Electronic component and motor drive device

Abstract

In the past, foreign matter such as cutting fluid has adhered to terminals of an electronic component and adversely affected the performance of the electronic component.　An electronic component 50 comprises: a pair of terminals 62 and 88 that have continuity with each other, said terminals being respectively provided on a first surface 68 and a second surface 98 facing each other; and a protective wall 102 extending from one of the first surface 68 and the second surface 98 to the other and surrounding the pair of terminals 62 and 88.

Description

Electronic component and motor drive device

[0001] The present disclosure relates to an electronic component and a motor drive device.

[0002] There is known an electronic component including a printed circuit board on which a terminal is mounted (for example, Patent Document 1).

[0003] Japanese Unexamined Patent Application Publication No. 2016-1643

[0004] Conventionally, foreign substances such as cutting fluid may adhere to terminals of an electronic component, which affects the performance of the electronic component.

[0005] In one aspect of the present disclosure, the electronic component includes a pair of terminals that are respectively provided on a first surface and a second surface facing each other and are electrically connected to each other, and a protective wall that extends from one of the first surface and the second surface to the other and surrounds the periphery of the pair of terminals.

[0006] It is a block diagram of a motor drive device according to an embodiment. It is a circuit diagram of a motor drive device according to an embodiment. It is an exploded perspective view of an electronic component according to an embodiment. It is an enlarged perspective view of the voltage dividing resistor module shown in FIG. 3. It shows a voltage dividing resistor circuit incorporated in the voltage dividing resistor module shown in FIG. 4. It is an enlarged perspective view enlarging a main part of the substrate shown in FIG. 3. It shows a state where the voltage dividing resistor module shown in FIG. 3 is mounted on a substrate. It is a cross-sectional view cut along VIII-VIII in FIG. 7. It is an exploded perspective view of an electronic component according to another embodiment. It is a cross-sectional view showing a state where the voltage dividing resistor module shown in FIG. 9 is mounted on a substrate. It is an exploded perspective view of an electronic component according to still another embodiment. It is a cross-sectional view showing a state where the voltage dividing resistor module shown in FIG. 11 is mounted on a substrate. It is an exploded perspective view of an electronic component according to still another embodiment. It is an exploded perspective view of an electronic component according to still another embodiment. It is a perspective view of a substrate according to still another embodiment.

[0007] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the various embodiments described below, the same elements will be denoted by the same reference numerals, and redundant explanations will be omitted. First, a motor drive device 10 according to one embodiment will be described with reference to Figures 1 and 2. The motor drive device 10 drives a servo motor 12 provided on an industrial machine (industrial robot, machine tool, etc.) in response to a command from a controller (not shown).

[0008] Specifically, the motor drive unit 10 comprises an AC power supply 14, a converter 16, an inverter 18, a control unit 20, and electronic components 50. The AC power supply 14 outputs a three-phase AC voltage. The converter 16 rectifies the AC voltage output by the AC power supply 14 and converts it into a DC voltage. The inverter 18 converts the DC voltage output by the converter 16 into a three-phase AC current and outputs it to the servo motor 12.

[0009] Figure 2 shows an example of the electrical circuit of the motor drive device 10. The converter 16 includes a plurality of rectifier diodes 22, while the inverter 18 includes a plurality of switching elements 24. A capacitor 26 is interposed on the output side of the converter 16. The output side of the converter 16 is generally referred to as the DC link 28.

[0010] In this embodiment, the electronic component 50 is a voltage sensor that detects the voltage V of the motor drive device 10. The electronic component 50 may be configured to detect the voltage V at any point in the electrical circuit of the motor drive device 10. For example, in the example shown in Figure 2, the electronic component 50A is configured to detect the voltage V at the output terminal of the AC power supply 14.

[0011] Meanwhile, electronic components 50B, 50C, and 50D are provided to detect the voltage V of the DC link 28. Specifically, electronic component 50B is provided to detect the voltage V at the output terminal of the converter 16. Electronic component 50C is provided to detect the voltage V between the high-potential terminal on the output side of the capacitor 26 and ground, while electronic component 50D is provided to detect the voltage V between the low-potential terminal on the output side of the capacitor 26 and ground.

[0012] In this way, the electronic components 50 (50A to 50D) detect the voltage V at any point in the electrical circuit of the motor drive unit 10 and supply it to the control unit 20 as a detection signal S. The control unit 20 has an IC chip or the like and controls the three-phase AC current output to the servo motor 12 based on the detection signal S output by the electronic components 50, thereby controlling the power (specifically, current) supplied to the servo motor 12. The control unit 20 also monitors for abnormalities (for example, overvoltage or undervoltage of voltage V) based on the detection signal S. The control unit 20 may also generate an alarm signal when it detects an abnormality. The servo motor 12 is rotated according to the AC current supplied from the motor drive unit 10 to operate the industrial machine.

[0013] Next, the configuration of the electronic component 50 will be described with reference to Figures 3 to 6. The electronic component 50 comprises a voltage divider resistor module 52 and a substrate 54. As shown in Figures 4 and 5, the voltage divider resistor module 52 has a housing 56, a plurality of terminals 58, 60 and 62, and a plurality of voltage divider resistors 64 and 66. The housing 56 is a roughly cubic hollow member made of resin or the like, and houses the voltage divider resistors 64 and 66 inside. The housing 56 has a surface 68, a side surface 70 connected to one edge of the surface surface 68, and a side surface 72 on the opposite side from the side surface 70, connected to the other edge of the surface surface 68.

