Conductive adhesive member and electronic device comprising same

Abstract

According to various embodiments, an electronic device comprises: a housing including a front cover, a rear cover, and a side member comprising at least one non-conductive portion and at least one conductive portion; a first support member disposed between the front cover and the rear cover; a conductive adhesive member disposed between the first support member and the rear cover; and a wireless communication circuit configured to transmit and / or receive wireless signals in at least one frequency band via the at least one conductive portion, wherein the conductive adhesive member may comprise a first adhesive portion disposed so as to correspond to the at least one non-conductive portion and spaced apart from the at least one non-conductive portion by a first distance, and a second adhesive portion in contact with the at least one conductive portion, or disposed so as to correspond to the at least one conductive portion and spaced apart from the at least one conductive portion by a second distance that is smaller than the first distance.

Description

Conductive adhesive member and electronic device including the same

[0001] The various embodiments disclosed in this document relate to a conductive adhesive member and an electronic device including the same.

[0002] As functional gaps between manufacturers narrow, electronic devices are becoming increasingly slimmer to satisfy consumer purchasing desires. They are also being developed to increase rigidity, enhance design aspects, and differentiate their functional elements. As part of this trend, electronic devices may include at least one antenna among their components that must be provided for communication. Such antennas can be implemented through metal bezels (e.g., side members) used as part of the electronic device's housing and are being developed to improve the antenna's radiation performance.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] The electronic device may include at least one housing (e.g., housing structure) comprising a space for accommodating electronic components. The housing may include a front cover, a rear cover facing the front cover, a side member positioned to surround the space between the front cover and the rear cover, and a first support member extending from the side member into the space. The side member may be formed of a metal (e.g., conductive layer, conductive portion, or conductive material) and a polymer (e.g., non-conductive layer, non-conductive portion, or non-conductive material) to reinforce the rigidity of the electronic device and / or perform a specific function (e.g., antenna function). For example, the side member may include at least one non-conductive portion (e.g., segment) and at least one conductive portion, wherein the at least one non-conductive portion may be positioned between adjacent regions of the at least one conductive portion. The at least one conductive portion may function as at least one antenna operating in at least one frequency band by being electrically connected to a wireless communication circuit of the electronic device.

[0005] Meanwhile, the first support member and the rear cover are joined via an adhesive member, and this joining structure can provide a waterproof space to protect electronic components placed within the internal space of the electronic device from external moisture and / or foreign substances. The adhesive member may include a conductive adhesive (e.g., an ionic adhesive) placed on a substrate layer (e.g., a base layer) to comply with European Union (EU) repair regulations prohibiting the use of heat and to improve electrostatic discharge (ESD). In this conductive adhesive member, the ions of the ionic adhesive are aligned by polarity according to the voltage supply, thereby weakening the adhesive force and inducing easy delamination between the bonded materials.

[0006] For the maintenance of the electronic device, the rear cover needs to be separated from the first support member. In this case, the rear cover can be easily separated from the first support member by supplying voltage to the conductive adhesive member and weakening the adhesive force.

[0007] However, generally, a conductive adhesive member placed along the edge of an electronic device can reduce radiation efficiency by being placed in close proximity to the conductive part of a side member used as an antenna.

[0008] To solve these problems, the conductive adhesive member may have a segmented structure in which the non-conductive portion of the side member and / or the portion corresponding to the feed portion of the antenna is segmented.

[0009] However, with this segmented structure, waterproofing performance may be reduced when the conductive adhesive is used as a waterproofing member. Furthermore, since a voltage supply unit (e.g., positive connection unit and negative connection unit) for supplying voltage must be placed for each of the multiple segmented conductive adhesive parts, there may be difficulties in placement efficiency and voltage supply procedures for maintenance.

[0010] Various embodiments of the present disclosure may provide a conductive adhesive member that can help improve the radiation performance of an antenna and an electronic device including the same.

[0011] Various embodiments of the present disclosure may provide a conductive adhesive member that can help improve waterproof performance and an electronic device including the same.

[0012] Various embodiments of the present disclosure can provide a conductive adhesive member that can help improve ESD through a conductive adhesive member, and an electronic device including the same.

[0013] Various embodiments of the present disclosure can provide a conductive adhesive member and an electronic device including the same that can help with efficient maintenance by minimizing the number of voltage supply units.

[0014] However, the problems intended to be solved by the present disclosure are not limited to the problems mentioned above, and may be expanded in various ways without departing from the concept and adhesive portion of the present disclosure.

[0015] According to various embodiments, the electronic device comprises a housing including a front cover, a rear cover facing in a direction opposite to the front cover, and a side member surrounding the space between the front cover and the rear cover and including at least one non-conductive portion and at least one conductive portion, a first support member extending from the side member into the space, a loop-shaped conductive adhesive member disposed between the first support member and the rear cover, and a wireless communication circuit disposed in the space and transmitting and / or receiving a wireless signal in at least one frequency band through the at least one conductive portion, wherein the conductive adhesive member may include a first adhesive portion spaced apart from the at least one non-conductive portion by a first distance, and a second adhesive portion that is in contact with the at least one conductive portion or spaced apart from the at least one conductive portion by a second distance smaller than the first distance.

[0016] According to various embodiments, the electronic device comprises a housing including a front cover, a rear cover facing in a direction opposite to the front cover, and a side member surrounding the space between the front cover and the rear cover and including at least one non-conductive portion and at least one conductive portion; a first support member extending from the side member into the space; a conductive adhesive member having at least a segmented shape disposed between the first support member and the rear cover; a non-conductive adhesive member disposed in the segmented adhesive portion of the conductive adhesive member between the first support member and the rear cover; and a wireless communication circuit disposed in the space and transmitting and / or receiving a wireless signal in at least one frequency band through the at least one conductive portion, wherein at least a portion of the conductive adhesive member is connected to the non-conductive adhesive member to form a loop shape, and the conductive adhesive member may include a first adhesive portion spaced apart from the at least one non-conductive portion by a first distance, and a second adhesive portion that is in contact with the at least one conductive portion or spaced apart from the at least one conductive portion by a second distance smaller than the first distance.

[0017] According to various embodiments, the electronic device may comprise a housing including a front cover, a rear cover facing opposite to the front cover, and a side member surrounding the space between the front cover and the rear cover and comprising at least one non-conductive portion and at least one conductive portion; a first support member disposed between the front cover and the rear cover; a conductive adhesive member disposed between the first support member and the rear cover and at least partially surrounding the space; and a wireless communication circuit disposed in the space and transmitting and / or receiving a wireless signal in at least one frequency band through the at least one conductive portion. The conductive adhesive member may comprise a first adhesive portion disposed to correspond to the at least one non-conductive portion and spaced apart from the at least one non-conductive portion by a first distance; and a second adhesive portion disposed to contact or correspond to the at least one conductive portion and spaced apart from the at least one conductive portion by a second distance smaller than the first distance.

[0018] An electronic device according to exemplary embodiments of the present disclosure may include a loop-shaped conductive adhesive member, and the conductive adhesive member may help improve antenna radiation performance by being spaced apart from a non-conductive portion of a side member and / or a feed portion of an antenna, and the conductive adhesive member may help improve waterproof performance of an electronic component placed inside the electronic device by being formed in a loop shape, and the conductive adhesive member may be separated from a first support member by receiving voltage through a voltage supply unit, and may guide static electricity flowing into the interior of the electronic device to ground through a voltage supply unit used as ground.

[0019] An electronic device according to exemplary embodiments of the present disclosure may include a conductive adhesive member comprising segmented adhesive portions and a non-conductive adhesive member disposed in the segmented adhesive portions of the conductive adhesive member, wherein the conductive adhesive member may help improve antenna radiation performance by being disposed spaced apart from the non-conductive portion of a side member and / or the feed portion of an antenna, and the conductive adhesive member may help improve the waterproof performance of an electronic component disposed inside the electronic device by being connected to the non-conductive adhesive member and formed in a loop shape, and the conductive adhesive member may be separated from a first support member by receiving voltage through a voltage supply unit, and may guide static electricity flowing into the interior of the electronic device to ground through a voltage supply unit used as ground.

[0020] In addition, various effects identified directly or indirectly through this document may be provided.

[0021] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0022] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0023] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0024] FIG. 2a is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0025] FIG. 2b is a perspective view of the rear of the electronic device of FIG. 2a according to various embodiments of the present disclosure.

[0026] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to various embodiments of the present disclosure.

[0027] FIG. 4a is an enlarged view of an electronic device according to various embodiments of the present disclosure.

[0028] FIG. 4b is a drawing in which a conductive adhesive member according to various embodiments of the present disclosure is peeled off from a side member by supplying voltage.

[0029] FIG. 4c is a partial configuration diagram of a conductive adhesive member according to various embodiments of the present disclosure.

[0030] FIG. 4d is a partial configuration diagram of a conductive layer according to various embodiments of the present disclosure.

[0031] FIG. 5 is a partial configuration diagram of an electronic device including a conductive adhesive member according to various embodiments of the present disclosure.

[0032] FIG. 6a is a partial configuration diagram of a conductive adhesive member spaced apart from a non-conductive portion of a side member and a feed portion of a wireless communication circuit according to various embodiments of the present disclosure.

[0033] FIG. 6b is an enlarged view of the adhesive portion 6b of FIG. 6a according to various embodiments of the present disclosure.

[0034] FIG. 7 is a graph comparing the first antenna radiation performance of a non-conductive adhesive member, a conductive adhesive member, a conductive adhesive member spaced apart from a non-conductive portion of a side member, a non-conductive portion of a side member, and a conductive adhesive member spaced apart from a feed portion of a wireless communication circuit according to various embodiments of the present disclosure.

[0035] FIG. 8 is a graph comparing the second antenna radiation performance of a non-conductive adhesive member, a conductive adhesive member, a conductive adhesive member spaced apart from a non-conductive portion of a side member, a non-conductive portion of a side member, and a conductive adhesive member spaced apart from a feed portion of a wireless communication circuit according to various embodiments of the present disclosure.

[0036] FIG. 9 is a graph comparing the third antenna radiation performance of a non-conductive adhesive member, a conductive adhesive member, a conductive adhesive member spaced apart from a non-conductive portion of a side member, a conductive adhesive member spaced apart from a non-conductive portion of a side member and a feed portion of a wireless communication circuit according to various embodiments of the present disclosure.

[0037] FIG. 10 is a partial configuration diagram of a conductive adhesive member and a non-conductive adhesive member spaced apart from a non-conductive portion of a side member and a feed portion of a wireless communication circuit according to various embodiments of the present disclosure.

[0038] FIG. 11 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0039] FIGS. 12a to 12e are diagrams of a conductive layer according to various embodiments of the present disclosure.

[0040] FIGS. 13a and FIGS. 13b are drawings in which a rear cover is attached to a first support member by means of a conductive adhesive member and a conductive layer according to various embodiments of the present disclosure.

[0041] FIG. 14 is a partial configuration diagram of a conductive adhesive member according to various embodiments of the present disclosure.

[0042] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0043] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0044] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0045] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0046] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0047] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0048] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0049] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0050] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0051] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0052] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0053] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0054] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0055] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0056] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0057] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0058] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0059] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0060] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0061] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0062] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0063] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0064] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0065] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0066] FIG. 2a is a front perspective view of an electronic device according to various embodiments. FIG. 2b is a rear perspective view of the electronic device of FIG. 2a according to various embodiments.

[0067] The electronic device (200) of FIGS. 2a and 2b may be at least partially similar to the electronic device (101) of FIG. 1, or may include other embodiments of the electronic device.

[0068] Referring to FIG. 2a and FIG. 2b, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In other embodiments (not shown), the housing (210) may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C). According to one embodiment, the first surface (210A) may be formed by a front cover (202) (e.g., a glass plate or a polymer plate comprising various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear cover (211) that is substantially opaque. The rear cover (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side member (or "side bezel structure") (218) comprising metal and / or polymer, which is combined with the front cover (202) and the rear cover (211). In some embodiments, the rear cover (211) and the side member (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0069] In one embodiment, the front cover (202) may include a first region (210D) that is curved seamlessly from the first surface (210A) toward the rear plate at both ends of the long edge of the front plate. In one embodiment, the rear cover (211) may include a second region (210E) that is curved seamlessly from the second surface (210B) toward the front plate at both ends of the long edge. In some embodiments, the front cover (202) or the rear cover (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front cover (202) and the rear cover (211) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side member (218) may have a first thickness (or width) on the side side that does not include the first region (210D) or the second region (210E) as above, and may have a second thickness that is thinner than the first thickness on the side side that includes the first region or the second region.

[0070] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or an indicator) or additionally include other components.

[0071] The display (201) may be exposed, for example, through a substantial portion of the front cover (202). In some embodiments, at least a portion of the display (201) may be exposed through the front cover (202) forming the first surface (210A) and the first area (210D) of the side (210C). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0072] The input device (203) may include a microphone. In some embodiments, the input device (203) may include a plurality of microphones positioned to detect the direction of sound. The sound output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be positioned in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used for both the microphone and the speakers. In some embodiments, the sound output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates with the hole formed in the housing (210) excluded. In some embodiments, the electronic device (200) may include a tray member positioned through at least a portion of the side member (218).

