Link parameter processing method, optical interconnection system, device, non-volatile readable storage medium and product
Patent Information
- Application Number
- PCT/CN2026/084642
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-21
- Filing Date
- 2026-03-19
- Publication Date
- 2026-09-24
Smart Images

Figure CN2026084642_24092026_PF_FP_ABST
Abstract
Description
Link parameter processing methods, optical interconnect systems, devices, non-volatile readable storage media and products
[0001] Cross-references to related applications
[0002] This application claims priority to Chinese Patent Application No. 202510344187.5, filed on March 21, 2025, entitled “Link Parameter Processing Method, Optical Interconnect System, Device, Medium and Product”, the entire contents of which are incorporated herein by reference. Technical Field
[0003] This application relates to the field of data processing technology, and in particular to a link parameter processing method, an optical interconnect system, an apparatus, a non-volatile readable storage medium, and a product. Background Technology
[0004] In conventional optical interconnect systems, the number of optical modules on both the host and device sides is relatively large, and different links are configured with different parameters to ensure normal communication needs are met. If the configuration parameters of a link change, the parameters of the corresponding optical modules on both the host and device sides of the entire link need to be manually rematched. This includes rematching parameters between optical modules at locations along the entire link where the configuration parameters have not been modified. This undoubtedly increases the number of matching steps for optical modules, thereby reducing configuration speed.
[0005] Therefore, how to reduce unnecessary optical module matching steps during the configuration process to improve configuration speed is a technical problem in related technologies. Summary of the Invention
[0006] This application provides a link parameter processing method, an optical interconnect system, a device, a non-volatile readable storage medium, and a product to solve the technical problem in related technologies where conventional optical interconnect systems match the parameters of the entire link's optical modules during configuration, thereby reducing configuration speed.
[0007] This application provides a link parameter processing method, including:
[0008] Obtain the preset identifier parameters corresponding to the optical modules on both the host and device sides;
[0009] The index level corresponding to the link location is determined according to the preset identifier parameters; wherein, the link location includes the location of the optical module of the host end and itself, the link transmission channel, and the location of the optical module of the device end and itself;
[0010] The target index level for storage is determined by matching the index level with the configuration parameters of the host-side storage.
[0011] The configuration strategy for determining the target link location based on the target index level is used to process the link parameters.
[0012] This application also provides an optical interconnect system, which includes a control unit, a host terminal, and a device terminal; the control unit is connected to the host terminal and the device terminal.
[0013] The optical modules of the host and the device are connected by optical fiber.
[0014] The control platform on the host side and the control platform on the device side exchange link parameters supported by the host side and the device side through a network switching unit;
[0015] The control unit is configured to perform the steps of the link parameter processing method described above.
[0016] This application also provides an electronic device, including:
[0017] The memory is configured to store computer programs;
[0018] The processor is configured to implement any of the above-described link parameter processing methods when executing a computer program.
[0019] This application also provides a non-volatile computer-readable storage medium storing a computer program, wherein the computer program, when executed by a processor, implements the steps of any of the above-described link parameter processing methods.
[0020] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of any of the above-described link parameter processing methods.
[0021] This application addresses the issue that conventional optical interconnect systems often experience parameter mismatch problems when configuring parameters. These problems arise between the host and its compatible optical modules, the device and its compatible optical modules, and the optical modules at both ends of the link. This application divides the entire link into three locations based on link position: the host's optical module location, the link transmission channel, and the device's optical module location. It establishes a mapping relationship between the preset identifiers of the host and device's optical modules and the link positions, allowing different preset identifier parameters to represent corresponding index levels. The target index level stored on the host is determined based on the actual configuration parameters stored on the host and the corresponding index level. Based on the target index level, it can be determined which links in the current link have been matched, thus identifying which link positions have mismatch issues. This system refines the link parameters to be configured based on link location, avoiding the slow configuration speed caused by manually rematching the optical module parameters on both the host and device sides, including rematching parameters corresponding to unchanged configuration parameters, when link configuration parameters change in test scenarios. It automatically detects the specific link location that needs matching, reducing unnecessary optical module matching operations and improving configuration speed. It also avoids the complex operation of replacing the entire link location every time adaptation occurs in practical applications, and the increased equipment cost of optical modules, thus simplifying link parameter matching and saving equipment costs. Therefore, it solves the technical problem of conventional optical interconnect systems reconfiguring the parameters of all optical modules on the entire link during parameter configuration, regardless of which link location has a problem. It achieves the technical effect of breaking down the entire link into individual link locations during each matching process, clearly identifying the specific link location that needs adaptation, and performing subsequent matching only for the required link location, thereby reducing unnecessary optical module matching operations and improving configuration speed. Attached Figure Description
[0022] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 is a schematic diagram of an optical interconnect system provided in an embodiment of this application;
[0024] Figure 2 is a flowchart of a link parameter processing method provided in an embodiment of this application;
[0025] Figure 3 is a schematic diagram of host-side and device-side link adaptation provided in an embodiment of this application;
[0026] Figure 4 is a flowchart of another link parameter processing method provided in an embodiment of this application;
[0027] Figure 5 is a schematic diagram of a link parameter processing device provided in an embodiment of this application. Detailed Implementation
[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.
[0029] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.
[0030] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0031] The specific application environment architecture or specific hardware architecture on which the execution of the link parameter processing method depends is described here.
[0032] In an optical interconnect system composed of optical modules, the host and device communicate by transmitting data through an optical transmission medium. This method utilizes the high-speed transmission characteristics of optical signals to replace traditional electrical signal transmission and meet the ever-increasing demand for data transmission.
[0033] In optical interconnect systems, optical modules are optoelectronic conversion devices that can convert externally input electrical signals into optical signals for transmission via optical fibers, and can also convert received optical signals in optical fibers into electrical signals for transmission to relevant processors. Standardization and specifications are applied to the interface types, installation, and functions of optical modules, defining their physical dimensions, electrical interfaces, and optical interfaces. Due to differences in communication rates and data volumes, the form and interface of optical modules are constantly changing, and the light-emitting devices, light-receiving devices, and built-in signal processing methods within them also vary. Different interface forms, optical module types, and manufacturers are used based on different design, cost, and service requirements, leading to differences in communication link configuration parameters. Figure 1 is a schematic diagram of an optical interconnect system provided in an embodiment of this application. As shown in Figure 1, in conventional optical interconnect systems, the host end and the device end may contain different optical modules. Different configuration parameters need to be set for the links composed of corresponding optical modules to ensure that the communication links meet normal communication requirements. The conventional approach is to obtain the optimal link results through continuous testing by testers. If a mismatch occurs, it is necessary to replace the entire link with optical modules of different forms and types. Unbeknownst to many, the adaptation process involves three steps: the optical module on the host side needs to be adapted to its own optical module, the optical module on the device side needs to be adapted to its own optical module, and the optical module on the host side needs to be adapted to the optical module on the device side. According to the current conventional testing scheme, these three adaptation steps increase the complexity of system design and the difficulty of link debugging in order to adapt to different link requirements.
