Electronic device

Abstract

The present application provides an electronic device, comprising a substrate, heat-generating elements, a heat sink, a fan module, and sealing members. The heat-generating elements are mounted on the substrate. At least a portion of the heat sink is spaced apart from the substrate in a first direction so as to define a heat-generating space for accommodating the heat-generating elements. The heat sink is configured to dissipate heat from the heat-generating elements. The fan module and the heat sink are arranged in a second direction. The sealing members are configured to seal the heat-generating space in the second direction, thereby reducing the risk that low-temperature air blown by the fan module toward the heat sink is diverted into the heat-generating space, improving the utilization efficiency of the low-temperature air blown by the fan module toward the heat sink, reducing the risk of high-temperature air flowing back through the heat-generating space, reducing the risk of an increase in the temperature of the air blown by the fan module into a heat dissipation channel, improving the heat dissipation efficiency of the heat sink, the heat-generating elements, and the electronic device, and enhancing the heat dissipation capability of the electronic device.

Description

An electronic device

[0001] This application claims priority to Chinese patent application filed on March 18, 2025, with application number 202520469886.8 and entitled "An Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of heat dissipation technology, and more particularly to an electronic device. Background Technology

[0003] The circuit board of an electronic device contains multiple heat-generating elements. These elements contact a heat sink via a heat-conducting medium. The heat sink dissipates heat from the elements through efficient heat exchange with the outside air. To improve the heat sink's efficiency, a fan is installed inside the electronic device, directly opposite the heat sink. The fan draws in cool air from outside the device and blows it towards the heat sink. After exchanging heat with the heat sink, the cool air's temperature rises, becoming hot air, which is then exhausted through the device's exhaust vent.

[0004] Before the hot air is exhausted through the air outlet, there is a problem that the hot air flows back to the heat sink, heat-generating components, etc., which reduces the heat dissipation efficiency. There is also a problem that the hot air flows back to the air inlet of the fan, which makes the air blown by the fan to the heat sink at a higher temperature, which also reduces the heat dissipation efficiency, thus leading to a decrease in the performance of electronic devices.

[0005] Therefore, how to improve the heat dissipation efficiency of heating elements and heat sinks is an urgent problem to be solved in this field.

[0006] Application content

[0007] In view of this, this application provides an electronic device that can improve the heat dissipation efficiency of heat-generating components and heat sinks.

[0008] This application discloses an electronic device, including a substrate, a heating element, a heat sink, a fan module, and a sealing member. The heating element is mounted on the substrate. At least a portion of the structure of the heat sink has a heat-generating space in a first direction with the substrate for accommodating the heating element. The heat sink is used to dissipate heat from the heating element. The fan module is arranged with the heat sink in a second direction and is used to cool the heat sink. The second direction is not parallel to the first direction. For example, the first direction is parallel to the length direction of the electronic device, and the second direction is parallel to the height direction of the electronic device. The sealing member contacts the substrate and the heat sink on both sides in the first direction, respectively, and is used to seal the heat-generating space in the second direction.

[0009] In this application, by sealing the heat-generating space with a sealing element, the risk of low-temperature air blown from the fan module to the heat sink being diverted into the heat-generating space is reduced, thereby improving the utilization rate of the low-temperature air blown from the fan module to the heat sink. At the same time, it reduces the risk of high-temperature air flowing back to the fan module through the heat-generating space under negative pressure, and reduces the risk of the air temperature rising when blown into the heat dissipation channel by the fan module. This increases the temperature difference between the air and the fins in the heat dissipation channel, thereby improving the heat dissipation efficiency of the heat sink, heat-generating elements, and electronic equipment, and enhancing the heat dissipation capacity of the electronic equipment.

[0010] In some possible designs, the seal includes a first seal, at least a portion of which is located in a second direction between the heat-generating space and the fan module. And / or, the seal includes a second seal, with the heat-generating space located in a second direction between the second seal and the fan module.

[0011] In this application, the first sealing element blocks the side of the heat-generating space near the fan module, reducing the risk of low-temperature air blown from the fan module to the heat sink being diverted into the heat-generating space and improving the utilization rate of the low-temperature air blown from the fan module to the heat sink. At the same time, the first sealing element reduces the risk of high-temperature air flowing back to the fan module through the heat-generating space under negative pressure, reducing the risk of the air temperature rising when blown into the heat dissipation channel by the fan module. This increases the temperature difference between the air and the fins in the heat dissipation channel, thereby improving the heat dissipation efficiency of the heat sink, heat-generating elements, and electronic equipment, and enhancing the heat dissipation capacity of the electronic equipment.

[0012] By sealing the side of the heat-generating space away from the fan module with a second seal, the risk of high-temperature air entering the heat-generating space and causing a decrease in the heat dissipation efficiency of the heat-generating components in the heat-generating space is reduced. This improves the heat dissipation efficiency of the heat sink, heat-generating components, and electronic equipment, and enhances the heat dissipation capacity of the electronic equipment.

[0013] In some possible designs, the seal is integrally formed with the substrate, or the seal is integrally formed with the heat sink, or the seal is a separate part and is connected to the substrate and the heat sink separately.

[0014] In this application, the seal and the substrate are integrally formed, or the seal and the heat sink are integrally formed, to simplify the connection structure between the seal and the substrate, and between the seal and the heat sink, thereby reducing the connection cost between the seal and the substrate, and between the seal and the heat sink.

[0015] The seals are connected to the substrate and heat sink separately as independent parts to facilitate the processing of the seals and reduce the processing cost of the seals.

[0016] In some possible designs, the electronic device also includes a first air guide plate. A first end of the first air guide plate is sealed to the fan module, and a second end extends towards the heat sink. The first air guide plate is circumferentially positioned around the outside of the fan module. In a second direction, the portion of the first air guide plate between the fan module and the heat sink forms an air intake channel, which communicates with the heat dissipation channel of the heat sink. The second end forms an outlet for the air intake channel, which is directly opposite the heat dissipation channel in the second direction.

[0017] In this application, the low-temperature air blown by the fan module towards the heat sink first enters the air intake channel and then enters the heat dissipation channel through the air intake channel outlet. The first air guide plate, which forms the air intake channel, guides the low-temperature air blown by the fan module towards the heat sink. The first air guide plate also reduces the airflow resistance between the fan module and the heat sink, increasing the flow rate of the low-temperature air entering the heat dissipation channel and improving the heat dissipation efficiency of the heat sink, heat-generating components, and electronic equipment. Simultaneously, the first air guide plate forms the air intake channel for the low-temperature air between the fan module and the heat sink, reducing the impact of the returning high-temperature air on the temperature of the low-temperature air between the fan module and the heat sink, thereby lowering the temperature of the air entering the heat dissipation channel and further improving the heat dissipation efficiency of the heat sink, heat-generating components, and electronic equipment, thus enhancing the heat dissipation capacity of the electronic equipment.

[0018] In some possible designs, the second end is connected to a shielding part in the second direction opposite to the heating space. The shielding part is used to block the part of the outlet in the second direction opposite to the heating space, and the shielding part serves as a seal.

[0019] In this application, the shielding part is an independent component and is fixed to the first air guide plate, or the shielding part and the second end are integrally formed. During the installation process, after the first air guide plate is installed and fixed as a whole, the shielding part on the second end can directly block the heat-generating space in the height direction of the electronic device, thereby helping to shorten the installation cycle of the electronic device.

[0020] In some possible designs, the fan module is mounted on the substrate, and the fan module and the substrate are sealed together in a first direction. The electronic device also includes a housing having an inner cavity in which the substrate, heat-generating element, heat sink, and fan module are all located. The substrate is connected to the housing, and a first assembly gap is provided between the fan module and the housing. The first assembly gap is located on at least one side of the fan module along its circumference. The electronic device also includes a third seal, at least a portion of which is located within the first assembly gap to seal the fan module to the housing.

[0021] In this application, the fan module and the substrate are sealed together in the first direction, which reduces the risk of high-temperature air flowing between the fan module and the air inlet. This is beneficial to increasing the volume of low-temperature air drawn in by the fan module and also helps to reduce the temperature of the air blown by the fan module to the heat sink, thereby improving the heat dissipation efficiency of the fan module on the heat sink and enhancing the heat dissipation capacity of the electronic device.

