Cleaning device, CVD system and cleaning method

Abstract

The present invention relates to a cleaning device (40) for a chemical vapour deposition apparatus (10), a chemical vapour deposition system including such a cleaning device (40) and a method (100) for cleaning a process chamber (20) of a chemical vapour deposition apparatus (10). The chemical vapour deposition apparatus (10) has a process chamber (20) and a transport mechanism (12) for transporting substrate carriers (14) through said process chamber (20). The cleaning device (40) comprises at least one cleaning element (42) for mechanically cleaning at least one surface area within the process chamber (20). According to the invention, the cleaning device (40) is configured for an operative connection with the transport mechanism (12) such that the cleaning device (40) is transportable through the process chamber (20) by means of said transport mechanism (12).

Description

[0001] NXW004DE0 21 . 03. 2025

[0002] 1

[0003] Cleaning device, CVD system and cleaning method

[0004] The present invention relates to a cleaning device for a chemical vapour deposition apparatus, a chemical vapour deposition system including such a cleaning device and a method for cleaning a process chamber of a chemical vapour deposition apparatus .

[0005] Chemical vapour deposition (CVD) is a method suitable to produce thin films on substrates . One of its prominent applications is in the semiconductor industry, e . g. during the production process of solar cells . There, chemical vapour deposition is often deployed as part of a process line, wherein the semiconductor substrates, i . e . wafers, are sequentially and substantially continuously transported on substrate carriers through a plurality of processing stations . An according chemical vapour deposition apparatus arranged in such a process line usually comprises a process chamber having a substrate entry opening for receiving the substrates and an opposite substrate exit opening. Inside the process chamber, between the entry opening and the exit opening, the substrates are moved past a showerhead which inj ects process gas into the process chamber, particularly onto the substrate surfaces such that the desired material layer can form on the substrate surfaces .

[0006] A problem in these CVD apparatuses is parasitic deposition of material on the showerhead surface facing the substrates and on all other surfaces in the process chamber . During long or many operation cycles, this can lead to a loss in emissivity of the showerhead and so-called flaking, i . e . particle agglomerates detaching and falling onto the substrates because it may not be possible to transport them away by the gas flowNXW004DE0 21 . 03. 2025

[0007] 2

[0008] within the process chamber . This problem is usually tackled by regularly cleaning the process chamber . For this purpose, an initial chemical etching for cleaning the showerhead surface and, advantageously, also all other surfaces in the process chamber followed by a mechanical cleaning, e . g. with a suitable brush, is performed. In order to reach every region of the process chamber surface that requires mechanical cleaning and / or to secure thorough cleaning, particularly in so-called close coupled showerhead (CCS) systems where the distance between showerhead and substrate surface is particularly small, it is usually necessary to open the process chamber during the mechanical cleaning process . This, however, prolongs the cleaning process and leads to a prolonged downtime of the CVD apparatus or the whole process line, respectively. Also, after the cleaning process, the process chamber has to be heated again up to the desired process temperature and air has to be purged out of the process chamber before operation can commence, making the cleaning energy-intensive .

[0009] Against this background, it is an obj ect of the present invention to improve cleaning of the interior of a process chamber of a chemical vapour deposition apparatus, in particular increasing the efficiency of the cleaning process and reducing the downtime of the apparatus due to the cleaning process .

[0010] This obj ect is achieved by a cleaning device for a chemical vapour deposition apparatus, a chemical vapour deposition system including such a cleaning device and a method for cleaning a process chamber of a chemical vapour deposition apparatus according to the independent claims .

[0011] Preferred embodiments of the invention are subj ect to the dependent claims and the following description.NXW004DE0 21 . 03. 2025

[0012] 3

[0013] According to a first aspect of the invention, the cleaning device for a chemical vapour deposition apparatus having a process chamber and a transport mechanism for transporting substrate carriers (also termed susceptors) through said process chamber comprises at least one cleaning element for mechanically cleaning, particularly brushing particles off , at least one surface area within the process chamber of the CVD apparatus, particularly while being transported through the process chamber . According to the invention, the cleaning device is configured for an operative connection with the transport mechanism of the CVD apparatus such that the cleaning device is transportable through the process chamber of the CVD apparatus by means of said transport mechanism.

[0014] An aspect of the invention is based on the approach of using a transport mechanism of a chemical vapour deposition apparatus or, more generally, a transport mechanism of a process line for processing substrates, particularly wafers, for moving a cleaning device having at least one cleaning element, e . g. a rotating or rotatable brush or a spring-loaded sponge, through a process chamber of said CVD apparatus . Preferably, the transport mechanism is intrinsically configured for transporting substrate carriers through said process chamber or, more generally, through at least a part of the process line . Thus, using the already present transport mechanism for moving the cleaning device through the process chamber, a particularly efficient cleaning can be performed. Specifically, cleaning can be performed without having to open the process chamber . Accordingly, the cleaning may be performed with significantly less effort compared to conventional, possibly even manual, cleaning of the process chamber . It becomes possible to shorten the set-up time for cleaning and clean the process chamber or at least parts thereof in a short period. The interruption of nominal operation, i . e . the downtime, of the CVDNXW004DE0 21 . 03. 2025

[0015] 4

[0016] apparatus can thus be reduced to a minimum. Further, because the process chamber has not to be opened, no external contaminants or gases such as air with high oxygen content enter the chamber . Hence, no flushing of the process chamber with purge gas to get rid of these external contaminants or gases upon completion of the cleaning is required. This lowers expenditure and effort, and increases process stability and sustainability.

[0017] For transportation by means of the transport mechanism, the cleaning device is preferably compatible with said transport mechanism. For example, the cleaning device may be configured to fit into or onto receptacles or entrainers of said transport mechanism, e . g. coupled to a so-called transport taxi of said transport mechanism. Accordingly, the cleaning device can preferably be hooked into or attached in another manner to said transport mechanism. In use, i . e . during transport of the cleaning device through the process chamber, the cleaning device preferably replaces a substrate carrier .

[0018] For instance, the cleaning device may comprise a coupling arrangement for operatively connecting the cleaning device with the transport mechanism. Specifically, the cleaning device may comprise a coupling arrangement formed for cooperation with the transport mechanism, such that the cleaning device can be transported by the transport mechanism in the same manner as substrate carriers are transported through the process chamber during nominal operation of the CVD apparatus . This enables to adapt the cleaning device to already existing CVD apparatuses . In other words, already existing CVD apparatuses having continuous carrier transportation do preferably not require any modification in order to be cleaned by means of the cleaning device .NXW004DE0 21 . 03. 2025

[0019] 5

[0020] It is conceivable, for example, that the cleaning element comprises a brush-like cleaning roller . In this case, a shaft of the brush-like cleaning roller, which defines a rotational axis of the cleaning roller, is configured to be operatively connected with the transport mechanism. I . e . the shaft may comprise or form the coupling arrangement for cooperating with the transport mechanism. This space-saving and lightweight design of the cleaning device enables easy handling and fast preparation for an upcoming cleaning process .

