Component mounting device and component mounting method

Abstract

This component mounting device is provided with: a first mounting head for mounting a first component, from a first component supply unit, onto a first substrate on a first conveyance path; a first camera that is arranged between the first component supply unit and the first conveyance path and images a first component supported on a first support part; and a second mounting head for mounting a second component, from a second component supply unit, onto the first substrate. A first substrate conveyance unit comprises: a first rail arranged on the first component supply unit side; and a second rail arranged on the second component supply unit side. A control unit causes the first mounting head to move in a direction along the first rail with respect to the first camera if the first rail is located at a first location, and causes the first mounting head to move in a diagonal direction with respect to the first camera if the first rail is located at a second location which is shifted from the first location by a predetermined amount toward the second rail side.

Description

Component Mounting Apparatus and Component Mounting Method

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method.

[0002] Conventionally, in a component mounting apparatus that mounts components on a substrate, alternate mounting is sometimes performed in which two mounting heads mount components on a single substrate. The two mounting heads each convey and mount a component toward the substrate from respective width directions of the substrate.

[0003] For example, Patent Document 1 describes a dual-lane type component mounting apparatus including two conveyance lanes. Each conveyance lane can convey substrates of different sizes by configuring, of the two rails included in each conveyance lane, the rail on the other conveyance lane side as a movable rail. As mounting modes, there are an independent mounting mode in which two mounting heads mount components only on respective lanes for substrates conveyed in each of the two conveyance lanes, and an alternate mounting mode in which, for example, components are alternately mounted on each substrate conveyed in the two conveyance lanes by the two mounting heads. Note that in the alternate mounting mode, there are also cases where two mounting heads alternately mount respective components on a single substrate conveyed in one of the conveyance lanes.

[0004] Before a component conveyed by a mounting head is conveyed toward the substrate, the component is imaged by component recognition cameras respectively disposed on both sides of the conveyance lane, and the posture of the supported component is recognized by image processing.

[0005] Japanese Unexamined Patent Publication No. 2021-82746

[0006] In the component mounting apparatus of Patent Document 1, in the alternate mounting mode, when the other mounting head mounts a component on the substrate toward the vicinity of one component recognition camera, in order to avoid interference with the other camera, the one mounting head sometimes has to move over the component recognition camera along a path parallel to the conveyance lane. In this case, the mounting head travels along a detour path from the component recognition camera toward the substrate.

[0007] An object of the present disclosure is to solve the problem described above and provide a component mounting apparatus with improved productivity.

[0008] To achieve the above objective, the component mounting apparatus of this disclosure includes a first component supply unit for supplying a first component, a first substrate transport unit for transporting a first substrate on a first transport path, a first mounting head for mounting the first component from the first component supply unit onto the first substrate, a first camera positioned between the first component supply unit and the first transport path for imaging the first component supported by the first support unit, and a first head for moving the first mounting head from the first component supply unit through the first camera onto the first substrate. The first substrate transport unit includes a head transport mechanism, a second component supply unit for supplying a second component, a second support unit for supporting the second component, a second mounting head for mounting the second component from the second component supply unit onto the first substrate, a second camera positioned between the second component supply unit and the first transport path for imaging the second component supported by the second support unit, a second head transport mechanism for moving the second mounting head from the second component supply unit through the second camera to the first substrate, and a control unit for driving and controlling the first head transport mechanism and the second head transport mechanism. The first substrate transport unit includes a first rail positioned on the first component supply unit side and a second rail positioned on the second component supply unit side. The first rail is movable in a direction intersecting the transport direction of the first substrate. The control unit moves the first mounting head in a direction along the first rail relative to the first camera when the first rail is in a first position, and moves the first mounting head diagonally relative to the first camera when the first rail is in a second position which is moved by a predetermined amount toward the second rail than the first position.

[0009] To achieve the above objective, the component mounting method of the present disclosure comprises: a first component removal step in which a first mounting head removes a first component from a first component supply unit; a first imaging step in which the removed first component is imaged with a first camera; a first mounting step in which the imaged first component is mounted on a first substrate on a first transport path; a second component removal step in which a second mounting head removes a second component from a second component supply unit; a second imaging step in which the removed second component is imaged with a second camera; and a second mounting step in which the imaged second component is mounted on a first substrate on a first transport path. The first substrate transport unit has a first rail arranged on the side of the first component supply unit and a second rail arranged on the side of the second component supply unit. The first rail is movable in a direction intersecting the transport direction of the first substrate. In the first imaging step, if the first rail is in a first position, the control unit moves the first mounting head in a direction along the first rail relative to the first camera. If the first rail is in a second position, which is closer to the second rail than the first position, the control unit moves the first mounting head diagonally relative to the first camera.

[0010] According to this disclosure, it is possible to provide a component mounting device that improves productivity.

