Display device and electronic device using same

Abstract

The present invention relates to a display device and an electronic device using same, the display device according to an embodiment comprising: a display panel for displaying an image by means of pixels in a display area; a touch driving circuit for detecting a user touch by means of a touch sensing unit of the display panel and generating touch coordinate data; a display driving circuit for supplying a data voltage to the pixels in the display area and controlling an image display timing of the pixels; a circuit board electrically contacting the display panel and including a plurality of lines among touch lines, ground lines, interface lines, power lines, and optional control lines; and a low-resistance film attached to an upper surface or a front surface (a surface in a Z-axis direction in a thickness direction or a Z-axis direction) of the circuit board by partially covering the upper surface or the front surface.

Description

Display device and electronic device using the same

[0001] The present invention relates to a display device and an electronic device using the same.

[0002] As the information society develops, the demand for display devices to show images is increasing in various forms. For example, display devices are being applied to a wide range of electronic devices, such as smartphones, digital cameras, laptop computers, navigation systems, and smart televisions.

[0003] The display device may be a flat panel display device such as a Liquid Crystal Display Device, a Field Emission Display Device, or an Organic Light Emitting Display Device. Among these flat panel display devices, the light-emitting display device includes a light-emitting element in which each pixel of the display panel can emit light on its own, thereby enabling the display of an image without a backlight unit that provides light to the display panel.

[0004] The display device controls the driving timing (image display timing) of the display panel to be synchronized with synchronization signals, such as frequency clocks and enable signals from a graphics system, such as a graphics card, or a built-in graphics control processor (microprocessor). The display device can perform bidirectional communication with an external graphics system or a built-in graphics control processor using an interface communication method such as MIPI (Mobile Industry Processor Interface).

[0005] The problem that the present invention aims to solve is to provide a display device capable of reducing the effects of electromagnetic interference by forming a low-resistance film on a circuit board having a plurality of communication wires and a metal pattern, and an electronic device using the same.

[0006] In addition, the problem that the present invention aims to solve is to provide a display device and an electronic device using the same that can efficiently adjust or maintain the impedance magnitude of interface wiring formed on a circuit board by adding a pattern structure of a low-resistance film and changing the stacking structure of the circuit board.

[0007] The problems of the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below.

[0008] A display device of one embodiment for solving the above problem comprises: a display panel that displays an image through pixels of a display area; a touch driving circuit that detects a user touch through a touch detection unit of the display panel and generates touch coordinate data; a display driving circuit that supplies data voltage to pixels of the display area and controls the image display timing of the pixels; a circuit board electrically contacted to the display panel and including a plurality of wires among touch wires, ground wires, interface wires, power wires, and option control wires; and a low-resistance film that is adhered to partially cover the upper surface or front surface of the circuit board, wherein the low-resistance film is positioned in the direction of the upper surface or front surface of the interface wires in correspondence with the interface wires.

[0009] In addition, a display device of one embodiment for solving the above problem includes a display panel that displays an image through pixels of a display area, a touch driving circuit that detects a user touch through a touch detection unit of the display panel and generates touch coordinate data, a display driving circuit that supplies data voltage to pixels of the display area and controls the image display timing of the pixels, and a circuit board that includes a plurality of wires among touch wires, ground wires, interface wires, power wires, and option control wires and is electrically in contact with the display panel, wherein the circuit board includes a low-resistance film that is adhered to partially cover the upper surface or front surface of the circuit board, and the low-resistance film is positioned in the direction of the upper surface or front surface of the interface wires.

[0010] An electronic device using a display device according to one embodiment for solving the above problem includes a display device for displaying an image, an image signal processor for controlling the image display timing of the display device, and a power module for providing a power signal to the display device. The display device includes a display panel that displays an image through pixels of a display area, a touch driving circuit that detects a user touch through a touch detection unit of the display panel and generates touch coordinate data, a display driving circuit that supplies data voltage to pixels of the display area and controls the image display timing of the pixels, a circuit board electrically contacted to the display panel including a plurality of wires among touch wires, ground wires, interface wires, power wires and option control wires, and a low-resistance film that is adhered to partially cover the upper surface or front surface of the circuit board.

[0011] A display device according to embodiments of the present invention and an electronic device using the same can prevent data signal distortion and image quality degradation due to electromagnetic interference by forming a low-resistance film on a circuit board and increase user satisfaction.

[0012] A display device according to embodiments of the present invention and an electronic device using the same can improve the display quality of an image and enhance user reliability by efficiently adjusting or maintaining a constant impedance of interface wirings formed on a circuit board.

[0013] The effects according to the embodiments are not limited to those exemplified above, and a wider variety of effects are included in this specification.

[0014] FIG. 1 is a perspective view showing a display device according to one embodiment.

[0015] FIG. 2 is a plan view showing a display device according to one embodiment.

[0016] FIG. 3 is a side view showing a display device according to one embodiment.

[0017] FIG. 4 is a layout diagram schematically showing an example of a display panel illustrated in FIG. 1 to 3.

[0018] Figure 5 is a layout diagram schematically showing an example of a touch sensing module illustrated in Figure 3.

[0019] FIG. 6 is a plan view of a first embodiment specifically showing the circuit board illustrated in FIG. 1 to FIG. 3.

[0020] FIG. 7 is a cross-sectional view showing an example of a circuit board cut along the line I-I' of FIG. 8.

[0021] FIG. 8 is a plan view of a second embodiment specifically showing the circuit board illustrated in FIG. 1 to 3.

[0022] FIG. 9 is a plan view of a third embodiment specifically showing the circuit board illustrated in FIG. 1 to 3.

[0023] FIG. 10 is a block diagram of an electronic device according to one embodiment.

[0024] FIG. 11 is a schematic diagram of an electronic device according to various embodiments.

[0025] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0026] When elements or layers are referred to as being "on" another element or layer, this includes cases where another layer or element is interposed directly on or in the middle of another element. Throughout the specification, the same reference numerals refer to the same components. Shapes, sizes, ratios, angles, numbers, etc., disclosed in the drawings for describing embodiments are exemplary and therefore the invention is not limited to the depicted details.

