Component mounting system, component mounting apparatus, inspection server, and inspection method

Abstract

A component mounting system (1) comprises: a component mounting apparatus (M1) that takes out a component and mounts the component on a substrate; and an inspection server (3). The component mounting apparatus (M1) is provided with: an imaging unit (a head camera (12) or a component recognition camera (13)); a first inspection processing unit (22) that executes inspection of a first inspection target on the basis of a first image in which the first inspection target captured by the imaging unit appears; and a mounting communication unit (26) that transmits, to the inspection server (3), a second image in which a second inspection target captured by the imaging unit appears. The inspection server (3) is provided with: an inspection communication unit (35) that receives the second image transmitted by the mounting communication unit (26); and a second inspection processing unit (32) that executes inspection of the second inspection target on the basis of the second image received by the inspection communication unit (35). The inspection communication unit (35) transmits the inspection result obtained by the second inspection processing unit (32) to the component mounting apparatus (M1).

Description

Component mounting system, component mounting apparatus, inspection server and inspection method

[0001] The present disclosure relates to a component mounting system and the like.

[0002] Patent Document 1 discloses a component mounting system capable of ensuring the quality of a mounted substrate and improving the efficiency of component mounting work.

[0003] Japanese Unexamined Patent Publication No. 2021-52037

[0004] However, in the component mounting system disclosed in Patent Document 1, since inspection of an inspection object such as a substrate is performed by a controller in the component mounting apparatus, there are the following problems. Since the controller in the component mounting apparatus has constraints on the operating system (OS) and hardware, its specifications are lower than those of a general personal computer (PC), it is difficult to follow the latest technology, and there are cases where a license for commercially available software cannot be used. Since the controller in the component mounting apparatus cannot easily upgrade the version of application software, it is necessary to consider version matching of application software between respective component mounting apparatuses and simultaneous version upgrade of application software for all component mounting apparatuses. When software is developed inside the component mounting apparatus, actual machine verification is ultimately required, resulting in poor development efficiency.

[0005] Therefore, the present disclosure provides a component mounting system and the like that can achieve further improvements.

[0006] The component mounting system according to this disclosure comprises a component mounting device for removing components and mounting them on a substrate, and an inspection server, wherein the component mounting device comprises an imaging unit, a first inspection processing unit for performing an inspection of a first inspection target based on a first image of the first inspection target captured by the imaging unit, and a mounting communication unit for transmitting a second image of a second inspection target captured by the imaging unit to the inspection server, wherein the inspection server comprises an inspection communication unit for receiving the second image transmitted by the mounting communication unit, and a second inspection processing unit for performing an inspection of a second inspection target based on the second image received by the inspection communication unit, and the inspection communication unit transmits the inspection results from the second inspection processing unit to the component mounting device.

[0007] These comprehensive or specific aspects may be implemented in a system, apparatus, method, recording medium, or computer program, or in any combination of a system, apparatus, method, recording medium, and computer program.

[0008] Further improvements can be made according to the component mounting system and other related information disclosed herein.

[0009] This is a configuration diagram showing an example of a component mounting system according to an embodiment. This is a sequence diagram showing a first example of the operation of the component mounting system according to an embodiment. This is a sequence diagram showing a second example of the operation of the component mounting system according to an embodiment. This is a configuration diagram showing an example of a component mounting device according to an embodiment. This is a diagram showing an example of a mounting substrate manufactured in the component mounting system according to an embodiment. This is a functional configuration diagram showing an example of a component mounting system according to an embodiment. This is a diagram showing an example of an inspection result display screen displayed on the touch panel of the component mounting device according to an embodiment. This is a flowchart showing an example of the operation of the component mounting device according to an embodiment. This is a configuration diagram showing an example of a component mounting system according to a modified embodiment. This is a sequence diagram showing an example of the operation of a component mounting system according to a modified embodiment. This is a flowchart showing an example of an inspection method according to another embodiment. This is a flowchart showing an example of an inspection method according to another embodiment.

[0010] The embodiments will be described in detail below with reference to the drawings.

[0011] The embodiments described below are all general or specific examples. The numerical values, shapes, materials, components, arrangement and connection configurations of components, steps, and the order of steps shown in the following embodiments are examples only and are not intended to limit this disclosure.

[0012] (Embodiment) The component mounting system, component mounting apparatus, and inspection server according to the embodiment will be described below with reference to Figures 1 to 8.

[0013] Figure 1 is a configuration diagram showing an example of a component mounting system 1 according to an embodiment.

[0014] The component mounting system 1 comprises a component mounting device that picks up components and mounts them on a circuit board, and an inspection server 3 that performs inspections of the components to be inspected. For example, Figure 1 shows an example in which the component mounting system 1 comprises two component mounting devices M1 and M2, but the component mounting system 1 may have only one component mounting device or three or more. In the following, we will focus on component mounting device M1 of component mounting devices M1 and M2. Since component mounting device M2 has basically the same configuration and function as component mounting device M1, its description will be omitted.