[0034] In the aforementioned optical interconnect system, the corresponding protocol can be the Peripheral Component Interconnect Express (PCIe) protocol or other fiber optic protocols; no specific limitation is made here, and the appropriate protocol can be chosen based on the actual situation. PCIe is a high-speed, high-bandwidth serial data transmission standard used for data transmission between expansion cards and the computer motherboard. As PCIe speeds continue to increase, the requirements for PCIe signal quality also rise, and the transmission distance of PCIe signals over traditional printed circuit boards (PCBs) or copper cables continues to shorten. In some long-distance PCIe transmission applications, designers need to add additional driver circuits to improve signal quality, increasing both design complexity and cost. Compared to traditional PCIe copper cable transmission, using optical signals to transmit PCIe signals offers advantages such as low loss, low latency, high bandwidth, and long distance. However, the PCIe protocol currently does not require the use of optical signals for PCIe signal transmission, leading to some differences between PCIe optical transmission applications and traditional PCIe applications.
[0035] Figure 2 is a flowchart of a link parameter processing method provided in an embodiment of this application. As shown in Figure 2, the method includes:
[0036] S11: Obtain the preset identifier parameters corresponding to the optical modules of the host and device sides respectively;
[0037] S12: Determine the index level corresponding to the link location based on the preset identifier parameters; wherein, the link location includes the optical module location of the host end and itself, the link transmission channel, and the optical module location of the device end and itself;
[0038] S13: Match the index level with the host-side storage configuration parameters to determine the target index level for storage;
[0039] S14: A configuration strategy for determining the target link location based on the target index level, in order to process the link parameters.
[0040] Specifically, the preset identifier parameters in step S11 are based on the corresponding identifier parameters in the adapted link. There must be at least one type of identifier parameter, and multiple types are also possible. Identifier parameters do not specifically refer to a particular value or model number, but rather to a general term encompassing various categories, such as model number or size. The acquisition process can involve reading preset identifier parameters stored on the host and device sides, or retrieving preset identifier parameters stored on both the host and device sides; no limitation is placed here. There is no limitation on the number of devices on the device side, but at least one must exist. There is no limitation on the number of optical modules within the host and device sides; these can be set according to actual conditions.
[0041] Step S12, determining the index level corresponding to the link position based on preset identifiers, refines the parameters of each preset identifier to obtain identifiers corresponding to the mapping relationship of each link position for subsequent index matching. The link position divides the entire link into three parts: the host-side optical module position, the link transmission channel, and the device-side optical module position. The host-side optical module is located at the core node of the optical link's transmitting or receiving end. Its function is to convert electrical signals generated by the host into optical signals for transmission into the link, or to convert optical signals received from the link into electrical signals for host processing. There is an adaptation relationship between the host-side and its own optical modules. The device-side optical module is located at the subordinate node of the optical link, i.e., the end or branch of the link. Its function is to convert electrical signals generated by the device into optical signals for transmission to the host, or to convert optical signals received from the host into electrical signals for device processing. There is an adaptation relationship between the device-side and its own optical modules. The link transmission channel refers to the physical transmission path connecting the host-side and device-side optical modules, ensuring efficient and reliable transmission of optical signals between the host and device ends.
[0042] The three link locations are mapped to preset identifier parameters corresponding to corresponding index levels. This allows for the representation of the matching status of the corresponding link locations based on different index levels. This facilitates subsequent viewing of the actual identifier parameters to map to the actual target index level, indicating which link locations have been adapted successfully and which have not been adapted or have failed to adapt, requiring further configuration of link parameters. Compared to conventional testing and adaptation, replacing the entire link's optical modules presents a different challenge. This involves not just the two optical modules in the link transmission channel, but also configuration issues between the two optical modules and their corresponding host or device-side components. This forces testers to repeatedly replace the entire link's optical modules, thus extending the debugging time.
[0043] In step S13, matching is performed based on the index level and the configuration parameters stored on the host side. The configuration parameters stored on the host side include the actual identifier parameters and real-time communication information on the link, such as the transmission rate and bit error rate used to characterize signal quality, and the configuration information of the optical module's input and output ports, etc., which are not limited here. The matching process can involve first filtering the identifier parameters corresponding to the host's own optical module and the device's own optical module from the configuration parameters stored on the host side. Then, matching is performed based on the index level and each identifier parameter. If an index level representing different link locations is matched in the identifier parameters stored on the host side, it means that the link location is already matched and applicable, and no debugging is needed. Only subsequent configuration is required for link locations that do not match the index level, saving configuration operations.
[0044] In step S14, the configuration strategy for the target link location determined according to the target index level determines which link locations need to be configured. The configuration can be completed by debugging the actual configuration parameters.
[0045] In this application embodiment, since conventional optical interconnect systems often encounter parameter matching issues when configuring parameters, the optical modules at both the host and device ends along the entire link may experience problems in the transmission channels between the host and its adapted optical modules, the device and its adapted optical modules, or the optical modules at both ends, this application divides the entire link into three locations based on the link position: the location of the host and its own optical module, the link transmission channel, and the location of the device and its own optical module. A mapping relationship is established between the preset identifiers of the optical modules at both the host and device ends and the link positions, allowing different preset identifier parameters to represent the corresponding index levels. The target index level stored on the host is determined based on the actual configuration parameters stored on the host and the corresponding index levels of the mapping relationship. Based on the target index level, it can be determined which positions on the current link are already matched, thus identifying which link positions have adaptation problems. This system refines the link parameters to be configured based on link location, avoiding the slow configuration speed caused by manually rematching the optical module parameters on both the host and device sides, including rematching parameters corresponding to unchanged configuration parameters, when link configuration parameters change in test scenarios. It automatically detects the specific link location that needs matching, reducing unnecessary optical module matching operations and improving configuration speed. It also avoids the complex operation of replacing the entire link location every time adaptation occurs in practical applications, and the increased equipment cost of optical modules, thus simplifying link parameter matching and saving equipment costs. Therefore, it solves the technical problem of conventional optical interconnect systems reconfiguring the parameters of all optical modules on the entire link during parameter configuration, regardless of which link location has a problem. It achieves the technical effect of breaking down the entire link into individual link locations during each matching process, clearly identifying the specific link location that needs adaptation, and performing subsequent matching only for the required link location, thereby reducing unnecessary optical module matching operations and improving configuration speed.