[0021] It is preferred, however, that the cleaning device comprises a frame on which the at least one cleaning element is arranged. In this case, said frame is advantageously configured for an operative connection with the transport mechanism. Providing the cleaning device with the frame has the advantage that stability of the cleaning device can significantly be improved. Also, by means of a frame, it is possible to realize other angles of the cleaning elements other than perpendicular to the transport direction, and / or arrange additional elements, such as additional cleaning elements, compartments for collecting and storing or electrostatically charged members for attracting particles brushed off the process chamber interior, a motor for driving a rotation of the at least one cleaning element and / or the like, on said frame . In some instances, it is also conceivable that such a frame could be operatively connected more easily and / or in a more reliable manner with the transport mechanism.

[0022] As the cleaning device preferably replaces a substrate carrier (and the substrates carried thereon) during the cleaning process, it is preferable that the at least one brush-like element has the same orientation as the substrates carried by the substrate carrier during treatment in the process chamber . This allows unimpeded transportation of the cleaning deviceNXW004DE0 21 . 03. 2025

[0023] 6

[0024] through the process chamber . To this end, the cleaning device, particularly the frame, is preferably configured such that the at least one cleaning element, in particular its longitudinal axis or its axis of rotation, respectively, is arranged substantially perpendicular to a transport direction upon transportation through the process chamber by means of the transport mechanism. For example, the at least one cleaning element, specifically its longitudinal or rotational axis, respectively, may have a substantially vertical orientation. Preferably, the at least one cleaning element has an inclination of 0° to 20° , more preferably of 0° to 10° , with respect to the vertical direction. This is advantageous in cases where substrates carried by the substrate carrier are inclined in the same manner in order to brace them with their back against a support element of the substrate carrier . Having the at least one cleaning element arranged substantially perpendicular to the transport direction or with an inclination of 0° to 20° , advantageously of 0° to 10° , with respect to the vertical direction, allows easy introduction into and transport through the process chamber .

[0025] In order to enable thorough cleaning of at least parts of the process chamber, the at least one cleaning element may be rotatable or rotating during the cleaning process . To this end, the cleaning device preferably comprises a drive mechanism for driving a rotation of the at least one cleaning element during transportation through the process chamber by means of the transport mechanism. It is further preferred, in that case, that the at least one cleaning element comprises a cleaning roller, i . e . to have a substantially cylindrical shape . Further advantageously, the drive mechanism is part of the cleaning device and thus configured for transportation through the process chamber, along with the rotatable or rotating cleaningNXW004DE0 21 . 03. 2025

[0026] 7

[0027] roller (s) . As the drive mechanism is part of the cleaning device, an external driving of the at least one cleaning element, for example through the opening (s) of the process chamber, is not necessary. This lessens the effort for driving a rotation of the at least one cleaning element, i . e . simplifies the driving.

[0028] For example, a particularly effortless driving can be achieved by having the drive mechanism configured as a purely mechanical mechanism. In this case, the rotation of the at least one cleaning element is driven or driveable by the relative movement of the cleaning device, particularly the at least one cleaning element, relative to the process chamber during transportation through the process chamber . Such a purely mechanical drive mechanism requires no additional energy source and can be designed to be particularly robust . For example, the drive mechanism may comprise a gear mechanism that induces rotation of the at least one cleaning element simply by moving through the process chamber . For example, rotational movement can be generated by having the gear mechanism, particularly a toothed gear of said gear mechanism, cooperating with a toothed rack in or at the process chamber along the transport mechanism.

[0029] Alternatively or additionally, the drive mechanism may include at least one electric motor for driving the rotation of the at least one cleaning element . In order to ease handling, said electric motor is preferably battery-powered. Utilisation of such an electric motor allows a reduction of parts and therefore a particularly compact design of the drive mechanism.

[0030] Particularly when having the at least one cleaning element being rotatable or rotating upon transportation through the process chamber, an increase of the cleaning efficiency can beNXW004DE0 21 . 03. 2025

[0031] 8

[0032] achieved by providing a plurality of cleaning elements, e . g. cleaning rollers, arranged in parallel to each other . For example, the plurality of cleaning elements can be arranged consecutively. Such consecutively arranged cleaning elements can come into contact with a surface area within the process chamber one after another . Therein, the cleaning elements are preferably made of different materials and / or are arranged in different distances relative to a transport plane and / or comprise bristles of different length and / or comprise bristles in different distances to one another . For example, a first cleaning roller may be configured as a stiff and sparse brush for rough cleaning of large contaminants, while following cleaning rollers may be configured as soft and dense brushes or sponges for fine and intensive cleaning of small contaminants .

[0033] A transport plane according to the present invention is preferably a plane defined within the process chamber, e . g. within the slit formed between the showerhead and a heating unit, back wall or separator wall of the CVD apparatus . The transport plane is substantially parallel to the showerhead and / or heating unit, back wall or separator wall surface . Further, the plane is substantially parallel to an orientation of the at least one cleaning element upon transportation through the process chamber by means of the transport mechanism.

[0034] It is also conceivable that at least two cleaning elements are arranged pairwise in a direction perpendicular to the transport direction upon transportation through the process chamber by means of the transport mechanism, particularly perpendicular to the transport plane . In this case, one of the cleaning elements can be provided for cleaning a component on one side of the transport plane, and the other one of the cleaning rollers can be provided for cleaning a component onNXW004DE0 21 . 03. 2025

[0035] 9

[0036] the opposite side of the transport plane . For example, one cleaning element may be provided for cleaning the showerhead, while the other cleaning element may be provided for simultaneously cleaning a back wall, a separator wall, or a heater element of the process chamber . Of course, also in this case it may be advantageous when the at least pairwise arranged cleaning elements are made of different materials and / or are arranged in different distances relative to the plane and / or comprise bristles of different length and / or comprise bristles in different distances to one another, depending on the requirements when cleaning the different components within the process chamber .

[0037] Alternatively or additionally, an increase in the cleaning efficiency can also be achieved by having the drive mechanism configured to drive a rotation of the plurality of cleaning elements, wherein at least some of the cleaning elements are advantageously driven with different rotational speeds . For example, the drive mechanism may be configured to drive a first cleaning element at a slow rotation for rough cleaning of large particles, and drive a following or adj acent cleaning element at a fast rotation for fine and intensive cleaning of small particles .

[0038] In order to prevent these brushed-off particles to settle again in another region of the process chamber, the cleaning device preferably comprises at least one particle compartment for collecting and storing particles brushed off the interior of the process chamber during the cleaning process . By this means, particles received by the compartment can securely and reliably be conveyed out of the process chamber when the cleaning device exits the chamber .

[0039] In this regard, it is particularly preferred that the at leastNXW004DE0 21 . 03. 2025

[0040] 10

[0041] one particle compartment is integrated into the at least one cleaning element . For example, the cleaning element may comprise a cavity forming the particle compartment . Specifically, the cleaning element, e . g. a roller, may be formed as a hollow cylinder or tube . This allows the particles to be collected immediately after being brushed off, i . e . in the immediate vicinity of the surface on which they were deposited. Thereby, the risk of brushed-off particles settling in other regions of the process chamber can significantly be reduced.

[0042] In this case, in order to collect the brushed-off particles in the particle compartment, the at least one cleaning element comprises advantageously at least one, preferably a plurality of openings on its outer surface through which particles can enter the compartment . Particularly, if a plurality of openings are provided, a homogenous collection of particles can be achieved .