[0027] Although terms such as "first," "second," etc., are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may also be the second component within the technical scope of the present invention.

[0028] The features of each of the various embodiments of the present invention may be combined or combined with one another, either partially or wholly, and may technically enable various interlocking and operation. Each embodiment may be implemented independently of one another or may be implemented together in an associated relationship.

[0029] Specific embodiments will be described below with reference to the attached drawings.

[0030] FIG. 1 is a perspective view showing a display device according to one embodiment. FIG. 2 is a plan view showing a display device according to one embodiment, and FIG. 3 is a side view showing a display device according to one embodiment.

[0031] Referring to FIGS. 1 to 3, a display device (10) according to one embodiment can be applied to portable electronic devices such as mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic notebooks, e-books, PMPs (portable multimedia players), navigation systems, UMPCs (Ultra Mobile PCs), etc. Additionally, a display device (10) according to one embodiment can be applied to a television, laptop, monitor, billboard, or display unit of the Internet of Things (IOT). Furthermore, a display device (10) according to one embodiment can be applied to wearable devices such as smart watches, watch phones, glasses-type displays, and head-mounted displays (HMDs). Additionally, the display device (10) according to one embodiment may be applied to a center information display (CID) placed on the instrument panel of a vehicle, the center fascia of a vehicle, the dashboard of a vehicle, a room mirror display replacing the side mirror of a vehicle, or a display placed on the back of the front seat as entertainment for the rear seat of a vehicle.

[0032] A display device (10) according to one embodiment may be a light-emitting display device such as an organic light-emitting display device using an organic light-emitting diode, a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including an inorganic semiconductor, and a micro light-emitting display device using a micro or nano light-emitting diode (micro LED or nano LED). Hereinafter, the display device (10) according to one embodiment is described with an organic light-emitting display device, but the present invention is not limited thereto.

[0033] A display device (10) according to one embodiment includes a display panel (100) having a touch detection unit (TSU) formed thereon, a display driving circuit (200), a circuit board (300), and a touch driving circuit (400).

[0034] The display panel (100) may be formed as a rectangular plane having a short side in a first direction (X-axis direction) and a long side in a second direction (Y-axis direction) that intersects the first direction (X-axis direction). The corner where the short side in the first direction (X-axis direction) and the long side in the second direction (Y-axis direction) meet may be formed rounded to have a predetermined curvature or formed at a right angle. The plane shape of the display panel (100) is not limited to a rectangle and may be formed as other polygons, circles, or ellipses. The display panel (100) may be formed flat, but is not limited thereto. For example, the display panel (100) includes a curved surface formed at the left and right ends, having a constant curvature or a changing curvature. In addition, the display panel (100) may be formed flexibly so that it can be bent, curved, banded, folded, or rolled.

[0035] The display panel (100) includes a main area (MA) and a sub-area (SBA).

[0036] The main area (MA) includes a display area (DA) that displays an image and a non-display area (NDA) which is a surrounding area of ​​the display area (DA). The display area (DA) includes pixels that display an image. A sub-area (SBA) may protrude in a second direction (Y-axis direction) from one side of the main area (MA).

[0037] In FIGS. 1 and 2, the sub-region (SBA) is illustrated as being unfolded, but the sub-region (SBA) can be bent as in FIG. 3, and in this case, it can be placed on the lower surface of the display panel (100). When the sub-region (SBA) is bent, it can overlap with the main region (MA) in the third direction (Z-axis direction), which is the thickness direction of the substrate (SUB). A display driving circuit (200) can be placed in the sub-region (SBA).

[0038] As illustrated in FIG. 3, the display panel (100) includes a display module (DU) comprising a substrate (SUB), a thin film transistor layer (TFTL), a light-emitting element layer (EML), and an encapsulation layer (TFEL), and a touch sensing unit (TSU) formed on the front surface of the display module (DU) (wherein the front surface or front direction is a third direction surface or a third direction in the Z-axis direction of the thickness direction).

[0039] A thin-film transistor layer (TFTL) may be disposed on a substrate (SUB). The thin-film transistor layer (TFTL) may be disposed in a main region (MA) and a sub-region (SBA). The thin-film transistor layer (TFTL) includes thin-film transistors.

[0040] The light-emitting element layer (EML) can be disposed on the thin-film transistor layer (TFTL). The light-emitting element layer (EML) can be disposed in the display area (DA) of the main area (MA). The light-emitting element layer (EML) includes light-emitting elements disposed in the light-emitting parts.

[0041] An encapsulation layer (TFEL) may be formed on a light-emitting element layer (EML). The encapsulation layer (TFEL) may be formed in the display area (DA) and non-display area (NDA) of the main area (MA). The encapsulation layer (TFEL) comprises at least one inorganic film and at least one organic film for encapsulating the light-emitting element layer.

[0042] The touch sensing unit (TSU) may be formed on the encapsulation layer (TFEL) or mounted on the encapsulation layer (TFEL). The touch sensing unit (TSU) may be formed on the display area (DA) of the main area (MA). The touch sensing unit (TSU) can detect a touch of a person or object using touch electrodes.

[0043] At least one cover window may be disposed on the touch sensing unit (TSU) to protect the upper part of the display panel (100). The at least one cover window may be attached to the touch sensing unit (TSU) by a transparent adhesive member such as an optically clear adhesive (OCA) film or an optically clear resin (OCR). The cover window may be an inorganic material such as glass, or an organic material such as plastic or polymer material. Meanwhile, to prevent a decrease in image visibility due to external light reflection, a polarizing film may be additionally disposed between the touch sensing unit (TSU) and the cover window.

[0044] The display driving circuit (200) can generate signals and voltages to drive the display panel (100). The display driving circuit (200) may be formed as an integrated circuit (IC) and attached to the display panel (100) using a COG (chip on glass) method, a COP (chip on plastic) method, or an ultrasonic bonding method, but is not limited thereto. For example, the display driving circuit (200) may be attached to the circuit board (300) using a COF (chip on film) method.