[0015] The inspection targets include components, circuit boards, materials such as tapes or trays, tape feeders, and mounting heads. There are two types of inspection targets: first and second. For example, the first type of inspection targets include those related to component suction and component mounting onto circuit boards. For instance, inspections of the first type of inspection targets are real-time inspections directly related to production operations, such as whether the mounting head can correctly suction components or whether components can be correctly mounted onto the circuit board. The second type of inspection targets include those other than the first type of inspection targets. For example, inspections of the second type of inspection targets are advanced inspections targeting specific components at specific timings, such as whether materials like tapes or trays are correctly set when switching between them, whether components are present in the event of a suction error, or whether there are any foreign objects in the component mounting areas of the circuit board, such as BGAs (Ball Grid Arrays). Inspections of the first type of inspection targets (i.e., real-time inspections) are performed by the component mounting device M1, while inspections of the second type of inspection targets (i.e., inspections that do not require real-time performance) are performed by the inspection server 3. The component mounting devices M1 and M2 are connected to the inspection server 3 via a communication network 2 such as a LAN (Local Area Network).

[0016] Next, the operation of the component mounting system 1 will be explained using Figures 2 and 3.

[0017] First, the operation of the component mounting system 1 when performing the inspection of the first object to be inspected will be explained using Figure 2.

[0018] Figure 2 is a sequence diagram showing a first example of the operation of the component mounting system 1 according to the embodiment.

[0019] The component mounting device M1 sets the lamp value of the camera for imaging the first object to be inspected (step S101), images the first object to be inspected (step S102), performs an inspection of the first object to be inspected based on the first image showing the imaged first object to be inspected (step S103), and performs processing according to the inspection result (step S104).

[0020] Next, we will explain the operation of the component mounting system 1 when performing the inspection of the second object to be inspected, using Figure 3.

[0021] Figure 3 is a sequence diagram showing a second example of the operation of the component mounting system according to the embodiment.

[0022] The component mounting device M1 sets the lamp value of the camera for imaging the second inspection target (step S111), images the second inspection target (step S112), and transmits the second image showing the imaged second inspection target to the inspection server 3 (step S113). The component mounting device M1 also issues an inspection command (step S104). The inspection command includes the equipment number indicating the component mounting device M1, a transaction number (unique ID) specific to the inspection command issued this time, a command number indicating the type of inspection, a set of command-specific parameters indicating the specific content of the inspection, and the full file path of the transmitted second image. The transmitted second image and the inspection command are associated with each other.

[0023] The inspection server 3 receives a second image of the second object to be inspected and an inspection command from the component mounting device M1, and executes the inspection command (step S115). For example, it reads the image file based on the full file path of the second image included in the inspection command, and also executes the inspection process based on the command number and parameter group. The inspection server 3 sends the inspection results to the component mounting device M1 (step S116).

[0024] The component mounting device M1 receives inspection results from the inspection server 3 and performs processing according to the inspection results (step S117).

[0025] The inspection target is predetermined to be either the first inspection target or the second inspection target. When the first inspection target is set as the inspection target, the component mounting device M1 performs the operation described in Figure 2. When the second inspection target is set as the inspection target, the component mounting device M1 performs the operation described in Figure 3.

[0026] Next, the configuration of the component mounting device M1 will be explained with reference to Figure 4.

[0027] Figure 4 is a configuration diagram showing an example of a component mounting apparatus M1 according to an embodiment.

[0028] In the component mounting device M1, a substrate transport mechanism 5 is installed in the center of the base 4 in the X direction. The substrate transport mechanism 5 transports the substrate B, which is brought in from the upstream side, in the X direction, and positions and holds it at the mounting work position by the mounting head 10, which will be described below. The substrate transport mechanism 5 also transports the substrate B, after the component mounting work is completed, to the downstream side. That is, the substrate B that is transported out of the component mounting device M1 is transported to the component mounting device M2.

[0029] Component supply units 6 are installed on both sides (front and rear) of the substrate transport mechanism 5. Multiple tape feeders 7 are mounted in parallel in the X direction on both sides of the component supply units 6. The tape feeders 7 feed a carrier tape, which has pockets for storing components, in a pitch direction from the outside of the component supply units 6 toward the substrate transport mechanism 5 (tape feeding direction), thereby supplying components to the component pick-up position where the mounting head 10 picks up the components.

[0030] Y-axis tables 8 equipped with linear drive mechanisms are positioned at both ends in the X direction on the upper surface of the base 4. A beam 9, also equipped with a linear drive mechanism, is coupled to the Y-axis tables 8 so as to be movable in the Y direction. A mounting head 10 is mounted on the beam 9 so as to be movable in the X direction. The mounting head 10 is equipped with a plurality of suction units (not shown) that can hold and move parts up and down and rotate around the vertical axis (Z-axis). A suction nozzle (not shown) for picking up and holding parts is attached to the lower end of each suction unit. In this example, both the Y-axis tables 8 and the beam 9 are equipped with linear drive mechanisms, but the design is not limited to this. For example, at least one of them may be a drive mechanism such as a ball screw.

