Antenna and antenna module

Abstract

Provided is an antenna that achieves both an improvement in antenna gain and downsizing of a filter. An antenna (100) comprises: a first dielectric layer (1); a second dielectric layer (7); an antenna electrode (31); a ground electrode (32); a first filter disposed in the first dielectric layer (1) and connected to the antenna electrode (31); and a second filter disposed in the second dielectric layer (7) and connected between a power supply electrode and the first filter. The antenna electrode (31) is disposed in the first dielectric layer (1). The ground electrode (32) is disposed in the first dielectric layer (1) and positioned between the antenna electrode (31) and the second dielectric layer (7). The power supply electrode is disposed in the second dielectric layer (7). The dielectric constant of the first dielectric layer (1) is lower than the dielectric constant of the second dielectric layer (7). The elastic modulus of the first dielectric layer (1) is lower than the elastic modulus of the second dielectric layer (7).

Description

Antenna and antenna module

[0001] The present invention relates generally to antennas and antenna modules, and more specifically to antennas and antenna modules including a filter.

[0002] Patent Document 1 discloses a patch antenna with a built-in filter. The patch antenna with a built-in filter disclosed in Patent Document 1 includes a base body made of a dielectric material, a radiation conductor, and a ground conductor. The radiation conductor and the ground conductor are provided on two mutually opposing surfaces of the base body. The patch antenna with a built-in filter includes a filter inside the base body.

[0003] Japanese Patent Application Laid-Open No. 2001-94336

[0004] However, in the patch antenna with a built-in filter disclosed in Patent Document 1, the dielectric material disposed between the radiation conductor and the ground conductor is the same as the dielectric material for the filter, so it is difficult to achieve both an improvement in antenna gain and a reduction in filter size.

[0005] An object of the present invention is to provide an antenna and an antenna module that achieve both an improvement in antenna gain and a reduction in filter size.

[0006] An antenna according to one aspect of the present invention includes a first dielectric layer, a second dielectric layer, an antenna electrode, a ground electrode, a first filter, and a second filter. The first dielectric layer has a first main surface and a second main surface. The second dielectric layer has a third main surface and a fourth main surface. The third main surface is in contact with the second main surface of the first dielectric layer. The antenna electrode is disposed on the first dielectric layer. The ground electrode is disposed on the first dielectric layer, and is located between the antenna electrode and the second dielectric layer. The first filter is disposed on the first dielectric layer, and is connected to the antenna electrode. The second filter is disposed on the second dielectric layer, and is connected to the first filter. A dielectric constant of the first dielectric layer is lower than a dielectric constant of the second dielectric layer. An elastic modulus of the first dielectric layer is lower than an elastic modulus of the second dielectric layer.

[0007] Furthermore, an antenna according to another aspect of the present invention comprises a first dielectric layer, a second dielectric layer, an antenna electrode, a ground electrode, a first conductor portion, and a second conductor portion. The first dielectric layer has a first main surface and a second main surface. The second dielectric layer has a third main surface and a fourth main surface. The third main surface is in contact with the second main surface of the first dielectric layer. The antenna electrode is disposed in the first dielectric layer. The ground electrode is disposed in the first dielectric layer and is located between the antenna electrode and the second dielectric layer. The first conductor portion is disposed between the antenna electrode and the ground electrode in the thickness direction of the first dielectric layer. The first conductor portion is a microstrip line or strip line connected to the antenna electrode. The second conductor portion is a strip line disposed in the second dielectric layer and is not connected to the ground electrode. The first conductor portion includes a first portion and a second portion having a different width from the first portion. The second conductor portion is adjacent to the signal line connected to the first conductor portion. The dielectric constant of the first dielectric layer is lower than that of the second dielectric layer. The elastic modulus of the first dielectric layer is lower than that of the second dielectric layer.

[0008] An antenna module according to one aspect of the present invention comprises the antenna, a mounting substrate, and a signal processing circuit. The mounting substrate on which the antenna is arranged. The signal processing circuit is arranged on the mounting substrate and connected to the antenna.

[0009] According to the antenna and antenna module described above, it is possible to achieve both improved antenna gain and miniaturization of the filter.

[0010] Figure 1 is a cross-sectional view taken along line I-I in Figures 2 to 5, relating to the antenna according to Embodiment 1. Figure 2 is a plan view of each layer included in the antenna. Figure 3 is a plan view of each layer included in the antenna, different from that shown in Figure 2. Figure 4 is a plan view of each layer included in the antenna, different from those shown in Figures 2 and 3. Figure 5 is a plan view of each layer included in the antenna, different from those shown in Figures 2 to 4. Figure 6 is a plan view of each layer included in the antenna according to Modification 1 of Embodiment 1. Figure 7 is a plan view of each layer included in the antenna, different from those shown in Figure 6. Figure 8 is a cross-sectional view taken along line VIII-VIII in Figure 9, relating to the antenna according to Modification 2 of Embodiment 1. Figure 9 is a plan view of each layer included in the antenna. Figure 10 is a cross-sectional view taken along line X-X in Figure 11, relating to the antenna according to Modification 3 of Embodiment 1. Figure 11 is a plan view of each layer included in the antenna. Figure 12 is a cross-sectional view of the antenna according to Embodiment 2. Figure 13 is a cross-sectional view taken along line XIII-XIII in Figures 14 to 17 relating to the antenna according to Embodiment 3. Figure 14 is a plan view of each layer included in the antenna. Figure 15 is a plan view of each layer included in the antenna, different from that shown in Figure 14. Figure 16 is a plan view of each layer included in the antenna, different from those shown in Figures 14 and 15. Figure 17 is a plan view of each layer included in the antenna, different from those shown in Figures 14 to 16. Figure 18 is a cross-sectional view of the antenna according to Embodiment 4. Figure 19 is a plan view of the antenna module according to Embodiment 5. Figure 20 is a cross-sectional view taken along line XX-XX in Figure 19 relating to the antenna module. Figure 21 is a schematic circuit diagram of the antenna module, including a schematic circuit diagram of the antenna according to Embodiment 1. Figure 22 is a cross-sectional view of the antenna module according to Embodiment 6.

[0011] Embodiments 1 to 6 will be described below with reference to the drawings. The drawings referenced in Embodiments 1 to 6 below are schematic diagrams, and the size and thickness of the components shown in the drawings do not necessarily reflect the actual dimensions, nor do the size ratios and thickness ratios between components necessarily reflect the actual dimensional ratios.

[0012] (Embodiment 1) The antenna 100 according to Embodiment 1 will be described with reference to Figures 1 to 5.

[0013] (1) The antenna 100 according to the first antenna embodiment, as shown in Figure 1, comprises a first dielectric layer 1, a second dielectric layer 7, and one or more (two in Figure 2, only one in Figure 1) antenna electrodes 31. The antenna 100 further comprises a plurality of pad electrodes 21 (see Figure 2), a plurality of pad electrodes 24 (see Figure 3), a plurality of signal lines 22a, 22b, 25a, 25b (see Figures 2 and 3), a first conductor portion 23 (see Figure 2), and a first conductor portion 26 (see Figure 3). The antenna 100 further comprises a first ground electrode 32a (see Figure 3), a first ground electrode 32b (see Figure 3), and a plurality of feed electrodes 41a and 41b (see Figure 5). Furthermore, the antenna 100 further comprises a second ground electrode 33a (see Figure 4), a second ground electrode 33b (see Figure 5), two signal lines 28a and 28b (see Figure 5), two second conductor sections 29a and 29b (see Figure 5), and a plurality of ground connection electrodes 41c (see Figure 5). Furthermore, the antenna 100 further comprises a plurality of first connection conductors 61 (see Figure 2), a plurality of second connection conductors 62 (see Figure 2), and a plurality of third connection conductors 63 (see Figure 2). Furthermore, the antenna 100 further comprises a plurality of fourth connection conductors 64 (see Figure 3), a plurality of fifth connection conductors 65 (see Figure 3), and a plurality of sixth connection conductors 66 (see Figure 3). Furthermore, the antenna 100 further comprises a plurality of seventh connecting conductors 67 (see Figure 4), a plurality of eighth connecting conductors 68 (see Figure 4), and a plurality of ninth connecting conductors 69 (see Figure 4). Furthermore, the antenna 100 further comprises a plurality of tenth connecting conductors 81 (see Figure 5), a plurality of eleventh connecting conductors 82 (see Figure 5), and a plurality of twelfth connecting conductors 83 (see Figure 5).

[0014] Figure 1 shows the antenna 100 mounted on the mounting board 510 using multiple solders 501.

[0015] The components of the antenna 100 according to this embodiment will be described below with reference to the drawings.

[0016] (1.1) First Dielectric Layer The first dielectric layer 1 has a plurality of dielectric layers 11 to 16, as shown in Figures 1 to 3, and the plurality of dielectric layers 11 to 16 are stacked. In Figures 2 and 3, only each of the plurality of dielectric layers 11 to 16 and the components located on one of the main surfaces of each dielectric layer are shown. The thickness direction D1 of the first dielectric layer 1 is the stacking direction of the plurality of dielectric layers 11, 12, 13, 14, 15, and 16. The first dielectric layer 1 has a first main surface 101 and a second main surface 102, as shown in Figure 1.

[0017] In this embodiment, the first dielectric layer 1 is a long rectangle in the direction D2 (see Figure 2) perpendicular to the thickness direction D1. The first dielectric layer 1 may be in a shape other than rectangle.

[0018] Each of the dielectric layers 11 to 16 is made of a material such as a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer. The thermoplastic resin is not limited to a liquid crystal polymer, but may also be, for example, PTFE (polytetrafluoroethylene).

[0019] As shown in Figure 2, the dielectric layer 11 has a fifth main surface 111 and a sixth main surface 112. The fifth main surface 111 of the dielectric layer 11 is included in the first main surface 101 of the first dielectric layer 1 (see Figure 1). As shown in Figures 1 and 2, one or more (two in Figure 2) antenna electrodes 31 are arranged on the fifth main surface 111 of the dielectric layer 11. The sixth main surface 112 of the dielectric layer 11 is in contact with the dielectric layer 12.

[0020] As shown in Figure 2, the dielectric layer 12 has a seventh main surface 121 and an eighth main surface 122. The seventh main surface 121 of the dielectric layer 12 is in contact with the dielectric layer 11. The eighth main surface 122 of the dielectric layer 12 is in contact with the dielectric layer 13.

[0021] As shown in Figure 2, the dielectric layer 13 has a ninth main surface 131 and a tenth main surface 132. The ninth main surface 131 of the dielectric layer 13 is in contact with the dielectric layer 12. As shown in Figure 2, a plurality (three in Figure 2) of pad electrodes 21, signal lines 22a and 22b, and a first conductor portion 23 are arranged on the ninth main surface 131 of the dielectric layer 13. The tenth main surface 132 of the dielectric layer 13 is in contact with the dielectric layer 14.

[0022] As shown in Figure 3, the dielectric layer 14 has an eleventh main surface 141 and a twelfth main surface 142. The eleventh main surface 141 of the dielectric layer 14 is in contact with the dielectric layer 13. As shown in Figure 3, a first ground electrode 32a is placed on the eleventh main surface 141 of the dielectric layer 14. The twelfth main surface 142 of the dielectric layer 14 is in contact with the dielectric layer 15.

[0023] As shown in Figure 3, the dielectric layer 15 has a 13th main surface 151 and a 14th main surface 152. The 13th main surface 151 of the dielectric layer 15 is in contact with the dielectric layer 14. As shown in Figure 3, a plurality (three in Figure 3) of pad electrodes 24, signal lines 25a and 25b, and a first conductor portion 26 are arranged on the 13th main surface 151 of the dielectric layer 15. The 14th main surface 152 of the dielectric layer 15 is in contact with the dielectric layer 16.

[0024] As shown in Figure 3, the dielectric layer 16 has a 15th main surface 161 and a 16th main surface 162. The 15th main surface 161 of the dielectric layer 16 is in contact with the dielectric layer 15. As shown in Figure 3, the first ground electrode 32b is located on the 15th main surface of the dielectric layer 16. The 16th main surface 162 of the dielectric layer 16 is included in the second main surface 102 of the first dielectric layer 1 (see Figure 1). The 16th main surface 162 of the dielectric layer 16 is in contact with the dielectric layer 71 of the second dielectric layer 7.

