Temperature control assembly

Abstract

A temperature control assembly for controlling a temperature of a semiconductor process equipment is provided. The temperature control assembly comprises: a first modular device of a series chain of modular devices, the first modular device having a temperature change device for changing the temperature of the semiconductor process equipment, a condition sense device, a power input configured to receive power to power the first modular device and a power output configured to supply power to a second modular device in the series chain of modular devices, wherein the condition sense device is configured to cause the power output to supply power to the second modular device when a predetermined condition has been met.

Description

[0001]

[0002] TEMPERATURE CONTROL ASSEMBLY

[0003] FIELD OF THE INVENTION

[0004] The field of the invention relates to a temperature control assembly.

[0005] BACKGROUND

[0006] Semiconductor process equipment may require thermal management for proper operation. This may be for example heating to avoid generation of gaseous byproducts, some of which may be prone to condensation of process gases, or particles collecting for example on vacuum pump walls or connecting pipes of the semiconductor process equipment, which can cause blockages. Although techniques exist for temperature control, they can have shortcomings.

[0007] Accordingly, it is desired to provide for an improved technique for temperature control.

[0008] SUMMARY

[0009] In a first aspect there is provided a temperature control assembly for controlling a temperature of a semiconductor process equipment, comprising: a first modular device of a series chain of modular devices, the first modular device having a temperature change device for changing the temperature of the semiconductor process equipment, a condition sense device for sensing a condition, a power input configured to receive power to power the first modular device and a power output configured to supply power to a second modular device in the series chain of modular devices, wherein the condition sense device is configured to cause the power output to supply power to the second modular device when a predetermined condition has been met.

[0010] The first aspect recognises that certain heating or cooling elements of a temperature control assembly for controlling the temperature of the semiconductor process equipment, such as, for example, Positive Thermal Coefficient (PTC) heaters, can have a large surge start-up current which reduces significantly once at their operating temperature. Also, multiple heating or cooling

[0011]

[0012] elements are typically used to cover a large area, requiring a large amount of wiring and expensive equipment at start-up such as high-capacity power supplies and large wire gauges. Conventionally, this has been addressed using power supply voltage control to start with a low voltage which steadily increases. This allows a larger number of heaters and / or coolers to be used without requiring expensive equipment. However, large transformers or variable power supplies may be required, which can reduce power efficiency in part due to power supply components used to control the voltage, resulting in a longer start-up time.

[0013] Alternatively, sequencer circuits may be used which directly start-up individual heaters or coolers. This is more cost effective than power supply voltage control, although this typically requires a multitude of additional cables, cable routings, cable connections, and extensions to run from the power source to the individual heaters or coolers.

[0014] Accordingly, a temperature control assembly is provided. The assembly may be for controlling a temperature of a semiconductor process equipment. The assembly may comprise: a first modular device of a series chain or sequence of individual or separate modular, unitary or component devices. The first modular device may have a temperature change device. The temperature change device may be for changing the temperature of the semiconductor process equipment. The first modular device may have a condition sense device. The condition sense device may be configured to sense a condition. The first modular device may have a power input configured to receive power to power the first modular device. The first modular device may have a power output configured to supply power to a second modular device in the series chain of modular devices. The condition sense device may be configured to cause, enable or activate the power output to provide or supply power to the second modular device when a predetermined condition has been met. In this way, by providing modular devices which are arranged in series or in a daisy chain enables each modular device to supply power to the next when a condition has been met which reduces the peak power load by cascading, sequentially controlling or delaying the startup of the individual modular devices. Also, this enables the provision of identical

[0015]

[0016] modular devices which allows manufacturing complexity to be reduced.

[0017] Furthermore, by wiring the temperature control modular devices in series, the amount of wiring can be reduced making the assembly simpler to set up. In addition, there is no requirement for complex equipment to provide power supply voltage control or for the complex wiring required for sequencer circuits.

[0018] The power input may be coupled to the temperature change device and configured to cause or enable power to be supplied to the temperature change device. The temperature change device may be coupled with the power output via the condition sense device. Power from the temperature change device must therefore be allowed to pass through the condition sense device before it is supplied to the power output and second modular device. The condition sense device therefore controls when power from the temperature change device will be supplied to the power output and in turn the second modular device. The predetermined condition may be a threshold temperature of the condition sense device being exceeded. The threshold temperature can be adjusted to be similar to the target temperature of the temperature change device. Thus, the temperature change device will be powered to heat the first modular device to a target temperature before the condition sense device allows power to then pass to the second modular device. This provides a relatively simple, passive way to achieve the power surge control discussed above.

[0019] The condition sense device may be an NTC (Negative Temperature Coefficient) thermistor or a thermal switch.

[0020] The condition sense device may be coupled with the power input and may be configured to cause or enable power to be supplied or provided to the temperature change device when the predetermined condition has been met. The condition sense device may be coupled with the power input and may be configured to cause or enable power to be supplied or provided to the second modular device when the predetermined condition has been met. In other words, the condition sense device may supply power to both the temperature change

[0021]

[0022] device and the second modular device when the predetermined condition has been met. Alternatively, the condition sense device may supply power to the temperature change device but only supply power to the second modular device when the predetermined condition has been met. Using an adjustable predetermined condition allows the start-up process to be optimised for the particular application and equipment.

[0023] The predetermined condition may comprise a timing interval being exceeded. The predetermined condition may comprise a timing interval since power was received by the power input being exceeded. The predetermined condition may comprise a timing interval since power was received by the temperature change device being exceeded. Hence, simple timing intervals can be used to control the supply of power.