[0073] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). The fingerprint sensor (e.g., ultrasonic or optical fingerprint sensor) may be disposed below the display (201) on the first surface (210A). The electronic device (200) may further include at least one of an unillustrated sensor module, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0074] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (200), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0075] A key input device (217) may be placed on the side (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input device (217) not included may be implemented in other forms, such as soft keys, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0076] The indicator may be placed, for example, on a first surface (210A) of the housing (210). The indicator may, for example, provide status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may, for example, provide a light source that is coupled with the operation of the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0077] The connector hole (208) may include a first connector hole (208) capable of accommodating a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) capable of accommodating a connector for transmitting and receiving audio signals with an external electronic device.

[0078] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be positioned to be exposed through the display (201). For example, the camera module (205), sensor module (204), or indicator may be positioned to come into contact with the external environment through an opening or a transparent area perforated to the front cover (202) of the display (201) within the internal space of the electronic device (200). In one embodiment, the area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of the area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. This transparent area may include an area that overlaps with the effective area (e.g., field of view area) of the camera module (205) through which light passes to form an image and generate an image by being formed by an image sensor. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In another embodiment, some sensor modules (204) may be positioned to perform their functions without being visually exposed through the front cover (202) within the internal space of the electronic device. For example, in this case, the perforated opening may be unnecessary for the area of ​​the display (201) facing the sensor modules.

[0079] According to various embodiments, the side member (218) may include a first side (218-1) having a first length, a second side (218-2) extended from one end of the first side (218-1) to have a second length in a direction perpendicular to the first side (218a) (e.g., -y-axis direction), a third side (218-3) extended from the second side (218-2) to have a first length substantially parallel to the first side (218-1), and a fourth side (218-4) extended from the third side (218-3) to the other end of the first side (218-1) to have a second length substantially parallel to the second side (218-2).

[0080] According to various embodiments, the electronic device (200) may include non-conductive portions (321, 322, 323, 324, 325, 326, 327) (e.g., segments or gaps) and conductive portions (311, 312, 313, 314, 315, 316, 317) disposed in at least some of the side members (218). In one embodiment, the non-conductive portions may be disposed between the conductive portions. For example, non-conductive parts (321, 322, 323, 324, 325, 326, 327) may be placed between conductive parts (311, 312, 313, 314, 315, 316, 317) along a direction parallel to the first plane (210A) (e.g., a direction parallel to the xy plane of FIG. 2a and 2b). In one embodiment, during the manufacturing process of the side member (218) and / or electronic device (200), conductive parts (311, 312, 313, 314, 315, 316, 317) may be formed first, and then non-conductive parts (321, 322, 323, 324, 325, 326, 327) may be formed in the space between the conductive parts (311, 312, 313, 314, 315, 316, 317) (e.g., through an insert injection process). In one embodiment, when the electronic device (200) is viewed from above (e.g., in the z-axis direction), the side member (218) may appear to be segmented into conductive parts (311, 312, 313, 314, 315, 316, 317) by non-conductive parts (321, 322, 323, 324, 325, 326, 327).

[0081] According to various embodiments, the conductive parts (311, 312, 313, 314, 315, 316, 317) comprise a first conductive part (311) disposed between a spaced-apart first non-conductive part (321) and a second non-conductive part (322), a second conductive part (312) disposed between a spaced-apart first non-conductive part (321) and a third non-conductive part (323), a third conductive part (313) disposed between a spaced-apart third non-conductive part (323) and a fifth non-conductive part (325), a fourth conductive part (314) disposed between a spaced-apart fourth non-conductive part (324) and a second non-conductive part (322), and a fifth conductive part disposed between a spaced-apart fifth non-conductive part (325) and a seventh non-conductive part (327). It may include a portion (315), a sixth conductive portion (316) disposed between a spaced-apart sixth non-conductive portion (326) and a fourth non-conductive portion (324), and / or a seventh conductive portion (317) disposed between a spaced-apart seventh non-conductive portion (327) and a sixth non-conductive portion (326). In one embodiment, the first conductive portion (311) may be disposed to extend from a portion of the first side (218-1) to a portion of the fourth side (218-4) through a first non-conductive portion (321) disposed on the first side (218-1) and a second non-conductive portion (322) disposed on the fourth side (218-4). The second conductive portion (312) may be positioned to extend from a portion of the first side (218-1) to a portion of the second side (218-2) through a first non-conductive portion (312) positioned on the first side (218-1) and a third non-conductive portion (323) positioned on the second side (218-2). The third conductive portion (313) may be positioned on a portion of the second side (218-2) through a third non-conductive portion (323) positioned on the second side (218-2) and a fifth non-conductive portion (325) positioned on the second side (218-2).The fourth conductive portion (314) may be positioned in part of the fourth side (218-4) through the second non-conductive portion (322) positioned in the fourth side (218-4) and the fourth non-conductive portion (324) positioned in the fourth side (218-4). The fifth conductive portion (315) may be positioned to extend from part of the second side (218-2) to part of the third side (218-3) through the third non-conductive portion (323) positioned in the second side (218-2) and the seventh non-conductive portion (327) positioned in the third side (218-3). The sixth conductive portion (316) may be positioned to extend from a portion of the third side (218-3) to a portion of the fourth side (218-4) through the sixth non-conductive portion (326) positioned on the third side (218-3) and the fourth non-conductive portion (324) positioned on the fourth side (218-4). The seventh conductive portion (317) may be positioned on a portion of the third side (218-3) through the sixth non-conductive portion (326) positioned on the third side (218-3) and the seventh non-conductive portion (327) positioned on the third side (218-3). In one embodiment, the first, second, third, fourth, fifth, sixth, and seventh conductive parts (311, 312, 313, 314, 315, 316, 317) can be operated as antennas selectively or simultaneously in multiple frequency bands through a plurality of conductive lines (e.g., feed lines) electrically connected to a wireless communication circuit (e.g., wireless communication module (192) of FIG. 1). Although seven conductive parts (311, 312, 313, 314, 315, 316, 317) and seven non-conductive parts (321, 322, 323, 324, 325, 326, 327) are shown in FIG. 2a and 2b, they are not limited thereto, and it is obvious that other numbers and arrangements of conductive and non-conductive parts may also be used.

[0082] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to various embodiments.

[0083] Referring to FIG. 3, the electronic device (200) may include a side member (218), a first support member (2181) (e.g., a bracket, or a front housing), a front cover (202) (e.g., a front plate), a display (201), a printed circuit board (240), a battery (250), a second support member (260) (e.g., a rear housing), an antenna (270), and a rear cover (211) (e.g., a rear plate). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the first support member (2181), or the second support member (260)) or additionally include other components. At least one of the components of the electronic device (200) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2a or FIG. 2b, and redundant descriptions are omitted below.

[0084] According to various embodiments, the first support member (2181) may be disposed inside the electronic device (200). For example, the first support member (2181) may be disposed between the front cover (202) and the rear cover (211). For example, the first support member (2181) may be structurally coupled to the side member (218) or formed integrally with the side member (218). The first support member (2181) may be formed from, for example, a metal material and / or a non-metal (e.g., a polymer) material. The first support member (2181) may have a display (201) coupled to one side and a printed circuit board (240) coupled to the other side. A processor, memory, and / or interface may be mounted on the printed circuit board (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, the display (201) may be positioned to be supported by a first support member (2181).

[0085] Memory may include, for example, volatile memory or non-volatile memory.

[0086] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD (secure digital) card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (200) to an external electronic device and may include a USB connector, an SD card / MMC (multi-media card) connector, or an audio connector.

[0087] The battery (250) is a device for supplying power to at least one component of the electronic device (200) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially coplanar with, for example, the printed circuit board (240). The side member (218) may include a first support member (2181) that extends at least partially into the internal space from the side of the electronic device (200) (e.g., the side (210C) of FIG. 2a). The battery (250) may be disposed between the first support member (2181) and the rear cover (211). At least a portion of the printed circuit board (240) may be connected to the battery (250). In some embodiments, the battery (250) may be integrally disposed inside the electronic device (200). In some embodiments, the printed circuit board (240) may be positioned between the first support member (2181) and the front cover (202). In one embodiment, the battery (250) may be positioned so as to be detachable from the electronic device (200).

[0088] An antenna (270) may be positioned between the rear cover (211) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In other embodiments, the antenna structure may be formed by a part or combination thereof of the side member (218) and / or the first support member (2181).

[0089] According to various embodiments, the side member (218) may include non-conductive portions (321, 322, 323, 324, 325, 326, 327) and conductive portions (e.g., conductive portions of FIG. 2a and FIG. 2b (311, 312, 313, 314, 315, 316, 317)). The conductive portions form at least a portion of the side of the electronic device (200) and may be positioned so as to be visible from the outside. For example, at least one of the first, second, third, and fourth sides (218-1, 218-2, 218-3, 218-4) of the side member (218) can be configured to operate in a specified frequency band (e.g., a legacy band in the range of about 600 MHz to 6000 MHz) by being electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) placed on a printed circuit board of the electronic device (200) (e.g., a printed circuit board (240) of FIG. 3) through conductive parts.

[0090] FIG. 4a is an enlarged view of an electronic device according to various embodiments of the present disclosure. FIG. 4b is a diagram showing a conductive adhesive member being peeled off from a side member by supplying voltage according to various embodiments of the present disclosure. FIG. 4c is a partial configuration diagram of a conductive adhesive member according to various embodiments of the present disclosure. FIG. 4d is a partial configuration diagram of a conductive layer according to various embodiments of the present disclosure.

[0091] Referring to FIGS. 4a, 4b, 4c, and 4d, the electronic device (200) may include a side member (218), a first support member (2181), a conductive adhesive member (400), a conductive layer (500), and a rear cover (211). The conductive adhesive member (400) may include a substrate layer (403), a voltage supply layer (402) (e.g., a voltage application layer) disposed on a first surface of the substrate layer (403), a first adhesive layer (401) laminated on the voltage supply layer (402), and a second adhesive layer (404) disposed on a second surface opposite to the first surface of the substrate layer (403). In one embodiment, the substrate layer (403) may include a polymer sheet (e.g., PET, or TPU material). In one embodiment, the voltage supply layer (402) may include a conductive layer (e.g., a metal sheet) electrically connected to a battery of the electronic device. In some embodiments, the voltage supply layer (402) may be replaced (or may include) a conductive paint applied to the substrate layer (403). In one embodiment, the first adhesive layer (401) may include a conductive adhesive (e.g., an ionic adhesive) containing ions of different polarities. In one embodiment, the first adhesive layer (401) may be attached to a conductive layer (500) positioned at a location corresponding to the conductive adhesive member (400) on the inner surface of the rear cover (211). In one embodiment, the conductive layer (500) may include a metal sheet, a conductive adhesive, or a conductive paint and may be positioned on the inner surface of the rear cover (211). In some embodiments, if the rear cover (211) is formed of a conductive material (e.g., metal), the conductive layer (500) may be omitted. In one embodiment, the second adhesive layer (404) may include a non-conductive adhesive layer (e.g., PSA) for attachment to the first support member (2181). At least one of the components of the electronic device (200) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 3, and redundant descriptions are omitted below.

[0092] According to various embodiments, the conductive adhesive member (400) and / or the conductive layer (500) may be arranged to at least partially surround the space between the front cover (202) and the rear cover (211). For example, the conductive adhesive member (400) and / or the conductive layer (500) may be formed in a loop shape. By forming the conductive adhesive member (400) and / or the conductive layer (500) in a continuous closed loop shape, moisture entering the space between the side member (e.g., the side member (218) of FIG. 3) and the rear cover (e.g., the rear cover (211) of FIG. 3) may be blocked. For example, the first adhesive layer (401), the substrate layer (403), and the second adhesive layer (404) may be formed in corresponding shapes.

[0093] According to various embodiments, the conductive adhesive member (400) may include a second-1 adhesive portion (431), a second-2 adhesive portion (432) extending from one end of the second-1 adhesive portion (431), a second-3 adhesive portion (not shown) extending from the second-2 adhesive portion (432) to be at least partially parallel to the second-1 adhesive portion (431), and a second-4 adhesive portion (434) extending from the second-3 adhesive portion to be at least partially parallel to the second-2 adhesive portion (432). At least a portion of the 2-1 adhesive portion (431), 2-2 adhesive portion (432), 2-3 adhesive portion, and 2-4 adhesive portion (434) may be positioned parallel to the edges of the side member (e.g., the first side (218-1), second side (218-2), third side (218-3), and fourth side (218-4) of FIG. 3). The conductive layer (500) may include a 5-1 adhesive portion (531), a 5-2 adhesive portion (532) extending from one end of the 5-1 adhesive portion (531), a 5-3 adhesive portion (not shown) extending from the 5-2 adhesive portion (532) so as to be at least partially parallel to the 5-1 adhesive portion (531), and a 5-4 adhesive portion (534) extending from the 5-3 adhesive portion so as to be at least partially parallel to the 5-2 adhesive portion (532). At least a portion of the 5-1 adhesive portion (531), the 5-2 adhesive portion (532), the 5-3 adhesive portion, and the 5-4 adhesive portion (534) may be arranged parallel to the edge of the side member. The 2-1 adhesive portion (431) and the 5-1 adhesive portion (531) may be arranged parallel to at least partially the first side (218-1). The 2-2 adhesive portion (432) and the 5-2 adhesive portion (532) may be positioned so as to be at least partially parallel to the 2nd side (218-2). The 2-3 adhesive portion and the 5-3 adhesive portion may be positioned so as to be at least partially parallel to the 3rd side (218-3).The 2-4 adhesive portion (434) and the 5-4 adhesive portion (534) may be positioned so as to be at least partially parallel to the 4th side (218-4).