[0025] (1.2) Second Dielectric Layer The second dielectric layer 7 has a plurality of dielectric layers 71 to 76, as shown in Figures 1 and 4 to 5, and the plurality of dielectric layers 71 to 76 are stacked. Note that in Figures 4 and 5, only each of the plurality of dielectric layers 71 to 76 and the components located on one of the main surfaces of each dielectric layer are shown. The second dielectric layer 7 has a plurality of dielectric layers 71, 72, 73, 74, 75, and 76 stacked along the thickness direction D1 of the first dielectric layer. As shown in Figure 1, the second dielectric layer 7 has a third main surface 701 and a fourth main surface 702. As shown in Figure 1, the third main surface 701 of the second dielectric layer 7 is in contact with the second main surface 102 of the first dielectric layer 1.

[0026] In this embodiment, in a plan view from the thickness direction D1 of the first dielectric layer 1, the entirety of the first dielectric layer 1 overlaps with the entirety of the second dielectric layer 7. In a plan view from the thickness direction D1 of the first dielectric layer 1, the antenna 100 may have portions where the first dielectric layer 1 and the second dielectric layer 7 overlap, but the first dielectric layer 1 may have portions where it does not overlap with the second dielectric layer 7, or the second dielectric layer 7 may have portions where it does not overlap with the first dielectric layer 1.

[0027] The dielectric constant of each material in the multiple dielectric layers 71 to 76 is higher than the dielectric constant of each material in the multiple dielectric layers 11 to 16. In other words, the dielectric constant of the material in the first dielectric layer 1 is lower than the dielectric constant of the material in the second dielectric layer 7. For example, the relative permittivity of the material in the first dielectric layer 1 is between 2 and 4. Also, for example, the relative permittivity of the material in the second dielectric layer is between 4 and 50.

[0028] Furthermore, the elastic modulus of each material in the multiple dielectric layers 71 to 76 is higher than the elastic modulus of each material in the multiple dielectric layers 11 to 16. Here, the elastic modulus of each material in the multiple dielectric layers 71 to 76 refers to, for example, the Young's modulus of each material in the multiple dielectric layers 71 to 76. Similarly, the elastic modulus of each material in the multiple dielectric layers 11 to 16 refers to, for example, the Young's modulus of each material in the multiple dielectric layers 11 to 16. In other words, the elastic modulus of the material in the first dielectric layer 1 is lower than the elastic modulus of the material in the second dielectric layer 7. For example, the Young's modulus of the material in the first dielectric layer 1 is between 0.1 GPa and 30 GPa, and the Young's modulus of the material in the second dielectric layer 7 is between 100 GPa and 400 GPa.

[0029] Each of the dielectric layers 71 to 76 is made of, for example, ceramic. Each of the dielectric layers 71 to 76 is, for example, an LTCC (Low Temperature Co-fired Ceramics) substrate. Each of the dielectric layers 71 to 76 may be, for example, an HTCC (High Temperature Co-fired Ceramics) substrate, a glass epoxy substrate, or may contain a resin as a material.

[0030] As shown in Figure 4, the dielectric layer 71 has a 17th main surface 711 and an 18th main surface 712. The 17th main surface 711 of the dielectric layer 71 is included in the 3rd main surface 701 of the 2nd dielectric layer 7. The 17th main surface 711 of the dielectric layer 71 is in contact with the dielectric layer 16 of the 1st dielectric layer 1. The 18th main surface 712 of the dielectric layer 71 is in contact with the dielectric layer 72.

[0031] As shown in Figure 4, the dielectric layer 72 has a 19th main surface 721 and a 20th main surface 722. The 19th main surface 721 of the dielectric layer 72 is in contact with the dielectric layer 71. As shown in Figure 4, a second ground electrode 33a is placed on the 19th main surface 721 of the dielectric layer 72. The 20th main surface 722 of the dielectric layer 72 is in contact with the dielectric layer 73.

[0032] As shown in Figure 4, the dielectric layer 73 has a 21st main surface 731 and a 22nd main surface 732. The 21st main surface 731 of the dielectric layer 73 is in contact with the dielectric layer 72. The 22nd main surface 732 of the dielectric layer 73 is in contact with the dielectric layer 74.

[0033] As shown in Figure 5, the dielectric layer 74 has a 23rd main surface 741 and a 24th main surface 742. The 23rd main surface 741 of the dielectric layer 74 is in contact with the dielectric layer 73. As shown in Figure 5, the 23rd main surface 741 of the dielectric layer 74 has a plurality (four in Figure 5) of pad electrodes 27, two signal lines 28a and 28b, and two second conductor portions 29a and 29b arranged on it. The 24th main surface 742 of the dielectric layer 74 is in contact with the dielectric layer 75.

[0034] As shown in Figure 5, the dielectric layer 75 has a 25th main surface 751 and a 26th main surface 752. The 25th main surface 751 of the dielectric layer 75 is in contact with the dielectric layer 74. The 26th main surface 752 of the dielectric layer 75 is in contact with the dielectric layer 76. As shown in Figure 5, a second ground electrode 33b is disposed on the 26th main surface 752 of the dielectric layer 75.

[0035] As shown in Figure 5, the dielectric layer 76 has a 27th main surface 761 and a 28th main surface 762. The 27th main surface 761 of the dielectric layer 76 is in contact with the dielectric layer 75. The 28th main surface 762 of the dielectric layer 76 is included in the 4th main surface 702 of the second dielectric layer 7 (see Figure 1). As shown in Figure 5, a plurality (45 in Figure 5) of external connection electrodes 41 are arranged on the 28th main surface 762 of the dielectric layer 76. The 45 external connection electrodes 41 include power supply electrodes 41a and 41b and a plurality (43 in Figure 5) of ground connection electrodes 41c.

[0036] (1.3) Antenna electrodes As shown in Figures 1 and 2, the two antenna electrodes 31 are arranged in the first dielectric layer 1. In this embodiment, the two antenna electrodes 31 are arranged on the first main surface 101 of the first dielectric layer 1.

[0037] Each of the two antenna electrodes 31 is conductive. The material of each of the two antenna electrodes 31 is, for example, copper. The thickness of each of the two antenna electrodes 31 is, for example, 3 μm or more and 40 μm or less. Each of the two antenna electrodes 31 is, for example, square in shape with a pair of sides aligned in direction D2. The two antenna electrodes 31 are spaced apart from each other and arranged along direction D2.

[0038] The antenna electrode 31a, the first ground electrode 32a, and the first dielectric layer 1 constitute two antennas. More specifically, the antenna electrode 31a, the first ground electrode 32a, and the first connecting conductor 61a constitute an antenna 55 (see Figure 21) whose polarization plane is in a direction D3 perpendicular to the thickness direction D1 and direction D2 of the first dielectric layer 1. Furthermore, the antenna electrode 31a, the first ground electrode 32a, and the first connecting conductor 61b constitute an antenna 57 (see Figure 21) whose polarization plane is in direction D2.

[0039] The antenna electrode 31b, the first ground electrode 32a, and the first dielectric layer 1 constitute two antennas. More specifically, the antenna electrode 31b, the first ground electrode 32a, and the first connecting conductor 61c constitute antenna 56 (see Figure 21) with direction D3 as its polarization plane. Furthermore, the antenna electrode 31b, the first ground electrode 32a, and the first connecting conductor 61d constitute antenna 58 (see Figure 21) with direction D2 as its polarization plane.

[0040] Furthermore, the dielectric constant of the first dielectric layer 1 is lower than that of the second dielectric layer 7. Therefore, in the antenna 100, the area of ​​the antenna electrode 31a and the antenna electrode 31b are larger compared to the case where the material of the second dielectric layer 7 is used as the material of the first dielectric layer 1, making it possible to improve the gain.

[0041] On the other hand, the elastic modulus of the first dielectric layer 1 is lower than that of the second dielectric layer 7. However, in the antenna 100, since the first dielectric layer 1 overlaps with the second dielectric layer 7, the antenna 100 is less prone to deformation compared to the case where the elastic modulus of the second dielectric layer 7 is approximately the same as that of the first dielectric layer 1.

[0042] (1.4) First ground electrodes As shown in FIG. 1 and FIG. 3, the two first ground electrodes 32 are disposed on the first dielectric layer 1. Each of the two first ground electrodes 32 is located between each of the two antenna electrodes 31 and the second dielectric layer 7 in the thickness direction D1 of the first dielectric layer 1. The two first ground electrodes 32 include a first ground electrode 32a and a first ground electrode 32b. As shown in FIG. 1 to FIG. 3, the first ground electrode 32a faces each of the two antenna electrodes 31 in the thickness direction D1 of the first dielectric layer 1. Further, as shown in FIG. 1 and FIG. 3, the first ground electrode 32a faces the first ground electrode 32b in the thickness direction D1 of the first dielectric layer 1.

[0043] The first ground electrode 32a is connected to the first ground electrode 32b via a plurality of fourth connection conductors 64d and a plurality of fifth connection conductors 65c. The first ground electrode 32b is connected to the second ground electrode 33a via a plurality of sixth connection conductors 66c and a plurality of seventh connection conductors 67c.

[0044] Each of the two first ground electrodes 32 has electrical conductivity. The material of the two first ground electrodes 32 includes, for example, copper. The thickness of each of the two first ground electrodes 32 is, for example, 3 μm or more and 40 μm or less. For example, as shown in FIG. 3, the first ground electrode 32a has a rectangular shape and includes a plurality of through holes that allow the plurality of fourth connection conductors 64a to 64c to pass therethrough. For example, as shown in FIG. 3, the first ground electrode 32b is rectangular and includes a plurality of through holes that allow the plurality of sixth connection conductors 66a and 66b to pass therethrough.

[0045] (1.5) Second ground electrodes As shown in FIG. 1, FIG. 4 and FIG. 5, the two second ground electrodes 33 are disposed on the second dielectric layer 7. The two second ground electrodes 33 include a second ground electrode 33a and a second ground electrode 33b. As shown in FIG. 1 and FIG. 4, the second ground electrode 33a faces the first ground electrode 32b and the second ground electrode 33b in the thickness direction D1 of the first dielectric layer 1.

[0046] The second ground electrode 33a is connected to the second ground electrode 33b via the plurality of eighth connection conductors 68c, the plurality of ninth connection conductors 69c, the plurality of tenth connection conductors 81c and the plurality of eleventh connection conductors 82c.

[0047] Each of the two second ground electrodes 33 has conductivity. The material of the two second ground electrodes 33 includes copper, for example. The thickness of each of the two second ground electrodes 33 is, for example, 3 µm or more and 40 µm or less. The second ground electrode 33a is, for example, rectangular as shown in FIG. 4 and has a plurality of through holes through which the plurality of eighth connection conductors 68a and 68b pass. The second ground electrode 33b is, for example, rectangular as shown in FIG. 5 and has a plurality of through holes through which the plurality of eleventh connection conductors 82a and 82b pass.

[0048] (1.6) First conductor portions As shown in FIGS. 1 to 3, the two first conductor portions 23 and 26 are arranged on the first dielectric layer 1. Each of the first conductor portion 23 and the first conductor portion 26 is connected to two antenna electrodes 31. Specifically, as will be described later, the first conductor portion 23 is connected to the antenna electrode 31a via the second connection conductor 62a and the first connection conductor 61a, and is connected to the antenna electrode 31b via the second connection conductor 62c and the first connection conductor 61c. Furthermore, as will be described later, the first conductor portion 26 is connected to the antenna electrode 31a via the fourth connection conductor 64a, the third connection conductor 63a, the second connection conductor 62b and the first connection conductor 61b, and is connected to the antenna electrode 31b via the fourth connection conductor 64b, the third connection conductor 63d, the second connection conductor 62d and the first connection conductor 61d.