[0024] The predetermined condition may comprise a temperature of the temperature change device exceeding a temperature threshold amount. The predetermined condition may comprise a temperature of the temperature change device falling below a temperature threshold amount. The predetermined condition may comprise a rate of change of temperature of the temperature change device falling below a rate of change threshold amount. Hence, simple changes in temperature can be used to control the supply of power.

[0025] The predetermined condition may comprise a power consumed by the temperature change device falling below a power threshold amount. Hence, simple changes in power can be used to control the supply of power.

[0026] The condition sense device may comprise a timer configured to measure the timing interval. The condition sense device may comprise a temperature sensor configured to measure the temperature of the temperature change device. The condition sense device may comprise a power sensor configured to measure a power consumed by the temperature change device. Advantageously, incorporating one or more sensors into the condition sense device allows the

[0027]

[0028] predetermined condition to be effectively customised to a particular application and could allow for sensing of telemetry data which may help diagnosing issues, or optimising the equipment.

[0029] The condition sense device may comprise processing logic. Advantageously, processing logic allows more complex predetermined conditions to be used which may further increase efficiency.

[0030] The processing logic may be configured to receive an indication of that number of modular devices preceding it in the series chain of modular devices. The processing logic may be configured to determine its number in the series chain of modular devices based on the indication of that number of modular devices preceding it in the series chain of modular devices. The processing logic may be configured to provide that number to the second modular device.

[0031] Advantageously, determining the number of the modular device its location in the series can enable predetermined conditions to be adjusted for that modular device to increase the efficiency of the assembly and can enable failure conditions to be more accurately identified and associated with that modular device.

[0032] The processing logic may be configured to receive an indication of a cumulative or overall power consumption of modular devices preceding it in the series chain of modular devices. The processing logic may be configured to determine an updated cumulative power consumption based on its power consumption and the cumulative power consumption of modular devices preceding it in the series chain of modular devices. Advantageously, by communicating cumulative power consumption to the modular devices, predetermined conditions can be adjusted to increase the efficiency or performance of the assembly, and failure conditions can be more accurately identified.

[0033] The processing logic may be configured, based on the cumulative power consumption, to vary the timing interval. The processing logic may be

[0034]

[0035] configured, based on the cumulative power consumption, to vary the temperature threshold amount. The processing logic may be configured, based on the cumulative power consumption, to vary the rate of change threshold amount. The processing logic may be configured, based on the cumulative power consumption, to vary the power threshold amount. The processing logic may be configured, based on the cumulative power consumption, to vary the power supplied to the temperature change device. Advantageously, allowing the processing logic to change operations depending on physical conditions can improve the safety or performance of the assembly.

[0036] The processing logic may be configured to cause the power output to cease supplying power to the second modular device when the updated cumulative power consumption exceeds a safety threshold amount. Hence, should the power consumption be too high, those modular devices coupled with the power output may be prevented from being powered to improve safety. More generally, the processing logic in the condition sense device has control over the power output of the modular device which means that that part of the system can be safely shut down when a condition is met.

[0037] The processing logic may be configured to transmit a fault indication to a preceding modular device in the series chain of modular devices on occurrence of a fault condition comprising the updated cumulative power consumption exceeding the safety threshold amount. The processing logic may be configured to transmit a fault indication to a preceding modular device in the series chain of modular devices on occurrence of a fault condition comprising the temperature of the temperature change device failing to exceed the temperature threshold amount by a threshold time interval. The processing logic may be configured to transmit a fault indication to a preceding modular device in the series chain of modular devices on occurrence of a fault condition comprising the rate of change of temperature of the temperature change device failing to fall below the rate of change threshold amount by a threshold time interval. The processing logic may be configured to transmit a fault indication to a preceding modular device in the

[0038]

[0039] series chain of modular devices on occurrence of a fault condition comprising the power consumed by the temperature change device failing to fall below the power threshold amount by a threshold time interval. The processing logic may be configured to transmit a fault indication to a preceding modular device in the series chain of modular devices on occurrence of a fault condition comprising failure to detect power consumption by the second modular device by a threshold time interval. Advantageously, communicating along the series chain that a fault has occurred within the assembly can allow the system to respond quickly to safety issues.

[0040] The processing logic may be configured to encode an indication of the fault condition in the fault indication. Advantageously, the fault condition indication can provide the operator with information to help diagnose issues or more efficiently operate the assembly.

[0041] The processing logic may be configured to encode an indication of its number in the series chain of modular devices in the fault indication. Advantageously, encoding location information in the fault indication can help the operator diagnose issues more effectively.

[0042] The processing logic may be configured to convey a fault indication received from the second modular device to the preceding modular device in the series chain of modular devices. Advantageously, the fault indications can be transmitted along the series chain towards the power source and operator.

[0043] The processing logic may be configured to transmit a temperature indication encoding an indication of a temperature of the temperature change device. The processing logic may be configured to transmit an indication of its number in the series chain of modular devices to a preceding modular device in the series chain of modular devices. Advantageously, indicating temperature can allow the operator to diagnose issues more effectively.

[0044]

[0045] The processing logic may be configured to convey a temperature indication received from the second modular device to the preceding modular device in the series chain of modular devices. Advantageously, the temperature indication can be transmitted along the series chain towards the power source and operator.

[0046] The temperature change device may be coupled with the power input.

[0047] Advantageously, the temperature change device can operate using appropriate power specifications, provided via the power input which can transform power to comply with said appropriate power specifications.

[0048] The temperature change device may be coupled with the power input via the condition sense device. Advantageously, the condition sense device can control the operation of the temperature change device based on processing of external stimuli.