[0043] Alternatively, the compartment can be formed by or in the frame . This allows for potentially larger compartments and can thereby increase the capacity for received particles .

[0044] An alternative or additional way of catching brushed-off particles is to provide a cleaning device that is at least partially electrostatically charged. For example, the at least one cleaning element, e . g. a roller body, and / or the frame can be electrostatically charged. Particles brushed off a surface within the process chamber may then stick to the corresponding component of the cleaning device . This can (also) reduce the risk of having brushed-off particles settle onto a different surface within the process chamber, or reduce this risk even further .NXW004DE0 21 . 03. 2025

[0045] 11

[0046] An at least partially electrostatically charged cleaning device, e . g. an electrostatically charged component of the cleaning device, can be obtained by triboelectic charging, i . e . in a passive manner . For example, in order to electrostatically charge a component of the cleaning device, said component may be swept across a surface of the process chamber when actively cleaning or when passing said surface during transport of the cleaning device through the process chamber . To this end, said component is preferably arranged to come into contact with a surface within the process chamber such that the component is electrostatically charged by the triboelectric effect . For example, the surface of the at least one cleaning element can become electrostatically charged when sweeping across a surface to be cleaned, e . g. the surface of the showerhead. Alternatively, or in addition, it is conceivable to generate the electrostatic charge already prior to entering the process chamber, e . g. by sweeping the component or cleaning element, respectively across a dedicated charging surface arranged in front of an entry opening of the process chamber or CVD apparatus, respectively.

[0047] If such an electrostatic charge of a component of the cleaning device, e . g. of the at least one cleaning element, occurs by triboelectric charging and particles attach to the charged component by electrostatic induction, it is advantageous to also provide means for detaching electrostatically adhering particles that cling to the electrostatically charged component . This can help to keep the corresponding component, particularly the at least one cleaning element - that preferably continuously or repeatedly comes into contact with the interior of the surface chamber when being transported through the process chamber, clean or prevent an agglomeration of particles on said component, respectively. Accordingly, in a preferred embodiment, the cleaning device comprises at least one,NXW004DE0 21 . 03. 2025

[0048] 12

[0049] particularly dedicated, wiper arranged for wiping particles off the at least one cleaning element . Preferably, the wiping off of particles is achieved by relative movement of the at least one wiper relative to the at least one cleaning element . Particularly, the at least one wiper may be arranged such that upon rotation of the at least one cleaning element, the wiper sweeps across at least part of the surface, particularly a lateral surface, of the cleaning element . By this sweeping across the surface, particles electrostatically attached to the at least one cleaning element may receive an additional impulse that overcomes the attraction between particle and cleaning element and thus leads to detachment of the particle .

[0050] In addition or in the alternative to triboelectric charging, electrostatic charge of a component of the cleaning device can be generated actively, i . e . by connecting said component to a voltage source . Accordingly, the cleaning device may comprise a tap being arranged for electrically contacting a contact element arranged along a transport direction of the cleaning device during transport through the process chamber such that the cleaning device is electrostatically chargeable at least partially during transport through the process chamber . The tap can be formed by a sliding contact, in order to electrically contact a dedicated contact bar extending along the transport direction. Alternatively, the tap can be formed by an electrically conducting wheel of the cleaning device, said wheel running on a guide rail for guiding the cleaning element and / or substrate carriers through the process chamber. Particularly, the tab can be an electrically conductive bearing, in particular a slide bearing or ball bearing, which connects to the guide rail with the guide rail acting as a busbar, i . e . the contact element or contact bar, respectively.

[0051] For example, the tap can be electrically connected to a bodyNXW004DE0 21 . 03. 2025

[0052] 13

[0053] of the at least one cleaning element, in particular to a body of a rotatable cleaning roller or a cleaning brush. The at least one cleaning element, in this case, is advantageously electrically insulated from surfaces to be cleaned when being transported through the process chamber . For example, the cleaning element may comprise bristles that are electrically insulating and form an insulating layer between the body and the surface to be cleaned when the cleaning device is transported through the process chamber . By electrically connecting the body of the at least one cleaning element to the tap, the at least one cleaning element can immediately and therefore very reliably catch particles brushed off the interior of the process chamber .

[0054] Alternatively or additionally, the cleaning device may comprise at least one, particularly dedicated, electrostatic catcher arranged adj acent to the at least one cleaning element . For example, the electrostatic catcher is a plate arranged behind the cleaning element . Advantageously, said electrostatic catcher is electrically connected to the tap, e . g. the electrically conducting wheel or bearing or the sliding contact . The at least one electrostatic catcher is preferably configured for electrostatically catching particles brushed off the interior of the process chamber . By means of the electrostatic catcher, even particles having a large impulse due to being brushed off the interior of the process chamber can be catched reliably.

[0055] Besides operating the regular exhaust system of the CVD apparatus at high capacity during cleaning, providing the cleaning device with a particle compartment is particularly useful in combination with a suction unit for sucking particles brushed off the interior of the process chamber into the particle compartment . By this means, the amount of brushed-off particlesNXW004DE0 21 . 03. 2025

[0056] 14

[0057] collected in the particle compartment can be significantly increased. This allows for a particularly reliable cleaning of the interior of the process chamber by means of the at least one cleaning element and can significantly reduce the risk of brushed-off particles to settle down in a different region of the process chamber .

[0058] The suction unit is preferably configured for generating a vacuum or a lower pressure, respectively, within the compartment relative to the pressure within the volume of the surrounding process chamber . The suction unit may be advantageously arranged in the particle compartment, thereby simplifying the gas flow.

[0059] In order to achieve a particularly efficient and thorough cleaning of the process chamber, the at least one cleaning element is configured to simultaneously clean more than one component of the chemical vapour deposition apparatus arranged within the process chamber . For example, the diameter of the element may be large enough to come into contact with components on opposite sides of the transport mechanism or transport path through the process chamber, respectively. For instance, the at least one cleaning element can come into contact with the showerhead of the apparatus and simultaneously with a back wall, a separator wall or a heating element opposite of the showerhead.

[0060] Alternatively, a plurality of cleaning elements may be provided in a manner enabling simultaneous cleaning of more than one component . For example, cleaning elements may be arranged pairwise in a direction perpendicular to the transport direction, as has been pointed out above already.

[0061] A particularly reliable cleaning of a surface area within theNXW004DE0 21 . 03. 2025

[0062] 15

[0063] process chamber can be achieved by having the at least one cleaning element comprise a roller . Said roller is preferably rotatable or rotatably mounted, in order to enhance the cleaning effect . Alternatively or additionally, the at least one cleaning element is a brush-like element . That is, the cleaning element preferably comprises bristles . Such a brush-like element may be particularly suited for mechanically brushing off particles of a surface area within the process chamber .