[0094] According to various embodiments, the conductive adhesive member (400) and the conductive layer (500) may be formed in corresponding shapes. The first adhesive portion (e.g., first segmental spaced adhesive portion (421), second segmental spaced adhesive portion (422), and / or third segmental spaced adhesive portion (423)), second adhesive portion (e.g., second-1 adhesive portion (431), second-2 adhesive portion (432), second-3 adhesive portion (not shown), and / or second-4 adhesive portion (434))), and / or third adhesive portion (e.g., first feed portion spaced adhesive portion (411), second feed portion spaced adhesive portion (412), and / or third feed portion spaced adhesive portion (413)) of the conductive adhesive member (400) is the fourth adhesive portion (e.g., fourth segmental spaced adhesive portion (521), fifth segmental spaced adhesive portion (522), and / or sixth segmental spaced adhesive portion (523)), and fifth adhesive portion (e.g., It may be formed in a shape corresponding to the 5-1 adhesive portion (531), 5-2 adhesive portion (532), 5-3 adhesive portion (not shown), and / or 5-4 adhesive portion (534)), and / or 6 adhesive portion (e.g., 4th feed portion spaced adhesive portion (511), 5th feed portion spaced adhesive portion (512), and / or 6th feed portion spaced adhesive portion (513)). For example, the 1st feed portion spaced adhesive portion (411) of the conductive adhesive member (400) may be formed in a shape corresponding to the 4th feed portion spaced adhesive portion (511) of the conductive layer (500).

[0095] According to various embodiments, the conductive adhesive member (400) may be disposed between the first support member (2181) and the rear cover (211). At least a portion of the conductive layer (500) may be disposed between the rear cover (211) and the conductive adhesive member (400). The rear cover (211) may be attached to the first support member (2181) through the conductive adhesive member (400). The conductive adhesive member (400) may be attached to the first support member (2181) through a second adhesive layer (404). The conductive layer (500) (the conductive layer (500) that may be disposed on the rear cover (211)) may be attached to the first support member (2181) through the adhesive force of the first adhesive layer (401) of the conductive adhesive member (400). Accordingly, the rear cover (211) can be attached to the first support member (2181) through a conductive adhesive member (400) (and a conductive layer (500)). The first adhesive layer (401) is positioned between the conductive layer (500) and the substrate layer (403) so that the conductive layer (500) and the substrate layer (403) can be bonded. The substrate layer (403) is positioned between the first adhesive layer (401) and the second adhesive layer (404) so ​​that the first adhesive layer (401) and the second adhesive layer (404) can be bonded. The second adhesive layer (404) is positioned between the first support member (2181) and the substrate layer (403) so that the first support member (2181) and the substrate layer (403) can be bonded. The first adhesive layer (401) can be formed from an ionic adhesive material in which cations and anions are arranged. The substrate layer (403) may be formed from an adhesive material on which an electrically conductive substrate is deposited. The second adhesive layer (404) may be formed from a non-conductive adhesive material.

[0096] According to various embodiments, the electronic device (200) may include a voltage supply connected to at least a portion of the conductive adhesive member (400) and at least a portion of the conductive layer (500). The voltage supply may be connected to at least a portion of a printed circuit board (e.g., the printed circuit board (240) of FIG. 3). In one embodiment, when the conductive adhesive member (400) is separated from the conductive layer (500), power from a battery (e.g., the battery (250) of FIG. 3) may be delivered to the voltage supply, which may be done, for example, through a switching circuit of the printed circuit board. In one embodiment, by separating the conductive adhesive member (400) from the conductive layer (500) through a switching circuit (e.g., the switching circuit of the printed circuit board), the first support member (2181) and the rear cover (211) may be separated. In this case, an electronic component (e.g., battery (250) of FIG. 3) placed between the first support member (2181) and the rear cover (211) can be repaired by a worker. In one embodiment, the voltage supply may be positioned in such a way that it extends into the internal space of the electronic device (200) from at least a portion of the conductive adhesive member (400) and at least a portion of the conductive layer (500). For example, the voltage supply may include an extension portion (e.g., positive connection portion (441)) extending into the internal space (e.g., the internal space of the shape or loop formed by the conductive layer (500)) from at least a portion of the voltage supply layer (402) of the conductive adhesive member (400), and an extension portion (e.g., negative connection portion (542)) extending into the internal space (e.g., the internal space of the shape or loop formed by the conductive layer (500)) from at least a portion of the conductive layer (500). In some embodiments, the positive connection (not shown) may extend into the internal space from at least a portion of the conductive layer (500), and the negative connection (not shown) may extend into the internal space from at least a portion of the voltage supply layer (402).In one embodiment, the voltage supply may be electrically connected to at least a portion of the conductive adhesive member (400) and at least a portion of the conductive layer (500). In some embodiments, the voltage connection may be directly connected to the battery. For example, the positive connection (441) may be connected to the positive electrode of the battery, and the negative connection (542) may be connected to the negative electrode of the battery.

[0097] According to various embodiments, a battery (e.g., the battery (250) of FIG. 3) may include a positive electrode and a negative electrode. In one embodiment, the positive electrode connection (441) of the voltage supply may be electrically connected to the positive electrode of the battery through a switching circuit (e.g., the switching circuit of the printed circuit board (240) of FIG. 3). The negative electrode connection (542) of the voltage supply may be electrically connected to the negative electrode of the battery or ground (e.g., the reference potential of a wireless signal transmitted and / or received in a wireless communication circuit (e.g., the wireless communication circuit (192) of FIG. 1). In one embodiment, the positive electrode connection (441) of the voltage supply may be directly connected to the positive electrode of the battery. The negative electrode connection (542) of the voltage supply may be connected to the negative electrode of the battery or ground through a switching circuit (e.g., the switching circuit of the printed circuit board (240) of FIG. 3).

[0098] According to various embodiments, the positive connection (441) of the voltage supply unit is connected to at least a portion of the conductive adhesive member (400) and can be connected to the positive of the battery (e.g., the battery (250) of FIG. 3) through a switching circuit (e.g., the switching circuit of the printed circuit board (240) of FIG. 3). Power supplied from the battery (e.g., the battery (250) of FIG. 3) to the voltage supply unit (e.g., the positive connection (441) and the negative connection (542)) can be amplified through an electronic component (e.g., the switching circuit) of the printed circuit board (e.g., the printed circuit board (240) of FIG. 3). When power is supplied to the positive connection (441), power can be supplied to the voltage supply layer (402) extending from the positive connection (441). When power is supplied to the negative connection (542), power can be supplied to the conductive layer (500) extending from the negative connection (542). In one embodiment, when power is supplied to each of the voltage supply layer (402) and the conductive layer (500), a potential difference may occur between the voltage supply layer (402) and the conductive layer (500). In one embodiment, when a potential difference occurs between the voltage supply layer (402) and the conductive layer (500), the cations and anions contained in the first adhesive layer (401) may be rearranged so that they are grouped together with the same polarity. As a result, the bonding force between the first adhesive layer (401) and the conductive layer (500) is reduced, and the conductive adhesive member (400) may be separated from the conductive layer (500).

[0099] According to various embodiments, the negative terminal connection (542) of the voltage supply unit is connected to at least a portion of the conductive layer (500) and may be connected to the negative terminal of a battery (e.g., battery (250) of FIG. 3) or to ground (e.g., reference potential of a wireless signal transmitted and / or received in a wireless communication circuit (e.g., wireless communication circuit (192) of FIG. 1). The negative terminal connection may help improve electrostatic discharge (e.g., electrostatic discharge) by inducing static electricity flowing into the space between the front cover (e.g., front cover (202) of FIG. 3) and the rear cover (211) to ground.

[0100] According to various embodiments, the side member (218) may be configured such that at least a portion of the side of the electronic device (200) (e.g., the side (210C) in FIG. 2a) and the first support member (2181) (e.g., the conductive portions (311, 312, 313, 314, 315, 316, 317) in FIG. 2a and 2b) is formed of a conductive material (218a) (e.g., metal), and the remaining portion of the side of the electronic device (200) and the first support member (2181) (e.g., non-conductive portions (321, 322, 323, 324, 325, 326, 327)) is formed of a non-conductive material (218b) (e.g., polymer). The side member (218) may be configured such that the conductive portions (e.g., the conductive portions in FIG. 2a and 2b) It can be formed through a combination of parts (311, 312, 313, 314, 315, 316, 317)) and / or non-conductive parts (e.g., non-conductive parts (321, 322, 323, 324, 325, 326, 327)).

[0101] FIG. 5 is a partial configuration diagram of an electronic device including a conductive adhesive member according to various embodiments of the present disclosure. FIG. 5 is a diagram showing the internal structure of an electronic device with the rear cover removed.

[0102] Referring to FIG. 5, the electronic device (200) may include a first antenna (A1) operating through a first conductive portion (311), and / or a second antenna (A2) and a third antenna (A3) operating through a second conductive portion (312). For example, the first, second, and third antennas (A1, A2, A3) may be configured as upper antennas positioned on the upper side of the electronic device (200). In one embodiment, the first conductive portion (311) may have a first electrical length through a first non-conductive portion (321) and a second non-conductive portion (322). For example, the electrical length of the first conductive part (311) may be the distance between the first non-conductive part (321) and the second non-conductive part (322). The second conductive part (312) may have a second electrical length through the first non-conductive part (321) and the third non-conductive part (323). For example, the electrical length of the second conductive part (312) may be the distance between the first non-conductive part (321) and the third non-conductive part (323). For example, the second electrical length may be formed to be equal to or shorter than the first electrical length. In one embodiment, the antennas (A1, A2, A3) may operate in at least one frequency band among a low band of about 600 MHz to 960 MHz, a mid band of about 1700 MHz to 2200 MHz, a high band of about 2300 MHz to 2800 MHz, a sub-6 band of about 5 GHz to 6 GHz, a UHB band of about 3.2 GHz to 4.5 GHz, BT (Bluetooth), GPS (Global Positioning System), or WIFI (Wireless Fidelity).

[0103] According to various embodiments, the side member (218) may include at least one feed portion in which the first and second conductive portions (311, 312) are electrically connected to the first, second, and third wireless communication circuits (F1, F2, F3). According to non-limiting embodiments, the first, second, and third wireless communication circuits (F1, F2, F3) may be distinguished as three wireless communication circuits, but may be one or more wireless communication circuits. In one embodiment, the feed portion may include a first feed portion (LA1), a second feed portion (LA2), and / or a third feed portion (LA3). For example, the first conductive portion (311) can be used as a first antenna (A1) operating in a low band by being electrically connected to a first feed portion (LA1) at a first point (L1) or a first-1 point (L1-1) with a first wireless communication circuit (F1) (e.g., the wireless communication module (192) of FIG. 1) placed on a printed circuit board (e.g., the printed circuit board (240) of FIG. 3). The second conductive portion (312) can be used as a second antenna (A2) operating in a mid band by being electrically connected to a second feed portion (LA2) at a second point (L2), a second-1 point (L2-1), or a second-2 point (L2-2) with a second wireless communication circuit (F2) (e.g., the wireless communication module (192) of FIG. 1) placed on a printed circuit board. The second conductive portion (312) can be used as a third antenna (A3) operating in the high band and / or UHB band by being electrically connected to the third feed portion (LA3) at the third point (L3) or the third-1 point (L3-1) and the third wireless communication circuit (F3) (e.g., the wireless communication module (192) of FIG. 1) placed on the printed circuit board.

[0104] According to various embodiments, the electronic device (200) may include a voltage supply unit (e.g., a positive connection unit (441) and, e.g., a negative connection unit (542) of FIG. 4d) connected to at least a portion of a conductive adhesive member (400) and at least a portion of a conductive layer (e.g., a conductive layer (500) of FIG. 4a). In one embodiment, the positive connection unit (441) may be connected to at least a portion of a printed circuit board (e.g., a printed circuit board (240) of FIG. 3). The positive connection unit (441) may be electrically connected to the positive terminal of a battery (e.g., a battery (250) of FIG. 3) through a switching circuit (e.g., a switching circuit of the printed circuit board). The positive connection unit (441) may be connected to at least a portion of the conductive adhesive member (400) and connected to the positive terminal of the battery through a switching circuit (e.g., a switching circuit of the printed circuit board). In one embodiment, the negative connection is connected to at least a portion of the conductive layer (500) and may be connected to the negative electrode or ground of the battery (e.g., the reference potential of a wireless signal transmitted and / or received in a wireless communication circuit (e.g., the wireless communication circuit (192) of FIG. 1). In one embodiment, when power is supplied to the substrate layer (403) and the conductive layer (500) to separate the conductive adhesive member (400) from the conductive layer (500), power from the battery may be transferred to the positive connection (441) and / or the negative connection through a switching circuit (e.g., a switching circuit of a printed circuit board).

[0105] According to various embodiments, the conductive adhesive member (400) may be positioned in close proximity to a first conductive portion (311) used as a first antenna (A1) and / or a second conductive portion (312) used as a second antenna (A2) and a third antenna (A3), and due to this close proximity, the first antenna (A1), the second antenna (A2), and the third antenna (A3) may be subject to interference and their radiation performance may be reduced.