[0049] The temperature change device may comprise a heater configured to increase the temperature of the semiconductor process equipment. The temperature change device may comprise a cooler configured to decrease the temperature of the semiconductor process equipment. Advantageously, the temperature control assembly can be used in a wide range of semiconductor process applications where heating or cooling is required.

[0050] The temperature change device may comprise a plurality of temperature change components. Advantageously, multiple, often identical, temperature change components can be used which reduces manufacturing complexity and provides a greater area of temperature control coverage on the target object.

[0051] The temperature change device may comprise a flexible conductive sleeve thermally couplable with a conduit of the semiconductor process equipment conveying a semiconductor process gas. Advantageously, using a flexible sleeve can allow the temperature change device to be wrapped around conduits,

[0052]

[0053] thereby increasing the contact surface area and the efficiency of the temperature control.

[0054] The temperature control assembly may comprise the series chain of modular devices. Advantageously, wiring modular devices in series reduces the amount of wiring required for operation.

[0055] The temperature control assembly may comprise a controller coupled with a first in the series chain of modular devices. Advantageously, using an, often single, controller in combination with the data transfer over power cables allows the user to manually control the assembly from one place while also reducing wiring.

[0056] The controller may be configured to provision the modular devices of the series chain of modular devices with the timing interval. The controller may be configured to provision the modular devices of the series chain of modular devices with the temperature threshold amount. The controller may be configured to provision the modular devices of the series chain of modular devices with the rate of change threshold amount. The controller may be configured to provision the modular devices of the series chain of modular devices with the power threshold amount. The controller may be configured to provision the modular devices of the series chain of modular devices with the safety threshold. The controller may be configured to provision the modular devices of the series chain of modular devices with the threshold time interval. Advantageously, the controller can set the predetermined conditions on the modular devices which means the operator can adjust the operation of the assembly quickly and efficiently.

[0057] The controller may be configured to provide a user with an indication of a power consumption of the series chain of modular devices. The controller may be configured to provide a user with an indication of the temperature of each temperature change device. The controller may be configured to provide a user

[0058]

[0059] with an indication of the fault indication. Advantageously, the indication can allow the operator to quickly and efficiently monitor the conditions of the assembly.

[0060] In a second aspect there is provided a method of controlling a temperature of a semiconductor process equipment, comprising: providing a first modular device of a series chain of modular devices, the first modular device having a temperature change device for changing the temperature of the semiconductor process equipment, a condition sense device for sensing a condition, a power input configured to receive power to power the first modular device and a power output configured to supply power to a second modular device in the series chain of modular devices; and causing the power output to supply power to the second modular device when a predetermined condition has been met.

[0061] The method may comprise coupling the condition sense device with the power input and may comprise causing power to be supplied to the temperature change device when the predetermined condition has been met.

[0062] The method may comprise coupling the condition sense device with the power input and may comprise causing power to be supplied to the second modular device when the predetermined condition has been met.

[0063] The predetermined condition may comprise whether a timing interval is exceeded.

[0064] The predetermined condition may comprise whether a timing interval since power was received by the power input is exceeded. The predetermined condition may comprise whether a timing interval since power was received by the temperature change device is exceeded. The predetermined condition may comprise whether a temperature of the temperature change device exceeds a temperature threshold amount. The predetermined condition may comprise whether a temperature of the temperature change device falls below a temperature threshold amount. The predetermined condition may comprise whether a rate of

[0065]

[0066] change of temperature of the temperature change device falls below a rate of change threshold amount. The predetermined condition may comprise whether a power consumed by the temperature change device falls below a power threshold amount.

[0067] The condition sense device may comprise a timer and the method may comprise measuring the timing interval with the timer. The condition sense device may comprise a temperature sensor and the method comprises measuring the temperature of the temperature change device with the temperature sensor. The condition sense device may comprise a power sensor and the method comprises measuring a power consumed by the temperature change device with the power sensor.

[0068] The condition sense device may comprise processing logic.

[0069] The method may comprise receiving an indication of a number of modular devices preceding it in the series chain of modular devices. The method may comprise determining its number in the series chain of modular devices based on the indication of a number of modular devices preceding it in the series chain of modular devices. The method may comprise providing that number to the second modular device.

[0070] The method may comprise receiving an indication of a cumulative power consumption of modular devices preceding it in the series chain of modular devices. The method may comprise determining an updated cumulative power consumption based on its power consumption and the cumulative power consumption of modular devices preceding it in the series chain of modular devices.

[0071] The method may comprise, based on the cumulative power consumption, varying the timing interval. The method may comprise, based on the cumulative power consumption, varying the temperature threshold amount. The method may

[0072]

[0073] comprise, based on the cumulative power consumption, varying the rate of change threshold amount. The method may comprise, based on the cumulative power consumption, varying the power threshold amount. The method may comprise, based on the cumulative power consumption, varying the power supplied to the temperature change device. The method may comprise causing the power output to cease supplying power to the second modular device when the updated cumulative power consumption exceeds a safety threshold amount.

[0074] The method may comprise transmitting a fault indication to a preceding modular device in the series chain of modular devices on occurrence of a fault condition comprising the updated cumulative power consumption exceeding the safety threshold amount. The method may comprise transmitting a fault indication to a preceding modular device in the series chain of modular devices on occurrence of a fault condition comprising the temperature of the temperature change device failing to exceed the temperature threshold amount by a threshold time interval. The method may comprise transmitting a fault indication to a preceding modular device in the series chain of modular devices on occurrence of a fault condition comprising the rate of change of temperature of the temperature change device failing to fall below the rate of change threshold amount by a threshold time interval. The method may comprise transmitting a fault indication to a preceding modular device in the series chain of modular devices on occurrence of a fault condition comprising the power consumed by the temperature change device failing to fall below the power threshold amount by a threshold time interval. The method may comprise transmitting a fault indication to a preceding modular device in the series chain of modular devices on occurrence of a fault condition comprising failure to detect power consumption by the second modular device by a threshold time interval.