[0022] The fan module and the housing are sealed together by a third seal, which reduces the risk of hot air flowing through the first assembly gap between the fan module and the housing to the space between the fan module and the air inlet. This helps to increase the volume of cold air drawn in by the fan module and also helps to reduce the temperature of the air blown by the fan module to the heat sink, thereby improving the heat dissipation efficiency of the fan module for the heat sink and heat-generating components, and thus enhancing the heat dissipation capacity of the electronic device.

[0023] In some possible designs, the third seal is integrally formed with the housing, or integrally formed with the fan module, or the third seal is a separate part that is connected to both the housing and the fan module.

[0024] In this application, the third seal and the fan module bracket are integrally formed, or the third seal and the housing are integrally formed, to simplify the connection structure between the third seal and the fan module, and between the third seal and the housing, thereby reducing the connection cost between the third seal and the fan module, and between the third seal and the housing.

[0025] The third seal is connected separately to the fan module and the housing as an independent part, which facilitates the processing of the third seal and reduces its processing cost.

[0026] In some possible designs, the heat sink includes a body and fins. The fins are located on the side of the body facing away from the substrate in a first direction. The fins extend along a second direction, and multiple fins are spaced apart along a third direction to form a heat dissipation channel. The third direction is perpendicular to the first and second directions; exemplarily, the third direction is parallel to the width direction of the electronic device. The electronic device also includes a partition, with the end of the fins away from the body in the first direction sealed to the partition. The partition is used to block the heat dissipation channel in the first direction.

[0027] In this application, the heat dissipation channel is blocked by a partition in the first direction, which reduces the risk of low-temperature air in the heat dissipation channel escaping to the outside of the heat dissipation channel, thereby increasing the volume of low-temperature air in the heat dissipation channel for heat exchange with the fins and improving the heat dissipation efficiency of the fan module for the heat sink.

[0028] In some possible designs, the partition includes a first plate and a second plate. The first plate and the heat sink body are located on opposite sides of the fins in a first direction, and the first plate is sealed to the fins. The second plate is disposed opposite to the first plate in a third direction, with one end of the second plate connected to the first plate and the other end of the second plate sealed to the substrate. The second plate abuts against the body in the third direction, and the second plate is used to seal the heat-generating space in the third direction.

[0029] In this application, the heating space is sealed by a first seal and a second seal on both sides in the second direction, and the heating space is sealed by a second plate on both sides in the third direction. By setting the first seal, the second seal, and the second plate, the sealing effect of the heating space can be improved, thereby reducing the risk of high-temperature gas flowing back into the heating space and causing a decrease in the heat dissipation efficiency of the heating element. It also reduces the risk of low-temperature air escaping and the volume of low-temperature air exchanging heat decreasing, thereby improving the heat dissipation performance of electronic devices.

[0030] In some possible designs, the baffle and fins are integrally formed.

[0031] In this application, the partition and the heat sink are integrally formed, specifically, the partition and the fins are integrally formed, in order to simplify the connection between the partition and the heat sink, and between the partition and the substrate, thereby reducing the connection cost between the partition and the heat sink, and between the partition and the substrate.

[0032] In some possible designs, the electronic device also includes a housing and a second air guide plate. One end of the second air guide plate is connected to the heat sink, and the other end of the second air guide plate extends toward the air outlet of the electronic device. The second air guide plate forms an air outlet channel, which connects the heat dissipation channel of the heat sink and the air outlet of the electronic device.

[0033] In this application, after the high-temperature air in the heat dissipation channel flows in the second direction and leaves the heat sink, the high-temperature air can enter the air outlet channel surrounded by the second air guide plate. The second air guide plate can guide the flow of high-temperature air, so that the high-temperature air can quickly flow to the air outlet and be discharged from the electronic device, reducing the risk of high-temperature air accumulating inside the electronic device and reducing the heat dissipation efficiency of the electronic device, thereby improving the heat dissipation efficiency of the electronic device and enhancing the heat dissipation capacity of the electronic device.

[0034] In some possible designs, the electronic device also includes a housing with an inner cavity in which the substrate, heating element, heat sink, and fan module are located, with a second assembly gap between the second air guide plate and the housing. The electronic device also includes a fourth seal, at least a portion of which is located within the second assembly gap to seal it.

[0035] In this application, a second assembly gap is left between the second air guide plate and the outer casing in a plane perpendicular to the second direction, which reduces the processing and installation difficulty of the outer casing and the second air guide plate, thereby reducing the processing cost of electronic equipment and shortening the installation cycle of electronic equipment.

[0036] The fourth seal can block the gap of the second assembly in the second direction, reducing the risk that the high-temperature air in the air outlet channel will flow back into the electronic device through the second assembly gap, thereby reducing the heat dissipation efficiency of the electronic device and improving the heat dissipation efficiency and heat dissipation capacity of the electronic device.

[0037] In some possible designs, the fourth seal is integrally formed with the second air guide plate, or the third seal is integrally formed with the housing, or the fourth seal is a separate part connected to the second air guide plate and the housing respectively.

[0038] In this application, the fourth seal and the second air guide plate are integrally formed, or the third seal and the outer shell are integrally formed, in order to simplify the connection structure between the third seal and the second air guide plate and the third seal and the outer shell, thereby reducing the connection cost between the third seal and the second air guide plate and the third seal and the outer shell.

[0039] The fourth seal is connected to the second air guide plate and the outer casing as an independent part, so as to facilitate the processing of the fourth seal and reduce the processing cost of the fourth seal.

[0040] In some possible designs, at least two of the first air guide plate, the baffle, and the second air guide plate are integrally formed structures.

[0041] In this application, at least two of the first air guide plate, the partition plate, and the second air guide plate are integrally formed to simplify the connection structure of the first air guide plate, the partition plate, and the second air guide plate, thereby reducing the connection cost of the first air guide plate, the partition plate, and the second air guide plate. Attached Figure Description

[0042] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 is a schematic diagram of the structure of an electronic device in some embodiments;

[0044] Figure 2 is a schematic diagram of the internal structure of an electronic device in some embodiments;

[0045] Figure 3 is a schematic diagram of the internal structure of the electronic device in some other embodiments;

[0046] Figure 4 is a cross-sectional view of the electronic device in Figure 1 along the BB direction in some embodiments;

[0047] Figure 5 is an enlarged view of part D in Figure 4 in some embodiments;

[0048] Figure 6 is a schematic diagram of the connection structure of the substrate, heating element and heat sink;

[0049] Figure 7 is a cross-sectional view along direction AA of the electronic device in Figure 1 in some embodiments;

[0050] Figure 8 is a schematic diagram of airflow in a cross-sectional view along the BB direction of the electronic device in Figure 1 in some embodiments;

[0051] Figure 9 is a schematic diagram of airflow in a cross-sectional view along the CC direction of the electronic device in Figure 1 in some embodiments;

[0052] Figure 10 is a schematic diagram of airflow in a cross-sectional view along the BB direction of the electronic device in Figure 1 in some embodiments;

[0053] Figure 11 is a cross-sectional view along the BB direction of the electronic device provided in this application in some embodiments;

[0054] Figure 12 is a cross-sectional view along the BB direction of the electronic device provided in this application in some other embodiments;

[0055] Figure 13 is a schematic diagram of the fan module in some embodiments;

[0056] Figure 14 is a cross-sectional view along the BB direction of the electronic device provided in this application in some other embodiments;

[0057] Figure 15 is a cross-sectional view along the BB direction of the electronic device provided in this application in some other embodiments;

[0058] Figure 16 is a structural schematic diagram of the fan module in some other embodiments;

[0059] Figure 17 is a cross-sectional view of a portion of the structure of the electronic device provided in this application in the BB direction in some other embodiments;

[0060] Figure 18 is a schematic diagram of high-temperature airflow in some embodiments of the electronic device;