[0106] According to various embodiments, the conductive adhesive member (400) is spaced apart from the first non-conductive portion (321), the second non-conductive portion (322), and / or the third non-conductive portion (323), thereby reducing interference received by the first antenna (A1), the second antenna (A2), and / or the third antenna (A3) and helping to improve radiation performance. In one embodiment, the conductive adhesive member (400) may include a first adhesive portion (e.g., a segmented adhesive portion) spaced apart from the first, second, and third non-conductive portions (321, 322, 323) by a first distance (e.g., the first distance (S1) in FIG. 6b). In one embodiment, the positive connection (441) and / or the negative connection (e.g., the negative connection of FIG. 4d) may be positioned so as not to overlap with the first adhesive portion when the rear cover (e.g., the rear cover (211) of FIG. 4a) is viewed from above (e.g., in the z-axis direction).

[0107] According to various embodiments, the first adhesive portion may include one or more segmental spaced adhesive portions (which may also be referred to as closely spaced adhesive portions). The segmental spaced adhesive portions may be positioned to correspond to non-conductive portions. For example, the first adhesive portion may include a first segmental spaced adhesive portion (421), a second segmental spaced adhesive portion (422), and / or a third segmental spaced adhesive portion (423). In one embodiment, the distance between the first segmental spaced adhesive portion (421) and the first non-conductive portion (321) may be set to be greater than the distance between the first conductive portion (311). The first segmental spaced adhesive portion (421) may be positioned spaced from the first non-conductive portion (321) by a first distance (e.g., the first distance (S1) in FIG. 6b). For example, the first distance can be measured from the inner surface of the first non-conductive portion (321) (or, at the point where the first conductive portion (311) and the second conductive portion (312) meet the first non-conductive portion (321), a line parallel to the inner surface of the first conductive portion and the second conductive portion) to the outer surface of the nearest first segmental gap adhesive portion (421) in a direction perpendicular to the inner surface of the first non-conductive portion (321) (e.g., y-axis direction). The second-1 adhesive portion (431) may be positioned parallel to the first conductive portion (311), and the first segmental gap adhesive portion (421) may be positioned spaced apart from the first non-conductive portion (321) by the first distance. For example, the first segmental spaced adhesive portion (421) may be part of a conductive adhesive member (400) positioned to correspond to the first non-conductive portion (321). For example, when the electronic device is viewed from above (e.g., in the y-axis direction), at least a portion of the first segmental spaced adhesive portion (421) may be aligned with or overlap with the first non-conductive portion (321).In one embodiment, the distance between the second segmental gap adhesive portion (422) and the second non-conductive portion (322) may be set to be greater than the distance between the first conductive portion (311) and the fourth conductive portion (314). The second segmental gap adhesive portion (422) may be positioned at a distance from the second non-conductive portion (322) by a first distance. For example, the first distance may be measured from the inner surface of the second non-conductive portion (322) (or a line parallel to the inner surface of the first conductive portion and the fourth conductive portion at the point where the first conductive portion (311) and the fourth conductive portion (314) meet the second non-conductive portion (322)) to the outer surface of the closest second segmental gap adhesive portion (422) in a direction perpendicular to the inner surface of the second non-conductive portion (322) (e.g., x-axis direction). The second-fourth adhesive portion (434) may be positioned parallel to the first conductive portion (311), and the second segmental spaced adhesive portion (422) may be positioned spaced apart from the second non-conductive portion (322) by a first distance. For example, the second segmental spaced adhesive portion (422) may be part of a conductive adhesive member (400) positioned to correspond to the second non-conductive portion (322). For example, when the electronic device is viewed from the side (e.g., when viewed in the x-axis direction), at least a portion of the second segmental spaced adhesive portion (422) may be aligned with or overlap the second non-conductive portion (322). In one embodiment, the distance between the third segmental spaced adhesive portion (423) and the third non-conductive portion (323) may be set to be greater than the distance between the second conductive portion (312) and the third conductive portion (313). The second-2 adhesive portion (432) may be spaced apart from the third non-conductive portion (323) by a first distance. The second-2 adhesive portion (432) may be spaced parallel to the second conductive portion (312) and the third conductive portion (313), and the third segmental spaced adhesive portion (423) may be spaced apart from the third non-conductive portion (323) by a first distance.For example, the third segmental gap adhesive portion (423) may be part of a conductive adhesive member (400) positioned to correspond to the third non-conductive portion (323). For example, when the electronic device is viewed from the side (e.g., in the x-axis direction), at least a portion of the third segmental gap adhesive portion (423) may be aligned with or overlap the third non-conductive portion (323). For example, the first distance may be measured from the inner surface of the third non-conductive portion (323) (or a line parallel to the inner surface of the second conductive portion and the third conductive portion at the point where the second conductive portion (312) and the third conductive portion (313) meet the third non-conductive portion (323)) to the outer surface of the nearest third segmental gap adhesive portion (423) in a direction perpendicular to the inner surface of the third non-conductive portion (323) (e.g., in the x-axis direction). In one embodiment, the first distance may be set to about 0.7 mm or more. In one embodiment, the first distance may be set to about 2 mm or more. In one embodiment, the first distance may be set to about 0.7 mm or more and 2 mm or less.

[0108] According to various embodiments, the second adhesive portion may include one or more closely spaced adhesive portions (which may be referred to as second-n adhesive portions). The closely spaced adhesive portions may be positioned to correspond to the conductive portions. For example, the second adhesive portion may include a second-1 adhesive portion (431), a second-2 adhesive portion (432), a second-3 adhesive portion (not shown), and / or a second-4 adhesive portion (434). In one embodiment, the second-1 adhesive portion (431) may be in contact with the first conductive portion (311) or positioned at a second distance (e.g., the second distance (S2) in FIG. 6b) from the first conductive portion (311). For example, the second distance may be measured from the inner surface of the first conductive portion (311) to the outer surface of the nearest second-1 adhesive portion (431) in a direction perpendicular to the inner surface of the first conductive portion (311). In one embodiment, the second-2 adhesive portion (432) may be in contact with the first conductive portion (311) and / or the third conductive portion (313), or spaced apart from the first conductive portion (311) and / or the third conductive portion (313) by a second distance. For example, the second distance may be measured from the inner surface of the first conductive portion (311) and / or the third conductive portion (313) to the outer surface of the nearest second-2 adhesive portion (432) in a direction perpendicular to the inner surface of the first conductive portion (311) and / or the third conductive portion (313). In one embodiment, the second-4 adhesive portion (434) may be in contact with the first conductive portion (311) and / or the fourth conductive portion (314), or spaced apart from the first conductive portion (311) and / or the fourth conductive portion (314) by a second distance. For example, the second distance can be measured from the inner surface of the first conductive part (311) and / or the fourth conductive part (314) to the outer surface of the nearest (2-4) secondary adhesive part (434) in a direction perpendicular to the inner surface of the first conductive part (311) and / or the fourth conductive part (314).In one embodiment, the second distance may be set to be smaller than the first distance.

[0109] According to various embodiments, the positive connection (441) and / or negative connection (e.g., negative connection (542) of FIG. 4d) are spaced apart from the first, second, and third non-conductive parts (321, 322, 323) and / or the first, second, and third feed parts (LA1, LA2, LA3), thereby reducing interference received by the first antenna (A1), the second antenna (A2), and / or the third antenna (A3). For example, the positive connection (441) and / or the negative connection (e.g., the negative connection (542) of FIG. 4d) may be positioned so as not to overlap with the first to third non-conductive parts (321, 322, 323) and / or the first to third feed parts (LA1, LA2, LA3) when the rear cover (e.g., the rear cover (211) of FIG. 4a) is viewed from above (e.g., when viewed in the z-axis direction). For example, the positive connection (441) and / or the negative connection (e.g., the negative connection (542) of FIG. 4d) may be positioned so as to be spaced apart from the first to third non-conductive portions (321, 322, 323) and / or the first to third feed portions (LA1, LA2, LA3) by at least a predetermined distance, wherein the predetermined distance may be calculated to reduce interference received by the first antenna (A1), the second antenna (A2) and / or the third antenna (A3). For example, the predetermined distance may be at least the first distance. The positive connection (441) may be formed by extending from at least a portion of the second-fourth adhesive portion (434) of the conductive adhesive member (400). The negative connection may be formed by extending from at least a portion of the fifth-second adhesive portion (532) of the conductive layer (500). In one embodiment, at least a portion of the positive connection portion (441) may be connected to the positive electrode of the battery and to the second-fourth adhesive portion (434) of the conductive adhesive member (400). At least a portion of the negative connection portion may be connected to the negative electrode of the battery and to the fifth-second adhesive portion (532) of the conductive layer (500).In one embodiment, the positive connection (441) may be formed by extending from at least a portion of the 5-4 adhesive portion (534) of the conductive layer (500). The negative connection may be formed by extending from at least a portion of the 2-2 adhesive portion (432) of the conductive adhesive member (400).

[0110] FIG. 6a is a partial configuration diagram of a conductive adhesive member spaced apart from a non-conductive portion of a side member and a feed portion of a wireless communication circuit according to various embodiments of the present disclosure. FIG. 6b is an enlarged view of a portion of the adhesive portion of FIG. 6a according to various embodiments of the present disclosure.

[0111] Referring to FIGS. 6a and 6b, the conductive adhesive member (400-1) is spaced apart from the first non-conductive portion (321), the second non-conductive portion (322), the third non-conductive portion (323), the first feed portion (LA1), the second feed portion (LA2), and / or the third feed portion (LA3), thereby reducing interference received by the first antenna (A1), the second antenna (A2), and / or the third antenna (A3). The conductive adhesive member (400-1) may include a third adhesive portion (e.g., a feed-separated adhesive portion) spaced apart by a second distance (S2) from the first, second, and third feed portions (LA1, LA2, LA3). In one embodiment, the positive connection (441) and / or the negative connection (e.g., the negative connection (542) of FIG. 4d) may be positioned so as not to overlap with the first adhesive portion (e.g., the first segmental spaced adhesive portion (421), the second segmental spaced adhesive portion (422), and / or the third segmental spaced adhesive portion (423)) and / or the third adhesive portion when the rear cover (e.g., the rear cover (211) of FIG. 4a) is viewed from above (e.g., in the z-axis direction). At least one of the components of the conductive adhesive member (400-1) may be identical or similar to at least one of the components of the conductive adhesive member (400) of FIG. 4a through 5, and redundant descriptions are omitted below.

[0112] According to various embodiments, the third adhesive portion may include one or more feed-part spaced adhesive portions (which may also be referred to as adjacent spaced adhesive portions). The feed-part spaced adhesive portions may be arranged to correspond to the feed-parts. For example, the third adhesive portion may include a first feed-part spaced adhesive portion (411), a second feed-part spaced adhesive portion (412), and / or a third feed-part spaced adhesive portion (413). In one embodiment, the first feed-part spaced adhesive portion (411) may be arranged spaced apart from the first feed-part (LA1) by a third distance (S3). For example, the third distance may be measured from the surface of the first feed-part (LA1) facing the first feed-part spaced adhesive portion (411) to the outer surface of the nearest first feed-part spaced adhesive portion (411) in a direction perpendicular to the surface of the first feed-part (LA1) (e.g., the y-axis direction). The second power supply separation adhesive portion (412) may be positioned separated from the second power supply (LA2) by a third distance (S3). For example, the third distance may be measured from the surface of the second power supply (LA2) facing the second power supply separation adhesive portion (412) to the outer surface of the nearest second power supply separation adhesive portion (412) in a direction perpendicular to the surface of the second power supply (LA2) (e.g., y-axis direction). The second-1 adhesive portion (431) may be positioned parallel to the first conductive portion (311). The first power supply separation adhesive portion (411) may be positioned separated from the first power supply (LA1) by a third distance (S3). The second power supply separation adhesive portion (412) may be positioned separated from the second power supply (LA2) by a third distance (S3). In one embodiment, the third feed unit spacing adhesive portion (413) may be spaced apart from the third feed unit (LA3) by a third distance (S3).For example, the third distance can be measured from the surface of the third power supply (LA3) facing the third power supply separation adhesive portion (413) to the outer surface of the nearest third power supply separation adhesive portion (413) in a direction perpendicular to the surface of the third power supply (LA3) (e.g., x-axis direction). The second-2 adhesive portion (432) is arranged parallel to the second conductive portion (312) and the third conductive portion (313), and the third power supply separation adhesive portion (413) can be arranged spaced apart from the third power supply (LA3) by a third distance (S3). In one embodiment, the third distance (S3) can be set to about 0.7 mm or more. In one embodiment, the third distance (S3) can be set to about 2 mm or more. In one embodiment, the third distance (S3) can be set to about 0.7 mm or more and 2 mm or less.

[0113] According to various embodiments, the second-1 adhesive portion (431) may be positioned parallel to the first conductive portion (311). The first segmental gap adhesive portion (421) may be positioned spaced apart from the first non-conductive portion (321) by a first distance. The first power supply gap adhesive portion (411) may be positioned spaced apart from the first power supply portion (LA1) by a third distance (S3). The second power supply gap adhesive portion (412) may be positioned spaced apart from the second power supply portion (LA2) by a third distance (S3). In one embodiment, the second-4 adhesive portion (434) may be positioned parallel to the first conductive portion (311). The second segmental gap adhesive portion (422) may be positioned spaced apart from the second non-conductive portion (322) by a first distance. In one embodiment, the second-2 adhesive portion (432) may be positioned parallel to the second conductive portion (312) and the third conductive portion (313). The third segmental spaced adhesive portion (423) may be positioned spaced apart from the third non-conductive portion (323) by a first distance. The third feed portion spaced adhesive portion (413) may be positioned spaced apart from the third feed portion (LA3) by a third distance (S3). In one embodiment, the third distance (S3) may be set to be greater than the second distance (S2). In one embodiment, the third distance (S3) may be set to be smaller than the first distance (S1).