[0011] Schematic plan view of the component mounting device of the embodiment. Explanatory diagram showing the positional relationship between the transport lane and the component recognition camera when the transport lane width is at its maximum. Explanatory diagram showing the rail width of the transport lane that allows the mounting head to perform oblique scanning with respect to the component recognition camera. Block diagram showing the configuration of the control system in the component mounting device of the embodiment. Explanatory diagram explaining the lateral scanning operation of the mounting head with respect to the component recognition camera. Explanatory diagram explaining the oblique scanning operation of the mounting head with respect to the component recognition camera. Explanatory diagram explaining the movement restriction area of ​​the mounting head. Flowchart of component mounting onto a substrate by the component mounting device.

[0012] (About the aspects of this disclosure) A component mounting apparatus according to a first aspect of this disclosure includes a first component supply unit for supplying first components, a first substrate transport unit for transporting a first substrate on a first transport path, a first mounting head for mounting first components from the first component supply unit onto the first substrate, a first camera positioned between the first component supply unit and the first transport path for imaging the first components supported by the first support unit, and a first head mover for moving the first mounting head from the first component supply unit through the first camera onto the first substrate. The first substrate transport unit includes a structure, a second component supply unit for supplying a second component, a second support unit for supporting the second component, a second mounting head for mounting the second component from the second component supply unit onto the first substrate, a second camera positioned between the second component supply unit and the first transport path for imaging the second component supported by the second support unit, a second head movement mechanism for moving the second mounting head from the second component supply unit through the second camera to the first substrate, and a control unit for driving and controlling the first head movement mechanism and the second head movement mechanism. The first substrate transport unit includes a first rail positioned on the first component supply unit side and a second rail positioned on the second component supply unit side. The first rail is movable in a direction intersecting the transport direction of the first substrate. The control unit moves the first mounting head in a direction along the first rail relative to the first camera when the first rail is in a first position, and moves the first mounting head diagonally relative to the first camera when the first rail is in a second position which is moved by a predetermined amount toward the second rail than the first position.

[0013] According to the component mounting apparatus of the first embodiment, when rail 2aa is moved by a predetermined amount from the maximum width of the transport path to rail 2ab in the first substrate transport section, depending on the size of the substrate on which the first component is mounted, the mounting head 9F is moved diagonally with respect to the component recognition camera 12F. When rail 2aa and rail 2ab are at the maximum width of the transport path in the first transport lane 2F, the mounting head 9F is moved in a direction along rail 2aa with respect to the component recognition camera 12F, resulting in a roundabout path with respect to the substrate 3A. However, when rail 2aa is moved by a predetermined amount to rail 2ab, the first mounting head is moved diagonally with respect to the first camera, resulting in a more linear movement toward the first substrate, which shortens the component mounting time and provides a component mounting apparatus with improved productivity.

[0014] According to a second aspect of the present disclosure, the component mounting apparatus of the first aspect includes a second substrate transport unit that transports a second substrate on a second transport path arranged alongside the first transport path. A first mounting head mounts the first component onto the second substrate from the first component supply unit. A first head moving mechanism moves the first mounting head from the first component supply unit, through the first camera, to the second substrate. A second mounting head mounts the second component onto the second substrate from the second component supply unit. A second head moving mechanism moves the second mounting head from the second component supply unit, through the second camera, to the second substrate.

[0015] According to a third aspect of the present disclosure, in the component mounting apparatus of the second aspect, the second substrate transport unit has a third rail disposed on the side of the second component supply unit and a fourth rail disposed on the side of the first component supply unit. The third rail is movable in a direction intersecting the transport direction of the second substrate. When the third rail is in the third position, the control unit moves the second mounting head in a direction along the third rail relative to the second camera. When the third rail is in the fourth position, which is moved by a predetermined amount toward the fourth rail than the third position, the control unit moves the second mounting head in an oblique direction relative to the second camera.

[0016] According to a fourth aspect of this disclosure, in the component mounting device of the second or third aspect, the control unit adjusts the positions of the first rail, the second rail, the third rail, and the fourth rail according to the width of the first substrate and the width of the second substrate.

[0017] A component mounting method according to a fifth aspect of the present disclosure comprises: a first component removal step in which a first mounting head removes a first component from a first component supply unit; a first imaging step in which the removed first component is imaged with a first camera; a first mounting step in which the imaged first component is mounted on a first substrate on a first transport path; a second component removal step in which a second mounting head removes a second component from a second component supply unit; a second imaging step in which the removed second component is imaged with a second camera; and a second mounting step in which the imaged second component is mounted on a first substrate on a first transport path. The first substrate transport unit has a first rail located on the side of the first component supply unit and a second rail located on the side of the second component supply unit. The first rail is movable in a direction intersecting the transport direction of the first substrate. In the first imaging step, if the first rail is in a first position, the control unit moves the first mounting head in a direction along the first rail relative to the first camera. If the first rail is in a second position, which is closer to the second rail than the first position, the control unit moves the first mounting head diagonally relative to the first camera.