[0045] The circuit board (300) may be a flexible printed circuit board, a printed circuit board, or a flexible film such as a chip on film.

[0046] A circuit board (300) may be attached to one end (an outer edge area) of a sub-region (SBA) formed on a display panel (100). The display panel (100) and the display driving circuit (200) may receive digital video data, timing signals, and driving voltages from a graphics system such as a graphics card or a graphics control processor, etc., through the circuit board (300). Here, the timing signals may include vertical and horizontal synchronization signals, a data enable signal, a driving frequency clock signal, etc. And the driving voltages may include high-potential DC voltages of various magnitudes such as about 5V to 21V, low-potential ground voltages, and AC voltages of preset magnitudes.

[0047] The circuit board (300) includes a plurality of touch wires that transmit touch driving signals and touch detection signals, interface wires that transmit digital video data and timing signals, power wires that transmit driving voltages of different sizes, ground or earth wires, and option control wires that transmit offset control signals such as sensor control signals or image processing signals. Here, the plurality of touch wires, at least one ground wire or earth wire, interface wires, power wires, and option control wires may be arranged and configured in a stacked form on different layers with an insulating layer in between. Here, the plurality of touch wires may include touch driving wires and touch detection wires.

[0048] The touch driving circuit (400) can be placed on the circuit board (300). The touch driving circuit (400) can be formed as an integrated circuit (IC) and mounted on the circuit board (300).

[0049] The touch driving circuit (400) is electrically connected to the touch electrodes of the touch detection unit (TSU) through touch wiring (e.g., touch driving wiring and touch detection wiring) formed on the circuit board (300) and touch wiring formed in the sub-area (SBA). The touch driving circuit (400) applies touch driving signals to the touch electrodes of the touch detection unit (TSU) and measures the amount of change in the mutual capacitance charge of the touch nodes formed by the touch electrodes. Specifically, the touch driving circuit (400) applies touch driving signals to the touch electrodes and measures the change in capacitance of the touch nodes according to the voltage magnitude or current amount change of the touch detection signal received through the touch electrodes. In this way, the touch driving circuit (400) can determine whether a user touches and whether they are in proximity, etc., based on the amount of change in the mutual capacitance charge of each of the touch nodes. A user touch refers to an object, such as a user's finger or an electronic pen, directly contacting one side of the cover window placed on the touch detection unit (TSU). User proximity refers to an object, such as the user's finger or electronic pen, hovering away from one side of the cover window.

[0050] FIG. 4 is a layout diagram schematically showing an example of a display panel illustrated in FIG. 1 to 3. Specifically, FIG. 4 is a layout diagram showing a display area (DA) and a non-display area (NDA) of a display module (DU) in a state prior to the formation of a touch sensing unit (TSU).

[0051] The display area (DA) is an area for displaying images and can be defined as the central area of ​​the display panel (100). The display area (DA) may include a plurality of pixels (SP), a plurality of gate wiring (GL), a plurality of data wiring (DL), and a plurality of power wiring (VL). Each of the plurality of pixels (SP) can be defined as a minimum unit that outputs light.

[0052] A plurality of gate wires (GL) can supply a gate signal received from a gate driver (210) to a plurality of pixels (SP). The plurality of gate wires (GL) can be extended in the X-axis direction and can be spaced apart from each other in the Y-axis direction intersecting the X-axis direction.

[0053] A plurality of data lines (DL) can supply data voltage received from a display driving circuit (200) to a plurality of pixels (SP). The plurality of data lines (DL) can be extended in the Y-axis direction and can be spaced apart from each other in the X-axis direction.

[0054] A plurality of power lines (VL) can supply a power voltage received from a display driving circuit (200) to a plurality of pixels (SP). Here, the power voltage may be at least one of a driving voltage, an initialization voltage, and a reference voltage. A plurality of power lines (VL) may extend in the Y-axis direction and may be spaced apart from each other in the X-axis direction.

[0055] A non-display area (NDA) may surround a display area (DA). The non-display area (NDA) may include a gate driver (210), fan-out wirings (FOL), and gate control wirings (GCL). The gate driver (210) may generate a plurality of gate signals based on a gate control signal and may sequentially supply the plurality of gate signals to a plurality of gate wirings (GL) according to a set order.

[0056] Fan-out wires (FOL) can extend from the display driving circuit (200) to the display area (DA). The fan-out wires (FOL) can supply data voltage received from the display driving circuit (200) to a plurality of data wires (DL).

[0057] The gate control wiring (GCL) can be extended from the display driving circuit (200) to the gate driving unit (210). The gate control wiring (GCL) can supply a gate control signal received from the display driving circuit (200) to the gate driving unit (210).

[0058] The sub-region (SBA) may include a display driving circuit (200), a display pad area (DPA), and first and second touch pad areas (TPA1, TPA2).

[0059] The display driving circuit (200) can output signals and voltages to drive the display panel (100) to the fan-out wiring (FOL). The display driving circuit (200) can supply a data voltage to the data wiring (DL) through the fan-out wiring (FOL). The data voltage can be supplied to a plurality of pixels (SP) and can determine the brightness of the plurality of pixels (SP). The display driving circuit (200) can supply a gate control signal to the gate driving unit (210) through the gate control wiring (GCL).

[0060] The display pad area (DPA), the first touch pad area (TPA1), and the second touch pad area (TPA2) may be positioned at the edge of the sub-area (SBA). The display pad area (DPA), the first touch pad area (TPA1), and the second touch pad area (TPA2) may be electrically connected to the circuit board (300) using a low-resistance, high-reliability material such as an anisotropic conductive film or SAP.

[0061] The display pad area (DPA) may include a plurality of display pad sections. The plurality of display pad sections may be connected to a display driving circuit (200) through a circuit board (300). The plurality of display pad sections may be connected to the circuit board (300) to receive digital video data and supply digital video data to the display driving circuit (200).

[0062] Figure 5 is a layout diagram schematically showing an example of a touch sensing module illustrated in Figure 3.