[0114] FIG. 7 is a graph comparing the first antenna radiation performance of a non-conductive adhesive member, a conductive adhesive member, a conductive adhesive member spaced apart from a non-conductive portion of a side member, a non-conductive portion of a side member, and a conductive adhesive member spaced apart from a feed portion of a wireless communication circuit according to various embodiments of the present disclosure.

[0115] Referring to FIG. 7, compared to a comparative example (e.g., graph 702) in which corresponding portions of a conductive adhesive member (400) corresponding to a first non-conductive portion (321) and a second non-conductive portion (322) are arranged to have the same proximity distance as a portion adjacent to a first conductive portion (311), according to an exemplary embodiment of the present disclosure, a first case (e.g., graph 703) in which corresponding portions of a conductive adhesive member (400) corresponding to a first non-conductive portion (321) and a second non-conductive portion (322) are spaced apart by a first distance (e.g., the first distance (S1) in FIG. 6b) that is relatively farther than a portion adjacent to a first conductive portion (311) and / or a first case in which corresponding portions of a conductive adhesive member (400) corresponding to the first and second non-conductive portions (321, 322) and a first feed portion (LA1) are relatively farther than a portion adjacent to a first conductive portion (311). In the second case (e.g., graph 704) where the antenna is separated by a distance (e.g., the first distance (S1) in FIG. 6b) or a third distance (e.g., the third distance (S3) in FIG. 6b), it can be seen that the first antenna (A1) operating through the first conductive part (311) exhibits excellent radiation performance in a specific frequency band (e.g., low band) (e.g., a frequency band in the range of about 600 MHz to 960 MHz or the adhesive part 705).

[0116] Furthermore, in the first and second cases according to the exemplary embodiments of the present disclosure, it can be confirmed that the radiation performance of the first antenna (A1) is substantially equivalent to the radiation performance when the conductive adhesive member is replaced with a non-conductive adhesive member or when the conductive adhesive member is not applied (e.g., graph 701).

[0117] FIG. 8 is a graph comparing the second antenna radiation performance of a non-conductive adhesive member, a conductive adhesive member, a conductive adhesive member spaced apart from a non-conductive portion of a side member, a non-conductive portion of a side member, and a conductive adhesive member spaced apart from a feed portion of a wireless communication circuit according to various embodiments of the present disclosure.

[0118] Referring to FIG. 8, compared to a comparative example (e.g., graph 802) in which corresponding portions of the conductive adhesive member (400) corresponding to the first non-conductive portion (321) and the third non-conductive portion (323) are arranged to have the same proximity distance as the portion adjacent to the second conductive portion (312), according to an exemplary embodiment of the present disclosure, a first case (e.g., graph 803) in which corresponding portions of the conductive adhesive member (400) corresponding to the first non-conductive portion (321) and the third non-conductive portion (323) are spaced apart by a first distance (e.g., the first distance (S1) in FIG. 6b) that is relatively farther than the portion adjacent to the second conductive portion (312) and / or a first case in which corresponding portions of the conductive adhesive member (400) corresponding to the first and third non-conductive portions (321, 323) and the second feed portion (LA2) are relatively farther than the portion adjacent to the second conductive portion (312) In the second case (e.g., graph 804) where the antenna is separated by a distance (e.g., the first distance (S1) in FIG. 6b) or a third distance (e.g., the third distance (S3) in FIG. 6b), it can be seen that the second antenna (A2) operating through the second conductive part (312) exhibits excellent radiation performance in a specific frequency band (e.g., mid band) (e.g., a frequency band in the range of about 1700 MHz to 2200 MHz or the adhesive part 805).

[0119] Furthermore, in the first and second cases according to the exemplary embodiments of the present disclosure, it can be confirmed that the radiation performance of the second antenna (A2) is substantially equivalent to the radiation performance when the conductive adhesive member is replaced with a non-conductive adhesive member or when the conductive adhesive member is not applied (e.g., graph 801).

[0120] FIG. 9 is a graph comparing the third antenna radiation performance of a non-conductive adhesive member, a conductive adhesive member, a conductive adhesive member spaced apart from a non-conductive portion of a side member, a conductive adhesive member spaced apart from a non-conductive portion of a side member and a feed portion of a wireless communication circuit according to various embodiments of the present disclosure.

[0121] Referring to FIG. 9, compared to a comparative example (e.g., graph 902) in which corresponding portions of the conductive adhesive member (400) corresponding to the first non-conductive portion (321) and the third non-conductive portion (323) are arranged to have the same proximity distance as the portion adjacent to the second conductive portion (312), according to an exemplary embodiment of the present disclosure, a first case (e.g., graph 903) in which corresponding portions of the conductive adhesive member (400) corresponding to the first non-conductive portion (321) and the third non-conductive portion (323) are spaced apart by a first distance (e.g., the first distance (S1) in FIG. 6b) that is relatively farther than the portion adjacent to the second conductive portion (312) and / or a first case in which corresponding portions of the conductive adhesive member (400) corresponding to the first and third non-conductive portions (321, 323) and the second feed portion (LA2) are relatively farther than the portion adjacent to the second conductive portion (312) In the second case (e.g., graph 904) where the antenna is separated by a distance (e.g., the first distance (S1) in FIG. 6b) or a second distance (e.g., the second distance (S2) in FIG. 6b), it can be seen that the third antenna (A3) operating through the second conductive part (312) exhibits excellent radiation performance in a specific frequency band (e.g., high band and / or UHB band) (e.g., a frequency band in the range of about 2300 MHz to 2800 MHz and / or about 3.2 GHz to 4.5 GHz or the adhesive part 905).

[0122] Furthermore, in the first and second cases according to the exemplary embodiments of the present disclosure, it can be confirmed that the radiation performance of the third antenna (A3) is substantially equivalent to the radiation performance when the conductive adhesive member is replaced with a non-conductive adhesive member or when the conductive adhesive member is not applied (e.g., graph 901).

[0123] FIG. 10 is a partial configuration diagram of a conductive adhesive member and a non-conductive adhesive member spaced apart from a non-conductive portion of a side member and a feed portion of a wireless communication circuit according to various embodiments of the present disclosure.

[0124] Referring to FIG. 10, a conductive adhesive member (400-2) may be formed by connecting a conductive adhesive portion (430a) that is at least partially segmented and a non-conductive adhesive portion (430b) disposed on the segmented adhesive portion of the conductive adhesive member. At least a portion of the conductive adhesive member (400-2) (e.g., the segmented conductive adhesive portion (430a)) may be connected to the non-conductive adhesive portion (430b) to form a shape that at least partially surrounds the space between the front cover (202) and the rear cover (211). For example, the conductive adhesive member (400-2) may be formed in a loop shape by connecting the non-conductive adhesive portion (430b) to at least a portion (431c, 431d) of the second-first adhesive portion (431) of the conductive adhesive portion (430a). For example, one end of the non-conductive adhesive portion (430b) may be connected to the first part (431c) of the second-1 adhesive portion (431), and the other end of the non-conductive adhesive portion (430b) may be connected to the second part (431d) of the second-1 adhesive portion (431). By forming the adhesive member (400) in a continuous closed loop shape, foreign substances such as dust or moisture entering the space between the front cover (e.g., the front cover (202) of FIG. 3) and the rear cover (e.g., the rear cover (211) of FIG. 3) can be blocked. At least one of the components of the conductive adhesive member (400-2) may be identical or similar to at least one of the components of the conductive adhesive member (400) of FIG. 4a to 5 and / or the conductive adhesive member (400-1) of FIG. 6a and 6b, and redundant descriptions are omitted below.

[0125] According to various embodiments, the second-1 adhesive portion (431) of the conductive adhesive portion (430a) may be formed by segmenting the adhesive portion adjacent to the second non-conductive portion (321) (e.g., by introducing a gap). A conductive layer (not shown) may be formed to correspond to the shape of the conductive adhesive portion (430a). In one embodiment, the positive connection portion (441) may be formed by extending from one end (431a) of the segmented adhesive portion of the second-1 adhesive portion (431). The negative connection portion (not shown) may be formed by extending from one end (not shown) of the segmented adhesive portion of the fifth-1 adhesive portion (not shown). In one embodiment, at least a portion of the positive connection portion (441) may be electrically connected to one end (431a) of the segmented adhesive portion of the second-1 adhesive portion (431). At least a portion of the cathode connection can be electrically connected to one end of the segmented adhesive portion of the 5-1 adhesive portion.

[0126] FIG. 11 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0127] Referring to FIG. 11, the electronic device (200) may include a side member (218), a first support member (2181), a conductive adhesive member (400-3), a conductive layer (500-1), and a rear cover (211). The conductive adhesive member (400-3) may include a substrate layer (403), a voltage supply layer (402-1) disposed on one side of the substrate layer (403), a first adhesive layer (401) laminated on the voltage supply layer (402-1), and a second adhesive layer (404) disposed on the other side of the substrate layer (403). The voltage supply layer (402-1) may be formed by segmenting into a first voltage supply layer (402a) and a second voltage supply layer (402b). The conductive layer (500-1) may be formed by segmenting into a first conductive layer (501a) and a second conductive layer (501b). At least one of the components of the conductive adhesive member (400-3) may be identical or similar to at least one of the components of the conductive adhesive member (400) of FIGS. 4a to 5, the conductive adhesive member (400-1) of FIGS. 6a and 6b, and / or the conductive adhesive member (400-2) of FIG. 10, and redundant descriptions are omitted below. At least one of the components of the voltage supply layer (402-1) may be identical or similar to at least one of the components of the voltage supply layer (402) of FIGS. 4a to 10, and redundant descriptions are omitted below.

[0128] According to various embodiments, the first adhesive layer (401) and the second adhesive layer (404) are formed in a loop shape, and the substrate layer (403) may be disposed on at least a portion of the first adhesive layer (401) and the second adhesive member (404). By forming the first adhesive layer (401) and / or the second adhesive layer (404) in a continuous closed loop shape, foreign substances such as moisture entering the space between the side member (218) and the rear cover (211) can be blocked. The first adhesive layer (401) and / or the second adhesive layer (404) may be formed in a corresponding shape.

[0129] According to various embodiments, the conductive voltage supply layer (402-1) may be formed by segmenting into a first voltage supply layer (402a) and a second voltage supply layer (402b) so as to be positioned to avoid antennas (e.g., the first, second, and third antennas (A1, A2, A3) of FIG. 5) placed in the electronic device (200). The conductive layer (501-1) may be formed by segmenting into a first conductive layer (501a) and a second conductive layer (501b) so as to be positioned to avoid antennas placed in the electronic device (200). In this case, interference received by the antennas can be reduced, and the radiation performance of the antennas can be improved.

[0130] According to various embodiments, the voltage supply unit may include an anode connection (e.g., anode connection (441) of FIG. 4c) extending into an internal space from at least a portion of the voltage supply layer (402-1), and a cathode connection (e.g., cathode connection (542) of FIG. 4d) extending into an internal space from at least a portion of the conductive layer (500-1). When power is supplied to the anode connection, power may be supplied to the voltage supply layer (402-1). When power is supplied to the cathode connection, power may be supplied to the second conductive layer (500-1). In one embodiment, when power is supplied to the voltage supply layer (402-1) and the conductive layer (500-1), the cations and anions contained in the first adhesive layer (401) may be rearranged so that they are grouped together with the same polarity. As a result, the bonding force between the first adhesive layer (401) and the conductive layer (500-1) is reduced, and the conductive adhesive member (400-3) can be separated from the conductive layer (500).

[0131] FIGS. 12a to 12e are diagrams of a conductive layer according to various embodiments. The conductive layer may include a plurality of adhesive portions that are at least partially segmented by one or more segmented regions corresponding to one or more non-conductive portions. The segmented adhesive portions may be connected to one another by one or more connecting portions.

[0132] Referring to FIG. 12a, in one embodiment, the conductive layer (500-2) may include a 5-2 adhesive portion (532-1), a 5-3 adhesive portion (533-1), and a 5-4 adhesive portion (534-1) that are at least partially segmented. The conductive layer (500-2) may be formed by segmenting portions corresponding to non-conductive portions (e.g., a first non-conductive portion (321), a second non-conductive portion (322), a fourth non-conductive portion (324), a sixth non-conductive portion (326), and / or a seventh non-conductive portion (327)) disposed on at least part of a side member (e.g., a side member (218) of FIG. 2a) of an electronic device (e.g., an electronic device (200) of FIG. 2a). The 5-2 adhesive portion (532-1) and the 5-4 adhesive portion (534-1) can be electrically connected through the first connecting portion (551). The conductive layer (500-2) can be applied in various shapes depending on the shape of the internal space of the electronic device (e.g., the electronic device (200) of FIG. 3), and can be designed considering the arrangement structure with surrounding electronic components or structures. At least one of the components of the conductive layer (500-2) may be identical or similar to at least one of the components of the conductive layer (500) of FIG. 4a through FIG. 10 and / or the conductive layer (500-1) of FIG. 11, and redundant descriptions are omitted below.