[0075] The method may comprise encoding an indication of the fault condition in the fault indication.

[0076]

[0077] The method may comprise encoding an indication of the number in the series chain of modular devices in the fault indication.

[0078] The method may comprise conveying a fault indication received from the second modular device to the preceding modular device in the series chain of modular devices.

[0079] The method may comprise transmitting a temperature indication encoding an indication of a temperature of the temperature change device and an indication of the number in the series chain of modular devices to a preceding modular device in the series chain of modular devices.

[0080] The method may comprise conveying a temperature indication received from the second modular device to the preceding modular device in the series chain of modular devices.

[0081] The method may comprise coupling the temperature change device with the power input.

[0082] The method may comprise coupling the temperature change device with the power input via the condition sense device.

[0083] The temperature change device may comprise a heater configured to increase the temperature of the semiconductor process equipment.

[0084] The temperature change device may comprise a cooler configured to decrease the temperature of the semiconductor process equipment.

[0085] The temperature change device may comprise a plurality of temperature change components.

[0086]

[0087] The temperature change device may comprise a flexible conductive sleeve thermally couplable with a conduit of the semiconductor process equipment conveying a semiconductor process gas.

[0088] The method may comprise providing the series chain of modular devices.

[0089] The method may comprise coupling a controller with a first in the series chain of modular devices.

[0090] The method may comprise provisioning the modular devices of the series chain of modular devices with the timing interval.

[0091] The method may comprise provisioning the modular devices of the series chain of modular devices with the temperature threshold amount.

[0092] The method may comprise provisioning the modular devices of the series chain of modular devices with the rate of change threshold amount.

[0093] The method may comprise provisioning the modular devices of the series chain of modular devices with the power threshold amount.

[0094] The method may comprise provisioning the modular devices of the series chain of modular devices with the safety threshold.

[0095] The method may comprise provisioning the modular devices of the series chain of modular devices with the threshold time interval.

[0096] The method may comprise providing a user with an indication of a power consumption of the series chain of modular devices.

[0097] The method may comprise providing a user with an indication of the temperature each temperature change device.

[0098]

[0099] The method may comprise providing a user with an indication of the fault indication.

[0100] Further particular and preferred aspects are set out in the accompanying independent and dependent claims. Features of the dependent claims may be combined with features of the independent claims as appropriate, and in combinations other than those explicitly set out in the claims.

[0101] Where an apparatus feature is described as being operable to provide a function, it will be appreciated that this includes an apparatus feature which provides that function or which is adapted or configured to provide that function.

[0102] BRIEF DESCRIPTION OF THE DRAWINGS

[0103] Embodiments of the present invention will now be described further, with reference to the accompanying drawings, in which:

[0104] FIG. 1 shows a temperature control assembly including a controller according to an embodiment;

[0105] FIG. 2 shows a temperature control assembly according to an embodiment; and FIG. 3 shows a modular device according to an embodiment; and

[0106] FIG. 4 shows a temperature control assembly according to another embodiment.

[0107]

[0108] DESCRIPTION OF THE EMBODIMENTS

[0109] Before discussing the embodiments in any more detail, first an overview will be provided. Embodiments provide a temperature control assembly and method for sequentially initiating the start-up process of a plurality of modular devices, each comprising one or more temperature change devices (TOD) which may be a heater and / or a cooler. The modular devices are typically arranged generally in series, with power to a modular device being selectively provided by a preceding modular device in the series. Each modular device has a temperature change device which operates to control the temperature of, for example, semiconductor process equipment or other apparatus and a condition sense device which operates to sense a particular condition such as, for example, the elapse of a timing period, achieving a temperature and / or a power consumption of that modular device being below a threshold amount. The modular device can operate with two main approaches. In a first approach, when the modular device receives power from a preceding modular device, it delays powering its temperature change device and providing power to the next modular device until after the timing period has elapsed. In a second approach, when the modular device receives power from the preceding modular device, it powers its temperature change device but delays providing power to the next modular device until after a predetermined condition has elapsed. Whichever approach is used, only one modular device performs its start-up process at any time, which helps to reduce the peak load consumed by the temperature control assembly. Typically, data may be communicated between modular devices. The data may be the provisioning of the condition(s) to be sensed by the condition sense device of a particular modular device, safe operation parameters and / or an indication of the current operational conditions of the temperature control assembly. The data may also be telemetry relating to the operation of a particular modular device and / or fault conditions experienced by a particular modular device. That data is conveyed or relayed between modular devices, typically to or from a controller under the control of, or to provide an indication to, a user.

[0110]

[0111] FIG. 1 shows an embodiment of the temperature control assembly 100. The temperature control assembly 100 may for example be multiple flexible sections or modular devices 110-112 wrapped around different sections of a semiconductor process equipment (not shown), connected in series or sequence or ‘daisy-chained’ via insulated wires, starting at an optional controller 160 having a power supply 1660. The controller 160 may be linked to a screen 1650 or comprise a computer displaying information about the temperature control assembly 100. The modular devices 110-112 have a Power Input (PI) 140, a Condition Sense Device (CSD) 130, a Temperature Control Device (TCD) 120 such as a heater and / or cooler to heat and / or cool the portion of the semiconductor process equipment in the proximity of the modular devices 110-112, and a Power Output (PO) 150. Once a predetermined condition is met, a modular device allows power to pass through to the following or next modular device in the series chain.