[0014] Terminal 58 is a conductive member (for example, a metal such as a copper alloy) with an L-shaped cross-section, and is attached to the surface 68 and side 70 of the housing 56 so as to extend from the surface 68 to the side 70. Terminal 60 is a conductive member (such as a copper alloy) having the same shape as terminal 58, and is attached to the surface 68 and side 72 of the housing 56 so as to extend from the surface 68 to the side 72. Terminal 62 is a conductive member (such as a copper alloy) having a substantially square outer shape, and is attached to the surface 68 of the housing 56 so as to be located between terminals 58 and 60. The width (or area) of terminal 62 is smaller than that of terminals 58 and 60.

[0015] Figure 5 shows a voltage divider resistor circuit 80 built into the voltage divider resistor module 52. The voltage divider resistors 64 and 66 are connected in series between terminals 74 and 76. Specifically, voltage divider resistor 64 is interposed between terminal 74 and voltage divider resistor 66 and has a resistance value Ω1 on the order of several hundred [kΩ]. On the other hand, voltage divider resistor 66 is interposed between terminal 76 and voltage divider resistor 64 and has a resistance value Ω2 (≪Ω1) on the order of several hundred [Ω], which is much smaller than that of voltage divider resistor 64. Terminal 78 is electrically connected to the wiring between voltage divider resistors 64 and 66. In this embodiment, terminal 74 is electrically connected to terminal 58, terminal 76 is electrically connected to terminal 60, and terminal 78 is electrically connected to terminal 62.

[0016] Referring to Figures 3 and 6, the substrate 54 is, for example, a printed wiring board (PWB) or printed circuit board (PCB), and has a main plate 82, a plurality of terminals 84, 86 and 88, a plurality of wirings 90, 92 and 94, and a conductive hole 96 that penetrates the main plate 82. The main plate 82 is an insulating flat plate member having a rectangular outer shape, and has a surface 98 and a back surface 100 opposite to the surface 98.

[0017] Terminals 84, 86, and 88 are provided on the surface 98 of the main body plate 82 by printing or the like. Specifically, terminals 84 and 86 are made of solder having a roughly rectangular shape and are arranged spaced apart from each other. On the other hand, terminal 88 is made of solder having a roughly square shape and is arranged between terminals 84 and 86. The length (or area) of terminal 88 in the width direction is smaller than that of terminals 84 and 86.

[0018] Wires 90 and 92 are provided on the surface 98 of the main body plate 82 by printing or the like, while wire 94 is provided on the back surface 100 of the main body plate 82 by printing or the like. Wire 90 is led out from terminal 84, and wire 92 is led out from terminal 86. The conductive hole 96 penetrates from the surface 98 to the back surface 100 of the main body plate 82, and connects terminal 88 and wire 94 electrically. Wire 90 is electrically connected to a first terminal (not shown) to which the voltage V of the object to be detected is applied, while wire 92 is electrically connected to a second terminal (not shown). Wire 94 is also electrically connected to the control unit 20 described above via an A / D converter (not shown).

[0019] During operation of industrial machinery, conductive foreign matter such as cutting fluid or minute chips may be generated. To prevent the entry of such foreign matter, in this embodiment, the electronic component 50 is equipped with a protective wall 102 (Figure 3). Specifically, the protective wall 102 has a metal wall 104 provided on the surface 68 of the housing 56 of the voltage divider resistor module 52 and a solder wall 106 provided on the surface 98 of the substrate 54 (specifically, the main body plate 82).

[0020] As shown in Figure 4, the metal wall 104 is made of a metal such as a copper alloy and is provided on the surface 68 of the housing 56 so as to protrude from the surface 68. The metal wall 104 may be made of the same material as the terminals 58, 60, and 62. The metal wall 104 extends in a substantially rectangular shape so as to surround the entire circumference of the terminal 62. The metal wall 104 is positioned at a distance from the terminals 58, 60, and 62, thereby insulating it from the terminals 58, 60, and 62.

[0021] On the other hand, as shown in Figure 6, the solder wall 106 is provided on the surface 98 of the main plate 82 by printing or the like so as to protrude from the surface 98, and extends in a substantially rectangular shape to surround the entire perimeter of the terminal 88. The solder wall 106 is positioned away from the terminals 84, 86 and 88, thereby insulating it from the terminals 84, 86 and 88.

[0022] The voltage divider resistor module 52 is mounted on the circuit board 54 by soldering. Figures 7 and 8 show the state in which the voltage divider resistor module 52 is mounted on the circuit board 54. When mounting the voltage divider resistor module 52, first the manufacturer (worker or robot) places the voltage divider resistor module 52 on the circuit board 54 such that the terminals 58, 60, and 62 of the voltage divider resistor module 52 are in contact with the terminals 84, 86, and 88 of the circuit board 54, respectively, and the metal wall 104 is in contact with the solder wall 106.

[0023] Next, the manufacturer heats the voltage divider resistor module 52 and the substrate 54 in a heating device to heat and melt the solder. As a result, terminal 84 of the substrate 54 is soldered to terminal 58 of the voltage divider resistor module 52, forming a pair of interconnected terminals 58 and 84. Also, terminal 86 of the substrate 54 is soldered to terminal 60 of the voltage divider resistor module 52, forming a pair of interconnected terminals 60 and 86. Furthermore, terminal 88 of the substrate 54 is soldered to terminal 62 of the voltage divider resistor module 52, forming a pair of interconnected terminals 62 and 88, and this pair of terminals 62 and 88 and the wiring 94 are interconnected via the interconnection hole 96.