[0063] In FIG. 5, for convenience of explanation, only the driving electrodes (TE), sensing electrodes (RE), dummy patterns (DE), touch wiring (SL), and first and second touch pads (TP1, TP2) are shown.

[0064] In FIG. 5, the touch electrodes (SE) of the main area (MA) include two types of electrodes, for example, driving electrodes (TE) and sensing electrodes (RE), and are driven by a mutual capacitance method in which a change in charge of each of the multiple touch nodes is detected through the sensing electrodes (RE) after a touch driving signal is applied to the driving electrodes (TE), but is not limited thereto.

[0065] The main area (MA) of the touch detection unit (TSU) includes a touch detection area (TSA) for detecting a user's touch and a touch peripheral area (TPA) disposed around the touch detection area (TSA). The touch detection area (TSA) may overlap with the display area (DA) of FIGS. 1 to 3, and the touch peripheral area (TPA) may overlap with the non-display area (NDA).

[0066] Driving electrodes (TE), sensing electrodes (RE), and dummy patterns (DE) are disposed in the touch sensing area (TSA). The driving electrodes (TE) and sensing electrodes (RE) may be electrodes for forming mutual capacitance to detect the touch of an object or person.

[0067] The sensing electrodes (RE) can be arranged parallel to each other in a first direction (X-axis direction) and a second direction (Y-axis direction). The sensing electrodes (RE) can be electrically connected in the first direction (X-axis direction). Adjacent sensing electrodes (RE) in the first direction (X-axis direction) can be connected to each other. Adjacent sensing electrodes (RE) in the second direction (Y-axis direction) can be electrically separated from each other. As a result, a touch node (TN) in which mutual capacitance is formed can be placed at each of the intersections of the driving electrodes (TE) and the sensing electrodes (RE). Multiple touch nodes (TN) can correspond to the intersections of the driving electrodes (TE) and the sensing electrodes (RE).

[0068] Driving electrodes (TE) can be arranged parallel to each other in a first direction (X-axis direction) and a second direction (Y-axis direction). Driving electrodes (TE) adjacent in the first direction (X-axis direction) can be electrically isolated from each other. Driving electrodes (TE) can be electrically connected in the second direction (Y-axis direction). Driving electrodes (TE) adjacent in the second direction (Y-axis direction) may also be connected to each other through separate connecting electrodes.

[0069] Each of the dummy patterns (DE) may be arranged in a form surrounded by a driving electrode (TE) or a sensing electrode (RE). Each of the dummy patterns (DE) may be electrically isolated from the driving electrode (TE) or the sensing electrode (RE). Each of the dummy patterns (DE) may be arranged apart from the driving electrode (TE) or the sensing electrode (RE). Each of the dummy patterns (DE) may be electrically floating.

[0070] In FIG. 5, the driving electrodes (TE), sensing electrodes (RE), and dummy patterns (DE) are each illustrated as having a rhombus planar shape, but are not limited thereto. For example, the driving electrodes (TE), sensing electrodes (RE), and dummy patterns (DE) may each have a planar shape other than a rhombus, a polygon other than a square, a circle, or an ellipse.

[0071] Touch wiring (SL) can be placed in the sensor peripheral area (TPA). The touch wiring (SL) includes first touch driving wiring (TL1) and second touch driving wiring (TL2) connected to driving electrodes (TE), and touch sensing wiring (RL) connected to sensing electrodes (RE).

[0072] Each sensing electrode (RE) positioned at one end of the touch sensing area (TSA) can be connected one-to-one to the touch sensing wires (RL). For example, as shown in FIG. 5, each sensing electrode (RE) positioned at the right end among the sensing electrodes (RE) electrically connected in the first direction (X-axis direction) can be connected to each touch sensing wire (RL). And each touch sensing wire (RL) can be connected one-to-one to the second touch pads (TP2) positioned in the pad portion (PD).

[0073] Driving electrodes (TE) positioned at one end of the touch sensing area (TSA) may be connected one-to-one to the first touch driving wires (TL1), and driving electrodes (TE) positioned at the other end of the touch sensing area (TSA) may be connected one-to-one to the second touch driving wires (TL2). For example, among the driving electrodes (TE) electrically connected in the second direction (Y-axis direction), the driving electrodes (TE) positioned at the end of the first side (e.g., the direction adjacent to the display pad area (DPA)) may be connected to the first touch driving wires (TL1), and the driving electrodes (TE) positioned at the end of the second side (e.g., the direction opposite to the display pad area (DPA)) may be connected to the second touch driving wires (TL2). The second touch driving wires (TL2) can be connected to driving electrodes (TE) on the second side of the touch sensing area (TSA) (e.g., opposite direction of the display pad area (DPA)) via the outside of the left or right direction of the touch sensing area (TSA).

[0074] The first touch driving wires (TL1) and the second touch driving wires (TL2) can be connected one-to-one to the first touch pads (TP1) placed in the pad portion (PD). Driving electrodes (TE) are connected to the first and second touch driving wires (TL1, TL2) on both sides of the touch detection area (TSA) to receive touch driving signals. Accordingly, it is possible to prevent a difference from occurring between the touch driving signal applied to the driving electrodes (TE) placed on the first side of the touch detection area (TSA) (e.g., in a direction adjacent to the display pad area (DPA)) and the touch driving signal applied to the driving electrodes (TE) placed on the second side of the touch detection area (TSA) (e.g., in a direction opposite to the display pad area (DPA)) due to the RC delay of the touch driving signal.

[0075] When a circuit board (300) is connected to a sub-region (SBA) of a display panel (100), the display pad area (DPA) of the pad portion (PD) and the first and second touch pad areas (TPA1, TPA2) may correspond to the pads of the display panel (100) connected to the circuit board (300). Accordingly, the pads of the display panel (100) may be in contact with the display pads (DP), the first touch pads (TP1), and the second touch pads (TP2). The display pads (DP), the first touch pads (TP1), and the second touch pads (TP2) may be electrically connected to the pads of the circuit board (300) using a low-resistance, high-reliability material such as an anisotropic conductive film or SAP. Therefore, the display pads (DP), the first touch pads (TP1), and the second touch pad (TP2) can be electrically connected to a touch driving circuit (400) placed on the circuit board (300).

