Cover plate, display module, and electronic device

Abstract

Provided in the present disclosure are a cover plate, a display module, and an electronic device. The cover plate comprises a substrate and an adhesive layer bonded to the substrate. The cover plate has a rounded corner, and comprises a main body region and a corner region having the rounded corner. The adhesive layer comprises a first edge, and an orthographic projection of a target section of the first edge on the substrate falls within the corner region. The cover plate satisfies at least two of the following conditions: (a) the adhesive layer comprises a first thickened portion located within the corner region and a first main body portion located within the main body region, and the thickness of the first thickened portion is greater than that of the first main body portion; (b) the target section comprises an uneven structure; (c) the substrate comprises a second thickened portion located within the corner region and a second main body portion located within the main body region, and the thickness of the second thickened portion is greater than that of the second main body portion; and (d) the substrate comprises a surface facing the adhesive layer, and the region of the surface located within the corner region comprises at least one groove.

Description

Cover plate, display module, electronic device Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a cover plate, a display module including the cover plate, and an electronic device. Background Technology

[0002] With the increasing use of digital products, various display devices such as mobile phones and laptops have become necessities in people's lives. Display devices typically consist of a cover glass and a display panel. In recent years, curved displays have been introduced to further improve the ratio of the display area to the total screen area and to enhance the user's sensory experience. Curved displays have a certain curvature at the edges, which can better improve the user experience. However, correspondingly, curved displays also place higher demands on the design of the cover glass. Summary of the Invention

[0003] According to one aspect of this disclosure, a cover plate is provided, comprising: a substrate, and an adhesive layer bonded to the substrate. The cover plate has rounded corners, includes a main body region and a corner region encompassing the rounded corners, and the adhesive layer includes a first edge, the orthographic projection of a target segment of the first edge onto the substrate falling within the corner region, and the cover plate satisfies at least two of the following conditions: the adhesive layer includes a first thickened portion located within the corner region and a first main body portion located within the main body region, the thickness of the first thickened portion being greater than the thickness of the first main body portion; the target segment includes an uneven structure; the substrate includes a second thickened portion located within the corner region and a second main body portion located within the main body region, the thickness of the second thickened portion being greater than the thickness of the second main body portion; the substrate includes a surface facing the adhesive layer, and the region of the surface located within the corner region includes at least one groove.

[0004] In some embodiments, the orthographic projection of the first thickened portion on the substrate at least partially overlaps with the orthographic projection of the at least one groove on the substrate.

[0005] In some embodiments, the thickness of the target segment is the same as the thickness of the first thickened portion.

[0006] In some embodiments, the first thickened portion is a continuous structure.

[0007] In some embodiments, the first thickened portion includes at least two first sub-thickened portions that are separated from each other, and the at least two first sub-thickened portions are distributed at equal intervals within the corner area.

[0008] In some embodiments, the thickness of the first thickened portion may be the same or different at various locations.

[0009] In some embodiments, the orthographic projection of the first thickened portion on the substrate overlaps with the arcuate corner region of the adhesive layer, or the orthographic projection of the first thickened portion on the substrate falls within the arcuate corner region of the adhesive layer.

[0010] In some embodiments, the substrate includes a second edge, and each groove includes a first end and a second end opposite to each other, the first end being closer to the second edge than the second end, and the first end communicating with the second edge.

[0011] In some embodiments, the substrate includes a second edge, and each groove includes an opposing first end and a second end, the first end and the second end being spaced apart from the second edge.

[0012] In some embodiments, the number of grooves is multiple, and the multiple grooves are arranged in a crisscross pattern on the surface of the substrate.

[0013] In some embodiments, the number of grooves is multiple, and the multiple grooves extend in parallel directions on the surface of the substrate.

[0014] In some embodiments, the uneven structure includes a sawtooth structure or a wavy structure.

[0015] In some embodiments, at least the central region of the target segment includes the uneven structure.

[0016] In some embodiments, the second thickened portion is a continuous structure.

[0017] In some embodiments, the second thickened portion includes at least two second sub-thickened portions that are separated from each other, and the at least two second sub-thickened portions are distributed at equal intervals within the corner area.

[0018] In some embodiments, the second thickened portion may have the same or different thicknesses at various locations.

[0019] In some embodiments, the orthographic projection of the second thickened portion on the substrate overlaps with the corner area, or the orthographic projection of the second thickened portion on the substrate falls within the corner area.

[0020] In some embodiments, the arc angle is a rounded arc angle.

[0021] According to another aspect of this disclosure, a display module is provided, comprising: a cover plate as described in any of the preceding embodiments; and a display panel located on the side of the adhesive layer away from the substrate and bonded to the cover plate by the adhesive layer.

[0022] According to another aspect of this disclosure, an electronic device is provided, including a display module described in any of the preceding embodiments. Attached Figure Description

[0023] The exemplary embodiments of this disclosure will be described in detail below with reference to the accompanying drawings; in the drawings:

[0024] Figure 1 shows a schematic diagram of a display screen;

[0025] Figure 2 shows a magnified view of a portion of region E in Figure 1;

[0026] Figure 3 shows a plan view of the cover plate according to an embodiment of the present disclosure;

[0027] Figure 4 is a partial enlarged view of region B in Figure 3 when the adhesive layer according to an embodiment of the present disclosure includes a first thickened portion in the corner area;

[0028] Figure 5 shows a variation of the first thickened portion shown in Figure 4;

[0029] Figure 6 is a partial enlarged view of region B in Figure 3 when the edge of the adhesive layer according to an embodiment of the present disclosure includes an uneven structure in the corner area;

[0030] Figure 7 shows a variation of the uneven structure shown in Figure 6;

[0031] Figure 8 is a partial enlarged view of region B in Figure 3 when the substrate according to an embodiment of the present disclosure includes a second thickened portion in the corner area;

[0032] Figure 9 shows a variation of the second thickened portion shown in Figure 8;

[0033] Figure 10 is a partial enlarged view of region B in Figure 3 when the substrate according to an embodiment of the present disclosure includes a groove in the corner area;

[0034] Figure 11 shows one arrangement of grooves on the substrate surface of the cover plate according to an embodiment of the present disclosure;

[0035] Figure 12 shows another arrangement of the grooves on the substrate surface of the cover plate according to an embodiment of the present disclosure;

[0036] Figure 13 shows yet another arrangement of the grooves on the substrate surface of the cover plate according to an embodiment of the present disclosure;

[0037] Figure 14 shows a schematic diagram of the structure of the cover plate according to an embodiment of the present disclosure;

[0038] Figure 15 shows a schematic diagram of the structure of the cover plate according to an embodiment of the present disclosure;

[0039] Figure 16 shows a schematic diagram of the structure of the cover plate according to an embodiment of the present disclosure;

[0040] Figure 17 shows a schematic diagram of the structure of the cover plate according to an embodiment of the present disclosure;

[0041] Figure 18 shows a schematic diagram of the structure of the cover plate according to an embodiment of the present disclosure;

[0042] Figure 19 shows a schematic diagram of the structure of the cover plate according to an embodiment of the present disclosure;

[0043] Figure 20 shows a schematic structural diagram of the cover plate according to an embodiment of the present disclosure;

[0044] Figure 21 shows a schematic diagram of the structure of the cover plate according to an embodiment of the present disclosure;

[0045] Figure 22 shows a schematic diagram of the cover plate according to an embodiment of the present disclosure;

[0046] Figure 23 shows a schematic diagram of the cover plate according to an embodiment of the present disclosure;

[0047] Figure 24 shows a schematic diagram of the structure of the cover plate according to an embodiment of the present disclosure;

[0048] Figure 25 shows a schematic diagram of the structure of a display module according to an embodiment of the present disclosure; and

[0049] Figure 26 shows a structural block diagram of an electronic device according to an embodiment of the present disclosure.