[0024] At this time, the pair of terminals 58 and 84 and terminal 74 in Figure 5 become electrically connected, and the pair of terminals 62 and 88 and terminal 78 in Figure 5 become electrically connected. As a result, the voltage divider resistor 64 is interposed between the pair of terminals 58 and 84 and the pair of terminals 62 and 88. In addition, the pair of terminals 60 and 86 and terminal 76 in Figure 5 become electrically connected, as a result, the voltage divider resistor 66 is interposed between the pair of terminals 60 and 86 and the pair of terminals 62 and 88.

[0025] Furthermore, as shown in Figure 8, the surface 68 of the housing 56 and the surface 98 of the substrate 54 (specifically, the main body plate 82) face each other with a small gap in between. The solder wall 106 is soldered to the metal wall 104 by heating and melting, and is integrally bonded to the metal wall 104. The protective wall 102 is formed by the metal wall 104 and the solder wall 106, which are thus bonded to each other.

[0026] The protective wall 102 extends from the surface 68 of the housing 56 to the surface 98 of the substrate 54, surrounding the pair of terminals 62 and 88. More specifically, the protective wall 102 extends in a rectangular shape around the entire perimeter of the pair of terminals 62 and 88, defining a sealed space 108 together with the surfaces 68 and 98. The pair of terminals 62 and 88 are housed within this sealed space 108 and are sealed from the outside.

[0027] On the other hand, the pair of terminals 58 and 84 and the pair of terminals 60 and 86 are located outside the protective wall 102. Furthermore, in this embodiment, the metal wall 104 and solder wall 106 that constitute the protective wall 102 are made of different materials from the surface 68 (i.e., the housing 56) and the surface 98 (i.e., the main body plate 82).

[0028] Next, the function of the electronic component 50 as a voltage sensor will be described. The voltage V to be detected is applied to the wiring 90. The pair of terminals 58 and 84 receive the voltage V input through the wiring 90. The voltage V applied to the pair of terminals 58 and 84 is divided by the voltage divider resistor 64 and applied to the pair of terminals 62 and 88 through terminal 78. The pair of terminals 62 and 88 output the divided voltage V' as a detection signal S.

[0029] The detection signal S (i.e., the analog signal of the divided voltage V') is input to the A / D converter through the conduction hole 96 and the wiring 94, where it is converted into a digital signal. The detection signal S is then supplied to the control unit 20 as a digital signal. In this way, the electronic component 50 detects the voltage V of the motor drive device 10 and outputs the detection signal S to the control unit 20.

[0030] As described above, in the electronic component 50, the pair of terminals 62 and 88 are provided on the surfaces 68 and 98 that face each other, and the protective wall 102 extends from one surface 68 and 98 to the other, surrounding the pair of terminals 62 and 88. Such a protective wall 102 can effectively prevent foreign matter such as cutting fluid from adhering to the pair of terminals 62 and 88.

[0031] Furthermore, in the electronic component 50, the protective wall 102 extends around the entire circumference of the pair of terminals 62 and 88, defining a sealed space 108 that, together with the surfaces 68 and 98, seals the pair of terminals 62 and 88. With this configuration, even if a highly permeable foreign substance (such as cutting fluid) is present around the electronic component 50, it is possible to reliably prevent the foreign substance from reaching the pair of terminals 62 and 88.

[0032] Furthermore, in the electronic component 50, the protective wall 102 (specifically, the metal wall 104 and the solder wall 106) is made of a different material (for example, copper alloy and solder) than the surface 68 (specifically, the resin housing 56) and the surface 98 (specifically, the insulating main body plate 82). With this configuration, a material suitable for blocking foreign matter can be used for the protective wall 102.

[0033] Furthermore, in the electronic component 50, the protective wall 102 has a metal wall 104 provided on the surface 68 and a solder wall 106 provided on the surface 98 and soldered to the metal wall 104 to form the protective wall 102 together with the metal wall 104. With this configuration, a protective wall 102 that is tightly bonded without gaps between the surfaces 68 and 98 can be formed by a simple process of soldering the solder wall 106 to the metal wall 104, and the manufacturing process of the electronic component 50 can be automated. Therefore, electronic components 50 equipped with a protective wall 102 that provides high shielding against foreign matter can be effectively mass-produced.

[0034] Furthermore, in the electronic component 50, in addition to the pair of terminals 62 and 88, other pairs of terminals 58 and 84, 60 and 86, respectively, are provided on the surfaces 68 and 98 and are located outside the protective wall 102. This configuration prevents the pair of terminals 62 and 88 and the other pairs of terminals 58 and 84, 60 and 86 from short-circuiting between the surfaces 68 and 98 due to foreign matter.

[0035] Furthermore, in the electronic component 50, the voltage divider resistor 64 is interposed between a pair of terminals 62 and 88 and another pair of terminals 58 and 84. The other pair of terminals 58 and 84 receive a voltage V input, and the pair of terminals 62 and 88 output the voltage V' divided by the voltage divider resistor 64 as a detection signal S. This configuration prevents the pair of terminals 62 and 88 from short-circuiting with the other pair of terminals 58 and 84 due to foreign matter, thereby ensuring that the voltage V input to the other pair of terminals 58 and 84 is reliably divided by the voltage divider resistor 64. Therefore, the electronic component 50 can detect the voltage V with high accuracy as a voltage sensor.

