Optical module

Abstract

The present disclosure provides an optical module, comprising: a carrier, an optical transmitting component, and an optical receiving component, the optical transmitting component being disposed on a top surface of the carrier. The optical transmitting component comprises a first laser array, a first optical filter array, a first reflector array, a first optical fiber, and a first light-transmitting substrate. The first optical filter array is located in a light emission direction of the first laser array. The first optical filter array and the first reflector array are bonded to one end of the first light-transmitting substrate, and the first reflector array is disposed opposite to the first optical filter array, such that multiple-wavelength optical signals can be reflected between the first reflector array and the first optical filter array to achieve wavelength combining. The first optical fiber is fixed to the other end of the first light-transmitting substrate. A first lens is formed at the other end of the first light-transmitting substrate. The first lens is located between the first optical fiber and the first optical filter array to focus the wavelength-combined optical signals into the first optical fiber, thereby achieving transmission of the multiple-wavelength optical signals. The optical receiving component is disposed on a bottom surface of the carrier, and comprises: a second optical fiber; a second optical filter array, located in a light emission direction of the second optical fiber; a second reflector array, disposed opposite to the second optical filter array, such that optical signals are reflected between the second optical filter array and the second reflector array to achieve wavelength demultiplexing; a first optical receiving chip array, having a light incident direction different from the light emission direction of the second optical fiber and configured to receive optical signals; and a second light-transmitting substrate, the second optical fiber being fixed at one end of the second light-transmitting substrate, and the second optical filter array and the second reflector array being bonded at a middle portion of the second light-transmitting substrate. A second lens is formed at one end of the second light-transmitting substrate and is located between the second optical fiber and the second optical filter array. The other end of the second light-transmitting substrate is configured to change a transmission direction of optical signals, so that the first optical receiving chip array receives the wavelength-demultiplexed optical signals.

Description

optical module

[0001] This application claims priority to Chinese Patent Application No. 202510322522.1, filed on March 18, 2025; and priority to Chinese Patent Application No. 2025103225005, filed on March 18, 2025; the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0003] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing. Summary of the Invention

[0004] This disclosure provides an optical module that enables the transmission of optical signals of multiple wavelengths.

[0005] In some embodiments, an optical module is provided, comprising:

[0006] Circuit board;

[0007] The carrier component is connected to the circuit board at one end;

[0008] A light-emitting component is disposed on the top surface of the carrier and is electrically connected to the circuit board;

[0009] The light emitting component includes:

[0010] The first laser array is used to emit optical signals;

[0011] The first filter array is located in the light-emitting direction of the first laser array;

[0012] The first reflective sheet array is arranged opposite to the first filter array so that the optical signal is reflected between the first filter array and the first reflective sheet array to achieve wave combining;

[0013] The first optical fiber is used to receive the optical signal;

[0014] A first light-transmitting substrate has the first filter array and the first reflective sheet array attached to one end, and the first optical fiber fixed to the other end; a first lens is formed at the other end of the first light-transmitting substrate, and the first lens is located between the first optical fiber and the first filter array.

[0015] A light receiving component is disposed on the bottom surface of the carrier and is electrically connected to the circuit board;

[0016] The optical receiving component includes:

[0017] Second optical fiber;

[0018] The second filter array is located in the light-emitting direction of the second optical fiber;

[0019] The second reflective sheet array is arranged opposite to the second filter array so that the optical signal is reflected between the second filter array and the second reflective sheet array to achieve wavelength division.

[0020] The first optical receiving chip array has an input light direction different from the output light direction of the second optical fiber, and is used to receive optical signals;

[0021] The second light-transmitting substrate has the second optical fiber fixed at one end and the second filter array and the second reflective sheet array mounted in the middle; a second lens is formed at one end of the second light-transmitting substrate, and the second lens is located between the second optical fiber and the second filter array; the other end of the second light-transmitting substrate is used to change the transmission direction of the optical signal so that the first optical receiving chip array receives the wavelength-divided optical signal. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments;

[0024] Figure 2 is a partial structural diagram of a host computer according to some embodiments;

[0025] Figure 3 is a structural diagram of an optical module according to some embodiments;

[0026] Figure 4 is an exploded view of an optical module according to some embodiments;

[0027] Figure 5a is an internal structural diagram of an optical module according to some embodiments;

[0028] Figure 5b is an exploded view of the internal structure of an optical module according to some embodiments;

[0029] Figure 5c is a cross-sectional view of the internal structure of an optical module according to some embodiments;

[0030] Figure 5d is a view of the internal structure of an optical module according to some embodiments from another perspective;

[0031] Figure 5e is a cross-sectional view of the internal structure of an optical module according to some embodiments from another perspective;

[0032] Figure 6a is a partial view of a first light emitting component according to some embodiments;

[0033] Figure 6b is a partial exploded view of a first light emitting component according to some embodiments;

[0034] Figure 6c is a structural diagram of a first light-transmitting substrate according to some embodiments;

[0035] Figure 6d is a structural diagram of a first light-transmitting substrate according to some embodiments;

[0036] Figure 6e is a structural diagram of a first light-transmitting substrate according to some embodiments;

[0037] Figure 6f is a partial cross-sectional view of a first light emitting component according to some embodiments;

[0038] Figure 7a is a structural diagram of a first optical receiving component according to some embodiments;

[0039] Figure 7b is an exploded view of a first optical receiving component according to some embodiments;

[0040] Figure 7c is a partial structural exploded view of a first optical receiving component according to some embodiments;

[0041] Figure 7d is a structural diagram of a second light-transmitting substrate according to some embodiments;

[0042] Figure 7e is a structural diagram of a second light-transmitting substrate according to some embodiments;

[0043] Figure 7f is a structural diagram of a second light-transmitting substrate according to some embodiments;

[0044] Figure 7g is a cross-sectional view of a second light-transmitting substrate provided according to some embodiments;

[0045] Figure 7h is a cross-sectional view of a first optical receiving component provided according to some embodiments. Detailed Implementation

[0046] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0047] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0048] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0049] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0050] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0051] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0052] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103, wherein the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0053] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0054] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0055] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0056] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0057] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0058] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0059] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0060] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0061] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0062] Figure 2 is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in a receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106;

[0063] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0064] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0065] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0066] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0067] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0068] Figure 3 is a structural diagram of an optical module according to some embodiments. Figure 4 is an exploded view of an optical module according to some embodiments. As shown in Figures 3 and 4, in some embodiments, the optical module 200 includes a shell, which includes an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0069] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0070] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0071] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200.

[0072] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0073] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0074] As shown in Figures 3 and 4, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors.

[0075] (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET). The chip may include a microcontroller unit (MCU), a laser driver chip, a transimpedance amplifier (TIA), a limiting amplifier (LA), a clock and data recovery chip (CDR), a power management chip, and a digital signal processing (DSP) chip.

[0076] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0077] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0078] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0079] In some implementations, the gold fingers are located on one side of the surface of the circuit board 300 (e.g., the upper surface shown in Figure 4); in other implementations, the gold fingers are located on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to applications with high pin count requirements.

[0080] In some implementations, the gold fingers of the circuit board extend from the electrical port and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0081] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0082] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0083] In some embodiments, the optical module includes a light emitting component 400, which is used to emit light signals.

[0084] In some embodiments, the optical module includes a carrier 900. One end of the carrier 900 may be connected to the circuit board 300. The light emitting component 400 may be supported on the top surface of the carrier 900. The carrier 900 may be made of metal.

[0085] Figure 5a is an internal structural diagram of an optical module according to some embodiments. Figure 5b is an exploded view of the internal structure of an optical module according to some embodiments. Figure 5c is a cross-sectional view of the internal structure of an optical module according to some embodiments. As shown in Figures 5a, 5b, and 5c, in some embodiments, the optical emitting component 400 may include a first laser array 410a, which can emit at least one optical signal. The first laser array 410a may include at least one first laser, which can emit an optical signal. For example, the laser array 420 may include four first lasers arranged side by side along the width direction of the carrier 900, so that the first laser array 410a can emit four optical signals.

[0086] In some embodiments, the first laser array 410a may be mounted on a semiconductor cooler to keep the temperature of the first laser array 410a within a relatively stable range.

[0087] In some embodiments, the light emitting component 400 may include a first filter array 430a. The first filter array 430a may be located in the light emission direction of the first laser array 410a, so that the first filter array 430a can receive the light signal emitted by the first laser array 410a. The first filter array 430a may allow a light signal of a certain wavelength to be transmitted or reflected.

[0088] In some embodiments, the light emitting component 400 may include a first reflective sheet array 440a. The first reflective sheet array 440a is disposed opposite to the first filter array 430a so that the light signal can be reflected between the first filter array 430a and the first reflective sheet array 440a to achieve wave combining.

[0089] In some embodiments, the light emitting component 400 may include a first light-transmitting substrate 420a. The first light-transmitting substrate 420a may be made of polyetherimide (PEI). PEI is a high-performance thermoplastic with excellent high-temperature resistance, mechanical strength, flame retardancy, electrical insulation, and light transmittance. The first light-transmitting substrate 420a is light-transmitting, allowing light signals to be transmitted within it. For example, the first light-transmitting substrate 420a may be molded from PEI.

[0090] In some embodiments, a first filter array 430a and a first reflective array 440a may be attached to one end of the first light-transmitting substrate 420a. The first light-transmitting substrate 420a, the first filter array 430a, and the first reflective array 440a constitute a first beam combiner. The first beam combiner may be located in the light-emitting direction of the first laser array 410a to receive multiple wavelengths of optical signals emitted by the first laser array 410a. The first beam combiner can be used to combine optical signals, such that it can combine multiple wavelengths of optical signals emitted by the first laser array 410a into a single beam of optical signals including multiple wavelengths.

[0091] In some embodiments, the medium between the first filter array 430a and the first reflective sheet array 440a can be air, and the light signal reflected between the first filter array 430a and the first reflective sheet array 440a is transmitted in the air.

[0092] In some embodiments, the medium between the first filter array 430a and the first reflective array 440a can be PEI, and the reflected light signal between the first filter array 430a and the first reflective array 440a is transmitted in the PEI. Since the refractive index of PEI is similar to that of the first reflective array 440a and the material of the first reflective array 440a, the refraction of the light signal can be reduced, thus reducing the loss of the light signal.