[0050] It should be understood that the accompanying drawings are merely schematic illustrations of exemplary embodiments of the present disclosure and are not intended to limit the present disclosure, nor need they be drawn to scale. Furthermore, in the drawings, the same or similar components are indicated by the same or similar reference numerals. Detailed Implementation

[0051] The technical solutions of the embodiments of this disclosure will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0052] Before formally describing the technical solutions of the embodiments of this disclosure, the terms used in the embodiments of this disclosure are explained and defined as follows to help those skilled in the art to more clearly understand the technical solutions of the embodiments of this disclosure.

[0053] As used herein, the term "arc angle" refers to a non-right-angle curved structure composed of continuous or discontinuous curves, including but not limited to rounded corners (also known as R-angles), elliptical arc angles, and continuous smooth curve angles. For example, when describing the corners of a cover plate as arc angles, it means that the corners of the cover plate (e.g., the four corners of the cover plate) are non-right-angle curved structures whose contours are composed of continuous or discontinuous curves.

[0054] To improve user experience, curved displays are gaining increasing popularity. Figure 1 shows a plan view of a conventional curved display 10, and Figure 2 is a partial enlarged view of region E in Figure 1. As shown in Figures 1 and 2, the curved display 10 includes a cover plate 12 and a display panel 13. The cover plate 12 includes a substrate and an optical adhesive layer, which is located between the substrate of the cover plate 12 and the display panel 13 to bond the cover plate 12 and the display panel 13 together. In the bonding process, high-pressure degassing technology is usually used to improve the bonding strength between the cover plate 12 and the display panel 13, in order to minimize the formation of air bubbles between the cover plate 12 and the display panel 13. However, when the high-pressure process ends and the pressure is released, due to the decrease in pressure, the air bubbles usually have a certain rebound rate, which leads to the reappearance of air bubbles between the cover plate 12 and the display panel 13. These reappeared air bubbles are usually called rebound air bubbles. Especially in the rounded corner area of ​​the curved display 10, rebound air bubbles 11 are more likely to appear, as shown in Figures 1 and 2.

[0055] Although rebound bubbles can be reduced to some extent by improving the adhesion of the ink layer on the cover plate, optimizing process parameters such as bonding pressure and temperature, and optimizing process parameters such as curing energy and curing time involved in bonding, some rebound bubbles can still easily be generated in the rounded corner area of ​​the curved display screen 10, which will affect the display effect of the curved display screen 10.

[0056] The inventors of this application further explored the reasons why rebound bubbles 11 are easily generated in the rounded corner area of ​​the curved display screen 10. The inventors found that when the cover plate 12 and the display panel 13 are bonded together using an optical adhesive layer during the bonding process, the multiple stacked film layers of the curved display screen 10 are compressed and deformed in the rounded corner area. Moreover, the greater the curvature of the rounded corner, the greater the compressive force on the multiple stacked film layers, and the greater the deformation. This results in two situations: firstly, the adhesive force of the optical adhesive layer is insufficient to firmly bond the cover plate 12 and the display panel 13 together in the rounded corner area; secondly, it causes gas to easily accumulate at the interface between the cover plate 12 and the display panel 13 in the rounded corner area. Both of these factors make it easier for rebound bubbles 11 to appear in the rounded corner area of ​​the curved display screen 10.

[0057] In order to solve the technical problems existing in the prior art, the various embodiments of this disclosure optimize the structure of the cover plate in the corner area, thereby reducing or even avoiding the occurrence of rebound bubbles in the corner area of ​​the cover plate.

[0058] Figure 3 shows a plan view of a cover plate 100 according to an embodiment of the present disclosure. As shown in Figure 3, the cover plate 100 includes an adhesive layer 101 and a substrate 102, the adhesive layer 101 being bonded to the substrate 102. The corners of the cover plate 100 are arc-shaped angles A, and the cover plate 100 includes a main body region M and corner regions C, the corner regions C including the arc-shaped angles A. As shown in Figure 3, the cover plate 100 includes four arc-shaped angles, and correspondingly, the cover plate 100 also includes four corner regions C. Apart from the four corner regions C, the other regions of the cover plate 100 can be referred to as the main body region M. The adhesive layer 101 includes a first edge 101A, which refers to the edge surrounding the adhesive layer 101, and the orthographic projection of the target segment 1011 of the first edge 101A onto the substrate 102 falls within the corner region C.

[0059] Cover plate 100 satisfies at least two of the following conditions (a), (b), (c), and (d):

[0060] (a) The adhesive layer 101 includes a first thickened portion located in the corner area C and a first main body portion located in the main body area M, wherein the thickness of the first thickened portion is greater than the thickness of the first main body portion;

[0061] (b) The target section 1011 of the adhesive layer 101 includes an uneven structure;

[0062] (c) The substrate 102 includes a second thickened portion located in the corner region C and a second main body portion located in the main body region M, wherein the thickness of the second thickened portion is greater than the thickness of the second main body portion;

[0063] (d) The substrate 102 includes a surface facing the adhesive layer 101, and the area of ​​the surface located in the corner region C includes at least one groove.

[0064] The accompanying drawings can be used to illustrate the technical solutions corresponding to conditions (a), (b), (c), and (d) in more detail. Figure 3 shows region B in the upper left corner with a dashed line. Region B is shaped like a quarter circle and includes a corner area C and a portion of the main body area M. For clarity, only region B is shown in Figure 3. In fact, the cover plate 100 also includes regions B in the upper right, lower right, and lower left corners. The structures of the adhesive layer 101 and substrate 102 in regions B in the upper right, lower right, and lower left corners are the same as those in region B in the upper left corner. Therefore, the structures of the adhesive layer 101 and substrate 102 in regions B in the upper right, lower right, and lower left corners can be referenced to their structures in region B in the upper left corner. Below, the structures of the adhesive layer 101 and substrate 102 in region B of the cover plate 100 will be described using only region B in the upper left corner as an example.