[0018] (Embodiments) Hereinafter, exemplary embodiments of a component mounting device relating to the present disclosure will be described with reference to the attached drawings. The present disclosure is not limited to the specific configurations of the embodiments described below, but configurations based on similar technical ideas are included in the present disclosure. The configurations, shapes, etc. described below are illustrative examples for illustrative purposes and can be modified as appropriate depending on the specifications of the mounting head and component mounting device.

[0019] In the following, corresponding elements in each drawing are denoted by the same reference numeral, and redundant explanations are omitted. Furthermore, in the following, two mutually orthogonal axes in the horizontal plane are defined as the X-axis direction in the substrate transport direction and the Y-axis direction perpendicular to the substrate transport direction, and the height direction perpendicular to the horizontal plane is defined as the Z-axis direction.

[0020] (Component Mounting Device) First, the configuration of the component mounting device 1 will be explained with reference to Figure 1. Figure 1 is a schematic plan view showing the component mounting device 1 of an embodiment.

[0021] The component mounting device 1 has the function of mounting components on two substrates 3 in parallel using two component supply units 5F and 5R and two mounting heads 9F and 9R. The component mounting device 1 has an independent mounting mode in which the mounting heads 9F and 9R mount components on each of the two substrates 3 in parallel, and an alternating mounting mode in which the two mounting heads 9F and 9R alternately perform component mounting processing on a common substrate 3.

[0022] In the center of the main body base 1a, a first transport lane 2F and a second transport lane 2R extending in the X-axis direction are installed in parallel in the Y-axis direction. The first transport lane 2F and the second transport lane 2R each position the substrate 3, which has been brought in from the upstream side, into the component mounting area where components are mounted by the mounting heads 9F and 9R. The first transport lane 2F and the second transport lane 2R also each transport out the substrate 3 in the downstream direction after the component mounting work is completed.

[0023] For convenience, unless otherwise necessary, the first transport lane 2F and the second transport lane 2R will be simply referred to as "transport lane 2". Also, the lower side of Figure 1 will be referred to as the front side of the component loading device 1, and the upper side of Figure 1 will be referred to as the rear side of the component loading device 1. That is, the first transport lane 2F is installed on the front side of the component loading device 1, and the second transport lane 2R is installed on the rear side of the component loading device 1.

[0024] Parts supply units 5F and 5R are installed on both sides of the transport lanes 2F and 2R, respectively. Both parts supply units 5F and 5R have multiple tape feeders 6 mounted in parallel in the X direction. The tape feeders 6 feed carrier tapes, which have pockets for storing parts, in a pitch direction from the outside of the parts supply units 5F and 5R toward the transport lanes 2F and 2R (tape feeding direction), thereby supplying parts 19F and 19R to the parts supply positions where the mounting heads 9F and 9R pick up the parts.

[0025] Y-axis tables 7 equipped with linear drive mechanisms are positioned at both ends in the X direction on the upper surface of the main body base 1a. Two beams 8F and 8R, also equipped with linear mechanisms, are connected to the Y-axis tables 7 so as to be movable in the Y direction. Mounting heads 9F and 9R are mounted on beams 8F and 8R, respectively, so as to be movable in the X direction. Suction nozzles 21F and 21R are detachably mounted on nozzle holders that are provided at the lower ends of the mounting heads 9F and 9R and move up and down. Suction nozzles 21F and 21R vacuum-suction and hold the parts 19F and 19R that are supplied to the part supply position.

[0026] The Y-axis table 7 and beams 8F and 8R constitute head movement mechanisms 10F and 10R that move the mounting heads 9F and 9R horizontally (X and Y directions). The head movement mechanisms 10F and 10R and the mounting heads 9F and 9R repeatedly perform a series of turns in the component mounting operation, picking up components 19F and 19R from the component supply position of the tape feeder 6 attached to the component supply unit 5F and 5R by vacuum suction nozzles 21F and 21R using suction nozzles, and transferring them to the mounting position of the substrate 3 held in the transport lane 2.

[0027] Beams 8F and 8R are each equipped with substrate recognition cameras 11F and 11R, respectively, located on the underside of beams 8F and 8R and moving integrally with mounting heads 9F and 9R. As mounting heads 9F and 9R move, the substrate recognition cameras 11F and 11R move above the substrate 3 positioned in the component mounting area of ​​the transport lane 2, and capture images of the substrate marks (not shown) provided on the substrate 3 to recognize the position of the substrate 3.