[0064] The at least one cleaning element may be fabricated at least partially from fiberglass, silica filament and / or silica fabric . In various tests, these materials have shown good cleaning properties of stainless steel surfaces of e . g. a showerhead within the process chamber, or graphite, SiC-coated graphite, ceramic or quartz glass surfaces of e . g. a heating element within the process chamber . Further, these materials do not contaminate the process chamber . For example, when the at least one cleaning element comprise a brush-like cleaning roller, a body of the roller may be fabricated from silica filaments or comprise fiberglass bristles . Alternatively, when the at least one cleaning element comprises a sponge-like body, the body may be fabricated from silica fabric .

[0065] According to a second aspect of the invention, the chemical vapour deposition system comprises a chemical vapour deposition apparatus having a process chamber and a transport mechanism for transportation of substrate carriers through said process chamber . According to the invention, a cleaning device according to the first aspect of the invention is provided. In this CVD system, the process chamber of the CVD apparatus can be cleaned in a particularly short period and with particularly low effort by combining the transport mechanism and the cleaning device . Specifically, no dedicated, external mecha-NXW004DE0 21 . 03. 2025

[0066] nism is required to move the cleaning device through the process chamber . At the same time, opening up the process chamber becomes superfluous, saving time ( for disassembly and reassembly of the CVD apparatus or the process chamber, respectively) , energy ( for reheating the process chamber back to the required process temperature after cleaning) and material (purge gas for flushing the process chamber before opening the chamber, to prevent escape of etching gas into the atmosphere, and / or for flushing the process chamber after closing the chamber, to get rid of the air and contaminants) .

[0067] In order to enable electrostatic catching of particles brushed off the interior of the process chamber by means of the at least one cleaning element, the system advantageously comprises a voltage source electrically connected to at least one component within the process chamber on the one hand and a contact element extending along a transport direction of the cleaning device through the process chamber on the other hand. For example, one of the two poles of the voltage source may be connected to the at least one component within the process chamber, e . g. the showerhead, the heating unit, the back wall or the like . The other one of the two poles may be connected to the contact element . Preferably, the contact element is configured, in particular arranged, for being electrically contacted by at least a part of the cleaning device when the cleaning device is transported through the process chamber . By applying a voltage, a potential difference between the at least one component within the process chamber and at least a part of the cleaning device, e . g. a body of a cleaning element or a dedicated electrostatic catcher, may be generated. This can facilitate the attraction of particles brushed off the interior of the process chamber to the part of the cleaning device electrically coupled to the contact element .NXW004DE0 21 . 03. 2025

[0068] 17

[0069] A particularly effective way of electrically coupling the cleaning device to the voltage source is to configure a guide rail for guiding the cleaning device and / or substrate carriers during transport through the process chamber as the contact element . An electrical coupling with the contact element, i . e . the guide rail, can be established by an electrically conducting wheel or bearing of the cleaning device which runs on or otherwise contacts the guide rail . In other words, the wheel or bearing may act as a tap . By electrically connecting the guide rail to the voltage source, an electrical coupling to the cleaning device can be established within the process chamber without any additional parts . This makes this solution very efficient .

[0070] In the alternative, a contact bar for being electrically contacted by a sliding contact of the cleaning device can be provided. Advantageously, the contact bar is at least partially arranged within the process chamber, e . g. at a side wall of the process chamber . Having a (dedicated) contact bar can simplify the electrical coupling of the cleaning device to the voltage source . Specifically, a dedicated tap can be utilised, e . g. a sliding contact . This can lower the requirements for electrical wiring and / or insulation in or on the cleaning device .

[0071] According to a third aspect of the invention, the method for cleaning a process chamber of a chemical vapour deposition apparatus comprises : i) operatively connecting a cleaning device, in particular according to the first aspect of the invention, with a transport mechanism of the chemical vapour deposition apparatus, said transport mechanism being configured for transporting substrate carriers through the process chamber; and ii) transporting the cleaning device through the process chamber by means of said transport mechanism, suchNXW004DE0 21 . 03. 2025

[0072] 18

[0073] that at least one cleaning element of said cleaning device mechanically cleans at least one surface area within the process chamber of the CVD apparatus .

[0074] For example, the at least one cleaning element may come into contact with a showerhead, the back wall, a heating element, a separator wall and / or the like within said process chamber or of said process chamber, respectively. This method may prevent the need for opening the process chamber for regular maintenance and cleaning, which is common in conventional CVD systems, particularly in close coupled showerhead systems . Hence, by means of said method, the CVD apparatus uptime and the material quality and overall equipment effectiveness may be increased. Particularly, due to more frequent routine cleaning, slow degradation of system performance can be prevented.

[0075] Depending on the material of the cleaning device, particularly the at least one cleaning element, it might be necessary to perform the mechanical cleaning at a cleaning temperature at or below a predefined temperature threshold. Because cleaning by means of the cleaning device is preferably performed in situ, i . e . without powering down the CVD apparatus and / or disconnecting it from a process line, it is hence preferred to reduce the temperature (e . g. from a process temperature) within the process chamber prior to transporting the cleaning device through the process chamber . For example, the temperature within the process chamber may be reduced from a process temperature of e . g. 1100 °C to 1200 °C down to or below a cleaning temperature of e . g. 900 °C . Preferably, the cleaning temperature is chosen according to a temperature necessary for a preceding etching step . However, the material of the at least one cleaning element may be taken into account as well when determining the temperature threshold.NXW004DE0 21 . 03. 2025

[0076] 19

[0077] In order to prevent particles brushed off the interior of the process chamber to settle in other regions of the process chamber, prior to transporting the cleaning device through the process chamber, a pressure in the process chamber is preferably reduced down to or below a predefined threshold. Advantageously, during transporting the cleaning device through the process chamber, gas is discharged from the process chamber via a process chamber exhaust system. Additionally, it can be advantageous to feed a purge gas into the process chamber via the showerhead, in order to establish a steady and / or uniform gas flow out of the process chamber . To this end, throttle valves of the exhaust system and / or in a showerhead feed line may, particularly fully, be opened. Specifically, the exhaust system is advantageously operated at maximum capacity. The exhaust system may thus operate as a suction device, preventing high concentrations of particles, in particular the formation of an aerosol, inside the process chamber .

[0078] Alternatively or additionally, prior to transporting the cleaning device through the process chamber, an etching gas may be inj ected into the process chamber, such that particles deposited on at least one surface area within the process chamber are removed at least partially by etching. This etching process may serve as a pre-cleaning step and prepare for the subsequent mechanical cleaning by means of the cleaning device . It is even more preferred however, to alternatively or additionally perform the etching and the transportation of the cleaning device through the process chamber - and hence the mechanical cleaning - simultaneously. This can even further speed up the cleaning process, i . e . further reduce the downtime of the CVD apparatus due to cleaning.

[0079] In order to further enhance the cleaning process, in particular to make sure particles brushed off the interior of theNXW004DE0 21 . 03. 2025

[0080] 20

[0081] process chamber do not settle in a different part of the process chamber, it is preferred to electrostatically charge the cleaning device at least partially, in particular during transport through the process chamber . For example, a body of the at least one cleaning element or a dedicated electrostatic catcher may be (actively) electrostatically charged. To this end, a voltage source is preferably electrically connected with the at least one component within the process chamber, e . g. the showerhead, the heating unit, the back wall or the like, on the one hand. Further, the voltage source is preferably electrically connected to at least a part of the cleaning device on the other hand. For example, one of two poles of the voltage source may be connected to the at least one component within the process chamber, while the other one of the two poles is connected to the cleaning device, particularly the body of the at least one cleaning element or the electrostatic catcher .