[0046] In some embodiments, determining the index level corresponding to the link location based on preset identifier parameters includes:
[0047] Obtain the preset optical module type identifier corresponding to the host's own optical module, the preset optical module manufacturer identifier corresponding to the optical modules of the host and the device, and the preset device device identifier corresponding to the device's own optical module.
[0048] Establish a first mapping relationship between the preset optical module type identifier, the host end and its own optical module location, as the first index level;
[0049] A second mapping relationship is established between the preset optical module manufacturer identifier and the link transmission channel, serving as the second index level;
[0050] A third mapping relationship is established between the preset device identifier, the device and its own optical module location, as a third index level;
[0051] The first index level represents the matching index between the host and its own optical module corresponding to the location of the host's optical module; the second index level represents the matching index between the host's optical module and the device's optical module corresponding to the link transmission channel; the third index level represents the matching index between the device and its own optical module corresponding to the location of the device's optical module; the index levels of the first, second, and third index levels decrease sequentially.
[0052] Considering that manual configuration will involve a proportional increase in the number and types of optical modules used, and that the same type of optical module may be used with different types and manufacturers of optical modules, this embodiment includes at least a preset optical module type identifier, a preset optical module manufacturer identifier, and a preset device identifier. It should be noted that the preset optical module type identifier and preset optical module manufacturer identifier correspond to identifiers set for the optical module, while the preset device identifier corresponds to identifiers set for the device itself, including the optical module connected to the device.
[0053] The matching index in this application embodiment is an index corresponding to the established mapping relationship between different types and manufacturers of optical modules of the same type paired with optical modules. It is only a general term, which includes the mapping relationship of the specific values of each identifier parameter in the actual test.
[0054] The system retrieves the preset optical module type identifier corresponding to the host's own optical module, the preset optical module manufacturer identifier corresponding to the optical modules on both the host and device sides, and the preset device device identifier corresponding to the optical module on the device side. It then establishes a first mapping relationship between the preset optical module type identifier corresponding to the host's own optical module and the location of the optical modules on both sides, serving as the first index level. This means that if the preset optical module type identifier exists in the configuration parameters stored on the host side, it indicates that the optical module locations on both sides match, and no further matching is needed. Next, it establishes a second mapping relationship between the preset optical module manufacturer identifiers corresponding to the optical modules on both the host and device sides and the link transmission channel, serving as the second index level. It should be noted that there are two types of preset optical module manufacturer identifiers: one for the host side and one for the device side. If both types exist in the configuration parameters stored on the host side, it indicates that the link transmission channel matches, and no further matching is needed. A third mapping relationship is established between the preset device identifier and the location of the device and its own optical module, which serves as the third index level. If the preset device identifier exists in the configuration parameters stored on the host, it indicates that the location of the device and its own optical module are matched.
[0055] The first index level is used to characterize the matching index between the host and its own optical modules at the link location corresponding to the host's optical module position. If the host can match the first index level, it is determined that the host's optical module is adapted, while the corresponding device's optical module, the host's optical module, and the device's optical module in the link transmission channel are not adapted. The second index level is used to characterize the matching index between the host and device's optical modules at the link transmission channel corresponding to the link location. If the host can match both the first and second index levels, it is determined that the host's optical module, the host's optical module, and the device's optical module in the link transmission channel are adapted, while only the device's optical module is not adapted. The third index level is used to characterize the matching index between the device and its own optical modules at the link location corresponding to the device's optical module position. If the host can match the first, second, and third index levels, it is determined that the entire link does not require adaptation.
[0056] In this embodiment, the index levels of the first, second, and third index levels decrease sequentially. This is because the priority of matching certain index levels is considered. If a match is made at the first index level, the matching continues at the second index level, and so on. If a match is made at the second index level, the matching continues at the third index level. If a match is not made at the first index level, subsequent index level matching is meaningless. This is because if the host optical module is not matched with its own, even if a match is made at the second or third index level, the subsequent matching between the device optical module and the host optical module will still require rematching the device optical module link when the host optical module is replaced. Therefore, if a match is not made at the first index level, no further matching operation will be performed to save matching time.
[0057] The mapping relationship between the preset identifier and the index level corresponding to each link position provided in this embodiment, compared with the matching of manually configured optical module types and a large number of manufacturers, pre-establishes the mapping relationship of the index level corresponding to each link position, avoids the complexity of re-matching all optical modules of the entire link in subsequent matching, improves the subsequent matching rate, and saves labor costs.
[0058] In some embodiments, the target index level for storage is determined by matching the index level with configuration parameters of the host-side storage, including:
[0059] Obtain the configuration parameters of the host-side storage; the configuration parameters include the optical module type identifier corresponding to the host-side optical module currently stored on the host, the manufacturer identifier corresponding to the optical modules of the host and the device, and the device device identifier corresponding to the optical module of the device.
[0060] Multiple identifier parameters are matched based on multiple index levels;
[0061] If the identifiers corresponding to the first index level, the second index level, and the third index level are matched among multiple identifiers, it is determined that the link between the host and the device has been adapted, and the target index level is determined to be the first index level, the second index level, and the third index level.
[0062] If an identifier corresponding to the first index level and the second index level is matched among multiple identifiers, it is determined that the optical modules of the host and itself, the optical modules of the host and itself and the optical modules of the device are adapted, and the target index level is determined to be the first index level and the second index level.
[0063] If the identifier corresponding to the first index level is matched among multiple identifiers, it is determined that the host and its own optical module have been adapted, and the target index level is determined to be the first index level.
[0064] If no identifier corresponding to the first, second, and third index levels is matched among multiple identifiers, it is determined that the link between the host and the device is not compatible.
[0065] Specifically, the configuration parameters are matched against multiple identifiers at multiple index levels. If the identifiers corresponding to the first, second, and third index levels mentioned above are matched on the host side, the link is considered fully adapted, and no further configuration of link parameters is required. If the first and second index levels are matched, the host and its own optical modules, and the host's own optical modules and the device's own optical modules are considered adapted, but the device's own optical modules are not. If the identifier corresponding to the first index level is matched, the host and its own optical modules are considered adapted, but the host's own optical modules and the device's own optical modules, and the device's own optical modules are not. If no index level is matched, the entire link between the host and the device is considered not adapted, and subsequent configuration needs to be performed for the entire link. The specific configuration operation can be the same as the regular configuration of the entire link, or the host and its own optical modules, and the device and its own optical modules can be configured first, and then the configuration parameters of the host's own optical modules and the device's own optical modules can be configured.
[0066] The matching process provided in this embodiment, which determines the target index level of storage based on the index level and the configuration parameters stored on the host side, facilitates subsequent targeted matching operations for each link location and simplifies the matching process.