[0031] The Y-axis table 8 and beam 9 constitute a mounting head movement mechanism 11 that moves the mounting head 10 horizontally (X direction, Y direction). The mounting head movement mechanism 11 and the mounting head 10 perform component mounting work, which involves taking components from the component supply unit 6 and mounting them to the mounting positions on the substrate B. In the component mounting work, the mounting head 10 moves above the component supply unit 6, picks up predetermined components with each suction nozzle, moves above the substrate B, rotates the components held by each suction nozzle in a predetermined direction, and repeats a series of turns to mount them to their respective mounting positions.

[0032] The beam 9 is equipped with a head camera 12 located on its underside and moving integrally with the mounting head 10. As the mounting head 10 moves, the head camera 12 moves above the substrate B positioned at the mounting work position of the substrate transport mechanism 5, and captures images of substrate marks (not shown) provided on the substrate B to recognize the position of the substrate B. The head camera 12 also captures images of the area around the mounting position on the substrate B where components are mounted, and the state of the substrate B is recognized from the imaging results.

[0033] A component recognition camera 13 is installed between the component supply unit 6 and the substrate transport mechanism 5. The component recognition camera 13 captures images of the component held by the suction nozzle from below when the mounting head 10, which has taken a component from the component supply unit 6, is positioned above the component recognition camera 13. During the component mounting operation by the mounting head 10, the mounting position is corrected by taking into account the recognition result of the substrate B by the head camera 12 and the recognition result of the component by the component recognition camera 13.

[0034] The head camera 12 and the component recognition camera 13 are examples of imaging units.

[0035] A touch panel 14 is installed at the front of the component mounting device M1 where the operator works. The touch panel 14 displays various information on its display, and the operator uses the operation buttons displayed on the display to input data and operate the component mounting device M1. For example, the inspection target may be set via the touch panel 14. A component waste unit 15 is installed next to the component recognition camera 13. Components that are supplied from the component supply unit 6 but are not mounted on the circuit board B, such as components with poor suction, are discarded in the component waste unit 15.

[0036] Next, with reference to Figure 5, an example of a mounted circuit board manufactured by the component mounting system 1 will be described.

[0037] Figure 5 shows an example of a mounting substrate manufactured in the component mounting system 1 according to the embodiment. Figure 5(a) shows a part of the substrate B before components D1 and D2 are mounted, and Figure 5(b) shows a part of the substrate B after components D1 and D2 are mounted. Component D1 is a small chip component, etc. Component D2 is a large BGA with bumps Da formed on its back surface.

[0038] In Figure 5(a), multiple electrodes Ba are formed on the upper surface of substrate B, electrically connected to the terminals of component D1, corresponding to the positions of the terminals of component D1. Also, multiple electrodes Bb are formed on the upper surface of substrate B, electrically connected to the bumps Da formed on the back surface of component D2, corresponding to the positions of the bumps Da. The component mounting apparatus M1 mounts components D1 and D2 onto substrate B such that the terminals of component D1 and the bumps Da of component D2 are positioned on electrodes Ba and Bb on substrate B.

[0039] Next, with reference to Figure 6, the configuration of the component mounting system 1 will be described.

[0040] Figure 6 is a functional configuration diagram showing an example of a component mounting system 1 according to an embodiment. The inspection server 3 and the component mounting device M1 are interconnected via a communication network 2.

[0041] The component mounting apparatus M1 includes a mounting control device 20, a substrate conveyance mechanism 5, a component supply unit 6, a mounting head 10, a mounting head moving mechanism 11, a head camera 12, a component recognition camera 13, and a touch panel 14. The mounting control device 20 includes a mounting storage unit 21, an inspection processing unit 22, an inspection request unit 23, a display processing unit 24, a mounting processing unit 25, and a mounting communication unit 26. The mounting communication unit 26 transmits and receives data between the component mounting apparatus M1 and the inspection server 3 via the communication network 2. The mounting communication unit 26 transmits, to the inspection server 3, a second image capturing a second inspection target imaged by the head camera 12 or the component recognition camera 13. The inspection request unit 23, the display processing unit 24, and the mounting processing unit 25 are implemented by a processor or the like that executes a program stored in a memory.

[0042] The mounting storage unit 21 stores production data 21a, inspection results 21c, and the like. The production data 21a stores, for each piece of information (component number) specifying a component to be mounted on the substrate B, a component name (type), a component size, a mounting position (XY coordinates), a mounting order, and the like, in association with the production model name of the mounted substrate.