[0082] The properties, features and advantages of the invention described above, as well as the manner in which they are achieved, will be explained in more detail in connection with the figures in the following description of examples . Where appropriate, the same reference signs are used in the figures for the same or corresponding elements of the invention. The examples serve to explain the invention and do not limit the invention to the combinations of features indicated therein, even with respect to functional features . Moreover, any of the features disclosed in the above description as well as in the examples below may be considered in isolation and suitably combined with the features of any of the above embodiments and their further aspects . In particular, each of the features described above and below may be combined alone or in conjunction with others of the described features with the cleaning device according to the first aspect of the invention, the CVDNXW004DE0 21 . 03. 2025

[0083] 21

[0084] system according to the second aspect of the invention and the cleaning method according to the third aspect of the invention .

[0085] It is shown, at least partially schematically, in:

[0086] Fig. 1 an example of a process line for processing substrates;

[0087] Fig. 2 an example of a cleaning device being transported through a process chamber;

[0088] Fig. 3 an example of a cleaning device comprising a plurality of cleaning elements in a side view;

[0089] Fig. 4 an example of a cleaning device comprising a plurality of cleaning elements in a top view;

[0090] Fig. 5 an example of a cleaning device being at least partially electrostatically charged in a top view;

[0091] Fig. 6 another example of a cleaning device being at least partially electrostatically charged in a top view;

[0092] Fig. 7 an example of a brush-like cleaning roller; and

[0093] Fig. 8 an example of a method for cleaning a process chamber .

[0094] Figure 1 shows an example of a process line 1 for processing substrates 2 such as semiconductor wafers . The process line 1 comprises multiple processing stations 4, 6, 10 and a transport mechanism 12 for transporting substrate carriers 14 carrying the substrates 2 through the processing stations 4,NXW004DE0 21 . 03. 2025

[0095] 22

[0096] 6, 10 and / or between the processing stations 4, 6, 10, in particular from one processing station 4, 10 to the subsequent processing station 10, 6, e . g. from a pre-heating station 4 to a CVD apparatus 10 or from the CVD apparatus 10 to an annealing station 6 or the like .

[0097] The transport mechanism 12 may comprise entrainers 12a such as so-called transport taxis which are configured for taking the substrate carriers 14 along. Advantageously, the substrate carriers 14 are formed to cooperate with these entrainers 12a, e . g. to receive corresponding pins of the transport mechanism 12 or interact in another manner with the transport mechanism 12 in order to establish an operative connection coupling the substrate carrier 14 to the transport mechanism 12.

[0098] As indicated above, one of the processing stations shown in figure 1 is a (inline) chemical vapour deposition (CVD) apparatus 10. The CVD apparatus 10 comprises a substrate entry opening 16 for receiving substrates 2 carried by a substrate carrier 14. On an opposite side, the CVD apparatus 10 comprises a substrate exit opening 18 through which the processed substrates 2 leave the apparatus . A process chamber 20 is defined between the entry opening 16 and the exit opening 18. Within the process chamber 20, during operation, at least one process gas is inj ected from a plurality of openings 24 or nozzles of a so-called showerhead 22. In particular, the showerhead 22 is arranged within the process chamber 20 such that process gas streaming from the openings 24 hits the surface of a passing substrate 2, i . e . a substrate 2 moved through the process chamber 20 by means of the transport mechanism 12, such that the process gas can react with or decompose on the surface of said substrate 2 and form a thin, preferably epitaxial, film or material layer, respectively. The process gas can be supplied by means of a gas supply system 26. Excess gasNXW004DE0 21 . 03. 2025

[0099] 23

[0100] can be discharged by means of an exhaust system 28. In order to drive the reaction of the process gas with the substrates surface, a heating system 30 can be controlled to heat the passing substrates 2.

[0101] Figure 2 shows an example of a cleaning device 40 being transported through a process chamber 20 of a chemical vapour deposition apparatus 10 by means of a transport mechanism 12, in particular by means of an entrainer 12a, e . g. a so-called transport taxi . Specifically, the cleaning device 40 is transported through a slit formed by a showerhead 22 and e . g. a back wall 32, heating unit, separator wall or the like of the CVD apparatus 10 or the process chamber 20, respectively. The cleaning device 40 comprises at least one cleaning element 42 that comes into contact with the interior of the process chamber 20 upon moving through the process chamber 20, i . e . with components arranged on both sides of the transport path through the process chamber 20 such as the showerhead 22 and the back wall 32. The at least one cleaning element 42 may be, for example, a brush-like or sponge-like cleaning roller .

[0102] The cleaning device 40 comprises a drive mechanism 44 for driving a rotation of the cleaning element 42, although other modes of movement of the cleaning element 42 such as vibration or a back-and-forth movement are also feasible . In the present example, the drive mechanism 44 is a purely mechanical drive mechanism and comprises a gear mechanism 46 that induces rotation of the cleaning element 42 upon movement through the process chamber 20. To this end, the gear mechanism 46 has a toothed wheel 48 cooperating with a toothed rack 50 immobilised relative to the process chamber 20 or the CVD apparatus 10, respectively. For example, the toothed rack 50 may be fixedly arranged in or at the process chamber 20 or the CVDNXW004DE0 21 . 03. 2025

[0103] 24

[0104] apparatus 10, respectively. The gear mechanism 46 is preferably coupled with a shaft 52 of the cleaning element 42 in order to transmit the generated rotational motion to the cleaning roller 42 .

[0105] In the present example, the cleaning element 42 has a width d, particularly a diameter, such that during its operation, the cleaning element 42 comes into contact with the showerhead 22 and the back wall 32, i . e . fills the entire width of the slit formed between the showerhead 22 and the back wall 32. Accordingly, the cleaning element 42 may brush off particles from the surface of the showerhead 22 and the surface of the back wall 32 facing the cleaning element 42 simultaneously.

[0106] As the transport mechanism 12 moves the cleaning device 40 in a horizontal direction, here perpendicular to the figure plane of figure 2, the at least one cleaning element 42, i . e . its longitudinal axis or axis of rotation, respectively, is oriented perpendicular relative to said transport direction. Further, as shown in figure 2, the cleaning element 42 or its longitudinal axis or axis of rotation, respectively, may be inclined with respect to the vertical direction. For example, the cleaning element 42 may be inclined by an angle of up to 20° , preferably up to 10° , with respect to the vertical direction. This orientation is particularly preferable in the case of substrate carriers that carry substrates in such an orientation as well e . g. for reasons of stability, e . g. when the substrate is braced with its back facing away from the showerhead 22 against a part of the substrate carrier .