[0065] When the cover plate 100 only satisfies condition (a), a partial enlarged view of region B in FIG. 3 is shown in FIG. 4. Referring to FIG. 3 and FIG. 4, under condition (a), the adhesive layer 101 includes a first thickened portion 1012 located in the corner region C and a first main body portion 1013 located in the main body region M. The thickness T1 of the first thickened portion 1012 is greater than the thickness T2 of the first main body portion 1013. In some embodiments, the thickness T1 of the first thickened portion 1012 of the adhesive layer 101 may be 0.18 mm, and the thickness T2 of the first main body portion 1013 of the adhesive layer 101 may be 0.15 mm. By thickening the portion of the adhesive layer 101 located in the corner region C to form the first thickened portion 1012, the cohesive force of the adhesive layer 101 at the corner region C can be enhanced, thereby enhancing the adhesion of the adhesive layer 101 at the corner region C. That is, the adhesion of the first thickened portion 1012 of the adhesive layer 101 is greater than the adhesion of the first main body portion 1013. In this way, when the adhesive layer 101 is bonded to the substrate 102, the adhesive layer 101 and the substrate 102 can be bonded more tightly together at the corner area C, thereby increasing the interlocking force between the adhesive layer 101 and the substrate 102 at the corner area C and reducing the possibility of the cover plate 100 generating rebound bubbles at the corner area C.

[0066] When the cover plate 100 only satisfies condition (b), a partial enlarged view of region B in FIG. 3 is shown in FIG. 6. Referring to FIG. 3 and FIG. 6, under condition (b), the adhesive layer 101 includes a first edge 101A, which refers to the edge surrounding the adhesive layer 101. The orthographic projection of the target segment 1011 of the first edge 101A onto the substrate 102 falls within the corner region C. This target segment 1011 includes an uneven structure 103. Since the corners of the cover plate 100 are rounded, the corners of the adhesive layer 101 are also rounded. The target segment 1011 can be understood as the outline of the rounded corner of the adhesive layer 101. By designing the target section 1011 of the adhesive layer 101 to include an uneven structure 103, the edge interlocking effect between the adhesive layer 101 and the substrate 102 can be enhanced, ensuring that the adhesive layer 101 and the substrate 102 can be tightly bonded together at the corner area C, reducing the possibility of the cover plate 100 generating rebound bubbles at the corner area C.

[0067] When the cover plate 100 only satisfies condition (c), a partial enlarged view of region B in FIG3 is shown in FIG8. It should be noted that, in order to clearly show the structure of the substrate 102, FIG8 does not show the structure of the adhesive layer 101, but only the structure of the substrate 102. Referring to FIG3 and FIG8, under condition (c), the substrate 102 includes a second thickened portion 1021 located in the corner region C and a second main body portion 1022 located in the main body region M. The thickness T3 of the second thickened portion 1021 is greater than the thickness T4 of the second main body portion 1022. By making the thickness T3 of the second thickened portion 1021 of the substrate 102 greater than the thickness T4 of the second main body portion 1022, the bonding stress between the substrate 102 and the adhesive layer 101 at the corner region C can be increased, reducing the possibility of the cover plate 100 generating rebound bubbles at the corner region C.

[0068] When the cover plate 100 only satisfies condition (d), a partial enlarged view of region B in FIG. 3 is shown in FIG. 10. Referring to FIG. 3 and FIG. 10, under condition (d), the substrate 102 includes a surface facing the adhesive layer 101, and the region of this surface located in the corner area C includes at least one groove 104. By providing the groove 104 on the surface of the substrate 102, bubbles generated during the pressure degassing process can be discharged to the outside of the cover plate 100 through the groove 104, thereby achieving the effect of dissipating rebound bubbles.

[0069] By ensuring that the cover plate 100 satisfies at least two of the conditions (a), (b), (c), and (d) above, the bonding force between the adhesive layer 101 and the substrate 102 at the corner area C can be significantly improved, thereby reducing or even eliminating the generation of rebound bubbles at the corner area C from the source. Furthermore, in some embodiments, not only can the bonding force between the adhesive layer 101 and the substrate 102 at the corner area C be significantly improved, but also the bubble dispersion channels are increased. This not only reduces or even eliminates the generation of rebound bubbles at the corner area C from the source, but also, even if rebound bubbles occur at the corner area C during the bonding process, the rebound bubbles can be discharged outside the corner area C through the grooves, thereby further reducing the risk of the cover plate 100 generating rebound bubbles at the corner area C.

[0070] As defined above, an arc angle refers to a non-right-angle curved structure composed of continuous or discontinuous curves. Arc angles include, but are not limited to, rounded arc angles, elliptical arc angles, and continuous smooth curve angles. In some embodiments, the arc angle of the cover plate 100 is a rounded arc angle, also known as an R angle.

[0071] The adhesive layer 101 can be made of various suitable materials. For example, the adhesive layer 101 can be optically clear adhesive (OCA).

[0072] In some embodiments, substrate 102 includes a substrate. The substrate can be a rigid material or a flexible material. For example, the rigid material can be glass, and the flexible material can be polyimide. In alternative embodiments, substrate 102 includes a substrate and a functional layer located between the substrate and adhesive layer 101. The substrate can be a rigid or flexible material, and the functional layer includes, for example, an ink layer, an anti-fingerprint coating, an anti-reflective coating, etc.

[0073] As shown in Figure 4, when the cover plate 100 meets condition (a), the adhesive layer 101 includes a first thickened portion 1012 in the corner area C. The target section 1011 of the adhesive layer 101 has a third thickness, which can be the same as the thickness T1 of the first thickened portion 1012. In other words, the target section 1011 of the adhesive layer 101 is part of the first thickened portion 1012. Since the cover plate 100 is prone to rebound bubbles in the corner area C, by making the third thickness of the target section 1011 of the adhesive layer 101 the same as the thickness T1 of the first thickened portion 1012, the cohesion and adhesion of the adhesive layer 101 at the edge can be enhanced, thereby increasing the bonding force between the adhesive layer 101 and the substrate 102 in the corner area C and reducing rebound bubbles.

[0074] The thickness of the first thickened portion 1012 can be the same or different at various locations. When the thickness of the first thickened portion 1012 is the same at various locations, the first thickened portion 1012 is uniformly thickened, which simplifies the preparation process of the adhesive layer 101. When the thickness of the first thickened portion 1012 is different at various locations, the thickness of the first thickened portion 1012 can be set in sections according to the magnitude of the extrusion pressure borne by the first thickened portion 1012 at different locations. For example, along the direction from the center of the arc corner to the contour of the arc corner, the closer to the contour of the arc corner, the greater the extrusion pressure borne by the first thickened portion 1012. The greater the extrusion pressure, the easier it is for the adhesive layer 101 to deform, and thus the easier it is to cause rebound bubbles. For example, the thickness of the first thickened portion 1012 can gradually increase along the direction from the center of the arc corner to the contour of the arc corner. The thicker the first thickened portion 1012, the greater the bonding force between the adhesive layer 101 and the substrate 102 during the bonding process, and the less likely it is to generate bounce bubbles. Therefore, the increased adhesive layer thickness can offset the risk of potential bounce bubbles caused by extrusion pressure.