[0061] Figure 19 is a schematic diagram of high-temperature airflow in the BB direction in some embodiments of the electronic device;

[0062] Figure 20 is a structural cross-sectional view of the electronic device in the BB direction in some other embodiments;

[0063] Figure 21 is a schematic diagram of the structure of the substrate and the first air guide plate in some embodiments;

[0064] Figure 22 is a schematic diagram of the structure of the substrate and the first air guide plate in some other embodiments;

[0065] Figure 23 is a schematic diagram of the structure of the substrate and the first air guide plate in some other embodiments;

[0066] Figure 24 is a schematic diagram of airflow in an electronic device in some other embodiments;

[0067] Figure 25 is a schematic diagram of airflow in the BB direction in some other embodiments of the electronic device;

[0068] Figure 26 is a structural cross-sectional view of the electronic device in the BB direction in some other embodiments;

[0069] Figure 27 is an enlarged view of part E in Figure 26;

[0070] Figure 28 is a schematic diagram of airflow at the radiator in some embodiments;

[0071] Figure 29 is a structural cross-sectional view of the electronic device in the BB direction in some other embodiments;

[0072] Figure 30 is a schematic diagram of the structure of the radiator in Figure 29 in some embodiments;

[0073] Figure 31 is a schematic diagram of the structure of the heat sink in some other embodiments;

[0074] Figure 32 is a structural cross-sectional view of the electronic device in the BB direction in some other embodiments;

[0075] Figure 33 is a schematic diagram of the connection structure between the substrate and the heat sink in some other embodiments;

[0076] Figure 34 is a schematic diagram of the connection structure between the substrate and the heat sink in some other embodiments;

[0077] Figure 35 is a structural cross-sectional view of the electronic device in the BB direction in some other embodiments;

[0078] Figure 36 is a structural cross-sectional view of the electronic device in the BB direction in some other embodiments.

[0079] Reference numerals: 1-Outer shell; 11-Inner cavity; 111-Heating space; 112-First assembly gap; 113-Air outlet channel; 114-Second assembly gap; 116-Fourth assembly gap; 12-Air inlet; 13-Air outlet; 14-Cellular antenna; 15-Wi-Fi antenna; 2-Substrate; 3-Heating element; 4-Heat sink; 41-Body; 42-Fin; 43-Heat dissipation channel; 44-Heat conduction medium; 5-Fan module; 6-First seal; 7-Second seal; 8-First air guide plate; 81-First end; 82-Second end; 83-Air inlet channel; 831-Outlet; 84-Shielding part; 9-Third seal; 10-Partition; 101-First plate; 102-Second plate; 20-Second air guide plate; 30-Fourth seal. Detailed Implementation

[0080] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0081] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0082] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0083] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0084] This application provides an electronic device, including but not limited to CPE (Customer Premises Equipment), speakers, computers, and other electronic products. This application does not specifically limit the type of electronic device. For example, the electronic device is a CPE device, which is used to convert LTE (Long Term Evolution) signals or NR (New Radio) signals received from a base station into Wi-Fi signals for user terminals to access.

[0085] Figure 1 is a schematic diagram of the structure of an electronic device in some embodiments. As shown in Figure 1, the electronic device has two perpendicular directions: length X, width Y, and height Z.

[0086] Figure 2 is a schematic diagram of the internal structure of an electronic device in some embodiments. As shown in Figure 2, the electronic device includes a housing 1, which encloses an inner cavity 11. A substrate 2 and a heating element 3 mounted on the substrate 2 are disposed within the inner cavity 11. This application does not impose any special limitations on the type or material of the substrate 2. The heating element 3 refers to a component with a high temperature during operation. The heating element 3 includes, but is not limited to, the power supply, central processing unit (CPU), and memory (RAM / ROM) of the electronic device. The number of heating elements 3 can be one or more. When there are multiple heating elements 3, they can be arranged in any direction. This application does not impose any special limitations on the specific type, number, or arrangement of the heating elements 3.

[0087] Figure 3 is a schematic diagram of the internal structure of an electronic device in some other embodiments. As shown in Figure 3, a heat sink 4 is also provided in the inner cavity 11. The heat sink 4 is used to dissipate heat from the heat-generating element 3. As shown in Figure 3, a fan module 5 is also provided in the inner cavity 11. Along the distribution direction of the fan module 5 and the heat sink 4, the fan module 5 generates negative pressure by rotating itself, thereby drawing low-temperature air from the outside into the inner cavity 11 and blowing the low-temperature air toward the heat sink 4. After the low-temperature air flows through the heat sink 4, it exchanges heat with the heat sink 4, thereby reducing the temperature of the heat sink 4. The heat sink 4, after its temperature is reduced, exchanges heat with the heat-generating element 3, which has a higher temperature, thereby achieving heat dissipation of the heat-generating element 3.

[0088] The distribution direction of the heating element 3 and the substrate 2 is denoted as the first direction, and the distribution direction of the fan module 5 and the heat sink 4 is denoted as the second direction. The first direction and the second direction are not parallel. For example, the first direction is parallel to the length direction X of the electronic device, and the second direction is parallel to the width and height direction Z of the electronic device, that is, the first direction and the second direction are perpendicular, and both the first direction and the second direction are perpendicular to the width direction Y of the electronic device.

[0089] For ease of description, the following directions are all referred to as the third direction: the first direction is parallel to the length direction X of the electronic device, the second direction is parallel to the width and height direction Z of the electronic device, and the third direction is parallel to the width direction Y of the electronic device.

[0090] Figure 4 is a cross-sectional view of the electronic device in Figure 1 along the BB direction in some embodiments. For example, the distribution of the substrate 2, the heating element 3, the heat sink 4 and the fan module 5 is shown in Figure 4. The substrate 2 and the heat sink 4 are arranged at intervals along the length direction X of the electronic device, and there is a space between the substrate 2 and the heat sink 4. This space is referred to as the heating space 111. The heating element 3 is contained in the heating space 111. The heat sink 4 and the fan module 5 are arranged along the height direction Z of the electronic device.

[0091] As shown in Figure 4, a cellular antenna 14 and a Wi-Fi antenna 15 may also be provided inside the cavity 11 of the electronic device. In this embodiment, no special limitation is made on the specific number or type of parts inside the electronic device.

[0092] There is an air gap between the heating element 3 and the heat sink 4 in the length direction X of the electronic device, or the heating element 3 and the heat sink 4 are indirectly connected by a heat-conducting medium 44.

[0093] Figure 5 is an enlarged view of part D in Figure 4 in some embodiments. As shown in Figure 5, the heating element 3 and the heat sink 4 are indirectly connected through a heat-conducting medium 44. The heat-conducting medium 44 can improve the heat transfer efficiency between the heating element 3 and the heat sink 4, thereby improving the heat dissipation efficiency of the heating element 3.

[0094] The thermally conductive medium 44 can be a material with good thermal conductivity, such as thermally conductive adhesive or thermally conductive pad. In this embodiment, the specific material of the thermally conductive medium 44 is not specifically limited.

[0095] Figure 6 is a schematic diagram of the connection structure of the substrate 2, the heating element 3 and the heat sink 4. As shown in Figure 6, the heat sink 4 includes a body 41 and fins 42. Along the length direction X of the electronic device, one side of the body 41 is used to contact the heating element 3, and the other side of the body 41 is connected to a plurality of fins 42. The fins 42 extend along a second direction, and the plurality of fins 42 are arranged at intervals along a third direction. For example, as shown in Figure 6, the fins 42 extend along the height direction Z of the electronic device, and the plurality of fins 42 are arranged at intervals along the width direction Y of the electronic device. In the width direction Y of the electronic device, the gap between adjacent fins 42 forms a heat dissipation channel of the heat sink 4.