[0076] FIG. 6 is a plan view of a first embodiment specifically showing the circuit board illustrated in FIG. 1 to FIG. 3.

[0077] Referring to FIG. 6, the circuit board (300) is divided into a main planar area (310) and a sub-extended area (320). The circuit board (300) includes a low-resistance film (EPF) that is bonded to cover at least a portion of the front surface of the wiring embedded area (wherein the front surface or front direction is a surface in the Z-axis direction of the thickness direction or Z-axis direction) and the front surface (third direction) of the sub-extended area (320).

[0078] Specifically, the main planar area (310) includes an element placement area (311), an output pad area, and a wiring embedding area, and the sub-extension area (320) is formed to protrude and extend from the main planar area (310), and an input pad area (321) is disposed at one end.

[0079] A low-resistance film (EPF) is bonded to cover at least a portion of the front of the wiring embedded area and the front of the sub-extended area (320) (e.g., the third direction).

[0080] The main planar area (310) is formed in a polygonal planar shape such as a circle, a rhombus, or a rectangle, and a plurality of output pad portions may be formed and arranged on one side of the main planar area (310). An element placement area (311) is defined in one outer planar area of ​​the main planar area (310), and various electrical elements such as an integrated circuit, a touch driving circuit (400), a resistor, and a capacitor may be arranged in the element placement area (311).

[0081] In the wiring embedded area of ​​the main planar area (310), a plurality of touch wires that transmit first and second touch driving signals and touch detection signals, interface wires that transmit digital video data and timing signals, power wires that transmit driving voltages of different sizes, ground or earth wires, and option control wires that transmit offset control signals such as sensor control signals or image processing signals are patterned and arranged. As described above, the plurality of touch wires, at least one ground wire or earth wire, interface wires, power wires, and option control wires can be arranged and configured in a stacked form on different layers with each insulating layer in between.

[0082] The sub-extension area (320) is formed integrally with the main planar area (310) and has a shape that protrudes from one side of the main planar area (310), extending to an input pad area (321) at one end. An input pad section is formed in the input pad area (321), and the input pads (PP) of the input pad section are electrically connected to contact pads such as a graphics system, such as a graphics card, or a graphics control processor.

[0083] The sub-extension area (320) is formed in a rectangular shape such as a rectangle or a square, and the interface wiring, power wiring, option control wiring, etc. formed in the wiring built-in area of ​​the main planar area (310) extend to the sub-extension area (320).

[0084] Interface wires, power wires, option control wires, etc. formed in the wiring built-in area of ​​the main planar area (310) have one end in one-to-one contact with the output pads of the output pad section and extend to the sub-extension area (320), so that the other end can be in one-to-one contact with the input pads (PP) of the input pad section formed in the input pad area (321) of the sub-extension area (320).

[0085] For example, touch wiring formed in the wiring embedded area of ​​the circuit board (300) transmits first and second touch driving signals output from the touch driving signal output terminal of the touch driving circuit (400) to output pads placed in the output pad section, and conversely transmits touch detection signals input through the input pads of the output pad section to the touch driving circuit (400).

[0086] Additionally, the interface wiring of the circuit board (300) transmits digital video data and timing signals input through input pads (PP) located in one input pad section to output pads located in the other output pad section. The digital video data and timing signals can be supplied to the display driving circuit (200) of the sub-region (SBA) through the output pads.

[0087] The ground wiring or ground wiring of the circuit board (300) transmits the ground voltage or ground voltage input through the input pads placed in the input pad section to the output pads placed in the output pad section of the other end. The ground voltage or ground voltage is supplied to the ground or ground terminal of the display driving circuit (200) mounted in the sub-region (SBA).

[0088] The optional control wiring of the circuit board (300) transmits offset control signals, such as sensor control signals or image processing signals, which are input through input pads placed in the input pad section, to output pads placed in the output pad section of the other end. The offset control signals, such as sensor control signals or image processing signals, are supplied to the display driving circuit (200) through the output pads, etc.

[0089] Meanwhile, the low-resistance film (EPF) is adhered to cover the front surface (e.g., the third direction (Z-axis direction)) or at least a portion of the main planar region (310) and the sub-extended region (320), excluding the device placement area (311) of the main planar region (310). Here, the low-resistance film (EPF) may be formed from a film or thin film forming material of a non-conductive material, such as elastic rubber, a non-conductive ceramic compound, an insulating plastic film, or an insulating tape.

[0090] The low-resistance film (EPF) includes an impedance control pattern area (ICO) formed corresponding to the interface wiring formed in the main planar area (310) and the sub-extended area (320), including at least one opening (e.g., an open area) or at least one cut-out in the front direction (e.g., a third direction (Z-axis direction)) of the interface wiring.

[0091] The impedance control pattern area (ICO) of the low-resistance film (EPF) can be formed in either the front direction of the main planar area (310) or the sub-extension area (320), and can be placed in any front area (e.g., the third direction (Z-axis direction)) that overlaps with the interface wiring, thereby controlling or maintaining the impedance magnitude of the interface wiring.

[0092] As described above, the interface wires, power wires, and option control wires are each patterned and arranged in an inner layer of either the main planar area (310) or the sub-extension area (320), such that one end is in one-to-one contact with the output pads of the main planar area (310) and the other end is in one-to-one contact with the input pads (PP) of the sub-extension area (320).

[0093] A low-resistance film (EPF) can be placed to cover the wiring embedded area of ​​the main planar area (310) and the front of the sub-extension area (320) where interface wiring, power wiring, and optional control wiring are formed.

[0094] However, the impedance control pattern area (ICO) of the low-resistance film (EPF) is positioned in the front direction (e.g., the third direction (Z-axis direction)) that overlaps with the interface wiring, including at least one opening or at least one open cut, thereby controlling the magnitude of electromagnetic interference of the interface wiring and controlling or maintaining the impedance magnitude.