[0133] According to various embodiments, a conductive adhesive member (not shown) may be formed to correspond to the shape of a conductive layer (500-2). In one embodiment, the conductive layer (500-2) may include a first cathode connection (542-1) extending into an internal space from a 5-4 adhesive portion (534-1) and a second cathode connection (542-2) extending into an internal space from a 5-3 adhesive portion (533-1). An anode connection (not shown) may be formed extending into an internal space from at least a portion of the conductive adhesive member. In one embodiment, the first cathode connection (542-1) and the second cathode connection (542-2) may be electrically connected to the conductive layer (500-2). The anode connection may be electrically connected to the conductive adhesive member.

[0134] According to various embodiments, the conductive layer (500-2) may include one or more segmented regions. The segmented regions may be gaps in the conductive layer (500-2) and may be arranged to correspond to non-conductive portions. For example, the conductive layer (500-2) may include a first segmented region (561), a second segmented region (562), and / or a third segmented region (563). At least a portion of the first segmented region (561) may be formed to correspond to the first non-conductive portion (321) and the second non-conductive portion (322). At least a portion of the second segmented region (562) may be formed to correspond to the fourth non-conductive portion (324) and the sixth non-conductive portion (326). The third segmented region (563) may be formed to correspond to the seventh non-conductive portion (327). The conductive layer (500-2) is spaced apart from the first, second, fourth, sixth, and seventh non-conductive portions (321, 322, 324, 326, 327), thereby reducing interference received by the first antenna (A1) and / or the second antenna (A2) and helping to improve radiation performance.

[0135] Referring to FIG. 12b, in one embodiment, the 5-3 adhesive portion (533-1) of the conductive layer (500-3) may be electrically connected to the 5-2 adhesive portion (532-1) and the 5-4 adhesive portion (534-1) through the 1 connection portion (551) and the 2 connection portion (552). A conductive adhesive member (not shown) may be formed to correspond to the shape of the conductive layer (500-3). In one embodiment, the conductive layer (500-3) may include a negative connection portion (542-1) extending into the internal space from the 5-4 adhesive portion (534-1). A positive connection portion (not shown) may be formed extending into the internal space from at least a portion of the conductive adhesive member. In one embodiment, the negative connection portion (542-1) may be electrically connected to the conductive layer (500-2). The positive connection portion may be electrically connected to the conductive adhesive member. At least one of the components of the conductive layer (500-3) may be identical or similar to at least one of the components of the conductive layer (500) of FIGS. 4a to 10, the conductive layer (500-1) of FIG. 11, and / or the conductive layer (500-2) of FIG. 12a, and redundant descriptions are omitted below.

[0136] Referring to FIG. 12c, in one embodiment, the conductive layer (500-4) may include a 5-1 adhesive portion (531-1), a 5-2 adhesive portion (532-1), a 5-3 adhesive portion (533-1), and a 5-4 adhesive portion (534-1), at least partially segmented. The 5-3 adhesive portion (533-1) may be electrically connected to the 5-4 adhesive portion (534-1) through a third connecting portion (553). The 5-1 adhesive portion (531-1) may be electrically connected to the 5-2 adhesive portion (532-1) and the 5-4 adhesive portion (534-1) through a first connecting portion (551) and a fourth connecting portion (554). The conductive layer (500-2) may include a first-1 segmented region (561-1), a first-2 segmented region (561-2), a second segmented region (562), and / or a third segmented region (563). At least a portion of the first-1 segmented region (561-1) may be formed to correspond to the second non-conductive portion (322). At least a portion of the first-2 segmented region (561-2) may be formed to correspond to the first non-conductive portion (321). By being spaced apart from the first, second, fourth, sixth, and seventh non-conductive portions (321, 322, 324, 326, 327), the conductive layer (500-2) may reduce interference received by the first antenna (A1) and / or the second antenna (A2) and help improve radiation performance. At least one of the components of the conductive layer (500-4) may be identical or similar to at least one of the components of the conductive layer (500) of FIGS. 4a to 10, the conductive layer (500-1) of FIG. 11, the conductive layer (500-2) of FIG. 12a, the conductive layer (500-3) of FIG. 12b, and / or the conductive layer (500-4) of FIG. 12c, and redundant descriptions are omitted below.

[0137] Referring to FIG. 12d, in one embodiment, the 5-3 adhesive portion (533-1) of the conductive layer (500-5) may be electrically connected to the 5-2 adhesive portion (532-1) and the 5-4 adhesive portion (534-1) through the 5th connection portion (555). The conductive layer (500-2) may include a 1-1 segmented region (561-1), a 1-3 segmented region (561-3), a 2 segmented region (562), and / or a 3 segmented region (563). At least a portion of the 1-3 segmented region (561-3) may be formed to correspond to the 2 non-conductive portion (322) and the 3 non-conductive portion (323). The conductive layer (500-2) is spaced apart from the first, second, third, fourth, sixth, and seventh non-conductive portions (321, 322, 323, 324, 326, 327), thereby reducing interference received by the first antenna (A1), the second antenna (A2), and / or the third antenna (A3), and helping to improve radiation performance. At least one of the components of the conductive layer (500-5) may be identical or similar to at least one of the components of the conductive layer (500) of FIGS. 4a to 10, the conductive layer (500-1) of FIG. 11, the conductive layer (500-2) of FIG. 12a, the conductive layer (500-3) of FIG. 12b, and / or the conductive layer (500-4) of FIG. 12c, and redundant descriptions are omitted below.

[0138] Referring to FIG. 12e, in one embodiment, the 5-1 adhesive portion (531-1) of the conductive layer (500-6) may be electrically connected to the 5-2 adhesive portion (532-1), the 5-3 adhesive portion (533-1), and the 5-4 adhesive portion (534-1) through the 6th connection portion (556). The 6th connection portion (556) may function as a negative connection portion (542-3). For example, the negative connection portion (542-3) may be formed as at least a part of the 6th connection portion (556). At least one of the components of the conductive layer (500-6) may be identical or similar to at least one of the components of the conductive layer (500) of FIGS. 4a to 10, the conductive layer (500-1) of FIG. 11, the conductive layer (500-2) of FIG. 12a, the conductive layer (500-3) of FIG. 12b, the conductive layer (500-4) of FIG. 12c, and / or the conductive layer (500-5) of FIG. 12d, and redundant descriptions are omitted below.

[0139] FIGS. 13a and FIGS. 13b are drawings in which a rear cover is attached to a first support member by means of a conductive adhesive member and a conductive layer according to various embodiments.

[0140] Referring to FIG. 13a, in one embodiment, a conductive adhesive member (400-4) may comprise a substrate layer (403-1), a voltage supply layer (402) disposed on one side of the substrate layer (403-1), a first adhesive layer (401) laminated on the voltage supply layer (402), and a second adhesive layer (404-1) disposed on the other side of the substrate layer (403-1). The substrate layer (403-1) and / or the second adhesive layer (404-1) may comprise a non-conductive waterproof material. The substrate layer (403-1) and / or the second adhesive layer (404-1) may be disposed parallel to the edges of a side member (e.g., the first side (218-1), second side (218-2), third side (218-3), and fourth side (218-4) of FIG. 3). The substrate layer (403-1) and / or the second adhesive layer (404-1) may be formed in a continuous closed loop shape. Foreign substances, such as dust or moisture, entering the space between the front cover (e.g., the front cover (202) of FIG. 3) and the rear cover may be blocked through the substrate layer (403-1) and / or the second adhesive layer (404-1). At least one of the components of the conductive adhesive member (400-4) may be identical or similar to at least one of the components of the conductive adhesive member (400) of FIG. 4a to 5, the conductive adhesive member (400-1) of FIG. 6a and 6b, the conductive adhesive member (400-2) of FIG. 10, and / or the conductive adhesive member (400-3) of FIG. 11, and redundant descriptions are omitted below. At least one of the components of the substrate layer (403-1) may be identical or similar to at least one of the components of the substrate layer (403) of FIGS. 4a to 11, and redundant descriptions are omitted below. At least one of the components of the second adhesive layer (404-1) may be identical or similar to at least one of the components of the second adhesive layer (404) of FIGS. 4a to 11, and redundant descriptions are omitted below.

[0141] Referring to FIG. 13b, in one embodiment, the electronic device (200) may include a voltage supply connected to at least a portion of the conductive adhesive member (400-5) and at least a portion of the conductive layer (500-7). In one embodiment, the voltage supply may include a positive connection (e.g., positive connection (441) in FIG. 4c) extending into an internal space from at least a portion of the voltage supply layer (402) of the conductive adhesive member (400-5) and a negative connection (e.g., negative connection (542) in FIG. 4d) extending into an internal space from at least a portion of the conductive layer (500-7). In one embodiment, the voltage supply may be electrically connected to at least a portion of the conductive adhesive member (400-5) and at least a portion of the conductive layer (500). In one embodiment, the negative connection of the voltage supply unit is connected to at least a portion of the conductive layer (500-7) and may be connected to ground (e.g., the reference potential of a wireless signal transmitted and / or received in a wireless communication circuit (e.g., the wireless communication circuit (192) of FIG. 1). In one embodiment, the negative connection of the voltage supply unit is omitted, and at least a portion of the conductive layer (500-7) may be connected to ground. In one embodiment, the positive connection of the voltage supply unit is connected to at least a portion of the voltage supply layer (402) and may be electrically connected to the positive terminal of a battery (e.g., the battery (250) of FIG. 3) through a switching circuit (e.g., the switching circuit of the printed circuit board (240) of FIG. 3). In one embodiment, the positive connection of the voltage supply unit may be directly connected to the positive terminal of the battery. In one embodiment, when power is supplied to the voltage supply layer (402), a potential difference may occur between the voltage supply layer (402) and the conductive layer (500-7). In one embodiment, the voltage When a potential difference occurs in the supply layer (402) and the conductive layer (500-7), the cations and anions contained in the first adhesive layer (401) can be rearranged so that they are grouped together with the same polarity.As a result, the bonding force between the first adhesive layer (401) and the conductive layer (500-7) is reduced, and the conductive adhesive member (400-5) can be separated from the conductive layer (500-7). In some embodiments, at least a portion of the conductive layer (500-7) may be electrically connected to the positive electrode of the battery through a switching circuit of the printed circuit board. At least a portion of the voltage supply layer (402) may be connected to ground. At least one of the components of the conductive adhesive member (400-5) may be identical or similar to at least one of the components of the conductive adhesive member (400) of FIGS. 4a to 5, the conductive adhesive member (400-1) of FIGS. 6a and 6b, the conductive adhesive member (400-2) of FIG. 10, the conductive adhesive member (400-3) of FIG. 11, and / or the conductive adhesive member (400-4) of FIG. 13a, and redundant descriptions are omitted below. At least one of the components of the conductive layer (500-7) may be identical or similar to at least one of the components of the conductive layer (500) of FIGS. 4a to 10, the conductive layer (500-1) of FIG. 11, the conductive layer (500-2) of FIG. 12a, the conductive layer (500-3) of FIG. 12b, the conductive layer (500-4) of FIG. 12c, the conductive layer (500-5) of FIG. 12d, and / or the conductive layer (500-6) of FIG. 12e, and redundant descriptions are omitted below.

[0142] FIG. 14 is a partial configuration diagram of a conductive adhesive member according to various embodiments of the present disclosure.

[0143] Referring to FIG. 14, in one embodiment, the conductive adhesive member (400-6) may include a first positive connection (441-1) extending into the internal space from the second-fourth adhesive portion (434) and a second positive connection (441-2) extending into the internal space from the second-second adhesive portion (432). In one embodiment, the first positive connection (441-1) and the second positive connection (441-2) may be electrically connected to a voltage supply layer (e.g., the voltage supply layer (402) of FIG. 4b). At least one of the components of the conductive adhesive member (400-6) may be identical or similar to at least one of the components of the conductive adhesive member (400) of FIGS. 4a to 5, the conductive adhesive member (400-1) of FIGS. 6a and 6b, the conductive adhesive member (400-2) of FIG. 10, the conductive adhesive member (400-3) of FIG. 11, the conductive adhesive member (400-4) of FIG. 13a, and / or the conductive adhesive member (400-5) of FIG. 13b, and redundant descriptions are omitted below.

[0144] According to various embodiments, an electronic device (e.g., electronic device (200) of FIG. 3) comprises a housing (e.g., housing (210) of FIG. 2a) comprising a front cover (e.g., front cover (202) of FIG. 3), a rear cover facing in the opposite direction to the front cover (e.g., rear cover (211) of FIG. 3), and a side member (e.g., side member (218) of FIG. 3)) surrounding the space between the front cover and the rear cover, and including at least one non-conductive portion (e.g., non-conductive portion (321, 322, 323, 324, 325, 326, 327) of FIG. 3) and at least one conductive portion (e.g., conductive portion (311, 312, 313, 314, 315, 316, 317) of FIG. 2b), and a first support member extending from the side member into the space (e.g., FIG. The apparatus comprises a first support member (2181) of 3, a loop-shaped conductive adhesive member disposed between the first support member and the rear cover (e.g., conductive adhesive member (400) of FIG. 4a, conductive adhesive member (400-1) of FIG. 6a, conductive adhesive member (400-2) of FIG. 10, conductive adhesive member (400-3) of FIG. 11, conductive adhesive member (400-4) of FIG. 13a, conductive adhesive member (400-5) of FIG. 13b, and / or conductive adhesive member (400-6) of FIG. 14), and a wireless communication circuit (e.g., wireless communication module (192) of FIG. 1) disposed within the space and transmitting and / or receiving a wireless signal in at least one frequency band through the at least one conductive portion, wherein the conductive adhesive member is a first adhesive spaced apart from the at least one non-conductive portion by a first distance (e.g., first distance (S1) of FIG. 6b). A portion (e.g., the first segment gap adhesive portion (421), the second segment gap adhesive portion (422), and / or the third segment gap adhesive portion (423) of FIG. 5),and may include a second adhesive portion (e.g., the second-1 adhesive portion (431), the second-2 adhesive portion (432), and / or the second-4 adhesive portion (434)) that is in contact with or spaced apart from the at least one conductive portion by a second distance smaller than the first distance (e.g., the second distance (S2) in FIG. 6b) in FIG. 5.