[0093] In some embodiments, a first lens may be formed at the other end of the first light-transmitting substrate 420a. The first lens may be located in the light-emitting direction of the first multiplexer to receive the optical signal emitted by the first multiplexer. The first lens may be a converging lens so that the first lens can converge the received optical signal.

[0094] In some embodiments, the light emitting component 400 may include a first optical fiber 460a. The first optical fiber 460a may be fixed to the other end of the first light-transmitting substrate 420a. The first optical fiber 460a may be located in the converging direction of the first lens so that the first optical fiber 460a can receive the light signal converged by the first lens. Instead of fixing the first optical fiber 460a with an optical fiber retainer, directly fixing the first optical fiber 460a to the first light-transmitting substrate 420a can reduce the length of the light emitting component 400.

[0095] In some examples, PEI molding is a mature process with extremely high molding precision. The first transparent substrate 420a can directly produce the first lens, and the relative position of the first lens and the first optical fiber 460a can be guaranteed.

[0096] In some examples, the first lens may be additionally provided and fixed to the other end of the first light-transmitting substrate 420a.

[0097] In some embodiments, the light emitting component 400 may include a first isolator 450a. The first isolator 450a may be mounted on a first light-transmitting substrate 420a. The first isolator 450a may be located between a first multiplexer and a first lens to prevent the light signal from returning along its original path to the first laser array 410a.

[0098] PEI mold opening is a mature process with extremely high mold opening precision. The first filter array 430a, the first reflective array 440a and the first isolator 450a can all be passively mounted on the first light-transmitting substrate 420a without requiring high mounting precision, which greatly improves the production yield.

[0099] In some embodiments, the light emitting component 400 may include a second lens array (not shown). The second lens array may be located in the light emission direction of the first laser array 410a, so that the second lens array can receive the light signal emitted by the first laser array 410a. The second lens array may be a collimating lens array, so that the second lens array can collimate the received light signal. The second lens array may be mounted on a semiconductor cooler, so that the light emission port of the first laser array 410a is at the same height as the central axis of the second lens array. The first filter array 430a may be located in the collimating direction of the second lens array, so that the first filter array 430a can receive the collimated light signal from the second lens array.

[0100] The following description uses the example of an optical emitting component 400 emitting eight optical signals to illustrate the solution provided in this disclosure. In some embodiments, the optical emitting component 400 may include a first laser array 410b, which can emit at least one optical signal. The first laser array 410b may include at least one first laser, which can emit optical signals. For example, the laser array 420 may include four first lasers arranged side-by-side along the width direction of the carrier 900, so that the first laser array 410b can emit four optical signals.

[0101] In some embodiments, the first laser array 410b may be mounted on a semiconductor cooler to keep the temperature of the first laser array 410b within a relatively stable range.

[0102] In some embodiments, the light emitting component 400 may include a first filter array 430b. The first filter array 430b may be located in the light emission direction of the first laser array 410b, so that the first filter array 430b can receive the light signal emitted by the first laser array 410b. The first filter array 430b may allow a certain wavelength of light signal to be transmitted or reflected.

[0103] In some embodiments, the light emitting component 400 may include a first reflective sheet array 440b. The first reflective sheet array 440b is disposed opposite to the first filter array 430b so that the optical signal can be reflected between the first filter array 430b and the first reflective sheet array 440b to achieve wave combining.

[0104] In some embodiments, the light emitting component 400 may include a first light-transmitting substrate 420b. The first light-transmitting substrate 420b may be made of polyetherimide (PEI). PEI is a high-performance thermoplastic with excellent high-temperature resistance, mechanical strength, flame retardancy, electrical insulation, and light transmittance. The first light-transmitting substrate 420b is light-transmitting, allowing light signals to be transmitted within it. For example, the first light-transmitting substrate 420b may be molded from PEI.

[0105] In some embodiments, a first filter array 430b and a first reflective array 440b may be mounted on one end of the first transparent substrate 420b. The first transparent substrate 420b, the first filter array 430b, and the first reflective array 440b constitute a second beam combiner. The second beam combiner may be located in the light emission direction of the first laser array 410b to receive optical signals of multiple wavelengths emitted by the first laser array 410b. The second beam combiner can be used to combine optical signals, such that it can combine the optical signals of multiple wavelengths emitted by the first laser array 410b into a single beam of optical signals including multiple wavelengths.

[0106] In some embodiments, the medium between the first filter array 430b and the first reflective array 440b can be air, and the light signal reflected between the first filter array 430b and the first reflective array 440b is transmitted in the air.

[0107] In some embodiments, the medium between the first filter array 430b and the first reflective array 440b can be PEI, and the reflected light signal between the first filter array 430b and the first reflective array 440b is transmitted in the PEI. Since the refractive index of PEI is similar to that of the first reflective array 440b and the material of the first reflective array 440b, the refraction of the light signal can be reduced, thus reducing the loss of the light signal.

[0108] In some embodiments, a third lens may be formed at the other end of the first light-transmitting substrate 420b. The third lens may be located in the light-emitting direction of the second multiplexer to receive the optical signal emitted by the second multiplexer. The third lens may be a converging lens so that it can converge the received optical signal.

[0109] In some embodiments, the light emitting component 400 may include a first optical fiber 460b. The first optical fiber 460b may be fixed to the other end of the first light-transmitting substrate 420b. The first optical fiber 460b may be located in the converging direction of the third lens so that the first optical fiber 460b can receive the light signal converged by the third lens. Instead of fixing the first optical fiber 460b with an optical fiber retainer, directly fixing the first optical fiber 460b to the first light-transmitting substrate 420b can reduce the length of the light emitting component 400.

[0110] In some examples, PEI molding is a mature process with extremely high molding precision. The third lens can be directly molded from the first light-transmitting substrate 420b, and the relative position of the third lens and the first optical fiber 460b can be guaranteed.

[0111] In some examples, a third lens may be additionally provided and fixed to the other end of the first light-transmitting substrate 420b. In some embodiments, the light-emitting component 400 may include a first isolator 450b. The first isolator 450b may be mounted on the first light-transmitting substrate 420b. The first isolator 450b may be located between the second multiplexer and the third lens to prevent the optical signal from returning along its original path to the first laser array 410b.

[0112] PEI mold opening is a mature process with extremely high mold opening precision. The first filter array 430b, the first reflective array 440b and the first isolator 450b can all be passively mounted on the first light-transmitting substrate 420b without requiring high mounting precision, which greatly improves the production yield.

[0113] In some embodiments, the light emitting component 400 may include a third lens array. The third lens array may be located in the light emission direction of the first laser array 410b, so that the third lens array can receive the light signal emitted by the first laser array 410b. The third lens array may be a collimating lens array, so that the third lens array can collimate the received light signal. The third lens array may be mounted on a semiconductor cooler, such that the light emission port of the first laser array 410b is at the same height as the central axis of the third lens array. The first filter array 430b may be located in the collimating direction of the third lens array, so that the first filter array 430b can receive the light signal collimated by the third lens array.

[0114] A first laser array 410a, a first filter array 430a, a first reflective sheet array 440a, a first transparent substrate 420a, and a first optical fiber 460a constitute a first light emitting component. A first laser array 410b, a first filter array 430b, a first reflective sheet array 440b, a first transparent substrate 420b, and a first optical fiber 460b constitute a second light emitting component.

[0115] As shown in Figures 5a, 5b, and 5c, in some embodiments, the carrier 900 may include a carrier base plate 910. The top surface of the carrier base plate 910 may support the light emitting component 400 and the circuit board 300. The top surface of the carrier base plate 910 may include a first carrier surface 913. The first carrier surface 913 may be connected to the lower surface of the circuit board 300 so that the carrier base plate 910 can support the circuit board 300.

[0116] In some embodiments, the top surface of the support base plate 910 may include a second support surface 912. The second support surface 912 may be connected to the bottom surface of the thermoelectric cooler so that the support base plate 910 can support the thermoelectric cooler, and the first laser array 410a and the first laser array 410b on the thermoelectric cooler.

[0117] In some embodiments, the second bearing surface 912 is recessed relative to the first bearing surface 913 so that the upper surface of the circuit board 300 is flush with the light outlet of the first laser array 410a and the first laser array 410b, thereby shortening the wire bonding distance between the circuit board 300 and the first laser array 410a and the first laser array 410b and reducing losses.

[0118] In some embodiments, the top surface of the support base plate 910 may include a third support surface 911. The third support surface 911 may be connected to the bottom surface of the first light-transmitting substrate 420a and the bottom surface of the first light-transmitting substrate 420b, so that the support base plate 910 can support the first light-transmitting substrate 420a and the first light-transmitting substrate 420b.

[0119] In some embodiments, the carrier 900 may include a first limiting side plate 920. The inner sidewall of the first limiting side plate 920 may be connected to the carrier base plate 910 so that the carrier 900 can form a first limiting groove. The light emitting component 400 may be placed in the first limiting groove to define the position of the light emitting component 400 in the width direction of the carrier 900. For example, the carrier 900 may include one first limiting side plate 920, the bottom of which is connected to one side of the carrier base plate 910, so that the shape of the first limiting groove formed by the carrier 900 is L-shaped. The carrier 900 may include two first limiting side plates 920, the bottom of one first limiting side plate 920 is connected to one side of the carrier base plate 910, and the bottom of the other first limiting side plate 920 is connected to the other side of the carrier base plate 910, so that the shape of the first limiting groove formed by the carrier 900 is U-shaped.

[0120] In some embodiments, a first limiting notch 921 may be formed at one end of the first limiting side plate 920. One sidewall of the first limiting notch 921 is correspondingly disposed with a first sidewall of the circuit board 300, so that the first sidewall of the circuit board 300 stops at a sidewall of the first limiting notch 921, thereby defining the position of the circuit board 300 in the length direction of the carrier 900. The other sidewall of the first limiting notch 921 is correspondingly disposed with a second sidewall of the circuit board 300, so that the second sidewall of the circuit board 300 stops at a sidewall of the first limiting notch 921, thereby defining the position of the circuit board 300 in the width direction of the carrier 900.

[0121] In some embodiments, one end face of the first limiting side plate 920 is a limiting surface 922. The limiting surface 922 may be correspondingly disposed with the third sidewall of the circuit board 300, so that the third sidewall of the circuit board 300 stops at the limiting surface 922, thereby defining the position of the circuit board 300 in the length direction of the carrier 900. The first sidewall, the second sidewall, and the third sidewall of the circuit board 300 are connected sequentially.