[0096] Figure 7 is a cross-sectional view along direction AA of the electronic device in Figure 1 in some embodiments. As shown in Figure 7, during the operation of the fan module 5, a negative pressure is generated between the fan module 5 and the air inlet 12 on the outer casing 1. Under the action of the negative pressure, the low-temperature air from the outside is drawn into the inner cavity 11 through the air inlet 12. The fan module 5 then blows the low-temperature air into the heat dissipation channel 43. The low-temperature air flows in the heat dissipation channel 43 and exchanges heat with the fins 42, causing the temperature of the low-temperature air to rise and become high-temperature air. At the same time, the temperature of the fins 42 decreases, thereby completing the heat dissipation of the heat sink 4. The heat sink 4 is provided with multiple fins 42, which increases the contact area between the heat sink 4 and the low-temperature air, thereby improving the heat dissipation efficiency of the heat sink 4.

[0097] Figure 8 is a schematic diagram of airflow in a cross-sectional view along the BB direction of the electronic device in Figure 1 in some embodiments. As shown in Figure 8, during the operation of the fan module 5, the fan blades of the fan module 5 rotate and draw in low-temperature air from the outside through the air inlet 12. As the fan blades rotate, they continuously push the low-temperature air towards the heat sink 4. During the flow of the low-temperature air towards the heat sink 4, some of the low-temperature air enters the heat-generating space 111 between the heat sink 4 and the substrate 2 and then leaves through the air outlet 13. Some of the low-temperature air enters the heat dissipation channel of the heat sink 4 for heat exchange and then leaves through the air outlet 13. A portion of the low-temperature air passes over the heat exchanger 4 on the side of the heat exchanger 4 away from the substrate 2 without exchanging heat with the heat exchanger 4 and leaves directly through the air outlet 13.

[0098] Figure 9 is a schematic diagram of airflow in a cross-sectional view along the CC direction of the electronic device in Figure 1 in some embodiments. As shown in Figure 9, a portion of the low-temperature air entering the heat-generating space 111 will dissipate along the width direction Y of the electronic device and leave the heat-generating space 111, so that only a portion of the low-temperature air in the heat-generating space 111 is used for efficient heat dissipation of the heat-generating element 3.

[0099] Referring to Figures 8 and 9, a portion of the low-temperature air drawn in by the fan module 5 passes over the heat exchanger 4 on the side of the heat exchanger 4 away from the substrate 2 and leaves directly through the air outlet 13. Another portion enters the heating space 111 and dissipates along the width direction Y of the electronic device before leaving the heating space 111. Neither of these two portions of low-temperature air effectively exchanges heat with the heating element 3 and the heat exchanger 4. That is, only a portion of the low-temperature air drawn in by the fan module 5 effectively participates in heat exchange, while the other portion does not effectively participate in heat exchange and leaves the electronic device directly through the air outlet 13. This reduces the utilization rate of the low-temperature air drawn in by the fan module 5, thereby reducing the heat dissipation efficiency of the heat sink 4 for the heating element and reducing the heat dissipation capacity of the electronic device.

[0100] Referring to Figures 8 and 9, a portion of the low-temperature air enters the heat dissipation channel 43 of the radiator 4 and exchanges heat efficiently with the heating element 3 through the heat exchanger 4. Another portion of the low-temperature air enters the heating space 111 and exchanges heat directly with the heating element 3. However, the contact area between the heating element 3 and the low-temperature air is much smaller than that between the radiator 4 and the low-temperature air. This results in the low-temperature air in the heating space 111 having a lower heat dissipation efficiency for the heating element 3 than the low-temperature air in the heat dissipation channel 43. Consequently, the heat dissipation efficiency of the radiator 4, the heating element 3, and the electronic equipment is reduced, thus lowering the heat dissipation capacity of the electronic equipment.

[0101] In addition, Figure 10 is a schematic diagram of airflow in a cross-sectional view along the BB direction of the electronic device in Figure 1 in some embodiments. As shown in Figure 10, after the low-temperature air exchanges heat with the heat exchanger 4 and becomes high-temperature air, the high-temperature air will flow back towards the fan module 5 under the drive of the negative pressure generated by the fan module 5, which will cause the temperature of the air entering the heat exchange channel 43 to rise, reduce the heat dissipation efficiency of the heat sink 4, the heat-generating element 3 and the electronic device, and reduce the heat dissipation capacity of the electronic device.

[0102] As electronic devices evolve in specifications and power consumption increases, the heat dissipation requirements of the heat-generating element 3 gradually increase. The diversion and dissipation of low-temperature air drawn in by the fan module 5, and the return flow of high-temperature air after heat exchange, limit the improvement of the heat dissipation capacity of electronic devices.

[0103] In view of this, the electronic device provided in the embodiments of this application is provided with a sealing member. The sealing member contacts the substrate and the heat sink on both sides of the electronic device in the length direction. The sealing member is used to block the heat-generating space in the height direction of the electronic device, which reduces the risk of low-temperature air blown by the fan module to the heat sink being diverted into the heat-generating space, improves the utilization rate of low-temperature air blown by the fan module to the heat sink, and at the same time reduces the risk of high-temperature air flowing back to the fan module through the heat-generating space under the action of negative pressure, and reduces the risk of the air temperature rising when blown by the fan module into the heat dissipation channel, so as to increase the temperature difference between the air in the heat dissipation channel and the fins, thereby improving the heat dissipation efficiency of the heat sink, the heat-generating element and the electronic device, and enhancing the heat dissipation capacity of the electronic device.

[0104] Figure 11 is a cross-sectional view of the electronic device provided in this application in some embodiments along the BB direction. As shown in Figure 11, the sealing element includes a first sealing element 6. The first sealing element 6 contacts the substrate 2 and the heat sink 4 on both sides in the length direction X of the electronic device, and at least a portion of the structure of the first sealing element 6 is located between the heat-generating space 111 and the fan module 5 in the height direction Z of the electronic device. The first sealing element 6 is used to block the side of the heat-generating space 111 near the fan module 5 in the height direction Z of the electronic device.

[0105] In this embodiment, the first sealing element 6 blocks the side of the heat-generating space 111 near the fan module 5, reducing the risk of low-temperature air blown from the fan module 5 to the heat sink 4 being diverted into the heat-generating space 111. This improves the utilization rate of the low-temperature air blown from the fan module 5 to the heat sink 4, thereby enhancing the heat dissipation efficiency of the heat sink 4, the heating element 3, and the electronic equipment, and strengthening the heat dissipation capacity of the electronic equipment. Simultaneously, the first sealing element 6 reduces the risk of high-temperature air flowing back into the fan module 5 through the heat-generating space 111 under negative pressure, thus reducing the risk of the air temperature rising in the heat dissipation channel 43 blown by the fan module 5. This increases the temperature difference between the air in the heat dissipation channel 43 and the fins 42, thereby improving the heat dissipation efficiency of the heat sink 4, the heating element 3, and the electronic equipment, and strengthening the heat dissipation capacity of the electronic equipment.

[0106] The length of the first sealing member 6 in the width direction Y of the electronic device is not less than the length of the heating space 111, so as to improve the sealing effect of the first sealing member 6 on the heating space 111.

[0107] In some embodiments, the first sealing member 6 and the substrate 2 are integrally formed, or the first sealing member 6 and the heat sink 4 are integrally formed, so as to simplify the connection structure between the first sealing member 6 and the substrate 2, and between the first sealing member 6 and the heat sink 4, thereby reducing the connection cost between the first sealing member 6 and the substrate 2, and between the first sealing member 6 and the heat sink 4.

[0108] In other embodiments, the first sealing element 6 is connected as an independent component to both the substrate 2 and the heat sink 4, facilitating its processing and reducing its cost. The methods for fixing the first sealing element 6 to the substrate 2 include, but are not limited to, bonding, welding, riveting, and snap-fitting. The methods for fixing the first sealing element 6 to the substrate 2 and the heat sink 4 can be the same or different. Alternatively, after the substrate 2 and the heat sink 4 are fixedly connected, the first sealing element 6 is directly clamped and fixed by the substrate 2 and the heat sink 4. This application does not impose any special limitations on the method of fixing the first sealing element 6.

[0109] The first sealing element 6 can be made of foam, rubber, gel, or other materials to reduce its cost. For example, the first sealing element 6 can be made of adhesive, allowing it to be directly bonded to the substrate 2 and the heat sink 4, thereby reducing the installation difficulty and shortening the assembly cycle of the electronic device.