[0036] Furthermore, in the electronic component 50, the voltage divider resistor module 52 has a housing 56 that includes a surface 68 on which one terminal 62 of the pair of terminals 62 and 88 is provided, and voltage divider resistors 64 and 66 housed inside the housing 56. The substrate 54 has a surface 98 on which the other terminal 88 of the pair of terminals 62 and 88 is provided, wiring 94 provided on the back surface 100 opposite to the surface 98 for transmitting a detection signal S, and a conduction hole 96 that penetrates from the surface 98 to the back surface 100 and allows the pair of terminals 62 and 88 and the wiring 94 to conduct electricity.

[0037] With this configuration, the voltage divider resistors 64 and 66 (or the voltage divider resistor circuit 80) are modularized to form a voltage divider resistor module 52, making it easier to automate the process of mounting them on the substrate 54. Therefore, the electronic component 50 as a voltage sensor can be mass-produced efficiently. In addition, the detection signal S output from the pair of terminals 62 and 88 surrounded by the protective wall 102 can be transmitted to external equipment (specifically, an A / D converter and a control unit 20) through the wiring 94 provided on the back surface 100. This makes it possible to automate the process of connecting the wiring 94 to the external equipment.

[0038] In this embodiment, the electronic component 50 is described as having voltage divider resistors 64 and 66 in a voltage divider resistor circuit 80 that constitutes a voltage sensor. However, any number of voltage divider resistors may be used in the voltage divider resistor circuit 80, or any type of electronic element other than voltage divider resistors may be used to constitute the voltage sensor.

[0039] In this embodiment, the metal wall 104 is provided on the surface 68 of the voltage divider resistor module 52, and the solder wall 106 is provided on the surface 98 of the substrate 54. However, the embodiment is not limited to this, and the metal wall 104 may be provided on the surface 98 of the substrate 54, and the solder wall 106 may be provided on the surface 68 of the voltage divider resistor module 52.

[0040] Furthermore, in this embodiment, we have described the case where terminal 58 is connected to terminal 74 in Figure 5, terminal 60 is connected to terminal 76 in Figure 5, and terminal 62 is connected to terminal 78 in Figure 5. However, we are not limited to this, and for example, terminal 58 may be connected to terminal 76 (or 78) in Figure 5, terminal 60 may be connected to terminal 78 (or 74) in Figure 5, and terminal 62 may be connected to terminal 74 (or 76) in Figure 5.

[0041] Next, an electronic component 110 according to another embodiment will be described with reference to Figures 9 and 10. The electronic component 110 differs from the electronic component 50 described above in its protective wall 112. In this embodiment, the protective wall 112 is made of a solder wall provided on the surface 98 of the substrate 54 (specifically, the main body plate 82). Specifically, the protective wall 112, like the solder wall 106 described above, is provided on the surface 98 of the main body plate 82 so as to protrude from the surface 98 by printing or the like, and extends to surround the entire perimeter of the terminal 88. On the other hand, on the surface 68 of the voltage divider resistor module 52 before mounting, no elements constituting a protective wall are provided around the terminal 62.

[0042] When the protective wall 112, which acts as a solder wall, is heated and melted, as shown in Figure 10, the protective wall 112 extends from surface 98 to surface 68 and comes into contact with surface 68. At this time, the tip 112a of the protective wall 112 is in close contact with surface 68, and together with surfaces 68 and 98, defines a sealed space 108 that seals the pair of terminals 62 and 88 from the outside.

[0043] As described above, in the electronic component 110, the protective wall 112 is provided on the surface 98, extends from the surface 98 toward the surface 68, and abuts against the surface 68. According to this configuration, the protective wall 112 formed on one surface 98 of the surfaces 68 and 98 can prevent foreign matter from adhering to the pair of terminals 62 and 88. Thereby, the manufacturing cost can be reduced.

[0044] In addition, in the electronic component 110, the protective wall 112 is provided on the surface 98, and has a solder wall that is heated and melted to abut against the surface 68. According to this configuration, the protective wall 102 can be formed by a simple process of heating and melting the solder wall. Therefore, since the manufacturing process can be advantageously automated, the electronic component 110 can be mass-produced.

[0045] In the present embodiment, the case where the protective wall 112 as a solder wall is provided on the surface 98 of the substrate 54 has been described. However, the present invention is not limited thereto. The protective wall 112 may be provided on the surface 68 of the voltage dividing resistor module 52, and the solder wall may be omitted from the surface 98 of the substrate 54. In this case, when the protective wall 112 is heated and melted, it extends from the surface 68 toward the surface 98, and abuts against the surface 98 at its tip 112a.

[0046] Next, an electronic component 120 according to still another embodiment will be described with reference to FIGS. 11 and 12. The electronic component 120 differs from the electronic component 50 described above in the protective wall 122. In the present embodiment, the protective wall 122 is provided as a separate body from the housing 56 of the voltage dividing resistor module 52 and the main body plate 82 of the substrate 54, and is fixed to the surface 68 of the housing 56 as shown in FIG. 11.

[0047] Specifically, the protective wall 122 is made of a material different from that of the surface 68 (that is, the housing 56) and the surface 98 (that is, the main body plate 82). For example, the protective wall 122 is made of an elastic material (such as rubber) or an adhesive material (such as adhesive, double-sided tape, adhesive sheet, etc.). Similarly to the metal wall 104 described above, the protective wall 122 extends so as to surround the entire periphery of the terminal 62. On the other hand, on the surface 98 of the substrate 54 before mounting, no element constituting a protective wall is provided around the terminal 88.