[0049] The first conductor portion 23 is located on the ninth main surface 131 of the dielectric layer 13. That is, the first conductor portion 23 is located between the two antenna electrodes 31 and the two first ground electrodes 32a and 32b in the thickness direction D1 of the first dielectric layer 1. The first conductor portion 23 is a microstrip line facing the first ground electrode 32a via the dielectric layer 13 in the thickness direction D1 of the first dielectric layer 1. The first conductor portion 23 includes one or more (three in Figure 2) first portions 231 and one or more (two in Figure 2) second portions 232. The first portions 231 and the second portions 232 have different widths in direction D2. As a result, the first portion 231 of the first conductor portion 23 is an open stub, and the first conductor portion 23 functions as a first filter 53 (see Figure 21). In other words, the first filter 53 is located on the first dielectric layer 1 and connected to the two antenna electrodes 31. The first filter 53 is, for example, a low-pass filter (LPF).

[0050] The first conductor portion 26 is positioned on the 13th main surface 151 of the dielectric layer 15. That is, the first conductor portion 26 is positioned between the two antenna electrodes 31 and the first ground electrode 32b in the thickness direction D1 of the first dielectric layer 1. The first conductor portion 26 is a stripline that faces the first ground electrode 32a via the dielectric layer 14 and faces the first ground electrode 32b via the dielectric layer 15 in the thickness direction D1 of the first dielectric layer 1. The first conductor portion 26 includes one or more (three in Figure 3) first portions 261 and one or more (two in Figure 3) second portions 262. The first portions 261 and the second portions 262 have different widths in direction D2. As a result, the first portion 261 of the first conductor portion 26 is an open stub, and the first conductor portion 26 functions as the first filter 54 (see Figure 21). The first filter 54 is located on the first dielectric layer 1 and is connected to the two antenna electrodes 31. The first filter 54 is, for example, a low-pass filter (LPF).

[0051] Furthermore, as shown in Figures 2 and 3, in a plan view from the thickness direction D1 of the first dielectric layer 1, the two first conductor portions 23 and 26 do not overlap with the two antenna electrodes 31. Here, "in a plan view from the thickness direction D1 of the first dielectric layer 1, the two first conductor portions 23 and 26 do not overlap with the two antenna electrodes 31" means that, in a plan view from the thickness direction D1 of the first dielectric layer 1, neither the first conductor portion 23 nor the first conductor portion 26 overlaps with either of the two antenna electrodes 31a or antenna electrode 31b at all. This makes it possible to reduce interference between the first filters 53 and 54 (see Figure 21) and the antennas 55-58 (see Figure 21).

[0052] Each of the first conductor portions 23 and 26 is electrically conductive. The material of the first conductor portions 23 and 26 includes, for example, copper. The thickness of each of the first conductor portions 23 and 26 is, for example, 3 μm or more and 40 μm or less.

[0053] (1.7) Second Conductor Sections As shown in Figures 1 and 5, the two second conductor sections 29a and 29b are arranged in the second dielectric layer 7. Each of the two second conductor sections 29a and 29b corresponds to an isolated conductor section. Here, an "isolated conductor section" refers to a conductor that is insulated from the two power supply electrodes 41a and 41b, and is also insulated from any of the first ground electrode 32a, the first ground electrode 32b, the second ground electrode 33a, and the second ground electrode 33b.

[0054] Each of the two second conductor portions 29a and 29b is positioned on the 23rd main surface 741 of the dielectric layer 74. Each of the two second conductor portions 29a and 29b faces the second ground electrode 33a via the dielectric layers 72 and 73. Furthermore, each of the two second conductor portions 29a and 29b faces the second ground electrode 33b via the dielectric layer 74. In other words, each of the second conductor portions 29a and 29b is a stripline.

[0055] The second conductor section 29a includes a plurality (three in Figure 5) of conductors 291, 292, and 293. The three conductors 291, 292, and 293 are not connected to any of the first ground electrode 32a, first ground electrode 32b, second ground electrode 33a, or second ground electrode 33b. Furthermore, the three conductors 291, 292, and 293 are not connected to any of the power supply electrodes 41a and 41b.

[0056] The second conductor section 29a is adjacent to the signal line 28a. Here, "adjacent to the signal line 28a" means that there is no conductor between the second conductor section 29a and the signal line 28a. The second conductor section 29a and the signal line 28a act as a resonator and function as a second filter 51 (see Figure 21). The second filter 51 is located in the second dielectric layer 7. As will be described later, since the signal line 28a is connected between the power supply electrode 41a and the first conductor section 23, the second filter 51 is connected to the first filter 53. The second filter 51 is, for example, a band-stop filter (BSF). Each of the three conductors 291, 292, and 293 constitutes a half-wavelength resonator having an electrical length of, for example, half the wavelength of the frequency component blocked by the second filter 51.

[0057] The second conductor section 29b includes a plurality (three in Figure 5) of conductors 294, 295, and 296. The three conductors 294, 295, and 296 are not connected to any of the first ground electrode 32a, first ground electrode 32b, second ground electrode 33a, or second ground electrode 33b. Furthermore, the three conductors 294, 295, and 296 are not connected to any of the power supply electrodes 41a or 41b.

[0058] The second conductor section 29b is adjacent to the signal line 28b. Here, "the second conductor section 29b is adjacent to the signal line 28b" means that there is no conductor between the second conductor section 29b and the signal line 28b. The second conductor section 29b and the signal line 28b act as a resonator and function as a second filter 52 (see Figure 21). The second filter 52 is located in the second dielectric layer 7. The second filter 52 is, for example, a bandstop filter (BSF). Each of the three conductors 294, 295, and 296 constitutes a half-wavelength resonator having an electrical length of, for example, half the wavelength of the frequency components blocked by the second filter 51.

[0059] The material of the second conductor portions 29a and 29b includes, for example, copper. The thickness of each of the second conductor portions 29a and 29b is, for example, 3 μm or more and 40 μm or less.

[0060] (1.8) Pad electrodes and signal lines As shown in Figure 2, the multiple (three in Figure 2) pad electrodes 21 and the two signal lines 22a and 22b are arranged on the ninth main surface 131 of the dielectric layer 13, just like the first conductor portion 23. The three pad electrodes 21 include pad electrode 21a, pad electrode 21b, and pad electrode 21c.

[0061] The pad electrode 21a is connected to the antenna electrode 31a via the first connecting conductor 61a and the second connecting conductor 62a.

[0062] The pad electrode 21b is connected to the antenna electrode 31b via the first connecting conductor 61c and the second connecting conductor 62c.

[0063] The signal line 22a is connected between the pad electrode 21a and the first conductor portion 23. In other words, the first conductor portion 23 is connected to the antenna electrode 31a.

[0064] The signal line 22b is connected between the pad electrode 21b and the first conductor portion 23. In other words, the first conductor portion 23 is connected to the antenna electrode 31b.

[0065] Signal lines 22a and 22b are connected to the first end of the first conductor section 23. That is, signal lines 22a and 22b operate as distributors that distribute the power output from the first end of the first conductor section 23 to antenna electrodes 31a and 31b. The power output from the first end of the first conductor section 23 is radiated from antenna electrodes 31a and 31b as radio waves with direction D3 as the polarization plane.

[0066] Furthermore, signal lines 22a and 22b function as mixers, mixing the signal from antenna electrode 31a and the signal from antenna electrode 31b and inputting them to the first end of the first conductor section 23. The components of the radio waves received by antenna electrode 31a and antenna electrode 31b that have direction D3 as their polarization plane are combined and input to the first end of the first conductor section 23.

[0067] The pad electrode 21c is connected to the second end of the first conductor portion 23.

[0068] Each of the multiple (three in Figure 2) pad electrodes 21 and the two signal lines 22a and 22b is conductive. The material of the multiple pad electrodes 21 and the two signal lines 22a and 22b includes, for example, copper. The thickness of each of the multiple pad electrodes 21 and the two signal lines 22a and 22b is, for example, 3 μm or more and 40 μm or less.

[0069] As shown in Figure 3, the multiple (three in Figure 3) pad electrodes 24 and the two signal lines 25a and 25b are arranged on the 13th main surface 151 of the dielectric layer 15, just like the first conductor portion 26. The multiple pad electrodes 24 include pad electrode 24a, pad electrode 24b, and pad electrode 24c.

[0070] The pad electrode 24a is connected to the antenna electrode 31a via the first connecting conductor 61b, the second connecting conductor 62b, the third connecting conductor 63a, and the fourth connecting conductor 64a.

[0071] The pad electrode 24b is connected to the antenna electrode 31b via the first connecting conductor 61d, the second connecting conductor 62d, the third connecting conductor 63b, and the fourth connecting conductor 64b.

[0072] The signal line 25a is connected between the pad electrode 24a and the first conductor portion 26. In other words, the first conductor portion 26 is connected to the antenna electrode 31a.

[0073] The signal line 25b is connected between the pad electrode 24b and the first conductor section 26. In other words, the first conductor section 26 is connected to the antenna electrode 31b.

[0074] Signal lines 25a and 25b are connected to the first end of the first conductor section 26. That is, signal lines 25a and 25b operate as distributors that distribute the power output from the first end of the first conductor section 26 to antenna electrodes 31a and 31b. The power output from the first end of the first conductor section 23 is radiated from antenna electrodes 31a and 31b as radio waves with direction D2 as the polarization plane.

[0075] Furthermore, signal lines 25a and 25b function as mixers, mixing the signal from antenna electrode 31a and the signal from antenna electrode 31b and inputting them to the first end of the first conductor section 26. The components of the radio waves received by antenna electrode 31a and antenna electrode 31b that have direction D2 as their polarization plane are combined and input to the first end of the first conductor section 23.

[0076] Here, the electrical length of the signal line 25b is longer than the electrical length of the signal line 25a by half a wavelength of the radio wave whose polarization plane is in the direction D2 from which the antenna 100 transmits or receives. As a result, the electric field of the antenna electrode 31a and the electric field of the antenna electrode 31b are in phase due to the power output from the first end of the first conductor portion 26, making it possible to improve the antenna gain.

[0077] The pad electrode 24c is connected to the second end of the first conductor portion 26.

[0078] Each of the multiple (three in Figure 2) pad electrodes 24 and the two signal lines 25a and 25b is conductive. The material of the multiple pad electrodes 24 and the two signal lines 25a and 25b includes, for example, copper. The thickness of each of the multiple pad electrodes 24 and the two signal lines 25a and 25b is, for example, 3 μm or more and 40 μm or less.

[0079] As shown in Figure 5, the multiple (four in Figure 5) pad electrodes 27 and the two signal lines 28a and 28b are arranged on the 23rd main surface 741 of the dielectric layer 74, just like the second conductor sections 29a and 29b. The multiple pad electrodes 27 include pad electrode 27a, pad electrode 27b, pad electrode 27c, and pad electrode 27d.

[0080] The pad electrode 27a is connected to the first conductor portion 23 via the third connecting conductor 63c, the fourth connecting conductor 64c, the fifth connecting conductor 65a, the sixth connecting conductor 66a, the seventh connecting conductor 67a, the eighth connecting conductor 68a, and the ninth connecting conductor 69a.

[0081] The signal line 28a is connected between the pad electrode 27a and the pad electrode 27b. The signal line 28a and the second conductor portion 29a constitute the second filter 51 (see Figure 21) as described above. The pad electrode 27b is connected to the power supply electrode 41a via the tenth connecting conductor 81a, the eleventh connecting conductor 82a, and the twelfth connecting conductor 83a, as will be described later. In other words, the second filter 51 is connected to the first filter 53.

[0082] The pad electrode 27c is connected to the first conductor portion 26 via the fifth connecting conductor 65b, the sixth connecting conductor 66b, the seventh connecting conductor 67b, the eighth connecting conductor 68b, and the ninth connecting conductor 69b.

[0083] The signal line 28b is connected between the pad electrode 27c and the pad electrode 27d. The signal line 28b and the second conductor section 29b constitute the second filter 52 (see Figure 21) as described above. The pad electrode 27d is connected to the power supply electrode 41b via the tenth connecting conductor 81b, the eleventh connecting conductor 82b, and the twelfth connecting conductor 83b, as will be described later. In other words, the second filter 52 is connected to the first filter 54.