[0067] In some embodiments, the configuration strategy for determining the target link location based on the target index level includes:
[0068] When the target index level is the first index level or the second index level, the target link location is determined to be the location of the device and its own optical module. Then, the device devices are replaced and configured according to the location of the device and its own optical module.
[0069] When the target index level is the first index level, the target link location is determined as the location of the optical module on the device end and its own optical module, and the optical module on the device end corresponding to the link transmission channel. Then, the optical module on the device end is adapted according to the location of the optical module on the device end and its own optical module, and the optical module on the device end corresponding to the link transmission channel.
[0070] Specifically, when the target index level is the first index level or the second index level, the target link position corresponds to the link position that needs to be configured, that is, the position of the device end and its own optical module. Compared with the already successfully adapted link, the current link only requires the replacement of the device end components.
[0071] When the target index level is the first index level, the target link location is that the optical module location of the device end is not compatible with its own location, and the optical module of the device end corresponding to the link transmission channel is not compatible.
[0072] The target link locations corresponding to different target index levels are different in this embodiment, so the corresponding adaptation operation objects are also different. It is necessary to determine the configuration strategy corresponding to different target link locations according to different target index levels to improve the flexibility of configuration processing and simplify configuration operations.
[0073] In some embodiments, in conjunction with the above embodiments, when the target index level is a first index level and a second index level, the device-side components are replaced and configured according to the location of the device-side optical module and its own optical module, including:
[0074] The initial target device is determined by matching the type identifier of the optical module itself on the device side with the device identifiers of multiple device side devices.
[0075] Match the device identifier of the initial target device with the host device identifier;
[0076] If there is a device identifier that matches the host device identifier, the initial target device will be used as the final device.
[0077] Replace the final device components and configure the link parameters of the final device components to the host side to complete the configuration.
[0078] Specifically, during the replacement process, the optical module on the device side can correctly receive and convert the optical signal emitted by the optical module on the host side, determining that the configuration parameters of the current device on the device side are not suitable for the current link. The controller on the host side, such as the Baseboard Management Controller (BMC), synchronizes its judgment result to the controller on the device side, such as the BMC, informing the device on the device side to adjust the link parameters to meet the requirements of the current link operation.
[0079] The device's own optical module type identifier is matched with the device identifiers of multiple device devices to be replaced to initially select the target device. Among the target device devices, the device identifier is matched with the host device identifier. After confirming that it matches the host device identifier of the link, the final device is selected, and the final device is replaced. The corresponding link parameters are configured to the host to complete the configuration operation.
[0080] The configuration strategy for the location of the device's optical modules provided in this embodiment, when the target index level is the first index level or the second index level, achieves the technical effect of targeted matching, eliminating the need to perform matching tests on all optical modules in the entire link, thus improving matching efficiency and accuracy.
[0081] In some embodiments, when the target index level is the first index level, the optical module of the device is adapted according to the location of the optical module of the device and the optical module of the device corresponding to the link transmission channel, including:
[0082] Obtain the first electrical signal amplitude of the output port of the optical module of multiple devices;
[0083] The amplitude values of multiple first electrical signals are adjusted to obtain the adjusted first electrical signal amplitude, so as to adapt to the optical module of the device.
[0084] The first target parameter used to characterize the electrical signal quality is obtained from the output ports of the optical modules of multiple devices.
[0085] The first bit error rate of the optical module input port of the device itself is determined based on multiple first target parameters;
[0086] Multiple first bit error rates are compared to filter out the target first bit error rate;
[0087] Apply the first target parameter corresponding to the first target bit error rate to the optical module of the adapter device itself to complete the configuration.
[0088] Specifically, if only a first-level index is matched, it indicates that the device's optical module is not compatible with its own. The host controller, such as the BMC, informs the device's BMC that the parameters of the device's optical module need to be adjusted to meet the link requirements. Therefore, it is necessary to obtain the first electrical signal amplitudes of multiple output ports of the device's own optical modules. The device's signal processing module detects whether the input signal amplitude meets the requirements and feeds back the judgment result of whether the amplitude is too large, too small, or appropriate to the device's baseboard manager. If it does not meet the requirements, the amplitudes of multiple first electrical signals need to be adjusted to obtain adjusted first electrical signal amplitudes to adapt to the device and its own optical module. That is, the device's baseboard manager adjusts the parameters of the optical module output port according to the feedback result of the device's signal processing unit until the device's baseboard manager detects that the amplitude result fed back by the device's signal processing unit is appropriate. Then, the first target parameters used to characterize the electrical signal quality of multiple output ports of the device's own optical modules are obtained. The target parameters here are not limited, as long as they can be used to characterize the electrical signal quality and determine parameters such as bit error rate or transmission rate.
[0089] The first target parameter is sequentially applied to the output port of the optical module on the device side. During this process, the signal processing module judges the signal quality of the electrical signal output by the optical module and calculates the first bit error rate (BER) of the input signal. Besides calculating the BER, parameters such as the transmission rate can also be calculated. The BER is then fed back to the BMC. The device-side baseboard manager records the signal quality configuration parameters of the optical module output port and the BER result fed back by the signal processing module. Multiple BERs are compared to select the optimal target BER. The first target parameter corresponding to the target BER is then applied to the optical module adapted to the device side, completing the configuration. In other words, after traversing all adjustable parameter values for the signal quality of the optical module output port, the device-side baseboard manager generates a correspondence between the optical module signal quality parameters and the link signal BER, and extracts the set of optical module output port signal quality parameter values with the best BER, applying them to the device-side optical module. At this point, the configuration of the device-side optical module output parameters is considered complete.
[0090] In this embodiment, during the adaptation process of the optical module on the device side, the amplitude of the electrical signal at the output port of the optical module is adjusted to achieve the technical effect of adapting the device side and the replaced optical module. On this basis, the bit error rate of the input port of the optical module is screened to determine the first target parameter with higher electrical signal quality and adapt it to the optical module on the device side, thus realizing the effect of adapting the optical module on the device side and the optical module on the host side.
[0091] In some embodiments, after the adaptation is completed, the method further includes:
[0092] Obtain the second electrical signal amplitude from the input ports of the optical modules of multiple devices;
[0093] The amplitudes of multiple second electrical signals are adjusted to obtain the adjusted amplitude of the second electrical signal, so as to adapt to the optical module of the device.
[0094] Acquire the second target parameter from the input ports of the optical modules of multiple devices to characterize the quality of the electrical signal;
[0095] The second bit error rate of the optical module input port of the device itself is determined based on multiple second target parameters;
[0096] Multiple second bit error rates are compared to filter out the target second bit error rate;
[0097] Obtain the amplitude of the third electrical signal and the third target parameter used to characterize the quality of the electrical signal from the output port of the host optical module stored on the host side;
[0098] The third bit error rate of the optical module input port of the device itself is determined based on the third target parameter;
[0099] The consistency of parameters between the host and device ends is determined based on the amplitude of the second electrical signal, the amplitude of the third electrical signal, the target second bit error rate, and the third bit error rate.