[0048] When the voltage dividing resistor module 52 is mounted on the substrate 54, as shown in FIG. 12, the protective wall 122 extends from the surface 68 toward the surface 98 and abuts against the surface 98. At this time, the tip end 122a of the protective wall 122 is in close contact with the surface 98, and together with the surfaces 68 and 98, defines a sealed space 108 that seals the pair of terminals 62 and 88 from the outside.

[0049] As described above, in the electronic component 120, the protective wall 122 is made of a material different from that of the surfaces 68 and 98, and the material includes an elastic material or an adhesive material. According to this configuration, the protective wall 122 excellent in sealing performance can be easily formed using a relatively low-cost material. Note that the protective wall 122 may be made of the same material as the surface 68 (that is, the housing 56) and may be formed integrally with the surface 68.

[0050] In the present embodiment, the case where the protective wall 122 is provided on the housing 56 of the voltage dividing resistor module 52 has been described. However, the present invention is not limited thereto, and the protective wall 122 may be provided on the surface 98 of the substrate 54. In this case, the protective wall 122 extends from the surface 98 toward the surface 68, and abuts against the surface 68 at the tip end 122a thereof.

[0051] Alternatively, the protective wall 122 may be composed of a first wall portion 122A fixed to the surface 68 of the voltage dividing resistor module 52 and a second wall portion 122B fixed to the surface 98 of the substrate 54. The first wall portion 122A and the second wall portion 122B may be made of an elastic material or an adhesive material. In this case, when the voltage dividing resistor module 52 is mounted, the first wall portion 122A and the second wall portion 122b abut and closely contact each other at their respective tip ends to form the protective wall 122.

[0052] In this embodiment, the case described is one in which the protective wall 122 is made of a different material (i.e., an elastic material or an adhesive material) than the surfaces 68 and 98. However, the invention is not limited to this, and the protective wall 122 may be made of the same material as the surfaces 68 or 98. For example, the protective wall 122 may be made of the same material as the housing 56 (i.e., resin) and formed integrally with the housing 56. Alternatively, the protective wall 122 may be made of the same material as the main body plate 82 (i.e., an insulating material) and formed integrally with the main body plate 82.

[0053] In the embodiments described above, the protective walls 102, 112, and 122 were provided to surround a pair of terminals 62 and 88. However, the protective walls are not limited to this configuration and may be provided to surround multiple pairs of terminals 58 and 84, 60, 86, 62, and 88. Further embodiments of electronic components will be described below with reference to Figures 13 and 14.

[0054] The electronic component 130 shown in Figure 13 comprises a voltage divider resistor module 132 and a circuit board 134. The voltage divider resistor module 132 differs from the voltage divider resistor module 52 described above in the following configuration. Specifically, the voltage divider resistor module 132 has a plurality of terminals 136, 60, and 62 provided on the surface 68 of the housing 56. Terminal 136 has a substantially square shape, similar to terminal 62. In this embodiment, terminal 136 is electrically connected to terminal 74 in Figure 5, terminal 60 is electrically connected to terminal 76 in Figure 5, and terminal 62 is electrically connected to terminal 78 in Figure 5.

[0055] On the other hand, the substrate 134 has a main plate 82, a plurality of terminals 138, 86 and 88, a plurality of wirings 140, 92 and 94, and a plurality of conductive holes 142 and 96. Terminal 138 has the same external shape as terminal 88. Wiring 140 is provided on the back surface 100 of the main plate 82. Conductive holes 142 penetrate from the front surface 98 to the back surface 100 of the main plate 82, and provide electrical connection between terminal 138 and wiring 140. Wiring 140 is electrically connected to a first terminal to which the voltage V of the object to be detected is applied.

[0056] The electronic component 130 is equipped with a protective wall 144. Specifically, the protective wall 144 has a metal wall 146 provided on the surface 68 of the housing 56 of the voltage divider resistor module 132 and a solder wall 148 provided on the surface 98 of the substrate 54 (specifically, the main body plate 82). The metal wall 146, like the metal wall 104 described above, is made of a metal such as a copper alloy and is provided on the surface 68 so as to protrude from the surface 68. In this embodiment, the metal wall 146 extends in a substantially rectangular shape so as to surround the entire perimeter of the terminals 136 and 62.

[0057] On the other hand, the solder wall 148, like the solder wall 106 described above, is provided on the surface 98 of the main body plate 82 by printing or the like so as to protrude from the surface 98. In this embodiment, the solder wall 148 extends in a substantially rectangular shape so as to surround the entire perimeter of the terminals 138 and 88.

[0058] When mounting the voltage divider resistor module 52, the manufacturer places the voltage divider resistor module 132 on the substrate 134 such that terminals 136, 60, and 62 of the voltage divider resistor module 132 are in contact with terminals 138, 86, and 88 of the substrate 134, respectively, and the metal wall 146 is in contact with the solder wall 148. Next, the manufacturer heats the voltage divider resistor module 132 and the substrate 134 with a heating device.

[0059] As a result, terminal 138 of the substrate 134 is soldered to terminal 136 of the voltage divider resistor module 52, forming a pair of interconnected terminals 136 and 138. This allows the pair of terminals 136 and 138 and the wiring 140 to be interconnected via the interconnection hole 142. Furthermore, the pair of terminals 136 and 138 are interconnected with terminal 74 in Figure 5, thereby interposing the voltage divider resistor 64 in Figure 5 between the pair of terminals 136 and 138 and the pair of terminals 62 and 88.