[0043] The inspection processing unit 22 executes inspection of a first inspection target based on a first image capturing the first inspection target imaged by the head camera 12 or the component recognition camera 13. The inspection processing unit 22 is an example of a first inspection processing unit. For example, the inspection processing unit 22 inspects, based on the first image, whether the mounting head 10 correctly sucks a component, or whether the component is correctly mounted on the substrate B, and the like. The inspection processing unit 22 stores the inspection result 21c in the mounting storage unit 21.

[0044] The inspection request unit 23 generates an inspection command to request the inspection server 3 to inspect the second inspection target. The mounting communication unit 26 transmits the second image in association with identification information such as the inspection command. Accordingly, the inspection server 3 can confirm, based on the identification information, from which component mounting apparatus the received second image is transmitted, what kind of inspection needs to be executed, and the like.

[0045] The inspection server 3 is a server that performs inspection of a second inspection object, and includes an inspection processing unit 32, an input unit 33, a display unit 34, and an inspection communication unit 35. The input unit 33 is an input device such as a keyboard, a touch panel, or a mouse, and is used when inputting operation commands or data. The display unit 34 is a display device such as a liquid crystal panel, and displays various data stored in a storage unit included in the inspection server 3, and also displays various types of information such as an operation screen for operations performed via the input unit 33. The inspection communication unit 35 transmits and receives data to and from component mounters M1 and M2 via the communication network 2. The inspection communication unit 35 receives the second image transmitted by the mounting communication unit 26. The inspection processing unit 32 is implemented by a processor or the like that executes a program stored in a memory.

[0046] The inspection processing unit 32 executes inspection of the second inspection object based on the second image received by the inspection communication unit 35. The inspection processing unit 32 is an example of the second inspection processing unit. For example, based on the second image, the inspection processing unit 32 inspects whether members such as a tape or a tray are correctly set when they are switched, whether there is any component at the time of a suction error, and whether there is any foreign matter in a mounting portion of a component such as a BGA on a substrate B, or the like.

[0047] Then, the inspection communication unit 35 transmits an inspection result 21c obtained by the inspection processing unit 32 to the component mounter M1. The inspection communication unit 35 determines a transmission destination of the inspection result based on identification information (inspection command). Accordingly, the inspection server 3 can transmit the inspection result obtained by executing inspection using the received second image to the component mounter M1 that transmitted the second image.

[0048] The mounting communication unit 26 receives, from an external device (the inspection server 3 in the present embodiment), the inspection result 21c of the inspection of the second inspection object executed by the inspection server 3 based on the transmitted second image. The component mounter M1 stores the received inspection result 21c in the mounting storage unit 21.

[0049] The display processing unit 24 displays the inspection results on the touch panel 14 and displays an inspection result display image that allows the operator to select the next action. An example of the inspection result display screen 40 displayed on the touch panel 14 will now be described with reference to Figure 7.

[0050] Figure 7 shows an example of an inspection result display screen shown on the touch panel 14 of the component mounting device M1 according to the embodiment.

[0051] The inspection result display screen 40 displays an "Inspection Result Information" display frame 41, an "Imagine Image" display frame 42, a "Continue" button 43, and a "Remove" button 44. The "Inspection Result Information" display frame 41 displays a warning based on the inspection results from the inspection processing unit 32 stating that "there is a possibility that a part has fallen to the mounting position of part number (D0123)," and a work instruction to select the next process by pressing a button.

[0052] The "Image Capture" display frame 42 displays an image of the mounting position of the inspection candidate component included in the inspection result 21c. In the example shown in Figure 7, the inspection candidate component is component D2 shown in Figure 5, and the image shows the electrode Bb formed on the substrate B, as well as component D1, which is another component that has fallen to the mounting position. When the operator uses the input function of the touch panel 14 to operate the "Continue" button 43, the component mounting work on the inspection candidate component (component to be mounted) continues. When the operator operates the "Remove" button 44, a series of processes to remove the substrate B from the component mounting device M1 begins.

[0053] The operator looks at the captured image in the "Captured Image" display frame 42 and, if they determine that there are no foreign objects such as other components that have fallen into the mounting position and that there are no problems, they operate the "Continue" button 43. If they determine that there is a problem, they operate the "Remove" button 44 to perform a defect processing that removes the circuit board B from the component mounting device M1.

[0054] The mounting processing unit 25 controls each part of the component mounting device M1 and, based on the production data 21a, performs component mounting work, which involves taking components from the component supply unit 6 and mounting them to the mounting positions on the circuit board B. The mounting processing unit 25 performs component mounting work if the inspection processing unit 32 determines that there is no possibility of other components falling. The mounting processing unit 25 also performs component mounting work if the operator operates the "Continue" button 43 on the inspection result display screen 40.