[0112] The controller 160 comprises a power supply 1660 and processing logic 1680. The controller 160 is connected to the screen 1650. The controller 160 connects and provides power to the first modular device 110, and therefore interfaces with the PI 140 of the first modular device 100. The PI 140 interfaces with the CSD 130. In this example, the TCD 120 comprises a heater 1220 comprising heating units 1221 connected in series, and a cooler 1240 comprising cooling units 1241 connected in series. However, only a heater 1220 or only a cooler 1240 may be provided and these may comprise fewer units. The CSD 130 comprises processing logic 1380 and a sensor such as a temperature sensor 1320, a timer 1340, and / or a power sensor 1360. These sensors may operate in conjunction with the processing logic 1380 to determine whether a predetermined condition has been met. The TCD 120 interfaces with the CSD 130, with power being supplied to the TCD 120 from the CSD 130. One or both of the TCD 120 and CSD 130 interface, and therefore provide power to, the PO 150 of the first modular device 110, which in turn interfaces with the PI of second modular device 111 connected in series with the first modular device 110. The second modular device 111 typically has identical features to the first but may be

[0113]

[0114] configured differently with a different predetermined condition, and interfaces in series with the next modular device in the series, which ends with the nth modular device 112.

[0115] The temperature sensor 1320, timer 1340 and power sensor 1360 within the CSD 130 are examples of potential sensors which may be used to measure whether the predetermined condition has been met and that power should be supplied to the PO 150 to provide power to the successive connected modular devices and / or to the TCD 120. Other sensors may be incorporated into the CSD 130 such as pressure sensors, accelerometers, ultrasonic sensors, light sensors, humidity sensors, gas sensors, magnetic sensors, force sensors, and / or displacement sensors.

[0116] In operation, the temperature control assembly 100 operates by sequentially starting the series of modular devices 110-112. In a basic configuration, each of the modular devices 110-112 are preconfigured with just a single sensor, such as the timer 1340, and with the same predetermined condition such as a time period of 1 minute. Power is supplied to the first modular device 110 via the PI 140, which passes to the CSD 130. The CSD manages power supplied to the TCD 120 which is powered to adjust the temperature of the semiconductor processing equipment. Once the time period elapses, the TCD 120 and / or the CSD 130 provide power to the PO 150, which provides power to the PI of the second modular device 111, and so on. In other configurations, each of the modular devices 110-112 are preconfigured with just a single sensor, such as the temperature sensor 1340 or the power sensor 1360 and with the same predetermined condition such as threshold temperature or threshold power consumption. Power is supplied to the first modular device 110 via the PI 140, and the TCD 120 is powered via the CSD 130 to adjust the temperature of the semiconductor processing equipment. Once the temperature has exceeded the threshold temperature or the power consumption drops below the threshold power consumption, the CSD 130 provides power to the PO 150, which provides power to the PI of the second modular device 111, and so on. In other

[0117]

[0118] configurations, more than one sensor may be provided and the predetermined condition may be a combination of conditions. Also, in other configurations, the different modular devices may be provided with different sensors and / or with different predetermined conditions.

[0119] As mentioned above, the heater 1220 may comprise one or more of a heating units 1221 , connected via wiring or circuitry which may be in series or parallel or otherwise. The heating unit 1221 may be any device which converts electrical power into heat, creates a heat flux which results in heating and / or raises the temperature of the target object to a desired level. The heating unit 1221 may comprise one or more of: a carbon heater, a ceramic heater, a flexible heater, a halogen heater, an immersion heater, an induction heater, a metal-sheathed heater, a mica heater, PTC (Positive Temperature Coefficient) heater, a resistive wire (such as nichrome), and an infrared heater. The individual heating unit 1221 may typically affect or operate over a portion or smaller area of the target object within the vicinity of the heating unit 1221. The cooler 1240 may comprise one or more cooling units 1241 connected via wiring or circuitry which may be in series or parallel or otherwise. The cooling unit 1241 may be any device which converts electrical power into a heat flux which results in cooling and / or reduces the temperature of the target object to the desired level. The cooling unit 1241 may comprise one or more of: an absorption chiller, an air conditioner, a cryogenic cooler, an evaporative cooler, a fan, a flexible cooler, a heat exchanger, a liquid cooling system, a Peltier cooler, a phase change material system, a refrigeration unit, and a thermoelectric cooler. The individual cooling unit 1241 may typically affect or operate over a portion or smaller area of the target object within the vicinity of the cooling unit. The TCD 120 may also comprise a thin layer or a flexible conductive sleeve thermally couplable with, or wrapped around, the target object. The heater / cooler units 1221 / 1241 may be distributed over the surface area of the flexible conductive sleeve or otherwise in a grid pattern separated by a certain spacing, wired in series or parallel or otherwise. The distribution of heaters / coolers 1220 / 1240 or constituent heating / cooling units 1221 / 1241 may be such that the heat flux or heating or temperature change caused by the TCD 120

[0120]

[0121] is evenly distributed or unevenly distributed to target a certain region of the target object in the vicinity of the TCD 120. Each modular device 110-112 is connected via a circuit generally in series and controls the temperature of the portion of the target object in the vicinity of that modular device with its TCD. The target object may be any object which requires thermal management. The target object may be semiconductor process equipment such as piping or a conduit, which may be over a large industrial scale, and may convey or carry process gas. The TCD 120 receives electrical power and causes a heat flux of a nearby vicinity region of the target object on which the TCD 120 may be attached, which causes the target object to gain or lose heat to reach the desired temperature.

[0122] As mentioned above, the PI 140 may be coupled with any form of power source. This may be by interfacing with a PO 150 of a previous modular device in the series, the controlled 60, mains electricity or a generator providing an alternating or direct current power source. The PI 140 may comprise hardware or other means to provide or transform the received power into power of the correct specification (i.e. voltage, current, frequency, etc.) in order to operate as intended.