[0060] Furthermore, the solder wall 148 is soldered to the metal wall 146 by heating and melting, and is integrally bonded to the metal wall 146 to form a protective wall 144. This protective wall 144 extends from the surface 68 of the housing 56 to the surface 98 of the substrate 54, extending in a rectangular shape around the entire perimeter of the pair of terminals 136 and 138 and the pair of terminals 62 and 88, and together with the surfaces 68 and 98, defines a sealed space 108. In this way, in this embodiment, the pair of terminals 62 and 88 and the other pair of terminals 136 and 138 are housed in the sealed space 108 and sealed from the outside.

[0061] As described above, in the electronic component 130, the other pair of terminals 136 and 138, along with the pair of terminals 62 and 88, are arranged inside the protective wall 144. With this configuration, the protective wall 144 can prevent foreign matter from adhering to the two pairs of terminals 62 and 88, 136 and 138.

[0062] In this embodiment, the case described is one in which terminal 136 is connected to terminal 74 in Figure 5, terminal 60 is connected to terminal 76, and terminal 62 is connected to terminal 78 in Figure 5. However, the invention is not limited to this, and for example, terminal 136 may be connected to terminal 76 (or 78) in Figure 5, terminal 60 may be connected to terminal 78 (or 74) in Figure 5, and terminal 62 may be connected to terminal 74 (or 76) in Figure 5.

[0063] In this embodiment, the case described is one in which the protective wall 144 has a metal wall 146 and a solder wall 148. However, it is not limited to this, and for example, the protective wall 112 shown in Figure 9 or the protective wall 122 shown in Figure 11 may be applied instead of the protective wall 144 to surround the pair of terminals 62 and 88 and the other pair of terminals 136 and 138.

[0064] The electronic component 150 shown in Figure 14 comprises a voltage divider resistor module 152 and a circuit board 154. The voltage divider resistor module 152 differs from the voltage divider resistor module 52 described above in the following configuration. Specifically, the voltage divider resistor module 152 has a plurality of terminals 156, 158, and 160 provided on the surface 68 of the housing 56. The terminals 156, 158, and 160 are conductive members (copper alloy, etc.) having the same substantially rectangular outer shape. In this embodiment, terminal 156 is electrically connected to terminal 74 in Figure 5, terminal 158 is electrically connected to terminal 76 in Figure 5, and terminal 160 is electrically connected to terminal 78 in Figure 5.

[0065] On the other hand, the substrate 154 has a main plate 82, a plurality of terminals 162, 164 and 166, a plurality of wirings 168, 170 and 172, and a plurality of conductive holes 174, 176 and 178. The terminals 162, 164 and 166 are made of solder having the same substantially rectangular shape and are provided on the surface 98 of the main plate 82 by printing or the like. On the other hand, the wirings 168, 170 and 172 are provided on the back surface 100 of the main plate 82 by printing or the like.

[0066] Each of the conduit holes 174, 176, and 178 penetrates from the front surface 98 to the back surface 100 of the main body plate 82. Conduit hole 174 connects terminal 162 and wiring 168, conduit hole 176 connects terminal 164 and wiring 170, and conduit hole 178 connects terminal 166 and wiring 172. Wiring 168 is electrically connected to a first terminal to which the voltage V to be detected is applied, while wiring 170 is electrically connected to a second terminal. Wiring 172 is electrically connected to the control unit 20 via an A / D converter.

[0067] The electronic component 150 is equipped with a protective wall 180. Specifically, the protective wall 180 has a metal wall 182 provided on the surface 68 of the housing 56 of the voltage divider resistor module 152 and a solder wall 184 provided on the surface 98 of the substrate 154 (specifically, the main body plate 82). The metal wall 182, like the metal wall 104 described above, is made of a metal such as a copper alloy and is provided on the surface 68 so as to protrude from the surface 68. In this embodiment, the metal wall 182 extends in a substantially rectangular shape so as to surround the entire perimeter of the terminals 156, 158 and 160.

[0068] The solder wall 184, like the solder wall 106 described above, is provided on the surface 98 of the main plate 82 by printing or the like so as to protrude from the surface 98. In this embodiment, the solder wall 184 extends in a substantially rectangular shape so as to surround the entire perimeter of terminals 162, 164 and 166.

[0069] When mounting the voltage divider resistor module 152, the manufacturer places the voltage divider resistor module 152 on the substrate 154 such that terminals 156, 158, and 160 of the voltage divider resistor module 152 are in contact with terminals 162, 164, and 166 of the substrate 154, respectively, and the metal wall 182 is in contact with the solder wall 184. Next, the manufacturer heats the voltage divider resistor module 152 and the substrate 154 with a heating device.

[0070] As a result, terminals 162, 164, and 166 of the substrate 154 are soldered to terminals 156, 158, and 160 of the voltage divider resistor module 152, respectively, forming pairs of interconnected terminals 156 and 162, 158 and 164, and 160 and 166. The pairs of terminals 156 and 162 and the wiring 168 are interconnected via the conduit hole 174, the pairs of terminals 158 and 164 and the wiring 170 are interconnected via the conduit hole 176, and the pairs of terminals 160 and 166 and the wiring 172 are interconnected via the conduit hole 178. As a result, the pairs of terminals 156 and 162 are interconnected with terminal 74 in Figure 5, and the voltage divider resistor 64 in Figure 5 is interposed between the pairs of terminals 156 and 162 and the pairs of terminals 160 and 166.