[0122] In some embodiments, the length of the first limiting side plate 920 is smaller than the length of the supporting base plate 910, so that the limiting surface 922 can form an L-shaped third limiting notch with the first supporting surface 913 of the supporting base plate 910. One side wall of the third limiting notch (i.e., the limiting surface 922) can be connected to the third side wall of the circuit board 300 to define the position of the circuit board 300 in the length direction of the supporting member 900. The other side wall of the third limiting notch (i.e., the first supporting surface 913) can be connected to the lower surface of the circuit board 300 to increase the contact area between the circuit board 300 and the supporting member 900 and improve the connection stability between the circuit board 300 and the supporting member 900.

[0123] In some embodiments, the circuit board 300 may include a first sub-circuit board 310. The front end of the first sub-circuit board 310 may be connected to the limiting surface 922.

[0124] In some embodiments, the circuit board 300 may include a second sub-circuit board 320. The second sub-circuit board 320 may be connected to the front end of the first sub-circuit board 310. The width of the second sub-circuit board 320 is smaller than the width of the first sub-circuit board 310, so that the circuit board 300 forms a clearance notch 330. One side wall of the clearance notch 330 (i.e., the front end of the first sub-circuit board 310) may be connected to the limiting surface 922, and the other side wall of the clearance notch 330 (i.e., the side wall where the second sub-circuit board 320 connects to the first sub-circuit board 310) may be connected to one side wall of the first limiting notch 921, thereby increasing the contact area between the circuit board 300 and the carrier 900 and improving the connection stability between the circuit board 300 and the carrier 900.

[0125] As shown in Figures 5a, 5b, and 5c, in some embodiments, the optical module includes a light receiving component 500, which receives signals and converts the optical signals into electrical signals. The light receiving component 500 can be mounted on the bottom surface of the carrier 900.

[0126] Figure 5d is a view of the internal structure of an optical module according to some embodiments from another perspective. Figure 5e is a cross-sectional view of the internal structure of an optical module according to some embodiments from another perspective. As shown in Figures 5c, 5d, and 5e, in some embodiments, the optical receiving component 500 may include a first optical receiving chip array. The first optical receiving chip array may be mounted on a circuit board 300. The first optical receiving chip array can receive at least one optical signal. The first optical receiving chip array may include at least one optical receiving chip that can receive the optical signal and convert the optical signal into a current signal. For example, the first optical receiving chip array may include four optical receiving chips arranged side by side along the width direction of the carrier 900, so that the first optical receiving chip array can receive four optical signals.

[0127] In some embodiments, the optical receiving component 500 may include a transimpedance amplifier chip 560a. The transimpedance amplifier chip 560a may be mounted on a circuit board 300. The transimpedance amplifier chip 560a may be electrically connected to a first optical receiving chip array to receive current signals and convert them into voltage signals. For example, the first optical receiving chip array may be mounted upside down on the transimpedance amplifier chip 560a. Alternatively, the first optical receiving chip array may be wire-connected to the transimpedance amplifier chip 560a.

[0128] In some embodiments, the optical receiving component 500 may include a second optical fiber 510a. The second optical fiber 510a can receive optical signals.

[0129] In some embodiments, the optical receiving component 500 may include a second filter array 540a. The second filter array 540a may be located in the light-emitting direction of the second optical fiber 510a, so that the second filter array 540a can receive the optical signal emitted from the second optical fiber 510a. The second filter array 540a may allow a certain wavelength of optical signal to be transmitted or reflected.

[0130] In some embodiments, the light receiving component 500 may include a second reflective sheet array 530a. The second reflective sheet array 530a is disposed opposite to the second filter array 540a so that the optical signal can be reflected between the second filter array 540a and the second reflective sheet array 530a to achieve wavelength division.

[0131] In some embodiments, the light receiving component 500 may include a second light-transmitting substrate 520a. The second light-transmitting substrate 520a may be made of polyetherimide (PEI). PEI is a high-performance thermoplastic with excellent high-temperature resistance, mechanical strength, flame retardancy, electrical insulation, and light transmittance. The second light-transmitting substrate 520a is light-transmitting, allowing optical signals to be transmitted within it. For example, the second light-transmitting substrate 520a may be molded from PEI.

[0132] In some embodiments, a second optical fiber 510a may be fixed to one end of the second light-transmitting substrate 520a.

[0133] Instead of fixing the second optical fiber 510a with an optical fiber holder that wraps around it, fixing the second optical fiber 510a directly to the second light-transmitting substrate 520a can reduce the length of the light receiving component 500.

[0134] In some embodiments, a second lens may be formed at one end of the second light-transmitting substrate 520a. The second lens may be located in the light-emitting direction of the second optical fiber 510a to receive the optical signal emitted from the second optical fiber 510a. The second lens may be a collimating lens so that it can collimate the received optical signal. The second lens may be located between the second optical fiber 510a and the second filter array 540a so that it can collimate the optical signal emitted from the second optical fiber 510a and then direct it into the second filter array 540a.

[0135] In some examples, PEI molding is a mature process with extremely high molding precision. The second transparent substrate 520a can directly produce the second lens, and the relative position of the second lens and the second optical fiber 510a can be guaranteed.

[0136] In some examples, a second lens may be additionally provided and fixed to the other end of the second light-transmitting substrate 520a.

[0137] In some embodiments, a second filter array 540a and a second reflective array 530a may be mounted in the middle of the second light-transmitting substrate 520a. The second light-transmitting substrate 520a, the second filter array 540a, and the second reflective array 530a constitute a first wavelength division multiplexing (WDM). The WDM can be located in the collimating direction of the second lens to receive the optical signal collimated by the second lens. The WDM can be used to split the optical signal, such that the WDM can divide a beam of optical signal collimated by the second lens, which includes multiple wavelengths, into multiple wavelength optical signals.

[0138] PEI mold opening is a mature process with extremely high mold opening precision. The second filter array 540a and the second reflective array 530a can be passively mounted on the second light-transmitting substrate 520a without requiring high mounting precision, which greatly improves the production yield.

[0139] In some embodiments, the medium between the second filter array 540a and the second reflective array 530a can be air, and the light signal reflected between the second filter array 540a and the second reflective array 530a is transmitted in the air.

[0140] In some embodiments, the medium between the second filter array 540a and the second reflective array 530a can be PEI, and the reflected light signal between the second filter array 540a and the second reflective array 530a is transmitted in the PEI. Since the refractive index of PEI is similar to that of the materials of the second filter array 540a and the second reflective array 530a, the refraction of the light signal can be reduced, thus reducing the loss of the light signal.

[0141] In some embodiments, the light input direction of the first optical receiving chip array is different from the light output direction of the second optical fiber 510a, and the other end of the second light-transmitting substrate 520a can be used to change the transmission direction of the optical signal so that the first optical receiving chip array can receive the wavelength-divided optical signal.

[0142] The following description uses an optical receiving component 500 receiving eight optical signals as an example to illustrate the solution provided in this disclosure. In some embodiments, the optical receiving component 500 may include a second optical receiving chip array. The second optical receiving chip array may be mounted on a circuit board 300. The second optical receiving chip array can receive at least one optical signal. The second optical receiving chip array may include at least one optical receiving chip, which can receive the optical signal and convert the optical signal into a current signal. For example, the second optical receiving chip array may include four optical receiving chips arranged side by side along the width direction of the carrier 900, so that the second optical receiving chip array can receive four optical signals.

[0143] In some embodiments, the optical receiving component 500 may include a transimpedance amplifier chip 560b. The transimpedance amplifier chip 560b may be mounted on a circuit board 300. The transimpedance amplifier chip 560b may be electrically connected to a second optical receiving chip array to receive current signals and convert them into voltage signals. For example, the second optical receiving chip array may be mounted upside down on the transimpedance amplifier chip 560b. Alternatively, the second optical receiving chip array may be wire-connected to the transimpedance amplifier chip 560b.

[0144] In some embodiments, the optical receiving component 500 may include a second optical fiber 510b. The second optical fiber 510b can receive optical signals.

[0145] In some embodiments, the light receiving component 500 may include a second light-transmitting substrate 520b. The second light-transmitting substrate 520b may be made of polyetherimide (PEI). PEI is a high-performance thermoplastic with excellent high-temperature resistance, mechanical strength, flame retardancy, electrical insulation, and light transmittance. The light transmittance of the second light-transmitting substrate 520b allows light signals to be transmitted within it. For example, the second light-transmitting substrate 520b may be molded from PEI.

[0146] In some embodiments, a second optical fiber 510b may be fixed to one end of the second light-transmitting substrate 520b.

[0147] Instead of using an optical fiber holder to fix the second optical fiber 510b, the second optical fiber 510b is directly fixed to the second light-transmitting substrate 520b, which can reduce the length of the light receiving component 500.

[0148] In some embodiments, a fourth lens may be formed at one end of the second light-transmitting substrate 520b. The fourth lens may be located in the light-emitting direction of the second optical fiber 510b to receive the optical signal emitted from the second optical fiber 510b. The fourth lens may be a collimating lens so that it can collimate the received optical signal. The fourth lens may be located between the second optical fiber 510b and the second filter array 540b so that it can collimate the optical signal emitted from the second optical fiber 510b and then direct it into the second filter array 540b.

[0149] In some examples, PEI molding is a mature process with extremely high molding precision. The fourth lens can be directly molded from the second light-transmitting substrate 520b, and the relative position of the fourth lens and the second optical fiber 510b can be guaranteed.

[0150] In some examples, a fourth lens may be additionally provided and fixed to the other end of the second light-transmitting substrate 520b.

[0151] In some embodiments, a second filter array 540b and a second reflective array 530b may be mounted in the middle of the second transparent substrate 520b. The second transparent substrate 520b, the second filter array 540b, and the second reflective array 530b constitute a second wavelength division multiplexing (WDM). The WDM can be located in the collimation direction of the fourth lens to receive the optical signal collimated by the fourth lens. The WDM can be used to split the optical signal, such that it can divide a beam of optical signal collimated by the fourth lens, which includes multiple wavelengths, into multiple wavelength optical signals.

[0152] PEI mold opening is a mature process with extremely high mold opening precision. The second filter array 540b and the second reflective array 530b can be passively mounted on the second light-transmitting substrate 520b without requiring high mounting precision, which greatly improves the production yield.