[0110] Figure 12 is a cross-sectional view of the electronic device provided in this application in the BB direction in some other embodiments. As shown in Figure 12, the seal includes a second seal 7. The second seal 7 contacts the substrate 2 and the heat sink 4 on both sides in the length direction X of the electronic device, respectively. The heat-generating space 111 is located between the second seal 7 and the fan module 5 in the height direction of the electronic device. The second seal 7 is used to block the side of the heat-generating space 111 away from the fan module 5 in the height direction of the electronic device.

[0111] In this embodiment, the side of the heat-generating space 111 away from the fan module 5 is sealed by the second sealing member 7, which reduces the risk of high-temperature air entering the heat-generating space 111 and causing a decrease in the heat dissipation efficiency of the heat-generating element 3 in the heat-generating space 111, thereby improving the heat dissipation efficiency of the heat sink 4, the heat-generating element 3 and the electronic device, and enhancing the heat dissipation capability of the electronic device.

[0112] The length of the second seal 7 in the width direction Y of the electronic device is not less than the length of the heating space 111, so as to improve the sealing effect of the second seal 7 on the heating space 111.

[0113] In some embodiments, the second seal 7 and the substrate 2 are integrally formed, or the second seal 7 and the heat sink 4 are integrally formed, so as to simplify the connection structure between the second seal 7 and the substrate 2 and the second seal 7 and the heat sink 4, thereby reducing the connection cost between the second seal 7 and the substrate 2 and the second seal 7 and the heat sink 4.

[0114] In other embodiments, the second sealing element 7 is connected as an independent component to both the substrate 2 and the heat sink 4, facilitating its processing and reducing its cost. The methods for fixing the second sealing element 7 to the substrate 2 include, but are not limited to, bonding, welding, riveting, and snap-fitting. The methods for fixing the second sealing element 7 to the heat sink 4 also include, but are not limited to, bonding, welding, riveting, and snap-fitting. These methods can be the same as or different from those for fixing the second sealing element 7 to the substrate 2 and the heat sink 4. Alternatively, after the substrate 2 and the heat sink 4 are fixedly connected, the second sealing element 7 is directly clamped and fixed by the substrate 2 and the heat sink 4. This application does not impose any special limitations on the method of fixing the second sealing element 7.

[0115] The second seal 7 can be made of foam, rubber, gel, or other materials to reduce its cost. For example, the second seal 7 can be made of adhesive, allowing it to be directly bonded to the substrate 2 and the heat sink 4, thus reducing the installation difficulty and shortening the assembly cycle of the electronic device.

[0116] The electronic device may have only a first seal, only a second seal, or both a first seal and a second seal.

[0117] Figure 13 is a schematic diagram of the fan module 5 in some embodiments. As shown in Figure 13, the electronic device also includes a first air guide plate 8. The first end 81 of the first air guide plate 8 is sealed to the fan module 5, and the second end 82 of the first air guide plate 8 extends toward the direction close to the heat sink 4. The first air guide plate 8 is arranged around the outside of the fan module 5 along the circumference of the fan module 5. The circumference of the fan module 5 specifically refers to the direction around the fan module 5 along the outer contour of the fan module 5 in a plane perpendicular to the height direction Z of the electronic device. In the height direction Z of the electronic device, the portion of the first air guide plate 8 located between the fan module 5 and the heat sink 4 forms an air intake channel 83.

[0118] Figure 14 is a cross-sectional view along the BB direction of the electronic device provided in this application in some other embodiments. As shown in Figure 14, the air inlet channel 83 is connected to the heat dissipation channel 43 of the heat sink 4. Referring also to Figures 13 and 14, the second end 82 forms the outlet 831 of the air inlet channel 83, and the outlet 831 is directly opposite the heat dissipation channel 84 in the height direction Z of the electronic device.

[0119] In this embodiment, the low-temperature air blown by the fan module 5 towards the heat sink 4 first enters the air inlet channel 83, and then enters the heat dissipation channel 43 through the outlet 831 of the air inlet channel 83. The first air guide plate 8, which forms the air inlet channel 83, guides the low-temperature air blown by the fan module 5 towards the heat sink 4, reducing the airflow resistance between the fan module 5 and the heat sink 4, thereby increasing the flow rate of the low-temperature air entering the heat dissipation channel 43, improving the heat dissipation efficiency of the heat sink 4, the heat-generating element 3, and the electronic equipment, and enhancing the heat dissipation capacity of the electronic equipment. At the same time, the first air guide plate 8 forms the air inlet channel 83 for the low-temperature air between the fan module 5 and the heat sink 4, reducing the impact of the returning high-temperature air on the temperature of the low-temperature air between the fan module 5 and the heat sink 4, thereby reducing the temperature of the air entering the heat dissipation channel 43, improving the heat dissipation efficiency of the heat sink 4, the heat-generating element 3, and the electronic equipment, and enhancing the heat dissipation capacity of the electronic equipment.

[0120] The fan module 5 includes a fan, a bracket for fixing the fan, and other structures. The first air guide plate 8 is integrally formed with the bracket, or the first air guide plate 8 is fixed to the bracket by welding, bonding, riveting, or other means. In this embodiment, the connection method between the first air guide plate 8 and the fan module 5 is not specifically limited.

[0121] In the height direction Z of the electronic device, there can be a gap between the first air guide plate 8 and the heat sink 4, or they can be sealed together.

[0122] For example, as shown in Figure 14, the first air guide plate 8 and the heat sink 4 are separated by a gap in the height direction Z of the electronic device to reduce the processing accuracy and installation accuracy of the first air guide plate 8 and the heat sink 4, thereby reducing the processing and installation difficulty of the first air guide plate 8 and the heat sink 4, and thus reducing the processing cost of the electronic device and shortening the installation cycle of the electronic device.

[0123] Figure 15 is a cross-sectional view of the electronic device provided in this application in the BB direction in some other embodiments. For example, as shown in Figure 15, the first air guide plate 8 and the heat sink 4 are sealed together in the height direction Z of the electronic device, thereby further reducing the risk of low-temperature air leakage between the fan module 5 and the heat sink 4 and further increasing the volume of low-temperature air entering the heat dissipation channel 43, so as to improve the heat dissipation efficiency of the heat sink 4, the heat-generating element 3 and the electronic device, and enhance the heat dissipation capacity of the electronic device.

[0124] Figure 16 is a structural schematic diagram of the fan module in some other embodiments. As shown in Figure 16, a shielding part 84 is connected to the second end 82.

[0125] Figure 17 is a cross-sectional view of the electronic device provided in this application in some embodiments in the BB direction. Referring to Figures 16 and 17, the second end 82 is connected to a shielding part 84 in the part of the electronic device facing the heating space 111 in the height direction Z. The shielding part 84 is used to block the part of the outlet 831 facing the heating space 111 in the height direction Z of the electronic device, that is, the shielding part 84 is used as the first sealing member mentioned above.

[0126] In this embodiment, the shielding part 84 is an independent part and is fixed on the first air guide plate 8, or the shielding part 84 and the second end 82 are integrally formed. During the installation process, after the first air guide plate 8 is installed and fixed as a whole, the shielding part 84 on the second end 82 can directly block the heat-generating space 111 in the height direction Z of the electronic device, which helps to shorten the installation cycle of the electronic device.

[0127] Along the length X direction of the electronic device, there may be a gap between the first air guide plate 8 and the substrate 2, or they may abut against each other.

[0128] For example, as shown in FIG17, the first air guide plate 8 and the substrate 2 have a fourth assembly gap 116 in the length direction X of the electronic device to reduce the processing accuracy and installation accuracy of the first air guide plate 8 and the substrate 2, thereby reducing the processing and installation difficulty of the substrate 2 and the first air guide plate 8, and thus reducing the processing cost of the electronic device and shortening the installation cycle of the electronic device.