[0075] Referring to Figure 4, it should be noted that the four corners of the cover plate 100 are rounded corners; therefore, correspondingly, the four corners of the adhesive layer 101 and the substrate 102 are also rounded corners. The adhesive layer 101 includes a first corner area C1, and the substrate 102 includes a second corner area C2. The corner area C of the cover plate 100 is defined by the second corner area C2 of the substrate 102; therefore, in this application, the term "second corner area C2" can be used interchangeably with the term "corner area C". Since the size of the adhesive layer 101 is generally slightly smaller than the size of the substrate 102, the edges of the substrate 102 generally extend beyond the edges of the adhesive layer 101. Therefore, the first corner area C1 of the adhesive layer 101 falls within the second corner area C2 of the substrate 102.

[0076] As shown in Figure 4, in some embodiments, the orthographic projection of the first thickened portion 1012 of the adhesive layer 101 onto the substrate 102 overlaps with the first corner area C1 of the adhesive layer 101. With this design, the first thickened portion 1012 of the adhesive layer 101 can fill the first corner area C1, thereby better enhancing the bonding force between the adhesive layer 101 and the substrate 102 at the corner area C, reducing or even avoiding the generation of bounce bubbles.

[0077] Alternatively, in some embodiments, the orthographic projection of the first thickened portion 1012 of the adhesive layer 101 onto the substrate 102 may fall within the first corner region C1 of the adhesive layer 101. For example, the first thickened portion 1012 may be designed only at the location in the first corner region C1 where bounce bubbles are most likely to occur, and the first thickened portion 1012 may not be provided at other locations.

[0078] In some embodiments, the first thickened portion 1012 of the adhesive layer 101 can be a continuous structure, as shown in FIG4. This simplifies the manufacturing process of the adhesive layer 101.

[0079] In an alternative embodiment, the first thickened portion 1012 of the adhesive layer 101 may also include at least two first sub-thickened portions that are separated from each other. As shown in FIG5, the first thickened portion 1012 of the adhesive layer 101 includes three first sub-thickened portions 1012A, 1012B, and 1012C that are separated from each other. The three first sub-thickened portions 1012A, 1012B, and 1012C are arranged at equal intervals in the corner area C in a regular arrangement. The thickness of the three first sub-thickened portions 1012A, 1012B, and 1012C is T1, and the thickness T1 of the three first sub-thickened portions 1012A, 1012B, and 1012C is greater than the thickness T2 of the first main body portion 1013.

[0080] Referring to Figure 6, as previously described, when the cover plate 100 meets condition (b), the target section 1011 of the adhesive layer 101 includes an uneven structure 103. The target section 1011 of the adhesive layer 101 can be processed in any suitable manner to roughen it and form the uneven structure 103. The uneven structure 103 can be of various suitable shapes; for example, it can be a serrated structure or a wavy structure. In the manufacturing process, when the cover plate is bonded to the display panel, the adhesive layer needs to be UV cured. After curing, air bubbles are easily generated at the corners of the adhesive layer. In the embodiments of this disclosure, by making the edge structure of the adhesive layer 101 at the corner area C have an uneven structure 103, the adhesive layer 101 can have an edge effect that resists rebound bubbles, and enhance the edge bonding effect between the adhesive layer 101 and the substrate 102 (or the ink layer on the substrate 102), thereby preventing rebound bubbles from occurring in the corner area C of the cover plate 100.

[0081] During the preparation of the adhesive layer 101, adhesive overflow may occur. To prevent adhesive overflow from adversely affecting the display panel, the edge of the display panel typically extends beyond the edge of the adhesive layer 101, and the edge of the display panel and the edge of the adhesive layer 101 typically have a certain distance, such as 0.1 to 0.2 mm. As shown in FIG6, in the uneven structure 103 provided in the embodiment of this disclosure, the height h of the protrusion or depression can be 0.03 to 0.1 mm, which is less than the distance of 0.1 to 0.2 mm. With this design, even if adhesive overflow may occur during the preparation of the adhesive layer 101, the adhesive will not overflow onto the display panel and will not affect the display effect.

[0082] The uneven structure 103 can be arranged along the entire contour of the arc corner of the adhesive layer 101, or it can be arranged only along a local contour of the arc corner of the adhesive layer 101. The specific arrangement method can be determined based on the actual bonding process and simulation data analysis, with the aim of maximizing the improvement of rebound bubbles.

[0083] For example, as shown in Figure 6, the entire target section 1011 of the adhesive layer 101 can be provided with an uneven structure 103, or in other words, the entire contour of the arc corner of the adhesive layer 101 can be provided with an uneven structure 103. This arrangement ensures that the adhesive layer 101 has better edge resistance to rebound bubbles at the corner area C.

[0084] For example, as shown in Figure 7, the uneven structure 103 is arranged only in the central region of the target segment 1011 of the adhesive layer 101. Since the arc depth corresponding to the central region of the target segment 1011 of the adhesive layer 101 is the largest, and the greater the depth, the greater the curvature of the arc angle, and the easier it is for rebound bubbles to occur. By ensuring that at least the central region of the target segment 1011 of the adhesive layer 101 has the uneven structure 103, the bonding effect between the adhesive layer 101 and the substrate 102 in this central region can be enhanced, thereby reducing the generation of rebound bubbles to a certain extent.

[0085] Referring to Figure 8, as described above, when the cover plate 100 meets condition (c), the thickness T3 of the second thickened portion 1021 of the substrate 102 is greater than the thickness T4 of the second main body portion 1022 of the substrate 102. This can enhance the bonding stress between the substrate 102 and the adhesive layer 101 at the corner area C, reducing or even avoiding the generation of rebound bubbles. In some embodiments, the thickness T3 of the second thickened portion 1021 can be 0.02 to 0.08 mm greater than the thickness T4 of the second main body portion 1022. For example, in one example, the thickness T4 of the second main body portion 1022 of the substrate 102 can be 0.65 mm, and the thickness T3 of the second thickened portion 1021 of the substrate 102 can be 0.7 mm.

[0086] Similar to the first thickened portion 1012, the thickness of the second thickened portion 1021 can be the same or different at various locations. For example, when the thickness of the second thickened portion 1021 is the same at various locations, the second thickened portion 1021 is uniformly thickened, which helps to simplify the fabrication process of the substrate 102. When the thickness of the second thickened portion 1021 is different at various locations, the thickness of the second thickened portion 1021 can gradually increase along the direction from the center of the arc corner to the contour of the arc corner.