[0028] Component recognition cameras 12F and 12R are installed between the component supply units 5F and 5R and the transport lane 2, respectively. When the mounting heads 9F and 9R, which have taken out components 19F and 19R from the component supply units 5F and 5R, are positioned above the component recognition cameras 12F and 12R, the component recognition cameras 12F and 12R capture images of the components 19F and 19R held by the suction nozzles 21F and 21R from below. During the component mounting operation of components 19F and 19R onto the substrate 3 by the mounting heads 9F and 9R, the mounting position is corrected by taking into account the recognition results of the substrate 3 by the substrate recognition cameras 11F and 11R and the recognition results of the components by the component recognition cameras 12F and 12R. The component recognition cameras 12F and 12R are solid-state image sensors such as a CCD image sensor, a CMOS image sensor, or an infrared image sensor, and line scan cameras may be used.

[0029] In Figure 1, a touch panel 13 is installed at the front of the component mounting device 1 where the worker works, serving as an operating unit for the worker. The touch panel 13 displays various information on its display, and the worker uses the operation buttons displayed on the display to input data and operate the component mounting device 1.

[0030] In the transport lane 2, transport conveyors 43 are provided inside rails 2aa and 2ba, and inside rails 2ab and 2bb, respectively, along the transport direction (X-axis direction) of the substrate 3 (see Figure 2). By driving the transport conveyors 43 with both ends of the substrate 3 in the Y-axis direction in contact with the upper surface of the transport conveyors 43, the substrate 3 is transported in the substrate transport direction.

[0031] Refer to Figures 1 to 3. Figure 2 is an explanatory diagram showing the positional relationship between the transport lane 2 and the part recognition cameras 12F and 12R when the width of the transport lane 2 is at its maximum. Figure 3 is an explanatory diagram showing the rail width of the transport lane 2 that allows the mounted heads 9F and 9R to scan diagonally with respect to the part recognition cameras.

[0032] The first transport lane 2F and the second transport lane 2R (transport lane 2) each have two rails (rails 2aa, 2ba and rails 2ab, 2bb). The transport lane 2F, the transport conveyor 43, and the conveyor motor M1 constitute the first substrate transport unit 2cf, which transports the substrate 3 in the positive X-axis direction. Similarly, the transport lane 2R, the transport conveyor 43, and the conveyor motor M1 constitute the second substrate transport unit 2cr, which transports the substrate 3 in the positive X-axis direction.

[0033] Furthermore, of the two rails in the transport lanes of the first and second substrate transport units 2cf and 2cr, the rails 2aa and 2ab on the side of the component recognition cameras 12F and 12R are movable rails, and the rail drive units 4F and 4R can move the rails 2aa and 2ab in a direction of movement (Y-axis direction) perpendicular to the transport direction.

[0034] In Figure 1, the rail drive units 4F and 4R are configured with a lead screw 4a, nuts 4b positioned on rails 2aa and 2ab and screwed onto the lead screw 4a, and a motor 4c that rotates the lead screw 4a. The control unit controls the motor 4c to rotate the lead screw 4a, causing rails 2aa and 2ab to move in the Y-axis direction. This allows the spacing between rails 2aa and 2ba, and between rails 2ab and 2bb, to be changed to match the width of the substrate 3 being transported by the transport lanes 2F and 2R.

[0035] Figures 2 and 3 show an example in which two substrates 3A and 3B are transported independently by two transport lanes 2F and 2R.

[0036] In transport lane 2F, the distances L1 and L3 between the part recognition camera 12F and rail 2aa can be adjusted by adjusting the Y-axis position of rail 2aa. Similarly in transport lane 2R, the distances L2 and L4 between the part recognition camera 12R and rail 2ab can be adjusted by adjusting the Y-axis position of rail 2ab. When the width of transport lane 2F is at its maximum, the distance between the part recognition camera 12F and rail 2aa is L1, and when the width of transport lane 2R is at its maximum, the distance between the part recognition camera 12R and rail 2ab is L2. Furthermore, L3 and L4 are the distances between the part recognition cameras 12F and 12R and rails 2aa and 2ab, respectively, that allow the mounted heads 9F and 9R to perform diagonal scans with respect to the part recognition cameras 12F and 12R.

[0037] Rail 2ba of transport lane 2F and rail 2bb of transport lane 2R may be fixed rails or movable rails. When rails 2ba and 2bb are movable rails, there is a lane expansion mode in which the two rails 2ba and 2bb are moved to one rail 2ab to transport the substrate 3. In lane expansion mode, one large substrate 3 can be transported, and components can be mounted on the large substrate 3.

[0038] In the first substrate transport section 2cf and the second substrate transport section 2cr, the outer transport conveyors 43 are both movable conveyors that can move freely in the Y direction, and the distance between each transport conveyor 43, i.e., the transport width, is variable. Both the first substrate transport section 2cf and the second substrate transport section 2cr are equipped with rail drive units 4F and 4R, which have a linear motion mechanism equipped with a motor 4c and a lead screw 4a. By driving the motor 4c with the rail drive units 4F and 4R, the outer transport conveyor 43 connected to the lead screw 4a can be moved in the Y direction, thereby changing the transport width of the first substrate transport section 2cf and the second substrate transport section 2cr.