[0095] FIG. 7 is a cross-sectional view showing an example of a circuit board cut along the line I-I' of FIG. 6.

[0096] Referring to FIG. 7, the circuit board (300) may be configured to include a plurality of wiring layers stacked and arranged on different layers with each insulating layer in between on a base substrate (SCB).

[0097] Specifically, the circuit board (300) may be formed to include a base substrate (SCB), a touch wiring layer (TLA), a first ground wiring layer (GLA1), an interface wiring layer (MPA), a second ground wiring layer (GLA2), and an option control wiring layer (SLA).

[0098] Specifically, the base substrate (SCB) can be formed from an insulating substrate such as glass, silicon, or plastic.

[0099] A touch wiring layer (TLA) is patterned and formed on a base substrate (SCB) including touch wiring (e.g., a first touch driving wiring (TL1)) and at least one first interlayer insulating film (IN1).

[0100] The first ground wiring layer (GLA1) is patterned and formed on the touch wiring layer (TLA) including first ground wirings (FG) and at least one second interlayer insulating film (IN2).

[0101] An interface wiring layer (MPA) is patterned and formed on a first ground wiring layer (GLA1) including interface wirings (ML) and at least one third interlayer insulating film (IN3).

[0102] The second ground wiring layer (GLA2) is patterned and formed on the interface wiring layer (MPA) including second ground wirings (MG) and at least one fourth interlayer insulating film (IN4).

[0103] The optional control wiring layer (SLA) is patterned and formed on the second ground wiring layer (GLA2) to include optional control wiring (DSL) and at least one fifth interlayer insulating film (IN5).

[0104] A low-resistance film (EPF) is attached and disposed on the optional control wiring layer (SLA), wherein an impedance control pattern region (ICO) is formed in the front direction (e.g., the third direction (Z-axis direction)) of at least some of the interface wirings (ML). At least one opening or at least one open cut is formed in the impedance control pattern region (ICO) of the low-resistance film (EPF), thereby allowing the electromagnetic field characteristics of the interface wirings (ML) to be maintained or controlled at a constant level without distortion. Accordingly, the impedance magnitude of the interface wirings (ML) can be efficiently controlled or maintained at a constant level.

[0105] Referring to FIG. 7, the base substrate (SCB) may be made of an insulating material such as a polymer resin. For example, the base substrate (SCB) may be made of polyimide. The base substrate (SCB) may be a flexible substrate capable of bending, folding, rolling, etc. A barrier film may first be formed on such a base substrate (SCB). The barrier film is a film intended to protect each interlayer insulating film (IN1 to IN5) and each wiring, such as the interface wiring (ML), from moisture penetrating through the base substrate (SCB), which is vulnerable to moisture permeability. The barrier film may be formed as a multilayer film in which a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, etc. are stacked.

[0106] The touch wiring of the touch wiring layer (TLA) (e.g., first touch driving wiring (TL1)) may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof. And the first interlayer insulating film (IN1) may be formed as an inorganic film, e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0107] The first ground wiring (FG) of the first ground wiring layer (GLA1) can be formed in the form of a through ground wiring, that is, a flat wiring. This first ground wiring (FG) can be formed as a single layer or a multilayer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof. And the second interlayer insulating film (IN2) can be formed from the same inorganic material as the first interlayer insulating film (IN1), for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0108] The interface wires (ML) of the interface wiring layer (MPA) may be formed as a single layer or multiple layers made of any one of the same metallic materials or alloys as the touch wires (e.g., the first touch driving wire (TL1)). And the third interlayer insulating film (IN3) may be formed of the same inorganic material as the first or second interlayer insulating film (IN1, IN2).

[0109] The second ground wiring (MG) of the second ground wiring layer (GLA2) can be patterned and formed in the form of a mesh structure or a net structure. These second ground wiring (MG) can be formed as a single layer or a multilayer made of any one of the same metal materials as the first ground wiring (FG) or an alloy thereof. And the fourth interlayer insulating film (IN3) can be formed of the same inorganic material as the first or second interlayer insulating film (IN1, IN2).

[0110] The optional control wires (DSL) of the optional control wiring layer (SLA) may be formed as a single layer or multiple layers made of any one of the same metallic materials or alloys as the touch wires (e.g., the first touch driving wire (TL1)). And the fifth interlayer insulating film (IN5) may be formed of the same inorganic material as the first or second interlayer insulating film (IN1, IN2).

[0111] FIG. 8 is a plan view of a second embodiment specifically showing the circuit board illustrated in FIG. 1 to 3.

[0112] Referring to FIG. 8, a low-resistance film (EPF) is bonded to cover the front surface (e.g., the third direction (Z-axis direction)) or at least a portion of the main planar region (310) and the sub-extended region (320), excluding the element placement area (311) of the main planar region (310).

[0113] The low-resistance film (EPF) includes an impedance control pattern area (ICO) formed such that at least a portion of the front (e.g., third direction (Z-axis direction)) areas corresponding to the interface wirings formed in the main planar area (310) and the sub-extension area (320), e.g., first to n interface wirings (ML1 to MLn), are open. Here, n is a positive integer.

[0114] The impedance control pattern area (ICO) controls the impedance magnitude of the interface wiring (ML1 to MLn) according to the size or area of ​​the open area, such as an opening or cut.

[0115] Specifically, the impedance control pattern area (ICO) includes first to nth cuts (IO1 to IOn) that are each cut into the same or different sizes and areas so that at least some front areas corresponding to the interface wiring (ML1 to MLn) are open. For example, the first and second cuts (IO1, IO2) may be cut into the same size and area, and the nth cut (IOn) may be cut into a different size and area from the first and second cuts (IO1, IO2).

[0116] In addition, the open cut shapes of the first to nth cut sections (IO1 to IOn) may be formed in polygonal shapes such as triangles or rhombuses, in addition to the rectangles shown in the drawings, or may be formed in shapes that are identical or different from each other, such as circles, semicircles, or ellipses.