[0145] According to various embodiments, the first distance may be formed to be 0.7 mm or more.

[0146] According to various embodiments, the side member may include at least one feed portion (e.g., feed portions (LA1, LA2, LA3) of FIG. 5) in which the at least one conductive portion is electrically connected to the wireless communication circuit, and the conductive adhesive member may include a third adhesive portion (e.g., first feed portion spaced adhesive portion (411), second feed portion spaced adhesive portion (412), and / or third feed portion spaced adhesive portion (413) of FIG. 6a) spaced apart from the at least one feed portion by a third distance (e.g., third distance (S3) of FIG. 6b) that is further than the second distance.

[0147] According to various embodiments, the third distance may be formed to be 0.7 mm or more.

[0148] According to various embodiments, the electronic device may further include a conductive layer (e.g., conductive layer (500) of FIG. 4a, conductive layer (500-1) of FIG. 11, conductive layer (500-2) of FIG. 12a, conductive layer (500-3) of FIG. 12b, conductive layer (500-4) of FIG. 12c, conductive layer (500-5) of FIG. 12d, conductive layer (500-6) of FIG. 12e, and / or conductive layer (500-7) of FIG. 13b) disposed at least partially between the rear cover and the conductive adhesive member.

[0149] According to various embodiments, the conductive adhesive member may comprise a substrate layer (e.g., substrate layer (403) of FIG. 4b and / or substrate layer (403-1) of FIG. 13a), a voltage supply layer disposed on a first surface of the substrate layer (e.g., voltage supply layer (402) of FIG. 4b and / or voltage supply layer (402-1) of FIG. 11), a first adhesive layer disposed on the voltage supply layer (e.g., first adhesive layer (401) of FIG. 4b), and a second adhesive layer disposed on a second surface of the substrate layer opposite to the first surface (e.g., second adhesive layer (404) of FIG. 4b and / or second adhesive layer (404-1) of FIG. 13a).

[0150] According to various embodiments, the conductive adhesive member is attached to the first support member through the second adhesive layer, and the conductive layer can be attached to the conductive adhesive member through the first adhesive layer and attached to the support member.

[0151] According to various embodiments, the electronic device further comprises a battery (e.g., battery (250) of FIG. 3) disposed within the space and including a positive electrode and a negative electrode, and one of the conductive adhesive member or the conductive layer may include at least one positive connection (e.g., positive connection (441) of FIG. 4c and / or a first positive connection (441-1) and a second positive connection (441-2) of FIG. 14) electrically connected to the positive electrode of the battery.

[0152] According to various embodiments, the other of the conductive adhesive member or the conductive layer may include at least one negative connection (e.g., negative connection (542) of FIG. 4d, first negative connection (542-1) and second negative connection (542-2) of FIG. 12a, and / or negative connection (542-3) of FIG. 12e) that is electrically connected to the negative electrode or ground of the battery.

[0153] According to various embodiments, when power from the battery is supplied to the conductive adhesive member through the positive terminal, the conductive adhesive member may be configured to be separated from the rear cover.

[0154] According to various embodiments, the electronic device further comprises a printed circuit board (e.g., the printed circuit board (240) of FIG. 3) disposed within the space and electrically connected to the battery, and the positive connection may be electrically connected to the positive electrode of the battery through the printed circuit board.

[0155] According to various embodiments, the printed circuit board may include an electronic component configured to amplify power supplied from the battery to the conductive adhesive member.

[0156] According to various embodiments, the positive electrode connection and / or the negative electrode connection may be positioned so as not to overlap with the first adhesive portion when viewed in a direction substantially perpendicular to the rear cover.

[0157] According to various embodiments, the side member comprises at least one feed portion (e.g., feed portions (LA1, LA2, LA3) of FIG. 5) to which the at least one conductive portion is electrically connected to the wireless communication circuit, and the conductive adhesive member comprises a third adhesive portion (e.g., first feed portion spaced adhesive portion (411), second feed portion spaced adhesive portion (412), and / or third feed portion spaced adhesive portion (413) of FIG. 6a) spaced apart from the at least one feed portion by a third distance longer than the second distance (e.g., third distance (S3) of FIG. 6b), and the positive connection portion and / or the negative connection portion may be positioned so as not to overlap with the third adhesive portion when viewed in a direction substantially perpendicular to the rear cover.

[0158] According to various embodiments, the conductive adhesive member can induce static electricity flowing into the space to ground.

[0159] According to various embodiments, an electronic device (e.g., electronic device (200) of FIG. 3) comprises a housing (e.g., housing (210) of FIG. 2a) comprising a front cover (e.g., front cover (202) of FIG. 3), a rear cover facing in the opposite direction to the front cover (e.g., rear cover (211) of FIG. 3), and a side member (e.g., side member (218) of FIG. 3)) surrounding the space between the front cover and the rear cover, and including at least one non-conductive portion (e.g., non-conductive portion (321, 322, 323, 324, 325, 326, 327) of FIG. 3) and at least one conductive portion (e.g., conductive portion (311, 312, 313, 314, 315, 316, 317) of FIG. 2b), and a first support member extending from the side member into the space (e.g., FIG. The invention comprises a first support member (2181) of 3, a conductive adhesive member having at least a partially segmented shape disposed between the first support member and the rear cover (e.g., the conductive adhesive portion (430a) of FIG. 10 or the voltage supply layer (402-1) of FIG. 11), a non-conductive adhesive member disposed between the first support member and the rear cover in the segmented adhesive portion of the conductive adhesive member (e.g., the non-conductive adhesive portion (430b) of FIG. 10, the first adhesive layer (401) of FIG. 4b, the substrate layer (403), and / or the second adhesive layer (404), and / or the substrate layer (403-1) and / or the second adhesive layer (404-1) of FIG. 13a), and a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) disposed in the space and transmitting and / or receiving a wireless signal in at least one frequency band through the at least one conductive portion, wherein the conductive adhesive member At least a portion is connected to the non-conductive adhesive member to form a loop shape, and the conductive adhesive member is a first adhesive portion (e.g., the first segmented adhesive portion (421) of FIG. 5) spaced apart from the at least one non-conductive portion by a first distance (e.g., the first distance (S1) of FIG. 6b),It may include a second segmented adhesive portion (422), a third segmented adhesive portion (423)), and a second adhesive portion (e.g., a second adhesive portion (431), a second adhesive portion (432), and / or a second adhesive portion (434)) that is in contact with or spaced apart from the at least one conductive portion by a second distance smaller than the first distance (e.g., the second distance (S2) in FIG. 6b) from the at least one conductive portion.

[0160] According to various embodiments, the side member may include at least one feed portion (e.g., feed portions (LA1, LA2, LA3) of FIG. 5) formed on the at least one conductive portion and supplying the wireless signal to the wireless communication circuit, and the conductive adhesive member may include a third adhesive portion (e.g., first feed portion spaced adhesive portion (411), second feed portion spaced adhesive portion (412), or third feed portion spaced adhesive portion (413) of FIG. 6a) spaced apart from the at least one feed portion by a second distance (e.g., second distance (S2) of FIG. 6b).

[0161] According to various embodiments, the electronic device may further include a conductive layer (e.g., conductive layer (500) of FIG. 4a, conductive layer (500-1) of FIG. 11, conductive layer (500-2) of FIG. 12a, conductive layer (500-3) of FIG. 12b, conductive layer (500-4) of FIG. 12c, conductive layer (500-5) of FIG. 12d, conductive layer (500-6) of FIG. 12e, and / or conductive layer (500-7) of FIG. 13b) disposed at least partially between the rear cover and the conductive adhesive member.

[0162] According to various embodiments, the electronic device further comprises a battery (e.g., battery (250) of FIG. 3) disposed within the space and including a positive electrode and a negative electrode, and one of the conductive adhesive member or the conductive layer comprises at least one positive connection (e.g., positive connection (441) of FIG. 4c and / or a first positive connection (441-1) and a second positive connection (441-2) of FIG. 14)) electrically connected to the positive electrode of the battery, and the other of the conductive adhesive member or the conductive layer may comprise at least one negative connection (e.g., negative connection (542) of FIG. 4d, a first negative connection (542-1) and a second negative connection (542-2) of FIG. 12a, and / or a negative connection (542-3) of FIG. 12e) electrically connected to the negative electrode or ground of the battery.

[0163] According to various embodiments, when power from the battery is supplied to the conductive adhesive member through the positive connection, the conductive adhesive member may be configured to be separated from the rear cover.

[0164] In the first example, an electronic device (e.g., 200) comprising the following: a housing (e.g., 210) comprising a front cover (e.g., 202), a rear cover facing opposite the front cover (e.g., 211), and a side member (e.g., 218) surrounding the space between the front cover and the rear cover, wherein the side member comprises at least one non-conductive portion (e.g., 321, 322, 323, 324, 325, 326, 327) and at least one conductive portion (e.g., 311, 312, 313, 314, 315, 316, 317), a first support member (e.g., 2181) extending from the side member into the space, and a loop-shaped conductive adhesive member (e.g., 400, 400-1, 400-2, 400-3) disposed between the first support member and the rear cover. 400-4, 400-5, 400-6), a wireless communication circuit (e.g., 192) disposed in the space and configured to transmit and / or receive a wireless signal through the at least one conductive part in at least one frequency band, wherein the conductive adhesive member comprises: a first adhesive part (e.g., 421, 422, 423) spaced apart from the at least one non-conductive part by a first distance (e.g., S1), and a second adhesive part (e.g., 431, 432, 434) in contact with the at least one conductive part or spaced apart from the at least one conductive part by a second distance (e.g., S2) shorter than the first distance.

[0165] In the second example, an electronic device of the first example is provided in which the first distance (e.g., S1) is 0.7 mm or greater.

[0166] In a third example, an electronic device of the first example is provided, wherein a side member comprises at least one feed portion (e.g., LA1, LA2, LA3) in which at least one conductive portion is electrically connected to a wireless communication circuit, and a conductive adhesive member comprises a third adhesive portion (e.g., 411, 412, 413) spaced apart from at least one feed portion by a third distance (e.g., S3) longer than a second distance.

[0167] In the fourth example, an electronic device of the third example is provided, wherein the third distance is 0.7 mm or more.

[0168] In the fifth example, an electronic device of the first example is provided, further comprising a conductive layer (e.g., 500, 500-1, 500-2, 500-3, 500-4, 500-5, 500-6, 500-7) partially disposed between a rear cover and a conductive adhesive member.

[0169] In the sixth example, an electronic device of the fifth example is provided, wherein the conductive adhesive member comprises: a substrate layer (e.g., 403, 403-1), a voltage supply layer disposed on a first surface of the substrate layer (e.g., 402, 402-1), a first adhesive layer disposed on the voltage supply layer (e.g., 401), and a second adhesive layer disposed on a second surface opposite to the first surface of the substrate layer (e.g., 404, 404-1).

[0170] In the seventh example, an electronic device of the sixth example is provided in which a conductive adhesive member is attached to a first support member through a second adhesive layer, and a conductive layer is attached to the conductive adhesive member through the first adhesive layer and attached to the first support member.

[0171] In the eighth example, an electronic device of the fifth example is provided, further comprising a battery (e.g., 250) disposed in space and including a positive electrode and a negative electrode, and at least one positive connection (e.g., 441, 441-1, 441-2) in which one of a conductive adhesive member or a conductive layer is electrically connected to the positive electrode of the battery.

[0172] In the ninth example, an electronic device of the eighth example is provided, comprising at least one negative connection (e.g., 542, 542-1, 542-2, 542-3) in which the other of the conductive adhesive member or the conductive layer is electrically connected to the negative electrode or ground of the battery.

[0173] In the 10th example, an electronic device of the 9th example is provided, configured such that when power from the battery is supplied to the conductive adhesive member through the positive connection, the conductive adhesive member is separated from the rear cover.

[0174] In the 11th example, the electronic device of the 9th example is provided, further comprising a printed circuit board (e.g., 240) disposed in space and electrically connected to a battery, wherein a positive connection is electrically connected to the positive of the battery through the printed circuit board.

[0175] In the 12th example, an electronic device of the 11th example is provided, comprising an electronic component configured to amplify power supplied from a battery to a conductive adhesive member on a printed circuit board.

[0176] In the 13th example, an electronic device of the 9th example is provided, wherein, when viewed in a direction substantially perpendicular to the rear cover, the positive connection and / or negative connection are positioned so as not to overlap with the first adhesive portion.

[0177] An electronic device of the 9th example is provided, wherein in the 14th example, the side member comprises at least one feed portion (e.g., LA1, LA2, LA3) in which at least one conductive portion is electrically connected to a wireless communication circuit, and the conductive adhesive member comprises a third adhesive portion (e.g., 411, 412, 413) spaced apart from the at least one feed portion by a third distance (e.g., S3) longer than a second distance, and when viewed in a direction substantially perpendicular to the rear cover, the positive connection portion and / or the negative connection portion are positioned so as not to overlap with the third adhesive portion.