[0100] Specifically, the device-side BMC also adjusts the second electrical signal amplitude and the second target parameter characterizing the electrical signal quality at the input port of its own optical module. The process for determining the second electrical signal amplitude and the second target parameter corresponding to the second bit error rate is the same as in the above embodiment and will not be repeated here. It should be noted that, unlike the modification of the output port in the above embodiment, when adjusting these parameters of the input port, the host needs to detect the parameters corresponding to the signal amplitude and signal quality. The host-side BMC feeds back the detection results to the device-side BMC for subsequent adjustments. This continues until the second and third electrical signal amplitudes of the host and device are similar, and the target second bit error rate and third bit error rate are similar. Only then is it determined that the host and device are similar. The similarity determined here can be that the corresponding differences are small, and a comparison method using a preset range or a difference not exceeding a threshold is used. This is not limited here.
[0101] In this embodiment, in addition to modifying the configuration of the optical module output port of the device itself in the above embodiments, the accuracy of the configured link parameters is improved by adjusting the configuration parameters of the optical module input port of the device itself and the feedback detection of the host.
[0102] In some embodiments, if no first index level is matched among multiple identifier parameters, the method further includes:
[0103] The target index level of the device is determined by matching the index level and the configuration parameters stored on the device. The configuration parameters stored on the device include the manufacturer identifier of the optical module currently stored on the device and the device device identifier.
[0104] Configuration strategy for determining the target link location based on the target index level on the device side.
[0105] Specifically, if no identifier at the first index level is matched on the host side, the system checks whether the device side can match the index level. It should be noted that the device's storage only stores the identifier parameters corresponding to the second and third index levels, i.e., the manufacturer identifier of the optical module and the device identifier currently stored on the device. In this case, the optical module on the host side is considered incompatible with the host, so the configuration strategy for the currently determined target link location is the same as the determination process in the above embodiment, and will not be repeated here. It is similar to the configuration strategy in the case where the host side does not match the second index level, i.e., only the first index level is matched.
[0106] This embodiment provides an index configuration for the device side when no match is found at the first index level, in order to determine that the link position of the host side and its own optical module is not adapted, thereby improving the comprehensiveness and diversity of adaptation detection.
[0107] In some embodiments, the target index level on the device is determined by matching the index level with configuration parameters stored on the device, including:
[0108] Retrieve configuration parameters stored on the device;
[0109] The manufacturer identifier and device identifier of the optical module on the device side are matched according to each index level;
[0110] If the identifiers corresponding to the second and third index levels are matched, it is determined that the host end and its own optical module location are not compatible, and the target index level of the device end is determined to be the second and third index levels.
[0111] Specifically, similar to the matching situation mentioned in the above embodiments when the host only matches the first index level, this method matches the manufacturer identifier and device identifier of the device optical module based on each index level. If a match is found, it means that the device is compatible with its own optical module, the host optical module and the device optical module in this link transmission channel, but the host is not compatible with its own optical module position.
[0112] The process for determining the mismatch between the host and its own optical module position provided in this embodiment improves the accuracy of matching judgment by using a matching process between the device and the host, compared to detecting only the host itself.
[0113] In some embodiments, the configuration strategy for determining the target link location based on the target index level on the device side includes:
[0114] Obtain the amplitude of the fifth electrical signal from the output ports of multiple optical modules on the host side;
[0115] The amplitudes of multiple fifth electrical signals are adjusted to obtain the adjusted fifth electrical signal amplitude, which is adapted to the optical module of the host and itself.
[0116] The fifth target parameter is obtained from the output ports of multiple optical modules on the host side to characterize the quality of electrical signals.
[0117] The fifth bit error rate of the optical module input port at the host end is determined based on multiple fifth target parameters;
[0118] Multiple fifth bit error rates are compared to filter out the target fifth bit error rate;
[0119] Obtain the amplitude of the sixth electrical signal and the sixth target parameter used to characterize the quality of the electrical signal from the input port of the host optical module stored on the host side;
[0120] The sixth bit error rate of the optical module input port on the host side is determined based on the sixth target parameter;
[0121] The consistency of parameters between the host and device ends is determined based on the adjusted fifth electrical signal amplitude, the target fifth bit error rate, and the sixth bit error rate.
[0122] Specifically, the controller on the host side, such as the BMC, adjusts the input and output amplitudes and signal quality parameters of the host-side optical module. The process of determining the adjusted fifth electrical signal amplitude, the target fifth bit error rate, and the sixth bit error rate is the same as the process of determining the input and output signals of the device-side optical module in the above embodiment, and will not be repeated here. The main difference is that the host side participates in the adjustment process as the execution subject. After the host side's own optical module is adapted, it is then adapted with the device side.
[0123] In this embodiment, the optical module adaptation of the host side is completed. In order to adjust the configuration of the entire link, parameter configuration between the host side and the device side is added to improve the accuracy of the link configuration parameters.
[0124] In some embodiments, after determining that the link between the host and the device is not compatible, the method further includes:
[0125] The host and device ends are respectively controlled to adjust the amplitude of the fourth signal at the output port of the corresponding optical module;
[0126] The amplitude values of the multiple fourth electrical signals are adjusted to obtain the adjusted amplitude values of the fourth electrical signals, so as to adapt to the optical modules of the host and itself, and the optical modules of the device and itself respectively.
[0127] The fourth target parameter for characterizing the electrical signal quality is obtained from the output ports of the optical modules at both the host and device ends.
[0128] The fourth bit error rate of the optical module input port of each host and device is determined based on their respective multiple fourth target parameters;
[0129] The adjusted fourth electrical signal amplitude and the respective fourth bit error rate are used to determine the consistency of parameters between the host and the device.
[0130] Specifically, after the link between the host and device ends is not adapted, the entire link needs to be configured. This configuration must be done sequentially. For example, the host-side substrate manager and the device-side substrate manager adjust the relevant parameters of the connected optical modules in the order of first adjusting the amplitude of the optical module output signal and then adjusting the signal quality. After the optical module parameters are adjusted, the device-side device link parameters are then adjusted to achieve the optimization process of the optical module interconnection link parameters. Unlike the above, the adjustment of the host-side optical module and the device-side optical module are performed simultaneously. Figure 3 is a schematic diagram of host-side and device-side link adaptation provided in an embodiment of this application. As shown in Figure 3, the components of the link position are first detected. Based on the component configuration information, one approach is to use the parameter matching of the current link transmission channel's link position, and the other is to modify and match the parameters of the current link transmission channel's link position. Finally, the parameters of the optical modules on both the host and device ends are adjusted, and the adjusted and configured link parameters are stored.