[0055] If the mounting processing unit 25 detects from the image of the component held by the suction nozzle captured by the component recognition camera 13 that a suction error has occurred, such as the suction nozzle not holding the component or suctioning it in an abnormal position, it will execute a component disposal process to discard the component held by the suction nozzle to the component disposal unit 15. The mounting processing unit 25 will also execute a component disposal process if it detects that a mounting defect has occurred, such as the suction nozzle taking back a component that has been mounted on the substrate B. If the mounting processing unit 25 has executed a component disposal process, it will then perform the component mounting work again on the component that could not be mounted.

[0056] Next, the operation of the component mounting device M1 will be explained using Figure 8.

[0057] Figure 8 is a flowchart showing an example of the operation of the component mounting apparatus M1 according to the embodiment.

[0058] The head camera 12 or component recognition camera 13 captures an image of the object to be inspected (the first or second object to be inspected) (step S1), and performs an inspection using the captured first image, or sends the captured second image to the inspection server 3 to request an inspection (step S2). The inspection result performed by the component mounting device M1, or the inspection result received from the inspection server 3, is displayed on the touch panel 14 (step S3). For example, the mounting processing unit 25 determines whether it is possible to continue mounting components onto the board (step S4). If mounting is possible (Yes in step S4), the mounting processing unit 25 mounts the component (step S5), and if mounting is not possible (No in step S4), it performs a defect processing (step S6).

[0059] As explained above, since the inspection server 3 has no OS or hardware constraints, its specifications can be increased, it can keep up with the latest technologies, and it can use licenses for commercially available software. In addition, the inspection server 3 allows for easy version upgrades of application software, and there is no need to consider matching application software versions between each component mounting device or simultaneous version upgrades of application software for all component mounting devices. Furthermore, when developing software within the inspection server 3, development and operation verification can be performed solely on a PC if the IN / OUT communication does not change, thus improving development efficiency. For this reason, it is conceivable to send images of the objects to be inspected from the component mounting device M1 to the inspection server 3, and have the inspection server 3, which is external to the component mounting device M1, perform inspection of the objects using the images sent from the component mounting device M1. However, some objects require real-time inspection that directly affects production operations. If such inspections are performed on the inspection server 3, the inspection may take a long time and affect production operations. Therefore, for the first inspection target requiring real-time inspection, the inspection is performed in the component mounting device M1, and for the second inspection target that does not require real-time inspection, the inspection is performed by the inspection server 3. This makes it possible to provide a component mounting system 1 that can be further improved. Specifically, it is possible to provide a component mounting system 1 that realizes a hybrid system architecture in which inspection is performed in either the component mounting device M1 or the inspection server 3 depending on the inspection target. For example, for the first inspection target related to component suction and component mounting to the substrate, the inspection can be performed in real time in the component mounting device M1.

[0060] (Modified Examples of the Embodiment) Next, a component mounting system according to a modified example of the embodiment will be described with reference to Figures 9 and 10.

[0061] Figure 9 is a configuration diagram showing an example of a component mounting system 1a according to a modified embodiment.

[0062] The component mounting system 1a differs from the component mounting system 1 according to the embodiment in that it further includes a relay device 16, and the inspection server 3 is connected to the component mounting devices M1 and M2 via the relay device 16. Other aspects are the same as the component mounting system 1 according to the embodiment, so the following explanation will focus on the differences.

[0063] The relay device 16 may also be a management computer, also known as an LNB (Line Network Box), which may integrate and manage the production of mounted boards by the component mounting system 1a, and may also create various parameters used by the component mounting devices M1 and M2.

[0064] Figure 10 is a sequence diagram showing an example of the operation of a component mounting system 1a according to a modified embodiment.

[0065] The component mounting device M1 sets the lamp value of the camera for imaging the second inspection target (step S201) and images the second inspection target (step S202). The component mounting device M1 (mounting communication unit 26) transmits the second image showing the imaged second inspection target to an external device (in a modified example of this embodiment, a relay device 16) (step S203). The relay device 16 has an image storage unit, which stores the second image transmitted by the mounting communication unit 26 (step S204). The component mounting device M1 also issues an inspection command (step S205). Specifically, the component mounting device M1 transmits the inspection command to the inspection server 3 via the relay device 16.

[0066] The inspection server 3 receives an inspection command and also acquires a second image stored in the image storage unit of the relay device 16 (step S206). The inspection server 3 (inspection processing unit 32) performs an inspection of the object to be inspected based on the image stored in the image storage unit of the relay device 16, specifically executing the received inspection command (step S207). The inspection server 3 transmits the inspection results to the component mounting device M1 (step S208). Specifically, the inspection server 3 (inspection communication unit 35) transmits the inspection results from the inspection processing unit 32 to the component mounting device M1 via the relay device 16.

[0067] The component mounting device M1 receives inspection results from the inspection server 3 via the relay device 16 and performs processing according to the inspection results (step S209).

[0068] In this way, the second image of the second inspection target is transmitted from the component mounting device M1 to the relay device 16, and the inspection server 3 outside the component mounting device M1 may perform inspection of the inspection target using the second image stored in the relay device 16. In this case as well, a component mounting system 1a that can be further improved can be provided, similar to the embodiment. Specifically, a component mounting system 1a that realizes a hybrid system architecture in which inspection is performed by the component mounting device M1 or the inspection server 3 depending on the inspection target can be provided.