[0107] Figure 3 shows an example of a cleaning device 40 comprising a plurality of cleaning elements 42 in a side view. The cleaning elements 42 are arranged consecutively and in parallel to each other on a frame 54. The frame 54 houses a drive mechanism 44NXW004DE0 21 . 03. 2025

[0108] 25

[0109] formed by a gear mechanism 46 coupled to an electric motor 56. Preferably, the cleaning elements 42 are fabricated from different materials, and the gear mechanism 46 is configured to rotate the different cleaning elements 42 at different speeds . This allows to adapt the rotational speed of each cleaning element 42 to its respective material, i . e . to take the effect of the material on the surfaces to be cleaned into account . For example, it is conceivable to rotate a cleaning element 42 formed from a hard material at a lower speed than a subsequent cleaning element 42 fabricated from a soft material in order to prevent overly strong abrasion of the cleaned component .

[0110] Figure 4 shows an example of a cleaning device 40 comprising a plurality of cleaning elements 42 in a top view. As in figure 3, the cleaning elements 42 are arranged or seated within a frame 54. The cleaning elements 42 are arranged in a direction perpendicular to a transport direction of the cleaning device 40 when transported by means of a transport mechanism 12 through a process chamber of a CVD apparatus . Specifically, the cleaning elements 42 are arranged in a manner that allows each element 42 to come into contact with a component to be cleaned on one of the two opposing sides of the cleaning device 40. For example, one of the cleaning elements 42 shown in figure 4 may come into contact exclusively with a showerhead 22 of the CVD apparatus e . g. made from stainless steel, while another cleaning element 42 may come into contact exclusively with a back wall 32 or heating unit of the process chamber e . g. made from quartz glass or silicon carbide . Yet another one of the cleaning elements 42 may contact both the showerhead 22 and the back wall 32 or heating unit simultaneously. Accordingly, it is advantageous when the cleaning elements 42 are specifically configured for cleaning of a respective component of the CVD apparatus . For example, the cleaning elements 42 can be fabricated from different materials and / orNXW004DE0 21 . 03. 2025

[0111] 26

[0112] may comprise bristles of different length and / or arranged in in different distances to each other, as indicated by the different hatching.

[0113] In a configuration of the cleaning device 40 such as shown in figure 4, it is also conceivable to have at least some of the cleanings cleaning elements 42 to be spring-loaded in a direction perpendicular to both their longitudinal axis and the transport direction, i . e . to the right and left side in figure 4. By this means, the spring-loaded cleaning elements 42 can be pushed against a passing surface area within the process chamber when the cleaning device 40 is transported therethrough .

[0114] Figure 5 shows an example of a cleaning device 40 being electrostatically charged at least partially in a top view. The cleaning device 40 comprises two electrostatic catchers 68 seated in a frame 54 and being arranged adj acent to a rotating cleaning element 42 each, particularly behind the respective cleaning element 42 with respect to a transport direction through a process chamber formed between a showerhead 22 and a back wall 32 or heater . Additionally, the cleaning device 40 comprises two wipers 84 seated in the frame 54 and being arranged adj acent to a rotating cleaning element 42 each, particularly between the respective cleaning element 42 and the corresponding electrostatic cater 68. The cleaning device 40 is electrically coupled to a voltage source 70 by means of a tap 72 in form of an electrically conductive wheel 74 or bearing which runs on or otherwise contacts a guide rail 76. The guide rail 76 is preferably a part of a transport mechanism 12 for transporting the cleaning device 40 through the process chamber and forms a contact element 78 electrically connected to one pole of the voltage source 70. The other pole of the voltage source 70 is preferably electrically connected to theNXW004DE0 21 . 03. 2025

[0115] 27

[0116] showerhead 22 and the back wall 32 or heater, respectively. In order to prevent short-circuiting the voltage source 70, in the present example, the cleaning elements 42 are electrically insulating .

[0117] By means of the voltage source 70, a potential difference between the showerhead 22 and back wall 32 or heater, respectively, on the one hand and at least a part of the cleaning device 40, in particular the electrostatic catchers 68, can be created. This potential difference, i . e . the electrostatic charge, may attract particles brushed off the showerhead 22 and the back wall 32 or heater to the electrostatic catchers 68 .

[0118] In the present example, the electrostatic catchers 68 are each formed by a metallic plate . However, other shapes and materials for the electrostatic catchers 68 are conceivable as well .

[0119] The electrostatic catchers 68 are inclined with respect to the longitudinal direction of the frame 54 in order to increase their efficiency in catching particles brushed off the showerhead 22 or the back wall 32 or heater, respectively, by the rotating cleaning elements 42.

[0120] Advantageously, the wipers 84 are configured to support the detachment of particles electrostatically clinging to the surface of the cleaning elements 42, particularly bristles of brush-like cleaning elements 42 or rollers . To this end, the wipers 84, e . g. bars extending parallel to the longitudinal axis of the cleaning elements 42, can be arranged such that the bristles of the respective cleaning element 42 are bend, i . e . strained, when passing the respective wiper 84 . This may provide the bristles with additional impulse when they come free of the wiper 84, i . e . when the strain due to the bendingNXW004DE0 21 . 03. 2025

[0121] 28

[0122] suddenly vanishes . By means of this additional impulse, particles can be detached from the cleaning elements 42 and be catched reliably by the subsequent catcher 68.

[0123] Figure 6 shows another example of a cleaning device 40 being electrostatically charged at least partially in a top view. In contrast to the cleaning device 40 shown in figure 5, the contact element 78 for electrically coupling the cleaning device 40 to the voltage source 70 is formed by a dedicated contact bar 80 extending along the transport direction of the cleaning device 40 through the process chamber formed between the showerhead 22 and the back wall 32 or heater . The cleaning device 54 comprises a tap 72 in form of a sliding contact 82. The tap 72, in the present example, is electrically connected with the bodies 60 of the cleaning elements 42. Here, bristles 64 arranged on a lateral surface of the bodies 60 (indicated by the hatching) are electrically insulating and form an insulation layer between the bodies 60 and the showerhead 22 and back wall 32 or heater, respectively, thus preventing short-circuiting of the voltage source 70.

[0124] Similar to the example shown in figure 5, by means of the voltage source 70, a potential difference between the showerhead and back wall 32 or heater, respectively, on the one hand and at least a part of the cleaning device 40, in particular the bodies 60 of the cleaning elements 42, can be created. This potential difference, i . e . the electrostatic charge, may attract particles brushed off the showerhead 22 and the back wall 32 or heater to the bodies 60.

[0125] Figure 7 shows an example of a cleaning element 42 configured as a brush-like cleaning roller in a cross-sectional view. The cleaning element 42 comprises a particle compartment 58 formed by a cavity within a body 60 of the cleaning element 42. TheNXW004DE0 21 . 03. 2025

[0126] 29

[0127] particle compartment 58 is in fluid communication with the atmosphere around the cleaning element 42 by means of a plurality of openings 62 on a surface of the body 60. The openings 62, of which only a few are indicated by a reference numeral for reasons of clarity, are arranged between bristles 64 of the cleaning element 42. Again, only a few bristles 64 are indicated by reference numerals for reasons of clarity.

[0128] The cleaning element 42 further comprises a suction unit 66 for generating a gas flow through the openings 62 into the particle compartment 58. This allows to reliably transport particles brushed off a surface area within the process chamber of a CVD apparatus by the bristles 64 into the particle compartment 58.

[0129] Figure 8 shows an example of a method 100 for cleaning a process chamber of a chemical vapour deposition (CVD) apparatus by means of a cleaning device having at least one cleaning element .