[0153] In some embodiments, the medium between the second filter array 540b and the second reflective array 530b is air, and the light signal reflected between the second filter array 540b and the second reflective array 530b is transmitted in the air.

[0154] In some embodiments, the medium between the second filter array 540b and the second reflective array 530b is PEI, and the reflected light signal between the second filter array 540b and the second reflective array 530b is transmitted in the PEI. Since the refractive index of PEI is similar to that of the materials of the second filter array 540b and the second reflective array 530b, the refraction of the light signal can be reduced, thus reducing the loss of the light signal.

[0155] In some embodiments, the light input direction of the second optical receiving chip array is different from the light output direction of the second optical fiber 510b, and the other end of the second light-transmitting substrate 520b can be used to change the transmission direction of the optical signal so that the second optical receiving chip array can receive the wavelength-divided optical signal.

[0156] The second optical fiber 510a, the second transparent substrate 520a, the second filter array 540a, the second reflective array 530a, the first optical receiver chip array, and the transimpedance amplifier chip 560a constitute the first optical receiver component. The second optical fiber 510b, the second transparent substrate 520b, the second filter array 540b, the second reflective array 530b, the second optical receiver chip array, and the transimpedance amplifier chip 560b constitute the second optical receiver component.

[0157] As shown in Figures 5c, 5d, and 5e, in some embodiments, the carrier 900 may include a fourth carrier surface 915. The fourth carrier surface 915 is the bottom surface of the carrier 900. The fourth carrier surface 915 may be connected to the bottom surfaces of the second light-transmitting substrate 520a and the second light-transmitting substrate 520b, so that the carrier 900 can carry the light-receiving component 500.

[0158] In some embodiments, the inner sidewall of the first limiting side plate 920 may be connected to the supporting base plate 910, so that the supporting member 900 can form a second limiting groove. The second light-transmitting substrate 520a and the second light-transmitting substrate 520b may be placed within the second limiting groove to define the positions of the second light-transmitting substrate 520a and the second light-transmitting substrate 520b in the width direction of the supporting member 900. For example, the supporting member 900 may include one first limiting side plate 920, the inner sidewall of which is connected to one side of the supporting base plate 910, so that the second limiting groove formed by the supporting member 900 is L-shaped. The supporting member 900 may include two first limiting side plates 920, the inner sidewall of one first limiting side plate 920 being connected to one side of the supporting base plate 910, and the inner sidewall of the other first limiting side plate 920 being connected to the other side of the supporting base plate 910, so that the second limiting groove formed by the supporting member 900 is U-shaped.

[0159] In some embodiments, a second limiting notch 923 may be formed at one end of the first limiting side plate 920. One side wall of the second limiting notch 923 may be correspondingly disposed with one side wall of the second light-transmitting substrate 520a, and the other side wall of the second limiting notch 923 may be correspondingly disposed with the other side wall of the second light-transmitting substrate 520a, so that one side wall of the second light-transmitting substrate 520a stops at one side wall of the second limiting notch 923, and the other side wall of the second light-transmitting substrate 520a stops at the other side wall of the second limiting notch 923, thereby defining the position of the second light-transmitting substrate 520a in the width direction of the carrier 900.

[0160] In some embodiments, one sidewall of the second limiting notch 923 may be correspondingly disposed with one sidewall of the second light-transmitting substrate 520b, and the other sidewall of the second limiting notch 923 may be correspondingly disposed with the other sidewall of the second light-transmitting substrate 520b, so that one sidewall of the second light-transmitting substrate 520b is stopped at one sidewall of the second limiting notch 923, and the other sidewall of the second light-transmitting substrate 520b is stopped at the other sidewall of the second limiting notch 923, thereby defining the position of the second light-transmitting substrate 520b in the width direction of the carrier 900.

[0161] In some embodiments, the carrier 900 may include a clearance via 914. The clearance via 914 may be correspondingly provided with the first optical receiver chip array, the second optical receiver chip array, and the transimpedance amplifier chips 560a and 560b. The clearance via 914 may extend from the top surface of the carrier 900 to the bottom surface of the carrier 900, so that the first optical receiver chip array, the second optical receiver chip array, and the transimpedance amplifier chips 560a and 560b are exposed, facilitating the reception of optical signals by the first optical receiver chip array and the second optical receiver chip array.

[0162] In some embodiments, the carrier 900 may include a second limiting side plate 930. The second limiting side plate 930 may be disposed on the fourth bearing surface 915. The length of the second limiting side plate 930 is smaller than the length of the first limiting side plate 920, so as to provide mounting space for the second light-transmitting substrate 520a and the second light-transmitting substrate 520b. The second limiting side plate 930 and the first limiting side plate 920 form a second limiting groove 940. The second limiting groove 940 may accommodate the second optical fiber 510a or the second optical fiber 510b. For example, the second limiting side plate 930 may be located between the two first limiting side plates 920.

[0163] Figure 6a is a partial view of a first light emitting component according to some embodiments. Figure 6b is a partial exploded view of a first light emitting component according to some embodiments. Figure 6c is a structural diagram of a first light-transmitting substrate according to some embodiments. As shown in Figures 6a, 6b, and 6c, in some embodiments, the first filter array 430a may include at least two filters arranged side by side. For example, the first filter array 430a may include a first filter 431a, a second filter 432a, a third filter 433a, and a fourth filter 434a arranged side by side.

[0164] In some embodiments, the first reflective sheet array 440a may include a reflective sheet. The reflective sheet may be located in the transmission direction of the first filter 431a, the second filter 432a, and the third filter 433a, and may also be located in the reflection direction of the second filter 432a and the third filter 433a. The second filter 432a, the third filter 433a, and the fourth filter 434a may be located in the reflection direction of the reflective sheet.

[0165] In some embodiments, the first reflective sheet array 440a may include a first reflective sheet, a second reflective sheet, and a third reflective sheet arranged side by side. The first reflective sheet may be located in the transmission direction of the first filter 431a, and the second filter 432a may be located in the reflection direction of the first reflective sheet. The second reflective sheet may be located in both the transmission and reflection directions of the second filter 432a, and the third filter 433a may be located in the reflection direction of the second reflective sheet. The third reflective sheet may be located in both the transmission and reflection directions of the third filter 433a.

[0166] In some embodiments, the first light-transmitting substrate 420a may include a first carrier portion 421a. The top surface of the first carrier portion 421a may be fitted with a first filter array 430a and a first reflective sheet array 440a, such that the medium between the first filter array 430a and the first reflective sheet array 440a is air.

[0167] In some embodiments, the first light-transmitting substrate 420a may include a first mounting portion 422a. The bottom surface of the first mounting portion 422a may be connected to the top surface of the first carrier portion 421a. The first mounting portion 422a may mount a first filter array 430a and a first reflective sheet array 440a, such that the medium between the first filter array 430a and the first reflective sheet array 440a is PEI.

[0168] In some embodiments, the first mounting portion 422a may include a first mounting surface 4221a. The first mounting surface 4221a may face the first laser array 410a. The first mounting surface 4221a may mount the first filter array 430a so that the first filter array 430a can be located in the light emission direction of the first laser array 410a, so that the first filter array 430a can receive the light signal emitted by the first laser array 410a.

[0169] In some embodiments, the first light-transmitting substrate 420a may include a first fixing portion 423a. The bottom surface of the first fixing portion 423a may be connected to the top surface of the first support portion 421a. A first lens 4231a is formed at the end of the first fixing portion 423a facing the first mounting portion 422a. The first lens 4231a may be located at the converging lens so that the first lens 4231a can converge the received light signal.

[0170] In some embodiments, the first mounting surface 4221a is inclined relative to the end face where the first lens 4231a is located, that is, the first mounting surface 4221a is inclined relative to the central axis of the light output port of the laser array 410a, so that the light signal emitted by the laser array 410a is obliquely incident on the first filter array 430a. For example, the inclination angle of the first mounting surface 4221a relative to the end face where the first lens 4231a is located is 7° to 15°.

[0171] In some embodiments, there is a gap between the first mounting portion 422a and the first fixing portion 423a to facilitate mounting the light emitting component 400 between the first mounting portion 422a and the first fixing portion 423a. The first isolator 450a can be mounted in the area between the first mounting portion 422a and the first fixing portion 423a so that the first isolator 450a can be located between the first filter array 430a and the first lens 4231a, so that the light signal transmitted through the first filter array 430a is incident on the first lens 4231a through the first isolator 450a, but cannot return to the first filter array 430a through the first isolator 450a.

[0172] In some embodiments, the first carrier portion 421a may include a region connected to the bottom surface of the first mounting portion 422a, a region connected to the bottom surface of the first fixing portion 423a, and a region between the first mounting portion 422a and the first fixing portion 423a, to facilitate the mounting of the first filter array 430a and the first reflective sheet array 440a.

[0173] In some embodiments, the first support portion 421a may include a first sub-region and a second sub-region to increase the area of ​​the first support portion 421a, thereby increasing the strength of the first support portion 421a and reducing the deformation of the first support portion 421a. The first sub-region is the region that extends outward from the region of the bottom surface of the first mounting portion 422a and the region that connects to the bottom surface of the first fixing portion 423a, and the second sub-region is the region that extends from the region of the bottom surface of the first mounting portion 422a toward the first laser array 410a.

[0174] In some embodiments, the first light-transmitting substrate 420a may be an integrally molded structure.

[0175] In some embodiments, the first light-transmitting substrate 420a may be formed by connecting, for example, the first carrier portion 421a, the first fixing portion 423a and the first mounting portion 422a together.

[0176] Figure 6d is a structural diagram of a first light-transmitting substrate according to some embodiments. Figure 6e is a structural diagram of a first light-transmitting substrate according to some embodiments. Figure 6f is a partial cross-sectional view of a first light-emitting component according to some embodiments. As shown in Figures 6d, 6e, and 6f, in some embodiments, the first mounting portion 422a may include a second mounting surface 4222a. The second mounting surface 4222a may mount the first reflective sheet array 440a. The second mounting surface 4222a may be disposed opposite to the first mounting surface 4221a so that the optical signal can be reflected between the first reflective sheet array 440a and the first filter array 430a to achieve wave combining.