[0069] (Other Embodiments) The component mounting systems 1 and 1a, component mounting device M1, and inspection server 3 of this disclosure have been described above based on embodiments, but this disclosure is not limited to the above embodiments. Without departing from the spirit of this disclosure, various modifications to these embodiments that a person skilled in the art could conceive of, and forms constructed by combining components from different embodiments are also included within the scope of this disclosure.

[0070] For example, this disclosure can be implemented not only as a component mounting system 1 or 1a, but also as an inspection method that includes steps (processes) performed by the components constituting the component mounting system 1 or 1a.

[0071] Figures 11 and 12 are flowcharts showing an example of an inspection method according to another embodiment.

[0072] The inspection method is performed by a component mounting system 1 comprising a component mounting device M1 that removes components and mounts them on a circuit board, and an inspection server 3. As shown in Figure 11, the component mounting device M1 performs an inspection of a first inspection target based on a first image showing the first inspection target (step S11), transmits a second image showing a second inspection target to the inspection server 3 (step S12), the inspection server 3 receives the second image transmitted from the component mounting device M1 (step S13), performs an inspection of a second inspection target based on the received second image (step S14), and transmits the inspection result of the second inspection target to the component mounting device M1 (step S15).

[0073] The inspection method is performed by a component mounting system 1a comprising a component mounting device M1 for removing components and mounting them on a circuit board, a relay device 16, and an inspection server 3. As shown in Figure 12, the component mounting device M1 performs an inspection of a first inspection target based on a first image showing the first inspection target (step S21), transmits a second image showing a second inspection target to the relay device 16 (step S22), the relay device 16 stores the second image transmitted from the component mounting device M1 (step S23), the inspection server 3 performs an inspection of a second inspection target based on the second image stored in the relay device 16 (step S24), and transmits the inspection result of the second inspection target to the component mounting device M1 via the relay device 16 (step S25).

[0074] For example, this disclosure can be implemented as a program that causes a computer (processor) to execute the steps included in the inspection method. Furthermore, this disclosure can be implemented as a non-temporary computer-readable recording medium, such as a CD-ROM, on which the program is recorded.

[0075] For example, if this disclosure is implemented in a program (software), each step is executed by the program using hardware resources such as the computer's CPU, memory, and input / output circuits. In other words, each step is executed by the CPU obtaining data from memory or input / output circuits, performing calculations, and outputting the calculation results to memory or input / output circuits.

[0076] In the above embodiment, each component included in the component mounting system 1 or 1a may be implemented by dedicated hardware or by executing a software program suitable for each component. Each component may also be implemented by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory.

[0077] Some or all of the functions of the component mounting system 1 or 1a according to the above embodiment are typically implemented as an LSI, which is an integrated circuit. These may be individually integrated into a single chip, or some or all of them may be integrated into a single chip. Furthermore, the implementation of integrated circuits is not limited to LSIs, but may also be implemented using dedicated circuits or general-purpose processors. An FPGA (Field Programmable Gate Array) that can be programmed after LSI manufacturing, or a reconfigurable processor that can reconfigure the connections and settings of circuit cells inside the LSI may also be used.

[0078] Furthermore, if advances in semiconductor technology or other derived technologies lead to the emergence of integrated circuit technologies that can replace LSIs, then naturally, those technologies may be used to integrate each component included in component mounting system 1 or 1a into an integrated circuit.

[0079] Furthermore, this disclosure also includes forms obtained by applying various modifications to the embodiments that a person skilled in the art could conceive, and forms realized by arbitrarily combining the components and functions of each embodiment without departing from the spirit of this disclosure.

[0080] (Note) The above description of embodiments discloses the following technology.

[0081] (Technology 1) A component mounting system comprising a component mounting device for removing components and mounting them on a circuit board, and an inspection server, wherein the component mounting device comprises an imaging unit, a first inspection processing unit for performing an inspection of a first inspection target based on a first image of a first inspection target captured by the imaging unit, and a mounting communication unit for transmitting a second image of a second inspection target captured by the imaging unit to the inspection server, wherein the inspection server comprises an inspection communication unit for receiving the second image transmitted by the mounting communication unit, and a second inspection processing unit for performing an inspection of a second inspection target based on the second image received by the inspection communication unit, and the inspection communication unit transmits the inspection results from the second inspection processing unit to the component mounting device.