[0117] FIG. 9 is a plan view of a third embodiment specifically showing the circuit board illustrated in FIG. 1 to 3.

[0118] Referring to FIG. 9, the low-resistance film (EPF) is formed such that at least some front areas corresponding to interface wirings formed in the main planar area (310) and sub-extension area (320), such as the first to nth interface wirings (ML1 to MLn), are open, and includes an impedance control pattern area (ICO) that controls the impedance magnitude of the interface wirings (ML1 to MLn) according to the size or area of ​​the open area.

[0119] The impedance control pattern area (ICO) includes first to n openings (CO1 to COn) formed such that at least some front areas corresponding to the interface wiring (ML1 to MLn) are each opened with the same or different sizes and areas. For example, the first and second openings (CO1, CO2) may be opened with the same size and area, and the n opening (COn) may be opened with a different size and area from the first and second openings (CO1, CO2).

[0120] In addition, the open shapes of the first to n openings (CO1 to COn) may be formed in polygonal shapes such as triangles or rhombuses, in addition to the rectangles shown in the drawings, or in shapes that are identical or different from each other, such as circles, semicircles, or ellipses.

[0121] The display device (10) according to an embodiment of the present invention can be applied to various electronic devices. An electronic device according to one embodiment includes the display device (10) according to an embodiment of the present invention as described below, and may further include a module or device having additional functions other than the display device.

[0122] FIG. 10 is a block diagram of an electronic device according to one embodiment.

[0123] Referring to FIG. 10, an electronic device (110) according to one embodiment may include a display device (10), a processor (12), a memory (13), and a power module (14).

[0124] The processor (12) may include at least one of a central processing unit (CPU), an application processor (AP), a graphic processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0125] The memory (15) may store data information necessary for the operation of the processor (12) or the display device (10). When the processor (12) executes an application program stored in the memory (15), an image data signal and / or an input control signal are transmitted to the display device (10), and the display device (10) can process the received signal and output image information through a display screen.

[0126] The power module (14) may include a power supply module, such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate power necessary for the operation of the electronic device (110).

[0127] At least one of each component of the electronic device (110) described above may be included in a display device according to the embodiments described above. Additionally, some of the individual modules functionally included in one module may be included in the display device (10), while others may be provided separately from the display device (10). For example, the display device (10) may include a display panel, and the processor (12), memory (13), and power module (14) may be provided in the form of other devices within the electronic device (110) rather than the display device (10).

[0128] FIG. 11 is a schematic diagram of an electronic device according to various embodiments.

[0129] Referring to FIG. 11, various electronic devices (110) to which a display device (10) according to embodiments is applied may include not only image display electronic devices such as a smartphone (110_1a), tablet PC (110_1b), laptop (110_1c), TV (110_1d), and desk monitor (110_1e), but also wearable electronic devices including display modules such as smart glasses (110_2a), head-mounted display (110_2b), and smart watch (110_2c), and automotive electronic devices (110_3) including display modules such as a Center Information Display (CID) and a room mirror display placed on the instrument panel, center fascia, and dashboard of a car. In addition, the display device (10) may be applied as a display component of a television, laptop, monitor, billboard, or Internet of Things (IOT).

Claims

1. A display panel that displays an image through pixels in a display area; A touch driving circuit that detects user touch through a touch detection unit of the above-mentioned display panel and generates touch coordinate data; A display driving circuit that supplies data voltage to pixels of the above-mentioned display area and controls the image display timing of the pixels; A circuit board electrically contacted to the display panel, comprising a plurality of wires among touch wires, ground wires, interface wires, power wires and optional control wires; and It includes a low-resistance film that is bonded to partially cover the upper surface of the circuit board or the thickness direction of the Z-axis, and The above low-resistance film is A display device positioned on the upper surface of the interface wirings or in the thickness direction of the Z-axis in correspondence with the interface wirings.

2. In Paragraph 1, A plurality of wires among the touch wires, ground wires, interface wires, power wires, and option control wires are patterned and arranged in a stacked form on different layers with each different interlayer insulation layer in between, and A display device comprising an impedance control pattern area formed in the form of at least one opening or at least one cut, wherein the above low-resistance film is disposed on the upper surface of the interface wirings or in the thickness direction of the Z-axis.

3. In Paragraph 2, The above low-resistance film is a display device formed as an elastic rubber, a non-conductive film including a non-conductive ceramic compound, an insulating tape formed of a non-conductive thin film forming material, or an insulating plastic film type.

4. In Paragraph 1, The above circuit board is A main planar area in which the component placement area, output pad area, and wiring embedding area are respectively separated in a planar form; It includes a sub-extension area formed to protrude and extend from the main planar area and having an input pad area formed at one end that includes a plurality of input pads, A display device in which the above low-resistance film is disposed and bonded to cover at least a portion of the front direction of the wiring embedded area (wherein the front or front direction is a surface in the Z-axis direction of the thickness direction or the Z-axis direction) and the front of the sub-extended area.

5. In Paragraph 4, A plurality of wires among the touch wires, ground wires, interface wires, power wires, and option control wires are patterned and arranged in a stacked form on different layers with each different interlayer insulation layer in between, and The above low-resistance film is a display device positioned and adhered to the front direction of the interface wirings in correspondence with the interface wirings.

6. In Paragraph 5, The above low-resistance film is It includes an impedance control pattern region formed in the shape of at least one opening or at least one cutout corresponding to the upper surface or front direction of the interface wirings, The above impedance control pattern region is A display device disposed in any one area of ​​the front surface that overlaps with the interface wiring to adjust or maintain the impedance magnitude and electromagnetic interference magnitude of the interface wiring formed in the main planar area or the sub-extension area.