[0129] Figure 18 is a schematic diagram of high-temperature airflow in some embodiments of the electronic device. When the first air guide plate 8 and the substrate 2 have a fourth assembly gap 116 in the length direction X of the electronic device, the high-temperature gas in the heat dissipation channel 43 leaves the heat sink 4 along the height direction Z of the electronic device. Under the action of the negative pressure generated by the fan module 5, the high-temperature gas will flow towards the fan module 5 and enter the fourth assembly gap 116.

[0130] Figure 19 is a schematic diagram of high-temperature airflow in the BB direction in some embodiments of the electronic device. Referring to Figures 18 and 19, after the high-temperature gas flows back to the fourth assembly gap 116, the high-temperature air flows along the fourth assembly gap 116 to the space between the fan module 5 and the air inlet 12. The high-temperature air and low-temperature air between the fan module 5 and the air inlet 12 mix and exchange heat, causing the temperature of the air blown by the fan module 5 towards the heat sink 4 to rise. This reduces the temperature difference between the air in the heat dissipation channel 43 and the fins 42, thus reducing the heat dissipation efficiency of the fan module 5 for the heat sink 4 and the heat-generating element 3. At the same time, the volume of air drawn in by the fan module 5 is related to the power, speed, and other parameters of the fan module 5. That is, the volume of air drawn in by the fan module 5 is a preset fixed value. When the high-temperature air flows along the fourth assembly gap 116 to the space between the fan module 5 and the air inlet 12, the volume of low-temperature air drawn in by the fan module 5 through the air inlet 12 decreases, thereby reducing the heat dissipation efficiency of the fan module 5 for the heat sink 4 and the heat-generating element 3.

[0131] Therefore, Figure 20 is a cross-sectional view of the electronic device in the BB direction in some other embodiments. As shown in Figure 20, the fan module 5 is mounted on the substrate 2, and the fan module 5 and the substrate 2 are sealed together in the longitudinal direction X of the electronic device. In some embodiments, a portion of the structure of the fan module 5 is embedded in the substrate 2 to achieve a sealed connection, or the fan module 5 and the substrate 2 abut against each other in the longitudinal direction X of the electronic device to achieve a sealed connection. In other embodiments, the fan module 5 and the substrate 2 are sealed together by welding, bonding, or other methods. In still other embodiments, the fan module 5 and the substrate 2 are sealed together by filling the space between them with sealing materials such as foam, rubber, or gel. The embodiments of this application do not impose any special limitations on the sealing connection method between the fan module 5 and the substrate 2.

[0132] In this embodiment, the fan module 5 and the substrate 2 are sealed together in the length direction X of the electronic device, which reduces the risk of high-temperature air flowing between the fan module 5 and the air inlet 12. This helps to increase the volume of low-temperature air drawn in by the fan module 5 and also helps to increase the temperature of the air blown by the fan module 5 to the heat sink 4, thereby improving the heat dissipation efficiency of the fan module 5 on the heat sink 4 and the heat-generating element 3, and thus enhancing the heat dissipation capacity of the electronic device.

[0133] When the fan module 5 abuts against the base plate 2 in the length direction X of the electronic device, the structure of the base plate 2 and the first air guide plate 8 is shown in Figure 21. The first air guide plate 8 is configured as a closed structure extending along the circumferential direction of the fan module 5, that is, along the plane where the length direction X and the width direction Y of the electronic device are located, the contour shape of the cross-section of the first air guide plate 8 is a closed图形. Figure 21 illustrates that the contour shape of the cross-section of the first air guide plate 8 is a "mouth"-shape.

[0134] When the fan module 5 abuts against the base plate 2 in the length direction X of the electronic device, the structure of the base plate 2 and the first air guide plate 8 can also be as shown in Figure 22. The first air guide plate 8 is configured as an non-closed structure extending along the circumferential direction of the fan module 5, that is, along the plane where the length direction X and the width direction Y of the electronic device are located, the contour shape of the cross-section of the first air guide plate 8 is an unclosed图形. Figure 22 illustrates that the contour shape of the cross-section of the first air guide plate 8 is a "U" shape. The first air guide plate 8 is buckled on the base plate 2, and the first air guide plate 8 and the base plate 2 enclose an air inlet channel 83.

[0135] When the fan module 5 abuts against the base plate 2 in the length direction X of the electronic device and the second end 82 of the first air guide plate 8 is connected with a shielding portion 84, the structure of the base plate 2 and the first air guide plate 8 is shown in Figure 23, and the shielding portion 84 covers the side of the air inlet channel 83 away from the fan module 5. At this time, the shielding portion 84 may be integrally formed with the base plate 2, or the shielding portion 84 may be integrally formed with the first air guide plate 8, or the shielding portion 84 may be fixed to the base plate 2 or the first air guide plate 8 as an independent component by means of bonding, welding, riveting or the like. The embodiment of the present application does not impose special limitations on the specific structural form of the shielding portion 84.

[0136] Figure 24 is a schematic diagram of air flow in an electronic device according to still some embodiments. As shown in Figure 24, after the high-temperature gas in the heat dissipation channel 43 leaves the heat sink 4 along the height direction Z of the electronic device, the high-temperature gas will flow back to the fan module 5 under the action of the negative pressure generated by the fan module 5.

[0137] Figure 25 is a schematic diagram of air flow in the B-B direction of an electronic device according to still some embodiments. As shown in Figure 25, in a plane perpendicular to the height direction Z of the electronic device, a first assembly gap 112 is left between the fan module 5 and the housing 1, and the first assembly gap 112 is located on at least one side of the fan module 5 along the circumferential direction of the fan module 5. As shown in Figure 24, the high-temperature air flowing back to the fan module 5 will enter the first assembly gap 112, and the high-temperature air in the first assembly gap 112 will flow to between the fan module 5 and the air inlet 12, so that the volume of low-temperature air sucked by the fan module 5 through the air inlet 12 is reduced, and the temperature of the air blown by the fan module 5 to the heat sink 4 is also increased.

[0138] In view of this, FIG26 is a structural cross-sectional view of the electronic device in the BB direction in some other embodiments, FIG27 is an enlarged view of part E in FIG26, and referring to FIG26 and FIG27, the electronic device further includes a third seal 9, at least a portion of the structure of the third seal 9 being located within the first assembly gap 112 to seal the fan module 5 to the housing 1.

[0139] In this embodiment, the fan module 5 and the housing 1 are sealed together by a third sealing member 9, which reduces the risk of high-temperature air flowing through the first assembly gap 112 between the fan module 5 and the housing 1 to the space between the fan module 5 and the air inlet 12. This helps to increase the volume of low-temperature air drawn in by the fan module 5 and also helps to reduce the temperature of the air blown by the fan module 5 to the heat sink 4, thereby improving the heat dissipation efficiency of the fan module 5 on the heat sink 4 and the heat-generating element 3, and thus enhancing the heat dissipation capacity of the electronic device.

[0140] In some embodiments, the third seal 9 and the bracket of the fan module 5 are integrally formed, or the third seal 9 and the housing 1 are integrally formed, so as to simplify the connection structure between the third seal 9 and the fan module 5 and the third seal 9 and the housing 1, thereby reducing the connection cost between the third seal 9 and the fan module 5 and the third seal 9 and the housing 1.

[0141] In other embodiments, the third seal 9 is connected as an independent part to both the fan module 5 and the housing 1, facilitating its processing and reducing its cost. The methods for fixing the third seal 9 to the fan module 5 include, but are not limited to, bonding, welding, riveting, and snap-fitting. Similarly, the methods for fixing the third seal 9 to the housing 1 include, but are not limited to, bonding, welding, riveting, and snap-fitting. These methods can be the same or different. Alternatively, after the substrate 2 is fixedly connected to the housing 1 and the fan module 5 is fixedly connected to the substrate 2, the third seal 9 is directly clamped and fixed by the fan module 5 and the housing 1. This application does not impose any special limitations on the method of fixing the third seal 9.

[0142] The third sealing element 9 can be made of foam, rubber, gel, or other materials. This application does not impose any special limitations on the material of the third sealing element 9. For example, the third sealing element 9 is made of adhesive, allowing it to be directly bonded to the fan module 5 and the housing 1, thereby reducing the installation difficulty of the third sealing element 9 and shortening the assembly cycle of the electronic device.