[0084] The pad electrode 27d is connected to the pad electrode 27c via the signal line 28b.

[0085] Each of the multiple (four in Figure 5) pad electrodes 27 and the two signal lines 28a and 28b is conductive. The material of the multiple pad electrodes 27 and the two signal lines 28a and 28b includes, for example, copper. The thickness of each of the multiple pad electrodes 27 and the two signal lines 28a and 28b is, for example, 3 μm or more and 40 μm or less.

[0086] (1.9) External connection electrodes As shown in Figure 5, multiple (45 in Figure 5) external connection electrodes 41 are arranged on the 28th main surface 762 of the dielectric layer 76. That is, multiple external connection electrodes 41 are arranged on the 4th main surface 702 (see Figure 1) of the second dielectric layer 7.

[0087] The 45 external connection electrodes 41 are arranged in a matrix, for example, in a plan view from the thickness direction D1 of the first dielectric layer 1. The 45 external connection electrodes 41 include two power supply electrodes 41a and 41b and a plurality (43 in Figure 5) of ground connection electrodes 41c. That is, the two power supply electrodes 41a and 41b are located on the fourth main surface 702 of the second dielectric layer 7.

[0088] The power supply electrode 41a is connected to the signal line 28a via the 10th connecting conductor 81a, the 11th connecting conductor 82a, the 12th connecting conductor 83a, and the pad electrode 27b.

[0089] The power supply electrode 41b is connected to the signal line 28b via the 10th connecting conductor 81b, the 11th connecting conductor 82b, the 12th connecting conductor 83b, and the pad electrode 27d.

[0090] Multiple ground connection electrodes 41c are connected to the second ground electrode 33b via multiple twelfth connecting conductors 83c. In other words, the multiple ground connection electrodes 41c are connected to the first ground electrode 32a, the first ground electrode 32b, the second ground electrode 33a, and the second ground electrode 33b.

[0091] The multiple ground connection electrodes 41c include two or more external connection electrodes 41c arranged along the outer edge 763 of the dielectric layer 76. That is, each of the two or more external connection electrodes 41c arranged along the outer edge of the second dielectric layer 7 is a ground connection electrode 41c connected to the first ground electrode 32a, the first ground electrode 32b, the second ground electrode 33a, and the second ground electrode 33. As a result, the feed electrodes 41a and 41b are surrounded by the ground connection electrodes 41c, making the antenna 100 less susceptible to external electromagnetic influences.

[0092] Each of the multiple external connection electrodes 41 is conductive. The material of each of the multiple external connection electrodes 41 is, for example, copper. The thickness of each of the multiple external connection electrodes 41 is, for example, 3 μm or more and 40 μm or less.

[0093] (1.10) The first connecting conductor 61 of the multiple connecting conductors (four in Figure 2) penetrates the dielectric layer 11 and is connected to the multiple antenna electrodes 31, as shown in Figures 1 and 2. The first connecting conductor 61a connects the antenna electrode 31a to the second connecting conductor 62a. The first connecting conductor 61b connects the antenna electrode 31a to the second connecting conductor 62b. The first connecting conductor 61c connects the antenna electrode 31b to the second connecting conductor 62c. The first connecting conductor 61c connects the antenna electrode 31b to the second connecting conductor 62d.

[0094] As shown in Figures 1 and 2, the multiple (four in Figure 2) second connecting conductors 62 penetrate the dielectric layer 12. The second connecting conductor 62a connects the first connecting conductor 61a to the pad electrode 21a. The second connecting conductor 62b connects the first connecting conductor 61b to the third connecting conductor 63a. The second connecting conductor 62c connects the first connecting conductor 61c to the pad electrode 21b. The second connecting conductor 62d connects the first connecting conductor 61d to the third connecting conductor 63b.

[0095] The multiple (three in Figure 2) third connecting conductors 63 penetrate the dielectric layer 13, as shown in Figure 2. The third connecting conductor 63a connects the second connecting conductor 62b and the fourth connecting conductor 64a. The third connecting conductor 63b connects the second connecting conductor 62d and the fourth connecting conductor 64b. The third connecting conductor 63c connects the pad electrode 21c and the fourth connecting conductor 64c. None of the three third connecting conductors 63 are in contact with the first ground electrode 32a.

[0096] Multiple (31 in Figure 3) fourth connecting conductors 64 penetrate the dielectric layer 14, as shown in Figure 3. The fourth connecting conductor 64a connects the third connecting conductor 63a to the pad electrode 24a. The fourth connecting conductor 64b connects the third connecting conductor 63b to the pad electrode 24b. The fourth connecting conductor 64c connects the third connecting conductor 63c to the fifth connecting conductor 65a. Multiple (28 in Figure 3) fourth connecting conductors 64d connect the first ground electrode 32a to multiple fifth connecting conductors 65c. The fourth connecting conductors 64a, 64b, and 64c do not come into contact with the first ground electrode 32a.

[0097] Multiple (30 in Figure 4) fifth connecting conductors 65 penetrate the dielectric layer 15, as shown in Figure 4. Fifth connecting conductor 65a connects the fourth connecting conductor 64c and the sixth connecting conductor 66a. Fifth connecting conductor 65b connects the pad electrode 24c and the sixth connecting conductor 66b. Multiple (28 in Figure 4) fifth connecting conductors 65c connect multiple fourth connecting conductors 64d and the first ground electrode 32b. Fifth connecting conductors 65a and 5th connecting conductors 65b are not in contact with the first ground electrode 32b.

[0098] Multiple (32 in Figure 4) sixth connecting conductors 66 penetrate the dielectric layer 16, as shown in Figure 4. The sixth connecting conductor 66a connects the fifth connecting conductor 65a and the seventh connecting conductor 67a. The sixth connecting conductor 66b connects the fifth connecting conductor 65b and the seventh connecting conductor 67b. Multiple (30 in Figure 4) sixth connecting conductors 66c connect the first ground electrode 32b and multiple seventh connecting conductors 67c. The sixth connecting conductors 66a and 66b are not in contact with the first ground electrode 32b.

[0099] Multiple (32 in Figure 5) seventh connecting conductors 67 penetrate the dielectric layer 71, as shown in Figure 5. Seventh connecting conductor 67a connects the sixth connecting conductor 66a and the eighth connecting conductor 68a. Seventh connecting conductor 67b connects the sixth connecting conductor 66b and the eighth connecting conductor 68b. Multiple (30 in Figure 5) seventh connecting conductors 67c connect multiple sixth connecting conductors 66c and the second ground electrode 33a. Seventh connecting conductors 67a and 7th connecting conductors 67b are not in contact with the second ground electrode 33a.

[0100] Multiple (24 in Figure 5) eighth connecting conductors 68 penetrate the dielectric layer 72, as shown in Figure 5. The eighth connecting conductor 68a connects the seventh connecting conductor 67a and the ninth connecting conductor 69a. The eighth connecting conductor 68b connects the seventh connecting conductor 67b and the ninth connecting conductor 69b. Multiple (22 in Figure 5) eighth connecting conductors 68c connect the second ground electrode 33a and multiple ninth connecting conductors 69c. The eighth connecting conductors 68a and 68b are not in contact with the second ground electrode 33a.

[0101] Multiple (24 in Figure 5) ninth connecting conductors 69 penetrate the dielectric layer 73, as shown in Figure 5. The ninth connecting conductor 69a connects the eighth connecting conductor 68a to the pad electrode 27a. The ninth connecting conductor 69b connects the eighth connecting conductor 68b to the pad electrode 27b. Multiple (22 in Figure 5) ninth connecting conductors 69c connect multiple eighth connecting conductors 68c to multiple tenth connecting conductors 81c.

[0102] Multiple (24 in Figure 6) tenth connecting conductors 81 penetrate the dielectric layer 74, as shown in Figure 6. The tenth connecting conductor 81a connects the pad electrode 27b to the eleventh connecting conductor 82a. The tenth connecting conductor 81b connects the pad electrode 27d to the eleventh connecting conductor 82b. Multiple (22 in Figure 6) tenth connecting conductors 81c connect multiple ninth connecting conductors 69c to multiple eleventh connecting conductors 82c.

[0103] Multiple (24 in Figure 6) 11th connecting conductors 82 penetrate the dielectric layer 75, as shown in Figure 6. The 11th connecting conductor 82a connects the 10th connecting conductor 81a and the 12th connecting conductor 83a. The 11th connecting conductor 82b connects the 10th connecting conductor 81b and the 12th connecting conductor 83b. Multiple (22 in Figure 6) 11th connecting conductors 82c connect multiple 10th connecting conductors 81c and the second ground electrode 33b. The 11th connecting conductors 82a and 11th connecting conductors 82b are not in contact with the second ground electrode 33b.

[0104] Multiple (45 in Figure 6) 12th connecting conductors 83 penetrate the dielectric layer 76, as shown in Figure 6. The 12th connecting conductor 83a connects the 11th connecting conductor 82a to the power supply electrode 41a. The 12th connecting conductor 83b connects the 11th connecting conductor 82b to the power supply electrode 41b. Multiple (43 in Figure 6) 12th connecting conductors 83c connect the second ground electrode 33b to multiple ground connecting electrodes 41c. The 12th connecting conductors 83a and 12th connecting conductors 83b are not in contact with the second ground electrode 33b.

[0105] Each of the multiple first connecting conductors 61, multiple second connecting conductors 62, multiple third connecting conductors 63, multiple fourth connecting conductors 64, multiple fifth connecting conductors 65, multiple sixth connecting conductors 66, multiple seventh connecting conductors 67, multiple eighth connecting conductors 68, multiple ninth connecting conductors 69, multiple tenth connecting conductors 81, multiple eleventh connecting conductors 82, and twelfth connecting conductors 83 is electrically conductive. The material of each of the multiple first connecting conductors 61, multiple second connecting conductors 62, multiple third connecting conductors 63, multiple fourth connecting conductors 64, multiple fifth connecting conductors 65, multiple sixth connecting conductors 66, multiple seventh connecting conductors 67, multiple eighth connecting conductors 68, multiple ninth connecting conductors 69, multiple tenth connecting conductors 81, multiple eleventh connecting conductors 82, and twelfth connecting conductors 83 includes, for example, copper, copper alloys, and resins.

[0106] (1.11) Resist layer As shown in Figure 1, the resist layer 9 covers the first dielectric layer 1 and the plurality of antenna electrodes 31.

[0107] The resist layer 9 includes, for example, a polyimide film and an adhesive layer. The material of the adhesive layer includes, for example, an acrylic resin, a silicone resin, an epoxy resin, or a urethane resin. However, the resist layer 9 is not limited to a configuration including a polyimide film and an adhesive layer; for example, it may be a resist layer without an adhesive layer. The resist layer is formed, for example, using spin coating technology and photolithography technology.

[0108] The antenna 100 may further include a resist layer that covers the portion of the fourth main surface 702 of the second dielectric layer 7 where no external connection electrodes 41 are located.

[0109] (2) The antenna 100 according to the first embodiment comprises a first dielectric layer 1, a second dielectric layer 7, an antenna electrode 31, a ground electrode 32, first filters 53, 54, and second filters 51, 52. The first dielectric layer 1 has a first main surface 101 and a second main surface 102. The second dielectric layer 7 has a third main surface 701 and a fourth main surface 702. The third main surface 701 is in contact with the second main surface 102 of the first dielectric layer 1. The antenna electrode 31 is located in the first dielectric layer 1. The ground electrode 32 is located in the first dielectric layer 1 and is positioned between the antenna electrode 31 and the second dielectric layer 7. The first filters 53, 54 are located in the first dielectric layer 1 and are connected to the antenna electrode 31. The second filters 51, 52 are located in the second dielectric layer 7. The second filter 51 is connected to the first filter 53. The second filter 52 is connected between the power supply electrode 41b and the first filter 54. The dielectric constant of the first dielectric layer 1 is lower than that of the second dielectric layer 7. The elastic modulus of the first dielectric layer 1 is lower than that of the second dielectric layer 7.