[0071] Furthermore, the solder wall 184 is soldered to the metal wall 182 by heating and melting, and is integrally bonded to the metal wall 182 to form a protective wall 180. This protective wall 180 extends from the surface 68 of the housing 56 to the surface 98 of the substrate 154, and extends in a rectangular shape around the entire perimeter of the pair of terminals 156 and 162, 158 and 164, and 160 and 166, defining a sealed space 108 together with the surfaces 68 and 98. Thus, in this embodiment, the pair of terminals 160 and 166, and the other pair of terminals 156 and 162, and 158 and 164 are housed in the sealed space 108 and sealed from the outside.

[0072] As described above, in the electronic component 150, the other pair of terminals 156 and 162, as well as 158 and 164, are arranged inside the protective wall 180, along with the pair of terminals 160 and 166. With this configuration, the protective wall 180 can prevent foreign matter from adhering to the three pairs of terminals 156 and 162, 158 and 164, as well as 160 and 166.

[0073] In this embodiment, the case described is that terminal 156 is connected to terminal 74 in Figure 5, terminal 158 is connected to terminal 76, and terminal 160 is connected to terminal 78 in Figure 5. However, the invention is not limited to this, and for example, terminal 156 may be connected to terminal 76 (or 78) in Figure 5, terminal 158 may be connected to terminal 78 (or 74) in Figure 5, and terminal 160 may be connected to terminal 74 (or 76) in Figure 5.

[0074] In this embodiment, the case in which the protective wall 180 has a metal wall 182 and a solder wall 184 has been described. However, it is not limited to this, and for example, the protective wall 112 shown in Figure 9, or the protective wall 122 shown in Figure 11, may be applied instead of the protective wall 180 to surround the pair of terminals 160 and 166 and the other pair of terminals 156 and 162, 158 and 164.

[0075] In the above-described embodiment, the conduit holes 96, 142, 174, 176, or 178 may be positioned offset from the terminals 88, 138, 162, 164, or 166 on the surface 98 of the main body plate 82. Figure 15 shows a modified example of the substrate 54. In the substrate 54' shown in Figure 15, the conduit holes 96 are positioned offset from the terminals 88 on the surface 98. The substrate 54' further includes wiring 186 provided on the surface 98, which connects the terminals 88 and the upper ends of the conduit holes 96. The terminals 88, the upper ends of the conduit holes 96, and the wiring 186 are all located inside the solder wall 106.

[0076] In the above-described embodiment, the protective walls 102, 112, 122, 144, and 180 are provided so as to encircle the entire periphery of a pair of terminals 62 and 88, 160, and 166, defining a sealed space 108 inside them. However, the invention is not limited to this, and the protective walls 102, 112, 122, 144, or 180 may have openings that connect the inside and the outside. In this case, the protective walls 102, 112, 122, 144, or 180 do not define a sealed space 108. In this case, the openings may be formed in the protective walls 102, 112, 122, 144, or 180 so as to open in the direction opposite to the source of foreign matter (cutting fluid, etc.).

[0077] In the embodiments described above, the case in which the voltage divider resistors 64 and 66 are built into the housing 56 to constitute the voltage divider resistor modules 52, 132, and 152 was described. However, the invention is not limited to this, and for example, the voltage divider resistors 64 and 66 may be mounted on a substrate having a front surface and a back surface. In this case, terminals 58, 60 and 62, 136, 60 and 62, or 156, 158 and 160 may be mounted on the front surface of the substrate, while the voltage divider resistors 64 and 66 may be mounted on the back surface of the substrate.

[0078] In the embodiments described above, the case where electronic components 50, 110, 120, 130, and 150 are voltage sensors that detect the voltage V of the motor drive device 10 was described. However, the electronic components 50, 110, 120, 130, or 150 are not limited to the motor drive device 10, but may be provided to detect the voltage V of, for example, the welding power supply of a welding machine, or to detect the voltage V of any other machine. Furthermore, the electronic components 50, 110, 120, 130, or 150 are not limited to voltage sensors, but may be any type of component, such as a current sensor, power sensor, IC chip, or encoder.

[0079] Although the present disclosure has been described in detail above, it is not limited to the individual embodiments described above. These embodiments can be added, replaced, modified, partially deleted, etc., in any way that does not depart from the gist of the present disclosure or from the spirit of the present disclosure derived from the claims and their equivalents. Furthermore, these embodiments can be implemented in combination. For example, the order of operations and processes in the embodiments described above are shown as examples only and are not limited thereto. The same applies when numerical values ​​or mathematical formulas are used in the description of the embodiments described above.