[0039] The rotational drive of the conveyor motor M1 is controlled by the mounting operation processing unit 31. In addition to the substrate positioning method that controls the conveyor motor M1 based on the result of detecting the substrate 3 by the substrate detection sensor, a mechanical substrate positioning unit may also be used to position the substrate 3 at the stop position by bringing the substrate 3 into contact with a mechanical stopper.

[0040] Next, with reference to Figure 4, the configuration of the control system of the component mounting device 1 will be described. The component mounting device 1 includes a control unit 16 that can communicate with each of the following: substrate transport units 2cf, 2cr, rail drive units 4F, 4R, tape feeder 6, mounting heads 9F, 9R, head movement mechanisms 10F, 10R, substrate recognition cameras 11F, 11R, component recognition cameras 12F, 12R, and touch panel 13.

[0041] The control unit 16 comprises a mounting operation processing unit 31, a lane change processing unit 32, and a storage unit 34. The storage unit 34 is a memory device that stores production programs 35, mounting data 36, ​​and the like. The control unit 16 can be implemented using semiconductor elements or the like. For example, the control unit 16 can be composed of a microcontroller, CPU, MPU, GPU, DSP, FPGA, or ASIC. The functions of the control unit 16 may be implemented using hardware alone, or they may be implemented by combining hardware and software.

[0042] The storage unit 34 can be implemented, for example, by a hard disk (HDD), SSD, RAM, DRAM, ferroelectric memory, flash memory, magnetic disk, or a combination thereof. The control unit 16 reads data and programs stored in the storage unit 34 and performs various arithmetic operations to realize predetermined functions.

[0043] The production program 35 stores information such as component information and the planned number of circuit boards 3 to be processed for each transport lane 2F and 2R.

[0044] The mounting data 36 stores, for each type of substrate 3 (substrate type), information necessary for component mounting work, such as the size of the substrate 3, the mounting modes for mounting components on the substrate 3 (independent mounting mode, alternate mounting mode), the widths of the conveyance lanes 2F, 2R for conveying the substrate 3 (first conveyance lane 2F, second conveyance lane 2R), and the types and mounting positions (XY coordinates) of the components to be mounted.

[0045] The mounting operation processing unit 31 drives and controls the conveyance conveyor 43, the mounting heads 9F, 9R, and the head moving mechanisms 10F, 10R to control the component mounting operation on the substrate 3. Specifically, it controls each part of the component mounting apparatus 1 based on the mounting data 36, holds the component supplied by the tape feeder 6 with the mounting heads 9F and 9R, and controls the component mounting work for mounting the component onto the substrate 3.

[0046] The lane change processing unit 32 controls the rail driving units 4F and 4R based on the production schedule information included in the production program 35, the size and mounting mode of the substrate 3 included in the mounting data 36, and the conveyance lanes 2F and 2R for conveying the substrate 3, to cause the substrate conveyance unit to execute a substrate type change process for changing the type of substrate conveyed.

[0047] Specifically, when changing the type of substrate conveyed by the conveyance lanes 2F and 2R, the lane change processing unit 32 controls the rail driving units 4F and 4R to move the movable rails 2aa and 2ab in accordance with the width of the substrate type to be conveyed next.

[0048] Next, with reference to FIG. 5 and FIG. 6, the moving path of the mounting head that is changed according to the width of the conveyance lane will be described, taking the first conveyance lane 2F as an example. FIG. 5 is an explanatory diagram illustrating a horizontal scanning operation performed by the mounting head 9F with respect to the component recognition camera 12F. FIG. 6 is an explanatory diagram illustrating an oblique scanning operation performed by the mounting head 9F with respect to the component recognition camera 12F.

[0049] The mounting heads 9F and 9R each have a plurality of suction nozzles 21F and 21R, respectively. In order to capture images of components sucked by all of the suction nozzles 21F and 21R, it is necessary to perform scanning in the horizontal direction or oblique direction with respect to the component recognition cameras 12F and 12R.

[0050] If the distance between the rail 2aa of the first transport lane 2F and the component recognition camera 12F is small, there is a risk that the mounting head 9R, which mounts components onto the substrate 3A, and the mounting head 9F after scanning the component recognition camera 12F may interfere during alternating mounting. Therefore, as shown in Figure 5, if the mounting head 9F is scanned laterally, the mounting head 9F after scanning can wait without moving in the Y-axis direction compared to the mounting head 9F during scanning, thus avoiding interference with the mounting head 9R.