[0130] In a method step SI, a temperature within the process chamber is lowered. For example, the temperature can be lowered from a process temperature of 1100°C to 1200°C during nominal operation of the CVD apparatus down to a cleaning temperature of approximately 900°C .

[0131] In a method step S2, an etching gas, e . g. hydrogen chloride (HC1) , is inj ected into the process chamber . At the cleaning temperature, the etching gas may prepare the process chamber interior for subsequent mechanical cleaning by loosening and / or already removing a large part of particles that have deposited on surfaces within the process chamber during nominal operation.NXW004DE0 21 . 03. 2025

[0132] 30

[0133] If required, the temperature within the process chamber may be reduced further in an optional method step S3. Whether this is necessary depends on the material of the cleaning device, particularly the at least one cleaning element of the cleaning device, utilised for mechanical cleaning of at least one surface area within the process chamber in subsequent method step S5. Preferably, the temperature is reduced only as much as required for thermal stability of the cleaning device, particularly the cleaning roller (s) .

[0134] In a method step S4, a pressure within the process chamber is reduced. Preferably, gas is discharged from the process chamber down to a predefined pressure threshold or below. This may be achieved by operating an exhaust system of the CVD apparatus, preferably at maximum capacity. Simultaneously, in order to enhance the gas flow out of the process chamber, a purge gas may be fed into the process chamber via the showerhead .

[0135] In method step S5, the cleaning device is operatively connected with a transport mechanism of the CVD apparatus that is intrinsically configured for transportation of substrate carriers through the process chamber . Subsequently, the cleaning device is transported through the process chamber by means of the transport mechanism. That is, during method step S5, the cleaning device replaces a substrate carrier .

[0136] Preferably, the at least one cleaning element is rotated during said transportation through the process chamber . To this end, a gear mechanism can be used that generates rotational motion from the relative movement of the cleaning device and the process chamber or CVD apparatus, respectively ("passive rotation") ; alternatively, an electric motor of the cleaning device may be used ("active rotation") .NXW004DE0 21 . 03. 2025

[0137] 31

[0138] Preferably, method step S4 is performed at least until method step S5 has been completed, i . e . until the cleaning apparatus has been moved out of the process chamber by means of the transport mechanism. Accordingly, the method steps S4 and S5 may overlap, i . e . may be performed simultaneously at least in parts, in order to make sure to suck particles brushed off the interior of the process chamber by means of the cleaning device out of the process chamber or at least reduce the risk of having these particles settle down in a different region of the process chamber after being brushed off .

[0139] The order of method steps SI to S5 as outlined above is not imperative . It is rather possible to exchange some of the steps, perform some of the steps at least partially in parallel and / or divide some steps into sub-steps, and perform some of these sub-steps earlier or later than outlined above . For example, it is possible to operatively connect the cleaning device with the transport mechanism before even lowering the temperature in the process chamber . Also, it is possible to lower the pressure in the process chamber simultaneously with lowering the temperature, and then - if the materials of the cleaning device allow - inj ect the etching gas simultaneously with moving the cleaning device through the process chamber, in order to shorten the overall cleaning process even more .NXW004DE0 21 . 03. 2025

[0140] 32

[0141] List of reference numerals

[0142] 1 process line

[0143] 2 substrate

[0144] 4, 6 processing station 10 CVD apparatus

[0145] 12 transport mechanism 12a entrainer

[0146] 14 substrate carrier

[0147] 16 entry opening

[0148] 18 exit opening

[0149] 20 process chamber

[0150] 22 showerhead

[0151] 24 opening or nozzle

[0152] 26 gas supply system

[0153] 28 exhaust system

[0154] 30 heating system

[0155] 32 back wall or heater 40 cleaning device

[0156] 42 cleaning element

[0157] 44 drive mechanism

[0158] 46 gear mechanism

[0159] 48 toothed wheel

[0160] 50 toothed rack

[0161] 52 shaft

[0162] 54 frame

[0163] 56 electric motor

[0164] 58 particle compartment 60 body

[0165] 62 opening

[0166] 64 bristle

[0167] 66 suction unit

[0168] 68 electrostatic catcherNXW004DE0 21 . 03. 2025

[0169] 70 voltage source

[0170] 72 tap

[0171] 74 wheel or bearing

[0172] 76 guide rail

[0173] 78 contact element

[0174] 80 contact bar

[0175] 82 sliding contact

[0176] 84 wiper

[0177] 100 method

[0178] 51 lowering temperature

[0179] 52 inj ecting etching gas

[0180] 53 lowering temperature

[0181] 54 reducing pressure

[0182] S5 operatively connecting cleaning device

[0183] d width

Claims

NXW004DE0 21 . 03 . 202534Patent claims1 . A cleaning device ( 40 ) for a chemical vapour deposition apparatus ( 10 ) having a process chamber ( 20 ) and a transport mechanism ( 12 ) for transporting substrate carriers ( 14 ) through said process chamber ( 20 ) , said cleaning device ( 40 ) comprising at least one cleaning element ( 42 ) for mechanically cleaning at least one surface area within the process chamber ( 20 ) of the chemical vapour deposition apparatus ( 10 ) ,c h a r a c t e r i s e d i n t h a tthe cleaning device ( 40 ) is configured for an operative connection with the transport mechanism ( 12 ) of the chemical vapour deposition apparatus ( 10 ) such that the cleaning device ( 40 ) is transportable through the process chamber ( 20 ) of the chemical vapour deposition apparatus ( 10 ) by means of said transport mechanism ( 12 ) .2 . The cleaning device ( 40 ) according to claim 1 , c h a r a c t e r i s e d b ya frame ( 54 ) on which the at last one cleaning element ( 42 ) is arranged, said frame ( 54 ) being configured for an operative connection with the transport mechanism ( 12 ) .3 . The cleaning device ( 40 ) according to any one of the preceding claims ,c h a r a c t e r i s e d i n t h a tthe cleaning device ( 40 ) is configured such that the at least one cleaning element ( 42 ) is arranged substantially perpendicular to a transport direction upon transportation through the process chamber ( 20 ) by means of the transport mechanism ( 12 ) .NXW004DE0 21 . 03 . 2025354 . The cleaning device ( 40 ) according to any one of the preceding claims ,c h a r a c t e r i s e d b ya drive mechanism ( 44 ) for driving a rotation of the at least one cleaning element ( 42 ) during transportation through the process chamber ( 20 ) .

5. The cleaning device ( 40 ) according to claim 4 , c h a r a c t e r i s e d i n t h a tthe drive mechanism ( 44 ) is a purely mechanical mechanism, wherein rotation of the at least one cleaning element ( 42 ) is driveable by the relative movement of the cleaning device ( 40 ) relative to the process chamber ( 20 ) during transportation through the process chamber ( 20 ) .