[0082] Because the inspection server has no OS or hardware constraints, its specifications can be increased, it can keep up with the latest technologies, and it can use licenses for commercially available software. Furthermore, application software can be easily upgraded on the inspection server, and there is no need to consider matching application software versions between individual component mounting machines or simultaneous version upgrades of application software on all component mounting machines. Also, when developing software within the inspection server, development and operation verification can be performed solely on a PC if the IN / OUT communication does not change, thus improving development efficiency. For this reason, it is conceivable to send images of the objects to be inspected from the component mounting machine to the inspection server, and have the inspection server, which is external to the component mounting machine, perform inspection of the objects using the images sent from the component mounting machine. However, some objects require real-time inspection that directly affects production operations. If such inspections are performed on the inspection server, the inspection may take a long time and affect production operations. Therefore, for the first type of object requiring real-time inspection, the inspection is performed on the component mounting machine, and for the second type of object that does not require real-time inspection, the inspection is performed on the inspection server. This enables us to provide a component mounting system that allows for further improvements. Specifically, we can provide a component mounting system that realizes a hybrid system architecture in which inspections are performed on either a component mounting device or an inspection server, depending on the object being inspected.

[0083] (Technical 2) A component mounting system comprising a component mounting device for removing components and mounting them on a circuit board, a relay device, and an inspection server, wherein the component mounting device comprises an imaging unit, a first inspection processing unit for performing an inspection of a first inspection target based on a first image of a first inspection target captured by the imaging unit, and a mounting communication unit for transmitting a second image of a second inspection target captured by the imaging unit to the relay device, the relay device comprises an image storage unit for storing the second image transmitted by the mounting communication unit, and the inspection server comprises a second inspection processing unit for performing an inspection of a second inspection target based on the second image stored in the image storage unit, and an inspection communication unit for transmitting the inspection results from the second inspection processing unit to the component mounting device via the relay device.

[0084] Because the inspection server has no OS or hardware constraints, its specifications can be increased, it can keep up with the latest technologies, and it can use licenses for commercially available software. Furthermore, application software can be easily upgraded on the inspection server, and there is no need to consider matching application software versions between each component mounting device or simultaneous version upgrades of application software on all component mounting devices. Also, when developing software within the inspection server, development and operation verification can be performed solely on a PC if the IN / OUT communication does not change, thus improving development efficiency. For this reason, it is conceivable to send images of the objects to be inspected from the component mounting device to the inspection server via a relay device, and have the inspection server, which is external to the component mounting device, perform inspection of the objects using the images sent from the component mounting device. However, some objects require real-time inspection that directly affects production operations. If such inspections are performed on the inspection server, the inspection may take a long time and affect production operations. Therefore, for the first type of object requiring real-time inspection, the inspection is performed on the component mounting device, and for the second type of object that does not require real-time inspection, the inspection is performed on the inspection server. This enables us to provide a component mounting system that allows for further improvements. Specifically, we can provide a component mounting system that realizes a hybrid system architecture in which inspections are performed on either a component mounting device or an inspection server, depending on the object being inspected.

[0085] (Technical 3) The component mounting system according to Technical 1 or 2, wherein the first object of inspection includes an object of inspection related to the adsorption of the component and the mounting of the component to the substrate.

[0086] According to this, the first inspection target, which is related to the adsorption of components and the mounting of components onto the substrate, can be inspected in real time using a component mounting device.

[0087] (Technology 4) The component mounting system according to any one of Technologies 1 to 3, wherein the mounting communication unit transmits the second image in association with identification information.

[0088] According to this, the inspection server can use identification information to determine which component mounting device the received second image originated from and what kind of inspection needs to be performed.

[0089] (Technical 5) The component mounting system according to Technical 4, wherein the inspection communication unit determines the destination for transmitting the inspection results based on the identification information.

[0090] According to this, the inspection server can transmit the inspection results obtained by performing an inspection using the received second image to the component mounting device that sent the second image.

[0091] (Technical 6) A component mounting apparatus for removing components and mounting them on a circuit board, comprising: an imaging unit; a first inspection processing unit that performs an inspection of a first inspection target based on a first image of the first inspection target captured by the imaging unit; and a mounting communication unit that transmits a second image of a second inspection target captured by the imaging unit to an external device, wherein the mounting communication unit receives the inspection result of the inspection of the second inspection target performed based on the second image from the external device.

[0092] This allows for the provision of component mounting equipment that can be further improved.

[0093] (Technical 7) A second inspection processing unit that performs an inspection of a second inspection target based on a second image obtained by imaging the second inspection target in a component mounting apparatus that removes components and mounts them on a circuit board, and an inspection server that transmits the inspection results from the second inspection processing unit to the component mounting apparatus.

[0094] This allows us to provide a testing server that can be further improved.

[0095] (Technical 8) An inspection method performed by a component mounting system comprising a component mounting device for removing components and mounting them on a circuit board, and an inspection server, wherein the component mounting device performs an inspection of a first inspection target based on a first image showing the first inspection target, transmits a second image showing a second inspection target to the inspection server, the inspection server receives the second image transmitted from the component mounting device, performs an inspection of a second inspection target based on the received second image, and transmits the inspection result of the second inspection target to the component mounting device.