[0131] In this embodiment, the fourth signal amplitude, fourth target parameter, and corresponding fourth bit error rate of the optical module output port are only general terms. Here, they represent the parameters of the host and device sides respectively to achieve adaptation between the host and its own optical module, and between the device and its own optical module. Regarding the link adaptation between the host and device sides, consistency is determined by comparing their respective adjusted fourth electrical signal amplitudes and their respective fourth bit error rates.
[0132] In this embodiment, the host and device sides each adapt their internal systems to see if they are compatible with the optical module, and then the link adaptation is adjusted based on the parameters, so that the adaptation process is orderly and the adaptation efficiency is improved.
[0133] In some embodiments, when an identifier corresponding to a first index level, a second index level, and a third index level is matched among multiple identifier parameters, the method further includes:
[0134] Obtain the configuration parameters of the input and output ports of the optical modules on both the host and device sides stored on the host side;
[0135] The host side is matched with multiple optical modules according to the configuration parameters to determine the matching result;
[0136] The matching results are synchronized to the device to control the optical modules of both the host and the device to perform initialization processing to obtain the updated configuration parameters.
[0137] Determine whether the current port status of the optical module input / output ports on both the host and device sides has been modified;
[0138] If the current port status of the optical module input / output ports of the host and the device is modified, it is determined whether the link transmission channel between the host and the device meets the preset requirements.
[0139] If the link transmission channel between the host and the device meets the preset requirements, then the configuration parameters between the host and the device are determined to be updated.
[0140] Specifically, considering that once all host-side components are matched to the index level, the current link can be considered adapted, in actual use, it's necessary to verify whether the configuration parameters have changed or been updated. Therefore, it's necessary to obtain the configuration parameters of the input and output ports of the optical modules on both the host and device sides, perform matching to determine the matching results, and synchronize the device side for initialization and updates. In addition, it's necessary to determine whether the port status of the input and output ports has been modified. If the port status has been modified, it's further necessary to determine whether the transmission parameters of the link transmission channel meet the preset requirements. If the transmission parameters of the link transmission channel meet the preset requirements, then the configuration parameter update is considered complete.
[0141] For example, the host-side substrate manager can read the storage area pointed to by the three-level index in the storage device to extract the configuration parameter information of the input / output ports of the host-side optical module and the device-side optical module. The host-side substrate manager synchronizes the optical module information matching results to the device-side substrate manager. The two substrate managers control the connected optical modules to enter the initialization process, and update the input / output port configuration parameter information to the internal active control storage area of the optical module during the initialization process. The optical module reads and applies the parameter information read from the active control storage area to configure the corresponding parameters of the input / output ports. After all optical modules are configured, the two substrate managers read the current status of the input / output ports of the connected optical modules again to determine whether the optical module parameters have been modified correctly. At the same time, the two substrate managers read the results processed by the two signal processing modules to determine whether the current optical interconnect link meets the system operating requirements.
[0142] This embodiment provides an additional verification process in actual use when all matches reach the index level, thereby improving the accuracy of data transmission.
[0143] Figure 4 is a flowchart of another link parameter processing method provided in an embodiment of this application. As shown in Figure 4, it includes:
[0144] S21: Determine whether the first index level is matched; if the first index level is matched, proceed to step S22; if the first index level is not matched, proceed to step S23.
[0145] S22: Determine whether a second index level is matched; if a second index level is matched, proceed to step S24; if no second index level is matched, proceed to step S25.
[0146] S23: Optimize the configuration parameters of the optical module link on the host side, and proceed to step S22;
[0147] S24: Determine whether a third index level is matched; if a third index level is matched, proceed to step S26; if no third index level is matched, proceed to step S27.
[0148] S25: Optimize the configuration parameters of the optical module link on the device side, and proceed to step S24;
[0149] S27: Optimize the configuration parameters of the device link on the device side, and proceed to step S26;
[0150] S26: The link parameters are directly applied to the optical modules of both the host and the device.
[0151] It should be noted that this embodiment does not take into account the situation where none of the three index levels match. Please refer to the above embodiment for details, which will not be repeated here.
[0152] Furthermore, this application provides an optical interconnect system, which includes a control unit, a host terminal, and a device terminal; the control unit connects the host terminal and the device terminal.
[0153] The optical modules on the host side and the device side are connected via optical fiber.
[0154] The host-side control platform and the device-side control platform exchange link parameters supported by the host and device through a network switching unit;
[0155] The control unit is configured to perform the steps of the link parameter processing method described above.
[0156] In this embodiment, the structure differs from that of the optical interconnect system in Figure 1, with the addition of a control unit; the remaining components are the same as those in Figure 1.
[0157] In Figure 1, the link parameter processing method of this application can also be applied. As shown in Figure 1, a network switching unit is connected to a host server containing a unique processor and multiple device servers containing at least one device. The host server connects to multiple sets of electrical signal data links, which are respectively processed by a host-side signal processing module and N optical modules of type-A. The optical modules convert the input electrical signals into optical signals and connect them to the device-side optical modules in the multiple device servers via optical fibers connected to the optical modules. The device-side optical modules in the device servers are of different models and quantities. After the device-side optical modules convert the optical signals into electrical signals, they are then processed by the device-side signal processing module and connected to different device devices. In addition to the above-mentioned optical interconnect links, the host processor and the device servers also include a baseboard manager and a storage device. The baseboard managers in all servers are connected to the same network unit through a network.
[0158] The storage devices within the host server and device servers record the number of optical modules supported by the server, the type of optical modules, the corresponding configuration parameters for different optical modules to operate normally, the configuration parameters for the host to operate normally with different optical modules, and the configuration parameters for the device to operate normally with different optical modules. The host server is unique, with only one storage device storing this information. There are multiple device servers, and each storage device within each server stores different information. The baseboard manager can communicate with the storage devices and can be used to read or edit the information stored within the corresponding storage device.
[0159] The signal processing module is configured to process the electrical signal converted by the optical module, determine whether the electrical signal converted by the optical module meets the requirements for the operation of the processor or device, and then determine the current working status of the processor or device. The baseboard manager can read the working status determined by the signal processing module and adjust the optical module parameters accordingly.
[0160] The baseboard manager is also connected to the host or device inside the server and is configured to adjust and store optical interconnect link parameters.
[0161] 1. Before the optical interconnect link is established: the device on the device side actively sends the device-supported parameter information applicable to the general link to the substrate manager; the host in the host server also actively sends the host-supported parameter information applicable to the general link to the substrate manager; the substrate manager in the device server and the substrate manager in the host server exchange host and device-supported parameter information with each other through the network switching unit.