[0177] The first mounting section 422a, the first filter array 430a, and the first reflector array 440a can form a first beam combiner. The first beam combiner can combine multiple wavelengths of optical signals into a single beam, including multiple different optical signals.

[0178] In some embodiments, the second mounting surface 4222a and the first mounting surface 4221a can be arranged in parallel so that the first reflective sheet array 440a and the first filter array 430a can be arranged in parallel, so that the spacing between two adjacent filters of the first filter array 430a is the same, which facilitates the mounting of the first filter array 430a.

[0179] The second mounting surface 4222a and the first mounting surface 4221a can be arranged parallel to each other. The first mounting surface 4221a is inclined relative to the end face where the first lens 4231a is located. Similarly, the second mounting surface 4222a is also inclined relative to the end face where the first lens 4231a is located, so that the light signal can be incident obliquely onto the first mounting portion 422a, thereby allowing the light signal to be reflected between the first filter array 430a and the first reflective array 440a. For example, the tilt angle of the second mounting surface 4222a relative to the end face where the first lens 4231a is located is called the tilt angle of the second mounting surface 4222a, which is 7° to 15°.

[0180] In some embodiments, the first mounting portion 422a may include an exiting surface 4223a. The exiting surface 4223a may be disposed opposite to the first mounting surface 4221a. One end of the exiting surface 4223a may be connected to the second mounting surface 4222a. The exiting surface 4223a is disposed opposite to the first mounting surface 4221a so that the optical signal can be reflected between the second mounting surface 4222a and the first mounting surface 4221a, and after being reflected by the first mounting surface 4221a, it is emitted again through the exiting surface 4223a.

[0181] In some embodiments, the exit surface 4223a may be inclined relative to the end face of the first lens 4231a, so that the light signal emitted through the exit surface 4223a can be obliquely incident on the first lens 4231a, reducing the reflection of the light signal. For example, the tilt angle of the exit surface 4223a relative to the end face of the first lens 4231a is the tilt angle of the exit surface 4223a, and the tilt angle of the exit surface 4223a is 5° to 7°.

[0182] In some embodiments, the center-to-center distance between two adjacent lasers in the first laser array 410a is within a first preset range, so as to facilitate the mounting of the first laser array 410a and to ensure that the light spots of the light signals emitted by the two adjacent lasers do not overlap, thereby reducing crosstalk.

[0183] The center-to-center spacing between two adjacent lasers in the first laser array 410a can be adjusted in the following two ways so that the center-to-center spacing between two adjacent lasers in the first laser array 410a is within a first preset range.

[0184] The first method involves keeping the length of the first mounting section 422a unchanged, and adjusting the tilt angle of the exit surface 4223a relative to the end face where the first lens 4231a is located. A larger tilt angle of the exit surface 4223a relative to the end face where the first lens 4231a is located results in a smaller center-to-center distance between two adjacent lasers in the first laser array 410a; conversely, a smaller tilt angle of the exit surface 4223a relative to the end face where the first lens 4231a is located results in a larger center-to-center distance between two adjacent lasers in the first laser array 410a.

[0185] The second method involves keeping the tilt angle of the exit surface 4223a relative to the end face of the first lens 4231a unchanged, while adjusting the length of the first mounting portion 422a. A smaller length of the first mounting portion 422a results in a smaller center-to-center distance between adjacent lasers in the first laser array 410a; conversely, a larger length of the first mounting portion 422a results in a larger center-to-center distance between adjacent lasers in the first laser array 410a. The initial value of the tilt angle of the exit surface 4223a relative to the end face of the first lens 4231a is the same as the tilt angle of the second mounting surface 4222a relative to the end face of the first lens 4231a.

[0186] In some embodiments, the exit surface 4223a and the second mounting surface 4222a may be arranged in parallel.

[0187] In some embodiments, the exit surface 4223a and the second mounting surface 4222a can be inclined, and the inclination angle of the second mounting surface 4222a is greater than the inclination angle of the exit surface 4223a. Instead of the exit surface 4223a and the second mounting surface 4222a being parallel, the exit surface 4223a and the second mounting surface 4222a being inclined, with the inclination angle of the second mounting surface 4222a being greater than the inclination angle of the exit surface 4223a, effectively reduces the inclination angle of the exit surface 4223a relative to the end face where the first lens 4231a is located, increasing the center-to-center distance between two adjacent lasers in the first laser array 410a, so that the center-to-center distance between two adjacent lasers in the first laser array 410a can be within a first preset range.

[0188] In some embodiments, a first fixing groove 4233a may be formed at one end of the first fixing portion 423a (i.e., the end of the first fixing portion 423a). The first fixing groove 4233a can fix the first optical fiber 460a. The inner wall of the first fixing groove 4233a is connected to the outer wall of the first optical fiber 460a so that the inner wall of the first fixing groove 4233a carries the first optical fiber 460a. Rigid adhesive is filled between the inner wall of the first fixing groove 4233a and the outer wall of the first optical fiber 460a. After the rigid adhesive solidifies, an adhesive layer is formed so that the inner wall of the first fixing groove 4233a is connected to the first optical fiber 460a. The opening of the first fixing groove 4233a may face away from the bottom of the first fixing portion 423a to facilitate the application of rigid adhesive inside the first fixing groove 4233a.

[0189] In some embodiments, the inner wall of the first fixing groove 4233a and the outer wall of the first optical fiber 460a have complementary shapes, so that the inner wall of the first fixing groove 4233a and the outer wall of the first optical fiber 460a are connected. This increases the contact area between the inner wall of the first fixing groove 4233a and the outer wall of the first optical fiber 460a, reduces local stress concentration, and improves the connection stability between the first fixing groove 4233a and the first optical fiber 460a. For example, the cross-section of the first optical fiber 460a is circular, and the cross-section of the first fixing groove 4233a is semi-circular.

[0190] In some embodiments, a first placement through-hole 4232a may be formed in the middle of the first fixing part 423a. The first placement through-hole 4232a may be located between the first fixing groove 4233a and the first lens 4231a. One end of the first placement through-hole 4232a may communicate with the first fixing groove 4233a, so that the first optical fiber 460a can be inserted into the first placement through-hole 4232a through the first fixing groove 4233a. The other end of the first placement through-hole 4232a may be positioned in front of the first lens 4231a, so that the first optical fiber 460a is positioned in front of the first lens 4231a. The fiber end face of the first optical fiber 460a may be located at the focal point of the first lens 4231a, so that the fiber end face of the first optical fiber 460a can receive the optical signal converged by the first lens 4231a.

[0191] The first optical fiber 460a may include a core, a cladding, and a coating layer, with the coating layer enclosing the cladding and the cladding enclosing the core. The cladding and the core enclosed by the cladding of the first optical fiber 460a can be placed in a first placement through-hole 4232a, and the coating layer, the cladding enclosed by the coating layer, and the core enclosed by the cladding of the first optical fiber 460a can be placed in a first fixing slot 4233a.

[0192] In some embodiments, the radius of curvature of the first fixing groove 4233a is greater than the radius of curvature of the first placement through hole 4232a, so that the cladding of the first optical fiber 460a and the fiber core wrapped by the cladding can be placed in the first placement through hole 4232a, and the coating layer of the first optical fiber 460a, the cladding wrapped by the coating layer, and the fiber core wrapped by the cladding layer can be placed in the first fixing groove 4233a.

[0193] In some embodiments, a first countersunk hole 4235a may be formed in the middle of the first fixing part 423a. The first countersunk hole 4235a may be located at one end of the first storage through hole 4232a, and the first countersunk hole 4235a may be located at the other end of the first storage through hole 4232a. The first countersunk hole 4235a may be connected to the first storage through hole 4232a. The first countersunk hole 4235a is more recessed than the first storage through hole 4232a, so that the first optical fiber 460a is suspended at the first countersunk hole 4235a. Due to gravity, the hard adhesive along the cladding of the first optical fiber 460a can flow into the first countersunk hole 4235a and no longer flow to the optical fiber end face of the first optical fiber 460a, thereby reducing the contamination of the optical fiber end face of the first optical fiber 460a by the hard adhesive.

[0194] In some embodiments, the first storage through-hole 4232a may include a first sub-storage through-hole 42322a. One end of the first sub-storage through-hole 42322a may be connected to one end of the first fixing groove 4233a. The first sub-storage through-hole 42322a may have an opening facing the upper housing 201 to facilitate the application of hard adhesive to the first sub-storage through-hole 42322a.

[0195] In some embodiments, the first storage through hole 4232a may include a second sub-storage through hole 42323a. One end of the second sub-storage through hole 42323a may be connected to the other end of the first sub-storage through hole 42322a, and the other end of the second sub-storage through hole 42323a may be connected to one end of the first countersunk hole 4235a.

[0196] In some embodiments, the first storage through-hole 4232a may include a third sub-storage through-hole 42321a. One end of the third sub-storage through-hole 42321a is connected to the other end of the first countersunk hole 4235a. The other end of the third sub-storage through-hole 42321a is located in front of the first lens 4231a.

[0197] In some embodiments, the second sub-placement through hole 42322a and the third sub-placement through hole 42321a may be located inside the fixing part 423a to increase the contact area between the first optical fiber 460a and the first placement through hole 4232a and improve the connection stability between the first optical fiber 460a and the first placement through hole 4232a.

[0198] In some embodiments, the end face of the first placement through-hole 4232a (i.e., the end near the first lens 4231a) is a first inclined surface, and the end face of the first optical fiber 460a is a second inclined surface. The first and second inclined surfaces can be arranged in parallel, which can increase the contact area between the end face of the first optical fiber 460a and the end face of the first placement through-hole 4232a (i.e., the other end face of the third sub-placement through-hole 42321a). The medium between the first lens 4231a and the end face of the first optical fiber 460a is preferably the first light-transmitting substrate, so that the optical signal between the first lens 4231a and the end face of the first optical fiber 460a is transmitted in the first light-transmitting substrate 421a as much as possible. For example, the inclination angle of both the first and second inclined surfaces is 5°-7°.

[0199] In some embodiments, the other end (i.e., the front end of the first fixing part 423a) may form a first protective groove 4234a. The first protective groove 4234a may be connected to the other end of the first fixing groove 4233a. The first optical fiber 460a may be placed in the first protective groove 4234a. The first protective groove 4234a is filled with soft glue, which protects the first optical fiber 460a to reduce damage to the first optical fiber 460a. The opening of the first protective groove 4234a may face the upper housing 201 to facilitate the application of soft glue inside the first protective groove 4234a.