[0087] In some embodiments, the orthographic projection of the second thickened portion 1021 of the substrate 102 onto the substrate 102 overlaps with the corner area C. This design allows the second thickened portion 1021 to completely fill the corner area C, thereby enhancing the adhesion between the substrate 102 and the adhesive layer 101 at the corner area C and reducing or even preventing the formation of bounce bubbles. In alternative embodiments, the orthographic projection of the second thickened portion 1021 of the substrate 102 onto the substrate 102 may fall within the corner area C. For example, the second thickened portion 1021 may be designed only at the location in the corner area C where bounce bubbles are most likely to occur.

[0088] In some embodiments, the second thickened portion 1021 of the substrate 102 can be a continuous structure, as shown in FIG8. This simplifies the manufacturing process of the substrate 102.

[0089] As shown in FIG9, in an alternative embodiment, the second thickened portion 1021 of the substrate 102 may also include at least two second sub-thickened portions that are separated from each other. For example, the second thickened portion 1021 of the substrate 102 includes three second sub-thickened portions 1021A, 1021B, and 1021C that are separated from each other. The three second sub-thickened portions 1021A, 1021B, and 1021C are arranged at equal intervals in the corner area C to achieve a regular arrangement. The thickness of the three second sub-thickened portions 1021A, 1021B, and 1021C is T3, and the thickness T3 of the three second sub-thickened portions 1021A, 1021B, and 1021C is greater than the thickness T4 of the second main body portion 1022.

[0090] Referring to Figure 11, as previously described, when the cover plate 100 meets condition (d), the substrate 102 has a surface S facing the adhesive layer 101, and the area of ​​the surface S located in the corner region C includes at least one groove 104. During the fabrication process, when the adhesive layer 101 is cured using ultraviolet light, the volume of the adhesive layer 101 may shrink, potentially causing air bubbles to appear in the adhesive layer 101. By providing at least one groove 104 at the corner region C of the substrate 102, if air bubbles are generated during the fabrication process of the cover plate 100, the groove 104 can be used to expel these air bubbles outside the cover plate 100, thereby increasing the dispersion channels for air bubbles and achieving the effect of dissipating rebound air bubbles. Another function of the groove 104 is that it can also be used to increase the roughness of the surface S of the substrate 102, improving the adhesion between the substrate 102 and the adhesive layer 101, thereby reducing the occurrence of rebound air bubbles from the source.

[0091] The number of grooves 104 can be one or more. When there are multiple grooves 104, they can be arranged in a crisscross pattern on the surface S of the substrate 102. Alternatively, the extending directions of the multiple grooves 104 on the surface S of the substrate 102 can be parallel to each other. The depth of the grooves 104 can be 0.02mm to 0.06mm to ensure that the adhesive layer 101 can overcome the step difference at the grooves 104 and ensure the overall flatness of the cover plate 100.

[0092] It should be noted that in Figures 11 to 24, the adhesive layer 101 and the substrate 102 are shown as separate. However, this is only to illustrate the structure of the relevant components more clearly and does not mean that such a state will be present in the finished product. Those skilled in the art will understand that in the finished cover plate, the adhesive layer 101 and the substrate 102 are bonded together.

[0093] Referring to FIG12, three grooves 104 are shown on the surface S of the substrate 102, two of which extend generally along the length direction of the substrate 102 and one groove 104 extends generally along the width direction of the substrate 102. The substrate 102 includes a second edge 1023, which refers to the edge surrounding the substrate 102. Each groove 104 includes an opposing first end 1041 and a second end 1042, the first end 1041 being closer to the second edge 1023 of the substrate 102 than the second end 1042, and the first end 1041 communicating with the second edge 1023. By making the first end 1041 of the groove 104 communicate with the second edge 1023 of the substrate 102, the groove 104 can be formed as a through groove, thereby allowing air bubbles to be better discharged outside the cover plate 100.

[0094] Referring to FIG13, in an alternative embodiment, the first end 1041 and the second end 1042 of each groove 104 are spaced apart from the second edge 1023. This arrangement allows the grooves 104 to be formed as blind grooves, thus preventing openings at the second edge 1023 of the substrate 102 and improving the sealing of the cover plate 100.

[0095] The optimized structures of adhesive layer 101 and substrate 102 in schemes (a), (b), (c), and (d) have been described in detail above. Below, various possible combinations of the cover plate are described.

[0096] As mentioned above, the cover plate satisfies at least two of the following schemes: (a), (b), (c), and (d). That is, the cover plate can be any one of the following combinations: (a)(b), (a)(c), (a)(d), (b)(c), (b)(d), (c)(d), (a)(b)(c), (a)(b)(d), (a)(c)(d), (b)(c)(d), (a)(b)(d). Verification has shown that the cover plate obtained by combining the above schemes significantly reduces the effect of rebounding bubbles better than the effect of using any one scheme alone, and is also better than the simple summation of the individual effects of each scheme. Furthermore, the relevant technology does not provide any technical inspiration for combining at least two of the following schemes: (a), (b), (c), and (d).

[0097] Figure 14 illustrates the structure of the cover plate 200, which satisfies both conditions (a) and (d). Specifically, the cover plate 200 includes an adhesive layer 101 and a substrate 102. The thickness T1 of the first thickened portion 1012 of the adhesive layer 101 is greater than the thickness T2 of the first main body portion 1013 of the adhesive layer 101. Furthermore, the area of ​​the surface S of the substrate 102 located within the corner region C includes at least one groove 104. The orthographic projection of the first thickened portion 1012 of the adhesive layer 101 onto the substrate 102 at least partially overlaps with the orthographic projection of the groove 104 onto the substrate 102. In this cover plate 200, the adhesive layer 101 can be the structure embodied in any of the embodiments described above in conjunction with Figures 4 and 5, and the substrate 102 can be the structure embodied in any of the embodiments described above in conjunction with Figures 10 to 13. For the sake of brevity, the specific structures of the adhesive layer 101 and the substrate 102 will not be described in detail here.

[0098] In the cover plate 200, the groove 104 serves two purposes: firstly, it increases the bubble dispersion channel, allowing bubbles generated during the degassing process to be evenly dispersed outside the cover plate 200, thus eliminating rebound bubbles; secondly, it increases the surface roughness and surface energy of the substrate 102, thereby improving the adhesion between the adhesive layer 101 and the substrate 102, and reducing the occurrence of rebound bubbles at the source. Furthermore, by providing a first thickened portion 1012 above the groove 104, when the adhesive layer 101 is bonded to the substrate 102, the first thickened portion 1012 can fill the groove 104, effectively eliminating the step difference between the adhesive layer 101 and the substrate 102 caused by the groove 104, thereby achieving a better bonding effect between the adhesive layer 101 and the substrate 102.