[0162] 2. When a normal communication is established in an optical interconnect link: the devices in the host server actively send parameter information applicable to the normal operation of the current link to the baseboard manager. The baseboard manager updates the optical module type, quantity, and device parameter information in this link to the corresponding storage device. Similarly, the host in the host server and the baseboard manager therein also update the relevant information to the corresponding storage device.
[0163] The baseboard manager inside the server is connected to all optical modules. After the optical modules are powered on, the baseboard manager reads the type identifier, manufacturer identifier, device identifier, and signal configuration parameters of the transmitting and receiving ends from the optical modules. When the link is in normal communication mode, the baseboard manager stores the correspondence between the above configuration parameters and the optical module type identifier and manufacturer identifier in the host-side storage device. The storage format is that the optical module type identifier is the first-level index, the manufacturer identifier is the second-level index, and the device identifier is the third-level index. Unlike the host-side storage device, which stores three indexes, the device-side storage device only stores two indexes: the device-side optical module and the device itself. That is, it only has a second-level index and a third-level index. Different third-level indices point to different storage areas inside the storage device, which store the corresponding optical module signal configuration parameters. When an optical interconnect link composed of optical modules with the same or similar parameters is subsequently detected, the baseboard manager can call the previously configured parameter information to configure the optical modules.
[0164] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.
[0165] An embodiment of this application also provides a link parameter processing device. Figure 5 is a schematic diagram of the structure of a link parameter processing device provided in an embodiment of this application. As shown in Figure 5, it includes:
[0166] The acquisition module 11 is configured to acquire the preset identifier parameters corresponding to the optical modules of the host and the device respectively;
[0167] The first determining module 12 is configured to determine the index level corresponding to the link location based on preset identifier parameters; wherein, the link location includes the optical module location of the host end and itself, the link transmission channel, and the optical module location of the device end and itself;
[0168] The second determining module 13 is configured to determine the target index level of the storage by matching the index level with the configuration parameters of the host-side storage.
[0169] The third determining module 14 is configured with a strategy to determine the target link location based on the target index level in order to process the link parameters.
[0170] For a description of the features in the embodiment corresponding to the link parameter processing device, please refer to the relevant description in the embodiment corresponding to the link parameter processing method, which will not be repeated here.
[0171] Embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above-described link parameter processing method embodiments.
[0172] Embodiments of this application also provide a non-volatile computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above-described link parameter processing method embodiments at runtime.
[0173] In one exemplary embodiment, the aforementioned non-volatile computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks.
[0174] The embodiments of this application also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in any of the above-described link parameter processing method embodiments.
[0175] Embodiments of this application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps in any of the above-described link parameter processing method embodiments.
[0176] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.
[0177] The foregoing has provided a detailed description of the link parameter processing method, optical interconnect system, device, medium, and product provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of this application.
Claims
1. A link parameter processing method, characterized in that, include: Obtain the preset identifier parameters corresponding to the optical modules on both the host and device sides; The index level corresponding to the link location is determined according to the preset identifier parameters; wherein, the link location includes the location of the host end and its own optical module, the link transmission channel, and the location of the device end and its own optical module; The target index level for storage is determined by matching the index level with the configuration parameters of the host-side storage. The configuration strategy for determining the target link location based on the target index level is used to process the link parameters.
2. The link parameter processing method according to claim 1, characterized in that, The index level corresponding to the link location is determined based on preset identifier parameters, including: Obtain the preset optical module type identifier corresponding to the host's own optical module, the preset optical module manufacturer identifier corresponding to the optical modules of the host and the device, and the preset device device identifier corresponding to the device's own optical module. Establish a first mapping relationship between the preset optical module type identifier, the host end and its own optical module location, as the first index level; A second mapping relationship is established between the preset optical module manufacturer identifier and the link transmission channel, serving as the second index level; A third mapping relationship is established between the preset device identifier, the device and its own optical module location, as a third index level; Wherein, the first index level represents the host-side optical module matching index corresponding to the location of its own optical module; the second index level represents the host-side optical module and device-side optical module matching index corresponding to the link transmission channel; the third index level represents the device-side optical module matching index corresponding to the location of its own optical module; the index levels of the first index level, the second index level and the third index level decrease sequentially.
3. The link parameter processing method according to claim 2, characterized in that, The target index level for storage is determined by matching the index level with the host-side storage configuration parameters, including: Obtain the configuration parameters stored on the host side; wherein, the configuration parameters include the optical module type identifier corresponding to the host side's own optical module currently stored on the host side, the manufacturer identifier corresponding to the optical modules of the host side and the device side respectively, and the device device identifier corresponding to the optical module of the device side itself; Multiple identifier parameters are matched based on multiple index levels; If the identifiers corresponding to the first index level, the second index level, and the third index level are matched among multiple identifiers, it is determined that the link between the host and the device has been adapted, and the target index level is determined to be the first index level, the second index level, and the third index level.
4. The link parameter processing method according to claim 3, characterized in that, If an identifier corresponding to the first index level and the second index level is matched among multiple identifiers, it is determined that the optical modules of the host and itself, the optical modules of the host and the optical modules of the device are adapted, and the target index level is determined to be the first index level and the second index level. If the identifier corresponding to the first index level is matched among multiple identifiers, it is determined that the host and its own optical module have been adapted, and the target index level is determined to be the first index level. If no identifier corresponding to the first, second, and third index levels is matched among multiple identifiers, it is determined that the link between the host and the device is not compatible.
5. The link parameter processing method according to claim 3, characterized in that, The configuration strategy for determining the target link location based on the target index level includes: When the target index level is the first index level and the second index level, the target link location is determined to be the location of the optical module of the device and itself. Then, the device devices are replaced and configured according to the location of the optical module of the device and itself. When the target index level is the first index level, the target link location is determined to be the optical module location of the device end and its own optical module, and the optical module of the device end corresponding to the link transmission channel. Then, the optical module of the device end is adapted according to the optical module location of the device end and its own optical module, and the optical module of the device end corresponding to the link transmission channel.
6. The link parameter processing method according to claim 5, characterized in that, Replace and configure the devices based on the location of the optical modules on the device itself, including: The initial target device is determined by matching the type identifier of the optical module itself on the device side with the device identifiers of multiple device side devices. Match the device identifier of the initial target device with the host device identifier; If there is a device identifier that matches the host device identifier, then the matched initial target device will be used as the final device. Replace the final device and configure its link parameters to the host to complete the configuration.