[0096] This allows us to provide an inspection method that can be further improved.

[0097] (Technical 9) An inspection method performed by a component mounting system comprising a component mounting device for removing components and mounting them on a circuit board, a relay device, and an inspection server, wherein the component mounting device performs an inspection of a first inspection target based on a first image showing the first inspection target, transmits a second image showing a second inspection target to the relay device, the relay device stores the second image transmitted from the component mounting device, the inspection server performs an inspection of a second inspection target based on the second image stored in the relay device, and transmits the inspection result of the second inspection target to the component mounting device via the relay device.

[0098] This allows us to provide an inspection method that can be further improved.

[0099] This disclosure can be applied to component mounting systems in which inspection targets are performed in component mounting equipment.

[0100] 1, 1a Component mounting system 2 Communication network 3 Inspection server 4 Base 5 Board transport mechanism 6 Component supply unit 7 Tape feeder 8 Y-axis table 9 Beam 10 Mounting head 11 Mounting head movement mechanism 12 Head camera 13 Component recognition camera 14 Touch panel 15 Component disposal unit 16 Relay device 20 Mounting control device 21 Mounting storage unit 21a Production data 21c Inspection results 22, 32 Inspection processing unit 23 Inspection request unit 24 Display processing unit 25 Mounting processing unit 26 Mounting communication unit 33 Input unit 34 Display unit 35 Inspection communication unit 40 Inspection result display screen 41, 42 Display frame 43, 44 Buttons B Board Ba, Bb Electrodes D1, D2 Component Da Bump M1, M2 Component mounting device

Claims

1. A component mounting system comprising: a component mounting device for removing components and mounting them onto a circuit board; and an inspection server, wherein the component mounting device comprises: an imaging unit; a first inspection processing unit for performing an inspection of a first inspection target based on a first image of the first inspection target captured by the imaging unit; and an installation communication unit for transmitting a second image of a second inspection target captured by the imaging unit to the inspection server, wherein the inspection server comprises: an inspection communication unit for receiving the second image transmitted by the installation communication unit; and a second inspection processing unit for performing an inspection of a second inspection target based on the second image received by the inspection communication unit, and the inspection communication unit for transmitting the inspection results from the second inspection processing unit to the component mounting device.

2. A component mounting system comprising: a component mounting device for removing components and mounting them on a circuit board; a relay device; and an inspection server, wherein the component mounting device comprises: an imaging unit; a first inspection processing unit for performing an inspection of a first inspection target based on a first image of the first inspection target captured by the imaging unit; and a mounting communication unit for transmitting a second image of a second inspection target captured by the imaging unit to the relay device; the relay device comprises: an image storage unit for storing the second image transmitted by the mounting communication unit; and the inspection server comprises: a second inspection processing unit for performing an inspection of a second inspection target based on the second image stored in the image storage unit; and an inspection communication unit for transmitting the inspection results from the second inspection processing unit to the component mounting device via the relay device.

3. The component mounting system according to claim 1 or 2, wherein the first object of inspection includes an object of inspection related to the adsorption of the component and the mounting of the component to the substrate.

4. The component mounting system according to claim 1 or 2, wherein the mounting communication unit transmits the second image in association with identification information.

5. The component mounting system according to claim 4, wherein the inspection communication unit determines the destination for transmitting the inspection results based on the identification information.

6. A component mounting apparatus for removing components and mounting them onto a circuit board, comprising: an imaging unit; a first inspection processing unit that performs an inspection of a first inspection target based on a first image of the first inspection target captured by the imaging unit; and a mounting communication unit that transmits a second image of a second inspection target captured by the imaging unit to an external device, wherein the mounting communication unit receives the inspection results of the inspection of the second inspection target performed based on the second image from the external device.

7. A second inspection processing unit that performs an inspection of a second inspection target based on a second image obtained by imaging the second inspection target in a component mounting device that removes components and mounts them on a circuit board, and an inspection server that transmits the inspection results from the second inspection processing unit to the component mounting device.

8. An inspection method performed by a component mounting system comprising a component mounting device for removing components and mounting them on a circuit board, and an inspection server, wherein the component mounting device performs an inspection of a first inspection target based on a first image showing the first inspection target, transmits a second image showing a second inspection target to the inspection server, the inspection server receives the second image transmitted from the component mounting device, performs an inspection of a second inspection target based on the received second image, and transmits the inspection result of the second inspection target to the component mounting device.

9. An inspection method performed by a component mounting system comprising a component mounting device for removing components and mounting them on a circuit board, a relay device, and an inspection server, wherein the component mounting device performs an inspection of a first inspection target based on a first image showing the first inspection target, transmits a second image showing a second inspection target to the relay device, the relay device stores the second image transmitted from the component mounting device, the inspection server performs an inspection of a second inspection target based on the second image stored in the relay device, and transmits the inspection result of the second inspection target to the component mounting device via the relay device.

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