[0123] The PO 150 may provide any form of interface to provide outgoing power to any external devices or apparatuses. External devices or apparatuses may be another modular device or controller, or any other electronic or electrical equipment. The PO 150 may comprise hardware or other means to provide or transform incoming power into power of the correct specification (i.e. voltage, current, frequency, etc.) in order to operate as intended.

[0124] As mentioned above, the OSD 130 may comprise logic to allow for efficient operation. The CSD 130 may comprise at least one processor 1380, at least one memory including computer program code, and, optionally, at least one communication module, the at least one memory and computer program code configured, with the at least one processor, and the at least one communication module, to cause the CSD 130 to perform its intended function. The CSD 130

[0125]

[0126] may comprise any processing, sensors, or other logic in the form of electrical or electronic circuitry such as via a delay circuit using transistors, capacitors, and diodes; a temperature detection circuit using a thermistor or otherwise; a circuit to measure electrical parameters such as voltage, current, frequency; a microcontroller; or otherwise. The CSD 130 may use artificial intelligence or other computing techniques to improve operation. The CSD 130 may be implemented via software on an external or cloud server. The CSD 130 may be responsible for the level of limiting or throttling, the time taken, and processing of any possible collected or calibrated sensor data to determine the optimum control conditions to be performed by constituent parts of the modular device. The logic employed by the CSD 130 may be calibrated to achieve different possible aims such as to maximise the semiconductor process equipment temperature change rate in a certain area, or to operate using certain equipment, or with a certain rating of power supply, or to allow the start-up process to take a certain duration of time. The CSD may be coupled with the PI and be configured to cause an amount of incoming power from or via the PI to be supplied to the TCD and one or more connected modular devices such as the next modular device in series, when a predetermined condition has been met.

[0127] The CSD 130 may receive an indication of a number of modular devices preceding it in the series chain of modular devices, determine its number in the circuit or series chain of modular devices based on the indication of a number of modular devices preceding, or its location in general, and provide that number or location indication to the second or later modular device. This allows each modular device to be uniquely identified. The CSD 130 may receive an indication of a safe power consumption threshold amount (typically from the controller 160) and a current cumulative power consumption of preceding modular devices in the series chain of modular devices in the temperature control assembly 100 (typically provided by either the controller 160 or the first modular device in the series periodically). The CSD 130 may determine its current power consumption, and add this to the current cumulative power consumption. The CSD 130 may perform a certain action such as vary the power supplied to the TCD 120, or

[0128]

[0129] update the predetermined condition or any thresholds based on indications received by the CSD 130. The indications may come from the controller 160, or the controller 160 may provide information, instructions, computer code, or otherwise to instruct the CSD to perform a certain action or update the predetermined condition. Those indications may be associated with a particular modular device by including an indication of the number of the modular device for which that indication is associated. The CSD 130 may transmit or receive information, instructions, computer code, or otherwise to instruct or be instructed by another CSD in the circuit or series chain of modular devices. These instructions may cause the CSD to perform the action or update the predetermined condition. Similarly, the CSD may perform the action or update the predetermined condition based on the location or other information (such as cumulative power consumption) or sensor data. The action may be to cause the PO 150 to be disabled or to disable the CSD next in series based on a condition such as, for example, the cumulative power consumption exceeding a safe threshold. The CSD 130 may also transmit a temperature indication encoding an indication of the temperature of the TCD 120 or other operational or telemetry data to one or more of the connected modular devices. For example, the CSD 130 may transmit an indication of the temperature of the TCD 120 together with the number of the modular device via the PI 140 for receipt by the controller 160. Any such transmissions received by the CSD via the PO 150 are conveyed via the PI 140. Such transmissions may be performed by encoding the messages and utilizing, for example, powerline communications.

[0130] The predetermined condition or logic may involve a measurement from any of the contained processing logic or sensors such as a time interval measurement (e.g. an elapsed time exceeding a value), a temperature measurement (e.g. a temperature at a location exceeding or falling below a value), or an electrical parameter or power measurement, integrator or differentiator circuitry to determine rates or cumulative values (e.g. a rate of change of temperature exceeds or falls below a threshold). Predetermined conditions may also involve a combination of multiple factors possibly using logic gates or other more complex

[0131]

[0132] logic, for example if the detected power exceeds a threshold and a timer exceeds a threshold, or for example if the rate of change of temperature is below a threshold and a timer exceeds a threshold and the modular device is in a certain position in the circuit or series chain of modular devices.

[0133] The CSD 130 may be configured to detect a predetermined fault condition and perform a certain action such as transmitting a fault indication to the controller or other CSD of another modular device, or disabling the PI 140, TCD 123, or PO 150. The fault condition may trigger a rebooting procedure or may require a certain number of faults from a number of sensors or processing logic to be triggered to perform the action. Fault conditions may for example involve one or more of the updated cumulative power consumption exceeding a safety threshold, or the temperature of the TCD 120 failing to exceed a temperature threshold in a certain time, or the rate of change of temperature of the TCD 120 failing to fall below a rate of change threshold in a given time interval, or the CSD 130 detecting that a connected modular device is not drawing any power. The transmitted fault indication may encode one or more of an indication of the condition which has caused the fault, or an indication of its number in the series of modular devices. The CSD 130 may also transmit or convey the fault indication of another modular device or CSD to another modular device, CSD, or the controller 160.