[0099] Figure 15 shows the structure of the cover plate 300, which satisfies both conditions (a) and (b). That is, the cover plate 300 includes an adhesive layer 101 and a substrate 102. The adhesive layer 101 includes both a first thickened portion 1012 and an uneven structure 103. The thickness T1 of the first thickened portion 1012 of the adhesive layer 101 is greater than the thickness T2 of the first main body portion 1013 of the adhesive layer 101, and the uneven structure 103 is disposed on the target section 1011 of the first edge 101A of the adhesive layer 101. In this cover plate 300, the first thickened portion 1012 of the adhesive layer 101 can be referred to the description above regarding Figures 4 and 5, and the uneven structure 103 of the adhesive layer 101 can be referred to the description above regarding Figures 6 and 7. For the sake of brevity, the specific structures of the adhesive layer 101 and the substrate 102 will not be described again here.

[0100] In the cover plate 300, by including a first thickened portion 1012 in the corner area C of the adhesive layer 101, the volume of the adhesive at the corner area C is increased, stress concentration is reduced, and the filling performance of the adhesive is improved. This enhances the cohesion and adhesion of the adhesive layer 101 at the corner area C, reducing bubble rebound caused by deformation. Simultaneously, by including an uneven structure 103 in the target section 1011 of the adhesive layer 101, the edge engagement effect between the adhesive layer 101 and the substrate 102 is further enhanced, ensuring that the adhesive layer 101 and the substrate 102 can adhere tightly together at the corner area C, reducing or even preventing the generation of rebound bubbles in the corner area C of the cover plate 100. The cover plate 300 obtained by combining schemes a and b has a significantly better effect on reducing rebound bubbles than either scheme alone.

[0101] Figure 16 illustrates the structure of the cover plate 400, which satisfies both conditions (b) and (c). Specifically, the cover plate 400 includes an adhesive layer 101 and a substrate 102. The target section 1011 of the adhesive layer 101 includes an uneven structure 103, and the thickness T3 of the second thickened portion 1021 of the substrate 102 is greater than the thickness T4 of the second main body portion 1022 of the substrate 102. In this cover plate 400, the adhesive layer 101 can be the structure of the adhesive layer 101 embodied in any of the embodiments described above in conjunction with Figures 6 and 7, and the substrate 102 can be the structure of the substrate 102 embodied in any of the embodiments described above in conjunction with Figures 8 and 9. For the sake of brevity, the specific structures of the adhesive layer 101 and the substrate 102 will not be described again here.

[0102] In the cover plate 400, by including an uneven structure 103 in the target section 1011 of the adhesive layer 101 and including a second thickened portion 1021 in the corner area C of the substrate 102, the interlocking force between the adhesive layer 101 and the substrate 102 at the corner area C can be significantly enhanced, allowing the adhesive layer 101 and the substrate 102 to adhere more tightly together at the corner area C, thereby reducing or even avoiding the generation of rebound bubbles in the corner area C of the cover plate 400. The cover plate 400 obtained by combining schemes b and c has a significantly better effect on reducing rebound bubbles than the effect produced by using either scheme alone.

[0103] Figure 17 illustrates the structure of the cover plate 500, which satisfies both conditions (b) and (d). Specifically, the cover plate 500 includes an adhesive layer 101 and a substrate 102. The target section 1011 of the adhesive layer 101 includes an uneven structure 103, and the surface S of the substrate 102 has a groove 104 at the corner area C. In this cover plate 500, the adhesive layer 101 can be the structure of any of the embodiments described above in conjunction with Figures 6 and 7, and the substrate 102 can be the structure of any of the embodiments described above in conjunction with Figures 10 to 13. For simplicity, the specific structures of the adhesive layer 101 and the substrate 102 will not be described further here.

[0104] In the cover plate 500, by including an uneven structure 103 in the target section 1011 of the adhesive layer 101, the edge engagement effect between the adhesive layer 101 and the substrate 102 can be enhanced, ensuring that the adhesive layer 101 and the substrate 102 can be tightly bonded together at the corner area C. Furthermore, by providing a groove 104 on the surface S of the substrate 102, even if air bubbles are generated during the manufacturing process, these air bubbles can be discharged to the outside of the cover plate 500 through the groove 104. Therefore, the cover plate 500 has a significant effect on reducing bounce air bubbles.

[0105] Figure 18 shows the structure of the cover plate 600, which satisfies both conditions (a) and (c). That is, the cover plate 600 includes an adhesive layer 101 and a substrate 102. The thickness T1 of the first thickened portion 1012 of the adhesive layer 101 is greater than the thickness T2 of the first main body portion 1013 of the adhesive layer 101, and the thickness T3 of the second thickened portion 1021 of the substrate 102 is greater than the thickness T4 of the second main body portion 1022 of the substrate 102. In this cover plate 600, the adhesive layer 101 can be the structure of any embodiment of the adhesive layer 101 described above in conjunction with Figures 4 and 5, and the substrate 102 can be the structure of any embodiment of the substrate 102 described above in conjunction with Figures 8 and 9. For the sake of brevity, the specific structures of the adhesive layer 101 and the substrate 102 will not be described again here.

[0106] In the cover plate 600, by including a first thickened portion 1012 in the corner area C of the adhesive layer 101 and a second thickened portion 1021 in the corner area C of the substrate 102, the interlocking force between the adhesive layer 101 and the substrate 102 at the corner area C can be significantly enhanced. This allows the adhesive layer 101 and the substrate 102 to adhere more tightly together at the corner area C, thereby reducing or even eliminating the generation of rebound bubbles in the corner area C of the cover plate 600. The cover plate 600 obtained by combining schemes a and c has a significantly better effect on reducing rebound bubbles than the effect produced by using either scheme alone.

[0107] Figure 19 illustrates the structure of the cover plate 700, which satisfies both conditions (c) and (d). Specifically, the cover plate 700 includes an adhesive layer 101 and a substrate 102. The thickness T3 of the second thickened portion 1021 of the substrate 102 is greater than the thickness T4 of the second main body portion 1022 of the substrate 102. Furthermore, the surface S of the substrate 102 includes at least one groove 104 at the corner region C. In this cover plate 700, the second thickened portion 1021 of the substrate 102 can be referred to the preceding description with reference to Figures 8 and 9, and the groove 104 can be referred to the preceding description with reference to Figures 10 to 13. For the sake of brevity, the specific structures of the second thickened portion 1021 and the groove 104 will not be repeated here.

[0108] In the cover plate 700, by including a second thickened portion 1021 in the corner region C of the substrate 102, the interlocking force between the adhesive layer 101 and the substrate 102 at the corner region C can be significantly enhanced, allowing the adhesive layer 101 and the substrate 102 to adhere more tightly together at the corner region C. Furthermore, by providing a groove 104 on the surface S of the substrate 102, even if air bubbles are generated during the manufacturing process, these air bubbles can be discharged to the outside of the cover plate 700 through the groove 104. Therefore, the cover plate 700 has a significant effect on reducing bounce air bubbles.