[0110] The above configuration makes it possible to achieve both improved gain for the antenna 100 and miniaturization of the second filters 51 and 52. More specifically, since the dielectric constant of the first dielectric layer 1 is lower than that of the second dielectric layer 7, it becomes easier to enlarge the antenna electrode 31 compared to the case where the antenna electrode 31 and ground electrode 32 are provided on the second dielectric layer 7. Therefore, it becomes easier to improve the gain of the antenna 100. Also, since the dielectric constant of the second dielectric layer 7 is higher than that of the first dielectric layer 1, it becomes easier to miniaturize the second filters 51 and 52 when they include capacitive elements, compared to the case where the second filters 51 and 52 are provided on the first dielectric layer 1. Therefore, it becomes easier to miniaturize the antenna 100. Furthermore, even when the elastic modulus of the first dielectric layer 1 is lower than that of the second dielectric layer 7, the antenna 100 is less prone to deformation compared to when the second dielectric layer 7 is not present, thus reducing the degradation of the antenna's characteristics due to deformation. Moreover, if the first dielectric layer 1 and the second dielectric layer 7 of the antenna 100 are formed only from materials with high elastic modulus, there is a limit to how low the dielectric constant can be. In the antenna 100, by using two different materials in the first dielectric layer 1 and the second dielectric layer 7—one where a low dielectric constant is desired and the other where a high elastic modulus is required—it is possible to achieve both improved antenna gain and miniaturization of the filter.

[0111] Furthermore, in the antenna 100 according to Embodiment 1, the first filter 53 includes a first conductor portion 23 positioned between the antenna electrode 31 and the ground electrode 32 in the thickness direction D1 of the first dielectric layer 1. The first conductor portion 23 is connected between the antenna electrode 31 and the second filter 51 and is a microstrip line. The first filter 54 includes a first conductor portion 26 positioned between the antenna electrode 31 and the ground electrode 32b in the thickness direction D1 of the first dielectric layer 1. The first conductor portion 26 is connected between the antenna electrode 31 and the second filter 52 and is a strip line. In a plan view from the thickness direction D1 of the first dielectric layer 1, the first conductor portions 23 and 26 do not overlap with the antenna electrode 31.

[0112] With the above configuration, it is possible to reduce the characteristic changes in the first filters 53 and 54 caused by the coupling between the antenna electrode 31 and the first conductor portions 23 and 26.

[0113] Furthermore, the antenna 100 according to Embodiment 1 comprises a first dielectric layer 1, a second dielectric layer 7, an antenna electrode 31, a ground electrode 32, first conductor portions 23 and 26, and second conductor portions 29a and 29b. The first dielectric layer 1 has a first main surface 101 and a second main surface 102. The second dielectric layer 7 has a third main surface 701 and a fourth main surface 702. The third main surface 701 is in contact with the second main surface 102 of the first dielectric layer 1. The antenna electrode 31 is arranged in the first dielectric layer 1. The ground electrode 32 is arranged in the first dielectric layer 1 and is located between the antenna electrode 31 and the second dielectric layer 7. The first conductor portion 23 is arranged between the antenna electrode 31a and the ground electrode 32a in the thickness direction D1 of the first dielectric layer 1. The first conductor portion 23 is a microstrip line connected to the antenna electrode 31a. The first conductor portion 26 is positioned between the antenna electrode 31b and the ground electrode 32b in the thickness direction of the first dielectric layer 1. The first conductor portion 26 is a stripline connected to the antenna electrode 31b. The second conductor portions 29a and 29b are striplines positioned in the second dielectric layer 7 and are not connected to the ground electrode 32. The first conductor portion 23 includes a first portion 231 and a second portion 232 having a different width from the first portion 231. The first conductor portion 26 includes a first portion 261 and a second portion 262 having a different width from the first portion 261. The second conductor portion 29a is adjacent to the signal line 28a connected between the feed electrode 41a and the first conductor portion 23. The second conductor portion 29b is adjacent to the signal line 28b connected between the feed electrode 41b and the first conductor portion 26. The dielectric constant of the first dielectric layer 1 is lower than the dielectric constant of the second dielectric layer 7. The elastic modulus of the first dielectric layer 1 is lower than that of the second dielectric layer 7.

[0114] The above configuration makes it possible to achieve both an improvement in the gain of the antenna 100 and miniaturization of the second filters 51 and 52, which include the second conductor portions 29a and 29b. More specifically, since the dielectric constant of the first dielectric layer 1 is lower than that of the second dielectric layer 7, it becomes easier to enlarge the antenna electrode 31 compared to the case where the antenna electrode 31 and ground electrode 32 are provided on the second dielectric layer 7. Therefore, it becomes easier to improve the gain of the antenna 100. Also, since the dielectric constant of the second dielectric layer 7 is higher than that of the first dielectric layer 1, it becomes easier to miniaturize the second filters 51 and 52 when the second conductor portions 29a and 29b function as capacitive elements compared to the case where the second conductor portions 29a and 29b are provided on the first dielectric layer 1. Therefore, it becomes easier to miniaturize the antenna 100. Furthermore, even when the elastic modulus of the first dielectric layer 1 is lower than that of the second dielectric layer 7, the antenna 100 is less prone to deformation compared to when the second dielectric layer 7 is not present, thus reducing the degradation of the antenna's characteristics due to deformation. Moreover, if the first dielectric layer 1 and the second dielectric layer 7 of the antenna 100 are formed only from materials with high elastic modulus, there is a limit to how low the dielectric constant can be. In the antenna 100, by using two different materials in the first dielectric layer 1 and the second dielectric layer 7—one where a low dielectric constant is desired and the other where a high elastic modulus is required—it is possible to achieve both improved antenna gain and miniaturization of the filter.

[0115] Furthermore, in the antenna 100 according to Embodiment 1, the first conductor portions 23 and 26 and the antenna electrode 31 do not overlap when viewed in a plan view from the thickness direction D1 of the first dielectric layer 1.

[0116] According to the above configuration, it is possible to reduce the characteristic changes in the first filters 53 and 54, which include the first conductor portions 23 and 26, due to the coupling between the antenna electrode 31 and the first conductor portions 23 and 26.

[0117] Furthermore, the antenna 100 according to Embodiment 1 further comprises a plurality of external connection electrodes 41 arranged on the fourth main surface 702 of the second dielectric layer 7. Of the plurality of external connection electrodes 41, two or more external connection electrodes 41c arranged along the outer edge of the second dielectric layer 7 are connected to the ground electrode 32.

[0118] With the above configuration, since the feed electrodes 41a and 41b are surrounded by two or more external connection electrodes 41c connected to the ground electrode 32, it becomes difficult for noise from outside the antenna 100 to be mixed into the signals that the antenna 100 inputs or outputs via the feed electrodes 41a and 41b.

[0119] (Modification 1) An antenna 100 according to Modification 1 of Embodiment 1 will be described with reference to Figures 6 and 7. With respect to the antenna 100 according to Modification 1 of Embodiment 1, components that are the same as those in the antenna 100 according to Embodiment 1 (see Figures 1 to 5) are denoted by the same reference numerals and their description is omitted.

[0120] (1) The antenna 100 according to Modification 1 of Embodiment 1 differs from the antenna 100 according to Embodiment 1 in that it is equipped with a first conductor portion 23a instead of the first conductor portion 23 (see Figure 2) and a first conductor portion 26a instead of the first conductor portion 26 (see Figure 3).

[0121] As shown in Figure 6, the first conductor portion 23a is located in the first dielectric layer 1. More specifically, the first conductor portion 23a is located on the ninth main surface 131 of the dielectric layer 13. Similar to the first conductor portion 23, the first conductor portion 23a is located in the thickness direction D1 of the first dielectric layer 1 between the two antenna electrodes 31 and the two first ground electrodes 32a and 32b.

[0122] The first conductor portion 23a is a microstrip line facing the first ground electrode 32a via the dielectric layer 13. The first conductor portion 23a includes one or more (three in Figure 6) first portions 234 and one or more (one in Figure 6) second portions 235. The first portions 234 and the second portions 235 have different widths in direction D2. As a result, the first portion 234 of the first conductor portion 23a is an open stub, and similar to the first conductor portion 23, the first conductor portion 23a functions as the first filter 53 (see Figure 21).

[0123] Furthermore, as shown in Figure 7, the first conductor portion 26a is located in the first dielectric layer 1. More specifically, the first conductor portion 26a is located on the 13th main surface 151 of the dielectric layer 15. Similar to the first conductor portion 26, the first conductor portion 26a is located between the first ground electrode 32a and the first ground electrode 32b in the thickness direction D1 of the first dielectric layer 1.

[0124] The first conductor portion 26a is a stripline that faces the first ground electrode 32a via the dielectric layer 14 and faces the first ground electrode 32b via the dielectric layer 15. The first conductor portion 26a includes one or more (three in Figure 7) first portions 264 and one or more (one in Figure 7) second portions 265. The first portions 264 and the second portions 265 have different widths in direction D2. As a result, the first portion 264 of the first conductor portion 26a is an open stub, and similar to the first conductor portion 26, the first conductor portion 26a functions as the first filter 54 (see Figure 21).

[0125] Furthermore, as shown in Figures 6 and 7, in a plan view from the thickness direction D1 of the first dielectric layer 1, the two first conductor portions 23a and 26a do not overlap with the two antenna electrodes 31. Here, "in a plan view from the thickness direction D1 of the first dielectric layer 1, the two first conductor portions 23a and 26a do not overlap with the two antenna electrodes 31" means that, in a plan view from the thickness direction D1 of the first dielectric layer 1, neither the first conductor portion 23a nor the first conductor portion 26a overlaps with either of the two antenna electrodes 31a or antenna electrode 31b at all. This makes it possible to reduce interference between the first filters 53 and 54 (see Figure 21) and the antennas 55-58 (see Figure 21).

[0126] Each of the first conductor portions 23a and 26a is electrically conductive. The material of the first conductor portions 23a and 26a includes, for example, copper. The thickness of each of the first conductor portions 23a and 26a is, for example, 3 μm or more and 40 μm or less.

[0127] (Modification 2) An antenna 100a according to Modification 2 of Embodiment 1 will be described with reference to Figures 8 and 9. With respect to the antenna 100a according to Modification 2 of Embodiment 1, components that are the same as those of the antenna 100 according to Embodiment 1 (see Figures 1 to 5) are denoted by the same reference numerals and their description is omitted.

[0128] (1) The antenna 100a according to Modification 2 of Embodiment 1 differs from the antenna 100 according to Embodiment 1 in that it is equipped with a signal line 25c instead of a signal line 25a, a signal line 25d instead of a signal line 25b, and does not have a first ground electrode 32b.

[0129] As shown in Figure 9, the first ground electrode 32b is not located on the 15th main surface 161 of the dielectric layer 16. Multiple (28 in Figure 9) fifth connecting conductors 65c connect multiple (28 in Figure 9) fourth connecting conductors 64d and multiple sixth connecting conductors 66c. Multiple (28 in Figure 9) sixth connecting conductors 66c connect multiple fifth connecting conductors 65c and multiple seventh connecting conductors 67c (see Figure 4). Therefore, the first ground electrode 32a is connected to the second ground electrode 33a.

[0130] The first conductor portion 26 is a stripline that faces the first ground electrode 32a via the dielectric layer 14 and faces the second ground electrode 33a via the dielectric layers 15, 16, and 71. Similar to Embodiment 1, the first conductor portion 26 functions as the first filter 54 (see Figure 21).

[0131] The signal line 25c is connected between the pad electrode 24a and the first conductor portion 26.

[0132] The signal line 25d is connected between the pad electrode 24b and the first conductor portion 26.

[0133] Here, the distance between signal lines 25c and 25d and the second ground electrode 33a is longer than the distance between signal lines 25a and 25b and the first ground electrode 32b in Embodiment 1. Therefore, it is preferable that the widths of signal lines 25c and 25d are different from the widths of signal lines 25a and 25b. In this modified example, the widths of signal lines 25c and 25d are wider than the widths of signal lines 25a and 25b.

[0134] (Modification 3) The antenna 100b according to Modification 3 of Embodiment 1 will be described with reference to Figures 10 and 11. With respect to the antenna 100b according to Modification 3 of Embodiment 1, components that are the same as those of the antenna 100 according to Embodiment 1 (see Figures 1 to 5) are denoted by the same reference numerals and their description is omitted.