[0080] As described above, the present disclosure describes the following embodiments: (Embodiment 1) Electronic components 50, 110, 120, 130, 150, comprising a pair of terminals 62 and 88, 160 and 166 provided on a first surface 68 and a second surface 98 facing each other and being electrically conductive with respect to each other, and protective walls 102, 112, 122, 144, 180 extending from one of the first surface 68 and the second surface 98 to the other and surrounding the pair of terminals 62 and 88, 160 and 166. (Aspect 2) The electronic components 50, 110, 120, 130, 150 according to Aspect 1, wherein the protective walls 102, 112, 122, 144, 180 extend around the entire circumference of a pair of terminals 62 and 88, 160, and 166, and together with the first surface 68 and the second surface 98 define a sealed space 108 that seals the pair of terminals 62 and 88, 160, and 166. (Aspect 3) The electronic components 110, 120 according to Aspect 1 or 2, wherein the protective walls 112, 122 are provided on one of the above and extend from one to the other and abut against the other. (Aspect 4) The electronic component 110 according to Aspect 3, wherein the protective wall 112 is provided on one of the above and has a solder wall that is heated and melted to abut against the other. (Aspect 5) The protective walls 102, 112, 122, 144, 180 are made of materials different from the first surface 68 and the second surface 98, in the electronic components 50, 110, 120, 130, 150 according to any one of aspects 1 to 4. (Aspect 6) The electronic component 120 according to aspect 5, wherein the material includes an elastic material or an adhesive material. (Aspect 7) The protective walls 102, 144, 180 have metal walls 104, 146, 182 provided on one side and solder walls 106, 148, 184 provided on the other side and soldered to the metal walls 104, 146, 182 to form the protective walls 102, 144, 180 together with the metal walls 104, 146, 182, in the electronic components 50, 130, 150 according to aspect 5.(Aspect 8) Electronic components 50, 110, 120, 130, 150 according to any one of aspects 1 to 7, further comprising other pairs of terminals 58 and 84, 60 and 86, 136 and 138, 156 and 162, 158 and 164 provided on the first surface 68 and the second surface 98, respectively, which are located outside the protective walls 102, 112, 122, 144, 180, or located inside the protective walls 102, 112, 122, 144, 180 together with the pair of terminals 62 and 88, 160 and 166. (Aspect 9) Electronic components 50, 110, 120, 130, 150 are voltage sensors that detect voltage, and further comprise a voltage divider resistor 64 interposed between another pair of terminals 58 and 84, 136 and 138, 156 and 162 and a pair of terminals 62 and 88, 160 and 166, wherein the other pair of terminals 58 and 84, 136 and 138, 156 and 162 receive a voltage V input, and the pair of terminals 62 and 88, 160 and 166 output the voltage V' divided by the voltage divider resistor 64 as a detection signal S, as described in aspect 8. (Aspect 10) Electronic components 50, 110, 120, 130, 150 according to aspect 9, comprising: a housing 56 including a first surface 68 on which one of a pair of terminals 62 and 88, 160 and 166 is provided; a voltage divider resistor module 52, 132, 152 having voltage divider resistors 64, 66 housed inside the housing 56; a substrate 54, 134, 154 having a second surface 98 on which the other of a pair of terminals 62 and 88, 160 and 166 is provided; wiring 94, 172 provided on a back surface 100 opposite to the second surface 98 for transmitting a detection signal S; and conductive holes 96, 178 penetrating from the second surface 98 to the back surface 100 for making electrical contact between the pair of terminals 62 and 88, 160 and 166 and the wiring 94, 172. (Aspect 11) A motor drive device 10 comprising the electronic components 50, 110, 120, 130, and 150 described in any of aspects 1 to 10.

[0081] 10 Motor drive unit 12 Servo motor 50, 110, 120, 130, 150 Electronic components 52, 132, 152 Voltage divider resistor module 54, 134, 154 Circuit board 56 Housing 58, 60, 62, 84, 86, 88, 136, 138, 156, 158, 160, 162, 164, 166 Terminals 68, 98 Front surface 100 Back surface 90, 92, 94, 140, 168, 170, 172 Wiring 96, 142, 174, 176, 178 Conduction holes 102, 112, 122, 144, 180 Protective wall 104, 146, 182 Metal wall 106, 148, 184 Solder wall

Claims

1. An electronic component comprising: a pair of terminals provided on a first surface and a second surface facing each other and electrically connected to each other; and a protective wall extending from one of the first surface and the second surface to the other and surrounding the pair of terminals.

2. The electronic component according to claim 1, wherein the protective wall extends around the entire circumference of the pair of terminals and, together with the first surface and the second surface, defines a sealed space that seals the pair of terminals.

3. The electronic component according to claim 1, wherein the protective wall is provided on one of the components, extends from the one component toward the other, and abuts against the other component.

4. The electronic component according to claim 3, wherein the protective wall is provided on one of the surfaces and has a solder wall that is heated and melted to come into contact with the other surface.

5. The electronic component according to claim 1, wherein the protective wall is made of a material different from the first surface and the second surface.

6. The electronic component according to claim 5, wherein the material includes an elastic material or an adhesive material.

7. The electronic component according to claim 5, wherein the protective wall comprises a metal wall provided on one side and a solder wall provided on the other side, which is soldered to the metal wall and together with the metal wall forms the protective wall.

8. The electronic component according to claim 1, further comprising another pair of terminals provided on the first surface and the second surface, respectively, which are located outside the protective wall or located inside the protective wall together with the pair of terminals.

9. The electronic component according to claim 8, which is a voltage sensor for detecting voltage, further comprising a voltage divider resistor interposed between the other pair of terminals and the pair of terminals, wherein the other pair of terminals accepts the voltage input, and the pair of terminals outputs the voltage divided by the voltage divider resistor as a detection signal.

10. The electronic component according to claim 9, comprising: a voltage divider resistor module having a housing including a first surface on which one of the pair of terminals is provided; and the voltage divider resistor housed inside the housing; and a substrate having a second surface on which the other of the pair of terminals is provided; wiring provided on the back surface opposite to the second surface for transmitting the detection signal; and a conductive hole penetrating from the second surface to the back surface for making electrical contact between the pair of terminals and the wiring.

11. A motor drive device comprising the electronic component described in claim 1.

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