[0109] Figure 20 illustrates the structure of a cover plate 800, which simultaneously satisfies conditions (a), (b), and (c). That is, the cover plate 800 includes an adhesive layer 101 and a substrate 102. The adhesive layer 101 includes both a first thickened portion 1012 and an uneven structure 103. Simultaneously, the substrate 102 includes a second thickened portion 1021. In this cover plate 800, the first thickened portion 1012 of the adhesive layer 101 can be referred to the description above regarding Figures 4 and 5; the uneven structure 103 of the adhesive layer 101 can be referred to the description above regarding Figures 6 and 7; and the substrate 102 can be referred to the description above regarding Figures 8 and 9. For the sake of simplicity, the specific structures of the adhesive layer 101 and the substrate 102 will not be described further here.

[0110] Figure 21 shows the structure of the cover plate 900, which simultaneously satisfies conditions (a), (b), and (d). That is, the cover plate 900 includes an adhesive layer 101 and a substrate 102. The adhesive layer 101 includes both a first thickened portion 1012 and an uneven structure 103. Simultaneously, the surface S of the substrate 102 has a groove 104 at its corner area C. The orthographic projection of the first thickened portion 1012 onto the substrate 102 and the orthographic projection of the groove 104 onto the substrate 102 can at least partially overlap, ensuring that the first thickened portion 1012 can at least partially fill the groove 104. This effectively eliminates the step difference between the adhesive layer 101 and the substrate 102 caused by the groove 104, thereby achieving a better adhesion between the adhesive layer 101 and the substrate 102. In this cover plate 900, the first thickened portion 1012 of the adhesive layer 101 can be referred to the description above regarding Figures 4 and 5, the uneven structure 103 of the adhesive layer 101 can be referred to the description above regarding Figures 6 and 7, and the substrate 102 can be referred to the description above regarding Figures 10 to 13. For the sake of brevity, the specific structures of the adhesive layer 101 and the substrate 102 will not be described in detail here.

[0111] Figure 22 illustrates the structure of a cover plate 1000, which simultaneously satisfies conditions (b), (c), and (d). Specifically, the cover plate 1000 includes an adhesive layer 101 and a substrate 102. The target section 1011 of the adhesive layer 101 includes an uneven structure 103, and the substrate 102 includes a second thickened portion 1021 and a groove 104. In this cover plate 1000, the adhesive layer 101 can be referred to the preceding description with reference to Figures 6 and 7; the second thickened portion 1021 of the substrate 102 can be referred to the preceding description with reference to Figures 8 and 9; and the groove 104 of the substrate 102 can be referred to the preceding description with reference to Figures 10 to 13. For the sake of brevity, the specific structures of the adhesive layer 101 and the substrate 102 will not be described further here.

[0112] Figure 23 shows the structure of the cover plate 1100, which simultaneously satisfies conditions (a), (c), and (d). That is, the cover plate 1100 includes an adhesive layer 101 and a substrate 102. The adhesive layer 101 includes a first thickened portion 1012, and the substrate 102 simultaneously includes a second thickened portion 1021 and a groove 104. The orthographic projection of the first thickened portion 1012 onto the substrate 102 and the orthographic projection of the groove 104 onto the substrate 102 can at least partially overlap, ensuring that the first thickened portion 1012 can at least partially fill the groove 104. This effectively eliminates the step difference between the adhesive layer 101 and the substrate 102 caused by the groove 104, thereby achieving a better adhesion between the adhesive layer 101 and the substrate 102. In this cover plate 1100, the adhesive layer 101 can be referred to the description above regarding Figures 4 and 5, the second thickened portion 1021 of the substrate 102 can be referred to the description above regarding Figures 8 and 9, and the groove 104 of the substrate 102 can be referred to the description above regarding Figures 10 to 13. For the sake of brevity, the specific structures of the adhesive layer 101 and the substrate 102 will not be described in detail here.

[0113] Figure 24 shows the structure of the cover plate 1200, which simultaneously satisfies conditions (a), (b), (c), and (d). That is, the cover plate 1200 includes an adhesive layer 101 and a substrate 102. The adhesive layer 101 includes a first thickened portion 1012 and an uneven structure 103, and the substrate 102 includes a second thickened portion 1021 and a groove 104. The orthographic projection of the first thickened portion 1012 onto the substrate 102 and the orthographic projection of the groove 104 onto the substrate 102 can at least partially overlap, ensuring that the first thickened portion 1012 can at least partially fill the groove 104. This effectively eliminates the step difference between the adhesive layer 101 and the substrate 102 caused by the groove 104, thereby achieving a better adhesion between the adhesive layer 101 and the substrate 102. In the cover plate 1200, the first thickened portion 1012 of the adhesive layer 101 can be referred to the description above regarding Figures 4 and 5; the uneven structure 103 of the adhesive layer 101 can be referred to the description above regarding Figures 6 and 7; the second thickened portion 1021 of the substrate 102 can be referred to the description above regarding Figures 8 and 9; and the groove 104 of the substrate 102 can be referred to the description above regarding Figures 10 to 13. For the sake of brevity, the specific structures of the adhesive layer 101 and the substrate 102 will not be described in detail here.

[0114] In cover plates 800, 900, 1000, 1100, and 1200, by optimizing the structure of the adhesive layer 101 and the substrate 102, the edge bonding effect between the adhesive layer 101 and the substrate 102 is enhanced, allowing the adhesive layer 101 and the substrate 102 to adhere tightly together at the corner area C, and reducing the possibility of rebound bubbles forming at the corner area C. Furthermore, when the substrate 102 includes a groove 104, the groove 104 allows bubbles generated during the pressure degassing process to be discharged to the outside of the cover plate, thereby dissipating the generated bubbles. The groove 104 can also increase the surface roughness S of the substrate 102 to improve the adhesion between the substrate 102 and the adhesive layer 101, which also helps reduce the occurrence of rebound bubbles.

[0115] Figure 25 shows a schematic diagram of the structure of the display module 2000. As shown in Figure 25, the display module 2000 includes a cover plate 3000 and a display panel 105. The cover plate 3000 includes an adhesive layer 101 and a substrate 102. The cover plate 3000 can be any of the cover plates described in the previous embodiments. The display panel 105 is located on the side of the adhesive layer 101 away from the substrate 102 and is bonded to the cover plate 3000 through the adhesive layer 101.

[0116] It should be noted that in Figure 25, the adhesive layer 101, the substrate 102, and the display panel 105 are shown as separate from each other. However, this is only to show the structure of the relevant components more clearly and does not mean that such a state will be presented in the finished product. Those skilled in the art will understand that in the finished display module, the adhesive layer 101, the substrate 102, and the display panel 105 are bonded together.