[0135] (1) The antenna 100b according to Modification 3 of Embodiment 1 differs from the antenna 100 according to Embodiment 1 in that, instead of the pad electrodes 27a to 27d and signal lines 28a, 28b (see Figure 5) formed in the same layer as the second conductor portions 29a, 29b, it comprises pad electrodes 27e to 27h and signal lines 28c, 28d formed in a different layer from the second conductor portions 29c, 29d. Furthermore, the antenna 100b according to Modification 3 of Embodiment 1 comprises ninth connecting conductors 69d and 69e instead of ninth connecting conductors 69a and 69b (see Figure 4), and tenth connecting conductors 81d and 81e instead of tenth connecting conductors 81a and 81b.

[0136] As shown in Figure 11, the multiple (four in Figure 11) pad electrodes 27 and the two signal lines 28c and 28d are arranged on the 21st main surface 731 of the dielectric layer 73, unlike the second conductor sections 29c and 29d. The second conductor sections 29c and 29d are arranged on the 23rd main surface 741 of the dielectric layer 74. The second conductor sections 29c and 29d have the same configuration as the second conductor sections 29a and 29b (see Figure 5).

[0137] The pad electrode 27e is connected to the first conductor portion 23 via the third connecting conductor 63c, the fourth connecting conductor 64c, the fifth connecting conductor 65a, the sixth connecting conductor 66a, the seventh connecting conductor 67a, and the eighth connecting conductor 68a.

[0138] The signal line 28c is connected between the pad electrode 27e and the pad electrode 27f. The signal line 28c and the second conductor section 29c constitute the second filter 51 (see Figure 21).

[0139] The pad electrode 27f is connected to the power supply electrode 41a via the ninth connecting conductor 69d, the tenth connecting conductor 81d, the eleventh connecting conductor 82a, and the twelfth connecting conductor 83a.

[0140] The pad electrode 27g is connected to the first conductor portion 26 via the fifth connecting conductor 65a, the sixth connecting conductor 66b, the seventh connecting conductor 67b, and the eighth connecting conductor 68b.

[0141] The signal line 28d is connected between the pad electrode 27g and the pad electrode 27h. The signal line 28d and the second conductor portion 29d constitute the second filter 52 (see Figure 21).

[0142] The pad electrode 27h is connected to the power supply electrode 41a via the ninth connecting conductor 69e, the tenth connecting conductor 81e, the eleventh connecting conductor 82b, and the twelfth connecting conductor 83b.

[0143] In this modified example, a dielectric layer 73 exists between the signal line 28c and the second conductor portion 29c, and between the signal line 28d and the second conductor portion 29d. Therefore, by separating the signal line 28c and the signal line 28d along the thickness direction D1 of the first dielectric layer 1, it is possible to increase the distance between the signal line 28c and the second conductor portion 29d, and the distance between the signal line 28d and the second conductor portion 29d, without increasing the area of ​​the 23rd main surface 741 of the dielectric layer 74. Consequently, it is possible to reduce the volume of the second dielectric layer 7.

[0144] (Embodiment 2) The antenna 100c according to Embodiment 2 will be described with reference to Figure 12. With respect to the antenna 100c according to Embodiment 2, components that are the same as those of the antenna 100 according to Embodiment 1 (see Figures 1 to 5) are denoted by the same reference numerals and their description is omitted.

[0145] (1) The antenna 100c according to the second embodiment differs from the antenna 100 according to the first embodiment in that, in a plan view from the thickness direction D1 of the first dielectric layer 1, the area of ​​the first dielectric layer 1 is larger than the area of ​​the second dielectric layer 7.

[0146] As shown in Figure 12, in a plan view from the thickness direction D1 of the first dielectric layer 1, the area of ​​the first dielectric layer 1 is larger than the area of ​​the second dielectric layer 7. Specifically, as shown in Figure 12, the width of the first dielectric layer 1 along direction D3 is larger than the width of the second dielectric layer 7 along direction D3. Also, the width of the first dielectric layer 1 along direction D2 (see Figure 2) may be larger than the width of the second dielectric layer 7 along direction D2.

[0147] Furthermore, as shown in Figure 12, in a plan view from the thickness direction D1 of the first dielectric layer 1, the first ground electrode 32 has a region AR2 that does not overlap with the second ground electrode 33. Specifically, as shown in Figure 12, the first ground electrode 32b includes both a region AR1 that overlaps with the second ground electrode 33 and a region AR2 that does not overlap, in a plan view from the thickness direction D1 of the first dielectric layer 1. Note that the first ground electrode 32a may also include both a region that overlaps with the second ground electrode 33 and a region that does not overlap, in a plan view from the thickness direction D1 of the first dielectric layer 1.

[0148] With the above configuration, it is possible to widen the cross-sectional area of ​​antennas 55 to 58 (see Figure 21), which are composed of antenna electrode 31, first ground electrode 32, and first dielectric layer 1, in a direction perpendicular to the thickness direction D1 of the first dielectric layer 1. Therefore, in antenna 100c, it is possible to improve the transmission or reception gain of radio waves traveling along the thickness direction D1 of the first dielectric layer 1.

[0149] (2) The antenna 100c according to the second embodiment is provided with a second ground electrode 33. The second ground electrode 33 is located in the second dielectric layer 7. In a plan view from the thickness direction D1 of the first dielectric layer 1, the area of ​​the first dielectric layer 1 is larger than the area of ​​the second dielectric layer 7. In a plan view from the thickness direction D1 of the first dielectric layer 1, the first ground electrode 32b has a region AR2 that does not overlap with the second ground electrode 33.

[0150] With the above configuration, it is possible to increase the cross-sectional area of ​​the antenna, which is composed of the antenna electrode 31, the first ground electrode 32, and the first dielectric layer 1, in a direction perpendicular to the thickness direction D1 of the first dielectric layer 1. Therefore, in antenna 100c, it is possible to improve the transmission or reception gain of radio waves traveling along the thickness direction D1 of the first dielectric layer 1.

[0151] (Embodiment 3) The antenna 100d according to Embodiment 3 will be described with reference to Figures 13 to 17. With respect to the antenna 100d according to Embodiment 3, components that are the same as those of the antenna 100 according to Embodiment 1 (see Figures 1 to 5) are denoted by the same reference numerals and their description is omitted.

[0152] (1) The antenna 100d according to Embodiment 3 differs from the antenna 100 according to Embodiment 1 in that the second dielectric layer 7a has a projection 71a that protrudes from the third main surface 701a in the thickness direction D1 of the first dielectric layer 1a, and in a plan view from the thickness direction D1 of the first dielectric layer 1a, the projection 71a overlaps with the second conductor portions 29a and 29b. In addition, the antenna 100d has multiple (three in Figure 16) second ground electrodes 33c, 33d, and 33e instead of the second ground electrode 33a (see Figures 1 and 4).

[0153] The first dielectric layer 1a has a dielectric layer 16a instead of dielectric layer 16 (see Figures 1 and 3). Dielectric layer 16a is in contact with the third main surface 701a of the second dielectric layer 7a.

[0154] The second dielectric layer 7a replaces the dielectric layer 71 (see Figures 1 and 4) with a dielectric layer 71b and has one or more (two in Figures 13 and 15) protrusions 71a. The two protrusions 71a project from the third main surface 701a of the second dielectric layer 7a in the thickness direction D1 of the first dielectric layer 1a.

[0155] As shown in Figures 13 and 15, the 15th main surface 161a of the dielectric layer 16a is in contact with the first dielectric layer 1a, and the first ground electrode 32b is positioned thereon. The 16th main surface 162a of the dielectric layer 16a is in contact with the dielectric layer 71b of the second dielectric layer 7a. In this embodiment, the 16th main surface 162a of the dielectric layer 16a is in contact with the dielectric layer 71b of the second dielectric layer 7a, and is not in contact with the two protrusions 71a. Also, in this embodiment, as shown in Figure 15, in a plan view from the thickness direction of the first dielectric layer 1a, the dielectric layer 16a does not overlap with either of the two protrusions 71a.

[0156] Multiple sixth connecting conductors 66 that penetrate the dielectric layer 16a are connected to multiple seventh connecting conductors 67.

[0157] As shown in Figure 13, the two protrusions 71a are located on the 17th main surface 711b of the dielectric layer 71b. As shown in Figures 13, 15, and 17, in a plan view from the thickness direction D1 of the first dielectric layer 1a, the two protrusions 71a overlap with the second conductor portions 29a and 29b. More specifically, the two protrusions 71a include a protrusion 71a that overlaps with the second conductor portion 29a in a plan view from the thickness direction D1 of the first dielectric layer 1a, and a protrusion 71a that overlaps with the second conductor portion 29b in a plan view from the thickness direction D1 of the first dielectric layer 1a.

[0158] Each of the two protrusions 71a is, for example, a dielectric layer located on the 17th main surface 711b of the dielectric layer 71b. The material of each of the two protrusions 71a is, for example, the same as the material of the dielectric layer 71b and the dielectric layers 72 to 76.

[0159] Each of the two protrusions 71a has a 29th main surface 711a and a 30th main surface 712a, as shown in Figure 15. The 29th main surface 711a of each of the two protrusions 71a is in contact with the first dielectric layer 1a. In this embodiment, the 29th main surface 711a of each of the two protrusions 71a is in contact with the 14th main surface 152 of the dielectric layer 15.

[0160] The antenna 100 has multiple (12 in each of the two protrusions 71a) 13th connecting conductors 84 that pass through each of the two protrusions 71a. As shown in Figures 15 and 16, the multiple 13th connecting conductors 84 connect to multiple 5th connecting conductors 65c and to the second ground electrodes 33c and 33d, which will be described later. As a result, the first ground electrode 32b is connected to both the second ground electrodes 33c and 33d.

[0161] As shown in Figure 16, the dielectric layer 71b has a 17th main surface 711b and an 18th main surface 712b. Multiple second ground electrodes 33c and 33d are arranged on the 17th main surface 711b of the dielectric layer 71b. As shown in Figures 13, 15, and 16, the multiple second ground electrodes 33c and 33d are in contact with the 30th main surface 712a of the two protrusions 71a. Therefore, in a plan view from the thickness direction D1 of the first dielectric layer 1a, the two second ground electrodes 33c and 33d overlap with the second conductor portions 29a and 29b.

[0162] The multiple seventh connecting conductors 67 penetrating the dielectric layer 71b include multiple (16 in Figure 16) seventh connecting conductors 67d. The multiple seventh connecting conductors 67d connect the second ground electrodes 33c and 33d to the eighth connecting conductor 68d. As a result, the second ground electrodes 33c and 33d are connected to the second ground electrode 33b (see Figure 17).

[0163] As shown in Figure 16, the second ground electrode 33e is positioned on the 19th main surface 721 of the dielectric layer 72. As shown in Figures 13 and 16, in a plan view from the thickness direction D1 of the first dielectric layer 1a, the second ground electrode 33e does not overlap with either the second ground electrodes 33c or 33d.

[0164] The multiple eighth connecting conductors 68 penetrating the dielectric layer 72 include multiple (16 in Figure 16) eighth connecting conductors 68d. The multiple eighth connecting conductors 68d connect multiple seventh connecting conductors 67d and multiple ninth connecting conductors 69c.

[0165] Furthermore, the first conductor portion 26 and the plurality of pad electrodes 24c, 24d, and 24e, which are arranged on the 13th main surface 151 of the dielectric layer 15, are arranged so that their entire areas overlap with the first ground electrode 32b when viewed from a plan view from the thickness direction D1 of the first dielectric layer 1a. The pad electrodes 24c and 24d are connected to the fourth connecting conductors 64e and 64f, which penetrate the dielectric layer 14. The signal line 25e connecting the pad electrode 24c and the first conductor portion 26, and the signal line 25f connecting the pad electrode 24d and the first conductor portion 26, are both arranged so that their entire areas overlap with the first ground electrode 32b when viewed from a plan view from the thickness direction D1 of the first dielectric layer 1a.