[0051] Furthermore, as shown in Figure 6, by moving the rail 2aa inward to increase the distance between the rail 2aa of the first transport lane 2F and the part recognition camera 12F, an area can be secured in which the mounting head 9F does not interfere with the mounting head 9R even when it is waiting after an oblique scan. Let P2 be the position of the rail 2aa in the Y-axis direction that enables oblique scanning. The scan speed for the part recognition camera 12F is determined by the type of part, and the minimum distance L3 at position P2 is determined by the braking distance of the mounting head 9R after an oblique scan and the size of the mounting heads 9F and 9R. The difference between L1 and L3 is, for example, about 40 mm to 50 mm.

[0052] Furthermore, the angle of the mounted head 9F with respect to the X-axis for oblique scanning may be changed according to the size of the distance L3. For example, the larger the distance L3, the larger the angle in the Y-axis direction may be made to approach vertical scanning, and the smaller the distance L3, the smaller the angle in the Y-axis direction may be made to approach horizontal scanning.

[0053] Similarly, the second transport lane 2R and the mounting head 9R can also use both horizontal and diagonal scanning. In this way, even in alternating mounting mode, the component mounting speed can be improved by enabling diagonal scanning of the mounting head 9R according to the size of the substrate.

[0054] Next, the method of mounting components onto the substrate 3 by the component mounting device 1 will be explained with reference to Figures 1, 5, 6, 7, and 8. Figure 7 is an explanatory diagram illustrating the movement restriction area of ​​the mounting head 9F. Figure 8 is a flowchart of the component mounting onto the substrate 3 by the component mounting device 1.

[0055] In step S1, as a first part removal step, the mounting head 9F removes part 19F from the part supply unit 5F.

[0056] In step S2, as a second part removal step, the mounted head 9R removes part 19R from the part supply unit 5R.

[0057] In step S3, as a second component imaging step, the mounted head 9R moves above the component recognition camera 12R by the head movement mechanism 10R to image the component 19R supported by the suction nozzle 21R. The captured image is transmitted to the control unit 16. Based on the captured image, the rotation of the suction nozzle 21R is adjusted.

[0058] In step S4, as a second component mounting step, the mounting head 9R moves to the substrate 3A or 3C by the head movement mechanism 10R to mount component 19R onto the substrate 3A or 3C. At this time, the mounting operation processing unit 31 of the control unit 16 recognizes the movement path of the mounting head 9R from the component recognition camera 12R to the substrate 3A or 3C, and sets the area on this movement path of the mounting head 9R as the movement restriction area Ar of the mounting head 9F in the coordinate system of the control space, as shown in Figure 7. Figure 8 illustrates the movement restriction area Ar of the mounting head 9F as an example when the rail 2aa is located at the second position P2.

[0059] In step S5, the mounting operation processing unit 31 determines whether the rail 2aa (first rail) is located at the second position P2. If the mounting operation processing unit 31 determines that the rail 2aa is located at the second position P2 where it can be obliquely scanned (Yes in step S5), in step S6, the mounting head 9F is moved obliquely above the part recognition camera 12F by the head moving mechanism 10F to image the part 19F supported by the suction nozzle 21F. The captured image is transmitted to the control unit 16. Based on the captured image, the rotation of the suction nozzle 21F is adjusted.

[0060] In step S5, if the mounting operation processing unit 31 determines that the rail 2aa is not in the second position P2 where it can be obliquely scanned (No. in step S5), in step S7, the mounting head 9F is moved laterally above the part recognition camera 12F parallel to the X-axis by the head moving mechanism 10F to capture an image of the part 19F supported by the suction nozzle 21F. The captured image is transmitted to the control unit 16. Based on the captured image, the rotation of the suction nozzle 21F is adjusted.

[0061] In step S8, the mounting operation processing unit 31 determines whether or not the mounting head 9R is scheduled to pass through a set movement restriction area. If the mounting operation processing unit 31 determines that the mounting head 9R will not pass through the set movement restriction area Ar (No in step S8), after the component recognition camera 12F has finished scanning, the head movement mechanism 10F moves the mounting head 9F to the substrate 3A or 3C and mounts the component 19F onto the substrate 3A or 3C.

[0062] In step S8, if the mounting operation processing unit 31 determines that the mounting head 9R has passed through the set movement restriction area Ar (Yes in step S8), the mounting head 9F waits after the component recognition camera 12F has finished scanning. When the mounting operation processing unit 31 determines that the mounting head 9R has finished mounting the component and the movement restriction area has been released, in step S9, the mounting head 9F is moved by the head movement mechanism 10F to the substrate 3A or 3C and the component 19F is mounted on the substrate 3A or 3C. This completes one pattern of component mounting.