[0117] The technical effects of the display module 2000 can be referred to the technical effects of the cover plate described in the previous embodiments. For the sake of brevity, the technical effects of the display module 2000 will not be described again here.

[0118] Figure 26 shows a structural block diagram of an electronic device 4000, which includes the aforementioned display module 2000.

[0119] Electronic device 4000 can be any suitable type of display device (e.g., flexible display device), including but not limited to mobile phones, tablets, televisions, monitors, laptops, digital photo frames, navigators, near-eye display devices such as VR or AR, etc.

[0120] The technical effects of the electronic device 4000 can be referred to the technical effects of the cover plate described in the previous embodiments. For the sake of brevity, the technical effects of the electronic device 4000 will not be described again here.

[0121] It will be understood that although the terms first, second, third, etc., may be used herein to describe various elements, components, areas, layers, and / or parts, these elements, components, areas, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, area, layer, or part from another. Therefore, the first element, component, area, layer, or part discussed above may be referred to as the second element, component, area, layer, or part without departing from the teachings of this disclosure.

[0122] Spatial relative terms such as “row,” “column,” “below,” “above,” “left,” “right,” etc., may be used herein for ease of description to describe the relationship between one element or feature illustrated in the figures and another element(s). It will be understood that these spatial relative terms are intended to cover different orientations of the device in use or operation other than those depicted in the figures. For example, if the device in the figure is flipped, then an element described as “below other elements or features” will be oriented “above other elements or features.” Thus, the exemplary term “below” can cover both orientations above and below. Devices may be oriented in other ways (rotated 90 degrees or otherwise) and the spatial relative descriptors used herein will be interpreted accordingly. Additionally, it will be understood that when a layer is referred to as “between two layers,” it may be the only layer between those two layers, or there may be one or more intermediate layers.

[0123] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprising” and / or “including”, when used in this specification, specify the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. In the description of this specification, references to the terms “one embodiment,” “another embodiment,” etc., mean that a specific feature, structure, material, or characteristic described in connection with that embodiment is included in at least one embodiment of this disclosure. The illustrative expressions of the foregoing terms in this specification do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, those skilled in the art can combine the different embodiments or examples described herein and the features of the different embodiments or examples without contradiction.

[0124] It will be understood that when a component or layer is referred to as "on another component or layer," "connected to another component or layer," "coupled to another component or layer," or "adjacent to another component or layer," it may be directly on another component or layer, directly connected to another component or layer, directly coupled to another component or layer, or directly adjacent to another component or layer, or there may be intermediate components or layers. Conversely, when a component is referred to as "directly on another component or layer," "directly connected to another component or layer," "directly coupled to another component or layer," or "directly adjacent to another component or layer," no intermediate components or layers exist. However, in any case, "on" or "directly on" should not be interpreted as requiring a layer to completely cover the layer below.

[0125] Embodiments of this disclosure are described herein with reference to illustrative illustrations (and intermediate structures) of idealized embodiments. Therefore, variations in the illustrated shapes should be expected, for example, as a result of manufacturing techniques and / or tolerances. Consequently, embodiments of this disclosure should not be construed as limited to the specific shapes of the regions illustrated herein, but should include, for example, shape deviations due to manufacturing processes. Thus, the regions illustrated are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of a device and are not intended to limit the scope of this disclosure.

[0126] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the relevant field and / or the context of this specification, and will not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0127] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A cover plate, comprising: substrate; as well as The adhesive layer is bonded to the substrate. The cover plate has rounded corners, includes a main body area and a corner area containing the rounded corners, and the adhesive layer includes a first edge, the orthographic projection of the target segment of the first edge onto the substrate falling within the corner area. The cover plate satisfies at least two of the following conditions: The adhesive layer includes a first thickened portion located in the corner area and a first main body portion located in the main body area, wherein the thickness of the first thickened portion is greater than the thickness of the first main body portion; The target section includes an uneven structure; The substrate includes a second thickened portion located in the corner area and a second main body portion located in the main body area, wherein the thickness of the second thickened portion is greater than the thickness of the second main body portion; The substrate includes a surface facing the adhesive layer, and the area of ​​the surface located within the corner region includes at least one groove.

2. The cover plate according to claim 1, wherein, The orthographic projection of the first thickened portion on the substrate at least partially overlaps with the orthographic projection of the at least one groove on the substrate.

3. The cover plate according to claim 1, wherein, The thickness of the target section is the same as the thickness of the first thickened portion.

4. The cover plate according to claim 1, wherein, The first thickened portion is a continuous structure.

5. The cover plate according to claim 1, wherein, The first thickened portion includes at least two first sub-thickened portions that are separated from each other, and the at least two first sub-thickened portions are distributed at equal intervals in the corner area.

6. The cover plate according to claim 1, wherein, The thickness of the first thickened portion may be the same or different in different places.

7. The cover plate according to claim 1, wherein, The orthographic projection of the first thickened portion onto the substrate overlaps with the arc-shaped corner region of the adhesive layer, or The orthographic projection of the first thickened portion onto the substrate falls within the arc-shaped corner region of the adhesive layer.

8. The cover plate according to claim 1, wherein, The substrate includes a second edge, and each groove includes a first end and a second end opposite to each other, the first end being closer to the second edge than the second end, and the first end communicating with the second edge.

9. The cover plate according to claim 1, wherein, The substrate includes a second edge, and each groove includes a first end and a second end opposite to each other, with the first end and the second end being spaced apart from the second edge.

10. The cover plate according to claim 1, wherein, The number of grooves is multiple, and the multiple grooves are arranged in a crisscross pattern on the surface of the substrate.

11. The cover plate according to claim 1, wherein, The number of grooves is multiple, and the extension directions of the multiple grooves on the surface of the substrate are parallel to each other.

12. The cover plate according to claim 1, wherein, The uneven structure includes a sawtooth structure or a wavy structure.

13. The cover plate according to claim 1, wherein, At least the central region of the target segment includes the uneven structure.

14. The cover plate according to claim 1, wherein, The second thickened section is a continuous structure.

15. The cover plate according to claim 1, wherein, The second thickened portion includes at least two second sub-thickened portions that are separated from each other, and the at least two second sub-thickened portions are distributed at equal intervals in the corner area.

16. The cover plate according to claim 1, wherein, The second thickened portion may have the same or different thickness in different locations.

17. The cover plate according to claim 1, wherein, The orthographic projection of the second thickened portion onto the substrate overlaps with the corner area, or The orthographic projection of the second thickened portion onto the substrate falls within the corner area.

18. The cover plate according to any one of claims 1-17, wherein, The arc angle is a rounded arc angle.

19. A display module, comprising: Cover plate according to any one of claims 1-18; as well as The display panel is located on the side of the adhesive layer away from the substrate and is bonded to the cover plate through the adhesive layer.

20. An electronic device comprising a display module according to claim 19.

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