7. The link parameter processing method according to claim 5, characterized in that, Based on the location of the optical module on the device and its own optical module, and the optical module on the device corresponding to the link transmission channel, the optical module on the device is adapted, including: Obtain the first electrical signal amplitude of the output port of the optical module of multiple devices; The amplitude values of multiple first electrical signals are adjusted to obtain the adjusted amplitude value of the first electrical signal, so as to adapt to the optical module of the device. The first target parameter used to characterize the electrical signal quality is obtained from the output ports of the optical modules of multiple devices. The first bit error rate of the optical module input port of the device itself is determined based on multiple first target parameters; Multiple first bit error rates are compared to filter out the target first bit error rate; Apply the first target parameter corresponding to the first target bit error rate to the optical module of the adapter device itself to complete the configuration.
8. The link parameter processing method according to claim 7, characterized in that, After the adaptation is complete, it also includes: Obtain the second electrical signal amplitude from the input ports of the optical modules of multiple devices; The amplitudes of multiple second electrical signals are adjusted to obtain the adjusted amplitude of the second electrical signal, so as to adapt to the optical module of the device. Acquire the second target parameter from the input ports of the optical modules of multiple devices to characterize the quality of the electrical signal; The second bit error rate of the optical module input port of the device itself is determined based on multiple second target parameters; Multiple second bit error rates are compared to filter out the target second bit error rate; Obtain the amplitude of the third electrical signal and the third target parameter used to characterize the quality of the electrical signal from the output port of the host optical module stored on the host side; The third bit error rate of the optical module input port of the device itself is determined based on the third target parameter; The consistency of parameters between the host and device ends is determined based on the amplitude of the second electrical signal, the amplitude of the third electrical signal, the target second bit error rate, and the third bit error rate.
9. The link parameter processing method according to claim 3, characterized in that, If no identifier corresponding to the first index level is matched among multiple identifier parameters, the following also applies: The target index level of the device is determined by matching the index level with the configuration parameters stored on the device; wherein, the configuration parameters stored on the device include the manufacturer identifier of the optical module currently stored on the device and the device device identifier. Configuration strategy for determining the target link location based on the target index level on the device side.
10. The link parameter processing method according to claim 9, characterized in that, The target index level on the device is determined by matching the index level with the configuration parameters stored on the device, including: Retrieve configuration parameters stored on the device; The manufacturer identifier and device identifier of the optical module on the device side are matched according to each index level; If the identifiers corresponding to the second and third index levels are matched, it is determined that the host end and its own optical module location are not compatible, and the target index level of the device end is determined to be the second and third index levels.
11. The link parameter processing method according to claim 4, characterized in that, After determining that the link between the host and the device is incompatible, the following steps are also included: The host and device ends are respectively controlled to adjust the amplitude of the fourth signal at the output port of the corresponding optical module; The amplitude values of the multiple fourth electrical signals are adjusted to obtain the adjusted amplitude values of the fourth electrical signals, so as to adapt to the optical modules of the host and itself, and the optical modules of the device and itself respectively. The fourth target parameter, used to characterize the electrical signal quality, is obtained from the output ports of the optical modules at both the host and device ends. The fourth bit error rate of the optical module input port of each host and device is determined based on their respective multiple fourth target parameters; The adjusted fourth electrical signal amplitude and the respective fourth bit error rate are used to determine the consistency of parameters between the host and the device.
12. The link parameter processing method according to claim 3, characterized in that, When matching identifiers corresponding to the first, second, and third index levels among multiple identifier parameters, it also includes: Obtain the configuration parameters of the input and output ports of the optical modules on both the host and device sides stored on the host side; The host side is matched with multiple optical modules according to the configuration parameters to determine the matching result; The matching results are synchronized to the device to control the optical modules of both the host and the device to perform initialization processing to obtain updated configuration parameters. Determine whether the current port status of the optical module input / output ports on both the host and device sides has been modified; If the current port status of the optical module input / output ports of the host and the device is modified, it is determined whether the link transmission channel between the host and the device meets the preset requirements. If the link transmission channel between the host and the device meets the preset requirements, then it is determined that the configuration parameters between the host and the device have been updated.
13. The link parameter processing method according to claim 4, characterized in that, After determining that the link between the host and the device is not compatible, the process further includes: the baseboard manager on the host side adjusting the parameters of the optical module on the host side, and the baseboard manager on the device side adjusting the parameters of the optical module on the device side. In the parameter adjustment process, the parameters are adjusted in the following order: first the amplitude of the output signal of the optical module is adjusted, and then the parameters used to characterize the quality of the electrical signal are adjusted.
14. The link parameter processing method according to claim 7, characterized in that, The step of adjusting the amplitudes of multiple first electrical signals to obtain the adjusted amplitude of the first electrical signal includes: The signal processing module on the device side detects whether the amplitude of the first electrical signal at the output port of the optical module on the device side meets the preset requirements to obtain a judgment result, and feeds the judgment result back to the substrate management controller on the device side. The substrate management controller on the device side adjusts the parameters of the output port of the optical module on the device side according to the judgment result until the substrate management controller on the device side detects that the amplitude of the first electrical signal meets the preset requirement and obtains the judgment result, thus obtaining the adjusted amplitude of the first electrical signal.
15. The link parameter processing method according to claim 8, characterized in that, The step of determining the parameter consistency between the host and device sides based on the amplitude of the second electrical signal, the amplitude of the third electrical signal, the target second bit error rate, and the third bit error rate includes: Calculate the first difference between the amplitude of the second electrical signal and the amplitude of the third electrical signal, and the second difference between the target second bit error rate and the third bit error rate, respectively. Determine whether both the first difference and the second difference do not exceed a preset threshold; If neither the first difference nor the second difference exceeds a preset threshold, then the parameters of the host and the device are determined to be consistent.
16. The link parameter processing method according to claim 12, characterized in that, The control host and device terminals each perform initialization processing on their respective optical modules to obtain updated configuration parameters, including: The host-side substrate manager and the device-side substrate manager respectively control the connected optical modules to enter the initialization process; During the initialization process of the optical module, the configuration parameter information of the input and output ports of the optical module is updated to the active control storage area inside the optical module; The optical module is controlled to read and apply the configuration parameter information in the activity control storage area to configure the parameters of the input / output port, thereby obtaining updated configuration parameters.
17. An optical interconnect system, characterized in that, The optical interconnect system includes a control unit, a host terminal, and a device terminal; the control unit connects the host terminal and the device terminal. The optical modules of the host and the device are connected by optical fiber. The control platform on the host side and the control platform on the device side exchange link parameters supported by the host side and the device side through a network switching unit; The control unit is configured to perform the steps of the link parameter processing method according to any one of claims 1 to 16.
18. An electronic device, characterized in that, include: The memory is configured to store computer programs; The processor is configured to implement the steps of the link parameter processing method as described in any one of claims 1 to 16 when executing the computer program.
19. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, wherein when the computer program is executed by a processor, it implements the steps of the link parameter processing method as described in any one of claims 1 to 11.
20. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the link parameter processing method as described in any one of claims 1 to 16.