manner as in Example 1, a device wafer I4 was obtained.

[0147] (Analysis of cleanability) The device wafer I4 after cleaning was analyzed in the same manner as in Example 1. 1100 cm －１ The observation of strong peaks in areas other than the immediate vicinity confirmed that the residue was not adequately removed.

[0148] The results for Examples 1-6 and Comparative Examples 1-3 are shown in Table 1 below.

[0149]

[0150] As shown in Examples 1 to 6, it was confirmed that including a light-absorbing monomer and a hydrogen polyorganosiloxane in the compound allows for good processing of all three processes in semiconductor manufacturing: "adhesion," "peelability," and "cleanability."

[0151] As shown in Comparative Example 1, when the compound does not contain a light-absorbing monomer, it is not possible to peel off the bonded wafer, and the compound cannot be applied as a temporary adhesive for semiconductor processing.

[0152] As shown in Comparative Example 2, when the compound did not contain a light-absorbing monomer, but a light-absorbing agent was present as a monomer in the temporary adhesive composition, the outer periphery of the bonded wafer could not be peeled off. It was shown that immersion in an organic solvent caused the light-absorbing agent present as a monomer to dissolve, making it impossible to maintain peelability.

[0153] As shown in Comparative Example 3, when the compound did not contain hydrogen polyorganosiloxane, peaks other than those of the silicon wafer were observed in the device wafer after cleaning following the delamination of the bonded wafer, indicating that the cured temporary adhesive composition remained.

[0154] This specification includes the following inventions:

[0155] [1]: A light-absorbing compound characterized by being a polymer of (A) a compound represented by the following general formula (1), (B) a hydrogen polyorganosiloxane containing two silicon-hydrogen bonds, and (C) a compound represented by the following general formula (2) containing two carbon-carbon double bonds and at least one epoxide or phenolic hydroxyl group. (In the formula, V is, A divalent organic group selected from either of the following, where p is 0 or 1. Also, R １ and R ２ and R ３ Each of these is a hydrogen atom, a hydroxyl group, an oxyalkyl group, or an alkyl group, and R １ and R ３ At least one of them is a hydroxyl group. (In the formula, W is, is a divalent organic group selected from any one of the above, and q is 0 or 1. Further, R ４ is a hydrogen atom or an alkylene oxide group.)

[0156] [2]: The component (B) is each R ５ R ６ R ７ SiO １／２ M units represented by, R ８ R ９ SiO ２／２ D units represented by, R １０ SiO ３／２ T units represented by or SiO ４／２ Q units represented by, the component (B) is composed of at least one selected from the above, and the substituent R ５ , R ６ , R ７ , R ８ , R ９ , R １０ are each a methyl group, a phenyl group or a hydrogen atom, and one molecule contains two silicon-hydrogen bonds, which is the light-absorbing compound according to the above [1].

[0157] [3]: When the total number of moles of the component (A) and the component (B) is 100 mol%, the light-absorbing compound according to the above [1] or [2] is characterized by comprising 5 to 95 mol% of the component (A) and 5 to 95 mol% of the component (B).

[0158] [4]: The total number of moles of vinyl groups M of the component (A which is a vinyl group-containing component) and the component (C) ｖｉ and the total number of moles of silicon-hydrogen bonds M of the component (B which is a silicon-hydrogen bond-containing component) ｓｉ－Ｈ satisfy the relational expression 0.5 ≤ M ｓｉ－Ｈ / M ｖｉ ≤ 1.5, which is the light-absorbing compound according to any one of the above [1] to [3].

[0159] [5]: A temporary adhesive composition characterized by comprising (D) the light-absorbing compound according to any one of the above [1] to [4], (E) a crosslinking agent, (F) a catalyst, and (G) a solvent.

[0160] [6]: The temporary adhesive composition according to [5] above, characterized in that component (E) contains at least two functional groups in one molecule that react with an epoxide or phenolic hydroxyl group contained in component (D).

[0161] [7] The temporary adhesive composition according to [5] or [6] above, characterized in that component (E) comprises at least two or more epoxide or phenolic hydroxyl groups.

[0162] [8]: The temporary adhesive composition according to any one of [5] to [7] above, characterized in that the component (F) generates an acid or a base upon heat.

[0163] [9]: The temporary adhesive composition according to any one of [5] to [8] above, characterized in that when MD is the number of moles of epoxide or phenolic hydroxyl groups contained in a unit weight of component (D) and ME is the number of moles of epoxide or phenolic hydroxyl groups contained in a unit weight of component (E), the relation 0.5 ≤ MD / ME ≤ 1.5 is satisfied.

[0164]

[10] : A method for manufacturing a laminate, comprising: (1) forming a temporary adhesive layer made of any of the temporary adhesive compositions described in [5] to [9] above on the bonding surface of a substrate; (2) bonding the substrate and the other substrate so that the bonding surface of the other substrate faces the temporary adhesive layer formed on the substrate and the other substrate to form a laminate; and (3) curing the temporary adhesive layer of the laminate.