[0166] Multiple pad electrodes 21d to 21g and signal lines 22c and 22d are arranged on the ninth main surface 131 of the dielectric layer 13. Pad electrode 21d is connected to antenna electrode 31a via first connecting conductor 61b and second connecting conductor 62b. Pad electrode 21e is connected to pad electrode 21e via third connecting conductor 63d and fourth connecting conductor 64d. Signal line 22c connects pad electrode 21d and pad electrode 21e. In other words, signal line 22c and signal line 25e are connected in series. This makes it possible to adjust the electrical length between the first conductor portion 26 and antenna electrode 31a using signal line 22c when the electrical length of signal line 25e cannot be made long.

[0167] Similarly, the pad electrode 21f is connected to the antenna electrode 31b via the first connecting conductor 61d and the second connecting conductor 62d. The pad electrode 21g is connected to the pad electrode 21f via the third connecting conductor 63e and the fourth connecting conductor 64e. The signal line 22d connects the pad electrode 21f and the pad electrode 21g. In other words, the signal line 22d and the signal line 25f are connected in series. This makes it possible to adjust the electrical length between the first conductor portion 26 and the antenna electrode 31a using the signal line 22d when the electrical length of the signal line 25f cannot be made long.

[0168] In the antenna 100c according to Embodiment 3, the distance between the second conductor portion 29a and the second ground electrode 33c is longer than the distance between the second conductor portion 29a and the second ground electrode 33a in the antenna 100 according to Embodiment 1. Therefore, it becomes easier to improve the characteristics of the second filter 51 (see Figure 21) including the second conductor portion 29a, particularly the Q value. Also, in the antenna 100c according to Embodiment 3, the distance between the second conductor portion 29b and the second ground electrode 33d is longer than the distance between the second conductor portion 29b and the second ground electrode 33a in the antenna 100 according to Embodiment 1. Therefore, it becomes easier to improve the characteristics of the second filter 52 (see Figure 21) including the second conductor portion 29a, particularly the Q value.

[0169] Furthermore, in the antenna 100c according to Embodiment 3, the elastic modulus of the first dielectric layer 1a is lower than that of the second dielectric layer 7a. Therefore, the thickness of the antenna 100c is less likely to be larger than that of the antenna 100. In the antenna 100c according to this embodiment, the thickness of the portion of the first dielectric layer 1a that overlaps with the protruding portion 71a in a plan view from direction D1 is thinner than the thickness of the portion of the first dielectric layer 1a that does not overlap with the protruding portion 71a in a plan view from direction D1. Therefore, it is possible to make the thickness of the antenna 100c the same as the thickness of the antenna 100.

[0170] (2) In the antenna 100c according to the third embodiment, the second filters 51 and 52 include second conductor portions 29a and 29b. The second conductor portions 29a and 29b are striplines not connected to the ground electrode 32. The second conductor portion 29a is adjacent to the signal line 28a connected to the first filter 53. The second conductor portion 29b is adjacent to the signal line 28b connected to the first filter 54. The second dielectric layer 7a has a protrusion 71a. The protrusion 71a protrudes from the third main surface 701 in the thickness direction D1 of the first dielectric layer 1a. In a plan view from the thickness direction D1 of the first dielectric layer 1a, the protrusion 71a and the second conductor portions 29a and 29b overlap.

[0171] According to the above configuration, the distance between the second conductor portions 29a, 29b and the second ground electrodes 33c, 33d is longer than the distance between the second conductor portions 29a, 29b and the second ground electrode 33a in the antenna 100 according to Embodiment 1. Therefore, it becomes easier to improve the characteristics of the second filters 51, 52 including the second conductor portion 29a, particularly the Q value. Also, since the elastic modulus of the first dielectric layer 1a is lower than that of the second dielectric layer 7a, the thickness of the antenna 100c is less likely to be thicker compared to the thickness of the antenna 100.

[0172] Furthermore, in the antenna 100c according to Embodiment 3, the second dielectric layer 7a has a protruding portion 71a. The protruding portion 71a protrudes from the third main surface 701 in the thickness direction D1 of the first dielectric layer 1a. In a plan view from the thickness direction D1 of the first dielectric layer 1a, the protruding portion 71a and the second conductor portions 29a and 29b overlap.

[0173] According to the above configuration, the distance between the second conductor portions 29a, 29b and the second ground electrodes 33c, 33d is longer than the distance between the second conductor portions 29a, 29b and the second ground electrode 33a in the antenna 100 according to Embodiment 1. Therefore, it becomes easier to improve the characteristics of the second filters 51, 52 including the second conductor portion 29a, particularly the Q value. Also, since the elastic modulus of the first dielectric layer 1a is lower than that of the second dielectric layer 7a, the thickness of the antenna 100c is less likely to be larger compared to the thickness of the antenna 100.

[0174] (Embodiment 4) The antenna 100e according to Embodiment 4 will be described with reference to Figure 18. With respect to the antenna 100e according to Embodiment 4, components that are the same as those of the antenna 100 according to Embodiment 1 (see Figures 1 to 5) are denoted by the same reference numerals and their description is omitted.

[0175] (1) The antenna 100e according to Embodiment 4 differs from the antenna 100 according to Embodiment 1 in that it includes a third dielectric layer 92 with a higher elastic modulus than the first dielectric layer 1, and the first dielectric layer 1 is arranged between the second dielectric layer 7 and the third dielectric layer 92.

[0176] The third dielectric layer 92 is located on the first main surface 101 of the first dielectric layer 1. In other words, the first dielectric layer 1 is located between the second dielectric layer 7 and the third dielectric layer 92 in the thickness direction D1 of the first dielectric layer 1.

[0177] The elastic modulus of the material of the third dielectric layer 92 is higher than that of the first dielectric layer 1. For example, the Young's modulus of the material of the third dielectric layer 92 is between 100 GPa and 400 GPa.

[0178] The material of the third dielectric layer 92 is, for example, an epoxy resin. The third dielectric layer 92 may also contain a substrate containing epoxy resin and a filler.

[0179] The antenna 100e may also have a resist layer covering the third dielectric layer 92.

[0180] In the antenna 100e according to Embodiment 4, the first dielectric layer 1 is arranged between the second dielectric layer 7 and the third dielectric layer 92. Therefore, compared to the antenna 100 according to Embodiment 1 (see Figure 1), which does not have the third dielectric layer 92, deformation of the antenna 100e is less likely to occur. Thus, it is possible to further reduce changes in characteristics due to deformation of the antenna 100e.

[0181] (2) The antenna 100e according to the effect embodiment 4 includes a third dielectric layer 92. The first dielectric layer 1 is arranged between the second dielectric layer 7 and the third dielectric layer 92. The elastic modulus of the third dielectric layer 92 is higher than that of the first dielectric layer 1.

[0182] With the above configuration, deformation of the antenna 100e is less likely to occur compared to a configuration without the third dielectric layer 92. Therefore, it is possible to further reduce changes in characteristics due to deformation of the antenna 100e.

[0183] (Embodiment 5) The antenna module 500 according to Embodiment 5 will be described with reference to Figures 19 to 21. With respect to the antenna module 500 according to Embodiment 5, components that are the same as those of the antenna 100 according to Embodiment 1 (see Figures 1 to 5) are denoted by the same reference numerals and their description is omitted.

[0184] (1) The antenna module 500 according to the antenna module embodiment 5 is used, for example, in a communication device. The communication device is, for example, a mobile phone (e.g., a smartphone), but is not limited to a mobile phone; it may also be, for example, a notebook personal computer, a wearable device (e.g., a smartwatch), etc. The communication device may also be, for example, part of communication equipment such as a wireless base station or a wireless relay station.

[0185] The antenna module 500 according to Embodiment 5, as shown in Figures 19 and 20, comprises one or more (eight in Figure 19) antennas 100, a mounting substrate 510, and one or more (two in Figure 19) signal processing circuits 520. The signal processing circuits 520 are connected to the antennas 100, as shown in Figure 21. More specifically, the signal processing circuits 520 are connected to the feed electrodes 41a and 41b (see Figure 5) of the antennas 100. Furthermore, as shown in Figure 20, the antenna module 500 comprises a plurality of (two in Figure 20) electronic components 530 and connectors 540. Note that in Figure 20, only the first dielectric layer 1 and the second dielectric layer 7 of the antenna 100 are shown, and other components are omitted. Also, in Figure 20, electrodes and via conductors arranged on the mounting substrate 510 are omitted.

[0186] The mounting substrate 510 is, for example, an LTCC substrate. However, the mounting substrate 510 is not limited to an LTCC substrate; for example, it may be a resin multilayer substrate, a printed circuit board, or an HTCC substrate.

[0187] The antenna 100 is located on the 31st main surface 511 of the mounting substrate 510. The antenna 100 is connected to the mounting substrate 510, for example, via bumps.

[0188] Two signal processing circuits 520, two electronic components 530, and a connector 540 are arranged on the 32nd main surface 512 of the mounting board 510. Each of the two signal processing circuits 520 and the two electronic components 530 is connected to the mounting board 510, for example, via bumps.

[0189] The two electronic components 530 include, for example, a chip inductor or a chip capacitor.

[0190] Connector 540 is an external connection terminal that connects to an external circuit (not shown).

[0191] The signal processing circuit 520 includes, for example, an RFIC (Radio Frequency Integrated Circuit). The signal processing circuit 520 and the two electronic components 530 also include, for example, an amplifier, a filter, and a matching circuit.

[0192] The RFIC included in the signal processing circuit 520 performs signal processing, such as upconversion, on the transmission signal output from an external circuit (not shown) connected to the connector 540, and outputs the processed transmission signal. The power amplifier, which is an amplifier included in the signal processing circuit 520, amplifies the transmission signal and outputs it. The amplified transmission signal is input to the feed electrodes 41a and 41b of the antenna 100 via the filter and matching circuit included in the signal processing circuit 520 and the two electronic components 530. The transmission signal input to the feed electrode 41a of the antenna 100 is output from the antenna 55, which includes the antenna electrode 31a, and the antenna 56, which includes the antenna electrode 31b, via the second filter 51, which includes the second conductor portion 29a, and the first filter 53, which includes the first conductor portion 23. The transmission signal input to the feed electrode 41b of antenna 100 is output from antenna 57, which includes antenna electrode 31a, and antenna 58, which includes antenna electrode 31b, via a second filter 52 including a second conductor portion 29b and a first filter 54 including a first conductor portion 26.

[0193] Furthermore, the component of the radio waves received by antenna 100 with polarization plane D3 is output from the feed electrode 41a of antenna 100 via a first filter 53 including a first conductor portion 23 and a second filter 51 including a second conductor portion 29a. Furthermore, the component of the radio waves received by antenna 100 with polarization plane D2 is output from the feed electrode 41b of antenna 100 via a first filter 54 including a first conductor portion 26 and a second filter 52 including a second conductor portion 29b. The received signals output from the feed electrodes 41a and 41b of antenna 100 are input to a low-noise amplifier, which is an amplifier included in the signal processing circuit 520, via filters and matching circuits included in the signal processing circuit 520 and two electronic components 530. The low-noise amplifier amplifies the received signal and outputs it to the RFIC. The RFIC included in the signal processing circuit 520 performs signal processing such as down-conversion on the input received signal and outputs the processed received signal to an external circuit connected to the connector 540.

[0194] Here, the multiple antennas 100 are arranged such that, in a plan view from the thickness direction of the mounting substrate 510, the multiple antenna electrodes 31 are arranged in a straight line at equal intervals. Here, "arranged such that, in a plan view from the thickness direction of the mounting substrate 510, the multiple antenna electrodes 31 are arranged in a straight line at equal intervals" includes the case where the ratio of the distance between two adjacent antenna electrodes 31 to the distance between two other adjacent antenna electrodes 31 is 0.9 or more and 1.1 or less.

[0195] As a result, the antenna module 500 combines the radio waves radiated from each of the multiple antennas 100 and outputs them, thus improving directivity. Furthermore, the antenna module 500 combines the signals received by each of the multiple antennas 100 and performs reception processing, thus improving directivity.