6. The cleaning device ( 40 ) according to claim 4 , c h a r a c t e r i s e d i n t h a tthe drive mechanism ( 44 ) includes at least one electric motor ( 56 ) for driving the rotation of the at least one cleaning element ( 42 ) .7 . The cleaning device ( 40 ) according to any one of the preceding claims ,c h a r a c t e r i s e d b ya plurality of cleaning elements ( 42 ) arranged consecutively and in parallel to each other, wherein said cleaning elements ( 42 ) are made of di f ferent materials and / or are arranged in di f ferent distances relative to a transport plane and / or comprise bristles ( 64 ) of di f ferent length and / or in di f ferent distances to one another .8 . The cleaning device ( 40 ) according to claim 7 and any one of claims 4 to 6 ,c h a r a c t e r i s e d i n t h a tNXW004DE0 21 . 03 . 202536the drive mechanism ( 44 ) is configured to drive a rotation of the plurality of cleaning elements ( 42 ) , wherein at least some of the cleaning elements ( 42 ) are driven with di f ferent rotational speeds .9 . The cleaning device ( 40 ) according to any one of the preceding claims ,c h a r a c t e r i s e d b yat least one particle compartment ( 58 ) for collecting and storing particles brushed of f the interior of the at least one surface area within the process chamber ( 20 ) .10 . The cleaning device ( 40 ) according to claim 9 , c h a r a c t e r i s e d i n t h a tthe at least one particle compartment ( 58 ) is integrated into the at least one cleaning element ( 42 ) .11 . The cleaning device ( 40 ) according to any one of claims 9 or 10 ,c h a r a c t e r i s e d b ya suction unit ( 66 ) for sucking particles brushed o f f the interior of the process chamber ( 20 ) into the particle compartment ( 58 ) .12 . The cleaning device ( 40 ) according to any one of the preceding claims ,c h a r a c t e r i s e d b yat least one wiper ( 84 ) arranged for wiping particles of f the at least one cleaning element ( 42 ) by relative movement of the at least one cleaning element ( 42 ) relative to the at least one wiper ( 84 ) .NXW004DE0 21 . 03 . 20253713 . The cleaning device ( 40 ) according to any one of the preceding claims ,c h a r a c t e r i s e d b ya tap ( 72 ) being arranged for electrically contacting a contact element ( 78 ) arranged along a transport direction of the cleaning device ( 40 ) during transport through the process chamber ( 20 ) such that the cleaning device ( 40 ) is electrostatically chargeable at least partially during transport through the process chamber ( 20 ) .14 . The cleaning device ( 40 ) according to claim 13 , c h a r a c t e r i s e d i n t h a tthe tap ( 72 ) is electrically connected to a body ( 60 ) of the at least one cleaning element ( 42 ) .

15. The cleaning device ( 40 ) according to any one of the preceding claims ,c h a r a c t e r i s e d b yat least one electrostatic catcher ( 68 ) arranged adj acent to the at least one cleaning element ( 42 ) , said electrostatic catcher ( 68 ) being configured for electrostatically catching particles brushed of f the interior of the process chamber ( 20 ) .

16. The cleaning device ( 40 ) according to any one of the preceding claims ,c h a r a c t e r i s e d i n t h a tthe at least one cleaning element ( 42 ) is configured to simultaneously clean more than one component ( 22 , 30 , 32 ) of the chemical vapour deposition apparatus ( 10 ) arranged within the process chamber ( 20 ) .17 . The cleaning device ( 40 ) according to any one of the preceding claims ,NXW004DE0 21 . 03 . 202538c h a r a c t e r i s e d i n t h a tthe at least one cleaning element ( 42 ) comprises a brushlike rotatable roller .18 . The cleaning device ( 40 ) according to any one of the preceding claims ,c h a r a c t e r i s e d i n t h a tthe at least one cleaning element ( 42 ) is fabricated at least partially from fiberglass , silica filament and / or silica fabric .

19. A chemical vapour deposition system, comprising a chemical vapour deposition apparatus ( 10 ) having a process chamber ( 20 ) and a transport mechanism ( 12 ) for transportation of substrate carriers ( 14 ) through said process chamber ( 20 ) ,c h a r a c t e r i s e d b ya cleaning device ( 40 ) according to any one of the preceding claims .20 . The chemical vapour deposition system according to claim 19 ,c h a r a c t e r i s e d b ya voltage source ( 70 ) electrically connected to at least one component ( 22 , 32 ) within the process chamber ( 20 ) on the one hand and a contact element ( 78 ) extending along a transport direction of the cleaning device ( 40 ) through the process chamber ( 20 ) on the other hand, the contact element ( 78 ) being configured for being electrically contacted by at least a part of the cleaning device ( 40 ) when the cleaning device ( 40 ) is transported through the process chamber ( 20 ) .NXW004DE0 21 . 03 . 20253921 . The chemical vapour deposition system according to claim 20 ,c h a r a c t e r i s e d i n t h a tthe contact element ( 78 ) is a guide rail ( 76 ) for guiding the cleaning device ( 40 ) and / or substrate carriers ( 14 ) during transport through the process chamber ( 20 ) or a contact bar ( 80 ) for being electrically contacted by a contact ( 82 ) of the cleaning device ( 40 ) .22 . A method ( 100 ) for cleaning a process chamber ( 20 ) of a chemical vapour deposition apparatus ( 10 ) , comprising :- Operatively connecting ( S5 ) a cleaning device ( 40 ) , in particular according to any one of claims 1 tol 8 , with a transport mechanism ( 12 ) of the chemical vapour deposition apparatus ( 10 ) , said transport mechanism ( 12 ) being configured for transporting substrate carriers ( 14 ) through the process chamber ( 20 ) ; and- transporting the cleaning device ( 40 ) through the process chamber ( 20 ) by means of said transport mechanism ( 12 ) , such that at least one cleaning element ( 42 ) of said cleaning device ( 40 ) mechanically cleans at least one surface area within the process chamber ( 20 ) of the chemical vapour deposition apparatus ( 10 ) .23 . The method ( 100 ) according to claim 22 , c h a r a c t e r i s e d i n t h a ta temperature within the process chamber ( 20 ) is reduced ( S I ) prior to transporting the cleaning device ( 40 ) through the process chamber ( 20 ) .24 . The method ( 100 ) according to any one of claims 22 or 23 , c h a r a c t e r i s e d i n t h a tprior to transporting the cleaning device ( 40 ) through theNXW004DE0 21 . 03 . 202540process chamber ( 20 ) , a pressure in the process chamber ( 20 ) is reduced ( S4 ) down to or below a predefined threshold, and during transporting the cleaning device ( 40 ) through the process chamber ( 20 ) , gas is discharged from the process chamber ( 20 ) by means of a process chamber exhaust system ( 28 ) of the chemical vapour deposition apparatus ( 10 ) .

25. The method ( 100 ) according to any one of claims 22 to 24 , c h a r a c t e r i s e d i n t h a tprior to and / or during transporting the cleaning device ( 40 ) through the process chamber ( 20 ) , an etching gas is inj ected ( S2 ) into the process chamber ( 20 ) .

26. The method according to any one of claims 22 to 25 , c h a r a c t e r i s e d i n t h a tthe cleaning device ( 40 ) is electrostatically charged at least partially during transport through the proces s chamber ( 20 ) by electrically connecting a voltage source ( 70 ) with at least one component ( 22 , 32 ) within the process chamber ( 20 ) on the one hand and at least a part of the cleaning device ( 40 ) on the other hand .

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