[0165]

[11] : A method for peeling a laminate, characterized in that a substrate, a temporary adhesive layer made of a temporary adhesive composition according to any one of [5] to [9] above, and another substrate are stacked in this order, and light is irradiated onto the laminate to separate the substrate and the other substrate.

[0166]

[12] : A method for cleaning a substrate, characterized in that a substrate to which residue of the temporary adhesive composition described in any of [5] to [9] above is attached is brought into contact with a liquid containing a cleaning component, thereby decomposing and dissolving the residue and removing the residue from the substrate.

[0167] It should be noted that the present invention is not limited to the embodiments described above. The embodiments described above are illustrative, and any configuration that is substantially identical to the technical idea described in the claims of the present invention and achieves similar effects is included within the technical scope of the present invention.

[0168] By using the semiconductor processing temporary adhesive composition containing the light-absorbing compound of the present invention, it is expected that the peelability of the laminate will be maintained even when exposed to organic solvents during the semiconductor processing process, and that high yield semiconductor manufacturing will be possible due to the degradability provided by the inclusion of siloxane bonds.

Claims

1. A light-absorbing compound characterized by being a polymer of (A) a compound represented by the following general formula (1), (B) a hydrogen polyorganosiloxane containing two silicon-hydrogen bonds, and (C) a compound represented by the following general formula (2), containing two carbon-carbon double bonds and at least one epoxide or phenolic hydroxyl group. (In the formula, V is, A divalent organic group selected from either of the following, where p is 0 or 1. Also, R １ and R ２ and R ３ Each of these is a hydrogen atom, a hydroxyl group, an oxyalkyl group, or an alkyl group, and R １ and R ３ At least one of them is a hydroxyl group. (In the formula, W is, A divalent organic group selected from either of the above, where q is 0 or 1. Also, R ４ (This is either a hydrogen atom or an alkylene oxide group.) 2. Said component (B) is each R ５ R ６ R ７ SiO １／２ M units represented by, R ８ R ９ SiO ２／２ D units represented by, R １０ SiO ３／２ T units represented by or SiO ４／２ composed of at least one of Q units represented by, and the substituent R ５ , R ６ , R ７ , R ８ , R ９ , R １０ is a methyl group, a phenyl group or a hydrogen atom, and contains two silicon-hydrogen bonds in one molecule. The light-absorbing compound according to claim 1, wherein 3. The light-absorbing compound according to claim 1, characterized in that when the total number of moles of component (A) and component (B) is 100 mol%, it contains 5 to 95 mol% of component (A) and 5 to 95 mol% of component (B).

4. The total number of moles of vinyl groups M of component (A) and component (C), which are vinyl group-containing components. ｖｉ The total number of silicon-hydrogen bond moles of component (B), which is a silicon-hydrogen bond-containing component, is M. ｓｉ－Ｈ The relationship is 0.5 ≤ M ｓｉ－Ｈ / M ｖｉ The light-absorbing compound according to claim 1, characterized in that it satisfies ≤ 1.

5.

5. A temporary adhesive composition characterized by comprising (D) the light-absorbing compound described in claim 1, (E) a crosslinking agent, (F) a catalyst, and (G) a solvent.

6. The temporary adhesive composition according to claim 5, characterized in that component (E) contains at least two functional groups in one molecule that react with epoxide or phenolic hydroxyl groups contained in component (D).

7. The temporary adhesive composition according to claim 5, characterized in that component (E) contains at least two or more epoxide or phenolic hydroxyl groups.

8. The temporary adhesive composition according to claim 5, characterized in that the component (F) generates an acid or base upon heat.

9. The temporary adhesive composition according to claim 5, characterized in that when MD is the number of moles of epoxide or phenolic hydroxyl groups contained in a unit weight of component (D) and ME is the number of moles of epoxide or phenolic hydroxyl groups contained in a unit weight of component (E), the relation 0.5 ≤ MD / ME ≤ 1.5 is satisfied.

10. A method for manufacturing a laminate, comprising: (1) forming a temporary adhesive layer made of the temporary adhesive composition described in claim 5 on the bonding surface of a substrate; (2) bonding the substrate and the other substrate so that the bonding surface of the temporary adhesive layer formed on the substrate and the bonding surface of the other substrate face each other to form a laminate; and (3) curing the temporary adhesive layer of the laminate.

11. A method for peeling a laminate, characterized in that a substrate, a temporary adhesive layer made of the temporary adhesive composition described in claim 5, and another substrate are laminated in this order, and light is irradiated onto the laminate to separate the substrate and the other substrate.

12. A method for cleaning a substrate, characterized by contacting a substrate to which residue of the temporary adhesive composition described in claim 5 is attached with a liquid containing a cleaning component, thereby decomposing and dissolving the residue and removing it from the substrate.

Images