[0200] In some embodiments, the first protective groove 4234a is more recessed than the first fixing groove 4233a to provide a space for the soft adhesive and prevent the height of the first optical fiber 460a located in the first protective groove 4234a from being greater than the height of the first optical fiber 460a located in the first fixing groove 4233a, so as to protect the first optical fiber 460a.

[0201] As shown in Figure 6f, the first reflective sheet array 440a is located in the transmission direction of the first filter 431a, so that the first reflective sheet array 440a can receive the first optical signal transmitted by the first filter 431a and reflect the first optical signal outwards. The second filter 432a is located in the reflection direction of the first reflective sheet array 440a, so that the second filter 432a can receive the first optical signal reflected by the first reflective sheet array 440a and reflect the first optical signal outwards. The first reflective sheet array 440a is located in the reflection direction of the second filter 432a, so that the first reflective sheet array 440a can receive the first optical signal reflected by the second filter 432a and reflect the first optical signal outwards. The first reflective sheet array 440a is located in the transmission direction of the second filter 432a, so that the first reflective sheet array 440a can receive the second optical signal transmitted by the second filter 432a and reflect the second optical signal outwards. The third filter 433a is located in the reflection direction of the first reflective sheet array 440a, so that the third filter 433a can receive the first optical signal and the second optical signal reflected by the first reflective sheet array 440a, and reflect the first optical signal and the second optical signal out. The first reflective sheet array 440a is located in the reflection direction of the third filter 433a, so that the first reflective sheet array 440a can receive the first optical signal and the second optical signal reflected by the third filter 433a. The first reflective sheet array 440a is located in the transmission direction of the third filter 433a, so that the first reflective sheet array 440a can receive the third optical signal transmitted by the third filter 433a. The fourth filter 434a is located in the reflection direction of the first reflective sheet array 440a, so that the fourth filter 434a can receive the first optical signal, the second optical signal and the third optical signal reflected by the first reflective sheet array 440a, and reflect the first optical signal, the second optical signal and the third optical signal out. The fourth filter 434a reflects the first, second, and third optical signals and transmits the fourth optical signal. The first filter array 430a and the first reflective array 440a can combine the first, second, third, and fourth optical signals into a single beam.

[0202] As shown in Figure 6f, the first lens 4231a is located in the transmission direction and the reflection direction of the fourth filter 434a, so that the first lens 4231a can receive the first light signal, the second light signal and the third light signal reflected by the fourth filter 434a, and can also receive the fourth light signal transmitted by the fourth filter 434a.

[0203] Figure 7a is a structural diagram of a first optical receiving component according to some embodiments. Figure 7b is an exploded view of a first optical receiving component according to some embodiments. Figure 7c is a partial exploded view of a first optical receiving component according to some embodiments. As shown in Figures 7a, 7b, and 7c, in some embodiments, the first optical receiving chip array 550a may be located in the light-emitting direction of the second light-transmitting substrate 520a, so that the first optical receiving chip array 550a can receive the optical signal emitted by the second light-transmitting substrate 520a. For example, the first optical receiving chip array 550a may be located below the second light-transmitting substrate 520a and at the end of the second light-transmitting substrate 520a away from the first optical fiber 510a, so as to receive the optical signal emitted by the second light-transmitting substrate 520a.

[0204] In some embodiments, the second filter array 540a may include at least two filters arranged side by side. For example, the second filter array 540a may include a fifth filter 541a, a sixth filter 542a, a seventh filter 543a, and an eighth filter 544a arranged side by side.

[0205] In some embodiments, the second reflective sheet array 530a may include a reflective sheet. The reflective sheet may be located in the reflection direction of the eighth filter 544a, the seventh filter 543a, and the sixth filter 542a, with the seventh filter 543a, the sixth filter 542a, and the fifth filter 541a located in the reflection direction of the reflective sheet.

[0206] In some embodiments, the second reflective sheet array 530a may include a fourth, fifth, and sixth reflective sheet arranged side by side. The sixth reflective sheet may be located in the reflection direction of the eighth filter 544a, the seventh filter 543a may be located in the reflection direction of the sixth reflective sheet, the fifth reflective sheet may be located in the reflection direction of the seventh filter 543a, the sixth filter 542a may be located in the reflection direction of the fifth reflective sheet, the fourth reflective sheet may be located in the reflection direction of the sixth filter 542a, and the fifth filter 541a may be located in the reflection direction of the fourth reflective sheet.

[0207] Figure 7d is a structural diagram of a second light-transmitting substrate according to some embodiments. Figure 7e is a structural diagram of a second light-transmitting substrate according to some embodiments. Figure 7f is a structural diagram of a second light-transmitting substrate according to some embodiments. As shown in Figures 7d, 7e, and 7f, in some embodiments, the second light-transmitting substrate 520a may include a second carrier portion 521a. The top surface of the first carrier portion 421a may be fitted with a second filter array 540a and a second reflective sheet array 530a, such that the medium between the second filter array 540a and the second reflective sheet array 530a is air.

[0208] In some embodiments, the second light-transmitting substrate 520a may include a second mounting portion 523a. The second mounting portion 523a may be located in the middle of the second light-transmitting substrate 520a. The bottom surface of the second mounting portion 523a may be connected to the top surface of the second carrier portion 521a. The second mounting portion 523a may mount a second filter array 540a and a second reflective sheet array 530a, such that the medium between the second filter array 540a and the second reflective sheet array 530a is PEI.

[0209] In some embodiments, the second light-transmitting substrate 520a may include a direction adjustment portion 522a. The direction adjustment portion 522a may be located at one end of the second light-transmitting substrate 520a. The bottom surface of the direction adjustment portion 522a may be connected to the top surface of the second support portion 521a. The first light receiving chip array 550a may be located in the light emission direction of the direction adjustment portion 522a, so that the first light receiving chip array 550a can receive the light signal whose transmission direction has been adjusted by the direction adjustment portion 522a.

[0210] In some embodiments, the second mounting portion 523a may include a third mounting surface 5231a. The third mounting surface 5231a may face the orientation adjustment portion 522a. The third mounting surface 5231a may mount the second filter array 540a so that the orientation adjustment portion 522a can be located in the transmission direction of the second filter array 540a, so that the orientation adjustment portion 522a can receive the optical signal filtered by the second filter array 540a.

[0211] In some embodiments, the second mounting portion 523a may include a fourth mounting surface 5232a. The fourth mounting surface 5232a may mount the second reflective sheet array 530a. The fourth mounting surface 5232a may be disposed opposite to the third mounting surface 5231a, so that the second filter array 540a may be located in the reflection direction of the second reflective sheet array 530a, allowing the optical signal to be reflected back and forth between the second reflective sheet array 530a and the second filter array 540a, thereby achieving wavelength division.

[0212] The second mounting section 523a, the second filter array 540a, and the second reflector array 530a can form a first wavelength division multiplexing (WDM) device. The first WDM device can divide a beam containing multiple different optical signals into optical signals of multiple wavelengths.

[0213] In some embodiments, the fourth mounting surface 5232a and the third mounting surface 5231a can be arranged in parallel so that the second reflective sheet array 530a and the second filter array 540a can be arranged in parallel, so that the detection of two adjacent filters of the second filter array 540a is the same, which facilitates the mounting of the second filter array 540a.

[0214] In some embodiments, the second light-transmitting substrate 520a may include a second fixing portion 524a. The second fixing portion 524a may be located at the other end of the second light-transmitting substrate 520a. The bottom surface of the second fixing portion 524a may be connected to the top surface of the second supporting portion 521a. One end of the second fixing portion 524a is fixed to the second optical fiber 510a, and the other end of the second fixing portion 524a forms a second lens 5241a. The second lens 5241a may be located at the collimating lens so that the second lens 5241a can collimate the received optical signal.

[0215] In some embodiments, there may be a gap between the second mounting portion 523a and the second fixing portion 524a to facilitate adjustment of the angle of the second mounting portion 523a.

[0216] In some embodiments, the fourth mounting surface 5232a is inclined relative to the end face where the second lens 5241a is located, so that the light signal can be incident obliquely onto the second mounting portion 523a, thereby allowing the light signal to be reflected between the second filter array 540a and the second reflective array 530a. For example, the inclination angle of the fourth mounting surface 5232a relative to the end face where the second lens 5241a is located is 7° to 15°.

[0217] In some embodiments, the second mounting portion 523a may include an incident surface 5233a. The incident surface 5233a may be disposed opposite to the third mounting surface 5231a. One end of the incident surface 5233a may be connected to the fourth mounting surface 5232a. The incident surface 5233a is disposed opposite to the third mounting surface 5231a so that an optical signal can be incident on the second mounting portion through the incident surface and reflected between the third and fourth mounting surfaces of the second mounting portion.

[0218] In some embodiments, the incident surface 5233a may be inclined relative to the end face of the second lens 5241a, so that the light signal collimated by the second lens 5241a can be incident obliquely onto the incident surface 5233a, reducing the reflection of the light signal. For example, the inclination angle of the incident surface 5233a relative to the end face of the second lens 5241a is the inclination angle of the incident surface 5233a, and the inclination angle of the incident surface 5233a is 5° to 7°.

[0219] In some embodiments, the center-to-center spacing between two adjacent optical receiving chips in the first optical receiving chip array 550a is within a second preset range, so that the light spots of two adjacent optical signals do not overlap, reducing crosstalk and facilitating the mounting of the first optical receiving chip array 550a.

[0220] The center spacing between two adjacent optical receiver chips in the first optical receiver chip array 550a can be adjusted in the following two ways so that the center spacing between two adjacent optical receiver chips in the first optical receiver chip array 550a is within a second preset range.

[0221] The first method involves keeping the length of the second mounting portion 523a unchanged, and adjusting the tilt angle of the incident surface 5233a relative to the end face where the second lens 5241a is located. A larger tilt angle between the incident surface 5233a and the end face where the second lens 5241a is located results in a smaller center-to-center distance between two adjacent light-receiving chips in the first light-receiving chip array 550a; conversely, a smaller tilt angle between the incident surface 5233a and the end face where the second lens 5241a is located results in a larger center-to-center distance between two adjacent light-receiving chips in the first light-receiving chip array 550a.