[0134] The controller 160 is an optional feature which can be used to: supply power of a suitable nature to modular devices in the circuit or series of modular devices, optionally provide the user with an indication of system parameters, optionally allow the user to control modular device parameters such as temperatures or transmit action requests, predetermined condition or threshold changes to one or more of the modular devices, or allow the user to target heating or cooling of a certain part of the target object. The controller 160 may comprise at least one processor, at least one memory including computer program code, and at least one communication module, the at least one memory and computer program code configured, with the at least one processor, and the at least one

[0135]

[0136] communication module, to cause the controller to perform its intended function. The controller 160 may operate via a cloud server and / or use artificial intelligence or other techniques to perform its intended function. The controller 160 may provide one or more modular devices with one or more of: a timing interval, temperature threshold, rate of change of temperature threshold, power threshold, safety threshold, and a threshold time interval. The controller 160 may have an indicator which can provide an indication to an operator via one or more of: a monitor, projector, printer, speaker, lights, LEDs, LED display, haptic feedback device, a VR headset, or any other means of displaying information. The indicator or controller 160 may also comprise a method of obtaining user input requests such as via one or more of: a keyboard, mouse, touchscreen, microphone, webcam, scanner, controller, or any other means of obtaining user input requests. The user input requests may be used to assist or control the controller 160 operation, or the operation of one or more modular devices 110-112 in the temperature control assembly 100. The indicator may indicate to the user any parameters or information from any aspect of the temperature control assembly 100, such as one or more of: a power consumption of the circuit or series chain of modular devices 110-112, the temperature of each TCD, the fault indication.

[0137] The modular device 110-112 may be contained in one physical object or may comprise multiple connected objects. The modular device may be at least partially contained in the aforementioned flexible sleeve of the TCD 120.

[0138] All interfaces, wiring, electrical or other communication connection may instead be facilitated by information transfer via wireless transmission such as Bluetooth (low energy or otherwise), or Wi-Fi, possibly in combination with battery powered components to provide electrical power at each locality.

[0139] FIG. 2 shows a simple realisation of the temperature control assembly 200 of FIG. 1 comprising a modular device 210 according to an embodiment comprising a PI 240, TCD 220, CSD 230, and PO 250. This modular device 210 may be

[0140]

[0141] configured as a small potted circuit with a heater attachment, in one or more interconnected parts, possibly including a flexible TCD 120. The modular devices would typically be connected in series to form an entire temperature control assembly 200 or system, such that each individual device 210 is configured to release its inputted power to the next device or devices in series.

[0142] The modular device 210 receives power using the PI 240, which interfaces with the TCD 220 and / or CSD 230. The TCD 220 is used to heat or cool the vicinity depending on the semiconductor process equipment requirements. The modular device can then control outputting power via the PO 250 using logic provided by the CSD 230. In the simplest embodiment, the CSD 230 prevents power being supplied to the successive modular device in series until a predetermined condition is met.

[0143] FIG. 3 shows an example implementation of a modular device 310 which would cause the power release of each modular device 310 to be staggered based on a time interval. This shows an example circuit implementation of the PI 340, CSD 330, TCD 320 and PO 350 of the modular device shown in FIG. 2. The circuit may be enclosed in a housing and / or potted. The circuit prevents power from being supplied to the TCD 320 a certain period of time after being received by the PI 340.

[0144] In operation, power is received by the PI 340, which powers the CDS 330. The CSD 330 waits a given time, which in this case corresponds to the predetermined condition. Once the time condition has been met, the live current can pass to the TCD 320 which will allow the heater or cooler to engage and start approaching the target temperature, and the live current can also pass through to the next modular device in series. The next modular device in series would then similarly enable a timer circuit to wait a given time before the cycle repeats.

[0145] In summary, embodiments build on the sequence power start for high current start heater elements by simplifying the installation and makes the overall system

[0146]

[0147] more modular, the temperature control assembly may utilise a self-powered small timer circuit that is part of the heater assembly, either by incorporating this as part of the power lead and / or incorporating this in the electrical connector itself.

[0148] FIG. 4 shows another embodiment of the temperature control assembly 100’. This embodiment is the same as that of FIG. 1 except that the Condition Sense Device (CSD) 130’ has been changed as discussed below. The other elements of the temperature control assembly 100’ and its overall functions (e.g., to be wrapped around and control the temperature of sections of semiconductor process equipment) are the same as described in FIG. 1 and where appropriate the same elements have been denoted with the same reference numerals. As such, these common elements will not be discussed in detail again, except for where they are differences in their connection and interaction with the CSD 130’.

[0149] In contrast to FIG. 1, the PI 140 is electrically coupled directly to the TCD 120, which is then electrically coupled to the PO 150 via the CSD 130’. In other words, the PI 140, TCD 120, CSD 130’ and PO 150 are electrically connected in series (and in this order) with each other. The CSD 130’ has been simplified, by replacing the processor and sensors with a more “passive” device that will only allow power to be supplied to the PO 150 and second modular device 111 when a predetermined condition is met. Specifically, the CSD 130’ is a device that under a threshold temperature will not permit power to flow, but that over the threshold temperature will permit (or start to permit) power to flow. Such devices are known, and the CSD 130’ could be a thermal switch or an NTC (Negative Temperature Coefficient) thermistor or the like.

[0150] In such devices, the threshold temperature can be modified as required (as known in the art), and so can be correlated to the target temperature of the TCD 120. In this way, the TCD 120 will heat the modular device 110 (and thus the CSD 130’) to the threshold temperature, and only then will power be allowed to proceed from the first modular device 110 to the second modular device 111. The CSD 130’ of the second modular device 111 will then operate before passing

[0151]

[0152] power to the third modular devices 112 and so on. Thus, sequentially starting the series of modular devices 110-112 and preventing large current surges thereby can be achieved.