[0063] (Effects) As described above, the component mounting device 1 of this embodiment includes a component supply unit 5F for supplying first components, a first substrate transport unit 2cf for transporting substrates 3A and 3C on a first transport lane 2F, a mounting head 9F having a first support unit for supporting the first components and mounting the first components from the component supply unit 5F onto the substrates 3A and 3C, a component recognition camera 12F positioned between the component supply unit 5F and the first transport lane 2F for imaging the first components supported by the first support unit, and a head for moving the mounting head 9F from the component supply unit 5F through the component recognition camera 12F to the substrates 3A and 3C. The system includes a moving mechanism 10F, a parts supply unit 5R for supplying second parts, a second mounting head having a second support for supporting the second parts and mounting the second parts from the parts supply unit 5R onto substrates 3A and 3C, a parts recognition camera 12R positioned between the parts supply unit 5R and the first transport lane 2F for imaging the second parts supported by the second support, a head moving mechanism 10R for moving the mounting head 9R from the parts supply unit 5R through the parts recognition camera 12R to the substrates 3A and 3C, and a control unit 16 for driving and controlling the head moving mechanism 10F and the head moving mechanism 10R. The first substrate transport unit 2cf has a rail 2aa positioned on the parts supply unit 5F side and a rail 2ba positioned on the parts supply unit 5R side. The rail 2aa is movable in a direction intersecting the transport direction of the substrates 3A and 3C. The control unit 16 moves the mounting head 9F in a direction along the rail 2aa relative to the part recognition camera 12F when the rail 2aa is in the first position P1, and moves the mounting head 9F in an oblique direction relative to the part recognition camera 12F when the rail 2aa is in the second position P2 which is moved by a predetermined amount towards the rail 2ba from the first position P1.

[0064] With this configuration, depending on the size of the substrate on which the components are mounted, if rail 2aa is moved by a predetermined amount from the maximum width of the transport path to rail 2ab in the first transport lane 2F, the mounting head 9F is moved diagonally relative to the component recognition camera 12F. When rail 2aa and rail 2ab are at the maximum width of the transport path in the first transport lane 2F, the mounting head 9F is moved in a direction along rail 2aa relative to the component recognition camera 12F, resulting in a roundabout path to the substrate 3A. However, when rail 2aa is moved by a predetermined amount to rail 2ab, the mounting head 9F is moved diagonally relative to the component recognition camera 12F, resulting in a more linear movement toward the substrate 3C, which shortens the component mounting time and provides a component mounting device 1 with improved productivity.

[0065] Furthermore, the component mounting device 1 of this embodiment includes a substrate transport unit 2cr that transports substrates 3B and 3D on a second transport lane 2R arranged alongside the first transport lane 2F. The mounting head 9F mounts the first component onto the substrates 3B and 3D from the component supply unit 5F. The head movement mechanism 10F moves the mounting head 9F from the component supply unit 5F to the substrates 3B and 3D via the component recognition camera 12F. The mounting head 9R mounts the second component onto the substrates 3B and 3D from the component supply unit 5R. The head movement mechanism 10R moves the mounting head 9R from the component supply unit 5R to the substrates 3B and 3D via the component recognition camera 12R.

[0066] With this configuration, since there are two transport paths, productivity can be improved by mounting components separately on each substrate in each transport path using the independent mounting mode.

[0067] Furthermore, in the component mounting device 1 of the embodiment, the second transport lane 2R has a rail 2ab located on the component supply unit 5R side and a rail 2bb located on the component supply unit 5F side. The rail 2ab is movable in a direction intersecting the transport direction of the substrates 3B and 3D.

[0068] The control unit 16 moves the mounting head 9R in a direction along the rail 2ab relative to the part recognition camera 12R when the rail 2ab is in the third position P3, and moves the mounting head 9R in an oblique direction relative to the part recognition camera 12R when the rail 2ab is in the fourth position P4, which is a predetermined amount closer to the rail 2bb than the third position P3.

[0069] With this configuration, even in the second transport lane 2R, when rail 2ab is moved by a predetermined amount to rail 2bb, the mounting head 9R is moved diagonally with respect to the component recognition camera 12r, resulting in a more linear movement toward the substrate 3D, which shortens the component mounting time and provides a component mounting device 1 with improved productivity.

[0070] Furthermore, in the component mounting device 1 of the embodiment, the control unit 16 adjusts the positions of rails 2aa, rail 2ba, rail 2ab, and rail 2bb according to the widths of substrates 3A and 3C and substrates 3B and 3D.

[0071] With this configuration, the widths of the first and second transport lanes 2F and 2R can be adjusted to correspond to the sizes of the two substrates transported on the two lanes, respectively. Therefore, the control unit 16 adjusts the first and second transport lanes 2F and 2R so that both mounting heads 9F and 9R can scan at an angle as much as possible. This makes it possible to further improve production efficiency.

[0072] (Other) Although the present disclosure has been described above with reference to the embodiments described above, the present disclosure is not limited to the embodiments described above.