[0143] To reduce the risk of hot air flowing back between the fan module 5 and the air inlet 12, the substrate 2 and the housing 1 are sealed together in the width direction Y of the electronic device, thereby further improving the heat dissipation efficiency of the fan module 5 for the heat sink 4 and the heat-generating element 3.

[0144] Figure 28 is a schematic diagram of air flow at the heat sink 4 in some embodiments. As shown in Figure 28, after the low-temperature air enters the heat dissipation channel 43, part of the low-temperature air will flow along the height direction Z of the electronic device and exchange heat with the fins 42, while another part of the low-temperature air will dissipate along the width direction Y of the electronic device to both sides of the heat sink 4 and leave the heat sink 4. This reduces the volume of low-temperature air used for heat exchange with the fins 42, thereby reducing the utilization rate of the low-temperature air blown into the heat dissipation channel 43 by the fan module 5.

[0145] Therefore, Figure 29 is a cross-sectional view of the electronic device of this application in the BB direction in some other embodiments, and Figure 30 is a schematic diagram of the heat sink 4 in Figure 29 in some embodiments. Referring also to Figures 29 and 30, the electronic device further includes a partition 10, and the end of the fin 42 away from the body 41 in the longitudinal direction X of the electronic device is sealed to the partition 10. The partition 10 is used to block the heat dissipation channel 43 in the longitudinal direction X of the electronic device.

[0146] In this embodiment, the heat dissipation channel 43 is blocked in the length direction X of the electronic device by the partition 10, which reduces the risk of low temperature air in the heat dissipation channel 43 escaping to the outside of the heat dissipation channel 43, thereby increasing the volume of low temperature air in the heat dissipation channel 43 for heat exchange with the fins 42, and improving the heat dissipation efficiency of the fan module 5 for the heat sink 4 and the heat-generating element 3.

[0147] Figure 31 is a schematic diagram of the structure of the heat sink 4 in some other embodiments. As shown in Figure 31, the partition 10 includes a first plate 101 and a second plate 102. The first plate 101 and the main body 41 are respectively located on both sides of the fins 42 in the length direction X of the electronic device. The first plate 101 is sealed to the fins 42. The second plate 102 is disposed opposite to the first plate 101 on both sides along the width direction Y of the electronic device. One end of the second plate 102 is connected to the first plate 101, and the other end of the second plate 102 is sealed to the substrate 2. That is, the heat sink 4 and the heating element 3 are located in the space enclosed by the substrate 2 and the partition 10. As shown in Figure 31, the second plate 102 abuts against the main body 41 in the width direction Y of the electronic device. The second plate 102 is used to seal the heating space 111 in the width direction Y of the electronic device.

[0148] In this embodiment, the heating space 111 is sealed by the first sealing member 6 and the second sealing member 7 on both sides of the height direction Z of the electronic device, and the heating space 111 is sealed by the second plates 102 on both sides of the width direction Y of the electronic device. By setting the first sealing member 6, the second sealing member 7 and the second plates 102, the sealing effect of the heating space 111 can be improved, thereby reducing the risk of high temperature gas flowing back into the heating space 111 and causing the heat dissipation efficiency of the heating element 3 to decrease, and also reducing the risk of low temperature air escaping and entering the heating space 111, so as to improve the heat dissipation performance of the heat sink 4, the heating element and the electronic device.

[0149] In some embodiments, the partition 10 and the heat sink 4 are integrally formed. Specifically, the partition 10 and the fins 42 are integrally formed, or the partition 10 and the substrate 2 are integrally formed, so as to simplify the connection method between the partition 10 and the heat sink 4 and the partition 10 and the substrate 2, thereby reducing the connection cost between the partition 10 and the heat sink 4 and the partition 10 and the substrate 2.

[0150] In other embodiments, the partition 10 is connected as a separate component to both the heat sink 4 and the substrate 2, thereby facilitating the processing of the partition 10 and reducing its processing cost. The methods for fixing the partition 10 to the heat sink 4 include, but are not limited to, bonding, welding, riveting, and snap-fitting. The methods for fixing the partition 10 to the substrate 2 also include, but are not limited to, bonding, welding, riveting, and snap-fitting. The methods for fixing the partition 10 to the heat sink 4 and to the substrate 2 can be the same or different. This application does not impose any special limitations on the method of fixing the partition 10.

[0151] Figure 32 is a cross-sectional view of the electronic device in the BB direction in some other embodiments. As shown in Figure 32, the electronic device also includes a second air guide plate 20. The second air guide plate 20 is located on the side of the heat sink 4 away from the fan module 3 in the height direction Z of the electronic device. One end of the second air guide plate 20 is connected to the heat sink 4, and the other end of the second air guide plate 20 extends toward the air outlet 13 of the electronic device.

[0152] Figure 33 is a schematic diagram of the connection structure between the substrate 2 and the heat sink 4 in some other embodiments. Referring to Figures 32 and 33, the second air guide plate 20 forms an air outlet channel 113, which connects the heat dissipation channel 43 of the heat sink 4 and the air outlet 13 of the electronic device.

[0153] In this embodiment, after the high-temperature air in the heat dissipation channel 43 flows along the height direction Z of the electronic device and leaves the heat sink 4, the high-temperature air can enter the air outlet channel 113 formed by the second air guide plate 20. The second air guide plate 20 can guide the flow of high-temperature air, so that the high-temperature air can quickly flow to the air outlet 13 and be discharged from the electronic device, reducing the risk of high-temperature air accumulating inside the electronic device, improving the heat dissipation efficiency of the electronic device, and enhancing the heat dissipation capacity of the electronic device.

[0154] In some embodiments, the second air guide plate 20 and the partition plate 10 are integrally formed to simplify the connection structure between the second air guide plate 20 and the partition plate 10, thereby reducing the connection cost between the second air guide plate 20 and the partition plate 10.

[0155] In other embodiments, the second air guide plate 20 is fixed to the partition plate 10 as a separate part to facilitate the processing of the second air guide plate 20 and reduce the processing cost of the second air guide plate 20. The fixing methods of the second air guide plate 20 and the partition plate 10 include, but are not limited to, bonding, welding, riveting, snap-fitting, etc. The embodiments of this application do not impose special limitations on the fixing method of the partition plate 10.

[0156] Figure 34 is a schematic diagram of the connection structure of the substrate and the heat sink in some other embodiments. As shown in Figure 34, when the electronic device has a first air guide plate 8, a partition plate 10, and a second air guide plate 20, at least two of the first air guide plate 8, the partition plate 10, and the second air guide plate 20 are integrally formed. For example, the first air guide plate 8, the partition plate 10, and the second air guide plate 20 are all integrally formed. During installation, the heating element 3, the heat sink 4, the first sealing member 6, and the second sealing member 7 are first installed on the substrate 2, and then the overall structure of the first air guide plate 8, the partition plate 10, and the second air guide plate 20 is fastened onto the substrate 2 to seal the heating space 111. The integrally formed structure of the first air guide plate 8, the partition plate 10, and the second air guide plate 20 facilitates the processing and installation of the first air guide plate 8, the partition plate 10, and the second air guide plate 20, which helps to reduce the processing cost and assembly cycle of the electronic device.

[0157] Alternatively, when the electronic device has a first air guide plate 8, a partition plate 10, and a second air guide plate 20, the first air guide plate 8, the partition plate 10, and the second air guide plate 20 are all independent parts. The first air guide plate 8, the partition plate 10, and the second air guide plate 20 are then fixedly connected by means of bonding, welding, riveting, snap-fitting, etc., so as to facilitate the processing of the first air guide plate 8, the partition plate 10, and the second air guide plate 20, reduce the processing difficulty and processing cost of the first air guide plate 8, the partition plate 10, and the second air guide plate 20. The embodiments of this application do not impose special limitations on the connection method of the first air guide plate 8, the partition plate 10, and the second air guide plate 20.

[0158] Figure 35 is a cross-sectional view of the electronic device in the BB direction in some other embodiments. As shown in Figure 35, in the plane perpendicular to the height direction Z of the electronic device, a second assembly gap 114 is left between the second air guide plate 20 and the outer casing 1.