[0222] The second method involves keeping the tilt angle of the incident surface 5233a relative to the end face of the second lens 5241a unchanged, while adjusting the length of the second mounting portion 523a. A smaller length of the second mounting portion 523a results in a smaller center-to-center distance between adjacent light-receiving chips in the first light-receiving chip array 550a; conversely, a larger length of the second mounting portion 523a results in a larger center-to-center distance between adjacent light-receiving chips in the first light-receiving chip array 550a. The initial value of the tilt angle of the incident surface 5233a relative to the end face of the second lens 5241a is the tilt angle of the fourth mounting surface 5232a relative to the end face of the second lens 5241a.

[0223] In some embodiments, the incident surface 5233a and the fourth mounting surface 5232a may be arranged in parallel.

[0224] In some embodiments, the incident surface 5233a and the fourth mounting surface 5232a can be inclined, and the inclination angle of the fourth mounting surface 5232a is greater than the inclination angle of the incident surface 5233a. While the incident surface 5233a and the fourth mounting surface 5232a can be parallel, the inclined arrangement of the incident surface 5233a and the fourth mounting surface 5232a, with the inclination angle of the fourth mounting surface 5232a greater than the inclination angle of the incident surface 5233a, effectively reduces the inclination angle of the incident surface 5233a relative to the end face where the second lens 5241a is located. This increases the center-to-center distance between two adjacent light receiving chips in the first light receiving chip array 550a, allowing the center-to-center distance between two adjacent light receiving chips in the first light receiving chip array 550a to be within a second preset range.

[0225] In some embodiments, the second carrier portion 521a may include a region connected to the bottom surface of the second mounting portion 523a, a region connected to the bottom surface of the second fixing portion 524a, a region connected to the bottom surface of the orientation adjustment portion 522a, a region between the second mounting portion 523a and the second fixing portion 524a, and a region between the second mounting portion 523a and the orientation adjustment portion 522a, to facilitate the mounting of the second filter array 540a and the second reflective sheet array 530a.

[0226] In some embodiments, the second support portion 521a may include a third sub-region to increase the area of ​​the second support portion 521a, thereby increasing the strength of the second support portion 521a and reducing the deformation of the second support portion 521a. The third sub-region is an overlapping region where the region connected to the bottom surface of the second mounting portion 523a extends outward and the region connected to the bottom surface of the second fixing portion 524a extends outward; that is, the region of the second support portion 521a located between the second mounting portion 523a and the second fixing portion 524a.

[0227] In some embodiments, the second light-transmitting substrate 520a may be an integrally formed structure.

[0228] In some embodiments, the second light-transmitting substrate 520a may be formed by bonding the second support portion 521a, the second fixing portion 524a, the second mounting portion 523a, and the orientation adjustment portion 522a together.

[0229] In some embodiments, the direction adjustment portion 522a may include a light-incident surface 5221a. The light-incident surface 5221a may face the third mounting surface 5231a of the second mounting portion 523a to receive the light signal filtered by the second filter array 530a. The direction adjustment portion 522a may include a reflective surface 5222a. The reflective surface 5222a may reflect the incident light signal. The reflective surface 5222a may face the light-incident surface 5221a to receive the light signal incident through the light-incident surface 5221a. The reflective surface 5222a may face the first light-receiving chip array 550a so that the first light-receiving chip array 550a can receive the light signal reflected by the reflective surface 5222a. The direction adjustment portion 522a may include a light-emitting surface. The light-emitting surface can be located in the reflection direction of the reflecting surface 5222a, so that the light signal reflected by the reflecting surface 5222a can be emitted through the light-emitting surface.

[0230] In some embodiments, a first lens array 525a may be formed on the bottom surface of the second carrier portion 521a, i.e., the bottom surface of the second light-transmitting substrate 520a. The first lens array 525a may be located in the light-emitting direction of the direction adjustment portion 522a (i.e., in the reflection direction of the reflecting surface 5222a) so that the first lens array 525a can receive the light signal emitted by the direction adjustment portion 522a. The first lens array 525a may be a converging lens array so that the first lens array 525a can converge the received light signal. A first light-receiving chip array 550a may be located in the converging direction of the first lens array 525a so that the first light-receiving chip array 550a can receive the light signal converged by the first lens array 525a. For example, the first lens array 525a may be located below the direction adjustment portion 522a, and the first lens array 525a may include four converging lenses arranged side-by-side along the width direction of the second light-transmitting substrate 520a.

[0231] Figure 7g is a cross-sectional view of a second light-transmitting substrate according to some embodiments. Figure 7h is a cross-sectional view of a first light-receiving component according to some embodiments. As shown in Figures 7g and 7h, in some embodiments, a second fixing groove 5243a can be formed at one end of the second fixing portion 423a (i.e., the end of the second fixing portion 423a). The second fixing groove 5243a can fix the second optical fiber 510a. The inner wall of the second fixing groove 5243a is connected to the outer wall of the second optical fiber 510a so that the inner wall of the second fixing groove 5243a carries the second optical fiber 510a. Hard glue is filled between the inner wall of the second fixing groove 5243a and the outer wall of the second optical fiber 510a, and after the hard glue solidifies, an adhesive layer is formed so that the inner wall of the second fixing groove 5243a is connected to the second optical fiber 510a. The opening of the first fixing groove 4223a can face away from the bottom of the second fixing portion 524a to facilitate the application of hard glue inside the second fixing groove 5243a.

[0232] In some embodiments, the inner wall of the second fixing groove 5243a and the outer wall of the second optical fiber 510a have complementary shapes, so that the inner wall of the second fixing groove 5243a and the outer wall of the second optical fiber 510a are connected. This reduces the contact area between the inner wall of the second fixing groove 5243a and the outer wall of the second optical fiber 510a, reduces local stress concentration, and improves the connection stability between the second fixing groove 5243a and the second optical fiber 510a. For example, the cross-section of the second optical fiber 510a is circular, and the cross-section of the second fixing groove 5243a is semi-circular.

[0233] In some embodiments, a second placement through-hole 5242a may be formed in the middle of the second fixing portion 524a. The second placement through-hole 5242a may be located between the second fixing groove 5243a and the second lens 5241a. One end of the first placement through-hole 4232a may communicate with the second fixing groove 5243a, so that the second optical fiber 510a can be inserted into the second placement through-hole 5242a through the second fixing groove 5243a. The other end of the second placement through-hole 5242a may be positioned in front of the second lens 5241a, so that the second optical fiber 510a is positioned in front of the second lens 5241a. The fiber end face of the second optical fiber 510a may be located at the focal point of the second lens 5241a, so that the fiber end face of the second optical fiber 510a can receive the optical signal converged by the second lens 5241a.

[0234] The second optical fiber 510a may include a core, a cladding, and a coating layer, with the coating layer covering the cladding and the cladding covering the core. The cladding and the core covered by the cladding of the second optical fiber 510a can be placed in the second placement through-hole 5242a, and the coating layer, the cladding covered by the coating layer, and the core covered by the cladding of the second optical fiber 510a can be placed in the second fixing slot 5243a.

[0235] In some embodiments, the radius of curvature of the second fixing groove 5243a is greater than the radius of curvature of the second placement through hole 5242a, so that the cladding of the second optical fiber 510a and the fiber core wrapped by the cladding can be placed in the second placement through hole 5242a, and the coating layer of the second optical fiber 510a, the cladding wrapped by the coating layer, and the fiber core wrapped by the cladding layer can be placed in the second fixing groove 5243a.

[0236] In some embodiments, a second countersunk hole 5245a may be formed in the middle of the second fixing part 524a. The second countersunk hole 5245a may be located at one end of the second placement through hole 5242a, and the second countersunk hole 5245a may be located at the other end of the second placement through hole 5242a, and the second countersunk hole 5245a may be connected to the second placement through hole 5242a. The second countersunk hole 5245a is more recessed than the second placement through hole 5242a, so that the second optical fiber 510a is suspended at the second countersunk hole 5245a. The hard adhesive along the cladding of the second optical fiber 510a can flow into the second countersunk hole 5245a and no longer flow to the optical fiber end face of the second optical fiber 510a, thereby reducing the contamination of the optical fiber end face of the second optical fiber 510a by the hard adhesive.

[0237] In some embodiments, the second storage through-hole 5242a may include a fourth sub-storage through-hole 52422a. One end of the fourth sub-storage through-hole 52422a may be connected to one end of the second fixing groove 5243a. The fourth sub-storage through-hole 52422a may have an opening facing the upper housing 201 to facilitate the application of hard adhesive to the fourth sub-storage through-hole 52422a.

[0238] In some embodiments, the second storage through hole 5242a may include a fifth sub-storage through hole 52423a. One end of the fifth sub-storage through hole 52423a may be connected to the other end of the fourth sub-storage through hole 52422a. The other end of the fifth sub-storage through hole 52423a may be connected to one end of the second countersunk hole 5245a.

[0239] In some embodiments, the second storage through-hole 5242a may include a sixth sub-storage through-hole 52421a. One end of the sixth sub-storage through-hole 52421a is connected to the other end of the second countersunk hole 5245a. The other end of the sixth sub-storage through-hole 52421a is located in front of the second lens 5241a.

[0240] In some embodiments, the sixth sub-placement through hole 52421a and the fifth sub-placement through hole 52423a may be located inside the second fixing part 524a to increase the contact area between the second optical fiber 510a and the second placement through hole 5242a and improve the connection stability between the second optical fiber 510a and the second placement through hole 5242a.

[0241] In some embodiments, the end face of the second placement through hole 5242a (i.e., the end near the second lens 5241a) is a third inclined surface, and the end face of the second optical fiber 510a is a fourth inclined surface. The third and fourth inclined surfaces can be arranged in parallel to increase the contact area between the end face of the second optical fiber 510a and the end face of the second placement through hole 5242a, reduce the transmission of the light signal converged by the second lens 5241a in the air, and make the light signal transmit as much as possible in the second light-transmitting substrate 520a.

[0242] In some embodiments, the other end (i.e., the front end of the second fixing part 524a) may form a second protective groove 5244a. The second protective groove 5244a may be connected to the other end of the second fixing groove 5243a. The second optical fiber 510a may be placed inside the second protective groove 5244a. The second protective groove 5244a is filled with soft glue, which protects the second optical fiber 510a to reduce damage to the second optical fiber 510a. The opening of the second protective groove 5244a may face the upper housing 201 to facilitate the application of soft glue inside the second protective groove 5244a.