[0178] In the 15th example, an electronic device of the first example is provided, configured such that a conductive adhesive member induces static electricity introduced into the space to ground.

[0179] In the 16th example, an electronic device is provided comprising: a housing (e.g., 210) comprising a front cover (e.g., 202), a rear cover facing opposite the front cover (e.g., 211), and a side member (e.g., 218) surrounding the space between the front cover and the rear cover; the side member comprising at least one non-conductive portion (e.g., 321, 322, 323, 324, 325, 326, 327) and at least one conductive portion (e.g., 311, 312, 313, 314, 315, 316, 317), a first support member (e.g., 2181) extending from the side member into the space, a conductive adhesive member (e.g., 430a, 402-1) disposed between the first support member and the back cover having at least a partially segmented shape, and a segmented adhesive portion of the conductive adhesive member between the first support member and the back cover A non-conductive adhesive member (e.g., 430b, 401, 403, 404, 403-1, 404-1) disposed in the space and configured to transmit and / or receive a wireless signal through the at least one conductive part in at least one frequency band (e.g., 192), wherein at least a portion of the conductive adhesive member is connected to the non-conductive adhesive member to form a loop shape, and the conductive adhesive member comprises a first adhesive part (e.g., 421, 422, 423) spaced apart from at least one non-conductive part by a first distance (e.g., S1), and a second adhesive part (e.g., 431, 432, 434) in contact with or spaced apart from at least one conductive part by a second distance (e.g., S2) shorter than the first distance from said conductive part.

[0180] An electronic device of Example 16 is provided, wherein in Example 17, the side member comprises at least one feed portion (e.g., LA1, LA2, LA3) formed on at least one conductive portion and configured to supply a wireless signal to a wireless communication circuit, and the conductive adhesive member comprises a second adhesive portion (e.g., 411, 412, 413) spaced apart from at least one feed portion by a second distance (e.g., S2).

[0181] In the 18th example, an electronic device of the 17th example is provided, further comprising a conductive layer (e.g., 500, 500-1, 500-2, 500-3, 500-4, 500-5, 500-6, 500-7) partially disposed between a rear cover and a conductive adhesive member.

[0182] In the 19th example, an electronic device of the 16th example is provided, further comprising a battery (e.g., 250) disposed in space and comprising a positive electrode and a negative electrode, and comprising at least one positive connection (e.g., 441, 441-1, 441-2) in which one of the conductive adhesive member or conductive layer is electrically connected to the positive electrode of the battery, and at least one negative connection (e.g., 542, 542-1, 542-2, 542-3) in which the other of the conductive adhesive member or conductive layer is electrically connected to the negative electrode of the battery or ground.

[0183] In the 20th example, an electronic device of the 19th example is provided, configured such that when power from the battery is supplied to the conductive adhesive member through the positive connection, the conductive adhesive member is separated from the rear cover.

[0184] In the 21st example, an electronic device (e.g., 200) comprising: a housing (e.g., 210) comprising a front cover (e.g., 202), a rear cover facing opposite the front cover (e.g., 211), and a side member (e.g., 218) surrounding the space between the front cover and the rear cover, wherein the side member comprises at least one non-conductive portion (e.g., 321, 322, 323, 324, 325, 326, 327) and at least one conductive portion (e.g., 311, 312, 313, 314, 315, 316, 317), a first support member (e.g., 2181) disposed between the front cover and the rear cover, and a conductive adhesive member (e.g., 400, 400-1, 400-2) disposed between the first support member and the rear cover to at least partially surround the space. 400-3, 400-4, 400-5, 400-6), a wireless communication circuit (e.g., 192) disposed in the space and configured to transmit and / or receive a wireless signal through the at least one conductive part in at least one frequency band, wherein the conductive adhesive member comprises: a first adhesive part (e.g., 421, 422, 423) disposed to correspond to at least one non-conductive part and spaced apart from the at least one non-conductive part by a first distance (e.g., S1), and a second adhesive part (e.g., 431, 432, 434) in contact with the at least one conductive part or disposed to correspond to the at least one conductive part and spaced apart from the at least one conductive part by a second distance (e.g., S2) shorter than the first distance.

[0185] In the 22nd example, an electronic device of the 21st example is provided, in which the first distance is 0.7 mm or more.

[0186] An electronic device of Example 21 or Example 22 is provided, wherein the side member comprises at least one feed portion (e.g., LA1, LA2, LA3) electrically connected to at least one conductive portion in a wireless communication circuit, and the conductive adhesive member comprises a third adhesive portion (e.g., 411, 412, 413) positioned to correspond to at least one feed portion and spaced apart from the at least one feed portion by a third distance (e.g., S3) longer than a second distance.

[0187] In the 24th example, an electronic device of the 23rd example is provided, in which the third distance is 0.7 mm or more.

[0188] In the 25th example, an electronic device of any one of the 21st to 24th examples is provided, further comprising a conductive layer (e.g., 500, 500-1, 500-2, 500-3, 500-4, 500-5, 500-6, 500-7) partially disposed between a back cover and a conductive adhesive member.

[0189] In the 26th example, an electronic device of the 25th example is provided, comprising a conductive adhesive member as follows: a substrate layer (e.g., 403, 403-1), a voltage supply layer disposed on a first surface of the substrate layer (e.g., 402, 402-1), a first adhesive layer disposed on the voltage supply layer (e.g., 401), and a second adhesive layer disposed on a second surface opposite to the first surface of the substrate layer (e.g., 404, 404-1), wherein the conductive adhesive member is attached to a first support member through the second adhesive layer, and the conductive layer is attached to the first support member by being attached to the conductive adhesive member through the first adhesive layer.

[0190] In the 27th example, an electronic device of the 26th example is provided, further comprising a battery (e.g., 250) disposed in space and comprising a positive electrode and a negative electrode, and at least one positive connection (e.g., 441, 441-1, 441-2) in which one of a conductive adhesive member or a conductive layer is electrically connected to the positive electrode of the battery.

[0191] In Example 28, an electronic device of Example 27 is provided, comprising at least one negative connection (e.g., 542, 542-1, 542-2, 542-3) in which the other of the conductive adhesive member or the conductive layer is electrically connected to the negative electrode or ground of the battery.

[0192] In the 29th example, an electronic device of the 28th example is provided, configured such that when power from the battery is supplied to the conductive adhesive member through the positive connection, the conductive adhesive member is separated from the rear cover.

[0193] In the 30th example, an electronic device of the 29th example is provided, further comprising a printed circuit board (e.g., 240) disposed in space and electrically connected to a battery, wherein a positive connection is electrically connected to the positive of the battery through the printed circuit board.

[0194] In the 31st example, an electronic device of the 30th example is provided, comprising an electronic component configured such that a printed circuit board amplifies power supplied from a battery to a conductive adhesive member.

[0195] In Example 32, an electronic device of any one of Examples 28 to 31 is provided in which the positive connection and / or negative connection are positioned so as not to overlap with the first adhesive part when viewed in a direction substantially perpendicular to the rear cover.

[0196] In Example 33, an electronic device of any one of Examples 28 through 32 is provided, wherein the side member comprises at least one feed portion (e.g., LA1, LA2, LA3) in which at least one conductive portion is electrically connected to a wireless communication circuit, and the conductive adhesive member comprises a third adhesive portion (e.g., 411, 412, 413) spaced apart from the at least one feed portion by a third distance (e.g., S3) longer than a second distance, and when viewed in a direction substantially perpendicular to the rear cover, the positive connection portion and / or the negative connection portion are positioned so as not to overlap with the third adhesive portion.

[0197] In the 34th example, an electronic device of any one of the 21st to 33rd examples is provided, configured such that a conductive adhesive member induces static electricity introduced into the space to ground.

[0198] In Example 35, a conductive adhesive member (e.g., 430a, 402-1) has at least a partially segmented shape, and the electronic device further comprises a non-conductive adhesive member (e.g., 430b, 401, 403, 404, 403-1, 404-1) disposed on the segmented adhesive portion of the conductive adhesive member, and at least a portion of the conductive adhesive member is connected to the non-conductive adhesive member to form a shape that at least partially surrounds the space, thereby providing an electronic device of any one of Examples 21 to 34.

[0199] Furthermore, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples provided to facilitate the explanation of the technical content according to the embodiments of the present disclosure and to aid in understanding the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of the various embodiments of the present disclosure should be interpreted to include all modifications or variations derived based on the technical concept of the various embodiments of the present disclosure, in addition to the embodiments disclosed herein.

Claims

1. In an electronic device (200), A housing (210) comprising a front cover (202), a rear cover (211) facing in the opposite direction to the front cover, and a side member (218) surrounding the space between the front cover and the rear cover and including at least one non-conductive portion (321, 322, 323, 324, 325, 326, 327) and at least one conductive portion (311, 312, 313, 314, 315, 316, 317); A first support member (2181) disposed between the front cover and the rear cover; A conductive adhesive member (400, 400-1, 400-2, 430a, 400-3, 402-1, 400-4, 400-5, 400-6) disposed between the first support member and the rear cover and at least partially surrounding the space; and A wireless communication circuit (192) disposed within the above space and transmitting and / or receiving a wireless signal in at least one frequency band through at least one conductive part, and The conductive adhesive member above is, A first adhesive portion (421, 422, 423) positioned to correspond to the at least one non-conductive portion and spaced apart from the at least one non-conductive portion by a first distance (S1), and An electronic device comprising a second adhesive portion (431, 432, 434) positioned to be in contact with or corresponding to the at least one conductive portion, and spaced apart from the at least one conductive portion by a second distance (S2) smaller than the first distance.

2. In Paragraph 1, An electronic device in which the above-mentioned first distance is formed to be 0.7 mm or more.

3. In Paragraph 1 or 2, The above-mentioned side member is, The above-mentioned at least one conductive part includes at least one feed part (LA1, LA2, LA3) that is electrically connected to the wireless communication circuit, and The conductive adhesive member above is, An electronic device comprising a third adhesive portion (411, 412, 413) arranged to correspond to the at least one power supply portion and spaced apart from the at least one power supply portion by a third distance (S3) farther than the second distance.

4. In Paragraph 3, An electronic device in which the above third distance is formed to be 0.7 mm or more.

5. In any one of paragraphs 1 through 4, The above electronic device is, An electronic device further comprising a conductive layer (500, 500-1, 500-2, 500-3, 500-4, 500-5, 500-6, 500-7) disposed at least partially between the rear cover and the conductive adhesive member.

6. In Paragraph 5, The conductive adhesive member above is, Base layer (403, 403-1), A voltage supply layer (402, 402-1) disposed on the first surface of the above substrate layer, A first adhesive layer (401) disposed on the voltage supply layer, and It includes a second adhesive layer (404, 404-1) disposed on a second surface opposite to the first surface of the above substrate layer, and The conductive adhesive member is attached to the first support member through the second adhesive layer, and The above conductive layer is attached to the conductive adhesive member through the first adhesive layer and is an electronic device attached to the first support member.

7. In Paragraph 5, The above electronic device is, A battery (250) is further included, which is disposed within the above space and includes a positive electrode and a negative electrode, and One of the above conductive adhesive member or the above conductive layer is, An electronic device comprising at least one positive terminal connection (441, 441-1, 441-2) electrically connected to the positive terminal of the battery.

8. In Paragraph 7, The other one of the above conductive adhesive member or the above conductive layer is, An electronic device comprising at least one negative terminal connection (542, 542-1, 542-2, 542-3) electrically connected to the negative terminal or ground of the battery.

9. In Paragraph 8, The conductive adhesive member above is, An electronic device configured to be separated from the rear cover as power from the battery is supplied to the conductive adhesive member through the positive terminal connection.

10. In Paragraph 9, The above electronic device is, It further includes a printed circuit board (240) disposed within the above space and electrically connected to the battery, and The above positive terminal is an electronic device that is electrically connected to the positive terminal of the battery through the printed circuit board.

11. In paragraph 10, the above printed circuit board is, An electronic device comprising an electronic component configured to amplify power supplied from the battery to the conductive adhesive member.

12. In any one of paragraphs 8 through 11, An electronic device wherein the positive electrode connection and / or the negative electrode connection are positioned so as not to overlap with the first adhesive portion when viewed in a direction substantially perpendicular to the rear cover.

13. In either Paragraph 8 or Paragraph 12, The above-mentioned side member is, The above-mentioned at least one conductive part includes at least one feed part (LA1, LA2, LA3) that is electrically connected to the wireless communication circuit, and The conductive adhesive member above is, It includes a third adhesive portion (411, 412, 413) spaced apart from the above at least one feed portion by a third distance (S3) longer than the second distance, and The above positive electrode connection and / or the above negative electrode connection is, An electronic device positioned at a location that does not overlap with the third adhesive portion when viewed in a direction substantially perpendicular to the rear cover.

14. In any one of paragraphs 1 through 13, The conductive adhesive member above is, An electronic device that induces static electricity flowing into the above space to ground.

15. In any one of paragraphs 1 through 14, The conductive adhesive member above is, Having at least a partially segmented shape, The above electronic device is, It further includes a non-conductive adhesive member (430b, 401, 403, 404, 403-1, 404-1) disposed on a segmented adhesive portion of the conductive adhesive member, and At least a portion of the above conductive adhesive member is, An electronic device connected to the non-conductive adhesive member to form a shape that at least partially surrounds the space.

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