[0159] In this embodiment, a second assembly gap 114 is left between the second air guide plate 20 and the outer shell 1 in the plane perpendicular to the height direction Z of the electronic device. This reduces the processing accuracy and installation accuracy of the second air guide plate 20 and the outer shell 1, thereby reducing the processing and installation difficulty of the outer shell 1 and the second air guide plate 20, and thus reducing the processing cost of the electronic device and shortening the installation cycle of the electronic device.

[0160] As shown in Figure 35, a second assembly gap 114 is left between the second air guide plate 20 and the outer casing 1. The high-temperature air in the air outlet channel 113 will flow back into the electronic device through the second assembly gap 114 under the negative pressure of the fan module, resulting in a reduction in the heat dissipation efficiency of the electronic device.

[0161] In view of this, Figure 36 is a structural cross-sectional view of the electronic device in the BB direction in some other embodiments. As shown in Figure 36, the electronic device also includes a fourth seal 30. At least a portion of the structure of the fourth seal 30 is located within the second assembly gap 114. The fourth seal 30 can block the second assembly gap 114 in the height direction Z of the electronic device, reducing the risk that high-temperature air in the air passage 113 will flow back into the electronic device through the second assembly gap 114, thereby improving the heat dissipation efficiency of the electronic device and enhancing its heat dissipation capacity.

[0162] In some embodiments, the fourth seal 30 and the second air guide plate 20 are integrally formed, or the third seal 9 and the outer shell 1 are integrally formed, so as to simplify the connection structure between the third seal 9 and the second air guide plate 20 and the third seal 9 and the outer shell 1, thereby reducing the connection cost between the third seal 9 and the second air guide plate 20 and the third seal 9 and the outer shell 1.

[0163] In other embodiments, the fourth seal 30 is connected as an independent part to both the second air guide plate 20 and the outer shell 1, to facilitate the processing of the fourth seal 30 and reduce its processing cost. The methods for fixing the fourth seal 30 to the second air guide plate 20 include, but are not limited to, bonding, welding, riveting, and snap-fitting. The methods for fixing the fourth seal 30 to the outer shell 1 also include, but are not limited to, bonding, welding, riveting, and snap-fitting. The methods for fixing the fourth seal 30 to the second air guide plate 20 and to the outer shell 1 can be the same or different. Alternatively, after the second air guide plate 20 is fixedly connected to the outer shell 1, the fourth seal 30 is directly clamped and fixed by the second air guide plate 20 and the outer shell 1. This application does not impose any special limitations on the method of fixing the fourth seal 30.

[0164] The fourth sealing element 30 can be made of foam, rubber, gel, or other materials. This application embodiment does not impose any special limitations on the material of the fourth sealing element 30. For example, the fourth sealing element 30 is made of adhesive, allowing it to be directly bonded to the second air guide plate 20 and the outer casing 1, thereby reducing the installation difficulty of the fourth sealing element 30 and shortening the assembly cycle of the electronic device.

[0165] For example, the electronic device provided in this application embodiment achieves the sealing between the fan module 5 and the heat sink 4 and the sealing of the heat-generating space 111, reducing the leakage of low-temperature air, allowing all the low-temperature air to enter the heat dissipation channel 43 of the heat sink 4, while reducing the risk of high-temperature air recirculation, increasing the system airflow of the electronic device by 30%, and enhancing the heat dissipation capacity of the electronic device.

[0166] For the same or similar parts among the various embodiments in this specification, please refer to each other.

Claims

1. An electronic device, characterized in that, The electronic device includes: substrate; A heating element, wherein the heating element is mounted on the substrate; A heat sink, wherein at least a portion of the structure of the heat sink and the substrate have a heat-generating space in a first direction for accommodating a heat-generating element, the heat sink being used to dissipate heat from the heat-generating element; A fan module is arranged along a second direction with the heat sink, and the fan module is used to cool the heat sink. The second direction is not parallel to the first direction. A sealing element is provided, wherein the sealing element contacts the substrate and the heat sink on both sides in the first direction, and the sealing element is used to seal the heat-generating space in the second direction.

2. The electronic device according to claim 1, characterized in that, The seal includes a first seal, at least a portion of the structure of which is located in the second direction between the heat-generating space and the fan module; And / or, the electronic device includes a second seal, and the heat-generating space is located between the second seal and the fan module in the second direction.

3. The electronic device according to claim 1, characterized in that, The seal is integrally formed with the substrate, or the seal is integrally formed with the heat sink, or the seal is a separate part and is connected to the substrate and the heat sink respectively.

4. The electronic device according to claim 1, characterized in that, The electronic device further includes a first air guide plate, a first end of which is sealed to the fan module, and a second end of which extends toward the direction close to the heat sink. The first air guide plate is arranged around the outside of the fan module along the circumference of the fan module, and in the second direction, the portion of the first air guide plate located between the fan module and the heat sink forms an air intake channel, which is connected to the heat dissipation channel of the heat sink. The second end forms the outlet of the air inlet channel, and the outlet is directly opposite the heat dissipation channel in the second direction.

5. The electronic device according to claim 4, characterized in that, The second end is connected to a shielding part on the part of the outlet that is directly opposite the heating space in the second direction. The shielding part is used to block the part of the outlet that is directly opposite the heating space in the second direction and serves as the sealing element.

6. The electronic device according to claim 4, characterized in that, The fan module is mounted on the substrate, and the fan module and the substrate are sealed together in the first direction; The electronic device further includes a housing having an inner cavity, in which the substrate, the heating element, the heat sink, and the fan module are all located. The substrate is connected to the housing, and a first assembly gap is provided between the fan module and the housing. The first assembly gap is located on at least one side of the fan module along its circumference. The electronic device further includes a third seal, at least a portion of which is located within the first assembly gap to seal the fan module to the housing.

7. The electronic device according to claim 6, characterized in that, The third seal is integrally formed with the housing, or the third seal is integrally formed with the fan module, or the third seal is a separate part and is connected to the housing and the fan module respectively.

8. The electronic device according to claim 4, characterized in that, The heat sink includes a body and fins. The fins are located on the side of the body facing away from the substrate in the first direction. The fins extend along the second direction. A plurality of the fins are spaced apart along a third direction to form the heat dissipation channel. The third direction is perpendicular to the first direction and the second direction. The electronic device further includes a partition, wherein the end of the fin away from the body in the first direction is sealed to the partition, and the partition is used to block the heat dissipation channel in the first direction.

9. The electronic device according to claim 8, characterized in that, The partition includes a first plate and a second plate. The first plate and the main body are located on both sides of the fin in the first direction. The first plate is sealed to the fin. The second plate is disposed opposite to the first plate in the third direction. One end of the second plate is connected to the first plate, and the other end of the second plate is sealed to the substrate. The second plate abuts against the main body in the third direction, and the second plate is used to seal the heating space in the third direction.

10. The electronic device according to claim 8, characterized in that, The partition and the fins are integrally formed.

11. The electronic device according to claim 8, characterized in that, The electronic device also includes a second air guide plate, one end of which is connected to the heat sink, and the other end of which extends toward the air outlet of the electronic device. The second air guide plate forms an air outlet channel, which connects the heat dissipation channel of the radiator and the air outlet of the electronic device.

12. The electronic device according to claim 11, characterized in that, The electronic device also includes a housing with an inner cavity, wherein the substrate, the heating element, the heat sink and the fan module are all located within the inner cavity, and a second assembly gap is left between them and the housing; The electronic device further includes a fourth seal, at least a portion of which is located within the second assembly gap to seal the second assembly gap.

13. The electronic device according to claim 12, characterized in that, The fourth sealing element is integrally formed with the outer shell, or the fourth sealing element is integrally formed with the second air guide plate, or the fourth sealing element is an independent part that is connected to the outer shell and the second air guide plate respectively.

14. The electronic device according to any one of claims 11 to 13, characterized in that, At least two of the first air guide plate, the partition plate and the second air guide plate are integrally formed structures.

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