[0243] In some embodiments, the second protective groove 5244a is more recessed than the second fixing groove 5243a to provide a space for the soft adhesive and prevent the height of the second optical fiber 510a in the second protective groove 5244a from being greater than the height of the second optical fiber 510a in the second fixing groove 5243a, so as to protect the second optical fiber 510a.

[0244] As shown in Figure 7h, the direction adjustment unit 522a is located in the transmission direction of the eighth filter 544a, so that the direction adjustment unit 522a can receive the eighth optical signal transmitted by the eighth filter 544a. The second reflective sheet array 530a is located in the reflection direction of the eighth filter 544a, so that the second reflective sheet array 530a can receive the seventh, sixth, and fifth optical signals reflected by the eighth filter 544a. The seventh filter 543a is located in the reflection direction of the second reflective sheet array 530a, so that the seventh filter 543a can receive the seventh, sixth, and fifth optical signals reflected by the second reflective sheet array 530a. The direction adjustment unit 522a is located in the transmission direction of the seventh filter 543a, so that the direction adjustment unit 522a can receive the seventh optical signal transmitted by the seventh filter 543a. The second reflective sheet array 530a is located in the reflection direction of the seventh filter 543a, so that the second reflective sheet array 530a can receive the sixth and fifth optical signals reflected by the seventh filter 543a. The sixth filter 542a is located in the reflection direction of the second reflective sheet array 530a, so that the sixth filter 542a can receive the sixth and fifth optical signals reflected by the second reflective sheet array 530a. The direction adjustment unit 522a is located in the transmission direction of the sixth filter 542a, so that the direction adjustment unit 522a can receive the sixth optical signal transmitted by the sixth filter 542a. The second reflective sheet array 530a is located in the reflection direction of the sixth filter 542a, so that the second reflective sheet array 530a can receive the fifth optical signal reflected by the sixth filter 542a. The fifth filter 541a is located in the reflection direction of the second reflective sheet array 530a, so that the fifth filter 541a can receive the fifth optical signal reflected by the second reflective sheet array 530a. The direction adjustment unit 522a is located in the transmission direction of the fifth filter 541a so that the direction adjustment unit 522a can receive the fifth light signal transmitted by the fifth filter 541a.

[0245] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, comprising: Circuit board; The carrier component is connected to the circuit board at one end; A light-emitting component is disposed on the top surface of the carrier and is electrically connected to the circuit board; The light emitting component includes: The first laser array is used to emit optical signals; The first filter array is located in the light-emitting direction of the first laser array; A first reflective sheet array is disposed opposite to the first filter array so that the optical signal is reflected between the first filter array and the first reflective sheet array to achieve wave combining; The first optical fiber is used to receive the optical signal; A first light-transmitting substrate has the first filter array and the first reflective sheet array attached to one end, and the first optical fiber fixed to the other end; a first lens is formed at the other end of the first light-transmitting substrate, and the first lens is located between the first optical fiber and the first filter array. A light receiving component is disposed on the bottom surface of the carrier and is electrically connected to the circuit board; The optical receiving component includes: Second optical fiber; The second filter array is located in the light-emitting direction of the second optical fiber; The second reflective sheet array is arranged opposite to the second filter array so that the optical signal is reflected between the second filter array and the second reflective sheet array to achieve wavelength division. The first optical receiving chip array has an input light direction different from the output light direction of the second optical fiber, and is used to receive optical signals; The second light-transmitting substrate has the second optical fiber fixed at one end and the second filter array and the second reflective sheet array mounted in the middle; a second lens is formed at one end of the second light-transmitting substrate, and the second lens is located between the second optical fiber and the second filter array; the other end of the second light-transmitting substrate is used to change the transmission direction of the optical signal so that the first optical receiving chip array receives the wavelength-divided optical signal.

2. The optical module according to claim 1, wherein, The first light-transmitting substrate includes: The first mounting section includes: The first mounting surface faces the first laser array and is on which the first filter array is mounted; The second mounting surface is disposed opposite to the first mounting surface and parallel to the first mounting surface, and the first reflective sheet array is mounted thereon; The exit surface is positioned opposite to the first mounting surface and connected to the second mounting surface.

3. The optical module according to claim 2, wherein, The first light-transmitting substrate includes: The first fixing part has the first lens formed at one end and the following at the other end: The inner wall of the first fixing groove is connected to the outer wall of the coating layer of the first optical fiber; The first placement through hole has its inner wall connected to the outer wall of the cladding of the first optical fiber, one end of which is connected to one end of the first fixing groove, and the other end is located in front of the first lens. The coating of the first optical fiber covers the cladding of the first optical fiber. The first protective groove is connected to the other end of the first fixing groove and is more recessed than the first fixing groove.

4. The optical module according to claim 3, wherein, The first fixing part is formed as follows: The first countersunk hole is located between one end of the first storage through hole and the other end of the first storage through hole, and is connected to the first storage through hole, and is more recessed relative to the first storage through hole.

5. The optical module according to claim 4, wherein, The first storage through hole includes: The first sub-placement through hole has one end connected to the first fixing groove, and the opening faces away from the bottom of the first fixing part; The second sub-storage through hole is connected at one end to the first sub-storage through hole and at the other end to one end of the first countersunk hole; The third sub-position through hole is connected at one end to the other end of the first countersunk hole, and the other end is located in front of the first lens.

6. The optical module according to claim 5, wherein, The fiber end face of the first optical fiber is arranged parallel to the other end face of the third sub-position through hole.

7. The optical module according to claim 3, wherein, The first light-transmitting substrate further includes: The top surface of the first bearing part is connected to the bottom surface of the first fixing part and the bottom surface of the first mounting part; The light emitting component also includes: The first isolator is attached to the top surface of the first bearing portion and is located between the first attachment portion and the first fixing portion.

8. The optical module according to claim 2, wherein, The exit surface is inclined to the second mounting surface, and the angle of inclination of the exit surface relative to the end face where the first lens is located is smaller than the angle of inclination of the second mounting surface relative to the end face where the first lens is located.

9. The optical module according to claim 1, wherein, The first filter array includes: A first filter; the first reflective array is located in the transmission direction of the first filter; The second filter is located in the reflection direction of the first reflective sheet array; the first reflective sheet array is located in both the transmission and reflection directions of the second filter. The third filter is located in the reflection direction of the first reflective sheet array; the first reflective sheet array is located in both the transmission direction and the reflection direction of the third filter. The fourth filter is located in the reflection direction of the first reflective sheet array; the first lens is located in both the transmission and reflection directions of the fourth filter.

10. The optical module according to claim 1, wherein, The other end of the second light-transmitting substrate is formed as follows: The direction adjustment section has an incident light surface facing the second filter array and a reflective surface facing the incident light surface and the first light receiving chip array.

11. The optical module according to claim 10, wherein, The bottom surface of the second light-transmitting substrate is formed as follows: The first lens array is located in the light-emitting direction of the direction adjustment section; the first light-receiving chip array is located in the converging direction of the first lens array.

12. The optical module according to claim 10, wherein, The second light-transmitting substrate includes: The second mounting section includes: The third mounting surface, facing the direction adjustment part, is where the second filter array is mounted; The fourth mounting surface is disposed opposite to the third mounting surface and parallel to the third mounting surface, and the second reflective sheet array is mounted thereon; The incident surface is positioned opposite to the third mounting surface and connected to the fourth mounting surface.

13. The optical module according to claim 12, wherein, The fourth mounting surface is inclined relative to the end face where the second lens is located, and the incident surface is inclined relative to the end face where the second lens is located; the incident surface is inclined to the fourth mounting surface.

14. The optical module according to claim 12, wherein, The second light-transmitting substrate includes: The second fixing part has the second lens formed at one end and the following formed at the other end: The inner wall of the second fixing groove is connected to the coating layer of the second optical fiber; The second placement through hole has its inner wall connected to the cladding of the second optical fiber, one end of which is connected to one end of the second fixing groove, and the other end is located in front of the second lens. The coating of the second optical fiber covers the cladding of the second optical fiber.

15. The optical module according to claim 14, wherein, The second fixing part is formed as follows: The second countersunk hole is located between one end of the second storage through hole and the other end of the second storage through hole, and is connected to the second storage through hole. It is more recessed than the second storage through hole.

16. The optical module according to claim 15, wherein, The second storage through hole includes: The fourth sub-placement through hole is connected at one end to the second fixing groove, and its opening faces away from the bottom of the second fixing part; The fifth sub-placement through hole is connected at one end to one end of the fourth sub-placement through hole and at the other end to one end of the second countersunk hole; The sixth sub-position through hole is connected at one end to the other end of the second countersunk hole, and the other end is located in front of the second lens.

17. The optical module according to claim 16, wherein, The fiber end face of the second optical fiber is set parallel to the other end face of the sixth sub-position through hole.

18. The optical module according to claim 14, wherein, The second light-transmitting substrate further includes: The top surface of the second bearing part is connected to the bottom surface of the second fixing part, the bottom surface of the second mounting part, and the bottom surface of the direction adjustment part, and one end of the bottom surface forms a first lens array.

19. The optical module according to claim 1, wherein, The carrier includes: The supporting base plate, the top surface of which includes: The first bearing surface is connected to the lower surface of the circuit board; The second bearing surface is connected to the lower surface of the first laser array; The third bearing surface is connected to the bottom surface of the first light-transmitting substrate; The first limiting side plate has its inner wall connected to the supporting base plate, and one end forms: The first limiting notch has one side wall corresponding to the first side wall of the circuit board and the other side wall corresponding to the second side wall of the circuit board; A limiting surface is provided corresponding to the third sidewall of the circuit board; wherein the first sidewall, the second sidewall, and the third sidewall of the circuit board are connected in sequence.

20. The optical module according to claim 19, wherein, The bottom surface of the supporting base plate supports the second light-transmitting substrate, and one end of the supporting base plate forms: The through-hole extends from the top surface of the supporting base plate to the bottom surface of the supporting base plate, so as to expose the first optical receiving chip array on the circuit board; A second limiting notch is formed on the first limiting side plate. One side wall of the second limiting notch is correspondingly disposed with one side wall of the second light-transmitting substrate, and the other side wall of the second limiting notch is correspondingly disposed with the other side wall of the second light-transmitting substrate.

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