[0196] (2) The antenna module 500 according to the effect embodiment 5 comprises an antenna 100, a mounting board 510, and a signal processing circuit 520. The antenna 100 is arranged on the mounting board 510. The signal processing circuit 520 is arranged on the mounting board 510 and is connected to the antenna 100.

[0197] According to the above configuration, the antenna module 500 makes it possible to achieve both an improvement in the gain of the antenna 100 and miniaturization of the second filters 51 and 52.

[0198] Furthermore, the antenna module 500 according to Embodiment 5 includes a plurality of antennas 100. In a plan view from the thickness direction of the mounting substrate 510, the plurality of antenna electrodes 31 included in the plurality of antennas 100 are arranged at equal intervals in a straight line.

[0199] According to the above configuration, the directivity of the antenna module 500 is improved.

[0200] (Embodiment 6) The antenna module 500a according to Embodiment 6 will be described with reference to Figure 22. With respect to the antenna module 500a according to Embodiment 6, components that are the same as those in the antenna module 500a according to Embodiment 6 (see Figures 19 to 21) are denoted by the same reference numerals and their description is omitted.

[0201] (1) The antenna module 500a according to the configuration embodiment 6 differs from the antenna module 500 according to embodiment 5 in that it includes a mounting board 510a instead of the mounting board 510.

[0202] The mounting substrate 510 is a flexible substrate. The mounting substrate 510 is, for example, a resin multilayer substrate. The material of the mounting substrate 510 is, for example, liquid crystal polymer, polyimide, etc.

[0203] The antenna 100 and connector 540 are located on the 31st main surface 511 of the mounting substrate 510a. The antenna 100 is connected to the mounting substrate 510, for example, via bumps.

[0204] The two signal processing circuits 520 and the two electronic components 530 are arranged on the 32nd main surface 512 of the mounting substrate 510a. Each of the two signal processing circuits 520 and the two electronic components 530 is connected to the mounting substrate 510, for example, via bumps.

[0205] In the antenna module 500a according to Embodiment 6, since the mounting substrate 510 is a flexible substrate, the degree of freedom in the positional relationship between the antenna 100 and the connector 540 is improved. Therefore, in the antenna module 500a, the orientation of the antenna 100 can be adjusted more easily.

[0206] Furthermore, the antenna 100 includes a second dielectric layer 7 with a higher elastic modulus than the first dielectric layer 1. Therefore, even if the mounting substrate 510a is deformed, deformation of the antenna 100 is unlikely to occur.

[0207] (2) In the antenna module 500a according to the effect embodiment 6, the mounting substrate 510a is a flexible substrate.

[0208] According to the above configuration, the orientation of the antenna 100 in the antenna module 500a can be adjusted more easily. Furthermore, since the antenna 100 has a second dielectric layer 7 with a higher elastic modulus than the first dielectric layer 1, deformation of the antenna 100 is less likely to occur even if the mounting substrate 510a is deformed.

[0209] (Modifications) Embodiments 1 to 6 described above are merely one of many embodiments of the present invention. Embodiments 1 to 6 described above can be modified in various ways depending on the design, etc., as long as the objective of the present invention is achieved, and may be combined as appropriate.

[0210] For example, the antenna module 500 or 500a may be equipped with any of the antennas 100a to 100e instead of the antenna 100.

[0211] Furthermore, the antenna 100 includes two antenna electrodes 31, two first conductor sections 23 and 26, two second conductor sections 29a and 29b, and two feed electrodes 41a and 41b. However, it may also have only one antenna electrode 31 and omit the antenna electrodes 31b, first conductor section 26, second conductor section 29b, and feed electrodes 41b. Alternatively, it may have three or more antenna electrodes 31 by providing two or more configurations similar to those of the antenna electrodes 31b, first conductor section 26, second conductor section 29b, and feed electrodes 41b.

[0212] Furthermore, in antennas 100 to 100e, the first filters 53 and 54 are not limited to LPFs, but may be HPFs (High Pass Filters), BPFs (Band Pass Filters), BSFs, etc. Similarly, in antennas 100 to 100e, the second filters 51 and 52 are not limited to BSFs, but may be BPFs, LPFs, HPFs, etc.

[0213] Furthermore, in antennas 100 to 100e, some or all of the multiple first connecting conductors 61 to 9th connecting conductors 69 and 10th connecting conductors 81 to 13th connecting conductors 84 may be replaced with conductors that penetrate through holes. Also, among the multiple first connecting conductors 61 to 9th connecting conductors 69 and 10th connecting conductors 81 to 13th connecting conductors 84, two connecting conductors adjacent in the thickness direction D1 of the first dielectric layer 1 may be connected via pad electrodes or the like.

[0214] In antennas 100 to 100e, the antenna electrode 31 is a square with two sides along direction D2 and two sides along direction D3, but the antenna electrode 31 may be any shape, such as a rectangle or a circle. The antenna electrode 31 may also be a slot antenna with slits. Furthermore, the antenna electrode 31 may be integrally molded with a signal line, stub, etc.

[0215] Antenna 100, 100a, 100b, 100c, 100d, 100e 1, 1a First dielectric layer 101 First main surface 102 Second main surface 11, 12, 13, 14, 15, 16, 16a Dielectric layer 111 Fifth main surface 112 Sixth main surface 121 Seventh main surface 122 Eighth main surface 131 Ninth main surface 132 Tenth main surface 141 Eleventh main surface 142 Twelfth main surface 151 Thirteenth main surface 152 Fourteenth main surface 161, 161a Fifteenth main surface 162, 162a Sixteenth main surface 7, 7a Second dielectric layer 701, 701a Third main surface 702 Fourth main surface 71, 72, 73, 74, 75, 76, 71b Dielectric layer 711, 711b 17th main surface 712, 712b 18th main surface 721 19th main surface 722 20th main surface 731 21st main surface 732 22nd main surface 741 23rd main surface 742 24th main surface 751 25th main surface 752 26th main surface 761 27th main surface 762 28th main surface 763 Outer edge 71a Protrusion 711a 29th main surface 712a 30th main surface 9 Resist layer 92 Third dielectric layer 21, 21a, 21b, 21c, 21d, 21e, 21f, 21g, 24, 24a, 24b, 24c, 24d, 24e, 27, 27a, 27b, 27c, 27d, 27e, 27f, 27g, 27h Pad electrodes 22a, 22b, 22c, 22d, 25a, 25b, 25c, 25d, 25e, 25f, 28a, 28b, 28c, 28d Signal lines 23, 23a, 26, 26a First conductor section 231, 234, 261, 264 First part 232, 235, 262, 265 Second part 29a, 29b, 29c, 29d Second conductor section (isolated conductor section) 291, 292, 293, 294, 295, 296 Conductors 31, 31a, 31b Antenna electrodes 32, 32a, 32b First ground electrode (ground electrode) 33, 33a, 33b, 33c, 33d, 33e Second ground electrode 41 External connection electrode 41a, 41b Feed electrode 41c Ground connection electrode (external connection electrode) 51, 52 Second filter 53, 54 First filter 55, 56, 57, 58 Antenna 61, 61a, 61b, 61c, 61d First connecting conductor62, 62a, 62b, 62c, 62d Second connecting conductor 63, 63a, 63b, 63c Third connecting conductor 64, 64a, 64b, 64c, 64d Fourth connecting conductor 65, 65a, 65b, 65c Fifth connecting conductor 66, 66a, 66b, 66c Sixth connecting conductor 67, 67a, 67b, 67c, 67d Seventh connecting conductor 68, 68a, 68b, 68c, 68d Eighth connecting conductor 69, 69a, 69b, 69c, 69d, 69e Ninth connecting conductor 81, 81a, 81b, 81c, 81d, 81e Tenth connecting conductor 82, 82a, 82b, 82c Eleventh connecting conductor 83, 83a, 83b, 83c Twelfth connecting conductor 84 13th connecting conductor 500, 500a Antenna module 501 Solder 510, 510a Mounting board 511 31st main surface 512 32nd main surface 520 Signal processing circuit 530 Electronic component 540 Connector AR1, AR2 Region D1 direction (thickness direction of the first dielectric layer) D2 direction D3 direction

Claims

1. An antenna comprising: a first dielectric layer having a first main surface and a second main surface; a second dielectric layer having a third main surface in contact with the second main surface of the first dielectric layer and a fourth main surface; an antenna electrode disposed on the first dielectric layer; a ground electrode disposed on the first dielectric layer and located between the antenna electrode and the second dielectric layer; a first filter disposed on the first dielectric layer and connected to the antenna electrode; and a second filter disposed on the second dielectric layer and connected to the first filter, wherein the dielectric constant of the first dielectric layer is lower than that of the second dielectric layer, and the elastic modulus of the first dielectric layer is lower than that of the second dielectric layer.

2. The antenna according to claim 1, wherein the first filter is connected between the antenna electrode and the second filter and includes a first conductor portion which is a microstrip line or strip line disposed between the antenna electrode and the ground electrode in the thickness direction of the first dielectric layer, and in a plan view from the thickness direction of the first dielectric layer, the first conductor portion and the antenna electrode do not overlap.

3. The antenna according to claim 1 or 2, wherein the second filter includes an isolated conductor portion which is a stripline adjacent to the signal line connected to the first filter and not connected to the ground electrode, the second dielectric layer has a projection that protrudes from the third main surface in the thickness direction of the first dielectric layer, and in a plan view of the first dielectric layer from the thickness direction, the projection and the isolated conductor portion overlap.

4. An antenna comprising: a first dielectric layer having a first main surface and a second main surface; a second dielectric layer having a third main surface in contact with the second main surface of the first dielectric layer and a fourth main surface; an antenna electrode disposed on the first dielectric layer; a ground electrode disposed on the first dielectric layer and located between the antenna electrode and the second dielectric layer; a first conductor portion which is a microstrip line or strip line disposed between the antenna electrode and the ground electrode in the thickness direction of the first dielectric layer and connected to the antenna electrode; and a second conductor portion which is a strip line disposed on the second dielectric layer and not connected to the ground electrode, wherein the first conductor portion includes a first portion and a second portion having a different width from the first portion; the second conductor portion is adjacent to a signal line connected to the first conductor portion; the dielectric constant of the first dielectric layer is lower than that of the second dielectric layer; and the elastic modulus of the first dielectric layer is lower than that of the second dielectric layer.

5. In a plan view of the first dielectric layer from the thickness direction, the first conductor portion does not overlap with the antenna electrode, as described in claim 4.

6. The antenna according to claim 4 or 5, wherein the second dielectric layer has a projection that protrudes from the third main surface in the thickness direction of the first dielectric layer, and in a plan view from the thickness direction of the first dielectric layer, the projection and the second conductor overlap.

7. The antenna according to any one of claims 1 to 6, further comprising a plurality of external connection electrodes arranged on the fourth main surface of the second dielectric layer, wherein two or more of the plurality of external connection electrodes arranged along the outer peripheral edge of the second dielectric layer are connected to the ground electrode.

8. The antenna according to any one of claims 1 to 7, further comprising a second ground electrode disposed in the second dielectric layer, which is different from the first ground electrode which is the ground electrode, wherein in a plan view from the thickness direction of the first dielectric layer, the area of ​​the first dielectric layer is larger than the area of ​​the second dielectric layer, and in a plan view from the thickness direction of the first dielectric layer, the first ground electrode has a region that does not overlap with the second ground electrode.

9. The antenna according to any one of claims 1 to 8, further comprising a third dielectric layer, wherein the first dielectric layer is disposed between the second dielectric layer and the third dielectric layer, and the elastic modulus of the third dielectric layer is higher than that of the first dielectric layer.

10. An antenna module comprising: an antenna according to any one of claims 1 to 9; a mounting substrate on which the antenna is arranged; and a signal processing circuit arranged on the mounting substrate and connected to the antenna.

11. The antenna module according to claim 10, wherein the mounting substrate is a flexible substrate.

12. The antenna module according to claim 10 or 11, comprising a plurality of the antennas, wherein, in a plan view from the thickness direction of the mounting substrate, the plurality of antenna electrodes included in the plurality of antennas are arranged at equal intervals in a straight line.

Images