[0153] In the FIG. 4 embodiment, the use of an NTC (Negative Temperature Coefficient) thermistor can provide additional benefit as its nature is to gradually decrease resistance as temperature increases. This means the threshold temperature can be tuned so that a smooth increase in power is allowed to flow as the threshold temperature is reached / passed. This can reduce the likelihood of large amounts of current suddenly being allowed to flow between the modular devices 110-112, which can help further protect the assembly from unnecessarily tripping safety mechanisms (such as circuit breakers or fuses). A specifically tuned NTC thermistor for this purpose may however be more expensive to manufacture than a simpler device such as a thermal switch, and so both these embodiments have their relative pros and cons.

[0154] Although illustrative embodiments of the invention have been disclosed in detail herein, with reference to the accompanying drawings, it is understood that the invention is not limited to the precise embodiment and that various changes and modifications can be affected therein by one skilled in the art without departing from the scope of the invention as defined by the appended claims and their equivalents.

[0155]

[0156] REFERENCE SIGNS

[0157] 100, 100’, 200 Temperature control assembly 110, 111, 112, 210, 310 Modular device

[0158] 120, 220, 320 Temperature Change Device (TCD) 130, 130’, 230, 330 Condition Sense Device (CSD) 140, 240, 340 Power Input (PI)

[0159] 150, 250, 350 Power Output (PO)

[0160] 160 Controller

[0161] 1220 Heater

[0162] 1221 Heating unit

[0163] 1240 Cooler

[0164] 1241 Cooling unit

[0165] 1320 Temperature sensor

[0166] 1340 Timer

[0167] 1360 Power sensor

[0168] 1380 Processing logic

[0169] 1650 Indicator

[0170] 1660 Power supply

[0171] 1680 Processing logic

Claims

CLAIMS1. A temperature control assembly for controlling a temperature of a semiconductor process equipment, comprising:a first modular device of a series chain of modular devices, said first modular device havinga temperature change device for changing said temperature of said semiconductor process equipment,a condition sense device for sensing a condition,a power input configured to receive power to power said first modular device anda power output configured to supply power to a second modular device in said series chain of modular devices,wherein said condition sense device is configured to cause said power output to supply power to said second modular device when a predetermined condition has been met.

2. The temperature control assembly of claim 1, wherein said power input is coupled to said temperature change device, said temperature change device is coupled with said power output via said condition sense device, and said predetermined condition is a threshold temperature of the condition sense device being exceeded.

3. The temperature control assembly of claim 1 or 2, wherein said condition sense device is an NTC (Negative Temperature Coefficient) thermistor or a thermal switch.

4. The temperature control assembly of claim 1, wherein said condition sense device is coupled with said power input and is configured to cause power to be supplied to at least one of said temperature change device and said second modular device when said predetermined condition has been met.

5. The temperature control assembly of claim 1 or 4, wherein said predetermined condition comprises at least one of:a timing interval is exceeded;a timing interval since power was received by said power input is exceeded;a timing interval since power was received by said temperature change device is exceeded;a temperature of said temperature change device exceeds a temperature threshold amount;a temperature of said temperature change device falls below a temperature threshold amount;a rate of change of temperature of said temperature change device falls below a rate of change threshold amount; anda power consumed by said temperature change device falls below a power threshold amount.

6. The temperature control assembly of claim 1, 4 or 5, wherein said condition sense device comprises processing logic, and said processing logic is configured to receive an indication of a number of modular devices preceding it in said series chain of modular devices, determine its number in said series chain of modular devices based on said indication of a number of modular devices preceding it in said series chain of modular devices and provide that number to said second modular device.

7. The temperature control assembly of claim 6, wherein said processing logic is configured to receive an indication of a cumulative power consumption of modular devices preceding it in said series chain of modular devices, determine an updated cumulative power consumption based on its power consumption and said cumulative power consumption of modular devices preceding it in said series chain of modular devices.

8. The temperature control assembly of claim 7, when dependent on claim 5, wherein said processing logic is configured, based on said cumulative power consumption, to vary at least one of:said timing interval;said temperature threshold amount;said rate of change threshold amount;said power threshold amount; andsaid power supplied to said temperature change device.

9. The temperature control assembly of claim 7 or 8, wherein said processing logic is configured to cause said power output to cease supplying power to said second modular device when said updated cumulative power consumption exceeds a safety threshold amount.

10. The temperature control assembly of any one of claims 1 and 4 to 9, wherein said temperature change device is coupled with said power input via said condition sense device.

11. The temperature control assembly of any preceding claim, wherein said temperature change device comprises a flexible conductive sleeve thermally couplable with a conduit of said semiconductor process equipment conveying a semiconductor process gas.

12. The temperature control assembly of any preceding claim, comprising a controller coupled with a first in said series chain of modular devices.

13. The temperature control assembly of claim 12 when dependent on claim 4, wherein said controller is configured to provision said modular devices of said series chain of modular devices with at least one of:said timing interval;said temperature threshold amount;said rate of change threshold amount;said power threshold amount;said safety threshold; andsaid threshold time interval.

14. The temperature control assembly of claim 12 or 13, wherein said controller is configured to provide a user with an indication of at least one of: a power consumption of said series chain of modular devices;said temperature each temperature change device;said fault indication.

15. A method of controlling a temperature of a semiconductor process equipment, comprising:providing a first modular device of a series chain of modular devices, said first modular device having a temperature change device for changing said temperature of said semiconductor process equipment, a condition sense device for sensing a condition, a power input configured to receive power to power said first modular device and a power output configured to supply power to a second modular device in said series chain of modular devices; andcausing said power output to supply power to said second modular device when a predetermined condition has been met.

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