7. In Paragraph 4, The above circuit board is Base substrate; A touch wiring layer formed on the base substrate, comprising touch wiring and at least one first interlayer insulating film; A first ground wiring layer formed on the touch wiring layer, comprising first ground wirings and at least one second interlayer insulating film; An interface wiring layer formed on the first ground wiring layer, comprising interface wirings and at least one third interlayer insulating film; A second ground wiring layer formed on the interface wiring layer, comprising second ground wirings and at least one fourth interlayer insulating film; and A display device comprising an optional control wiring layer formed on the second ground wiring layer, including optional control wiring and at least one fifth interlayer insulating film.

8. In Paragraph 7, The above low-resistance film is It is positioned and bonded in the front direction of the interface wirings in correspondence with the interface wirings, and A display device comprising an impedance control pattern area formed in the shape of at least one opening or at least one cutout corresponding to the upper surface or front direction of the interface wiring (wherein the front or front direction is the surface or Z-axis direction of the thickness direction).

9. A display panel that displays an image through pixels in a display area; A touch driving circuit that detects user touch through a touch detection unit of the above-mentioned display panel and generates touch coordinate data; A display driving circuit that supplies data voltage to pixels of the above-mentioned display area and controls the image display timing of the pixels; and A circuit board electrically contacted to the display panel, comprising a plurality of wires among touch wires, ground wires, interface wires, power wires, and optional control wires, and The above circuit board includes a low-resistance film that is bonded to partially cover the upper surface or the front surface of the circuit board, and The above low-resistance film is a display device positioned on the upper surface or front side of the above interface wirings.

10. In Paragraph 9, The above low-resistance film is a display device formed as an elastic rubber, a non-conductive film including a non-conductive ceramic compound, an insulating tape formed of a non-conductive thin film forming material, or an insulating plastic film type.

11. In Paragraph 9, The above circuit board is A main planar area in which the component placement area, output pad area, and wiring embedding area are respectively separated in a planar form; It includes a sub-extension area formed to protrude and extend from the main planar area and having an input pad area formed at one end that includes a plurality of input pads, A display device in which the above low-resistance film is placed and adhered to cover at least a portion of the front surface of the wiring embedded area and the front surface of the sub-extended area.

12. In Paragraph 11, A plurality of wires among the touch wires, ground wires, interface wires, power wires, and option control wires are patterned and arranged in a stacked form on different layers with each different interlayer insulation layer in between, and The above low-resistance film is a display device positioned and adhered to the front direction of the interface wirings in correspondence with the interface wirings.

13. In Paragraph 12, The low-resistance film includes an impedance control pattern region formed in the shape of at least one opening or at least one cut corresponding to the upper surface or front direction of the interface wirings, and The above impedance control pattern area is a display device positioned in any area of ​​the front surface (e.g., thickness direction of the Z-axis) that overlaps with the interface wiring formed in the main planar area or the sub-extension area to control or maintain the impedance magnitude and electromagnetic interference magnitude of the interface wiring.

14. In Paragraph 11, The above circuit board is Base substrate; A touch wiring layer formed on the base substrate, comprising touch wiring and at least one first interlayer insulating film; A first ground wiring layer formed on the touch wiring layer, comprising first ground wirings and at least one second interlayer insulating film; An interface wiring layer formed on the first ground wiring layer, comprising interface wirings and at least one third interlayer insulating film; A second ground wiring layer formed on the interface wiring layer, comprising second ground wirings and at least one fourth interlayer insulating film; and A display device comprising an optional control wiring layer formed on the second ground wiring layer, including optional control wiring and at least one fifth interlayer insulating film.

15. In Paragraph 14, The above low-resistance film is It is positioned and bonded in the front direction of the interface wirings in correspondence with the interface wirings, and A display device comprising an impedance control pattern area formed in the shape of at least one opening or at least one cutout corresponding to the upper surface or front direction of the interface wiring.

16. A display device for displaying images; An image signal processor that controls the image display timing of the above-mentioned display device; A memory storing data information and application programs necessary for the operation of the above-mentioned display device; and In an electronic device comprising a power module that provides a power signal to the above-mentioned display device, The above display device A display panel that displays an image through pixels in a display area; A touch driving circuit that detects user touch through a touch detection unit of the above-mentioned display panel and generates touch coordinate data; A display driving circuit that supplies data voltage to pixels of the above-mentioned display area and controls the image display timing of the pixels; A circuit board electrically contacted to the display panel, comprising a plurality of wires among touch wires, ground wires, interface wires, power wires and optional control wires; and An electronic device comprising a low-resistance film bonded to partially cover the upper surface or front surface (wherein the front surface or front direction is the surface in the Z-axis direction of the thickness direction or the Z-axis direction) of the above circuit board.

17. In Paragraph 16, The above circuit board is A main planar area in which the component placement area, output pad area, and wiring embedding area are respectively separated in a planar form; It includes a sub-extension area formed to protrude and extend from the main planar area and having an input pad area formed at one end that includes a plurality of input pads, A display device in which the above low-resistance film is placed and adhered to cover at least a portion of the front surface of the wiring embedded area and the front surface of the sub-extended area.

18. In Paragraph 17, A plurality of wires among the touch wires, ground wires, interface wires, power wires, and option control wires are patterned and arranged in a stacked form on different layers with each different interlayer insulation layer in between, and The above low-resistance film is an electronic device disposed and bonded in the front direction of the interface wirings in correspondence with the interface wirings.

19. In Paragraph 18, The low-resistance film includes an impedance control pattern region formed in the shape of at least one opening or at least one cut corresponding to the upper surface or front direction of the interface wirings, and The above impedance control pattern area is an electronic device disposed in any one area of ​​the front surface that overlaps with the interface wiring to control or maintain the impedance magnitude and electromagnetic interference magnitude of the interface wiring formed in the main planar area or the sub-extension area.

20. In Article 18 or Article 19, The low-resistance film includes an impedance control pattern region formed in the shape of at least one opening or at least one cut corresponding to the upper surface or front direction of the interface wirings, and The above impedance control pattern area is an electronic device disposed in any one area of ​​the front surface that overlaps with the interface wiring to control or maintain the impedance magnitude and electromagnetic interference magnitude of the interface wiring formed in the main planar area or the sub-extension area.

Images