[0073] In the embodiment described above, a dual-lane type component mounting device 1 having two transport lanes 2 is illustrated, but the device is not limited to this. The component mounting device may have one transport lane and two mounting heads for each transport lane.

[0074] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various variations and modifications will be obvious to those skilled in the art. Such variations and modifications should be understood as being included within the scope of this disclosure as defined by the attached claims. Furthermore, variations in combinations and sequences of elements in each embodiment can be realized without departing from the scope and spirit of this disclosure.

[0075] This disclosure is applicable to component mounting equipment that mounts components on a single substrate using two mounting heads.

[0076] 1. Component mounting device 1a. Main base 2. Transport lanes 2aa, 2ab, 2ba, 2bb Rails 2cf. First substrate transport unit 2cr. Second substrate transport unit 2F. First transport lane 2R. Second transport lane 3, 3A, 3B, 3C, 3D. Substrates 4F, 4R. Rail drive unit 4a. Lead screw 4b. Nut 4c. Motor 5F, 5R. Component supply unit 6. Tape feeder 7. Y-axis table 8F, 8R. Beam 9F, 9R. Mounting head 10F, 10R. Head movement mechanism 11F, 11R. Substrate recognition camera 12F, 12R. Component recognition camera 13. Touch panel 16. Control unit 19F, 19R. Component 21F, 21R. Suction nozzle 31. Mounting operation processing unit 32. Lane change processing unit 34. Memory unit 35. Production program 36. Onboard Data 43. Conveyor M1. Conveyor Motor

Claims

1. A first component supply unit for supplying a first component; a first substrate transport unit for transporting a first substrate on a first transport path; a first mounting head having a first support part for supporting the first component, for mounting the first component from the first component supply unit onto the first substrate; a first camera positioned between the first component supply unit and the first transport path for imaging the first component supported by the first support part; a first head movement mechanism for moving the first mounting head from the first component supply unit through the first camera onto the first substrate; a second component supply unit for supplying a second component; a second mounting head having a second support part for supporting the second component, for mounting the second component from the second component supply unit onto the first substrate; a second camera positioned between the second component supply unit and the first transport path for imaging the second component supported by the second support part; A component mounting device comprising: a second head movement mechanism for moving the second mounting head from the second component supply unit through the second camera to the first substrate; and a control unit for driving and controlling the first head movement mechanism and the second head movement mechanism, wherein the first substrate transport unit has a first rail disposed on the side of the first component supply unit and a second rail disposed on the side of the second component supply unit, the first rail is movable in a direction intersecting the transport direction of the first substrate, and the control unit moves the first mounting head in a direction along the first rail relative to the first camera when the first rail is in a first position, and moves the first mounting head in an oblique direction relative to the first camera when the first rail is in a second position which is moved by a predetermined amount toward the second rail than the first position.

2. The component mounting device according to claim 1, comprising a second substrate transport unit that transports a second substrate on a second transport path arranged alongside the first transport path, wherein a first mounting head mounts the first components onto the second substrate from the first component supply unit, a first head moving mechanism moves the first mounting head from the first component supply unit via the first camera to the second substrate, a second mounting head mounts the second components onto the second substrate from the second component supply unit, and a second head moving mechanism moves the second mounting head from the second component supply unit via the second camera to the second substrate.

3. The component mounting device according to claim 2, wherein the second substrate transport unit has a third rail positioned on the side of the second component supply unit and a fourth rail positioned on the side of the first component supply unit, the third rail is movable in a direction intersecting the transport direction of the second substrate, and the control unit moves the second mounting head in a direction along the third rail relative to the second camera when the third rail is in a third position, and moves the second mounting head in an oblique direction relative to the second camera when the third rail is in a fourth position moved by a predetermined amount toward the fourth rail from the third position.

4. The component mounting device according to claim 3, wherein the control unit adjusts the positions of the first rail, the second rail, the third rail, and the fourth rail according to the width of the first substrate and the width of the second substrate.

5. The first mounting head includes a first component removal step in which a first mounting head removes a first component from a first component supply unit; a first imaging step in which the removed first component is imaged with a first camera; a first mounting step in which the imaged first component is mounted on a first substrate on a first transport path; a second component removal step in which a second mounting head removes a second component from a second component supply unit; a second imaging step in which the removed second component is imaged with a second camera; and a second mounting step in which the imaged second component is mounted on the first substrate on the first transport path; the first substrate transport unit includes a first rail located on the side of the first component supply unit and a second rail located on the side of the second component supply unit, the first rail is movable in a direction intersecting the transport direction of the first substrate, and the control unit, in the first imaging step, A component mounting method comprising: moving the first mounting head in a direction along the first rail relative to the first camera when the first rail is in a first position; and moving the first mounting head diagonally relative to the first camera when the first rail is in a second position closer to the second rail than the first position.

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